Lift pins, lift pin arrangements, semiconductor processing systems with lift pin arrangements, and methods of making lift pin arrangements for semiconductor processing systems

Abstract

To provide lift pins, lift pin arrangements, semiconductor processing systems with lift pin arrangements, and the like.SOLUTION: In a lift pin arrangement 100, a lift pin 102 includes a lift pin body 106 arranged along a lift pin axis 108 having a contact pad 124, a stem segment 126, a neck segment 128, and a span feature 130. The contact pad is defined at a first end of the lift pin body. The stem segment extends from the contact pad. The neck segment extends from the stem segment. The span feature is defined at a second end of the lift pin body, is connected to the contact pad by the neck segment and the stem segment, and has minor and major widths. The minor width is equivalent to a neck diameter defined by the neck segment, and the major width with is greater than the minor width, and greater than a stem diameter defined by the stem segment.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates generally to depositing a material layer onto a substrate. More specifically, the present disclosure relates to attaching a substrate to and removing a substrate from a substrate support before and after deposition of a material layer onto the substrate, such as during deposition of a material layer during the manufacture of a semiconductor device. [Background technology]

[0002] A material layer is generally deposited onto a substrate during the manufacture of semiconductor devices, such as during the manufacture of logic and memory devices. Deposition of the material layer is generally accomplished by mounting the substrate on a substrate support in a reaction chamber, heating the substrate to a desired deposition temperature, and exposing the substrate to a material layer precursor under environmental conditions selected to deposit the material layer onto the substrate. Once the material layer develops the desired properties, exposure of the substrate to the material layer precursor is typically stopped, the substrate is detached from the substrate support, and the substrate is removed from the reactor chamber to undergo further processing, as required, for the semiconductor device being manufactured. Attachment may be accomplished using lift pins, which are generally slidably received within the substrate and slide through the substrate to attach and detach the substrate to and from the substrate support.

[0003] One challenge to the use of lift pins to mount and remove substrates in reaction chambers is the adhesion of material within mechanical gaps defined within the interior of the reaction chamber, such as between the lift pins and the substrate support. For example, in some material layer deposition operations, material may adhere onto the stem of the lift pin. The adhered material may be carried by the stem of the lift pin during movement of the lift pin through the substrate support, potentially increasing the resistance to the sliding movement of the lift pin through the substrate support and / or binding the lift pin into the substrate support. Material may also adhere onto the tip of the lift pin when mounted on the substrate, and may begin to slide the lift pin through the substrate support once deposition of the material layer is complete, increasing the force that must be applied to the lift pin to remove the substrate from the substrate support.

[0004] There are various countermeasures to limit the binding of the lift pins in the substrate. For example, the lift pins may be maintained at a temperature different from that required for the material layer deposition in the reaction chamber, limiting the tendency of material to adhere to the lift pins. The lift pins may be isolated from the material layer precursor employed during the deposition process, for example, by disposing the lift pins in a bellows or by providing a purge to the lift pin stem, also limiting the tendency of material to adhere to the lift pins during the deposition of the material layer on the substrate. Also, the interior of the reaction chamber may be etched following the deposition of the material layer on the substrate to remove the adhered material before it reaches a size sufficient to bind the lift pins in the substrate support. While generally satisfactory for their intended purposes, such countermeasures may add complexity to the reaction chamber architecture and / or increase the cost of ownership of the reaction chamber due to increased use of consumables and / or reduced throughput of the reaction chamber.

[0005] Such systems and methods have generally been satisfactory for their intended purposes. However, there remains a need for improved lift pins, lift pin arrangements, and semiconductor processing systems, as well as methods of making lift pin arrangements for semiconductor processing systems. The present solution provides a solution to this need. Summary of the Invention

[0006] A lift pin is provided. The lift pin includes a lift pin body disposed along a lift pin axis and having a contact pad, a stem segment, a neck segment, and a spanning feature. The contact pad is defined at a first end of the lift pin body, the stem segment extends from the contact pad, and the neck segment extends from the stem segment. The spanning feature is defined at a second end of the lift pin body, connected to the contact pad by the neck segment and the stem segment of the lift pin body, and has a minor width and a major width. The minor width of the spanning feature is substantially equal to a neck diameter defined by the neck segment of the lift pin body, and the major width of the spanning feature is greater than a stem diameter defined by the neck segment of the lift pin body.

[0007] In addition to or in the alternative to one or more of the features discussed above, further embodiments may include that the lift pin body is formed from a ceramic material.

[0008] In addition to or in the alternative to one or more of the above features, further embodiments may include the smaller width being offset from the larger width by approximately 90 degrees about the lift pin axis.

[0009] In addition to or in the alternative to one or more of the above features, further embodiments may include the spanning feature having a larger lobe and a smaller lobe, the larger lobe spanning the larger width and the smaller lobe spanning the smaller width.

[0010] In addition to or as an alternative to one or more of the features discussed above, further embodiments may include the major lobe being a first major lobe and the spanning feature having a second major lobe separated from the first major lobe by a minor lobe.

[0011] In addition to or as an alternative to one or more of the above features, further embodiments may include the second major lobe being offset from the first major lobe by approximately 180 degrees.

[0012] In addition to or as an alternative to one or more of the features discussed above, further embodiments may include the minor lobe being a first minor lobe and the spanning feature having a second minor lobe, the second minor lobe being separated from the first minor lobe by a larger lobe.

[0013] In addition to or in the alternative to one or more of the above features, further embodiments may include the second minor lobe being offset from the first minor lobe by approximately 180 degrees.

[0014] In addition to or as an alternative to one or more of the features discussed above, further embodiments may include the spanning feature having a first planar surface and a second planar surface, and the greater width intersects both the first planar surface and the second planar surface.

[0015] In addition to or as an alternative to one or more of the features discussed above, further embodiments may include the spanning feature having two or more arcuate surfaces defined between the major and minor widths.

[0016] In addition to or as an alternative to one or more of the above features, further embodiments may include the spanning feature having an intermediate planar surface that is offset from both the major width and the minor width.

[0017] In addition to or as an alternative to one or more of the above features, further examples may include the first planar surface and the second planar surface are two of at least six planar surfaces defined by the spanning feature, the spanning feature having at least eight arcuate surfaces.

[0018] A lift pin arrangement is provided that includes a lift pin as described above and a lift pin weight having a weight body having a through opening extending therethrough with a flanged segment thereon, the lift pin body being slidably received within the through opening and carried by first and second flange portions that extend toward a lift pin axis defined by the lift pin body.

[0019] In addition to or in the alternative to one or more of the above features, further embodiments may include the through opening having a first through opening segment and a second through opening segment separated by a plurality of flanges, the first through opening segment connecting an upper surface of the weight body to the plurality of flanges, and the second through opening segment connecting the plurality of flanges to a lower surface of the weight body.

[0020] In addition to or as an alternative to one or more of the features discussed above, further embodiments may include the first through opening segment having a generally circular shape between the upper surface and the plurality of flanges and the second through opening having a generally cross-shaped shape extending between the lower surface and the plurality of flanges.

[0021] In addition to or as an alternative to one or more of the above features, further embodiments may include the first through opening segment having a diameter substantially equal to a width of the stem segment of the lift pin body, the second through opening segment having a larger width of the second segment that is greater than a larger width of the span feature of the lift pin body, and the second through opening segment having a smaller width of the second segment that is less than the larger width of the span feature of the lift pin body.

[0022] In addition to or as an alternative to one or more of the above features, further embodiments may include the lift pin weight having a frusto-conical shape, the first through opening segment having a diameter substantially equal to a width of the stem segment of the lift pin body, and the second through opening segment having a width substantially equal to a width of the span feature of the lift pin body.

[0023] A semiconductor processing system is provided that includes a chamber body formed from a quartz material, a substrate support disposed within the interior of the chamber body and configured to support a substrate during deposition of a layer of material thereon, a lift pin as described above, and a lift pin weight having an aperture therethrough, the lift pin being slidably received within the lift pin aperture that extends through the substrate support and a portion of the stem segment, and a span feature of the lift pin being disposed within the aperture such that the lift pin weight is carried by the lift pin through the span feature and neck segment of the lift pin body.

[0024] In addition to or as an alternative to one or more of the above features, further embodiments may include a lift pin body of the lift pin formed from silicon carbide and a weight body of the lift pin weight formed from quartz.

[0025] A method of making a lift pin arrangement for a semiconductor processing system is provided. The method includes disposing a lift pin weight on a lift pin as described above, the weight body having a weight body defining a through opening therethrough along a lift pin axis, and rotating the weight body about the lift pin axis such that a larger width of the flanged portion is aligned with a larger width of a span feature of the lift pin body. The weight body of the lift pin weight is translated along the lift pin axis such that the span feature of the lift pin body is axially between the contact pad of the lift pin body and the span feature of the lift pin body, and the weight body is rotated about the lift pin axis such that the first and second flange portions of the weight body overlap the larger width of the span feature of the lift pin body. The weight body is then translated along the lift pin axis in a direction opposite the contact pad such that both the first and second flange portions of the weight body abut the span feature of the lift pin body such that the lift pin weight is carried by the span feature of the lift pin body to apply a downward force to the lift pin during movement of the lift pin through a substrate support within a chamber arrangement such as a semiconductor processing system.

[0026] This Summary is provided to introduce selected concepts in a simplified form. These concepts are described in more detail in the Detailed Description of Example Embodiments of the Disclosure below. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0027] These and other features, aspects, and advantages of the inventions disclosed herein are described below with reference to drawings of certain specific embodiments, which are intended to illustrate but not to limit the invention. [Brief description of the drawings]

[0028] [Figure 1]FIG. 1 is a schematic diagram of a semiconductor processing system including a lift pin arrangement according to the present disclosure, showing the lift pin arrangement supported within a chamber arrangement of the semiconductor processing system. [Diagram 2] FIG. 2 is a cross-sectional side view of the chamber arrangement of the semiconductor processing system of FIG. 1 in accordance with a first embodiment of the present disclosure, showing a lift pin arrangement including lift pins and lift pin weights carried by a substrate support during rotation about an axis of rotation within the chamber arrangement. [Diagram 3] FIG. 3 is a diagram of the chamber arrangement of FIG. 2 sequentially illustrating a lift pin arrangement for attaching and detaching a substrate to and from a substrate support before and after deposition of a layer of material onto the substrate. [Figure 4] FIG. 4 is a diagram of the chamber arrangement of FIG. 2 sequentially illustrating a lift pin arrangement for attaching and detaching a substrate to and from a substrate support before and after deposition of a layer of material onto the substrate. [Diagram 5] FIG. 5 is a diagram of the chamber arrangement of FIG. 2 sequentially illustrating a lift pin arrangement for attaching and detaching a substrate to and from a substrate support before and after deposition of a layer of material onto the substrate. [Figure 6] FIG. 6 is a side view of the lift pin arrangement of FIG. 1 showing the lift pins exploded from the lift pin weights along the lift pin axis according to an embodiment of the present disclosure. [Figure 7] FIG. 7 is a side view of a portion of the lift pin of FIG. 6 showing a surface defined on a spanning feature of the lift pin for supporting a lift pin weight on the lift pin in accordance with an embodiment of the present disclosure. [Figure 8] FIG. 8 is a side view of a portion of the lift pin of FIG. 6 showing a surface defined on a spanning feature of the lift pin for supporting a lift pin weight on the lift pin in accordance with an embodiment of the present disclosure. [Figure 9] FIG. 9 is a bottom view of a portion of the lift pin of FIG. 6 showing a surface defined on a spanning feature of the lift pin for supporting a lift pin weight on the lift pin in accordance with an embodiment of the present disclosure. [Figure 10]FIG. 10 is a cross-sectional view of the lift pin weight of FIG. 6 showing a through opening extending through the lift pin weight and a shelf-like arrangement for supporting the lift pin weight on the lift pin according to an embodiment of the present disclosure. [Figure 11] FIG. 11 is a top plan view of the lift pin weight of FIG. 6 showing the through openings extending through the lift pin weight and a shelf-like arrangement for supporting the lift pin weight on the lift pins in accordance with an embodiment of the present disclosure. [Figure 12] FIG. 12 is a bottom view of the lift pin weight of FIG. 6 showing the through openings extending through the lift pin weight and a shelf-like arrangement for supporting the lift pin weight on the lift pins in accordance with an embodiment of the present disclosure. [Figure 13] 13 is a cross-sectional side view of the lift pin and lift pin weight of FIG. 7 sequentially illustrating the lift pin weight being assembled onto the lift pin according to an embodiment of the present disclosure. [Figure 14] 14 is a cross-sectional side view of the lift pin and lift pin weight of FIG. 7 sequentially illustrating the lift pin weight being assembled onto the lift pin according to an embodiment of the present disclosure. [Figure 15] 15 is a cross-sectional side view of the lift pin and lift pin weight of FIG. 7 sequentially illustrating the lift pin weight being assembled onto the lift pin according to an embodiment of the present disclosure. [Figure 16] 16 is a cross-sectional side view of the lift pin and lift pin weight of FIG. 7 sequentially illustrating the lift pin weight being assembled onto the lift pin according to an embodiment of the present disclosure. [Figure 17] FIG. 17 is a block diagram of a method of making a lift pin arrangement illustrating operation of the method in accordance with an exemplary and non-limiting embodiment of the method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale, for example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the illustrated embodiments of the present disclosure.

[0030] Reference will now be made to the drawings in which like reference numbers identify similar structural features or aspects of the present disclosure. For purposes of explanation and illustration, and not for purposes of limitation, a partial view of a lift pin arrangement including a lift pin according to the present disclosure is shown in FIG. 1 and generally designated by reference character 100. Other examples of lift pins, lift pin arrangements, semiconductor processing systems including lift pin arrangements, and methods of making lift pin arrangements for semiconductor processing systems according to the present disclosure or embodiments thereof, as described, are provided in FIGS. 2-17. The lift pins and lift pin arrangements of the present disclosure may be used to attach and detach a substrate to and from a substrate support in semiconductor processing systems, such as in semiconductor processing systems having a rotating substrate support and a fixed substrate support employed to deposit a layer of material onto a substrate using chemical vapor deposition techniques, where material may adhere within a mechanical gap defined between the lift pins employed to attach the substrate to the substrate support and the substrate support employed to support the substrate during deposition, although the present disclosure is not limited to any particular type of substrate support or deposition technique.

[0031] Referring to FIG. 1, a semiconductor processing system 200 including a lift pin arrangement 100 according to an embodiment of the present disclosure is shown. In the illustrated embodiment, the semiconductor processing system 200 includes a precursor source 202, a chamber arrangement 204, an exhaust source 206, and a controller 208. The precursor source 202 includes a material layer precursor 10 and is configured to provide a flow of the material layer precursor 10 to the chamber arrangement 204. The chamber arrangement 204 is connected to the exhaust source 206 and configured to deposit a material layer 4 onto a substrate 2 using the flow of the material layer precursor 10 received from the precursor source 202. The exhaust source 206 is fluidly connected to an external environment 12 outside the chamber arrangement 204 and configured to communicate residual material layer precursor and / or reaction products 14 emitted by the chamber arrangement 204 to the external environment 12, and may include one or more vacuum pumps and / or abatement devices. The controller 208 is operatively connected to the chamber arrangement 204, for example, to mount the substrate 2 within the chamber arrangement 204 prior to deposition of the material layer 4 onto the substrate 2, and to remove the substrate 2 after deposition of the material layer 4 onto the substrate 2.

[0032] In certain embodiments, the material layer precursor 10 may include a silicon-containing material layer precursor. Examples of suitable silicon-containing material layer precursors include silane (SiH4), dichlorosilane (H2SiCl2), and disilane (Si2H6). According to certain embodiments, the material layer precursor 10 may include a germanium-containing material layer precursor, such as germane (GeH4). It is contemplated that the material layer precursor 10 may include a dopant-containing material layer precursor, such as an n-type dopant or a p-type dopant. Non-limiting examples of suitable n-type dopants include arsine (AsH3), and non-limiting examples of suitable p-type dopants include diborane (B2H6) and phosphine (PH3). It is also contemplated and still within the scope of the present disclosure that, according to certain embodiments, the material layer precursor 10 may include a carrier / purge gas, such as hydrogen (H2) gas, and / or an etchant source, including an etchant, such as hydrochloric acid (HCl).

[0033] 2, a chamber arrangement 204 is shown in accordance with an embodiment of the present disclosure. In the illustrated embodiment, the chamber arrangement 204 includes a chamber body 210, an inlet flange 212, an exhaust flange 214, an upper heater element array 216, a lower heater element array 218, and a lift and rotate module 220. The chamber arrangement 204 also includes a partition 222, a substrate support 224, a support member 226, a shaft member 228, a lift pin actuator 230, and a lift pin arrangement 100. Although shown and described herein as including certain elements and having a specific arrangement, i.e., a single wafer cross-flow arrangement with a rotating substrate support 224, it should be understood and appreciated that the chamber arrangement 204 may include other elements and / or exclude certain elements shown and described herein, and / or have other arrangements in other embodiments, and still remain within the scope of the present disclosure.

[0034] The chamber body 210 extends longitudinally between an inlet end 242 and a longitudinally opposite exhaust end 244. The inlet flange 212 abuts the inlet end 242 of the chamber body 210 and couples the precursor source 202 to the chamber body 210 to communicate the material layer precursor 10 to the interior 248 of the chamber body 210. The exhaust flange 214 abuts the exhaust end 244 of the chamber body 210 and couples with the chamber body 210 to communicate residual precursors and / or reaction products 14 emitted by the chamber arrangement 204 to the exhaust source 206. It is contemplated that the chamber body 210 has a top wall 232, a bottom wall 234, a first sidewall 236, and a second sidewall 238. The top wall 232 spans longitudinally between the inlet end 242 and the exhaust end 244 of the chamber body 210. The lower wall 234 is similar to the upper wall 232 and is additionally separated from the upper wall 232 by an interior 248 of the chamber body 210. A first side wall 236 and a second side wall 238 connect the lower wall 234 to the upper wall 232 and are laterally separated from one another by an interior 248 of the chamber body 210. It is contemplated that the chamber body 210 is formed from a material that is transmissive to electromagnetic radiation in the infrared wavelength range, such as a transparent material 240, e.g., a ceramic material such as quartz or sapphire. It is contemplated that the chamber body 210 may have a plurality of external ribs 246 extending around an outer surface of the chamber body 210 and spaced longitudinally from one another between an inlet end 242 and an exhaust end 244 of the chamber body 210. As shown and described herein, the upper wall 232 and the lower wall 234 are substantially planar in shape. As will be understood by one of ordinary skill in the art in view of the present disclosure, either (or both) of the upper wall 232 and the lower wall 234 may have an arcuate profile and / or a dome-like shape and still be within the scope of the present disclosure.

[0035] The upper heater element array 216 is configured to communicate radiant heat to the interior 248 of the chamber body 210, for example using electromagnetic radiation in the infrared wavelength range, and is supported above the chamber body 210 in this regard. The upper heater element array 216 is contemplated to include a plurality of heater elements, for example linear filament type lamps, extending laterally between the first and second sidewalls 236 and 238 of the chamber body 210 and spaced apart longitudinally from one another between the inlet end 242 and the exhaust end 244 of the chamber body 210. The lower heater element array 218 is similar to the upper heater element array 216 and may additionally be supported below the lower wall 234 of the chamber body 210 and further include a plurality of linear filament type lamps extending laterally between the inlet end 242 and the exhaust end 244 of the chamber body 210 and spaced apart laterally from one another between the first and second sidewalls 236 and 238. Although shown and described herein as including linear lamps having a particular orientation, it is to be understood and appreciated that either (or both) of the upper heater element array 216 and the lower heater element array 218 may have linear filament type lamps having a different orientation and / or may include bulb type lamps and still be within the scope of the present disclosure.

[0036] The partition 222 is secured within the interior 248 of the chamber body 210 and divides the interior 248 into an upper chamber 250 and a lower chamber 252. It is contemplated that the partition 222 is further formed from an opaque material 256, e.g., a material opaque to electromagnetic radiation in the infrared wavelength range, and that the partition 222 further defines a partition opening 254 therethrough. The partition opening 254 fluidly connects the upper chamber 250 of the chamber body 210 to the lower chamber 252 of the chamber body 210, and it is contemplated that the substrate support 224 is supported for rotation R about a rotation axis 258 within the interior 248 of the chamber body 210 and at least partially within the partition opening 254. In certain embodiments, the opaque material 256 may include a carbonaceous material, such as graphite and / or pyrolytic carbon. According to one particular embodiment, the opaque material 256 may include a ceramic material, such as silicon carbide, that coats an underlying bulk carbonaceous material or forms the bulk material that defines the partition 222 .

[0037] The substrate support 224 is configured to mount the substrate 2 during deposition of the material layer 4 thereon, and in this regard is supported within the partition opening 254 for rotation about an axis of rotation 258. It is contemplated that the substrate support 224 may be formed from an opaque material 260, which may be similar or different in composition to the opaque material 256 forming the partition 222. It is also contemplated that the substrate support 224 may include a susceptor structure, and that the substrate support 224 may be fixed in rotation R about the axis of rotation 258 relative to the support member 226. In this regard, it is contemplated that the support member 226 is disposed within the lower chamber 252 of the chamber body 210 and along the axis of rotation 258, the support member 226 connects the substrate support 224 to the shaft member 228, which in turn extends through the lower wall 234 of the chamber body 210 and operably connects the lift and rotate module 220 to the substrate support 224, such that the lift and rotate module 220 may rotate the substrate support 224 about the axis of rotation 258 during deposition of the material layer 4 onto the substrate 2.

[0038] The substrate support 224 defines one or more lift pin openings 262 therethrough, and it is contemplated that the lift pins 102 of the lift pin arrangement 100 are slidably received within the lift pin openings 262. It is further contemplated that the lift pin actuator 230 is disposed within the lower chamber 252 of the chamber body 210, e.g., about (at least partially) the shaft member 228, and extends through the lower wall 234 of the chamber body 210. The lift pin actuator 230 is operatively associated with the lift and rotate module 220 for movement between a first position 264 and a second position 266 for attaching and detaching a substrate, e.g., substrate 2, to and from the substrate support 224. When in the first position 264, the lift pin arrangement 100 hangs from the substrate support 224, and the lift pin arrangement 100 is spaced apart from the lift pin actuator 230 and carried by the substrate support 224 during rotation about the axis of rotation 258. When in the second position 266, the lift pin actuator 230 abuts the lift pin arrangement 100, causing the lift pins 102 to protrude above the substrate support 224. As would be understood by one of ordinary skill in the art in light of this disclosure, movement between the first position 264 and the second position 266 attaches and detaches the substrate 2 to and from the substrate support 224. As would be understood by one of ordinary skill in the art in light of this disclosure, movement between the first position 264 and the second position 266 also allows for loading and unloading of the substrate in the chamber body 210, for example, using a substrate transfer robot 270 having an end effector 272 coupled to the chamber body 210 by a gate valve 268. As shown and described herein, the chamber arrangement 204 includes three lift pin arrangements 100, it should be understood and appreciated that in other embodiments, the chamber arrangement 204 may have fewer or additional lift pin arrangements 100 and still be within the scope of the present disclosure.

[0039] 3-5, the installation and removal of the substrate 2 using the lift pin arrangement 100 is illustrated. As shown in FIG. 3, installation of the substrate 2 in the chamber body 210 is accomplished by opening the gate valve 268 and advancing the end effector 272 into the upper chamber 250 of the chamber body 210 using the substrate transport robot 270, such that the substrate 2 is aligned with the substrate support 224 at a location above the substrate support 224. The lift and rotate module 220 then translates the lift pin actuator 230 along the rotation axis 258 toward the substrate support 224 between a first position 264 and a second position 266. As the lift pin actuator 230 translates along the axis of rotation 258, the lift pin actuator 230 abuts the lift pin weight 104 supported on the lift pin 102, and further translation of the lift pin actuator 230 then drives the lift pin 102 through the substrate support 224, causing the lift pin 102 to protrude above the substrate support 224 and advance upwardly within the upper chamber 250 of the chamber body 210.

[0040] The advancement of the lift pins 102 continues until the lift pins 102 abut the underside 6 of the substrate 2, and further advancement transfers the substrate 2 into the lift pin arrangement 100. The substrate transport robot 270 then withdraws the end effector 272 from the upper chamber 250 of the chamber body 210, and the lift and rotate module 220 translates the lift pin actuator 230 downwardly between its second position 266 and its first position 264 within the lower chamber 252 of the chamber body 210. The downward translation of the lift pin actuator 230 withdraws the support from the lift pin arrangement 100, and the lift pins 102 slide downwardly through the lift pin openings 262 under the action of gravity along with the mass of the lift pin weight 104 as well as the mass of the lift pins 102 and substrate 2. Downward sliding of the lift pin 102 through the lift pin opening 262 continues until the contact pad 124 (shown in FIG. 6 ) of the lift pin 102 is seated within the lift pin opening 262, and further downward translation of the lift pin actuator 230 causes the lift pin arrangement 100 to hang from the substrate support 224 within the lower chamber 252 of the chamber body 210.

[0041] As shown in Figure 4, deposition of the material layer 4 is accomplished by heating the substrate 2 to a predetermined material layer deposition temperature, rotating the substrate support 224 and thereby rotating the substrate 2 about the axis of rotation 258, and exposing the substrate 2 to the material layer precursor 10 under conditions whereby the material layer 4 is deposited onto the substrate 2. When the material layer 4 reaches a predetermined material layer thickness, the flow of the material layer precursor 10 into the interior 248 of the chamber body 210 is stopped. The substrate 2 is then allowed to cool, for example, to a substrate unloading temperature, either by allowing the substrate 2 to remain attached on the substrate support 224 and / or by removing the substrate 2 from the substrate support 224 using the lift pin arrangement 100 and lift pin actuator 230. As will be understood by one of ordinary skill in the art in view of the present disclosure, the lift pin arrangement 100 is carried by the substrate support 224 during rotation R about the axis of rotation 258, whereby the lift pin arrangement 100 rotates R in coordination with the substrate support 224 about the axis of rotation 258 during deposition of the material layer 4 onto the top surface 8 of the substrate 2.

[0042] 5, removal of the substrate 2 is accomplished by aligning the lift pin actuator 230 with the lift pin arrangement 100 in rotation about a rotation axis 258 so that the lift pin arrangement 100 overlaps the lift pin actuator 230. The lift pin actuator 230 is then driven upwardly within the lower chamber 252 of the chamber body 210 toward the substrate support 224 between a first position 264 and a second position 266 using the lift and rotate module 220. Upward translation of the lift pin actuator 230 along the rotation axis 258 toward the substrate support 224 causes the lift pin actuator 230 to abut the lift pin weight 104 within the lower chamber 252 of the chamber body 210, after which further upward translation causes the lift pin 102 to slide upwardly through the lift pin opening 262, whereby the lift pin 102 protrudes from the substrate support 224. Protrusion of the lift pins 102 above the substrate support 224 removes the substrate 2 from the substrate support 224 and transfers the substrate 2 to the lift pin arrangement 100, and further translation of the lift pin actuator 230 then causes the substrate 2 to be supported at a location above the substrate support 224 along the rotation axis 258 and within the upper chamber 250 of the chamber body 210.

[0043] Once the lift pin actuator 230 reaches the second position 266 and the substrate 2 is supported above the substrate support 224, the gate valve 268 reopens and the end effector 272 is advanced by the substrate transport robot 270 into the upper chamber 250 of the chamber body 210. The substrate transport robot 270 is contemplated to advance the end effector 272 such that the end effector 272 is perpendicular between the substrate 2 and the substrate support 224. The lift pin actuator 230 so positioned is again translated downwardly within the lower chamber 252 of the chamber body 210 from the second position 266 towards the first position 264 of the lift pin actuator 230. The downward translation of the lift pin actuator 230 causes the lift pin arrangement 100, and more specifically the lift pins 102, to slide downwardly through the lift pin openings 262 and retract generally towards the substrate support 224. The retraction is contemplated to be such that the substrate 2 is transferred from the lift pins 102 to the end effector 272, and the substrate transport robot 270 then withdraws the end effector 272 and the substrate 2 carried by the end effector 272 from the upper chamber 250 of the chamber body 210. The substrate 2 may then be sent for further processing, or the chamber arrangement 204 may be prepared for deposition of a further layer of material onto another substrate, or deposition of a further layer onto the substrate 2, as required for a semiconductor device to be fabricated using the layer of material 4.

[0044] As explained above, the lift pins may bind within the substrate support during installation and / or removal of the substrate on the substrate. The binding may occur, for example, due to tilting of the lift pins within the substrate support. The binding may also occur due to adhesion of material on the lift pins and / or within the lift pin openings in which the lift pins are received, such as when residual precursors and / or reaction products enter the atmosphere containing the lift pins during material layer deposition, deposit onto the lift pins, and are then carried into the lift pin openings during sliding of the lift pins through the lift pin openings. To limit (or completely eliminate) such binding, the lift pin arrangement 100 is provided.

[0045] 6-12, a lift pin arrangement 100 is shown in accordance with an embodiment of the present disclosure. As shown in FIG. 6, the lift pin arrangement 100 generally includes a lift pin 102 and a lift pin weight 104. The lift pin 102 includes a lift pin body 106. The lift pin body 106 defines (or is disposed along) a lift pin axis 108 and is configured to be slidably received within a lift pin opening 262 (shown in FIG. 2) that extends through a substrate support 224 (shown in FIG. 2). The lift pin body 106 is further configured to carry (e.g., support) the lift pin weight 104 during deposition of a material layer 4 (shown in FIG. 1) onto a substrate 2 (shown in FIG. 1), whereby the lift pin weight 104 exerts a tensile load onto the lift pin body 106. The lift pin body 106 may be formed from an opaque ceramic material 110, e.g., a material that is opaque to electromagnetic radiation in the infrared waveband, and may have a heat transfer coefficient substantially similar to the heat transfer coefficient of the material forming the substrate support 224. Examples of suitable opaque materials include ceramic materials such as silicon carbide, as well as carbonaceous materials such as glassy carbon. As will be appreciated by those of skill in the art in view of the present disclosure, forming the lift pin body 106 from an opaque ceramic material may limit temperature variations across the substrate 2 and promote uniformity of the material layer 4. Advantageously, weighting the lift pin 102 with the lift pin weight 104 tends to both (a) center the lift pin body 106 within the lift pin opening 262 so that the lift pin axis 108 remains parallel to the axis of rotation 258 (shown in FIG. 2 ), and (b) facilitate attachment of the lift pin 102 within the substrate support 224 (shown in FIG. 1 ), for example, by opposing the horizontal force component exerted on the lift pin body 106 by the substrate 2 and / or by increasing the downward force on the lift pin body 106 during withdrawal of the lift pin actuator 230 (shown in FIG. 2 ).

[0046] The lift pin weight 104 is configured to be carried by the lift pin body 106 and in this regard defines a through opening 112. The through opening 112 extends through the lift pin weight 104, for example, between an upper surface 114 (shown in FIG. 10 ) and a lower surface 116 (shown in FIG. 10 ) of the lift pin weight 104, and is sized to (partially) receive the lift pin body 106 therein. It is contemplated that the lift pin weight 104 is formed from a transparent material 118 (shown in FIG. 10 ), such as a material that is transparent to electromagnetic radiation in the infrared wavelength range. Examples of suitable transparent materials include ceramic materials, such as, by way of non-limiting example, quartz and fused silica. As will also be understood by one of ordinary skill in the art in light of this disclosure, forming the lift pin weights 104 from transparent material 118 limits shadowing of the underside of the substrate support 224 (shown in FIG. 1 ) from electromagnetic radiation emitted by the lower heater element array 218 (shown in FIG. 1 ), may also limit temperature variation across the substrate 2, and may also promote uniformity of the material layer 4.

[0047] In certain embodiments of the present disclosure, the lift pin body 106 may extend axially between a first end 120 and an axially opposite second end 122 and may further include a stem segment 126, a neck segment 128, and a spanning feature 130. A contact pad 124 may be defined at the first end 120 of the lift pin body 106 and may be configured to attach and detach the substrate 2 (shown in FIG. 1 ) to and from a substrate support 224 (shown in FIG. 2 ). The stem segment 126 may extend axially from the contact pad 124, may have a stem diameter 132 (shown in FIG. 7 ), and may connect the neck segment 128 and the spanning feature 130 to the contact pad 124. The neck segment 128 may extend from the stem segment 126, may have a neck diameter 134 (shown in FIG. 7 ), and may connect the spanning feature 130 to the stem segment 126 of the lift pin body 106. A spanning feature 130 may be defined at the second end 122 of the lift pin body 106, may be connected to the contact pad 124 by a neck segment 128 and a stem segment 126 of the lift pin body 106, and may have a minor width 138 (shown in FIG. 9 ) and a major width 136 (shown in FIG. 9 ). The minor width 138 of the spanning feature 130 may be substantially equal to a neck diameter 134 (shown in FIG. 7 ) defined by the neck segment 128 of the lift pin body 106, and the major width 136 of the spanning feature 130 may be larger than the minor width 138 of the spanning feature 130, and the major width 136 of the spanning feature 130 may be even larger than a stem diameter 132 (shown in FIG. 7 ) defined by the neck segment 128 of the lift pin body 106 so as to suspend the lift pin weight 104 from the lift pin body 106. In certain embodiments, the larger width 136 may be offset from the smaller width 138 by approximately 90 degrees about the lift pin axis 108, and in such embodiments, the smaller width 138 is substantially perpendicular to the larger width 136. According to certain embodiments, the larger width 136 may intersect with the smaller width 138, such as at an intersection of the larger width 136 and the smaller width 138.It is also contemplated that major width 136 may be axially offset from minor width 138 and still be within the scope of the present disclosure.

[0048] As shown in Figures 7-9, the spanning feature 130 may have both a major lobe 140 and a minor lobe 142. The major lobe 140 may be circumferentially offset from the minor lobe 142 about the lift pin axis 108, for example, by about 90 degrees to about 270 degrees, and may span the major width 136 of the spanning feature 130. The major lobe 140 may further protrude laterally from the lift pin body 106, for example, in a direction substantially perpendicular to the lift pin axis 108, and may have an axial height less than the axial height of the neck segment 128 of the lift pin body 106. It is contemplated that the major lobe 140 may protrude laterally from the lift pin body 106 a distance substantially greater than, for example, half the neck diameter 134 defined by the neck segment 128. It is further contemplated that the larger lobe 140 may protrude laterally from the lift pin body 106 a distance substantially equal to about half the stem diameter 132 defined by the stem segment 126 of the lift pin body 106 .

[0049] In certain embodiments, the major lobe 140 may be a first major lobe 140, and the spanning feature 130 may have one or more second major lobes 144. The second major lobe 144 may be similar to the first major lobe 140 in such embodiments, with the one or more second major lobes 144 additionally circumferentially offset from the first major lobe 140 about the lift pin axis 108, and the one or more second major lobes 144 further circumferentially offset from the minor lobe 142 about the lift pin axis 108. In this regard, the one or more second major lobes 144 may be separated (e.g., circumferentially separated) from the first major lobe 140 by the minor lobe 142. For example, the one or more second major lobes 144 may be circumferentially offset from the minor lobe 142 by approximately 90 degrees about the lift pin axis 108, and the one or more second major lobes 144 may be circumferentially offset from the first major lobe 140 by approximately 180 degrees about the lift pin axis 108. Although shown and described herein as having two major lobes, it should be understood and appreciated and still be within the scope of the present disclosure that the spanning feature 130 may have a single major lobe or three or more major lobes.

[0050] The minor lobe 142 may be circumferentially intermediate the first major lobe 140 and the second major lobe 144, and the minor lobe 142 may be offset by approximately 90 degrees about the lift pin axis 108 from either (or both) of the first major lobe 140 and the one or more second minor lobes 146. The minor lobe 142 may further protrude from the lift pin body 106, for example, in a direction substantially perpendicular to the lift pin axis 108, and in this regard it is contemplated that the minor lobe 142 extends radially from the lift pin body 106 a radial distance less than the radial distance that the major lobe 140 protrudes radially from the lift pin body 106. In further respects, the smaller lobe 142 may protrude radially from the lift pin body 106 a radial distance less than about half the neck diameter 134 defined by the neck segment 128 of the lift pin body 106, may have an axial height greater than the axial height of the larger lobe 140 and less than the axial height of the neck segment 128 of the lift pin body 106, and may be spanned by the smaller width 138 of the span feature 130.

[0051] In certain embodiments, the minor lobe 142 may be a first minor lobe 142, and the spanning feature 130 may have one or more second minor lobes 146. The one or more second minor lobes 146 may be similar to the first minor lobe 142, may be additionally circumferentially offset from the first minor lobe 142, and may be further circumferentially intermediate the first major lobe 140 and the second major lobe 144. For example, the one or more second major lobes 144 may be circumferentially offset by about 90 degrees about the lift pin axis 108 from either (or both) the first minor lobe 142 and / or the one or more second minor lobes 146. In this regard, the one or more second minor lobes 146 may be separated (e.g., circumferentially separated) from the first minor lobe 142 by the major lobe 140. The one or more second minor lobes 146 may be further circumferentially offset from the first minor lobe 142 by approximately 180 degrees about the lift pin axis 108. Although shown and described herein as having two minor lobes, it is understood and should be understood and still be within the scope of the present disclosure that the spanning feature 130 may have a single minor lobe or three or more minor lobes.

[0052] With reference to FIG. 9 , the spanning feature 130 may have multiple sides (e.g., may be bounded by multiple sides). In this regard, the spanning feature 130 may have (or may be bounded by) a first planar surface 148 and one or more second planar surfaces 150. The minor width 138 may intersect (e.g., extend between) both the first planar surface 148 and the one or more second planar surfaces 150. The one or more second planar surfaces 150 may be offset from the first planar surface 148 by approximately 180 degrees about the lift pin axis 108. In a further respect, either (or both) of the first planar surface 148 and the one or more second planar surfaces 150 may be substantially orthogonal to the minor width 138. In certain embodiments, the spanning feature 130 may have (e.g., may be bounded by) one or more intermediate planar surfaces 152. The one or intermediate planar surfaces 152 may be intermediate (e.g., offset from both) the minor width 138 and the major width 136, e.g., offset circumferentially from either (or both) the minor width 138 and the major width 136 about the lift pin axis 108. According to one particular embodiment, the one or more intermediate planar surfaces 152 may be intermediate the first planar surface 148 and the one or more second planar surfaces 150, the one or more intermediate planar surfaces 152 circumferentially spacing the first planar surface 148 from the one or more second planar surfaces 150 in this respect.

[0053] In certain embodiments, the spanning feature 130 may have (e.g., may be bounded by) six planar surfaces. In this regard, it is contemplated that the one or more intermediate planar surfaces 152 may be a first intermediate planar surface 152, and the spanning feature 130 may have (or be bounded by) a second intermediate planar surface 154, a third intermediate planar surface 156, and a fourth intermediate planar surface 158, each intermediate planar surface 154 being intermediate the minor width 136 and the major width 136 of the spanning feature 130. The second intermediate planar surface 154 may be similar to the first intermediate planar surface 152, and may additionally be separated from the first intermediate planar surface 152 by both the major width 136 and the minor width 138, and may further extend substantially parallel to the first intermediate planar surface 152. The third intermediate planar surface 156 may also be similar to the first intermediate planar surface 152, or may additionally be separated from the first intermediate planar surface 152 by a smaller width 138, and may further be oblique to both the first intermediate planar surface 152 and the second intermediate planar surface 154. The fourth intermediate planar surface 158 may separate the first intermediate planar surface 152 from the second planar surface 150, and may extend substantially parallel to the third intermediate planar surface 156, whereby the multiple surfaces impart a generally diamond-shaped shape to the spanning feature 130. Although shown and described herein as having six planar surfaces, it is understood and should be understood that the spanning feature 130 may have (or be bounded by) fewer or additional planar surfaces and remain within the scope of this disclosure.

[0054] In certain embodiments, the spanning feature 130 may have (e.g., be bounded by) multiple arcuate surfaces. In this regard, the spanning feature 130 may have (or be bounded by) a first terminal arcuate surface 160 and one or more second terminal arcuate surfaces 162. The first arcuate surface 160a and the one or more second terminal arcuate surfaces 162 may be on laterally opposite ends of the larger width 136. The one or more second terminal arcuate surfaces 162 may be offset from the first terminal arcuate surface 160 by approximately 180 degrees about the lift pin axis 108. The one or more second terminal arcuate surfaces 162 may be further separated from the first terminal arcuate surface 160 by both the first planar surface 148 and the one or more second planar surfaces 150. It is also contemplated that one or more of the second terminal arcuate surfaces 162 may be separated from the first terminal arcuate surface 160 by the smaller width 138, and that each of the intermediate planar surfaces 152-158 may separate one or more of the second terminal arcuate surfaces 162 from the first terminal arcuate surface 160.

[0055] According to certain embodiments, spanning feature 130 may have (or be bounded by) a plurality of intermediate arcuate surfaces. In this regard, it is contemplated that spanning feature 130 may have a first intermediate arcuate surface 164, a second intermediate arcuate surface 166, a third intermediate arcuate surface 168, and a fourth intermediate arcuate surface 170. First intermediate arcuate surface 164 and second intermediate arcuate surface 166 may be circumferentially between first terminal arcuate surface 160 and second terminal arcuate surface 162, and may be further separated from one another by minor width 138 and on a common lateral side of major width 140, such that two or more of the plurality of arcuate surfaces are defined between major width 136 and minor width 138 of spanning feature 130. The third intermediate arcuate surface 168 and the fourth intermediate arcuate surface 170 may be similar to the first intermediate arcuate surface 164 and the second intermediate arcuate surface 166 and may be further separated therefrom by the greater width 136. It is contemplated that the second intermediate arcuate surface 166 may be connected to the first intermediate arcuate surface 164 by the first planar surface 148, the third intermediate arcuate surface 168 may be connected to the fourth intermediate arcuate surface 170 by the second planar surface 150, the first terminal arcuate surface 160 may connect the first intermediate arcuate surface 164 to the third intermediate arcuate surface 168, and the second terminal arcuate surface 162 may connect the second intermediate arcuate surface 166 to the fourth intermediate arcuate surface 170. As would be understood by one of ordinary skill in the art in view of the present disclosure, multiple arcuate surfaces may limit stresses in the material forming the spanning feature 130 and may enable the lift pin body 106 to support a lift pin weight 104 having a greater weight (and associated tensile load) than would otherwise be possible for a given width of neck diameter 134. Although shown and described herein as having eight arcuate surfaces, it should be understood and appreciated that the spanning feature 130 may have (or be bounded by) fewer or additional arcuate surfaces and still be within the scope of the present disclosure.

[0056] 10-13, a lift pin weight 104 is shown. The lift pin weight 104 includes a weight body 172 having a mass selected to resist impediment to movement between a first position 264 (shown in FIG. 2) and a second position 266 (shown in FIG. 2), for example, due to material deposited on the lift pin 102 (shown in FIG. 2) and / or within the lift pin opening 262 (shown in FIG. 2). In certain embodiments, the weight body 172 may be formed from a material that is transparent to electromagnetic radiation in the infrared wavelength range, such as the transparent material 118, for example, a ceramic material such as quartz or fused silica. According to certain embodiments, the weight body 172 may have a frusto-conical shape. In this regard, it is contemplated that the weight body 172 has an upper surface 114 that extends circumferentially about the lift pin axis 108, a lower surface 116 that extends circumferentially about the lift pin axis 108 and is axially offset from the upper surface 114 along the lift pin axis 108, and an outer surface 180 that connects the lower surface 116 to the upper surface 114 and tapers diametrically between the lower surface 116 and the upper surface 114 of the weight body 172.

[0057] The lift pin weight 104 is configured to slidably receive the lift pin 102 (shown in FIG. 2) therein, and in this regard has a through opening 112 extending therethrough. The through opening 112 extends between an upper surface 114 of the weight body 172 and a lower surface 116 of the weight body 172, the upper surface 114 defining a generally annular shape extending about a generally circular opening, and the lower surface 116 defining a generally cross-shaped opening, the generally cross-shaped opening being connected to the generally circular opening by the through opening 112. The lift pin weight 104 is further configured for carriage by the lift pin 102, and in this regard defines a plurality of flanges 182 within the through opening 112, the through opening 112 having a first through opening segment 186 and a second through opening segment 188 separated by the plurality of flanges 182. The first through opening segment 186 extends axially from the upper surface 114 of the weight body 172 to the plurality of flanges 182. The first through opening segment 186 further defines a first segment profile 190. The second through opening segment 188 extends axially from the plurality of flanges 182 to the lower surface 116 of the weight body 172. The second through opening segment 188 further defines a second segment profile 192 and differs in shape and width from the first segment profile 190. The second through opening segment 188 is further axially separated from the first through opening segment 186 by the plurality of flanges 182, the plurality of flanges 182 being intermediate the first through opening segment 186 and the second through opening segment 188 within the interior of the weight body 172.

[0058] As shown in FIG. 11 , the first through opening segment 186 is generally circular in shape, extends circumferentially about the lift pin axis 108, and defines a first segment diameter 194. In certain embodiments, the first segment diameter 194 may be greater than the neck diameter 134 (shown in FIG. 7 ) of the neck segment 128 (shown in FIG. 7 ). According to certain embodiments, the first segment diameter 194 may be greater than the stem diameter 132 (shown in FIG. 7 ) of the stem segment 126 (shown in FIG. 7 ). In certain embodiments, it is contemplated that the first segment diameter 194 may be greater than both the minor width 138 (shown in FIG. 9 ) and the major width 136 (shown in FIG. 9 ) of the span feature 130 (shown in FIG. 6 ). According to certain embodiments, it is also contemplated that the first segment diameter 194 may be substantially equal to the stem diameter 132 of the stem segment 126 of the lift pin body 106. As will be understood by one of ordinary skill in the art in view of the present disclosure, this laterally secures the lift pin weight 104 relative to the lift pin body 106 when the first through opening segment 186 of the through opening 112 laterally overlaps with the stem segment 126 of the lift pin body 106.

[0059] 12, the second through opening segment 188 of the through opening 112 has a generally cross-shaped configuration between the lower surface 116 of the weight body 172 and the plurality of flanges 182. The generally cross-shaped configuration defines a second segment major width 196 and a second segment minor width 198, the second segment minor width 198 being substantially perpendicular to the second segment major width 196. It is contemplated that the second segment major width 196 is greater than the second segment minor width 198, the second segment minor width 198 is less than the major width 136 (shown in FIG. 9) of the spanning feature 130 (shown in FIG. 6), and the second segment major width 196 of the second through opening segment 188 is greater than the major width 136 of the spanning feature 130. As would be understood by one of ordinary skill in the art in view of the present disclosure, this allows the spanning feature 130 to axially traverse the second through opening segment 188 when the larger lobe 140 of the spanning feature 130 is aligned with the larger width 196 of the second segment of the second through opening segment 188.

[0060] 11, the flanged segment 184 has a first flange portion 101 and a second flange portion 103. The first flange portion 101 projects into the through opening 112 and toward the lift pin axis 108 and has a first mounting surface 105 (shown in FIG. 11). The first mounting surface 105 is configured to mount the underside 116 of the weight body 172 on a first major lobe 140 (shown in FIG. 6) of the span feature 130 (shown in FIG. 6) such that the lift pin weight 104 is carried by the lift pin 102 when the first mounting surface 105 abuts the first major lobe 140 of the span feature 130 of the lift pin body 106. The second flange portion 103 is similar to the first flange portion 101 and is additionally diametrically opposed to the first flange portion 101 and has a second mounting surface 107 (shown in FIG. 11 ). The second mounting surface 107 is similar to the first mounting surface 105 and is additionally configured to mount the weight body 172 on the second larger lobe 144 of the spanning feature 130 when the second mounting surface 107 abuts the top surface of the second larger lobe 144 of the spanning feature 130. As will be understood by one of ordinary skill in the art in view of the present disclosure, abutting the second mounting surface 107 against the top surface of the second larger lobe 144 allows the lift pin weight 104 to be carried by the lift pin 102 such that the center of gravity of the lift pin weight 104 is on the lift pin axis 108.

[0061] It is contemplated that the first flange portion 101 and the second flange portion 103 define a flanged portion major width 109 and a flanged portion minor width 111. The flange portion minor width 111 extends between the first flange portion 101 and the second flange portion 103 and is smaller than the major width 136 (shown in FIG. 9 ) of the span feature 130 (shown in FIG. 6 ) and is substantially equal to (or larger than) the minor width 138 (shown in FIG. 6 ) of the span feature 130. The flange portion major width 109 is orthogonal to the flange portion minor width 111 and is larger than the flange portion minor width 111, is larger than the minor width with the span feature 130 minor width 138, and is substantially equal to or larger than the major width 136 of the span feature 130. As would be understood by one of ordinary skill in the art in view of the present disclosure, sizing the larger width 109 of the flanged portion to be substantially equal in size to the larger width 136 of the span feature 130 allows the span feature 130 of the lift pin body 106 to axially traverse the flanged segment 184 of the through opening 112 when the lift pin weight 104 is rotated about the lift pin axis 108 and aligned onto the lift pin 102, such that the larger width 136 of the span feature 130 overlaps the larger width 109 of the flanged portion. As will also be understood by one of ordinary skill in the art in light of the present disclosure, sizing the flanged portion minor width 111 to be smaller than the span feature major width 136 allows the first flange portion 101 and second flange portion 103 to be attached to the span feature 130 of the lift pin body 106 such that the lift pin weight 104 is carried by the lift pin 102 as the lift pin weight 104 rotates such that the flanged portion minor width 111 overlaps the span feature major width 136 of the span feature 130.

[0062] 13-16, assembly of the lift pin arrangement 100 is illustrated. As shown in FIG. 13, the lift pin 102 is first slidably received within a lift pin opening 262 (shown in FIG. 2) defined within the substrate support 224 (shown in FIG. 2). It is contemplated that the lift pin 102 is slidably received within the lift pin opening 262 such that the contact pad 124 is attached within an upper surface of the substrate support 224 and the spanning feature 130 hangs from the substrate support 224 within a lower chamber 252 of the chamber body 210 (shown in FIG. 2). In this regard, it is contemplated that at least a portion of the neck segment 128 and the stem segment 126 of the lift pin body 106 are axially between the spanning feature 130 and the lower surface of the substrate support 224. The weight body 172 is then positioned along the lift pin axis 108 within the lower chamber 252 of the chamber body 210 such that the through opening 112 extends about the lift pin axis 108. The weight body 172 is then rotated about the lift pin axis 108 so that the larger width 109 of the flange portion (shown in FIG. 11 ) is aligned with and axially overlaps the larger width 136 of the span feature 130 (shown in FIG. 9 ).

[0063] 14 , the weight body 172 is then translated relative to the lift pin body 106 along the lift pin axis 108 toward the contact pad 124 of the lift pin body 106 such that the flanged segment 184 of the through aperture 112 defined in the weight body 172 is axially between the span feature 130 and the stem segment 126 of the lift pin body 106. At this point, it is contemplated that the flanged segment 184 of the through aperture 112 defined in the weight body 172, and more specifically the first flange portion 101 and the second flange portion 103 of the weight body 172, laterally overlap the neck segment 128 of the lift pin body 106 along the lift pin axis 108.

[0064] 15, weight body 172 is then rotated, for example, by approximately 90 degrees about lift pin axis 108 such that first and second flange portions 101, 103 axially overlap first and second major lobes 140, 144 of span feature 130. As shown in FIG. 16, weight body 172 is then translated along lift pin axis 108 such that first and second mounting surfaces 105, 107 abut the top surfaces of first and second major lobes 140, 144 of span feature 130, respectively.

[0065] As will be understood by one of ordinary skill in the art in light of this disclosure, this secures the lift pin weight 104 of the lift pin 102 to the span feature 130 such that the lift pin 102, and through it the substrate support 224 (shown in FIG. 2 ), carries the lift pin weight 104. As will also be understood by one of ordinary skill in the art in light of this disclosure, the first mounting surface 105 and the second mounting surface 107 may be axially offset from the lower surface 116 of the weight body 172 a distance substantially equivalent to the vertical height of the first major lobe 140 and the second major lobe 144, to limit (or completely prevent) axial translation of the lift pin weight 104 relative to the lift pin 102 during movement of the lift pin actuator 230 (shown in FIG. 2 ) prior to movement of the lift pin 102 between the first position 264 (shown in FIG. 2 ) and the second position 266 (shown in FIG. 2 ).

[0066] 17, a method 300 of making a lift pin arrangement for a semiconductor processing system, such as lift pin arrangement 100 (shown in FIG. 1) for semiconductor processing system 200 (shown in FIG. 1), is shown. Method 300 includes supporting a lift pin including a lift pin body within a lift pin opening extending through a substrate support, as shown in box 310, e.g., lift pin 102 (shown in FIG. 2) includes lift pin body 106 (shown in FIG. 6) within lift pin opening 262 (shown in FIG. 2) extending through substrate support 224 (shown in FIG. 2). Method 300 also includes disposing a lift pin weight having a weight body defining a through opening therethrough along a lift pin axis defined by the lift pin body, e.g., lift pin weight 104 (shown in FIG. 2) including weight body 172 (shown in FIG. 10) defining a through opening 112 (shown in FIG. 10) along lift pin axis 108 (shown in FIG. 6), as shown in box 320. Method 300 further includes, as shown by boxes 330 and 340, rotating the weight body about the lift pin axis such that a larger width of the flanged portion defined within the through opening of the weight body is aligned with a larger width of the span feature of the lift pin body, e.g., larger width 109 (shown in FIG. 11 ) of the flanged portion is aligned with larger width 136 (shown in FIG. 6 ) of span feature 130 (shown in FIG. 6 ), and translating the weight body along the lift pin axis such that the span feature of the lift pin body is axially between a contact pad of the lift pin body, e.g., contact pad 124 (shown in FIG. 6 ), and the span feature of the lift pin body.

[0067] The weight body is then rotated about the lift pin axis, as shown by boxes 350 and 360, such that the first and second flange portions of the weight body axially overlap the larger width of the span feature of the lift pin body, e.g., first flange portion 101 (shown in FIG. 11 ) and second flange portion 103 (shown in FIG. 11 ) overlap the larger width of the span feature of the lift pin body, and the weight body is translated along the lift pin axis in a direction axially opposite the contact pad of the lift pin body, such that the first and second flange portions of the weight body abut the span feature of the lift pin body. It is contemplated that the abutment of the first and second flange portions on the span feature is such that the lift pin body applies a downward force to the lift pin during sliding movement of the lift pin through the substrate support, e.g., during movement of the lift pin between first and second positions through the substrate support during installation and removal of a substrate within a chamber arrangement of a semiconductor processing system. It is also contemplated that the lift pin arrangement may be one of three lift pin arrangements included in the semiconductor processing system, as indicated by arrow 380.

[0068] Semiconductor processing systems, such as those employed to deposit material layers using chemical vapor deposition techniques such as epitaxy and atomic layer deposition techniques, generally require a substrate to be mounted on a substrate support prior to material layer deposition and then removed from the substrate support after material layer deposition. Mounting and removing the substrate from the substrate support may be accomplished using lift pins, which may move between retracted and extended positions relative to the substrate support, or the substrate may be mounted on and removed from the substrate support, or the lift pins may be recessed or protruding from the substrate support as a result of the substrate support being driven between a processing position and a load / unload position. As explained above, in some deposition processes, the lift pins may bind in the substrate support, such as when the lift pins tilt in the lift pin openings and / or when material adheres on the lift pins and / or accumulates in the lift pin openings that receive the lift pins, disrupting the operation of the semiconductor processing system.

[0069] In the embodiments described herein, a lift pin arrangement is provided that includes a lift pin and a lift pin weight supported by the lift pin. Advantageously, the lift pin weight establishes a center of gravity of the lift pin arrangement below the center of gravity of the lift pin, increasing the magnitude of the horizontal force component required to tilt the lift pin, thereby limiting the tendency for binding in the lift pin opening due to tilt. Of further advantage, the lift pin weight increases the downward force on the lift pin, increasing the resistance that deposited material must apply to the lift pin to bind the lift pin in the lift pin opening, limiting the tendency that such deposition of material may have to cause the lift pin in the lift pin opening.

[0070] In the embodiments described herein, the lift pin has a lift pin body including a contact pad and an opposing span feature separated by a neck segment, and the lift pin weight has a through aperture and is attached to the lift pin by receiving the lift pin in the through aperture and attaching the lift pin weight over the span feature. The lift pin weight may be fixed in rotation about the lift pin either in a geometry defined by the span feature and / or in the through aperture extending through the lift pin weight, as well as through cooperation of a keeper received about the lift pin. As will be appreciated by those skilled in the art in view of the present disclosure, this may not only simplify assembly of the lift pin assembly, for example, by avoiding the need for fasteners and / or the employment of tools to assemble the lift pin arrangement, but may also provide the aforementioned advantages regarding reliability of the lift pin during operation of a semiconductor processing system employing the lift pin arrangement.

[0071] The illustrations presented herein are not meant to be actual figures of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of the present disclosure. The specific implementations shown and described are illustrative of the present invention and its best mode, and are not intended to otherwise limit the scope of aspects and implementations in any way. Indeed, for the sake of brevity, conventional manufacturing, association, preparation, and other functional aspects of the system may not be described in detail. Furthermore, the connecting lines shown in the various figures are intended to represent exemplary functional relationships and / or physical connections between the various elements. Many alternative or additional functional relationships or physical connections may be present in an actual system and / or may not be present in some embodiments.

[0072] It should be understood that the configurations and / or approaches described herein are exemplary in nature, and that these specific embodiments or examples are not to be construed in a limiting sense, as numerous variations are possible. The specific routines or methods described herein may represent one or more of any number of processing strategies. Thus, various illustrated operations may be performed in the order illustrated, or in other orders, or may be omitted in some cases.

[0073] The subject matter of the present disclosure includes all novel and non-obvious combinations and subcombinations of the various processes, systems, and configurations, and other features, functions, operations and / or properties disclosed herein, as well as all equivalents thereof. [Explanation of symbols]

[0074] 102 Lift pin 106 Lift pin body 108 Lift pin shaft 124 Contact Pad 126 Stem Segment 128 Neck Segment 130 Span Features 200 Semiconductor Processing System 202 Precursor Source 204 Chamber Arrangement 206 Exhaust Source 208 Controller

Claims

1. A lift pin, A lift pin body disposed along a lift pin axis, a contact pad defined at a first end of the lift pin body; a stem segment extending from the contact pad; a neck segment extending from the stem segment; a spanning feature defined at a second end of the lift pin body and connected to the contact pad by the neck segment and the stem segment of the lift pin body; a lift pin, the spanning feature having a minor width and a major width, the minor width being substantially equal to and greater than a neck diameter defined by the neck segment of the lift pin body, the major width being greater than a stem diameter defined by the neck segment of the lift pin body.

2. The lift pin of claim 1 , wherein the lift pin body is formed from a ceramic material.

3. The lift pin of claim 1 , wherein the smaller width is offset from the larger width by approximately 90 degrees about the lift pin axis.

4. 2. The lift pin of claim 1, wherein the spanning feature has a major lobe and a minor lobe, the major width spanning the major lobe and the minor width spanning the minor lobe.

5. 5. The lift pin of claim 4, wherein said major lobe is a first major lobe and said spanning feature has a second major lobe separated from said first major lobe by said minor lobe.

6. The lift pin of claim 5 , wherein said second major lobe is offset from said first major lobe by approximately 180 degrees.

7. 5. The lift pin of claim 4, wherein the minor lobe is a first minor lobe and the spanning feature has a second minor lobe, the second minor lobe separated from the first minor lobe by the larger lobe.

8. The lift pin of claim 7 , wherein the second minor lobe is offset from the first minor lobe by approximately 180 degrees.

9. 2. The lift pin of claim 1 , wherein the spanning feature has a first planar surface and a second planar surface, and the smaller width intersects both the first planar surface and the second planar surface.

10. The lift pin of claim 9 , wherein the spanning feature has two or more arcuate surfaces defined between the major width and the minor width.

11. The lift pin of claim 10 , wherein the spanning feature has an intermediate planar surface offset from both the major width and the minor width.

12. 10. The lift pin of claim 9, wherein the first planar surface and the second planar surface are two of at least six planar surfaces defined by the spanning feature, the spanning feature having at least eight arcuate surfaces.

13. 1. A lift pin arrangement comprising: A lift pin according to claim 1 ; a lift pin weight including a weight body having an aperture therethrough, the aperture having a flanged segment; a lift pin weight carried by the spanning feature of the lift pin body through first and second flange portions of the flanged segment of the through opening and extending radially toward the lift pin axis defined by the lift pin body of the lift pin;

14. 14. The lift pin arrangement of claim 13, wherein the through opening has a first through opening segment and a second through opening segment separated by a plurality of flanges, the first through opening segment connecting an upper surface of the weight body to the plurality of flanges, and the second through opening segment connecting the plurality of flanges to a lower surface of the weight body.

15. 15. The lift pin arrangement of claim 14, wherein the first through opening segment has a generally circular shape between the upper surface of the weight body and the plurality of flanges in the through opening, and the second through opening segment has a generally cruciform shape extending between the lower surface of the weight body and the plurality of flanges in the through opening.

16. 15. The lift pin arrangement of claim 14, wherein the first through opening segment has a diameter substantially equal to a width of the stem segment of the lift pin body, the second through opening segment has a second segment major width greater than the larger width of the span feature of the lift pin body, and the second through opening segment has a second segment minor width less than the larger width of the span feature of the lift pin body.

17. 15. The lift pin arrangement of claim 14, wherein the lift pin weight has a frusto-conical shape, the first through opening segment has a diameter substantially equal to a width of the stem segment of the lift pin body, and the second through opening segment has a second segment greater width that is substantially equal to the greater width of the span feature of the lift pin body.

18. 1. A semiconductor processing system comprising: a chamber body formed from a quartz material; a substrate support disposed within the chamber body and configured to support a substrate during deposition of a layer of material onto the substrate; a lift pin as in claim 1 slidably received in a lift pin opening extending through the substrate support; a lift pin weight having a through opening extending therethrough, a portion of the stem segment and the span feature being disposed within the through opening of the lift pin weight, and the lift pin weight being carried by the lift pin through the span feature and the neck segment of the lift pin.

19. 20. The semiconductor processing system of claim 18, wherein said lift pin body is formed from silicon carbide and said lift pin weight weight body is formed from quartz.

20. 1. A method of making a lift pin arrangement for a semiconductor processing system, comprising:

1. A lift pin comprising: a lift pin body disposed along a lift pin axis, the lift pin body including: a contact pad defined at a first end of the lift pin body; a stem segment extending from the contact pad; a neck segment extending from the stem segment; and a spanning feature defined at a second end of the lift pin body and connected to the contact pad by the neck segment and the stem segment of the lift pin body, the spanning feature having a minor width and a major width, the minor width being substantially equal to a neck diameter defined by the neck segment of the lift pin body, the major width being greater than the minor width, the major width being greater than a stem diameter defined by the neck segment of the lift pin body. providing a lift pin weight having a weight body defining a through opening therethrough along the lift pin axis; rotating the weight body about the lift pin axis whereby a greater width of a flanged portion is aligned with the greater width of the span feature of the lift pin body; translating the weight body along the lift pin axis such that the spanning feature is axially between the contact pad of the lift pin body and the spanning feature of the lift pin body; rotating the weight body about the lift pin axis whereby a first flange portion and a second flange portion of the weight body overlap the greater width of the span feature of the lift pin body; translating the weight body along the lift pin axis in a direction opposite to the contact pad, whereby the first and second flange portions of the weight body abut the span feature of the lift pin body; whereby the lift pin weight is carried by the span feature of the lift pin body to apply a downward force to the lift pin during movement of the lift pin through a substrate support within a chamber arrangement of the semiconductor processing system.

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