Lift pins, lift pin arrangements, semiconductor processing systems with lift pin arrangements, and methods of making lift arrangements for semiconductor processing systems

Abstract

To provide lift pins, lift pin arrangements, semiconductor processing systems with lift pin arrangements, and methods of making lift arrangements for semiconductor processing systems.SOLUTION: A lift pin includes a lift pin body arranged along a lift pin axis having an enlarged contact pad, a stem segment extending axially from the contact pad, a neck segment extending axially from the stem segment and separated from the contact pad by the stem segment of the lift pin body, and a base segment extending axially from the neck segment and separated from the stem segment by the neck segment. The base segment of the lift pin body has a base segment width, the neck segment of the lift pin body has a neck segment width, and the neck segment width is smaller than the base segment width to carry lift pin weight with the lift pin body. Lift pin arrangements, semiconductor processing systems including lift pin arrangements, and methods of making lift pin arrangements for semiconductor processing systems are also described.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates generally to depositing a layer of material on a substrate. More specifically, the present disclosure relates to loading and unloading a substrate from a substrate support before and after deposition of a layer of material on the substrate, such as during deposition of a layer of material during the manufacture of a semiconductor device. [Background technology]

[0002] A material layer is typically deposited on a substrate during the manufacture of semiconductor devices, such as during the manufacture of logic and memory devices. Deposition is typically accomplished by mounting the substrate on a substrate support in a reaction chamber, heating the substrate to a desired deposition temperature, and exposing the substrate to a material layer precursor under environmental conditions selected to deposit a material layer on the substrate. Once the material layer develops the desired properties, exposure of the substrate to the material layer precursor is typically terminated, and the substrate is detached from the substrate support and removed from the reaction chamber to undergo further processing appropriate for the semiconductor device being manufactured. Mounting can be accomplished using lift pins, which are typically slidably housed within the substrate and slide through the substrate to mount and remove the substrate from the substrate support.

[0003] One challenge to the use of lift pins to load and unload a substrate in a reaction chamber is the accumulation of material within a defined mechanical clearance within the reaction chamber, such as between the lift pin and the substrate support. For example, in some material layer deposition operations, material can accumulate on the stem of the lift pin. The accumulated material can be carried by the stem of the lift pin during movement of the lift pin through the substrate support, which can increase the resistance to the sliding movement of the lift pin through the substrate support and / or bind the lift pin within the substrate support. Material can also accumulate on the tip of the lift pin when loaded onto the substrate, which increases the force that needs to be applied to the lift pin to initiate the sliding of the lift pin through the substrate support and unload the substrate from the substrate support when deposition of the material layer is completed. Additionally, static electricity and / or charges between the substrate support and the lift pin can prevent the lift pin from sliding through the substrate support.

[0004] There are various measures to limit the binding of the lift pins in the substrate support. For example, the lift pins may be maintained at a temperature different from that required for the deposition of the material layer in the reaction chamber, thereby limiting the tendency of material to accumulate on the lift pins. The lift pins may be isolated from the material layer precursors used during the deposition process, for example by the use of bellows or by providing a purge flow to the lift pins, thereby also limiting the tendency of material to accumulate on the lift pins during the deposition of the material layer on the substrate. Also, the interior of the reaction chamber may be etched after the deposition of the material layer on the substrate, thereby removing accumulated material before it reaches a size sufficient to bind the lift pins in the substrate support. While generally satisfactory for their intended purposes, such measures may further complicate the construction of the reaction chamber and / or increase the cost of ownership of the reaction chamber due to increased use of consumables and / or reduced throughput of the reaction chamber.

[0005] Such systems and methods have generally been satisfactory for their intended purposes. However, a need remains for improved lift pins, lift pin arrangements and semiconductor processing systems, and methods of making lift pin arrangements for semiconductor processing systems. The present solution provides a solution to this need. Summary of the Invention

[0006] A lift pin is provided. The lift pin includes a lift pin body disposed along a lift pin axis. The lift pin body has an enlarged contact pad, a stem segment, a neck segment, and a base segment. The stem segment of the lift pin extends axially from the contact pad. The neck segment of the lift pin body extends axially from the stem segment and is separated from the contact pad by the stem segment of the lift pin body, and has a neck segment width. The base segment of the lift pin body extends axially from the neck segment and is separated from the stem segment by the neck segment, and has a base segment width. The base segment width is greater than the neck segment width to carry a weight together with the lift pin body.

[0007] In addition to or as an alternative to one or more of the above features, further embodiments of the lift pin may include that the lift pin body is formed from a ceramic material.

[0008] In addition to or as an alternative to one or more of the above features, further examples of the lift pin may include the contact pad having a contact pad width, the stem segment having a stem segment width, and the stem segment width being smaller than the contact pad width and larger than the neck segment width.

[0009] In addition to or as an alternative to one or more of the above features, further embodiments of the lift pin may include a base segment of the lift pin body having an annular mounting surface and a hemispherical portion. The annular mounting surface may extend around the neck segment of the lift pin body and oppose the stem segment of the lift pin body. The annular mounting surface may be orthogonal to the lift pin axis.

[0010] In addition to or as an alternative to one or more of the above features, further examples of the lift pin may include the base segment having a base segment height, the neck segment having a neck segment height greater than the base segment height, the contact pad having a contact pad height greater than the neck segment height, and the stem segment having a stem segment height greater than the contact pad height.

[0011] A lift pin arrangement is provided that includes a lift pin as described above, a weight, and a cap member. The weight is mounted on a base segment of the lift pin body and is axially fixed and radially free relative to the lift pin body. The cap member is slidably received on the lift pin body and extends circumferentially around the weight. The cap member is further axially free and radially fixed relative to the lift pin body.

[0012] In addition to or as an alternative to one or more of the above features, further examples of the lift pin arrangement may include the lift pin body having a lift pin body center of gravity disposed along the lift pin axis, the weight having a weight center of gravity radially offset from the lift pin axis, and the cap member having a cap member center of gravity radially offset from the lift pin axis. The lift pin arrangement may have a lift pin arrangement center of gravity that is offset from the lift pin axis.

[0013] In addition to or in place of one or more of the features described above, further examples of lift pin arrangements can include the weight having a weight width and a recess. The recess may have a recess depth that spans more than half the weight width of the weight.

[0014] In addition to or as an alternative to one or more of the above features, further examples of lift pin arrangements may include the weight defining an internal shoulder facet substantially perpendicular to the lift pin axis. The weight may have a C-shaped upper surface and a C-shaped lower surface axially opposite the C-shaped upper surface and parallel to the internal shoulder facet. The internal shoulder facet may be axially spaced from the base segment of the lift pin body by a neck segment height of the neck segment.

[0015] In addition to or as an alternative to one or more of the above-mentioned features, further examples of the lift pin arrangement may include the cap member having an axially extending key portion slidably received within a recess in the weight body.

[0016] In addition to or as an alternative to one or more of the above features, further examples of lift pin arrangements may include the recess having a recess width, and the neck segment width being substantially equal to the recess width.

[0017] In addition to or as an alternative to one or more of the above features, further examples of the lift pin arrangement may include the cap member having an annular upper surface and an annular lower surface. The annular upper surface of the cap body may extend circumferentially around the stem segment of the lift pin body and radially secure the cap member relative to the lift pin body. The annular lower surface of the cap member may extend around the weight and radially secure the weight relative to the cap member.

[0018] In addition to or in place of one or more of the above features, further examples of the lift pin arrangement may include the lift pin body being formed from aluminum oxide (Al2O3), the lift pin weight being formed from aluminum oxide (Al2O3), and the cap member being formed from aluminum oxide (Al2O3).

[0019] In addition to or as an alternative to one or more of the above features, further examples of the lift pin arrangement may include the cap member having a cap member axial height, the weight having a weight body axial height, and the cap member axial height being greater than the weight body axial height.

[0020] In addition to or as an alternative to one or more of the above features, further examples of lift pin arrangements may include the cap member having a cap member interior width, the weight having a weight width, and the cap member interior width being greater than the weight width. The cap member interior width may be equal to the weight width.

[0021] A semiconductor processing system is provided that includes a chamber body having an inlet port and an exhaust port, a showerhead, a substrate support, and the lift pins described above. The showerhead is secured within the chamber body between the inlet port and the exhaust port. The substrate support is disposed within the chamber body between the showerhead and the exhaust port. The substrate support further defines a lift pin opening therein, and the stem segment of the lift pin body is slidably received within the lift pin opening.

[0022] In addition to or in the alternative to one or more of the features discussed above, further embodiments of the semiconductor processing system may include a substrate support having a first position and a second position, the second position being capable of isolating the first position from the showerhead, and a substrate support actuator being operatively connected to the substrate support to move the substrate support between the first position and the second position.

[0023] In addition to or in place of one or more of the features discussed above, further examples of the semiconductor processing system may include a weight having a recess for receiving the neck segment of the lift pin body and a cap member. The cap member may have a stem segment opening and a weight opening, the stem segment of the lift pin body may be slidably received within the stem segment opening, and the weight may be slidably received within the weight opening.

[0024] In addition to or as an alternative to one or more of the above-mentioned features, further examples of the semiconductor processing system may include the recess having a first recess width and a second recess width, the second recess width being axially offset from the first recess width, and the first recess width being substantially equal to a stem segment width of the lift pin body. The second recess width defined by the weight may be substantially equal to a neck segment width defined by a neck segment of the lift pin body.

[0025] A method of making a lift pin arrangement for a semiconductor processing system is provided. The method includes aligning a cap member on a lift pin axis of the lift pin described above, and translating the cap member in a first direction along the lift pin axis such that a stem segment of the lift pin body is slidably received within the cap member. A weight is positioned along the lift pin axis, the weight is rotated such that a recess faces a neck segment of the lift pin body, and the weight is shifted relative to the lift pin body such that the neck segment of the lift pin body is slidably received within the recess. The cap member is then translated in a second direction along the lift pin body such that the cap member encapsulates the weight, whereby the lift pin body carries the weight.

[0026] This Summary is provided to introduce a selection of concepts in a simplified form that are described in more detail below in the Detailed Description of Examples of the Disclosure. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0027] These and other features, aspects, and advantages of the invention disclosed herein are described below with reference to drawings of specific embodiments that are intended to illustrate, but not to limit, the invention. [Brief description of the drawings]

[0028] [Figure 1] FIG. 1 is a schematic diagram of a semiconductor processing system including a chamber arrangement according to the present disclosure, showing a lift pin arrangement including a lift pin body and a weight secured to the lift pin by a cap member within the chamber arrangement. [Diagram 2] FIG. 2 is a schematic diagram of the chamber arrangement of FIG. 1 according to an embodiment of the present disclosure, showing the lift pins of the lift pin arrangement slidably housed within the substrate support and the lift pins having a carried weight that hangs below the substrate support. [Diagram 3] 3-6 are schematic diagrams of the chamber arrangement of FIG. 1 in accordance with an embodiment of the present disclosure, sequentially showing the substrate support moving between a first position and a second position to load and unload a substrate using a lift pin arrangement. [Figure 4] 3-6 are schematic diagrams of the chamber arrangement of FIG. 1 in accordance with an embodiment of the present disclosure, sequentially showing the substrate support moving between a first position and a second position to load and unload a substrate using a lift pin arrangement. [Diagram 5] 3-6 are schematic diagrams of the chamber arrangement of FIG. 1 in accordance with an embodiment of the present disclosure, sequentially showing the substrate support moving between a first position and a second position to load and unload a substrate using a lift pin arrangement. [Figure 6]3-6 are schematic diagrams of the chamber arrangement of FIG. 1 in accordance with an embodiment of the present disclosure, sequentially showing the substrate support moving between a first position and a second position to load and unload a substrate using a lift pin arrangement. [Figure 7] FIG. 7 is an exploded view of the lift pin arrangement of FIG. 1 showing the cap member and weight separated from the lift pin along a lift pin axis defined by the lift pin in accordance with an embodiment of the present disclosure. [Figure 8] 8 and 9 are side and perspective views, respectively, of a base segment of a lift pin included in the lift pin arrangement of FIG. 1 according to an embodiment of the present disclosure, illustrating the bearing surface and hemispherical surface of the base segment of the lift pin. [Figure 9] 8 and 9 are side and perspective views, respectively, of a base segment of a lift pin included in the lift pin arrangement of FIG. 1 according to an embodiment of the present disclosure, illustrating the bearing surface and hemispherical surface of the base segment of the lift pin. [Figure 10] FIG. 10 is a top view of a weight included in the lift pin arrangement of FIG. 1 according to an embodiment of the present disclosure, illustrating a recess and a shoulder defined therein for axially securing the weight to the lift pin body. [Figure 11] FIG. 11 is a perspective view of a weight included in the lift pin arrangement of FIG. 1 according to an embodiment of the present disclosure, illustrating a recess and a shoulder defined therein for axially securing the weight to the lift pin body. [Figure 12] FIG. 12 is a top view of a cap member included in the lift pin arrangement of FIG. 1 according to an embodiment of the present disclosure, showing the stem segment opening and the weight opening, respectively, with an axially keyed portion therebetween. [Figure 13] FIG. 13 is a perspective view of a cap member included in the lift pin arrangement of FIG. 1 according to an embodiment of the present disclosure, showing the stem segment opening and the weight opening, respectively, with an axial key portion therebetween. [Figure 14]FIG. 14 is a perspective view of the lift pin arrangement of FIG. 1 showing a weight and a cap member assembled onto the lift pins of the lift pin arrangement in accordance with an embodiment of the present disclosure. [Figure 15] FIG. 15 is a cross-sectional side view of a portion of the lift pin arrangement and semiconductor processing system of FIG. 1 showing the lift pins slidably housed within the substrate support and the lift pin weights depending from the substrate support. [Figure 16] FIG. 16 is a cross-sectional side view of a portion of the lift pin arrangement of FIG. 1 showing the neck segment of the lift pin body and the key portion of the cap body received within a recess in the weight body in accordance with an embodiment of the present disclosure. [Figure 17] FIG. 17 is a cross-sectional top view of the lift pin arrangement of FIG. 1 in accordance with an embodiment of the present disclosure, showing a key portion received within a recess defined in the weight such that the weight is rotationally fixed about an axis of rotation relative to the cap member and freely rotatable about an axis of rotation relative to the lift pin. [Figure 18] FIG. 18 is a block diagram of a method for fabricating a lift pin arrangement for a semiconductor processing system according to the present disclosure, illustrating operation of the method according to a non-limiting example embodiment of the method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] It will be appreciated that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale - for example, the relative size of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of the illustrated embodiments of the present disclosure.

[0030] Reference is now made to the drawings, in which like reference numbers identify similar structural features or aspects of the presently disclosed subject matter. For purposes of explanation and illustration, and not by way of limitation, a partial view of a lift pin according to the present disclosure is shown in FIG. 1 and generally designated by reference number 100. Other examples of lift pins, lift pin arrangements, and semiconductor processing systems including lift pin arrangements, as well as methods of making lift pin arrangements for semiconductor processing systems, or aspects thereof, according to the present disclosure are provided in FIGS. 2-18, which will now be described. The systems and methods of the present disclosure may be used to load and unload substrates in chamber arrangements having downflow structures, such as semiconductor processing systems used to deposit material layers using plasma-enhanced chemical vapor deposition and atomic layer deposition, although the present disclosure is not generally limited to any particular chamber arrangement structure or material layer deposition technique.

[0031] Referring to FIG. 1, a semiconductor processing system 200 is shown. The semiconductor processing system 200 generally includes a precursor source 202, a chamber arrangement 204, an exhaust source 206, and a controller 208. The precursor source 202 is configured to provide a flow of material layer precursor 10 to the chamber arrangement 204. The chamber arrangement 204 is connected to the precursor source 202, includes a lift pin arrangement 100, and is configured to expose the substrate 2 to the material layer precursor 10 under environmental conditions to deposit a material layer 4 on the substrate 2. The exhaust source 206 is connected to the chamber arrangement 204 and is configured to convey a flow of residual precursors and / or reaction products 12 to an external environment 14 outside the semiconductor processing system 200. The controller 208 is operatively connected to the semiconductor processing system 200, for example, via a wired or wireless link 210, and is configured to control the operation of the semiconductor processing system 200.

[0032] The term "substrate" as used herein may refer to any underlying material(s), including any underlying material(s) that may be modified or upon which a device, circuit, or film may be formed. A "substrate" may be continuous or non-continuous, rigid or flexible, solid or porous, and combinations thereof. A substrate may be in any form, such as, but not limited to, a powder, a plate, or a workpiece. Substrates in the form of plates may include wafers of various shapes and sizes, including, for example, 300 millimeter wafers.

[0033] The substrate may be formed from semiconductor materials, including, for example, silicon (Si), silicon germanium (SiGe), silicon oxide (SiO2), gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC). The substrate may include blanket-type substrates, patterned or unpatterned. As an example, a substrate in powder form may have applications for pharmaceutical manufacturing. A porous substrate may include one or more polymers. Examples of workpieces may include medical devices (e.g., stents and syringes), jewelry, tooling devices, components for battery manufacturing (e.g., anodes, cathodes, or separators), or components of photovoltaic cells, etc.

[0034] 2, a chamber arrangement 204 is shown according to an embodiment of the present disclosure. In the illustrated embodiment, the chamber arrangement 204 has a downflow configuration and in this regard includes a chamber body 212, a showerhead 214, a substrate support 216, and a bellows member 218. As shown and described herein, the chamber arrangement 204 also includes a substrate support actuator 220, a gate valve 222, a substrate transfer robot 224, and a lift pin arrangement 100. Although shown and described herein as including certain elements and having a certain arrangement (e.g., a downflow configuration), it should be understood and appreciated that a chamber arrangement may include additional elements and / or exclude certain elements shown and described herein and / or have a different arrangement and remain within the scope of the present disclosure.

[0035] The chamber body 212 may be formed from a metallic material 226 and has an inlet port 228 and an exhaust port 230. The inlet port 228 is connected to a precursor source 202 (shown in FIG. 1 ) by a precursor supply conduit 232 and configured to receive a flow of material layer precursor 10 therethrough. The exhaust port 230 is connected to an exhaust source 206 (shown in FIG. 1 ) by an exhaust conduit 234 and configured to provide a flow of residual precursor and / or reaction products 12 generated from the chamber arrangement 204 during deposition of a material layer 4 on a substrate 2 to an external environment 14 (shown in FIG. 1 ) outside the semiconductor processing system 200 (shown in FIG. 1 ). In certain embodiments, the metallic material 226 may include aluminum, for example, a low copper content aluminum alloy. According to certain embodiments, the metallic material 226 may include a stainless steel material, such as a low copper content stainless steel alloy.

[0036] The showerhead 214 is formed from a showerhead material 236 and is secured within an interior 238 of the chamber body 212, separating the interior 238 of the chamber body 212 into a distribution plenum 240 and a process volume 242. The showerhead 214 further defines a plurality of flow openings 244 therethrough that fluidly connect the distribution plenum 240 to the process volume 242, and thus the inlet port 228 to the exhaust port 230, for providing the material layer precursor 10 to the substrate 2. In certain embodiments, the showerhead material 236 may include aluminum, such as a low copper content aluminum alloy. According to certain embodiments, the showerhead material 236 may include a stainless steel material, such as a low copper content stainless steel material.

[0037] The substrate support 216 is disposed within the interior 238 of the chamber body 212 along a drive axis 246 and is movable between a first position 248 and a second position 250. The first position 248 is proximate to the showerhead 214 and the second position 250 is axially separated from the showerhead 214 by the first position 248, and a substrate support actuator 220 is operatively connected to the substrate support 216 to move the substrate support 216 along the drive axis 246 between the first position 248 and the second position 250. In this regard, the substrate support actuator 220 may extend into the interior 238 of the chamber body 212 and be coupled to the substrate support 216 by a pedestal member 252 enclosed within a bellows member 218. In further accordance with certain aspects, the substrate support actuator 220 may be operatively associated with the controller 208 (shown in FIG. 1 ) for exposing the substrate 2 to the material layer precursor 10 when in the first position 248 to deposit a material layer 4 on the substrate 2, and for loading and unloading the substrate 2 from the substrate support 216 by translating the substrate support 216 along the drive axis 246 between the first position 248 and a second position 250 within the interior 238 of the chamber body 212.

[0038] The lift pin arrangement 100 is slidably received within the substrate support 216 and is movable therein between a retracted position 254 in which the lift pin arrangement 100 is recessed within an upper surface 256 of the substrate support 216 and an extended position 258 (view A) in which the lift pin arrangement 100 protrudes above the upper surface 256 of the substrate support 216. In this regard, it is contemplated that the substrate support 216 defines a plurality of lift pin openings 260 therein, the lift pin arrangement 100 being one of a plurality of lift pin arrangements 100 included in the chamber arrangement 204, and each of the plurality of lift pin openings 260 slidably receiving a respective one or more lift pin arrangements 100 therein for loading and unloading a substrate, e.g., substrate 2, from the substrate support 216. In the illustrated embodiment, the substrate support 216 has three (3) lift pin openings distributed circumferentially around the drive shaft 246. This is for illustrative and descriptive purposes only and is non-limiting. As will be appreciated by those of ordinary skill in the art in view of the present disclosure, fewer or additional lift pin arrangements may be included in the chamber arrangement and remain within the scope of the present disclosure.

[0039] 3-5, the lift pin arrangement 100 is used to load and unload a substrate 2 onto a substrate support 216. As shown in FIG. 3, loading is accomplished by driving the substrate support 216 downwardly within the interior 238 of the chamber body 212 along a drive shaft 246 using a substrate support actuator 220. Driving the substrate support 216 downwardly within the chamber body 212 causes the lift pin arrangement 100 to engage (e.g., abut) an interior surface 262 of the chamber body 212, and further translating 256 the substrate support 216 downwardly toward the interior surface 262 of the chamber body 212 causes the lift pin arrangement 100 to protrude above an upper surface 256 of the substrate support 216 until the substrate support 216 reaches a second position 250 and the lift pin arrangement 100 is in an extended position 258. When the substrate support 216 reaches the second position 250, the lift pin arrangement 100 protrudes above the top surface 256 of the substrate support 216 in an extended position 258. The gate valve 222 is then opened and the end effector carrying the substrate 2 advances into the interior 238 of the chamber body 212 so that the substrate 2 can be aligned with the substrate support 216 within the chamber body 212.

[0040] As shown in FIG. 4, once the substrate 2 is aligned with the substrate support 216, the substrate 2 may be transferred to the lift pin arrangement 100 and the substrate supported on the lift pin arrangement 100. The transfer may be accomplished using the substrate transfer robot 224 by performing a downward stroke of the end effector 264 (shown in FIG. 3). It is contemplated that the downward stroke transfers the substrate 2 to the lift pin arrangement 100, after which the substrate transfer robot 224 withdraws the end effector 264 from the interior 238 of the chamber body 212 and the gate valve 222 is closed. The substrate support actuator 220 then drives the substrate support 216 upward within the interior 238 of the chamber body 212 and along the drive shaft 246 in a direction toward the showerhead 214.

[0041] 5, mounting the substrate 2 on the substrate support 216 is accomplished by using the substrate support actuator 220 to drive the substrate support 216 upward along a drive shaft 246 toward the showerhead 214. Upward translation of the substrate support 216 along the drive shaft 246 causes the lift pin arrangement 100 to slide through the substrate support 216 within one of a plurality of lift pin openings 260 that slidably accommodate the lift pin arrangement 100, such that when the substrate support 216 approaches the first position 248, the lift pin arrangement 100 is mounted to an upper surface 256 of the substrate support 216, and when the lift pin arrangement 100 is in the first position 248, the lift pin arrangement 100 hangs from the substrate support 216 and above an interior surface 262 of the chamber body 212. The substrate 2 may then be exposed to a flow of material layer precursor 10 received from the precursor source 202 (shown in FIG. 1 ) via the inlet port 228 and the showerhead 214, the substrate 2 is heated to a predetermined material layer deposition temperature using one or more heating elements 266 and / or cooling circuits 268 disposed within the substrate support 216, and a material layer 4 is deposited on the substrate 2 using the flow of material layer precursor 10.

[0042] 6, once deposition of the material layer 4 is completed, the substrate 2 may be removed from the chamber body 212. Removal of the substrate 2 from the chamber body 212 may be accomplished by disengaging the substrate 2 from the substrate support 216 using the substrate support actuator 220 to drive the substrate support 216 along the drive shaft 246 from a first position 248 to a second position 250. Movement from the first position 248 to the second position 250 engages (e.g., abuts) the lift pin arrangement 100 with an interior surface 262 of the chamber body 212, thereby causing the lift pin arrangement 100 to slide upward through the substrate support 216 from a retracted position 254 (shown in FIG. 2) to an extended position 258. The gate valve 222 is then opened, the end effector 264 is again driven into the interior 238 of the chamber body 212 and positioned between the substrate 2 and the substrate support 216, the substrate 2 is transferred to the end effector 264 on an upward stroke, and the substrate 2 can be removed from the chamber body 212 by withdrawing the end effector 264 and the substrate 2 carried by the end effector 264 by the operation of the substrate transfer robot 224 through the gate valve 222. As will be appreciated by those skilled in the art in view of the present disclosure, substrate material layers may then be deposited onto subsequent substrates using the aforementioned operations, such as in a serial processing manner in which material layers are sequentially deposited onto single substrates in succession using a flow of material layer precursors 10 provided by the precursor source 202 to the chamber arrangement 204.

[0043] As explained above, material may accumulate on surfaces and structures located within the interior 238 of the chamber body 212 during some deposition operations, potentially reducing the reliability of the semiconductor processing system 200 (shown in FIG. 1 ). For example, material 14 (shown in FIG. 5 ) may accumulate on stem portions of lift pins slidably housed within one or more lift pin openings 260 that house the lift pins therein, and may bind the lift pins within one of the lift pin openings 260 during movement of the substrate support 216 between the first position 248 and the second position 250. Material 16 (shown in FIG. 5 ) may accumulate on the top surface 256 of the substrate support 216, and may bind the lift pins therein and within the substrate support 216 during movement of the substrate support 216 between the first position 248 and the second position 250. Also, material 18 (shown in FIG. 5 ) may accumulate between the substrate support 216 and a portion of the lift pin housed within the substrate support 216, increasing resistance to sliding of the lift pin through the substrate support 216 and potentially binding the lift pin within one of the plurality of lift pin openings 260 that house the lift pin during movement between the first position 248 and the second position 250. To limit (or eliminate) the risk of such lift pin binding, the lift pin arrangement 100 is provided.

[0044] Referring to FIG. 7, a lift pin arrangement 100 is shown in an embodiment of the present disclosure. In the illustrated example, the lift pin arrangement 100 includes a lift pin 102, a weight 104, and a cap member 106. The lift pin 102 is configured to support a substrate 2 (shown in FIG. 1) and suspend the weight 104 above an interior surface 262 (shown in FIG. 3) of a chamber body 212 (shown in FIG. 2) such that the mass of the weight 104 counters resistance to sliding movement of the lift pin 102 through the substrate support 216 (shown in FIG. 2) due to, for example, the accumulation of materials 14-18 (shown in FIG. 5). The weight 104 is configured to be secured to the lift pin 102 such that, for example, the weight 104 is axially secured to a lift pin axis 110 defined by the lift pin 102 and radially free to the lift pin axis 110 when mounted on the lift pin 102. The cap member 106 is configured to be slidably received on the lift pin 102 such that the cap member 106 is axially free and radially fixed relative to the lift pin 102, and the cap member 106 thereby captures the weight body 104 to radially fix it relative to the lift pin axis 110, and the cap member 106 cooperates with the lift pin 102 to secure the weight body 104 to the lift pin 102 without fastening or threading.

[0045] The lift pin 102 includes a lift pin body 108. The lift pin body 108 defines (or is disposed along) a lift pin axis 110 and has a contact pad 112, a stem segment 114, a neck segment 116, and a base segment 118. The contact pad 112 is configured to support the substrate 2 (shown in FIG. 1) during loading and unloading of the substrate 2 on the substrate support 216 (shown in FIG. 1), and in this regard may be radially expanded relative to other segments of the lift pin body 108, extends about the lift pin axis 110, and has a contact pad width 120 and a contact pad height 122. In certain embodiments, the contact pad 112 may have a cylindrical shape, with the contact pad width 120 being the diameter of the contact pad in such embodiments. In certain embodiments, the lift pin body 108 may be formed from a ceramic material 124. Examples of suitable ceramic materials include alumina, aluminum oxide (Al2O3), and silicon carbide (SiC). It is also contemplated that the lift pin body 108 may be formed from a carbonaceous material, such as, by way of non-limiting example, glassy carbon, and remain within the scope of the present disclosure.

[0046] The stem segment 114 of the lift body 108 is configured to be slidably received within the substrate support 216 (shown in FIG. 1 ) and in this respect extends axially from the contact pad 112 along the lift pin axis 110. In a further respect, the stem segment 114 has a stem segment width 126 and a stem segment height 128. The stem segment width 126 is less than the contact pad width 120 of the contact pad 112. The stem segment height 128 is greater than the contact pad height 122 of the contact pad 112. The stem segment 114 may be cylindrical in shape, the stem segment 114 defining a circular cross-sectional area, and the stem segment width 126 is a diameter in such an embodiment. The stem segment 114 and the contact pad 112 may further define a fillet therebetween, which reduces stress within the lift pin body 108.

[0047] The neck segment 116 of the lift pin body 108 is configured to axially secure the weight 104 along the lift pin body 108, and in this regard extends axially from the stem segment 114 and is separated from the contact pad 112 by the stem segment 114 of the lift pin body 108. It is contemplated that the neck segment 116 has a neck segment width 130 and a neck segment height 132. The neck segment width 130 may be less than the stem segment width 126 of the stem segment 114. The neck segment height 132 may be less than the stem segment height 128. It is further contemplated that the neck segment height 132 may be less than the contact pad height 122 of the contact pad 112, and that the neck segment 116 may be cylindrically shaped. The neck segment 116 may define a circular cross-sectional area, the neck segment width 130 may be a diameter in such examples, and the neck segment 116 and the stem segment 114 may further define a fillet therebetween. As will be appreciated by those of ordinary skill in the art in view of this disclosure, the fillet can further limit stresses within the lift pin body 108 and increase the mass that can be supported by the lift pin 102 compared to embodiments without the fillet.

[0048] 8 and 9, the base segment 118 of the lift pin body 108 is configured to mount the lift pin 102 inside the chamber body 212 (shown in FIG. 2). The base segment 118 of the lift pin body 108 is further configured to carry the weight 104 (shown in FIG. 7), thereby increasing the force that the lift pin body 108 can exert in response to the sliding resistance of the lift pin 102 through the substrate support 216 (shown in FIG. 1). In these respects, the base segment 118 extends axially from the neck segment 116 along the lift pin axis 110, is separated from the stem segment 114 of the lift pin body 108 by the neck segment 116 of the lift pin body 108, and has a base segment width 134 and a base segment height 136. The base segment width 134 may be greater than the neck segment width 130 of the neck segment 116, and may further be substantially equal to the stem segment width 126 of the stem segment 114. The base segment height 136 may be less than the neck segment height 132 of the neck segment 116 to limit the size of the process volume 242 (shown in FIG. 2 ) required for the weight 104 and the lift pin body 108 to cooperate with one another within the interior 238 of the chamber body 212. It is contemplated that the base segment 118 may have a cylindrical portion 138 and a hemispherical portion 140, the cylindrical portion 138 being adjacent to the neck segment 116 and defining the base segment width 134, and the hemispherical portion 140 extending from and separated from the neck segment 116 by the cylindrical portion 138 of the base segment 118. In certain embodiments, the base segment 118 and the neck segment 116 may define a fillet therebetween to limit stresses in the lift pin body 108. According to certain embodiments, the base segment 118 may join the neck segment 116 at an orthogonal interface to facilitate assembly of the weight 104 onto the lift pin 102 and to limit slop in the lift pin arrangement 100 .

[0049] In certain embodiments, the base segment 118 may have an annular mounting surface 142 configured to slidably receive the weight 104 thereon, and in this regard extends circumferentially around the neck segment 116 of the lift pin body 108, opposed to the stem segment 114 of the lift pin body 108, and substantially perpendicular to the neck segment 116 of the lift pin body 108. It is contemplated that the annular mounting surface 142 extends circumferentially around the lift pin axis 110, and substantially perpendicular to the lift pin axis 110. It is also contemplated that the hemispherical portion 140 of the base segment 118 defines a pole 144 disposed along the lift pin axis 110 and axially spaced from the neck segment 116 by both the cylindrical portion 138 of the base segment 118 and the hemispherical portion 140 of the base segment 118 of the lift pin body 108.

[0050] 10 and 11, the weight body 104 is shown. As shown in FIG. 9, the weight body 104 is formed from a weight body material 146, is generally cylindrical in shape, and defines a recess 148. The weight body 104 further has a C-shaped upper surface 150 defining an upper opening 152 to the recess 148, a C-shaped lower surface 154 defining a lower opening 156 to the recess 148, and a lateral surface 158 having a lateral surface opening 160 to the recess 148. The C-shaped upper surface 150 may define a weight body width 162 that may diametrically span both the weight body 104 and the recess 148 when the weight body 104 is assembled on the lift pin body 108 (shown in FIG. 7), extending circumferentially around the lift pin axis 110 in a generally circular shape substantially perpendicular to the lift pin axis 110 and interrupted by the recess 148. The C-shaped lower surface 154 is similar to the C-shaped upper surface 150 and is axially offset from the C-shaped upper surface 150 of the weight body 104 along the lift pin axis 110 and is coupled to the C-shaped upper surface 150 by a lateral surface 158 of the weight body 104. In certain embodiments, the weight body material 146 may include a ceramic material, such as a bulk ceramic material. Examples of suitable ceramic materials include, by way of non-limiting example, alumina, aluminum oxide (Al2O3), and silicon carbide (SiC).

[0051] It is contemplated that the weight body 104 is configured to receive the lift pin body 108 (shown in FIG. 7 ) therein. In this regard, it is contemplated that the recess 148 may extend radially inward from the lateral surface opening 160 and be bounded by a first interior planar facet 164, a second interior planar facet 166, and an interior cylindrical facet 168. The first interior planar facet 164 extends chordwise from the lateral surface opening 160 to the interior cylindrical facet 168. The interior cylindrical facet 168 faces the lateral surface opening 160 along a diameter of the weight body 104, is separated from the lateral surface opening 160 of the recess 148 by the lift pin axis 110, and is spaced from the lateral surface opening 160 by a radially extending recess depth 165. It is contemplated that the recess depth 165 is greater than half of the weight body width 162 defined by the weight body 104. For example, recess depth 165 may be about 60% to about 90% of weight width 162, or about 60% to about 80% of weight width 162, or even about 60% to about 70% of weight width 162. As will be appreciated by those of ordinary skill in the art in light of the present disclosure, recess depths within these ranges allow weight 104 to be concentrically mounted on lift pin body 108 and about lift pin shaft 110.

[0052] In certain embodiments, the weight body 104 may be configured to accommodate both the neck segment 116 (shown in FIG. 7 ) and a portion of the stem segment 114 (shown in FIG. 7 ) of the lift pin body 108 (shown in FIG. 7 ). In this regard, the recess 148 may be further bounded by an internal shoulder facet 170. The internal shoulder facet 170 may be substantially parallel to the upper C-shaped surface 150 and / or the lower C-shaped surface 154 of the weight body 104 and may be substantially perpendicular to the lift pin axis 110 when the weight body 104 is mounted on the lift pin body 108. The internal shoulder facet 170 may extend radially inwardly into the weight body 104 from the lateral surface opening 160 to the internal cylindrical facet 168 and divide the first internal planar facet 164 into an upper first internal planar facet 172 and a lower first internal planar facet 174. The internal shoulder facet 170 may extend across the internal cylindrical facet 168 and divide the internal cylindrical facet 168 into an upper internal cylindrical facet 176 and a lower internal cylindrical facet 178. The internal shoulder facet 170 may extend across the second internal planar facet 166 and divide the second internal planar facet 166 into an upper second internal planar facet 180 and a lower second internal planar facet 182.

[0053] It is contemplated that the internal shoulder facet 170 is separated from the C-shaped lower surface 154 by a shoulder facet height 184. The shoulder facet height 184 may be substantially equal to the neck segment height 132 (shown in FIG. 7 ) of the lift pin body 108 (shown in FIG. 7 ), with the internal shoulder facet 170 thereby dividing the recess 148 into a neck segment recess portion 186 and a stem segment recess portion 188. The neck segment recess portion 186 is bounded by the lower first internal planar facet 174, the lower internal cylindrical facet 178, and the lower second internal planar facet 182, and may thereby be configured to receive the entire neck segment 116 (shown in FIG. 6 ) of the lift pin body 108 therein. The stem segment recessed portion 188 is bounded by the upper first internal planar facet 172, the upper internal cylindrical facet 176, and the upper second internal planar facet 180, and may be configured to accommodate a portion of the stem segment 114 (shown in FIG. 6) of the lift pin body 108 therein.

[0054] In certain embodiments, the neck segment recess portion 186 may define a first recess width 147 between the lower first inner planar facet 174 and the lower second inner planar facet 182, and the stem segment recess portion 188 may define a second recess width 149 between the upper first inner planar facet 172 and the upper second inner planar facet 180. The first recess width 147 may be substantially equal to the neck segment width 130, and the second recess width 1491 may be substantially equal to the stem segment width 126. As will be appreciated by those of skill in the art in view of the present disclosure, the internal shoulder facet 170 and the C-shaped lower surface 154 may cooperate with the neck segment 116 of the lift pin body 108 to axially secure the weight 104 relative to the lift pin body 108 when the neck segment 116 is received within the recess 148.

[0055] 12 and 13, the cap member 106 is shown. The cap member 106 is formed from a cap member material 186 and has an annular upper surface 190, an annular lower surface 192, and an annular cap member body 194. The annular upper surface 190 extends circumferentially around a stem opening 196. The annular lower surface 192 extends circumferentially around a weight opening 198. The annular cap member body 194 extends circumferentially around a hollow interior 101 of the cap member 106, which couples the stem opening 196 defined by the annular upper surface 190 to the weight opening 198 in the annular lower surface 192 of the cap member 106. In certain embodiments, the cap member material 186 forming the cap member 106 may include a ceramic material, such as a bulk ceramic material. Examples of suitable ceramic materials include, by way of non-limiting example, alumina, aluminum oxide (Al2O3), and silicon carbide (SiC).

[0056] It is contemplated that the cap member 106 is configured to slidably receive both the lift pin body 108 (shown in FIG. 7) and the weight 104 (shown in FIG. 7) therein. In this regard, the stem opening 196 may have a stem opening width 103 substantially equal to the stem segment width 126 (shown in FIG. 7) of the stem segment 114 (shown in FIG. 7) and may have a shape substantially identical to the shape of the cross-sectional area of ​​the stem segment 114 of the lift pin body 108. In a further regard, the weight opening 198 may have a weight opening width 105 substantially equal to the weight width 162 (shown in FIG. 10) and the annular cap member body 194 may have a cap member interior height 107 (shown in FIG. 16) substantially equal to the weight height 109 (shown in FIG. 11) of the weight 104. As will be appreciated by those of ordinary skill in the art in light of this disclosure, sizing the stem opening width 103 to be substantially equal to, and substantially identical in shape to, the stem segment width 126 allows the cap member 106 to slidably receive the stem segment 114 of the lift pin body 108 therethrough. Also, as will be appreciated by those of ordinary skill in the art in light of this disclosure, sizing the weight opening width 105 to be substantially equal to the weight width 162 and the cap member interior height 107 to be substantially equal to the weight height 109 allows the cap member 106 to capture and thereby radially secure the weight 104 about the lift pin body 108 during assembly of the lift pin arrangement 100 (shown in FIG. 1 ).

[0057] The cap member 106 is also contemplated to define a key portion 113. The key portion 113 may be configured to rotationally secure the cap member 106 to the weight body 104 (shown in FIG. 7 ) about the lift pin axis 110 when the cap member 106 and the weight body 104 are assembled on the lift pin body 108. In this regard, the key portion 113 may project radially into the hollow interior 101 of the cap member 106 from a cap member inner surface 119 that bounds the hollow interior 101 of the cap member 106. The key portion 113 may have a key portion width 121 (shown in FIG. 17 ), which may be substantially equal to a recess width 147 (shown in FIG. 11 ) defined between a lower first inner planar facet 174 (shown in FIG. 11 ) and a lower second inner planar facet 182 (shown in FIG. 11 ) of the recess 148 (shown in FIG. 10 ) defined in the weight body 104. In a further respect, the key portion 113 may have a radial extent 125 that is less than half the weight width 162, allowing the key portion 113 of the cap member 106 to abut the neck segment 116 of the lift pin body 108 when the weight 104 is captured within the cap member 106. In certain embodiments, the key portion 113 may be substantially planar along the cap member interior height 107, and the key portion 113 is spaced from at least one of the top first interior planar facet 172 and the top second interior planar facet 180 to simplify manufacturing of the cap member 106. According to certain embodiments, the cap member 106 and the weight 104 are rotationally fixed to one another and collectively rotatable relative to the lift pin body 108 about the lift pin axis 110. As will be appreciated by one of ordinary skill in the art in view of the present disclosure, this can simplify maintenance of chamber arrangement 204 (shown in FIG. 1 ), for example, by providing a tactile indication (e.g., a rough reality check type manual inspection) to a maintainer whether accumulated material is present in the mechanical clearances within lift pin arrangement 100 (shown in FIG. 1 ) that may pose a contamination risk during operation of semiconductor processing system 200 (shown in FIG. 1 ).

[0058] It is contemplated that the cap member 106 has a cap member axial height 145 (shown in FIG. 14 ) and the weight body 104 has a weight body axial height 109 (shown in FIG. 11 ), with the cap member axial height 145 being greater than the weight body axial height 109. For example, the cap member axial height 127 may be greater than or equal to the weight body axial height 109 plus the axial thickness 133 of the annular top surface 190 of the cap member 106. As will be appreciated by those of skill in the art in light of this disclosure, this allows the cap member 106 to encase the weight body 104 when both are assembled onto the lift pin body 108. It is also contemplated that the cap member 106 may have a cap member interior width 137, which may be substantially equal to the weight body width 143. This also allows the cap member 106 to be secured at an angle relative to the lift pin axis 110 passing through the weight body 104, as will be appreciated by those of skill in the art in light of this disclosure.

[0059] 14-17, there is shown the assembly of the lift pin arrangement 100 and the positioning of the assembled lift pin arrangement 100. As shown in FIG 14, assembly of the lift pin arrangement 100 is achieved by mounting the lift pin 102 in one of a number of lift pin openings 260 (shown in FIG. 2) defined in the substrate support 216 such that portions of the stem segment 114, neck segment 116, and base segment 118 depend below the substrate support 216 (shown in FIG. 2) and within the interior 238 (shown in FIG. 2) of the chamber body 212 (shown in FIG. 2). The cap member 106 is then aligned in situ (e.g., in the chamber body 212) with the lift pin body 108 such that the base segment 118 of the lift pin body 108 is axially between the cap member 106 and the neck segment 116 of the lift pin body 108, and such that a stem opening 196 defined in the annular top surface 190 of the cap member 106 and the lift pin body 108 are coaxial with one another. The cap member 106 is then translated in a first direction A along the lift pin axis 110 toward the contact pad 112 of the lift pin body 108, such that the stem segment 114 of the lift pin body 108 is slidably received within the stem opening 196 of the cap member 106. The cap member 106 is intended to be translated along the lift pin axis 110 so that the annular lower surface 192 of the cap member 106 axially overlaps the stem segment 114 of the lift pin body 108, thereby securing the axial length of the lift pin body 108 within which the weight 104 resides when assembled onto the lift pin body 108.

[0060] Assembly of the weight body 104 onto the lift pin body 108 is accomplished by axially aligning the weight body 104 with respect to the lift pin body 108 such that the recess 148 of the weight body 104 faces the neck segment 116 of the lift pin body 108 and such that the C-shaped lower surface 154 is axially aligned with the annular mounting surface 142 of the base segment 118 of the lift pin body 108. After being so aligned, the weight body 104 may be shifted (e.g., radially advanced) to B toward the lift pin body 108 such that the C-shaped lower surface 154 slides across the annular mounting surface 142 of the base segment 118 of the lift pin body 108. The C-shaped lower surface 154 is contemplated to slide across the annular mounting surface 142 of the base segment 118 until the lower internal cylindrical facet 178 (shown in FIG. 10 ) abuts the neck segment 116 of the lift pin body 108 and the upper internal cylindrical facet 176 abuts the lower extent (e.g., lower portion) of the stem segment 114. So positioned, the weight 104 is axially secured to the lift pin body 108 along the neck segment 116 by cooperation of the base segment 118 and the stem segment 114 of the lift pin body 108, as will be understood by those of ordinary skill in the art in view of the present disclosure.

[0061] Once the weight body 104 is mounted on the annular mounting surface 142 of the base segment 118 of the lift pin body 108 and about the stem segment 114, the cap member 106 may then be rotated to D about the lift pin body 108 relative to the weight body 104 such that the key portion 113 (shown in FIG. 12 ) of the cap member 106 axially overlaps the recess 148 defined in the lateral surface 158 of the weight body 104, or vice versa. The cap member 106 may then be translated along the lift pin axis 110 in a second direction B opposite the first direction A (e.g., away from the contact pad 112 and toward the base segment 118) such that the key portion 113 of the cap member 106 is received within the recess 148 defined in the lateral surface 158 of the weight body 104. It is contemplated that the cap member 106 will translate further along the lift pin body 108 such that the annular upper surface 190 of the cap member 106 abuts the C-shaped upper surface 150 of the weight body 104. As will be understood by those of ordinary skill in the art in view of the present disclosure, this will radially secure the weight body 104 within the cap member 106 relative to the lift pin body 108, weight body 104, and cap member 106, thereby placing the lift pin body 108 in axial tension as it hangs from the substrate support 216 within the interior 238 (shown in FIG. 2 ) of the chamber body 212 (shown in FIG. 2 ). Additionally, as will be appreciated by those skilled in the art in view of the present disclosure, once assembled, the lift pin arrangement 100 increases the force applied to the lift pin body 108 while sliding through one of a plurality of lift pin openings 260 (shown in FIG. 2 ) that slidably accommodate the lift pin body 108 and / or during upward movement of the substrate support 216 (shown in FIG. 2 ) within the chamber body 212, limiting (or eliminating) the risk of accumulated material binding the lift pin 102 within the substrate support 216. Advantageously, in certain embodiments described herein, assembly of the lift pin arrangement 100 can be accomplished within fasteners and tools, simplifying assembly and / or maintenance of the chamber arrangement 204 and thus the semiconductor processing system 200 including the lift pin arrangement 100.

[0062] In certain embodiments, the lift pin arrangement 100 may have a lift pin arrangement center of gravity 131 (shown in FIG. 17) that is offset from the lift pin axis 110. In this regard, it is contemplated that (a) the lift pin body 108 has a lift pin body center of gravity 135 (shown in FIG. 17) that is centered, i.e., located along the lift pin axis 110, (b) the weight 104 has a weight center of gravity 139 (shown in FIG. 17) that is radially offset from the lift pin axis 110, and (c) the cap member 106 has a cap member center of gravity 141 (shown in FIG. 17) that is radially offset from the lift pin axis 110 in a direction diametrically opposite the weight center of gravity 139. It is contemplated that the volumes and compositions of the weight 104 and the cap member 106 are such that the weight center of gravity 139 and the cap member center of gravity 141 cooperate to position the lift pin arrangement center of gravity 131 on the side of the lift pin axis 110 opposite the key portion 113. Advantageously, the lift pin arrangement center of gravity 131 may induce off-axis force components into the lift pin arrangement 100 during movement of the substrate support 216 between the first position 248 (shown in FIG. 2 ) and the second position 250 (shown in FIG. 2 ), promoting yaw into the lift pin arrangement 100 and promoting breakup of accumulated material that may be present in the gap between the lift pin arrangement and the substrate support 216. As will be appreciated by those of skill in the art in view of the present disclosure, this may further limit the tendency of such accumulated material to bind the lift pin arrangement 100 within the substrate support 216.

[0063] 18, a method 300 of making a lift pin arrangement, such as lift pin arrangement 100 (shown in FIG. 1), is shown. Method 300 includes aligning a cap member on a lift pin, such as lift pin 102 (shown in FIG. 6), along a lift pin axis, such as aligning cap member 106 (shown in FIG. 6) with lift pin body 108 (shown in FIG. 6) along lift pin axis 110 (shown in FIG. 6), as shown in box 310. The cap member is then translated along the lift pin axis such that a stem segment of the lift pin body is slidably received within the cap member, such as stem segment 114 (shown in FIG. 6) is slidably received within stem opening 196 (shown in FIG. A) of the cap member, as shown in box 320. Then, as shown by boxes 330 and 340, a weight is placed along the lift pin axis, e.g., weight 104 (shown in FIG. 6), and the weight is rotated so that the recess in the weight and the neck segment of the lift pin body are at a common axial position along the lift pin axis, e.g., the weight is rotated so that recess 148 (shown in FIG. A) faces (opposite) the neck segment 116 of the lift pin body (shown in FIG. 6).

[0064] Next, the weight is assembled onto the lift pin body by shifting the weight toward the lift pin body (e.g., driving it radially toward the lift pin body) such that the neck segment of the lift pin body is slidably received within the recess in the weight, as shown in box 350. The cap member is then rotated about the lift pin body such that a key portion extending radially inward from an inner surface of the cap member axially overlaps with the recess in the weight, as shown in box 360, e.g., such that a key portion 113 (shown in FIG. A) extending radially inward from the cap member inner surface 119 (shown in FIG. A) into the hollow interior 101 (shown in FIG. A) axially overlaps with a recess defined in a lateral surface of the weight. Thereafter, the cap member is translated along the lift pin body in a second direction axially opposite to the first direction such that the cap member substantially encases the weight, as shown in box 370. It is contemplated that the cap member is secured to the lift pin body while leaving the cap axially free relative to the lift pin body by radially translating 320 the cap body in a first direction along the lift pin body, as shown in box 372. It is further contemplated that translating the cap member in a second direction relative to the lift pin body, as shown in box 374, axially constrains the cap member and radially secures the weight relative to the lift pin body.

[0065] A substrate may be mounted on a substrate support using lift pins, such as prior to depositing a material layer on the substrate using plasma enhanced chemical vapor deposition and plasma enhanced atomic layer deposition. While generally satisfactory for their intended purposes, material may accumulate on the lift pins and / or within the mechanical clearance defined between the lift pins and the substrate support in some deposition techniques, potentially limiting the reliability of semiconductor processing systems used in material layer deposition operations. And while various measures exist to limit such material layer build-up, such as temperature control and / or removal of accumulated material between material layer deposition events, there remains a need for improved lift pins, lift pin arrangements, and semiconductor processing systems including lift pin arrangements, as well as methods of making lift pin arrangements for semiconductor processing systems.

[0066] In embodiments described herein, a lift pin arrangement is provided that includes a weight carried by the lift pin to increase the force the lift pin can exert against resistance to sliding in a substrate support that slidably houses the lift pin. In certain embodiments, the lift pin arrangement may include a cap member for fixing the weight carried by the lift pin to the lift pin, limiting (or eliminating) the need for fasteners and / or tools to assemble the lift pin arrangement and simplifying assembly of the lift pin arrangement. According to certain embodiments, the lift pin weight and the cap member may be rotationally fixed to each other and rotatable relative to the lift pin, providing a tactile indication of the build-up of a layer of material in the lift pin arrangement and simplifying inspection and maintenance of the lift pin arrangement. It is also contemplated that the cap member may shift the lift pin arrangement center of gravity from the lift pin axis of the lift pin member, thereby facilitating yaw of the lift pin in the lift pin opening and facilitating the break-up of the accumulated material when the lift pin arrangement begins to slide during removal of the substrate after a layer of material has been deposited on the substrate attached to the substrate support.

[0067] Although the present disclosure has been provided in the context of certain embodiments and examples, those skilled in the art will understand that the present disclosure extends beyond the specifically described embodiments to other alternative embodiments and / or uses of the present embodiments, and obvious modifications and their equivalents. In addition, while several variations of the embodiments of the present disclosure have been shown and described in detail, other modifications that are within the scope of the present disclosure will be readily apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or subcombinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for one another to form various modes of the embodiments of the present disclosure. It is therefore intended that the scope of the present disclosure should not be limited by the specific embodiments described above.

[0068] Headings, if any, are provided herein are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein. [Explanation of symbols]

[0069] 2. Board 4 material layers 10 Material layer precursor 12 Reaction Products 100 Lift pin arrangement 102 Lift pin 108 Lift pin body 110 Lift pin shaft 112 Contact Pad 114 Stem Segment 116 Neck Segment 118 Base Segment 200 Semiconductor Processing System 202 Precursor Source 204 Chamber Layout 206 Exhaust Source 208 Control device

Claims

1. A lift pin, A lift pin body disposed along a lift pin axis, the lift pin body comprising: an enlarged contact pad; a stem segment extending axially from the contact pad; a neck segment extending axially from the stem segment and separated from the contact pad by the stem segment of the lift pin body; a base segment extending axially from and separated from the stem segment by the neck segment; 1. A lift pin comprising: a lift pin body, the base segment having a base segment width, the neck segment having a neck segment width, the neck segment width being smaller than the base segment width to carry a lift pin weight together with the lift pin body.

2. The lift pin of claim 1 , wherein the lift pin body is formed from a ceramic material.

3. 2. The lift pin of claim 1, wherein the contact pad has a contact pad width and the stem segment has a stem segment width, the stem segment width being smaller than the contact pad width and larger than the neck segment width.

4. 2. The lift pin of claim 1, wherein the base segment has an annular mounting surface and a hemispherical portion, the annular mounting surface extending around the neck segment and facing the stem segment of the lift pin body, the annular mounting surface being perpendicular to the lift pin axis.

5. 2. The lift pin of claim 1 , wherein the base segment has a base segment height, the neck segment has a neck segment height greater than the base segment height, the contact pad has a contact pad height greater than the neck segment height, and the stem segment has a stem segment height greater than the contact pad height.

6. 1. A lift pin arrangement comprising: A lift pin according to claim 1 ; a weight mounted on the base segment of the lift pin body, the weight being axially fixed and radially free with respect to the lift pin body; a cap member slidably received on the lift pin body and extending circumferentially around the weight, the cap member being axially free and radially fixed relative to the lift pin body.

7. 7. The lift pin arrangement of claim 6, wherein said lift pin body has a lift pin body center of gravity disposed along said lift pin axis, said weight has a weight center of gravity radially offset from said lift pin axis, said cap member has a cap member center of gravity radially offset from said lift pin axis, and said lift pin arrangement has a lift pin arrangement center of gravity offset from said lift pin axis.

8. 7. The lift pin arrangement of claim 6, wherein said weight has a weight width and a recess, said recess having a recess depth that extends more than half of said weight width.

9. 9. The lift pin arrangement of claim 8, wherein said weight defines an internal shoulder facet substantially perpendicular to said lift pin axis, said weight having an upper C-shaped surface and a lower C-shaped surface axially opposite said upper C-shaped surface and parallel to said internal shoulder facet, said internal shoulder facet being axially spaced from said base segment of said lift pin body by a neck segment height of said neck segment.

10. The lift pin arrangement of claim 8 , wherein said cap member has an axially extending key portion slidably received within said recess of said weight body.

11. The lift pin arrangement of claim 6 , wherein said recess has a recess width, and said neck segment width is substantially equal to said recess width.

12. 7. The lift pin arrangement of claim 6, wherein said cap member has an upper annular surface and a lower annular surface, said upper annular surface extending circumferentially around said stem segments of said lift pin body and radially securing said cap member to said lift pin body, and said lower annular surface extending around said weight and radially securing said weight to said cap member.

13. The lift pin body is made of aluminum oxide (Al ２ O ３ ), and the lift pin weight is made of aluminum oxide (Al ２ O ３ ), and the cap member is made of aluminum oxide (Al ２ O ３ 7. The lift pin arrangement of claim 6, wherein the lift pin arrangement is formed from

14. 7. The lift pin arrangement of claim 6, wherein said cap member has a cap member axial height and said weight has a weight body axial height, said cap member axial height being greater than said weight body axial height.

15. 7. The lift pin arrangement of claim 6, wherein said cap member has a cap member interior width and said weight has a weight width, said cap member interior width being greater than said weight width and said cap member interior width being equal to said weight width.

16. 1. A semiconductor processing system comprising: a chamber body having an inlet port and an exhaust port; a showerhead secured within the chamber body between the inlet port and the exhaust port; a substrate support disposed within the chamber body between the showerhead and the exhaust port, the substrate support defining a lift pin opening therein; 2. The semiconductor processing system of claim 1, wherein the stem segment of the lift pin body is slidably received within the lift pin opening.

17. 17. The semiconductor processing system of claim 16, wherein the substrate support has a first position and a second position separating the first position from the showerhead, the semiconductor processing system further comprising a substrate support actuator operatively connected to the substrate support for moving the substrate support between the first position and the second position.

18. a weight having a recess for receiving the neck segment of the lift pin body; a cap member having a stem segment opening and a weight opening, the stem segment of the lift pin body being slidably received within the stem segment opening and the weight being slidably received within the weight opening; 20. The semiconductor processing system of claim 16 further comprising:

19. 20. The semiconductor processing system of claim 18, wherein the recess has a first recess width and a second recess width, the second recess width being axially offset from the first recess width, the first recess width being substantially equal to a stem segment width of the lift pin body, and the second recess width being substantially equal to the neck segment width defined by the neck segment of the lift pin body.

20. 1. A method of making a lift pin arrangement for a semiconductor processing system, the method comprising:

1. A lift pin comprising: a lift pin body disposed along a lift pin axis having an enlarged contact pad; a stem segment extending axially from said contact pad; a neck segment extending axially from said stem segment and separated from said contact pad by said stem segment of said lift pin body; and a base segment extending axially from said neck segment and separated from said stem segment by said neck segment, wherein said base segment has a base segment width and said neck segment has a neck segment width, said neck segment width being less than said base segment width. aligning a cap member with the lift pin axis; translating the cap member in a first direction along the lift pin axis such that the stem segment of the lift pin body is slidably received within the cap member; disposing a weight along the lift pin axis; rotating the weight so that a recess faces the neck segment of the lift pin body; shifting the weight relative to the lift pin body such that the neck segment of the lift pin body is slidably received within the recess; and translating the cap member in a second direction along the lift pin body such that the cap member encases the weight body, whereby the lift pin body carries the weight body.

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