Liquid discharge device and article manufacturing method

Abstract

To provide a liquid discharge device that is advantageous in achieving safety measures in the liquid discharge device.SOLUTION: The liquid discharge device comprises: a substrate stage which holds a substrate; discharging means that discharges liquid to the substrate held by the substrate stage; a first chamber covering the substrate stage and the discharging means; a second chamber covering the first chamber; and control means that controls first pressure in the first chamber and second pressure outside the first chamber and second pressure in the second chamber. The control means controls the pressure so that the second pressure becomes higher than the first pressure and so that the second pressure becomes higher than pressure outside the second chamber.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a liquid ejection device and a method for manufacturing an article. [Background technology]

[0002] In recent years, when manufacturing various functional elements, attempts have been made to form patterns (patterning) by applying the material of the functional element using an inkjet device (liquid ejection device).Patterning using an inkjet device has the advantages of being highly efficient in terms of material usage because it allows on-demand patterning, being a non-vacuum process that requires relatively small manufacturing equipment, and being able to coat large areas at high speed.

[0003] Recently, a color conversion unit containing a quantum dot material and a display device having quantum dots as light-emitting elements have been attracting attention, and a technology for manufacturing a color conversion unit containing a quantum dot material using an inkjet device has been proposed. A color conversion unit using a conventional color filter extracts a specific color by cutting off light of wavelengths other than a specific wavelength. By using quantum dots in the color conversion unit instead of the conventional color filter, it is possible to directly convert the light wavelength, and it is expected that a very high light conversion efficiency can be achieved.

[0004] Cadmium, indium, lead, etc. are known to be the main components of quantum dots, but these heavy metal substances are toxic (harmful substances) to the human body, so exposure to them must be prevented. If we consider applying quantum dot material using an inkjet device, strict safety measures are required because the characteristics of inkjet devices cause the scattering of small mist-like droplets containing the quantum dot material, known as mist.

[0005] As a countermeasure against exposure in an inkjet device, a technology has been proposed in which the inkjet device is isolated (separated) by a barrier called a chamber and the air inside the chamber is sealed (see Patent Document 1). Patent Document 1 also proposes circulating the air inside the chamber with a blower and removing the air inside the chamber by placing a filter in the circulation path in order to keep the inside of the chamber always clean.

[0006] Furthermore, Patent Document 2 discloses a clean room facility for preventing particles from entering the device and for preventing odorous gases and harmful gases from leaking out of the device. Patent Document 2 discloses that when the pressure in a first booth in which the device is installed is P1, the pressure in the clean room is Pc, and the pressure in a second booth that communicates with the first booth and the clean room is P2, the pressures are adjusted so that P1>Pc>P2. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Patent Publication No. 2021-12815 [Patent Document 2] JP 2015-206549 A Summary of the Invention [Problem to be solved by the invention]

[0008] However, the method described in Patent Document 2 raises the concern that the gas in the second booth contains harmful substances, which may leak from the second booth into the clean room. For example, when the workpiece is transported out of the device, the atmosphere in the second booth may leak into the clean room due to the entrainment of atmosphere generated by the transportation of the workpiece. Furthermore, if even a small gap occurs in the partition wall or duct connection of the second booth, harmful substances may be pushed out into the clean room due to the air pressure difference of P1>Pc.

[0009] SUMMARY OF THE PRESENT EMBODIMENTS In view of the above, an object of the present invention is to provide a liquid ejection device that is advantageous in terms of realizing safety measures in the liquid ejection device. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, a liquid ejection device as one aspect of the present invention comprises a substrate stage for holding a substrate, an ejection means for ejecting liquid onto a substrate held on the substrate stage, a first chamber covering the substrate stage and the ejection means, a second chamber covering the first chamber, and a control means for controlling a first pressure in the first chamber and a second pressure outside the first chamber and in the second chamber, wherein the control means controls the second pressure to be higher than the first pressure and higher than the pressure outside the second chamber. Effect of the Invention

[0011] According to the present invention, it is possible to provide a liquid ejection device that is advantageous in terms of realizing safety measures in the liquid ejection device. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic diagram illustrating a configuration of an inkjet device according to a first embodiment. [Diagram 2] FIG. 11 is a schematic diagram showing the configuration of an inkjet device according to a second embodiment. [Diagram 3] FIG. 11 is a schematic diagram showing the configuration of an inkjet device according to a third embodiment. [Figure 4] 1 is a flowchart of a method for manufacturing an article. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to refer to the same components, and duplicated explanations will be omitted.

[0014] First Embodiment FIG. 1 is a schematic diagram showing the configuration of an inkjet device in this embodiment. Using FIG. 1, the basic configuration and operation principle of an inkjet device 1 (liquid ejection device) in this embodiment will be described. The inkjet device 1 includes a substrate stage 3 for mounting and holding a substrate 2 that serves as a base material for a display panel (such as a liquid crystal display or an OLED display). The substrate 2 is appropriately selected from a glass substrate, a plastic substrate, or the like, depending on the target product to be manufactured. The substrate 2 is typically a rectangular plate-like member, but the form is not limited as long as it can function as a base material, and may be, for example, a deformable film or a circular substrate. The substrate 2 is provided with a pixel area 201 for applying ink to form an array of a large number of display pixels.

[0015] The inkjet device 1 includes an inkjet head 5 (discharging means) capable of discharging ink droplets 4 toward a predetermined position on a substrate 2, an ink supply system 6 that supplies ink to the inkjet head 5, and an ink tank 7 that stores the ink.

[0016] The inkjet heads 5 are arranged in a main scanning direction and a sub-scanning direction perpendicular to the main scanning direction of the substrate stage 3. The inkjet heads 5 can apply ink in a desired distribution to the pixel area 201 on the substrate 2 by individually controlling the ejection of ink droplets 4 from each inkjet head 5.

[0017] Here, when considering a case where the functional element formed on the substrate is configured to include a quantum dot material (for example, a color conversion unit), the quantum dot material is contained in the ink ejected by the inkjet head 5. Since the quantum dot material contains at least one heavy metal substance of cadmium, indium, and lead, it is necessary to prevent exposure to the human body.

[0018] The substrate stage 3 and the inkjet head 5 are covered by a first chamber 40. The substrate stage 3 and the inkjet head 5 are configured to be supported by the first chamber 40. Hereinafter, the space within the first chamber will be referred to as a first space 10, and the pressure in the first space 10 will be referred to as a first pressure P1.

[0019] When the ink droplets 4 are ejected from the inkjet head 5, the ejected ink droplets 4 (main droplets) land on the pixel areas 201 of the substrate 2 held by the substrate stage 3. At this time, a part of the ink ejected from the inkjet head 5 becomes fine ink 8 in the form of fine particles that are not included in the main droplets and scatters into the air in the first space 10. If the ink contains a quantum dot material, this fine ink 8 may be harmful to the human body. For this reason, safety measures are required to prevent the gas in the first space 10 containing the fine ink 8 from leaking into the clean room space 30 outside the inkjet device 1.

[0020] Therefore, in this embodiment, a second chamber 50 is provided so as to cover the first chamber 40. Hereinafter, the space outside the first chamber and inside the second chamber is referred to as the second space 20, and the pressure in the second space 20 is referred to as the second pressure P2. Also, the pressure in the clean room space 30 is referred to as P3.

[0021] Further, the first chamber 40 is provided with a first opening 9, and the second chamber 50 is provided with a second opening 53. The first opening 9 and the second opening 53 are provided, for example, so that the substrate 2 can be loaded from the clean room space 30 to the substrate stage 3. At least one of the first opening 9 and the second opening 53 may be configured to be openable and closable, and may be opened when the substrate is loaded and closed when the substrate loading is completed. For example, the second opening 53 may be provided with a shutter 54. The second chamber 50 may be provided with a slit 51 that communicates between the clean room space 30 and the second space 20, and a skirt 52 that can adjust the opening area of ​​the slit 51.

[0022] Here, if foreign matter adheres to the pixel area 201 on the substrate 2, it may cause defects in the elements in that portion. Therefore, it is desirable that the first space 10 in which the substrate 2 is processed is a space with a high degree of cleanliness from which foreign matter has been removed. The inkjet device 1 has a first supply duct 11 (first supply section) that supplies gas to the first space 10 in the first chamber 40, and a first exhaust duct 12 (first exhaust section) that exhausts gas from the first space 10 in the first chamber 40. The first supply duct 11 supplies clean gas from which foreign matter has been removed. A first filter 13 such as a HEPA filter or a ULPA filter may be provided at the tip of the first supply duct 11.

[0023] A first supply damper 14 capable of adjusting the flow rate of gas supplied from the first supply duct 11 to the first space 10 is provided upstream of the first supply duct 11. Furthermore, a first exhaust damper 15 capable of adjusting the exhaust flow rate from the first space 10 is provided downstream of the first exhaust duct 12. When adjusting the air volume with the first supply damper 14 and the first exhaust damper 15, the ducts may be provided with a measurement port or an anemometer so that the air speed inside the first supply duct 11 and the first exhaust duct 12 can be measured with the anemometer.

[0024] The inkjet device 1 has a second supply duct 21 (second supply section) that supplies gas to a second space 20 outside the first chamber 40 and within the second chamber, and a second exhaust duct 22 (second exhaust section) that exhausts gas from the second space 20 outside the first chamber 40 and within the second chamber. The second supply duct 21 supplies clean gas from which foreign matter has been removed. A second filter 23 such as a HEPA filter or a ULPA filter may be provided at the tip of the second supply duct 21.

[0025] A second supply damper 24 capable of adjusting the flow rate of gas supplied from the second supply duct 21 to the second space 20 is provided upstream of the second supply duct 21. In addition, a second exhaust damper 25 capable of adjusting the exhaust flow rate from the second space 20 is provided downstream of the second exhaust duct 22. When adjusting the air volume by the second supply damper 24 and the second exhaust damper 25, the ducts may be provided with a measurement port or an anemometer so that the air speed inside the second supply duct 21 and the second exhaust duct 22 can be measured with the anemometer.

[0026] The above-mentioned first supply duct 11 (first supply section), first exhaust duct 12 (first exhaust section), second supply duct 21 (second supply section), and second exhaust duct 22 (second exhaust section) are also called control means that control the first pressure P1 and the second pressure P2.

[0027] The inkjet device 1 has a control unit CNT configured with a computer (information processing device) including a CPU, a memory, etc., and the control unit CNT performs overall control of each part of the inkjet device 1 according to a program stored in the memory. The control unit CNT can control each part of the control means.

[0028] In this embodiment, it is possible to provide a liquid ejection device that is advantageous in preventing the gas in the first space 10 containing the fine ink 8 from leaking out of the device and in preventing foreign matter from entering the first space 10 and the second space 20 from the clean room space 30. The principle behind this is described in detail below.

[0029] The flow rate of the clean gas supplied to the first space 10 by the first supply duct 11 is determined by various factors such as the temperature control accuracy and cleanliness requirements of the first space 10, or the controlled concentration of harmful substances. As an example, it is assumed that the first supply damper 14 is adjusted to supply a flow rate of 20 L / min. At this time, the first space 10 is placed in a negative pressure state relative to the second space by adjusting the flow rate recovered from the first exhaust duct 12 to a value (e.g., 25 L / min) greater than the supplied flow rate by operating the first exhaust damper 15. The safety measures in this embodiment are expected to be effective, for example, when the flow rate of the gas exhausted by the first exhaust duct 12 is 1.1 times or more the flow rate of the gas supplied by the first supply duct 11.

[0030] The flow rate supplied from the second supply duct 21 to the second space 20 is also determined by various requirements such as the cleanliness requirement and temperature control requirement of the second space 20. As an example, it is assumed that the second supply damper 24 is adjusted so that a flow rate of 30 L / min is supplied. At this time, if the flow rate recovered from the second exhaust duct 22 is adjusted to a value (e.g., 20 L / min) smaller than the supplied flow rate by operating the second exhaust damper 25, the pressure in the second space 20 becomes higher than the pressure in the first space 10. At the same time, the second pressure P2 in the second space 20 can be made higher than the third pressure P3 in the clean room space 30. For example, when the flux of the gas supplied by the second supply duct 21 is 1.1 times or more the flux of the gas exhausted by the second exhaust duct 22, the effect of reducing the inflow of foreign matter from the clean room space 30 to the second space 20 can be expected. Note that the flux in this embodiment is the flow rate per unit time and per unit area.

[0031] By the above adjustment, gas flows from the second space 20 to the first space 10 through the first opening 9 as a vent, and the gas in the first space 10 is prevented from leaking into the second space 20, which in turn prevents leakage of the fine ink 8 into the clean room space 30. Furthermore, due to the relationship between the pressures of the second space 20 and the clean room space 30, gas flows from the second space 20 to the clean room space 30 through the gaps of the second chamber 50 including the slit 51. Therefore, the gas in the clean room space 30 is prevented from entering the second space 20, and the effect of preventing foreign matter from entering the first space 10 and the second space 20 from the clean room space 30 is expected. In addition, in order to check the state of the pressure setting by the flow rate adjustment at each location, a micro-differential pressure gauge capable of measuring the pressure difference between the second space 20 and the first space 10 and the pressure difference between the second space 20 and the clean room space 30 may be provided.

[0032] That is, in this embodiment, the control means operates to control the second pressure P2 to be higher than the first pressure P1 and higher than the pressure outside the second chamber (third pressure P3). In other words, in this embodiment, the control means operates to control the first airflow at the first opening 9 to flow from outside the first chamber 40 to inside the first chamber 40, and the second airflow at the second opening 53 to flow from inside the second chamber 50 to outside the second chamber 50. This makes it possible to provide a liquid ejection device that is advantageous in preventing the gas in the first space 10 containing the fine ink 8 from leaking outside the device and in preventing foreign matter from entering the first space 10 and the second space 20 from the clean room space 30.

[0033] Preferably, the control means operates to control the first pressure P1 to be higher than the pressure outside the second chamber (third pressure P3), thereby further enhancing the effect of preventing the gas in the first space 10 containing the fine ink 8 from leaking outside the device.

[0034] In this embodiment, the first air conditioner 60 supplies temperature-controlled clean gas to the first space 10 via the first supply duct 11. The first air conditioner 60 also supplies temperature-controlled clean gas to the second space 20 via the second supply duct 21, and can exhaust gas from the second space 20 via the second exhaust duct 22.

[0035] The gas exhausted from the second exhaust duct 22 passes through the first air conditioning filter 61 to remove foreign matter. The first air conditioning filter 61 preferably has both a HEPA filter and a chemical filter and is configured to be able to remove both inorganic and organic foreign matter. In addition, gas can be supplied from a gas intake port 64 to supplement the amount of gas flowing into the first air conditioner 60. The supplied gas may be gas in the clean room space 30. In addition, a damper can also be provided in the gas intake port 64 to adjust the amount of gas taken in.

[0036] The gas that has passed through the first air conditioning filter 61 and has had foreign matter removed therefrom is adjusted to a temperature required for inkjet printing (for example, 23° C.) by the temperature adjustment unit 62. The gas whose temperature has been adjusted by the temperature adjustment unit 62 is pushed out of the first air conditioner 60 by the first air conditioning fan 63, and is supplied to its respective connection destinations by the first supply duct 11 and the second supply duct 21. In order to perform precise temperature adjustment, a heater that individually overheats the gas and an individual temperature sensor that measures the temperature of each duct may be provided in each supply duct, and the amount of overheating of the heater may be controlled based on the measurement value of the temperature sensor, thereby performing individual temperature adjustment for each supply system.

[0037] Furthermore, the rotation speed of the first air conditioning fan 63 can be controlled by an inverter or the like configured in a drive control system of the first air conditioning fan 63. By controlling the rotation speed of the first air conditioning fan 63, the amount of air pushed out from the first air conditioner 60 becomes constant. By changing the set value of this rotation speed control, the amount of air pushed out from the first air conditioner 60 can be adjusted.

[0038] As another method for adjusting the flow rate of each air supply duct, there is a method of adjusting the flow rate of either the first supply duct 11 or the second supply duct 21 and the total flow rate of the gas pushed out from the first air conditioner 60 by the first air conditioning fan 63. According to this method, it is sufficient to configure only one of the first supply damper 14 and the second supply damper 24.

[0039] Furthermore, at the stage of designing the ducts, it is possible to omit both the first supply damper 14 and the second supply damper 24 by determining the ratio of pressure losses between the ducts so that the required flow rate is distributed to each supply duct. In that case, the flow rate supplied from each supply duct is adjusted by adjusting the setting value for the rotation speed control of the first air conditioning fan 63.

[0040] The second air conditioner 70 is configured to exhaust the gas in the first space 10 through the first exhaust duct 12. The gas exhausted from the first exhaust duct 12 passes through a second air conditioning filter 71 to remove foreign matter. The second air conditioning filter 71 preferably has both a HEPA filter and a chemical filter and removes both inorganic and organic foreign matter. The gas that has been subjected to dust collection treatment by the second air conditioning filter 71 is exhausted to the outside of the device by a second air conditioning fan 73 and an external exhaust duct 80. Depending on the type of substance contained in the ink, it may be necessary to exhaust the exhaust gas from the first space 10 to the outside, so it is preferable that the external exhaust duct 80 be an exhaust system independent of the second exhaust duct 22 so that it can be connected to an outdoor exhaust system.

[0041] The rotation speed of the second air conditioning fan 73 is controlled by an inverter or the like configured in the drive control system of the second air conditioning fan 73. This control of the rotation speed of the second air conditioning fan 73 keeps the volume of air collected by the second air conditioner 70 constant. By changing the set value of this rotation speed control, the volume of air collected by the second air conditioner 70 can be adjusted.

[0042] As a method of adjusting the flow rate in the first exhaust duct 12, the final flow rate may be adjusted by the first exhaust damper 15, or the first exhaust damper 15 may not be configured and the flow rate may be adjusted by the setting value of the rotation speed control of the second air conditioning fan 73.

[0043] In this embodiment, the gas exhausted by the first exhaust duct 12 is prevented from circulating to the first supply duct 11, thereby preventing harmful substances from circulating.

[0044] <Second embodiment> In this embodiment, an example in which the configuration of the first exhaust duct 12 in the first embodiment is changed will be described. Note that the configuration of the inkjet device 1 is similar to that of the first embodiment, and therefore a description thereof will be omitted. Furthermore, matters not mentioned in this embodiment follow the first embodiment.

[0045] The configuration of the inkjet device 1 in this embodiment will be described with reference to Fig. 2. As shown in Fig. 2, when the second chamber 50 and the second air conditioner 70 are not connected, the path 121 of the first exhaust duct 12 is adjacent to the clean room space 30 without the second space 20 in between. This configuration can be achieved for various reasons, such as the connection position of the first exhaust duct 12, the size of the device, and the layout when installing the device.

[0046] Since gas containing harmful substances from the first space 10 flows through the first exhaust duct 12, it is necessary to prevent leakage of the gas into the clean room space 30 in the path of the first exhaust duct 12 until the harmful substances are removed by the second air conditioning filter 71. Therefore, the pressure in the first space 10 and the first exhaust duct 12 communicating therewith is set lower than the pressure in the clean room space 30. This makes it possible to prevent leakage of the gas in the first exhaust duct 12 into the clean room space 30 even if a gap occurs in the joint of the first exhaust duct 12 in this path 121.

[0047] <Third embodiment> In this embodiment, an example will be described in which the gas exhausted through the first exhaust duct 12 is circulated. Note that the configuration of the inkjet device 1 is similar to that of the first embodiment, and therefore a description thereof will be omitted. Furthermore, matters not mentioned in this embodiment will follow the first embodiment.

[0048] The inkjet device 1 in this embodiment will be described with reference to Fig. 3. Fig. 3 shows an air conditioning system in which the exhaust air from the first space 10 is re-temperature-adjusted by the first air conditioner 60 and circulated. Depending on the type of substance contained in the ink, it is also possible to circulate the exhaust air from the first space 10. The exhaust air from the first space 10 is collected by the first exhaust duct 12 into the first air conditioner 60, and is combined with the exhaust air from the second space 20 collected by the second exhaust duct 22 and the gas taken in from the gas intake port 64, and is subjected to dust removal processing by the first air conditioning filter 61.

[0049] In comparison with the second embodiment, in this embodiment, the flow rate taken in from the gas inlet 64 is smaller, so that when taking in gas from the clean room space 30, the power consumption of the air conditioner can be reduced. This is because, generally, the gas circulated from the device has less temperature variation from the target temperature of temperature control than the gas in the clean room space 30, so less power is required for temperature control. In this embodiment, the gas exhausted by the first exhaust duct 12 is configured to circulate to the first supply duct 11, but this is not a problem because the gas circulated has had harmful substances removed by a filter along the way.

[0050] The present invention may be configured such that the gas exhausted by the first exhaust section does not circulate to the first supply section, and the gas exhausted by the second exhaust section circulates to at least one of the first supply section and the second supply section via a filter. Also, the present invention may be configured such that the gas exhausted by the first exhaust section and the gas exhausted by the second exhaust section circulates to at least one of the first supply section and the second supply section via a filter.

[0051] <Embodiments of the method for manufacturing an article> The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing an article such as a display panel for organic EL or the like, a microdevice such as a semiconductor device, or an element having a fine structure. The method for manufacturing an article according to the embodiment includes a step of forming a liquid film by ejecting a liquid onto a substrate using an inkjet device 1 (forming step, S11). The method also includes a step of processing the substrate on which the liquid film has been formed in the above step, specifically, a step of drying the substrate to obtain a substrate on which a dry film has been formed (processing step, S12). The method for manufacturing an article according to the embodiment also includes a step of manufacturing an article from the substrate on which a dry film has been formed. Furthermore, the method for manufacturing an article according to the embodiment includes other well-known steps (firing, cooling, cleaning, oxidation, film formation, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to the embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article, compared to conventional methods.

[0052] The disclosure of the present specification includes at least the following liquid ejection device and article manufacturing method.

[0053] (Item 1) A substrate stage for holding a substrate; a discharge means for discharging a liquid onto the substrate held by the substrate stage; a first chamber covering the substrate stage and the ejection means; A second chamber covering the first chamber; control means for controlling a first pressure in the first chamber and a second pressure outside the first chamber and in the second chamber; having The liquid ejection device, wherein the control means controls the second pressure so that the second pressure is higher than the first pressure and higher than the pressure outside the second chamber.

[0054] (Item 2) 2. The liquid ejection device according to item 1, wherein the control means controls the first pressure to be higher than the pressure outside the second chamber.

[0055] (Item 3) 3. The liquid ejection device according to item 1 or 2, wherein the first chamber and the second chamber have an opening.

[0056] (Item 4) The control means a first exhaust section that exhausts gas from a first space in the first chamber; A first supply unit that supplies a gas to the first space; 4. The liquid ejection device according to any one of items 1 to 3, comprising:

[0057] (Item 5) 5. The liquid ejection device according to item 4, wherein the gas exhausted by the first exhaust section is not circulated to the first supply section.

[0058] (Item 6) 5. The liquid ejection device according to item 4, wherein the gas exhausted by the first exhaust section is circulated to the first supply section via a filter.

[0059] (Item 7) 7. The liquid ejection device according to any one of items 4 to 6, wherein the control means controls the pressure of the gas in the first exhaust section to be lower than the pressure outside the second chamber.

[0060] (Item 8) The liquid ejection device described in any one of items 4 to 7, characterized in that the control means controls the flux of gas exhausted by the first exhaust section to be 1.1 times or more the flux of gas supplied by the first supply section.

[0061] (Item 9) The control means a second exhaust section that exhausts gas from a second space in the second chamber; A second supply unit that supplies a gas to the second space; 9. The liquid ejection device according to any one of items 1 to 8, comprising:

[0062] (Item 10) 10. The liquid ejection device according to item 9, wherein the gas exhausted by the second exhaust section is circulated to the second supply section via a filter.

[0063] (Item 11) The liquid ejection device described in item 9 or 10, characterized in that the control means controls the flux of gas supplied by the second supply section to be 1.1 times or more the flux of gas exhausted by the second exhaust section.

[0064] (Item 12) The control means a first exhaust section that exhausts gas from a first space in the first chamber; A first supply unit that supplies a gas to the first space; a second exhaust section that exhausts gas from a second space in the second chamber; A second supply unit that supplies a gas to the second space; Including, The gas exhausted by the first exhaust unit does not circulate to the first supply unit, The gas exhausted by the second exhaust unit is circulated to at least one of the first supply unit and the second supply unit via a filter. 4. The liquid ejection device according to any one of items 1 to 3.

[0065] (Item 13) The control means a first exhaust section that exhausts gas from a first space in the first chamber; A first supply unit that supplies a gas to the first space; a second exhaust section that exhausts gas from a second space in the second chamber; A second supply unit that supplies a gas to the second space; Including, A liquid ejection device described in any one of items 1 to 3, characterized in that the gas exhausted by the first exhaust section and the gas exhausted by the second exhaust section are circulated to at least one of the first supply section and the second supply section via a filter.

[0066] (Item 14) 14. The liquid ejection device according to any one of items 1 to 13, wherein the liquid contains a quantum dot material.

[0067] (Item 15) 15. The liquid ejection device according to item 14, wherein the quantum dot material contains a heavy metal substance.

[0068] (Item 16) Item 16. The liquid ejection device according to item 15, wherein the quantum dot material contains at least one of cadmium, indium, and lead.

[0069] (Item 17) A substrate stage for holding a substrate; a discharge means for discharging a liquid onto the substrate held by the substrate stage; a first chamber covering the substrate stage and the discharge means and having a first opening; a second chamber covering the first chamber and having a second opening; a control means for controlling a first airflow through the first opening and a second airflow through the second opening; having The liquid ejection device, characterized in that the control means controls the first air flow so that it flows from outside the first chamber into the first chamber, and the second air flow so that it flows from inside the second chamber to outside the second chamber.

[0070] (Item 18) A forming step of discharging a liquid onto a substrate using the liquid discharge device according to any one of items 1 to 17 to form a liquid film; a processing step of processing the substrate onto which the liquid has been discharged; having A method for manufacturing an article, comprising the steps of: manufacturing an article from the processed substrate; [Explanation of symbols]

[0071] 1 Inkjet device (liquid ejection device) 2. Board 3. Substrate stage 5 Inkjet head (discharge means) 11 First supply duct (control means) 12 First exhaust duct (control means) 21 Second supply duct (control means) 22 Second exhaust duct (control means) 40 First Chamber 50 Second Chamber P1 First pressure P2 Second pressure

Claims

1. A substrate stage for holding a substrate; a discharge means for discharging a liquid onto the substrate held by the substrate stage; a first chamber covering the substrate stage and the ejection means; A second chamber covering the first chamber; control means for controlling a first pressure in the first chamber and a second pressure outside the first chamber and in the second chamber; having The liquid ejection apparatus, wherein the control means controls the second pressure so that the second pressure is higher than the first pressure and higher than the pressure outside the second chamber.

2. 2. The liquid ejection apparatus according to claim 1, wherein the control means controls the first pressure so that the first pressure is higher than the pressure outside the second chamber.

3. The liquid ejection device according to claim 1 , wherein the first chamber and the second chamber have an opening.

4. The control means a first exhaust section that exhausts gas from a first space in the first chamber; A first supply unit that supplies a gas to the first space; The liquid ejection device according to claim 1 , further comprising:

5. 5. The liquid ejection device according to claim 4, wherein the gas exhausted by the first exhaust section does not circulate to the first supply section.

6. 5. The liquid ejection device according to claim 4, wherein the gas exhausted by the first exhaust unit is circulated to the first supply unit via a filter.

7. 5. The liquid ejection device according to claim 4, wherein the control means controls the pressure of the gas in the first exhaust section to be lower than the pressure outside the second chamber.

8. The liquid ejection device according to claim 4 , wherein the control means controls the flow rate of the gas exhausted by the first exhaust section to be 1.1 times or more the flow rate of the gas supplied by the first supply section.

9. The control means a second exhaust section that exhausts gas from a second space in the second chamber; A second supply unit that supplies a gas to the second space; The liquid ejection device according to claim 1 , further comprising:

10. 10. The liquid ejection device according to claim 9, wherein the gas exhausted by the second exhaust unit is circulated to the second supply unit via a filter.

11. The liquid ejection device according to claim 9 , wherein the control means controls the flow rate of the gas supplied by the second supply section to be 1.1 times or more the flow rate of the gas exhausted by the second exhaust section.

12. The control means a first exhaust section that exhausts gas from a first space in the first chamber; A first supply unit that supplies a gas to the first space; a second exhaust section that exhausts gas from a second space in the second chamber; A second supply unit that supplies a gas to the second space; Including, The gas exhausted by the first exhaust unit does not circulate to the first supply unit, The gas exhausted by the second exhaust unit is circulated to at least one of the first supply unit and the second supply unit via a filter. The liquid ejection device according to claim 1 .

13. The control means a first exhaust section that exhausts gas from a first space in the first chamber; A first supply unit that supplies a gas to the first space; a second exhaust section that exhausts gas from a second space in the second chamber; A second supply unit that supplies a gas to the second space; Including, The liquid ejection device according to claim 1, characterized in that the gas exhausted by the first exhaust section and the gas exhausted by the second exhaust section are circulated to at least one of the first supply section and the second supply section via a filter.

14. The liquid ejection device according to claim 1 , wherein the liquid contains a quantum dot material.

15. The liquid ejection device according to claim 14 , wherein the quantum dot material includes a heavy metal substance.

16. The liquid ejection device of claim 15 , wherein the quantum dot material includes at least one of cadmium, indium, and lead.

17. A substrate stage for holding a substrate; a discharge means for discharging a liquid onto the substrate held by the substrate stage; a first chamber covering the substrate stage and the ejection means and having a first opening; a second chamber covering the first chamber and having a second opening; a control means for controlling a first airflow through the first opening and a second airflow through the second opening; having A liquid ejection device characterized in that the control means controls the first air flow so that it flows from outside the first chamber into the first chamber, and the second air flow so that it flows from inside the second chamber to outside the second chamber.

18. a forming step of discharging a liquid onto a substrate using the liquid discharge device according to any one of claims 1 to 17 to form a liquid film; a processing step of processing the substrate onto which the liquid has been discharged; having A method for manufacturing an article, comprising the steps of: manufacturing an article from the processed substrate;

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