Superconducting wire material and superconducting coil

Abstract

To provide a superconducting wire material capable of preventing deterioration of a superconducting characteristic while securing an electric insulation property, and further suppressing deterioration of a current density, and provide a superconducting coil constructed by the superconducting wire material.SOLUTION: A superconducting wire material 10 includes a tape-like superconducting lamination body 1 having a superconducting layer 4 laminated onto the other layer on a metal substrate 2. On an external front surface of the superconducting lamination body 1, a separation material layer 8 is provided to one part containing a width direction center part of at least one tape width surface (e.g., a back surface 1B), and an insulation material layer 9 is provided to a residual region excluding the one part.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] An embodiment of the present invention relates to a superconducting wire and a superconducting coil formed from the superconducting wire. [Background technology]

[0002] With the improvement of superconducting technology, superconducting application devices such as magnetic resonance imaging devices (MRI), superconducting magnetic energy storage devices (SMES), single crystal pulling devices, etc. These superconducting application devices contain superconducting coils made by winding superconducting wires.

[0003] In recent years, superconducting coils using high-temperature superconducting wires that have excellent critical current characteristics in high temperatures and strong magnetic fields have been developed. As high-temperature superconducting wires, for example, thin-film superconducting wires with a multilayer structure (hereinafter referred to as superconducting laminates) have been developed that have a tape-shaped metal substrate such as Hastelloy (registered trademark), an intermediate layer such as cerium oxide, an oxide superconducting layer such as YBa2Cu3O7, and a protective metal layer such as silver.

[0004] In order to maintain the wound shape and improve the heat transfer in a vacuum, a superconducting coil is known that is impregnated with a thermosetting synthetic resin such as an epoxy resin. However, a multi-layered superconducting laminate is vulnerable to a tensile stress in a direction perpendicular to the wide surface of the tape, i.e., a peeling force. Therefore, when the superconducting coil is cooled, the thermal stress caused by the difference in the thermal contraction rate between the thermosetting synthetic resin and the superconducting laminate may cause delamination, which may deteriorate the superconducting characteristics. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2011-198469 A [Patent Document 2] JP 2012-216504 A [Patent Document 3] JP 2008-85498 A [Patent Document 4] JP 2012-59403 A Summary of the Invention [Problem to be solved by the invention]

[0006] In response to this, Patent Document 1 discloses a technique for reducing the peeling force generated inside a superconducting coil due to cooling by forming a release material layer on a part of the outer surface of a superconducting wire insulated with a superconducting laminate. When insulating the tape-shaped superconducting laminate described in Patent Document 1, it is difficult to form a film thickness at the corners of the superconducting laminate. If the stabilizing layer (metal plating) is exposed at the corners of the superconducting laminate, there is a risk of insulation failure. Therefore, as described in Patent Document 2, it is necessary to thicken the insulating layer and cover the entire circumference of the superconducting laminate, including the corners, with the insulating layer.

[0007] Also in Patent Document 2, it is necessary to add a configuration such as a release material layer that reduces the peeling force acting on the superconducting laminate in order to prevent deterioration of the superconducting characteristics as described in Patent Document 1. On the other hand, it is necessary to increase the current density in order to reduce the weight and size of the superconducting coil, and therefore it is preferable that the thickness of the superconducting wire is thin.

[0008] An embodiment of the present invention has been made in consideration of the above-mentioned circumstances, and aims to provide a superconducting wire that can prevent deterioration of superconducting characteristics while ensuring electrical insulation, and further suppress a decrease in current density, and a superconducting coil made of this superconducting wire. [Means for solving the problem]

[0009] The superconducting wire in an embodiment of the present invention has a tape-shaped superconducting laminate having a superconducting layer laminated on a metal substrate together with other layers, and is characterized in that the outer surface of this superconducting laminate is provided with a release material layer on a portion including the widthwise center of at least one of the tape wide faces, and an insulating material layer on the remaining area excluding the portion.

[0010] A superconducting coil in an embodiment of the present invention is a superconducting coil formed by winding the superconducting wire described in the embodiment, characterized in that at least a portion of the wound superconducting wire is impregnated with resin. Effect of the Invention

[0011] According to the embodiment of the present invention, it is possible to prevent deterioration of superconducting characteristics while ensuring electrical insulation, and further to suppress a decrease in current density. [Brief description of the drawings]

[0012] [Figure 1] 1(A) is a cross-sectional view showing the superconducting wire according to the first embodiment, and (B), (C), and (D) are cross-sectional views showing first, second, and third modified forms, respectively, of the superconducting wire in FIG. 1(A). [Diagram 2] 2 is a perspective view showing a partly cutaway view of a superconducting laminate constituting the superconducting wire of FIG. 1. [Diagram 3] 2 is a perspective view showing one half of a superconducting coil made of the superconducting wire of FIG. 1. [Figure 4] 4 is an enlarged cross-sectional view showing a part of cross section S of the superconducting coil of FIG. 3 cut in the diameter direction. [Diagram 5] FIG. 6 is a cross-sectional view showing a superconducting wire according to a second embodiment. [Figure 6] 6A is a cross-sectional view showing a superconducting wire according to a third embodiment, and FIG. 6B is a cross-sectional view showing a modified form of the superconducting wire of FIG. 6A. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. [A] First embodiment (FIGS. 1 to 4) Fig. 1(A) is a cross-sectional view showing a superconducting wire according to a first embodiment, Fig. 2 is a perspective view showing a superconducting laminate constituting the superconducting wire of Fig. 1 with a part cut away, and Fig. 3 is a perspective view showing one half of a superconducting coil composed of the superconducting wire of Fig. 1. As shown in Fig. 1(A), a superconducting wire 10 is configured by providing a release material layer 8 on a part of the outer surface of a tape-shaped superconducting laminate 1 and an insulating material layer 9 on the entire remaining area of ​​the outer surface. The superconducting wire 10 configured in this manner is wound as shown in Fig. 3, and at least a part of a winding portion 12 around which the superconducting wire 10 is wound is impregnated with a thermosetting synthetic resin 13 (Fig. 4), thereby forming a superconducting coil 11.

[0014] As shown in Fig. 2, the superconducting laminate 1 is configured to include a superconducting layer 4 on a metal substrate 2 together with other layers. In other words, the superconducting laminate 1 is a tape-shaped wire in which a plurality of thin-film layers are laminated, and includes at least the metal substrate 2, an intermediate layer 3, and a superconducting layer 4, which are covered with a stabilization layer 5. If necessary, an orientation layer 6 is provided between the metal substrate 2 and the intermediate layer 3. Furthermore, a protective layer 7 is provided between the superconducting layer 4 and the stabilization layer 5.

[0015] The metal substrate 2 is made of a high-strength metal material, such as stainless steel or a nickel alloy such as Hastelloy (registered trademark). The intermediate layer 3 is made of a material such as cerium oxide, magnesium oxide, yttrium oxide, or ytterbium oxide. The intermediate layer 3 functions as a buffer layer between the superconducting layer 4 and the metal substrate 2. The superconducting layer 4 is made of a Re123-based high-temperature superconductor, such as YBCO, DyBCO, or GdBCO.

[0016] The stabilization layer 5 is made of a conductive material such as copper or silver. When an excessive amount of electricity flows through the superconducting layer 4, the stabilization layer 5 functions as a bypass for diverting the current to the stabilization layer 5. The orientation layer 6 is provided for the purpose of oriented orientation of the intermediate layer 3. The orientation layer 6 is made of a material such as magnesium oxide. The protective layer 7 is provided for the purpose of preventing the superconducting layer 4 from being deteriorated due to contact with moisture in the air. The protective layer 7 is made of a material such as silver. Like the stabilization layer 5, the protective layer 7 also functions as a bypass for diverting the current to the protective layer 7 when an excessive amount of electricity flows through the superconducting layer 4.

[0017] Each layer of the superconducting laminate 1 (metal substrate 2, orientation layer 6, intermediate layer 3, superconducting layer 4, protective layer 7, stabilization layer 5) has an asymmetric structure with respect to the stacking direction. This asymmetric structure with respect to the stacking direction indicates that the types of layers stacked are different. The wide tape surface of the superconducting laminate 1 is divided into the wide tape surface (front surface 1A) closer to the superconducting layer 4 and the wide tape surface (back surface 1B) closer to the metal substrate 2. At least some of the layers of the superconducting laminate 1 may have a different thickness from the other layers.

[0018] As shown in FIG. 1(A), the release material layer 8 provided on a portion of the outer surface of the above-mentioned superconducting laminate 1 has the function of reducing the peeling force acting on the superconducting laminate 1 of the superconducting wire 10 when the superconducting coil 11 is cooled, and is a layer containing at least one type selected from the group consisting of fluorine-based resins such as Teflon (registered trademark), paraffin, grease, and silicone oil.

[0019] Here, as shown in Fig. 2, the outer surface of the superconducting laminate 1 is composed of a front surface 1A (superconducting layer 4 side) and a back surface 1B (metal substrate 2 side) which are opposed to each other and which are the tape wide surfaces, and two side surfaces 1C which are continuous with and opposed to the front surface 1A and the back surface 1B. As shown in Figs. 1(A) to 1(D), the release material layer 8 is provided on a part including a widthwise center portion of at least one of the tape wide surfaces (e.g., the back surface 1B) on the outer surface of the superconducting laminate 1. That is, the release material layer 8 is provided on the widthwise center portion of the back surface 1B of the superconducting laminate 1 in the first embodiment and the third modified embodiment shown in Figs. 1(A) and 1(D), on the entire surface of the back surface 1B of the superconducting laminate 1 in the first modified embodiment shown in Fig. 1(B), and on the entire surface of the back surface 1B of the superconducting laminate 1 and on a region extending outward from the back surface 1B in the second modified embodiment shown in Fig. 1(C).

[0020] As shown in FIG. 4, when the superconducting coil 11 is cooled, the release material layer 8 must be peeled off from the thermosetting synthetic resin 13 on one of the wide tape surfaces (e.g., the back surface 1B) on the outer surface of the superconducting laminate 1 before each layer of the superconducting laminate 1 is destroyed or peeled off. For this reason, it is preferable that the release material layer 8 is formed on 50% or more of the wide tape surface (e.g., the back surface 1B) on the outer surface of the superconducting laminate 1 so as to include the widthwise center of the wide tape surface (e.g., the back surface 1B). Between the first embodiment of FIG. 1(A) and the first modified form of FIG. 1(B), the first modified form can reduce the risk of deterioration of the superconducting characteristics due to peeling of each layer of the superconducting laminate 1. In addition, the release material layer 8 may not be provided on the other wide tape surface (e.g., the front surface 1A) as long as it is provided on a portion including the widthwise center of one of the wide tape surfaces (e.g., the back surface 1B) on the outer surface of the superconducting laminate 1.

[0021] 4, the release material layer 8, which causes an increase in thermal resistance due to peeling between the release material layer 8 and the thermosetting synthetic resin 13 when the superconducting coil 11 is cooled, is preferably formed only on the wide surfaces of the tape (front surface 1A, back surface 1B) and not on the side surface 1C of the superconducting laminate 1. This is because, in the axial direction O of the superconducting coil 11, the superconducting laminate 1 and the thermosetting synthetic resin 13 are bonded together via the insulating material layer 9 to ensure a heat transfer path in the axial direction O, thereby making it possible to reduce the risk of thermal damage occurring when the superconducting coil 11 generates heat.

[0022] Furthermore, an insulating material layer 9 may be formed on the tape wide surface (e.g., back surface 1B) on the outer surface of the superconducting laminate 1 on which the release material layer 8 is formed (FIG. 1(A)), but in this case, the thickness of the insulating material layer 9 is preferably equal to that of the release material layer 8. Also, as shown in FIG. 1(D), the thickness of the insulating material layer 9 formed on the tape wide surface (e.g., back surface 1B) on which the release material layer 8 is formed on the outer surface of the superconducting laminate 1 may be thinner than the thickness of the insulating material layer 9 formed on the other tape wide surface (e.g., front surface 1A). The thickness of the insulating material layer 9 needs to be thick to cover the corners of the superconducting wire 10, but the thickness of the release material layer 8 can be thin within a range that satisfies the releasing action. Therefore, by thinning the thickness of the insulating material layer 9 formed on the same tape wide surface (e.g., back surface 1B) as the release material layer 8 to the same thickness as the release material layer 8, it is possible to further increase the current density of the superconducting wire 10.

[0023] The insulating material layer 9 formed on all remaining regions (including, for example, the front surface 1A and the side surface 1C) of the outer surface of the superconducting laminate 1 except for the portion where the release material layer 8 is formed has the function of preventing electrical insulation failure of the superconducting laminate 1 and ensuring the thermal conductivity of the superconducting wire 10 by bonding with the thermosetting synthetic resin 13. This insulating material layer 9 is a layer containing at least one selected from the group consisting of polyvinyl formal, polyvinyl butyral, polyester, polyurethane, polyamide, polyamideimide, polyimide, epoxy, acrylic, and rubber.

[0024] The release material layer 8 and the insulating material layer 9 described above are preferably heat-cured and further dried at or below 200° C., since the superconducting characteristics of the superconducting wire 10 generally deteriorate when the wire is heated to 200° C. or higher for a long period of time, as described in Patent Document 4.

[0025] An example of a method for forming a release material layer 8 on one of the wide tape surfaces (e.g., back surface 1B) on the outer surface of the superconducting laminate 1, and forming an insulating material layer 9 on the entire outer surface except for the part on which the release material layer 8 is formed, is as follows: That is, after masking one of the wide tape surfaces (e.g., back surface 1B) on the outer surface of the superconducting laminate 1, spray painting or electrostatic painting is performed in a direction perpendicular to this wide tape surface (e.g., back surface 1B) over a coating range wider than the tape width to form insulating material layer 9 on the other wide tape surface (e.g., front surface 1A) and both side surfaces 1C of the superconducting laminate 1, and then the masking is removed and release material layer 8 is formed on one of the wide tape surfaces (e.g., back surface 1B) by electrochemical coating. By using a post-process such as a water washing process after the electrocoating, the release material adhered to the insulating layer 9 can be washed away before thermal curing, making it possible to form the release material layer 8 only on the wide surface of the tape (e.g., the back surface 1B) on the outer surface of the superconducting laminate 1 where the insulating layer 9 is not formed.

[0026] 1(D), an example of a method for forming the insulating layer 9 on one of the tape wide surfaces (e.g., rear surface 1B) on the outer surface of the superconducting laminate 1 with a thin coating is as follows: That is, a coating of the insulating layer 9 is formed on the entire outer surface of the superconducting laminate 1 using a masking agent, except for a portion where the release material layer 8 is to be formed, and then, before the coating is thermally cured, a tool such as a spatula is brought into contact with one of the tape wide surfaces (e.g., rear surface 1B) and the coating attached to this one of the tape wide surfaces (e.g., rear surface 1B) is scraped off with the spatula or the like.

[0027] Furthermore, the above-mentioned electrodeposition coating has the advantage that it is possible to form a high-quality coating film compared to other coating techniques such as electrostatic coating, spray coating, or powder coating as described in Patent Document 3. However, when the release material layer 8 is formed on the insulating material layer 9 as in Patent Document 1, it is difficult to apply coating of the release material layer 8 using electrophoresis such as electrodeposition coating to coating of the insulating material layer 9. In contrast, in the first embodiment and the first to third modified embodiments, the release material layer 8 is formed on the outer surface of the superconducting laminate 1, so that coating of this release material layer 8 can be easily applied.

[0028] When the release material layer 8 and the insulating material layer 9 are formed by electrodeposition coating as described above, it is preferable that the release material layer 8 and the insulating material layer 9 are a chemical composition for electrophoretic coating. This chemical composition for electrophoretic coating is not limited to anionic or cationic types, and is a paint for electrophoretic coating that is made by dissolving a paint containing an acidic group such as a carboxyl group or an alkaline group such as an amino group in water and neutralizing it with an alkali or acid to charge it.

[0029] Being configured as described above, the first embodiment and the first to third modified embodiments provide the following advantages (1) to (3). 1 and 4, the outer surface of the superconducting laminate 1 having the superconducting layer 4 is entirely covered with the insulating material layer 9 and the release material layer 8. Therefore, in the superconducting coil 11 formed by winding the superconducting wire 10 constituted by this superconducting laminate 1, it is possible to prevent the stabilization layers (metal plating) of the superconducting laminate 1 from coming into direct contact with each other between adjacent superconducting wires 10. Therefore, the electrical insulation of the superconducting wire 10 can be ensured.

[0030] (2) On the outer surface of the tape-shaped superconducting laminate 1 having the superconducting layer 4, a release material layer 8 is provided on a part of one of the tape wide surfaces (for example, the back surface 1B). Therefore, when the superconducting wire 10 constituted by this superconducting laminate 1 is wound and impregnated with a thermosetting synthetic resin 13 to form a superconducting coil 11, the superconducting wire 10 is bonded to the thermosetting synthetic resin 13 via the release material layer 8. Therefore, when the superconducting coil 11 is cooled, the release material layer 8 peels off from the thermosetting synthetic resin 13 before each layer of the superconducting laminate 1 in the superconducting wire 10 peels off, so that the peeling force acting on the superconducting laminate 1 can be reduced. As a result, deterioration of the superconducting characteristics of the superconducting wire 10 due to peeling off of each layer of the superconducting laminate 1 can be prevented.

[0031] (3) As shown in Fig. 1, in the superconducting wire 10 of the first embodiment and the first to third modified embodiments, a release material layer 8 is provided on a portion of the outer surface of the superconducting laminate 1, and an insulating material layer 9 is provided on the entire remaining area of ​​the outer surface excluding the portion, to form the superconducting wire 10. Therefore, in the first embodiment etc., the thickness of the superconducting wire 10 can be made thinner than in the case where an insulating material layer is provided on the entire outer surface of the superconducting laminate 1 and a release material layer is provided on a portion of this insulating material layer to form a superconducting wire (see Patent Document 1). As a result, a decrease in current density in the superconducting wire 10 of the first embodiment etc. can be suppressed.

[0032] [B] Second embodiment (Fig. 5) 5 is a cross-sectional view showing a superconducting wire according to the second embodiment. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof will be simplified or omitted.

[0033] The superconducting wire 20 of the second embodiment differs from the first embodiment in that a release material layer 8 is provided on a portion of the tape wide surface, including the widthwise center portion, of both one (e.g., back surface 1B) and the other (e.g., front surface 1A) of the outer surface of the superconducting laminate 1.

[0034] An example of a method for forming the release material layer 8 on both tape wide surfaces (front surface 1A, back surface 1B) on the outer surface of the superconducting laminate 1 and further forming the insulating material layer 9 is as follows: That is, after masking the center portions in the width direction of both tape wide surfaces (front surface 1A, back surface 1B) on the outer surface of the superconducting laminate 1, spray painting or electrostatic painting is performed in a direction perpendicular to these tape wide surfaces over a coating range wider than the tape width to form the insulating material layers 9 near both side surfaces 1C of the superconducting laminate 1, and then the masking is removed and the release material layer 8 is formed by electrochemical coating.

[0035] Another method is to mask both wide tape surfaces (front surface 1A, back surface 1B) on the outer surface of the superconducting laminate 1, then narrow the area to be sprayed or electrostatically painted, and spray the paint targeting both side surfaces 1C of the superconducting laminate 1 to form insulating material layers 9 on both side surfaces 1C of the superconducting laminate 1, and then remove the masking and form release material layers 8 by electrochemical coating.

[0036] As configured as above, the second embodiment also provides the following effect (4) in addition to the effects (1) and (3) of the first embodiment.

[0037] (4) On the outer surface of the superconducting laminate 1, the release material layer 8 is formed on both the one and the other tape wide surfaces (front surface 1A, back surface 1B). Therefore, when the superconducting wire 20 composed of this superconducting laminate 1 is wound and impregnated with the thermosetting synthetic resin 13 to form a superconducting coil, the superconducting wire 20 is adhered to the thermosetting synthetic resin 13 via the two release material layers 8. Therefore, when the superconducting coil is cooled, before each layer of the superconducting laminate 1 in the superconducting wire 20 peels off, at least one of the release material layers 8 formed on each of the front surface 1A and the back surface 1B of the outer surface of the superconducting laminate 1 peels off from the thermosetting synthetic resin 13, so that the peeling force acting on the superconducting laminate 1 can be further reduced. As a result, it is possible to reliably prevent the deterioration of the superconducting characteristics of the superconducting wire 20 due to peeling off of each layer of the superconducting laminate 1.

[0038] [C] Third embodiment (FIG. 6) 6A is a cross-sectional view showing a superconducting wire according to the third embodiment. In the third embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and the description thereof will be simplified or omitted.

[0039] The superconducting wire 30 of this third embodiment differs from the first embodiment in that a release material layer 8 is provided over the entire area of ​​one surface 31 of the superconducting wire 30 that contacts the entire surface of one of the tape wide surfaces (e.g., back surface 1B) on the outer surface of the superconducting laminate 1.

[0040] As shown in Figures 6(A) and (B), the insulating material layer 9 is formed on the other tape wide surface (e.g., front surface 1A) and both side surfaces 1C on the outer surface of the superconducting laminate 1, and is preferably formed thick in order to form a coating film up to the corners of the superconducting laminate 1. On the other hand, as shown in Figure 6(A), the release material layer 8 is preferably formed thinner than the insulating material layer 9 because it is not necessary to cover the corners of the superconducting laminate 1. By forming the release material layer 8 on the entire area of ​​one surface portion 31 of the superconducting wire 30 that contacts the entire surface of one tape wide surface (e.g., back surface 1B) on the outer surface of the superconducting laminate 1, as shown in Figure 6(A), it is not necessary to make the thicknesses of the release material layer 8 and the insulating material layer 9 the same, and it is possible to form the release material layer 8 thinner than the insulating material layer 9 within a range in which the release effect functions.

[0041] An example of a method for forming the release material layer 8 on the entire region of one surface portion 31 of the superconducting wire 30 in contact with the entire surface of one wide surface of the tape (e.g., back surface 1B) on the outer surface of the superconducting laminate 1 is as follows. That is, a mask is applied so as to cover the entire surface of one wide surface of the tape (e.g., back surface 1B) on the outer surface of the superconducting laminate 1, and a general coating such as spray coating or powder coating is performed from the other wide surface of the tape (e.g., front surface 1A) to form an insulating material layer 9 on the other wide surface of the tape (e.g., front surface 1A) and both side surfaces 1C on the outer surface of the superconducting laminate 1. Thereafter, the masking is removed, and the release material layer 8 is formed on the entire region of one surface portion 31 of the superconducting wire 30 in contact with the entire surface of one wide surface of the tape (e.g., back surface 1B) on the outer surface of the superconducting laminate 1.

[0042] In the modified superconducting wire 30 shown in Fig. 6(B), the release material layer 8 is formed on the entire area of ​​one surface portion 31 of the superconducting wire 30 in contact with the entire surface of one of the tape wide surfaces (e.g., rear surface 1B) on the outer surface of the superconducting laminate 1, and on parts of both side surfaces 1C adjacent to this one of the tape wide surfaces (e.g., rear surface 1B). Even in this modified form, the release material layer 8 can be formed thinner than the insulating material layer 9. Furthermore, when forming the insulating material layer 9 and the release material layer 8, the insulating material layer 9 may be formed by masking, for example, the entire surface of the rear surface 1B and parts of both side surfaces 1C of the superconducting laminate 1, and then the masking may be removed to form the release material layer 8.

[0043] As configured as above, the third embodiment provides the following effect (5) in addition to the effects (1) to (3) of the first embodiment.

[0044] (5) By forming the insulating material layer 9, which needs to be applied thickly, in a limited manner on the other tape wide surface (e.g., front surface 1A) and both side surfaces 1C on the outer surface of the superconducting laminate 1, the thickness of the release material layer 8 formed on the entire area of ​​one surface portion 31 of the superconducting wire 30 contacting the entire surface of one tape wide surface (e.g., back surface 1B) on the outer surface of the superconducting laminate 1 can be made thinner than the thickness of the insulating material layer 9. As a result, the current density of the superconducting wire 30 can be increased.

[0045] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, changes, and combinations can be made without departing from the spirit of the invention. Furthermore, these substitutions, changes, and combinations are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0046] REFERENCE SIGNS LIST 1...superconducting laminate, 1A...front surface, 1B...rear surface, 2...metal substrate, 4...superconducting layer, 8...release material layer, 9...insulating material layer, 10...superconducting wire, 11...superconducting coil, 13...thermosetting synthetic resin, 20...superconducting wire, 30...superconducting wire, 31...one surface

Claims

1. A tape-shaped superconducting laminate having a superconducting layer laminated on a metal substrate together with other layers, This superconducting wire is characterized in that a release material layer is provided on a portion of the outer surface of the superconducting laminate, including the widthwise center of at least one of the wide tape faces, and an insulating material layer is provided on the remaining area excluding the portion.

2. 2. The superconducting wire according to claim 1, characterized in that the insulating layer contains at least one material selected from the group consisting of polyvinyl formal, polyvinyl butyral, polyester, polyurethane, polyamide, polyamideimide, polyimide, epoxy, acrylic, and rubber.

3. 2. The superconducting wire according to claim 1, wherein the release material layer contains at least one material selected from the group consisting of fluororesin, paraffin, grease, and silicone oil.

4. 2. The superconducting wire according to claim 1, wherein the insulating layer is comprised of a chemical composition containing an acidic group or an alkaline group.

5. 2. The superconducting wire according to claim 1, wherein the release layer is comprised of a chemical composition containing an acidic group or an alkaline group.

6. 2. The superconducting wire according to claim 1, wherein the release material layer is provided on one and the other tape wide surfaces on the outer surface of the superconducting laminate.

7. 2. The superconducting wire according to claim 1, wherein the release material layer is provided over the entire area of ​​one surface of the superconducting wire that is in contact with one of the tape wide surfaces on the outer surface of the superconducting laminate.

8. A superconducting coil formed by winding the superconducting wire according to claim 1, A superconducting coil, characterized in that at least a portion of the wound superconducting wire is impregnated with resin.

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