Method for determining probing parameters used when probe system performs test on device under test, probe system and method of operating the same, non-transitory computer-readable recording medium, method for testing unpackaged semiconductor device, tested semiconductor device and method for manufacturing the same, and method for generating virtual mark images

Abstract

To provide a method for determining probing parameters used when a probe system performs a test on a device under test.SOLUTION: A method defines a dataset representing the relationship between a slip distance and a probing stroke on the basis of the configuration of probes in a probe assembly within a probe system and the configuration of contact pads on the device under test to be tested. A control device acquires a value for setting the slip distance after the probe tip contacts the contact pad of the device under test or a value for setting the probing stroke which represents the relative movement between the probe assembly and the device under test after the probe tip contacts the contact pad of the device under test, acquires a slip distance value and a probing stroke value on the basis of the probe target position or probe current position, and determines the position used for the relative positioning of the probe assembly and the device under test.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a technology for performing inspection and measurement using a probe assembly, and in particular to a method for determining probing parameters used when a probe system performs a test on a device under test, a method for operating a probe system using the method, a probe system, a non-transitory computer-readable recording medium, a method for testing an unpackaged semiconductor device, a method for manufacturing a tested semiconductor device, and a tested semiconductor device, as well as a method for generating a virtual mark image. [Background technology]

[0002] As shown in FIGS. 1A and 1B, when a test is conventionally performed on a device under test using a probe assembly, the device under test is placed on a chuck, and the probe assembly and the chuck move relatively to a state in which a probe tip 11 of a probe 10 of the probe assembly initially contacts a contact pad 12 of the device under test. At this time, the probe tip 11 of the probe 10 is located at an initial contact position P1 (see FIGS. 1A and 1B). Thereafter, the probe assembly and the chuck move relatively to a vertical direction (i.e., Z axis) a predetermined distance (probing stroke (overdrive) OD). Usually, the chuck moves upward from the contact height and approaches the probe assembly, so that the probe tip 11 of the probe 10 and the surface of the contact pad 12 of the device under test receive a force and are reliably abutted against each other. At the same time, the probe tip 11 of the probe 10 is deflected (i.e., moved on the X-axis or Y-axis) to move a predetermined distance (skate distance SD) on the surface of the contact pad 12 and stop at a final contact position P2, so that a probe mark is generated on the surface of the contact pad 12. The length of the probe mark is equal to the skate distance SD. To ensure that the probe assembly provides good test performance on the device under test and that performance is maintained consistently, it is usually desired that a consistent probe mark is generated from each test. That is, the exact initial contact position P1, final contact position P2, and skate distance SD are required.

[0003] Currently, before starting a test, it is necessary to first find the appropriate probing stroke OD using a calibration board. This process is very inconvenient and time-consuming. For example, there is at least a material difference between the calibration board and the device under test during actual operation. Therefore, even if an appropriate probing stroke OD is obtained on the calibration board, it is difficult to guarantee that the probe tip 11 of the probe 10 will stop at the predetermined final contact position P2 when it is applied to the device under test. If the device under test is the calibration standard (test circuit) of the calibration board, usually, calibration tests of the probing stroke OD must be performed many times on the calibration standard (test circuit) before the initial contact position P1 at which the probe tip 11 of the probe stops at the predetermined final contact position P2 can be known. Not only is this process inconvenient and time-consuming, but repeated operation will cause wear and damage to the probe or calibration standard. In addition, errors may occur in the calibration result of the probing stroke OD, which may result in an inaccurate final contact position P2 during actual testing, causing erroneous test results. An accurate final contact position P2 is especially important in high-frequency testing. More specifically, once the probing stroke OD is obtained, this setting is uniformly applied to all devices under test on the board, so it is not realistic to adjust and set the probing stroke OD individually for each device under test so that the probe tip 11 of the probe 10 stops at the desired final contact position P2 in order to obtain good test results.

[0004] In addition, when performing a test, it is necessary to confirm by an imaging device (e.g., a microscope) whether the position where the probe tip 11 of the probe 10 is in contact with the contact pad 12 of the device under test in advance is the desired initial contact position P1. However, since the field of view (FOV) of the imaging device is narrow, even if the probe tip 11 of the probe 10 and the contact pad 12 of the device under test are on the same plane, they generally cannot be clearly seen at the same time, except when the probe tip 11 of the probe 10 and the contact pad 12 of the device under test are in contact with each other. For this reason, even if the desired initial contact position P1 is known, it is difficult to accurately position the probe tip 11 of the probe 10 at the desired initial contact position P1. As a result, it is difficult to generate a matched probe mark, and it is difficult to maintain and match good test performance of the device under test by the probe assembly. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made to solve the above-mentioned problems, and aims to provide a method for determining probing parameters used when a probe system performs a test on a device under test, which enables the probing parameters to be obtained simply and quickly, and enables the probe assembly to exhibit good and consistent test performance. [Means for solving the problem]

[0006] In order to solve the above problems, a method for determining probing parameters used when a probe system performs a test on a device under test according to the present invention includes the steps of: defining a data set indicating a relationship between a sliding distance and a probing stroke based on a configuration of a probe of a probe assembly in the probe system and a configuration of a contact pad of a device under test to be tested; providing one of a slip distance value and a probing stroke value to a controller; The sliding distance value is a value that sets a distance that the probe tip of the probe slides on the contact pad of the device under test after the probe tip comes into contact with the contact pad, the probing stroke value is a value that sets a distance that the probe assembly and the device under test move relative to each other again after the probe tip of the probe contacts a contact pad of the device under test; providing one of a probe target position and a probe current position to the controller; the probe target position is a position where the probe tip of the probe is to stop after sliding over the contact pad of the device under test, the probe current position being a current position of the probe tip; using the control device to determine the other of the slippage distance value and the probing stroke value based on one of the slippage distance value and the probing stroke value and a data set indicating a relationship between slippage distance and probing stroke, and determining a position to be used for relative positioning of the probe assembly and the device under test based on the slippage distance value and one of the probe target position and the probe current position.

[0007] Thus, the data set indicating the relationship between the sliding distance and the probing stroke may be data previously stored in the control device, or the relationship between the sliding distance and the probing stroke may be measured using a calibration board before the test is performed, and the relationship data set may be constructed in the control device based on the measured data. Then, by providing a predetermined sliding distance value or probing stroke value and a predetermined probe target position or probe current position, the control device can perform calculations using the relationship data set. Thus, both the sliding distance value and the probing stroke value can be known, and necessary parameters can be calculated according to the requirements of the alignment method. For example (but not limited to this), the position where the probe tip of the probe should start to contact the contact pad of the device under test (e.g., the initial contact position P1 in FIG. 1B) is calculated from the probe target position and the sliding distance value. In other words, if the data set indicating the relationship between the sliding distance and the probing stroke has already been constructed, the user only needs to input partial parameters (e.g., the sliding distance value and the probe target position) into the control device to obtain the parameters required to test the device under test using the probe assembly. Thus, a time-consuming initial setting process is not required before each test. For example, there is no need to use a calibration substrate to find the proper probing stroke, or to calibrate and measure multiple probing strokes to obtain the initial contact position. Also, the method of the present invention can provide accurate parameters to ensure that the probe tip of the probe stops at the desired probe target position after sliding over the contact pad of the device under test. Therefore, the method of the present invention for determining the probing parameters used when the probe system tests the device under test is convenient and time-saving, and can ensure that the probe assembly has good and consistent test performance, improve the test accuracy, and reduce wear and prolong the life of the probe and calibration substrate.

[0008] Preferably, a probe target position is provided to the controller, as in the example given in the previous paragraph. The position used to position the probe assembly and the device under test relative to one another is a probe contact position. The lobe contact position is the position where the probe tip of the probe will start to contact the contact pad of the device under test and is used to position the probe tip of the probe at the probe contact position.

[0009] As a result, when the control device acquires the probe contact position, it directly positions the probe tip of the probe at the probe contact position, and then executes the probing stroke work program so that the probe tip of the probe stops at the desired probe target position.

[0010] More preferably, the method for determining probing parameters to be used when the probe system performs a test on a device under test further includes a step of confirming that both the probe contact position and the probe target position are located within an acceptable range corresponding to the contact pad of the device under test.

[0011] As mentioned above, the control device performs calculations based on the data set showing the relationship between the slip distance and the probing stroke, and can obtain the slip distance value, the probing stroke value, the probe contact position, and the probe target position. Therefore, after the probe contact position and the probe target position are obtained, it can be confirmed whether these two positions are located within the allowable range of the contact pad of the device under test, and during the probing stroke, the probe tip of the probe can be reliably abutted against the contact pad of the device under test, and an appropriate probe mark can be generated, so as to further ensure the test accuracy.

[0012] More preferably, the method for determining probing parameters to be used when the probe system performs a test on a device under test further includes a step of using the control device to generate a virtual alignment mark indicating the probe contact position, and using the virtual alignment mark to align the probe tip of the probe with respect to the virtual alignment mark.

[0013] Thus, when a user manually aligns the probe, even if only the probe tip of the probe is clearly displayed by the microscope and the contact pad of the device to be measured is not clearly displayed, the user can align the probe tip of the probe with the virtual alignment mark by simply displaying the virtual alignment mark on the display device. Therefore, after the probe tip of the probe is accurately positioned at the probe contact position, the probing stroke operation program is executed to ensure that the probe tip stops at the required probe target position. Furthermore, even when automatic positioning is performed, the virtual alignment mark is displayed on the display device so that the user can grasp the current situation.

[0014] Preferably, the probe current position can be changed to provide to the control device. The position used for the relative positioning of the probe assembly and the device under test is a relative target position. The relative distance between the relative target position and the probe current position is the same as the slip distance value, and the relative target position and the probe assembly are moved relatively to the device under test in synchronization with each other to move the relative target position to a position corresponding to the contact pad of the device under test, and the probe assembly and the device under test are positioned relative to each other.

[0015] Thus, the position of the contact pad of the measured device is visually set by the user, and a value has not yet been provided to the control device. More specifically, the position of the contact pad of the measured device may be a position where the user intends to stop the probe tip of the probe after sliding it on the contact pad of the measured device. This is similar to the above-mentioned probe target position, and a value is not set, and the user decides it by himself when performing the operation. Thus, the relative target position can be calculated based on the sliding distance value and the probe current position, and the user can move the relative target position relatively to the probe stop position determined by himself. Alternatively, even in a situation where the probe target position is already known, it is possible to perform alignment by calculating the relative target position and moving the relative target position relatively to the probe target position, rather than positioning based on the probe contact position. In this case, the position of the corresponding contact pad of the measured device becomes the probe target position. This relative target position moves relatively to the measured device together with the probe assembly. The probe tip of the probe is positioned at an appropriate position on the contact pad of the measured device simply by moving the relative target position relative to the position of the above-mentioned corresponding contact pad of the measured device. Therefore, after executing the probing stroke operation program, the probe tip of the probe can be stopped at a required position.

[0016] More preferably, the method for determining probing parameters to be used when the probe system performs a test on a device under test further includes a step of using the control device to generate a virtual alignment mark indicating the relative target position, relatively moving the virtual alignment mark to a position corresponding to the contact pad of the device under test, and using the control device to move the relative target position to a position corresponding to the contact pad of the device under test.

[0017] Thus, when the user manually aligns the probe, even if the probe tip of the probe and the contact pad of the device to be measured cannot be displayed clearly at the same time by the microscope, the virtual alignment mark is displayed on the display device, and the probe assembly and the virtual alignment mark are moved relative to the device to be measured in synchronization, so that the user can align the virtual alignment mark with the probe target position when the probe target position is also displayed on the display device. Alternatively, with the contact pad of the device to be measured clearly displayed on the display device, the user can move the mie alignment mark relatively to the probe stop position set by visual observation, so that the probe tip of the probe is positioned at an appropriate position on the contact pad of the device to be measured, and the probe tip of the probe stops at the required position after the probing stroke work program is executed. Also, even when automatic positioning is performed, the virtual alignment mark is displayed on the display device so that the user can grasp the current situation.

[0018] Preferably, a data set indicating the relationship between sliding distance and probing stroke is constructed using said probe system and a calibration substrate, the construction method comprising the steps of: Step 1: The probe tip of the probe is brought into contact with the calibration substrate. Step 2: The probe and the calibration substrate are moved relative to each other by one probing stroke in the vertical axis direction, and the tip of the probe is slid on the calibration substrate to generate a sliding distance, and the sliding distance is observed using an optical imaging device. Step 3: Using the control device, generate a data set indicative of a relationship between the slippage distance and the probing stroke based on the slippage distance and the probing stroke.

[0019] Thus, the user can provide multiple different probing strokes and perform measurements on the calibration board to obtain the corresponding slip distances, and a data set showing the relationship between the slip distances and the probing strokes is built in the control device. In the future, when a probe whose shape corresponds to this data set is used to test a contact pad whose shape corresponds to this data set, the data set showing the relationship between the slip distances and the probing strokes that has already been built can be directly used. Thus, the required probing parameters can be easily and quickly obtained, and the probe assembly can have good and consistent test performance.

[0020] Further, a method of operating a probe system according to the present invention corresponds to a situation where positioning is performed using the above-mentioned probe contact position. The probe system includes a probe assembly and a control device. The probe assembly includes a probe having a probe tip that is used to contact a contact pad of a device under test. The method of operating the probe system includes the following steps: Step 1: Using the control device, execute the method for determining probing parameters to be used when the probe system performs a test on a device under test described above. Step 2: Using the control device, position the probe tip of the probe at the probe contact position. Step 3: Utilizing the controller, execute a probing stroke operation program. The probing stroke operation program causes the probe assembly and the device under test to move relatively a probing stroke value, so that the probe tip of the probe deflects and slides to stop at the probe target position.

[0021] This operation method can easily and quickly obtain accurate probing parameters, and then use the probe contact position first for positioning and the probing stroke value later for spot testing, so that the probe assembly can have good and consistent test performance and reach excellent test precision.

[0022] Further, a method for operating a probe system according to the present invention corresponds to a situation where positioning is performed using the above-mentioned relative target position. The probe system includes a probe assembly and a control device. The probe assembly includes a probe having a probe tip used for contacting a contact pad of a device under test. The method for operating the probe system includes the following steps: Step 1: Using the control device, execute the method for determining probing parameters to be used when the probe system performs a test on a device under test described above. Step 2: Using the control device, the relative target position is relatively moved to a position corresponding to the contact pad of the device under test. Step 3: Utilizing the controller, execute a probing stroke operation program. The probing stroke operation program causes the probe assembly and the device under test to move relatively a probing stroke value, so that the probe tip of the probe deflects, slides and stops at a position corresponding to the contact pad of the device under test.

[0023] This operation method can easily and quickly obtain accurate probing parameters, and then use the probe contact position first for positioning and the probing stroke value later for spot testing, so that the probe assembly can have good and consistent test performance and reach excellent test precision.

[0024] Further, a probe system according to the present invention includes a chuck, a probe assembly, an optical imaging device, and a controller. The chuck includes a chuck support surface configured to support a substrate including one or more devices under test. The probe assembly includes a probe having a probe tip, the probe configured to test the devices under test. The optical imaging device is configured to receive an optical image of at least a portion of the probe system, the image including at least a portion of the probe assembly. The controller is programmed to perform a method for determining probing parameters to be used by the probe system to perform tests on the devices under test.

[0025] This probe system allows accurate probing parameters to be obtained simply and quickly, ensuring that the probe assembly has good and consistent test performance and reaches excellent test accuracy.

[0026] Furthermore, a non-transitory computer readable recording medium according to the present invention includes computer executable instructions that, when executed, direct the probe system to perform the method described above for determining probing parameters to be used when the probe system performs a test on a device under test.

[0027] This readable non-transitory recording medium allows accurate probing parameters to be obtained simply and quickly, so that the probe assembly has good and consistent test performance and reaches excellent test accuracy.

[0028] Furthermore, a method for testing an unpackaged semiconductor device according to the present invention includes the following steps. Step 1: Providing at least one probe assembly including a probe having a probe tip configured for mechanically and electrically contacting an unpackaged semiconductor device. Step 2: Provide a control device programmed to execute and obtain results from the method for determining probing parameters used when the probe system performs a test on a device under test. Step 3: Based on the result, using the control device, a test is performed on the unpackaged semiconductor device by the probe.

[0029] This unpackaged semiconductor device testing method can easily and quickly obtain accurate probing parameters, ensure that the probe assembly has good and consistent test performance, and reach excellent test accuracy.

[0030] Furthermore, the manufacturing method of the tested semiconductor device according to the present invention includes the following steps. Step 1: Providing at least one probe assembly including a probe having a probe tip configured for mechanically and electrically contacting an unpackaged semiconductor device. Step 2: Provide a control device programmed to execute and obtain results from the method for determining probing parameters used when the probe system performs a test on a device under test. Step 3: Based on the result, using the control device, a test is performed on the unpackaged semiconductor device by the probe.

[0031] The semiconductor device manufactured by this method has been subjected to highly accurate testing, and its performance can be assured.

[0032] Further, a tested semiconductor device according to the present invention comprises an unpackaged semiconductor device, the unpackaged semiconductor device including a plurality of contact pads, the unpackaged semiconductor device being tested by a test process, the test process including the following steps: Step 1: Execute the method for determining the probing parameters used when the probe system performs a test on the device under test, and obtain the results. Step 2: The contact pads are made to receive mechanical and electrical contact based on the results.

[0033] As a result, the semiconductor device has been subjected to highly accurate testing, and performance can be assured.

[0034] Furthermore, a method for generating a virtual mark image according to the present invention is used to generate a virtual mark image representative of a portion of a probe system, the probe system comprising a substrate having one or more devices under test and a probe configured to perform tests on the devices under test, the method comprising the steps of: Step 1: Utilizing an optical imaging device, obtain an image of a current probe system that is at least part of the probe system and includes an image of at least a portion of the probe and an image of at least a portion of the substrate. Step 2: Utilizing a controller, generate a virtual mark image based at least in part on the current probe system image. Step 3: The virtual mark image is displayed on a display device. The virtual mark image includes an indication of a probe contact position or an indication of a probe target position. The probe contact position is the position where the probe tip of the probe is expected to begin to contact the contact pad of the device under test. The probe target position is a position where the probe tip of the probe is to stop after it starts to slide over the contact pad of the device under test.

[0035] Thus, the representation of the probe contact position is, for example, a virtual alignment mark indicating the above-mentioned probe contact position, and the representation of the probe target position is, for example, a virtual alignment mark indicating the above-mentioned relative target position. Even if the optical image generating device cannot clearly display the contact pad of the measured device and the probe tip of the probe at the same time, the user can manually align the probe and the measured device using the virtual mark image. Or, even in the case of automatic positioning, the user can grasp the current situation using the virtual mark image.

[0036] Preferably, the control device derives one of a slippage distance value and a probing stroke value based on a data set indicating a relationship between slippage distance and probing stroke, and derives the other of a slippage distance value and a probing stroke value based on the slippage distance value and the probe target position.

[0037] In other words, the above-mentioned method for generating a virtual mark image is used for manual or automatic alignment of the probe and the device under test by obtaining the probe contact position through a method for determining probing parameters used when the above-mentioned probe system performs a test on the device under test, and further displaying the probe contact position in the virtual mark image.

[0038] Preferably, the control device obtains one of a slippage distance value and a probing stroke value based on a dataset indicating a relationship between slippage distance and probing stroke, and obtains a relative target position based on the slippage distance value and a current probe position, the current probe position being a current position of a probe tip of the probe, and a relative distance between the relative target position and the current probe position being equal to the slippage distance value.

[0039] In other words, the above-mentioned method for generating a virtual mark image is used for manual or automatic alignment of the probe and the measured device by obtaining a relative target position by a method for determining probing parameters used when the above-mentioned probe system performs a test on the measured device, and further displaying the relative target position in the virtual mark image.

[0040] Preferably, in the current probe system image, the device under test is clearer than at least the probe tip of the probe. The step of generating a virtual mark image includes the step of generating a virtual alignment mark, the virtual alignment mark indicating the probe contact position.

[0041] As a result, even if the optical image generating device cannot capture a clear image of the probe tip and the device to be measured at the same time, if the device to be measured is clear in the acquired image of the existing probe system, the probe target position can be defined from the image and the probe contact position can be calculated, and the virtual mark image can include a virtual alignment mark indicating the probe contact position. Thus, the user can align the probe tip with the virtual alignment mark by manual alignment, and position the probe tip so that it is accurately located at the probe contact position. Even when automatic positioning is performed, the user can grasp the current situation.

[0042] Preferably, in the current probe system image, at least the probe tip of the probe is clearer than the device under test. The step of generating a virtual mark image includes the step of generating a virtual alignment mark. The virtual alignment mark indicates a relative target position. A relative relationship between the relative target position and a current position of the probe tip is equal to a relative relationship between the probe target position and the probe contact position.

[0043] Thus, even if the optical image generating device cannot capture a clear image of the probe tip and the device to be measured at the same time, if the probe tip is clear in the acquired image of the existing probe system, the current probe position can be defined from the image and the relative target position can be calculated, and the virtual mark image includes a virtual alignment mark indicating the relative target position. Thus, the user can relatively move the relative target position to the probe stop position determined by the user through manual alignment, and position the probe tip to an appropriate probe contact position.

[0044] Preferably, the step of generating a virtual alignment mark comprises determining a relative position of the virtual alignment mark with respect to a probe tip of the probe, and the step of generating a virtual mark image comprises modifying the virtual mark image based on at least the determined relative position of the virtual alignment mark with respect to the probe tip of the probe, so that the virtual mark image includes the virtual alignment mark.

[0045] As a result, in either case where a virtual alignment mark indicating the probe contact position described above is generated, or where a virtual alignment mark indicating the relative target position described above is generated, the position of the probe tip can be obtained by the optical image generating device, the position of the virtual alignment mark relative to the probe tip can be determined, and the virtual alignment mark can be added to the virtual mark image.

[0046] Detailed structures, features, assembly, or usage of the method for determining probing parameters used when a probe system tests a device under test, the probe system and its operation method, the non-transitory computer readable recording medium, the method for testing an unpackaged semiconductor device, the tested semiconductor device and its manufacturing method, and the method for generating a virtual mark image according to the present invention will be described in the following detailed description of the preferred embodiment of the present invention. However, those having ordinary skill in the art of the present invention should understand that such detailed description and the specific embodiments enumerated for carrying out the present invention are merely for the purpose of explaining the present invention, and are not intended to limit the scope of the claims of the present invention. [Brief description of the drawings]

[0047] [Figure 1A] 1 is a side view showing a state in which a probe tip of a probe in a conventional probe assembly is in point contact with a contact pad of a device under test. [Figure 1B] 1 is a plan view showing a state in which a probe tip of a probe in a conventional probe assembly is in point contact with a contact pad of a device under test. [Diagram 2] FIG. 2 shows a flowchart of a method of operating a probe system according to a first embodiment of the present invention. [Diagram 3] 1 is a schematic diagram illustrating a probe system according to the present invention; [Figure 4] 3A to 3C are schematic diagrams illustrating images of the process of performing an operating method of a probe system according to a first embodiment of the present invention viewed from above (Z axis). [Diagram 5] 3A to 3C are schematic diagrams illustrating images of the process of performing an operating method of a probe system according to a first embodiment of the present invention viewed from above (Z axis). [Figure 6] 3A to 3C are schematic diagrams illustrating images of the process of performing an operating method of a probe system according to a first embodiment of the present invention viewed from above (Z axis). [Figure 7]3A to 3C are schematic diagrams illustrating images of the process of performing an operating method of a probe system according to a first embodiment of the present invention viewed from above (Z axis). [Figure 8] 3A to 3C are schematic diagrams illustrating images of the process of performing an operating method of a probe system according to a first embodiment of the present invention viewed from above (Z axis). [Figure 9] 3A to 3C are schematic diagrams illustrating images of the process of performing an operating method of a probe system according to a first embodiment of the present invention viewed from above (Z axis). [Figure 10] 7, except that it displays virtual alignment marks in different states and further displays the tolerance range of the probe target position and the contact pad of the device under test. [Figure 11] FIG. 6 shows a flowchart of a method of operating a probe system according to a second embodiment of the present invention. [Figure 12] 11A to 11C are schematic diagrams showing images of a process of performing an operating method of a probe system according to a second embodiment of the present invention. [Figure 13] 11A to 11C are schematic diagrams showing images of a process of performing an operating method of a probe system according to a second embodiment of the present invention. [Figure 14] 11A to 11C are schematic diagrams showing images of a process of performing an operating method of a probe system according to a second embodiment of the present invention. [Figure 15] FIG. 1 is a schematic diagram showing a data set of slippage distance versus probe measurement travel. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0048] The applicant hereby explains that in the embodiments and drawings introduced below, the same reference numerals represent the same or similar components or structural features thereof. It should be noted that the components and structures in the drawings are not illustrated based on actual proportions and quantities for convenience of illustration, and that the features of different embodiments may be applied to each other if possible. In addition, when referring to a component being installed on another component, it means that the aforementioned component is directly configured on the other component, or that the aforementioned component is indirectly configured on the other component, that is, one or more other components are further configured between the two components. When a component is "directly" installed on another component, it means that no other components are installed between the two components.

[0049] 2 and 3, a first embodiment of the present invention provides a method of operating a probe system 20. The probe system 20 includes a chuck 21, a probe assembly 22, an optical image forming device 23, a controller 24, a display device 25, and an electrically actuatable positioning assembly 26. The probe system 20 can define two horizontal axial directions (i.e., X-axis and Y-axis) and one vertical axial direction (i.e., Z-axis).

[0050] The chuck 21 includes a chuck support surface 211 along an X-axis and a Y-axis. The chuck support surface 211 is configured to receive a substrate 30 (e.g., a wafer). The substrate 30 includes one or more devices under test 31 (e.g., unpackaged semiconductor devices diced onto a wafer), which include a plurality of contact pads 311.

[0051] The probe assembly 22 includes a probe 221 having a probe tip 222 configured to mechanically and electrically contact a contact pad 311 of the device under test 31, thereby performing a test on the device under test 31. Depending on the needs of the test, the probe 221 may have any suitable number of probe tips 222. For example, the probe 221 may include one probe tip 222, two probe tips 222, three probe tips 222, or more than three probe tips 222. A commonly found two probe tip 222 configuration includes a signal probe and a ground probe, also called a GS (ground-signal) probe configuration. A commonly found three probe tip 222 configuration includes a signal probe located in the middle and a pair of ground probes located on either side, also called a GSG (ground-signal-ground) probe configuration.

[0052] The optical imaging device 23 is configured to receive an optical image of at least a portion of the probe system 20, including an image of at least a portion of the probe assembly 22 (particularly the probe tips 222), and typically also an image of at least a portion of the substrate 30 (particularly the contact pads 311 of the device under test 31).

[0053] The control device 24 is electrically connected to the optical image generating device 23 and acquires an image received by the optical image generating device 23. The control device 24 is programmed to execute an operation method of the probe system 20 as shown in Fig. 2. The control device 24 is also electrically connected to the display device 25. As a result, an image related to the operation of the probe system 20 is displayed on the display device 25. Figs. 4 to 9 are schematic diagrams showing images displayed by the display 25 during operation of the probe system 20 according to this embodiment, and these parts will be described later.

[0054] The electrically actuable positioning assembly 26 is connected to the probe assembly 22. The electrically actuable positioning assembly 26 is also electrically connected to the controller 24. The controller 24 controls the electrically actuable positioning assembly 26 according to test needs, and controls the movement of the probe assembly 22 along the X-axis, Y-axis, and Z-axis. In the present invention, the relative movement between the probe assembly 22 and the device under test 31 is realized by the electrically actuable positioning assembly 26 moving the probe assembly 22, or by another moving device (not shown) moving the chuck 21. Therefore, the probe system 20 of the present invention is not limited to a configuration including the electrically actuable positioning assembly 26 connected to the probe assembly 22.

[0055] The method of operating the probe system 20 of this embodiment is a method of determining probing parameters to be used when the probe system performs a test on a device under test, and includes the following steps a) to f).

[0056] Step A): Based on the configuration of the probes 221 of the probe assembly 22 of the probe system 20 and the configuration of the contact pads 311 of the device under test 31, a data set is defined that indicates the relationship between the sliding distance and the probing stroke, where the sliding distance is along the X-axis and / or Y-axis, and the probing stroke is along the Z-axis.

[0057] What needs to be explained first here is that the relative relationship between the sliding distance and the probing stroke differs depending on different probe configurations (e.g., thickness, material, shape, etc. of the probe) and / or different contact pad configurations (e.g., material, etc. of the contact pad), and therefore corresponds to a data set showing the relationship between different sliding distances and probing strokes. The data set showing the relationship between the sliding distance and the probing stroke may be constructed in advance in the control device 24 by the manufacturer of the probe system 20, for example, as shown in the graph in FIG. 15, or may be constructed in the control device 24 by the user of the probe system 20 himself. The steps of such an initial setting stage are included in the operation method of the probe system 20 shown in FIG. 2, i.e., steps S1 to S2, and will be explained in detail below.

[0058] As shown in Figures 2 and 4, step S1 defines a contact height on the calibration substrate 41. This contact height is the position in the Z axis when the probe tip 222 first contacts the contact pad 311 of the device under test 31. That is, when located at the contact height, the probe tip 222 has just contacted the contact pad 311 of the device under test 31 and has not been deflected by the probing stroke. In this step, the probe assembly 22 and the calibration substrate 41 are moved relatively along the Z axis until the probe tip 222 is in contact with the calibration substrate 41, and the contact height is found and recorded, so that the probing stroke value required for the subsequent test can be set.

[0059] As shown in FIG. 2, in step S2, a data set is defined on the calibration substrate 41, which indicates the relationship between the sliding distance and the probing stroke. The calibration substrate 41 includes a plurality of parallelization patterns (not shown), each of which represents a different shape of contact pads. In this step, a test is performed using the probe assembly 22 of the probe system 20 in an area of ​​the calibration substrate 41 having the same shape as the parallelization pattern of the contact pad 311 of the device under test 31. That is, first, the probe tip 222 is brought into contact with the parallelization pattern of the calibration substrate 41. Then, the probe assembly 22 and the calibration substrate 41 are moved relatively in the Z axis by one probing stroke, and the probe tip 222 is caused to slide on the calibration substrate 41, generating one sliding distance. During the sliding process, the probe tip 222 is located on the same XY plane as the calibration substrate 41, and the optical image forming device 23 can clearly image the probe tip 222 and the calibration substrate 41 at the same time, so that the sliding distance can be observed by the optical image forming device 23. A user can provide multiple different probing strokes and perform measurements on the calibration substrate 41, respectively, to determine corresponding slip distances, and use the controller 24 to generate a data set of slip distance vs. probing stroke based, at least in part, on the detected slip distances and the corresponding probing strokes. After the data set of slip distance vs. probing stroke is built in the controller 24, when a configuration uses a probe 221 corresponding to the data set to perform a test on a contact pad 311 corresponding to the data set, the already built data set of slip distance vs. probing stroke can be directly adopted, and further, the measurement parameters required in the subsequent steps can be easily and quickly obtained.

[0060] Step B): 2, either the sliding distance value or the probing stroke value is provided to the control device 24. The sliding distance value sets the distance that the probe tip 222 of the probe 221 slides on the contact pad 311 along the X-axis or Y-axis after it comes into contact with the contact pad 311 of the device under test 31. The probing stroke value sets the distance that the probe assembly 22 and the device under test 31 move relatively again along the Z-axis after the probe tip 222 of the probe 221 comes into contact with the contact pad 311 of the device under test 31.

[0061] The sliding distance and probing stroke in the present invention are similar to the sliding distance SD and probing stroke OD in the prior art (see FIG. 1A and FIG. 1B). Also, the sliding distance value and probing stroke value are values ​​set for the sliding distance and probing stroke, which are used by the control device 24 to perform related calculations and controls.

[0062] Step c): 2, a probe target position P3 (see FIG. 3) is provided to the control device 24. The probe target position P3 is a position where the probe tip 222 of the probe 221 is to stop after sliding over the contact pad 311 of the device under test 31. In this embodiment, this stop position is the position where the probe assembly 22 is to perform a test (electrical test) on the device under test 31.

[0063] The user first moves the line of sight of the chuck 21 or the optical image forming device 23 so that the optical image forming device 23 roughly finds the device under test 31 to be tested. Then, the user finely adjusts the line of sight of the optical image forming device 23 on the Z axis to focus on the contact pad 311 to be tested, thereby obtaining a clear image of the contact pad 311. Then, the user defines the probe target position P3 on the image, and the control device 24 receives the value of the probe target position P3 and displays the probe target position P3 on the image. In this embodiment, the probe assembly 22 includes three probe tips 222, and tests are performed on the three contact pads 311 of the device under test 31. Since the three probe tips 222 are displaced synchronously, in this embodiment, the probe target positions P3 of the three probe tips 222 are displayed together with only a dashed line. Also, as shown in FIG. 10, the probe target positions P3 of the three probe tips 222 can be displayed separately. At this step, the optical imaging device 23 is focused on the contact pads 311, resulting in a relatively blurred image of the probe assembly 22. Thus, in Figure 5, the probe assembly 22 is shown in phantom lines.

[0064] As shown in FIG. 6, in this embodiment, the probe current position P4 can be defined (but is not limited to this). The probe current position P4 is the current position of the probe tip 222. The user first moves the line of sight of the probe assembly 22 or the optical image forming device 23 so that the optical image forming device 23 roughly finds the probe tip 222. Then, the user finely adjusts the line of sight of the optical image forming device 23 on the Z axis and focuses on the probe tip 222 to obtain a clear image of the probe tip 222. Then, the user defines the probe current position P4 on the image, and the control device 24 receives the numerical value of the probe current position P4 and displays the probe current position P4 on the image. In this embodiment, the probe current positions P4 of the three probe tips 222 are displayed together with one dashed line. However, it is also possible to display the probe current positions P4 of the three probe tips 222 separately. In the process of defining the probe current position P4, the optical image forming device 23 is focused on the probe tip 222, so the image of the contact pad 311 is relatively blurred. Therefore, the contact pad 311 is shown in phantom lines in Fig. 6. There is no restriction on the order of the steps of defining the probe target position P3 shown in Fig. 5 and the step of defining the probe current position P4 shown in Fig. 6.

[0065] Step d): The controller 24 is utilized to determine the other of the slippage distance value and the probing stroke value based on one of the slippage distance value and the probing stroke value provided in step b) and the data set indicating the relationship between the slippage distance and the probing stroke defined in step a). In other words, the user can provide the slippage distance value to the controller 24, and the controller 24 can obtain the probing stroke value based on the data set indicating the relationship between the slippage distance and the probing stroke. Alternatively, the user can provide the probing stroke value to the controller 24, and the controller 24 can obtain the slippage distance value based on the data set indicating the relationship between the slippage distance and the probing stroke.

[0066] This step further utilizes the control device 24 to obtain a probe contact position P5 based on the slippage distance value and the probe target position P3 provided in step c) (see FIG. 7). The probe contact position P5 is the position where the probe tip 222 is expected to start contacting the contact pad 311 of the device under test 31, and is used to position the probe assembly 22 and the device under test 31 relative to each other in a later step.

[0067] In other words, when this step is completed, the controller 24 has obtained the main probing parameters required for the probe system 20 to perform a test on the device under test 31, namely, the slip distance value, the probing stroke value, the probe target position P3, and the probe contact position P5, for example, step S5 shown in FIG.

[0068] Step e): In step S6 shown in FIG. 2, after obtaining the probe target position P3 and the probe contact position P5, it is confirmed that both the probe contact position P5 and the probe target position P3 are located within the tolerance range corresponding to the contact pad 311 of the device under test 31. As shown in FIG. 10, the tolerance range 42 is equal to or smaller than the range of the contact pad 311. The control device 24 can determine whether the probe contact position P5 and the probe target position P3 are all located within the tolerance range 42 by calculation. Or, the probe contact position P5, the probe target position P3, and the tolerance range 42 are displayed in the image for the user to determine. This step is used to ensure that the probe tip 222 is reliably abutted against the contact pad 311 of the device under test 31 during the probing stroke, and an appropriate probe mark is generated. Thus, the test accuracy can be further ensured. However, this step does not have to be performed.

[0069] Step f): In step S71 shown in FIG. 2, the control device 24 is used to generate a virtual alignment mark 43 indicating the probe contact position P5 (see FIG. 7) and to align the probe tip 222 with respect to the virtual alignment mark 43 (see FIG. 8).

[0070] According to different operation methods, the virtual alignment mark 43 is selectively displayed. As shown in step S81 in FIG. 2, when the operation is performed manually, the virtual alignment mark 43 is displayed on the display device 25 and is used by the user to align the probe tip 222 with the virtual alignment mark 43. At this time, even if only the probe tip 222 is clearly displayed and the contact pad 311 of the device under test 31 is not clearly displayed, the user can align the probe tip 222 with the virtual alignment mark 43 and accurately position the probe tip 222 at the probe contact position P5. When the operation is performed automatically, as shown in step S72 in FIG. 2, if only the current position of the probe tip 222, that is, the probe current position P4 mentioned in the above step c), is defined, as shown in step S82 in FIG. 2, the probe system 20 automatically moves the probe tip 222 relatively to the probe contact position P5. At this time, the virtual alignment mark 43 can also be displayed on the display device 25 to allow the user to grasp the current situation. It is also possible not to display the virtual alignment mark 43. Furthermore, it is also possible not to perform step f) of generating the virtual alignment mark 43.

[0071] In this embodiment, the same virtual alignment mark 43 is used to display the probe contact positions P5 of the three probe tips 222. However, as shown in Fig. 10, three virtual alignment marks 43 may be used to display the probe contact positions P5 of the three probe tips 222, respectively. There is no restriction on the shape of the virtual alignment mark, and it can be a shape corresponding to the shape of the different probe tips. Or, for example, it can be a shape only for identifying the position, like the virtual alignment mark 43 shown in Fig. 12.

[0072] After the user positions the probe tip 222 at the probe contact position P5 using the virtual alignment mark 43, or after the control device 24 automatically positions the probe tip 222 at the probe contact position P5, the control device 24 can be used to execute a probing stroke operation program as shown in S91 or S92 in Fig. 2. The probing stroke operation program causes the probe assembly 22 and the device under test 31 to move relatively according to the probing stroke value obtained in step b) or step d), and deflects the probe tip 222 to slide and stop at the probe target position P3 as shown in Fig. 9. This allows the probe tip 222 to stop at the required probe target position when the probing stroke operation program is completed.

[0073] 11, the operation method of the probe system according to the second embodiment of the present invention is similar to that according to the first embodiment, and similarly, first, a method for determining probing parameters used when the probe system tests the device under test is executed, and then, by performing manual operations, the probe assembly 22 and the device under test 31 are positioned relative to each other. Then, a probing stroke operation program is executed. This embodiment has the following differences from the first embodiment.

[0074] 11 and 12, in this embodiment, the same steps as steps S1 to S3 in the first embodiment are executed. After that, in step S4, the current probe position P4 is provided to the control device 24. In addition, the current probe position P4 is displayed in an image (but is not limited to this).

[0075] The control device 24 can obtain both the slip distance value and the needle probing stroke value based on the data set indicating the relationship between the slip distance and the probing stroke defined in step S2, and the slip distance value or the needle stroke value provided in step S3. Then, the control device 24 calculates the relative target position P6 from the slip distance value and the probe current position P4, and the relative distance between the relative target position P6 and the probe current position P4 becomes the slip distance value. The relative relationship between the relative target position P6 and the probe current position P4 is the same as the relative relationship between the probe target position P3 and the probe contact position P5 described in the first embodiment. For this reason, although the probe contact position P5 is not obtained in this embodiment, if the probe assembly 22 and the relative target position P6 can be moved synchronously relative to the measured device 31, and the relative target position P6 can be moved relatively to the position where the probe tip 222 of the probe assembly 22 is scheduled to stop after starting to slide on the contact pad 311 of the measured device 31, for example, a position that coincides with the probe target position P3 described in the first embodiment, the probe assembly 22 and the measured device 31 can be positioned.

[0076] That is, in step S5 of this embodiment, the control device 24 acquires the main probing parameters required for testing the measured device 31 by the probe system 20, namely, the slip distance value, the probing stroke value, the probe current position P4, and the relative target position P6.

[0077] Then, in step S6' shown in FIG. 11, the control device 24 generates a virtual alignment mark 43 indicating the relative target position P6. When performing manual operation, the virtual alignment mark 43 is displayed on the display device 25 and moves relative to the measured device 31 in synchronization with the probe assembly 22 (see FIG. 13), and the user relatively moves the virtual alignment mark 43 to the position of the corresponding contact pad 311 of the measured device 31 (see FIG. 14). That is, this is step S7 shown in FIG. 11. As a result, the relative target position P6 is relatively moved to the contact pad 311 of the measured device 31. To explain more clearly, the position of the corresponding contact pad 311 of the measured device 31 is a position where the probe tip 222 is scheduled to stop after it starts to slide on the contact pad 311 of the measured device 31 by the user. Also, it is similar to the probe target position P3 described in the first embodiment, but a numerical value is not set, and it is a position that the user decides by his / her own eyes during operation. This position is also referred to herein as the user-determined probe stop position.

[0078] To explain further, there are two methods for the relative target position P6 to move relative to the measured device 31. In the first method, the user operates a lever of a machine to control the movement of the probe assembly 22. The relative target position P6 moves in synchronization with the probe assembly 22. At this time, the virtual alignment mark 43 also moves in synchronization on the display device 25. The user can move the relative target position P6 (i.e., the virtual alignment mark 43) to a desired position by controlling the movement of the probe assembly 22 while watching the movement status of the virtual alignment mark 43 on the display device 25. In the second method, the user drags and moves the virtual alignment mark 43 on the display device 25 to a desired position by using a mouse or a touch function of a touch screen. At this time, the probe assembly 22 may move in synchronization, and the relative target position P6 may move in synchronization with the virtual alignment mark 43. Alternatively, the probe assembly 22 may move after the user determines the stop position of the virtual alignment mark 43. All of these methods are operated by a user and are included in the manual operation of the present invention, and it will be understood that both the manual operation and the automatic operation of the present invention are performed via the control device 24.

[0079] During the above-mentioned movement, even if only the image of the contact pad 311 of the device under test 31 is clear and the probe tip 222 is unclear, the user can align the virtual alignment mark 43 with the position of the corresponding contact pad 311 of the device under test 31. That is, the user can align the virtual alignment mark 43 with the position where the probe tip 222 of the probe assembly 22 is to be stopped after sliding it on the contact pad 311 of the device under test 31. For example, this is the probe target position P3 described in the first embodiment. This allows the probe tip 222 to be positioned at an appropriate position on the contact pad 311 of the device under test 31, that is, the above-mentioned probe contact position P5.

[0080] The user positions the virtual alignment mark 43 at a position where the probe tip 222 of the probe assembly 22 is to stop after sliding over the contact pad 311 of the device under test 31. This position is, for example, the probe target position P3 described in the first embodiment. Then, as shown in step S8 of FIG. 11, the probing stroke operation program is executed using the control device 24. The probing stroke operation program causes the probe assembly 22 and the device under test 31 to move relatively according to the probing stroke value provided in step S3 or acquired in step S5, and deflects the probe tip 222 to slide and stop at the probe stop position determined by the user. As a result, the probe tip 222 stops at the required position when the probing stroke operation program is completed.

[0081] According to the second embodiment of the present invention, the present invention establishes a data set showing the relationship between the sliding distance and the probing stroke, so that when a test is performed, the user only needs to provide the sliding distance value or the probing stroke value and the probe target position P3 or the probe current position P4 to obtain the parameters required to test the device under test 31 using the probe assembly 22. There is no need to perform tedious initial setup for each test, such as using a calibration board to find the appropriate probing stroke, and calibrating and measuring multiple probing strokes to obtain the initial contact position. In addition, the method of the present invention can provide accurate parameters to ensure that the probe tip 222 of the probe 221 stops at a desired position after sliding on the contact pad 311 of the device under test 31. Thus, the method of the present invention is convenient and time-saving, and can ensure that the probe assembly has good and consistent test performance, improve the test accuracy, and reduce wear and extend the life of the probe and calibration board.

[0082] Controller 24 may include (or be) any suitable structure, device, or devices that can be configured, designed, constructed, and / or programmed to perform the functions described herein. For example, controller 24 may include one or more of an electronic controller, a dedicated controller, a special purpose controller, a personal computer, a special purpose computer, a display device, a logic device, and a memory device.

[0083] If present, the computer readable storage medium may be referred to herein as a non-transitory computer readable storage medium, which contains and / or stores computer executable instructions, programs and / or program code. These computer executable instructions may direct the probe system 20 and / or its controller 24 to perform any suitable portion or subset of any of the methods described above. Examples of such non-transitory computer readable storage medium include CD-ROMs, magnetic disks, hard disks, flash memory, and the like. As used herein, storage or storage device and / or storage medium, which has computer executable instructions and which has computer implemented methods and other methods according to the present disclosure, is subject matter that is considered patentable pursuant to Title 35, Section 101 of the United States Code.

[0084] Thus, the non-transitory computer-readable recording medium according to the present invention includes computer-executable instructions, which when executed, instruct the probe system 20 to execute a method for determining probing parameters used when the probe system tests a device under test, so that accurate probing parameters can be easily and quickly obtained, allowing the probe assembly 22 to have good and consistent test performance, and achieve good test accuracy.

[0085] As described in the second embodiment above, the method for generating a virtual mark image according to the present invention is used to generate a virtual mark image representative of a part of the probe system 20. In the method, first, the optical image forming device 23 is used to obtain a current probe system image (e.g., the image shown in FIG. 5) which is at least a part of the probe system 20. The current probe system image includes an image of at least a part of the probe 221 (e.g., the probe tip 222) and / or an image of at least a part of the substrate 30 (e.g., the contact pad 311 of the device under test 31). Then, the control device 24 is used to generate a virtual mark image based at least in part on the current probe system image, and the display device 25 is used to display the virtual mark image (e.g., the image shown in FIG. 7). The virtual mark image includes an indication of the probe contact position or an indication of the probe target position.

[0086] In the first embodiment, the virtual mark image includes an indication of the probe contact position, i.e., the virtual alignment mark 43 displaying the probe contact position P5 shown in FIG. 7. In the first embodiment, the virtual mark image includes an indication of the probe target position, i.e., the virtual alignment mark 43 displaying the relative target position P6 shown in FIG. 12. The method for generating the virtual alignment mark 43 includes a step of determining a relative position of the virtual alignment mark 43 with respect to the probe tip 222. For example, the optical image forming device 23 is used to obtain the position of the probe tip 222, thereby determining the relative position of the virtual alignment mark 43 with respect to the probe tip 222. The step of generating the virtual mark image includes modifying the virtual mark image based on at least the determined relative position of the virtual alignment mark 43 with respect to the probe tip 222, so that the virtual mark image includes the virtual alignment mark 43.

[0087] To explain further, in the first embodiment, since the probe target position P3 is provided, the probe tip 222 in the current image of the probe system is blurred compared to the measured device 31. However, the probe target position P3 is defined by a clear image of the measured device 31, the probe contact position P5 is calculated based on this, and the virtual mark image is made to include the virtual alignment mark 43 indicating the probe contact position P5. This allows the user to manually align the probe tip 222 to the virtual alignment mark 43 and accurately position the probe tip 222 at the probe contact position P5, and the user can be informed of the current situation even in the case of automatic positioning. Conversely, in the second embodiment, since the probe current position P4 is provided, the probe tip 222 in the current image of the probe system is clear compared to the measured device 31. The probe current position P4 is defined by a clear image of the probe tip 222, the relative target position P6 is calculated based on this, and the virtual mark image is made to include the virtual alignment mark 43 indicating the relative target position P6. This allows the user to manually perform positioning to relatively move relative target position P6 to the probe stop position determined by the user, thereby positioning probe tip 222 at an appropriate probe contact position.

[0088] Finally, it is reiterated that the components disclosed in the embodiments according to the present invention are for illustrative purposes only and do not limit the scope of the present invention, and that the replacement or modification of other equivalent components should be included in the scope of the claims of the present invention. [Explanation of symbols]

[0089] 10: Probe 11: Probe tip 12: Contact pad 20: Probe Systems 21: Zipper 211: Chuck support surface 22: Probe Assembly 221: Probe 222: Probe tip 23: Optical image forming device 24: Control Unit 25: Display device 26: Electrically actuable positioning assembly 30: Circuit Board 31: Device under test 311: Contact Pad 41: Calibration board 42: Tolerance 43: Virtual alignment mark P1: Initial contact position P2: Final contact position P3: Probe target position P4: Current probe position P5: Probe contact position P6: Relative target position OD: Probing stroke SD: Slide distance S1, S2, S3, S4, S5, S6, S6´, S7, S71, S72, S8, S81, S82, S91, S92: Step

Claims

1. 1. A method for determining probing parameters to be used when a probe system performs a test on a device under test, comprising: defining a data set indicating a relationship between a sliding distance and a probing stroke based on a configuration of a probe of a probe assembly in the probe system and a configuration of a contact pad of a device under test to be tested; providing one of a slip distance value and a probing stroke value to a controller; The sliding distance value is a distance that the tip of the probe slides on the contact pad of the device under test after the tip of the probe comes into contact with the contact pad, the probing stroke value is a value that indicates a distance that the probe assembly and the device under test move relative to each other again after the probe tip contacts the contact pad of the device under test; providing one of a probe target position and a probe current position to the controller; the probe target position is a position where the probe tip of the probe is to stop after sliding over the contact pad of the device under test, the probe current position being a current position of the probe tip; using the controller to determine the other of the slippage distance value and the probing stroke value based on one of the slippage distance value and the probing stroke value and a data set indicating a relationship between slippage distance and probing stroke, and determining a position for use in relative positioning of the probe assembly and the device under test based on the slippage distance value and one of the probe target position and the probe current position. A method comprising:

2. 13. A method for determining probing parameters used when the probe system according to claim 1 performs a test on a device under test, comprising the steps of: A probe target position is provided to the controller; the position used to position the probe assembly and the device under test relative to one another is a probe contact position; The lobe contact position is a position where the probe tip of the probe is to start contacting the contact pad of the device under test, and is used to position the probe tip of the probe at the probe contact position. A method comprising:

3. 3. A method for determining probing parameters used when the probe system according to claim 2 performs a test on a device under test, comprising the steps of: verifying that both the probe contact position and the probe target position are within a tolerance range corresponding to the contact pads of the device under test. A method comprising:

4. 3. A method for determining probing parameters used when the probe system according to claim 2 performs a test on a device under test, comprising the steps of: and generating, with the controller, a virtual alignment mark indicative of the probe contact position, the virtual alignment mark being used to align the probe tip of the probe with respect to the virtual alignment mark. A method comprising:

5. 13. A method for determining probing parameters used when the probe system according to claim 1 performs a test on a device under test, comprising the steps of: The current probe position is provided to the controller; the position used to position the probe assembly and the device under test relative to one another is a relative target position; The relative distance between the relative target position and the current probe position is the same as the slip distance value, and the relative target position and the probe assembly are moved relative to the device under test in synchronization with each other to move the relative target position to a position corresponding to the contact pad of the device under test, and the relative distance is used to position the probe assembly and the device under test relative to each other. A method comprising:

6. 6. A method for determining probing parameters used when the probe system according to claim 5 performs a test on a device under test, comprising the steps of: using the control device to generate a virtual alignment mark indicating the relative target position, relatively move the virtual alignment mark to a position corresponding to the contact pad of the device under test, and use the virtual alignment mark to move the relative target position to a position corresponding to the contact pad of the device under test. A method comprising:

7. 13. A method for determining probing parameters used when the probe system according to claim 1 performs a test on a device under test, comprising the steps of: A data set showing the relationship between the sliding distance and the probing stroke is constructed using the probe system and a calibration substrate, the construction method comprising: contacting a probe tip of a probe with the calibration substrate; moving the probe and the calibration substrate relative to each other in a vertical axis direction by one probing stroke, sliding the probe tip on the calibration substrate to generate a sliding distance, and observing the sliding distance using an optical imaging device; and generating, with the controller, a data set indicative of a relationship between the slippage distance and the probing stroke based on the slippage distance and the probing stroke. A method comprising:

8. 1. A method of operating a probe system, comprising: The probe system includes a probe assembly and a controller. The probe assembly includes a probe having a probe tip adapted to contact a contact pad of a device under test; A method of operating the probe system includes: Utilizing the control device to execute a method for determining probing parameters used when the probe system of claim 2 performs a test on a device under test; utilizing the control device to position the probe tip of the probe at the probe contact position; Utilizing the control device to execute a probing stroke operation program; The probing stroke operation program causes the probe assembly and the device to move relatively by a probing stroke value, so that the probe tip of the probe deflects and slides to stop at the probe target position.

23. A method of operating a probe system comprising:

9. 1. A method of operating a probe system, comprising: The probe system includes a probe assembly and a controller. The probe assembly includes a probe having a probe tip adapted to contact a contact pad of a device under test; A method of operating the probe system includes: Utilizing the control device to execute a method for determining probing parameters used when the probe system according to claim 5 performs a test on a device under test; using the control device to relatively move the relative target position to a position corresponding to the contact pad of the device under test; Utilizing the control device to execute a probing stroke operation program; The probing stroke operation program causes the probe assembly and the device under test to move relatively over a probing stroke value, and causes the probe tip of the probe to deflect, slide, and stop at a position corresponding to the contact pad of the device under test.

23. A method of operating a probe system comprising:

10. 1. A probe system comprising: a chuck including a chuck support surface configured to support a substrate including one or more devices to be measured; a probe assembly including a probe having a probe tip, the probe configured for testing a device under test; an optical imaging device configured to receive an optical image of at least a portion of the probe system, the optical image including an image of at least a portion of the probe assembly; and a control device programmed to execute a method for determining probing parameters to be used when the probe system according to claim 1 performs a test on a device under test. A probe system comprising:

11. A non-transitory computer-readable recording medium, Contains computer executable instructions, The instructions, when executed, direct the probe system to perform a method for determining probing parameters to be used when the probe system performs a test on a device under test as recited in claim 1. A recording medium comprising:

12. 1. A method for testing an unpackaged semiconductor device, comprising: providing at least one probe assembly including a probe having a probe tip configured for mechanically and electrically contacting an unpackaged semiconductor device; providing a control device programmed to perform and produce results from the method for determining probing parameters used when the probe system performs a test on a device under test according to claim 1; and using the control device to perform a test on the unpackaged semiconductor device with the probe based on the result. A test method comprising:

13. A method for manufacturing a tested semiconductor device, comprising the steps of: providing at least one probe assembly including a probe having a probe tip configured for mechanically and electrically contacting an unpackaged semiconductor device; providing a control device programmed to perform and produce results from the method for determining probing parameters used when the probe system performs a test on a device under test according to claim 1; and using the control device to perform a test on the unpackaged semiconductor device with the probe based on the result. A manufacturing method comprising the steps of:

14. A tested semiconductor device, an unpackaged semiconductor device including a plurality of contact pads; the unpackaged semiconductor device is tested by a test process; The test process includes: Executing a method for determining probing parameters used when the probe system according to claim 1 performs a test on a device under test and obtaining results; The contact pads receive mechanical and electrical contact that is performed based on the results. A semiconductor device comprising:

15. 1. A method for generating a virtual mark image, the method being used to generate a virtual mark image representative of a portion of a probe system, the method comprising: The probe system comprises: a substrate having one or more devices under test; a probe configured to perform a test on the device under test; The method comprises: acquiring a current probe system image utilizing an optical imaging device, the current probe system image being at least a part of the probe system, the current probe system image including an image of at least a portion of the probe and an image of at least a portion of the substrate; generating, utilizing a controller, a virtual mark image based at least in part on the current probe system image; and displaying the virtual mark image using a display device; The virtual mark image includes an indication of a probe contact position or an indication of a probe target position; the probe contact position is a position where the probe tip of the probe is expected to start contacting the contact pad of the device under test; The probe target position is a position where the probe tip of the probe is to stop after sliding over the contact pad of the device under test. A generating method comprising:

16. A method for generating a virtual mark image according to claim 15, comprising the steps of: The controller obtains one of a slippage distance value and a probing stroke value based on a data set indicating a relationship between slippage distance and probing stroke, and obtains the other of a slippage distance value and a probing stroke value based on the slippage distance value and the probe target position. A generating method comprising:

17. A method for generating a virtual mark image according to claim 15, comprising the steps of: The control device obtains the other of the slippage distance value and the probing stroke value based on one of the slippage distance value and the probing stroke value and a data set indicating a relationship between the slippage distance and the probing stroke, and obtains a relative target position based on the slippage distance value and a probe current position, the probe current position being a current position of a probe tip of the probe, and a relative distance between the relative target position and the probe current position being equal to the slippage distance value. A generating method comprising:

18. A method for generating a virtual mark image according to claim 15, comprising the steps of: In the current probe system image, the device under test is clearer than at least the probe tip of the probe; said generating a virtual mark image includes generating a virtual alignment mark; The virtual alignment mark indicates the probe contact position. A generating method comprising:

19. A method for generating a virtual mark image according to claim 15, comprising the steps of: In the current probe system image, at least the probe tip of the probe is clearer than the device under test; said generating a virtual mark image includes generating a virtual alignment mark; the virtual alignment marks indicate relative target positions; The relative relationship between the relative target position and the current position of the probe tip is equal to the relative relationship between the probe target position and the probe contact position. A generating method comprising:

20. A method for generating a virtual mark image according to claim 18 or 19, comprising the steps of: The step of generating a virtual alignment mark includes determining a relative position of the virtual alignment mark with respect to a probe tip of the probe; The step of generating a virtual mark image includes modifying the virtual mark image based on at least the determined relative position of the virtual alignment mark with respect to the probe tip of the probe, so that the virtual mark image includes the virtual alignment mark. A generating method comprising:

Images