Multilayer electronic component

Abstract

To minimize the capacity decrease while suppressing the occurrence of a crack due to electrostriction stress even if dielectric strength is improved.SOLUTION: A multilayer electronic component includes: a main body including a first internal electrode layer including a first dielectric layer and a first internal electrode disposed on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a second internal electrode disposed on the second dielectric layer, and an auxiliary electrode layer including a third dielectric layer, and first and second auxiliary electrodes disposed on the third dielectric layer apart from each other in a second direction, in which the first and second internal electrode layers are disposed alternately in a first direction with the auxiliary electrode layer held therebetween; a first external electrode disposed on a third surface and connected to the first internal electrode and the first auxiliary electrode; and a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second auxiliary electrode. The first internal electrode overlaps with the second auxiliary electrode in the first direction, and the second internal electrode overlaps with the first auxiliary electrode in the first direction.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as imaging devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity. Multi-layered ceramic capacitors can be used as components of various electronic devices due to their advantages of being small in size, high capacity, and easy to mount.

[0003] Recently, the demand for multilayer ceramic capacitors is increasing not only for IT products such as conventional smartphones and laptops, but also for electrical and industrial products such as electric vehicles and autonomous driving. This has led to a need for research into products that have high reliability in high-voltage environments.

[0004] 8 is a schematic cross-sectional view of a conventional multilayer ceramic capacitor. The conventional multilayer ceramic capacitor includes a body 10 including first and second internal electrodes 21 and 22 alternately arranged with a dielectric layer 11 therebetween, and first and second external electrodes 31 and 32 connected to the first and second internal electrodes, respectively.

[0005] In the conventional multilayer ceramic capacitor, the first and second internal electrodes 21, 22 are alternately arranged with the dielectric layer 11 therebetween to form a capacitance, and the area of ​​the capacitance forming portion is large. Therefore, in a high pressure environment, the chip shrinks and expands, causing significant deformation, and such shrinkage and expansion of the chip causes electrostrictive cracks in the body 10.

[0006] To solve this problem, the thickness of the cover part, the margin part, and / or the dielectric layer may be increased, a buffer layer may be introduced, or a floating electrode may be introduced, but all of these methods reduce the area of ​​the capacitance forming part relative to the overall area of ​​the body, thereby reducing the capacitance of the multilayer ceramic capacitor.

[0007] Therefore, research is required into a laminate structure design that can improve the voltage resistance and suppress the occurrence of cracks due to electrostrictive stress while minimizing the capacitance reduction of the multilayer ceramic capacitor. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 1995-135124 Summary of the Invention [Problem to be solved by the invention]

[0009] One of the various objects of the present invention is to improve voltage resistance, suppress the occurrence of cracks due to electrostrictive stress, and minimize the decrease in capacity.

[0010] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0011] According to an embodiment of the present invention, there is provided a semiconductor device including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other in a third direction, the semiconductor device including a first internal electrode layer including a first dielectric layer and a first internal electrode disposed on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a second internal electrode disposed on the second dielectric layer, and a third dielectric layer and first and second auxiliary electrodes disposed on the third dielectric layer at a distance from each other in the second direction. the first internal electrode layer and the second internal electrode layer are alternately arranged in the first direction with the auxiliary electrode layer in between; a first external electrode arranged on the third surface and connected to the first internal electrode and the first auxiliary electrode; and a second external electrode arranged on the fourth surface and connected to the second internal electrode and the second auxiliary electrode, wherein at least a portion of the first internal electrode overlaps with the second auxiliary electrode in the first direction, and at least a portion of the second internal electrode overlaps with the first auxiliary electrode in the first direction. Effect of the Invention

[0012] One of the various effects of the present invention is that it is possible to improve voltage resistance and suppress the occurrence of cracks due to electrostrictive stress while minimizing the decrease in capacity. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 1 is an exploded perspective view showing a schematic exploded view of a main body of a multilayer electronic component according to an embodiment of the present invention; [Diagram 3] 2 is a cross-sectional view that shows a schematic cross section taken along line II' in FIG. 1. [Figure 4] 4 is a cross-sectional view that shows a schematic cross section taken along line II-II' in FIG. 3. [Diagram 5] 3. FIG. 4 is a cross-sectional view showing a cross section taken along line III-III' in FIG. [Figure 6]4 is a cross-sectional view that shows a schematic cross section taken along line IV-IV' in FIG. 3. [Figure 7] This is a modified example of FIG. [Figure 8] 1 is a cross-sectional view that roughly illustrates a cross section of a conventional multilayer ceramic capacitor. [Figure 9] 1 is a diagram showing a simulation result of measuring a displacement and an electrostrictive stress in a first direction. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0015] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0016] In the drawings, the first direction can be defined as a thickness T direction, the second direction can be defined as a length L direction, and the third direction can be defined as a width W direction.

[0017] Multilayer Electronic Components FIG. 1 is a perspective view showing a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is an exploded perspective view showing a main body of the multilayer electronic component according to one embodiment of the present invention, FIG. 3 is a cross-sectional view showing a cross-section taken along line I-I' in FIG. 1, FIG. 4 is a cross-sectional view showing a cross-section taken along line II-II' in FIG. 3, FIG. 5 is a cross-sectional view showing a cross-section taken along line III-III' in FIG. 3, and FIG. 6 is a cross-sectional view showing a cross-section taken along line IV-IV' in FIG. 3.

[0018] A multilayer electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to Figures 1 to 6. Also, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described as an example of the multilayer electronic component, but the present invention is not limited thereto and can be applied to various multilayer electronic components, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0019] The multilayer electronic component 100 according to the embodiment of the present invention includes a body 110 and external electrodes 131 and 132 in which first internal electrode layers 120a and second internal electrode layers 120b are alternately arranged in a first direction with an auxiliary electrode layer 120c interposed therebetween.

[0020] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process and grinding of the edges, the body 110 may not be a hexahedral shape with perfectly straight lines, but may be substantially hexahedral.

[0021] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 1 and 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, 2, 3 and 4 and facing each other in the third direction.

[0022] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The plurality of dielectric layers 111 can include a first dielectric layer 111a in which the first internal electrode 121 is disposed, a second dielectric layer 111b in which the second internal electrode 122 is disposed, and a third dielectric layer 111c in which the first and second auxiliary electrodes 123 and 124 spaced apart from each other in the second direction are disposed. Hereinafter, the description of the dielectric layer 111 can be similarly applied to the first to third dielectric layers 111a, 111b, and 111c.

[0023] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing a ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as a sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. As an example of the ceramic powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0024] The body 110 includes a first internal electrode layer 120a including a first dielectric layer 111a and a first internal electrode 121 arranged on the first dielectric layer, a second internal electrode layer 120b including a second dielectric layer 111b and a second internal electrode 122 arranged on the second dielectric layer, and an auxiliary electrode layer 120c including a third dielectric layer 111c and first and second auxiliary electrodes 123, 124 arranged on the third dielectric layer at a distance from each other in a second direction, and the first internal electrode layer 120a and the second internal electrode layer 120b can be alternately arranged in the first direction with the auxiliary electrode layer 120c sandwiched therebetween.

[0025] The first internal electrode 121 of the first internal electrode layer 120a may be extended to the third surface 3 and separated from the fourth surface 4. The second internal electrode 122 of the second internal electrode layer 120b may be extended to the fourth surface 4 and separated from the third surface 3. The first auxiliary electrode 123 of the auxiliary electrode layer 120c may be extended to the third surface 3, and the second auxiliary electrode 124 may be extended to the fourth surface.

[0026] As a result, the first internal electrode 121 of the first internal electrode layer 120a and the first auxiliary electrode 123 of the auxiliary electrode layer 120c can be connected to the first external electrode 131 arranged on the third surface 3, and the second internal electrode 122 of the second internal electrode layer 120b and the second auxiliary electrode 124 of the auxiliary electrode layer 120c can be connected to the second external electrode 132 arranged on the fourth surface 4.

[0027] The conductive metals contained in the internal electrodes 121, 122 and the auxiliary electrodes 123, 124 may each be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, but the present invention is not limited thereto.

[0028] The internal electrodes 121, 122 and the auxiliary electrodes 123, 124 may be formed by applying a conductive paste containing a conductive metal to a predetermined thickness on a ceramic green sheet and firing the applied paste. The conductive paste may be printed by a screen printing method, a gravure printing method, or the like, but the present invention is not limited thereto.

[0029] According to an embodiment of the present invention, at least a portion of the first internal electrode 121 may overlap the second auxiliary electrode 124 in the first direction, and at least a portion of the second internal electrode 122 may overlap the first auxiliary electrode 123 in the first direction.

[0030] If the first and second internal electrode layers 120a, 120b are alternately arranged without the auxiliary electrode layer 120c as in the conventional method, when a high voltage is applied to the external electrodes 131, 132, an electric field is applied to one capacitance forming portion having a large area, causing a large contraction and expansion of the body 110, which causes electrostrictive cracks in the body 10.

[0031] Meanwhile, according to an embodiment of the present invention, the auxiliary electrode layer 120c disposed between the first internal electrode layer 120a and the second internal electrode layer 120b can divide the capacitance forming parts Ac1, Ac2, and Ac3 into a plurality of parts, and the voltage applied to each capacitance forming part Ac1, Ac2, and Ac3 can be efficiently dispersed, thereby relieving electrostrictive stress and preventing the occurrence of cracks due to the same. In particular, in an embodiment of the present invention, at least a portion of the first internal electrode 121 overlaps with the second auxiliary electrode 124 in the first direction, and at least a portion of the second internal electrode 122 overlaps with the first auxiliary electrode 122 in the first direction, so that capacitance can be formed not only between the first internal electrode 121 and the second internal electrode 122, but also between the first internal electrode 121 and the second auxiliary electrode 124 and between the second internal electrode 122 and the first auxiliary electrode 123. As a result, the capacitance reduction of the multilayer electronic component 100 can be minimized while improving the withstand voltage.

[0032] The capacitance forming parts Ac1, Ac2, and Ac3 will be described in more detail below. Referring to Fig. 3 and Fig. 4, the main body 110 may include a plurality of first capacitance forming parts Ac1 in which two first auxiliary electrodes 123 adjacent to each other in the first direction are disposed with the second internal electrode 122 interposed therebetween. Also, referring to Fig. 3 and Fig. 5, the main body 110 may include a plurality of second capacitance forming parts Ac2 in which two second auxiliary electrodes 124 adjacent to each other in the first direction are disposed with the first internal electrode 121 interposed therebetween.

[0033] The first capacitance forming parts Ac1 and the second capacitance forming parts Ac2 may be arranged in a first direction, and the first capacitance forming parts Ac1 and the second capacitance forming parts Ac2 may be arranged alternately with each other, as shown in FIG.

[0034] The reason why a plurality of first capacitance-forming portions Ac1 are formed apart from one another is that the first internal electrode 121 and the first auxiliary electrode 123, which have the same polarity, face each other between two adjacent first capacitance-forming portions Ac1. Similarly, the reason why a plurality of second capacitance-forming portions Ac2 are formed apart from one another is that the second internal electrode 122 and the second auxiliary electrode 124, which have the same polarity, face each other between two adjacent second capacitance-forming portions Ac2.

[0035] On the other hand, electrostrictive stress is proportional to the square of the electric field (V / d, V: voltage, d: distance between the electrodes) and to the number of laminated dielectric layers disposed between the electrodes. The total number of laminated dielectric layers 111b, 111c included in the plurality of first capacitance forming portions Ac1 and the total number of laminated dielectric layers 111a, 111c included in the plurality of second capacitance forming portions Ac2 are each approximately half that of the conventional multilayer ceramic capacitor shown in FIG. 8, so that the electrostrictive stress acting on the plurality of first and second capacitance forming portions Ac1, Ac2 can be effectively reduced.

[0036] The body 110 may also include a third capacitance forming portion Ac3 in which the first internal electrodes 121 and the second internal electrodes 122 are alternately arranged with the first auxiliary electrodes 123 and the second auxiliary electrodes 124 spaced apart from each other in the second direction.

[0037] That is, unlike the first and second capacitance forming portions Ac1 and Ac2 which are formed in plurality, one third capacitance forming portion Ac3 may be formed at the center in the second direction of the body 110 via an area in which the first auxiliary electrode 123 and the second auxiliary electrode 124 are spaced apart from each other in the second direction. As a result, the size in the first direction of the third capacitance forming portion Ac3 may be larger than the sizes in the first direction of the second capacitance forming portion Ac2 and the third capacitance forming portion Ac3.

[0038] Also, unlike the first and second capacitance forming parts Ac1 and Ac2, the third capacitance forming part Ac3 may have two dielectric layers between the first internal electrode 121 and the second internal electrode 122. For example, as shown in FIG. 6, the first dielectric layer 111a and the third dielectric layer 111c stacked in the first direction may be arranged between the first internal electrode 121 and the second internal electrode 122, or the second dielectric layer 111b and the third dielectric layer 111c stacked in the first direction may be arranged. The total number of laminated dielectric layers included in the third capacitance forming part Ac3 is about half that of the conventional multilayer ceramic capacitor shown in FIG. 8, and the distance d between the electrodes in the third capacitance forming part Ac3 is about twice that of the first and second capacitance forming parts Ac1 and Ac2 and the capacitance forming parts of the conventional multilayer ceramic capacitor shown in FIG. 8, so that the electrostrictive stress acting on the third capacitance forming part Ac3 can be reduced to about 1 / 8 that of the conventional multilayer ceramic capacitor.

[0039] That is, the multilayer electronic component 100 according to one embodiment of the present invention reduces the electrostrictive stress acting on each capacitance forming portion, but by forming a plurality of capacitance forming portions, i.e., the first to third capacitance forming portions Ac1, Ac2, and Ac3, it is possible to minimize capacitance degradation.

[0040] In one embodiment, in the cross sections of the main body 110 in the first and second directions, the length by which the second internal electrode 122 and the first auxiliary electrode 123 overlap each other in the first direction is defined as L1, the length by which the first internal electrode 121 and the second auxiliary electrode 124 overlap each other in the first direction is defined as L2, and the distance by which the first auxiliary electrode 123 and the second auxiliary electrode 124 are separated from each other in the second direction is defined as L3. In this embodiment, L1+L2>L3 may be satisfied.

[0041] The distance in the first direction between the first internal electrode 121 and the second internal electrode 122 in the third capacitance forming portion Ac3 is about twice the distance in the first direction between the internal electrodes 121, 122 and the auxiliary electrodes 123, 124 in the first and second capacitance forming portions Ac1, Ac2. As a result, the area occupied by the third capacitance forming portion Ac3 increases as the distance L3 by which the first auxiliary electrode 123 and the second auxiliary electrode 124 are separated from each other in the second direction increases, and the electrostrictive stress can be reduced, but since the capacitance is inversely proportional to the distance d between the electrodes, the third capacitance forming portion Ac3 is disadvantageous in terms of capacitance realization compared to the first and second capacitance forming portions Ac1, Ac2. As a result, in order to realize the capacitance of the multilayer electronic component 100, it may be preferable to satisfy L1+L2>L3. Also, in order to realize the capacitance of the multilayer electronic component 100, it may be preferable to satisfy L1>L3 and L2>L3, respectively.

[0042] The above L1 and L2 do not need to be particularly limited, but for example, when the size of the main body 110 in the second direction is Lo, 0.5×Lo≦L1+L2≦0.9×Lo can be satisfied. If L1+L2 is less than 0.5×Lo, it may be difficult to achieve the capacity of the multilayer electronic component 100, and if it exceeds 0.9×Lo, the effect of reducing electrostrictive stress may be slight.

[0043] The above L3 does not need to be particularly limited, but may satisfy, for example, 0.05×Lo≦L3≦0.4×Lo. If L3 is less than 0.05×Lo, the effect of reducing electrostrictive stress may be slight, and a short circuit may occur between the first auxiliary electrode 123 and the second auxiliary electrode 124. If L3 exceeds 0.4×Lo, it may be difficult to achieve the capacitance of the multilayer electronic component 100.

[0044] The L1 to L3 may be measured by, for example, scanning the cross sections in the first and second directions cut at the center in the third direction of the body 110 with a scanning electron microscope (SEM). More specifically, the L1 to L3 may refer to the length L1 of the overlap between the second internal electrode 122 and the first auxiliary electrode 123 adjacent to each other and disposed in the center region in the first direction of the cross sections of the body 110 in the first and second directions, the length L2 of the overlap between the first internal electrode 121 and the second auxiliary electrode 124 adjacent to each other and disposed in the center region in the first direction, and the distance L3 between the first auxiliary electrode 123 and the second auxiliary electrode 124 disposed in the center region in the first direction. Meanwhile, to generalize L1 to L3, L1 may be an average value measured for 10 pairs of the second internal electrode 122 and the first auxiliary electrode 123, L2 may be an average value measured for 10 pairs of the first internal electrode 121 and the second auxiliary electrode 124, and L3 may be an average value measured for 10 pairs of the first auxiliary electrode 123 and the second auxiliary electrode 124. Meanwhile, Lo may refer to the maximum size of the body 110 in the second direction when cross sections in the first and second directions cut at the center of the body 110 in the third direction are scanned by a scanning electron microscope (SEM).

[0045] The body 110 may include a laminated part SP in which the first internal electrode layers 120a and the second internal electrode layers 120b are alternately arranged with the auxiliary electrode layers 120c interposed therebetween, and a first cover part CP1 and a second cover part CP2 respectively arranged on both sides of the laminated part facing each other in a first direction. The cover parts CP1 and CP2 may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The cover parts CP1 and CP2 may have a structure in which a single or two or more dielectric layers 111 are stacked, without the first internal electrode 121, the second internal electrode 122, the first auxiliary electrode 123, and the second auxiliary electrode 124 being arranged thereon.

[0047] The average thickness of the cover parts CP1 and CP2 does not need to be particularly limited. However, in order to reduce the size and increase the capacity of the multilayer electronic component, the average thickness of the cover parts CP1 and CP2 may be 300 μm, 200 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less. Here, the average thickness of the cover parts CP1 and CP2 means the average thickness of each of the first cover part CP1 and the second cover part CP2.

[0048] The average thickness of the cover parts CP1 and CP2 may mean the average size of the cover parts CP1 and CP2 in the first direction, and may be the average value of the size in the first direction measured at five equally spaced points in the second direction from the cross-sections of the body 110 in the first and second directions.

[0049] Fig. 7 is a modified example of Fig. 3. Referring to Fig. 7, the cover parts CP1 and CP2 may include a first dummy electrode 125 connected to a first external electrode 131 and a second dummy electrode 126 spaced apart from the first dummy electrode and connected to a second external electrode 132.

[0050] The dummy electrodes 125, 126 can improve the moisture resistance reliability and mechanical strength of the multilayer electronic component. The number and shape of the dummy electrodes 125, 126 are not particularly limited, but for example, the size in the second direction of the dummy electrodes 125, 126 can be smaller than the size in the second direction of the auxiliary electrodes 123, 124. In the drawings, one each of the first dummy electrode 125 and the second dummy electrode 126 is disposed, but the present invention is not limited thereto, and a plurality of each of the first dummy electrodes 125 and the second dummy electrodes 126 can be disposed according to the purpose.

[0051] The body 110 may include first and second margin portions MP1 and MP2 disposed on both sides of the laminated part SP facing each other in the third direction. That is, the margin portions MP1 and MP2 may refer to regions between ends of the internal electrodes 121 and 122 and the auxiliary electrodes 123 and 124 and the boundary surface of the body 110 in a cross section of the body 110 cut in the first and third directions.

[0052] The margin portions MP1 and MP2 may include the same material as the dielectric layer 111, except that the internal electrodes 121 and 122 and the auxiliary electrodes 123 and 124 are not disposed in the margin portions MP1 and MP2. The margin portions MP1 and MP2 basically serve to prevent damage to the internal electrodes 121 and 122 and the auxiliary electrodes 123 and 124 due to physical or chemical stress.

[0053] The margin parts MP1 and MP2 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin parts are to be formed, and then firing the sheet. Alternatively, in order to suppress steps, the margin parts MP1 and MP2 may be formed by cutting the laminated parts so that the internal electrodes 121 and 122 and the auxiliary electrodes 123 and 124 are exposed on the fifth and sixth faces 5 and 6 of the body, and then laminating a single dielectric layer or two or more dielectric layers on both sides of the laminated part SP facing each other in the third direction.

[0054] The average thickness of the margin parts MP1 and MP2 does not need to be particularly limited. However, in order to reduce the size and increase the capacity of the multilayer electronic component, the average thickness of the margin parts MP1 and MP2 can be 100 μm or less, 20 μm or less, or 15 μm or less. Here, the average thickness of the margin parts MP1 and MP2 means the average thickness of each of the first margin part MP1 and the second margin part MP2.

[0055] The average thickness of the margin portions MP1 and MP2 may mean the average size of the margin portions MP1 and MP2 in the third direction, and may be the average value of the sizes in the third direction measured at five equally spaced points on the cross sections of the body 110 in the first and third directions.

[0056] The external electrodes 131, 132 may be disposed on the third and fourth surfaces 3, 4 of the body 110 and may extend onto parts of the first, second, fifth and sixth surfaces 1, 2, 5, 6. The external electrodes 131, 132 may include a first external electrode 131 connected to the first internal electrode 121 and the first auxiliary electrode 123, and a second external electrode 132 connected to the second internal electrode 122 and the second auxiliary electrode 124.

[0057] The external electrodes 131, 132 are disposed on the third and fourth surfaces 3, 4 of the body 110 and may include electrode layers 131a, 132a connected to the internal electrodes 121, 122 and the auxiliary electrodes 123, 124 and plating layers 131b, 132b disposed on the electrode layers 131a, 132a. Specifically, the first external electrode 131 includes a first electrode layer 131a disposed on the third surface 3 and connected to the first internal electrode 121 and the first auxiliary electrode 123 and a first plating layer 131b disposed on the first electrode layer 131a, and the second external electrode 132 includes a second electrode layer 132a disposed on the fourth surface 4 and connected to the second internal electrode 122 and the second auxiliary electrode 124 and a second plating layer 132b disposed on the second electrode layer 132a.

[0058] The electrode layers 131a and 132a may include a conductive metal and glass. The conductive metal included in the electrode layers 131a and 132a may serve to ensure electrical connectivity, and the glass may serve to improve bonding strength with the body 110.

[0059] The conductive metal included in the electrode layers 131a and 132a may be formed using any material that has electrical conductivity, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc. For example, the metal included in the electrode layers 131a and 132a may be one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0060] Meanwhile, the electrode layers 131a and 132a may be formed of only one layer including a conductive metal and glass, but the present invention is not limited thereto, and the electrode layers 131a and 132a may have a multi-layer structure.

[0061] For example, the electrode layers 131a and 132a may include a first layer including a conductive metal and glass and a second layer including a conductive metal and a resin disposed on the first layer. When the electrode layers 131a and 132a include the second layer, the warpage strength of the multilayer electronic component 100 can be improved.

[0062] The conductive metal contained in the second layer is not particularly limited, and may include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0063] The conductive metal contained in the second layer may include one or more of a spherical powder and a flake powder. That is, the conductive metal contained in the second layer may be composed of only a flake powder, only a spherical powder, or a mixture of a flake powder and a spherical powder. Here, the spherical powder may include a shape that is not completely spherical, for example, a shape in which the length ratio of the major axis to the minor axis (major axis / minor axis) is 1.45 or less. The flake powder means a powder having a flat and elongated shape, and is not particularly limited, but for example, the length ratio of the major axis to the minor axis (major axis / minor axis) may be 1.95 or more. The lengths of the major axis and minor axis of the spherical powder and the flake powder may be measured from an image obtained by scanning the cross sections in the first and second directions cut at the center of the third direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0064] The resin contained in the second layer may play a role of ensuring adhesion and absorbing shock. The resin is not particularly limited as long as it has adhesion and shock absorption properties and can be mixed with the conductive metal powder to form a paste, and may include at least one selected from the group consisting of epoxy resin, acrylic resin, ethyl cellulose, etc.

[0065] In addition, the second layer may include a plurality of metal particles, an intermetallic compound, and a resin. By including the intermetallic compound, electrical connectivity with the second layer may be further improved. The intermetallic compound may function to connect the plurality of metal particles to improve electrical connectivity, and may function to surround the plurality of metal particles to connect them to each other.

[0066] At this time, the intermetallic compound may include a metal having a melting point lower than the curing temperature of the resin. That is, since the intermetallic compound includes a metal having a melting point lower than the curing temperature of the resin, the metal having a melting point lower than the curing temperature of the resin melts during the drying and curing process, and forms an intermetallic compound with a part of the metal particles to surround the metal particles. At this time, the intermetallic compound may include a low melting point metal of preferably 300° C. or less.

[0067] In one embodiment, the second layer may include Sn. During the drying and curing process, Sn melts, and the molten Sn wets high melting point metal particles such as Ag, Ni, or Cu by capillary action, and reacts with some of the Ag, Ni, or Cu metal particles to form intermetallic compounds such as Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn. Ag, Ni, or Cu that is not involved in the reaction remains in the form of metal particles.

[0068] Thus, the plurality of metal particles may include one or more of Ag, Ni, and Cu, and the intermetallic compound may include one or more of Ag3Sn, Ni3Sn4, Cu6Sn5, and Cu3Sn.

[0069] The plating layers 131b and 132b can improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer containing nickel (Ni), tin (Sn), palladium (Pd) and / or an alloy containing these, and may be formed of a plurality of layers. The plating layers 131b and 132b may be, for example, a nickel (Ni) plating layer or a tin (Sn) plating layer, and may be in a form in which a nickel (Ni) plating layer and a tin (Sn) plating layer are formed in sequence. The plating layers 131b and 132b may also include a plurality of nickel (Ni) plating layers and / or a plurality of tin (Sn) plating layers.

[0070] In the drawings, the multilayer electronic component 100 has a structure including two external electrodes 131 and 132, but this is not limited thereto, and the number and shapes of the external electrodes 131 and 132 may be changed according to other purposes.

[0071] The average thickness of the dielectric layer 111 does not need to be particularly limited, but may be, for example, 0.1 μm to 10 μm. The average thickness of the dielectric layer 111 may be set arbitrarily depending on the desired characteristics and applications. For example, in the case of electronic components for high-voltage electrical equipment, the average thickness of the dielectric layer may be less than 2.8 μm, and in the case of electronic components for small IT devices, the average thickness of the dielectric layer may be 0.4 μm or less to achieve miniaturization and high capacity, but the present invention is not limited thereto.

[0072] The average thickness of the internal electrodes 121, 122 and the average thickness of the auxiliary electrodes 123, 124 do not need to be particularly limited, but may be, for example, 0.1 μm to 3 μm, respectively. The average thickness of the internal electrodes 121, 122 and the average thickness of the auxiliary electrodes 123, 124 may be arbitrarily set according to the desired characteristics and applications, and for example, in the case of electronic components for high-voltage electrical equipment, the average thickness of the internal electrodes 121, 122 and the average thickness of the auxiliary electrodes 123, 124 may be less than 1 μm, and in the case of electronic components for small IT equipment, the average thickness of the internal electrodes 121, 122 and the average thickness of the auxiliary electrodes 123, 124 may be 0.4 μm or less, respectively, in order to achieve miniaturization and high capacity, but the present invention is not limited thereto.

[0073] Generally, the thinner the dielectric layer 111 or the internal electrodes 121, 122, the more likely cracks are to occur due to electrostrictive stress, which may reduce the reliability of the multilayer electronic component. Meanwhile, in the case of the multilayer electronic component according to an embodiment of the present invention, the first internal electrode layer 120a and the second internal electrode layer 120b are alternately arranged with the auxiliary electrode layer 120c sandwiched therebetween, so that the voltage applied to each capacitance forming portion Ac1, Ac2, Ac3 can be efficiently dispersed, and thus the reliability of the multilayer electronic component can be good even if the average thicknesses of the dielectric layer 111, the internal electrodes 121, 122, and the auxiliary electrodes 123, 124 are thinned to satisfy the above range.

[0074] In one embodiment, when the average thickness of the dielectric layer 111 is td and the average thickness of the internal electrodes 121, 122 is te, td>2×te can be satisfied. In the case of an electronic component for high-voltage electrical equipment, in order to prevent a decrease in the breakdown voltage in a high-voltage environment, the average thickness of the dielectric layer 111 is made greater than twice the average thickness of the internal electrodes 121, 122, thereby improving the breakdown voltage characteristics.

[0075] Here, the average thickness of the dielectric layer 111, the average thickness of the internal electrodes 121 and 122, and the average thickness of the auxiliary electrodes 123 and 124 refer to the sizes in the first direction of the dielectric layer 111, the internal electrodes 121 and 122, and the auxiliary electrodes 123 and 124, respectively. The average thickness of the dielectric layer 111, the average thickness of the internal electrodes 121 and 122, and the average thickness of the auxiliary electrodes 123 and 124 can be measured by scanning cross sections of the body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000.

[0076] More specifically, the average thickness of the dielectric layer 111 may be calculated by measuring the thickness at multiple points, for example, 30 points equally spaced in the second direction, of one dielectric layer 111 and calculating the average value. Also, the average thickness of the internal electrodes 121, 122 may be calculated by measuring the thickness at multiple points, for example, 30 points equally spaced in the second direction, of one internal electrode 121, 122 and calculating the average value, and the average thickness of the auxiliary electrodes 123, 124 may be calculated by measuring the thickness at multiple points, for example, 30 points equally spaced in the second direction, of one auxiliary electrode 123, 124 and calculating the average value.

[0077] When such an average value measurement is extended to ten dielectric layers 111, ten internal electrodes 121, 122, and ten auxiliary electrodes 123, 124, the average thickness of each can be further generalized. Meanwhile, the 30 equally spaced points can be designated as the stacked portion SP. That is, the average thickness of the dielectric layer 111 can mean the average thickness of the first dielectric layer 111a, the second dielectric layer 111b, and / or the third dielectric layer 111c.

[0078] There is no need to particularly limit the overall size of the multilayer electronic component 100. For example, the size of the multilayer electronic component 100 in the second direction can be 0.1 mm to 4.5 mm, the size of the multilayer electronic component 100 in the third direction can be 0.05 mm to 3.2 mm, and the size of the multilayer electronic component 100 in the first direction can be 0.05 mm to 2.5 mm.

[0079] FIG. 9 is a diagram showing the results of a simulation in which the displacement and electrostrictive stress in the first direction are measured.

[0080] Specifically, the comparative example is a conventional multilayer ceramic capacitor shown in Fig. 8, and the experimental examples 1 and 2 are multilayer electronic components according to an embodiment of the present invention. At this time, the size of the main body of the comparative example, experimental example 1, and experimental example 2 was set to 4.0 mm in the second direction and 3.0 mm in the third direction, respectively.

[0081] In the comparative example, the length of the capacitance forming portion overlapping each other in the lamination direction of the first internal electrode 21 and the second internal electrode 22 shown in Fig. 8 was set to 2.0 mm. In the experimental example 1, the length of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 was set to 1.25 mm, and the length of the third capacitance forming portion Ac3 was set to 0.7 mm. In the experimental example 2, the length of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 was set to 1.40 mm, and the length of the third capacitance forming portion Ac3 was set to 0.4 mm. After that, the number of layers was determined so that the capacitance of the comparative example, experimental example 1, and experimental example 2 was 100 pF, and then the displacement in the first direction and the electrostrictive stress at that time were measured by simulation.

[0082] 9, it can be seen that the displacement in the first direction is reduced by about 40% and the electrostrictive stress is reduced by about 20% in Experimental Examples 1 and 2 compared to the Comparative Example, which confirms that the present invention can reduce the electrostrictive stress more effectively than the conventional method when the capacity is the same.

[0083] The present invention is not limited by the above-described embodiments and the attached drawings, but is limited by the appended claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary skill in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0084] In addition, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as being related to the other embodiment unless there is a description in the other embodiment that is opposite or contradictory to the matter.

[0085] Furthermore, the terms "first", "second", etc. are used to distinguish one component from another and do not limit the order and / or importance of the components. In some cases, a first component may be named as a second component, and similarly, a second component may be named as a first component, without departing from the scope of the invention. [Explanation of symbols]

[0086] 100 Multilayer electronic components 110 Main body SP laminated part 120a, 120b Internal electrode layer CP1, CP2 Cover part 120c Auxiliary electrode layer MP1, MP2 margin area 111, 111a, 111b, 111c dielectric layers 121, 122 Internal electrode 123, 124 Auxiliary electrodes 125, 126 Dummy electrodes 131, 132 External electrode 131a, 132a Electrode layer 131b, 132b plating layer

Claims

1. The insulating film includes a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other in a third direction, a main body including a first internal electrode layer including a first dielectric layer and a first internal electrode disposed on the first dielectric layer, a second internal electrode layer including a second dielectric layer and a second internal electrode disposed on the second dielectric layer, and a third dielectric layer and an auxiliary electrode layer including first and second auxiliary electrodes disposed on the third dielectric layer and spaced apart from each other in the second direction, the first internal electrode layer and the second internal electrode layer being alternately disposed in the first direction with the auxiliary electrode layer interposed therebetween; a first external electrode disposed on the third surface and connected to the first internal electrode and the first auxiliary electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second auxiliary electrode, at least a portion of the first internal electrode overlaps with the second auxiliary electrode in the first direction, and at least a portion of the second internal electrode overlaps with the first auxiliary electrode in the first direction.

2. In a cross section of the main body in the first direction and the second direction, 2. The multilayer electronic component according to claim 1, wherein L1 + L2 > L3 is satisfied, where L1 is a length by which the second internal electrode and the first auxiliary electrode overlap in the first direction, L2 is a length by which the first internal electrode and the second auxiliary electrode overlap in the first direction, and L3 is a distance by which the first auxiliary electrode and the second auxiliary electrode are spaced apart in the second direction.

3. 3. The multilayer electronic component according to claim 2, wherein L1, L2, and L3 satisfy L1>L3 and L2>L3.

4. When the size of the main body in the second direction is Lo, 3. The multilayer electronic component according to claim 2, wherein L1 and L2 satisfy 0.5×Lo≦L1+L2≦0.9×Lo.

5. When the size of the main body in the second direction is Lo, 3. The multilayer electronic component according to claim 2, wherein L3 satisfies 0.05×Lo≦L3≦0.4×Lo.

6. 2. The laminated electronic component according to claim 1, wherein the main body includes a plurality of first capacitance forming portions in which two of the first auxiliary electrodes adjacent to each other in the first direction are arranged with the second internal electrode between them, a plurality of second capacitance forming portions in which two of the second auxiliary electrodes adjacent to each other in the first direction are arranged with the first internal electrode between them, and a third capacitance forming portion in which the first internal electrode and the second internal electrode are arranged alternately via regions in which the first auxiliary electrode and the second auxiliary electrode are spaced apart from each other in the second direction.

7. the first capacitance forming portions and the second capacitance forming portions are arranged in the first direction, 7. The multilayer electronic component according to claim 6, wherein the plurality of first capacitance-forming portions and the plurality of second capacitance-forming portions are arranged alternately with each other.

8. 2. The multilayer electronic component according to claim 1, wherein the main body includes a laminated portion in which the first and second internal electrodes are alternately arranged with the first and second auxiliary electrodes interposed therebetween, and cover portions arranged on both sides of the laminated portion facing each other in the first direction.

9. The multilayer electronic component according to claim 8 , wherein the first internal electrode, the second internal electrode, the first auxiliary electrode, and the second auxiliary electrode are not arranged on the cover portion.

10. 9. The multilayer electronic component according to claim 8, wherein the cover part includes a first dummy electrode connected to the first external electrode, and a second dummy electrode spaced apart from the first dummy electrode and connected to the second external electrode.

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