Tape processing device for semiconductor work-piece and method for replacing tape for semiconductor work-piece

Abstract

To provide a tape processing device for a semiconductor work-piece which can further improve efficiency in processing a tape for a semiconductor work-piece, and a method for replacing a tape for a semiconductor work-piece.SOLUTION: A tape processing device for a semiconductor work-piece comprises: a tape supply part 3 which is provided with a plurality of original fabric rolls 11 of an adhesive tape T, and supplies the adhesive tape T from the original fabric rolls 11 arranged at an attachment position G1; a tape attaching part 4 that performs predetermined processing on a wafer W using the adhesive tape T; and a tape collecting part 5 which is provided with a plurality of winding cores 15 for winding up an unwanted tape Tn, and winds up the unwanted tape Tn around the winding cores 15 arranged at a collection position K1. The tape supply part 3 is configured to be able to carry the unused original fabric roll 11 into a preparation position G2 that is different from a feeding-out position G1, and the tape collecting part 5 is configured to be able to carry the winding core 15 from the stand-by position K2.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a tape processing device for semiconductor workpieces, which is used to perform various tape processing, such as adhesive tape application processing or adhesive tape peeling processing, on semiconductor workpieces, such as semiconductor wafers (hereinafter referred to as "wafers" as appropriate) or substrates, and a tape replacement method for semiconductor workpieces. [Background technology]

[0002] In the process of manufacturing various products from semiconductor workpieces, such as wafers or substrates, various treatments using adhesive tape may be performed on the workpiece. Examples of tape treatment processes for semiconductor workpieces include a process of attaching an adhesive tape (protective tape) for circuit protection to the workpiece, a process of attaching an adhesive tape (dicing tape) for supporting the workpiece and mounting it on a ring frame, a process of sealing the semiconductor workpiece using an adhesive film for device sealing, and a process of attaching an adhesive tape (peeling tape) for peeling to the protective tape attached to the semiconductor workpiece and peeling the protective tape together with the peeling tape.

[0003] A conventional configuration of a tape processing device for performing tape processing on semiconductor workpieces will be described using a tape application device for applying protective adhesive tape to semiconductor workpieces as an example. As shown in Fig. 37, a conventional tape application device 201 includes a tape supply section 203, a separator peeling section 205, a holding table 207, a tape application section 209, a tape cutting mechanism 211, a tape recovery section 213, and a separator recovery section 215.

[0004] The tape supply unit 203 pays out and guides the separator-attached adhesive tape TS from a supply bobbin on which a roll of adhesive tape TS with a separator (release liner) for protecting circuits is wound. The separator peeling unit 205 peels off the separator S from the paid-out separator-attached adhesive tape TS. The holding table 207 suctions and holds the wafer W with the circuit formation surface facing upward. The tape joining unit 209 is, for example, a joining roller, and moves horizontally to the left in FIG. 37. By this horizontal movement, the tape joining unit 209 joins the adhesive tape T from which the separator S has been peeled off to the wafer W on the holding table 207.

[0005] The tape cutting mechanism 211 includes a cutter 211a, and the tape cutting mechanism 211 rotates around a vertical axis indicated by the symbol P, thereby cutting out the adhesive tape T along the outline of the wafer W. The unnecessary portion of the adhesive tape T after being cut out, i.e., the unnecessary tape Tn, is wound up in a roll on a take-up shaft constituting the tape recovery unit 213 and recovered. The separator S peeled off from the adhesive tape T is wound up in a roll on a take-up shaft constituting the separator recovery unit 215 and recovered.

[0006] In such a tape application device, when the amount of adhesive tape T loaded in the tape supply unit 203 falls below a certain amount, or when the amount of unnecessary tape Tn collected in the tape collection unit 113 exceeds a certain amount, it is necessary to replace the roll. In the conventional tape application device 101, when replacing the roll, the operator must manually perform a complicated task.

[0007] That is, in the tape supply unit 203, a series of operations are required, such as, for example, the operation of cutting the adhesive tape T and separator S being paid out from the original roll and separating them from the original roll, the operation of replacing the original roll with a new original roll, the operation of joining the cut preceding adhesive tape T to the subsequent adhesive tape T on the new original roll, and the operation of resuming the payment of the adhesive tape T. And in the tape recovery unit 213 and the like, a series of operations are required, such as, for example, the operation of cutting the unnecessary tape Tn and separating it from the roll on the winding shaft, the operation of removing the unnecessary tape Tn recovered in a roll from the winding shaft, the operation of joining the unnecessary tape Tn to the winding shaft, and the operation of resuming the winding of the unnecessary tape Tn.

[0008] In recent years, attempts have been made to automate the task of joining the ends of cut adhesive tapes T. As one example, the following tape joining method has been proposed (see, for example, Patent Documents 1 and 2). That is, a joining tape, which is an adhesive tape for joining, is attached to the rear end of a leading adhesive tape with a separator.

[0009] After the splice tape is applied, the rear end of the separator-attached adhesive tape to which the splice tape has been applied is pressed against the front end of the succeeding separator-attached adhesive tape to join them. In this manner, the ends of the preceding adhesive tape and the succeeding adhesive tape can be joined together via the splice tape. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] JP 2014-133616 A [Patent Document 2] JP 2019-172393 A DISCLOSURE OF THEINVENTION [Problem to be solved by the invention]

[0011] However, the above-mentioned conventional apparatus has the following problems. That is, the automation of the roll replacement process is insufficient in the conventional tape processing apparatus. In the roll replacement process in the conventional apparatus, the operator is frequently required to perform the work, and each work takes a long time. As a result, there is a concern that it is difficult to reduce the burden on the operator. In addition, there is a concern that it is difficult to improve the processing efficiency of the tape processing apparatus because the operation of the apparatus is stopped for a long time in the roll replacement process.

[0012] The present invention has been made in consideration of the above circumstances, and has an object to provide a tape processing device for semiconductor workpieces and a tape changing method for semiconductor workpieces that can further improve the efficiency of tape processing for semiconductor workpieces. [Means for solving the problem]

[0013] In order to achieve the above object, the present invention has the following configuration. That is, the tape processing device for semiconductor workpieces according to the present invention includes a plurality of original roll holding units for holding original rolls of adhesive tape, a tape supply unit for unwinding the adhesive tape from the original roll held by one of the original roll holding units that has moved to a unwinding position, and a tape processing unit that performs a predetermined process on a semiconductor workpiece using the adhesive tape fed from the tape supply unit; a tape recovery section including a plurality of winding core holding sections for holding a winding core capable of winding up an unnecessary tape, which is an unnecessary portion of the adhesive tape after the predetermined processing has been performed, and winding and recovering the unnecessary tape in a roll on the winding core held by a winding core holding section that has moved to a recovery position among the winding core holding sections; Equipped with the tape supply unit is configured to be capable of feeding a new web roll to the web roll holding unit moving to a preparation position while feeding the adhesive tape from the web roll moving to the feeding position, The tape recovery unit is characterized in that it is configured to be able to wind and recover the unnecessary tape onto the winding core which is moving to the recovery position, while transporting the winding core from the winding core holding unit which is moving to a standby position.

[0014] (Actions and Effects) According to this configuration, the tape supply unit is provided with a plurality of original roll holding units that hold original rolls of adhesive tape. In addition, among the original roll holding units provided in the tape supply unit, the original roll held by the original roll holding unit that has moved to the payout position is configured to pay out and supply the adhesive tape to the tape processing unit. Therefore, a mechanism for supplying the adhesive tape from the tape supply unit to the tape processing unit does not need to be provided for each original roll holding unit, but may be provided for the original roll holding unit that has moved to the payout position. Therefore, the number of parts required to supply the adhesive tape from the tape supply unit to the tape processing unit can be reduced, and the configuration of the tape processing device for semiconductor workpieces can be further simplified.

[0015] The tape supply unit is configured to be able to feed a new original roll to the original roll holding unit moving to the preparation position while unwinding the adhesive tape from the original roll moving to the unwinding position. Therefore, a new original roll can be replenished to the preparation position of the tape supply unit while continuing the operation of supplying adhesive tape from the original roll moving to the unwinding position to the tape processing unit and performing a predetermined processing on the semiconductor workpiece. In other words, since it is not necessary to stop the processing operation on the semiconductor workpiece when replenishing the original roll in the tape supply unit, the processing efficiency of the workpiece can be improved.

[0016] In addition, the winding core holding parts provided in the tape recovery part are configured to wind and recover the unnecessary tape sent out from the tape processing part onto the winding core held by the winding core holding part that is moving to the recovery position. Therefore, a mechanism for sending out the adhesive tape from the tape processing part to the tape recovery part does not need to be provided for each of the winding core holding parts, but only needs to be provided for the winding core holding part that is moving to the recovery position. Therefore, the number of parts required to send out the unnecessary tape from the tape processing part to the tape recovery part can be reduced, and the configuration of the tape processing device for semiconductor workpieces can be further simplified.

[0017] The tape recovery unit is configured to be able to unload the winding core from the winding core holding unit moving to the standby position while winding and recovering the unnecessary tape on the winding core moving to the recovery position. Therefore, the operation of winding and recovering the unnecessary tape after the predetermined processing of the semiconductor workpiece is continued on the winding core moving to the recovery position, while the used winding core can be recovered from the preparation position of the tape recovery unit. In other words, since it is not necessary to stop the processing operation on the semiconductor workpiece when recovering the used winding core from the tape recovery unit, the processing efficiency of the workpiece can be improved. In addition, by loading a new winding core into the winding core holding unit after unloading the winding core from the winding core holding unit moving to the standby position, the winding core can be newly replenished in the tape recovery unit without stopping the processing operation on the semiconductor workpiece.

[0018] In addition, in the above-mentioned invention, it is preferable that the tape supply unit includes a preparation processing mechanism that unwinds a portion of the adhesive tape from the original roll moving to the preparation position and performs preparation processing in preparation for splicing the adhesive tape, a cutting mechanism that cuts the adhesive tape being unwound from the original roll moving to the unwinding position and separates it from the original roll, a position change mechanism that moves the original roll holding unit holding the original roll that has been subjected to the preparation processing from the preparation position to the unwinding position, and a tape splicing mechanism that splices the adhesive tape separated from the original roll by the cutting mechanism to the original roll that has been subjected to the preparation processing and moved to the unwinding position.

[0019] (Function and Effect) According to this configuration, the tape supply unit includes a preparation process mechanism, a cutting mechanism, and a tape splicing mechanism. The preparation process mechanism unwinds a portion of the adhesive tape from an unused web roll that has been moved to the preparation position, and performs preparation processing for splicing the adhesive tape. The cutting mechanism cuts the adhesive tape unwound from the web roll that is in the unwinding position, and separates it from the web roll. The tape splicing mechanism splices the separated adhesive tape to the unused web roll that has been prepared.

[0020] By undergoing preparation processing in advance when the unused original roll is moved to the preparation position, when the original roll moved to the unwinding position becomes used and is replaced with a new unused original roll, the operation of joining the adhesive tape separated from the used original roll at the unwinding position to the unused original roll for which preparation processing has been completed can be quickly completed. Therefore, the operation of unwinding and supplying new adhesive tape from the unused original roll to perform a predetermined processing on the semiconductor workpiece can be quickly resumed, thereby improving the processing efficiency of the semiconductor workpiece. In addition, by providing a preparation processing mechanism, the preparation processing of the original roll can be automatically performed. Therefore, when the original roll is replaced, the operator does not need to manually perform the preparation processing of the original roll, thereby reducing the burden on the operator.

[0021] In addition, in the above-mentioned invention, the apparatus includes a reel-out tape amount detection unit that detects the amount of adhesive tape wound around the original web roll moving to the reel-out position, a reel-out mechanism control unit that controls the operation of the reel-out mechanism in accordance with the amount of adhesive tape detected by the reel-out tape amount detection unit, and a preparation process mechanism control unit that controls the operation of the preparation process mechanism in accordance with the amount of adhesive tape detected by the reel-out tape amount detection unit, wherein the reel-out mechanism control unit controls the reel-out mechanism to move the original web roll holding unit at the preparation position to the reel-out position when the reel-out tape amount detection unit detects that the amount of adhesive tape wound around the original web roll moving to the reel-out position is equal to or less than a predetermined amount, and the preparation process mechanism control unit controls the operation of the preparation process mechanism to perform the preparation process on the original web roll moving to the preparation position when the reel-out tape amount detection unit detects that the amount of adhesive tape wound around the original web roll moving to the reel-out position is equal to or less than the predetermined amount.

[0022] (Action and effect) According to this configuration, the tape amount detector detects the amount of adhesive tape wound on the original roll moving to the unwinding position, and controls the position change mechanism and the original roll transport mechanism according to the amount of adhesive tape wound on the original roll moving to the unwinding position. That is, when the amount of adhesive tape wound on the original roll moving to the unwinding position becomes equal to or less than a predetermined amount, the original roll holder in the preparation position is moved to the unwinding position. In this configuration, the timing of the preparatory operation required for replacing the original roll is appropriately determined according to the amount of adhesive tape wound on the original roll. Therefore, it is possible to avoid a situation in which the adhesive tape on the original roll deteriorates due to the preparatory operation being too fast, or a situation in which the time required for replacing the original roll is extended due to the preparatory operation being too slow.

[0023] In addition, in the above-mentioned invention, the preparation processing mechanism control unit is configured to control the operation of the preparation processing mechanism to perform the preparation processing on the original web roll moving to the preparation position when the unreeled tape amount detection unit detects that the amount of adhesive tape wound around the original web roll moving to the unreeled position is equal to or less than a predetermined first predetermined amount, and the positioning change mechanism control unit is configured to control the positioning change mechanism to move the original web roll holding unit located at the preparation position to the unreeled position when the unreeled tape amount detection unit detects that the amount of adhesive tape wound around the original web roll moving to the unreeled position is equal to or less than a predetermined second predetermined amount, and it is preferable that the first predetermined amount is defined as a threshold value having a greater amount of tape than the second predetermined amount.

[0024] (Function and Effect) According to this configuration, the original roll transport mechanism, the position change mechanism control unit, and the preparation processing mechanism are controlled according to the amount of adhesive tape wound on the original roll moving to the unwinding position. That is, when the amount of adhesive tape wound on the original roll that has moved to the unwinding position and is supplying the adhesive tape to the tape processing unit becomes equal to or less than a first predetermined amount, the preparation processing is performed on the original roll that has moved to the preparation position in the tape supply unit. Then, when the amount of adhesive tape wound on the original roll that is supplying the adhesive tape becomes equal to or less than a second predetermined amount, the original roll holding unit at the preparation position is moved to the unwinding position. Then, the first predetermined amount is determined as a threshold value that is greater than the second predetermined amount of tape. Therefore, before the original roll is moved to the unwinding position to replace the original roll, an operation of moving the original roll to the preparation position and performing the preparation processing is performed. That is, the time required for the original roll replacement operation, which involves cutting off the adhesive tape from the used original roll and joining the adhesive tape to an unused original roll, can be further shortened. Therefore, the processing efficiency for semiconductor workpieces can be further improved.

[0025] In addition, in the above-mentioned invention, it is preferable that the tape recovery unit includes an unnecessary tape cutting mechanism that cuts the unnecessary tape being reeled out to the first winding core moving to the recovery position and separates it from the winding core, a recovery unit positioning change mechanism that moves the winding core holding unit that is in the standby position and holds the second winding core from the standby position to the recovery position and newly positions the second winding core at the recovery position, and an unnecessary tape splicing mechanism that joins the unnecessary tape separated from the first winding core by the unnecessary tape cutting mechanism to the second winding core.

[0026] (Action and Effect) According to this configuration, the tape collection unit includes an unnecessary tape cutting mechanism, a collection unit location changing mechanism, and an unnecessary tape cutting mechanism. By providing these configurations, the unnecessary tape transported from the tape processing unit can be quickly and automatically cut off from the first winding core at the collection position and spliced ​​to the second winding core arranged from the standby position to the collection position. Therefore, the process of replacing the first winding core, which has accumulated unnecessary tape and become used, with a new second winding core can be automated to a higher degree, greatly reducing the burden on the worker.

[0027] In addition, in the above-mentioned invention, it is preferable that the device further comprises an unnecessary tape detection unit that detects the amount of unnecessary tape wound around the take-up core moving to the collection position, and a collection unit location change control unit that controls the operation of the collection unit location change mechanism in accordance with the amount of unnecessary tape detected by the unnecessary tape detection unit, and when the unnecessary tape detection unit detects that the amount of unnecessary tape wound around the take-up core moving to the collection position is a third predetermined amount or more, the collection unit location change control unit controls the collection unit location change mechanism to move the take-up core holding unit, which is in the standby position and holds the second take-up core, to the collection position.

[0028] (Function and Effect) According to this configuration, the unnecessary tape detection unit detects the amount of unnecessary tape wound on the winding core moving to the collection position, and the collection unit location change mechanism is controlled according to the amount of unnecessary tape wound on the winding core moving to the collection position. That is, when the amount of unnecessary tape wound on the winding core moving to the collection position becomes equal to or greater than a third predetermined amount, the winding core holding unit in the standby position is moved to the collection position. In this configuration, the timing of replacing the winding core is appropriately determined according to the amount of unnecessary tape wound on the winding core at the collection position. Therefore, it is possible to avoid a situation in which the processing efficiency of the adhesive tape processing device is reduced due to the timing of replacing the winding core being too late.

[0029] In the above-mentioned invention, the system includes at least one of a tape-reeled-out amount detection unit that detects the amount of the adhesive tape wound around the original web roll moved to the reel-out position and an unnecessary tape detection unit that detects the amount of the unnecessary tape wound around the take-up core moved to the recovery position, and the tape supply unit includes a preparation processing mechanism that performs a preparation processing for reeling out a part of the adhesive tape from the original web roll moved to the preparation position and preparing for splicing the adhesive tape, a cutting mechanism that cuts the adhesive tape reeled out from the original web roll moved to the reel-out position and separates it from the original web roll, a position change mechanism that moves the original web roll holding unit that holds the original web roll that has been subjected to the preparation processing from the preparation position to the reel-out position, and a tape splicing mechanism that splices the adhesive tape separated from the original web roll by the cutting mechanism and the original web roll that has been subjected to the preparation processing and moved to the reel-out position, and the tape recovery unit is a winding core replacement system having an unnecessary tape cutting mechanism that cuts the unnecessary tape being paid out onto the first winding core that is moving and separates it from the first winding core; a collection section position change mechanism that moves the winding core holding section that is in the standby position and holds the second winding core from the standby position to the collection position and newly arranges the second winding core at the collection position; and an unnecessary tape splicing mechanism that splices the unnecessary tape separated from the first winding core by the unnecessary tape cutting mechanism and the second winding core that has been moved to the collection position by the collection section position change mechanism, and it is preferable that the original roll replacement system and the winding core replacement system are controlled to start operation when the paid-out tape amount detection section detects that the amount of the adhesive tape wound around the original roll that is moving to the pay-out position is equal to or less than a first threshold value, or when the unnecessary tape detection section detects that the amount of the unnecessary tape wound around the winding core that is moving to the collection position is equal to or more than a second threshold value.

[0030] (Function and Effect) According to this configuration, at least one of a fed-out tape amount detection unit that detects the amount of adhesive tape wound around the original roll moving to the feed position and an unnecessary tape detection unit that detects the amount of unnecessary tape wound around the take-up core moving to the recovery position is provided. The original roll replacement system of the tape supply unit and the take-up core replacement system of the tape recovery unit are controlled to start operation according to the amount of adhesive tape detected by the fed-out tape amount detection unit or the amount of unnecessary tape detected by the unnecessary tape detection unit.

[0031] In other words, when the amount of adhesive tape wound on the original roll moving to the unwinding position falls below a first threshold value, or when the amount of unnecessary tape detected by the unnecessary tape detection unit becomes equal to or greater than a second threshold value, the original roll replacement process is started by the original roll replacement system in the tape supply unit, and the take-up core replacement process is started by the take-up core replacement system in the tape recovery unit.

[0032] In this configuration, both the timing for replacing the raw roll and the timing for replacing the take-up core can be appropriately determined according to the amount of adhesive tape wound on the raw roll at the pay-out position or the amount of unnecessary tape wound and collected on the take-up core at the collection position. Therefore, it is possible to avoid a situation in which the raw roll and the take-up core are replaced too early, which would increase the frequency of replacement. It is also possible to avoid a situation in which the adhesive tape on the raw roll is depleted and the tape processing process is hindered because the take-up core is unable to collect all the unnecessary tape, which would cause a problem in the tape processing process, due to a situation in which the replacement is too late.

[0033] Furthermore, in such a configuration, by satisfying a predetermined condition, the process of replacing the raw roll in the tape supply section and the process of replacing the take-up core in the tape recovery section are performed synchronously. This simplifies the control of the adhesive tape processing device. In addition, since the two replacement processes are performed synchronously, the frequency of the replacement processes can be reduced. As a result, the frequency of stopping the tape processing process when performing the replacement process is reduced, and the processing efficiency of the adhesive tape processing device can be further improved.

[0034] In the above-mentioned invention, the system further includes an input unit for inputting instructions from an operator, the tape supply unit having a preparation processing mechanism for performing a preparation processing for preparing for splicing of the adhesive tape while unwinding a part of the adhesive tape from the original web roll moved to the preparation position, a cutting mechanism for cutting the adhesive tape unwound from the original web roll moved to the unwinding position and separating it from the original web roll, a position changing mechanism for moving the original web roll holding unit holding the original web roll for which the preparation processing has been performed from the preparation position to the unwinding position, and a tape splicing mechanism for splicing the adhesive tape separated from the original web roll by the cutting mechanism and the original web roll for which the preparation processing has been performed and which has been moved to the unwinding position, and the tape recovery unit is configured to recover the adhesive tape unwound from the original web roll by the unwinding position. a winding core replacement system having an unnecessary tape cutting mechanism that cuts the unnecessary tape held by the winding core and separates it from the winding core; a recovery section position change mechanism that moves the winding core holding section, which is in the standby position and holds the second winding core, from the standby position to the recovery position and newly positions the second winding core at the recovery position; and an unnecessary tape splicing mechanism that splices the unnecessary tape separated from the first winding core by the unnecessary tape cutting mechanism and the second winding core moved to the recovery position by the recovery section position change mechanism, and it is preferable that the original roll replacement system is controlled to start operation when an instruction to start replacement of the original roll is input to the input section, and the winding core replacement system is controlled to start operation when an instruction to start replacement of the winding core is input to the input section.

[0035] (Function and Effect) According to this configuration, an input unit is provided for inputting instructions from an operator. The raw roll exchange system of the tape supply unit is controlled to start operation when an instruction to start exchanging the raw roll is input to the input unit. The take-up core exchange system of the tape recovery unit is controlled to start operation when an instruction to start exchanging the take-up core is input to the input unit.

[0036] In this configuration, the timing for replacing the raw roll and the timing for replacing the take-up core can be appropriately determined by manually operating the input unit. Therefore, it is possible to avoid a situation in which the raw roll and the take-up core are replaced too early, which would increase the frequency of replacement. It is also possible to avoid a situation in which the adhesive tape on the raw roll is depleted and the tape processing process is hindered because the take-up core is unable to collect all the unnecessary tape and the tape processing process is hindered because the adhesive tape is replaced too late.

[0037] In order to achieve the above object, the present invention may have the following configuration. That is, a method for replacing an original roll of adhesive tape in a tape processing device for semiconductor work, the method comprising: a plurality of original roll holding units for holding an original roll of adhesive tape; a tape supply unit for unwinding the adhesive tape from the original roll held by the original roll holding unit that has moved to a unwinding position among the original roll holding units; and a tape processing unit for performing a predetermined process on a semiconductor work using the adhesive tape unwound from the tape supply unit, a preparation process in which a part of the adhesive tape is fed from the roll of the adhesive tape, the roll being in a preparation position provided in the tape supply unit, and a preparation process is performed for splicing the adhesive tape; a cutting process of cutting the adhesive tape being unwound from the original roll at the unwinding position and separating the adhesive tape from the original roll at the unwinding position; a position changing step of moving the web roll holding unit, which holds the web roll that has been subjected to the preparation process, from the preparation position to the payout position; a tape splicing process of splicing the adhesive tape cut off from the raw roll by the cutting mechanism and the raw roll that has been subjected to the preparation process and moved to the payout position; a used roll carrying-out process of carrying out the raw roll cut off from the adhesive tape by the cutting mechanism while the adhesive tape is being supplied to the tape processing section from the raw roll at the payout position spliced ​​in the tape splicing process; a raw roll carrying-in process of carrying a new raw roll into the raw roll holding unit at the preparation position after the used roll carrying-out process; The present invention is characterized by comprising:

[0038] (Function and Effect) According to this configuration, in a configuration in which adhesive tape is fed from a raw roll located at the feeding position of the tape supply unit to the tape processing unit and a predetermined process is performed on semiconductor workpieces in the tape processing unit, a process of replacing a used raw roll of adhesive tape with a new unused raw roll can be suitably executed. That is, the raw roll replacement process includes a preparation process, a cutting process, a position change process, a tape joining process, a used roll transport process, and a raw roll transport process.

[0039] In the preparation process, a part of the adhesive tape is unwound from the original roll at the preparation position, and preparation processing is performed to prepare for splicing the adhesive tape. By undergoing preparation processing in advance when the unused original roll is moved to the preparation position, when the original roll moved to the unwound position becomes used and is replaced with a new unused original roll, the splicing process of newly splicing the adhesive tape cut off from the used original roll at the unwound position and the unused original roll for which preparation processing has been completed can be quickly completed. Therefore, the operation of unwinding and supplying new adhesive tape from the unused original roll to perform the specified processing on the semiconductor workpieces can be quickly resumed, thereby improving the processing efficiency of the semiconductor workpieces.

[0040] In the used roll discharge process, the original roll separated from the adhesive tape in the cutting process is discharged. The used roll discharge process is performed in a state where the adhesive tape is supplied to the tape processing section from the original roll at the payout position spliced ​​in the tape splicing process. In other words, since it is not necessary to stop the processing operation on the semiconductor workpieces when discharging the used original roll from the tape recovery section, the processing efficiency of the workpieces can be improved.

[0041] In the original roll carrying-in process, a new original roll is carried into the original roll holding section which is in the preparation position of the tape supply section. The original roll carrying-in process is performed in a state where the adhesive tape is being supplied to the tape processing section from the original roll which is in the unwinding position and which was spliced ​​in the tape splicing process. In other words, since it is not necessary to stop the processing operation of the semiconductor workpieces when replenishing the tape supply section with an unused original roll, the processing efficiency of the workpieces can be improved.

[0042] In order to achieve the above object, the present invention may have the following configuration. That is, a tape processing device for semiconductor workpieces, which includes a tape processing section that performs a predetermined process on a semiconductor workpiece using an adhesive tape, and a tape recovery section that includes a plurality of winding core holding sections that hold a winding core that can wind up an unnecessary tape, which is the adhesive tape that is an unnecessary portion after the predetermined process has been performed, and that winds up and recovers the unnecessary tape in a roll on the winding core held by the winding core holding section that has moved to a recovery position among the winding core holding sections, is a tape replacement method for semiconductor workpieces, which replaces the winding core that can wind up the unnecessary tape, a waste tape cutting process for cutting the waste tape that has been unwound onto the first winding core at the recovery position and separating it from the first winding core; a recovery unit location change process in which the winding core holding unit, which is in a standby position provided in the tape recovery unit and holds the second winding core, is moved from the standby position to the recovery position, and the second winding core is newly disposed at the recovery position; a waste tape splicing process for splicing the waste tape separated from the first winding core by the waste tape cutting process to the second winding core; a used winding core carrying-out process for carrying out a first winding core that has been cut off from the unnecessary tape by the unnecessary tape cutting process, while the unnecessary tape is being wound and collected on the winding core at the collection position that has been spliced ​​with the unnecessary tape by the tape splicing process; a winding core introduction process for introducing a new winding core into the original roll holding unit at the standby position after the used winding core removal process; The present invention is characterized by comprising:

[0043] (Function and Effect) According to this configuration, in a configuration in which a predetermined process is performed on semiconductor workpieces in a tape processing section, and the unnecessary tape, which is the adhesive tape that is no longer needed after the predetermined process, is wound around a winding core and collected, a process of replacing the winding core that has been used after the unnecessary tape has been sufficiently wound up with a new winding core can be suitably executed. That is, the winding core replacement process includes an unnecessary tape cutting process, a collection section arrangement changing process, an unnecessary tape splicing process, a used winding core carrying-out process, and a winding core carrying-in process.

[0044] In the unnecessary tape cutting process, the unnecessary tape that is being fed to the first winding core at the collection position is cut and separated from the first winding core. In the collection unit arrangement changing process, in the unnecessary tape joining process, a new winding core, i.e., the second winding core, is moved from the standby position to the collection position. And in the unnecessary tape joining process, the unnecessary tape separated from the first winding core is joined to the second winding core. Since these steps are performed automatically, there is no need for an operator to manually perform the complicated operation of separating the unnecessary tape from the used winding core and joining it to the new winding core. This improves the work efficiency of the adhesive tape processing device and further reduces the burden on the operator.

[0045] In the used winding core removal process, the first winding core separated from the unnecessary tape in the unnecessary tape cutting process is removed. In the winding core insertion process, a new winding core is transported to the winding core holding section located at the standby position of the tape recovery section. The used winding core removal process and the winding core insertion process are performed while the winding core at the recovery position that was spliced ​​with the unnecessary tape in the tape splicing process is winding and recovering the unnecessary tape. In other words, since there is no need to stop the processing operation on the semiconductor workpiece when the winding core is removed and inserted, the processing efficiency of the workpiece can be improved. Effect of the Invention

[0046] According to the tape processing device for semiconductor workpieces and the tape changing method for semiconductor workpieces of the present invention, the tape supply unit is provided with a plurality of original roll holding units for holding original rolls of adhesive tape. Also, among the original roll holding units provided in the tape supply unit, the original roll held by the original roll holding unit moving to the pay-out position is configured to pay out and supply the adhesive tape to the tape processing unit. Therefore, a mechanism for supplying the adhesive tape from the tape supply unit to the tape processing unit does not need to be provided for each original roll holding unit, but may be provided for the original roll holding unit moving to the pay-out position. Therefore, the number of parts required for supplying the adhesive tape from the tape supply unit to the tape processing unit can be reduced, and the configuration of the tape processing device for semiconductor workpieces can be further simplified.

[0047] The tape supply unit is configured to be able to feed a new original roll to the original roll holding unit moving to the preparation position while unwinding the adhesive tape from the original roll moving to the unwinding position. Therefore, a new original roll can be replenished to the preparation position of the tape supply unit while continuing the operation of supplying adhesive tape from the original roll moving to the unwinding position to the tape processing unit and performing a predetermined processing on the semiconductor workpiece. In other words, since it is not necessary to stop the processing operation on the semiconductor workpiece when replenishing the original roll in the tape supply unit, the processing efficiency of the workpiece can be improved.

[0048] In addition, the winding core holding parts provided in the tape recovery part are configured to wind and recover the unnecessary tape sent out from the tape processing part onto the winding core held by the winding core holding part that is moving to the recovery position. Therefore, a mechanism for sending out the adhesive tape from the tape processing part to the tape recovery part does not need to be provided for each of the winding core holding parts, but only needs to be provided for the winding core holding part that is moving to the recovery position. Therefore, the number of parts required to send out the unnecessary tape from the tape processing part to the tape recovery part can be reduced, and the configuration of the tape processing device for semiconductor workpieces can be further simplified.

[0049] The tape recovery unit is configured to be able to unload the winding core from the winding core holding unit moving to the standby position while winding and recovering the unnecessary tape on the winding core moving to the recovery position. Therefore, the operation of winding and recovering the unnecessary tape after the predetermined processing of the semiconductor workpiece is continued on the winding core moving to the recovery position, while the used winding core can be recovered from the preparation position of the tape recovery unit. In other words, since it is not necessary to stop the processing operation on the semiconductor workpiece when recovering the used winding core from the tape recovery unit, the processing efficiency of the workpiece can be improved. In addition, by loading a new winding core into the winding core holding unit after unloading the winding core from the winding core holding unit moving to the standby position, the winding core can be newly replenished in the tape recovery unit without stopping the processing operation on the semiconductor workpiece. [Brief description of the drawings]

[0050] [Figure 1] 1 is a front view showing a basic configuration of a tape processing apparatus for semiconductor wafers according to an embodiment; [Diagram 2] FIG. 2 is a perspective view showing a configuration of a tape supply unit in the embodiment. [Diagram 3] FIG. 2 is a perspective view showing a configuration of a tape recovery unit according to an embodiment. [Figure 4] 1A and 1B are diagrams showing the configuration of a raw fabric roll in a standby state according to an embodiment, in which (a) is a perspective view of the raw fabric roll in a standby state, and (b) is a front view of the raw fabric roll in a standby state. [Diagram 5] 1A and 1B are diagrams showing the configuration of a raw fabric roll in a ready state according to an embodiment, in which (a) is a perspective view of the raw fabric roll in the ready state, and (b) is a front view of the raw fabric roll in the ready state. [Figure 6] FIG. 2 is a front view showing the overall configuration of a tape supply unit according to the embodiment. [Figure 7] FIG. 2 is a front view showing the configuration of a tape holding unit and a tape cutting mechanism according to the embodiment. [Figure 8] 10A to 10C are front views illustrating the operation of the tape splicing mechanism according to the embodiment. [Figure 9] FIG. 4 is a front view illustrating a configuration of a tape application section according to the embodiment. [Figure 10] FIG. 2 is a front view illustrating the overall configuration of the tape recovery unit according to the embodiment. [Figure 11] FIG. 2 is a front view illustrating a main part of the tape recovery unit according to the embodiment. [Figure 12] 1 is a flowchart showing the operation of the adhesive tape joining device according to the embodiment, where (a) is a flowchart showing steps S1 to S5 which are basic steps of the adhesive tape joining device, and (b) is a flowchart showing steps S6 to S8 which are appropriately performed depending on the amount of raw roll or take-up core loaded. [Figure 13] 11 is a flowchart showing the operation of the adhesive tape application device in the embodiment, in which (a) is a flowchart showing the operation in step S6, (b) is a flowchart showing the operation in step S7, and (c) is a flowchart showing the operation in step S8. [Figure 14] FIG. 11 is a diagram for explaining step S2 according to the embodiment. [Figure 15] FIG. 11 is a diagram for explaining step S3 according to the embodiment. [Figure 16] FIG. 11 is a diagram for explaining step S4 according to the embodiment. [Figure 17] FIG. 11 is a front view illustrating step S6-1 according to the embodiment. [Figure 18] FIG. 11 is a front view illustrating step S6-2 according to the embodiment. [Figure 19] FIG. 11 is a front view illustrating step S6-3 according to the embodiment. [Figure 20] FIG. 11 is a front view illustrating step S6-4 according to the embodiment. [Figure 21] FIG. 11 is a front view illustrating step S6-5 according to the embodiment. [Figure 22] 11A and 11B are front views for explaining step S7-2 according to the embodiment, in which (a) shows the state before the adhesive tape is cut, and (b) shows the state after the adhesive tape has been cut. [Figure 23]FIG. 11 is a front view illustrating step S7-3 according to the embodiment. [Figure 24] FIG. 13 is a front view illustrating the configuration of the tape supply unit at the time when step S7-3 according to the embodiment is completed. [Diagram 25] FIG. 13 is a front view illustrating the configuration of the tape supply unit at the time when step S7-4 according to the embodiment is completed. [Figure 26] 13A and 13B are front views for explaining step S7-5 according to the embodiment, in which (a) shows a state before the adhesive tape is joined, and (b) shows a state after the adhesive tape is joined. [Figure 27] FIG. 11 is a perspective view illustrating step S7-7 according to the embodiment. [Figure 28] FIG. 11 is a perspective view illustrating step S7-8 according to the embodiment. [Figure 29] 1A is a front view illustrating step S8 according to an embodiment, in which (a) shows a configuration in which the winding core arranged at the collection position is in an unused state, and (b) shows a state in which the winding core arranged at the collection position has been used. [Diagram 30] 13A and 13B are front views for explaining step S8-2 according to the embodiment, in which (a) shows a state in which the rotation plate has been rotated by 90 degrees, and (b) shows a state in which the rotation plate has been rotated by 180 degrees. [Diagram 31] 11A and 11B are front views for explaining step S8-3 according to the embodiment, in which (a) shows a state before the unnecessary tape is cut, and (b) shows a state after the unnecessary tape is cut. [Diagram 32] FIG. 11 is a front view illustrating step S8-4 according to the embodiment. [Diagram 33] FIG. 13 is a front view illustrating the tape recovery section in a state where step S8-4 according to the embodiment is completed. [Diagram 34] FIG. 11 is a perspective view illustrating step S8-6 according to the embodiment. [Diagram 35] FIG. 11 is a perspective view illustrating step S8-7 according to the embodiment. [Diagram 36] FIG. 11 is a perspective view illustrating a state in which step S8 according to the embodiment is completed. [Figure 37] FIG. 1 is a diagram illustrating a configuration of an adhesive tape joining device according to a conventional example. [Figure 38] 1A is a perspective view illustrating the configuration of a peeling bar according to an embodiment, and FIG. 1B is a view illustrating the state in which a release liner is peeled off from an adhesive tape using the peeling bar. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0051] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. An adhesive tape joining apparatus 1 that joins an adhesive tape T for circuit protection to a wafer W will be described as an example of a tape processing apparatus for semiconductor workpieces according to the embodiment. The wafer W corresponds to the semiconductor workpiece in the present invention. Note that in the drawings showing the adhesive tape joining apparatus 1, the support means for supporting the various components and the drive means for driving the various components are omitted as appropriate.

[0052] <Overall configuration overview> FIG 1 is a front view of an adhesive tape application device 1. In the following description, the longitudinal direction of the adhesive tape application device 1, which is rectangular in plan view, is referred to as the left-right direction (x direction), and the horizontal direction perpendicular to this is referred to as the front-rear direction (y direction). The vertical direction is referred to as the z direction. As shown in FIG 1, the adhesive tape application device 1 comprises a tape supply section 3, a tape application section 4, and a tape recovery section 5. In this embodiment, the tape supply section 3, the tape application section 4, and the tape recovery section 5 are arranged in parallel in the x direction from right to left in that order.

[0053] As shown in Figs. 1 and 2, the tape supply unit 3 unwinds the adhesive tape T from an original roll 11 and supplies the adhesive tape T to the tape application unit 4. The original roll 11 has a strip-shaped adhesive tape T with a release liner S (separator S) affixed thereto wound thereon. The original roll 11 is used together with a liner bobbin 13. The liner bobbin 13 winds and collects the strip-shaped release liner S peeled off from the adhesive tape T. Hereinafter, the adhesive tape T with the release liner S affixed thereto will be referred to as the tape TS. That is, the original roll 11 is configured such that the tape TS is wound in a roll shape around a supply bobbin. The original roll 11 is also provided with two guide shafts 23.

[0054] In this embodiment, the unused web roll 11 refers to the web roll 11 before it is used in the operation of supplying the adhesive tape T to the tape application unit 4. In other words, it refers to the web roll 11 in a state in which the wound adhesive tape T has not yet been paid out to the tape application unit 4. As an example, the web roll 11 in a state in which the loaded tape TS has not yet been paid out corresponds to the unused web roll 11. Note that the unused web roll 11 is not limited to a brand new web roll 11, but includes the web roll 11 in a state in which a certain amount of adhesive tape T has been used in an adhesive tape processing device other than the adhesive tape application device 1.

[0055] In this embodiment, the used web roll 11 refers to the web roll 11 after it has been used to supply the adhesive tape T to the tape application unit 4. One example of a used web roll 11 is a web roll 11 in which the amount of adhesive tape T loaded therein falls below a predetermined allowable value and it is difficult to use the web roll 11 to supply any more adhesive tape T.

[0056] In this embodiment, an unused liner bobbin 13 refers to the liner bobbin 13 before it is used in the operation of supplying the adhesive tape T to the tape application unit 4. As an example, a liner bobbin 13 on which the release liner S is not wound corresponds to an unused liner bobbin 13. In this embodiment, a used liner bobbin 13 refers to the liner bobbin 13 that has been used in the operation of supplying the adhesive tape T to the tape application unit 4 and on which the release liner S is wound.

[0057] The tape applying unit 4 applies an adhesive tape T to the circuit surface of the wafer W, and then cuts out the adhesive tape T to fit the shape of the wafer W. The tape applying unit 4 corresponds to the tape processing unit in this invention.

[0058] 1 and 3, the tape recovery unit 5 recovers the unnecessary tape Tn transported from the tape application unit 4 by winding it around a winding core 15. In this embodiment, the unnecessary tape Tn refers to the unnecessary portion of the adhesive tape T after the process of applying the adhesive tape T has been performed.

[0059] In this embodiment, "upstream" and "downstream" are defined as being along the unwinding direction of the tape TS. In other words, "upstream" means the side closer to the tape supply unit 3, which will be described later, in the unwinding direction of the tape TS. The adhesive tape T has a configuration in which a non-adhesive base material and an adhesive layer having adhesiveness are laminated. It is more preferable that the material constituting the release liner S is a material that allows bonding by thermal adhesion.

[0060] As shown in Fig. 1, the adhesive tape application apparatus 1 further includes a control unit 9 and an input unit 10. The control unit 9 includes a CPU (Central Processing Unit) and the like, and controls various operations of each of the components provided in the adhesive tape application apparatus 1. Examples of the input unit 10 include a console panel and a keyboard, and an operator inputs various instructions using the input unit 10. The instructions input to the input unit 10 are transmitted to the control unit 9, and the control unit 9 can carry out various controls in accordance with the instructions.

[0061] <Tape supply unit configuration> 6 and other figures, the tape supply section 3 includes a plurality of tape holding units 25, a tape cutting mechanism 27, a guide roller 29, a spliced ​​tape preparation mechanism 31, a tape amount detection sensor 32, and a liner cutting mechanism 54. The tape holding unit 25 holds the original web roller 11 and the liner bobbin 13, and is configured to peel off the release liner S from the tape TS wound around the original web roller 11.

[0062] Each of the tape holding units 25 holds the original roll 11. In this embodiment, the tape supplying section 3 is provided with two tape holding units 25 as a whole, that is, a first tape holding unit 25A and a second tape holding unit 25B. In addition, for each component disposed in the tape holding unit 25, the component disposed in the tape holding unit 25A is given the symbol A, and the component disposed in the tape holding unit 25B is given the symbol B to distinguish between the two. As shown in FIG. 6 as an example, of the two tape splicing mechanisms 37 provided in the tape supplying section 3, one provided in the first tape holding unit 25A is specified by being written as a tape splicing mechanism 37A. And the other provided in the second tape holding unit 25B is written as a tape splicing mechanism 37B. The tape holding unit 25 corresponds to the original roll holding section in the present invention.

[0063] The tape supply section 3 is provided with a payout position G1 and a preparation position G2, and each of the tape holding units 25 is configured to be movable between the payout position G1 and the preparation position G2. The tape supply section 3 is configured to be able to supply the adhesive tape T to the tape processing section 4 from the original web roll 11 held by the tape holding unit 25 that has moved to the payout position G1 among the multiple tape holding units 25. FIG. 6 shows a state in which the tape supply unit 25A has moved to the payout position G1, and the tape supply unit 25B has moved to the preparation position G2. In this state, the adhesive tape T can be paid out and supplied to the tape processing section 4 from the original web roll 11 held by the tape holding unit 25A.

[0064] When the tape supply unit 25B moves to the payout position G1, the tape supply unit 25A moves synchronously to the preparation position G2. In this case, the adhesive tape T can be paid out and supplied from the web roll 11 held by the tape holding unit 25B to the tape processing unit 4. Hereinafter, the web roll 11 that is held by the tape supply unit 25 moving to the payout position G1 and is in a state where it can supply the adhesive tape T to the tape application unit 4 is referred to as the "operating web roll 11."

[0065] 7 shows the configurations of the tape supply unit 25 and the tape cutting unit 27. The tape supply unit 25 includes a movable wall 33, a raw roll support shaft 34, a bobbin support shaft 35, a liner guide roller 36, a tape splicing mechanism 37, and a liner peeling roller 40. The movable wall 33 is a vertical wall extending in the xz plane, and in this embodiment is configured to be movable in the y and z directions.

[0066] The tape supply unit 25 moves as a whole by appropriately moving the movable wall 33. As an example, the movable wall 33A of the tape supply unit 25A moves back in the y direction from the payout position G1, so that the movable wall 33B of the tape supply unit 25B rises in the z direction and can move from the standby position G2 to the payout position G1. On the other hand, the movable wall 33A that has moved backward moves down in the z direction and forward in the y direction, so that the tape supply unit 25A can move from the payout position G1 to the standby position G2.

[0067] The original web roll support shaft 34 is, for example, a cylindrical shaft, and supports the original web roll 11. The original web roll support shaft 34 is erected so as to protrude forward from the front surface of the movable wall 33. By fitting the hole portion 14 of the original web roll 11 onto the original web roll support shaft 34, the tape supply unit 25 stably holds the original web roll 11.

[0068] The bobbin support shaft 35 supports the liner bobbin 13 and is disposed below the original roll support shaft 34. The bobbin support shaft 35 stands so as to protrude forward from the front surface of the movable wall 33. By fitting the hole 16 of the liner bobbin 13 onto the bobbin support shaft 35, the tape supply unit 25 stably holds the liner bobbin 13.

[0069] Note that Fig. 7 shows a state in which the original web roll 11 and the liner bobbin 13 are not held by the tape supply unit 25. That is, in the tape supply unit 25 shown in Fig. 7, the original web roll support shaft 34 and the bobbin support shaft 35 can be seen from the front. On the other hand, Figs. 1 and 2 show a state in which the original web roll 11 and the liner bobbin 13 are held by the tape supply unit 25. For convenience of explanation, the perspective view shown in Fig. 2 appropriately omits the description of the tape splicing mechanism 37 and the liner cutting mechanism 54.

[0070] The outer diameter of the original fabric roll support shaft 34 is configured to be slightly smaller than the inner diameter of the hole 14 formed in the center of the supply bobbin of the original fabric roll 11. That is, the original fabric roll 11 is stably supported by the original fabric roll support shaft 34 by fitting the hole 14 formed along the central axis of the original fabric roll 11 shown in FIG.

[0071] The liner guide roller 36 is disposed on the movable wall 33 below and to the left of the original fabric roll support shaft 34. The liner guide roller 36 winds the release liner S peeled off from the tape TS of the original fabric roll 11 supported by the original fabric roll support shaft 34, and guides it to the liner bobbin 13 supported by the bobbin support shaft 35. As shown in Fig. 7, the liner guide roller 36 is configured to be able to reciprocate up and down (z direction) along an elevation rail 38 extending in the z direction.

[0072] The liner guide roller 36 can move to a guide position H1 by ascending along the lift rail 38, and can move to a retracted position H2 by descending along the lift rail 38. By moving to the guide position H1, the liner guide roller 36 can guide the release liner S to the liner bobbin 13. The retracted position H2 is determined as a position where interference between the liner guide roller 36 and a tape splicing mechanism 37, which will be described later, can be avoided. In other words, by moving the liner guide roller 36 to the retracted position H2, the tape splicing mechanism 37 can splice the release liner S to the liner bobbin 13, as will be described later.

[0073] The tape splicing mechanism 37 includes a vertical lifting platform 39, an adhesive tape holding member 41, and a splicing tape holding member 43. The vertical lifting platform 39 is configured to be movable up and down in the z direction along a lifting rail 44 extending in the z direction. The adhesive tape holding member 41 is, for example, a plate-shaped member, and is connected to the vertical lifting platform 39 via an extendable arm 45. In other words, the adhesive tape holding member 41 is configured to be movable in the z direction by the vertical lifting platform 39 moving up and down.

[0074] The extendable arm 45 is configured to be extendable and retractable in the x direction, and this extension and contraction causes the adhesive tape holding member 41 to move back and forth in the x direction. As shown in Fig. 8, as the extendable arm 45 extends, the adhesive tape holding member 41 moves in the x direction from an initial position B1 indicated by a dotted line to a holding position B2 indicated by a solid line. As the adhesive tape holding member 41 moves to holding position B2, it holds the adhesive tape T or release liner S that is being paid out from the raw material roll 11. As a preferred example of a configuration, the adhesive tape holding member 41 adsorbs and holds the adhesive tape T or release liner S using a suction device (not shown).

[0075] The splice tape holding member 43 is, for example, a plate-shaped member similar to the adhesive tape holding member 41, and is connected to the vertical lifting platform 39 via the expandable arm 47. That is, the vertical lifting platform 39 moves up and down, and the splice tape holding member 43 can move in the z direction. The splice tape holding member 43 holds the splice tape Ns created by the splice tape creating mechanism 31. The splice tape Ns is a piece of tape used to join the rear end of the preceding adhesive tape T to the front end of the following adhesive tape T. In this embodiment, the rear end of the adhesive tape separated from the used original roll 11 and the front end of the adhesive tape T fed from the unused original roll 11 newly moved to the feeding position G1 are spliced ​​with the splice tape Ns. By this joining, the adhesive tape T loaded on the unused original roll 11 can be supplied to the tape application unit 4.

[0076] 6, the splice tape preparation mechanism 31 has a cutter unit equipped with a cutter holder 48 and a cutter blade 49. The cutter holder 48 is configured to be able to move back and forth in the width direction (y direction) of the adhesive tape T by a drive mechanism (not shown). The cutter holder 48 is also configured to be able to move back and forth in the x direction between a cutting position where the adhesive tape T can be cut and an initial position separated from the adhesive tape T.

[0077] The cutter blade 49 is disposed at the tip of the cutter holder 48. The cutter blade 49 cuts the adhesive tape T being unwound from the original web roll 11 moving to the preparation position G2. In this embodiment, the splice tape producing mechanism 31 cuts the tip of the adhesive tape T being unwound from the original web roll 11 in the width direction to produce the splice tape Ns. The process by which the splice tape producing mechanism 31 produces the splice tape Ns will be described in detail later.

[0078] The liner peeling roller 40 peels the release liner S from the adhesive tape T unwound from the original roll 11. The liner peeling roller 40 is installed so as to be located downstream of the guide shaft 23 attached to the original roll 11 when the original roll 11 is attached to the original roll support shaft 34. When the liner bobbin 13 rotates with the release liner S wound thereon, the release liner S portion of the tape TS unwound from the original roll 11 is folded back by the liner peeling roller 40. Then, the release liner S is pulled while being folded back by the liner peeling roller 40, so that the release liner S is peeled off from the adhesive tape T downstream of the guide shaft 23 as shown in FIG. 5(a) etc.

[0079] The angle θ1 at which the release liner S is folded back by the liner peeling roller 40 is preferably 90 degrees or more and 180 degrees or less. The angle θ1 at which the release liner S is folded back is the angle between the conveying direction of the adhesive tape T indicated by the symbol L1 in FIG. 5(b) and the folding back direction of the release liner S indicated by the symbol L2. In other words, the conveying direction L1 corresponds to the direction in which the adhesive tape T unwound from the original roll 11 is conveyed past the liner peeling roller 40, and the folding back direction L2 of the release liner S corresponds to the direction in which the release liner S is folded back by the liner peeling roller 40. By increasing the angle θ1 at which the release liner S is folded back, it is possible to more reliably prevent the occurrence of a phenomenon (glue residue) in which the layer of the adhesive material contained in the adhesive tape T is torn and a part of the adhesive material is peeled off from the adhesive tape T and adheres to the release liner S, and the release liner S is peeled off from the adhesive tape T.

[0080] The tape cutting mechanism 27 includes a cutter unit 50 and a leading tape holding member 51. The cutter unit 50 includes a cutter holder 52 and a cutter blade 53. The cutter holder 52 is configured to be movable in the x direction and the y direction by a drive mechanism (not shown). That is, the cutter holder 52 moves in the x direction so as to approach or move away from the adhesive tape T being fed and supplied by the tape supply unit 3, and also moves in the y direction, which is the width direction of the adhesive tape T.

[0081] Cutter blade 53 is disposed at the tip of cutter holder 52, and moves together with cutter holder 52 in the x or y direction to cut the adhesive tape T in the width direction. The original roll 11, which is disposed at pay-out position G1 and pays out the adhesive tape T, has the adhesive tape T cut by tape cutting mechanism 27, whereby the adhesive tape T supplied to the tape application unit 4 and the original roll 11 are separated.

[0082] The leading tape holding member 51 is disposed downstream of the cutter unit 50. The leading tape holding member 51 is configured to be movable in the x direction by a movable base (not shown), and reciprocates between a holding position where it can contact the adhesive tape T to hold the adhesive tape T, and an initial position where it is separated from the adhesive tape T. The leading tape holding member 51 holds the adhesive tape T being unwound from the original roll 11 toward the tape application section 4 by moving to the holding position. As an example of a preferred configuration, the adhesive tape holding member 41 adsorbs and holds the adhesive tape T or the release liner S using a suction device (not shown). When the leading tape holding member 51 holds the adhesive tape T, the cutter unit 50 cuts the adhesive tape T on the upstream side of the leading tape holding member 51, so that the rear end portion of the adhesive tape T (leading tape Tm) cut off from the original roll 11 is stably held by the leading tape holding member 51.

[0083] The guide roll 29 is provided downstream of the tape cutting mechanism 27, and winds up the adhesive tape T being unwound from the original roll 11 arranged at the unwinding position G1, and guides it to the tape application section 4.

[0084] The tape splicing mechanism 37 changes the web roll 11 from a standby state to a standby state in the preparation process in step S6 described below. Fig. 4(a) is a perspective view showing the web roll 11 in the standby state. Fig. 4(b) is a front view of the web roll 11 in the standby state. Fig. 5(a) is a perspective view showing the web roll 11 in the standby state. Fig. 5(b) is a front view of the web roll 11 in the standby state.

[0085] In this embodiment, the standby state refers to a state of the original web roll 11 in which the entire length of the adhesive tape T is protected by the release liner S. The original web roll 11 is in a standby state before the original web roll 11 is carried into the tape supplying section 3 of the adhesive tape application device 1. In other words, when the original web roll 11 is stored in a storage facility not shown, the original web roll 11 is configured in a standby state, and the original web roll 11 in the standby state is loaded onto the original web roll support shaft 34 of the tape holding unit 25.

[0086] In the standby state, a predetermined amount of tape TS is pulled out from the original roll 11 as shown in each drawing in Fig. 4, and the pulled out tape TS is guided by the guide shaft 23 and held in a position extending downward. In a range of a predetermined length L at the leading end of the tape TS, the adhesive tape T has been removed in advance across the width direction, leaving the release liner S exposed. The region at the leading end where the release liner S is exposed is joined to an unused liner bobbin 13 in a process relating to step S6, which will be described later.

[0087] 4, the adhesive tape T loaded on the unused raw roll 11 has a release liner S affixed over the entire length of its adhesive surface. Therefore, even when the raw roll 11 is placed at the preparation position G2 for a long period of time, the adhesive surface of the adhesive tape T is protected by the release liner S, so that deterioration of the adhesiveness of the adhesive tape T can be avoided. Note that the area where the release liner S is exposed at the tip of the raw roll 11 in the standby state is referred to as the liner tip portion Sa.

[0088] In this embodiment, the preparation process means a pretreatment required for performing an operation of joining the adhesive tape T separated from the used raw roll 11 to a new unused raw roll 11. The preparation state means a state of the raw roll 11 after the preparation process. The preparation state in this embodiment means a state in which the leading end of the release liner S is peeled off from the adhesive tape T and joined to the liner bobbin 13, as shown in each diagram of FIG. 5. At this time, a part of the adhesive tape T is peeled off from the release liner S at the leading end of the tape TS, and the adhesive surface of the adhesive tape T is partially exposed. The leading end V1 of the exposed adhesive tape T becomes an area to be joined to the trailing end V2 of the preceding tape Tm described later. As described later, by putting the raw roll 11 in a preparation state before starting the raw roll replacement process in step S7, the time required for the process of replacing the raw roll 11 in step S7 can be shortened.

[0089] The tape amount detection sensor 32 is disposed at the payout position G1 in the tape supply unit 3. The tape amount detection sensor 32 constantly detects the amount of adhesive tape T wound around the original web roll 11 (the original web roll 11 in operation) that has been moved to the payout position G1 and is capable of supplying the adhesive tape T to the tape application unit 4. Information about the amount of adhesive tape T detected by the tape amount detection sensor 32 is sequentially transmitted to the control unit 9.

[0090] In the adhesive tape application device 1, when the tape amount detection sensor 32 detects that the amount of adhesive tape T wound around the operating original roll 11 has decreased to a predetermined value T1 or less, a tape replacement process described below is started, and an operation is performed to automatically replace the original roll 11 loaded in the tape supply unit 3. As the tape amount detection sensor 32, various sensors such as an optical sensor are used. The tape amount detection sensor 32 corresponds to the payout tape amount detection unit in the present invention.

[0091] 6, the liner cutting mechanism 54 is disposed at the payout position G1, and cuts the portion of the release liner S that has been paid out from the original web roll 11 disposed at the payout position G1 and peeled off from the adhesive tape T. The liner cutting mechanism 54 is equipped with a movable base and a cutter blade, and can move in a direction approaching or moving away from the release liner S, and in the width direction of the release liner S. The release liner S is cut in the width direction by the cutter blade connected to the movable base to separate it from the original web roll 11.

[0092] <Tape application section configuration> As shown in FIG. 9, the tape joining section 4 includes a holding table 55, a tape joining unit 57, a tape cutting unit 59, and a tape peeling unit 60. The holding table 55 holds the wafer W with the circuit formation surface facing upward. In this embodiment, a chuck table that suction-holds the wafer W is used as the holding table 55, but the configuration of the holding table 55 is not limited to this. In addition, a cutter running groove 55a is formed on the upper surface of the holding table 55 so that a cutter blade 59c provided in a tape cutting unit 59 described later is moved in a swiveling manner along the outer shape of the wafer W to cut the adhesive tape T. The holding table 55 may be configured to be able to move up and down as appropriate using a lifting platform 55b or the like.

[0093] The tape application unit 57 applies an adhesive tape T to the circuit surface of the wafer W placed on and held by suction on the holding table 55. The tape application unit 57 includes a movable base 57a that reciprocates horizontally left and right along a rail (not shown), and an application roller 57b that is journaled on a bracket connected to the movable base 57a. The movable base 57 is configured to be movable up and down in the z direction along a lift base (not shown).

[0094] The tape cutting unit 59 is provided with a support arm 59b that is rotatable around a vertical axis P located at the center of the holding table 55, below a movable base 59a that can be driven to move up and down. A cutter 59c with a blade pointing downward is attached to the free end of the support arm 59b. In other words, the cutter 59c is configured to move along the outer periphery of the wafer W to cut out the adhesive tape T by rotating the support arm 59b around the vertical axis P as the center of rotation.

[0095] The tape separation unit 60 separates the adhesive tape Tw cut out by the cutter 59c and attached to the surface of the wafer W from the unnecessary tape Tn, which is the adhesive tape T that has become unnecessary after the adhesive tape Tw has been cut out. The tape separation unit 60 includes a guide roller 61 that maintains the tension of the unnecessary tape Tn, and a nip roller 62. The nip roller 62 is composed of a pinch roller 63 that allows the tape to move up and down, and a feed roller 64 that is driven by a motor. The tape separation unit 60 is configured to be capable of horizontally reciprocating left and right along a rail (not shown). The unnecessary tape Tn separated from the adhesive tape Tw by the tape separation unit 60 is wound around the guide roller 61 and guided to the tape recovery section 5.

[0096] <Tape Collection Section Configuration> Next, the configuration of the tape recovery unit 5 will be described in detail. As shown in Fig. 10, the tape recovery unit 5 is configured such that a plurality of winding core support shafts 67 are erected on a rotating plate 65, and a winding core 15 can be loaded onto each of the winding core support shafts 67. In this embodiment, two winding core support shafts 67A and 67B are erected on the rotating plate 65. The tape recovery unit 5 further includes a guide roller 66, a guide roller 69, a splicing unit 70, and a tape amount detection sensor 71.

[0097] The take-up core support shaft 67 is, for example, a cylindrical shaft, and supports the take-up core 15 that winds and collects the unnecessary tape Tn. For example, the take-up core support shaft 67 fits into a hole in the take-up core 15, so that the tape collection unit 5 stably holds the take-up core 15. The take-up core support shafts 67A and 67B are disposed in positions facing each other with the central axis 68 of the rotating plate 65 in between.

[0098] The rotating plate 65 is configured to rotate around a central shaft 68 by a drive mechanism (not shown). By the rotation of the rotating plate 65, the winding core support shaft 67A and the winding core support shaft 67B can be moved between a collection position K1 and a standby position K2 shown in FIG.

[0099] The tape recovery unit 5 is configured so that the unnecessary tape Tn is wound from the tape application unit 4 onto the winding core 15 held by the winding core support shaft 67 that has moved to the recovery position K1 among the multiple winding core support shafts 67. An unused winding core 15 is loaded onto the winding core support shaft 67 that has moved to the standby position K2 among the multiple winding core support shafts 67, in preparation for the case where the winding core 15 that has moved to the recovery position K1 has wound up a predetermined amount of unnecessary tape Tn or more. Hereinafter, the winding core 15 that is held by the winding core support shaft 67 that has moved to the recovery position K1 and is ready to wind up and recover the unnecessary tape Tn is referred to as the "operating winding core 15."

[0100] That is, when the unnecessary tape Tn wound and collected on the take-up core 15 moving to the collection position K1 reaches a predetermined allowable amount, the unused take-up core 15 arranged at the waiting position K2 can be quickly moved to the collection position K1 by rotating the rotating plate 65. Figs. 3 and 10 show a state in which the take-up core support shaft 67A moves to the collection position G1 and the take-up core support shaft 67B moves to the waiting position K2. In this state, the unnecessary tape Tn transported from the tape application section 4 can be wound and collected on the take-up core 15 held by the take-up core support shaft 67A. The take-up core support shaft 67 corresponds to the take-up core holding section in the present invention.

[0101] In this embodiment, the unused winding core 15 refers to the winding core 15 before it is used in the process of collecting the unnecessary tape Tn in the tape collection section 5. As an example, the winding core 15 in a state in which the unnecessary tape Tn is not wound thereon corresponds to the unused winding core 15. The used winding core 15 refers to the winding core 15 after it has been used in the process of collecting the unnecessary tape Tn in the tape collection section 5. An example of a used winding core 15 is a winding core 15 in which a sufficient amount of the unnecessary tape Tn has been wound, and as a result, the amount of the wound unnecessary tape Tn has reached a predetermined allowable amount.

[0102] Note that Fig. 10 shows a state in which the take-up core 15 is not loaded onto the take-up core support shaft 67. That is, in the tape recovery section 5 shown in Fig. 10, the take-up core support shaft 67 is visible from the front. On the other hand, Figs. 1 and 3 show a state in which the take-up core 15 is loaded onto each of the take-up core support shafts 67A and 67B.

[0103] The guide roller 66 is disposed in a position intermediate between the take-up core support shaft 67A and the take-up core support shaft 67B near the outer periphery of the rotating plate 65. When the rotating plate 65 rotates, the unnecessary tape Tn is wound around the guide roller 66 and guided to a track along the outer periphery of the rotating plate 65. The guide roller 69 winds the unnecessary tape Tn fed out from the tape application unit 4, and guides the unnecessary tape Tn to the operating take-up core 15 at the collection position K1.

[0104] The splicing unit 70 is disposed near the collection position K1 in the tape collection section 5, and splices the unnecessary tape Tn to an unused take-up core 15 that has newly moved to the collection position K1. As shown in FIG. 11 , the splicing unit 70 includes a rotating shaft 73, a pivot arm 74, an application roller 75, and a cutter blade 77.

[0105] The rotating shaft 73 is disposed at the base end of the pivot arm 74, and is configured to be rotatable around an axis in the y direction. The pivot arm 74 is configured to pivot about the rotating shaft 73, and supports the joining roller 75 and the cutter blade 77. The pivot arm 74 pivots as the rotating shaft 73 rotates, and the joining unit 70 reciprocates between a joining position P1 and a retracted position P2, which are indicated by solid lines in FIG.

[0106] The splicing position P1 is a position where the splicing unit 70 approaches the take-up core 15 moving to the collection position K1. By moving to the splicing position P1, the splicing unit 70 becomes able to splice the unnecessary tape Tn to the take-up core 15 moving to the collection position K1. The retracted position P2 is a position where the splicing unit 70 is separated from the take-up core 15 moving to the collection position K1. When the rotating plate 65 is rotated to move the take-up core 15 at the collection position K1 to the standby position K2, it is possible to prevent the take-up core 15, the unnecessary tape Tn, or the like from interfering with the splicing unit 70 by moving the splicing unit 70 to the retracted position P2 in advance.

[0107] The joining roller 75 is connected to the tip of the pivot arm 74 via a movable base 76. The joining roller 75 is configured to be rotatable around an axis in the y direction, and rolls along the outer periphery of the take-up core 15 that has moved to the collection position K1 to join the unnecessary tape Tn to the take-up core 15. This joining operation allows the unnecessary tape Tn to be joined to an unused take-up core 15. The movable base 76 is configured to be movable in a direction approaching or moving away from the take-up core 15 that has moved to the collection position K1. The moving of the movable base 76 toward the take-up core 15 allows the joining roller 75 to come into contact with the take-up core 15.

[0108] The cutter blade 77 is disposed downstream of the joining roller 75, and is connected to the tip of the pivot arm 74 via a movable base 78. The movable base 78 is configured to be movable in a direction approaching or moving away from the unnecessary tape Tn wound around the take-up core 15, and is also configured to be movable in the width direction (y direction) of the unnecessary tape Tn. As the movable base 78 moves, the cutter blade 77 cuts the unnecessary tape Tn and separates it from the operating take-up core 15. The process in which the splicing unit 70 splices the unnecessary tape Tn to an unused take-up core 15 and the process in which the splicing unit 70 cuts the unnecessary tape Tn and separates it from the operating take-up core 15 will be described later.

[0109] The tape amount detection sensor 71 is disposed at the recovery position K1 in the tape recovery section 3. The tape amount detection sensor 71 sequentially detects the amount of the unnecessary tape Tn wound around the operating take-up core 15 disposed at the recovery position K1. When the tape amount detection sensor 71 detects that the amount of the unnecessary tape Tn wound around the operating take-up core 15 is equal to or greater than a predetermined value M1, a take-up core replacement process in step S8 described below is started, and an operation of automatically replacing the take-up core 15 loaded in the tape recovery section 5 is performed. As the tape amount detection sensor 71, various sensors, such as an optical sensor equipped with a laser emitter and a laser receiver, are used. The tape amount detection sensor 71 corresponds to the unnecessary tape detector in the present invention.

[0110] <Basic operation overview> Here, a series of basic operations for applying the adhesive tape T for protecting a circuit surface to the wafer W using the adhesive tape application apparatus 1 according to the embodiment will be described. Fig. 12(a) is a flow chart for explaining a series of steps for applying the adhesive tape T to the surface of the wafer W using the adhesive tape application apparatus 1.

[0111] It is assumed that the original web roll 11 is preloaded in the tape supplying section 3, and the take-up core 15 is preloaded in the tape collecting section 5. Specifically, as shown in FIG. 2 etc., it is assumed that the tape holding unit 25A is moved to the unwinding position G1 and the tape holding unit 25B is moved to the preparation position G2 in the tape supplying section 3. In order to distinguish the multiple original web rolls 11 mounted on the adhesive tape joining device 1, the original web roll 11 held by the original web roll support shaft 34A provided in the tape holding unit 25A is referred to as the original web roll 11A. The unused original web roll 11 held by the original web roll support shaft 34B provided in the tape holding unit 25B is referred to as the original web roll 11B. That is, at the start of step S1, the original web roll 11A corresponds to the original web roll 11 in operation.

[0112] Similarly, to distinguish between the multiple liner bobbins 13, the liner bobbin 13 held by the bobbin support shaft 35A of the tape holding unit 25A at the start of step S1 is referred to as the liner bobbin 13A. And the liner bobbin 13 held by the bobbin support shaft 35B of the tape holding unit 25B at the start of step S1 is referred to as the liner bobbin 13B. The liner bobbin 13B is considered to be an unused liner bobbin 13.

[0113] 3 and other figures, it is assumed that in the tape recovery section 5, the take-up core support shaft 67A has moved to recovery position K1, and the take-up core support shaft 67B has moved to standby position K2. In order to distinguish between the multiple original rolls 11 mounted in the adhesive tape application device 1, the take-up core 15 held by the take-up core support shaft 67A is referred to as the take-up core 15A. The unused take-up core 15 held by the take-up core support shaft 67B is referred to as the take-up core 15B. In other words, at the start of step S1, the take-up core 15A corresponds to the operating take-up core 15. It is assumed that the take-up core 15B is an unused take-up core 15.

[0114] Step S1 (Placing the wafer) When a joining command is issued via the control unit 9, the wafer W is placed on the holding table 55 in the tape joining unit 4. That is, the wafer W stored in a predetermined storage unit is aligned on the alignment stage and then placed on the holding table 55 by a wafer transfer mechanism (not shown). The wafer W placed on the holding table 55 is rotated and is held by suction in a state where the center of the wafer W is aligned to the center of the holding table 55.

[0115] At this time, the tape application unit 57, the tape cutting unit 59, and the tape peeling unit 60 have each moved to their initial positions shown in Fig. 9. That is, the tape application unit 59 has moved to the right side of the holding table 55, and the tape peeling unit 60 has moved to the left side of the holding table 55. In addition, the tape cutting unit 59 is on standby above the holding table 55.

[0116] Step S2 (applying adhesive tape) After the wafer W is placed on the holding table 55, the process of bonding the adhesive tape T to the surface of the wafer W begins. That is, in the tape supply unit 3, as shown in FIG. 6, the tape TS is fed downstream from the original web roll 11A loaded on the original web roll holding shaft 34A moving to the feeding position G1. The tape TS fed from the original web roll 11A is peeled off into the adhesive tape T and the release liner S by the liner peeling roller 40 downstream of the guide shaft 23. The adhesive tape T is then wound around the guide roller 29 and guided to the tape application unit 4. The release liner S peeled off from the adhesive tape T is guided by the liner guide roller 36A and taken up on the liner bobbin 13A.

[0117] 14, in the tape joining section 4, the joining roller 57b of the tape joining unit 57 rolls on the wafer W toward the left side of the figure while pressing the adhesive tape T downward, and moves in the x direction from the initial position indicated by the dotted line to the terminal position indicated by the solid line. In this way, the adhesive tape T is joined to the entire surface of the wafer W.

[0118] Step S3 (Cutting the adhesive tape) After the adhesive tape T is attached to the wafer W, the adhesive tape T is cut according to the shape of the wafer W. That is, as shown in Fig. 15, the tape cutting unit 59, which has been waiting above, is lowered and moves from the initial position indicated by the dotted line to the cutting position indicated by the solid line. Then, as the tape cutting unit 59 is lowered to the cutting position, the cutter 59c is thrust into the adhesive tape T in the cutter running groove 55a of the holding table 55.

[0119] When the cutter 59c pierces the adhesive tape T, the support arm 59b rotates about the vertical axis P. Accordingly, the cutter 59c rotates while being in sliding contact with the outer periphery of the wafer W, and the adhesive tape T is cut along the outline of the wafer.

[0120] Step S4 (peel off the adhesive tape) When cutting of the adhesive tape T is completed, the operation of peeling off the unnecessary portion of the adhesive tape T is started. That is, as shown in Fig. 16, the tape cutting unit 59 is raised to the original standby position. Then, the tape application unit 57 returns from the terminal position to the initial position. As the tape application unit 57 returns to the initial position, the tape separation unit 60 moves in the x direction toward the right side of the figure. That is, the tape separation unit 60 moves horizontally to the right from the initial position shown by the dotted line in Fig. 16 to the terminal position shown by the solid line.

[0121] While moving to the terminal position, the tape peeling unit 60 rolls up and peels off the unnecessary tape Tn that remains after being cut into a circle on the wafer W from the strip-shaped adhesive tape T. Note that the portion of the adhesive tape T that is attached to the surface of the wafer W is given the symbol Tw to distinguish it from the unnecessary tape Tn.

[0122] When the tape separating unit 11 reaches the end position and the separating operation is completed, the tape separating unit 60 returns from the end position to the initial position. At this time, the unnecessary tape Tn is fed downstream and transported from the tape application unit 4 to the tape recovery unit 5. The unnecessary tape Tn transported to the tape recovery unit 5 is guided by the guide roll 69 to the recovery position K1 of the tape recovery unit 5. The unnecessary tape Tn is then wound into a roll and collected by the take-up core 15A arranged at the recovery position K1. In synchronization with the operation of collecting the unnecessary tape Tn in the tape recovery unit 5, a certain amount of tape TS is fed from the original roll 11A arranged at the feed position G1 in the tape supply unit 3.

[0123] Step S5 (wafer recovery) When each process up to step S4 is completed, the suction of the wafer W on the holding table 55 is released. After the suction is released, the wafer W with the adhesive tape Tw attached thereto is transported by the wafer transport mechanism and collected in a wafer recovery section (not shown). This completes one basic operation of the adhesive tape joining process. By appropriately repeating the series of basic operations from step S1 to step S5, the adhesive tape T is joined to a specified number of wafers W.

[0124] <Process branching> In the adhesive tape application apparatus 1 of this embodiment, during the adhesive tape application process from steps S1 to S5, the apparatus is configured to perform a predetermined preparatory process on the raw roll 11 positioned at the preparation position G2 and to automatically replace the raw roll 11 positioned at the pay-out position G1, depending on the amount of adhesive tape T loaded on the operating raw roll 11 positioned at the pay-out position G1.

[0125] 12(b) is a flowchart showing branching of the process depending on the amount of adhesive tape T loaded, etc. When the amount of adhesive tape T loaded on the web roll 11A arranged at the pay-out position G1 has decreased to a predetermined value T1 or less (branch Q1) and the predetermined preparation process has not been performed on the web roll 11 arranged at the preparation position G2 (branch Q2), the preparation process is performed on the web roll 11B arranged at the preparation position G2 (step S6). The process of step S6 is performed while the adhesive tape joining process relating to steps S1 to S5 is continued.

[0126] When the preparation process is completed for the raw web roll 11 arranged at the preparation position G2, the adhesive tape application process in steps S1 to S5 is continued. Then, when the amount of adhesive tape T loaded on the raw web roll 11A decreases further from the predetermined value T1 by continuing the adhesive tape application process and becomes equal to or less than a predetermined value T2 (branch Q3), a process of automatically replacing the raw web roll 11A arranged at the pay-out position G1 with an unused raw web roll 11B is started (step S7).

[0127] The predetermined value T1 and the predetermined value T2 can be appropriately set according to the time required for the adhesive tape joining process or the properties of the adhesive material constituting the adhesive tape T. An example of the predetermined value T1 is 10% to 20% of the amount of the adhesive tape T loaded on the unused raw roll 11. The predetermined value T1 is set as a threshold value having a tape amount larger than the predetermined value T2. An example of the predetermined value T2 is 0% to 5% of the amount of the adhesive tape T loaded on the unused raw roll 11. The predetermined value T1 corresponds to the first predetermined amount in the present invention. The predetermined value T2 corresponds to the second predetermined amount in the present invention. In other words, if the adhesive tape T is continuously fed from the raw roll 11, the timing at which the amount of the adhesive tape T loaded on the raw roll 11 decreases to the predetermined value T1 or less is always earlier than the timing at which the amount of the adhesive tape T loaded on the raw roll 11 decreases to the predetermined value T2 or less.

[0128] The adhesive tape joining device 1 according to this embodiment is configured to automatically replace the winding core 15 disposed at the collection position K1 during the adhesive tape joining process from steps S1 to S5, depending on the amount of unnecessary tape Tn wound on the operating winding core 15 disposed at the collection position K1. That is, as shown in Fig. 13(b), when the amount of unnecessary tape Tn wound and collected on the winding core 15A disposed at the collection position G1 is equal to or greater than a predetermined value M1 (branch Q4), a process of automatically replacing the winding core 15A disposed at the collection position K1 with an unused winding core 15B is started (step S8). The predetermined value M1 corresponds to the third predetermined amount in the present invention.

[0129] Hereinafter, each step of the raw roll preparation process in step S6, the automatic raw roll replacement in step S7, and the automatic take-up core replacement in step S8 will be described in detail.

[0130] <Preparation process for raw roll> First, a series of steps for the raw fabric roll preparation process in step S6, i.e., the process for bringing the raw fabric roll 11 in a standby state into a ready state, will be described. Fig. 13(a) is a flowchart illustrating a series of steps for carrying out the preparation process on the raw fabric roll 11.

[0131] Step S6-1 (holding the tip of the liner) When the loading amount of the adhesive tape T in the original web roll 11A that is feeding and supplying the adhesive tape T at the feeding position G1 becomes equal to or less than the predetermined value T1, it is predicted that the adhesive tape T wound around the original web roll 11A will run out in the near future, and the original web roll 11A will be unable to supply the adhesive tape T to the tape application unit 4. In other words, it is predicted that the operation of step S7 for replacing the operating original web roll 11A with a new unused original web roll 11B will become necessary in the near future. Therefore, before the original web roll replacement process in step S7 is actually required, the original web roll preparation process in step S6 is performed in advance.

[0132] When the tape amount detection sensor 32 detects that the loading amount of the adhesive tape T in the operating web roll 11A is equal to or less than T1, information that the loading amount is equal to or less than T1 is transmitted from the tape amount detection sensor 32 to the control unit 9, as shown in Fig. 17. Then, upon receiving the information, the control unit 9 controls the tape holding unit 25B moving to the preparation position G2, and starts preparation processing for the web roll 11 (here, web roll 11B) located at the preparation position G2. Note that before starting the preparation processing, the liner guide roller 36B is lowered in advance to move from the guide position H1 to the retracted position H2.

[0133] When a command to start preparation processing of the original web roll 11 is issued via the control unit 9, the liner tip of the original web roll 11 in the standby state is first held. That is, as shown in FIG. 17, the vertical lifting platform 39B is raised and lowered as appropriate, and the expandable arm 47B is extended to displace the splice tape holding member 43B in the x-direction and z-direction. Due to this displacement, the splice tape holding member 43B comes into contact with the liner tip Sa of the original web roll 11B in the standby state. The liner tip Sa refers to the tip portion of the original web roll 11 in the standby state shown in FIG. 4(a) and the like where the adhesive tape T has been removed and the release liner S is exposed. When the splice tape holding member 43B comes into contact with the liner tip Sa, a suction mechanism (not shown) is activated to cause the splice tape holding member 43B to suction and hold the liner tip Sa.

[0134] Step S6-2 (Joining the tip of the liner) When the liner tip portion Sa is held by the splice tape holding member 43B, a process of joining the liner tip portion Sa to the liner bobbin 13 is started. In this embodiment, since the liner bobbin 13 arranged at the preparation position G2 is the liner bobbin 13B, the splice tape holding member 43B joins the liner tip portion Sa to the inner bobbin 13B. That is, as shown in Fig. 18, the splice tape holding member 43B, while suction-holding the liner tip portion Sa, descends to the height at which the liner bobbin 13B is disposed.

[0135] By further extending the extendable arm 47, the splice tape holding member 43B approaches the liner bobbin 13B, and the liner tip portion Sa is pressed against the outer periphery of the liner bobbin 13B. After the liner tip portion Sa is brought into contact with the liner bobbin 13B, the liner tip portion Sa is spliced ​​to the liner bobbin 13B. At this time, the liner peeling roller 40 is appropriately retreated to a position (not shown) where it can avoid interference with the splice tape holding member 43B and the like.

[0136] In this embodiment, after the liner tip portion Sa is brought into contact with the liner bobbin 13B, the control unit 9 activates a heater built into the splicing tape holding member 43 to heat the liner tip portion Sa. Since the release liner S is made of a material that undergoes thermal adhesion, by heating the liner tip portion Sa, the liner tip portion Sa is joined to the outer periphery of the liner bobbin 13B. By joining the liner tip portion Sa to the liner bobbin 13B, it becomes possible to rotate the liner bobbin 13 to sequentially peel the release liner S from the tape TS of the original roll 11B and wind and collect it.

[0137] Step S6-3 (holding adhesive tape) When the step of bonding the release liner S to the liner bobbin 13B is completed, the step of holding the leading end of the adhesive tape T on the original roll 11B is started. When the step of holding the adhesive tape is started, the splice tape holding member 43B releases the liner leading end Sa from suction. Then, the expandable arm 47 is shortened to separate the splice tape holding member 43B from the liner leading end Sa. Thereafter, as shown in FIG. 19, the splice tape holding member 43B is raised to the height of the leading end of the adhesive tape T, and the expandable arm 47 is extended again to bring the splice tape holding member 43B into contact with the leading end of the adhesive tape T. Then, the suction device is operated to cause the splice tape holding member 43B to suction and hold the leading end of the adhesive tape T.

[0138] Step S6-4 (Exposing the adhesive tape) When the splice tape holding member 43B holds the adhesive tape T, the process of exposing the leading end of the adhesive tape T is started. That is, as shown in FIG. 20, the liner guide roller 36B is moved from the retracted position H2 to the guide position H1. The liner guide roller 36B is returned to the guide position H1, and the liner peeling roller 40B is also returned to the initial position shown in FIG. 1 or FIG. 22. As the liner guide roller 36B moves to the guide position H1, the release liner S is wound around the liner guide roller 36B, generating an appropriate tension. The liner leading end Sa is joined to the liner bobbin 13B, and tension is generated in the release liner S, allowing the liner bobbin 13B to wind and collect the release liner S.

[0139] After the liner guide roller 36B is moved to the guide position H1, the liner bobbin 13B is rotated around an axis in the y direction to wind up the release liner S, while the splice tape holding member 43B holding the adhesive tape T is lowered. As the liner bobbin 13B winds up and recovers the release liner S from the liner tip portion Sa, the release liner S of the adhesive tape T unwound from the original roll roller 11B is gradually peeled off from the tip portion, and the adhesive surface is exposed at the tip portion of the adhesive tape T. The tip portion of the adhesive tape T with the exposed adhesive surface is pulled downward while being adsorbed and held by the splice tape holding member 43B. The control unit 9 controls the vertical lifting platform 39 so that the splice tape holding member 43B is lowered to a position lower than the splice tape preparation mechanism 31.

[0140] After the leading end of the adhesive tape T is exposed, the adhesive tape T is further held by the adhesive tape holding member 41B. That is, in the tape splicing mechanism 37B, the expandable arm 45B is extended to bring the adhesive tape holding member 41B into contact with the non-adhesive surface of the adhesive tape T. Then, the suction mechanism is operated to adsorb and hold the area upstream from the leading end of the adhesive tape T to the adhesive tape holding member 41B. Note that, as shown in FIG. 20, the control unit 9 controls the tape splicing mechanism 37B so that the adhesive tape holding member 43B moves to a position lower than the cutter blade 49 provided in the spliced ​​tape preparation mechanism 31, while the adhesive tape holding member 41B moves to a position higher than the cutter blade 49.

[0141] Step S6-5 (Creating the bonding tape) After the release liner S is peeled off from the tip portion of the adhesive tape T and the adhesive tape T is held by the adhesive tape holding member 43B and the adhesive tape holding member 41B, the process of producing the splice tape Ns is started using the splice tape production mechanism 31. In this embodiment, the tip of the adhesive tape T in the original roll 11B that is the target of the preparation process is partially cut off by the splice tape production mechanism 31, and the cut-off fragmented tip portion is used as the splice tape Ns.

[0142] When the process of producing the splice tape Ns is started, the control unit 9 drives the cutter holder 48 of the splice tape producing mechanism 31 to move the cutter blade 49 from the initial position shown in Fig. 20 to the cutting position shown in Fig. 21. That is, the cutter blade 49 is moved in a direction approaching the adhesive tape T and in the width direction of the adhesive tape T. As a result, as shown in Fig. 21, the leading end of the adhesive tape T unwound from the original roll 11B is cut across the width direction at a predetermined position between the adhesive tape holding member 41B and the splice tape holding member 43B.

[0143] When the splice tape preparation mechanism 31 cuts the adhesive tape T, the leading end of the adhesive tape T is cut off from the original roll 11B. The leading end cut off from the original roll 11B is adsorbed and held by the splice tape holding member 43B as the splice tape Ns. The leading end V1 of the adhesive tape T newly formed by the cutting is adsorbed and held by the adhesive tape holding member 41B.

[0144] After the cutting is completed, the splice tape producing mechanism 31 returns from the cutting position to the initial position. Also, the splice tape holding member 43 holding the splice tape Ns retreats to the left in the x direction. The splice tape Ns is produced by the splice tape producing mechanism 31, and the raw roll preparation process in step S6 is completed.

[0145] When the series of steps in step S6 is completed, the raw web roll 11B changes from the standby state shown in Figures 4(a) and 4(b) to the ready state shown in Figures 5(a) and 5(b). In the ready state, the raw web roll 11B has a leading end V1 of the adhesive tape T of the tape TS loaded on the raw web roll 11B, which is held by suction by the adhesive tape holding member 41B. Also, of the tape TS, a leading end Sa of the release liner S is peeled off from the adhesive tape T and taken up around the liner bobbin 13B.

[0146] In this embodiment, the adhesive tape loading amount of the raw web roll 11A arranged at the unwinding position G1 becoming equal to or less than T1 is used as a trigger to perform a raw web roll preparation processing step in step S6 while the adhesive tape joining steps in steps S1 to S5 are being performed. When the raw web roll 11B arranged at the preparation position G2 becomes in a prepared state, the adhesive tape joining steps in steps S1 to S5 are continued until the step of step S7 becomes necessary. In other words, the adhesive tape T is kept being unwound and supplied from the raw web roll 11A until the adhesive tape loading amount of the raw web roll 11A further decreases to equal to or less than the predetermined amount T2.

[0147] <Automatic raw roll replacement process> Next, the automatic raw web roll replacement process in step S7, i.e., the process of automatically replacing the used raw web roll 11 arranged at the pay-out position G1 with an unused raw web roll 11 arranged at the preparation position G2, will be described. Fig. 13(b) is a flow chart illustrating a series of processes for replacing the raw web roll 11 arranged at the pay-out position G1 from the used raw web roll 11A with an unused raw web roll 11B.

[0148] Step S7-1 (Stopping tape transport) When the adhesive tape T continues to be unwound from a state in which the loading amount of the adhesive tape T in the raw web roll 11A is a predetermined value T1, the loading amount of the adhesive tape T in the raw web roll 11A becomes a predetermined value T2 which is lower than the predetermined value T1. When the loading amount of the adhesive tape T in the operating raw web roll 11A arranged at the unwinding position G1 becomes equal to or less than the predetermined value T2, it is determined that the adhesive tape T in the raw web roll 11A has run out and it is difficult to supply the adhesive tape T from the raw web roll 11A to the tape application unit 4.

[0149] Therefore, when the tape amount detection sensor 32 detects that the amount of adhesive tape T loaded on the operating raw web roll 11A has fallen below T2, information that the amount loaded is below T2 is transmitted from the tape amount detection sensor 32 to the control unit 9. Then, upon receiving this information, the control unit 9 controls the tape supply unit 3 to start a process of replacing the raw web roll arranged at the pay-out position G1 from the raw web roll 11A with the reduced amount of adhesive tape T loaded to the raw web roll 11B which is unused and has a sufficiently large amount of adhesive tape T loaded.

[0150] When a command to start the automatic replacement process of the original web roll 11 is issued via the control unit 9, first, the operation of transporting the adhesive tape T is temporarily stopped. That is, the control unit 9 performs control to stop each component of the adhesive tape joining device 1, for example, the mechanism that rotates the original web roll 11 arranged at the pay-out position G1 and the take-up core 15 arranged at the recovery position K1. This control stops the rotation of the operating original web roll 11 and the operating take-up core 15, so that the operation of paying out and supplying the adhesive tape T from the operating original web roll 11 and the operation of winding and recovering the unnecessary tape Tn by the operating take-up core 15 are interrupted. Therefore, the adhesive tape joining process in steps S1 to S5 is temporarily interrupted.

[0151] Step S7-2 (Cutting the adhesive tape) After the transport of the adhesive tape T is interrupted, a process is performed to separate the adhesive tape T being transported to the tape joining unit 4 from the operating original web roll 11A. First, the control unit 9 controls the tape cutting mechanism 27 to cause the adhesive tape T to be held by the leading tape holding member 51. As shown in FIG. 22(a), the leading tape holding member 51 moves from the initial position indicated by the dotted line to the holding position indicated by the solid line. By moving to the holding position, the leading tape holding member 51 comes into contact with the non-adhesive surface of the adhesive tape T. Then, by operating a suction mechanism (not shown), the leading tape holding member 51 adsorbs and holds the adhesive tape T.

[0152] Next, the control unit 9 controls the cutter unit 50 to cut the adhesive tape T upstream of the leading tape holding member 51. That is, the control unit 9 drives the cutter holder 52 of the cutter unit 50 to move the cutter blade 53 from the initial position shown in FIG. 22(a) to the cutting position shown in FIG. 22(b). That is, the cutter blade 53 is moved in a direction approaching the adhesive tape T and in the width direction of the adhesive tape T. As a result, as shown in FIG. 22(b), the adhesive tape T unwound from the raw roll 11A is cut across the width direction upstream of the portion held by the leading tape holding member 51. Because the conveyance of the adhesive tape T is stopped before starting the process of step S7-2, the cutter unit 50 can accurately cut the adhesive tape T.

[0153] By cutting the adhesive tape T across its width, the adhesive tape T being transported to the tape joining section 4 is separated from the original roll 11A. The portion of the adhesive tape T separated from the original roll 11A is referred to as the "leading tape Tm" to be distinguished from the portion of the adhesive tape T connected to the original roll 11A. By cutting the adhesive tape T with the cutter unit 50, the rear end V2 of the leading tape Tm is held by the leading tape holding member 51. When the adhesive tape T is cut, the cutter unit 50 returns to its initial position. In order to avoid interference in a process of switching the positions of the tape holding units 25A and 25B, which will be described later, the leading tape holding member 51 holding the leading tape Tm and the guide roller 29 guiding the leading tape Tm may be further retracted.

[0154] Step S7-3 (Cutting the release liner) After cutting the adhesive tape T to separate the preceding tape Tm from the used raw web roll 11A, an operation is started to cut the release liner S to separate it from the raw web roll 11A. That is, as shown in Fig. 23, the liner cutting mechanism 54 disposed at the payout position G1 is operated to cut the release liner S that has been paid out from the raw web roll 11A and peeled off from the adhesive tape T. The release liner S separated from the raw web roll 11A is taken up on the liner bobbin 13A. Note that the tape supply unit 3 in a state in which the adhesive tape T and the release liner S have been separated from the raw web roll 11A upon completion of the process of step S7-3 is as shown in Fig. 24.

[0155] Step S7-4 (Replacing the holding unit) After cutting the adhesive tape T, an operation is performed to switch the positions of the tape holding units 25. When the process of step S7-2 is started, the control unit 9 appropriately controls the drive units of the movable wall 33A of the tape holding unit 25A and the movable wall 33B of the tape holding unit 25B to switch the positions of the tape holding units 25A and 25B with each other.

[0156] Specifically, in this embodiment, the movable wall 33A located at the payout position G1 is moved back in the y direction, and the movable wall 33B located at the preparation position G2 is raised. As the movable wall 33B is raised, the tape holding unit 25B located at the preparation position G2 moves to the payout position G1. Then, the movable wall 33A, which has been moved back from the payout position G1, is lowered in the z direction and further moved forward in the y direction, thereby moving the movable wall 33A to the preparation position G2. As a result, the tape holding unit 25A located at the payout position G1 moves to the preparation position G2.

[0157] By such drive control, the tape holding unit 25A holding the used web roll 11A is moved to the preparation position G2, while the tape holding unit 25B holding the unused web roll 11B in the preparation state is moved to the unwinding position G1. The tape supply section 3 in the state where the positions of the tape holding units 25A and 25B are interchanged and the process of step S7-4 is completed is as shown in FIG. 25. That is, components disposed in the tape holding unit 25, such as the tape splicing mechanism 37, move together with the tape holding unit 25 in step S7-4. On the other hand, components not connected to the tape holding unit 25, such as the tape amount detection sensor 32, do not move in step S7-4.

[0158] The preparation process in step S6 has been completed for the original web roll 11B arranged in the tape holding unit 25B. Therefore, by moving the tape holding unit 25B to the payout position G1, the adhesive tape holding member 41B holding the leading end V1 of the adhesive tape T loaded in the original web roll 11B moves to a position corresponding to the upstream of the leading tape holding member 51 holding the trailing end V2 of the leading tape Tm, as shown in Fig. 25. Then, the splice tape holding member 43B holding the splice tape Ns moves to a position downstream of the adhesive tape holding member 41B and upstream of the leading tape holding member 51.

[0159] Step S7-5 (Adhesive tape bonding) After swapping the positions of the tape holding units 25 and moving the unused web roll 11B to the payout position G1, the step of splicing the adhesive tapes is started. That is, in step S7-5, an operation is performed to splice the leading tape Tm that has been cut off from the used web roll 11A with the adhesive tape T of the unused web roll 11B that has been newly arranged at the payout position G1. Figure 26(a) shows the state of the tape holding unit 25B immediately before the start of the step S7-5.

[0160] When the process of step S7-5 is started, the control unit 9 controls the expandable arm 47B to move the splice tape holding member 43B. By this control, the splice tape holding member 43B, which has retreated to the left in the x direction, moves to the right in the x direction and approaches the adhesive tape T. As a result, as shown in FIG. 26(b), the splice tape Ns held by the splice tape holding member 43B adheres to each of the rear end V2 of the preceding tape Tm and the front end V1 of the adhesive tape T loaded on the original web roll 11B. The splice tape Ns adheres to each of the rear end V2 of the preceding tape Tm and the front end V1 of the adhesive tape T, so that the preceding tape Tm is spliced ​​to the adhesive tape T of the original web roll 11B. Note that, in FIG. 26(b), the splice tape Ns is attached to both the non-adhesive surface of the rear end V2 and the non-adhesive surface of the front end V1, but the splice tape Ns may be attached to both the adhesive surface of the rear end V2 and the adhesive surface of the front end V1.

[0161] Step S7-6 (restart tape transport) By splicing the original web roll 11B newly arranged at the pay-out position G1 and the preceding tape Tm, it becomes possible to pay out and supply a large amount of adhesive tape T loaded on the unused original web roll 11B to the tape application unit 4. When the step of splicing the adhesive tapes in step S7-5 is completed, the operation of transporting the adhesive tape T is resumed. That is, the control unit 9 controls the resumption of operation of each component of the adhesive tape application device 1, such as the mechanism that rotates the original web roll 11 arranged at the pay-out position G1 and the take-up core 15 arranged at the recovery position K1.

[0162] This control restarts the rotation of the operating raw web roll 11B and the operating winding core 15A, restarting the operation of unwinding and supplying the adhesive tape T from the raw web roll 11B and the operation of winding and collecting the unnecessary tape Tn by the winding core 15A. This restarts the adhesive tape joining process involving steps S1 to S5. That is, among step S7, steps S7-7 and S7-8 can be performed in a state in which the adhesive tape joining process is being carried out.

[0163] Step S7-7 (unloading the original roll) When the series of operations for joining the adhesive tape T to the wafer W is resumed by the process of step S7-6, an operation of unloading the used web roll 11 from the tape supply unit 3 is started. That is, while the adhesive tape joining process of steps S1 to S5 is being performed, as shown in Fig. 27, the web roll 11A is removed from the web roll support shaft 34A. The used web roll 11A removed from the web roll support shaft 34A is transported from the adhesive tape joining apparatus 1 and stored in a storage facility (not shown) or the like. The operation of unloading the web roll 11A from the web roll support shaft 34A may be performed manually by an operator or automatically by a working robot.

[0164] After the original roll 11A is carried out from the tape supply unit 3, as shown in Fig. 27, the used liner bobbin 13A is also carried out from the tape supply unit 3. This completes the process of step S7-7.

[0165] Step S7-8 (Carrying in the raw roll) By removing the used raw material roll 11A and liner bobbin 13A from the tape supply unit 3, the raw material roll 11 and liner bobbin 13 are no longer positioned at the preparation position G2 of the tape supply unit 3.

[0166] Therefore, after the used raw web roll 11A and liner bobbin 13A are transported out of the preparation position G2 of the tape supplying unit 3, an operation is started to transport the unused raw web roll 11 and liner bobbin 13 into the preparation position G2 of the tape supplying unit 3. In this embodiment, an unused raw web roll 11C and an unused liner bobbin 13C are newly transported into the tape supplying unit 3.

[0167] When the process of step S7-8 is started, the original web roll 11C stored in a storage facility (not shown) or the like is carried into the tape supply unit 3. That is, as shown in Fig. 28, the original web roll 11C is attached to the original web roll support shaft 34 (here, the original web roll support shaft 34A provided on the tape holding unit 25A) provided on the tape holding unit 25 moving to the preparation position G2.

[0168] After an unused raw roll 11C is carried into the tape supplying section 3, an unused liner bobbin 13C is carried into the tape supplying section 3. That is, as shown in Fig. 28, the liner bobbin 13C is attached to the bobbin support shaft 35 (here, bobbin support shaft 35A) of the tape holding unit 25 that has moved to the preparation position G2. This completes the process of step S7-8.

[0169] By executing steps S7-1 to S7-8, the raw roll replacement step in step S7 is completed. Thereafter, the adhesive tape application device 1 executes the adhesive tape application steps in steps S1 to S5, while also executing steps S6 and S7 in accordance with the amount of adhesive tape T loaded on the raw roll 11 arranged at the pay-out position G1.

[0170] That is, when the adhesive tape T is paid out from the web roll 11B arranged at the pay-out position G1 and the adhesive tape joining step is performed, the amount of adhesive tape T loaded on the web roll 11B decreases. Then, when the amount of adhesive tape T loaded becomes equal to or less than a predetermined value T1, the preparation process step in step S6 is automatically performed on the web roll 11C in a standby state arranged at the preparation position G2, and the web roll 11C transitions from the standby state to the standby state.

[0171] Thereafter, when the amount of adhesive tape T loaded on the original web roll 11B falls below the predetermined value T2 and the original web roll 11B is in a used state, the process of step S7 is started. That is, the adhesive tape joining process is temporarily interrupted, and the original web roll 11C in a ready state is moved from the ready position G2 to the pay-out position G1. The original web roll 11C that has been moved to the pay-out position G1 is joined to the preceding tape Tm, and the adhesive tape joining process is resumed. Meanwhile, the original web roll 11B that has been used is moved from the pay-out position G1 to the ready position G2, and is then carried out from the ready position G2.

[0172] The process of unloading the used original roll 11 and liner bobbin 13, and the process of loading new unused original roll 11 and liner bobbin 13 into the tape supply unit 3 can be performed while the adhesive tape joining process relating to steps S1 to S5 is continuing. Therefore, the process of unloading and loading the original roll 11, etc. can be performed without reducing the efficiency of the process of joining the adhesive tape to the wafer W.

[0173] In this embodiment, the raw web roll preparation process in step S6 is completed at the time when the raw web roll replacement process in step S7 is started. Therefore, the raw web roll 11 newly arranged at the payout position G1 in step S7 is in a prepared state, and the pre-processing required for joining the adhesive tape T separated from the raw web roll 11 in step S7 is completed.

[0174] That is, the release liner S is attached to the liner bobbin 13, and it is already possible to peel the release liner S from the adhesive tape T and take it up. In addition, the splice tape Ns is held by the splice tape holding member 43, and it is in a state where the splice tape Ns can be quickly attached to the adhesive tape T. Therefore, the time required for the process of step S7-5 can be shortened, and the operation of attaching the adhesive tape T to the wafer W can be quickly resumed. Therefore, it is possible to improve the processing efficiency of the adhesive tape joining apparatus 1.

[0175] In addition, the original roll 11 that is transported to the preparation position G2 is in a standby state at the time of transport, and the adhesive surface of the adhesive tape T is protected by a release liner S. As an example, it takes several hours to several tens of hours for all of the adhesive tape T loaded on the original roll 11 to be unwound, so it takes a long time from when the supply of the adhesive tape T starts from the unused original roll 11 until the loading amount of the adhesive tape T on the original roll decreases to a predetermined amount T1 or less. Therefore, by maintaining the original roll 11 that is arranged at the preparation position G2 in a standby state during the period until the loading amount of the adhesive tape T on the original roll 11 arranged at the attachment position G1 becomes the predetermined amount T1 or less, the time during which the adhesive surface of the adhesive tape T is exposed on the original roll 11 that is arranged at the preparation position G2 can be shortened. Therefore, the adhesive strength of the adhesive tape T can be prevented from deteriorating on the unused original roll 11 that is arranged at the preparation position G2.

[0176] <Automatic winding core replacement process> Next, the automatic winding core replacement process in step S8, i.e., the process of automatically replacing the used winding core 15 arranged at the collection position K1 with the unused winding core 15 arranged at the standby position K2, will be described. Fig. 13(c) is a flow chart illustrating a series of processes for replacing the winding core arranged at the collection position K1 from the used winding core 15A to the unused winding core 15B.

[0177] Step S8-1 (Stopping tape transport) The winding core 15A disposed at the recovery position K1 is initially in an unused state with no unnecessary tape Tn wound thereon, as shown in Fig. 29(a). However, when the adhesive tape joining process involving steps S1 to S5 is executed, the amount of unnecessary tape Tn wound around the winding core 15A disposed at the recovery position K1 gradually increases, as shown in Fig. 29(b). There is an upper limit to the amount of unnecessary tape Tn that can be wound and collected by the winding core 15. Therefore, when the amount of unnecessary tape Tn wound and collected around the winding core 15A becomes equal to or greater than a predetermined value M1, it is determined that it is difficult for the winding core 15A to collect the unnecessary tape Tn transported from the tape joining unit 4.

[0178] Therefore, when the tape amount detection sensor 71 detects that the amount of unnecessary tape Tn wound and collected on the operating take-up core 15A is equal to or greater than the predetermined value M1, information that the collected amount of unnecessary tape Tn is equal to or greater than M1 is transmitted from the tape amount detection sensor 71 to the control unit 9. Then, by receiving this information, the control unit 9 controls the tape collection unit 5 and starts a process of replacing the take-up core 15 arranged at the collection position G1 from the take-up core 15A, for which the collected amount of unnecessary tape Tn has reached the allowable amount and it is difficult to collect the unnecessary tape Tn, to the take-up core 15B, which is unused and has no unnecessary tape Tn wound around it.

[0179] When a command to start the automatic replacement process of the take-up core 15 is issued via the control unit 9, first the operation of transporting the adhesive tape T is temporarily stopped. That is, the control unit 9 performs control to stop each component of the adhesive tape joining device 1, for example, the mechanism that rotates the original web roll 11 arranged at the pay-out position G1 and the take-up core 15 arranged at the recovery position K1. This control stops the rotation of the original web roll 11, which is in operation, and the rotation of the take-up core 15, which is in operation, so that the operation of paying out and supplying the adhesive tape T from the original web roll 11 and the operation of taking up and recovering the unnecessary tape Tn by the take-up core 15 are interrupted. Therefore, the adhesive tape joining process in steps S1 to S5 is temporarily interrupted.

[0180] Step S8-2 (Replacing the winding core) After the transport of the adhesive tape T is interrupted, an operation is performed to switch the position of the take-up core support shaft 67 that holds the take-up core 15. Specifically, in this embodiment, the position of the take-up core support shaft 67 is switched between the recovery position K1 and the standby position K2 by rotating the rotating plate 65 by 180°. By rotating the rotating plate 65, the guide roller 66, the take-up core support shaft 67, and the take-up core 15 loaded on the take-up core support shaft 67, which are connected to the rotating plate 65, also rotate.

[0181] FIG. 30(a) shows a state in which the rotating plate 65 has rotated 90° counterclockwise. The unnecessary tape Tn wound around the take-up core 15A is wound around the guide roller 66 that has been moved to the new collection position K1. Therefore, the track along which the unnecessary tape Tn is transported is a track along the outer periphery of the rotating plate 65. FIG. 30(b) shows a state in which the rotating plate 65 has rotated 180° counterclockwise. The collection position K1 and the standby position K2 are positions facing each other with the rotation shaft 68 in between. Therefore, when the rotating plate 65 rotates 180°, the used take-up core 15A that was disposed at the collection position K1 moves to the standby position K2. Meanwhile, the unused take-up core 15B that was disposed at the standby position K2 moves to the collection position K1. The process of step S8-2 is completed by swapping the positions of the two take-up cores 15 between the collection position K1 and the standby position K2.

[0182] Step S8-3 (Cutting off unnecessary tape) At the time when the process of step S8-2 is completed, the unnecessary tape Tn is guided by each of the guide roller 69, the take-up core 15B, and the guide roller 66, and is connected to the take-up core 15A. That is, the unnecessary tape Tn is connected to the used take-up core 15A, while the unnecessary tape Tn is not connected to the unused take-up core 15B newly arranged at the collection position K1. In order to wind and collect the unnecessary tape Tn on the take-up core 15B, it is necessary that an end of the unnecessary tape Tn is joined to the take-up core 15B. Therefore, as a preliminary step to joining the unnecessary tape Tn to the unused take-up core 15B, an operation is performed at the collection position K1 to cut the unnecessary tape Tn and form a new end of the unnecessary tape Tn.

[0183] When the process of step S8-3 is started, the control unit 9 operates the splicing unit 70 to cut the unnecessary tape Tn at the collection position G1. That is, as shown in Fig. 31(a), the rotating shaft 73 is rotated to move the splicing unit 70 from the retracted position P2 to the splicing position P1. As the splicing unit 70 moves to the splicing position P1, the unnecessary tape Tn is sandwiched and fixed between the joining roller 75 and the take-up core 15B.

[0184] After the unnecessary tape Tn is fixed, the unnecessary tape Tn is cut using the cutter blade 77. That is, the movable base 78 holding the cutter blade 77 is moved in a direction approaching the unnecessary tape Tn, and the movable base 78 is further moved in the width direction of the unnecessary tape Tn. By the movement of the movable base 78, the cutter blade 77 cuts the unnecessary tape Tn in the width direction on the downstream side of the position where the unnecessary tape Tn is sandwiched between the joining roller 75 and the take-up core 15B, as shown in Fig. 31(b). Since the conveyance of the adhesive tape T is stopped at the start of the process of step S8-3, the cutter blade 77 can accurately cut the unnecessary tape Tn.

[0185] By cutting the unnecessary tape Tn, the unnecessary tape Tn being transported from the tape application unit 4 to the tape recovery unit 5 is separated from the used take-up shaft 15A that has moved to the standby position K2. By cutting the unnecessary tape Tn from the used take-up shaft 15A, a new leading end V3 is formed in the unnecessary tape Tn on the upstream side of the cut-off portion. The unnecessary tape Tn on the downstream side of the cut-off portion is taken up onto the take-up core 15A by the rotation of the take-up core 15A.

[0186] Step S8-4 (Joining unnecessary tape) After the unnecessary tape Tn is cut off from the used take-up core 15A, the unnecessary tape Tn is joined to a new unused take-up core 15 arranged at the collection position K1. In this embodiment, the unnecessary tape Tn is joined to the take-up core 15B. That is, as shown in Fig. 32, the joining roller 75 is rolled on the outer periphery of the take-up core 15B by, for example, swinging the movable base 76 about the connection portion with the pivot arm 74, and the leading end V3 of the unnecessary tape Tn is pressed against the take-up core 15B.

[0187] By pressing the leading end V3 of the unnecessary tape Tn, the adhesive surface of the unnecessary tape Tn at the leading end V3 comes into close contact with the outer circumferential surface of the take-up core 15B, and the unnecessary tape Tn is joined to the take-up core 15B. FIG. 33 shows the tape recovery section 5 in a state in which the unnecessary tape Tn has been separated from the take-up core 15A and the leading end V3 of the unnecessary tape Tn has been joined to the take-up core 15B. Thereafter, the splicing unit 70 is retreated from the splicing position P1 to the retreat position P2. The unnecessary tape Tn is spliced ​​to the unused take-up core 15B that has been newly moved to the recovery position K1, thereby completing the process of step S8-4.

[0188] Step S8-5 (restarting tape transport) By splicing the unnecessary tape Tn to the winding core 15B newly arranged at the collection position K1, it becomes possible to wind and collect the unnecessary tape Tn transported from the tape application unit 4 onto the unused winding core 15B. Therefore, when the process of splicing the unnecessary tape in step S8-4 is completed, the operation of transporting the adhesive tape T is resumed. That is, the control unit 9 controls the resumption of operation of each component of the adhesive tape application device 1, such as the mechanism that rotates the original roll 11 arranged at the pay-out position G1 and the winding core 15 arranged at the collection position K1.

[0189] This control starts rotation of the original web roll 11B arranged at the payout position G1 and starts rotation of the take-up core 15B arranged at the collection position K1, so that the adhesive tape T is paid out from the original web roll 11B and the unnecessary tape Tn is taken up and collected by the take-up core 15B. Therefore, the adhesive tape joining process of steps S1 to S5 is restarted. That is, among step S8, steps S8-6 and S8-7 can be performed in a state where the adhesive tape joining process is being performed.

[0190] Step S8-6 (Removal of the winding core) When the series of operations for bonding the adhesive tape T to the wafer W is resumed, an operation for unloading the used take-up core 15 from the tape recovery unit 5 is started. That is, while the adhesive tape bonding process in steps S1 to S5 is being performed, the used take-up core 15A is removed from the take-up core support shaft 67A as shown in Fig. 34. The used take-up core 15A removed from the take-up core support shaft 67A is removed from the tape recovery unit 5 and stored in a storage facility (not shown) or the like. The operation for unloading the take-up core 15A from the take-up core support shaft 67A may be performed manually by an operator or automatically by a work robot.

[0191] Step S8-7 (Carrying in the winding core) By transporting the used take-up core 15A out of the standby position K2 of the tape recovery unit 5, the take-up core 15 is no longer disposed at the standby position K2 of the tape recovery unit 5.

[0192] Therefore, after the used winding core 15A is removed from the standby position K2 of the tape recovery unit 5, an operation is started to carry an unused winding core 15 into the standby position K2 of the tape recovery unit 5. In this embodiment, an unused winding core 15C is newly carried into the tape recovery unit 5.

[0193] When the process of step S8-7 is started, the take-up core 15C stored in a storage facility (not shown) or the like is carried into the tape recovery unit 5. That is, as shown in Fig. 35, the take-up core 15C is attached to the take-up core support shaft 67 (here, the take-up core support shaft 67A) that has moved to the standby position K2. This completes the process of step S8-7.

[0194] By executing steps S8-1 to S8-7, the automatic winding core replacing step in step S8 is completed. Fig. 36 shows a state after the step S8 is completed. Thereafter, the adhesive tape joining device 1 executes the adhesive tape joining steps in steps S1 to S5, while also executing the step S8 in accordance with the amount of unnecessary tape T collected on the winding core 15 arranged at the collection position K1.

[0195] That is, when the adhesive tape joining process is further carried out with the winding core 15B moved to the collecting position K1, the unnecessary tape Tn is wound and collected on the operating winding core 15B, and the amount of the unnecessary tape Tn wound on the winding core 15B increases. When the amount of the unnecessary tape Tn wound on the winding core 15B increases to or exceeds the predetermined value M1 and the winding core 15B becomes used, the adhesive tape joining process is temporarily interrupted, and the unused winding core 15C, which is previously placed in the waiting position K2, is moved from the waiting position K2 to the collecting position K1. The winding core 15C moved to the collecting position K1 is joined to the unnecessary tape Tn, and the adhesive tape joining process is resumed. On the other hand, the winding core 15B, which has become used, moves from the collecting position K1 to the waiting position K2, and is then carried out from the waiting position K2.

[0196] The process of unloading the used winding core 15 and the process of loading a new unused winding core 15 into the tape recovery unit 5 can be performed while the adhesive tape joining process relating to steps S1 to S5 is continuing. Therefore, the process of unloading and loading the winding core 15 can be performed without reducing the efficiency of the process of joining the adhesive tape to the wafer W.

[0197] <Effects of the configuration of the embodiment> In the adhesive tape application device 1 according to the embodiment, the tape supply section 3 includes a plurality of tape holding units 25 that hold the original web roll 11. The tape supply section 3 has a payout position G1 and a standby position G2. Among the original web roll holding sections included in the tape supply section, the tape supply section is configured to pay out and supply adhesive tape T to the tape processing section 3 from the original web roll 11 held by the tape holding unit 25 that has moved to the payout position G1. Meanwhile, the original web roll 11 that does not currently supply adhesive tape T to the tape processing section 3 is arranged at the standby position G2.

[0198] Therefore, in the configuration of the embodiment, a mechanism for supplying adhesive tape from the tape supply section 3 to the tape application section 4, such as the guide roller 29, does not need to be provided for each tape holding unit 25, and the adhesive tape application process can be suitably performed by providing it only for the tape holding unit 25 that is moving to the pay-out position G1. Therefore, even in a configuration with a plurality of tape holding units 25, it is sufficient to have one mechanism for supplying adhesive tape to the tape application section 4, such as the guide roller 29, and the configuration of the adhesive tape application device 1 can be further simplified.

[0199] Among the multiple tape holding units 25 provided in the tape supplying section 3, the tape holding unit 25 moving to the preparation position G2 is configured to be able to carry in the original web roll 11. Therefore, while continuing the operation of supplying the adhesive tape T from the original web roll 11 moving to the pay-out position G1 to the tape joining section 4 and joining the adhesive tape T to the wafer W, it is possible to replenish the preparation position G2 of the tape supplying section 3 with an unused original web roll 11. In other words, since it is not necessary to stop the operation of joining the adhesive tape T to the wafer W when replenishing the unused original web roll 11 in the tape supplying section 3, it is possible to improve the efficiency of the adhesive tape joining process.

[0200] Furthermore, in the adhesive tape application device 1 according to the embodiment, a preparation process step (step S6) is performed in advance to change the web roll 11, which is disposed at the application position G1 and supplies the adhesive tape T, from a standby state to a standby state, before performing a step (step S7) of replacing the web roll 11. In other words, the web roll 11, which is disposed at the standby position G2, is initially in a standby state.

[0201] When the amount of adhesive tape T loaded on the operating web roll 11 disposed at the attachment position G1 falls below a predetermined value T1, the supply of adhesive tape T on the web roll 11 at the attachment position G1 is continued while a preparation process is performed on an unused web roll 11 disposed at the preparation position G2. Then, when the amount of adhesive tape T loaded on the web roll 11 disposed at the attachment position G1 further decreases to below a predetermined value T2, the supply of adhesive tape T on the web roll 11 at the attachment position G1 is stopped, and a process of replacing the web roll 11 is performed.

[0202] In the preparation process in step S6, the release liner is peeled off from the leading end of the adhesive tape T wound around the original roll 11 to partially expose the adhesive surface of the adhesive tape T. Then, the release liner S peeled off from the adhesive tape T is joined to the liner bobbin 13, and the release liner S is wound up around the liner bobbin 13 so that it can be collected.

[0203] Such preparation processing is necessary before starting the operation of unwinding and supplying the adhesive tape T from the unused web roll 11 after joining the adhesive tape T cut off from the used web roll 11 to a new unused web roll 11. When starting step S7, it is necessary to temporarily suspend the adhesive tape joining process relating to steps S1 to S5. On the other hand, the preparation processing step relating to step S6 can be performed without temporarily suspending the adhesive tape joining process.

[0204] Therefore, by carrying out the preparation process step in step S6 while the adhesive tape joining process is being performed and putting the raw web roll 11 arranged at the preparation position G2 into a prepared state, it is possible to reduce the time and steps required until the adhesive tape T can be unwound and supplied after the raw web roll 11 is moved to the joining position G1. As a result, compared to the conventional configuration in which the raw web roll replacement operation including the preparation process is performed after the adhesive tape loaded on the raw web roll runs out, the configuration according to the embodiment can shorten the time during which the adhesive tape joining process is stopped when the used raw web roll 11 is replaced with a new unused raw web roll 11, thereby improving the efficiency of the adhesive tape joining process.

[0205] In step S6 according to the embodiment, the preparation process of the web roll 11 is automatically performed by control via the control unit 9. That is, as an example, an operator does not need to manually perform the operations of pulling out the tape TS from an unused web roll 11, peeling the release liner S from the adhesive tape T, and bonding the release liner S to the liner bobbin 13. Therefore, the web roll replacement process according to the embodiment can reduce the burden on the operator compared to the conventional replacement process in which the release liner S is manually bonded to the liner bobbin 13 and the web roll 11 is manually loaded onto the web roll support shaft 34 at the attachment position G1.

[0206] Moreover, the tape recovery unit 5 has a recovery position K1 and a standby position K2, and is configured to be able to arrange a plurality of take-up cores 15. That is, the take-up core 15 that is the target of the operation of recovering the unnecessary tape Tn transported from the tape application unit 4 is arranged at the recovery position K1, and the unnecessary tape Tn is wound and recovered on the take-up core 15. Meanwhile, the take-up core 15 that is not currently used to recover the unnecessary tape Tn is arranged at the standby position K2. With this configuration, the take-up core 15 in operation is arranged at the recovery position K1 to perform the operation of winding and recovering the unnecessary tape Tn, while an operation different from the recovery operation can be performed at the standby position K2 in parallel with the recovery operation at the recovery position K1.

[0207] As an example, when performing an operation to unload the used winding core 15 from the tape recovery unit 5, by disposing the used winding core 15 from the recovery position K1 to the standby position K2, it is possible to perform an operation to unload the used winding core 15 from the standby position K2 while performing an operation to wind up the unnecessary tape Tn using another winding core 15 at the recovery position K1. In other words, since it is not necessary to stop the operation to recover the unnecessary tape Tn when unloading the used winding core 15, it is possible to avoid a decrease in the efficiency of the process of bonding the adhesive tape T to the wafer W caused by performing an operation to unload the used winding core 15 from the standby position K2.

[0208] The process of moving the take-up core 15 between the collection position K1 and the standby position K2 can be performed by automatic operation using the rotating plate 65, etc. In other words, the transport process can be automated to a higher degree, so that the burden on the operator can be further reduced and the efficiency of the adhesive tape processing process for the wafer W can be further improved.

[0209] In the embodiment, a part of the adhesive tape T is cut off and the cut piece is used as the splice tape Ns. Therefore, when an unused original roll 11 newly arranged at the pay-out position G1 is spliced ​​with the preceding tape Tm, it is not necessary to prepare a tape other than each of the adhesive tapes T to be spliced ​​as the splice tape Ns in advance. In addition, it is not necessary to provide a configuration for supplying the other tape or a configuration for attaching the other tape to the adhesive tape T to be spliced. Therefore, it is possible to avoid a situation in which preparation for splicing the adhesive tapes becomes complicated, and a situation in which the adhesive tape application device 1 becomes large and costs increase.

[0210] Furthermore, since a part of the adhesive tape T is used as the splice tape Ns, the properties of the splice tape Ns are the same as the properties of the adhesive tape T to be spliced. This reliably avoids a situation in which the adhesive strength between the splice tape Ns and the adhesive tape T to be spliced ​​is low. This makes it possible to more reliably prevent splice errors caused by re-peeling at the splice portion.

[0211] <Configuration of the modified example> The embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention is indicated by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims. For example, the present invention can be modified as follows.

[0212] (1) In each embodiment, the two original web rolls 11A and 11B arranged in the tape supply unit 3 are held by the tape holding unit 25A and the tape holding unit 25B, which are separate members, respectively. However, the present invention is not limited to this. That is, the two original web rolls 11A and the original web rolls 11B may be held by one rotating member, such as the rotating plate 65 that holds the two take-up cores 15A and 15B. In this case, the original web roll 11 may be moved between the pay-out position G1 and the preparation position G2 by rotating the rotating member, similar to the configuration of the tape recovery unit 5 that moves the take-up core 15 between the recovery position K1 and the standby position K2 by rotating the rotating plate 65.

[0213] In addition, the tape recovery section 5 is not limited to a configuration in which the rotating plate 65, which is a single member, holds the two take-up cores 15A and 15B, and one of two separate holding units may hold the take-up core 15A, and the other holding unit may hold the take-up core 15B. In this case, by moving one holding unit that holds the take-up core 15A from the recovery position K1 to the standby position K2 and moving the other holding unit that holds the take-up core 15B from the standby position K2 to the recovery position K1 in synchronization with the operation of moving one holding unit that holds the take-up core 15A from the recovery position K1 to the standby position K2, it is possible to move the take-up core 15B to the recovery position K1 while moving the take-up core 15A to the standby position K2.

[0214] (2) In the embodiment, a part of the adhesive tape T supplied from the original roll 11 is cut and the cut piece is used as the splice tape Ns, but the present invention is not limited to this. That is, a tape piece supplying device loaded with a large number of pre-fragmented splice tapes Ns may be provided in the tape supply unit 3, and the tape piece supplying device may supply the pieces of the adhesive tape Ns to the splice tape holding member 43. In this case, components such as the cutter blade 49 in the splice tape preparation mechanism 31 may be omitted.

[0215] (3) In the embodiment, the adhesive tape processing step for the semiconductor workpiece is exemplified by a process of attaching an adhesive tape T for circuit protection to the surface of the wafer W, but the adhesive tape processing step for the semiconductor workpiece is not limited to this. Another example of the adhesive tape processing step is a mount frame creation process in which a dicing tape is attached across the wafer W and the ring frame to integrate them. Another example of the adhesive tape processing step is an adhesive tape peeling process in which a strip-shaped peeling adhesive tape (peeling tape) is attached to the protective tape attached to the surface of the wafer W, and the protective tape is peeled off from the wafer W together with the peeling tape.

[0216] (4) In the embodiment, a wafer W is exemplified as a semiconductor workpiece, but this is not limited thereto. Other examples of semiconductor workpieces include semiconductor substrates. The shape of the semiconductor workpiece is not limited to a circular shape, and may be any shape, such as a rectangular shape, a polygonal shape, or an elliptical shape. When the semiconductor workpiece is rectangular or polygonal, the corners may be sharp or rounded.

[0217] (5) In the embodiment, in the step of replacing the winding core 15 in step S8, a step of stopping the transport of the adhesive tape T in step S8-1 is performed, but step S8-1 may be omitted. As an example, by adding guide rollers 69 or the like to lengthen the transport path of the unnecessary tape Tn (adhesive tape T), it is possible to replace the winding core 15 without stopping the transport of the adhesive tape T. In such a configuration, the step of replacing the winding core 15 can be performed while continuing the operation of bonding the adhesive tape T to the wafer W, thereby improving the yield of the device.

[0218] (6) In the embodiment, the tape TS having a release liner S affixed to the adhesive tape T is loaded on the original roll 11, but a configuration without using a release liner S is also possible. In other words, the original roll 11 may be configured with a band-shaped adhesive tape T wound thereon without a release liner S affixed thereto. In the case of such a modified example, components such as the liner bobbin 13 that winds up and collects the release liner S and the liner peeling roller 40 that serves as an auxiliary member for peeling the release liner S from the adhesive tape T can be omitted, so that the configuration of the adhesive tape joining device 1 can be further simplified.

[0219] (7) In the embodiment, the process of replacing the original web roll 11 in the tape supplying unit 3 (step S7) is executed when the amount of adhesive tape T on the operating original web roll 11 moving to the unwinding position G1 becomes equal to or less than a predetermined value T2. On the other hand, the process of replacing the take-up core 15 in the tape collecting unit 5 (step S8) is executed when the amount of unnecessary tape Tn on the operating take-up core 15 moving to the collecting position K1 becomes equal to or more than a predetermined value M1. That is, in the embodiment, the process of replacing the original web roll 11 and the process of replacing the take-up core 15 are configured to be executed separately when different conditions are satisfied. Here, the process of replacing the original web roll 11 and the process of replacing the take-up core 15 are not limited to being executed when different conditions are satisfied, and may be executed synchronously when a single condition is satisfied.

[0220] As an example of a modified example in which the process of replacing the raw web roll 11 and the process of replacing the take-up core 15 are performed synchronously, there is a configuration in which, when the amount of adhesive tape T on the operating raw web roll 11 moving to the pay-out position G1 becomes equal to or less than a predetermined value T2, the process of replacing the raw web roll 11 and the process of replacing the take-up core 15 are performed synchronously. In this case, when the tape amount detection sensor 32 detects that the amount of adhesive tape T on the operating raw web roll 11 is equal to or less than the predetermined value T2, the control unit 9 controls each component such as the tape supply unit 3 and the tape recovery unit 5 to perform both the process of step S7 and the process of step S8.

[0221] Another example of a modified example in which the process of replacing the original roll 11 and the process of replacing the take-up core 15 are performed synchronously is a configuration in which, when the amount of unnecessary tape Tn on the operating take-up core 15 moving to the recovery position K1 becomes equal to or greater than a predetermined value M1, the process of replacing the original roll 11 and the process of replacing the take-up core 15 are performed synchronously. In this case, when the tape amount detection sensor 71 detects that the amount of unnecessary tape Tn on the operating take-up core 15 is equal to or greater than the predetermined value M1, the control unit 9 controls each component such as the tape supply unit 3 and the tape recovery unit 5 to perform both the process of step S7 and the process of step S8.

[0222] Also, in a configuration in which the tape supply unit 3 includes the tape amount detection sensor 32 and the tape recovery unit 5 includes the tape amount detection sensor 71, both of the steps S7 and S8 may be executed when either of the sensors detects a predetermined condition. That is, both of the steps S7 and S8 may be executed when either of the conditions that the tape amount detection sensor 32 detects that the amount of the adhesive tape T on the operating original roll 11 is equal to or less than a predetermined value T2 and that the tape amount detection sensor 71 detects that the amount of the unnecessary tape Tn on the operating take-up core 15 is equal to or more than a predetermined value M1 is satisfied.

[0223] In the configuration of this modified example in which steps S7 and S8 are executed synchronously, the frequency with which the tape application process of steps S1 to S5 is stopped to execute the replacement process of step S7 or step S8 can be reduced compared to a configuration in which steps S7 and S8 are executed at different timings. This can further improve the processing efficiency of the adhesive tape application apparatus 1. In addition, because steps S7 and S8 are controlled synchronously, the control program in the control unit 9 can be further simplified.

[0224] (8) In step S8-4 according to the embodiment, the step of joining the unnecessary tape Tn to the unused winding core 15 is performed in a state where the unused winding core 15 is moved from the standby position K2 to the collection position K1, but this is not limited to the above. That is, the unnecessary tape Tn may be joined to the unused winding core 15 in a state where the unused winding core 15 is disposed in the standby position K2. In this case, the step of switching the position of the winding core 15 in step S8-2 is performed after the step of joining the unnecessary tape Tn to the unused winding core 15 in step S8-4.

[0225] (9) In each embodiment, a configuration is illustrated in which the release liner S is peeled off from the adhesive tape T using the liner peeling roller 40 for the tape TS being unwound from the operating raw roll 11, but the configuration that assists in the peeling of the release liner S is not limited to the liner peeling roller 40 which is a roller-shaped member. Another example of a configuration that assists in the peeling of the release liner S is a peeling bar 98 as shown in Figures 38(a) and 38(b). As an example, as shown in Figure 38(a), the peeling bar 98 is a columnar member that extends in the width direction (y direction) of the adhesive tape T and has a tip portion 98a for folding back the release liner S. It is preferable that the angle θ2 of the tip portion 98a is an acute angle.

[0226] 38(b) shows the configuration of a modified example in which a peeling bar 98 is used as an auxiliary member to peel off the release liner S from the adhesive tape T. The peeling bar 98 is arranged so that a tip 98a faces the conveying direction L1 (downstream side) of the adhesive tape T. In this case, as the liner bobbin 13 rotates with the release liner S wound around it, the part of the release liner S of the tape TS unwound from the original roll 11 is folded back by the tip 98a of the peeling bar 98. Then, as the release liner S is pulled while being folded back by the peeling bar 98, the release liner S is peeled off from the adhesive tape T downstream of the guide shaft 23.

[0227] When the angle θ2 of the tip portion 98a is an acute angle, the angle θ1 at which the release liner S is folded back is equal to or greater than 90 degrees and equal to or less than 180 degrees. In this case, since the folded back angle θ1 is sufficiently large, it is possible to more reliably prevent the adhesive residue phenomenon from occurring when the release liner S is peeled off from the adhesive tape T.

[0228] (10) In each embodiment, the system for automatically replacing the original roll 11 in the tape supplying unit 3 and the system for automatically replacing the take-up core 15 in the tape collecting unit 5 have been described as being configured to automatically start operation based on information detected by the tape amount detection sensor 32 or the tape amount detection sensor 71, but the present invention is not limited to this. In other words, the system for automatically replacing the original roll 11 in the tape supplying unit 3 and the system for automatically replacing the take-up core 15 in the tape collecting unit 5 may be configured to start operation based on an instruction input by an operator to the input unit 10. In other words, the processes of steps S6, S7, and S8 may be configured to start when triggered by an operator manually operating the input unit 10. [Explanation of symbols]

[0229] 1 ... Adhesive tape application device (tape processing device) 3 … Tape supply section 4 … Tape application section (tape processing section) 5 … Tape collection section 11 ... Original roll 13 ... Liner bobbin 14 … Hole 15 ... Winding core 16 … Hole 23 ... Guide shaft 25 … Tape holding unit 27 ... Tape cutting mechanism 29 ... Guide roller 31 ... Joint tape making mechanism 32 … Tape amount detection sensor 33 … Movable wall 34 … Raw material roll support shaft 35 ... Bobbin support shaft 36 ... Liner guide roller 37 ... Tape splicing mechanism 38 … Lift rail 39 … Lifting platform 40 ... Liner peeling roller 41 ... Adhesive tape holding member 43 ... Joint tape holding member 45 … Telescopic arm 47 ... Telescopic arm 48 … Cutter holder 49 … Cutter blade 50 … Cutter unit 51 ... Leading tape holding member 52 … Cutter holder 53 ... Cutter blade 54 ... Liner cutting mechanism 55 … Holding table 57 … Tape application unit 59 … Tape cutting unit 60 … Tape peeling unit 65 ... Rotating plate 67 ... Winding core support shaft 69 ... Guide roller 70 … Joint unit 71 ... Tape amount detection sensor W: Wafer (semiconductor workpiece) TS... Tape T: Adhesive tape S... Release liner (separator) Tn...Unnecessary tape Ns: Bonding tape G1 … Feeding position G2 … Ready position K1 … Recovery location K2 … Standby position

Claims

1. a tape supply unit including a plurality of original roll holding units for holding original rolls of adhesive tape, the tape supply unit configured to unwind the adhesive tape from the original roll held by one of the original roll holding units that has moved to a unwinding position; a tape processing unit that performs a predetermined process on a semiconductor workpiece using the adhesive tape fed from the tape supply unit; a tape recovery section including a plurality of winding core holding sections for holding a winding core capable of winding up an unnecessary tape, which is an unnecessary portion of the adhesive tape after the predetermined processing has been performed, and winding and recovering the unnecessary tape in a roll on the winding core held by a winding core holding section that has moved to a recovery position among the winding core holding sections; Equipped with the tape supply unit is configured to be capable of feeding a new web roll to the web roll holding unit moving to a preparation position while feeding the adhesive tape from the web roll moving to the feeding position, The tape recovery unit is configured to be capable of winding and recovering the unnecessary tape onto the take-up core that is moving to the recovery position, while transporting the take-up core from the take-up core holding unit that is moving to a standby position.

2. A tape processing apparatus for semiconductor workpieces comprising:

2. 2. The tape processing apparatus for semiconductor workpieces according to claim 1, The tape supply unit includes: a preparation processing mechanism that performs a preparation process for splicing the adhesive tape by feeding out a portion of the adhesive tape from the web roll that has been moved to the preparation position; a cutting mechanism that cuts the adhesive tape being unwound from the web roll that is moving to the unwinding position, and separates the adhesive tape from the web roll; a position changing mechanism that moves the web roll holding unit that holds the web roll that has been subjected to the preparation process from the preparation position to the payout position; a tape splicing mechanism that splices the adhesive tape cut off from the raw roll by the cutting mechanism and the raw roll that has been subjected to the preparation process and moved to the payout position; 1. A tape processing apparatus for semiconductor workpieces, comprising:

3. 3. The tape processing apparatus for semiconductor workpieces according to claim 2, a tape feed amount detection unit that detects an amount of the adhesive tape wound around the raw roll that is moved to the feed position; a position changing mechanism control unit that controls an operation of the position changing mechanism in response to the amount of the adhesive tape detected by a tape feed amount detection unit; a preparation processing mechanism control unit that controls an operation of the preparation processing mechanism in accordance with the amount of the adhesive tape detected by the tape feed amount detection unit; Equipped with The position change mechanism control unit is when the tape amount detection unit detects that the amount of the adhesive tape wound around the web roll moved to the payout position is equal to or less than a predetermined amount, the position change mechanism is controlled to move the web roll holding unit located at the preparation position to the payout position; The preparation processing mechanism control unit includes: When the unwound tape amount detection unit detects that the amount of the adhesive tape wound around the web roll moving to the unwound position is equal to or less than the predetermined amount, the operation of the preparation processing mechanism is controlled so that the preparation processing is performed on the web roll moving to the preparation position.

2. A tape processing apparatus for semiconductor workpieces comprising:

4. 4. The tape processing apparatus for semiconductor workpieces according to claim 3, The preparation processing mechanism control unit includes: when the tape feed amount detection unit detects that the amount of the adhesive tape wound around the web roll moving to the feed position is equal to or less than a first predetermined amount, the operation of the preparation processing mechanism is controlled so as to perform the preparation processing on the web roll moving to the preparation position; The position change mechanism control unit is when the tape-reel-out amount detection unit detects that the amount of the adhesive tape wound around the web roll moved to the reel-out position is equal to or less than a second predetermined amount, the position change mechanism is controlled to move the web roll holding unit located at the preparation position to the reel-out position, The first predetermined amount is determined as a threshold value that is a larger amount of tape than the second predetermined amount.

2. A tape processing apparatus for semiconductor workpieces comprising:

5. 2. The tape processing apparatus for semiconductor workpieces according to claim 1, The tape recovery unit includes: a waste tape cutting mechanism that cuts the waste tape being fed to the first winding core that is moving to the collection position, and separates the waste tape from the first winding core; a collection section location change mechanism that moves the winding core holding section, which is in the standby position and holds the second winding core, from the standby position to the collection position, and newly positions the second winding core at the collection position; a waste tape splicing mechanism that splices the waste tape cut off from the first winding core by the waste tape cutting mechanism to the second winding core; 1. A tape processing apparatus for semiconductor workpieces, comprising:

6. 6. The tape processing apparatus for semiconductor workpieces according to claim 5, a waste tape detection unit that detects an amount of the waste tape wound around the winding core that is moved to the collection position; a collection unit location change control unit that controls an operation of the collection unit location change mechanism in accordance with the amount of unnecessary tape detected by the unnecessary tape detection unit; Equipped with The collection unit arrangement change control unit is When the unnecessary tape detection unit detects that the amount of the unnecessary tape wound around the take-up core moving to the collection position is equal to or greater than a third predetermined amount, the collection unit location change mechanism is controlled to move the take-up core holding unit, which is in the standby position and holds the second take-up core, to the collection position.

2. A tape processing apparatus for semiconductor workpieces comprising:

7. 2. The tape processing apparatus for semiconductor workpieces according to claim 1, a tape amount detection unit that detects an amount of the adhesive tape wound around the raw roll that is moving to the payout position, and / or a waste tape detection unit that detects an amount of the waste tape wound around the take-up core that is moving to the recovery position, The tape supply unit includes: a preparation processing mechanism that performs a preparation process for splicing the adhesive tape by feeding out a portion of the adhesive tape from the web roll that has been moved to the preparation position; a cutting mechanism that cuts the adhesive tape being unwound from the web roll that is moving to the unwinding position, and separates the adhesive tape from the web roll; a position changing mechanism that moves the web roll holding unit that holds the web roll that has been subjected to the preparation process from the preparation position to the payout position; a tape splicing mechanism that splices the adhesive tape cut off from the raw roll by the cutting mechanism and the raw roll that has been subjected to the preparation process and moved to the payout position; A raw material roll exchange system having The tape recovery unit includes: a waste tape cutting mechanism that cuts the waste tape being fed to the first winding core that is moving to the collection position, and separates the waste tape from the winding core; a collection section location change mechanism that moves the winding core holding section, which is in the standby position and holds the second winding core, from the standby position to the collection position, and newly positions the second winding core at the collection position; a waste tape splicing mechanism that splices the waste tape cut off from the first winding core by the waste tape cutting mechanism and the second winding core moved to the recovery position by the recovery unit arrangement changing mechanism; A winding core exchange system having The raw roll replacement system and the winding core replacement system are The device is controlled to start an operation when the unwound tape amount detection unit detects that the amount of the adhesive tape wound around the raw roll moving to the unwound position is equal to or less than a first threshold value, or when the unnecessary tape detection unit detects that the amount of the unnecessary tape wound around the take-up core moving to the recovery position is equal to or more than a second threshold value.

2. A tape processing apparatus for semiconductor workpieces comprising:

8. 2. The tape processing apparatus for semiconductor workpieces according to claim 1, An input unit for inputting an instruction from an operator, The tape supply unit includes: a preparation processing mechanism that performs a preparation process for splicing the adhesive tape by feeding out a portion of the adhesive tape from the web roll that has been moved to the preparation position; a cutting mechanism that cuts the adhesive tape being unwound from the web roll that is moving to the unwinding position, and separates the adhesive tape from the web roll; a position changing mechanism that moves the web roll holding unit that holds the web roll that has been subjected to the preparation process from the preparation position to the payout position; a tape splicing mechanism that splices the adhesive tape cut off from the raw roll by the cutting mechanism and the raw roll that has been subjected to the preparation process and moved to the payout position; A raw material roll exchange system having The tape recovery unit includes: a waste tape cutting mechanism that cuts the waste tape being fed to the first winding core that is moving to the collection position, and separates the waste tape from the winding core; a collection section location change mechanism that moves the winding core holding section, which is in the standby position and holds the second winding core, from the standby position to the collection position, and newly positions the second winding core at the collection position; a waste tape splicing mechanism that splices the waste tape cut off from the first winding core by the waste tape cutting mechanism and the second winding core moved to the recovery position by the recovery unit arrangement changing mechanism; A winding core exchange system having The raw web roll changing system is controlled to start an operation when an instruction to start changing the raw web roll is input to the input unit, The winding core replacement system is controlled to start an operation when an instruction to start replacing the winding core is input to the input unit.

2. A tape processing apparatus for semiconductor workpieces comprising:

9. A method for replacing an original roll of adhesive tape in a tape processing device for semiconductor work, the method comprising: a tape supplying unit that feeds out the adhesive tape from the original roll held by a first original roll holding unit that has moved to a feeding position among the first original roll holding units; and a tape processing unit that performs a predetermined process on a semiconductor work using the adhesive tape fed from the first tape supplying unit, the method comprising: a preparation process in which a part of the adhesive tape is fed from the roll of the adhesive tape, the roll being in a preparation position provided in the tape supply unit, and a preparation process is performed for splicing the adhesive tape; a cutting process of cutting the adhesive tape being unwound from the original roll at the unwinding position and separating the adhesive tape from the original roll at the unwinding position; a position changing step of moving the web roll holding unit, which holds the web roll that has been subjected to the preparation process, from the preparation position to the payout position; a tape splicing process of splicing the adhesive tape cut off from the raw roll by the cutting mechanism and the raw roll that has been subjected to the preparation process and moved to the payout position; a used roll carrying-out process of carrying out the raw roll separated from the adhesive tape by the cutting mechanism while the adhesive tape is being supplied to the tape processing section from the raw roll at the payout position spliced ​​in the tape splicing process; a raw roll carrying-in process of carrying a new raw roll into the raw roll holding unit at the preparation position after the used roll carrying-out process; A tape replacement method for semiconductor workpieces, comprising:

10. A tape exchange method for semiconductor workpieces, comprising: a tape processing unit which performs a predetermined process on a semiconductor workpiece using an adhesive tape; and a tape recovery unit which includes a plurality of winding core holding units which hold winding cores which can wind up an unnecessary tape, which is an unnecessary portion of the adhesive tape after the predetermined process has been performed, and which winds up and recovers the unnecessary tape in a roll on the winding core held by the winding core holding units which have moved to a recovery position among the winding core holding units, the method comprising: exchanging the winding cores which can wind up the unnecessary tape in a tape processing unit for semiconductor workpieces; a waste tape cutting process for cutting the waste tape that has been unwound onto the first winding core at the recovery position and separating it from the first winding core; a recovery unit location change process in which the winding core holding unit, which is in a standby position provided in the tape recovery unit and holds the second winding core, is moved from the standby position to the recovery position, and the second winding core is newly disposed at the recovery position; a waste tape splicing process for splicing the waste tape separated from the first winding core by the waste tape cutting process to the second winding core; a used winding core carrying-out process for carrying out a first winding core that has been cut off from the unnecessary tape by the unnecessary tape cutting process, while the unnecessary tape is being wound and collected on the winding core at the collection position that has been spliced ​​with the unnecessary tape by the tape splicing process; a winding core introduction process for introducing a new winding core into the original roll holding unit at the standby position after the used winding core removal process; A tape replacement method for semiconductor workpieces, comprising:

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