Manufacturing method of lamination body

Abstract

To provide a manufacturing method of a lamination body to which a foreign material is hardly adhered to a front surface after an implementation of a hydrophilic treatment.SOLUTION: A manufacturing method of a lamination body, containing: a plate-like first member having a first surface; and a plate-like second member having a second surface that faces the first surface, is used in manufacturing the lamination body. The method contains: a hydrophilization step of performing hydrophilization for applying a functional group of a hydrophilic property to the first surface of the first member; a conveyance step of conveying and moving the first member until the first surface of the first member and the second surface of the second member face each other after the hydrophilization step; and a bonding step of adhering the first and second members by contacting the first surface of the first member and the second surface of the second member after the conveyance step by bonding them to form the lamination body. In the conveyance step, the first member is conveyed in a state where the first surface of the first member is coated with a liquid.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a method for producing a laminate used in producing a laminate. [Background technology]

[0002] In order to achieve higher integration of devices such as integrated circuits (ICs), three-dimensional integration has been put to practical use in recent years, in which multiple semiconductor chips are stacked in the thickness direction and connected with through-silicon vias (TSVs), etc. In this three-dimensional integration, for example, multiple wafers on which devices are provided are bonded together by a method such as bonding (see, for example, Patent Document 1).

[0003] Specifically, first, the oxide film constituting the surface of each wafer to be bonded is subjected to a hydrophilic treatment, and hydroxyl groups, which are hydrophilic functional groups, are added to this surface. Next, multiple wafers are stacked so that the surfaces with hydroxyl groups are in contact with each other. As a result, the oxide films constituting the surfaces are bonded together by hydrogen bonds, and a stack (stacked wafers) is obtained in which one wafer is stacked on another. The stack is then subjected to a heat treatment to strengthen the bonding force. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-150172 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, when manufacturing a laminate by the above-mentioned method, fine foreign matter (particles) may adhere to various parts of the wafer. For example, if foreign matter adheres to the surface of each wafer after the hydrophilic treatment, the adhesion between the surfaces is hindered in the part where the foreign matter exists, and defects such as air bubbles are likely to occur.

[0006] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a method for producing a laminate in which foreign matter is less likely to adhere to the surface after hydrophilization treatment. [Means for solving the problem]

[0007] According to one aspect of the present invention, there is provided a method for manufacturing a laminate used in manufacturing a laminate including a first member having a first surface and a second member having a second surface opposing the first surface, the method including: a hydrophilization step of performing a hydrophilization treatment to attach a hydrophilic functional group to the first surface of the first member; a transport step of transporting and moving the first member until the first surface of the first member and the second surface of the second member are in a state where they face each other after the hydrophilization step; and a bonding step of bonding the first member and the second member by contacting the first surface of the first member with the second surface of the second member to form the laminate after the transport step, wherein in the transport step, the first member is transported in a state where the first surface of the first member is covered with a liquid.

[0008] Preferably, the method further comprises, after the hydrophilization step, a cleaning step of cleaning the first surface of the first member that has been subjected to the hydrophilization treatment.

[0009] Also, preferably, in the transporting step, the first member is transported while continuously supplying water as the liquid to the first surface of the first member. Also, preferably, in the transporting step, the first member is transported in a state immersed in water as the liquid.

[0010] Also, preferably, in the hydrophilization step, a hydrophilization treatment is further performed to add hydrophilic functional groups to the second surface of the second member, and in the transport step, the second member is further transported in a state in which the second surface of the second member is covered with liquid. Effect of the Invention

[0011] In the method for manufacturing a laminate according to one aspect of the present invention, when the first member after the hydrophilization treatment is transported, the first surface to which hydrophilic functional groups have been added by the hydrophilization treatment is covered with liquid, so that foreign matter is less likely to adhere to the first surface. Thus, according to one aspect of the present invention, there is provided a method for manufacturing a laminate in which foreign matter is less likely to adhere to the surface after the hydrophilization treatment. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view that typically illustrates a laminate produced in this embodiment. [Diagram 2] FIG. 2 is a cross-sectional view that illustrates a laminate produced in this embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing how the hydrophilic treatment is performed on the first member. [Figure 4] FIG. 4 is a cross-sectional view showing a state in which the first member is cleaned. [Diagram 5] FIG. 5 is a plan view showing how the first member is transported. [Figure 6] FIG. 6 is a cross-sectional view showing a state in which the first member is transported. [Figure 7] FIG. 7 is a cross-sectional view showing a state in which the first member is delivered. [Figure 8] FIG. 8 is a cross-sectional view showing a state in which the first member and the second member face each other. [Figure 9] FIG. 9 is a cross-sectional view showing a state in which the first member and the second member are bonded together. [Figure 10] FIG. 10 is a plan view showing how a first member is transported in a manufacturing method of a laminate according to a modified example. [Figure 11]FIG. 11 is a plan view showing how a first member is transported in a method for manufacturing a laminate according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view that shows a laminate 1 produced in this embodiment, and Fig. 2 is a cross-sectional view that shows the laminate 1. As shown in Figs. 1 and 2, in the method for producing a laminate according to this embodiment, a plate-like first member 11 and a plate-like second member 21 are bonded together by a method called bonding, thereby producing the laminate 1 having a structure in which two plate-like members are stacked.

[0014] The first member 11 is, for example, a disk-shaped wafer made of a semiconductor material such as silicon. That is, the first member 11 has a circular front surface (first surface) 11a and a circular back surface (third surface) 11b opposite the front surface 11a. For example, the front surface 11a side of the first member 11 is divided into a plurality of small regions by a plurality of streets (planned division lines) that intersect with each other, and a device (not shown) such as an integrated circuit (IC) is formed in each small region.

[0015] In this embodiment, a disk-shaped wafer made of a semiconductor material such as silicon is used as the first member 11, but the material, shape, structure, size, etc. of the first member 11 are not limited to this embodiment. For example, a substrate made of other semiconductors, ceramics (including silicate glass, etc.), resin, metal, etc. may be used as the first member 11. Similarly, the type, number, shape, structure, size, arrangement, etc. of the devices are not limited to the above embodiment. For example, the devices may be provided on the back surface 11b side of the first member 11. Also, the first member 11 does not need to have any devices formed thereon.

[0016] The second member 21 is, for example, a disk-shaped wafer of the same type (material, shape, structure, size, etc.) as the first member 11. That is, the second member 21 has a circular front surface (second surface) 21a and a circular back surface (fourth surface) 21b opposite to the front surface 21a. In addition, a plurality of devices (not shown) are formed on the front surface 21a side (or the back surface 21b side) of the second member 21. However, a substrate of a different type from the first member 11 may be used as the second member 21. In addition, the second member 21 may not have devices formed thereon.

[0017] Here, the surface 11a of the first member 11 and the surface 21a of the second member 21 are typically composed of a natural oxide film. Therefore, by performing a hydrophilic treatment on this natural oxide film, the surface 11a and the surface 21a can be later bonded together by hydrogen bonding to form the laminate 1 as shown in FIGS.

[0018] That is, in this state of the laminate 1, the front surface 11a and the front surface 21a are not exposed to the outside. On the other hand, the back surface 11b and the back surface 21b are exposed to the outside as the front surface and the back surface of the laminate 1. Note that the front surface 11a and the front surface 21a may be composed of an oxide film formed by any method such as thermal oxidation, instead of the natural oxide film as described above.

[0019] In the method for manufacturing a laminate according to this embodiment, first, a hydrophilization treatment is performed to attach hydrophilic functional groups to the surface 11a of the first member 11 and the surface 21a of the second member 21 (hydrophilization step). Fig. 3 is a cross-sectional view showing the state in which the hydrophilization treatment is performed on the first member 11. The hydrophilization treatment performed on the second member 21 is substantially the same as the hydrophilization treatment performed on the first member 11. Therefore, a detailed description of the hydrophilization treatment performed on the second member 21 will be omitted here.

[0020] The hydrophilization treatment according to this embodiment is performed, for example, by using an atmospheric plasma device 2 shown in Fig. 3. This atmospheric plasma device 2 is equipped with a table 4 capable of supporting a first member 11, which is a workpiece, on the upper surface. An irradiation head 6 capable of supplying nitrogen plasma or the like toward the table 4 under atmospheric pressure is disposed above the table 4. The irradiation head 6 is connected to a moving mechanism (not shown) and moves in a direction approximately parallel to the upper surface of the table 4 by the power generated by this moving mechanism.

[0021] When performing the hydrophilic treatment on the first member 11, first, the first member 11 is placed on the upper surface of the table 4 so that the surface 11a of the first member 11 faces upward. The first member 11 may be carried onto the table 4 automatically by a conveying mechanism (not shown) such as a robot arm, or may be carried by an operator, i.e., manually.

[0022] Next, the irradiation head 6 irradiates the plasma 31 such as nitrogen plasma toward the first member 11 below while moving by the power of the moving mechanism. This causes the plasma 31 to be supplied to the entire surface 11a of the first member 11, and organic matter adhering to the surface 11a is removed. In addition, hydrophilic functional groups such as -OH (hydroxyl group) are attached to the entire surface 11a.

[0023] The hydrophilic treatment is performed on the second member 21 in a procedure similar to that of the hydrophilic treatment performed on the first member 11. However, if the surface 11a and the surface 21a can be appropriately brought into close contact with each other without performing the hydrophilic treatment on the second member 21, the hydrophilic treatment on the second member 21 may be omitted. In addition, although the method of irradiating the plasma 31 under atmospheric pressure is adopted as the hydrophilic treatment in this embodiment, a method of irradiating the target surface with ultraviolet rays or the like may be adopted as the hydrophilic treatment.

[0024] After the hydrophilic treatment, the surface 11a of the first member 11 and the surface 21a of the second member 21 are washed (washing step). Fig. 4 is a cross-sectional view showing the state in which the first member 11 is washed. The washing treatment performed on the second member 21 is substantially the same as the washing treatment performed on the first member 11. Therefore, a detailed description of the washing treatment performed on the second member 21 will be omitted here.

[0025] The cleaning process according to this embodiment is performed, for example, by using a spin cleaning apparatus 12 shown in Fig. 4. This spin cleaning apparatus 12 is equipped with a spinner table 14 capable of holding a first member 11, which is an object to be cleaned, on its upper surface. A rotation drive source (not shown) such as a motor is connected to the lower part of the spinner table 14, and the spinner table 14 rotates about a rotation axis that is approximately perpendicular to the upper surface of the spinner table 14 and passes through the center of the upper surface of the spinner table 14 by the power generated by the rotation drive source.

[0026] A cleaning nozzle 16 capable of spraying cleaning fluid 33 toward the spinner table 14 is disposed above the spinner table 14. The cleaning nozzle 16 is connected to a moving mechanism (not shown) and moves in a direction generally parallel to the upper surface of the spinner table 14 by power generated by the moving mechanism. As the cleaning fluid 33 sprayed from the cleaning nozzle 16, for example, a liquid such as water (pure water) or a mixed fluid (two-fluid) in which a liquid such as water and a gas such as air are mixed is used.

[0027] When cleaning the first member 11, first, the first member 11 is placed on the upper surface of the spinner table 14 so that the surface 11a of the first member 11 faces upward. Note that the first member 11 may be carried out of the table 4 of the atmospheric plasma device 2 and carried into the spinner table 14 automatically by a transport mechanism (not shown) such as a robot arm, or may be carried out by an operator, i.e., manually.

[0028] Next, the first member 11 is held by the spinner table 14 using a method such as vacuum suction. Thereafter, the spinner table 14 rotates by the power of the rotation drive source, and the cleaning nozzle 16, while moving by the power of the movement mechanism, sprays the cleaning fluid 33 toward the first member 11 below. As a result, the cleaning fluid 33 is supplied to the entire surface 11a of the first member 11, and the surface 11a is cleaned.

[0029] The second member 21 is subjected to a cleaning process in a similar manner to the cleaning process for the first member 11. However, if the surfaces 11a and 21a can be appropriately brought into contact with each other later without performing a cleaning process for the first member 11 and the second member 21, the cleaning process for the first member 11 and the second member 21 may be omitted.

[0030] After the cleaning process, the first member 11 and the second member 21 are transported in order to be bonded together by bonding (transport step). Specifically, first, the first member 11 and the second member 21 are unloaded from the spinner table 14 of the spin cleaning device 12 and transported to a predetermined position (first transport step).

[0031] Fig. 5 is a plan view showing how the first member 11 is conveyed. Fig. 6 is a cross-sectional view showing how the first member 11 is conveyed, showing a cut surface at the position indicated by the dashed line in Fig. 5. Note that some of the procedures, etc. when conveying the second member 21 are substantially the same as some of the procedures, etc. when conveying the first member 11. Therefore, detailed explanations of the procedures, etc. common to the first member 11 and the second member 21 will be omitted here.

[0032] This unloading and transport process is performed, for example, by using a transport mechanism 22 shown in Figures 5 and 6. The transport mechanism 22 includes an arm section 24 having a predetermined length. A rotary drive source (not shown) such as a motor is connected to the base end of the arm section 24, and the arm section 24 rotates around a rotation axis along the length direction of the arm section 24 by power generated by the rotary drive source. In addition, a moving mechanism (not shown) is connected to the base end of the arm section 24, and the tip of the arm section 24 moves along the transport path by power generated by the moving mechanism.

[0033] A columnar support portion 26 is provided at the tip of the arm portion 24. Three rod-shaped edge clamp portions 28 are radially arranged around this support portion 26 at approximately equal angles to each other. For example, each edge clamp portion 28 has a length corresponding to the radius of the first member 11, which is the transported object, and its base end side is supported by the support portion 26. The three edge clamp portions 28 are also arranged on the same imaginary plane.

[0034] One clamp claw 30 is provided on the tip side of each of the three edge clamp portions 28. In other words, the transport mechanism 22 has a total of three clamp claws 30. All of these three clamp claws 30 are arranged on the same side with respect to an imaginary plane on which the three edge clamp portions 28 are arranged.

[0035] Moreover, each clamp claw 30 is configured to be movable along the length direction of the corresponding edge clamp portion 28. Therefore, by disposing the three clamp claws 30 on the outer side of the periphery (edge) of the first member 11 and then moving them closer to each other, the first member 11 is gripped by having its periphery sandwiched between the three clamp claws 30.

[0036] The number of edge clamp units 28 (clamp claws 30) included in the transport mechanism 22 is not limited to the above embodiment. The transport mechanism 22 may include four or more edge clamp units 28 (four or more clamp claws 30). The transport mechanism 22 may be configured so that the edge clamp units 28 and the clamp claws 30 move relative to the support unit 26, rather than each clamp claw 30 moving relative to the corresponding edge clamp unit 28.

[0037] The support portion 26 is provided with a liquid supply path 26a through which a liquid 35 such as water (pure water) flows, so as to penetrate the support portion 26. One end of the liquid supply path 26a opens into one surface 26b of the support portion 26 (the surface on the side on which the clamp claws 30 are not arranged) and is connected to a liquid supply source via a liquid supply pipe 32. The other end of the liquid supply path 26a opens into the other surface 26c of the support portion 26 (the surface on the side on which the clamp claws 30 are arranged) and serves as a liquid discharge port through which the liquid 35 flows out.

[0038] When the first member 11 is carried out from the spinner table 14 of the spin cleaning device 12, for example, the support portion 26 (the tip of the arm portion 24) of the transport mechanism 22 moves to directly above the first member 11 held by the spinner table 14. Next, the height of the support portion 26 is adjusted so that the three clamp claws 30 are positioned outside the periphery (edge) of the first member 11. Thereafter, the three clamp claws 30 move closer to each other. As a result, the first member 11 is held by the transport mechanism 22 with the surface 11a facing upward.

[0039] When the first member 11 is held by the transport mechanism 22, the spinner table 14 releases the hold of the first member 11. Thereafter, the height of the support portion 26 is adjusted so as to move the first member 11 away from the upper surface of the spinner table 14. As a result, the first member 11 is carried out from the spinner table 14. Then, the support portion 26 moves along the transport path by the power of the moving mechanism. That is, the first member 11 is transported along the transport path.

[0040] In this embodiment, for example, after the first member 11 is held by the transport mechanism 22, ejection of the liquid 35 from the liquid ejection port (the other end of the liquid supply path 26a) begins. That is, the liquid 35 begins to be supplied to the surface 11a of the first member 11, the periphery of which is gripped by the three clamp claws 30 below the support portion 26. Then, the surface 11a of the first member 11 is covered with the liquid 35.

[0041] In this manner, when the first member 11 is transported by the transport mechanism 22 while the liquid 35 is continuously supplied to the surface 11a of the first member 11, the first member 11 is transported with the surface 11a covered with the liquid 35. Therefore, in this embodiment, foreign matter is unlikely to adhere to the surface 11a of the first member 11 during this transport.

[0042] The amount of liquid 35 discharged (supplied) from the liquid discharge port is set so that the surface 11a of the first member 11 is adequately covered with the liquid 35, and is typically about 0.5 L / min to 1.5 L / min. As the liquid 35, ammonia water (ammonium hydroxide), hydrofluoric acid (hydrofluoric acid), etc. can be used in addition to water. When ammonia water is used as the liquid 35, -NH 2 When hydrofluoric acid is used as the liquid 35, hydrogen bonding due to -HF is easily generated.

[0043] The first member 11 is transported to a predetermined position by the transport mechanism 22, and then handed over to, for example, an apparatus for bonding the first member 11 and the second member 21 together (second transport step). Fig. 7 is a cross-sectional view showing the manner in which the first member 11 is handed over. In this embodiment, a bonding apparatus 42 shown in Fig. 7 etc. is used as the apparatus for bonding the first member 11 and the second member 21 together.

[0044] The joining device 42 is equipped with a holding mechanism 44 for holding the first member 11 from above. The holding mechanism 44 includes an arm portion 46 having a predetermined length. A moving mechanism (not shown) is connected to the base end side of the arm portion 46, and the tip of the arm portion 46 moves by power generated by this moving mechanism.

[0045] A columnar support portion 48 is provided at the tip of the arm portion 46. A holding pad 50 capable of holding the first member 11 is fixed to the lower end of the support portion 48. A negative pressure source (not shown) such as a vacuum pump is connected to the holding pad 50 via, for example, piping (not shown). Negative pressure generated by the negative pressure source acts on the lower surface of the holding pad 50, so that the first member 11 is adsorbed to the lower surface of the holding pad 50.

[0046] When transferring the first member 11 to the joining device 42, first, the rotation drive source of the transport mechanism 22 rotates the arm portion 24 about the rotation axis along the length direction. As a result, the first member 11 held by the transport mechanism 22 is turned over at a predetermined position (transfer position), and the top and bottom of the first member 11 are switched. In other words, as shown in FIG. 7, the back surface 11b of the first member 11 faces upward.

[0047] After the first member 11 is turned over, even if the liquid 35 is discharged from the liquid discharge port (the other end of the liquid supply path 26a), the liquid 35 is not supplied to the surface 11a of the first member 11 that has been subjected to the hydrophilic treatment. Therefore, it is desirable to stop the discharge of the liquid 35 from the liquid discharge port of the transport mechanism 22 in accordance with the timing at which the first member 11 is turned over. However, the discharge of the liquid 35 may be continued after the first member 11 is turned over, or may be stopped at an earlier timing.

[0048] Next, the holding pad 50 (the tip of the arm portion 46) of the holding mechanism 44 moves directly above the first member 11 held by the transport mechanism 22. Then, the height of the support portion 26 of the transport mechanism 22 and the height of the holding pad 50 of the holding mechanism 44 are relatively adjusted so that the lower surface of the holding pad 50 comes into contact with the upper surface (i.e., the back surface 11b) of the first member 11. Thereafter, when negative pressure from the negative pressure source acts on the holding pad 50, the first member 11 is held by the holding pad 50.

[0049] When the first member 11 is held by the holding pad 50, the three clamp claws 30 of the transport mechanism 22 move away from each other, and the transport mechanism 22 releases the hold of the first member 11. As a result, the first member 11 is transferred from the transport mechanism 22 to the holding mechanism 44 of the joining device 42. As shown in Fig. 7, the surface 11a of the first member 11 that has been transferred to the holding mechanism 44 faces downward, so there is a low possibility that foreign matter will adhere to the surface 11a of the first member 11 thereafter.

[0050] After the first member 11 is handed over to the holding mechanism 44 of the bonding device 42, the first member 11 is further transported inside the bonding device 42 so as to be in a state suitable for bonding by bonding (third transport step). Specifically, the first member 11 is transported by the holding mechanism 44 so as to realize a state in which the surface 11a of the first member 11 and the surface 21a of the second member 21 face each other. Fig. 8 is a cross-sectional view showing the state in which the first member 11 and the second member 21 face each other.

[0051] 8, the joining device 42 further includes a table 52 arranged below the holding mechanism 44. The second member 21 is placed in advance on the upper surface of this table 52 with the surface 21a facing upward. When the holding pad 50 (the tip of the arm portion 46) of the holding mechanism 44 moves directly above the table 52, the surface 11a of the first member 11 and the surface 21a of the second member 21 face each other, and the transport of the first member 11 and the second member 21 is completed.

[0052] The second member 21 is placed on the upper surface of a table 52 included in the bonding device 42 (fourth conveying step) before the procedure of at least bringing the surface 11a of the first member 11 and the surface 21a of the second member 21 into contact with each other. In this embodiment, the second member 21 that has been subjected to the hydrophilic treatment and the cleaning treatment is placed on the upper surface of the table 52.

[0053] First, the second member 21 is carried out from the spinner table 14 of the spin cleaning device 12 by the above-mentioned transport mechanism 22. The detailed procedure may be the same as the procedure for carrying out the first member 11 from the spinner table 14. Next, the second member 21 is carried in onto the upper surface of the table 52 included in the bonding device 42 by this transport mechanism 22.

[0054] Specifically, the second member 21 is moved by the transport mechanism 22 to directly above the table 52. Then, the height of the second member 21 is adjusted so that the lower surface of the second member 21 (i.e., the back surface 21b) comes into contact with the upper surface of the table 52. Thereafter, the hold of the second member 21 by the transport mechanism 22 is released. In this way, when the second member 21 is transported, it is not necessary to turn the second member 21 over.

[0055] For example, after the second member 21 is held by the transport mechanism 22, ejection of the liquid 35 from the liquid ejection port begins. That is, the liquid 35 starts to be supplied to the surface 21a of the second member 21. As a result, the surface 21a of the second member 21 is covered with the liquid 35. Then, the second member 21 is transported by the transport mechanism 22 with the surface 21a covered with the liquid 35.

[0056] In this manner, in this embodiment, the second member 21 is transported with the surface 21a of the second member 21 covered with the liquid 35, so that foreign matter is less likely to adhere to the surface 21a of the second member 21 during this transport. The discharge of the liquid 35 from the liquid discharge port stops when, for example, the second member 21 is placed on the upper surface of the table 52.

[0057] When the cleaning treatment for the first member 11 or the second member 21 is omitted, these are carried out, for example, by the transport mechanism 22 from the table 4 of the atmospheric plasma device 2 and carried into the bonding device 42 in the same procedure as in the embodiment. When both the hydrophilic treatment and the cleaning treatment for the second member 21 are omitted, the second member 21 is carried into the bonding device 42 by any method (including manual work).

[0058] When the transportation of the first member 11 and the second member 21 is completed, the first member 11 and the second member 21 are bonded together under atmospheric pressure (bonding step). Fig. 9 is a cross-sectional view showing the state in which the first member 11 and the second member 21 are bonded together. When bonding the first member 11 and the second member 21 together, as shown in Fig. 9, the height of the holding pad 50 of the holding mechanism 44 is adjusted so that the surface 11a of the first member 11 held by the holding pad 50 of the holding mechanism 44 comes into contact with the surface 21a of the second member 21 on the table 52.

[0059] As described above, in this embodiment, the surface 11a of the first member 11 and the surface 21a of the second member 21 are subjected to a hydrophilic treatment, and hydrophilic functional groups, such as -OH, are attached to the surfaces 11a and 21a. Therefore, when the surface 11a of the first member 11 is brought into contact with the surface 21a of the second member 21, they are adhered to each other by hydrogen bonds, and the laminate 1 in which the first member 11 and the second member 21 are bonded together is completed. The load applied from the holding pad 50 during this bonding is, for example, about 10 kN. However, the load applied from the holding pad 50 is not limited to this.

[0060] After the laminate 1 is obtained, the laminate 1 may be subjected to a heat treatment or the like in order to strengthen the bonding force acting between the first member 11 and the second member 21. The first member 11 and the second member 21 may be bonded together with the surface 11a or the surface 21a wetted with the liquid 35 or the like, or may be bonded together in a dry state. When the surface 11a and the surface 21a are dried, the variation in flatness of the interface involved in bonding is reduced.

[0061] As described above, in the method for manufacturing a laminate according to the present embodiment, when the first member 11 after the hydrophilization treatment is transported, the surface (first surface) 11a to which hydrophilic functional groups have been added by the hydrophilization treatment is covered with the liquid 35, so that foreign matter is less likely to adhere to the surface 11a. This reduces the possibility that foreign matter will hinder adhesion between the surface 11a of the first member 11 and the surface 21a of the second member 21, causing defects such as air bubbles.

[0062] The present invention is not limited to the above-described embodiment, and may be embodied in various modified forms. For example, in the above-described embodiment, the first member 11 is transported while the liquid 35 such as water is continuously supplied to the surface 11a of the first member 11, but the first member 11 may be transported with the surface 11a of the first member 11 immersed in the liquid such as water.

[0063] Fig. 10 is a plan view showing how a first member 11 is conveyed in a laminate manufacturing method according to a modified example. Fig. 11 is a plan view showing how a first member 11 is conveyed in a laminate manufacturing method according to a modified example, and shows a cross section taken at the position indicated by the dashed line in Fig. 10.

[0064] In this modified example, the first member 11 is transported using a transport mechanism 62 shown in Figures 10 and 11. The structure of the transport mechanism 62 is the same as that of the transport mechanism 22 according to the embodiment, except that the transport mechanism 62 includes a support part 64 that does not have a liquid supply path instead of the support part 26 having the liquid supply path 26a.

[0065] A liquid transport mechanism 72 configured to be able to transport the liquid 37 in accordance with the first member 11 is disposed below the transport mechanism 62 according to the modified example. The liquid transport mechanism 72 includes an arm portion 74 having a predetermined length. A moving mechanism (not shown) is connected to the base end side of the arm portion 74, and the tip of the arm portion 74 moves by power generated by this moving mechanism. A liquid tank 76 in which the liquid 37 such as water (pure water) is stored is fixed to the tip of the arm portion 74.

[0066] 10 and 11, in this modification, the first member 11 and the liquid tank 76 move together while the surface 11a of the first member 11 is immersed in the liquid 37 stored in the liquid tank 76. Therefore, when the first member 11 is transported after the hydrophilization treatment, foreign matter is unlikely to adhere to the surface 11a. Note that a flow may be formed in the liquid 37 while the surface 11a of the first member 11 is immersed in the liquid 37.

[0067] In the above-described embodiment, the same atmospheric pressure plasma device 2 is used for the hydrophilic treatment of the first member 11 and the second member 21, but another atmospheric pressure plasma device 2 having a structure similar to the atmospheric pressure plasma device 2 may be used for the hydrophilic treatment of the second member 21. Similarly, another spin cleaning device having a structure similar to the spin cleaning device 12 may be used for the cleaning treatment of the second member 21, and another transport mechanism having a structure similar to the transport mechanism 22 may be used for the transport treatment of the second member 21.

[0068] The hydrophilic treatment, cleaning treatment, transport treatment, and bonding treatment may be performed in one composite device including all of the above-mentioned devices. The bonding of the first member 11 and the second member 21 may be performed in a vacuum state. A chip cut from a wafer may be used as one or both of the first member 11 and the second member 21.

[0069] In addition, the structures, methods, and the like according to the above-described embodiment and each modified example may be implemented in modified forms without departing from the scope of the present invention. [Explanation of symbols]

[0070] 1: Laminate 11: First member 11a: Surface (first side) 11b: Back side (3rd side) 21: Second member 21a: Surface (second side) 21b: Back side (4th side) 31: Plasma 33 :Fluid 35:Liquid 37 :Liquid 2: Atmospheric pressure plasma device 4: Table 6: Irradiation head 12: Spin cleaning device 14: Spinner table 16: Cleaning nozzle 22: Transport mechanism 24: Arm section 26: Support part 26a:Liquid supply path 28: Edge clamp section 30: Clamp jaw 32: Piping 42:Joining device 44: Holding mechanism 46: Arm section 48: Support part 50: Holding pad 52: Table 62: Transport mechanism 64: Support part 72: Liquid transport mechanism 74: Arm section 76:Liquid tank

Claims

1. A method for producing a laminate including a plate-like first member having a first surface and a plate-like second member having a second surface facing the first surface, comprising: a hydrophilization step of performing a hydrophilization treatment to provide a hydrophilic functional group to the first surface of the first member; a conveying step of conveying and moving the first member until the first surface of the first member and the second surface of the second member face each other after the hydrophilization step; a joining step of bonding the first member and the second member to each other by bringing the first surface of the first member into contact with the second surface of the second member after the transporting step, thereby forming the laminate; In the transporting step, the first member is transported in a state in which the first surface of the first member is covered with liquid.

2. The method for producing a laminate according to claim 1 , further comprising, after the hydrophilizing step, a cleaning step of cleaning the first surface of the first member that has been subjected to the hydrophilizing treatment.

3. 3. The method for producing a laminate according to claim 1, wherein in the transporting step, the first member is transported while continuously supplying water as the liquid to the first surface of the first member.

4. 3. The method for producing a laminate according to claim 1, wherein in the transporting step, the first member is transported in a state immersed in water as the liquid.

5. 3. The method for manufacturing a laminate according to claim 1 or 2, wherein in the hydrophilization step, a hydrophilization treatment is further performed to add a hydrophilic functional group to the second surface of the second member, and in the transport step, the second member is further transported in a state in which the second surface of the second member is covered with liquid.

Images