Inspection socket

Abstract

To provide an inspection socket that can cause a large current to flow at the time of inspection for current conduction of a semiconductor integrated circuit.SOLUTION: An inspection socket comprises: a contact probe; a pin block having a through hole for accommodating the contact probe; and an electrically insulating heat radiation member that is located between the pin block and the contact probe, and on an inner side in the through hole in a penetration direction of the through hole, and that transfers heat from the contact probe to the pin block.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an inspection socket. [Background technology]

[0002] 2. Description of the Related Art In order to test electrical characteristics of a semiconductor integrated circuit, a testing socket is known which performs the test by passing a current through an external contact electrode of the semiconductor integrated circuit.

[0003] Patent Documents 1 and 2 disclose such inspection sockets. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-156530 A [Patent Document 2] JP 2018-179671 A Summary of the Invention [Problem to be solved by the invention]

[0005] An example of an object of the present invention is to provide a testing socket that can pass a large current during electrical testing of a semiconductor integrated circuit. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0006] One aspect of the present invention is an inspection socket comprising a contact probe, a pin block having a through hole for accommodating the contact probe, and an electrically insulating heat dissipation member located between the pin block and the contact probe, on the inner side of the through hole in the direction of penetration of the through hole, and which transfers heat from the contact probe to the pin block. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic diagram of one embodiment of a test socket. [Diagram 2] FIG. 2 is a schematic diagram of one embodiment of a contact probe. [Figure 3A] FIG. 3A is a schematic diagram showing the positional relationship between a contact probe and a pin block in a socket of the prior art. [Figure 3B] FIG. 3B is a schematic diagram showing the positional relationship between the contact probes, the pin block, and the heat dissipation member in one embodiment of the inspection socket. [Figure 4A] FIG. 4A is a schematic diagram illustrating one embodiment of a test socket that includes power probes, ground probes, and signal probes. [Figure 4B] FIG. 4B shows a cross-sectional view of the heat dissipation member used in FIG. 4A. [Diagram 5] FIG. 5 is a schematic diagram showing another embodiment of a testing socket including a power probe, a ground probe, and a signal probe. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] The present invention will be specifically described using the following embodiments as examples, but the present invention is not limited thereto. In the present specification, unless there is a specific detailed description of each configuration and its manufacturing method, those skilled in the art can use well-known techniques in this field. Each embodiment can be combined based on ordinary knowledge by those skilled in the art. A configuration not specifically described for each embodiment can have the same configuration as other embodiments or a configuration suitable for that embodiment. In addition, the dimensions shown in each figure are drawn differently from the actual dimensions and dimensional ratios of each configuration for ease of viewing. In this specification, the "upper part" refers to the side where the test object is located, and the "lower part" refers to the side where the test circuit is located.

[0009] Fig. 1 is a schematic diagram of one embodiment of a test socket 100, and Fig. 2 is a schematic diagram of one embodiment of a contact probe 10.

[0010] The inspection socket 100 in FIG. 1 includes a contact probe 10, a pin block 20, a heat dissipation member 30, a pin plate 40, an upper electrical insulating member 51, and a lower electrical insulating member 52. Here, the pin block 20 is made of metal and has a through hole 21 for accommodating the contact probe 10. The heat dissipation member 30 is electrically insulating, and is located between the pin block 20 and the contact probe 10, on the inner side of the through hole 21 in the penetration direction of the through hole 21, and transmits heat from the contact probe 10 to the pin block 20. The pin plate 40 is made of metal and is located below the pin block 20. The upper electrical insulating member 51 prevents electrical conduction between the contact probe 10 and the pin block 20. The lower electrical insulating member 52 prevents electrical conduction between the contact probe 10 and the pin plate 40.

[0011] The contact probe 10 in Fig. 2 has an upper plunger 1, a lower plunger 2, a spring member 3, and a cylindrical body 4 surrounding them. Here, the upper plunger 1 brings the contact probe 10 into contact with an object to be tested, and the lower plunger 2 brings the contact probe 10 into contact with a test circuit. This electrically connects the object to be tested and the test circuit via the upper plunger 1, cylindrical body 4, spring member 3, and lower plunger 2. Note that in Fig. 2, only a cross section of the cylindrical body 4 is drawn in order to show the internal structure of the contact probe 10.

[0012] It was found that the elastic operating performance of the contact probe 10 is reduced when a large current is passed through an inspection target such as a semiconductor integrated circuit. Analysis of the cause of this revealed that the contact probe 10 becomes too hot due to Joule heat, and in particular, the spring member 3 becomes too hot. The present inventors conducted various studies on the materials of each component of the contact probe 10 in order to prevent the contact probe 10 from becoming too hot. However, among the various measures considered, the present inventors found that using an electrically insulating heat dissipation member 30 that transfers heat from the contact probe 10 to the pin block 20 is particularly effective.

[0013] Even in conventional sockets, there was only a small gap of about 0.1 to 0.3 mm between the contact probe 10 and the pin block 20. Therefore, it was not thought that this gap would have a significant effect on heat transfer between the contact probe 10 and the pin block 20. The inventors of the present invention unexpectedly found that effective temperature control measures could be implemented simply by using the heat dissipation member 30 to fill this small gap.

[0014] The contact probe 10 is usually a cylindrical member that is long in the axial direction. In the inspection socket 100, a large number of the contact probes 10 are usually arranged side by side at a pitch of several hundred microns.

[0015] An upper plunger 1 of a contact probe 10 has a pin-shaped portion 1a and a cylindrical portion 1b having a diameter larger than that of the pin-shaped portion 1a, and the pin-shaped portion 1a comes into contact with an object to be inspected, such as an external contact electrode of a semiconductor integrated circuit.

[0016] The lower plunger 2 of the contact probe 10 also has a pin-shaped portion 2a and a cylindrical portion 2b having a diameter larger than that of the pin-shaped portion 2a, and the pin-shaped portion 2a comes into contact with the test circuit. This allows an electrical connection between the test object and the test circuit via the contact probe 10. The test circuit is a well-known element in this field, and can generate a signal to be supplied to the test object in order to test the electrical characteristics of the test object.

[0017] The spring member 3 of the contact probe 10 is composed of a coil spring made of piano wire or stainless steel wire. The spring member 3 is located between the upper plunger 1 and the lower plunger 2, and biases them in a direction away from each other. The elastic properties of the spring member 3 allow the upper plunger 1 and the lower plunger 2 to come into contact with the test object and the test circuit without applying excessive force to them.

[0018] The cylindrical body 4 of the contact probe 10 is a cylindrical body with at least one end open, and is made of a conductive material. The cylindrical body 4 can be made of a metal material such as beryllium copper, and may be further plated with gold or the like. The cylindrical body 4 surrounds the upper plunger 1, the lower plunger 2, and the spring member 3 by at least partially surrounding them from the outside in the circumferential direction. Each open end at both ends of the cylindrical body 4 is bent inward to form a locking portion, which prevents the upper plunger 1 and the lower plunger 2 from coming off the cylindrical body 4. The cylindrical body 4 of the contact probe 10 may be fixed to either the upper plunger 1 or the lower plunger 2, with one end closed on the fixed side and the other end open on the non-fixed side, or both ends may be open as shown in FIG. 2.

[0019] The cylindrical body 4 has an inner diameter larger than the diameters of the upper plunger 1, the lower plunger 2, and the spring member 3 so as to surround these members. The inner diameter of the cylindrical body 4 is, for example, in the range of 250 μm to 260 μm. The outer diameter of the cylindrical body 4 can constitute the outer diameter of the contact probe 10, and its size is, for example, in the range of 320 μm to 330 μm. The difference between the inner diameter and the outer diameter of the cylindrical body 4, i.e., the thickness of the cylindrical body 4, is, for example, in the range of 60 μm to 80 μm.

[0020] The pin block 20 has a through hole 21 for accommodating the contact probe 10. The through hole 21 is a stepped hole having a large diameter hole 23 that is larger than the outer diameter of the contact probe 10, and a small diameter hole 22 at the upper opening. A large number of the through holes 21 can be arranged at a pitch of several hundred microns to correspond to the arrangement of a large number of the contact probes 10. In this specification, the "penetration direction of the through hole" refers to the direction along the axial direction of the contact probe 10, and the axial direction of the contact probe 10 and the penetration direction of the through hole can be coaxial.

[0021] In the embodiment of Fig. 1, the pin block 20 is made of metal, but the material can be changed depending on the application of the inspection socket 100. For example, the pin block 20 may be made of an electrically insulating material such as resin. However, when a high-frequency signal is used during inspection, it is preferable that the pin block 20 is made of an electrically conductive material such as metal. This is because the contact probe 10 and the pin block 20 can be considered to have a similar configuration to a coaxial cable, and when a high-frequency signal is provided by the contact probe 10, which is the inner conductor, the pin block, which is the outer conductor, provides a shielding effect.

[0022] When the pin block 20 is made of an electrically conductive material, it is preferable to place an upper electrical insulating member 51 between the upper plunger 1 of the contact probe 10 and the pin block 20 in order to prevent electrical conduction between the contact probe 10 and the pin block 20. On the other hand, when the pin block 20 is made of an electrically insulating material, the upper electrical insulating member 51 is not necessary.

[0023] The heat dissipation member 30 is located between the pin block 20 and the contact probe 10, and is located on the inner side of the through hole 21 in the through hole 21 in the through hole 21 penetration direction. Here, "located on the inner side of the through hole" refers to a portion of the through hole 21 of the pin block 20 other than the vicinity of the opening of the through hole 21, for example, located in the portion in the through hole 21 where the large diameter hole 23 is formed. In an embodiment in which the pin plate 40 is present, "located on the inner side of the through hole" refers to a portion of the pin plate side through hole 41 of the pin plate 40 other than the vicinity of the opening of the pin plate side through hole 41 in addition to the above portion, and also refers to a portion of the pin plate side through hole 41 where the large diameter hole 43 is formed. It is sufficient that the heat dissipation member 30 is located along at least a part of the length of the through hole 21 in the through hole penetration direction. The shape of the heat dissipation member 30 is not particularly limited, but it is preferable that the heat dissipation member 30 has a tubular shape surrounding the periphery of the contact probe 10, because the heat from the contact probe 10 can be effectively transferred to the pin block 20. It is preferable that heat dissipation member 30 surrounds contact probe 10 in the circumferential and axial directions as much as possible, but it is not necessary for heat dissipation member 30 to surround contact probe 10 in part.

[0024] When the heat dissipation member has a tubular shape or the like, the difference between the inner diameter and the outer diameter of the heat dissipation member, i.e., the thickness of the heat dissipation member, may be, for example, 30 μm or more, 50 μm or more, 70 μm or more, 80 μm or more, or 100 μm or more, and may be 200 μm or less, 150 μm or less, 120 μm or less, 100 μm or less, or 80 μm or less. The thickness of the heat dissipation member is, for example, in the range of 30 μm or more to 200 μm or less, or 50 μm or more to 120 μm or less. The inner diameter of the heat dissipation member can be calculated from the gap d2 between the outer diameter of the contact probe 10 and the inner diameter of the heat dissipation member 30 described below with respect to FIG. 3B.

[0025] The heat dissipation member 30 is a member having electrical insulation to prevent conduction between the contact probe 10 and the pin block 20. On the other hand, the heat dissipation member 30 is not particularly limited as long as it is configured to increase the thermal conductivity and heat transferability from the contact probe 10 to the pin block 20. The heat dissipation member 30 preferably has a heat resistance of, for example, 200°C or more. The heat dissipation member 30 may be, for example, a ceramic such as silica, alumina, zirconia, barium titanate, silicon carbide, silicon nitride, or aluminum nitride. The heat dissipation member 30 may also include an electrically conductive material having an electrically insulating layer on the surface, and examples of the electrically insulating layer include, in addition to a ceramic layer, a resin layer such as a fluorine-based resin, polyphenylene sulfide, or polyimide, in particular a resin coating layer, but are not limited thereto. Examples of the electrically conductive material include metals, and examples of the electrically conductive material include, for example, copper-based metals such as beryllium copper, but are not limited thereto.

[0026] The heat dissipation member 30 may be disposed inside the through hole 21 of the pin block 20 without being supported by any other member. For example, in the case of the embodiment shown in Fig. 1, such a configuration can be obtained by forming or disposing an upper electrical insulating member 51 in the through hole 21 of the pin block 20, then disposing the contact probe 10 and the heat dissipation member 30, and further fixing the pin plate 40 on which the lower electrical insulating member 52 is formed or disposed to the pin block 20.

[0027] The upper electrical insulating member 51 is made of insulating material such as resin and is configured in a surrounding shape. As shown in FIG. 1, the upper electrical insulating member 51 has a large-diameter inner peripheral portion 51a for accommodating the end of the cylindrical body 4 of the contact probe 10 and a small-diameter inner peripheral portion 51b through which the upper plunger 1 of the contact probe 10 is inserted. The upper electrical insulating member 51 has a large-diameter outer peripheral portion 51a' having the same diameter as the large-diameter hole of the through hole 21 of the pin block 20 and a small-diameter outer peripheral portion 51b' for fitting into the small-diameter hole 22 of the through hole 21 on the outside. This prevents the upper electrical insulating member 51 from coming off the pin block 20. The lower electrical insulating member 52 also has a similar configuration to the upper electrical insulating member 51 with respect to the plate-side through hole 41.

[0028] Fig. 3A is a schematic diagram showing the positional relationship between a contact probe 10 and a pin block 20 in a socket of the prior art. Fig. 3B is a schematic diagram showing the positional relationship between a contact probe 10, a pin block 20, and a heat dissipation member 30 of the present embodiment.

[0029] 3A and 3B, the diameter of the contact probe 10 is, for example, about 300 μm, and the diameter (inner diameter) of the through hole 21 of the pin block 20 in which the contact probe 10 is housed is, for example, about 750 μm. Therefore, the gap d1 between the contact probe 10 and the pin block 20 shown in FIG. 3A is, for example, about 200 μm.

[0030] In contrast, the gap d2 formed by the outer diameter of the contact probe 10 and the inner diameter of the heat dissipation member 30, and the gap d3 formed by the inner diameter of the pin block 20 and the outer diameter of the heat dissipation member 30 shown in FIG. 3B may be 50 μm or less, 30 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less on average. It is preferable that the gap d2 and the gap d3 do not exist from the viewpoint of heat conduction and heat transfer, but from the viewpoint of ensuring the manufacturing tolerance of each member and facilitating the manufacturing of the inspection probe, they may be 1 μm or more, 3 μm or more, 5 μm or more, or 10 μm or more. The gap d2 and the gap d3 may be, for example, 1 μm or more to 30 μm or less, or 3 μm or more to 10 μm or less.

[0031] The pin plate 40 is located below the pin block 20 and is fixed vertically to the pin block 20. The pin plate 40 has a plate-side through hole 41 at a position communicating with the through hole 21 of the pin block 20, and holds one end of the contact probe 10 exposed. The plate-side through hole 41 is a stepped hole having a large diameter hole 43 that is larger in diameter than the outer diameter of the contact probe 10, and a small diameter hole 42 at the opening portion at the bottom.

[0032] 1, the pin block 20 is made of metal, but the material can be changed depending on the application of the inspection socket 100. The pin plate 40 may also be made of an electrically insulating material such as resin, but is preferably made of an electrically conductive material such as metal when a high-frequency signal is used during inspection. A configuration in which both the pin block 20 and the pin plate 40 are made of metal can provide a higher shielding effect than a configuration in which only the pin block 20 is made of metal, resulting in a configuration with better high-frequency characteristics.

[0033] When the pin plate 40 is made of an electrically conductive material, it is preferable to place a lower electrical insulating member 52 between the lower plunger 2 of the contact probe 10 and the pin plate 40 in order to prevent electrical conduction between the contact probe 10 and the pin plate 40. On the other hand, when the pin plate 40 is made of an electrically insulating material, the lower electrical insulating member 52 is not necessary.

[0034] 4A shows an embodiment in which the inspection socket 100 includes a power probe 11, a ground probe 12, and a signal probe 13 as contact probes 10. Since the power probe 11 can reach high temperatures due to the large current that flows through it, a heat dissipation member 30 is located between the power probe 11 and the pin block 20. On the other hand, as shown in this embodiment, the heat dissipation member 30 does not have to be present between the ground probe 12 and the signal probe 13 and the pin block 20.

[0035] In this embodiment, since the pin plate 40 is made of an electrically insulating resin, there is no lower electrical insulating member 52 between each probe and the pin plate 40. On the other hand, since the pin block 20 is made of an electrically conductive metal, an upper electrical insulating member 51 is disposed between the power supply probe 11 and the signal probe 13 and the pin block 20 to prevent electrical conduction therebetween. Since the ground probe 12 may be electrically connected to the pin block 20, no upper electrical insulating member 51 is disposed between the ground probe 12 and the pin block 20.

[0036] 4B shows a cross-sectional view of the heat dissipation member 30 used in FIG. 4A. In this embodiment, the heat dissipation member 30 includes a tubular metal 31 and an electrical insulation layer 32 formed on the surface of the tubular metal 31. In this embodiment, the electrical insulation layer 32 is formed on both the inner surface and the outer surface of the tubular metal 31, but the electrical insulation layer 32 may be formed on only one of the inner surface and the outer surface of the tubular metal 31.

[0037] Fig. 5 is the same as the embodiment in Fig. 4A except that the pin plate 40 is made of metal and the heat dissipation member 30 is made of ceramic. Since the pin plate 40 is made of metal, in the embodiment in Fig. 5, in addition to the upper electrical insulating member 51 between the power supply probe 11 and the signal probe 13 and the pin block 20, a lower electrical insulating member 52 is arranged between the pin plate 40 to prevent electrical conduction therebetween. EXAMPLES

[0038] A heat dissipation member was prepared by coating the inner and outer surfaces of a tubular beryllium copper sheet with polyimide by electrodeposition coating.

[0039] Six contact probes were inserted into six adjacent through holes of a pin block having an upper insulating member. The prepared heat dissipation member tube was inserted into the through holes so as to cover each of the contact probes. The tubes were then fixed with a pin plate to prepare an inspection socket of the embodiment. A comparative inspection socket was also prepared in the same manner, without using a heat dissipation member.

[0040] In this experiment, instead of connecting the external contact electrodes of the testing circuit and the semiconductor integrated circuit to the testing socket, a device was created that can simultaneously apply current by connecting the lower current-carrying board and the upper current-carrying board so that six contact probes are in series. This makes it possible to measure temperature by passing a large current through the contact probes.

[0041] The maximum temperatures of the probes of the inspection sockets of the embodiment and the comparative example were measured by a thermograph when the temperature became constant by gradually increasing the current applied to the contact probe at room temperature. As a result, the maximum temperatures shown in the following table were measured for the same standard current value.

[0042] [Table 1]

[0043] In this way, when a current of 1.0 was applied, the temperature rose to 49.2°C in the comparative example in which a heat dissipation member was not used, but when the same current was applied, the temperature was suppressed to 42.3°C in the example in which a heat dissipation member was used. When a current 4.0 times that was applied, the temperature rose to 244.3°C in the inspection socket of the comparative example, and it was overheated to a level that affected the elastic operation of the contact probe. In contrast, the inspection socket of the example to which the same current was applied was suppressed to 207.2°C. In addition, when a standard current value of 3.5 times was applied, the temperature difference between the example and the comparative example was the largest, and the temperature of the inspection socket of the example was 41.2°C lower. Since the elastic operation of the contact probe may be affected at around 200°C, it was very advantageous that the temperature difference was large around this temperature.

[0044] Next, a first heat dissipation member having a tubular shape and made of aluminum nitride was fabricated as a heat dissipation member, and a second heat dissipation member was fabricated by subjecting the surface of a tubular copper (C3604) to an electrical insulating treatment.

[0045] The second heat dissipation member was set on a pin block together with contact probes, and a current was applied to one of the probes. Similarly, a current was applied to one of the probes without using a heat dissipation member.

[0046] The maximum temperature of the probe when 4.05 times the standard current value was applied to an experimental device using a heat dissipation component was roughly the same as the temperature when 3.13 times the standard current value was applied to an experimental device not using a heat dissipation component.

[0047] Therefore, it was confirmed that when the heat dissipation member was used, the temperature was less likely to become high even when a larger current value was passed through it. This was also found to be true when the first heat dissipation member was used.

[0048] According to the present specification, there is provided an inspection socket having the following aspects. (Aspect 1) Aspect 1 is an inspection socket 100 comprising a contact probe 10, a pin block 20 having a through hole 21 for accommodating the contact probe 10, and an electrically insulating heat dissipation member 30 located between the pin block 20 and the contact probe 10, on the inner side of the through hole 21 in the penetrating direction of the through hole 21, and which transfers heat from the contact probe 10 to the pin block 20.

[0049] According to the above aspect, the use of heat dissipation member 30 makes it possible to prevent contact probe 10 from becoming too hot even if a large current is passed through contact probe 10. This makes it possible to prevent performance of contact probe 10 from deteriorating, so that a large current can be passed through contact probe 10 to test an object to be tested. The higher the performance of a semiconductor integrated circuit, the greater the current that must be passed through it to perform the test. Taking into account future improvements in the performance of semiconductor integrated circuits, therefore, testing socket 100 of this aspect is extremely advantageous.

[0050] (Aspect 2) In a second aspect, the heat dissipation member 30 has a tubular shape surrounding the periphery of the contact probe.

[0051] According to the above embodiment, the heat dissipation member 30 can effectively transfer heat from the contact probe 10 to the pin block 20, resulting in high heat dissipation properties, and allowing a larger current to flow through the contact probe 10 to inspect the inspection object.

[0052] (Aspect 3) In the third embodiment, the heat dissipation member 30 includes a ceramic or a metal having an electrically insulating layer on the surface.

[0053] According to the above-described embodiment, ceramics and metals having an electrically insulating layer on their surfaces can achieve both high thermal conductivity and electrical insulation, so that the heat dissipation member 30 has high heat dissipation properties and a large current can be passed through the contact probe 10 to inspect the inspection object.

[0054] (Aspect 4) In a fourth aspect, the gap between the heat dissipation member 30 and the contact probe 10, or the gap between the heat dissipation member 30 and the pin block 20, is 50 μm or less on average.

[0055] According to the above embodiment, heat can be easily transferred from the contact probe 10 to the pin block 20, so that the inspection socket 100 has high heat dissipation properties, and a larger current can be passed through the contact probe 10 to inspect the inspection object.

[0056] (Aspect 5) In the fifth aspect, the contact probe 10 includes an upper plunger 1 that connects to the object to be tested, a lower plunger 2 that connects to a testing circuit, a spring member 3 positioned between the upper plunger 1 and the lower plunger 2, and a cylindrical body 4 that surrounds these.

[0057] According to the above aspect, the configuration of the contact probe 10 is specified.

[0058] (Aspect 6) The sixth embodiment includes an electrical insulating member 50 between the upper plunger 1 and the pin block 20.

[0059] According to the above embodiment, even if the pin block 20 is made of metal, electrical insulation between the upper plunger 1 and the pin block 20 can be easily obtained.

[0060] (Aspect 7) The seventh embodiment further includes a pin plate 40 on the lower part of the pin block 20, and includes an electrical insulating member 50 between the lower plunger 2 and the pin plate 40.

[0061] According to the above embodiment, even if the pin plate 40 is made of metal, electrical insulation between the lower plunger 2 and the pin block 20 can be easily obtained.

[0062] (Aspect 8) In the eighth aspect, the contact probe 10 includes a power probe 11 , a ground probe 12 and a signal probe 13 , and the heat dissipation member 30 is located between the power probe 11 and the pin block 20 .

[0063] According to the above embodiment, the amount of heat generated in the power supply probe 11 can be effectively transferred to the pin block 20. [Explanation of symbols]

[0064] 1...Upper plunger 2…Lower plunger 3...Spring member 4...Cylindrical body 10…Contact probe 11…Power supply probe 12…Ground probe 13...Signal probe 20…Pin block 21...Through hole 22…Small diameter hole 23...Large diameter hole 30...Heat dissipation member 31...metal 32...Electrical insulation layer 40…Pin plate 41...Pin plate side through hole 42…Small diameter hole 43...Large diameter hole 50...Electrical insulating material 51...Upper electrical insulating member 51a…Large diameter inner circumference 51a'...Large diameter outer periphery 51b…Small diameter inner circumference 51b'...Small diameter outer periphery 52...Lower electrical insulation member 100...Inspection socket

Claims

1. A contact probe; a pin block having a through hole for accommodating the contact probe; a heat dissipation member that is between the pin block and the contact probe, is located inside the through hole in the through hole's penetration direction, and is electrically insulating and dissipates heat from the contact probe to the pin block; An inspection socket comprising:

2. 2. The inspection socket according to claim 1, wherein the heat dissipation member has a tubular shape surrounding the periphery of the contact probe.

3. 2. The test socket of claim 1, wherein the heat dissipation member comprises a ceramic or a metal having an electrically insulating layer on a surface thereof.

4. 2. The inspection socket according to claim 1, wherein a gap between said heat dissipation member and said contact probe or a gap between said heat dissipation member and said pin block is 50 [mu]m or less on average.

5. 2. The inspection socket according to claim 1, wherein the contact probe includes an upper plunger that connects to an object to be inspected, a lower plunger that connects to a testing circuit, a spring member positioned between the upper plunger and the lower plunger, and a cylindrical body that surrounds these.

6. 6. The test socket of claim 5 including an upper electrical insulator between said upper plunger and said pin block.

7. 6. The test socket of claim 5, further comprising a pin plate below said pin block, including a lower electrical insulator between said lower plunger and said pin plate.

8. 2. The inspection socket of claim 1, wherein the contact probes include a power probe, a ground probe, and a signal probe, and the heat dissipation member is located between the power probe and the pin block.

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