Electronic device

Abstract

To provide an electronic device in which a plurality of modules can be densely arranged.SOLUTION: The electronic device according to an embodiment includes: a plurality of modules, at least a part of which is arranged face to face or adjacent to one another; and a connection unit in which the modules are provided in sites adjacent to each other or facing each other, the connection unit having a plurality of connection members provided to the modules, respectively, and the connection members are connected to one another.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present invention relate to electronic devices. [Background technology]

[0002] In electronic devices that include multiple modules, each including a board and electronic components mounted on the board, a structure for connecting the multiple modules is adopted in which multiple module boards are inserted into a backplane that has a structure for inserting the module boards. In addition, with the trend toward further increasing density and miniaturization, stacked structures in which one or more daughter boards are mounted on multiple module boards and structures that use expansion slots are also known.

[0003] In such electronic devices, measures are taken to prevent physical interference between adjacent modules, such as ensuring sufficient gaps, etc. Therefore, there is a demand for a configuration that allows multiple modules to be arranged at high density. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-58093 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the present invention is to provide an electronic device in which a plurality of modules can be arranged at high density. [Means for solving the problem]

[0006] The electronic device according to the embodiment comprises a plurality of modules, at least a portion of which is arranged adjacent or facing each other, and a connection portion provided at a location where the plurality of modules are adjacent or facing each other, the connection portion having a plurality of connection members respectively provided on the plurality of modules, and to which the plurality of connection members are connected. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view of an electronic device according to a first embodiment. [Diagram 2] FIG. [Diagram 3] FIG. 2 is a plan view showing a configuration of an electronic module of the electronic device. [Figure 4] FIG. 2 is a cross-sectional view showing a schematic enlarged view of the configuration of the electronic device. [Diagram 5] FIG. 2 is an explanatory diagram showing a configuration of a connection portion of the electronic device. [Figure 6] FIG. 2 is an explanatory diagram showing a configuration of a connection portion of the electronic device. [Figure 7] FIG. 13 is an explanatory diagram showing a configuration of an electronic device according to another embodiment. [Figure 8] FIG. 13 is an explanatory diagram showing a configuration of an electronic device according to another embodiment. [Figure 9] FIG. 13 is an explanatory diagram showing a configuration of a connection portion of an electronic device according to another embodiment. [Figure 10] FIG. 13 is an explanatory diagram showing a configuration of a connection portion of an electronic device according to another embodiment. [Figure 11] FIG. 13 is an explanatory diagram showing a configuration of a connection portion of an electronic device according to another embodiment. [Figure 12] FIG. [Figure 13] FIG. 13 is an explanatory diagram showing a configuration of an electronic device according to another embodiment. [Figure 14] FIG. 13 is an explanatory diagram showing a configuration of an electronic device according to another embodiment. [Figure 15] FIG. 13 is an explanatory diagram showing a configuration of a connection portion of an electronic device according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] An electronic device 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 6. FIG. 1 is a perspective view of an electronic device according to a first embodiment, and FIG. 2 is a cross-sectional view showing the configuration of the electronic device. FIG. 3 is a plan view showing the configuration of an electronic module of the electronic device, and FIG. 4 is a cross-sectional view showing a schematic enlarged view of the configuration of the electronic device. FIG. 5 is an explanatory view showing the configuration of a connection part of the electronic device, and FIG. 6 is an explanatory view showing the configuration of a connection part of the electronic device. In each figure, the configuration is appropriately enlarged, reduced, or omitted for the purpose of explanation. In the figures, arrows X, Y, and Z respectively indicate three directions perpendicular to each other. As an example, the X axis indicates a posture in which the electronic device is arranged along the first direction, which is the stacking direction (parallel direction), and the Y axis indicates a posture in which the electronic device is arranged along the second direction, which is the insertion direction.

[0009] The electronic device 1 includes a housing 10, a backplane 20, a plurality of main boards 30, a sub-board 40 mounted on each of the main boards 30, and a connection section 50. For example, a plurality of electronic modules 60 (modules) each composed of the main boards 30 and the sub-boards 40 are arranged in the housing 10. For example, the electronic device 1 is a communication control device for an aircraft, etc.

[0010] The housing 10 is configured in a rectangular parallelepiped shape and forms a rectangular parallelepiped storage space S1 in which a stacked structure in which a plurality of main boards 30 are stacked is disposed. That is, the housing 10 accommodates a stacked structure of electronic modules 60 including a backplane 20 and a plurality of board bodies 31. For example, the housing 10 includes a rectangular back plate 11 and four side plates 12 to 15 that are erected from the four sides of the periphery of the back plate 11 along a direction perpendicular or intersecting the surface of the back plate 11, and a rectangular opening 16 that opens forward on the opposite side to the back plate 11 is formed. In the storage space S1 of the housing 10, the backplane 20 is disposed along the back plate 11. The shape of the housing 10 can be appropriately set according to the surrounding members. For example, the inner surfaces of a pair of side plates 12, 14 that face each other among the plurality of side plates 12 to 15 are disposed in close proximity to or in contact with both side edges of the plurality of board bodies 31. For example, a slot structure having projections and recesses along the insertion direction, which is the depth direction of the housing 10, and guiding the insertion direction of both side edges of the board body 31 may be provided at a predetermined position on the inside of a pair of side plates 12, 14. Also, a plate that faces the back plate 11 and closes the opening 16 may be provided at the front part of the housing 10.

[0011] The backplane 20 is a circuit board on which various wiring and terminals are formed, and includes a plurality of connectors 21 on which a board body 31 is mounted. Each connector 21 has a plurality of terminal pins to which terminal portions on one end side of the board body 31 of the main board 30 are connected, and engages with the board body 31. The board bodies 31 are connected to the respective connectors 21 provided on the mounting surface of the backplane 20, and electronic modules 60 are mounted on the respective connectors 21.

[0012] The main board 30 is, for example, a circuit board, and includes a board body 31 configured in a plate shape having a front surface and a back surface as a pair of main surfaces, and various terminals, wiring, and various electronic components 33 mounted on the board body 31. In this embodiment, a sub-board 40 mounting electronic components 43 is mounted on each of the front surface 31a and the back surface 31b of the board body 31. Note that, in addition to the above, various electronic components and various wiring patterns may be provided on the front surface 31a and the back surface 31b of the board body 31.

[0013] For example, the substrate body 31 is mounted on the backplane 20 by inserting an edge portion having a terminal on one end side into the connector 21. For example, the substrate body 31 may be a multilayer substrate having a wiring layer. Each substrate body 31 is erected perpendicular to or intersecting with the surface direction of the backplane 20. The multiple substrate bodies 31 are arranged in multiple rows at a predetermined pitch in a first direction, which is the stacking direction.

[0014] A sub-substrate 40 is mounted on the main surface of the substrate body 31. As an example in this embodiment, the sub-substrate 40 is disposed on each of the front and back surfaces of the multiple substrate bodies 31. The front and back surfaces of the substrate bodies 31 extend along a plane perpendicular to the first direction. For example, in addition to the sub-substrate 40, various electronic components and various wiring patterns may be provided on the substrate body 31.

[0015] The sub-board 40 includes a board body 41 and one or more electronic components 43 mounted on the board body 41 .

[0016] The substrate body 41 is mounted on the front and back surfaces that intersect with the stacking direction of the multiple substrate bodies 31. The substrate body 41 is, for example, a circuit board. Electronic components are mounted on the substrate body 41. In addition to the above, various electronic components 43 and various wiring patterns may be provided on the front and back surfaces of the substrate body 41.

[0017] The substrate bodies 41 mounted on the multiple substrate bodies 31 facing each other are disposed adjacent to each other. As an example, the substrate bodies 41 disposed on the front and back surfaces of the adjacent substrate bodies 31 are disposed adjacent to each other. As an example, a pair of substrate bodies 41 are disposed at different positions in the stacking direction and disposed adjacent to each other in a plane direction intersecting with the stacking direction. The substrate bodies 41 may be disposed opposite or adjacent to each other in the stacking direction. As an example of the position of the adjacent portion 62 between the electronic modules 60, for example, a connection portion 50 is provided in the adjacent portion 42 where the multiple substrate bodies 41 are disposed adjacent to each other.

[0018] The connection section 50 is disposed in an adjacent section 42 where the sub-substrates 40 are adjacent to or facing each other. For example, the connection section 50 includes a plurality of connection members 51, 52 that are respectively connected to the plurality of substrate bodies 41. For example, the connection section 50 includes a first connection member 51 mounted on one substrate body 41 and a second connection member 52 mounted on the other substrate body 41. When the electronic module 60 is mounted, the plurality of connection members 51 and 52 are mechanically connected to each other. For example, the connection members 51, 52 are made of a conductive material such as metal. Alternatively, the connection members 51, 52 may have a metal layer such as copper foil on the surface. Alternatively, the connection members 51, 52 may be made of a thermally conductive material. That is, for example, the first connection member 51 and the second connection member 52 may be connected to a machine to be thermally, electrically, or thermally and electrically connected to each other to form a heat path or a signal path. The plurality of connection members 51, 52 may be in direct contact with each other, or may be indirectly connected via another member.

[0019] As an example, the first connecting member 51 and the second connecting member 52 are arranged opposite each other in the third direction at adjacent portion 42 where the substrate bodies 41, 41 are arranged opposite each other in the third direction different from the stacking direction, and each connecting member 51, 52 is provided protruding in the third direction from the end face of the substrate body 41.

[0020] The first connecting member 51 integrally includes a rail base 51a joined to the board body 41 and a rail top 51b provided at the tip of the rail base 51a. The rail base 51a is, for example, a bar member whose longitudinal direction extends along the insertion direction, which is the moving direction when mounted, and the bottom surface joined to the board body 41 is configured in a long and thin rectangular shape. As an example, the rail base 51a is configured such that the longitudinal length along the insertion direction is longer than the width dimension, which is the length in the short direction. The rail top 51b is integrally provided at the tip edge of the rail base 51a protruding toward the opposing second connecting member 52 side. For example, the rail top 51b is provided over the entire length of the rail base 51a in the longitudinal direction. The outer surface of the rail top 51b has an engagement surface 51d having a convex portion 51c as an uneven portion protruding toward the second connecting member 52 side.

[0021] The first connecting member 51 has a width dimension, which is the length in the short direction, that is reduced at the central portion, which is spaced apart in the direction protruding from the substrate body 41, from the base end where the rail base 51a is joined to the substrate body 41, and the width dimension increases again at the rail top 51b.

[0022] The second connection member 52 integrally includes a rail base 52a joined to the board body 41 and a rail top 52b provided at the tip of the rail base 52a as a rail portion. The rail base 52a is, for example, a bar member extending in the longitudinal insertion direction, and the bottom surface joined to the board body 41 is configured in a long and narrow rectangular shape. As an example, the rail base 52a is configured such that the longitudinal length along the insertion direction is longer than the width dimension, which is the length in the short direction. The rail top 52b is integrally provided at the tip edge of the rail base 52a protruding toward the opposing first connection member 51 side. For example, the rail top 52b is provided over the entire length of the rail base 52a in the longitudinal direction. As an example of an uneven portion, the outer surface of the rail top 52b has a recess 52c at the center on the first connection member 51 side that retreats to the base end side, and an engagement surface 52d that serves as a receiving surface for receiving the engagement surface 51d.

[0023] That is, for example, the multiple connection members 51, 52 each have a concave-convex portion having a concave portion or a convex portion, and each have rail tops 51b, 52b that engage with each other.

[0024] The second connecting member 52 has a width dimension, which is the length in the short direction, reduced in a central portion spaced apart in a direction protruding from the board body 41 from a base end portion where the rail base 52a is joined to the board body 41, and the width dimension is increased again at the rail top 52b. For example, the space freed up by reducing the width dimension on the base end side may be used as a space for arranging the electronic component 33 or a space for flowing a cooling fluid.

[0025] For example, as conditions for the cross-sectional area and cross-sectional shape, if the minimum cross-sectional area in a cross section perpendicular to the opposing direction of connecting member 51 is defined as Amin [cm^2], the minimum cross-sectional area of ​​connecting member 52 as Bmin [cm^2], the bonding area with the board main body 41 as Aboard [cm^2] and Bboard [cm^2], and the contact area between connecting members 51 and 52 as AB [cm^2], then it is desirable that the following conditions of equations (1) to (4) be satisfied in order to obtain the minimum space. Amin = Bmin … Equation (1) Aboard= Bboard …Formula (2) AB>Amin…Formula (3) Aboard>Amin…Formula (4) The electronic modules 60 are mounted in the housing 10 by inserting the board body 31 into the housing 10 along the insertion direction. As an example, the electronic modules 60 are inserted in a predetermined order and sequentially mounted, and the connection members 51, 52 of the electronic modules 60 facing or adjacent to each other in the mounted state come into contact with each other. The connection members 51, 52 are movable in the insertion direction when the board body 31 is inserted into the connector 21 of the backplane 20 while being brought close to each other, and the connection members 51, 52 are arranged facing each other in contact with each other so as to regulate the relative positions of the connection members 51, 52 in the stacking direction and the width direction intersecting the stacking direction and the insertion direction in the mounted state. That is, the connection members 51, 52 engage with each other so as to regulate the relative positions in at least one of the opposing direction intersecting the insertion direction and the width direction intersecting the opposing direction in the mounted state where the adjacent modules 60 are arranged at the mounting position.

[0026] That is, the multiple connection members 51, 52 have engagement surfaces 51d, 52d having a recess or protrusion on the surface facing the other connection members 52, 51, and engage with the engagement surfaces 52d, 51d of the opposing other connection members 52, 51. For example, the rail top 51b of one connection member 51 has one protrusion 51c having a curved surface that protrudes toward the other side, and the rail top 52b of the opposite connection member 52 has a recess 52c that is recessed toward the other side and receives the outer surface of the protrusion 51c, and the protrusion 51c and the recess 52c engage with each other.

[0027] In addition, in consideration of the insertability and removal of the electronic module 60, the connecting portion 50 is structured such that the dimensions of the cross-sectional shape are continuously changed in the insertion direction, so that the multiple connecting members are pressed against each other and the physical contact force is enhanced. For example, the engaging surfaces 51d, 52d, which are the outer surfaces of the portions where the rail tops 51b, 52b of the pair of opposing connecting members 51, 52 face each other, respectively form continuous surfaces that continue in a predetermined direction that is inclined with respect to the insertion direction, which is the movement direction when the board main body 31 is inserted into the connector 21. That is, the pair of connecting members 51, 52 each have opposing surfaces having uneven portions that engage with each other, which extend along a predetermined continuous direction that is inclined with respect to the insertion direction.

[0028] For example, when mounting, if multiple main boards 30 are inserted in sequence along the insertion direction, the engaging surfaces 52d, 51d of the other connecting members 52, 51 are moved in the insertion direction while facing the engaging surfaces 51d, 52d of the connecting members 51, 52 that were inserted first.

[0029] 6, for example, in this embodiment, the pair of connecting members 51, 52 have continuous surfaces inclined with respect to the insertion direction, and the rail tops 51b, 52b can move in the insertion direction to a predetermined position where they abut against each other, and the movement in the insertion direction is restricted at the abutting position. The shape and dimensions of each connecting member 51, 52 are set to a dimension such that, when one board body 31 is inserted into the connector 21, the other board body 31 is guided to a position where it is inserted into the connector 21, and the engagement surfaces 51d, 52d are in an abutting position.

[0030] That is, it is necessary to take into consideration the shape of the cross section, assuming that one of the electronic modules 60 is inserted first so that the multiple electronic modules 60 can move relative to each other in the insertion direction. Specifically, the inclination direction of the engagement surfaces 51d, 52d having projections and recesses is such that the continuous direction of the engagement surfaces is inclined so that the connecting member 51 provided on the electronic module 60 placed deeper first increases the amount of protrusion from the board body 41 toward the depth, and the continuous direction of the engagement surfaces is inclined so that the connecting member 52 of the electronic module 60 inserted later decreases the amount of protrusion from the board body 41 toward the depth.

[0031] In the engaged state, the rail tops 51b, 52b engage with each other by facing each other at the engaging surfaces 51d, 52d, and the relative positions of the connecting members 51, 52 are restricted in the width direction intersecting or perpendicular to the insertion direction. That is, the projections 51c fit into the recesses 52c, and thus the relative positions are restricted in two directions perpendicular to the insertion direction.

[0032] The electronic components 33, 43 are package components such as BGA, LGA, etc. The electronic components 33, 43 have elements such as a processor, FPGA, etc. The free space in the board body 41 may be used to place the electronic components 33 of the main board 30, or may be used as a space for flowing a cooling fluid.

[0033] In the electronic device 1 configured as described above, when multiple main boards 30 equipped with sub-boards 40 are set in the housing 10, the board bodies 31 of the multiple main boards 30 arranged in the stacking direction, for example, are inserted from the opening 16 of the housing 10 toward the backplane 20, and the terminal portions provided on the edges of the board bodies 31 are plugged into the connector 21.

[0034] That is, the terminal portion of the board body 31 of a certain main board 30 is inserted toward the connector 21 to be attached to the backplane 20. At this time, the board body 31 is moved relative to the housing 10 in the first direction. Then, the other board bodies 31 are inserted toward the connector 21 in sequence.

[0035] For example, when the next board body 31 is inserted after an adjacent board body 31 has already been placed, the next board body 31 is moved relative to the connecting member 51 or second connecting member 52 formed on another adjacent electronic module 60 in the insertion direction while engaging with or opposing the engagement surfaces 51d, 52d of the second connecting member 52 or connecting member 51 of the electronic module 60 to be inserted later.

[0036] Here, in the case where the opposing surfaces of the multiple connection members 51, 52 of the connection portion 50 extend at an angle in the insertion direction, as shown in Fig. 6 as an example, the connection member 52 having the engagement surface 52d which is a continuous surface extending toward the connector 21 is first arranged at the back, and then the connection member 51 having the engagement surface 51d which is a continuous surface extending toward the opening 16 is inserted. Then, when the terminal of the board main body 31 is inserted into the connector 21, the engagement surface 51d comes into contact with the engagement surface 52d, and the engagement surface 51d is pressed against the engagement surface 52d by, for example, the pressure of the connector 21 holding the connection member 51, and they are connected thermally, electrically, and mechanically.

[0037] According to the electronic device 1 and electronic module 60 of the above embodiment, by providing a connection part 50 having connecting members 51, 52 connected to each other, high density mounting is possible, and high density and miniaturization are possible. In addition, by mechanically, thermally, or electrically connecting the connecting members of each module to each other, a power path, a signal path, and a heat path can be set, and these paths can be secured. That is, when supplying signal communication or power (electricity) between the electronic module 60 and the backplane 20, if the number of signals increases due to the high density of the module, the number of connector pins becomes insufficient. In addition, due to miniaturization, the maximum allowable current that can be passed through one pin is physically limited. In addition, the pin of the connector 21 can also serve as a heat dissipation path or heat path as one heat path, but there is also a physical limit to the thermal conductivity. In contrast, according to the present embodiment, by connecting the electronic modules 60 to each other by the connection part 50, it is possible to secure a signal path and a heat conduction path in addition to the passage via the backplane 20, and a compact structure can be realized to save space. In other words, the connection part 50 can be used as a composite area of ​​power, electricity, and machinery.

[0038] Moreover, each of the connection members 51, 52 can improve the mounting and contacting properties by using a rail portion having a continuous surface in a continuous direction inclined toward the insertion direction. That is, the connection portion 50 adopts a rail structure with a shape change rate (for example, an inclined structure) in the insertion direction, which is inspired by the shape of a rail of a railway, thereby increasing the contact force between the connection members 51, 52 and improving the mounting properties. Also, by using a hierarchical structure in which the sub-substrate 40 is stacked on the main substrate 30, the area for mounting components can be secured. Therefore, multiple main substrates 30 can be densely stacked and arranged, and the empty space can be reduced. That is, when the main substrates 30 are arranged densely, it becomes difficult to dissipate heat by air circulation, and heat conduction in mechanical components becomes dominant, but by intentionally contacting the electronic modules 60, 60, the heat dissipation and the mountability can be improved.

[0039] Furthermore, when the electronic module 60 is densely mounted, the wiring pattern of the board on the backplane 20 side becomes difficult, and in the past, increasing the number of board layers limited the wiring layout due to differences in transmission characteristics depending on the board layers, but according to this embodiment, some signals, power supplies, etc. can be bridged between modules, simplifying the layout of the backplane. In addition, a path for GND connection can be secured by, for example, the connecting members 51 and 52. For example, when connecting to GND, the area of ​​the copper foil layer that serves as the reference potential (GND) can be made large, which contributes to reducing the occurrence of loop-type ground bounce that is easily caused by abrupt changes in current.

[0040] As described above, by fitting the ends of the daughter boards of adjacent modules having conductive joint shapes, it is possible to connect low-frequency signals and power sources (supply side, GND side) that do not require impedance matching. For example, when power can be supplied, it is also possible to directly supply power converted to a desired voltage on an adjacent board to a board that does not have enough mounting area. Therefore, depending on the conditions, it is possible to reduce the number of power pins on the connector of the main board, and increase the allocation of other signal pins accordingly. In addition, when a power supply module is configured, the modules on both sides adjacent to the power supply module can be modules that do not have power supplies, which makes it possible to further save space. In addition, when a multi-layer board is used, the number of wiring layers can be reduced.

[0041] In the above embodiment, the shape of the connection member is a rail-shaped member reminiscent of a railway rail, thereby reducing the weight and ensuring a cross-sectional area for the required amount of current. It is expected that the connection member will be subjected to a certain amount of weight, and the strength can be improved by increasing the area to reinforce the strength of the connection surface. Furthermore, since the metal surface is rough (uneven and rough), contact resistance occurs, but by adopting a shape that ensures surface area, heat dissipation and electrical connectivity can be ensured. That is, in addition to the balance of strength, it can also contribute to saving materials. Therefore, effects such as weight reduction and miniaturization can be expected.

[0042] Furthermore, since each connecting member has a continuous surface that is inclined toward the insertion direction and the abutting surface is inclined relative to the insertion direction, the contact force can be improved compared to an opposing surface that is continuous along the insertion direction. Therefore, even if the electronic module 60 is vibrated due to external vibration, for example, the contact state can be maintained, and electrical contact failure can be reduced as much as possible.

[0043] The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit and scope of the present invention.

[0044] For example, the main boards 30 may have the same configuration or may have different configurations. For example, as in the electronic device 1A shown in FIG. 7 as another embodiment, a plurality of different types of modules may be used. In the electronic device 1A of this embodiment, for example, a plurality of modules having different temperature characteristics are arranged adjacent to each other. That is, a heat-generating component 35 is arranged on some of the main boards 30 adjacent to each other in the stacking direction. In this case, as shown by the arrow in the figure, heat dissipation can be ensured by a heat path via the connection part 50. Also, even if such temperature characteristics are different and some of the modules are vulnerable to low or high temperatures, a heat dissipation path can be ensured by combining another adjacent main board 30 or sub-board 40, so that warm air during warm-up can be passed to the adjacent module.

[0045] Also, when the heat cannot be completely dissipated, for example, when the adjacent electronic module 60 has low power consumption and does not easily generate heat, it is possible to cover the heat by conducting it to the housing 10, as shown by the dashed arrow in FIG.

[0046] The specific configuration of the connection members 51, 52 in the connection part 50, that is, the shape, dimensions, material, number, and other conditions of the connection members 51, 52, are not limited to the above embodiment, and various shapes can be applied. For example, in the above embodiment, each connection member 51, 52 has a shape having one convex part 51c and one concave part 52c as an example of the uneven part, but this is not limited to the above. For example, the concave part and the convex part may be reversed, or there may be multiple concave parts. For example, in an electronic device 1B shown in FIG. 8 as another embodiment, the connection part 150 includes connection members 151, 152 having multiple concave parts formed on the outer surface. For example, the outer surface of the first connection member 151 has two convex parts 151c aligned in the width direction and one concave part 151e formed therebetween, and the outer surface of the second connection member 152 has two concave parts 152c aligned in the width direction and one convex part 152e formed therebetween. Note that if the contact area is increased too much, the required insertion and removal force becomes large and the maintainability decreases, so it is desirable to have a shape that is not too complicated and not too fine.

[0047] Also, as shown in FIG. 9, each of the connection members 251, 252 may have a built-in heater 251f, 252f, like the connection part 250 of the electronic device 1C according to another embodiment. For example, if one of the connection members 251, 252 is the supply side (voltage application) and the other is the receiving end side (GND), it is possible to share the heater. For example, in this case, it is efficient to gather components that are difficult to start up at low temperatures on the board body 41. Since the connection members 251, 252 need to be separated from each other, the heaters 251f, 252f are provided for each of the connection members 251, 252, respectively, and are electrically connected in series. Furthermore, a configuration may be used in which a plurality of connection members 251, 252 are provided in parallel to supply the required amount of heat.

[0048] In the above embodiment, the connecting portion 50 is provided with a pair of connecting members 51, 52 as engaging members, but the present invention is not limited to this, and may include three or more engaging members. In addition, the first connecting member 51 and the second connecting member 52 are not limited to being in direct contact with each other, and may be indirectly connected via other members such as a link member. For example, in the above first embodiment, the interlocking force can be increased by using a continuous surface that is inclined in the insertion direction, but providing an inclination in the insertion direction would result in adjacent modules being removed in order during replacement, which would create restrictions. For this reason, the connecting portion 350 shown in FIG. 10 and FIG. 11 as another embodiment is provided with a third connecting member 353 as a link member in addition to a first connecting member 351 and a second connecting member 352, and the first connecting member 351 and the second connecting member 352 are indirectly connected to each other by the third connecting member 353. For example, an opening narrowing toward the back in the insertion direction is formed by the first connecting member 351 and the engagement surfaces 351d, 352d of the second connecting member 352, and the third connecting member 353 is inserted along the shape of the opening, and the opening is filled with the third connecting member 353, so that the first connecting member 351 and the second connecting member 352 are indirectly connected by the third connecting member 353. In addition, for example, as shown in the table of FIG. 12, a combination of shapes of the engagement surfaces 351d, 352d, 353d, 353e of the connecting members 351, 352, 353 can be adopted. That is, as shown in FIG. 12, a protruding ellipse forming a convex portion and a recessed ellipse forming a concave portion can be appropriately combined as the shapes of the engagement surfaces 351d, 352d, 353d, 353e of the connecting members 351, 352, 353. In these cases, the shape of the engagement surfaces 351d, 352d, 353d, 353e of the connecting members 351, 352, 353 can be played as a "key" during assembly, thereby preventing erroneous insertion of the module. In addition, by using different shapes to distinguish the multiple connection parts 50, it is possible to prevent incorrect assembly. That is, for example, when the same material is used, the parts can be standardized, and when different materials are used, erroneous insertion can be prevented.

[0049] In the above embodiment, an example has been shown in which sub-substrates 40 having electronic components 43 are mounted on the front and back of substrate body 31 of each main substrate 30, but the number and shapes (area ratio) of sub-substrates 40 are not limited to the above example. For example, multiple sub-substrates 40 may be mounted on one surface of main substrate 30, or a configuration without a sub-substrate 40 may be used.

[0050] In the above embodiment, the connection portion 50 is disposed in the adjacent portion 42 where the sub-substrates 40, which are child substrates, face each other or are adjacent to each other, but the present invention is not limited to this. For example, the sub-substrate 40 may not be provided, and the connection portion 50 may be provided in the adjacent portion 32 where the multiple main substrates 30 face each other or are adjacent to each other. For example, in an electronic device 1D as another embodiment shown in FIG. 13, the multiple main substrates 30 may each have a protective cover 34, and a part of the protective cover 34 may constitute the connecting member 51, 52. That is, the protective covers 34, 34 that are disposed adjacent or facing each other may be connected to each other to constitute the connecting portion 50. Alternatively, a pair of protective covers 34, 34 may be disposed opposite each other as the connecting members 51, 52, and may be connected via another member that serves as a third connecting member. Even in such a configuration, a thermal or electrical path can be secured, and the same effects as those of the above embodiments can be obtained.

[0051] Furthermore, as another embodiment, a cooling structure 70 may be added as in the electronic device 1E shown in Fig. 14. For example, a path for heat conduction can be added at the connection portion 50, but when the electronic device 1E is viewed as a whole device, if there is an empty space at the end of the arrangement of the main boards 30, this area can be expanded as an area for ensuring heat dissipation. The cooling structure 70 may be liquid-cooled, or may be thermally conductive such as metal or a heat pipe.

[0052] In addition, in each of the above embodiments, the connection members 51, 52 are shown to be provided on the end surface of the substrate main body 41, but this is not limited to this, and the connection members 51, 52 may be mounted on the mounting surface, which is the main surface of the substrate main body 41 or the substrate main body 31.

[0053] In addition, in each of the above-mentioned embodiments, examples having the engaging surfaces 51d, 52d that are continuous in the direction inclined toward the insertion direction have been shown, but the present invention is not limited to this. For example, as another embodiment, as in the connecting portion 450 shown in FIG. 15, the engaging surfaces 451d, 452d may extend in the insertion direction and have a continuous outer shape in the insertion direction. Even in this case, since the engaging surfaces 451d, 452d are in contact with each other in the attached state while being relatively movable in the insertion direction, they are at least electrically and thermally connected, and electrical and thermal paths can be secured as described above. In addition, since the position can be restricted in the stacking direction and width direction, the positional accuracy can be improved, which contributes to high density and space saving.

[0054] According to at least one of the embodiments described above, by providing the connection portion 50 having the connection members 51, 52 which are connected to each other, high density mounting is possible, and high density and miniaturization are possible. can.

[0055] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0056] 1, 1A, 1B, 1C, 1D, 1E...electronic device, 10...casing, 11...back plate, 12 to 15...side plate, 16...opening, 20...backplane, 21...connector, 30...main board, 31...board body, 31a...surface, 31b...back side, 32...adjacent part, 33...electronic component, 34...protective cover, 35...heat generating component, 40...sub-board, 41...board body, 42...adjacent part, 43...electronic component, 50...connection part, 51...connection member, 51a...rail base, 51b...rail top, 51c...convex part, 51d...engagement surface, 52...connection member, 52a...rail base, 52b...rail top, 52c...concave portion, 52d...engagement surface, 60...electronic module (module), 62...adjacent portion, 70...cooling structure, 150...connection portion, 151...connection member, 151c...convex portion, 151e...concave portion, 152...connection member, 152c...concave portion, 152e...convex portion, 250...connection portion, 251...connection member, 251f...heater, 252...connection member, 252f...heater, 350...connection portion, 351...connection member, 351d...engagement surface, 352...connection member, 352d...engagement surface, 353...connection member, 353d...engagement surface, 353e...engagement surface, 450...connection portion, 451d...engagement surface, 452d...engagement surface, S1...accommodation space.

Claims

1. A plurality of modules, at least some of which are disposed adjacent to or facing each other; a connection section to which the plurality of modules are connected, the connection section having a plurality of connection members provided on the plurality of modules, the plurality of connection members being connected; An electronic device comprising:

2. a base into which the plurality of modules are inserted; the connection portion includes connection members provided on a plurality of the modules, The electronic device according to claim 1 , wherein the connecting members have continuous surfaces inclined with respect to an insertion direction of the modules on opposing surfaces facing the other connecting members when the modules are mounted on the base.

3. 3. The electronic device according to claim 2, wherein the plurality of connection members engage with each other in a manner that allows the relative positions of the plurality of connection members to be regulated in at least one of an opposing direction intersecting with the insertion direction and a width direction intersecting with the opposing direction when the plurality of adjacent modules are arranged in the mounting position.

4. The electronic device according to claim 1, wherein the plurality of connection members have a concave or convex portion on a surface facing at least one of the other connection members or a member disposed between the other connection members and the other connection members when mounted, and a rail portion having an uneven portion that engages with the facing surface of the other connection member or the member.

5. The electronic device according to claim 4 , wherein the rail portion has a continuous surface extending in a direction inclined with respect to a direction of movement when the module is mounted.

6. The module includes a main board inserted into a connector provided on a backplane, and a sub-board provided on the main board, The electronic device according to claim 1 , wherein the connection members are provided on the sub-boards.

7. The module has a substrate; The electronic device according to claim 1 , wherein the connection member is disposed on a mounting surface or an end surface of a substrate of the module.

8. The module has a substrate; The electronic device according to claim 1 , wherein the connection member is disposed on a mounting surface or an end surface of a substrate of the module.

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