Optical processing device

Abstract

To provide an optical processing device that addresses issues arising from housing deflection.SOLUTION: A optical processing device includes: a light source that irradiates a treatment object conveyed along a conveyance path with ultraviolet light; a housing having the light source therein and having an opening through which the treatment object is carried in or out; and a heat deflection reducer that reduces heat deflection of the housing surrounding the opening.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to an optical processing device. [Background technology]

[0002] There is known an optical treatment device that has a light source that emits light and a housing (lamp house) that has the light source inside, and that performs optical cleaning or optical surface treatment on the object to be treated by irradiating light onto the object to be treated within the housing while transporting the object so that the object passes through the housing (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-108069 A Summary of the Invention [Problem to be solved by the invention]

[0004] In such light processing devices, the light source emits light and also generates heat. The housing surrounding the light source may be heated by the heat emitted from the light source and may thermally expand. It has been found that thermal expansion of the housing may cause problems such as bending of the housing and interference with members arranged inside the housing. Therefore, a light processing device that reduces bending of the housing is being considered. [Means for solving the problem]

[0005] As a result of intensive research by the present inventors, it was found that the bending of the housing occurs concentratedly in a certain area of ​​the housing. The area that is particularly prone to bending is the area surrounding the opening for loading and unloading the object to be processed. As a result, the inventors have found the following optical processing device.

[0006] The optical treatment device of the present invention includes a light source that irradiates an object to be treated transported along a transport path with ultraviolet light; a housing having the light source therein and an opening through which the object to be treated is carried in or out; a thermal deflection reducing portion that reduces thermal deflection of the housing surrounding the opening; Equipped with.

[0007] The thermal deflection of the housing is caused by the heat generated by the light source and the like arranged in the housing being transmitted to the housing. When the housing is heated, the housing expands. If the temperature rise of the housing spreads over a wide area, the housing thermally expands as a whole, which is not a big problem, but if the heating of the housing does not spread and a temperature difference occurs between areas located nearby, a difference in the amount of thermal expansion occurs, and thermal deflection occurs in the housing. As will be described in detail later, the inventors noticed that in the area surrounding the opening, the local temperature difference of the housing is large, so the thermal expansion difference is large and the housing is easily deflected. By providing a thermal deflection reduction part, it is possible to reduce the thermal deflection of the housing surrounding the opening, which is particularly prone to deflection. This makes it possible to prevent the housing from interfering with members arranged in the housing.

[0008] The housing may be composed of two or more housings. For example, the housing may be composed of a first housing having a space for irradiating the ultraviolet light to the object to be treated, and a second housing having the light source therein. The first housing and the second housing form a space by closing each other's openings. In this way, when a space is formed by multiple housings closing each other's openings, if the multiple housings are separated from each other, the maintainability of the members arranged inside the housings is improved. In the light processing device, the opening may be provided in the second housing. Also, the opening may be provided in the first housing.

[0009] The opening may be short in a thickness direction of the object to be processed and long in a width direction of the object to be processed. The second housing may include a band region sandwiched between the band-shaped opening and an end of the second housing.

[0010] The thermal deflection reduction portion includes a plurality of aspects as exemplified below. It is preferable that the thermal deflection reduction portion has at least one of the aspects described below.

[0011] The band region may be formed of a band member separate from a main body constituting a portion other than the band region. The thermal deflection reduction portion may include an engagement mechanism that loosely engages the band member with the main body. The engagement mechanism may allow the band member to escape thermal expansion in the extension direction of the band member relative to the main body, i.e., allow the band member to elongate while restricting displacement in a direction perpendicular to the extension direction.

[0012] The thermal deflection reduction unit may have a heater that heats a region of the first housing that faces the band region across the opening. The heater may be an electric heating wire, a pipe that passes a high-temperature fluid, a light source that irradiates infrared light, or the like.

[0013] The thermal deflection reduction portion may include a cooler for cooling the band region, and the cooler may include a heat sink, a Peltier element, a cooling pipe for circulating a refrigerant, or a cooling fan.

[0014] The thermal deflection reduction portion may include a light-shielding portion inserted between the band region and the light source. The light-shielding portion blocks light from the light source toward the band region, thereby preventing thermal expansion of the band region caused by irradiation of the light onto the band region. Effect of the Invention

[0015] The object of the present invention is to provide an optical processing device that solves at least one of the problems conventionally encountered. [Brief description of the drawings]

[0016] [Figure 1] FIG. 2 is a cross-sectional view of the optical processing device. [Figure 2A] 1 is a diagram of a housing viewed from the upstream side toward the downstream side in the conveying direction. [Figure 2B] 1 is a diagram of a housing viewed from the upstream side toward the downstream side in the conveying direction. [Diagram 3] FIG. 2 is an enlarged view of a main part of FIG. [Figure 4] 11 is a cross-sectional view of an optical processing device having a light-shielding portion that suppresses light irradiation onto a band region as a thermal deflection reducing portion. FIG. [Diagram 5] 13 is a diagram showing a housing employing another thermal deflection reduction portion, as viewed from the upstream side toward the downstream side in the conveying direction. [Figure 6] FIG. 6 is a diagram showing the configuration of a second housing out of the housings in FIG. 5. [Figure 7A] 5 is a diagram illustrating details of an engagement mechanism of the housing in FIG. 4. [Figure 7B] FIG. 7B is a cross-sectional view taken along line II in FIG. 7A. [Figure 8A] 13A and 13B are diagrams illustrating a modified example of the engagement mechanism of the housing. [Figure 8B] FIG. 8B is a cross-sectional view taken along line II in FIG. 8A. [Figure 9] FIG. 11 is a cross-sectional view showing another embodiment of the optical treatment device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The embodiments of the present invention will be described with reference to the drawings. The drawings disclosed in this specification are merely schematic. In other words, the dimensional ratios in the drawings do not necessarily match the actual dimensional ratios, and the dimensional ratios between the drawings do not necessarily match. The number of each component shown in the drawings does not necessarily match the actual dimensional ratios or the number of each component.

[0018] In the following, each drawing will be described with reference to the XYZ coordinate system as appropriate. In this specification, when a direction is expressed and a positive or negative direction is to be distinguished, it is described with a positive or negative sign, such as "+X direction" and "-X direction". When a direction is expressed without distinguishing between positive and negative directions, it is simply described as "X direction". That is, in this specification, when it is simply described as "X direction", both "+X direction" and "-X direction" are included. The same applies to the Y direction and the Z direction. In the embodiment described below, the gravity direction is the -Z direction, the transport direction in which the object is transported is the -Y direction, and the width direction of the object is the X direction.

[0019] [Outline of the optical processing equipment] FIG. 1 is a cross-sectional view of an example of an optical processing device. The optical processing device 100 has a light source 3 that irradiates a processing target 4 with light L1, and a housing (2a, 2b) having the light source 3 inside. The processing target 4 is transported along a transport path. In this embodiment, the transport path includes a belt 7 on which the processing target 4 is placed. The processing target 4 is placed on the belt 7 and transported together with the belt 7. The belt 7 is supported by a rotatable guide roller 33. From a different perspective, it can be said that the optical processing device 100 is disposed midway along the transport path. The light L1 of the light source 3 is emitted in the -Z direction. While the processing target 4 is transported in the -Y direction along the transport path, the processing target 4 is exposed to the light L1. As a result, the processing target 4 is optically processed. The processing content of the optical processing will be described later.

[0020] The housings (2a, 2b) are composed of a first housing 2a and a second housing 2b. The first housing 2a and the second housing 2b each have a box shape composed of one surface along the XY plane and four side surfaces surrounding the surface and along the XZ plane or the YZ plane. Of the one surface of the first housing 2a along the XY plane, there is no surface in a portion close to the object to be processed 4. The second housing 2b also has a box shape composed of one surface along the XY plane and four side surfaces surrounding the one surface and along the XZ plane or the YZ plane. Of the one surface of the second housing 2b along the XY plane, there is no surface in a portion close to the object to be processed 4.

[0021] When the housings (2a, 2b) are closed so that the non-faced portions of the housings (2a, 2b) are close to each other, the housings (2a, 2b) form one space. This space is the space to be treated of the object 4 to be treated. In FIG. 1, the second housing 2b is shown as having a hatched area, and the first housing 2a is shown by a thick line, but this is shown to be able to distinguish the first housing 2a from the second housing 2b, and does not necessarily indicate that the second housing 2b is configured to be thicker than the first housing 2a. The thickness of the second housing 2b and the thickness of the first housing 2a may be the same or different. The thickness of the second housing 2b may be thicker than the thickness of the first housing 2a, and the thickness of the first housing 2a may be thicker than the thickness of the second housing 2b.

[0022] After the housings (2a, 2b) are closed once, they can be opened again. This improves the ease of maintenance of the members disposed inside the housings (2a, 2b). However, the housing may be composed of a single housing that is not divided, or may be composed of three or more housings.

[0023] The first housing 2a has a gas supply port 8. Like the first housing 2a, the second housing 2b also has a gas supply port 8. By supplying gas from the gas supply port 8, it is possible to reduce gas entering the processing space from outside. However, the gas supply port 8 is not an essential component for the optical processing device. The gas supply port 8 will be described in detail later.

[0024] The first housing 2a functions as a lamp house. Although not shown in the figure, the first housing 2a supports the light source 3. An entrance opening 5i for carrying in the object 4 to be treated is provided on a side surface of the second housing 2b, and an exit opening 5o for carrying out the object 4 to be treated is provided on a side surface opposite to the entrance opening 5i. The openings (5i and 5o) are each surrounded by the side surface of the second housing 2b. The openings are used as a transport path for the object 4 to be treated.

[0025] Fig. 2A is a view of the housings (2a, 2b) of the optical processing device 100, viewed from the upstream in the transport direction toward the downstream direction (-Y direction). A gas recovery chamber, which will be described later, is not shown. In Fig. 2A, the light source 3 and the gas supply port 8 are not visible and are therefore shown by dashed lines. A cross section of the belt 7 on which the object to be processed 4 can be placed is shown. The object to be processed 4 is not shown in this figure.

[0026] As shown in FIG. 2A, the carry-in opening 5i has a shape that is short in the thickness direction (Z direction) of the workpiece 4 and long in the width direction (X direction) of the workpiece 4. The thickness T1 of the carry-in opening 5i is, for example, preferably 5 mm or more and 34 mm or less, and more preferably 9 mm or more and 17 mm or less. The length L2 of the carry-in opening 5i is longer than the length of the belt 7 (or the workpiece 4). However, in order to suppress the amount of gas in the housing (2a, 2b) leaking from the carry-in opening 5i, the difference between the length of the carry-in opening 5i and the length of the belt 7 (or the workpiece 4) is preferably 14 mm or less. The shape of the carry-out opening 5o may be the same as or different from the shape of the carry-in opening 5i.

[0027] As described above, in this embodiment, the second housing 2b has the carry-in opening 5i and the carry-out opening 5o. However, the first housing 2a may have at least one of the carry-in opening 5i and the carry-out opening 5o. Also, referring to FIG. 1, the first housing 2a has the light source 3 therein and functions as a lamp house, but the second housing 2b may have the light source 3 therein and function as a lamp house. Both the first housing 2a and the second housing 2b may have the light source 3 therein and function as a lamp house.

[0028] [Thermal deflection of the housing] As described above, the light source 3 generates heat as it emits the light L1. The housings (2a, 2b) surrounding the light source 3 are heated by the light source 3. When the housings (2a, 2b) are heated, the housings (2a, 2b) thermally expand. Problems associated with the thermal expansion of the housings (2a, 2b) will be described with reference to FIGS. 2B and 3.

[0029] 2B is a view of the housings (2a, 2b) viewed from the upstream in the transport direction toward the downstream direction (-Y direction), similar to FIG. 2A. In the second housing 2b, a strip area 20 is located between the entrance opening 5i and the end close to the first housing 2a. The strip area 20 is short in the Z direction and long in the X direction.

[0030] As shown in FIG. 1, the strip region 20 is located close to the light source 3. Therefore, heat generated by the light source 3 is easily transferred to the strip region 20. Since the strip region 20 is adjacent to the entrance opening 5i, the heat transferred to the strip region 20 is less likely to diffuse through the second housing 2b and is more likely to remain in the strip region 20. Therefore, the temperature of the strip region 20 is easily increased. In addition, the thickness T2 (see FIG. 2A) of the strip region 20 is small, which is also a factor that makes the temperature of the strip region 20 easily increase. In contrast, the region 21 (see FIG. 2B) facing the strip region 20 across the entrance opening 5i is far from the light source 3 and is separated from the strip region 20 by the entrance opening 5i, so that less heat is transferred from the strip region 20. Therefore, the temperature of the region 21 is less likely to increase. As a result, two regions (20, 21) with different temperatures exist through the entrance opening 5i.

[0031] The thickness T2 of the band region 20 (see FIG. 2A) is, for example, 5 mm or more and 80 mm or less. The thickness T2 is more preferably 10 mm or more and 50 mm or less. If the thickness T2 is short, the distance between the transport path of the workpiece 4 and the light source 3 becomes small, so that the ultraviolet light can be effectively irradiated onto the workpiece 4. The length of the band region is the same as the length L2 of the loading opening 5i.

[0032] Fig. 3 is an enlarged view of the main part of Fig. 1. Thermal deformation of the housings (2a, 2b) is caused by the difference in the amount of thermal expansion within the housings (2a, 2b) which have different ranges of temperature rise. The band region 20 and the region 21, which are located close to each other across the loading opening 5i, are prone to thermal deformation due to the difference in the amount of thermal expansion. The band region 20 is particularly prone to deformation due to its elongated shape in one direction.

[0033] The region v20 in FIG. 3 indicates the position of the band region 20 that is bent due to thermal expansion. The region v20 is shifted in the -Y direction by m1 from the original position. When the band region 20 of the second housing 2b is shifted to the position of the region v20 in this way, the band region 20 may come into contact with other members (for example, a reflecting member or a light source in the first housing 2a). In addition, a gap may be formed between the band region 20 and the first housing 2a, and the inert gas in the first housing 2a may leak out. In this embodiment, the band region 20 is shown shifted in the -Y direction, but the band region 20 may also be shifted in the +Y direction, or in the +Z direction or -Z direction. Even if such a position shift of the band region 20 occurs, there is a risk of contact with other members, the belt 7, or the processed object 4 constituting the optical processing device, or a gap may be generated between the band region 20 and the first housing 2a.

[0034] [Thermal deflection reduction section] In order to reduce the above-mentioned thermal distortion, the optical processing device 100 has a thermal distortion reduction part. By providing the thermal distortion reduction part, the thermal distortion of the band region 20 is reduced, and the band region 20 is prevented from shifting from its original position. There are various forms of the thermal distortion reduction part, which will be described below.

[0035] Methods for reducing the thermal deflection of the band region 20 are roughly divided into two types: a method for suppressing the thermal expansion of the band region 20 itself (first method), and a method for preventing the band region 20 from deflecting even if the band region 20 thermally expands (second method). Each method has various forms.

[0036] The first method (a method for suppressing the thermal expansion of the band region 20 itself) will be described. The first method includes a cooling method for cooling the band region 20 and a shading method for shading the band region 20 from light in order to suppress the thermal expansion of the band region 20 itself. First, a cooler for the cooling method for cooling the band region 20 will be described as a thermal deflection reduction unit for carrying out the first method.

[0037] Examples of the cooler include a heat sink, a cooling pipe, a Peltier element, and a cooling fan. A specific example of the heat sink is to form an uneven surface on the band region 20 to facilitate heat dissipation. A specific example of the cooling pipe is to place a cooling pipe that passes a refrigerant in contact with the surface of the band region 20, near the surface, or inside the band region 20. A specific example of the Peltier element is to place a Peltier element on the surface of the band region 20 and absorb heat from the band region 20 using the Peltier element. A specific example of the cooling fan is to place a cooling fan so as to send a cooling gas toward the band region 20, or to place a cooling fan so as to suck in the hot gas around the band region 20. A plurality of coolers of each type can be placed, and a cooler that is a suitable combination of these specific examples may be used.

[0038] Next, a light shielding method for shielding the band region 20 from light irradiation in order to suppress the thermal expansion of the band region 20 itself as a thermal deflection reduction unit for performing the first method will be described. The light irradiation device has a light shielding unit 22 as a thermal deflection reduction unit for performing the first method. As shown in FIG. 4, the light shielding unit 22 is inserted between the band region 20 and the light source 3. The light shielding unit 22 shown in FIG. 4 is plate-shaped. The shape and arrangement of the light shielding unit 22 in this embodiment are merely an example. The light shielding unit 22 is not particularly limited as long as it has the function of shielding the band region 20 from light from the light source 3.

[0039] The second method (a method for preventing the band region 20 from bending even if the band region 20 thermally expands) will be described. The second method includes a method for releasing the thermal expansion of the band region 20 in its extension direction, and a method for heating the region 21 facing the band region 20 across the loading opening 5i.

[0040] A method for releasing thermal expansion of the band region 20 in its extension direction will be described with reference to Figs. 5 and 6. Fig. 5 is a view of the housings (2a, 2b) from the upstream side in the transport direction toward the downstream side (-Y direction). Fig. 6 is a view showing only the second housing 2b in this method. The second housing 2b includes a main body 2b1 and a band member 2b2 separate from the main body 2b1. The band region of the optical processing device 200 is formed by the band member 2b2. The main body 2b1 has a recess 24 on one side of the side surface. Then, as shown by the dashed-dotted arrow in the -Z direction in Fig. 6, the band member 2b2 is moved and positioned so as to overlap the side of the main body 2b1 having the recess. This forms the entrance opening 5i.

[0041] An end 26 (see FIG. 6) of the belt member 2b2 is fixed so as not to move relative to the main body 2b1. An end 27 of the belt member 2b2 is loosely engaged with the main body 2b1 by an engagement mechanism F1 (see FIG. 5) so as to include play.

[0042] The details of the engagement mechanism F1 will be described with reference to FIG. 7A and FIG. 7B. FIG. 7A is a diagram for explaining the details of the engagement mechanism of the housing of FIG. 4. FIG. 7B is a cross-sectional view taken along line II in FIG. 7A. The belt member 2b2 has a groove 40 along its longitudinal direction (X direction). The end portion 27 is loosely engaged with the main body 2b1 using a headed bolt 42 in a state in which the belt member 2b2 can expand in the X direction. Inside the groove 40 provided in the end portion 27, there is a through hole 41 and a flange 43. The flange 43 forms a surface that is one step lower than the surface of the belt member 2b2. The head portion of the headed bolt 42 is larger than the gap between the opposing flanges 43 and smaller than the width of the groove 40. Then, the headed bolt 42 is tightened loosely so that the head of the headed bolt 42 does not touch the flange 43. This allows the expansion of the belt member 2b2 in the X direction to escape while suppressing the deviation of the belt member 2b2 in the Y direction and Z direction. Even if a difference in the amount of thermal expansion occurs between the belt member 2b2 and the main body 2b1, the belt member 2b2 is not pressed by the main body 2b1 and can thermally expand freely in the X direction relative to the main body 2b1, so that the belt member 2b2 is unlikely to bend.

[0043] As an example of the engagement mechanism F1 including play, a mechanism consisting of a groove 40 consisting of a flange 43 and a through hole 41 and a head bolt 42 has been described, but this engagement mechanism is merely an example and is not limited to this. FIG. 8A is a diagram illustrating a modified example of the engagement mechanism F1. FIG. 8B is a cross-sectional view taken along line II in FIG. 8A. The engagement mechanism shown in this example has a sliding guide 46 into which a portion 45 of the belt member 2b2 can be inserted. The sliding guide 46 is attached to the main body 2b1. The portion 45 of the belt member 2b2 is inserted in a slidable state into a ring surrounded by the sliding guide 46 and the main body 2b1. As shown in FIG. 8A, it is preferable that the portion 45 is formed thinner than the other portions of the belt member 2b2. Even with the engagement mechanism having the sliding guide 46, it is possible to suppress the displacement of the belt member 2b2 in the Y and Z directions while allowing the expansion of the belt member 2b2 in the X direction to escape.

[0044] In this embodiment and the modified example, of the ends 26, 27 of the belt member 2b2, only the end 27 is provided with a loosely engaging engagement mechanism F1, and the end 26 is fixed, but a loosely engaging engagement mechanism may be provided for both the ends 26, 27.

[0045] The belt member 2b2 may be made of the same material as the main body 2b1 (for example, an aluminum-based material). The belt member 2b2 may be made of a material different from that of the main body 2b1. When the belt member 2b2 is made of a material different from that of the main body 2b1, it is preferable to adopt a material whose linear expansion coefficient is smaller than that of the main body 2b1 (particularly, the region 21). Although the belt member 2b2 is separate from the main body 2b1 in the above description, the belt member 2b2 may be integral with the main body 2b1. For example, the belt member 2b2 may be formed integrally with the main body 2b1 so that the belt region protrudes from the end 26 toward the end 27.

[0046] A method of heating the region 21 will be described. As described above, if the amount of thermal expansion differs between the band region 20 and the region 21, the band region 20, which is long in the X direction, is likely to bend due to heat. Therefore, the region 21 is heated to bring the amount of thermal expansion in the region 21 closer to the amount of thermal expansion in the band region 20. In other words, the thermal bending reduction unit for realizing the heating method is preferably a heater that heats the region 21. The region 21 is heated by the heater to bring the temperature of the region 21 closer to the temperature of the band region 20. When the temperature difference between the region 21 and the band region 20 becomes small and the amounts of thermal expansion of the two become closer and the difference in the amount of thermal expansion becomes small, bending of the band region 20 is suppressed.

[0047] As a specific example of the heater, a heating wire or a temperature control pipe through which a temperature control fluid flows may be disposed on the surface or inside of the region 21, or light for generating heat may be irradiated toward the surface of the region 21.

[0048] As the first method, a method of cooling the band region 20 (hereinafter referred to as the "cooling method") and a light shielding method have been described, and as the second method, a method of releasing the expansion of the band region 20 or the region 21 existing as the band member 2b2 (hereinafter referred to as the "expansion release method") and a method of heating the region 21 facing the band region 20 (hereinafter referred to as the "heating method") have been described. Any one of these methods may be applied, or a plurality of methods may be applied. That is, the cooling method and the expansion release method may be adopted, the cooling method and the heating method may be adopted, the expansion release method and the heating method may be adopted, or the four methods of the cooling method, the light shielding method, the expansion release method, and the heating method may be adopted. In addition, although it has been described that the second housing 2b surrounding the carry-in opening 5i is provided with a thermal deflection reducing portion, the second housing 2b surrounding the carry-out opening 5o may also be provided with the above-mentioned thermal deflection reducing portion.

[0049] [light source] The light source 3 will be described with reference to FIG. 1. The light source 3 emits light L1 of a predetermined wavelength. The wavelength is set according to the processing contents of the object to be processed. The processing contents include surface modification, cleaning, exposure, processing, etc. of the object to be processed. The light L1 in this embodiment is vacuum ultraviolet light, that is, ultraviolet light having light belonging to a wavelength band of at least 205 nm or less. As used in this specification, "light belonging to a wavelength band of at least 205 nm or less" refers to light that shows an emission intensity at least at 205 nm or less in the emission spectrum of the light source 3. Examples of such light include (1) light that shows intensity in a broad wavelength band and shows an emission spectrum in which the peak emission wavelength showing the maximum intensity is 205 nm or less, (2) light that shows an emission spectrum showing multiple maximum intensities (multiple peaks) and shows an emission spectrum in which any one of the multiple peaks is included in the wavelength range of 205 nm or less, and (3) light that shows an integrated intensity of at least 30% or more of light at 205 nm or less with respect to the total integrated intensity in the emission spectrum. The light used does not have to be vacuum ultraviolet light.

[0050] In this embodiment, the light source 3 is a dielectric barrier discharge lamp filled with xenon gas. However, the light source 3 may be a dielectric barrier discharge lamp filled with a gas other than xenon gas. The light source 3 may also be another discharge lamp. The light source 3 may also be a light source other than a discharge lamp, for example, a solid-state light source such as an LED.

[0051] Although three light sources 3 are provided in the first housing 2a, one or two light sources 3, or four or more light sources 3 may be provided in the first housing 2a. In this embodiment, the multiple light sources 3 are arranged side by side in the transport direction (Y direction) of the workpiece 4, but the multiple light sources 3 may be arranged side by side in the X direction, or the light sources 3 may be arranged side by side in both the X direction and the Y direction.

[0052] The width of the light source 3 in the X direction is preferably larger than the width of the object 4 in the X direction. This allows the light L1 to be evenly irradiated in the width direction from the center to the edge of the object 4. Considering that the position of the object 4 in the X direction may change due to meandering of the belt 7 when the object 4 is transported, the width of the light source 3 in the X direction is preferably 50 mm to 100 mm larger than the width of the object 4 in the X direction. For example, when the width of the object 4 in the X direction is 500 mm, the width of the light source 3 in the X direction is preferably 550 mm to 600 mm.

[0053] The illuminance of the workpiece 4 may be changed by moving the light source 3 closer to or farther away from the workpiece 4 (transport path). Also, a desired neutral density filter may be disposed on the light source 3 to change the illuminance. A reflector or reflective layer that reflects ultraviolet light may be formed on the inner wall of the first housing 2a. The reflector or reflective layer directs the light L1 emitted from the light source 3 to travel in the -Z direction.

[0054] When the light source 3 is disposed inside the second housing 2b, the above description regarding the light source 3 also applies to the light source 3 disposed inside the second housing 2b.

[0055] [Gas supply port] The gas supply port 8 will be described in detail with reference to FIG. 1. The first housing 2a and the second housing 2b each have a plurality of gas supply ports 8 inside the housing. The gas supplied from the gas supply port 8 may be an inert gas IG (e.g., nitrogen gas). The gas supply port 8 supplies the inert gas IG to the inside of the housing to form an inert gas atmosphere. The gas supply port 8 is connected to a gas supply source 12 that supplies the inert gas IG via a gas pipe 6. A flow rate control valve 17 is present in the middle of the gas pipe 6. In this embodiment, nitrogen gas is used as the inert gas IG, but an inert gas other than nitrogen gas may be used.

[0056] By forming an inert gas atmosphere, the environment in the space formed by the first housing 2a and the second housing 2b can be stabilized. In particular, when vacuum ultraviolet light is used as the light L1, the formation of an inert gas atmosphere suppresses absorption of the light L1 by oxygen in the air and contributes to improving the illuminance of the light L1 on the treatment object 4.

[0057] In this specification, unless otherwise specified, the term "inert gas atmosphere" refers to a mixed gas in which the inert gas IG occupies 90 vol% or more of the total inside the housing (2a, 2b). In this case, the oxygen concentration inside the housing (2a, 2b) is definitely less than 10 vol%. For example, when 172 nm ultraviolet light travels 4 mm through a space in which the oxygen concentration is less than 10%, a light intensity of 50% or more can be ensured. It is preferable that the inert gas IG occupies 95 vol% or more inside the housing (2a, 2b). In this case, the oxygen concentration inside the housing (2a, 2b) is definitely less than 5%. For example, when 172 nm ultraviolet light travels 4 mm through a space in which the oxygen concentration is 5% or less, a light intensity of 70% or more can be ensured. It is more preferable that the inert gas concentration inside the housing (2a, 2b) is 98 vol% or more.

[0058] The gas supply port 8 provided in the housing (2a, 2b) will be described in detail. In this embodiment, the gas supply port 8 may be designed to supply the inert gas IG along a plane (XY plane) including the transport direction of the workpiece 4 and not to spray the inert gas IG toward the workpiece 4. This prevents the sprayed inert gas IG from colliding with the workpiece 4 and causing turbulence in the atmosphere in the housing (2a, 2b). If the gas becomes turbulent inside the housing (2a, 2b), gas will easily enter the housing (2a, 2b) from outside the housing (2a, 2b). The supply direction of the gas supply port 8 may be tilted from the XY plane to such an extent that the inert gas IG is not sprayed toward the workpiece 4.

[0059] 1, the gas supply ports 8 are arranged at approximately equal intervals in the transport direction. In this case, it is preferable to set the inert gas supply amount of each gas supply port 8 to approximately the same amount. This can suppress the formation of turbulence in the housings (2a, 2b).

[0060] 2A and 2B, the gas supply port 8 is provided in an elongated member that is long in the X direction. A plurality of holes are arranged in the member in the X direction. This allows the inert gas to be supplied evenly in the width direction (X direction). The gas supply port 8 may also be a slit-shaped gas supply port that is long in the X direction.

[0061] 1, a plurality of gas supply ports 8 are connected to a gas supply source 12 via gas piping 6. The gas piping 6 is branched as necessary. A flow rate control valve 17 is provided midway through the gas piping 6. Note that, in the present invention, the gas supply ports 8 are not an essential component, and the gas supply ports 8 may be used as necessary.

[0062] Only one of the first housing 2a and the second housing 2b may have the gas supply port 8. Even if only one of the first housing 2a and the second housing 2b has the gas supply port 8, the gas supplied from the gas supply port 8 flows around the object to be treated 4 and the belt 7 and can replace the atmospheric gas in the housing on the side without the gas supply port 8.

[0063] [Gas recovery chamber] The gas recovery chamber will be described with reference to FIG. 1. The optical processing device 100 has gas recovery chambers (20a, 20b) for recovering gas, located upstream (+Y direction) of the housings (2a, 2b) on the transfer path. The gas recovery chamber 20a is located on the light irradiation surface side (+Z side) of the object 4 to be processed. The gas recovery chamber 20b is located on the opposite side (-Z side) of the light irradiation surface of the object 4 to be processed. The gas recovery chamber 20b and the gas recovery chamber 20a are located opposite to each other across the object 4 to be processed. The optical processing device 100 has gas recovery chambers (30a, 30b) for recovering gas, located downstream (-Y direction) of the housings (2a, 2b) on the transfer path. The gas recovery chamber 30a is located on the light irradiation surface side (+Z side) of the object 4 to be processed. The gas recovery chamber 30b is located on the opposite side (-Z side) of the light irradiation surface of the object 4 to be processed. The gas recovery chamber 30b and the gas recovery chamber 30a are located opposite to each other with the object to be processed 4 interposed therebetween.

[0064] The gas recovery chamber 20a is a housing having an opening in a direction approaching the workpiece 4 (-Z direction). The gas recovery chamber 20a may have a plurality of gas recovery ports arranged in the housing. The plurality of gas recovery ports may be formed by arranging a multi-hole plate (not shown) in the gas recovery chamber 20a. The plurality of gas recovery ports may be connected to a common exhaust port 23. The exhaust port 23 is connected to an exhaust source not shown in FIG. 1. The gas recovery chambers (20b, 30a, 30b) may have a structure similar to that of the gas recovery chamber 20a, or may have a different structure.

[0065] The inert gas IG inside the first housing 2a and the second housing 2b leaks out upstream or downstream of the first housing 2a and the second housing 2b through the carry-in opening 5i or the carry-out opening 5o. The gas recovery chambers (20a, 20b, 30a, 30b) recover the leaking inert gas IG. This protects people near the light treatment device 100 from oxygen deficiency. Note that if there is no person near the light treatment device 100 or if there is an exhaust facility that does not belong to the light treatment device 100, the light treatment device 100 does not need to have a gas recovery chamber. In other words, the gas recovery chambers (20a, 20b, 30a, 30b) are not essential components of the light treatment device 100.

[0066] The optical treatment device may have only one of the gas recovery chambers (20a, 20b) upstream of the housings (2a, 2b) and the gas recovery chambers (30a, 30b) downstream of the housings (2a, 2b).

[0067] The oxygen concentration inside the housings (2a, 2b) may be measured by one or more oxygen concentration meters, and the supply amount of the inert gas IG may be adjusted or the exhaust amount of the gas recovery chambers (20a, 20b, 30a, 30b) may be adjusted according to the measured oxygen concentration. The oxygen concentration meters and a mechanism for adjusting the supply amount of the inert gas IG or a mechanism for adjusting the exhaust amount may be connected to a control unit, and the control unit may automatically control the oxygen concentration.

[0068] [Subject to be treated] The object to be treated in this embodiment may be a substrate used in an FPD (flat panel display) or the like. When the substrate is an inorganic material such as glass, it is particularly preferable to irradiate the entire surface of the substrate with light L1 for optical cleaning of the substrate. When the substrate is a film such as a resin, it is particularly preferable to irradiate the entire surface of the substrate with light L1 for modification of the substrate. When the substrate is a metal sheet used in a fuel cell or the like, it is preferable to irradiate the metal sheet with light L1 for cleaning the metal sheet or for imparting a matte effect to the metal sheet. Another example of the object to be treated 4 may be a sheet-like decorative sheet. It is preferable to impart a matte effect to the surface by surface-modifying the resin on the decorative sheet surface.

[0069] When the object 4 is in sheet form, the object 4 may be transported, for example, by a roll-to-roll method. In the roll-to-roll method, the sheet-shaped object 4 is unwound from a roll of the object 4 in an unwinding device (not shown), transported along a transport path, and wound up in a winding device (not shown). In the transport path, the object 4 is supported by a plurality of guide rollers 33. In other words, when the object 4 is in sheet form, the belt 7 may not be necessary.

[0070] FIG. 9 is a cross-sectional view showing another embodiment of the light treatment device. The light treatment device 200 has an outer housing 50 so as to surround the housings (2a, 2b) and the collection chambers (20a, 20b, 30a, 30b). A plurality of FFUs (fan filter units) 51 are attached to the ceiling (the wall on the +Z direction side) of the outer housing 50. The plurality of FFUs 51 send gas outside the outer housing 50 into the inside of the outer housing 50. The sent gas forms a downflow and is discharged from a plurality of holes 52 provided in the floor (the wall on the -Z direction side) of the outer housing 50. As shown in this figure, there may be a gap between the housings (2a, 2b) and the collection chambers (20a, 20b, 30a, 30b).

[0071] The above describes an embodiment of the optical processing device and its modified examples. However, the present invention is not limited to the above-described embodiment, and various modifications or improvements can be made to the above-described embodiment without departing from the spirit of the present invention.

[0072] For example, the above-mentioned light processing device has only one space formed by the first housing 2a and the second housing 2b, but may have a housing for forming a further light processing space upstream or downstream in the transport direction of the first housing 2a and the second housing 2b.

[0073] For example, in the above-mentioned light treatment device, the irradiation direction of the light L1 is the same as the gravity direction (-Z direction), but the irradiation direction of the light L1 may be different from the gravity direction. For example, the ultraviolet light may be irradiated in the horizontal direction to the transport body transported in the gravity direction. [Explanation of symbols]

[0074] 2a: First housing 2b: Second case 2b1: Main body (constituting the second housing) 2b2: (Constituting the second housing) belt member 3:Light source 4: Object to be treated 5i: Loading opening 5o:Export opening 6: Gas piping 7: Belt 8: Gas supply port 12: Gas supply source 15: Internal 17: Flow control valve 20: (Second housing) strip area 20a: Gas recovery chamber 20b: Gas recovery chamber 21: Area (opposing the strip area across the entrance opening in the second housing) 22: Light shielding section 23: Exhaust port (for gas recovery chamber) 24: (of belt member) recess 26, 27: (of belt member) end 30a, 30b: Gas recovery chamber 33: Guide roller 40: (Belt material) groove 41: Through hole (of belt member) 42: Head bolt 43: Flange (of belt member) 45: (part of belt material) 46: Sliding guide 50:Outer housing 51 :FFU 52: Hole (in outer housing) 100,200: Optical processing equipment F1: Engagement mechanism IG: Inert gas L1: light

Claims

1. a light source that irradiates ultraviolet light onto the object to be processed that is transported along the transport path; a housing having the light source therein and an opening for carrying the object into or out of the housing; a thermal deflection reducing portion that reduces thermal deflection of the housing surrounding the opening; An optical processing device comprising:

2. The housing includes a first housing having the light source therein, and a second housing having a space for irradiating the ultraviolet light onto the treatment object, The optical processing device according to claim 1 , wherein the opening is provided in the second housing.

3. the opening has a shape that is short in a thickness direction of the object to be processed and long in a width direction of the object to be processed, The optical processing device according to claim 2 , wherein the second housing includes a band region sandwiched between the opening and an end of the second housing.

4. The band region is formed of a band member separate from a main body constituting a portion other than the band region, the thermal deflection reduction portion includes an engagement mechanism that loosely engages the belt member with the main body, 4. The optical processing device according to claim 3, wherein the engagement mechanism allows displacement caused by thermal expansion in the extension direction of the belt member, while restricting displacement caused by thermal expansion in a direction perpendicular to the extension direction.

5. The optical processing device according to claim 3 , wherein the thermal deflection reduction section has a heater that heats a region of the first housing that faces the band region across the opening.

6. The optical processing device according to claim 3 , wherein the thermal deflection reducing portion has a cooler that cools the band region.

7. The optical processing device according to claim 3 , wherein the thermal deflection reducing portion includes a light blocking portion inserted between the band region and the light source.

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