Resin molding device, method for manufacturing resin molded product, and program

Abstract

To provide a resin molding device that can appropriately determine a scattering state of a resin material supplied onto an object to be used in molding a resin molded product, and can appropriately prevent an occurrence of molding defect.SOLUTION: A resin molding device includes: an imaging part that captures an image of a resin material supplied onto an object; a molding mechanism that uses resin material supplied onto the object to mold a resin molded product; and a control part that acquires images and controls an operation of the molding mechanism. The control part calculates an occupancy ratio of areas where resin material is present or not present in each of a plurality of blocks contained in the image, and determines whether or not molding using the resin material can be performed by the molding mechanism based on a similarity between the plurality of occupancy ratios calculated for each of the plurality of blocks and a plurality of reference ratios that are preset for each of the plurality of blocks.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus, a method for manufacturing a resin molded product, and a program. [Background technology]

[0002] Patent Document 1 discloses a compression molding device. In this compression molding device, granular resin is spread evenly on a sheet of film, and the sheet of film on which the resin has been spread is transported to a press section. In the press section, the resin spread on the sheet of film is used to perform compression molding of a workpiece. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-136942 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a compression molding device such as that described in Patent Document 1, the appearance of the workpiece after molding is affected by how the resin spread on the film is scattered. That is, depending on the scattering state of the resin supplied on the film, molding defects may occur. For example, when the resin material is significantly unevenly distributed on the film, molding defects may occur.

[0005] An object of the present invention is to provide a resin molding device, a manufacturing method for a resin molded product, and a program that can appropriately determine the scattering state of resin material supplied onto an object to be used in molding a resin molded product, and appropriately prevent the occurrence of molding defects. [Means for solving the problem]

[0006] A resin molding device according to an aspect of the present invention includes an imaging unit, a molding mechanism, and a control unit. The imaging unit captures an image of the resin material supplied onto an object. The molding mechanism molds a resin molded product using the resin material supplied onto the object. The control unit acquires the image and controls the operation of the molding mechanism. The control unit calculates the occupancy ratio of an area where the resin material is present or not present in each of a plurality of blocks included in the image. The control unit determines whether or not molding using the resin material can be performed by the molding mechanism based on the similarity between the multiple occupancy ratios calculated for each of the multiple blocks and multiple reference ratios preset for each of the multiple blocks.

[0007] A method for manufacturing a resin molded product according to another aspect of the present invention is a method for manufacturing a resin molded product using the above-mentioned resin molding apparatus, and includes the steps of placing a resin material in a molding die and clamping the molding die in which the resin material is placed.

[0008] A program according to yet another aspect of the present invention causes a computer connected to a molding mechanism that molds a resin molded product to execute the steps of acquiring an image of resin material supplied onto an object, calculating the occupancy ratio of areas where resin material is present or not present in each of a plurality of blocks contained in the image, and determining whether or not molding can be performed by the molding mechanism using the resin material based on the similarity between the multiple occupancy ratios calculated for each of the multiple blocks and multiple reference ratios that are preset for each of the multiple blocks. Effect of the Invention

[0009] According to the present invention, the scattering state of a resin material supplied onto an object to be used in molding a resin molded product can be appropriately determined, and the occurrence of molding defects can be appropriately prevented. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a plan view showing a resin molding apparatus; [Diagram 2]FIG. 4 is a side cross-sectional view that typically illustrates the periphery of a resin material supply mechanism. [Diagram 3] 10A and 10B are diagrams for explaining the state of shooting by the shooting section; [Figure 4] 4 is a flowchart showing an operation procedure of the resin molding device. [Diagram 5] FIG. 2 is a diagram for explaining blocks set in an image. [Figure 6] A graph comparing occupancy rate and standard rate. [Figure 7] Another graph comparing occupancy rate and standard rate graphs. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals and their description will not be repeated. In addition, in order to facilitate understanding, each drawing is drawn in a schematic manner with objects appropriately omitted or exaggerated.

[0012] [1. Configuration of resin molding equipment] 1 is a plan view showing a resin molding apparatus 100 according to the present embodiment. The resin molding apparatus 100 resin molds an object to be molded. In the description here, a substrate W1 on which electronic components such as semiconductor chips are mounted is exemplified as the object to be molded. The resin molding apparatus 100 resin-seals the substrate W1 using a resin material P to produce a substrate W2 that will be a resin molded product. Although not limited thereto, here, the component mounting surface of the substrate W1 on which electronic components are mounted is resin-sealed.

[0013] Examples of the substrate W1 include a semiconductor substrate such as a silicon wafer, a lead frame, a printed wiring board, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, etc. The substrate may be a carrier used in FOWLP (Fan Out Wafer Level Packaging) or FOPLP (Fan Out Panel Level Packaging). The substrate may or may not already have wiring.

[0014] As shown in FIG. 1, the resin molding apparatus 100 includes a master module M1, a mold module M2, and a resin module M3. The mold module M2 includes a molding mechanism 5. The molding mechanism 5 performs resin molding to process a substrate W2 by sealing electronic components on the substrate W1 with a resin material P. The master module M1 supplies the substrate W1, which is an object to be molded, to the molding mechanism 5, and collects and stores the substrate W2 (resin molded product) after molding from the molding mechanism 5. The resin module M3 supplies the resin material P to the molding mechanism 5. The above-mentioned modules M1 to M3 are connected in this order as an integrated device, but each of the modules M1 to M3 is detachable and replaceable with another module. In FIG. 1, two modules M2 are shown, but the number of modules M2 may be only one, or three or more may be provided. The same applies to the modules M1 and M3, and the number of the modules M1 to M3 can be increased or decreased.

[0015] The resin molding apparatus 100 further includes a control unit 10 and a storage unit 12. The control unit 10 includes a central processing unit (CPU), a random access memory (RAM), a read only memory (ROM), etc., and the CPU executes a program 15 stored in the storage unit 12 and / or the ROM to control the operation of each unit of the modules M1 to M3. The control unit 10 is connected to various mechanisms, such as the molding mechanism 5, included in the modules M1 to M3, and causes these mechanisms to operate in cooperation with each other. The storage unit 12 includes any type of storage medium, such as a hard disk or a flash memory, and may be configured by combining multiple types of storage media. The control unit 10 may be configured as one unit, or may be configured as multiple units distributed and arranged inside or outside the modules M1 to M3. The storage unit 12 may also be configured as one unit, or may be configured as multiple units distributed and arranged inside or outside the modules M1 to M3.

[0016] In the example of FIG. 1, the program 15 is stored in the storage unit 12. The program 15 may be provided to the resin molding apparatus 100 using a non-transitory storage medium 16 that readably stores the program 15. The storage medium 16 is, for example, a portable memory. Examples of the portable memory include a CD-ROM, a Universal Serial Bus (USB) memory, an SD card, a micro SD card, and a Compact Flash (registered trademark). When the storage medium 16 is a portable memory, the CPU of the control unit 10 may read the program 15 from the storage medium 16 using a reading device (not shown). The read program 15 is written to the storage unit 12. Furthermore, the program 15 may be provided to the resin molding apparatus 100 by a communication unit (not shown) of the resin molding apparatus 100 communicating with an external device. In this case, the CPU of the control unit 10 acquires the program 15 through the communication unit. The acquired program 15 is written to the storage unit 12. The number of CPUs included in the control unit 10 is not limited to one, and may be two or more. When the control unit 10 has a plurality of CPUs, the plurality of CPUs may cooperate to execute the operations of each of the modules M1 to M3.

[0017] Furthermore, the resin molding apparatus 100 includes an input device, a display device, and the like as a user interface (UI) device 14. The UI device 14 can be realized as, for example, a touch panel.

[0018] The master module M1 includes a supply mechanism 1, a storage unit 2, a placement unit 3, and a transport mechanism 4. The supply mechanism 1 supplies the substrate W1 onto the placement unit 3. The storage unit 2 stores the substrate W2. The placement unit 3 moves in the Y direction between a position corresponding to the supply mechanism 1 and a position corresponding to the storage unit 2. The transport mechanism 4 is movable in the X, Y, and Z directions within the master module M1 and the mold module M2. The transport mechanism 4 holds the substrate W1 on the placement unit 3, transports it to the mold module M2, and passes it on to the molding mechanism 5. The transport mechanism 4 also collects the substrate W2 from the molding mechanism 5, transports it to the master module M1, and places it on the placement unit 3. The substrate W2 is then stored in the storage unit 2. The X and Y directions correspond to the left-right and up-down directions in FIG. 1, respectively. The Z direction corresponds to the direction perpendicular to the paper surface of FIG. 1.

[0019] The molding mechanism 5 manufactures the board W2 by compression molding. Here, a granular resin material P is used. In compression molding, other forms of the resin material P, such as a liquid resin material P, may be used. An example in which the granular resin material P is used will be described below. The molding mechanism 5 includes a molding die 50 and a mold clamping mechanism 53. The molding die 50 includes an upper die 52 (first die) and a lower die 51 (second die) facing the upper die 52. The upper die 52 can hold the board W1 on its lower surface. The board W1 is held with the component mounting surface facing downward. The lower die 51 includes a bottom member and a frame-shaped side member. The bottom member is disposed inside the frame-shaped side member. This forms a concave cavity 51A. The bottom member constitutes the bottom surface of the cavity 51A, and the side member constitutes the side surface of the cavity 51A.

[0020] In the cavity 51A, the resin material P is arranged in a state where it is scattered on the film 73 as described later. The resin material P in the cavity 51A is heated by a heating device not shown. The mold clamping mechanism 53 clamps the upper mold 52 and the lower mold 51 to close the cavity 51A while the heating device is heating the resin material P, and hardens the resin material P in the cavity 51A. As a result, the component mounting surface of the board W1 held by the upper mold 52 is sealed with the resin material P. Thereafter, the mold clamping mechanism 53 performs mold opening to open the upper mold 52 and the lower mold 51, and the board W2 is taken out from the molding die 50. In this embodiment, the resin material P has thermosetting properties, but may have thermoplastic properties. When the resin material P has thermoplastic properties, the resin material P is heated and melted during resin molding, and then cooled to harden the resin material P.

[0021] The resin module M3 includes a moving table 6, a storage section 7, and a supply mechanism 8. The moving table 6 is movable in the X and Y directions within the resin module M3. FIG. 2 is a side cross-sectional view that shows the periphery of the supply mechanism 8. As shown in FIG. 2, a film 73 supplied from a film supply mechanism (not shown) is laid on the moving table 6, and a frame body 72 is further placed on the film 73. This forms a storage section 7 having a space 71 with the film 73 as the bottom surface and the frame body 72 as the side surface. The film 73 is a release film. The space 71 is open toward the top and has a shape and size corresponding to the cavity 51A of the lower mold 51. In this embodiment, the frame body 72 and the space 71 are rectangular. A resin material P is supplied from the supply mechanism 8 into the space 71 of the storage section 7. The resin material P is supplied from above so as to be scattered into the space 71.

[0022] As shown in FIG. 2, the supply mechanism 8 includes a storage section 80, a conveying path 81, and a vibration mechanism 82. The storage section 80 temporarily stores the resin material P. The conveying path 81 is connected to the storage section 80, and is a conveying path for the resin material P flowing out from the storage section 80, and has a discharge port 85. The vibration mechanism 82 vibrates the storage section 80 and the conveying path 81 to send out the resin material P from the storage section 80, and further conveys the resin material P along the conveying path 81 to the discharge port 85 side. After reaching the discharge port 85, the resin material P falls through the discharge port 85 and is contained in the storage section 7. During the operation of the vibration mechanism 82, the moving table 6 moves relative to the discharge port 85 in the X and Y directions. As a result, the resin material P is evenly spread in the storage section 7. The Y direction is perpendicular to the paper surface in FIG. 2. The X direction is the left-right direction.

[0023] The supply mechanism 8 further includes a weighing mechanism 83, and supplies a preset target amount of resin material P into the storage unit 7. For example, the weighing mechanism 83 weighs the weight of the resin material P in the storage unit 80 and the conveying path 81. The control unit 10 controls the vibration mechanism 82 based on the weighing result by the weighing mechanism 83 so that the amount of resin material P supplied into the storage unit 7 becomes the target amount.

[0024] 1 again, the resin module M3 further includes an imaging unit 20 and a transport mechanism 9. The imaging unit 20 captures an image of the resin material P supplied onto the film 73 by the supply mechanism 8. In other words, the imaging unit 20 captures an image of the resin material P scattered within the storage unit 7 being scattered on the film 73. The image generated by the imaging unit 20 is transmitted to the control unit 10 and appropriately stored in the memory unit 12.

[0025] FIG. 3 is a diagram for explaining the photographing state by the photographing unit 20. As shown in FIG. 3, the photographing unit 20 photographs the resin material P in the container 7 from above, for example, with the moving table 6 positioned below the photographing unit 20. The photographing unit 20 includes one or more camera modules 21. The camera module 21 includes an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The photographing unit 20 also includes a light source 22 disposed above the camera module 21. Note that a backlight may be disposed instead of such a light source 22. That is, a light source, a light guide plate, and the like may be disposed behind the subject as viewed from the camera module 21, in other words, below the film 73.

[0026] 1 again, the transport mechanism 9 can move in the X, Y, and Z directions in the mold module M2 and the resin module M3. The transport mechanism 9 transports the film 73 on which the resin material P is placed to the mold module M2. Then, the film 73 on which the resin material P is placed is placed in the cavity 51A of the lower mold 51 of the molding mechanism 5. After the resin material P is scattered on the film 73, the resin material P on the film 73 is handled so that its position does not move significantly until it is set in the cavity 51A after being photographed by the photographing unit 20. In other words, the scattered state of the resin material P on the film 73 does not change much from the time the resin material P is scattered to the time it is set in the cavity 51A.

[0027] [2. Suppression of molding defects in resin molded products] As described above, in the molding mechanism 5, the resin material P is used to resin mold the substrate W1. As described above, the resin material P that is accommodated in the lower die 51 in a state where it is scattered on the film 73 is melted by a heating device. During the clamping process, the molten resin material covers the component mounting surface of the substrate W1 held by the upper die 52. In this state, the temperature of the resin material P rises. This causes the resin material P to harden, forming a resin layer that seals the component mounting surface of the substrate W1. As a result, the substrate W2 having the resin layer is manufactured. The film 73 is peeled off from the substrate W2.

[0028] According to the molding process described above, the appearance of the substrate W2 after molding is affected by how the resin material P is scattered on the film 73. That is, depending on the state of scattering of the resin material P on the film 73, molding defects may occur in the substrate W2. Note that molding defects here include, for example, large variations in the thickness of the resin layer in one substrate W2. In addition, various molding defects, such as chips flowing on the component mounting surface, may be considered as molding defects that occur depending on the state of scattering of the resin material P.

[0029] In order to prevent molding defects as described above, in the resin molding apparatus 100, the photographing unit 20 photographs an image showing the state in which the resin material P is scattered on the film 73. Then, the control unit 10 judges whether the state in which the resin material P is scattered on the film 73 is appropriate based on this image, and judges whether resin molding can be performed accordingly. In other words, if molding defects are likely to occur based on the scattered state of the resin material P, resin molding is refrained from and the occurrence of molding defects is appropriately prevented. The specific processing will be described below.

[0030] [3. Operation of resin molding device] 4 is a flowchart showing a part of the operation procedure in the resin molding apparatus 100. The process shown in this flowchart is executed by the control unit 10.

[0031] First, in step S1, the control unit 10 controls the supply mechanism 8 to supply a target amount of resin material P into the container 7. This control is executed in a state where the container 7 is located below the discharge port 85 of the supply mechanism 8. The control unit 10 moves the moving table 6 to place the container 7 below the discharge port 85. In this state, the control unit 10 vibrates the vibration mechanism 82 to supply the resin material P into the container 7, while measuring the supply amount of the resin material P by the measuring mechanism 83. Then, the vibration and measuring are continued until the supply amount of the resin material P reaches the target amount, and when the target amount is reached, the vibration and measuring are stopped. In addition, the control unit 10 moves the moving table 6 while vibrating the vibration mechanism 82 so that the resin material P is evenly spread in the container 7.

[0032] In the next step S2, the control unit 10 moves the movable table 6 to position the accommodation unit 7 accommodating the resin material P below the camera module 21. Then, in this state, the photographing unit 20 performs photographing. The photographing unit 20 photographs the resin material P supplied into the frame body 72 from above. As a result, an image (hereinafter referred to as the original image) showing the resin material P scattered on the film 73 is generated. The control unit 10 acquires the original image from the photographing unit 20.

[0033] In the next step S3, the control unit 10 performs gradation processing and binarization on the original image. As an example, in this embodiment, it is assumed that the camera module 21 is a monochrome camera and the original image is a grayscale image. In this case, for example, in the gradation processing, each pixel of the original image is classified into 256 levels [0 (dark)-255 (light)]. "255" is assigned to a white pixel, and "0" is assigned to a black pixel. In the binarization, each pixel is classified into "white (1)" or "black (0)". For example, "white" is assigned to a pixel whose value assigned by the gradation processing is equal to or greater than a threshold value X1 (for example, 200), and "black" is assigned to a pixel whose value assigned by the gradation processing is less than the threshold value X1. As a result, each pixel value included in the original image is converted to a binary value, and the original image is converted to a binary image.

[0034] The threshold value X1 used for binarization can be appropriately set by the user. For example, the user determines an appropriate threshold value X1 according to the color of the resin material P, the color of the film 73, the color of the moving table 6 below the film 73, the amount of light from the light source 22, and the like, and inputs it by operating the UI device 14. The control unit 10 sets the threshold value X1 based on the user's input. The threshold value X1 is stored in the storage unit 12. The user's input may be the threshold value X1 itself, or may be information for specifying the threshold value X1. The information for specifying the threshold value X1 is, for example, information for specifying a specific pixel in an image prepared for testing, and when the user specifies a specific pixel, the pixel value of the pixel may be set as the threshold value X1.

[0035] In the next step S4, the control unit 10 sets a plurality of blocks T1 to T18 within the shooting range (entire field of view) A1 of the original image. Fig. 5 is a diagram for explaining the blocks T1 to T18 included in the original image. A rectangular area A2 included in the shooting range A1 corresponds to the space within the frame 72, i.e., the space 71 in which the resin material P is contained within the container 7. The blocks T1 to T18 are areas defined in a lattice pattern within the area A2.

[0036] In this embodiment, the control unit 10 specifies the position of the region A2 within the shooting range A1, and further sets the blocks T1 to T18 by dividing the region A2. The method of specifying the position of the region A2 is not particularly limited. For example, when the positional relationship between the camera module 21 and the frame body 72 at the time of shooting is constant, the position of the region A2 can be set in advance. Alternatively, the region A2 within the frame body 72 in which the resin material P is placed may be separated from the background and automatically detected by performing image processing such as processing to detect the edge of the frame body 72 on the original image. The position of the region A2 may be specified in step S3. In this case, the gradation processing and binarization in step S3 may be performed only on the image within the region A2. The method of dividing the region A2 is also not particularly limited. For example, the control unit 10 can equally divide the region A2 as in the example of FIG. 5 so that the number of blocks is a predetermined division number. The control unit 10 can set parameters such as the division number for setting the blocks T1 to T18 based on the user's input.

[0037] In the next step S5, the control unit 10 calculates the occupancy ratio in each of the multiple blocks T1 to T18. In this embodiment, the occupancy ratio is the ratio of the area where the resin material P exists to each block included in the original image or the binarized image.

[0038] By the binarization in step S3, pixels in the area A2 where resin material P exists and pixels in the area where resin material P does not exist are assigned different values ​​out of two values, "white" and "black." Moreover, the area in area A2 where resin material P does not exist is the area in the original image where film 73 (or moving table 6 below film 73 if film 73 is transparent) is reflected. Here, for example, assume that resin material P is a blackish color (or a deep or dark color) and film 73 or moving table 6 is a lighter or brighter color. In this case, "black" is assigned by binarization to pixels in the area where resin material P exists, and "white" is assigned to pixels in the area where resin material P does not exist.

[0039] In step S5, the control unit 10 counts the number of pixels in each block that have been assigned "black" through binarization. Then, the ratio of the number of pixels assigned "black" to the total number of pixels in the block is calculated as the occupation ratio. If the resin material P is a lighter or brighter color than the film 73 or the moving table 6, the occupation ratio in this embodiment can be calculated by dividing the number of pixels assigned "white" by the total number of pixels.

[0040] The above occupancy ratios are calculated for each of the multiple blocks T1 to T18. Therefore, a set of values ​​for multiple occupancy ratios C1 to C18 is calculated in step S5. The occupancy ratios C1 to C18 correspond to the blocks T1 to T18, respectively.

[0041] In the next step S6, the control unit 10 calculates the similarity between the set of multiple occupancy ratios C1 to C18 and the set of multiple reference ratios R1 to R18. The reference ratios R1 to R18 are set in advance for each of the blocks T1 to T18. Although not limited to this, in this embodiment, a correlation coefficient is calculated as the similarity. The correlation coefficient is a value obtained by dividing the covariance between the occupancy ratios C1 to C18 and the reference ratios R1 to R18 by the product of the standard deviation of the occupancy ratios C1 to C18 and the standard deviation of the reference ratios R1 to R18.

[0042] Fig. 6 is a diagram comparing graphs of occupancy ratios C1 to C18 and reference ratios R1 to R18. The similarity is the similarity between the set of values ​​of occupancy ratios C1 to C18 and the set of values ​​of reference ratios R1 to R18. In other words, it can be said to be the similarity between the graph of occupancy ratios C1 to C18 and the graph of reference ratios R1 to R18 as shown in Fig. 6.

[0043] The reference ratios R1 to R18 are the ratios of the areas where the resin material P exists in the blocks T1 to T18 included in the reference image. The reference ratios R1 to R18 can be calculated by performing the same processing as steps S3 to S5 on the original image on the reference image. The reference image is an image whose similarity with the original image is to be compared. For example, the reference image is an image captured when the resin material P used in molding the substrate W2 is scattered on the film 73 before molding the substrate W2 that has been manufactured satisfactorily. A high similarity between the reference ratios R1 to R18 calculated from such a reference image and the occupancy ratios C1 to C18 means that the scattering state of the resin material P on the film 73 in the reference image and the original image is similar. Therefore, the similarity calculated in step S6 being greater than a predetermined value means that there is a high possibility that a good substrate W2 will be molded without molding defects when the substrate W2 is molded using the resin material P in the scattered state shown in the original image.

[0044] Therefore, in the next step S7, the control unit 10 judges whether molding using the resin material P by the molding mechanism 5 is possible based on the similarity calculated in step S6. For example, it judges whether the similarity is equal to or greater than a threshold value X2, and if the similarity is equal to or greater than the threshold value X2 (similar), it judges that molding by the molding mechanism 5 is possible, and proceeds to step S8. On the other hand, if the similarity is smaller than the threshold value X2 (not similar), it judges that molding by the molding mechanism 5 is not possible, and proceeds to step S9.

[0045] The threshold value X2 used in step S7 can be appropriately set by the user. For example, the correlation coefficient threshold value X2 is preferably set to a value of 60% or more, may be set to a value of 70% or more, or may be set to a value of 80% or more. The user can input this by operating the UI device 14. In this case, the control unit 10 sets the threshold value X2 based on the user's input. The threshold value X2 is stored in the storage unit 12.

[0046] The set of values ​​of the reference ratios R1 to R18 used in step S6 can also be set appropriately by the user. The user can set this by operating the UI device 14. In this case, the control unit 10 sets the set of reference ratios R1 to R18 based on the user's input to the UI device 14. The set of reference ratios R1 to R18 is stored in the storage unit 12. The user may specify the values ​​of the reference ratios R1 to R18 themselves, or may specify a reference image. When the user specifies a reference image, the control unit 10 calculates a set of reference ratios R1 to R18 from the reference image and sets this. The control unit 10 may also calculate one set of reference ratios R1 to R18 from multiple reference images specified by the user and set this. In this case, for example, one set of reference ratios R1 to R18 can be calculated by averaging or taking the median for each block for multiple sets of reference ratios R1 to R18 calculated respectively from multiple reference images.

[0047] Note that a plurality of sets of values ​​of the reference ratios R1 to R18 may be set. For example, if there are a plurality of types of the dispersion of the resin material P on the film 73 that can favorably mold the substrate W2, a plurality of sets of the reference ratios R1 to R18 corresponding to the respective types can be set. In this case, in step S7, if the similarity between any of the plurality of similarities calculated between the occupancy ratios C1 to C18 and the plurality of sets of the reference ratios R1 to R18 is equal to or greater than the threshold value X2, it can be determined that molding is possible. Conversely, if the similarity between all the sets is smaller than the threshold value X2, it can be determined that molding is not possible. In this case, the threshold value X2 may be set for each set.

[0048] In step S8 when it is determined that molding is possible, the control unit 10 causes the molding mechanism 5 to perform molding using the scattered resin material P shown in the original image. Specifically, the control unit 10 controls the transport mechanism 9 to transport the film 73 carrying the resin material P to the molding mechanism 5, and the molding mechanism 5 manufactures the substrate W2. Thereafter, the control unit 10 controls the transport mechanism 4 to recover the substrate W2 into the storage unit 2.

[0049] On the other hand, in step S9 when it is determined that molding is not possible, the control unit 10 discards the scattered resin material P shown in the original image. For example, the control unit 10 controls the conveying mechanism 9 to convey the film 73 on which the resin material P is placed to a disposal box (not shown), and discards the resin material P and the film 73.

[0050] When step S8 or S9 is completed, the process of Fig. 4 is completed. The process of Fig. 4 is repeatedly executed, thereby continuously manufacturing the substrates W2.

[0051] [4. Features] In the above embodiment, before molding of the substrate W2, the suitability of the scattered state of the resin material P supplied onto the film 73 is appropriately judged based on the similarity. If the judgment result is poor, molding using the resin material P in such a scattered state is stopped. As a result, the occurrence of molding defects can be appropriately prevented.

[0052] Furthermore, even if the resin material P is supplied unevenly on the film 73 and is not evenly spread, a non-defective substrate W2 may be manufactured. In the above embodiment, it is possible to determine that molding is possible even in such a case, and it is also possible to prevent excessive waste of the resin material P.

[0053] 5. Other embodiments Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. In addition, the gist of the following modifications can be combined as appropriate.

[0054] [5―1] In the above embodiment, the correlation coefficient is calculated as the similarity, but the present invention is not limited to this example, and any index that can express the similarity between the set of values ​​of the occupancy ratios C1 to C18 and the set of values ​​of the reference ratios R1 to R18 can be used. For example, the similarity can be a coefficient of determination that is the square of the correlation coefficient, or it may be calculated by AI (artificial intelligence). In addition, it is not necessary to calculate a quantitative index such as similarity in order to determine whether or not the molding is possible based on the similarity. For example, AI (artificial intelligence) may determine whether or not the graph of the occupancy ratios C1 to C18 is similar to the graph of the reference ratios R1 to R18, and the possibility of molding may be determined according to the result of the similarity determination.

[0055] [5―2] In the above embodiment, the frame 72, the space 71 in the housing 7, and the area A2 are rectangular, but they may be any shape, such as a circle. The shape of the block is also not limited to a rectangle and may be any shape.

[0056] In the above embodiment, the blocks are set by equally dividing the area A2. However, the size and shape of the blocks may be different from each other. For example, the blocks may be set larger as they are closer to the center of the area A2 and smaller as they are further from the center, or conversely, the blocks may be set smaller as they are closer to the center of the area A2 and larger as they are further from the center. Furthermore, the blocks do not need to be set without gaps or overlaps within the area A2, and may partially overlap each other. There may be gaps within the area A2 that are not included in the blocks.

[0057] [5―3] In the above embodiment, the occupancy ratios C1 to C18 and the reference ratios R1 to R18 are the ratios of the regions in the blocks T1 to T18 where the resin material P is present. However, the occupancy ratios C1 to C18 and the reference ratios R1 to R18 may also be the ratios of the regions in the blocks T1 to T18 where the resin material P is not present.

[0058] [5―4] In the above embodiment, the reference image is an image of a good example. However, the reference image may be an image of a bad example. That is, an image of the resin material P scattered on the film 73 before molding of the defective substrate W2 may be used as the reference image. When a bad example is used as the reference image, in step S7, if the similarity is equal to or less than the threshold value X2 (not similar), it is determined that molding is possible, and if the similarity is greater than the threshold value X2 (similar), it is determined that molding is not possible. In addition, both images of good examples and images of bad examples may be prepared as the reference images.

[0059] [5―5] In the above embodiment, in step S1, the amount of resin material P supplied into the container 7 is controlled to be a target amount. In this case, the total value of the occupancy ratios C1 to C18 and the total value of the reference ratios R1 to R18 are approximately equal, and it is expected that the integral values ​​of both graphs shown in FIG. 6 are also approximately equal. On the other hand, if an excessive or insufficient amount of resin material P is supplied into the container 7 in step S1, molding defects may occur. However, even if an excessive or insufficient supply of resin material P occurs, as shown in FIG. 7, the shapes of the graphs of the occupancy ratios C1 to C18 and the graphs of the reference ratios R1 to R18 may be similar. Therefore, there may be cases where molding defects cannot be prevented only by the judgment based on the similarity in step S7.

[0060] To prepare for such a case, in addition to the judgment based on the similarity in step S7, the following judgment may be made. That is, a threshold value (upper limit and / or lower limit) may be set for each of the occupancy ratios C1 to C18 for each block, and if the occupancy ratio corresponding to any block is above the upper limit or below the lower limit, it may be judged as not moldable, and otherwise it may be judged as moldable. Furthermore, instead of or in addition to this, a threshold value (upper limit and / or lower limit) may be set for the total value of the occupancy ratios C1 to C18, and if the occupancy ratio is above the upper limit or below the lower limit, it may be judged as not moldable, and otherwise it may be judged as moldable.

[0061] [5―6] In the above embodiment, the original image is a grayscale image, but a color image may be obtained by using a visible light camera as the camera module 21. In addition, when there is a temperature difference between the resin material P and the film 73 to which it is supplied or the movable table 6 underneath, the camera module 21 may be an infrared camera, and the original image may be an infrared image. [Explanation of symbols]

[0062] 100 Resin molding equipment 1 Supply mechanism 2 Storage area 3. Placement section 4. Conveyor mechanism 5 Molding equipment 50 mold 51 Lower mold 51A Cavity 52 Upper mold 53 Mold clamping mechanism 6 Moving table 7 Storage section 71 Space 72 Frame 73 Film (Object) 8 Supply mechanism 80 Storage section 81 Transport Path 82 Vibration mechanism 83 Measuring mechanism 85 Discharge port 9. Transport mechanism 10 Control section 12 Storage section 14 User Interface Devices 15 Programs 16 Storage medium 20. Photography Department 21 Camera module 22 Light source M1 Master Module M2 Molded Module M3 Resin Module P Resin material A1 Shooting Range A2 area T1~T18 Block C1~C18 Occupancy Rate R1~R18 Standard Rate W1 Substrate before molding W2 Board (plastic molded product) X1 Threshold (First Threshold) X2 Threshold (Second Threshold)

Claims

1. an image capturing unit that captures an image of the resin material supplied onto the object; a molding mechanism that molds a resin molded product using the resin material supplied onto the object; and a control unit that acquires the image and controls the operation of the molding mechanism; Equipped with The control unit is calculating an occupancy ratio of an area where the resin material is present or not present in each of a plurality of blocks included in the image; determining whether or not the molding can be performed by the molding mechanism using the resin material based on similarities between a plurality of occupancy ratios calculated for each of the plurality of blocks and a plurality of reference ratios preset for each of the plurality of blocks; Resin molding equipment.

2. the control unit binarizes the image, and calculates, as the occupancy ratio, a ratio of a number of pixels included in each block to which the first value out of a first value and a second value is assigned by the binarization. The resin molding apparatus according to claim 1 .

3. The control unit sets a first threshold value used in the binarization based on a user input. The resin molding apparatus according to claim 2 .

4. The control unit calculates the similarity, and when the similarity is equal to or greater than a second threshold, causes the forming mechanism to perform the forming. The resin molding apparatus according to any one of claims 1 to 3.

5. The control unit sets the second threshold value based on a user input. The resin molding apparatus according to claim 4.

6. The control unit sets the plurality of reference ratios based on a user input. The resin molding apparatus according to any one of claims 1 to 5.

7. The similarity is a correlation coefficient or a coefficient of determination. The resin molding apparatus according to any one of claims 1 to 6.

8. The photographing unit photographs the resin material supplied into a rectangular frame placed on the object, The plurality of blocks are areas defined in a lattice pattern within the frame. The resin molding apparatus according to any one of claims 1 to 7.

9. A method for producing a resin molded product using the resin molding apparatus according to any one of claims 1 to 8, placing the resin material in a mold; clamping the mold in which the resin material is placed; A method for producing a resin molded product comprising the steps of:

10. A computer connected to a molding mechanism that molds resin molded products acquiring an image of the resin material dispensed onto the object; calculating an occupancy ratio of an area where the resin material is present or not present in each of a plurality of blocks included in the image; determining whether or not the molding can be performed by the molding mechanism using the resin material based on a similarity between a plurality of occupancy ratios calculated for each of the plurality of blocks and a plurality of reference ratios preset for each of the plurality of blocks; A program to execute.

Images