Manufacturing method of light emitting diode lamp

Abstract

To simplify a manufacturing step.SOLUTION: A manufacturing method of a light emitting diode lamp 1 configured in such a manner that a lamp unit 10 having a light emitting part 11 mounted with a light emitting element, a current limit part 12 mounted with a resistance element 122 and an electrode part 13 integrated with the current limit part 12 is inserted into a case 20, includes the steps of: punching a lead frame band material 2, and forming a lead frame unit 3; molding an insulative resin to a first portion 4 and a second portion 5 of the lead frame unit 3, forming a light emitting base part 15 at the first portion 4, and forming a current limit base part 14 at the second portion 5; making the resistance element firmly adhere to the current limit base part 14, and making the light emitting element firmly adhere to the light emitting base part 15; and forming the lamp unit 10 by cutting the lead frame unit 3 to which the resistance element or the like is made to firmly adhere from the lead frame band material 2, folding and bending it, and inserting the lamp unit 10 into the case 20.SELECTED DRAWING: Figure 4-1

Description

[Technical field]

[0001] The present invention relates to a method for manufacturing a light-emitting diode lamp used as a light source for an indicator lamp in, for example, a control panel, a distribution panel, etc. [Background technology]

[0002] Conventionally, a method for manufacturing a light-emitting diode lamp has been proposed in Patent Document 1. In the manufacturing method proposed in Patent Document 1, a lead frame unit is formed by pressing a strip of lead frame material, and then a resistive element and a light-emitting element are fixed at predetermined locations, and then an insulating resin is molded. After that, the lead frame unit is cut from the strip of lead frame material and folded to form a lamp unit, and the lamp unit is inserted into a cylindrical case to manufacture a light-emitting diode lamp. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-32763 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, in the above-mentioned method for manufacturing a light-emitting diode lamp, the resistive element and the light-emitting element are fixed to predetermined locations on the lead frame unit, and then the insulating resin is molded. Therefore, there is a risk that these elements may be damaged by the temperature during molding or the mold used for molding, and in order to prevent damage to the elements, the manufacturing process is complicated.

[0005] In view of the above circumstances, an object of the present invention is to provide a method for manufacturing a light-emitting diode lamp that can simplify the manufacturing process. [Means for solving the problem]

[0006] In order to achieve the above object, the manufacturing method of a light-emitting diode lamp according to the present invention is a manufacturing method of a light-emitting diode lamp configured by inserting a lamp unit having a light-emitting section on which a light-emitting element is mounted, a current limiting section that is continuous with the light-emitting section and has a resistance element mounted thereon, and an electrode section that is integral with the current limiting section into a cylindrical case, and is characterized by including the steps of: forming a lead frame unit having a first section and a pair of second sections that are continuous with the first section by performing punching and bending on a conductive lead frame strip; forming a light-emitting base that constitutes the light-emitting section in the first section and a current limiting base that constitutes the current limiting section in the second section by molding an insulating resin on each of the first section and the second section; fixing the resistance element to the current limiting base and fixing the light-emitting element to the light-emitting base; and cutting the lead frame unit to which the resistance element and the light-emitting element are fixed from the lead frame strip and bending it to form the lamp unit, and inserting the lamp unit into the case.

[0007] Furthermore, the present invention is characterized in that in the manufacturing method for the above-mentioned light-emitting diode lamp, in the process of forming the current limiting base, a fixed portion to which the resistive element is fixed is formed on a flat surface, and the protruding height position of the fixed portion from the lead frame strip material is made constant. Effect of the Invention

[0008] According to the present invention, by molding insulating resin on each of the first and second parts of the formed lead frame unit, the light emitting base is formed on the first part, and then the current limiting base is formed on the second part, and then the resistive element is fixed to the current limiting base and the light emitting element is fixed to the light emitting base, so that not only is there no risk of the light emitting element or resistive element being damaged by heat or the like, but there is also no need to use a complicated method for molding, and therefore the effect of simplifying the manufacturing process is achieved. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view showing the external configuration of a light-emitting diode lamp. [Diagram 2] FIG. 2 is a cross-sectional view showing the internal configuration of the light-emitting diode lamp. [Diagram 3] FIG. 3 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 4-1] FIG. 4-1 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 4-2] FIG. 4-2 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 4-3] FIG. 4-3 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Diagram 5] FIG. 5 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 6] FIG. 6 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 7] FIG. 7 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 8-1] FIG. 8-1 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 8-2] FIG. 8-2 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 9] FIG. 9 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. [Figure 10] FIG. 10 is an explanatory diagram illustrating steps of a method for manufacturing a light-emitting diode lamp according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the method for manufacturing a light-emitting diode lamp according to the present invention will be described in detail below with reference to the accompanying drawings.

[0011] <Outline of the Light-Emitting Diode Lamp> First, the schematic configuration of a light-emitting diode lamp will be described. Figures 1 and 2 respectively show a light-emitting diode lamp, where Figure 1 is a perspective view showing the external configuration of the light-emitting diode lamp, and Figure 2 is a cross-sectional view showing the internal configuration of the light-emitting diode lamp.

[0012] The light-emitting diode lamp 1 illustrated here is used as a light source for an indicator light in a control panel, a distribution panel, or the like, and is configured with a lamp unit 10 and a case 20.

[0013] The lamp unit 10 includes a light emitting section 11, a current limiting section 12, and an electrode section 13. The light emitting section 11 includes a light emitting diode supporting section 111 and a light emitting section holder 112.

[0014] The light-emitting diode support part 111 is formed of a lead frame. Although not shown in the figure, a light-emitting diode chip (light-emitting element) to which necessary electrical wiring is provided using thin gold wires is attached to this light-emitting diode support part 111.

[0015] The light emitting portion holder 112 also serves as a reflecting cylinder, and is formed by molding with insulating resin so as to integrally enclose the outer periphery of the light emitting diode support portion 111 including the light emitting diode chip.

[0016] The internal space of the light-emitting portion holder 112 is filled and sealed with a translucent resin sealing material 113 in order to protect the light-emitting diode chip, the gold wires, and the like.

[0017] The current limiting section 12 is configured by mounting resistors (resistance elements) 122 on two current limiting support sections 121 formed by lead frames drawn out on both sides from the light emitting diode support section 111, respectively.

[0018] The electrode portion 13 is configured by two connection electrodes 131 formed by lead frames drawn out from the current limiting support portions 121 .

[0019] Such a current limiting portion 12 and connection electrode 131 are covered by a current limiting base 14 formed by molding an insulating resin, except for the portion connected to the resistor 122 and the portion connected to the external electrode.

[0020] The case 20 is made of insulating resin and has a cylindrical shape, and includes a flange portion 21 and a tubular portion 22. The flange portion 21 is a large diameter portion that constitutes the upper portion of the case 20 in Figures 1 and 2. The tubular portion 22 has a smaller diameter than the flange portion 21, and is provided in a manner that extends downward from the flange portion 21 in Figures 1 and 2.

[0021] A bottom wall 23 having a partition member 231 extending to the axial middle of the central portion is provided at the lower end of the cylindrical portion 22. The cylindrical portion 22 also has cylindrical openings 221 formed by partially cutting out the cylindrical portion 22 in the axial direction at two opposing positions.

[0022] The light-emitting diode lamp 1 is constructed by inserting the lamp unit 10 into such a case 20 from the upper end opening 211 of the flange portion 21 and fitting the lamp unit 10 to the case 20. In this case, the electrode portion 13 of the lamp unit 10 is exposed from the tube opening 221.

[0023] By inserting such a light-emitting diode lamp 1 into a power socket or the like (not shown) and connecting it to a power source, the power terminal of the power socket comes into contact with the connection electrode 131 that constitutes the electrode portion 13, and a voltage is applied to the light-emitting diode lamp 1 from the external power source.

[0024] By applying a voltage in this manner, in the light-emitting diode lamp 1, a current flows from the electrode portion 13 through the resistor 122 to the light-emitting diode chip, causing the light-emitting diode chip to emit light.

[0025] <Manufacturing method of light-emitting diode lamp> Next, a method for manufacturing the above-mentioned light-emitting diode lamp 1, that is, a method for manufacturing the light-emitting diode lamp 1 according to an embodiment of the present invention, will be described. Fig. 3 to Fig. 10 are explanatory diagrams for explaining steps in the method for manufacturing the light-emitting diode lamp 1 according to an embodiment of the present invention.

[0026] As shown in FIG. 3, a lead frame strip 2 made of a conductive thin metal plate is subjected to press forming such as punching and bending to form a plurality of lead frame units 3 (lead frame forming step).

[0027] These lead frame units 3 have a first portion 4 and two second portions 5 on either side of the first portion 4. Of the first portion 4, the tongue-shaped portion 4a protruding inward constitutes the above-mentioned light-emitting diode support portion 111. The second portion 5 protrudes upward in FIG. 3 relative to the first portion 4. In these second portions 5, two current limiting supports 121 extending in the up-down direction in FIG. 3 are formed, and the current limiting support portion 121 separated from the first portion 4 has an electrode configuration portion 131a bent outward.

[0028] For each of the multiple lead frame units 3 formed by the lead frame forming process, an insulating resin is molded into the first portion 4 and the second portion 5 to form a light emitting base 15 and a current limiting base 14, respectively, as shown in Figures 4-1 to 4-3 (molding process).

[0029] The light emitting base 15 is formed in the first portion 4 of the lead frame unit 3, and is formed in a manner to protrude upward and downward from the lead frame strip material 2. Of the light emitting base 15, the annular portion 15a shown in Fig. 4-2 constitutes the light emitting unit holder 112 described above.

[0030] 4-1 and 4-2, the current limiting base 14 is formed in a state in which at least a part of the current limiting support part 121 and the electrode configuration part 131a in the second part 5 is exposed. That is, the current limiting base 14 configures a fixed part 14a having a flat upper surface, and a part of the current limiting support part 121 is exposed in the fixed part 14a. In addition, the current limiting base 14 exposes the electrode configuration part 131a downward.

[0031] 4-3, the current-limiting base 14 is formed so that the protruding height L of the fixed portion 14a from the lead frame strip 2 is constant. More specifically, the current-limiting base 14 is formed so that the protruding height L of the fixed portion 14a matches the upward protruding height of the light-emitting base 15 from the lead frame strip 2. As a result, the upper end portions of the light-emitting base 15 and the current-limiting base 14 formed by the molding process are flush with each other.

[0032] 5, a resistor 122 is mounted on each of the lead frame units 3 in which the light emitting base 15 and the current limiting base 14 are formed by the molding process (first mounting process). Since the upper end portions of the light emitting base 15 and the current limiting base 14 are flush with each other, the resistor 122 is mounted by placing a metal mask having a plurality of openings on the upper end portions of the light emitting base 15 and the current limiting base 14 in such a manner that the openings expose the fixed portion 14a of the current limiting base 14, screen printing cream solder or the like, and then fixing the resistor 122 to the fixed portion 14a.

[0033] As described above, the current limiting support portion 121 is partially exposed at the fixed portion 14a, and is therefore in contact with the resistor 122 in an electrically conductive state.

[0034] For each of the lead frame units 3 on which the resistor 122 is mounted by the first mounting process, a light-emitting diode chip is mounted on the annular portion 15a of the light-emitting base 15 as shown in FIG. 6, and then the resin sealing material 113 described above is filled in (second mounting process).

[0035] Each of the lead frame units 3 on which the light emitting diode chips are mounted in the second mounting process is separated from the lead frame strip 2 by cutting the tie bar portions 6 (see FIG. 3, etc.), to form a lamp unit base 10A as shown in FIG. 7 (separation process). In this lamp unit base 10A, the light emitting base 15 and the current limiting base 14 are connected by the lead portion 16 formed of the lead frame.

[0036] The lamp unit base 10A formed by the separation process is bent in the portion of the lead portion 16 adjacent to the light-emitting base 15 as shown in Figures 8-1 and 8-2, and the fixed portions 14a of the current-limiting base 14 are folded so as to face each other to form the lamp unit 10.

[0037] In this lamp unit 10, the light emitting base 15 constitutes the light emitting section 11, the resistors 122 fixed to the fixed portions 14a face each other, and the current limiting base 14 constitutes the current limiting section 12. Also, the electrode configuration parts 131a exposed on the current limiting base 14 constitute the electrode section 13 as connection electrodes 131. In other words, the electrode section 13 is integrally formed with the current limiting section 12.

[0038] In such a lamp unit 10, the current limiting portion 12 is inserted from the upper end opening 211 of the flange portion 21 in the case 20, as shown in Figs. 8-1 and 8-2.

[0039] Next, the lamp unit 10 is inserted into the case 20 from the upper end opening 211 of the flange 21, and the first locking projection 123 formed on the current limiting part 12 is locked to the upper edge part of the tube opening 221 of the case 20 as shown in Figures 9 and 10. Thereafter, the lamp unit 10 is pressed so as to be inserted into the case 20, and as shown in Figures 1 and 2, the lead part 16 is bent so that the second locking projection 114 formed on the light emitting part 11 is inserted into and locked in the locking hole 212 formed on the side part of the flange 21, whereby the lamp unit 10 and the case 20 are fitted together to assemble the light emitting diode lamp 1 (assembly process).

[0040] As described above, according to the manufacturing method of the light-emitting diode lamp 1 which is an embodiment of the present invention, by molding insulating resin onto each of the first portion 4 and the second portion 5 of the lead frame unit 3 formed in the lead frame unit forming step, the light-emitting base 15 is formed on the first portion 4 and the current-limiting base 14 is formed on the second portion 5, and then the resistor 122 is fixed to the current-limiting base 14 and the light-emitting diode chip is fixed to the light-emitting base 15. Therefore, not only is there no risk of the light-emitting diode chip or resistor 122 being damaged by heat or the like, but there is also no need to use a complicated method for molding. Therefore, the manufacturing process can be simplified.

[0041] Furthermore, according to the manufacturing method of the light-emitting diode lamp 1, in the molding process for forming the current limiting base 14, the fixed portion 14a to which the resistor 122 is fixed is formed on a flat surface, and the protruding height position of the fixed portion 14a from the lead frame strip 2 is made constant, so that the resistor 122 can be fixed to the fixed portion 14a after cream solder or the like is screen-printed using a metal mask or the like, simplifying the manufacturing process. Moreover, the time required for manufacturing can be reduced, which allows for an increase in the number of products produced and therefore a reduction in production costs.

[0042] Although the preferred embodiment of the present invention has been described above, the present invention is not limited to this and various modifications can be made.

[0043] That is, the shapes of the lamp unit 10 and the case 20 in the above-described embodiment are merely examples, and the present invention can be used to manufacture light-emitting diode lamps having lamp units and cases with different shapes. [Explanation of symbols]

[0044] 1...light-emitting diode lamp, 2...strip material for lead frame, 3...lead frame unit, 4...first part, 5...second part, 10...lamp unit, 11...light-emitting part, 111...light-emitting diode support part, 112...light-emitting part holder, 113...resin sealing material, 12...current limiting part, 121...current limiting support part, 122...resistor, 13...electrode part, 131...connection electrode, 14...current limiting base part, 14a...fixed part, 15...light-emitting base part, 15a...annular part, 16...lead part, 20...case, 21...flange part, 22...tubular part, 221...tubular opening.

Claims

1. A method for manufacturing a light-emitting diode lamp, which is constructed by inserting a lamp unit having a light-emitting section on which a light-emitting element is mounted, a current limiting section which is continuous with the light-emitting section and which has a resistive element mounted thereon, and an electrode section which is integrated with the current limiting section, into a cylindrical case, comprising: forming a lead frame unit having a first portion and a pair of second portions continuous with the first portion by punching and bending a conductive lead frame strip; a step of forming an insulating resin on each of the first portion and the second portion to form a light emitting base that constitutes the light emitting portion in the first portion and a current limiting base that constitutes the current limiting portion in the second portion; a step of fastening the resistor element to the current limiting base and fastening the light emitting element to the light emitting base; a step of cutting the lead frame unit to which the resistor element and the light emitting element are fixed from the lead frame strip and bending the lead frame unit to form the lamp unit, and inserting the lamp unit into the case; A method for manufacturing a light-emitting diode lamp, comprising:

2. 2. The method for manufacturing a light-emitting diode lamp according to claim 1, wherein in the step of forming the current limiting base, a portion to which the resistive element is to be fixed is formed on a flat surface, and a protruding height position of the portion to be fixed from the strip material for the lead frame is made constant.

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