Printed circuit board

Abstract

To provide a printed circuit board in which a glass layer is included, a warpage characteristic is improved, and the reliability can be improved.SOLUTION: A printed circuit board includes a glass layer 110 including a first surface 110-1 and a second surface 110-2 facing the first surface, a penetration via 140 penetrating the glass layer, a first wiring layer 121 disposed on the first surface so as to be in contact with the first surface, a first insulating layer 111 disposed on the first surface and covering the first wiring layer, a second insulating layer 112 disposed on the second surface and covering a side surface of the glass layer, a second wiring layer 122 disposed on the second insulating layer, and a connection via 141 penetrating the second insulating layer so as to connect the second wiring layer and the penetration via 140 to each other and being in contact with the penetration via. The first insulating layer includes a material different from an insulating material of the second insulating layer.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to printed circuit boards. [Background technology]

[0002] Recently, with the development of artificial intelligence (AI) technology, etc., multi-chip packages including memory chips such as HBM (High Bandwidth Memory) for processing data that has increased exponentially, and processor chips such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), ASIC (Application Specific Integrated Circuit), and FPGA (Field Programmable Gate Array) are being used. As a result, the demand for substrates with a large area is increasing. In the case of using glass materials, it is possible to overcome the problem of warpage while manufacturing substrates with a large area, so attempts to use glass materials are continuing. Summary of the Invention [Problem to be solved by the invention]

[0003] One of several objects of the present disclosure is to provide a printed circuit board that includes a glass layer.

[0004] Another of several objects of the present disclosure is to provide a printed circuit board having improved warpage characteristics.

[0005] Another of several objects of the present disclosure is to provide a printed circuit board that can improve reliability. [Means for solving the problem]

[0006] One of several solutions proposed through the present disclosure is to provide a printed circuit board including a glass layer including a first surface and a second surface opposite to the first surface, a through via penetrating the glass layer, a first wiring layer disposed on the first surface so as to contact the first surface, a first insulating layer disposed on the first surface and covering the first wiring layer, a second insulating layer disposed on the second surface and covering a side surface of the glass layer, a second wiring layer disposed on the second insulating layer, and a connecting via penetrating the second insulating layer and contacting the through via so as to connect the second wiring layer and the through via to each other, wherein the first insulating layer includes a material different from the insulating material of the second insulating layer.

[0007] Another of several solutions proposed through the present disclosure is to provide a printed circuit board including a glass layer including a first surface and a second surface opposite to the first surface, a through via penetrating the glass layer, a first wiring layer disposed on the first surface and having an interface with the through via, the first wiring layer including a first metal layer and a second metal layer disposed on the first metal layer, a first insulating layer disposed on the first surface and covering the first wiring layer, a second insulating layer disposed on the second surface, covering a side surface of the glass layer and in contact with a portion of the first insulating layer, a second wiring layer disposed on the second insulating layer, and a connecting via penetrating the second insulating layer to connect the second wiring layer and the through via to each other, wherein at least a portion of the first metal layer is in contact with the through via and extends onto the first surface. Effect of the Invention

[0008] Among other advantages of the present disclosure is the provision of a printed circuit board including a glass layer.

[0009] Among other advantages of the present disclosure, one advantage is that a printed circuit board having improved warpage characteristics can be provided.

[0010] Another advantage of the present disclosure, among other advantages, is that it is possible to provide a printed circuit board that can improve reliability. [Brief description of the drawings]

[0011] [Figure 1]FIG. 1 is a block diagram illustrating an example of an electronic device system. [Diagram 2] FIG. 1 is a perspective view illustrating an example of an electronic device. [Diagram 3] FIG. 1 is a cross-sectional view illustrating an example of a printed circuit board. [Figure 4] FIG. 11 is a cross-sectional view illustrating another example of a printed circuit board. [Diagram 5] FIG. 11 is a cross-sectional view illustrating another example of a printed circuit board. [Figure 6] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 7] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 8] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 9] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 10] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 11] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 12] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 13] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 14] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 15] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. [Figure 16] 1A to 1C are cross-sectional views each showing an example of a method for manufacturing a printed circuit board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. The shapes and sizes of elements in the drawings may be scaled (or highlighted or simplified) for a clearer description.

[0013] [Electronic equipment] FIG. 1 is a block diagram illustrating an example of an electronic device system.

[0014] Referring to the drawing, an electronic device 1000 houses a main board 1010. Chip-related components 1020, network-related components 1030, and other components 1040 are physically and / or electrically connected to the main board 1010. These are also coupled to other electronic components described below to form various signal lines 1090.

[0015] The chip-related components 1020 include, but are not limited to, memory chips such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM), and flash memory; application processor chips such as central processors (e.g., CPU), graphic processors (e.g., GPU), digital signal processors, encryption processors, microprocessors, and microcontrollers; and logic chips such as analog-to-digital converters and ASICs (application-specific ICs). In addition, these chip-related components 1020 may be combined with each other. The chip-related components 1020 may be in the form of a package including the above-mentioned chips and electronic components.

[0016] The network-related components 1030 may include, but are not limited to, any other wireless and wired protocols designated as Wi-Fi (such as the IEEE 802.11 family), WiMAX (such as the IEEE 802.16 family), IEEE 802.20, LTE (long term evolution), Ev-DO, HSPA+, HSDPA+, HSUPA+, EDGE, GSM, GPS, GPRS, CDMA, TDMA, DECT, Bluetooth, 3G, 4G, 5G, and beyond, and may include any of numerous other wireless or wired standards and protocols. The network-related components 1030 may also be combined with the chip-related components 1020 together.

[0017] The other components 1040 include high-frequency inductors, ferrite inductors, power inductors, ferrite beads, LTCC (low temperature co-firing ceramics), EMI (electromagnetic interference) filters, MLCC (multi-layer ceramic capacitors), etc. However, the other components 1040 are not limited to these, and may include passive elements in the form of chip components used for various other applications. The other components 1040 may also be combined with the chip-related components 1020 and / or the network-related components 1030.

[0018] Depending on the type of electronic device 1000, the electronic device 1000 may include other electronic components that may or may not be physically and / or electrically connected to the main board 1010. Examples of other electronic components include, but are not limited to, a camera module 1050, an antenna module 1060, a display 1070, and a battery 1080. Other electronic components may include, but are not limited to, an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a compact disk (CD), a digital versatile disk (DVD), and the like. In addition, other electronic components used for various purposes may be included depending on the type of electronic device 1000.

[0019] The electronic device 1000 may be a smart phone, a personal digital assistant, a digital video camera, a digital still camera, a network system, a computer, a monitor, a tablet, a laptop, a netbook, a television, a video game, a smart watch, an automotive, etc. However, the electronic device 1000 is not limited to these, and may be any other electronic device that processes data.

[0020] FIG. 2 is a perspective view that illustrates an example of an electronic device.

[0021] Referring to the drawings, the electronic device may be, for example, a smartphone 1100. A motherboard 1110 is housed inside the smartphone 1100, and various components 1120 are physically and / or electrically connected to the motherboard 1110. In addition, other components, such as a camera module 1130 and / or a speaker 1140, which may or may not be physically and / or electrically connected to the motherboard 1110, are housed inside the smartphone 1100. Some of the components 1120 may be the above-mentioned chip-related components, for example, a component package 1121, but are not limited thereto. The component package 1121 may be in the form of a printed circuit board on which electronic components including active components and / or passive components are mounted on a surface. Alternatively, the component package 1121 may be in the form of a printed circuit board in which active components and / or passive components are built in. Meanwhile, the electronic device is not necessarily limited to the smartphone 1100, but may be other electronic devices as described above.

[0022] [Printed Circuit Board] FIG. 3 is a cross-sectional view that illustrates an example of a printed circuit board.

[0023] Referring to FIG. 3, an example printed circuit board may include a glass layer 110 including a first surface 110-1 and a second surface 110-2 opposite to the first surface, a through via 140 penetrating the glass layer 110, a first wiring layer 121 arranged on the first surface 110-1 so as to contact the first surface 110-1 of the glass layer 110, a first insulating layer 111 arranged on the first surface 110-1 of the glass layer 110 and covering the first wiring layer 121, a second insulating layer 112 arranged on the second surface 110-2 of the glass layer 110 and covering a side surface of the glass layer 110, a second wiring layer 122 arranged on the second insulating layer 112, and a connecting via 141 penetrating the second insulating layer 112 to connect the second wiring layer 122 and the through via 140 to each other and contacting the through via 140.

[0024] The printed circuit board according to the embodiment includes the glass layer 110 and can have excellent flatness and can be advantageous in warpage control through a low coefficient of thermal expansion (CTE). In particular, the printed circuit board according to the embodiment can have the glass layer 110 as a core, which can be advantageous in warpage control even in a step of laminating other insulating layers. Furthermore, the first insulating layer 111 can be formed on the first surface 110-1 of the glass layer 110, and the second insulating layer 112 can be laminated on the second surface 110-2 of the glass 110, which can further increase flatness, and thus can be advantageous in forming a high-density fine circuit having a fine pitch. Furthermore, the number of layers of the printed circuit board can be reduced through the characteristics of glass having a variable dielectric property of, for example, Dk2.5 to 11, and the degree of freedom in design can be further increased.

[0025] In the printed circuit board according to an example, the first insulating layer 111 laminated on the first surface 110-1 of the glass layer 110 and the second insulating layer 112 laminated on the second surface 110-2 of the glass layer 110 may include different materials. Even if the insulating layers of the printed circuit board are laminated such that the first insulating layer 111 and the second insulating layer 112 include different insulating materials, the printed circuit board can be protected from warping because stiffness can be ensured through the glass layer 110. Without being limited thereto, the printed circuit board can be protected from warping even if the materials of the insulating layers laminated on the first insulating layer 111 and the second insulating layer 112 are different from each other or the number of insulating layers laminated is different from each other.

[0026] The glass layer 110 may include glass, which is an amorphous solid. Glass may include, for example, pure silicon dioxide (about 100% SiO2), soda-lime glass, borosilicate glass, alumino-silicate glass, and the like. However, alternative glass materials, such as, but not limited to, fluoroglass, phosphate glass, chalcogenide glass, and the like, may also be used as the material of the glass layer 110. In addition, other additives may be included to form a glass having specific physical properties. These additives may include calcium carbonate (e.g., lime) and sodium carbonate (e.g., soda), as well as magnesium, calcium, manganese, aluminum, lead, boron, iron, chromium, potassium, sulfur, and antimony, as well as carbonates and / or oxides of such elements and other elements. The glass layer 110 is a layer that is distinct from materials containing glass fibers (glass fiber, glass cloth, glass fabric), such as copper clad laminate (CCL) and prepreg (PPG), and can be understood as, for example, sheet glass.

[0027] The glass layer 110 may include a first surface 110-1 and a second surface 110-2. The second surface 110-2 may be a surface opposite to the first surface and may correspond to a surface facing the first surface. The first surface 110-1 and the second surface 110-2 may be positioned to face each other based on the lamination direction of the printed circuit board. In FIG. 3, the first surface 110-1 is represented as the lower side of the glass layer 110 and the opposing second surface 110-2 is represented as the upper side of the glass layer 110 for convenience, but this is merely a representation for convenience and is not intended to be limiting, and the up-down relationship may be different.

[0028] 3, in the printed circuit board according to an example, the first wiring layer 121 may be disposed on the first surface 110-1 of the glass 110 so as to contact the first surface 110-1, and the first wiring layer 121 may be connected to the through via 140 so as to contact the through via. The second wiring layer 122 may be disposed on the second insulating layer 112 and connected to the through via 140 through the connection via 141. The connection via 141 may be connected to the through via 140 by passing through the second insulating layer 112. That is, the through via 140 of the glass 110 may contact the first wiring layer 121 on the first surface 110-1 side, and may contact the connection via 141 on the second surface 110-2 side. That is, the printed circuit board according to an example may realize an asymmetric substrate in which the configurations contacting the first surface 110-1 and the second surface 110-2 of the glass 110 are different from each other.

[0029] Each of the first insulating layer 111 and the second insulating layer 112 may include an organic insulating material. The organic insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including an inorganic filler, an organic filler, and / or a glass fiber (glass fiber, glass cloth, glass fabric) together with a resin. For example, the insulating material may be a non-photosensitive insulating material such as ABF (Ajinomoto Build-up Film) or PPG (Prepreg), but is not limited thereto, and other polymer materials may be used. The insulating material may also be a photosensitive insulating material such as PID (Photo Imageable Dielectric). The insulating material may also include an adhesive sheet such as BS (Bonding Sheet).

[0030] The first insulating layer 111 and the second insulating layer 112 may contain different insulating materials. The term "different insulating materials" means that the insulating materials may contain different types of insulating materials in the above-mentioned group of insulating materials, and may also contain insulating materials that are the same type but contain different types of compositions. For example, the first insulating layer 111 and the second insulating layer 112 may each contain ABF (Ajinomoto Build-up Film), but the composition contained in the first insulating layer 111 and the composition contained in the second insulating layer 112 may be different.

[0031] That is, the first insulating layer 111 and the second insulating layer 112 each include a filler, but the fillers may be different, and the first insulating layer 111 and the second insulating layer 112 may include different insulating materials. The filler included in the second insulating layer 112 may have a finer structure than the filler included in the first insulating layer 111. In this case, the filler may be an inorganic filler, but is not necessarily limited thereto. The fact that the filler included in the second insulating layer 112 is finer than the filler included in the first insulating layer 111 may mean that the size of the diameter, volume, etc. of the filler included in the second insulating layer 112 is smaller than the size of the diameter, volume, etc. of the filler included in the first insulating layer 111.

[0032] The fact that the fillers contained in the first insulating layer 111 and the second insulating layer 112 are different can be confirmed by analyzing a vertical cross section of the printed circuit board. Each filler can be compared using a scanning microscope or optical microscope based on the polished or cut cross section of the printed circuit board, and if necessary, the vertical cross section can be stained to more easily identify the filler. The diameter of the filler can be measured using a scanning microscope or optical microscope based on the polished or cut cross section of the printed circuit board as described above, and the average value can be compared as the average value of values ​​measured at any five points.

[0033] The printed circuit board according to an example includes a core 200. The core 200 may include a material different from the first insulating layer 111 and the second insulating layer 112. For example, the core 200 may include a material having a higher rigidity than the first insulating layer 111 and the second insulating layer 112, and may include an insulating material such as CCL (Copper Clad Laminate). The core 200 may be used as a jig for supporting the glass layer 110 to perform an embedding process of the glass layer 110. Therefore, the glass layer 110 may be prevented from being damaged during the manufacturing process of the printed circuit board, and may be disposed on the outermost side of the printed circuit board to protect the printed circuit board.

[0034] The glass layer 110 may be disposed in a through hole formed in the core 200 and may be embedded with the second insulating layer 112. That is, the second insulating layer 112 may be disposed on the second surface 110-2 of the glass layer 110 and may be disposed so as to cover the side surface of the glass layer 110. In this case, the second insulating layer 112 may also be disposed on the core 200 and may be disposed so as to fill the through hole formed in the core 200. In addition, the lower surface of the core 200 may be substantially coplanar with the first surface 110-1 of the glass layer 110. This may occur because the second insulating layer 112 is embedded after the glass layer 110 is fixed in the through hole of the core 200. The positional relationship between the core 200, the glass layer 110, the first insulating layer 111, and the second insulating layer 112 will be described in detail later in the method for manufacturing a printed circuit board.

[0035] The first wiring layer 121 and the second wiring layer 122 may each include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The first wiring layer 121 and the second wiring layer 122 may each perform various functions according to the design. For example, the first wiring layer 121 and the second wiring layer 122 may include a signal pattern, a power pattern, a ground pattern, and the like. These patterns may each have various forms such as a line, a plane, and a pad. The first wiring layer 121 and the second wiring layer 122 may each include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper). Or, the first wiring layer 121 and the second wiring layer 122 may include a metal foil (or copper foil) and an electrolytic plating layer (or electrolytic copper). Or, the first wiring layer 121 and the second wiring layer 122 may include a metal foil (or copper foil), an electroless plating layer (or chemical copper), and an electrolytic plating layer (or electrolytic copper). It may also include a sputtered layer instead of an electroless plated layer (or chemical copper), or all of both if desired.

[0036] Each of the first wiring layer 121 and the second wiring layer 122 may be formed by any one of SAP (Semi Additive Process), MSAP (Modified Semi Additive Process), TT (Tenting), or a subtractive method, but is not limited thereto, and any method capable of forming a circuit on a printed circuit board may be used without limitation. Also, the first wiring layer 121 and the second wiring layer 122 may be formed by different methods depending on the application, design, etc.

[0037] The first wiring layer 121 may include a first metal layer 131 and a second metal layer 132, and the second wiring layer 122 may also include a first metal layer 131 and a second metal layer 132. The first metal layer 131 and the second metal layer 132 may constitute the first wiring layer 121 and the second wiring layer 122, respectively, and the first metal layer 131 and the second metal layer 132 may include the same metal. The first metal layer 131 may function as a seed for forming the second metal layer 132. The first metal layer 131 may include electroless plating (or chemical copper) or may include a sputtering layer. Or, it may include a metal foil (or copper foil). The first metal layer 131 of the second wiring layer 122 disposed on the second insulating layer 112 preferably includes an electroless plating layer, but is not limited thereto. The first metal layer 131 of the first wiring layer 121 disposed on the glass layer 110 preferably includes a sputtering layer. When the first metal layer 131 of the first wiring layer 121 includes a sputtering layer, it may be advantageous to ensure adhesion between the glass layer 110 and the first metal layer 131. However, this is not necessarily limited thereto, and the first metal layer 131 of the first wiring layer 121 may include an electroless plating layer, and other configurations may be further included to ensure adhesion between the glass layer 110 and the first wiring layer 121. The second metal layer 132 may include an electrolytic plating layer formed using the first metal layer 131 as a seed.

[0038] The through via 140 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The through via 140 may penetrate the first surface 110-1 and the second surface 110-2 of the glass layer 110. The upper surface and the lower surface of the through via 140 may be substantially coplanar with the first surface 110-1 and the second surface 110-2 of the glass layer 110. The through via 140 may be a so-called filled via, which is filled with one metal layer, but is not limited thereto, and may be a conformal via arranged along the wall surface of a via hole, and there may be various methods for forming the through via 140. The through via 140 may perform various functions according to the design. For example, the through via 140 may include a ground via, a power via, a signal via, etc. The through via 140 may have a substantially circular, elliptical, or polygonal shape on a plane, but is not limited thereto, and may have a composite shape in which various shapes are combined into one on a plane, for example, from the viewpoint of ensuring close contact through an increase in specific surface area. The side surface of the through via 140 may be substantially perpendicular to the upper and lower surfaces of the through via 140, but is not limited thereto, and may be tapered to have an hourglass shape or the like on a cross section as necessary.

[0039] The connection vias 141 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The connection vias 141 may include a filled via that fills each via hole, and may also include a conformal via that is disposed along the wall surface of the via hole. The connection vias 141 may perform various functions according to the design. For example, they may include a ground via, a power via, a signal via, and the like. The connection vias 141 may include a first metal layer 131 and a second metal layer 132, similar to the second wiring layer 122.

[0040] The connection via 141 may penetrate the second insulating layer 112 to connect the second wiring layer 122 and the through via 140 to each other. The connection via 141 may be directly connected to the upper surface of the through via 140. That is, the lower surface of the connection via 141 may be connected to the upper surface of the through via 140 on the second surface 110-2 of the glass layer 110. Since it is difficult to ensure adhesion between the glass layer 110 and a metal material, the second insulating layer 112 may be formed on the second surface 110-2 of the glass layer 110, and then a via hole penetrating the second insulating layer 112 may be formed, and the connection via 141 filling the via hole may be formed, thereby connecting the through via 140 to the second wiring layer 122. At this time, the connection via 141 may be formed to fill the via hole of the second insulating layer 112, and may be formed simultaneously with the second wiring layer 122. That is, the first metal layer 131, which is a seed layer of the connection via 141, may be disposed on the through via 140 to cover at least a portion of the through via 140. When the bottom surface of a via hole for the connection via 141 is wider than the top surface of the through via 140, the connection via 141 may be formed to cover the entire through via 140, and when the bottom surface of the via hole is narrower than the top surface of the through via 140, the connection via 141 may be formed to cover a portion of the through via 140.

[0041] Meanwhile, the printed circuit board according to an example may include one or more third insulating layers 113 disposed on the second insulating layer 112 and covering at least a portion of the second wiring layer 122, one or more third wiring layers 123 disposed on or within the third insulating layer 113, and one or more first via layers 142 penetrating at least a portion of the third insulating layer 113 to connect the third wiring layer 123 and the second wiring layer 122 to each other. In addition, the printed circuit board according to an example may include one or more fourth insulating layers 114 disposed on the first insulating layer 111 and covering at least a portion of the first wiring layer 121, one or more fourth wiring layers 124 disposed on or within the fourth insulating layer 114, and one or more second via layers 143 penetrating at least a portion of the fourth insulating layer 114 to connect the fourth wiring layer 124 and the first wiring layer 121 to each other.

[0042] Each of the one or more third insulating layers 113 may include an organic insulating material. The organic insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including inorganic fillers, organic fillers, and / or glass fibers (glass fiber, glass cloth, glass fabric) in addition to these resins. For example, the insulating material may be a non-photosensitive insulating material such as ABF (Ajinomoto Build-up Film) or PPG (Prepreg), but is not limited thereto, and other polymer materials may be used. The insulating material may also be a photosensitive insulating material such as PID (Photo Imageable Dielectric). The insulating material may also include an adhesive sheet such as BS (Bonding Sheet). The third insulating layer 113 may include substantially the same insulating material as the second insulating layer 112, but is not limited thereto, and may include insulating materials different from each other. When the third insulating layer 113 contains substantially the same insulating material as the second insulating layer 112, the third insulating layer 113 may also contain a different insulating material from the first insulating layer 111. Since the rigidity can be ensured by the glass layer 110, even if the second insulating layer 112 and the third insulating layer 113 contain a different insulating material from the first insulating layer 111, warping of the printed circuit board can be prevented.

[0043] Each of the one or more third wiring layers 123 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The third wiring layer 123 may perform various functions according to the design. For example, it may include a signal pattern, a power pattern, a ground pattern, and the like. Each of these patterns may have various forms, such as a line, a plane, and a pad. The third wiring layer 123 may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper). Alternatively, it may include a metal foil (or copper foil) and an electrolytic plating layer (or electrolytic copper). Alternatively, it may include a metal foil (or copper foil), an electroless plating layer (or chemical copper), and an electrolytic plating layer (or electrolytic copper). It may also include a sputtering layer instead of the electroless plating layer (or chemical copper), or it may include all of both as necessary.

[0044] The one or more first via layers 142 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The first via layer 142 may include a filled via that fills a via hole, but may also include a conformal via that is disposed along the wall surface of the via hole. The first via layer 142 may perform various functions depending on the design. For example, it may include a ground via, a power via, a signal via, and the like. The first via layer 142 may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper), respectively. It may also include a sputtering layer instead of the electroless plating layer (or chemical copper), or it may include both as necessary.

[0045] Each of the third wiring layer 123 and the first via layer 142 can be formed by any one of SAP (Semi Additive Process), MSAP (Modified Semi Additive Process), TT (Tenting), or a subtractive method, but is not limited thereto, and any method that can form a circuit on a printed circuit board can be used without limitation.

[0046] Each of the one or more fourth insulating layers 114 may include an organic insulating material. The organic insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as a polyimide, or a material including inorganic fillers, organic fillers, and / or glass fibers (glass fiber, glass cloth, glass fabric) in addition to these resins. For example, the insulating material may be a non-photosensitive insulating material such as ABF (Ajinomoto Build-up Film) or PPG (Prepreg), but is not limited thereto, and other polymer materials may be used. The insulating material may also be a photosensitive insulating material such as PID (Photo Imageable Dielectric). The insulating material may also include an adhesive sheet such as BS (Bonding Sheet). The fourth insulating layer 114 may include substantially the same insulating material as the first insulating layer 111, but is not limited thereto, and may include insulating materials different from each other. When the fourth insulating layer 114 contains substantially the same insulating material as the first insulating layer 111, the fourth insulating layer 114 may also contain a different insulating material from the second insulating layer 112. Since the rigidity can be ensured by the glass layer 110, even if the first insulating layer 111 and the fourth insulating layer 114 contain a different insulating material from the second insulating layer 112, warping of the printed circuit board can be prevented.

[0047] Each of the one or more fourth wiring layers 124 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The fourth wiring layer 124 may perform various functions according to the design. For example, it may include a signal pattern, a power pattern, a ground pattern, and the like. Each of these patterns may have various forms, such as a line, a plane, and a pad. The fourth wiring layer 124 may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper). Alternatively, it may include a metal foil (or copper foil) and an electrolytic plating layer (or electrolytic copper). Alternatively, it may include a metal foil (or copper foil), an electroless plating layer (or chemical copper), and an electrolytic plating layer (or electrolytic copper). It may also include a sputtering layer instead of the electroless plating layer (or chemical copper), or it may include both as necessary.

[0048] The one or more second via layers 143 may include a metal. The metal may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), and / or an alloy thereof. Preferably, the metal may include copper (Cu), but is not limited thereto. The second via layer 143 may include a filled via that fills a via hole, but may also include a conformal via that is arranged along the wall surface of the via hole. The second via layer 143 may perform various functions depending on the design. For example, it may include a ground via, a power via, a signal via, and the like. The second via layer 143 may include an electroless plating layer (or chemical copper) and an electrolytic plating layer (or electrolytic copper), respectively. It may also include a sputtering layer instead of the electroless plating layer (or chemical copper), or it may include both as necessary.

[0049] Each of the fourth wiring layer 124 and the second via layer 143 can be formed by any one of SAP (Semi Additive Process), MSAP (Modified Semi Additive Process), TT (Tenting), or a subtractive method, but is not limited thereto, and any method that can form a circuit on a printed circuit board can be used without limitation.

[0050] As described above, the third insulating layer 113 may include substantially the same insulating material as the second insulating layer 112, and the fourth insulating layer 114 may include substantially the same insulating material as the first insulating layer 111. Including substantially the same insulating material may mean including not only the exact same insulating material but also the same type of insulating material. Thus, the third insulating layer 113 and the fourth insulating layer 114 may each include fillers, and the size of these fillers may be substantially the same as the size of the fillers included in the second insulating layer 112 and the first insulating layer 111, respectively.

[0051] The second insulating layer 112 and the third insulating layer 113 are disposed on the second surface 110-2 of the glass layer 110, and the first insulating layer 111 and the fourth insulating layer 114 are disposed on the first surface 110-1 of the glass layer 110, which means that the insulating layer disposed on the second surface 110-2 and the insulating layer disposed on the first surface 110-1 can contain different insulating materials. The insulating layer disposed on the second surface 110-2 of the glass layer 110 can contain a filler finer than the filler contained in the insulating layer disposed on the first surface 110-1. The method of comparing the diameter of the filler can be performed in the same manner as the method of comparing the filler diameter of the first insulating layer 111 and the second insulating layer 112. Since an insulating layer containing a finer filler may be advantageous in processing finer wiring, processing fine wiring on the second insulating layer 112 and the third insulating layer 113 may be more advantageous than processing fine wiring on the first insulating layer 111 and the fourth insulating layer 114.

[0052] Meanwhile, the number of layers of the third insulating layer 113 and the number of layers of the fourth insulating layer 114 may be different from each other. As shown in FIG. 3, the number of layers of the third insulating layer 113 may be greater than the number of layers of the fourth insulating layer 114, but is not necessarily limited thereto. That is, since the number of layers of the third insulating layer 113 and the number of layers of the fourth insulating layer 114 may be different from each other, the printed circuit board according to the example may have an asymmetric structure. Generally, a board having an asymmetric structure has a characteristic that it is weak against warping due to the difference in the number of laminations and processing, but the printed circuit board according to the example includes the glass layer 110 with high rigidity, so that warping can be prevented. Meanwhile, in FIG. 3, the third insulating layer 113 is expressed as being composed of three insulating layers, and the fourth insulating layer 114 is expressed as being composed of one insulating layer, but the number of layers is not limited thereto. The number of layers of the third wiring layer 123, which is a part connected to other components such as a semiconductor chip, may be greater than the number of layers of the fourth wiring layer 124 arranged on the opposite side. More wiring layers are required in the portion connected to other components such as a semiconductor chip, and it has been common to realize the wiring layers symmetrically to prevent warping. Meanwhile, in the printed circuit board according to an example, warping can be prevented through the glass layer 110, so the number of layers of the third wiring layer 123 and the third insulating layer 113 can be greater than the number of layers of the fourth wiring layer 124 and the fourth insulating layer 114.

[0053] As described above, the printed circuit board according to an example may have different layer configurations based on the glass layer 110. That is, the insulating layers laminated on the first surface 110-1 and the second surface 110-2 of the glass layer 110 may include different materials and may have different numbers of layers. In addition, the first wiring layer 121 may be directly formed on the first surface 110-1 of the glass layer 110, and the second wiring layer 122 may be disposed after the second insulating layer 112 is formed on the second surface of the glass layer 110. The through via 140 may contact the first wiring layer 121 in the direction of the first surface 110-1, and may contact the connecting via 141 instead of the second wiring layer 122 in the direction of the second surface 110-2.

[0054] That is, the printed circuit board according to the embodiment may have an asymmetric structure based on the glass layer 110, and even if the printed circuit board has an asymmetric structure, the occurrence of warping can be prevented. Meanwhile, the first and second surfaces 110-2 of the glass layer 110 are not necessarily limited to the representation in Fig. 3, and the up-down relationship may be reversed. For example, contrary to that shown in Fig. 3, an insulating layer covering a wiring layer formed directly on the glass layer 110 may further include finer fillers.

[0055] Meanwhile, the printed circuit board according to an example may further include a solder resist layer 150 on the third insulating layer 113 and / or the fourth insulating layer 114. The solder resist layer 150 is disposed on the outermost side of the printed circuit board to protect the printed circuit board from the outside. The solder resist layer 150 may use a known solder resist, and may include, but is not limited to, a liquid or film type solder resist, and may use other types of insulating materials, and may include a thermosetting resin and an inorganic filler dispersed in the thermosetting resin, but may not include glass fiber. The insulating resin may be a photosensitive insulating resin, and the filler may be, but is not limited to, an inorganic filler and / or an organic filler, and may use other polymer materials as necessary. The solder resist layer 150 may have an opening, and at least a part of the third wiring layer 123 and the fourth wiring layer 124 may be exposed through the opening. The third wiring layer 123 and the fourth wiring layer 124 exposed through the openings may be connected to an element such as a semiconductor chip, or may be connected to a main board or other printed circuit board. The wiring layers exposed through the openings function as pads, and a surface treatment layer may be further formed on the pads, if necessary. Alternatively, metal bumps or posts may be further formed on the pads, and the pads may have a protruding structure in the form of fillers, if necessary.

[0056] Meanwhile, the printed circuit board according to the embodiment is not limited to the configuration shown in Fig. 3 and may further include other general configurations of a printed circuit board, that is, may further include configurations that can be utilized by a person having ordinary skill in the art.

[0057] FIG. 4 is a cross-sectional view that illustrates another example of a printed circuit board.

[0058] Referring to FIG. 4, the printed circuit board according to another example may not include the core 200. This may correspond to a result of completing the printed circuit board by forming a printed circuit board structure and then cutting along a certain boundary in a manufacturing process of the printed circuit board according to another example. That is, the core 200 may correspond to a temporary structure that accommodates the glass layer 110 as a jig or frame, and may be a result of manufacturing the printed circuit board through a singulation process after forming each printed circuit board in a strip unit. As a result, the printed circuit board according to another example may have a structure in which the second insulating layer 112 covering the side surface of the glass layer 110 is exposed to the outside.

[0059] In addition, the description of the printed circuit board according to another example of FIG. 4 other than the presence or absence of the core 200 can be applied in the same manner as the description of the printed circuit board according to the one example, so duplicated description will be omitted.

[0060] FIG. 5 is a cross-sectional view that illustrates a schematic diagram of still another example of a printed circuit board.

[0061] Referring to FIG. 5, in another example of a printed circuit board, the wiring density of the third wiring layer 123 may be greater than the wiring density of the first wiring layer 121 and / or the fourth wiring layer 124, and the thickness of the third insulating layer 113 may be thinner than the thickness of the first insulating layer 111 and / or the fourth insulating layer 114.

[0062] In yet another example, the third insulating layer 113 of the printed circuit board may contain a finer filler than the inorganic filler of the first insulating layer 111 and / or the fourth insulating layer 114, making the third insulating layer 113 more advantageous for fine pattern processing than the first insulating layer 111 and / or the fourth insulating layer 114, and therefore the third wiring layer disposed on or within the third insulating layer 113 may contain finer wiring than the first wiring layer 121 and / or the fourth wiring layer 124.

[0063] Higher wiring density is a relative concept, and may mean, for example, that the average pitch of the wiring included in the third wiring layer 123 may be smaller than the average pitch of the wiring included in the first wiring layer 121. The pitch may be measured by photographing a cut cross section of the printed circuit board with a scanning microscope, and the average pitch may be an average value of the pitch between the wirings measured at any five points. In addition, the average interlayer insulation distance between the third wiring layers 123 may be smaller than the average interlayer insulation distance between the first wiring layer 121 and the fourth wiring layer 124 or the average interlayer insulation distance between the plurality of fourth wiring layers 124. The interlayer insulation distance may also be measured by photographing a cut cross section of the printed circuit board with a scanning microscope, and the average interlayer insulation distance may be an average value of the insulation distance between adjacent wiring layers measured at any five points. In other words, the wiring included in the third wiring layer 123 may be a high-density fine wiring having a smaller L / S (Line / Space) than the wiring included in the first wiring layer 121 and / or the fourth wiring layer 124. As a non-limiting example, the wiring included in the third wiring layer 123 may have a line / space of about 2 / 2 μm, but is not limited thereto. The high wiring density of the third wiring layer 220 may be effective in interconnecting electronic components such as semiconductor chips. That is, the third wiring layer 123 may be used as a redistribution layer for the semiconductor chip.

[0064] The first wiring layer 121 and the fourth wiring layer 124 can have substantially the same wiring density. This does not mean that the first wiring layer 121 and the fourth wiring layer 124 necessarily need to be designed with the same wiring density, but means that the first wiring layer 121 and the fourth wiring layer 124 have a lower wiring density than the third wiring layer 123, and the designs of the first wiring layer 121 and the fourth wiring layer 124 can be freely changed.

[0065] Generally, a printed circuit board including fine wiring often warps due to asymmetry of the board. However, since the printed circuit board according to another example includes the glass layer 110 having excellent rigidity, it is possible to prevent warping due to asymmetry even if the fine wiring is realized only on one side of the board.

[0066] Meanwhile, in FIG. 5, the third wiring layer 123 is shown to be finer than the second wiring layer 122, but is not limited thereto, and the second wiring layer 122 and the third wiring layer 123 may have substantially the same wiring density. That is, without being limited to the representation in the drawing, the second wiring layer 122 may also include finer wiring than the first wiring layer 121 and / or the fourth wiring layer 124. In this case, a wiring layer having fine wiring may be disposed directly on the glass layer 110. That is, this means that fine wiring such as a redistribution layer may be disposed directly on the glass layer 110.

[0067] In addition, the printed circuit board according to another example is not limited to that shown in FIG. 5, and may have a structure that does not include a core 200 like the printed circuit board according to the other example, and is manufactured in strip units and undergoes a singulation process.

[0068] The description of the printed circuit board according to another example of FIG. 5 other than the contents related to wiring density, insulation distance, etc. can be applied in the same manner as the description of the printed circuit board according to one example and the printed circuit board according to the other example, so duplicated description will be omitted.

[0069] [Method of manufacturing a printed circuit board] 6 to 16 are cross-sectional views that diagrammatically show an example of a method for producing a printed circuit board.

[0070] 6, the glass layer 110 may be disposed in the through-hole of the core 200 and fixed using an adhesive member 300. At this time, the surface of the glass layer 110 bonded to the adhesive member 300 may be represented as a first surface 110-1, and the surface opposite thereto may be represented as a second surface 110-2.

[0071] The core 200 is as described above in relation to the printed circuit board, but is not limited thereto, and may be a temporary structure such as a frame or a jig, as in the case of another example of a printed circuit board. The adhesive member 300 may be any adhesive means that can be used by a person skilled in the art, and may be, for example, a known tape. Since the glass layer 110 is attached to the through-hole of the core 200 via the adhesive member 300, the first surface 110-1 of the glass layer 110 and the lower surface of the core 200 may be substantially coplanar.

[0072] Meanwhile, the glass layer 110 may have a through via 140 formed therein. The step of forming the through via 140 in the glass layer 110 may also be performed by any method that can be used by a person skilled in the art. The through via 140 may be formed by forming a through hole in the glass layer 110, forming a seed layer, and then forming a plating layer. The method of forming the through hole may be performed by various methods such as laser processing, mechanical processing, chemical processing, etc., and the seed layer may be formed by electroless plating (or chemical copper plating) or sputtering. The plating layer may be formed by electrolytic plating (or electrolytic copper plating). Thereafter, if necessary, a planarization process may be performed so that the first surface 110-1 and the second surface 110-2 of the glass layer 110 have flat surfaces.

[0073] 7, the second insulating layer 112 may be disposed so as to embed the glass layer 110. The second insulating layer 112 may be disposed on the second surface 110-2 of the glass layer 110, and may be formed by laminating an insulating layer in a semi-cured state and then curing it. The second insulating layer 112 may cover the side surface of the glass layer 110 so as to fill the inside of the through hole of the core 200.

[0074] 8, the adhesive member 300 can be removed. Even if the adhesive member 300 is removed, the glass layer 110 can remain fixed via the second insulating layer 112.

[0075] 9 and 10, the connecting vias 141 and the second wiring layer 122 can be formed, and the first wiring layer 121 can be formed.

[0076] After forming a via hole penetrating the second insulating layer 112, the first metal layer 131 and the second metal layer 132 may be formed to form the connecting via 141 and the second wiring layer 122. The step of forming the first wiring layer 121 may also be performed by forming the first metal layer 131 and the second metal layer 132. At this time, the first metal layer 131 of the connecting via 141 may contact the upper surface of the through via 140 and may cover the upper surface of the through via 140.

[0077] Since the first wiring layer 121 may be formed directly on the first surface 110-1 of the glass layer 110, the first metal layer 131 of the first wiring layer 121 may be disposed so as to cover the lower surface of the through via 140. That is, since the first wiring layer 121 is formed after the first surface 110-1 of the glass layer 110 is planarized, the first wiring layer 121 can be distinguished from the through via 140, and the first metal layer 131, which is a seed layer of the first wiring layer 121, may be disposed so as to cover the through via 140. That is, after the adhesive member 300 is removed, the first wiring layer 121 may be formed on the surface from which the adhesive member 300 has been removed.

[0078] 9 and 10, it has been described that the first wiring layer 121 is formed after the second wiring layer 122, but the present invention is not limited thereto, and the first wiring layer 121 and the second wiring layer 122 may be formed simultaneously in one process, or the first wiring layer 121 may be formed before the second wiring layer 122 is formed. That is, there is no restriction on the order of forming the second wiring layer 122 and the first wiring layer 121.

[0079] In the printed circuit board according to an example, the first wiring layer 121 is formed after the glass layer 110 in which the through vias 140 are formed is embedded with the second insulating layer 112, so that the first metal layer 131 of the first wiring layer 121 can be formed to be distinguished from the through vias 140. That is, the first metal layer 131 of the first wiring layer 121 can be disposed to be in contact with the through vias 140 and can be disposed on the first surface of the glass layer 110. For the same purpose, the first metal layer 131 of the connecting vias 141 can also be distinguished from the through vias 140 and can have a similar arrangement structure.

[0080] 11 to 15, the first insulating layer 111, the third insulating layer 113, and the fourth insulating layer 114 can be formed, and the third wiring layer 123 and the fourth wiring layer 124 can be formed. First, the third insulating layer 113 and the third wiring layer 123 can be formed on the second insulating layer 112. Then, the first insulating layer 111 can be formed on the first surface 110-1 of the glass layer 110, and the fourth wiring layer 124 can be formed on the first insulating layer 111. Then, the third insulating layer 113 and the third wiring layer, and the fourth insulating layer 114 and the fourth wiring layer can be repeatedly laminated. The method of forming the insulating layer and the method of forming the via layer and the wiring layer can use a known method in the manufacturing method of the printed circuit board.

[0081] Meanwhile, in the drawings, it is described that the third insulating layer 113 is formed first, and then the first insulating layer 111 is formed, but the present invention is not limited thereto, and the order of lamination of the insulating layers may be different. Also, in the drawings, it is described that the steps of forming an insulating layer and a wiring layer on one side and then forming an insulating layer and a wiring layer on the other side are repeated, but the present invention is not limited thereto, and the process may be performed by forming an insulating layer on each of the one side and the other side, and then forming a wiring layer on each insulating layer. That is, build-up may be performed simultaneously in both directions. Also, in the drawings, it is described that one side and the other side are built up one layer at a time, but the present invention is not limited thereto, and it is also possible to complete build-up on one side and then build-up on the other side. Since the printed circuit board according to the embodiment includes the glass layer 110, it may be protected from warping, and the build-up order and the build-up form may not be limited.

[0082] 16, a solder resist layer 150 may be formed on the third insulating layer 113 and / or the fourth insulating layer 114. The solder resist layer 150 may be formed by a known method such as lamination or coating.

[0083] In addition, the present invention is not limited to the contents shown in the drawings, and may also be manufactured by removing the core 200 of the printed circuit board, and may also be manufactured by changing the wiring density and build-up procedure during the build-up process. In addition, the present invention is not limited to the contents shown in the drawings, and may further include a method of forming a configuration that can be used by a person having ordinary skill in the art.

[0084] In the present disclosure, the terms "cover" and "enclose" may include not only the case of covering entirely but also the case of covering at least a part, and may include not only the case of covering directly but also the case of covering indirectly. Furthermore, the term "fill" may include not only the case of filling completely but also the case of filling roughly, for example, the case where some gaps or voids are present.

[0085] In the present disclosure, "substantially" can be determined by including process errors, positional deviations, and measurement errors that occur during the manufacturing process. For example, "substantially perpendicular" can include not only a case where the two are completely perpendicular, but also a case where the two are approximately perpendicular. Furthermore, "substantially coplanar" can include not only a case where the two are exactly on the same plane, but also a case where the two are approximately on the same plane.

[0086] In the present disclosure, the same insulating material can mean not only the completely same insulating material, but also the same type of insulating material. Thus, the compositions of the insulating materials are substantially the same, but the specific composition ratios thereof can differ slightly.

[0087] In the present disclosure, the meaning of "on a cross section" can mean the cross-sectional shape of an object cut vertically, or the cross-sectional shape of an object cut vertically, or the cross-sectional shape of an object when viewed from a side, and the meaning of "on a plane" can mean the shape of an object cut horizontally, or the planar shape of an object when viewed from a top or bottom.

[0088] In this disclosure, for convenience, the terms lower, bottom, and lower surface are used to mean the downward direction based on the cross section of the drawing, and the terms upper, top, and upper surface are used to mean the opposite direction. However, this is merely a definition of the direction for convenience of explanation, and the scope of the claims is not particularly limited by the description of the direction, and the concepts of up / down can be changed at any time.

[0089] In the present disclosure, the term "connected" refers not only to a direct connection but also to an indirect connection via an adhesive layer or the like. The term "electrically connected" refers to a physical connection and a non-connection. Furthermore, the terms "first" and "second" are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, the first component may be named the second component, and the second component may be named the first component, without departing from the scope of the right.

[0090] The expression "one example" used in the present disclosure does not mean the same embodiment as the other, but is provided to emphasize and describe the unique features that are different from each other. However, the above-mentioned one example does not exclude being realized in combination with the features of another example. For example, even if the matter described in a particular example is not described in another example, it can be understood as being related to the other example, unless there is a description in the other example that is opposite or contradictory to the matter.

[0091] The terms used in the present disclosure are merely used to describe an example and are not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0092] 110 Glass layer 110-1 1st page 110-2 2nd side 111 First insulating layer 112 Second insulating layer 113 Third insulating layer 114 4th insulating layer 121 1st wiring layer 122 2nd wiring layer 123 3rd wiring layer 124 4th wiring layer 131 1st metal layer 132 Second metal layer 140 Through Via 141 Connected vias 142 1st via layer 143 2nd via layer 150 Solder resist layer 200 cores 300 Adhesive material 1000 electronic equipment 1010 Mainboard 1020 Chip related parts 1030 Network related parts 1040 Other parts 1050 Camera 1060 Antenna 1070 display 1080 Battery 1090 Signal Line 1100 Smartphone 1110 Motherboard 1120 parts 1121 Parts Package 1130 Camera Module 1140 Speaker

Claims

1. a glass layer including a first surface and a second surface opposite to the first surface; a through via that penetrates the glass layer; a first insulating layer disposed on the first surface; a second insulating layer disposed on the second surface and covering a side surface of the glass layer; a second wiring layer disposed on the second insulating layer; a connecting via that penetrates the second insulating layer to connect the second wiring layer and the through via and is in contact with the through via, The first insulating layer comprises an insulating material different from an insulating material of the second insulating layer.

2. the first insulating layer and the second insulating layer each contain a filler; The printed circuit board of claim 1 , wherein the second insulating layer includes a filler that is finer than the filler included in the first insulating layer.

3. one or more third insulating layers disposed on the second insulating layer and covering at least a portion of the second wiring layer; The printed circuit board according to claim 1 , further comprising one or more third wiring layers disposed on or within the third insulating layer.

4. one or more fourth insulating layers disposed on the first insulating layer; The printed circuit board according to claim 3 , further comprising one or more fourth wiring layers disposed on or within the fourth insulating layer.

5. The printed circuit board according to claim 4 , wherein the third wiring layer and the fourth wiring layer have different numbers of layers.

6. The printed circuit board according to claim 5 , wherein the number of layers of the third wiring layer is greater than the number of layers of the fourth wiring layer.

7. The printed circuit board according to claim 4 , wherein the third insulating layer and the fourth insulating layer have different numbers of layers.

8. The printed circuit board according to claim 7 , wherein the number of layers of the third insulating layer is greater than the number of layers of the fourth insulating layer.

9. Further comprising a first wiring layer disposed on the first surface so as to contact the first surface; the first insulating layer covers the first wiring layer; 4. The printed circuit board according to claim 3, wherein the wiring density of the third wiring layer is greater than the wiring density of the first wiring layer.

10. one or more fourth insulating layers disposed on the first insulating layer; The printed circuit board according to claim 9 , further comprising one or more fourth wiring layers disposed on or within the fourth insulating layer.

11. one or more third insulating layers disposed on the second insulating layer and covering at least a portion of the second wiring layer; one or more third wiring layers disposed on or within the third insulating layer; one or more fourth insulating layers disposed on the first insulating layer; one or more fourth wiring layers disposed on or within the fourth insulating layer, the third insulating layer comprises substantially the same insulating material as the second insulating layer; The printed circuit board of claim 1 , wherein the fourth insulating layer comprises substantially the same insulating material as the first insulating layer.

12. a core including a through hole; The printed circuit board of claim 1 , wherein the glass layer is disposed within the through hole.

13. Further comprising a first wiring layer disposed on the first surface so as to contact the first surface; The printed circuit board of claim 3 , wherein the first insulating layer covers the first wiring layer.

14. the first wiring layer includes a first metal layer and a second metal layer disposed on the first metal layer; The printed circuit board of claim 13 , wherein at least a portion of the first metal layer covers a bottom surface of the through via.

15. a glass layer including a first surface and a second surface opposite to the first surface; a through via that penetrates the glass layer; a first wiring layer disposed on the first surface, having an interface with the through via, and including a first metal layer and a second metal layer disposed on the first metal layer; a first insulating layer disposed on the first surface and covering the first wiring layer; a second insulating layer disposed on the second surface, covering a side surface of the glass layer, and in contact with a portion of the first insulating layer; a second wiring layer disposed on the second insulating layer; a connecting via that penetrates the second insulating layer to connect the second wiring layer and the through via to each other, At least a portion of the first metal layer contacts the through via and extends onto the first surface.

16. the connecting via includes a third metal layer and a fourth metal layer formed on the third metal layer; The printed circuit board of claim 15 , wherein the third metal layer covers at least a portion of the through via.

17. 16. The printed circuit board of claim 15, wherein the first insulating layer comprises an insulating material that is different from an insulating material of the second insulating layer.

Images