Method for bonding chips and system for carrying out method

Abstract

To provide method and system that collectively bond a plurality of source chips to a plurality of production chips while simultaneously matching chip quality, thereby improving productivity / throughput.SOLUTION: A bonding system 100 includes receiving chip arrangement information including locations on one or more product substrates 138 to which chips are to be bonded, generating an instruction for a chip arrangement device 118 for arranging a plurality of chips 124 from one or more chip source substrates 114 onto one or more intermediate substrates 116 based on the received chip arrangement information, receiving one or more intermediate substrates having a plurality of chips disposed thereon in accordance with the generated instruction, and operating a plurality of bonding heads 134 to collectively bond chips in a subset of the plurality of chips of the one or more intermediate substrates to one of the one or more product substrates. The number of the chips in the subset is equal to the bonding head number of the plurality of bonding heads.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to methods for bonding chips, including bonding multiple chips together. [Background technology]

[0002] Advanced packaging techniques require precise and accurate control and placement of chips. To increase productivity / throughput, it is desirable in the art to use multiple bond heads to bond multiple source chips to multiple product chips in bulk. However, known methods and systems are unable to bond multiple chips in bulk while selecting a source chip that matches the quality of the corresponding product chip. Even if the pitch of the source chips and the pitch of the product chips match, thereby allowing for bulk bonding using multiple bond heads, the quality of the source chips that are aligned with the multiple bond heads is likely not to match the quality of the corresponding product chips that have the same alignment. Furthermore, in known systems, even when quality is not a factor (e.g., all of the source chips and all of the product chips have the same quality), when multiple bond heads are used, it is often not possible to utilize all of the multiple bond heads for a particular layout of chips on the source substrate. The inability to use all available bond heads limits productivity / throughput.

[0003] FIG. 23 shows a schematic side view of a prior art source substrate 1 and a prior art product substrate 2, where multiple bonding heads cannot be used to bond source chips to product chips in bulk while matching the quality of the chips. As shown in FIG. 23, substrate 1 has three different quality chips, and product substrate 2 has the same three different quality chips. The source chip 3 of the first quality is designated as "A", the source chip 4 of the second quality is designated as "B", and the source chip 5 of the third quality is designated as "C". Similarly, the product chip 6 of the first quality is designated as "A", the product chip 7 of the second quality is designated as "B", and the product chip 8 of the third quality is designated as "C". FIG. 23 shows what happens when four chips are bonded in bulk from source substrate 1, even if it is possible to select source chips that match the pitch of the product chips using four bonding heads. As shown in FIG. 23, it is possible to select four chips from source substrate 1 and bond them to product chips using four bonding heads at the same time. However, because the quality of the chips located at the appropriate pitch on source substrate 1 does not match the quality of the corresponding chips on product substrate 2, only two of the four source chips will be bonded to the matching quality chips on product substrate 2. That is, known systems require bonding one chip at a time in order to select the appropriate source chip that matches the quality of the product chip to which it will be bonded.

[0004] FIG. 24 shows a schematic top view of a prior art source substrate where not all available bonding heads can be used during the batch bonding method because the layout of the source chips 10 on the source substrate 12 does not match the layout of the transfer heads / bonding heads. FIG. 24 shows two time instants where a set of transfer heads 14 are trying to pick up the maximum number of chips possible to carry to the bonding heads. In the illustrated example, the arrangement of the transfer heads is 2×4. The arrangement of the transfer heads 14 is the same as the layout of the multiple bonding heads, i.e., in this example, the bonding heads are also arranged in 2×4. This is because each transfer head transfers one source chip to a corresponding bonding head. The left side of FIG. 24 shows the first moment where the transfer head 14 picks up three chips that are aligned with the transfer head. Then, the right side of FIG. 24 shows the next moment where the transfer head picks up four more chips. As shown in FIG. 24, one of the eight transfer heads cannot be used because the layout of the chips 10 on the source substrate 12 and the transfer heads do not match. This also means that one of these bond heads will not have a tip during the subsequent bonding process, thus reducing productivity / throughput.

[0005] Therefore, there is a need in the art for a method and system for batch bonding of multiple source chips into multiple production chips while simultaneously matching chip quality and / or improving productivity / throughput. Summary of the Invention

[0006] A method for bonding chips includes receiving chip placement information including locations on one or more product substrates where chips are to be bonded, generating instructions for a chip placement machine to place a plurality of chips from one or more chip suppliers onto one or more intermediate substrates based on the received chip placement information, receiving the one or more intermediate substrates having a plurality of chips disposed thereon in accordance with the generated instructions, and operating a plurality of bond heads to collectively bond a subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates, where the number of chips of the subset of chips is equal to the number of bond heads of the plurality of bond heads.

[0007] A system for bonding chips comprises one or more product substrate chucks configured to hold one or more product substrates, one or more intermediate substrate chucks configured to hold one or more intermediate substrates, a plurality of bonding heads, one or more processors, and one or more memories storing instructions which, when executed by the one or more processors, cause the system to: receive chip placement information including locations on one or more product substrates to which chips are to be bonded; generate instructions for a chip placement device to place a plurality of chips from one or more chip sources onto one or more intermediate substrates based on the received chip placement information; receive one or more intermediate substrates having a plurality of chips disposed thereon and held by the one or more intermediate substrate chucks in accordance with the generated instructions; and operate the plurality of bonding heads to collectively bond a subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates held by the one or more product substrate chucks, wherein a number of chips of the subset of chips is equal to a number of bonding heads of the plurality of bonding heads.

[0008] A method for manufacturing a plurality of articles includes receiving chip placement information including locations on one or more product substrates to which chips are to be bonded; generating instructions for a chip placement device to place a plurality of chips from one or more chip suppliers onto one or more intermediate substrates based on the received chip placement information; receiving the one or more intermediate substrates having the plurality of chips disposed thereon in accordance with the generated instructions; and operating a plurality of bonding heads to collectively bond a subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates; singulating the product substrates to manufacture the plurality of articles, wherein a number of chips of the subset of chips is equal to a number of bonding heads of the plurality of bonding heads.

[0009] In an embodiment, the apparatus may further include a substrate receiving portion and a substrate transfer tool configured to transfer the first chip structure of the first sandwich structure to the substrate receiving portion. [Brief description of the drawings]

[0010] Embodiments are illustrated by way of example and not limitation in the accompanying figures. [Figure 1] FIG. 1 illustrates a schematic side view of an interface system in accordance with an illustrative embodiment. [Diagram 2] 2 illustrates a flowchart of a method for bonding chips using the bonding system of FIG. 1 according to an exemplary embodiment. [Figure 3A] 1 illustrates a simplified top view of an exemplary product substrate having multiple chips thereon, in accordance with an exemplary embodiment. [Figure 3B] FIG. 2 illustrates a schematic top view of an exemplary source substrate having multiple chips thereon, according to an exemplary embodiment. [Figure 4] 1 illustrates a schematic bottom view of multiple bond heads in accordance with an exemplary embodiment; [Diagram 5] 4 illustrates a schematic top view of an intermediate substrate after multiple chips have been placed by a chip placement device, according to an exemplary embodiment. [Figure 6A] FIG. 1 illustrates multiple bond heads roughly projected onto a first subset of chips on an intermediate substrate, according to an example embodiment. [Figure 6B] FIG. 13 illustrates another projection of multiple bond heads onto a second subset of chips of the intermediate substrate according to an exemplary embodiment. [Figure 7] 2 illustrates the bonding system of FIG. 1 at the moment when a chip used in the bonding process according to an exemplary embodiment has been loaded onto an intermediate substrate. [Figure 8] 2 illustrates the bonding system of FIG. 1 at a moment when the intermediate substrate is chucked to the second intermediate substrate chuck, according to an exemplary embodiment. [Figure 9] 2 illustrates the bonding system of FIG. 1 at a moment when a first set of chips has been transferred from the multiple transfer heads to the multiple bonding heads, according to an exemplary embodiment. [Figure 10] FIG. 2 illustrates a schematic top view of the intermediate substrate after the first set of chips has been removed, according to an exemplary embodiment. [Figure 11] 2 illustrates the bonding system of FIG. 1 at a moment when a first set of chips have been bonded to a product chip, according to an exemplary embodiment. [Figure 12] 4 illustrates a simplified top view of a product substrate after a first set of chips have been bonded to the product chips, according to an illustrative embodiment. [Figure 13] FIG. 1 illustrates a schematic top view of the intermediate substrate after the second set of chips has been removed, according to an exemplary embodiment. [Figure 14] 4 illustrates a simplified top view of the product substrate after a second set of chips have been bonded to the product chips, according to an illustrative embodiment. [Figure 15] FIG. 13 illustrates a schematic top view of the intermediate substrate after the third set of chips has been removed, according to an exemplary embodiment. [Figure 16] FIG. 2 illustrates a simplified top view of the product substrate after a third set of chips have been bonded to the product chips, according to an illustrative embodiment. [Figure 17] FIG. 13 illustrates a schematic top view of the intermediate substrate after the fourth set of chips has been removed, according to an exemplary embodiment. [Figure 18]FIG. 13 illustrates a simplified top view of the product substrate after a fourth set of chips have been bonded to the product chips, according to an illustrative embodiment. [Figure 19] FIG. 13 illustrates a schematic top view of the intermediate substrate after the fifth set of chips has been removed, according to an exemplary embodiment. [Figure 20] FIG. 13 illustrates a schematic top view of the product substrate after a fifth set of chips have been bonded to the product chips, according to an illustrative embodiment. [Figure 21] FIG. 13 illustrates a schematic top view of the intermediate substrate after the sixth set of chips 170 have been removed, according to an exemplary embodiment. [Figure 22] FIG. 13 illustrates a schematic top view of the product substrate after a sixth set of chips have been bonded to the product chips, according to an illustrative embodiment. [Figure 23] FIG. 1 shows a schematic side view of a prior art source substrate and a prior art product substrate, where multiple bonding heads cannot be used to collectively bond source chips to product chips while matching the quality of the chips. [Figure 24] 1 illustrates a schematic top view of an example related art source substrate where the layout of source chips on the source substrate prevents all of the available bond heads from being used during the bulk bonding step. Those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to aid in understanding implementations of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The following description in combination with the drawings is provided to aid in understanding the teachings disclosed herein. The following discussion focuses on specific implementations and implementations of the teachings. This focus is provided to help explain the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0012] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention belongs. The materials, methods, and examples are illustrative only and are not intended to be limiting. To the extent not described herein, many details regarding specific materials and processing acts are conventional and can be found in textbooks and other sources in the art.

[0013] FIG. 1 shows a schematic side view of a bonding system 100 according to an exemplary embodiment. As shown in FIG. 1, the bonding apparatus 100 includes a chip placement section 102, a chip transfer and activation section 104, and a chip bonding section 106. The chip placement section 102 is a part of the overall bonding system 100 that positions the chips before bonding. As used herein, a chip is an integrated circuit, also called a microchip, computer chip, etc. A chip may be defined as a small block of semiconductor material on which a given functional circuit is fabricated. In the context of a wafer / substrate divided into individual chips, a chip is known to be a die. A chip typically carries a set of integrated electronic components and circuits formed thereon by patterning, coating, etching, doping, plating, singulation, etc. A chip typically has electrical functions such as memory, logic, field programmable gate arrays (FPGAs), accelerator circuits, application specific integrated circuits (ASICs), security co-processors, graphics processing units (GPUs), machine learning circuits, dedicated processors, controllers, devices, electrical circuits, arrays of passive components, etc. The chips may also be MEMS devices, optical devices, electro-optical devices, etc. The chip transfer and activation section 104 is part of the overall bonding system 100 that transfers the placed chips from the chip placement section 102 to the chip bonding section 106. In another configuration, the chip placement section may be a separate device. Similarly, the chip activation section may be a separate device. The chip transfer and activation section 104 also activates the placed chips so that they are ready for bonding. In an alternative embodiment, the activation section 104 activates the plurality of chips 124 before the plurality of chips are placed on the intermediate substrate 116. The chip bonding section 106 receives the placed and activated chips and performs bonding. Details of each of these sections are described in more detail below.

[0014] The chip placement section 102 has a base 108 supporting a first substrate chuck 110 and a second substrate chuck 112. The first substrate chuck 110 holds a first substrate 114, and the second substrate chuck 112 holds a second substrate 116. The first substrate 114 is also referred to herein as a source substrate, and the second substrate 116 is also referred to herein as an intermediate substrate. The first substrate chuck 110 is also referred to herein as a source substrate chuck. The second substrate chuck 112 is also referred to herein as a first intermediate substrate chuck, or an intermediate substrate chuck of the chip placement section. The chip placement section 102 further includes a chip placement device 118. The chip placement device 118 is also known in the art as a pick-and-place machine or chip shooter. The chip placement device 118 has the ability to quickly pick up chips from a first source and place them at different positions in a predetermined arrangement. The placement accuracy may be relatively low compared to the accuracy described below with respect to the chip bonding section 106. For example, the chip placement device 118 may place a chip within 5 μm to 20 μm of a target location. The chip placement device 118 may be coupled to a carriage 120 that can move along a bridge 122. In operation, upon receiving a command, the chip placement device 118 picks up a chip located on the source substrate 114 and moves along the bridge 122 via the carriage 120 to place the chip on the intermediate substrate 116. The moment shown in FIG. 1 is a moment before the chip is placed by the chip placement device 118. Thus, multiple chips 124 are shown in the source substrate 114 and no chips are shown on the intermediate substrate 116. The chip placement device may be any suitable device known in the art, for example, a die sorter (e.g., BESTEM-S300) manufactured by Canon Machinery Inc. of Kusatsu City, Shiga Prefecture, Japan. In the exemplary embodiment, one source substrate 114 and one intermediate substrate are shown, but multiple source substrates and multiple intermediate substrates may be used. In that case, the chip placement device 118 picks up chips from multiple different source substrates to prepare multiple intermediate substrates. Thus, there may be one or multiple source substrates and one or multiple intermediate substrates.Each substrate may be a wafer, for example a silicon wafer.

[0015] The chip transfer and activation section 104 includes a transfer robot 126 that can lift and transport the intermediate substrate 116 from the intermediate substrate chuck 112 and transport it to a different intermediate substrate chuck in the bonding section 106. As understood in the art, the transfer robot 126 generally includes a hand and a robot arm that provides freedom of movement to lift, transport, and place the substrate from one location to another, such as from one substrate chuck to another substrate chuck or from a substrate storage location to a substrate chuck. The transfer robot 126 can be any suitable device known in the art, for example, a robot such as the wafer handling robot RR756L15 provided by Rohze Corporation of Fukuyama, Hiroshima Prefecture. The chip transfer and activation machine 104 further includes an activation machine 128. The activation machine 128 is a device that prepares the transferred chip for hybrid bonding. Hybrid bonding is a chip bonding technique in which electrically insulating (silicon dioxide) chip surfaces with embedded metal (e.g., copper) pads are brought into contact with each other. The metal pads are aligned with each other while the electrically insulating surfaces are bonded together through direct contact. Heat is then applied to the bonding structure, which causes the metal pads to expand more against the electrically insulating material and contact each other, thereby forming an electrical connection between the chips. In an exemplary embodiment, the activator 128 can include a fluid source, for example, applying deionized water, and a plasma source to activate the surfaces of the chips before being transported by the transfer robot 126. Depending on the material of the chips (i.e., the dielectric), when the activated chip contacts another chip, a fusion bond occurs between the dielectric surfaces of the two chips.

[0016] The interface 106 includes a third substrate chuck 130 for receiving the intermediate substrate 116 having chips transferred by the transfer robot 126 and activated by the activation device 128. The third substrate chuck is also referred to herein as a second intermediate substrate chuck or an intermediate substrate chuck of the interface. The interface 106 may include a bridge 132 to which the second intermediate substrate chuck 130 is attached. The bridge 132 is also referred to herein as a second bridge or a bridge of the interface section. The interface 106 also includes a plurality of bond heads 134 attached to the bridge 132. In one embodiment, the bond heads 134 can include a peripheral chuck region that holds the backside of the chips 124 along the periphery. In one embodiment, the bond heads 134 can include a chuck portion that holds the chips 124. In one embodiment, the bond head 134 can include one or more actuators that can move the chip chuck towards at least the product substrate chuck 136 and move the chip chuck in all six directions (x, y, z, tip, tilt, and rotation). The actuators can be voice coil motors, piezoelectric motors, linear motors, nut and screw motors, piezo actuated stages, brushless DC motor stages, DC motor stages stepper motors that are configured to move the chip chuck to and from the product substrate chuck 136 and to apply a controlled force to the chip when it is in contact with the bond surface 140. The chip chuck can hold the chip to the chuck surface using a Bernoulli chuck, vacuum, electrostatic force, electromagnetic force, mechanical gripping force, or any other method that releasably holds the chip to the chuck surface of the bond head 134. The bond portion 106 further includes a product substrate chuck 136 that holds a product substrate 138. The product substrate 138 has a plurality of chips 140 on a surface thereof. A plurality of chips 140 on the product substrate 138 is where the chips from the intermediate substrate 116 will ultimately be bonded, as described below. As shown in FIGURE 1, the product substrate chuck 136 is carried by a carriage 142. The carriage 142 is movable along a base 144.

[0017] The bonding portion 106 may further include a number of alignment devices 146 and a number of transfer heads 148, all carried by the carriage 142. Each of the number of transfer heads 148 may include any one of a variety of ways of holding a chip, including, but not limited to, a Bernoulli chuck, a suction nozzle, an electrostatic chuck, an edge-grasping chuck, a latching mechanism, or any way of releasably holding a chip. Each of the number of transfer heads 148 may include an actuator for moving in at least the z-direction toward and away from the bridge 132. The number of alignment devices 146 are used to inspect the alignment of the chips on the number of bond heads 134 after the chips are transferred to the number of bond heads 134, as described below. Each alignment device may be a microscope, a camera, an interferometer, or any type of measuring machine capable of measuring the position of each chip on the nanometer scale. The information provided by the number of alignment devices 146 allows an operator to know if each chip is at a target position within an acceptable amount of error. The alignment devices 146 may be any suitable device known in the art, for example, a 20x microscope with a 5 megapixel camera, such as the CI-5MGMCL from Canon Inc. of Tokyo, Japan. The transfer heads 148 are used to transfer chips from the intermediate substrate 116 held on the second intermediate substrate 130 to the bond heads 134.

[0018] The number of the bonding heads of the plurality of bonding heads may be at least two, eight or sixteen. As will be more clearly shown below, the arrangement of the plurality of bonding heads may be in the form of 1×2, 2×2, 1×3, 1×2, 2×3, 3, 2×2, 3, 3, 3, 4×1, 1×4, 4×2, 2×4, 3×4, 4×3, etc. In other words, the number of bonding heads may be expressed as "m×n" where m is 1 to 4 and n is 1 to 4. When either m or n is 1, the other is at least 2, such that there are at least two bonding heads. In the example shown in FIG. 1, at least one of m or n is 3. The number (number of transfer heads) and arrangement of the plurality of transfer heads may be the same as the number (number of bonding heads) and arrangement of the bonding heads. Alternatively, the number (number of transfer heads) and arrangement of the plurality of transfer heads may be greater than the number (number of bonding heads) and arrangement of the bonding heads.

[0019] The joint 106 may further include a first microscope 150 on the carriage 142 and a second microscope 152 on the bridge 132. The first microscope 150 on the carriage 142 is movable along the base 144 together with the plurality of transfer heads 148, the product substrate chuck 136, and the plurality of alignment devices 146. The first microscope 150 faces in a direction toward the second intermediate substrate chuck 130, i.e., upward. The first microscope 150 functions to measure the positions of the plurality of chips on the intermediate substrate 116. The second microscope 152 faces in a direction toward the product substrate chuck, i.e., downward. The second microscope 152 functions to measure the positions of the chips on the product substrate 138. Each of the first and second microscopes may be any suitable device known in the art, for example, a 20x microscope with a 5 megapixel camera, such as a CI-5MGMCL from Canon Inc. of Tokyo, Japan.

[0020] The bonding system 100 may be coordinated, controlled, and / or directed by one or more processors 154 (controllers) in communication with one or more components and / or subsystems, such as the chip placement unit 102, the chip transfer and activation unit 104, the bonding unit 106, the chip placement unit 118, the carriage 120, the source substrate chuck 110, the first intermediate substrate chuck 112, the transfer robot 126, the activation device 128, the second intermediate substrate chuck 130, the multiple bonding heads 134, the product substrate chuck 136, the carriage 142, the multiple alignment devices 146, the multiple transfer heads 148, the first microscope 150, and the second microscope 152. The processor 154 may operate based on instructions in a computer readable program stored in a non-transitory computer memory 156. The processor 154 may be or include one or more of a CPU, an MPU, a GPU, an ASIC, an FPGA, a DSP, and a general purpose computer. The processor 154 may be a dedicated controller or a general-purpose computing device adapted to be a controller. Examples of non-transitory computer-readable memory include, but are not limited to, RAM, ROM, CD, DVD, Blu-Ray, hard drives, network-attached storage (NAS), intranet-connected non-transitory computer-readable storage devices, and internet-connected non-transitory computer-readable storage devices. All of the steps described herein may be performed by the processor 154.

[0021] FIG. 2 shows a flow chart of a method for bonding chips 200 using the bonding system 100. The method 200 can begin at step S202 where chip placement information is received, the chip placement information including the locations on one or more product substrates where the chips are to be bonded. FIG. 3A shows a schematic top view of an exemplary product substrate 138 having a plurality of chips 140 thereon. As shown in FIG. 3A, the plurality of chips 140 have different letter designations A, B, and C. Each letter represents a quality of the chip, with A representing a first quality, B representing a distinct second quality, and C representing a distinct third quality. Although only three different quality chips are shown on the exemplary product substrate 138, in other embodiments there may be fewer or more different qualities on a single product substrate. The quality of the chip may be defined as the maximum clock rate, the percentage of transistors that function at one or more specified clock rates, local cache size, thermal conductivity, and other characteristics that affect the performance of the chip that may vary depending on the manufacturing performance of the chip. As also shown in FIG. 3A, each chip of the plurality of chips 140 is spaced apart from adjacent chips in the X and Y dimensions. The distance between chips is referred to herein as pitch, with the distance between adjacent chips in the X dimension being the x-dimension pitch Δpx and the distance between adjacent chips in the Y dimension being the y-dimension pitch Δpy. Both pitches are defined herein as the distance between the center point of one chip and the center point of an adjacent chip. However, any reference point on the chip is suitable for defining the pitch as long as the same point is used for each chip. In the exemplary product substrate 138 shown in FIG. 3A, there is a constant y-dimension pitch Δpy (i.e., all adjacent chips in the Y dimension are equidistant), but there are two different x-dimension pitches. That is, as shown in FIG. 3(a), many of the adjacent chips have a pitch Δpx and some have a pitch twice as large (i.e., 2Δpx). These pitches are shown for purposes of providing an example, but various pitches may exist in both the X and Y dimensions in other embodiments. The information received in step S202 includes the location of the chip, the quality of the chip, and the pitch of the chip.For example, the location of the chips may be in terms of x / y coordinates on the substrate relative to a reference point (e.g., the center of the substrate), the quality of the chips may be a ranking identifier (e.g., A, B, C), and the pitch may be a distance value (e.g., nanometers in x and y). Furthermore, there may be multiple product substrates, i.e., the information collected in step S202 may be information about multiple product substrates.

[0022] FIG. 3B shows a schematic top view of an exemplary source substrate 114. As shown in FIG. 3B, the source substrate 114 has a plurality of chips 124 thereon. The plurality of chips 124 of the source substrate 114 can have any arrangement and variety of chips for use in the method 200. That is, as shown in FIG. 3(b), the plurality of chips 124 have various qualities A-C and are randomly distributed without a set pitch. In one embodiment, the plurality of chips 124 on the source substrate 114 are distributed at a pitch (i.e., have a source pitch), but the source pitch is unrelated to the product pitch of the plurality of chips 140 on the product substrate 138. Since the exemplary product substrate 138 only has qualities A-C, only qualities A-C are shown in FIG. 3A for simplicity, but the source substrate 114 can have additional qualities. This is because only the chips that are needed are taken from the source substrate 114, as described below in subsequent steps. For the same reason, the pitch of the plurality of chips 124 on the source substrate 114 may be random as the chips are rearranged in subsequent steps. As mentioned above, although one source substrate 114 is shown, there may be many source substrates (i.e., one or more). As also shown in FIG. 3A, in an exemplary embodiment, the plurality of chips 124 are much smaller than the plurality of chips 140 on the product substrate 138. However, in other exemplary embodiments, the size of the chips may vary or may be closer in size to the plurality of chips 140 on the product substrate 138.

[0023] 1, where source substrate 114 having multiple chips 124 is held by source substrate chuck 110 and product substrate 138 having multiple chips 140 is held by product substrate chuck 136. Prior to this moment, robot arm 126 has placed source substrate 110 on source substrate chuck 110 and product substrate 138 on product substrate chuck 136.

[0024] Method 200 can then proceed to step S204, where instructions are generated for chip placement device 118 to place multiple chips from one or more chip suppliers onto one or more intermediate substrates based on the received chip placement information. In this step, the information received in step S202 (i.e., information regarding chip location, chip quality, and pitch) is used to determine what specific quality of chip is required for bonding and which location on intermediate substrate 116 will enable a more efficient bonding process. With respect to the required chip quality, as discussed above, the A, B, C designation in exemplary product substrate 138 signals which quality is required. That is, for each "A" chip on product substrate 138, a corresponding "A" chip is required for bonding. Similarly, for each "B" chip on product substrate 138, a "B" chip is required, and for each "C" chip on product substrate 138, a "C" chip is required. Thus, the instructions generated in step S204 include the number of each quality of chip required for the bonding process. With respect to placing the chips on the intermediate substrate, the pitch information received in step S202 generates instructions on where to place the chips. In particular, as described above, the chips from the source substrate 114, which are randomly distributed and / or have pitches that do not match the pitches of the chips on the product substrate 138, may be placed on the intermediate substrate 116 such that the pitches of the chips on the intermediate substrate 116 match the pitches of the chips 140 on the product substrate 138 or are placed at integer multiples of the pitches of the chips 140 on the product substrate 138. As will become apparent in the following steps, when the quality information and pitch information received in step S202 are used to generate instructions to place the chips on the intermediate substrate 116 such that the quality and pitch match the chips 140 on the product substrate 138, it is possible to use multiple bond heads 134 to collectively bond the chips to the chips 140 on the product substrate 138.

[0025] In addition to considering the quality of the chips and the pitch of the chips, the instructions generated in step S202 may be based on information regarding the pitch of the plurality of bonding heads 134, which itself is set based on the pitch of the plurality of chips 140 on the product substrate 138. FIG. 4 shows a schematic bottom view of the plurality of bonding heads 134, where there are 2×3 bonding heads for a total of six (i.e., m is 2 and n is 3). Due to construction limitations, the plurality of bonding heads 134 cannot have a pitch exactly equal to the pitch of the plurality of chips 140 on the product substrate 138. That is, the plurality of chips themselves may have a pitch of 3 mm to 32 mm. However, the pitch of the plurality of bonding heads is limited by their geometric dimensions of 30 mm to 150 mm relative to each other. Thus, in an exemplary embodiment, the plurality of bonding heads may be initially positioned to have a pitch that is an integer multiple of the pitch of the plurality of chips 140 on the product substrate 138. For example, in the illustrated embodiment, as described above, the pitch of the plurality of chips 140 on the product substrate 138 in the X dimension is as small as Δpx, and Δpy is as small as the Y dimension. Since the multiple bond heads 134 cannot be set this small, in the embodiment shown in FIG. 4, they are instead set to an integer multiple that is twice the x and y pitch. As shown in FIG. 4, in this embodiment, the multiple bond heads 134 are set to 2Δpx in the X dimension and 2Δpy in the Y dimension. Similar to the chip, the pitch of the bond heads is defined herein as the distance between the center point of one bond head and an adjacent bond head in the X and Y dimensions. However, any reference point can be used to define the bond head pitch as long as it is a consistent reference point. In the exemplary embodiment, an integer multiple of 2 is used, but other integer multiples are suitable. Furthermore, while the integer multiple is the same for both the X and Y dimensions in the exemplary embodiment (i.e., 2), in other embodiments, the integer multiple may be different depending on the particular application, i.e., 2Δpx and 3Δpx.

[0026] Once the pitch of the bond heads 134 is determined and set based on the pitch of the chips 140 of the product substrate 138, instructions can be generated in step S202 using the bond head pitch information. Specifically, in addition to determining which quality of chips is required, the placement of the chips that aligns with the pitch of the bond heads is determined. The chips 124 from the source substrate 114 can then be placed on the intermediate substrate 116 to meet both the required chip quality and the required pitch for optimal bonding productivity / throughput. FIG. 5 shows a schematic top view of the intermediate substrate 116 after the chip placement device 118 has placed the chips 158 on the intermediate substrate 116 according to the instructions generated from step S202. As shown in FIG. 5, the chips 158 are placed on the intermediate substrate 116 in a specific placement according to the instructions generated. The chips 158 are specifically placed on the intermediate substrate 116 with the appropriate pitch and the appropriate quality so that all the bond heads can be used simultaneously. 6A and 6B show schematic top views of the intermediate substrate 116 to illustrate how a subset of the plurality of chips 158 can correspond to the plurality of bond heads 134. Although the plurality of bond heads 134 may not actually pick up chips from the intermediate substrate 116, as described in more detail below, the schematic diagrams shown in FIGS. 6A and 6B illustrate the pitch of the arrangement on the intermediate substrate 116 compared to the pitch of the plurality of bond heads 134. In FIG. 6A, the plurality of bond heads 134 are shown projected generally onto a first subset of chips on the intermediate substrate 116. As shown in FIG. 6A, when projected onto the intermediate substrate, each bond head of the plurality of bond heads aligns with a chip of the plurality of chips 158. That is, the pitch of the plurality of bond heads 134 aligns to a multiple of the pitch of the chips 158. In the case of FIG. 6A, the six exemplary bond heads are all aligned with the six chips. FIG. 6B illustrates another projection of the multiple bond heads 134 onto a second subset of chips of the intermediate substrate 116, where the multiple bond heads 134 are shifted by a single x-dimension pitch Δpx.In the case of FIG. 6B, by moving over one x-dimension pitch, all six bond heads are aligned with different sets of six chips. Thus, by placing chips of the required quality on the intermediate substrate at a particular pitch, the chips are optimally positioned for an efficient bonding process. This concept is shown in more detail below as part of an exemplary bonding process involving multiple chip sets being bonded. Although FIGS. 6A and 6B show the bond head pitch projected onto the pitch of the chips on the intermediate substrate, as described below, multiple transfer heads with the same number of heads and multiple bond heads with the same pitch can be used to transfer one set of chips from the intermediate substrate to multiple bond heads.

[0027] 7 shows the bonding system 100 at a moment after the intermediate substrate 116 has been fully loaded with the chips 158 to be used in the bonding process. As shown in FIG. 6, the source substrate 114 now has fewer chips as the chips have been placed on the intermediate substrate 116. As mentioned above, multiple different source substrates can be used to completely fill the intermediate substrate 116. Additionally, multiple intermediate substrates can be prepared at this stage. In these cases, the transfer robot 126 moves source substrates and / or intermediate substrates in and out as needed.

[0028] Once the intermediate substrate 116 is filled with chips according to the instructions, the method proceeds to step S206, where one or more intermediate substrates having multiple chips disposed thereon are received. That is, the transfer robot 126 passes the intermediate substrate 116 to the activation device 128 to activate the chips as described above, and then transfers the intermediate substrate 116 to the chip bonding station 106. After the intermediate substrate 116 passes through the activation device 128 with the chips activated, the transfer robot 126 carries the intermediate substrate 116 to the second intermediate substrate chuck 130 of the chip bonding station 106. The intermediate substrate 116 with the activated chips 158 is then chucked by the second intermediate substrate chuck 130. FIG. 8 shows the bonding system 110 at the moment when the intermediate substrate 116 with the activated chips 158 is chucked by the second intermediate substrate chuck 130. As shown in FIG. 8, in this embodiment, the chips 158 face downward and are adjacent to the multiple bonding heads 134. In an alternative embodiment, the chips on the intermediate substrate are already activated before they reach the chip placement portion 102 and are transferred directly from the chip placement portion 102 to the bonding portion 106 .

[0029] Next, once the intermediate substrate 116 with activated chips is attached to the second intermediate substrate chuck 130, the first microscope 150 can be used to verify that the plurality of chips 158 are in the proper position. This step can be performed by moving the carriage 142 along the base 144 until the first microscope 150 is under the plurality of chips 158. If the feedback from the first microscope 150 indicates that a particular chip of the plurality of chips 158 is outside of an acceptable amount of error, a replacement intermediate substrate must be prepared. If the feedback from the first microscope 150 indicates that the plurality of chips 158 are properly positioned within an acceptable amount of error, the method can proceed.

[0030] The method can then proceed to transfer the first set of chips from the intermediate substrate 116 to the multiple bond heads 134. This step can be performed by first moving the carriage 142 along the base 144 until the multiple transfer heads 148 are under the multiple chips 158. The multiple transfer heads 148 may include the same number of heads with the same pitch as the multiple bond heads 134. The multiple transfer heads 148 may include a positive integer multiple of the multiple bond heads 134. As described above, this pitch is set to the same integer multiple of the pitch of the multiple chips 158 on the intermediate substrate 116. In other words, the multiple transfer heads 148 are configured to mirror the multiple bond heads 134, and the multiple transfer heads 148 can transfer up to as many chips as the multiple bond heads can bond in a single bonding step. The multiple transfer heads 148 can pick up the first set of chips 160 from the intermediate substrate 116, for example, by actuating a vacuum force. The multiple transfer heads 148 can maintain the vacuum force while the multiple transfer heads 148 holding the first set of chips 160 are moved via the carriage 142 into position beneath the multiple bond heads 134. Either the multiple transfer heads 148 or the multiple bond heads 134 move toward the other (or both move simultaneously) until the first set of chips 160 are in position to be transferred to the multiple bond heads 134. Once in sufficient proximity, the vacuum force on the multiple transfer heads 148 can be terminated and the vacuum force of the multiple bond heads 134 can be activated, thereby transferring the first set of chips 160 to the multiple bond heads 134.

[0031] FIG. 9 illustrates the bonding system 100 at the time when the first set of chips 160 have been transferred from the multiple transfer heads 148 to the multiple bonding heads 134. As illustrated in FIG. 9, the first set of chips 160 are now held by the multiple bonding heads 134, and there are fewer chips on the intermediate substrate 116. FIG. 10 illustrates a schematic top view of the intermediate substrate 116 after the first set of chips 160 have been removed. The removed first set of chips 160 are shown in dashed lines in FIG. 10 to help indicate where the used first set of chips are. That is, the first set of chips 160 shown in dashed lines in FIG. 10 are not present on the intermediate substrate at the moment when the first set of chips 160 are transferred to the multiple bonding heads 134.

[0032] After the first set of chips 160 are transferred to the multiple bonding heads 134, the method can proceed to measuring and adjusting the placement of individual chips of the first set of chips 160, if necessary, to ensure placement accuracy. This step may be performed by moving the carriage 142 until the multiple alignment devices 146 are under the multiple bonding heads 134 and under the first set of chips 160. The multiple alignment devices 146 may include a number of alignment devices equal to the number of bonding heads. That is, each alignment unit of the multiple alignment devices 146 may correspond to one bonding head of the multiple bonding heads 134. If there are fewer alignment units in one set than one set bonding heads, the carriage 142 moves the alignment units to the next subset of bonding heads to measure the position of the chips. Each alignment unit may be a microscope, a camera, or any type of measurement device capable of measuring the position of each chip on a micron, sub-micron, or nanometer scale. Based on feedback from each alignment unit, each bonding head can be controlled to move the tip to a precise position as needed. For example, a bonding head may be capable of moving a held tip by 100 μm, 10 μm, 1 μm, 500 nm, or 50 nm. In this way, the information obtained from multiple alignment devices 146 can be used to obtain the precise position of each individual tip.

[0033] Once each chip of the first set of chips 160 is confirmed to be in the correct position or moved to the correct position, the method proceeds to step S208, where the multiple bonding heads 134 are operated to collectively bond the first set of chips 160 to the product substrate 138. In particular, each chip of the first set of chips 160 is placed on a product chip of the multiple product chips 140. Since the chip quality and the pitch of the bonding heads have been precisely adjusted as described above, the multiple bonding heads 134 can simultaneously bond all of the first set of chips 160. That is, by pre-positioning the multiple chips 158 on the intermediate substrate 116, the bonding process can be efficiently performed using the multiple bonding heads simultaneously, taking into account the required chip quality and required pitch. As used herein, "collectively" can include providing bonding instructions to all bonding heads simultaneously, can include providing bonding instructions to all bonding heads within 1 second, can include completing bonding of all chips of the set of chips on the bonding heads within 1-3 seconds, and can also include any amount of time to complete bonding of all chips of the set of chips currently on the bonding heads. That is, no matter how long it takes for all the chips in the set of chips currently on the bond head to be bonded, they can be considered as a batch as long as the transfer head does not yet have another set of chips brought over for bonding.

[0034] The process of bonding the first set of chips 160 to the product substrate 138 may be performed by first moving the carriage 142 holding the product substrate chuck 136 until the plurality of bond heads 134 holding the first set of chips 160 are properly positioned above the corresponding plurality of chips 140 on the product substrate 138. Then, either the plurality of bond heads 134 or the product substrate chuck 136 (or both) move toward each other until the first set of chips 160 are in position to be bonded to the plurality of product chips 140 on the product substrate 138. Bonding is performed by activating each bond head of the plurality of bond heads 134 to bring each chip of the first set of chips 160 into contact with a corresponding chip of the plurality of product chips 140. Each bond head may also apply a force to the chip to ensure that the chip conforms to and bonds to the corresponding product chip on the product substrate 138. With the chips activated as described above, once the first set of chips 160 come into contact with the product chips 140, the hybrid bonding process begins.

[0035] FIG. 11 shows the bonding system 100 at the moment when the first set of chips 160 are bonded to the product chips 140. As shown in FIG. 11, the first set of chips 160 are no longer on the multiple bond heads, but instead are located on the multiple product chips 140. FIG. 12 shows a schematic top view of the product substrate 138 after the first set of chips 160 are bonded to the product chips 140. As shown in FIG. 12, each chip of the first set of chips 160 is bonded to a corresponding product chip 160. In the exemplary embodiment, six chips were bonded collectively to six corresponding product chips using six bond heads. In particular, as also shown in FIG. 12, the qualities of the chips from the first set of chips are arranged on the product chips having corresponding qualities. In the exemplary embodiment, the "A" quality chips are bonded to the "A" quality product chips, the "B" quality chips are bonded to the "B" quality product chips, and the "C" quality chips are bonded to the "C" quality product chips. Furthermore, comparing FIG. 12 with FIG. 10, it can be seen that the pitch in FIG. 10 matches the pitch in FIG. 12, in particular because the chips on intermediate substrate 116 are arranged to have a pitch that is an integer multiple of the pitch of product chips 140.

[0036] The above steps can then be repeated until all of the product chips 140 have been bonded to chips from the plurality of chips 158. In an exemplary embodiment, there are six bond heads, so six more chips can be bonded each time the process is repeated. By pre-positioning multiple chips on an intermediate substrate to match quality, multiple bond heads can be used in bulk compared to known systems that bond chips one at a time to match chip quality. Furthermore, because the pre-positioning of multiple chips on an intermediate substrate also takes pitch into account, all available bond heads can be used simultaneously. These two factors make the bonding process much more efficient than known systems.

[0037] FIG. 13 shows a schematic top view of the intermediate substrate 116 after the second set of chips 162 have been removed. Here, the removed first set of chips 160 have been completely omitted from FIG. 13. The second set of chips 162 are shown in dashed lines in FIG. 13 to help indicate where the second set of chips that will be used are. That is, the second set of chips 162 shown in dashed lines in FIG. 13 are not present on the intermediate substrate at the moment the second set of chips 162 are transferred to the multiple bonding heads 134 and then bonded to the product chips 140 according to the same steps described above. FIG. 14 shows a schematic top view of the product substrate 138 after the second set of chips 162 have been bonded to the product chips 140. Like the first set of chips 160, each chip of the second set of chips 162 has been bonded to a corresponding product chip 140. In this second bonding step, six more chips are bonded to the product chip 140 until all of the chips in the second set of chips 162 are bonded together.

[0038] FIG. 15 shows a schematic top view of the intermediate substrate 116 after the third set of chips 164 have been removed. Here, the removed first set of chips 160 and second set of chips 162 are completely omitted from FIG. 15. The third set of chips 164 are shown in dashed lines in FIG. 15 to help indicate where the third set of chips to be used are. That is, the third set of chips 164 shown in dashed lines in FIG. 15 are not present on the intermediate substrate at the moment the third set of chips 164 are transferred to the multiple bonding heads 134 and then bonded to the product chips 140 according to the same steps described above. FIG. 16 shows a schematic top view of the product substrate 138 after the third set of chips 164 have been bonded to the product chips 140. Like the first set of chips 160 and the second set of chips 162, each chip of the third set of chips 164 has been bonded to a corresponding product chip 140. In this third bonding step, there are six more chips bonded to product chip 140, with all of the chips in third set of chips 164 being bonded together.

[0039] FIG. 17 shows a schematic top view of the intermediate substrate 116 after the fourth set of chips 166 have been removed. The previously removed first set of chips 160, second set of chips 162, and third set of chips 164 have been completely omitted from FIG. 17. The fourth set of chips 166 are shown in dashed lines in FIG. 17 to help indicate where the fourth set of chips to be used are. That is, the fourth set of chips 166 shown in dashed lines in FIG. 17 are not present on the intermediate substrate at the moment the fourth set of chips 166 are transferred to the multiple bonding heads 134 and then bonded to the product chips 140 following the same steps described above. FIG. 18 shows a schematic top view of the product substrate 138 after the fourth set of chips 166 have been bonded to the product chips 140. Like the first set of chips 160, the second set of chips 162, and the third set of chips 164, each chip in the fourth set of chips 166 is bonded to a corresponding product chip 140. In this fourth bonding step, there are six more chips bonded to product chips 140, and all of the chips in the fourth set of chips 166 are bonded together.

[0040] FIG. 19 shows a schematic top view of the intermediate substrate 116 after the fifth set of chips 168 have been removed. The previously removed first set of chips 160, second set of chips 162, third set of chips 164, and fourth set of chips 166 have been completely omitted from FIG. 19. The fifth set of chips 168 are shown in dashed lines in FIG. 19 to help indicate where the fifth set of chips to be used are. That is, the fifth set of chips 168 shown in dashed lines in FIG. 19 are not present on the intermediate substrate at the moment the fifth set of chips 168 are transferred to the multiple bonding heads 134 and then bonded to the product chips 140 following the same steps described above. FIG. 20 shows a schematic top view of the product substrate 138 after the fifth set of chips 168 have been bonded to the product chips 140. Like the first set of chips 160, the second set of chips 162, the third set of chips 164, and the fourth set of chips 166, each chip in the fifth set of chips 168 is bonded to a corresponding product chip 140. In this fifth bonding step, there are six more chips bonded to product chips 140, and all of the chips in the fifth set of chips 168 are bonded together.

[0041] FIG. 21 shows a schematic top view of the intermediate substrate 116 after the sixth set of chips 170 have been removed. The previously removed first set of chips 160, second set of chips 162, third set of chips 164, fourth set of chips 166, and fifth set of chips 168 have been completely omitted from FIG. 21. The sixth set of chips 170 are shown in dashed lines in FIG. 21 to help indicate where the sixth set of chips are used. That is, the sixth set of chips 170 shown in dashed lines in FIG. 21 are not present on the intermediate substrate at the moment when the sixth set of chips 170 are transferred to the multiple bonding heads 134 and then bonded to the product chips 140 following the same steps described above. FIG. 22 shows a schematic top view of the product substrate 138 after the sixth set of chips 170 have been bonded to the product chips 140. A first set of chips 160, a second set of chips 162, a third set of chips 164, a fourth set of chips 166, a fifth set of chips 168, and a sixth set of chips 170 are bonded to corresponding product chips 140. In this sixth bonding step, there are six more chips bonded to product chips 140, and all of the chips in the sixth set of chips 170 are bonded together.

[0042] In the illustrated example, after the sixth set of chips 170 are bonded to the product chips 140, the entire bonding process is completed. That is, every product chip has a source chip bonded to it. Notably, in this exemplary embodiment, all six bonding heads could be used in every bonding step. Similarly, the quality of every source chip matches the quality of the product chip to which it is bonded. Thus, by implementing the above disclosed method and system, including the step of placing chips on an intermediate substrate, it is possible to collectively bond multiple source chips to multiple product chips, simultaneously matching chip quality and improving productivity / throughput. Although the exemplary embodiment allows all bonding heads to be implemented in every bonding step, the source chip placement on the intermediate substrate that allows at least one instance of using all of the available bonding heads is considered an improvement in productivity / throughput compared to a system in which it is not possible to use all of the available bonding heads even at a single time. After all of the multiple chips 140 are chip bonded, the product substrate 138 is removed from the chip bonding section 106, such as by the transfer robot 126. The product substrate may then be subjected to an annealing process (which may include one or both of heat and pressure) where the hybrid bonding process is completed. The product substrate may then be subjected to additional processes where additional chips are added to the product substrate before or after the annealing process. The product substrate may then be subjected to additional processes such as singulation, testing, encapsulation, etc., used to manufacture multiple articles from the product substrate.

[0043] It should be noted that not all of the activities described above in the general description or in the examples are required, some of the specific activities may not be required, and one or more additional activities may be performed in addition to those described. Furthermore, the order in which the activities are listed is not necessarily the order in which they are performed. Although the above description has been described in the context of a hybrid bonding process, other bonding processes may be used, such as soldering, flip chip bonding, ball grid array bonding, or another process used to form multiple electrical connections between chips.

[0044] Benefits, other advantages, and solutions to problems have been described above with respect to particular implementations. However, the benefits, advantages, solutions to problems, and any features that may give rise to or make more noticeable any benefit, advantage, or solution should not be construed as critical, required, or essential features of any or all of the claims.

[0045] The specification and illustrations of the implementations described herein are intended to provide a general understanding of the structure of the various implementations. The specification and illustrations are not intended to be exhaustive and comprehensive in describing all of the elements and features of the apparatus and systems that use the structures or methods described herein. Separate implementations may also be provided in combination in a single implementation, and conversely, for brevity, various features described in the context of a single implementation may also be provided separately or in any subcombination. Furthermore, references to values ​​described in ranges include each and every value within that range. Many other implementations may become apparent to those skilled in the art only after reading this specification. Other implementations may be used and derived from this disclosure, such that structural substitutions, logical substitutions, or other changes may be made without departing from the scope of this disclosure. Thus, this disclosure should be considered as illustrative and not restrictive.

Claims

1. 1. A method for bonding chips, comprising: receiving chip placement information including locations on one or more product substrates to which the chips are to be bonded; generating instructions for a chip placement device to place a plurality of chips from one or more chip suppliers onto one or more intermediate substrates based on the received chip placement information; receiving the one or more intermediate substrates having the plurality of chips disposed thereon in accordance with the generated instructions; and and actuating a plurality of bond heads to collectively bond a subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates; a number of tips in the subset of tips equal to a number of bonding heads in the plurality of bonding heads; A method for manufacturing a semiconductor device comprising the steps of:

2. The number of the bonding heads is 2 to 16.

2. The method for manufacturing a semiconductor device according to claim 1.

3. determining pitch information of the chips to be bonded based on the received chip arrangement information; 2. The method for manufacturing a semiconductor device according to claim 1.

4. and positioning the plurality of bonding heads based on the received chip placement information.

4. The method for manufacturing a semiconductor device according to claim 3.

5. positioning the plurality of bonding heads includes positioning the plurality of bonding heads at a pitch that is an integer multiple of the determined pitch information.

5. The method for manufacturing a semiconductor device according to claim 4.

6. generating the instructions is further based on a pitch of the plurality of bonding heads.

2. The method for manufacturing a semiconductor device according to claim 1.

7. the instructions include where to place the plurality of chips on the one or more intermediate substrates based on a pitch of the plurality of bond heads.

7. The method for manufacturing a semiconductor device according to claim 6.

8. receiving chip quality information of the chips to be bonded; 2. The method for manufacturing a semiconductor device according to claim 1.

9. generating the instructions is further based on the received chip quality information; 9. The method for manufacturing a semiconductor device according to claim 8.

10. the instructions include where to place the plurality of chips on the one or more intermediate substrates based on the received chip quality information.

9. The method for manufacturing a semiconductor device according to claim 8.

11. transferring the subset of chips from the one or more intermediate substrates to the plurality of bond heads.

2. The method for manufacturing a semiconductor device according to claim 1.

12. transferring the subset of chips includes using a plurality of transfer heads; the number of moving heads among the plurality of transfer heads is equal to an integer multiple of the number of bonding heads among the plurality of bonding heads; The method for manufacturing a semiconductor device according to claim 11 .

13. The chip placement information includes predetermined accuracy information.

2. The method for manufacturing a semiconductor device according to claim 1.

14. adjusting alignment of the plurality of bonding heads based on the predetermined accuracy information. The method for manufacturing a semiconductor device according to claim 13 .

15. transferring the subset of chips from the one or more intermediate substrates to the plurality of bond heads; and adjusting an alignment of a first set of tips on the plurality of bond heads based on the predetermined accuracy information; The method for manufacturing a semiconductor device according to claim 13, further comprising:

16. and actuating the plurality of bond heads to collectively bond chips of another subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates.

2. The method for manufacturing a semiconductor device according to claim 1.

17. the plurality of bond heads bond the subset of chips to the product substrate by hybrid bonding; 2. The method for manufacturing a semiconductor device according to claim 1.

18. the subset of chips are from a single intermediate substrate of the one or more intermediate substrates; 2. The method for manufacturing a semiconductor device according to claim 1.

19. 1. A system for bonding chips, comprising: one or more product substrate chucks configured to hold one or more product substrates; one or more intermediate substrate chucks configured to hold one or more intermediate substrates; A plurality of joining heads; one or more processors; and one or more memories storing instructions that, when executed by the one or more processors, cause the system to: receiving chip placement information including locations on one or more product substrates to which the chips are to be bonded; generating instructions for a chip placement device to place a plurality of chips from one or more chip suppliers onto the one or more intermediate substrates based on the received chip placement information; receiving, in accordance with the generated instructions, the one or more intermediate substrates having a plurality of chips disposed thereon and held by the one or more intermediate substrate chucks; and actuating the plurality of bonding heads to collectively bond a subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates held by the one or more product substrate chucks; a number of tips in the subset of tips equal to a number of bonding heads in the plurality of bonding heads; A system characterized by:

20. 1. A method of manufacturing a plurality of articles, comprising: receiving chip placement information including locations on one or more product substrates to which the chips are to be bonded; generating instructions for a chip placement device to place a plurality of chips from one or more chip suppliers onto one or more intermediate substrates based on the received chip placement information; receiving the one or more intermediate substrates having the plurality of chips disposed thereon in accordance with the generated instructions; and activating a plurality of bonding heads to collectively bond a subset of the plurality of chips of the one or more intermediate substrates to a product substrate of the one or more product substrates; singulating the product substrate to produce the plurality of articles; a number of tips in the subset of tips equal to a number of bonding heads in the plurality of bonding heads; A manufacturing method comprising the steps of:

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