Load lock arrangements, semiconductor processing systems including load lock arrangements, and associated methods for regulating temperature of substrates within load lock arrangements

Abstract

To provide load lock arrangements, semiconductor processing systems including the load lock arrangements, and associated methods for regulating the temperature of substrates within the load lock arrangements.SOLUTION: Load lock assemblies, semiconductor processing systems including the load lock assemblies, and associated methods for regulating the temperature of substrates within the load lock assemblies are disclosed. The load lock assemblies include a temperature control assembly coupled to an elevator, the elevator configured to provide vertical movement to the temperature control assembly within a load lock body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates generally to the fields of semiconductor processing systems and methods, and to the fields of device and integrated circuit manufacturing. More specifically, the present disclosure relates to a load lock arrangement, a semiconductor processing system including a load lock arrangement, and a method for regulating the temperature of a substrate within the load lock arrangement. [Background technology]

[0002] A semiconductor processing system, such as a semiconductor processing system employing a clustered platform, typically includes a front end connected to a back end by a load lock arrangement. The front end typically interconnects the semiconductor processing system to an external environment and typically includes a front end substrate transport robot for transferring substrates between the front end module and the load lock arrangement. The back end typically includes one or more process modules where substrate processing is performed as well as a back end substrate transport chamber including a back end substrate transport robot employed to transfer substrates between the load lock arrangement and the process module. The load lock arrangement typically couples the back end of the semiconductor processing system to the front end of the semiconductor processing system and is typically arranged to separate the environment maintained within the back end of the semiconductor processing system from the environment maintained within the front end of the semiconductor processing system.

[0003] Substrates transferred from a process module to the load lock arrangement are typically received and placed in the load lock arrangement at an elevated temperature due to the various substrate processes performed in the process module and the need to vacate the process module to process additional substrates. Such heated substrates may be cooled prior to transfer from the load lock arrangement to the front end of the semiconductor processing system. Alternatively, substrates placed in the load lock arrangement that undergo processing in a process module may be preheated prior to transfer to the process module as a way of reducing the time to reach the process temperature in the process module.

[0004] However, extended periods of substrate cooling / heating within the load lock arrangement can adversely affect the rate at which substrates are processed within the semiconductor processing system. In addition, because the load lock arrangement typically has a front face that interconnects with the front end of the semiconductor processing equipment and a rear face that interconnects with the back end of the semiconductor processing equipment, additional interconnections to the load lock arrangement can be complicated due to limited access and / or limited space within and / or adjacent to the load lock arrangement. As a result, improved load lock arrangements and semiconductor processing systems including such load lock arrangements, as well as methods for regulating the temperature of substrates within the load lock arrangement, are desirable.

[0005] Any discussion, including discussion of the problems and solutions described in this section, is included in this disclosure solely for the purpose of providing a context for the present disclosure, and such discussion should not be construed as an admission that any or all of the present inventions were previously known or otherwise constitute prior art. Summary of the Invention

[0006] This Summary may introduce selected concepts in a simplified form that may be described in more detail below. This Summary is not necessarily intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter.

[0007] Various embodiments of the present disclosure relate to load lock arrangements. As described in more detail below, the load lock arrangements described herein can be used during the manufacture of electronic devices. Such load lock arrangements can reduce the complexity and / or cost of the manufactured devices.

[0008] According to an embodiment of the present disclosure, a loadlock arrangement is provided. In such an embodiment, the loadlock arrangement includes a loadlock body including a front side configured to couple with an equipment front end module, a rear side configured to couple with a back end transport module, and a side including a side opening. In such an embodiment, a substrate stage is disposed within the loadlock body, the substrate stage including an upper stage surface and a lower stage surface. In such an embodiment, the upper stage surface is configured to hold the substrate at a holding location within the loadlock body. In such an embodiment, a temperature control assembly is disposed partially within the loadlock body, and an elevator is coupled to the temperature control assembly to provide vertical movement to the temperature control assembly. In such an embodiment, a flexible seal mechanism is connected between a side of the loadlock body and the temperature control assembly, the flexible seal mechanism maintaining an environment within the loadlock body while moving the temperature control assembly.

[0009] According to an embodiment of the present disclosure, the load lock arrangement may also include the side opening having a first cross-sectional dimension greater than a maximum cross-sectional dimension of the temperature control assembly, such that the temperature control assembly is inserted and removed through the side opening.

[0010] According to embodiments of the present disclosure, the load lock arrangement can also include that the temperature control assembly includes a temperature conditioning head having an upper temperature conditioning surface.

[0011] According to an embodiment of the present disclosure, the load lock arrangement can also include an elevator configured to position the upper temperature regulating surface at a distance of more than 10 mm from the lower stage surface when loading the substrate from the load lock arrangement into the unload / load lock arrangement.

[0012] According to embodiments of the present disclosure, the load lock arrangement may also include that the substrate stage includes a secondary stage for holding additional substrates.

[0013] According to embodiments of the present disclosure, the load lock arrangement may also include a load lock body further including an upper load lock chamber and a lower load lock chamber, the temperature control assembly being partially disposed within the upper load lock chamber.

[0014] According to an embodiment of the present disclosure, the load lock arrangement may also further include a sealing plate connected to a side of the load lock body, the sealing opening including a sealing opening aligned with the side opening, the sealing opening having a second cross-sectional dimension smaller than the first cross-sectional dimension.

[0015] According to embodiments of the present disclosure, the load lock arrangement may also include that the flexible sealing mechanism includes a bellows.

[0016] According to embodiments of the present disclosure, the load lock arrangement may also include the first end of the bellows having a third cross-sectional dimension greater than the first cross-sectional dimension such that the first end of the bellows contacts the sealing surface of the sealing plate and surrounds a sealing opening forming a first air-tight seal.

[0017] According to embodiments of the present disclosure, the load lock arrangement may also include contacting a second end of the bellows with a sealing surface of the temperature control assembly forming a second gas-tight seal.

[0018] According to an embodiment of the present disclosure, the load lock arrangement may also include that the sealing surface of the temperature control assembly includes a surface of a flange of the temperature control assembly.

[0019] According to embodiments of the present disclosure, the load lock arrangement may also include an elevator providing a maximum vertical displacement to the upper thermal conditioning surface of between 1 mm and 15 mm.

[0020] According to an embodiment of the present disclosure, the load lock arrangement may also include the elevator being configured to position the upper temperature conditioning surface at a distance of less than 0.5 mm from the lower stage surface when conditioning a temperature of a substrate placed on the upper stage surface.

[0021] According to embodiments of the present disclosure, the load lock arrangement may also include an additional temperature control assembly partially disposed within the lower load lock chamber and coupled to the lower elevator to provide vertical displacement to the additional temperature control assembly.

[0022] Various further embodiments of the present disclosure relate to semiconductor processing systems that include a load lock arrangement. As described in more detail below, the semiconductor processing systems described herein can be used during the manufacture of electronic devices. Such load lock arrangements can reduce the complexity and / or cost of the manufactured devices.

[0023] In one aspect, the semiconductor processing system includes a loadlock arrangement including a loadlock body, a substrate stage housed within the loadlock body, and a temperature control assembly including a temperature adjustment head located within the loadlock body at a proximal end and a coupling connected to an elevator for raising and lowering the temperature adjustment head at a distal end, the distal end extending laterally through a side opening located on a side of the loadlock body such that the distal end is located outside the loadlock body. In such an embodiment, the semiconductor processing system can further include a flexible seal mechanism connected between a side of the loadlock body and the temperature control assembly, the flexible seal mechanism maintaining an environment within the loadlock body during movement of the temperature adjustment head. In such an embodiment, the semiconductor processing system can further include a back-end transport module connected to a rear side of the loadlock body, the back-end transport module coupling a process module to the loadlock arrangement. In such an embodiment, the semiconductor processing system can further include an equipment front-end module connected to a front side of the loadlock body, the equipment front-end module housing a front-end substrate transport robot. In such an embodiment, the elevator is configured to lower the temperature conditioning head to allow a front-end substrate transport robot to load / unload substrates, and to raise the temperature conditioning head to position the temperature conditioning head in close proximity to the substrate stage to provide at least one of heating and cooling to a substrate placed on the substrate stage.

[0024] According to an embodiment of the present disclosure, the semiconductor processing apparatus may also further include: the load lock body further includes an upper load lock chamber and a lower load lock chamber, and the temperature control assembly is partially disposed in the upper load lock chamber. Other technical features may be readily apparent to those skilled in the art from the following figures, descriptions, and claims.

[0025] According to an embodiment of the present disclosure, the semiconductor processing apparatus may further include an additional temperature control assembly partially disposed within the lower load lock chamber and coupled to the lower elevator to provide vertical displacement to the additional temperature control assembly. Other technical features may be readily apparent to those skilled in the art from the following figures, descriptions, and claims.

[0026] Various further embodiments of the present disclosure relate to methods for adjusting the temperature of a substrate in a load lock arrangement. As described in more detail below, the methods described herein can be used during the manufacture of electronic devices. Such methods can reduce the complexity and / or cost of the manufactured devices.

[0027] In one aspect, a method of adjusting a temperature of a substrate in a loadlock arrangement includes a loadlock body housing a substrate stage, the substrate stage including an upper stage surface and a lower stage surface, the upper stage surface configured to hold the substrate at a holding location within the loadlock body. In such an embodiment, the method can further include lowering a vertical position of a temperature control assembly partially disposed within the loadlock body to a load / unload position, the load / unload position being distal from the lower stage surface. In such an embodiment, the method further includes placing the process substrate on the upper stage surface at the holding location, and raising a vertical position of the temperature control assembly to a substrate temperature adjustment position proximate the lower stage surface to enable at least one of heating and cooling to the substrate positioned at the holding location, where the lowering and raising of the temperature control assembly is performed by an elevator coupled to a distal portion of the temperature control assembly extending outside the loadlock body through an opening located in a side of the loadlock body.

[0028] According to an embodiment of the present disclosure, the method may also include that the temperature control assembly includes a temperature adjustment head having an upper temperature adjustment surface, the upper temperature adjustment surface being positioned at a distance of more than 10 mm from the lower stage surface when in the load / unload position.

[0029] According to an embodiment of the present disclosure, the method may also include, where the upper temperature conditioning surface is positioned at a distance of less than 0.5 mm from the lower stage surface when in the substrate temperature conditioning position. Other technical features may be readily apparent to those skilled in the art from the following figures, descriptions, and claims.

[0030] These and other embodiments will become readily apparent to those skilled in the art from the following detailed description of certain embodiments, when read in conjunction with the accompanying drawings, in which: The invention is not limited to any particular embodiment disclosed.

[0031] To easily identify the discussion of any particular element or act, the most significant digit(s) of a reference number refers to the figure number in which that element is first introduced.

[0032] A more complete understanding of the embodiments of the present disclosure may be obtained by reference to the detailed description and claims when considered in conjunction with the following illustrative drawings. [Brief description of the drawings]

[0033] [Figure 1] FIG. 1 illustrates a semiconductor processing system in accordance with one or more embodiments of the present disclosure. [Diagram 2] FIG. 2 illustrates a load lock arrangement in accordance with one or more embodiments of the present disclosure. [Diagram 3] FIG. 3 illustrates a further load lock arrangement in accordance with one or more embodiments of the present disclosure. [Figure 4] FIG. 4 illustrates an additional load lock arrangement in accordance with one or more embodiments of the present disclosure. [Diagram 5]FIG. 5 illustrates a temperature control assembly according to one or more embodiments of the present disclosure. [Figure 6] FIG. 6 illustrates an additional load lock arrangement in accordance with one or more embodiments of the present disclosure. [Figure 7] FIG. 7 illustrates a further load lock arrangement in accordance with one or more embodiments of the present disclosure. [Figure 8] FIG. 8 illustrates an additional load lock arrangement including an upper load lock chamber and a lower load lock chamber in accordance with one or more embodiments of the present disclosure. [Figure 9] FIG. 9 illustrates a method of adjusting the temperature of a substrate disposed in a load lock arrangement in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] The descriptions of exemplary embodiments of devices, assemblies, and methods provided below are merely exemplary and are intended for illustrative purposes only. The following descriptions are not intended to limit the scope of the disclosure or the claims. Moreover, the recitation of multiple embodiments having stated features or steps is not intended to exclude other embodiments having additional features or steps, or other embodiments incorporating different combinations of the stated features or steps.

[0035] As described in more detail below, various embodiments of the present disclosure relate to load lock arrangements, semiconductor processing systems including the load lock arrangements, and associated methods for regulating the temperature of substrates within the load lock arrangements. As described in more detail below, the load lock arrangements described herein can be used during the manufacture of electronic devices. Such load lock arrangements can reduce the complexity and / or cost of manufacturing devices / integrated circuits and can increase the throughput of substrates processed within semiconductor processing equipment. In addition, the load lock arrangements and associated semiconductor processing systems and methods disclosed therein can increase the accessibility and functionality of such devices, systems, and methods.

[0036] As used herein, the term "substrate" may refer to any underlying material that may be used to form a device, circuit, or film, or on which a device, circuit, or film may be formed by a method according to an embodiment of the present disclosure. The substrate may include bulk materials such as silicon (e.g., single crystal silicon), other Group IV materials such as germanium, or other semiconductor materials such as Group II-VI or Group III-V semiconductor materials, and may include one or more layers overlying or underlying the bulk material. Furthermore, the substrate may include various features, such as recesses, protrusions, and the like, formed in or on at least a portion of the layers of the substrate. As an example, the substrate may include a bulk semiconductor material and an insulating or dielectric material layer overlying at least a portion of the bulk semiconductor material. Furthermore, the term "substrate" may refer to any underlying material that may be used or on which a device, circuit, or film may be formed. The "substrate" may be continuous or non-continuous, rigid or flexible, solid or porous. The "substrate" may be in any form, such as a powder, a plate, or a workpiece. Substrates in the form of plates may include wafers of various shapes and sizes. Substrates may be made of materials such as silicon, silicon germanium, silicon oxide, gallium arsenide, gallium nitride, and silicon carbide. The continuous substrate may extend beyond the boundaries of the process chamber in which the deposition process occurs and may move through the processing chamber, whereby the process continues until the end of the substrate is reached. The continuous substrate may be fed from a continuous substrate feeding system, which allows for the production and output of the continuous substrate in any suitable form. Non-limiting examples of continuous substrates may include sheets, nonwoven films, rolls, foils, webs, flexible materials, bundles of continuous filaments or fibers (i.e., ceramic or polymeric fibers). The continuous substrate may also include carriers or sheets onto which the non-continuous substrates are placed.

[0037] Further, in this disclosure, any two numbers for a variable can constitute a workable range for that variable, and any ranges stated may include or exclude the endpoints. In addition, any values ​​for a stated variable (whether they are stated with "about" or not) may refer to an exact or approximate value, and may include equivalents, and may also refer to an average, median, representative value, majority, or the like. Further, in this disclosure, the terms "comprise," "comprise," and "have" refer, in some embodiments, independently to "typically or broadly include," "comprise," "consist essentially of," or "consist of." In this disclosure, any defined meaning does not necessarily exclude, in some embodiments, the ordinary and customary meaning.

[0038] Referring now to the figures, FIG. 1 shows a semiconductor processing system 100. The semiconductor processing system 100 includes a process module 102, a back-end transfer module 104, and a load lock arrangement 106 including a load lock body 108. The semiconductor processing system 100 also includes a front-end equipment module (EFEM) 110, a controller 112, and an exhaust / vent source 114. In the illustrated embodiment, the semiconductor processing system 100 includes a cluster platform 116 having four process modules configured to deposit a material layer onto a substrate 118 using deposition techniques such as, for example, atomic layer deposition (ALD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and plasma-enhanced atomic layer deposition (PEALD). This is for illustrative and descriptive purposes only and is non-limiting. As will be appreciated by those skilled in the art in view of the present disclosure, semiconductor processing systems configured for processing operations other than material layer deposition, as well as semiconductor processing systems configured for other material layer deposition operations, can benefit from the present disclosure.

[0039] The process module 102 is coupled to the back-end transfer module 104 by a process module gate valve 120. The process module 102 includes a process chamber 122, a heater 124, and a reactant source 126. The process chamber 122 is disposed within the process module 102, houses the heater 124, and is configured to flow precursors or reactants across the substrate 118 while positioned over the heater 124 during deposition of a material layer on the substrate 118. The precursor / reactant source 126 is fluidly coupled to the process chamber 122 and is configured to provide precursors / reactants to the process chamber 122 for deposition of one or more material layers on the substrate 118. The process module gate valve 120 couples the process module 102 to the back-end transfer module 104 and is configured to provide selective communication between the process chamber 122 and the back-end transfer module 104. In this regard, it is contemplated that the process module gate valve 120 may be configured to allow transfer of the substrate 118 between the back-end transport module 104 and the process module 102 before and after deposition of a material layer onto the substrate 118.

[0040] According to an embodiment of the present disclosure, the process chamber 122 may be a first process chamber, and the process module 102 may include one or more second process chambers. For example, the process module 102 may be a dual-chamber module having two process chambers, or a quad-chamber module having four process chambers. According to a particular embodiment, the process module gate valve 120 may be a first process module gate valve, and the process module 102 may include a second process module gate valve that also couples the process module 102 to the back-end transfer module 104. In a particular embodiment, it is contemplated that the reactants may include reactants or precursors suitable for deposition of a material layer, such as using atomic layer deposition or chemical vapor deposition techniques. According to a particular embodiment, it is also contemplated that the process module 102 includes a plasma unit configured to provide the reactants 126 to the substrate 118 as a suitable plasma. In this regard, the process module 102 may be configured to deposit a material layer onto the substrate 118, for example, using plasma-enhanced atomic layer deposition or plasma-enhanced chemical vapor deposition techniques.

[0041] The back-end transfer module 104 is coupled to a rear face 138 of the load lock body 108 and includes a back-end chamber body 128 and a back-end substrate transfer robot 130. The back-end chamber body 128 is disposed along a transfer axis 132. It is contemplated that the back-end substrate transfer robot 130 is disposed within the interior of the back-end chamber body 128 and supported therein for movement relative to the back-end chamber body 128 for transfer of substrates, such as the substrate 118, between the load lock arrangement 106 and the process module 102. In certain embodiments, the back-end chamber body 128 may have a polygonal shape. In this regard, the back-end chamber body 128 may have five sides, fewer than five sides (e.g., a rectangular or square shape), or more than five sides (e.g., a hexagonal shape), and may have a regular or scalene polygon shape.

[0042] The equipment front-end module (EFEM) 110 is coupled to the front 140 of the load lock body 108 and includes an enclosure 144, a front-end substrate transport robot 146, and one or more load ports 148. The enclosure 144 houses the front-end substrate transport robot 146. The front-end substrate transport robot 146 is housed within the enclosure 144 for movement relative to the enclosure 144 or for transfer of substrates, such as substrates 118, between the one or more load ports 148 and the load lock arrangement 106. The one or more load ports 148 are connected to the enclosure 144 and are configured to receive therein a pod 150 that contains one or more substrates before and after deposition of a material layer on the substrate. In certain embodiments, the pod 150 may include a standard mechanical interface pod. According to certain embodiments, the pod 150 may include a front-opening integrated pod. Although shown and described herein as having three load ports, it should be understood and appreciated that the equipment front-end module 110 may include fewer or additional load ports and still be within the scope of the present disclosure.

[0043] The controller 112 is operatively connected to the semiconductor processing system 100 and includes a device interface 152, a processor 154, a user interface 156, and a memory 158. The device interface 152 couples the processor 154 to the semiconductor processing system 100, for example, via (or over) a wired or wireless link 160. The processor 154 is operatively connected to the user interface 156 and is placed in communication with the memory 158. The memory 158 includes a non-transitory machine-readable medium having a number of program modules 162 recorded thereon that contain instructions that, when read by the processor 154, cause the processor 154 to perform certain operations. Among the operations are those for regulating the temperature of a substrate in the load lock arrangement 106, as illustrated by a method 900 (shown in FIG. 9), as described below.

[0044] As discussed above, some semiconductor processing systems may include substrate heating and / or substrate cooling within the load lock arrangement 106, such as for throughput purposes. For example, in some semiconductor processing systems, substrate heating within the load lock arrangement may be implemented to limit processing time within a process module to reduce the time it takes to ramp the substrate temperature to a desired material layer deposition temperature. Alternatively, or additionally, substrate cooling within the load lock arrangement 106 may be implemented to limit processing time within a process module. To meet the needs for a load lock arrangement with increased flexibility, accessibility, and configuration, as well as substrate cooling and / or substrate heating requirements, the load lock arrangement 106 is provided.

[0045] 1, the load lock arrangement 106 includes a front side 140 configured (i.e., constructed and arranged) to couple with an equipment front end module 110, a rear side 138 configured (i.e., constructed and arranged) to couple with a back end transport module, and a side 142 constructed and arranged for insertion of a temperature control assembly, as described in more detail below. In addition, the load lock arrangement 106, and specifically the load lock body 108, can include an upper load lock chamber, a lower load lock chamber, as described in more detail below.

[0046] 2, 3, and 4 illustrate different views of an exemplary loadlock arrangement 106 according to an embodiment of the present disclosure. FIG. 2 is a cutaway top view of the internal configuration of the loadlock elements within the loadlock arrangement, and FIG. 3 is a cross-sectional view taken along line AA in FIG. 2, which illustrates the side 142 of the loadlock body 108 and the configuration of the loadlock elements. The following details include references to FIG. 2, 3, and 4, and common elements are commonly labeled. In addition, the exemplary views of the loadlock arrangement 106 in FIG. 2 and FIG. 3 are substantially symmetrical about axis BB (FIG. 2) and axis CC (FIG. 3), and thus the detailed description of the loadlock arrangement 106 illustrated in FIG. 2 and FIG. 3 will focus on the loadlock elements to the left of axis BB and axis CC, and those elements to the right of axis BB and axis CC will be assumed to be the same unless otherwise noted.

[0047] More specifically, the loadlock arrangement 106 of the present disclosure includes a loadlock body 108. The loadlock body 108 includes a front side 140 configured for coupling with an equipment front end module such as that illustrated in FIG. 2. The front side 140 includes one or more forward gate valves 202 that maintain an environment with the loadlock body 108 while allowing controllable transfer of substrates to the front end module through the front side 140 of the loadlock body 108. The loadlock body 108 also includes a rear side 138 configured for coupling with a back end transport module. The rear side 138 includes a rear gate valve 204 to allow controllable transfer of substrates to a back end substrate transport robot through the rear side 138 of the loadlock body 108. The loadlock body 108 also includes sides, such as side 142. The side 142 includes a side opening 206 that extends through the loadlock body 108, the side opening 206 having a selected first cross-sectional dimension such that a selected loadlock component may be inserted into and removed from the loadlock body 108 through the side opening 206 (as shown in FIGS. 2-4 ). In some embodiments of the present disclosure, a sealing plate 208 may be attached to the side 142, the sealing plate 208 including a sealing surface 210 and a sealing opening 212 that extends through the sealing plate 208. In such embodiments, the sealing opening 212 is aligned with the side opening 212. In such embodiments, the sealing opening 212 may have a second cross-sectional dimension that is smaller than the first cross-sectional dimension of the side opening 206 (as shown in FIGS. 2-4 ).

[0048] According to an embodiment of the present disclosure, a substrate stage 302 is disposed within the loadlock body 108 (as shown in FIG. 3). The substrate stage 302 includes a support element 304 having an upper stage surface 306 and a lower stage surface 308. The upper stage surface 306 is configured to hold the substrate 118 at a holding location within the loadlock body 108. In some embodiments, the upper stage surface 306 may include a number of raised elements and / or one or more recessed features for holding the substrate 118 in a fixed position while placed on the upper stage surface 306 of the substrate stage 302. As shown in FIG. 3, the loadlock body 108 may accommodate two substrate stages 302 including a single level for holding a substrate. In a further embodiment of the present disclosure, the substrate stage 302 may optionally include an upper substrate stage 312 (shown as a dashed line indicating that this element is optional) for holding an additional substrate at a holding location within the loadlock body 108. In such an embodiment, an optional upper substrate stage 312 may be located directly above the substrate stage 302 (i.e., the lower substrate stage). According to embodiments of the present disclosure, a single substrate stage may include both the substrate stage 302 (i.e., the lower substrate stage) and the upper substrate stage 312.

[0049] The load lock arrangement of the present disclosure further includes one or more temperature control assemblies. The temperature control assemblies are employed for heating and / or cooling of substrates disposed within the load lock body. For example, substrate heating within the load lock arrangement of the present disclosure can be employed to shorten processing time within a process module by reducing the time required to ramp the substrate temperature to a desired process temperature. Alternatively, or additionally, substrate cooling within the load lock arrangement of the present disclosure can be employed to limit processing time within a process module by allowing cooling outside the process module, thereby freeing up the process module and allowing additional substrate processing through the semiconductor processing system and increasing substrate throughput.

[0050] More specifically, Figure 5 illustrates a temperature control assembly 500 according to an embodiment of the present disclosure. The temperature control assembly 500 includes a proximal end 502 that includes a temperature adjustment head 504 that includes an upper temperature adjustment surface 505. In some embodiments, the temperature control assembly 500, and in particular the temperature adjustment head 504, has a maximum width W 1 According to an embodiment of the present disclosure, the temperature adjustment head 504 can include a cooling and / or heating mechanism, as described below. The temperature control assembly 500 also includes a neck section 506 connected to the temperature adjustment head 504, and a flange 508 connected to the neck section 506. The temperature control assembly 500 includes a distal end 510 including a coupling 512 for connecting the temperature control assembly 500 to an elevator, which provides vertical movement to the temperature control assembly 500, and in particular to the temperature adjustment head 504. In some embodiments, the distal end 510 further includes ports 514a, 514b, and 514c for providing cooling and / or heating to the temperature adjustment head 504. According to an embodiment of the present disclosure, the temperature adjustment head 504 is configured to deliver heating and / or cooling to a substrate 118 held on the upper stage surface 306 of the substrate stage 302 (as shown in FIG. 3).

[0051] According to an embodiment of the present disclosure, the temperature adjustment head 504 includes a cooling mechanism (as illustrated in FIG. 5). In such a case, the cooling mechanism may include one or more sealed channels through which a cooling fluid may be introduced and withdrawn. According to an embodiment of the present disclosure, the cooling channel 516 is fed with coolant from the feed channels 518a and 518b via the ports 514a and 514c. In such an embodiment, the feed channels 518a and 518b extend through the neck section 506 and the flange 508 of the temperature control assembly 500 to form a fluid conduit between the temperature adjustment head 504 and the distal end 510 of the temperature control assembly 500. The cooling channel 516, the feed channels 518a and 518b are illustrated with dashed lines to indicate that they are disposed within the temperature control assembly 500, however, it is anticipated that other configurations of cooling channels and feed channels may be incorporated into the temperature control mechanism 500. According to embodiments of the present disclosure, cooling channel 516 may be supplied with cooling fluid through port 514a, and cooling fluid may be withdrawn from cooling channel 516 through port 514c. In some embodiments, ports 514a and 514c may be fluidly connected to a chiller system to provide temperature controlled fluid to temperature regulating head 504.

[0052] According to further embodiments of the present disclosure, temperature adjustment head 504 may alternatively or additionally include a heating mechanism. In such embodiments, the heating mechanism may include a heating element, such as elements 520a and 520b, disposed within and / or on temperature adjustment head 504. The heating element may include a resistive heating element electrically connected via conductive wires 522 that extend through neck section 506, flange 508, and to port 514b at distal end 510 of temperature control assembly 500, where an external electrical connection may be made to power the heating element in temperature adjustment head 504.

[0053] 2-4 illustrate the configuration of a temperature control assembly 500 with respect to a load lock arrangement 106 of the present disclosure. According to an embodiment of the present disclosure, the load lock arrangement 106 of the present disclosure can include a temperature control assembly 500 that is partially disposed within a load lock body 108, as illustrated in FIGS. 2 and 3. In some embodiments, a proximal end 502 of the temperature control assembly 500 includes a temperature adjustment head 504. According to an embodiment of the present disclosure, the temperature adjustment head 504 is disposed within the load lock body 108. In such an embodiment, the temperature adjustment head 504 is located below the support element 304 such that an upper temperature adjustment surface 505 of the temperature adjustment head 504 is substantially parallel to the lower stage surface 308 of the substrate stage 302 (as illustrated in FIG. 3). In addition, a center of the upper temperature adjustment surface 505 of the temperature control assembly 500 is aligned with a holding location where the substrate 118 is supported on the upper stage surface 306 of the substrate stage 302.

[0054] According to embodiments of the present disclosure, a distal end 510 of the temperature control assembly 500 extends laterally through a side opening 206 located in a side surface 142 of the load lock body 108 such that the distal end 510 is located outside of the load lock body 108. In some embodiments, the distal end 510 of the temperature control assembly 510 extends laterally through a sealing opening 212 of the sealing plate 208. In some embodiments, the side opening 206 and the sealing opening 212 are aligned such that the distal end 510 of the temperature control assembly extends laterally through both the side opening 206 and the sealing opening 212.

[0055] According to an embodiment of the present disclosure, the distal end 510 of the temperature control assembly 500 further includes a coupling 512. The coupling 512 is connected to an elevator 314 (see FIG. 3 ), thereby coupling the elevator 314 to the temperature control assembly 500, which provides vertical movement to the temperature control assembly 500 and, consequently, to the temperature adjustment head 504. Thus, the elevator 314 allows for raising and lowering of the temperature adjustment head 504 within the load lock body 108. According to an embodiment of the present disclosure, the elevator 314 can further include an elevator arm 316, which is movable in a substantially vertical direction to provide vertical movement to the temperature adjustment head 504 of the temperature control assembly 500.

[0056] According to embodiments of the present disclosure, the load lock arrangement of the present disclosure further includes a flexible seal mechanism. In some embodiments of the present disclosure, and referring to Figures 2 and 3, a flexible seal mechanism 218 can be connected between the side 142 of the load lock body 108 and the temperature control assembly 500, which maintains the environment within the load lock assembly 220 during movement (i.e., vertical displacement) of the temperature control assembly 500, and in particular, maintains the environment within the load lock body during lowering and raising of the temperature adjustment head 504 of the temperature control assembly 500 relative to the lower stage surface 308 of the substrate stage 304.

[0057] According to embodiments of the present disclosure, the flexible seal mechanism 218 may comprise a bellows. In such embodiments, the bellows may comprise an edge-welded metal bellows including multiple diaphragm plates connected to form a bellows core, which is connected at both sides by welded end fittings to complete the bellows assembly. In such embodiments, the bellows core is sealed at both ends by end fittings, which are then sealed to the load lock assembly (e.g., at the side 142 and the temperature control assembly 500) to maintain the environment within the load lock body as the bellows moves, for example, as the bellows compresses and expands during the movement of the temperature adjustment head 504 of the temperature control assembly 500 up and down.

[0058] In some embodiments of the present disclosure, bellows first end 222 has a third cross-sectional dimension that is larger than the second cross-sectional dimension of sealing opening 212 of sealing plate 208 such that bellows first end 222 contacts and surrounds sealing surface 210 of sealing plate 208. An air-tight seal is thereby formed between bellows first end 222 and sealing surface 210 of sealing plate 208.

[0059] In some embodiments of the present disclosure, the bellows second end 224 is connected to and surrounds a sealing surface of the temperature control assembly 500. In such examples, the sealing surface of the temperature control assembly 500 can comprise a surface of a flange 508 of the temperature control assembly. In such examples, the sealing surface of the temperature control assembly can include a surface of the flange 508 that faces the sealing plate 208, whereby an airtight seal is formed between the bellows second end 224 and the sealing surface of the flange 508. In other examples, the sealing surface of the temperature control assembly 500 can include a surface of the neck section 506, whereby an airtight seal is formed between the bellows second end 224 and the sealing surface of the neck section 506 of the temperature control assembly 500.

[0060] To further illustrate the flexible sealing of the temperature control assembly to the load lock chamber body to allow vertical movement of the temperature control assembly while maintaining the internal atmosphere of the load lock chamber body, FIG. 4 illustrates a side view of the load lock arrangement of the present disclosure.

[0061] More specifically, the side view of the loadlock arrangement 106 includes the side 142 of the loadlock chamber 108. The side 142 of the loadlock body 108 includes a side opening 206 that extends through the side 142 of the loadlock body 108. The side opening 206 is illustrated as a dashed line because it is obscured by the sealing plate 208. According to an embodiment of the present disclosure, the side opening 206 is substantially parallel to the maximum cross-sectional dimension (W 1 ) to allow the temperature control assembly to be inserted and removed through the side opening 206 prior to installation of the sealing plate 208.

[0062] According to an embodiment of the disclosure, the sealing plate 208 is connected to the side 142 of the load lock body 108 and includes a sealing opening 212. The sealing opening 212 is again illustrated as a dashed line because it is hidden by the flange 508 of the temperature control assembly 500 inserted into the side 142 of the load lock arrangement 106 through the side opening 206. In this embodiment, the sealing opening 212 is aligned with the side opening 206 disposed in the side 142 of the load lock body 108. According to an embodiment of the disclosure, the sealing opening 212 has a second cross-sectional dimension that is smaller than the first cross-sectional dimension of the side opening 206. As illustrated in FIG. 4, a distal end 510 of the temperature control assembly 500 extends outside the load lock body 108 such that the elevator 314 can be coupled to the temperature control assembly 500 by the elevator arm 316 and the coupling 512. According to an embodiment of the present disclosure, bellows 218 (illustrated as dashed line 218 contacting a surface of flange 508) forms an airtight seal with flange 508 and surrounds sealing opening 212. In such an embodiment, a first end of the bellows contacts flange 508 such that a third cross-sectional dimension of the bellows is larger than a second cross-sectional dimension of sealing opening 212. In such an embodiment, a first end of the bellows contacts flange 508 such that a third cross-sectional dimension of the bellows is smaller than a first cross-sectional dimension of side opening 206.

[0063] Thus, according to embodiments of the present disclosure, the first end of the bellows has a third cross-sectional dimension that is greater than the second cross-sectional dimension of the sealing opening, such that the first end of the bellows contacts the sealing surface of the sealing plate and surrounds the sealing opening. In such embodiments, the second end of the bellows contacts the sealing surface of the temperature control assembly and surrounds the temperature control assembly. In some embodiments, the sealing surface of the temperature control assembly comprises surface flange 512 of temperature control assembly 500.

[0064] According to an embodiment of the present disclosure, the elevator provides vertical movement to the temperature control assembly. Figures 6 and 7 further illustrate vertical movement of the temperature control assembly within the load lock arrangement of the present disclosure.

[0065] According to an embodiment of the present disclosure, the elevator 314 is configured to lower the temperature conditioning head 504 of the temperature control assembly 500 to a load / unload position (as shown in FIG. 6 ), which positions the upper temperature conditioning surface 505 of the temperature control assembly 500 distal from the lower stage surface 308 of the substrate stage 302. Positioning the temperature control assembly 500 in the unload / load position allows sufficient clearance between the lower stage surface 308 of the substrate stage 302 and the upper temperature conditioning surface 505 of the temperature conditioning head 504 to allow a front end substrate transport robot to load / unload the substrate 118 from the load lock body 108 to the load lock body 108.

[0066] Specifically, in some embodiments, the elevator 314 is configured to raise the temperature adjustment head 504 of the temperature control assembly 500 to a temperature adjustment position (as shown in FIG. 7 ), which positions an upper temperature adjustment surface 505 of the temperature control assembly 500 in close proximity to the lower stage surface 308 of the substrate stage 302. Positioning the temperature control assembly 500 in the temperature adjustment position allows sufficient proximity between the substrate 118 disposed on the upper stage surface 306 of the substrate stage 302 and the upper temperature adjustment surface 505 of the temperature adjustment head 504 to enable efficient heating and / or cooling of the substrate 118 disposed within the load lock body 108.

[0067] According to an embodiment of the present disclosure, the elevator 314 may have a maximum vertical displacement (V) of 0.5 mm to 20 mm, or 1 mm to 15 mm, or 2 mm to 10 mm, or 3 mm to 8 mm to the temperature adjustment head 504. 1In some embodiments, the elevator 314 provides a maximum vertical displacement (V) to the temperature adjustment head 504 of more than 0.5 mm, or more than 1 mm, or more than 2 mm, or more than 3 mm, or more than 5 mm, or more than 8 mm, or more than 10 mm, or more than 15 mm, or more than 20 mm. 1 ) is provided.

[0068] According to a further embodiment of the present disclosure, the elevator 314 is configured to position the upper temperature adjustment surface 505 of the temperature adjustment head 504 at a distance of less than 5 mm, or less than 2 mm, or less than 1 mm, or less than 0.9 mm, or less than 0.8 mm, or less than 0.7 mm, or less than 0.6 mm, or less than 0.5 mm from the lower stage surface 308 of the substrate stage 302 when the temperature control assembly 500 is positioned in the temperature adjustment position. According to a further embodiment of the present disclosure, the elevator 314 is configured to position the upper temperature adjustment surface 505 of the temperature adjustment head 504 at a distance of 0.5 mm to 5 mm, or 0.6 mm to 2 mm, or 0.7 mm to 1 mm from the lower stage surface 308 of the substrate stage 302 when the temperature control assembly 500 is positioned in the temperature adjustment position.

[0069] According to a further embodiment of the present disclosure, the elevator 314 is configured to position the upper temperature conditioning surface 505 of the temperature conditioning head 504 at a distance greater than 5 mm, or greater than 7 mm, or greater than 10 mm, or greater than 12 mm, or greater than 15 mm from the lower stage surface 308 of the substrate stage 302 when the temperature control assembly is positioned in the unload / load position. According to a further embodiment of the present disclosure, the elevator 314 is configured to position the upper temperature conditioning surface 505 of the temperature conditioning head 504 at a distance between 5 mm and 15 mm, or between 7 mm and 12 mm, or between 8 mm and 10 mm from the lower stage surface 308 of the substrate stage 302 when the temperature control assembly is positioned in the unload / load position.

[0070] According to further embodiments of the present disclosure, the loadlock arrangement of the present disclosure may further include a loadlock body including both an upper loadlock chamber and a lower loadlock chamber. FIG. 8 illustrates a loadlock arrangement 800 in more detail according to an embodiment of the present disclosure. The loadlock arrangement 800 includes a loadlock body 802 including an upper loadlock chamber 804 and a lower loadlock chamber 806. In such embodiments, the temperature control assembly 808 is partially disposed within the upper loadlock chamber 804. In such embodiments, the loadlock arrangement 800 may further include an additional temperature control assembly 810 partially disposed within the lower loadlock chamber 806 and coupled to a lower elevator 812 to provide vertical displacement to the additional temperature control assembly 810.

[0071] 9 illustrates an exemplary method 900 for adjusting a temperature of a substrate disposed in a loadlock arrangement of the present disclosure. More specifically, the method 900 includes a loadlock body housing a substrate stage, the substrate stage including an upper stage surface and a lower stage surface, the upper stage surface configured to hold the substrate at a holding location within the loadlock body (step 902).

[0072] In some embodiments of the present disclosure, the method 900 also includes lowering a vertical position of a temperature control assembly partially disposed within the load lock body to a load / unload position, which positions an upper temperature adjustment surface of the temperature control assembly distal from a lower stage surface of the substrate stage (step 904).

[0073] In some embodiments of the present disclosure, the method 900 also includes placing the substrate on an upper stage surface of the substrate stage at a holding location (step 906).

[0074] Some embodiments of the method 900 of the present disclosure also include raising the vertical position of the temperature control assembly to a substrate temperature adjustment position, which positions an upper temperature adjustment surface of the temperature control assembly proximate to a lower stage surface of the substrate stage to enable at least one of heating and cooling to a substrate positioned at the holding location (step 908).

[0075] In some embodiments of the present disclosure, the method 900 also includes that the lowering and raising of the temperature control assembly is performed by an elevator coupled to a distal portion of the temperature control assembly that extends outside the load lock body through an opening located in a side of the load lock body.

[0076] In some embodiments of the present disclosure, the method 900 also includes that the temperature control assembly includes a temperature conditioning head having an upper temperature conditioning surface, and the upper temperature conditioning surface is positioned a distance of more than 10 mm from the lower stage surface when in the load / unload position. Further, in some embodiments, the method 900 also includes that the upper temperature conditioning surface is positioned a distance of less than 0.5 mm from the lower stage surface when in the substrate temperature conditioning position.

[0077] Although certain embodiments and examples have been discussed, those skilled in the art will understand that the scope of the claims extends beyond the specifically disclosed embodiments to other alternative embodiments and / or uses and obvious modifications and their equivalents. Indeed, various modifications of the present disclosure in addition to those shown and described herein may become apparent to those skilled in the art from the description, such as alternative useful combinations of the described elements. Such modifications and embodiments are also intended to be included within the scope of the appended claims.

[0078] Where conditions and / or structures are not specified in the present disclosure, those skilled in the art will be readily able to provide such conditions and / or structures in view of the present disclosure as a matter of routine experimentation. [Explanation of symbols]

[0079] 104 Back-end transport module 108 Load lock body 110 Equipment Front-End Module 218 Flexible sealing mechanism 302 Substrate stage 306 Upper stage surface 308 Lower Stage Surface 314 Elevator 500 Temperature Control Assembly

Claims

1. 1. A load lock arrangement comprising: a load lock body having a front surface configured to couple with an equipment front end module, a rear surface configured to couple with a back end transport module, and a side surface including a side opening; a substrate stage disposed within the loadlock body, the substrate stage including an upper stage surface and a lower stage surface, the upper stage surface configured to hold a process substrate at a holding location within the loadlock body; a temperature control assembly disposed partially within the load lock body; an elevator coupled to the temperature control assembly for providing vertical movement to the temperature control assembly; a flexible seal mechanism connected between the side of the loadlock body and the temperature control assembly, the flexible seal mechanism maintaining an internal environment within the loadlock body while the temperature control assembly is moved.

2. 2. The load lock arrangement of claim 1, wherein the side opening has a first cross-sectional dimension greater than a maximum cross-sectional dimension of the temperature control assembly, whereby the temperature control assembly is inserted and extracted through the side opening.

3. 3. The load lock arrangement of claim 2, further comprising a sealing plate connected to the side, the sealing plate including a sealing opening aligned with the side opening, the sealing opening having a second cross-sectional dimension smaller than the first cross-sectional dimension.

4. The load lock arrangement of claim 3 , wherein the flexible sealing mechanism comprises a bellows.

5. 5. The load lock arrangement of claim 4, wherein the first end of the bellows has a third cross-sectional dimension greater than the first cross-sectional dimension such that the first end of the bellows contacts a sealing surface of the sealing plate and surrounds the sealing opening forming a first gas-tight seal.

6. The load lock arrangement of claim 5 , wherein a second end of the bellows contacts a sealing surface of the temperature control assembly forming a second gas-tight seal.

7. The load lock arrangement of claim 6 , wherein the sealing surface of the temperature control assembly comprises a surface flange section of the temperature control assembly.

8. The load lock arrangement of claim 1 , wherein the temperature control assembly includes a temperature conditioning head.

9. The load lock arrangement of claim 8 , wherein the elevator provides a maximum vertical displacement of between 1 mm and 15 mm for an upper temperature conditioning surface of the temperature conditioning head.

10. 10. The load lock arrangement of claim 9, wherein the elevator is configured to position the upper temperature conditioning surface at a distance of less than 0.5 mm from the lower stage surface when conditioning a temperature of a substrate placed on the upper stage surface.

11. The load lock arrangement of claim 10 , wherein the elevator is configured to position the upper temperature conditioned surface at a distance of more than 10 mm from the lower stage when loading / unloading a substrate from the load lock body.

12. The load lock arrangement of claim 1 , wherein the substrate stage includes a secondary stage for holding additional substrates.

13. The load lock arrangement of claim 1 , wherein the load lock body further comprises an upper load lock chamber and a lower load lock chamber, the temperature control assembly being partially disposed within the upper load lock chamber.

14. 14. The load lock arrangement of claim 13, further comprising an additional temperature control assembly disposed partially within the lower load lock chamber and coupled to a lower elevator to provide vertical displacement for the additional temperature control assembly.

15. 1. A semiconductor processing system comprising:

1. A load lock arrangement comprising: A load lock body; a substrate stage housed within the load lock body; a temperature control assembly including a temperature adjustment head located within the loadlock body at a proximal end and a coupling connected to an elevator for raising and lowering the temperature adjustment head at a distal end, the distal end extending laterally through a side opening located in a side of the loadlock body such that the distal end is located outside the loadlock body; a flexible seal mechanism connected between the side of the loadlock body and the temperature control assembly, the flexible seal mechanism maintaining an internal environment within the loadlock body during movement of the temperature adjustment head; a back-end transport module connected to a rear side of the load lock body, the back-end transport module coupling a process module to the load lock arrangement; an equipment front end module connected to a front face of the load lock body, the equipment front end module housing a front end substrate transport robot; a semiconductor processing system configured to: lower the temperature adjustment head to allow the front-end substrate transport robot to load / unload substrates; and raise the temperature adjustment head to position the temperature adjustment head in close proximity to the substrate stage to provide at least one of heating and cooling to a substrate placed on the substrate stage.

16. 16. The semiconductor processing system of claim 15, wherein said loadlock body further comprises an upper loadlock chamber and a lower loadlock chamber, said temperature control assembly being partially disposed within said upper loadlock chamber.

17. 17. The semiconductor processing system of claim 16, further comprising an additional temperature control assembly disposed partially within the lower load lock chamber and coupled to a lower elevator to provide vertical displacement for the additional temperature control assembly.

18. 1. A method for treating a substrate, comprising: a loadlock body housing a substrate stage, the substrate stage including an upper stage surface and a lower stage surface, the upper stage surface configured to hold a substrate at a holding location within the loadlock body; lowering a vertical position of a temperature control assembly partially disposed within the load lock body to a load / unload position, the unload / load position being distal from the lower stage surface; placing a process substrate on the upper stage surface at the holding location; raising the vertical position of the temperature control assembly to a substrate temperature adjustment position adjacent the lower stage surface to enable at least one of heating and cooling to the substrate positioned at the holding location; A method in which lowering and raising the temperature control assembly is performed by an elevator coupled to a portion of the temperature control assembly that extends outside the load lock body through an opening located in a side of the load lock body.

19. 20. The method of claim 18, wherein the temperature control assembly includes a temperature adjustment head having an upper temperature adjustment surface, the upper temperature adjustment surface being positioned a distance greater than 10 mm from the lower stage surface when in the load / unload position.

20. 20. The method of claim 19, wherein the upper temperature conditioning surface is positioned less than 0.5 mm from the lower stage surface when positioned in the substrate temperature conditioning position.

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