Semiconductor device

Abstract

To provide an electronic device (semiconductor device) having improved reliability.SOLUTION: An electronic device A5 (semiconductor device) includes an electronic component 1 (semiconductor element) having an electrode, a die pad part 21 having a main surface 211 (mounting surface) on which the electronic component 1 is mounted, a joint material for fastening the electronic component 1 to the die pad part 21, a plurality of terminal lead parts 23 (a plurality of terminals), a connection member for electrically connecting any one of the electrode and the plurality of terminal lead parts 23, and a resin member 5. The main surface 211 has a first region 211a in which a plurality of grooves 711 (first grooves) are formed below the electronic component 1, and a second region 211b surrounding the first region 211a, in which a plurality of grooves 721 (second grooves) are formed. The plurality of grooves 711 and the plurality of grooves 721 have a linear shape extending in a y direction (second direction), and the plurality of grooves 711 are arranged in parallel with each other. The plurality of grooves 721 include grooves 721 longer than one side of the electronic component 1 when viewed in a z direction (first direction).SELECTED DRAWING: Figure 21

Description

[Technical field]

[0001] The present disclosure relates to electronic devices and methods for manufacturing electronic devices. [Background technology]

[0002] Patent Document 1 describes a conventional electronic device. The electronic device described in Patent Document 1 includes a lead frame (metal member), a semiconductor element (electronic component), and a molded resin (resin member). The semiconductor element is mounted on the lead frame by, for example, soldering. The molded resin covers a part of the lead frame and the semiconductor element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-310609 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned soldering method includes, for example, the reflow method. In this reflow method, the solder temporarily becomes liquid. At this time, the liquid solder may flow out to unintended places. Such solder flow out can cause short circuits, deterioration of electrical and thermal properties, and bonding abnormalities of semiconductor elements in electronic devices, leading to a decrease in the reliability of the electronic devices.

[0005] The present disclosure has been made in view of the above-mentioned problems, and has an object to provide an electronic device with improved reliability and a method for manufacturing the electronic device. [Means for solving the problem]

[0006] An electronic device provided by a first aspect of the present disclosure comprises an electronic component, a support member having a mounting surface on which the electronic component is mounted, and a bonding material interposed between the electronic component and the support member and fixing the electronic component to the support member, wherein the mounting surface has a first region having a plurality of grooves formed therein and a second region surrounding the first region when viewed in a first direction, and the bonding material is in contact with the first region but not in contact with the second region.

[0007] A manufacturing method for an electronic device provided by a second aspect of the present disclosure includes a first step of preparing a support member having a mounting surface, a second step of forming a first region and a second region on the mounting surface that surrounds the first region when viewed in a first direction, a third step of applying a bonding material to the first region, a fourth step of placing an electronic component on the bonding material, and a fifth step of heating and cooling the bonding material to bond the electronic component to the support member with the bonding material, wherein in the second step, the first region is formed by forming a plurality of grooves in a portion of the mounting surface, and after the fifth step, the bonding material is in contact with the first region but not in contact with the second region. Effect of the Invention

[0008] According to the electronic device of the present disclosure, it is possible to improve the reliability. Also, according to the manufacturing method of the present disclosure, it is possible to manufacture an electronic device with improved reliability. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing an electronic device according to a first embodiment. [Diagram 2] In the plan view of FIG. 1, electronic components and bonding materials are shown by imaginary lines, and connecting members are omitted. [Diagram 3] FIG. 2 is a bottom view showing the electronic device according to the first embodiment. [Figure 4] 1 is a side view (right side view) showing an electronic device according to a first embodiment. [Diagram 5] 2 is a cross-sectional view taken along line VV in FIG. 1. [Figure 6] FIG. 6 is a partially enlarged cross-sectional view of an area VI in FIG. 5 . [Figure 7] FIG. 7 is a partially enlarged cross-sectional view of an area VII in FIG. 5 . [Figure 8] FIG. 11 is a partially enlarged cross-sectional view showing a first region according to a modified example. [Figure 9] FIG. 2 is a plan view showing a process of the method for manufacturing the electronic device according to the first embodiment. [Figure 10] FIG. 2 is a plan view showing a process of the method for manufacturing the electronic device according to the first embodiment. [Figure 11] FIG. 2 is a plan view showing a process of the method for manufacturing the electronic device according to the first embodiment. [Figure 12] FIG. 2 is a plan view showing a process of the method for manufacturing the electronic device according to the first embodiment. [Figure 13] FIG. 2 is a plan view showing a process of the method for manufacturing the electronic device according to the first embodiment. [Figure 14] FIG. 11 is a plan view showing an electronic device according to a second embodiment. [Figure 15] 15 is a cross-sectional view taken along line XV-XV in FIG. 14. [Figure 16] FIG. 13 is a plan view showing an electronic device according to a third embodiment. [Figure 17] FIG. 17 is a cross-sectional view taken along line XVII-XVII in FIG. [Figure 18] FIG. 13 is a plan view showing an electronic device according to a fourth embodiment. [Figure 19] 19 is a cross-sectional view taken along line XIX-XIX in FIG. 18. [Figure 20] FIG. 13 is a plan view showing an electronic device according to a fifth embodiment. [Figure 21] FIG. 21 is an enlarged view of a main part of FIG. 20. [Figure 22] FIG. 13 is a side view (right side view) showing an electronic device according to a fifth embodiment. [Diagram 23] FIG. 23 is a cross-sectional view taken along line XXIII-XXIII in FIG. 20. [Figure 24] FIG. 11 is a plan view showing a first region according to a modified example. [Diagram 25]FIG. 11 is a plan view showing a first region according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the electronic device of the present disclosure will be described below with reference to the drawings. Note that the same reference numerals are used to designate the same or similar components, and redundant description will be omitted.

[0011] 1 to 7 show an electronic device according to embodiment 1. The electronic device A1 of the first embodiment includes an electronic component 1, a lead frame 2, a bonding material 3, a connection member 4 and a resin member 5.

[0012] FIG. 1 is a plan view showing electronic device A1, with resin member 5 shown by imaginary lines (two-dot chain lines). FIG. 2 is the plan view of FIG. 1 with bonding material 3 and connection member 4 omitted, and with electronic component 1 shown by imaginary lines. FIG. 3 is a bottom view showing electronic device A1. FIG. 4 is a side view (right side view) showing electronic device A1. FIG. 5 is a cross-sectional view taken along line VV in FIG. 1. FIG. 6 is a partially enlarged cross-sectional view of region VI in FIG. 5. FIG. 7 is a partially enlarged cross-sectional view of region VII in FIG. 5.

[0013] For ease of explanation, three mutually orthogonal directions are defined as x-direction, y-direction, and z-direction in Figs. 1 to 7. The z-direction is the thickness direction of the electronic device A1. The x-direction is the left-right direction in the plan view of the electronic device A1 (see Fig. 1). The y-direction is the up-down direction in the plan view of the electronic device A1 (see Fig. 1). In the following explanation, one side of the z-direction (upper side in the cross-sectional view shown in Fig. 5) may be referred to as "upper" and the other side of the z-direction (lower side in the cross-sectional view shown in Fig. 5) may be referred to as "lower", but this does not limit the position of the electronic device A1. The z-direction corresponds to the "first direction" described in the claims.

[0014] The electronic device A1 is a surface-mounted package type. As shown in Figures 1 to 7, the electronic device A1 is configured in a package in which lead wires (terminal lead portions 23 described below) do not protrude from a resin member 5 in plan view.

[0015] The electronic component 1 is the functional center of the electronic device A1. The electronic component 1 is, for example, an integrated circuit (IC) such as an LSI (Large Scale Integration). Note that the electronic component 1 is not limited to an IC, and may be a voltage control element such as an LDO (Low Drop Out), an amplifying element such as an operational amplifier, or a discrete component such as a transistor, a diode, an LED, or a terahertz element. The electronic component 1 may also be, for example, a resistor, an inductor, or a capacitor.

[0016] The electronic component 1 has, for example, a rectangular shape in a plan view. The electronic component 1 is bonded to a part (a die pad portion 21 described below) of the lead frame 2 by a bonding material 3. The electronic component 1 has a main surface 11 and a back surface 12 as shown in FIGS. 4 and 5.

[0017] The main surface 11 and the back surface 12 are spaced apart in the z direction. The main surface 11 is the top surface of the electronic component 1, and the back surface 12 is the bottom surface of the electronic component 1. Both the main surface 11 and the back surface 12 are flat.

[0018] The electronic component 1 has a plurality of electrode pads 13. Each electrode pad 13 is a terminal of the electronic component 1. Each electrode pad 13 is exposed from the main surface 11.

[0019] The lead frame 2 is mounted on a circuit board of an electronic device or the like to provide a conductive path between the electronic component 1 and the circuit board. The lead frame 2 supports the electronic component 1. The lead frame 2 includes a conductive material. The conductive material is, for example, a metal containing Cu (copper). Specifically, the lead frame 2 may be a metal plate of Cu or a Cu alloy, or may be an organic substrate on which Cu is formed. The surface layer of the lead frame 2 is a metal containing Cu. The lead frame 2 corresponds to the "support member" described in the claims. As shown in FIG. 1, the lead frame 2 includes a die pad portion 21, a plurality of hanging lead portions 22, and a plurality of terminal lead portions 23. As shown in FIG. 1, the lead frame 2 in the electronic device A1 includes one die pad portion 21, two hanging lead portions 22, and eight terminal lead portions 23.

[0020] 1 and 5, the electronic component 1 is fixed to the die pad portion 21 via a bonding material 3, and the electronic component 1 is mounted on the die pad portion 21. The die pad portion 21 has, for example, a rectangular shape in a plan view. The die pad portion 21 has a main surface 211 and a back surface 212 as shown in FIG.

[0021] The main surface 211 and the back surface 212 are spaced apart in the z direction. The main surface 211 is an upper surface of the die pad portion 21. The back surface 212 is a lower surface of the die pad portion 21. As shown in FIGS. 3 to 5, the back surface 212 is exposed from the resin member 5. The back surface 212 may be covered by the resin member 5. However, exposing the back surface 212 from the resin member 5 enhances the effect of dissipating heat from the electronic component 1. As shown in FIG. 2, the main surface 211 has a first region 211a and a second region 211b. Details of the first region 211a and the second region 211b will be described later. The main surface 211 corresponds to a "mounting surface" recited in the claims.

[0022] 1 and 5, each of the suspension leads 22 is connected to the die pad portion 21. In a plan view, each of the suspension leads 22 extends in the y direction from each edge of the die pad portion 21 in the y direction. A portion of each suspension lead 22 is bent in the z direction. In the example shown in FIG. 5, the edge of each suspension lead 22 on the side connected to the die pad portion 21 in the y direction is located lower in the z direction than the edge on the opposite side, but it may be located higher in the z direction instead.

[0023] A portion of each of the multiple terminal lead portions 23 is exposed from the resin member 5 and serves as an external terminal of the electronic device A1. As shown in Fig. 1, each terminal lead portion 23 is spaced from the die pad portion 21 and the suspension lead portion 22. As shown in Figs. 1 to 4, each terminal lead portion 23 includes a pad portion 231 and a terminal portion 232.

[0024] One end of the connection member 4 is joined to the pad portion 231. A portion of the terminal portion 232 is exposed from the resin member 5. In each terminal lead portion 23, the pad portion 231 and the terminal portion 232 are connected to each other and formed integrally.

[0025] As shown in Figs. 4 and 5, the bonding material 3 is interposed between the electronic component 1 and the die pad portion 21 (lead frame 2) to bond them together. The constituent material of the bonding material 3 contains a solid of a first composition. The first composition is, for example, solder. The solder may be a lead-free solder or a lead-containing solder. The bonding material 3 may be a conductive bonding material different from solder. The bonding material 3 may be an insulating bonding material instead of a conductive bonding material. The first composition is a material that undergoes a phase transition to a liquid state when heated.

[0026] As shown in FIG. 5, the bonding material 3 has a first surface 31, a second surface 32, and a third surface 33. The first surface 31 faces upward in the z direction and contacts the electronic component 1. The second surface 32 faces downward in the z direction and contacts the die pad portion 21 of the lead frame 2. In this embodiment, the second surface 32 overlaps with the first region 211a in a plan view so as to substantially coincide with the first region 211a. The third surface 33 is connected to the first surface 31 and the second surface 32. The third surface 33 is a curved surface. In this embodiment, a part of the third surface 33 (the outer periphery in a plan view) overlaps with the second region 211b in a plan view as shown in FIG. 2. The third surface 33 does not have to overlap with the second region 211b in a plan view.

[0027] Each of the multiple connection members 4 electrically connects the electronic component 1 and the lead frame 2 (each terminal lead portion 23). Each connection member 4 is, for example, a bonding wire. Note that each connection member 4 is not limited to a bonding wire, and may be a bonding ribbon or a plate-shaped clip member. The constituent material of each connection member 4 may be any of Cu, Au (gold), and Al (aluminum).

[0028] One end of each connection member 4 is bonded to the electrode pad 13 of the electronic component 1, and the other end is bonded to the pad portion 231 of each terminal lead portion 23. In this embodiment, each connection member 4 is a bonding wire, and is bonded to the electrode pad 13 by ball bonding, and is bonded to the pad portion 231 by wedge bonding. Note that, conversely, the connection member 4 may be ball bonded to the pad portion 231, and wedge bonded to the electrode pad 13.

[0029] The resin member 5 is a sealing material in the electronic device A1. As shown in Figs. 4 and 5, the resin member 5 covers the electronic component 1, a part of the lead frame 2, the bonding material 3, and a plurality of connection members 4. The constituent material of the resin member 5 contains a solid of a second composition. The second composition is, for example, an epoxy resin. The resin member 5 is, for example, rectangular in plan view. As shown in Figs. 1 to 5, the resin member 5 has a resin main surface 51, a resin back surface 52, and a plurality of resin side surfaces 53.

[0030] The resin main surface 51 and the resin back surface 52 are spaced apart in the z direction. The resin main surface 51 is the upper surface of the resin member 5. The resin back surface 52 is the lower surface of the resin member 5. As shown in FIG. 3, a part of the lead frame 2 (the back surface 212 of the die pad portion 21 and a part of each terminal portion 232) is exposed from the resin back surface 52. The multiple resin side surfaces 53 are connected to both the resin main surface 51 and the resin back surface 52 and are sandwiched between them in the z direction. The resin member 5 has a pair of resin side surfaces 531 spaced apart in the x direction and a pair of resin side surfaces 532 spaced apart in the y direction. In this embodiment, a part of the terminal portion 232 of each terminal lead portion 23 is exposed on the resin back surface 52 and is exposed on either of the pair of resin side surfaces 531.

[0031] Next, the first region 211a and the second region 211b of the main surface 211 of the die pad portion 21 will be described.

[0032] The first region 211a contacts the bonding material 3 as shown in Fig. 5. The first region 211a has, for example, a rectangular shape in a plan view. In the plan view, the electronic component 1 overlaps the first region 211a. The first region 211a has a plurality of grooves 711, a plurality of raised portions 712, and a plurality of interposed portions 713 as shown in Fig. 6.

[0033] Each of the grooves 711 is recessed downward in the z direction from each of the intervening portions 713. The grooves 711 can be formed, for example, by laser processing in which a laser beam is irradiated. Note that the method of forming the grooves 711 is not limited to laser processing, and may be, for example, etching. The grooves 711 are arranged in the following pattern. Each groove 711 extends linearly along a direction perpendicular to the z direction. In this embodiment, each groove 711 extends along the x direction as shown in FIG. 2, but may extend along the y direction. The grooves 711 are arranged parallel to each other. The width W1 (see FIG. 6) of each groove 711 is, for example, about 20 to 40 μm. The depth d1 (see FIG. 6) of each groove 711 is, for example, about 5 to 20 μm. The interval P1 (see FIG. 6) between two adjacent grooves 711 is, for example, about 30 to 200 μm. The interval P1 is the distance between the centers of two adjacent grooves 711 in the width direction.

[0034] 6, each of the multiple raised portions 712 is connected to each edge in the y direction of one groove 711. One of the two edges in the y direction of each raised portion 712 is connected to the groove 711, and the other is connected to the intermediate portion 713. Each raised portion 712 protrudes upward in the z direction beyond each intermediate portion 713.

[0035] As shown in FIG. 6, each of the intervening portions 713 is disposed between two adjacent grooves 711. Each intervening portion 713 is sandwiched between two adjacent grooves 711 in the y direction via a raised portion 712. Each intervening portion 713 is formed because laser light is not irradiated when each groove 711 is formed. Note that, as shown in FIG. 8, depending on the width W1 and interval P1 of the multiple grooves 711 formed by laser processing, the intervening portion 713 may not be formed. For example, when the interval P1 is smaller than the width W1 of each groove 711, the intervening portion 713 is not formed. In this case, each raised portion 712 is sandwiched between two adjacent grooves 711 as shown in FIG. 8, and each edge in the y direction is connected to the groove 711.

[0036] The first region 211a is undulating due to the multiple grooves 711, the multiple raised portions 712, and the multiple intervening portions 713. Therefore, the first region 211a has a rough surface. Furthermore, the surfaces of the multiple grooves 711 and the multiple raised portions 712 have minute irregularities due to laser processing. Therefore, each of these surfaces is a rough surface due to this minute irregularity. The roughness of each of these surfaces is finer than the roughness of the first region 211a.

[0037] The first region 211a exhibits lyophilicity with respect to the liquid of the first composition (for example, solder). In this embodiment, the first region 211a is lyophilic with respect to the liquid of the first composition due to the multiple grooves 711 formed in the first region 211a. Furthermore, the first region 211a in which the multiple grooves 711 are formed has a higher lyophilicity with respect to the liquid of the first composition than the first region 211a in which the multiple grooves 711 are not formed.

[0038] As shown in FIG. 5, the second region 211b is not in contact with the bonding material 3 but is in contact with the resin member 5. The second region 211b has, for example, a rectangular ring shape in a plan view. The second region 211b surrounds the first region 211a in a plan view. The inner edge of the second region 211b is in contact with the outer edge of the first region 211a in a plan view. The second region 211b has a plurality of grooves 721, a plurality of raised portions 722, and a plurality of intervening portions 723 as shown in FIG.

[0039] As shown in FIG. 7, each of the grooves 721 is recessed downward in the z direction from each of the intervening portions 723. The grooves 721 can be formed by, for example, laser processing. The method of forming the grooves 721 is not limited to laser processing, and may be, for example, etching. The grooves 721 are arranged in the following pattern. Each groove 721 extends linearly along a direction perpendicular to the z direction. In this embodiment, each groove 721 extends along the x direction as shown in FIG. 2, but may extend along the y direction. The grooves 721 are arranged parallel to each other. The width W2 (see FIG. 7) of each groove 721 is, for example, about 5 to 10 μm. The depth d2 (see FIG. 7) of each groove 721 is, for example, about 5 to 10 μm. The interval P2 (see FIG. 7) between two adjacent grooves 721 is, for example, about 10 to 20 μm. The interval P2 is the distance between the centers of two adjacent grooves 721 in the width direction.

[0040] 7, each of the multiple raised portions 722 is connected to each edge in the y direction of one groove 721. One of the two edges in the y direction of each raised portion 722 is connected to the groove 721, and the other is connected to the intermediate portion 723. Each raised portion 722 protrudes upward in the z direction beyond each intermediate portion 723.

[0041] As shown in FIG. 7, each of the intervening portions 723 is disposed between two adjacent grooves 721. Each intervening portion 723 is sandwiched between two adjacent grooves 721 in the y direction via a raised portion 722. Each intervening portion 723 is formed because laser light is not irradiated when each groove 721 is formed. Note that, like the intervening portion 713, the intervening portion 723 may not be formed depending on the width W2 and interval P2 of the multiple grooves 721 formed by laser processing (see FIG. 8). For example, when the interval P2 is smaller than the width W2 of each groove 721, the intervening portion 723 is not formed. In this case, each raised portion 722 is sandwiched between two adjacent grooves 721, and each edge in the y direction is connected to the groove 721.

[0042] The second region 211b is undulating due to the plurality of grooves 721, the plurality of raised portions 722, and the plurality of intervening portions 723. Therefore, the second region 211b has a rough surface. Furthermore, the surfaces of the plurality of grooves 721 and the plurality of raised portions 722 have minute irregularities due to laser processing. Therefore, each of these surfaces is a rough surface due to this minute irregularity. The rough surface roughness of each of these surfaces is finer than the rough surface roughness of the second region 211b.

[0043] The second region 211b exhibits lyophilicity with respect to the liquid of the second composition (for example, epoxy resin). In this embodiment, the second region 211b is lyophilic with respect to the liquid of the second composition by the plurality of grooves 721 formed in the second region 211b.

[0044] In the main surface 211 of the die pad portion 21, the first region 211a has higher lyophilicity to the liquid of the first composition than the second region 211b. In this embodiment, since the first composition is solder, the first region 211a has higher solder wettability than the second region 211b. For example, by adjusting the width W1, interval P1, and depth d1 of the groove 711 formed in the first region 211a and the width W2, interval P2, and depth d2 of the groove 721 formed in the second region 211b, a difference is generated between the lyophilicity to the liquid of the first composition and the lyophilicity to the liquid of the second composition. In the electronic device A1, for example, the width W1 of the groove 711 is larger than the width W2 of the groove 721, and the interval P1 of the groove 711 is larger than the interval P2 of the groove 721. This makes the first region 211a more lyophilic to the liquid of the first composition than the second region 211b.

[0045] Next, a method for manufacturing the electronic device A1 will be described with reference to Figures 9 to 13. Figures 9 to 13 are plan views showing a step in the method for manufacturing the electronic device A1.

[0046] First, as shown in Fig. 9, a lead frame 2 is prepared. This step corresponds to the "first step" described in the claims. The prepared lead frame 2 can be formed, for example, by subjecting a copper plate to punching or bending. As shown in Fig. 9, the lead frame 2 at this point includes a die pad portion 21, a plurality of hanging lead portions 22, a plurality of terminal lead portions 23, and a plurality of tie bars 25, and the die pad portion 21, the plurality of hanging lead portions 22, and the plurality of terminal lead portions 23 are connected by the plurality of tie bars 25.

[0047] Next, as shown in FIG. 10, a first region 211a and a second region 211b are formed in the die pad portion 21 of the lead frame 2. This step corresponds to the "second step" described in the claims. The first region 211a is a portion where the bonding material 3 is formed and the electronic component 1 is mounted. The second region 211b is a region where the bonding material 3 is not formed. Specifically, the main surface 211 of the die pad portion 21 of the lead frame 2 is irradiated with a laser beam to excavate the main surface 211, thereby forming a plurality of grooves 711 and a plurality of grooves 721. A known laser irradiation device is used for the irradiation of the laser beam. The plurality of grooves 711 are formed, for example, in a rectangular region in a plan view. The region where the plurality of grooves 711 are formed is the first region 211a. The plurality of grooves 721 are formed in a rectangular ring-shaped region in a plan view surrounding the region where the plurality of grooves 711 are formed (the first region 211a). The region where the plurality of grooves 721 are formed is the second region 211b. The arrangement patterns of the plurality of grooves 711 and the plurality of grooves 721 are as described above. Either the first region 211a or the second region 211b may be formed first, or they may be formed simultaneously. Note that the grooves 711 and 721 are omitted in the subsequent drawings (FIGS. 11 to 13).

[0048] Next, as shown in FIG. 11, a paste-like bonding material 3 is applied to the region (first region 211a) where the multiple grooves 711 are formed, and the electronic component 1 is placed on the paste-like bonding material 3. The process of applying the paste-like bonding material 3 corresponds to the "third step" described in the claims, and the process of placing the electronic component 1 on the paste-like bonding material 3 corresponds to the "fourth step" described in the claims. The constituent material of the bonding material 3 is a first composition. This first composition is, for example, solder. Therefore, a solder paste is applied to the first region 211a.

[0049] Next, a reflow process is performed. This process corresponds to the "fifth process" described in the claims. In the reflow process, the paste-like bonding material 3 becomes liquid due to heating during the reflow process, and the fluidity becomes high. The liquid bonding material 3 spreads in the first region 211a. This is because the first region 211a exhibits lyophilicity with respect to the liquid bonding material 3 due to the multiple grooves 711. At this time, the liquid bonding material 3 spreads evenly in the first region 211a due to the lyophilicity of the bonding material 3 in the first region 211a with respect to the liquid. In addition, the liquid bonding material 3 remains in the first region 211a and does not flow out to the second region 211b. This is because the second region 211b has a lower lyophilicity with respect to the liquid bonding material 3 than the first region 211a, and a force that keeps the liquid bonding material 3 in the first region 211a works, suppressing the flow out to the second region 211b. Thereafter, the liquid bonding material 3 solidifies due to cooling during the reflow process, becoming a solid bonding material 3. As a result, the electronic component 1 is bonded to the lead frame 2 (die pad portion 21) by the solid bonding material 3.

[0050] 12, each electrode pad 13 on the main surface 11 of the electronic component 1 and the pad portion 231 of each terminal lead portion 23 of the lead frame 2 are electrically connected by a connection member 4. The connection member 4 is, for example, a bonding wire, and is formed by using, for example, a wire bonding device equipped with a capillary.

[0051] 13, the resin member 5 is formed. The resin member 5 is formed, for example, by transfer molding. The constituent material of the resin member 5 contains a solid of a second composition. This second composition is, for example, an epoxy resin.

[0052] Next, the lead frame 2 and the resin member 5 are cut to separate the electronic components 1. For example, the electronic components 1 are separated by blade dicing.

[0053] Through the above steps, the electronic device A1 shown in Figures 1 to 7 is formed. Note that the above-described manufacturing method is just one example.

[0054] The electronic device A1 configured as above has the following advantages.

[0055] According to the electronic device A1, the electronic component 1 is fixed to the lead frame 2 (die pad portion 21) by the bonding material 3 (solid). The lead frame 2 (die pad portion 21) has a main surface 211 on which the electronic component 1 is mounted. The main surface 211 has a first region 211a in which a plurality of grooves 711 are formed, and a second region 211b surrounding the first region 211a in a plan view. The bonding material 3 is in contact with the first region 211a, but is not in contact with the second region 211b. According to this configuration, the bonding material 3 is not formed in the second region 211b surrounding the first region 211a, so that it is possible to prevent the thickness of the bonding material 3 from becoming thin or uneven in the first region 211a. For example, if the thickness of the bonding material 3 is uneven, the electronic component 1 is fixed in an inclined state, which causes poor bonding of the electronic component 1 and poor bonding of the connection member 4. On the other hand, the electronic device A1 can prevent the above-mentioned bonding defects because it is possible to prevent the thickness of the bonding material 3 from becoming uneven, and therefore the reliability of the electronic device A1 can be improved.

[0056] According to the electronic device A1, the bonding material 3 is a solid of the first composition (for example, solder), and the first region 211a has a higher lyophilicity to the liquid of the first composition than the second region 211b. With this configuration, when the bonding material 3 becomes liquid during the manufacturing process (reflow process) of the electronic device A1, the liquid bonding material 3 tends to remain in the first region 211a, which has a relatively high lyophilicity to the liquid of the first composition, and is prevented from spreading to the second region 211b, which has a relatively low lyophilicity to the liquid of the first composition. Therefore, in the electronic device A1, the lyophilicity of the first region 211a to the liquid of the first composition is higher than the lyophilicity of the second region 211b to the liquid of the first composition, and thus the liquid bonding material 3 can be prevented from flowing out to the second region 211b.

[0057] According to the electronic device A1, the first region 211a has a plurality of grooves 711 formed therein. With this configuration, the plurality of grooves 711 in the first region 211a are filled with the bonding material 3, and therefore the adhesive strength of the bonding material 3 to the die pad portion 21 (first region 211a) is increased by the anchor effect. Furthermore, the plurality of grooves 711 are formed by laser processing, and therefore the surfaces of the plurality of grooves 711 have fine irregularities. Therefore, the adhesive strength of the bonding material 3 to the die pad portion 21 (first region 211a) can be further improved by the anchor effect.

[0058] According to the electronic device A1, the resin member 5 is a solid of the second composition (for example, epoxy resin). The second region 211b has a plurality of grooves 721 formed therein, and the plurality of grooves 721 make the second region 211b lyophilic to the liquid of the second composition. According to this configuration, the plurality of grooves 721 in the second region 211b are filled with the resin member 5, and the adhesive strength of the resin member 5 to the die pad portion 21 (second region 211b) is increased by the anchor effect. Furthermore, the plurality of grooves 721 are formed by laser processing, and thus the surfaces of the plurality of grooves 721 have fine irregularities. Therefore, the adhesive strength of the resin member 5 to the die pad portion 21 (second region 211b) can be further improved by the anchor effect.

[0059] 14 and 15 show an electronic device according to the second embodiment. The electronic device A2 of the second embodiment differs from the electronic device A1 in that it further includes a third region 211c on the main surface 211 of the die pad portion 21. FIG. 14 is a plan view showing the electronic device A2. In FIG. 14, the electronic component 1, the bonding material 3, and the resin member 5 are shown by imaginary lines, and the connection member 4 is omitted. FIG. 15 is a cross-sectional view taken along the line XV-XV in FIG. 14.

[0060] The third region 211c is interposed between the first region 211a and the second region 211b in plan view. The third region 211c is, for example, rectangular and annular in plan view. In plan view, the inner edge of the third region 211c contacts the outer edge of the first region 211a, and the outer edge of the third region 211c contacts the inner edge of the second region 211b. The third region 211c is flat without a groove. The third region 211c is, for example, Ag-plated (silver-plated). As shown in FIG. 15, the third region 211c contacts the bonding material 3. In this embodiment, the second surface 32 of the bonding material 3 contacts both the first region 211a and the third region 211c, and the second surface 32 of the bonding material 3 overlaps the first region 211a and the third region 211c in plan view. 15, the third region 211c may have a structure in which a plurality of grooves 711 continuing from the first region 211a are formed and then Ag plating is applied. The third region 211c is formed in the process of forming the first region 211a and the second region 211b in the die pad portion 21 of the lead frame 2.

[0061] The third region 211c exhibits lyophilicity to the liquid of the first composition due to the formed Ag plating. The third region 211c has higher lyophilicity to the liquid of the first composition than the first region 211a. As described above, the first region 211a has higher lyophilicity to the liquid of the first composition than the second region 211b, so the third region 211c has higher lyophilicity to the liquid of the first composition than the second region 211b.

[0062] The manufacturing method of the electronic device A2 is different from the manufacturing method of the electronic device A1 in that the third region 211c is formed, but otherwise is substantially the same as the manufacturing method of the electronic device A1.

[0063] According to the electronic device A2, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. According to this configuration, like the electronic device A1, the electronic device A2 does not have the bonding material 3 formed in the second region 211b surrounding the first region 211a, and therefore it is possible to prevent the thickness of the bonding material 3 from becoming thin or non-uniform in the first region 211a. Therefore, like the electronic device A1, the electronic device A2 can improve its reliability.

[0064] According to the electronic device A2, the third region 211c is formed on the main surface 211 of the die pad portion 21 between the first region 211a and the second region 211b in a plan view. The third region 211c has a higher lyophilicity to the liquid of the first composition than the second region 211b. According to this configuration, when the bonding material 3 becomes liquid in the manufacturing process (reflow process) of the electronic device A2, the liquid bonding material 3 tends to stay in the third region 211c, which has a relatively high lyophilicity to the liquid of the first composition, and is prevented from spreading to the second region 211b, which has a relatively low lyophilicity to the liquid of the first composition. Therefore, in the electronic device A2, the lyophilicity of the third region 211c to the liquid of the first composition is higher than the lyophilicity of the second region 211b to the liquid of the first composition, so that the liquid bonding material 3 can be prevented from flowing out to the second region 211b.

[0065] According to the electronic device A2, the third region 211c has a higher lyophilicity to the liquid of the first composition than the first region 211a. According to this configuration, the difference in lyophilicity to the liquid of the first composition at the boundary between the third region 211c and the second region 211b is larger than the difference in lyophilicity to the liquid of the first composition at the boundary between the first region 211a and the second region 211b. Therefore, the electronic device A2 can more effectively prevent the liquid bonding material 3 from flowing out to the second region 211b than the electronic device A1. In other words, the electronic device A2 can further improve the reliability than the electronic device A1.

[0066] According to the electronic device A2, by virtue of other configurations common to the electronic device A1, it is possible to achieve the same effects as the electronic device A1.

[0067] In the second embodiment, the third region 211c is plated with Ag to make the third region 211c lyophilic to the liquid of the first composition (bonding material 3), and the lyophilicity of the third region 211c is higher than that of the first region 211a, but the present invention is not limited to this. If the lyophilicity of the third region 211c to the liquid of the first composition is higher than that of the first region 211a to the liquid of the first composition, other coating agents may be used instead of the Ag plating.

[0068] 16 and 17 show an electronic device according to a third embodiment. The electronic device A3 of the third embodiment differs from the electronic device A2 in that the third region 211c is recessed relative to the first region 211a and the second region 211b. FIG. 16 is a plan view showing the electronic device A3. In FIG. 16, the electronic component 1, the bonding material 3, and the resin member 5 are shown by imaginary lines, and the connection member 4 is omitted. FIG. 17 is a cross-sectional view taken along the line XVII-XVII in FIG. 16.

[0069] In the electronic device A3, the third region 211c is recessed from the first region 211a and the second region 211b as described above. The third region 211c has a groove 731 surrounding the first region 211a. The third region 211c of this embodiment does not contact the bonding material 3 as shown in FIG. 17. In this embodiment, the second surface 32 of the bonding material 3 contacts the first region 211a and does not contact the third region 211c. In addition, a part of the third surface 33 of the bonding material 3 (the outer periphery in a plan view) does not overlap the second region 211b but overlaps the third region 211c in a plan view. The groove 731 is, for example, a rectangular ring in a plan view, and the inner edge is connected to the outer edge of the first region 211a and the outer edge is connected to the inner edge of the second region 211b. The width of the groove 731 is, for example, about 50 to 200 μm, and the depth of the groove 731 is, for example, about 30 to 100 μm. The groove 731 can be formed by, for example, laser processing or etching.

[0070] The manufacturing method of the electronic device A3 is different from the manufacturing method of the electronic device A2 in the method of forming the third region 211c, but otherwise is substantially the same as the manufacturing method of the electronic device A2.

[0071] According to the electronic device A3, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. With this configuration, like the electronic device A1, the electronic device A3 does not have the bonding material 3 formed in the second region 211b surrounding the first region 211a, so that it is possible to prevent the thickness of the bonding material 3 from becoming thin or non-uniform in the first region 211a. Therefore, like the electronic device A1, the electronic device A3 can improve its reliability.

[0072] According to the electronic device A3, the third region 211c is formed on the main surface 211 of the die pad portion 21, and is interposed between the first region 211a and the second region 211b in a plan view. The third region 211c is recessed downward in the z direction by the groove 731, which is lower than the first region 211a and the second region 211b. According to this configuration, in the manufacturing process (reflow process) of the electronic device A3, the liquid bonding material 3 remains in the first region 211a due to the action of surface tension at the boundary between the first region 211a and the third region 211c, and is suppressed from flowing out to the third region 211c. Therefore, the bonding material 3 is not in contact with the third region 211c. Therefore, the electronic device A3 can suppress the liquid bonding material 3 from flowing out to the second region 211b. That is, the electronic device A3 can improve reliability.

[0073] According to the electronic device A3, due to the configuration shared with the electronic device A1 (A2), it is possible to achieve the same effects as the electronic device A1 (A2).

[0074] 18 and 19 show an electronic device according to the fourth embodiment. The electronic device A4 of the fourth embodiment differs from the electronic device A2 in that the third region 211c is liquid repellent to the liquid of the first composition. FIG. 18 is a plan view showing the electronic device A4. In FIG. 18, the electronic component 1, the bonding material 3, and the resin member 5 are shown by imaginary lines, and the connection member 4 is omitted. FIG. 19 is a cross-sectional view taken along the line XIX-XIX in FIG. 18.

[0075] In the electronic device A4, the third region 211c is not in contact with the bonding material 3 as shown in FIG. 19. In this embodiment, the second surface 32 of the bonding material 3 is in contact with the first region 211a, but not with the third region 211c. In addition, a part (the outer periphery in plan view) of the third surface 33 of the bonding material 3 does not overlap the second region 211b, but overlaps with the third region 211c, in a plan view. As described above, the third region 211c exhibits liquid repellency with respect to the liquid of the first composition. That is, since the first composition is solder, the third region 211c has low solder wettability. A groove 731 is formed in the third region 211c, and a plurality of protrusions are formed in the groove 731, protruding upward in the z direction from the bottom surface thereof. Therefore, the third region 211c has a rough surface with a plurality of protrusions. The surface structure (shape) of the third region 211c is similar to that of a lotus leaf or taro leaf, for example. The third region 211c exhibits liquid repellency against the liquid of the first composition due to its surface structure. The grooves 731 can be formed by, for example, laser processing or etching.

[0076] The manufacturing method of the electronic device A4 is different from the manufacturing method of the electronic device A2 in the method of forming the third region 211c, but otherwise is substantially the same as the manufacturing method of the electronic device A2.

[0077] According to the electronic device A4, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. According to this configuration, like the electronic device A1, the electronic device A4 does not have the bonding material 3 formed in the second region 211b surrounding the first region 211a, so that it is possible to prevent the thickness of the bonding material 3 from becoming thin or non-uniform in the first region 211a. Therefore, like the electronic device A1, the electronic device A4 can improve the reliability.

[0078] According to the electronic device A4, the third region 211c is formed on the main surface 211 of the die pad portion 21 in a plan view, and is interposed between the first region 211a and the second region 211b. The third region 211c exhibits liquid repellency against the liquid of the first composition. According to this configuration, in the manufacturing process (reflow process) of the electronic device A4, the liquid bonding material 3 remains in the first region 211a due to the action of surface tension at the boundary between the first region 211a and the third region 211c, and is suppressed from flowing out to the third region 211c. Therefore, the third region 211c is not in contact with the bonding material 3. Therefore, the electronic device A4 can suppress the liquid bonding material 3 from flowing out to the second region 211b. That is, the electronic device A4 can improve reliability.

[0079] According to the electronic device A4, by virtue of the configuration common to the electronic device A1 (A2, A3), it is possible to achieve the same effects as the electronic device A1 (A2, A3).

[0080] 20 to 23 show an electronic device according to a fifth embodiment. The electronic device A5 of the fifth embodiment is different from the electronic device A1 mainly in the configuration of the lead frame 2.

[0081] FIG. 20 is a plan view showing electronic device A5. In FIG. 20, resin member 5 is shown by imaginary lines. FIG. 21 is an enlarged view of a main part of FIG. 20. In FIG. 20, electronic component 1 and resin member 5 are shown by imaginary lines, and bonding material 3 and connection member 4 are omitted. FIG. 22 is a side view (right side view) showing electronic device A5. In FIG. 22, resin member 5 is shown by imaginary lines. FIG. 23 is a cross-sectional view taken along line XXIII-XXIII in FIG. 20.

[0082] The electronic device A5 is constructed in a so-called TO (Transistor Outline) package.

[0083] 23, the electrode pad 13 of the electronic component 1 includes a principal surface electrode 131 and a back surface electrode 132. The principal surface electrode 131 is exposed on the principal surface 11, and the back surface electrode 132 is exposed on the back surface 12. The back surface electrode 132 is electrically connected to the die pad portion 21 (lead frame 2) via the bonding material 3. Therefore, the bonding material 3 in this embodiment is conductive.

[0084] In the lead frame 2, one of the multiple terminal lead portions 23 is connected to the die pad portion 21. In the electronic device A5, as shown in FIG. 20, the terminal lead portion 23 arranged in the center in the x direction is connected to the die pad portion 21. The terminal lead portion 23 connected to the die pad portion 21 does not include a pad portion 231, but includes a terminal portion 232. Each terminal lead portion 23 protrudes from the resin member 5.

[0085] In the lead frame 2, the main surface 211 of the die pad portion 21 has a first region 211a and a second region 211b, similar to the electronic device A1. The configurations of the first region 211a and the second region 211b are similar to those of the electronic device A1. In the electronic device A5, as shown in FIG. 21, the multiple grooves 711 formed in the first region 211a are linearly extending in the y direction and are arranged parallel to each other. In addition, the multiple grooves 721 formed in the second region 211b are linearly extending in the y direction and are arranged parallel to each other. In addition, the multiple grooves 711 and the multiple grooves 721 may be linearly extending in the x direction, similar to the electronic device A1.

[0086] The manufacturing method of the electronic device A5 is different from the manufacturing method of the electronic device A1 in that the lead frame 2 is prepared, but otherwise is substantially the same as the manufacturing method of the electronic device A1.

[0087] According to the electronic device A5, the main surface 211 of the die pad portion 21 (lead frame 2) has a first region 211a in which a plurality of grooves 711 are formed, and the bonding material 3 is in contact with the first region 211a. According to this configuration, like the electronic device A1, the electronic device A5 does not have the bonding material 3 formed in the second region 211b surrounding the first region 211a, so that it is possible to prevent the thickness of the bonding material 3 from becoming thin or non-uniform in the first region 211a. Therefore, like the electronic device A1, the electronic device A5 can improve the reliability.

[0088] According to the electronic device A5, by virtue of other configurations common to the electronic device A1, it is possible to achieve the same effects as the electronic device A1.

[0089] In the fifth embodiment, the first region 211a and the second region 211b are formed on the main surface 211 of the die pad portion 21 of the lead frame 2, but the present invention is not limited to this. For example, the third region 211c according to any one of the second to fourth embodiments may be further formed on the main surface 211. In this case, the same effect as any one of the second to fourth embodiments can be achieved.

[0090] In the first to fifth embodiments, the grooves 711 formed in the first region 211a are linear in plan view and arranged parallel to each other, but the present invention is not limited thereto. For example, the grooves 711 may be linear in plan view and arranged in a mesh pattern. FIG. 24 shows the first region 211a in the case where the grooves 711 linear in plan view are arranged in a mesh pattern. In this case, the widths W11 and W12 (see FIG. 24) and intervals P11 and P12 (see FIG. 24) of the grooves 711 are adjusted to change the lyophilicity of the first composition liquid and the lyophilicity of the second composition liquid. In this modification, the first region 211a is lyophilic to the first composition liquid. The same is true for the grooves 721 formed in the second region 211b. That is, the grooves 721 may be linear in plan view and arranged in a mesh pattern.

[0091] In the first to fifth embodiments, the grooves 711 formed in the first region 211a are linear in plan view, but the present invention is not limited thereto. For example, the grooves 711 may be circular (dot-like) in plan view and arranged in a matrix. FIG. 25 shows the first region 211a in the case where the grooves 711 are circular in plan view and arranged in a matrix. In this case, the width W1 (diameter) (see FIG. 25) and the arrangement intervals Px, Py (see FIG. 25) of each groove 711 may be adjusted to change the lyophilicity of the first composition liquid and the lyophilicity of the second composition liquid. In this modification, the first region 211a is also lyophilic to the first composition liquid. The same is true for the grooves 721 formed in the second region 211b. That is, the grooves 721 may be circular in plan view and arranged in a matrix.

[0092] In the first to fifth embodiments, the grooves 711 formed in the first region 211a are linear in plan view, but the present invention is not limited to this. For example, each of the grooves 711 may be a wavy or crank-shaped curve in plan view. For example, when forming the grooves 711, the laser light is moved in a wavy or crank-shaped manner rather than in a straight line, so that the grooves 711 are wavy or crank-shaped in plan view. Note that the crank-shaped shape is not limited to a shape in which the bending angle of the bent portion is a right angle, and includes a shape in which the angle is an acute angle or an obtuse angle. In this modified example, the first region 211a is lyophilic to the liquid of the first composition. Note that the same is true for the grooves 721 formed in the second region 211b. That is, the grooves 721 may be a wavy or crank-shaped curve in plan view.

[0093] In the first to fifth embodiments, the arrangement patterns of the plurality of grooves 711 formed in the first region 211a, the plurality of grooves 721 formed in the second region 211b, and the grooves 731 formed in the third region 211c are not limited to those described above. The first region 211a, the second region 211b, and the third region 211c may each be configured to exhibit the above-mentioned lyophilicity or lyophobicity. For example, the grooves 711, 721, and 731 may each be arranged in a lyophilic or lyophobic pattern based on well-known biomimetics.

[0094] Although the first to fifth embodiments have been described with respect to the case where one electronic component 1 is provided, a plurality of electronic components 1 may be provided. In this case, a first region 211a may be formed below each electronic component 1, and each electronic component 1 may be bonded onto the first region 211a via the bonding material 3.

[0095] In the first to fifth embodiments, the case where the plurality of grooves 721 are formed in the second region 211b has been described, but the present invention is not limited to this. For example, the second region 211b may be flat.

[0096] The electronic device and the manufacturing method of the electronic device according to the present disclosure are not limited to the above-mentioned embodiment. The specific configuration of each part of the electronic device according to the present disclosure and the specific processing of each step of the manufacturing method of the electronic device according to the present disclosure can be freely designed in various ways.

[0097] The electronic device and the method for manufacturing the electronic device of the present disclosure include embodiments relating to the following appendix. [Appendix 1] Electronic components, a support member having a mounting surface on which the electronic component is mounted; a bonding material interposed between the electronic component and the support member to fix the electronic component to the support member, the mounting surface has a first region in which a plurality of grooves are formed, and a second region surrounding the first region when viewed in a first direction; The bonding material is in contact with the first region and is not in contact with the second region. [Appendix 2] The bonding material includes a solid of a first composition, The electronic device of claim 1, wherein the first region is lyophilic to the liquid of the first composition and has a higher lyophilicity to the liquid of the first composition than the second region. [Appendix 3] 3. The electronic device of claim 2, wherein the first composition is a solder. [Appendix 4] 4. The electronic device of claim 2, wherein the mounting surface further has a third region interposed between the first region and the second region when viewed in the first direction. [Appendix 5] The electronic device of claim 4, wherein the third region is in contact with the bonding material. [Appendix 6] 6. The electronic device of claim 5, wherein the third region has a higher lyophilicity to the liquid of the first composition than the first region. [Appendix 7] 7. The electronic device according to claim 5, wherein the third region is Ag-plated. [Appendix 8] 5. The electronic device of claim 4, wherein the third region is not in contact with the bonding material. [Appendix 9] 9. The electronic device of claim 8, wherein the third region is recessed relative to the first region and the second region. [Appendix 10] 9. The electronic device of claim 8, wherein the third region is liquid-repellent to the liquid of the first composition. [Appendix 11] The electronic component and the mounting surface are further covered with a resin member. 11. The electronic device according to claim 1, wherein the resin member contains a solid of a second composition. [Appendix 12] 12. The electronic device of claim 11, wherein the second region is lyophilic to the liquid of the second composition. [Appendix 13] 13. The electronic device of claim 11 or 12, wherein the second composition is an epoxy resin. [Appendix 14] 14. The electronic device according to claim 1, wherein the support member includes a die pad portion having the mounting surface and a terminal lead portion spaced apart from the die pad portion. [Appendix 15] 15. The electronic device according to claim 14, wherein a surface layer of the die pad portion is a metal containing Cu. [Appendix 16] 16. The electronic device according to claim 14, further comprising a connection member for electrically connecting the electronic component and the terminal lead portion. [Appendix 17] The second region has a plurality of grooves formed therein, 17. The electronic device of any one of claims 1 to 16, wherein the plurality of grooves in the second region are different from the plurality of grooves in the first region. [Appendix 18] 18. The electronic device of claim 17, wherein a width of the plurality of grooves in the first region is greater than a width of the plurality of grooves in the second region. [Appendix 19] 19. The electronic device of claim 17, wherein the spacing between the grooves in the first region is greater than the spacing between the grooves in the second region. [Appendix 20] 20. The electronic device of claim 17, wherein the grooves in the first region are linear and arranged parallel to each other. [Appendix 21] 21. The electronic device of claim 17, wherein the grooves in the second region are linear and arranged parallel to each other. [Appendix 22] 22. The electronic device of claim 1, wherein the first region is rectangular when viewed in the first direction. [Appendix 23] A first step of providing a support member having a mounting surface; a second step of forming a first region and a second region surrounding the first region when viewed in a first direction on the mounting surface; A third step of applying a bonding material to the first region; A fourth step of placing an electronic component on the bonding material; and a fifth step of heating and cooling the bonding material to bond the electronic component to the support member by the bonding material, In the second step, the first region is formed by forming a plurality of grooves in a part of the mounting surface; A method for manufacturing an electronic device, wherein the bonding material after the fifth step is in contact with the first region and is not in contact with the second region.

Claims

1. A semiconductor element having an electrode on a surface thereof; a die pad portion having a mounting surface on which the semiconductor element is mounted; a bonding material interposed between the semiconductor element and the die pad portion for fixing the semiconductor element to the die pad portion; a plurality of terminals disposed apart from the die pad portion when viewed in a first direction which is a thickness direction of the semiconductor element; a connection member that electrically connects the electrode to any one of the plurality of terminals; a resin member that seals at least a portion of the die pad portion, at least a portion of each of the plurality of terminals, the semiconductor element, and the connection member; It is equipped with the mounting surface has a first region below the semiconductor element, the first region having a plurality of first grooves formed therein, and a second region surrounding the first region when viewed in the first direction, the second region having a plurality of second grooves formed therein; The first grooves and the second grooves are linear and extend in a second direction perpendicular to the first direction, The first grooves are arranged parallel to each other, the plurality of second grooves include a second groove that is longer than one side of the semiconductor element when viewed in the first direction; Semiconductor device.

2. The bonding material includes a first composition that undergoes a phase transition from a solid to a liquid upon heating, The first region exhibits lyophilicity with respect to the liquid of the first composition. The semiconductor device according to claim 1 .

3. the first composition is a solder; The semiconductor device according to claim 2 .

4. The depth of each of the plurality of first grooves is 5 to 20 μm. The semiconductor device according to claim 1 .

5. Each of the plurality of first grooves has a width of 20 to 40 μm. The semiconductor device according to claim 1 .

6. The arrangement interval of the plurality of first grooves is 30 to 200 μm. The semiconductor device according to claim 1 .

7. Each of the plurality of first grooves has a curved side surface. The semiconductor device according to claim 1 .

8. the die pad portion has a back surface spaced apart from the mounting surface in the first direction, The back surface is exposed from the resin member. The semiconductor device according to claim 1 .

9. the bonding material has a first surface, a second surface, and a third surface; the first surface and the second surface are spaced apart from each other in the first direction, the third surface is connected to the first surface and the second surface, A portion of the third surface overlaps the second region when viewed in the first direction. The semiconductor device according to claim 1 .

10. the first region has a plurality of raised portions and a plurality of intermediate portions each disposed between the plurality of first grooves, Each of the first grooves is recessed below the intermediate portions, Each of the plurality of raised portions is recessed upward relative to the plurality of intermediate portions, each of the plurality of interposed portions is disposed between two adjacent first grooves among the plurality of first grooves; Each of the plurality of raised portions has two edges in the second direction, one edge being connected to one first groove of the plurality of first grooves and the other edge being connected to one intermediate portion of the plurality of intermediate portions. The semiconductor device according to claim 1 .

11. The mounting surface further has a third region interposed between the first region and the second region when viewed in the first direction. The semiconductor device according to claim 2 or 3.

12. The third region is plated with Ag. The semiconductor device according to claim 11.

13. The third region is recessed relative to the first region and the second region, and is not in contact with the bonding material. The semiconductor device according to claim 11.

14. The third region exhibits liquid repellency to the liquid of the first composition. The semiconductor device according to claim 11.

15. The resin member is an epoxy resin containing a second composition that changes from a liquid to a solid, and contains the solid of the second composition. The semiconductor device according to claim 1 .

16. The second region exhibits lyophilicity with respect to the liquid of the second composition. The semiconductor device according to claim 15.

17. a surface layer of the die pad portion is a metal containing Cu; The semiconductor device according to claim 1 .

18. The width of the first grooves is greater than the width of the second grooves. The semiconductor device according to claim 1 .

19. The arrangement interval of the plurality of first grooves is greater than the arrangement interval of the plurality of second grooves. The semiconductor device according to claim 1 .

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