Compression molding device and compression molding method

Abstract

To provide a compression molding device and a compression molding method that are capable of preventing molding defects caused by a shortage of resin or resin flow.SOLUTION: A compression molding device 1 according to the present invention that seals a workpiece W with sealing resin R and processes the same into a molded product Wp includes: a guard frame 44 having a frame-like shape and held at a predetermined position on an upper surface of the workpiece W; a dispenser 42 for spraying R onto the upper surface of the workpiece W exposed within the guard frame 44; and a control unit 90 that controls the spraying operation of the dispenser 42 onto the workpiece W. The control unit 90 controls so that the R is sprayed on an area of the workpiece W excluding an area near the predetermined guard frame, and after or before that, the sealing resin R is sprayed on the area near the predetermined guard frame.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a compression molding apparatus and a compression molding method. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and method for sealing a workpiece with sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technique for resin sealing by supplying a predetermined amount of sealing resin to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and clamping the upper mold and lower mold (see Patent Document 1: JP 2015-128908 A). As an example, when a sealing mold having a cavity in the upper mold is used, a technique is known in which the sealing resin is supplied all at once to the center position on the workpiece and molded. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technique is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied and molded. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-128908 A Summary of the Invention [Problem to be solved by the invention]

[0005] As described above, when performing a so-called upper cavity type compression molding in which a workpiece is held in a lower die and a cavity is provided in an upper die, a method of spraying a sealing resin (granular resin, for example) on a workpiece is widely adopted. In addition, particularly when the workpiece is large, such as at a panel level or wafer level, a method of spraying the sealing resin on an exposed portion of the workpiece while a frame-shaped guard frame is held on the upper surface of the workpiece is known. As a specific example, as described in Patent Document 1, a method of spraying the sealing resin by moving a dispenser that supplies the sealing resin in parallel, back and forth, or rotationally is known.

[0006] When spraying the sealing resin while holding the guard frame on the top surface of the work as described above, it was necessary to spray the resin on an area smaller (inner) than the size of the molded product. This made it easy for the amount of resin to be insufficient on the periphery of the molded product, and the resin flow was greater on the periphery than in the center, both of which caused molding defects, especially deterioration of flatness (TTV: Total Thickness Variation). [Means for solving the problem]

[0007] The present invention has been made in consideration of the above circumstances, and has an object to provide a compression molding apparatus and a compression molding method that are capable of preventing the occurrence of molding defects caused by a shortage of resin or resin flow.

[0008] The present invention solves the above problems by the solution means described below as one embodiment.

[0009] A compression molding apparatus according to one embodiment is a compression molding apparatus that seals a workpiece with sealing resin and processes it into a molded product, and is equipped with a guard frame having a frame-like shape and held at a predetermined position on the upper surface of the workpiece, a dispenser that sprays the sealing resin on the upper surface of the workpiece exposed within the frame of the guard frame, and a control unit that controls the spraying operation of the dispenser onto the workpiece, wherein the control unit is configured to spray the sealing resin onto an area of ​​the workpiece excluding an area near a predetermined guard frame, and to control the spraying of the sealing resin onto the area near the predetermined guard frame before or after that.

[0010] This prevents a shortage of resin at the outer periphery of the molded product even when a sealing resin is sprayed onto the exposed portion of the workpiece while a guard frame is held on the upper surface of the workpiece. It also prevents the resin flow from becoming larger at the outer periphery than at the center.

[0011] Furthermore, it is preferable that the control unit is configured to control the dispenser to move back and forth in a predetermined first direction relative to the workpiece when spraying the sealing resin in an area excluding the area near the specified guard frame, while moving the dispenser linearly a predetermined distance in a second direction perpendicular to the first direction each time the dispenser reaches an end point of the forward path and an end point of the return path, so as to spray the sealing resin in a continuous or intermittent line.

[0012] Furthermore, it is preferable that the control unit is configured to control the dispenser to move linearly in the second direction relative to the workpiece when spraying the sealing resin in the vicinity of the specified guard frame, so as to spray the sealing resin in a linear manner in the vicinity of the inner wall surface that is parallel to the second direction.

[0013] It is also preferable that the control unit is configured to calculate an overlap volume between the guard frame and the area intended for resin sealing for each inner wall surface when spraying the sealing resin in the vicinity of the specified guard frame, and to control the spraying of an amount of the sealing resin obtained by multiplying the overlap volume by the resin specific gravity of the sealing resin and a set coefficient.

[0014] Moreover, a compression molding method according to one embodiment is a compression molding method for sealing a workpiece with sealing resin and processing it into a molded product, and includes a resin spraying step of holding a frame-shaped guard frame on an upper surface of the workpiece and spraying the sealing resin on the upper surface of the workpiece exposed within the frame of the guard frame, and the resin spraying step includes a first spraying step of spraying the sealing resin on an area of ​​the workpiece excluding an area near a specified guard frame, and a second spraying step of spraying the sealing resin on the area near the specified guard frame after or before the first spraying step.

[0015] Furthermore, it is preferable that the first spraying step includes a step of moving a dispenser back and forth relative to the workpiece in a predetermined first direction, and moving the dispenser linearly a predetermined distance in a second direction perpendicular to the first direction each time the dispenser reaches an end point of the forward path and an end point of the return path, thereby spraying the sealing resin in a continuous or intermittent line.

[0016] It is also preferable that the second spraying step includes a step of moving the dispenser linearly in the second direction relative to the workpiece to spray the sealing resin in a linear fashion in a region near an inner wall surface parallel to the second direction.

[0017] It is also preferable that the second spraying process includes a step of calculating an overlap volume between the specified guard frame and the area to be resin sealed for each inner wall surface, and spraying an amount of the sealing resin obtained by multiplying the overlap volume by the resin specific gravity of the sealing resin and a set coefficient. Effect of the Invention

[0018] According to the present invention, it is possible to prevent the occurrence of a shortage of resin at the outer periphery of a molded product. It is also possible to prevent the resin flow from becoming larger at the outer periphery than at the center. Therefore, it is possible to prevent molding defects caused by a shortage of resin or resin flow. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a plan view showing an example of a compression molding device according to an embodiment of the present invention. [Diagram 2] Figures 2A to 2C are explanatory diagrams showing the state in which a guard frame is held on the upper surface of a workpiece in the compression molding apparatus of Figure 1, where Figure 2A is a plan view, Figure 2B is a cross-sectional view, and Figure 2C is a cross-sectional view showing the overlapping volume between the guard frame and the area in the molded product to be resin sealed. [Diagram 3] 2 is an explanatory view for explaining a spraying operation of a sealing resin in the compression molding apparatus of FIG. 1. [Figure 4] 2 is a side view showing an example of a press device of the compression molding apparatus of FIG. 1. [Diagram 5] 2 is a front cross-sectional view showing an example of a sealing mold of the compression molding apparatus of FIG. 1. [Figure 6] FIG. 2 is an explanatory diagram of a compression molding method according to an embodiment of the present invention. [Figure 7] 6 (shown at the position AA in FIG. 3). [Figure 8] FIG. 8 is an explanatory diagram following FIG. [Figure 9] FIG. 9 is an explanatory diagram following FIG. [Figure 10] FIG. 10 is an explanatory diagram following FIG. [Figure 11] 11A and 11B are explanatory diagrams illustrating a dispensing operation of a sealing resin according to a conventional embodiment. [Figure 12] 12 is an explanatory view for explaining the sealing resin spraying operation according to the conventional embodiment (shown at position BB in FIG. 11). FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] (Overall composition) Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Fig. 1 is a plan view (schematic view) showing an example of a compression molding apparatus 1 according to this embodiment. For convenience of explanation, arrows in the drawing indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) in the compression molding apparatus 1. In addition, in all the drawings for explaining each embodiment, members having the same function are given the same reference numerals, and repeated explanations thereof may be omitted.

[0021] The compression molding apparatus 1 according to this embodiment is an apparatus that includes a sealing mold and performs resin sealing (compression molding) of a workpiece (molded article) W using sealing resin R.

[0022] First, the workpiece W to be molded has a configuration in which electronic components are mounted on a substrate. More specifically, examples of the substrate include plate-like members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, and a spacer. The shape of the substrate is a rectangular shape (striped shape), a square shape, a circular shape, and the like. The number of electronic components mounted on one substrate is set to one or more (for example, in a matrix shape, etc.).

[0023] Examples of methods for mounting electronic components on a substrate include wire bonding mounting, flip chip mounting, etc. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) is peeled off from the molded product Wp after resin sealing, there is also a method in which the electronic components are attached using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by exposure to ultraviolet light.

[0024] On the other hand, a granular thermosetting resin (for example, an epoxy resin containing a filler) is used as an example of the sealing resin R. The sealing resin R is not limited to the above-mentioned granular resin, and may be a powder resin, a crushed resin, a solid resin, a liquid resin, or a resin in which a plurality of these are combined, or may be a resin other than an epoxy thermosetting resin.

[0025] As examples of film F, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride, are preferably used.

[0026] Next, an overview of the compression molding apparatus 1 according to the present embodiment will be described. As shown in FIG. 1, the compression molding apparatus 1 mainly includes a supply unit 10A that supplies the workpiece W and the sealing resin R, a press unit 10B that seals the workpiece W with resin and processes it into a molded product Wp, and a storage unit 10C that stores the molded product Wp. As an example, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units, the arrangement order of the units, etc. may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in reverse to each other in the X direction, or may be arranged to be concentrated in one of the positions (not shown). In addition, the configuration may include units other than those described above (not shown).

[0027] In addition, the compression molding apparatus 1 has a guide rail 20 linearly provided between each unit, and a transport device (first loader) 22 for transporting the work W and the sealing resin R (may be used to transport the molded product Wp), and a transport device (second loader) 24 for transporting the molded product Wp (may be used to transport the work W and the sealing resin R) are provided so as to be movable between predetermined units along the guide rail 20. However, the configuration is not limited to the above, and a configuration may be provided with a common (single) transport device (loader) for transporting the work W, the sealing resin R, and the molded product Wp (not shown). Also, the transport device may be configured to include a robot hand or the like instead of a loader.

[0028] In addition, in the compression molding apparatus 1, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may be disposed in another unit).

[0029] (Supply unit) Next, the supply unit 10A included in the compression molding apparatus 1 will be described.

[0030] The supply unit 10A, for example, includes a stocker 12 used to store the workpieces W, and a table 14 on which the workpieces W are placed and moved. Note that the stocker 12 may be a known stack magazine, slit magazine, or the like, and is capable of storing a plurality of workpieces W together.

[0031] With this configuration, the workpieces W are removed from the stocker 12 using a known pusher or the like (not shown) and placed on the table 14 (one or more workpieces depending on the configuration of the workpieces W). Next, the table 14 on which the workpieces W are placed is moved to the resin supply section 40 described below.

[0032] The supply unit 10A etc. may be configured to include an inspection mechanism for inspecting the appearance of the workpiece W, a workpiece heater for preheating the workpiece W, etc. (neither of which is shown).

[0033] The supply unit 10A also includes a resin supply section 40 that supplies sealing resin R. The resin supply section 40 according to this embodiment includes a dispenser 42 that sprays sealing resin (granular resin, as an example) R, and a guard frame 44 that has a frame-like shape with a predetermined thickness and is held on the upper surface of the workpiece W (specifically, the plate-like member that constitutes the aforementioned base material). The guard frame 44 is formed using a metal material or a resin material.

[0034] With this configuration, the guard frame 44 is held at a predetermined position on the upper surface of the workpiece W (the above-mentioned plate-like member) placed on the table 14 (a plan view of the held state is shown in FIG. 2A, and a cross-sectional view is shown in FIG. 2B, but electronic components are not shown to make the configuration easier to understand). Next, a set amount of sealing resin R is supplied (sprayed) from the dispenser 42 onto the upper surface of the workpiece W exposed within the guard frame 44. Next, the workpiece W with the sealing resin R mounted thereon is transported to the press unit 10B using the first loader 22 or the like. At this time, since the workpiece W is surrounded by the guard frame 44, the sealing resin R can be prevented from flying up.

[0035] An example of a conventional spraying operation is shown in FIG. 11 (plan view) and FIG. 12 (cross-sectional view). The arrow U in the figure indicates the spraying path of the sealing resin R. As described above, when the sealing resin R is sprayed while the guard frame 44 is held on the upper surface of the workpiece W, it is necessary to spray the resin in an area smaller (inner) than the molded product size. This makes it easy for the amount of resin to be insufficient at the outer periphery of the molded product, and the resin flow is larger at the outer periphery than at the center, both of which cause molding defects (deterioration of flatness, etc.). In particular, as shown in FIG. 12, the occurrence of areas with and without the sealing resin R (spaces) caused deterioration of flatness after molding in the area near the guard frame 44 (in this case, the area near the inner wall surfaces 44a, 44b).

[0036] In order to solve the above problem, a control example of the spraying operation of the sealing resin R performed by the control unit 90 in the present invention will be described with reference to FIG. 3. Specifically, first, the sealing resin R is controlled to be sprayed in an area excluding a predetermined guard frame vicinity area (in this embodiment, an area near inner wall surfaces 44a, 44b perpendicular to a first direction described later) in the workpiece W (the exposed portion) (first spraying step). As an example, this first spraying step involves moving the dispenser 42 (or the table 14, or both) back and forth in a predetermined first direction (for example, a direction parallel to the X direction) and linearly moving a predetermined distance in a second direction (for example, a direction parallel to the Y direction) perpendicular to the first direction each time the dispenser reaches an end point of the forward path and an end point of the return path, thereby spraying the sealing resin R in a continuous line (so-called one-stroke line) (arrow S in FIG. 3). However, the spraying is not limited to a continuous line, and may be an intermittent line with interruptions in the middle. Furthermore, instead of a line formed by reciprocating movement, a line formed by unidirectional movement or a line formed by rotational movement (so-called a spiral shape) may be used (not shown).

[0037] Next, the sealing resin R is controlled to be sprayed onto a predetermined area (area adjacent to the inner wall surfaces 44a, 44b) of the workpiece W (the exposed portion) near the guard frame (second spraying step). In one example of this second spraying step, the dispenser 42 (or the table 14, or both) is moved linearly in the second direction, and the sealing resin R is sprayed in a continuous (or intermittent) linear manner onto the area adjacent to the inner wall surfaces 44a, 44b parallel to the second direction (arrow T in FIG. 3). The first and second spraying steps may be performed in the reverse order.

[0038] When the second spraying step is performed, the control unit 90 calculates the overlap volume between the guard frame 44 and the resin sealing planned area (broken line portion in FIG. 2C) for each inner wall surface (specifically, for each of the inner wall surface 44a and the inner wall surface 44b). Next, the controller 90 controls to spray the sealing resin R in an amount obtained by multiplying the calculated overlap volume by the resin specific gravity s of the sealing resin R to be used and a setting coefficient k (k is appropriately set in the range of about 0.5 to 1.0). In the example of this embodiment, the overlap volume for the inner wall surface 44a is V1 in FIG. 2C, and the resin amount M1 of the sealing resin R to be sprayed is M1=V1×s×k. Similarly, the overlap volume for the inner wall surface 44b is V2 in FIG. 2C, and the resin amount M2 of the sealing resin R to be sprayed is M2=V2×s×k. Incidentally, when V1=V2 is set (designed), the above resin amount is calculated for only one of the inner wall surfaces, and then the same amount is applied to the other opposing inner wall surface.

[0039] According to the configuration described above, the above-mentioned problems can be solved. That is, the problem of spraying the sealing resin R on the exposed portion of the workpiece W while holding the frame-shaped guard frame 44 on the upper surface of the workpiece W can be solved. Specifically, it is possible to prevent a shortage of the amount of resin at the outer periphery of the molded product Wp. It is also possible to prevent the resin flow from becoming larger at the outer periphery compared to the central portion. Therefore, it is possible to prevent molding defects (particularly deterioration of flatness) caused by a shortage of the amount of resin or resin flow.

[0040] As another example, the above problem can also be solved by relatively slowing down the moving speed of the dispenser 42 when spraying the sealing resin R in the dashed line region in Fig. 3, i.e., the guard frame vicinity region (region adjacent to the inner wall surfaces 44c, 44d parallel to the first direction) which is the starting end region Sa and the ending end region Sb of the arrow S. This is because the amount of the sealing resin R sprayed (supplied) in this region can be relatively increased.

[0041] (Press unit) Next, the press unit 10B included in the compression molding apparatus 1 will be described.

[0042] The press unit 10B is provided with a sealing die 202 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, etc., made of alloy tool steel, and other members assembled thereto) that can be opened and closed. The press unit 10B is also provided with a press device 250 that drives the sealing die 202 to open and close to resin seal the workpiece W. As an example, the press unit 10B is configured to include two press devices 250, but may include one or three or more press devices (not shown). A side view (schematic view) of the press device 250 provided in the press unit 10B is shown in FIG. 4, and a front cross-sectional view (schematic view) of the sealing die 202 is shown in FIG. 5.

[0043] Here, as shown in FIG. 4, the press machine 250 is configured to include a pair of platens 254, 256, a plurality of tie bars 252 on which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, the present invention is not limited to this). In this embodiment, the platen 254 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 252), and the platen 256 on the lower side is set as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0044] 5, the sealing mold 202 includes an upper mold 204 on the upper side in the vertical direction and a lower mold 206 on the lower side as a pair of molds disposed between the pair of platens 254, 256 in the press device 250. That is, the upper mold 204 is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper mold 204 and the lower mold 206 move toward and away from each other to close and open the mold (the vertical direction (up and down direction) is the mold opening and closing direction).

[0045] In the present embodiment, as an example, a film supply unit 213 is provided that transports (supplies) a roll-shaped film F to the inside of the sealing die 202. Depending on the configuration of the workpiece W, the film F may be in a strip shape instead of a roll shape.

[0046] Next, the upper mold 204 of the sealing mold 202 will be described in detail. As shown in Fig. 5, the upper mold 204 includes an upper mold chase 210, a cavity piece 226 held thereby, a clamper 228, etc. The upper mold chase 210 is fixed to the lower surface of a support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface of the upper mold 204 (the surface on the lower mold 206 side).

[0047] The clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is assembled to be movable up and down while being spaced (floating) from the lower surface of the support plate 214 via a push pin 222 and a clamper spring (a biasing member exemplified by a coil spring, for example) 224 (however, the assembly structure is not limited to this). The cavity piece 226 constitutes the inner part (bottom part) of the cavity 208, and the clamper 228 constitutes the side part of the cavity 208. The shape and number of cavities 208 provided in one upper mold 204 are appropriately set according to the shape and number of workpieces W (one or multiple).

[0048] In addition, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the lower surface of the clamper 228, on the boundary between the clamper 228 and the cavity piece 226, etc. This allows the film F supplied from the film supply unit 213 to be adsorbed and held on the mold surface 204a including the inner surface of the cavity 208. In addition, the cavity 208 can be degassed when the mold is closed and resin sealing is performed.

[0049] In this embodiment, an upper die heating mechanism (not shown) is provided to heat the upper die 204 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the upper die chase 210 and configured to apply heat to the entire upper die 204 and the sealing resin R contained in the cavity 208. The heater heats the upper die 204 to a predetermined temperature (e.g., 100°C to 300°C).

[0050] Next, a detailed description will be given of the lower mold 206 of the sealing mold 202. As shown in Fig. 5, the lower mold 206 includes a lower mold chase 240, a lower plate 242 held thereby, and the like.

[0051] In this embodiment, a workpiece holding section 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the lower plate 242. As an example, the workpiece holding section 205 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged penetrating the lower plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 206a of the lower die 206, and the other end is connected to a suction device arranged outside the lower die 206. This makes it possible to suck the workpiece W from the suction passage by driving the suction device, and to hold the workpiece W by suction on the die surface 206a (here, the upper surface of the lower plate 242). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 205 provided on one lower die 206 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0052] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the lower die chase 240 and configured to apply heat to the entire lower die 206 and the workpiece W held by the workpiece holding unit 205. The heater heats the lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0053] (Storage unit) Next, the storage unit 10C included in the compression molding apparatus 1 will be described.

[0054] The storage unit 10C, for example, includes a table 18 on which the molded products Wp are placed, and a stocker 16 used to store the molded products Wp. The stocker 16 may be a known stack magazine, slit magazine, or the like, and is capable of storing a plurality of molded products Wp at once.

[0055] With this configuration, the molded product Wp transferred from the press unit 10B using the second loader 24 or the like is placed on the table 18. Next, the molded product Wp is stored in the stocker 16 using a known pusher or the like (not shown).

[0056] The storage unit 10C etc. may be configured to include a molded product heater for post-curing the molded product Wp, an inspection mechanism for inspecting the appearance of the molded product Wp, etc. (neither of which is shown).

[0057] (Resin sealing operation) Next, the operation of resin sealing using the compression molding apparatus 1 according to this embodiment (that is, the compression molding method according to this embodiment) will be described.

[0058] First, a preparation step is performed. The preparation step includes the following steps. A heating step (upper die heating step) is performed in which the upper die 204 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the upper die heating mechanism (upper die heating step). In addition, a heating step (lower die heating step) is performed in which the lower die 206 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the lower die heating mechanism (lower die heating step). In addition, a film supply step is performed in which the film supply unit 213 is operated to supply new film F and adsorb it to cover a predetermined area of ​​the mold surface 204a including the inner surface of the cavity 208 in the upper die 204.

[0059] After the preparation step, as shown in Fig. 6, a work supply step is performed in which the workpieces W are carried out one by one from the stocker 12 and placed on the table 14. Then, a guard frame holding step is performed in which a frame-shaped guard frame 44 is held on the upper surface of the workpiece W (specifically, the plate-shaped member constituting the above-mentioned base material). Then, a resin spraying step is performed in which a sealing resin R is sprayed on the upper surface of the workpiece W exposed within the frame of the guard frame 44.

[0060] The resin spraying step according to this embodiment includes a first spraying step of spraying the sealing resin R onto an area excluding a predetermined area near the guard frame on the upper surface of the workpiece W (in this embodiment, the area near the inner wall surfaces 44a, 44b perpendicular to the first direction). Also, a second spraying step of spraying the sealing resin R onto a predetermined area near the guard frame on the upper surface of the workpiece W (the area near the inner wall surfaces 44a, 44b).

[0061] As an example of the first spraying step, the dispenser 42 (or the table 14, or both) is moved back and forth in a predetermined first direction (e.g., a direction parallel to the X direction) while moving linearly a predetermined distance in a second direction perpendicular to the first direction (e.g., a direction parallel to the Y direction) each time the dispenser reaches the end point of the forward path and the end point of the return path, thereby spraying the sealing resin R in a continuous line (so-called one-stroke pattern) (arrow S in FIG. 3). However, the line is not limited to a continuous line, and may be an intermittent line that is interrupted at an intermediate point. Furthermore, instead of a line formed by a reciprocating movement, a line formed by a unidirectional movement or a line formed by a rotational movement (so-called a spiral shape) may be used (not shown).

[0062] As described above, as another example of the first spraying process, the movement speed of the dispenser 42 may be relatively slowed in the area near the guard frame (area near the inner wall surfaces 44c, 44d parallel to the first direction) which is the starting area Sa and the ending area Sb of the arrow S, thereby relatively increasing the amount of sealing resin R sprayed (supplied) in that area.

[0063] As an example of the second spraying step, the dispenser 42 (or the table 14, or both) is moved linearly in the second direction, and the sealing resin R is sprayed in a continuous (or discontinuous) linear manner in the vicinity of the inner wall surfaces 44a, 44b parallel to the second direction (arrow T in FIG. 3). Note that the first spraying step and the second spraying step may be performed in the reverse order.

[0064] When carrying out the second spraying step, first, the overlap volume between the guard frame 44 and the region to be resin-sealed (broken line portion in FIG. 2C) is calculated for each inner wall surface (specifically, for each of the inner wall surface 44a and the inner wall surface 44b). Next, the sealing resin R is sprayed in an amount obtained by multiplying the calculated overlap volume by the resin specific gravity s of the sealing resin R to be used and the setting coefficient k (k is appropriately set in the range of about 0.5 to 1.0). In the example of this embodiment, the overlap volume for the inner wall surface 44a is V1 in FIG. 2C, and the resin amount M1 of the sealing resin R to be sprayed is M1=V1×s×k. Similarly, the overlap volume for the inner wall surface 44b is V2 in FIG. 2C, and the resin amount M2 of the sealing resin R to be sprayed is M2=V2×s×k. Incidentally, when V1=V2 is set (designed), the above resin amount is calculated for only one of the inner wall surfaces, and then the same amount is applied to the other opposing inner wall surface.

[0065] After the resin spraying step, a conveying device (e.g., first loader 22, etc.) conveys the workpiece W (with the sealing resin R mounted within the frame of guard frame 44) holding the guard frame 44 into the sealing mold 202, and performs a setting step of setting it in a predetermined position (specifically, on the workpiece holding portion 205 of the lower mold 206) (see FIG. 7). Next, a conveying device (e.g., first loader 22, etc.) removes the guard frame 44 from the top surface of the workpiece W and carries it out of the sealing mold 202 (see FIG. 8). The guard frame 44 is conveyed to supply unit 10A and is used repeatedly in other (subsequent) guard frame holding steps.

[0066] After all of the above steps are performed, a resin sealing step is performed in which the workpiece W is sealed with sealing resin R and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is lowered relatively within the cavity 208 to perform the mold closing step of heating and pressurizing the sealing resin R against the workpiece W (see FIG. 9). This thermally cures the sealing resin R, completing the resin sealing (compression molding), and forming the molded product Wp.

[0067] After the mold closing step, the sealing mold 202 is opened, and the molded product Wp is separated from the used film F so that the molded product Wp can be removed (see FIG. 10). Next, a molded product unloading step is performed in which the molded product Wp is unloaded from the sealing mold 202 by a transport device (e.g., the second loader 24, etc.) and transported to the storage unit 10C.

[0068] After or in parallel with the molded product removal process, the film supply section 213 is operated to perform a film supply process in which the used film F is sent out from within the sealing mold 202 and a new film F is sent into the sealing mold 202 and set therein.

[0069] After or in parallel with the film supplying process, a molded product storing process is carried out. Specifically, a process of placing the molded product Wp on the table 18 by a conveying device (e.g., the second loader 24, etc.) is carried out (note that a known pick-up mechanism, etc. may be used in combination). Next, a process of carrying the molded products Wp one by one into the stocker 16 is carried out by a known pusher, etc. (not shown). Note that, before these processes, a process of post-curing the molded products Wp, etc. may be carried out.

[0070] The above are the main steps of the compression molding method performed using the compression molding apparatus 1. By providing such steps, it is possible to solve the above-mentioned problems. Note that the above-mentioned order of steps is one example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0071] As described above, the compression molding apparatus and compression molding method according to the present invention can prevent the amount of resin from being insufficient at the outer periphery of the molded product. In addition, it can prevent the resin flow from being larger at the outer periphery than at the center. Therefore, it is possible to prevent molding defects (especially deterioration of flatness) caused by the insufficient amount of resin or the resin flow.

[0072] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0073] 1. Compression molding equipment 42 Dispenser 44 Guard Frame 202 Sealing mold R Sealing resin Double work

Claims

1. A compression molding apparatus that seals a workpiece with sealing resin to process it into a molded product, A guard frame having a frame-like shape and held at a predetermined position on the upper surface of the workpiece; a dispenser that sprays the sealing resin on an upper surface of the workpiece exposed within the guard frame; A control unit that controls the spraying operation of the dispenser onto the workpiece, The control unit is configured to control the spraying of the sealing resin to an area of ​​the workpiece excluding a predetermined area near a guard frame, and to spray the sealing resin to the predetermined area near the guard frame before or after the spraying. A compression molding apparatus comprising:

2. The control unit is configured to control, when spraying the sealing resin in an area excluding the predetermined guard frame vicinity area, the dispenser reciprocates relatively to the workpiece in a predetermined first direction while linearly moving the dispenser a predetermined distance in a second direction perpendicular to the first direction each time the dispenser reaches an end point of a forward path and an end point of a return path, so as to spray the sealing resin in a continuous or intermittent linear pattern.

2. The compression molding apparatus according to claim 1,

3. The control unit is configured to control, when spraying the sealing resin in the predetermined guard frame vicinity area, to linearly move the dispenser relative to the workpiece in the second direction so as to spray the sealing resin in a linear manner in the vicinity area of ​​an inner wall surface parallel to the second direction.

3. The compression molding apparatus according to claim 2,

4. The control unit is configured to calculate an overlap volume between the guard frame and a region to be sealed with resin for each of the inner wall surfaces when spraying the sealing resin in the vicinity of the predetermined guard frame, and to control spraying of the sealing resin in an amount obtained by multiplying the overlap volume by a resin specific gravity of the sealing resin and a set coefficient.

4. The compression molding apparatus according to claim 3,

5. A compression molding method for encapsulating a workpiece with a encapsulating resin to process the workpiece into a molded product, comprising the steps of: a resin spraying step of holding a frame-shaped guard frame on an upper surface of the workpiece and spraying the sealing resin on an upper surface of the workpiece exposed within a frame of the guard frame; The resin spraying step includes a first spraying step of spraying the sealing resin onto an area of ​​the workpiece excluding a predetermined guard frame vicinity area, and a second spraying step of spraying the sealing resin onto the predetermined guard frame vicinity area before or after the first spraying step. A compression molding method comprising the steps of:

6. The first spraying step includes a step of moving a dispenser reciprocally relative to the workpiece in a predetermined first direction, and linearly moving the dispenser a predetermined distance in a second direction perpendicular to the first direction each time the dispenser reaches an end point of a forward path and an end point of a return path, thereby spraying the sealing resin in a continuous or intermittent linear pattern.

6. The compression molding apparatus according to claim 5,

7. The second spraying step includes a step of linearly moving the dispenser relative to the workpiece in the second direction to spray the sealing resin linearly in a region near an inner wall surface parallel to the second direction.

7. The compression molding apparatus according to claim 6,

8. The second spraying step includes a step of calculating an overlap volume between the guard frame and a region to be sealed with resin for each of the inner wall surfaces, and spraying the sealing resin in an amount obtained by multiplying the overlap volume by a resin specific gravity of the sealing resin and a set coefficient.

8. The compression molding apparatus according to claim 7,

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