Semiconductor device handling device and semiconductor device testing device

Abstract

To provide a semiconductor device handling device capable of improving throughput.SOLUTION: A semiconductor device handling device 30 comprises a plurality of mobile devices 40A, 40B which relatively move a DUT 100 to a probe card 20; and a control device 70. The control device 70 controls the mobile devices 40A, 40B, when the mobile device 40A presses the DUT 100 against the probe card 20, so as to relatively position another DUT 100 held by the mobile device 40B to the probe card 20.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a semiconductor device handling apparatus that handles semiconductor devices under test (DUTs), such as dies formed by dicing a semiconductor wafer, in order to test the semiconductor devices, and a semiconductor device testing apparatus that tests the semiconductor devices. [Background technology]

[0002] 2. Description of the Related Art There is known an electronic device test apparatus that tests an electronic device by positioning the electronic device relative to a probe card using an alignment unit and then pressing the electronic device against the probe card (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-85203 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above electronic device testing apparatus, the electronic device must be pressed against the probe card after the electronic device is positioned relative to the probe card, which limits the improvement of the throughput of the testing apparatus. The problem to be solved by the present invention is to provide a semiconductor device handling apparatus and a semiconductor device testing apparatus that can improve the throughput. [Means for solving the problem]

[0005] [1] Aspect 1 of the present invention is a semiconductor device handling apparatus that moves a DUT to press the DUT against a contact portion, comprising a plurality of moving devices including first and second moving devices that respectively move the DUT relatively to the contact portion, and a control device that controls the plurality of moving devices, wherein the control device controls the first and second moving devices so as to position another DUT held by the second moving device relative to the contact portion when the first moving device presses the DUT against the contact portion, and the DUT is a bare die alone, a 2.5D device intermediate in which a plurality of bare dies are arranged side by side on a silicon interposer, or a 3D device intermediate in which a plurality of bare dies are stacked on top of each other.

[0006] [2] A second aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, wherein the control device adjusts the movement operation of the second mover device based on whether the first mover device is pressing the DUT against the contact portion.

[0007] [3] A third aspect of the present invention may be a semiconductor device handling apparatus according to the first or second aspect, wherein the control device controls the second moving device so that, when the first moving device is pressing the DUT against the contact portion, the magnitude of acceleration / deceleration of the second moving device is smaller compared to when the first moving device is not pressing the DUT against the contact portion.

[0008] [4] A fourth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 3, wherein the semiconductor device handling apparatus comprises a plurality of DUT cameras that respectively photograph the DUT held by a plurality of the moving devices, each of the moving devices comprising a holding portion that holds the DUT, a moving mechanism that moves the holding portion, and a contact camera that images the contact portion, the control device detects a relative position of the DUT with respect to the contact portion based on image information captured by the DUT camera and the contact camera, and the moving device positions the DUT with respect to the contact portion based on the relative position.

[0009] [5] A fifth aspect of the present invention may be a semiconductor device handling device according to the fourth aspect, wherein the DUT camera photographs the DUT held in the holding part while the moving mechanism moves the holding part holding the DUT.

[0010] [6] A sixth aspect of the present invention may be a semiconductor device handling apparatus according to any one of the first to fifth aspects, wherein each of the moving devices includes a holding portion for holding the DUT and a moving mechanism for moving the holding portion, and the holding portion includes a parallelism adjustment device for adjusting the parallelism of the DUT relative to the contact portion.

[0011] [7] A seventh aspect of the present invention may be a semiconductor device handling apparatus according to the sixth aspect, wherein the parallelism adjustment device includes a first tilt adjustment unit that tilts the DUT around a first axis and a second tilt adjustment unit that tilts the DUT around a second axis, and the first axis is an axis that is substantially parallel to the planar direction of the contact portion, and the second axis is an axis that is substantially parallel to the planar direction of the contact portion and is substantially perpendicular to the first axis when the second axis is projected onto a normal direction of the contact portion.

[0012] [8] An eighth aspect of the present invention may be a semiconductor device handling apparatus according to the sixth or seventh aspect, further comprising a parallelism detection device that detects the parallelism of the DUT relative to the contact portion, and the control device controls the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

[0013] [9] A ninth aspect of the present invention may be a semiconductor device handling apparatus according to the eighth aspect, wherein the parallelism detection device includes a first sensor for detecting a height of a predetermined position on the contact portion, a second sensor for detecting a height of a predetermined position on the DUT, and a calculation unit for calculating the parallelism of the DUT relative to the contact portion based on the detection results of the first and second sensors, and the control device controls the parallelism detection device based on the parallelism calculated by the calculation unit.

[0014]

[10] A tenth aspect of the present invention may be a semiconductor device handling apparatus according to the ninth aspect, wherein the holding portion is provided with a height adjustment device for adjusting the height of the DUT relative to the contact portion, and the control device controls the height adjustment device based on the detection results of the first and second sensors.

[0015]

[11] An eleventh aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 10, wherein the control device determines that the moving device is pressing the DUT against the contact portion when the DUT is positioned at a predetermined height.

[0016]

[12] A twelfth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 10, wherein the control device determines that the moving device is pressing the DUT against the contact portion when the control device receives a signal from a tester indicating that the die and the contact portion are electrically connected.

[0017]

[13] A thirteenth aspect of the present invention is a semiconductor device testing apparatus for testing a DUT, comprising a semiconductor device handling apparatus according to any one of aspects 1 to 12, and a tester to which the contact portion is electrically connected. Effect of the Invention

[0018] In the present invention, the semiconductor device handling equipment includes a plurality of moving devices, and while a first moving device presses a DUT against a contact portion, the first moving device performs relative positioning of the DUT held by the second moving device with respect to the contact portion. As a result, after the test of the DUT held by the first moving device is completed, the DUT held by the second moving device can be immediately pressed against the contact portion and tested, thereby improving the throughput of the semiconductor device testing equipment. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus and the internal structure of a handler in an embodiment of the present invention. [Diagram 2] FIG. 2 is an enlarged view showing a portion II in FIG. [Diagram 3] FIG. 3 is a block diagram showing a control system of a semiconductor device handling apparatus in an embodiment of the present invention. [Figure 4] FIG. 4 is a graph showing an example of a method for adjusting the movement operation of the second moving device in the embodiment of the present invention. [Figure 5A]FIG. 5A is a cross-sectional view (part 1) showing a method of transporting a die by a handler in an embodiment of the present invention. [Figure 5B] FIG. 5B is a cross-sectional view (part 2) showing a method of transporting a die by a handler in an embodiment of the present invention. [Figure 5C] FIG. 5C is a cross-sectional view (part 3) showing a method of transporting a die by a handler in an embodiment of the present invention. [Figure 5D] FIG. 5D is a cross-sectional view (part 4) showing a method of transporting a die by a handler in an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0021] Fig. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus 1 according to this embodiment and the internal structure of a handler 30. Fig. 2 is an enlarged view showing a part II in Fig. 1. Fig. 3 is a block diagram showing a control system of the handler 30 according to this embodiment.

[0022] The semiconductor device testing apparatus 1 in this embodiment is an apparatus for testing a semiconductor device 100. As shown in Fig. 1, the semiconductor device testing apparatus 1 includes a tester 10, a probe card 20, and a handler 30. The handler 30 corresponds to an example of a "semiconductor device handling apparatus" in an aspect of the present invention.

[0023] A bare die (bare chip) obtained after dicing a semiconductor wafer can be exemplified as a specific example of the DUT 100 that is the test target of the semiconductor device test apparatus 1. Note that the DUT 100 is not limited to a bare die alone, and may be, for example, a 2.5D device intermediate or a 3D device intermediate.

[0024] Here, the 2.5D device intermediate is a device intermediate having a silicon interposer and a plurality of bare dies arranged on the silicon interposer. This 2.5 device intermediate is, for example, mounted on a wiring board and packaged with a resin material to become a final product (i.e., a 2.5D device).

[0025] On the other hand, a 3D device intermediate is a device intermediate having multiple bare dies stacked on top of each other and electrically connected by through-silicon vias (TSVs). Like the above-mentioned 2.5D device intermediate, this 3D device intermediate is also mounted on a wiring board and packaged with a resin material to become a final product (i.e., a 3D device (three-dimensional device)).

[0026] 1, the tester 10 includes a test head 11 and a main frame (tester body) 12. The test head 11 is connected to the main frame 12 via a cable. A probe card 20 is electrically connected to the test head 11. The probe card 20 enters the inside of the handler 30 through an opening 32 formed in an upper base 31 of the handler 30.

[0027] Probe card 20 includes wiring board 21 and probe head 22 mounted on wiring board 21. Probe head 22 includes a plurality of probes 23. Probe card 20 corresponds to an example of a "contact portion" in an aspect of the present invention.

[0028] The probe 23 is an electric probe that comes into contact with a terminal 101 (see FIG. 2) of the DUT 100. The multiple probes 23 are arranged to correspond to the multiple terminals 101 of the DUT 100. Although not particularly limited, specific examples of the probe 23 include a pogo pin, a vertical probe needle, a cantilever probe needle, an anisotropic conductive rubber sheet, a bump on a membrane, or a contactor manufactured using MEMS technology.

[0029] Probe 23 is held in a housing (not shown), and this housing is fixed to wiring board 21 by screws or the like, thereby mounting probe head 22 on wiring board 21. Note that wiring board 21 may directly hold probe 23, in which case the housing can be omitted.

[0030] 1 and 2, the handler 30 includes moving devices 40A and 40B, DUT cameras 50A and 50B, a sensor unit 60, and a control device 70 (see FIG. 3). In the following, the moving devices 40A and 40B are also collectively referred to as "moving devices 40", and the DUT cameras 50A and 50B are also collectively referred to as "DUT cameras 50". The moving device 40 corresponds to an example of a "moving device" in an aspect of the present invention, the moving device 40A corresponds to an example of a "first moving device" in an aspect of the present invention, the moving device 40B corresponds to an example of a "second moving device" in an aspect of the present invention, the DUT camera 50 corresponds to an example of a "DUT camera" in an aspect of the present invention, the sensor unit 60 corresponds to an example of a "parallelism detection device" in an aspect of the present invention, and the control device 70 corresponds to an example of a "control device" in an aspect of the present invention.

[0031] The first moving device 40A includes a thermal chuck 41, a moving mechanism 42, and a contact camera 43. The first moving device 40A moves the DUT 100 held by the thermal chuck 41 relative to the probe card 20 and presses the DUT 100 against the probe card 20. The thermal chuck 41 corresponds to an example of a "holding unit" in an aspect of the present invention, the moving mechanism 42 corresponds to an example of a "moving mechanism" in an aspect of the present invention, and the contact camera 43 corresponds to an example of a "contact camera" in an aspect of the present invention.

[0032] The thermal chuck 41 is a block-shaped member, and includes an adsorption / holding mechanism (not shown) for adsorbing and holding the DUT 100, a temperature adjustment mechanism (not shown) for adjusting the temperature of the DUT 100, a parallelism adjustment device 80, and a height adjustment device 90. The adsorption / holding mechanism may be, for example, a mechanism for sucking a suction flow passage formed inside the thermal chuck 41 by a pressure reducing device. The thermal chuck 41 is capable of holding the DUT 100 by the adsorption / holding mechanism. The temperature adjustment mechanism may be, for example, a heating device, a cooling device, and a temperature sensor. The heating device may be, for example, an aluminum nitride heater, a silicon nitride heater, a ceramic heater such as a PTC heater, a polyimide heater, and a cartridge heater. The cooling device may be, for example, a flow passage formed inside the thermal chuck 41 and supplied with a refrigerant from the outside. The flow passage through which a hot medium is supplied from the outside may be used as the heating device. Alternatively, a Peltier element may be used as the heating device and the cooling device.

[0033] The parallelism adjustment device 80 is disposed below the thermal chuck 41, and the thermal chuck 41 is fixed to the parallelism adjustment device 80. The parallelism adjustment device 80 is a device for adjusting the rolling and pitching of the DUT 100 held by the thermal chuck 41, and is a so-called two-axis goniostage including a first adjustment unit 81 and a second adjustment unit 82. Although not particularly limited, in this embodiment, the second adjustment unit 82 is provided below the first adjustment unit 81, and the first and second adjustment units 81, 82 are fixed to each other. The parallelism adjustment device 80 corresponds to an example of a "parallelism adjustment device" in an aspect of the present invention.

[0034] The first adjustment unit 81 is a goniostage that rotates (tilts) the thermal chuck 41 about a first axis, and is a device that adjusts the rolling of the DUT 100. Here, the above-mentioned first axis is an axis that is substantially parallel to the planar direction of the probe head 22 (XY direction in the figure), and is an axis that is substantially parallel to the X-axis in the figure.

[0035] The first adjustment unit 81 is driven by a first actuator 83. A specific example of the first actuator 83 is not particularly limited, but may be, for example, an electric motor equipped with a worm gear mechanism.

[0036] In contrast, the second adjustment unit 82 is a goniostage that rotates (tilts) the thermal chuck 41 about a second axis, and is a device that adjusts the pitching of the DUT 100. Here, the second axis is an axis that is substantially parallel to the planar direction of the probe head 22 (XY directions in the figure), and is an axis that is substantially perpendicular to the first axis when the second axis is projected in the normal direction of the probe head 22 (Z direction in the figure) (the pressing direction of the DUT 100 against the probe head 22), and is an axis that is substantially parallel to the Y axis in the figure.

[0037] The second adjustment unit 82 is driven by a second actuator 84. A specific example of the second actuator 84 is not particularly limited, but may be, for example, an electric motor equipped with a worm gear mechanism, similar to the above-mentioned first actuator 83.

[0038] By rotating the thermal chuck 41 about a first axis by the first adjustment unit 81 and rotating the thermal chuck 41 about a second axis by the second adjustment unit 82, the DUT 100 held by the thermal chuck 41 can be tilted arbitrarily, and the parallelism of the DUT 100 with respect to the probe head 22 can be adjusted. Note that the mechanism included in the parallelism adjustment device 80 is not limited to the above-mentioned goniostage, as long as it is a mechanism that can arbitrarily tilt the DUT 100.

[0039] The height adjustment device 90 is provided below the parallelism adjustment device 80, and the parallelism adjustment device 80 is fixed to the height adjustment device 90. The height adjustment device 90 is capable of moving the thermal chuck 41 and the parallelism adjustment device 80 in the vertical direction (Z-axis direction in the figure) by an actuator 91. This height adjustment device 90 is used to cancel the displacement of the DUT 100 in the height direction caused by the parallelism adjustment of the DUT 100 by the parallelism adjustment device 80. A specific example of the actuator 91 of such height adjustment device 90 is not particularly limited, but may be, for example, an electric motor connected to a ball screw mechanism. The height adjustment device 90 corresponds to an example of a "height adjustment device" in the aspect of the present invention.

[0040] In addition, when the first and second axes of the parallelism adjustment device 80 described above coincide with the center of gravity of the DUT 100 held by the thermal chuck 41, the height adjustment device 90 may be omitted. In addition, in this embodiment, the height adjustment device 90 is provided below the parallelism adjustment device 80, but this is not particularly limited, and the height adjustment device 90 may be provided above the parallelism adjustment device 80. In other words, the parallelism adjustment device 80, the height adjustment device 90, and the thermal chuck 41 may be arranged in this order from the bottom.

[0041] The moving mechanism 42 is a device that moves the thermal chuck 41. The moving mechanism 42 includes a support member 44, an X-direction drive unit including an X-direction rail 45, a Y-direction drive unit including a Y-direction rail 46, and a Z-direction drive unit 47. A height adjustment device 90 is provided on the support member 44, and the support member 44 supports the thermal chuck 41, the parallelism adjustment device 80, and the height adjustment device 90. The moving mechanism 42 aligns the DUT 100 with respect to the probe card 20 so that the multiple terminals 101 of the DUT 100 face the multiple probes 23 of the probe head 22, respectively. The moving mechanism 42 is also capable of moving the support member 44 in the X, Y, and Z-axis directions in the figure and rotating it around the Z axis (θz).

[0042] As shown in FIG. 1, the X-direction rail 45 is provided on the lower base 34 of the handler 30 and extends along the X-direction. The Y-direction rail 46 is slidably held on the X-direction rail 45 and can move along the X-direction. The Z-drive unit 47 is slidably held on the Y-direction rail 46 and can move along the Y-direction. The support member 44 described above is attached to the Z-drive unit 47. The Z-drive unit 47 can raise and lower the support member 44 and rotate the support member 44 around the Z-axis. As a result, the thermal chuck 41, the parallelism adjustment device 80, and the height adjustment device 90 supported by the support member 44 can be moved in the X, Y, and Z directions by the moving mechanism 42 and can be rotated around the Z-axis.

[0043] Although not particularly limited, the X drive unit, the Y drive unit, and the Z drive unit 47 of the moving mechanism 42 include, for example, an actuator, a transmission mechanism, and a guide mechanism. Although not particularly limited, a specific example of the actuator can be, for example, a motor including an electric motor or an electric actuator including the electric motor, a specific example of the transmission mechanism can be, for example, a ball screw mechanism, and a specific example of the guide mechanism can be, for example, a linear guide mechanism including a guide rail and a block that can slide on the guide rail.

[0044] The contact camera 43 is a camera that captures an image of the probe card 20. The contact camera 43 is provided facing upward in the Z direction in the figure. The contact camera 43 may be a camera equipped with an imaging element such as a CCD or a CMOS. When the moving device 40 is moved below the probe card 20 by the moving mechanism 42, the contact camera 43 can capture an image of the probe card 20. The contact camera 43 is also electrically connected to the control device 70, and can output captured image information to the control device 70.

[0045] The contact camera 43 may capture an image of the probe card 20 and detect the height of a predetermined position of the probe head 22. Specifically, when the contact camera 43 captures an image of the probe card 20, the contact camera 43 may focus on a predetermined position of the probe head 22 and detect the height by calculating the focal length when the focus is achieved. The height of the predetermined position of the probe head 22 detected by the contact camera 43 can be output to the control device 70.

[0046] The moving device 40B, like the moving device 40A, is a device that holds the DUT 100 and moves it relatively to the probe card 20. The configuration of the moving device 40B is similar to that of the moving device 40A. That is, the moving device 40B includes a thermal chuck 41, a moving mechanism 42, and a contact camera 43. In this embodiment, the moving devices 40A and 40B share an X-direction rail 45. The moving devices 40A and 40B can be moved independently by control using a control device 70.

[0047] In this embodiment, the handler 30 is equipped with two moving devices 40 (40A, 40B), but the number of moving devices 40 is not particularly limited to this, and the handler 30 may be equipped with three or more moving devices 40.

[0048] The DUT camera 50 (50A, 50B) is a camera that captures an image of the DUT 100 held by the moving device 40 (40A, 40B). The DUT camera 50 is provided on the upper base 31 of the handler 30 facing downward in the Z direction in the figure. The DUT camera 50 may be a camera equipped with an image pickup device such as a CCD or a CMOS. When the moving device 40A holding the DUT 100 is moved to below the DUT camera 50A by the moving mechanism 42, the DUT camera 50A can capture an image of the DUT 100. Similarly, when the moving device 40B holding the DUT 100 is moved to below the DUT camera 50B by the moving mechanism 42, the DUT camera 50B can capture an image of the DUT 100. The DUT camera 50 is electrically connected to the control device 70, and can output captured image information to the control device 70. The DUT camera 50 corresponds to an example of the "DUT camera" in the embodiment of the present invention.

[0049] The DUT camera 50 may detect the height of a predetermined position of the DUT 100 while capturing an image of the DUT 100. Specifically, when the DUT camera 50 captures an image of the DUT 100, the focus of the DUT camera 50 may be adjusted to the height of the predetermined position of the DUT 100, and the focal length when the focus is achieved may be calculated to detect the height. The height of the predetermined position of the DUT 100 detected by the DUT camera 50 can be output to the control device 70.

[0050] The DUT camera 50 may capture an image of the DUT 100 held by the thermal chuck 41 while the moving mechanism 42 is moving the thermal chuck 41 holding the DUT 100. That is, the DUT camera 50 may capture an image of the DUT 100 held by the thermal chuck 41 while the moving device 40 continues its moving operation without stopping the moving device 40. This makes it possible to prevent the probe card 20 from being damaged by vibrations that occur when the moving device 40 stops and starts.

[0051] The sensor unit 60 includes a first sensor 61 (61A, 61B) and a second sensor 62 (62A, 62B).

[0052] The first sensor 61 is a sensor that detects the height of a predetermined position of the probe head 22 of the probe card 20. A specific example of the first sensor 61 is not particularly limited, but may be, for example, a laser displacement meter. The first sensor 61 is capable of transmitting the detected height of the predetermined position of the probe head 22 to the control device 70. The first sensor 61A is provided on the first moving device 40A, and the first sensor 61B is provided on the second moving device 40B.

[0053] Here, specific examples of the predetermined positions of the probe head 22 detected by the contact camera 43 and the first sensor 61 include the four corners of the probe head 22. Note that the predetermined positions of the probe head 22 are not particularly limited to the above, so long as they are three or more mutually different positions on the probe head 22.

[0054] In this embodiment, the contact camera 43 and the first sensor 61 are provided separately, but this is not particularly limited, and the contact camera 43 and the first sensor 61 may be provided integrally.

[0055] The second sensor 62 (62A, 62B) is a sensor that detects the height of a predetermined position of the DUT 100 held by the thermal chuck 41. A specific example of the second sensor 62 is not particularly limited, but may be, for example, a laser displacement meter, similar to the above-mentioned first sensor 61. The second sensor 62 is also connected to the control device 70, similar to the above-mentioned first sensor 61, and is capable of transmitting the detected height of the predetermined position of the DUT 100 to the control device 70. The second sensor 62 is not particularly limited, but is provided on the upper base 31 of the handler 30. The second sensor 62A detects the height of a predetermined position of the DUT 100 held by the moving device 40A. The second sensor 62B detects the height of a predetermined position of the DUT 100 held by the moving device 40B.

[0056] Here, specific examples of the predetermined positions of the DUT 100 detected by the DUT camera 50 and the second sensor 62 include the four corners of the DUT 100. Note that the predetermined positions of the DUT 100 are not limited to the above, so long as they are three or more mutually different positions on the DUT 100.

[0057] In this embodiment, the DUT camera 50 and the second sensor 62 are provided separately, but this is not particularly limited, and the DUT camera 50 and the second sensor 62 may be provided integrally.

[0058] The control device 70 is configured, for example, by a computer equipped with a processor, and functionally includes an image processing unit 71, a calculation unit 72, a control unit 73, and a determination unit 74, as shown in Fig. 3. These functions are realized by the processor executing software installed in the computer constituting the control device 70. Note that the control device 70 may be configured by a circuit board instead of a computer.

[0059] The control device 70 is a device that controls various actuators equipped in the moving device 40, the parallelism adjustment device 80, and the height adjustment device 90. The control device 70 also has a function of performing image processing on image information acquired by the contact camera 43 and the DUT camera 50, and recognizing the relative positional relationship of the DUT 100 with respect to the probe card 20. The control device 70 also has a function of detecting the relative parallelism of the DUT 100 with respect to the probe card 20 and detecting the relative height of the DUT 100 with respect to the probe card 20 based on the detection result of the sensor unit 60. The control device 70 also has a function of determining whether the moving device 40 is pressing the DUT 100 against the probe card 20.

[0060] The image processing unit 71 detects the position and orientation of the probes 23 (see FIGS. 1 and 2) of the probe head 22 by performing image processing on the image information output from the contact camera 43. The image processing unit 71 also detects the position and orientation of the terminals 101 (see FIG. 2) of the DUT 100 by performing image processing on the image information output from the DUT camera 50. This allows the control device 70 to recognize the relative positional relationship of the DUT 100 with respect to the probe card 20.

[0061] The calculation section 72 calculates the amount of correction for the position of the DUT 100 relative to the probe head 22 based on the detection result of the image processing section 71 .

[0062] Specifically, the calculation unit 72 calculates the amount of relative deviation of the positions of the terminals 101 of the DUT 100 with respect to the positions of the probes 23 of the probe head 22 from the detection result of the image processing unit 71, and calculates a position correction amount to cancel this deviation amount. That is, the calculation unit 72 calculates the amount of position correction from the detection result of the image processing unit 71 to relatively match the positions of the probes 23 of the probe head 22 and the positions of the terminals 101 of the DUT 100.

[0063] Furthermore, the calculation section 72 detects the parallelism of the DUT 100 with respect to the probe head 22 based on the detection results of the first and second sensors 61, 62. The calculation section 72 corresponds to an example of the "calculation section" in an aspect of the present invention.

[0064] Specifically, the calculation unit 72 first obtains the height of a predetermined position of the probe head 22 from the contact camera 43 and the first sensor 61, and calculates the inclination of the probe head 22 from the height of the predetermined position of the probe head 22. The calculation unit 72 also obtains the height of a predetermined position of the DUT 100 from the DUT camera 50 and the second sensor 62, and calculates the inclination of the DUT 100 from the height of the predetermined position of the DUT 100. The calculation unit 72 then calculates the relative inclination (parallelism) of the DUT 100 with respect to the probe head 22 from the inclination of the probe head 22 and the inclination of the DUT 100, and further calculates the amount of inclination correction of the DUT 100 to cancel the relative inclination. Note that, as the height of the predetermined position of the probe head 22 used to calculate the inclination of the probe head 22, both the height detected by the contact camera 43 and the height detected by the first sensor 61 may be used, or only one of them may be used. In addition, as the height of the predetermined position of the DUT 100 used to calculate the tilt of the DUT 100, both the height detected by the DUT camera 50 and the height detected by the second sensor 62 may be used, or only one of them may be used.

[0065] Furthermore, the calculation section 72 detects the height of the DUT 100 with respect to the probe head 22 based on the detection results of the first and second sensors 61 and 62.

[0066] Specifically, the calculation unit 72 first obtains the height of the predetermined position of the probe head 22 from the contact camera 43 and the first sensor 61. After the parallelism adjustment device 80 corrects the tilt of the DUT 100 based on the tilt correction amount, the calculation unit 72 obtains the height of the predetermined position of the DUT 100 from the DUT camera 50 and the second sensor 62. Next, the calculation unit 72 calculates the relative height of the DUT 100 with respect to the probe head 22 from the height of the predetermined position of the probe head 22 and the height of the predetermined position of the DUT 100. Then, the calculation unit 72 calculates the difference between this relative height and a predetermined value, and calculates a height correction amount of the DUT 100 that cancels the difference. Note that, as the height of the predetermined position of the probe head 22 used to calculate the relative height of the DUT 100 with respect to the probe head 22, both the height detected by the contact camera 43 and the height detected by the first sensor 61 may be used, or only one of them may be used. Furthermore, as the height of the predetermined position of the DUT 100, both the height detected by the DUT camera 50 and the height detected by the second sensor 62 may be used, or only one of them may be used.

[0067] The control unit 73 controls the driving of the moving device 40 , the parallelism adjusting device 80 , and the height adjusting device 90 .

[0068] For example, the control unit 73 controls the driving of the moving device 40 based on the position correction amount calculated by the above-mentioned calculation unit 72. The control unit 73 also controls the driving of the parallelism adjustment device 80 based on the tilt correction amount calculated by the calculation unit 72. The control unit 73 also controls the driving of the height adjustment device 90 based on the height correction amount calculated by the calculation unit 72. Furthermore, the control unit 73 controls the driving of the moving device 40 to press the DUT 100 against the probe head 22.

[0069] Further, the control unit 73 controls the driving of the moving device 40 so that when one moving device 40A presses the DUT 100 against the probe card 20, the moving device 40A and the moving device 40B are driven so as to position the DUT 100 held by the other moving device 40B relative to the probe card 20. That is, as described later, when the determination unit 74 determines that the moving device 40A is pressing the DUT 100 against the probe card 20, the control unit 73 controls the driving of the moving device 40A and the moving device 40B so as to position the DUT 100 held by the other moving device 40B relative to the probe card 20. As a result, after the test of the DUT 100 held by the moving device 40A is completed and the moving device 40A is withdrawn from under the probe card 20, the DUT 100 held by the moving device 40B can be immediately pressed against the probe card 20 to perform the test without positioning the DUT 100 held by the moving device 40B. Therefore, by using the handler 30 equipped with the moving devices 40A and 40B, the throughput can be improved.

[0070] The determination unit 74 determines whether the moving device 40 is pressing the DUT 100 against the probe card 20, and transmits the determination result to the control unit 73. For example, the determination unit 74 determines that the moving device 40A is pressing the DUT 100 against the probe card 20 when the height of the DUT 100 is a predetermined height based on a signal indicating the height in the Z direction, such as a feedback signal from an encoder provided in a Z drive unit of the moving mechanism. Alternatively, the determination unit 74 may detect the height of the DUT 100 based on image information from the contact camera 43 of the moving device 40A, and determine that the moving device 40A is pressing the DUT 100 against the probe card 20 when the height of the DUT 100 is a predetermined height. Alternatively, the determination unit 74 may determine that the moving device 40 is pressing the DUT 100 against the probe card 20 when a signal indicating that the DUT 100 and the probe card 20 are electrically connected is received from the tester 10.

[0071] Further, the control unit 73 may adjust the movement operation of the other mobile device 40B according to the determination result of the determination unit 74 regarding one mobile device 40A. For example, when the mobile device 40A presses the DUT 100 against the probe card 20, compared with the case when the DUT 100 is not being pressed (normal time), the driving of the mobile device 40B may be controlled so that the magnitudes of the acceleration and deceleration of the mobile device 40B become smaller. Specifically, as shown in FIG. 4, during normal times, the magnitudes of the acceleration and deceleration of the mobile device 40B are a0, whereas during contact (when the first mobile device 40A presses the DUT 100 against the probe card 20), the magnitudes of the acceleration and deceleration of the mobile device 40B are set to a1, which is smaller than the above a0 (a1 < a0). FIG. 4 is a graph showing an example of a method for adjusting the movement operation of the second mobile device in the present embodiment.

[0072] When the mobile device 40A presses the DUT 100 against the probe card 20, if the mobile device 40B is driven with a large acceleration or deceleration, the mobile device 40B may vibrate greatly, and there is a risk that the probe card 20 may be damaged due to this vibration. On the other hand, by controlling to reduce the magnitudes of the acceleration and deceleration of the other mobile device 40 when the DUT 100 is being pressed, the vibration of the mobile device 40 can be suppressed, and the occurrence of damage to the probe card 20 can be inhibited.

[0073] In addition, when it is determined that the DUT 100 is being pressed against the probe card 20, the control device 70 may reduce the movement speed of the mobile device 40B, or may stop the mobile device 40B. Further, when the handler 30 includes three or more mobile devices 40, when one mobile device 40 presses the DUT 100 against the probe card 20, it is preferable to control so that the magnitudes of the acceleration and deceleration of all the other mobile devices 40 become smaller.

[0074] 1 and 5A to 5D, a method for pressing the DUT 100 against the probe card 20 by the above-mentioned handler 30 will be described below. Figures 5A to 5D are cross-sectional views showing a method for pressing the DUT 100 against the probe card 20 by the handler 30 in this embodiment.

[0075] 5A, the moving device 40A moves so that the thermal chuck 41 is positioned below the opening 33 of the upper base 31 of the handler 30. In this state, the transport device 35 of the handler 30 picks up the untested DUT 100 from the tray or plate, and transports the DUT 100 to the thermal chuck 41 of the moving device 40A through the opening 33.

[0076] A specific example of the transport device 35 is not particularly limited, but may be a pick-and-place device equipped with a suction pad. A specific example of the tray is not particularly limited, but may be a customer tray conforming to the Joint Electron Device Engineering Council (JEDEC) standard. An example of the plate is a buffer plate capable of holding the DUT 100. If the DUT 100 is a single die, the DUT 100 before testing may be held in a ring frame (wafer ring) instead of the tray or plate.

[0077] When the DUT 100 is placed on the thermal chuck 41 by the transfer device 35, the control device 70 drives the suction holding mechanism and temperature adjustment mechanism of the thermal chuck 41. As a result, the thermal chuck 41 suctions and holds the DUT 100 and adjusts the temperature of the DUT 100.

[0078] 5B, the moving device 40A moves so that the DUT 100 faces the DUT camera 50A held on the upper base 31 of the handler 30. Then, the DUT camera 50A captures an image of the DUT 100 held on the thermal chuck 41. The contact camera 43 attached to the moving device 40 captures an image of the probe head 22 of the probe card 20 in advance, and the image processing unit 71 of the control device 70 recognizes the relative positional relationship between the terminal 101 of the DUT 100 and the probe 23 of the probe card 20 based on the image information captured by the DUT camera 50A and the contact camera 43. The timing for capturing an image of the probe card 20 by the contact camera 43 is, for example, when the probe card 20 is replaced in response to a change in the type of the DUT 100.

[0079] At this time, the second sensor 62A detects the heights of the four corners of the DUT 100. The first sensor 61 attached to the moving device 40 detects the heights of the four corners of the probe card 20 in advance, and the calculation unit 72 of the control device 70 calculates the tilt correction amount of the DUT 100 from the detection results of the heights of the four corners of the DUT 100 and the heights of the four corners of the probe card 20. The timing at which the first sensor 61 captures the image of the probe card 20 is not particularly limited, but is the same as the timing at which the contact camera 43 captures the image of the probe card 20, for example, when the probe card 20 is replaced due to a change in the type of the DUT 100.

[0080] Next, the position of the thermal chuck 41 is finely adjusted by the moving mechanism 42 based on the relative positional relationship between the terminals 101 of the DUT 100 and the probes 23 of the probe card 20. Next, the parallelism adjusting device 80 is driven to tilt the DUT 100 by the tilt correction amount calculated by the calculation unit. This cancels the relative tilt of the DUT 100 with respect to the probe head 22, and the DUT 100 becomes parallel to the probe head 22.

[0081] Next, the second sensor 62A detects the heights of the four corners of the DUT 100 again, and the control device 70 calculates the height correction amount for the DUT 100 based on the heights of the four corners of the probe head 22 and the heights of the four corners of the DUT 100. Next, the height adjustment device 90 is driven to adjust the height of the DUT 100 by the height correction amount. This cancels the displacement in the height direction of the DUT 100 caused by the parallelism adjustment. This completes the positioning of the DUT 100 held by the moving device 40A with respect to the probe card 20.

[0082] Furthermore, as shown in FIG. 5B, while the DUT 100 held by the moving device 40A is being positioned, the transport device 35 transports the pre-test DUT 100 to the thermal chuck 41 of the moving device 40B.

[0083] 5C, the moving device 40A is moved so that the DUT 100 faces the probe head 22 of the probe card 20. The moving device 40A then raises the thermal chuck 41, pressing the DUT 100 against the probe card 20, and electrically connecting the DUT 100 and the probe card 20. At this time, the multiple terminals 101 of the DUT 100 and the multiple probes 23 of the probe card 20 are in contact with each other.

[0084] Next, the tester 10 inputs an electrical signal to the DUT 100 via the terminal 101. The tester 10 then judges the quality and characteristics of the DUT 100 based on the electrical signal output from the DUT 100 via the terminal 101 and the probe 23.

[0085] Here, while the moving device 40A is pressing the DUT 100 against the probe card 20, the moving device 40B is moved so that the DUT 100 held by the thermal chuck 41 of the moving device 40B faces the DUT camera 50B, and the DUT 100 held by the moving device 40B is positioned relatively to the probe card 20 in the same procedure as for the DUT 100 held by the moving device 40A. At this time, in the moving device 40B, the DUT camera 50 may image the DUT 100 held by the thermal chuck 41 while the moving mechanism 42 is moving the thermal chuck 41 holding the DUT 100.

[0086] 5D, after the test of the DUT 100 held by the moving device 40A is completed, the moving device 40A is withdrawn from below the probe card 20, and the moving device 40B is moved so that the DUT 100 held by the moving device 40B faces the probe head 22, and the DUT 100 is pressed against the probe head 22. Thereafter, the DUT 100 held by the moving device 40B is tested in a similar manner, and the quality and characteristics of the DUT 100 are judged.

[0087] As described above, in this embodiment, the handler 30 includes a plurality of moving devices 40 (40A, 40B), and when the moving device 40A presses the DUT 100 against the probe card 20, it determines the relative position of the DUT 100 held by the moving device 40B with respect to the probe card 20. As a result, after the test of the DUT 100 held by the moving device 40A is completed, the DUT 100 held by the moving device 40B can be immediately pressed against the probe card 20 and tested, thereby improving the throughput of the test of the DUT 100.

[0088] Furthermore, in this embodiment, the movement operation of one moving device 40B is adjusted depending on whether or not one moving device 40A is pressing the DUT 100 against the probe card 20. In particular, when the moving device 40A is pressing the DUT 100 against the probe card 20, the driving of the moving device 40B is controlled so that the magnitude of the acceleration and deceleration of the moving device 40B is smaller compared to when the DUT 100 is not being pressed (normal). This makes it possible to suppress vibration of the moving device 40B and prevent the probe card 20 from being damaged by vibration.

[0089] Furthermore, in this embodiment, the parallelism adjustment device 80 can cancel the relative tilt of the DUT 100 with respect to the probe card 20, so that the occurrence of contact errors between the probe card 20 and the DUT 100 can be suppressed. In particular, in a 2.5D device intermediate or a 3D device intermediate having a stacked structure, contact errors caused by tilt are more likely to occur than in a single bare die. Therefore, the occurrence of contact errors can be suppressed more significantly in a 2.5 device intermediate or a 3D device intermediate.

[0090] Furthermore, in this embodiment, the displacement of the DUT 100 in the height direction caused by the parallelism adjustment by the parallelism adjustment device 80 can be canceled by the height adjustment device 90. Therefore, the occurrence of contact errors between the probe card 20 and the DUT 100 can be further suppressed.

[0091] The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0092] For example, in the above embodiment, only one DUT 100 is tested at a time by the semiconductor device testing apparatus 1, but the number of DUTs 100 tested simultaneously by the semiconductor device testing apparatus 1 is not particularly limited to the above, and the semiconductor device testing apparatus 1 may test multiple DUTs 100 simultaneously. [Explanation of symbols]

[0093] 1...Semiconductor device testing equipment 10…Tester 11...Test head 12…Mainframe 20...Probe card 21...Wiring board 22…Probe head 23…Probe 30…Handler 31…Upper base 32,33…Aperture 34…Lower base 35...Transportation device 40,40A,40B…Movement device 41…Thermal chuck 42...Movement mechanism 43…Contact Camera 44...Support member 45…X-direction rail 46…Y-direction rail 47…Z drive section 50, 50A, 50B…DUT camera 60...Sensor unit 61, 61A, 61B...First sensor 62, 62A, 62B...Second sensor 70...Control device 71...Image processing unit 72...Arithmetic section 73...Control section 74…Judgment department 80…Parallelism adjustment device 81…First adjustment part 82…Second adjustment part 83...First actuator 84…Second actuator 90…Height adjustment device 91...Actuator 100...Semiconductor device (DUT) 101...Terminal

Claims

1. A semiconductor device handling apparatus that moves a DUT and presses the DUT against a contact portion, comprising: a plurality of moving devices including first and second moving devices each moving the DUT relatively to the contact portion; A control device that controls a plurality of the moving devices, the control device controls the first and second moving devices so as to position another of the DUTs held by the second moving device relative to the contact portion when the first moving device is pressing the DUT against the contact portion; The DUT includes: Bare die only, A 2.5D device intermediate in which multiple bare dies are arranged side-by-side on a silicon interposer; or A semiconductor device handling device that is a 3D device intermediate having multiple bare dies stacked on top of each other.

2. 2. The semiconductor device handling apparatus of claim 1, The control device adjusts the movement operation of the second movement device based on whether the first movement device is pressing the DUT against the contact portion.

3. 3. The semiconductor device handling apparatus according to claim 1, The control device controls the second moving device so that the magnitude of acceleration / deceleration of the second moving device is smaller when the first moving device is pressing the DUT against the contact portion compared to when the first moving device is not pressing the DUT against the contact portion.

4. 3. The semiconductor device handling apparatus according to claim 1, the semiconductor device handling apparatus includes a plurality of DUT cameras for photographing the DUTs held by the plurality of moving apparatuses, Each of the plurality of mobile devices is A holding unit that holds the DUT; A moving mechanism that moves the holding unit; A contact camera that captures an image of the contact portion, The control device detects a relative position of the DUT with respect to the contact portion based on image information captured by the DUT camera and the contact camera, The moving device is a semiconductor device handling device that positions the DUT with respect to the contact portion based on the relative position.

5. 5. The semiconductor device handling apparatus according to claim 4, The DUT camera photographs the DUT held by the holder while the moving mechanism moves the holder that holds the DUT.

6. 3. The semiconductor device handling apparatus according to claim 1, Each of the plurality of mobile devices is A holding unit that holds the DUT; A moving mechanism that moves the holding part, The holding unit is provided with a parallelism adjustment device for adjusting the parallelism of the DUT with respect to the contact unit.

7. 7. The semiconductor device handling apparatus according to claim 6, The parallelism adjustment device is a first tilt adjustment unit that tilts the DUT about a first axis; a second tilt adjustment unit that tilts the DUT about a second axis, the first axis is an axis substantially parallel to a planar direction of the contact portion, A semiconductor device handling apparatus, wherein the second axis is substantially parallel to a planar direction of the contact portion and is an axis substantially perpendicular to the first axis when the second axis is projected onto a normal direction of the contact portion.

8. 7. The semiconductor device handling apparatus according to claim 6, the semiconductor device handling apparatus includes a parallelism detection device for detecting parallelism of the DUT with respect to the contact portion, The control device of the semiconductor device handling apparatus controls the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

9. 9. A semiconductor device handling apparatus according to claim 8, comprising: The parallelism detection device includes: a first sensor that detects a height of a predetermined position on the contact portion; a second sensor for detecting a height of a predetermined position on the DUT; a calculation unit that calculates a parallelism of the DUT with respect to the contact portion based on detection results of the first and second sensors, The control device controls the parallelism detection device based on the parallelism calculated by the calculation unit.

10. 10. The semiconductor device handling apparatus of claim 9, the holding unit includes a height adjustment device for adjusting a height of the DUT relative to the contact unit, The control device of the die handling apparatus controls the height adjustment device based on detection results of the first and second sensors.

11. A semiconductor device test apparatus for testing a DUT, comprising: A semiconductor device handling apparatus according to claim 1 or 2, a tester to which the contact portion is electrically connected.

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