Semiconductor device handling device and semiconductor device testing device

Abstract

To provide a semiconductor device handling device for testing a semiconductor device including an electronic circuit and an optical circuit.SOLUTION: A semiconductor device handling device 30 moves a DUT 100 to bring a terminal 111 arranged on a top face 101 of the DUT 100 into contact with a probe card 20 comprises: a thermal chuck 40 holding a bottom face 102 of the DUT 100; and a photoprobe 51 inputting and outputting an optical signal to and from an optical connection part 121 arranged on the bottom face 102 of the DUT 100.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a semiconductor device handling apparatus that handles a semiconductor device under test (DUT) having an electronic circuit and an optical circuit in order to test the DUT, and a semiconductor device testing apparatus that tests the DUT. [Background technology]

[0002] 2. Description of the Related Art There is known an electronic device test apparatus that tests an electronic device by positioning the electronic device relative to a probe card using an alignment unit and then pressing the electronic device against the probe card (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-85203 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above electronic device test apparatus has a problem in that it is designed to test only electronic devices and cannot test semiconductor devices that include optical circuits in addition to electronic circuits.

[0005] An object of the present invention is to provide a semiconductor device handling apparatus and a semiconductor device testing apparatus for testing a semiconductor device having an electronic circuit and an optical circuit. [Means for solving the problem]

[0006] [1] A first aspect of the present invention is a semiconductor device handling device that moves a DUT to bring terminals arranged on a first surface of the DUT into contact with contact portions, the semiconductor device handling device comprising: a holding portion that holds a second surface of the DUT; and an optical probe that inputs and outputs optical signals to and from an optical connection portion arranged on the second surface of the DUT.

[0007] [2] A second aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, comprising: a first moving device that positions the terminal of the DUT relative to the contact portion by moving the holding portion relative to the contact portion; and a second moving device that positions the optical probe relative to the optical connection portion of the DUT by moving the optical probe relative to the DUT held in the holding portion.

[0008] [3] A third aspect of the present invention may be a semiconductor device handling device according to the second aspect, wherein the first moving device is arranged on the opposite side of the holding part from the DUT, and the second moving device is arranged on the opposite side of the optical probe from the DUT.

[0009] [4] A fourth aspect of the present invention may be a semiconductor device handling apparatus according to the second or third aspect, wherein the first moving device moves the holding portion and the second moving device relative to the contact portion.

[0010] [5] A fifth aspect of the present invention may be a semiconductor device handling apparatus according to any one of the second to fourth aspects, wherein the first moving device includes a support member to which the holding portion is fixed, and the second moving device is fixed to the support member and moves the optical probe relative to the holding portion.

[0011] [6] A sixth aspect of the present invention may be a semiconductor device handling device according to any one of the second to fifth aspects, wherein the holding portion includes a contact surface that contacts the second surface of the DUT, and a recess that opens into the contact surface and into which the optical probe can be inserted, and the recess has a size that allows the optical probe to move relative to the holding portion.

[0012] [7] A seventh aspect of the present invention may be a semiconductor device handling device according to the fifth aspect, wherein the holding portion has a contact surface that contacts the second surface of the DUT and an insertion hole that opens into the contact surface, and the optical probe is inserted into the insertion hole so as to be movable relative to the holding portion.

[0013] [8] Aspect 8 of the present invention may be a semiconductor device handling apparatus according to any one of aspects 2, 3, and 6, wherein the first moving device is fixed to a base of the semiconductor device handling apparatus, and the second moving device is fixed to the base independently of the first moving device.

[0014] [9] A ninth aspect of the present invention may be the semiconductor device handling apparatus of any one of the first to eighth aspects, wherein the optical probe is provided with an optical transmission line capable of transmitting an optical signal.

[0015]

[10] A tenth aspect of the present invention may be a semiconductor device handling device according to any one of aspects 1 to 9, wherein the holding portion includes a contact surface that contacts the second surface of the DUT, and a temperature adjustment mechanism that adjusts the temperature of the DUT via the contact surface.

[0016]

[11] An eleventh aspect of the present invention may be a semiconductor device handling device according to any one of the first to tenth aspects, wherein the holding portion includes a contact surface that contacts the second surface of the DUT, and an adsorption holding mechanism that opens into the contact surface and holds the DUT by suction.

[0017]

[12] A twelfth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 11, comprising a first moving device that moves the holding portion relative to the contact portion to press the DUT held by the holding portion against the contact portion, thereby bringing the terminals of the DUT into contact with the contact portion.

[0018]

[13] A thirteenth aspect of the present invention may be a semiconductor device handling apparatus according to any one of the first to twelfth aspects, wherein the DUT is a semiconductor device handling apparatus including a die having the optical connection portion.

[0019]

[14] A fourteenth aspect of the present invention may be a semiconductor device handling apparatus according to the thirteenth aspect, wherein the DUT has the terminal and is provided with a substrate on which the die is mounted.

[0020]

[15] A fifteenth aspect of the present invention may be the semiconductor device handling apparatus of any one of the first to fourteenth aspects, wherein the optical connecting portion includes a grating coupler.

[0021]

[16] A sixteenth aspect of the present invention may be a semiconductor device handling device according to any one of aspects 1 to 15, wherein the contact portion is a probe card having a contactor that contacts the terminal of the DUT.

[0022]

[17] A seventeenth aspect of the present invention is a semiconductor device testing apparatus for testing a DUT, comprising: a contact portion for inputting and outputting an electrical signal to a terminal arranged on a first surface of the DUT; an optical probe for inputting and outputting an optical signal to an optical connection portion arranged on a second surface of the DUT; and a test apparatus connected to the contact portion so as to be capable of transmitting the electrical signal, and connected to the optical probe so as to be capable of transmitting the optical signal.

[0023]

[18] An eighteenth aspect of the present invention may be the semiconductor device testing apparatus of the seventeenth aspect, further comprising the electronic device handling apparatus of any one of the first to sixteenth aspects. Effect of the Invention

[0024] In the present invention, an optical signal can be input / output to / from an optical connection part arranged on the second surface of the DUT by using an optical probe, so that a semiconductor device handling device and a semiconductor device testing device can be provided for testing a semiconductor device having an electronic circuit and an optical circuit. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus and the internal structure of a handler in an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view of a thermal chuck and an optical probe unit according to an embodiment of the present invention, and a block diagram showing a control system. [Diagram 3] FIG. 3 is a plan view of a thermal chuck in an embodiment of the present invention. [Figure 4] 4(a) and 4(b) are a cross-sectional view and a plan view showing a modified example of the thermal chuck and the optical probe unit in the embodiment of the present invention. [Diagram 5] 5(a) to 5(c) are cross-sectional views showing a method of pressing a DUT against a probe card by a handler in an embodiment of the present invention. [Figure 6]FIG. 6 is a diagram showing a part of the internal structure of a handler according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0027] Fig. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus 1 and the internal structure of a handler 30 in this embodiment. Fig. 2 is a cross-sectional view of a thermal chuck 40 and an optical probe unit 50 in this embodiment, and a block diagram showing a control system. Fig. 3 is a plan view of the thermal chuck 40 in this embodiment. For ease of understanding, the DUT 100 is shown separated from the thermal chuck 40 in Fig. 2, but in reality, the DUT 100 is held by the thermal chuck 40 and therefore is in contact with the thermal chuck 40.

[0028] The semiconductor device testing apparatus 1 in this embodiment is an apparatus for testing a semiconductor device 100. As shown in Fig. 1, the semiconductor device testing apparatus 1 includes a tester 10, a probe card 20, and a handler 30. The handler 30 corresponds to an example of a "semiconductor device handling apparatus" in an aspect of the present invention.

[0029] The DUT 100, which is the test target of the semiconductor device test apparatus 1, is a semiconductor device capable of handling electrical signals and optical signals. In other words, the DUT 100 is a composite circuit device equipped with an electronic circuit and an optical circuit.

[0030] Specifically, as shown in FIG. 2, the DUT 100 includes a substrate 110 and a die 120. Although not limited thereto, a specific example of the substrate 110 may be a wiring board such as an interposer. The substrate 110 includes a terminal 111 for inputting and outputting an electric signal. The die 120 is a bare die (bare chip) formed by dicing a semiconductor wafer, and is mounted on the substrate 110. The die 120 includes an optical connection section 121 for inputting and outputting an optical signal. An optical circuit including the optical connection section 121 is formed on the die 120 using, for example, silicon photonics technology. Although not limited thereto, a specific example of the optical connection section 121 may be a grating coupler. The terminal 111 is disposed on the upper surface 101 of the DUT 100, whereas the optical connection section 121 is disposed on the lower surface 102 of the DUT 100.

[0031] The DUT 100 to be tested by the semiconductor device test apparatus 1 of the present embodiment may be a bare die including the terminals 111 and the optical connection portion 121. In other words, the DUT 100 to be tested may be a single die before being mounted on a board.

[0032] When testing the DUT 100, electrical signals are input to and output from the DUT 100 via the terminal 111, and optical signals are input to and output from the DUT 100 via the optical connection unit 121. For example, when this test is completed, an optical fiber connected to an optical connector is connected to the optical connection unit 121 to become a final product. This final product is, for example, a CPO (Co-Packaged Optics) device.

[0033] The tester 10 is a testing apparatus that tests a semiconductor device 100 using electrical signals and optical signals, and includes a test head 11 and a main frame (tester body) 12, as shown in Fig. 1. The test head 11 is connected to the main frame 12 via a cable. A probe card 20 is electrically connected to the test head 11. The probe card 20 enters the inside of the handler 30 through an opening 32 formed in an upper base 31 of the handler 30.

[0034] Probe card 20 includes wiring board 21 and probe head 22 mounted on wiring board 21. As shown in Fig. 2, probe head 22 includes a plurality of probes 23 and a housing 24. Probe card 20 corresponds to an example of a "contact portion" in an aspect of the present invention, and probe 23 corresponds to an example of a "contactor" in an aspect of the present invention.

[0035] The probe 23 is an electric probe that comes into contact with the terminal 111 of the DUT 100. The multiple probes 23 are arranged to correspond to the multiple terminals 111 of the DUT 100. Although not particularly limited, specific examples of the probe 23 include a pogo pin, a vertical probe needle, a cantilever probe needle, an anisotropic conductive rubber sheet, a bump on a membrane, or a contactor manufactured using MEMS technology.

[0036] Probe 23 is held in housing 24, and housing 24 is fixed to wiring board 21 by screws or the like, thereby mounting probe head 22 on wiring board 21. Note that wiring board 21 may directly hold probe 23, in which case housing 24 can be omitted.

[0037] 1 and 2, the handler 30 includes a thermal chuck 40, an optical probe unit 50, a first moving device 60, and a control device 70. The thermal chuck 40 corresponds to an example of a "holding unit" in an aspect of the present invention.

[0038] The thermal chuck 40 includes a suction holding mechanism that suction-holds the DUT 100, and a temperature adjustment mechanism that adjusts the temperature of the DUT 100. Specifically, as shown in FIG. 2, the thermal chuck 40 includes a holding member 41, a heater 42, a cooling flow path 43, a suction flow path 44, and a temperature sensor 45.

[0039] The holding member 41 is a block-shaped member having a flat contact surface 411 that contacts the lower surface 102 of the DUT 100. The heater 42 is embedded in the holding member 41. The heater 42 is provided inside the holding member 41 so as to cover the entire area of ​​the contact surface 411. Although not particularly limited, specific examples of the heater 42 include, for example, an aluminum nitride heater, a silicon nitride heater, and a ceramic heater such as a PTC heater, a polyimide heater, and a cartridge heater. The heater 42 is connected to the control device 70, generates heat by power supplied from the control device 70, and heats the DUT 100 via the contact surface 411.

[0040] In addition, two types of flow paths 43 and 44 are formed inside the holding member 41. The cooling flow path 43 is provided inside the holding member 41 so as to correspond to the entire area of ​​the contact surface 411, similar to the heater 42 described above. A coolant supply device 46 is connected to the cooling flow path 43, and a coolant having a temperature lower than room temperature is supplied from the coolant supply device 46 to the cooling flow path 43. The coolant passes through the cooling flow path 43, thereby cooling the DUT 100 via the contact surface 411. The coolant flowing through the cooling flow path 43 may be a liquid or a gas. Although not particularly limited, examples of the liquid coolant include water and a fluorine-based inert liquid. On the other hand, examples of the gas coolant include air and nitrogen.

[0041] The configuration of the temperature adjustment device that adjusts the temperature of the DUT 100 is not particularly limited to the above. Although not particularly shown, for example, a planar heater may be exposed from the upper surface of the holding member 41 and directly contact the DUT 100, in which case the upper surface of the heater forms the contact surface of the thermal head. Alternatively, instead of a heater, a hot medium at a temperature higher than room temperature may be passed through a flow path in the holding member 41. Alternatively, a Peltier element may be used as the heater, or a Peltier element may be used instead of the coolant. Also, the holding member 41 may not have either a heating device or a cooling device.

[0042] On the other hand, the suction flow path 44 is formed in the holding member 41 so that one end of the suction flow path 44 opens at the contact surface 411. The other end of the suction flow path 44 is connected to a pressure reducing device 47, and the DUT 100 is held by suction on the holding member 41 by sucking the suction flow path 44 with the DUT 100 placed on the contact surface 411 of the holding member 41. A specific example of the pressure reducing device 47 is a vacuum pump.

[0043] The temperature sensor 45 is also embedded in the holding member 41. The temperature sensor 45 is provided inside the holding member 41 so as to be located in the vicinity of the contact surface 411. This temperature sensor 45 detects the temperature of the DUT 100 via the contact surface 411. The temperature sensor 45 is connected to the control device 70 so as to be able to output the detection result.

[0044] 2 and 3, the optical probe unit 50 includes an optical probe 51 and a second moving device 54. The optical probe 51 is an optical input / output unit for inputting and outputting an optical signal to and from an optical connection unit 121 formed on the lower surface 102 of the DUT 100. The optical probe 51 includes optical fibers 52a and 52b and a mirror 53.

[0045] The optical fibers 52a and 52b are arranged so that their optical axes are aligned along the XY plane in the figure, and the pair of optical fibers 52a and 52b are arranged substantially parallel to each other. The optical fibers 52a and 52b are connected to the tester 10 so as to be capable of transmitting optical signals. The mirror 53 is arranged on the optical axes of the optical fibers 52a and 52b.

[0046] When testing the DUT 100, with the tip of the optical probe 51 facing the optical connection section 121 of the DUT 100, an optical signal input from the tester 10 is output from one optical fiber 52a toward the mirror 53, and the optical signal is reflected by the mirror 53 and input to the optical connection section 121 of the DUT 100. On the other hand, an optical signal output from the optical connection section 121 of the DUT 100 is reflected by the mirror 53 and input to the tester 10 via the other optical fiber 52b. That is, in this embodiment, one optical fiber 52a functions as an optical transmission path for input, and the other optical fiber 52b functions as an optical transmission path for output.

[0047] In this embodiment, the optical probe 51 inputs and outputs an optical signal in a non-contact state with the optical connection unit 121 of the DUT 100, but the optical probe 51 may be in contact with the optical connection unit 121. The optical probe 51 may also include optical elements other than the optical fibers 52a and 52b and the mirror 53 as an optical transmission path for transmitting an optical signal.

[0048] The optical probe 51 is supported by a second moving device 54. The second moving device 54 is an alignment device that positions the optical probe 51 with respect to the optical connection portion 121 of the DUT 100. The second moving device 54 is capable of moving the optical probe 51 in the X-axis and Y-axis directions in the figure, and rotating it around the Z-axis (θz). Note that the second moving device 54 may have six degrees of freedom including movement in the Z-axis direction and rotation around the X-axis and Y-axis (θx and θy) in addition to the above three degrees of freedom.

[0049] Although not particularly limited, the second moving device 54 includes, for example, an actuator, a transmission mechanism, and a guide mechanism. Although not particularly limited, a specific example of the actuator can be, for example, a motor including an electric motor (a rotary motor, a linear motor, etc.), or an electric actuator including the electric motor and a piezoelectric actuator (an actuator using a piezoelectric element), etc., while a specific example of the transmission mechanism can be, for example, a ball screw mechanism, and an example of the guide mechanism can be, for example, a linear guide mechanism including a guide rail and a block that can slide on the guide rail.

[0050] The first moving device 60 is a device that moves the thermal chuck 40 and the optical probe unit 50. As shown in Fig. 1, the first moving device 60 includes a support member 61 and a moving mechanism 62 that moves the support member 61. The first moving device 60 aligns the DUT 100 with respect to the probe card 20 so that the multiple terminals 111 of the DUT 100 face the multiple probes 23 of the probe head 22, respectively.

[0051] The thermal chuck 40 and the optical probe unit 50 are supported by a flat support member 61. Specifically, as shown in FIG. 2 and FIG. 3, the holding member 41 of the thermal chuck 40 and the second moving device 54 of the optical probe unit 50 are fixed to the support member 61. Therefore, the second moving device 54 can move the optical probe 51 relative to the thermal chuck 40. That is, the second moving device 54 can move the optical probe 51 relative to the optical connection portion 121 of the DUT 100 that is attracted and held by the thermal chuck 40. Therefore, in this embodiment, the alignment of the optical probe 51 with respect to the optical connection portion 121 can be performed independently of the alignment of the terminal 111 of the DUT 100 with respect to the electric probe 23 of the probe card 20.

[0052] A groove 412 is formed in the holding member 41 of the thermal chuck 40. This groove 412 is formed in the holding member 41 so that the groove 412 opens to a contact surface 411 that contacts the DUT 100, and the optical probe 51 is inserted into this groove 412. Note that a space is provided between the optical probe 51 and the groove 412 so that the optical probe 51 can be moved and rotated by the second moving device 54 described above.

[0053] In this manner, by overlapping the holding member 41 and the optical probe 51, the contact area of ​​the thermal chuck 40 with the DUT 100 can be increased while the optical probe 51 faces the optical connection portion 121 of the DUT 100. This allows the thermal chuck 40 to efficiently adjust the temperature of the DUT 100 and stably press the DUT 100 against the probe card 20. The groove 412 corresponds to an example of a "recess" in an aspect of the present invention.

[0054] The moving mechanism 62 is capable of moving the support member 61 in the X, Y and Z axis directions in the figure and rotating it around the Z axis (θz). The moving mechanism 62 is equipped with an X drive section including an X direction rail 63, a Y drive section including a Y direction rail 64, and a Z drive section 65.

[0055] As shown in FIG. 1, the X-direction rail 63 is provided on the lower base 34 of the handler 30 and extends along the X-direction. The Y-direction rail 64 is slidably held on the X-direction rail 63 and can move along the X-direction. The Z-drive unit 65 is slidably held on the Y-direction rail 64 and can move along the Y-direction. The above-mentioned support member 61 is attached to the Z-drive unit 65. The Z-drive unit 65 can raise and lower the support member 61 and rotate the support member 61 around the Z-axis. As a result, the thermal chuck 40 and the optical probe unit 50 supported by the support member 61 can be moved in the X, Y, and Z directions by the moving mechanism 62 and can be rotated around the Z-axis.

[0056] Although not limited thereto, the X drive unit, the Y drive unit, and the Z drive unit 65 of the moving mechanism 62 include, for example, an actuator, a transmission mechanism, and a guide mechanism. Although not limited thereto, a specific example of the actuator can be, for example, a motor including an electric motor (a rotary motor, a linear motor, or the like) or an electric actuator including the electric motor or the like, while a specific example of the transmission mechanism can be, for example, a ball screw mechanism, and an example of the guide mechanism can be, for example, a linear guide mechanism including a guide rail and a block that can slide on the guide rail.

[0057] The configuration of the thermal chuck and the optical probe unit is not particularly limited to the above. For example, the thermal head and the optical probe unit may be configured as shown in Fig. 4(a) and Fig. 4(b). Fig. 4(a) and Fig. 4(b) are a cross-sectional view and a plan view showing a modified example of the thermal head and the optical probe unit in this embodiment. Fig. 4(a) is a cross-sectional view taken along the line IVA-IVA in Fig. 4(b).

[0058] In the thermal chuck 40B and the optical probe unit 50B shown in FIG. 4(a) and FIG. 4(b), an insertion hole 413 is formed in the holding member 41 along the Z-axis direction so as to open to the contact surface 411, and the optical probe 51 is inserted into the insertion hole 413. In this modification, the optical probe 51 does not include a mirror 53 because the optical axes of the optical fibers 52a and 52b are arranged along the Z-axis direction in the figure. Note that a space is secured between the optical probe 51 and the insertion hole 413 so that the optical probe 51 can be moved and rotated by the second moving device 54. In this way, by arranging the optical probe 51 in the insertion hole 413 formed in the holding member 41, the contact area of ​​the thermal chuck 40 with the DUT 100 can be increased while the optical probe 51 faces the optical connection portion 121 of the DUT 100.

[0059] The control device 70 is configured, for example, by a computer. Although not particularly shown, this computer is an electronic calculator equipped with a CPU (processor), a main memory device (RAM, etc.), an auxiliary memory device (hard disk, SSD, etc.), and an interface, etc. The control described below is functionally realized, for example, by the control device 70 executing a program. Note that the control device 70 may be configured by a circuit board instead of a computer.

[0060] 2, the control device 70 is electrically connected to the heater 42, the temperature sensor 45, and the coolant supply device 46. The control device 70 adjusts the temperature of the DUT 100 via the holding member 41 by controlling the heater 42 and the coolant supply device 46 based on the detection result of the temperature sensor 45. Note that the control device 70 may control the heater 42 and the coolant supply device 46 based on the output of a temperature detection circuit included in the DUT 100, instead of the temperature sensor 45. Although not particularly limited, a specific example of the temperature detection circuit may be a circuit including a thermal diode included in the DUT 100.

[0061] The control device 70 is electrically connected to the pressure reducing device 47. The control device 70 controls the pressure reducing device 47, so that the thermal chuck 40 sucks and holds the DUT 100 or releases the DUT 100. The control device 70 is connected to the tester 10 so as to be capable of transmitting electrical signals. The tester 10 has a function of testing the electronic circuit of the DUT 100 and a function of testing the optical circuit of the DUT 100, and is connected to the optical fibers 52a and 52b of the optical probe 51 so as to be capable of transmitting optical signals. The function of testing the optical circuit of the DUT 100 includes a function of measuring the light source and the intensity of light. The control device 70 is connected to the first and second moving devices 60 and 54 so as to be capable of outputting control signals, and is capable of controlling the operations of the moving devices 60 and 54. Note that the tester 10 does not necessarily have to have the function of testing the optical circuit of the DUT 100. In this case, an external measuring instrument having the function of testing the optical circuit of the DUT 100 is connected to the optical fibers 52a and 52b of the optical probe 51 so as to be capable of transmitting optical signals. This external measuring instrument is a test device independent of the tester 10, and is electrically connected to the tester 10, for example.

[0062] 1 and 5(a) to 5(c), a method for pressing the DUT 100 against the probe card 20 by the above-mentioned handler 30 will be described below. Figures 5(a) to 5(c) are cross-sectional views showing a method for pressing the DUT 100 against the probe card 20 by the handler 30 in this embodiment.

[0063] 1, the first moving device 60 moves the thermal chuck 40 and the optical probe unit 50 so that the thermal chuck 40 is positioned below the opening 33 of the upper base 31 of the handler 30. In this state, the transport device 81 provided in the handler 30 picks up the untested DUT 100 from the tray or plate and transports the DUT 100 to the thermal chuck 40 through the opening 33.

[0064] A specific example of the transport device 81 is not particularly limited, but may be a pick-and-place device equipped with a suction pad. A specific example of the tray is not particularly limited, but may be a customer tray conforming to the Joint Electron Device Engineering Council (JEDEC) standard. An example of the plate is a buffer plate capable of holding the DUT 100. If the DUT 100 is a single die, the DUT 100 before testing may be held in a ring frame (wafer ring) instead of the tray or plate.

[0065] 5(a), when the DUT 100 is placed on the contact surface 411 by the transport device 81, the control device 70 drives the pressure reducing device 47, and the thermal chuck 40 adsorbs and holds the DUT 100. In addition, when the DUT 100 is placed on the contact surface 411, the control device 70 starts controlling the heater 42 and the coolant supply device 46 to adjust the temperature of the DUT 100.

[0066] 1, the first moving device 60 moves the thermal chuck 40 and the optical probe unit 50 so that the DUT 100 faces the camera 82 held on the upper base 31 of the handler 30. The camera 82 then captures an image of the DUT 100 held on the thermal chuck 40. The camera 83 attached to the support member 61 of the first moving device 60 captures an image of the probe head 22 of the probe card 20 in advance, and the image processing function of the control device 70 recognizes the relative positional relationship between the terminal 111 of the DUT 100 and the probe 23 of the probe card 20 based on the images captured by the cameras 82 and 83. The timing for capturing an image of the probe card 20 by the camera 83 is, for example, when the probe card is replaced in response to a change in the type of the DUT 100.

[0067] 1, the first moving device 60 moves the thermal chuck 40 and the optical probe unit 50 so that the DUT 100 faces the probe head 22 of the probe card 20. During this movement, the camera 83 may capture an image of the probe head 22 of the probe card 20.

[0068] 5(b), the position of the thermal chuck 40 is finely adjusted by the first moving device 60 based on the relative positional relationship between the terminals 111 of the DUT 100 and the probes 23 of the probe card 20 recognized by the cameras 82 and 83. As a result, the multiple terminals 111 of the DUT 100 face the multiple probes 23 of the probe head 22, respectively, and the DUT 100 is positioned with respect to the probe card 20.

[0069] 5(c), the first moving device 60 raises the thermal chuck 40 and the optical probe unit 50, and presses the DUT 100 against the probe card 20 to electrically connect them. In this state, the multiple terminals 111 of the DUT 100 and the multiple probes 23 of the probe card 20 are in contact with each other.

[0070] Next, the second moving device 54 finely adjusts the position of the optical probe 51 to position the tip of the optical probe 51 with respect to the optical connection part 121 of the DUT 100. Although not particularly limited, the positional relationship between the optical probe 51 and the optical connection part 121 is recognized based on the intensity of the light output from the optical connection part 121, for example.

[0071] Specifically, light output from a light source included in the tester 10 is irradiated from one optical fiber 52a of the optical probe 51 toward the bottom surface 102 of the DUT 100 including the optical connection portion 121. Then, the light output from the optical connection portion 121 via a loopback circuit incorporated in the optical circuit of the DUT 100 is acquired by the other optical fiber 52b. While performing this operation, the second moving device 54 causes the optical probe 51 to scan along the bottom surface 102 of the DUT 100. Then, the tester 10 measures the intensity of the light output from the optical connection portion 121, and the control device 70 stops the movement of the optical probe 51 at a position where the intensity of the light becomes equal to or greater than a predetermined value, thereby positioning the optical probe 51 relative to the optical connection portion 121.

[0072] Incidentally, like the above-mentioned relative positional relationship between the terminal 111 of the DUT 100 and the probe 23 of the probe card 20, the relative positional relationship between the optical probe 51 and the optical connection part 121 may be recognized by a camera and image processing. In this case, for example, the DUT 100 held by the transport device 81 is imaged from below by a camera, and the optical probe 51 is imaged from above by another camera before the DUT 100 is placed on the thermal chuck 40, and based on these images, the relative positional relationship between the optical probe 51 and the optical connection part 121 is recognized by the image processing function of the control device 70. Alternatively, the positioning of the optical probe 51 with respect to the optical connection part 121 may be performed by rough positioning using image processing, and then precise positioning using light intensity.

[0073] Note that, once the DUT 100 is placed on the contact surface 411 by the transport device 81 and the thermal chuck 40 adsorbs and holds the DUT 100 (as shown by the dashed line in FIG. 1), the optical probe 51 may be positioned relative to the optical connection section 121. That is, the optical probe 51 may be positioned relative to the optical connection section 121 before the DUT 100 and the probe card 20 are electrically connected.

[0074] Next, the tester 10 inputs an electrical signal to the DUT 100 via the electrical probe 23 and the terminal 111, and also inputs an optical signal to the DUT 100 via the optical probe 51 and the optical connection unit 121. The tester 10 then judges the quality and characteristics of the DUT 100 based on the electrical signal output from the DUT 100 via the terminal 111 and the electrical probe 23, and the optical signal output from the DUT 100 via the optical connection unit 121 and the optical probe 51.

[0075] As described above, in this embodiment, the optical probe 51 can input and output optical signals to and from the optical connection section 121 arranged on the lower surface 102 of the DUT 100, making it possible to test the semiconductor device 100 that includes an electronic circuit and an optical circuit. In particular, in this embodiment, it becomes possible to test the DUT 100 that has the terminal 111 arranged on one surface 101 of the DUT 100 and the optical connection section 121 arranged on the other surface 102 of the DUT 100.

[0076] Furthermore, in this embodiment, the handler 30 includes the second moving device 54 that moves the optical probe 51 independently of the first moving device 60, so that the optical probe 51 can be positioned relative to the optical connection portion 121 of the DUT 100 while the DUT 100 is held by suction to the thermal chuck 40. Even if the positioning accuracy of the optical probe 51 relative to the optical connection portion 121 is higher than the positioning accuracy of the electric probe 23 relative to the terminal 111, the optical probe 51 can be positioned with high accuracy relative to the optical connection portion 121 by the second moving device 54.

[0077] The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0078] For example, in the above embodiment, only one DUT 100 is tested at a time by the semiconductor device testing apparatus 1, but the number of DUTs 100 tested simultaneously by the semiconductor device testing apparatus 1 is not particularly limited to the above, and the semiconductor device testing apparatus 1 may test multiple DUTs 100 simultaneously.

[0079] In addition, in the above-described embodiment, the optical probe unit 50 is supported by the support member 61 of the first moving device 60, and the first moving device 60 moves the optical probe unit 50 together with the thermal chuck 40, but the first moving device 60 does not have to move the optical probe unit 50.

[0080] Fig. 6 is a diagram showing a part of the internal structure of a handler in another embodiment of the present invention. As shown in Fig. 6, a support member 35 independent of the first moving device 60 may be fixed to the lower base 34 of the handler 30, and the optical probe unit 50 may be supported (fixed) by this support member 35 instead of the support member 61 of the first moving device 60. This can reduce the length and movement of the optical fibers 52a, 52b, facilitate routing of the optical fibers 52a, 52b in the handler 30, and reduce the impact on the optical characteristics and lifespan of the optical fibers 52a, 52b. Even if the handler 40 includes a plurality of first moving devices 60, one optical probe unit 50 can be used.

[0081] 6, the optical probe 51 is inserted into the groove 412 of the holding member 41 of the thermal chuck 40 with the multiple terminals 111 of the DUT 100 positioned and in contact with the multiple probes 23 of the probe head 22. For example, the movable range of the second moving device 54 of the optical probe unit 50 in the X-axis direction is widened, and the optical probe 51 is inserted into and removed from the groove 412 of the thermal chuck 40 by the movement of the second moving device 54 in the X direction.

[0082] The installation position of the support member 35 is not particularly limited to the above-mentioned lower base 34, so long as the support member 35 is fixed relatively to the frame of the handler 30 and cannot be moved. For example, the support member 35 may be fixed to the upper base 31 or a side wall of the handler 30. [Explanation of symbols]

[0083] 1. Semiconductor device testing equipment 10…Tester 11...Test head 12…Mainframe 20...Probe card 21...Wiring board 22…Probe head 23…Probe 24. Housing 30…Handler 31…Upper base 32,33…Aperture 34…Lower base 35...Support member 40,40B...Thermal chuck 41...Retaining member 411…Contact surface 412...Groove 413…Insertion hole 42…Heater 43...Cooling channel 44...Suction channel 45...Temperature sensor 46... Refrigerant supply device 47…Decompression device 50,50B...Optical probe unit 51...Optical probe 52a, 52b...Optical fiber 53…Mirror 54...Second moving device 60...First moving device 61...Support member 62...Movement mechanism 63…X-direction rail 64…Y-direction rail 65…Z drive section 70...Control device 81...Transportation device 82...Camera 83...Camera 100...Semiconductor devices 101…Top surface 102…Bottom surface 110...Substrate 111...Terminal 120…Die 121...Optical connection part

Claims

1. 1. A semiconductor device handling apparatus that moves a DUT to bring a terminal arranged on a first surface of the DUT into contact with a contact portion, comprising: a holder for holding a second surface of the DUT; an optical probe for inputting and outputting an optical signal to and from an optical connection portion disposed on the second surface of the DUT.

2. 2. The semiconductor device handling apparatus of claim 1, The semiconductor device handling apparatus includes: a first moving device that moves the holding portion relative to the contact portion to position the terminal of the DUT relative to the contact portion; a second moving device that positions the optical probe relatively to the optical connection portion of the DUT by moving the optical probe relatively to the DUT held in the holding portion.

3. 3. The semiconductor device handling apparatus according to claim 2, the first moving device is disposed on an opposite side of the holder from the DUT; The second moving apparatus is a semiconductor device handling apparatus disposed on an opposite side of the optical probe from the DUT.

4. 3. The semiconductor device handling apparatus according to claim 2, The first moving device is a semiconductor device handling apparatus that moves the holding portion and the second moving device relative to the contact portion.

5. 3. The semiconductor device handling apparatus according to claim 2, the first moving device includes a support member to which the holding portion is fixed, The second moving device is a semiconductor device handling device that is fixed to the support member and moves the optical probe relatively to the holder.

6. 3. The semiconductor device handling apparatus according to claim 2, The holding portion is a contact surface contacting the second surface of the DUT; a recess that opens on the contact surface and into which the optical probe can be inserted; The recess has a size that allows the optical probe to move relatively to the holder.

7. 6. The semiconductor device handling apparatus according to claim 5, The holding portion is a contact surface contacting the second surface of the DUT; An insertion hole opening on the contact surface, The optical probe is inserted into the insertion hole so as to be movable relative to the holder.

8. 3. The semiconductor device handling apparatus according to claim 2, the first moving device is fixed to a base of the semiconductor device handling apparatus; The second moving device is fixed to the base independently of the first moving device.

9. 2. The semiconductor device handling apparatus of claim 1, The optical probe is a semiconductor device handling apparatus having an optical transmission path capable of transmitting an optical signal.

10. 2. The semiconductor device handling apparatus of claim 1, The holding portion is a contact surface contacting the second surface of the DUT; and a temperature adjustment mechanism for adjusting a temperature of the DUT via the contact surface.

11. 2. The semiconductor device handling apparatus of claim 1, The holding portion is a contact surface contacting the second surface of the DUT; a suction holding mechanism that opens on the contact surface and holds the DUT by suction.

12. 2. The semiconductor device handling apparatus of claim 1, The semiconductor device handling device is equipped with a first moving device that moves the holding portion relative to the contact portion, thereby pressing the DUT held by the holding portion against the contact portion and bringing the terminal of the DUT into contact with the contact portion.

13. 2. The semiconductor device handling apparatus of claim 1, The DUT is a semiconductor device handling apparatus having a die with the optical connection portion.

14. 14. A semiconductor device handling apparatus according to claim 13, comprising: The DUT is a semiconductor device handling apparatus having a substrate having the terminals and on which the die is mounted.

15. 2. The semiconductor device handling apparatus of claim 1, The contact unit is a probe card having contacts that come into contact with the terminals of the DUT.

16. A semiconductor device test apparatus for testing a DUT, comprising: a contact portion for inputting and outputting an electrical signal to a terminal disposed on a first surface of the DUT; an optical probe for inputting and outputting an optical signal to and from an optical connection portion disposed on a second surface of the DUT; a test apparatus connected to the contact portion so as to be capable of transmitting the electrical signal and connected to the optical probe so as to be capable of transmitting the optical signal.

17. 17. The semiconductor device testing apparatus according to claim 16, A semiconductor device testing apparatus comprising the semiconductor device handling apparatus according to any one of claims 1 to 15.

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