Semiconductor device handling device and semiconductor device testing device

Abstract

To provide a semiconductor device handling device capable of improving sealing property of a suction hole between a heater part and a heat exchange part and improving thermal conductivity between the heater part and the heat exchange part.SOLUTION: A handler 30 moving a DUT 100 to a probe card 20 comprises a thermal chuck 40 moving while holding the DUT 100. The thermal chuck 40 includes: a heater part 41 having a holding face 41a in contact with the DUT 100 and a bottom face 41c, a sheet-like heat transfer member 42 in contact with the bottom face 41c; a heat exchange part 43 including a coolant flow path 432 through which coolant passes and a top face 431a in contact with the heat transfer member 42, and exchanging heat with the heater part 41 through the heat transfer member 42; and a suction hole 46 penetrating the heat exchange part 43, the heat transfer member 42 and the heater part 41.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a semiconductor device handling apparatus and a semiconductor device testing apparatus used for testing electronic devices under test (hereinafter simply referred to as "DUTs" (Devices Under Test)) such as semiconductor integrated circuit elements. [Background technology]

[0002] A handler for transporting a DUT is equipped with a temperature adjustment device having a DUT heat exchanger (see, for example, Patent Document 1). This DUT heat exchanger exchanges heat by contacting the DUT, and includes a thermal block having a flow path through which a fluid can flow.

[0003] In the flow path of the thermal block, a first fluid as a hot medium and a second fluid as a coolant are mixed, and the temperature of the DUT is adjusted by the mixed fluid, which is adjusted by controlling the mixing ratio of the first fluid and the second fluid using a valve. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Application Publication No. 2019 / 0302178 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above conventional technology, when the flow rate of the fluid changes due to the opening and closing of the valve, vibration occurs, and the minute positional accuracy of the DUT heat exchanger may become unstable. As a temperature adjustment device that does not mix two types of fluid as in the conventional technology, it is possible to use a device that includes a heater and a heat exchanger that exchanges heat with the heater.

[0006] However, when providing such a temperature control device with a suction hole for sucking in the DUT, it is necessary to seal the gap between the heater and the heat exchanger. In this case, if a general rubber sealant (O-ring) is used, for example, there is a problem that the thermal conductivity between the heater and the heat exchanger is deteriorated.

[0007] The problem that the present invention aims to solve is to provide a semiconductor device handling apparatus and a semiconductor device testing apparatus that can increase the airtightness of the suction hole between a heater section and a heat exchange section, and can improve the thermal conductivity between the heater section and the heat exchange section. [Means for solving the problem]

[0008] [1] A first aspect of the present invention is a semiconductor device handling apparatus that moves a DUT to a contact section, the semiconductor device handling apparatus comprising a holding unit that moves while holding the DUT, the holding unit having a heater section having a first surface that contacts the DUT and a second surface opposite the first surface, a sheet-like heat transfer member that contacts the second surface, a flow path through which a fluid passes, and a third surface that contacts the heat transfer member, the semiconductor device handling apparatus including a heat exchange section that exchanges heat with the heater section via the heat transfer member, and a suction hole that penetrates the heat exchange section, the heat transfer member, and the heater section.

[0009] [2] A second aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, wherein the suction hole includes a first through hole formed in the heater section, a second through hole formed in the heat transfer member and communicating with the first through hole, and a third through hole formed in the heat exchange section and communicating with the second through hole.

[0010] [3] A third aspect of the present invention may be a semiconductor device handling apparatus according to the first or second aspect, wherein the holding unit further includes an intervening member interposed between the heater section and the heat exchange section and having a thickness substantially the same as that of the heat transfer member.

[0011] [4] A fourth aspect of the present invention may be a semiconductor device handling device according to the third aspect, wherein the heat transfer member has a fourth through hole penetrating the heat transfer member, and the intervening member is provided within the fourth through hole.

[0012] [5] A fifth aspect of the present invention may be a semiconductor device handling apparatus according to the third or fourth aspect, wherein the holding unit includes a plurality of the intervening members, and the plurality of intervening members are arranged, in a plan view, concentrically with the center of the second surface and equally spaced in the circumferential direction.

[0013] [6] A sixth aspect of the present invention may be the semiconductor device handling apparatus according to any one of the third to fifth aspects, wherein the rigidity of the interposition member is higher than the rigidity of the heat transfer member.

[0014] [7] A seventh aspect of the present invention may be the semiconductor device handling device of any one of the third to sixth aspects, wherein the interposition member is formed integrally with the heat exchange section.

[0015] [8] A seventh aspect of the present invention may be a semiconductor device handling device according to any one of aspects 3 to 7, wherein the holding unit includes a frame member that contacts and presses an outer periphery of the heater section, and a fixing member that fixes the frame member to the heat exchange section.

[0016] [9] A ninth aspect of the present invention may be a semiconductor device handling apparatus according to the eighth aspect, wherein the frame member is spaced apart from the heater portion in a planar direction of the heater portion and in contact with the outer periphery in a direction perpendicular to the planar direction, and a first gap is formed between the heater portion and the frame member in the planar direction.

[0017]

[10] A tenth aspect of the present invention may be a semiconductor device handling apparatus according to the eighth or ninth aspect, wherein a second gap is formed between the heat exchange section and the frame member in a direction perpendicular to the planar direction of the heater section.

[0018]

[11] An eleventh aspect of the present invention may be the semiconductor device handling apparatus of any one of the eighth to tenth aspects, wherein the first surface protrudes relative to the frame member.

[0019]

[12] A twelfth aspect of the present invention may be a semiconductor device handling device according to the eleventh aspect, wherein the heater section includes a first portion having the first surface and a second portion provided around the first portion, the height of the second portion is lower than the height of the first portion, and the frame member presses the second portion toward the heat exchange section.

[0020]

[13] A thirteenth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 1 to 12, wherein the heater section has a rectangular planar shape, the heater section includes a plurality of fifth through holes diagonally positioned at four corners of the heater section, the holding unit further includes a plurality of pins inserted into the fifth through holes, and a third gap is formed between the inner wall of the fifth through hole and the pins in the diagonal direction of the heater section, such that the heater section is held in the heat exchange section so as to be expandable and contractable in the diagonal direction.

[0021]

[14] A fourteenth aspect of the present invention may be the semiconductor device handling apparatus of the thirteenth aspect, wherein the plurality of pins are erected on the third surface so as to surround the heat transfer member.

[0022]

[15] A fifteenth aspect of the present invention may be a semiconductor device handling device according to any one of aspects 1 to 14, wherein the heater section has a rectangular planar shape, the suction hole includes a plurality of first through holes provided in the first surface, and the plurality of first through holes are provided on diagonals of the first surface.

[0023]

[16] A fifteenth aspect of the present invention is a semiconductor device testing apparatus for testing a DUT, comprising the contact portion, a tester electrically connected to the contact portion, and a semiconductor device handling apparatus of any one of aspects 1 to 15. Effect of the Invention

[0024] According to the present invention, the holding unit includes a heater section, a sheet-like heat transfer member in contact with the second surface of the heater section, a heat exchange section that exchanges heat with the heater section via the heat transfer member, and a suction hole that penetrates the heat exchange section, the heat transfer member, and the heater section. Therefore, the heat transfer member can increase the sealing of the suction hole between the heater section and the heat exchange section, and can improve the thermal conductivity between the heater section and the heat exchange section. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus and the internal structure of a handler in an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a thermal chuck according to an embodiment of the present invention and a block diagram showing a control system. [Diagram 3] FIG. 3 is an enlarged cross-sectional view showing a thermal chuck in an embodiment of the present invention. [Figure 4]FIG. 4 is a plan view showing a thermal chuck in an embodiment of the present invention. [Diagram 5] FIG. 5 is a plan view showing a state in which a heater portion and a frame member are removed from the thermal chuck of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0027] FIG. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus 1 and the internal structure of a handler 30 in this embodiment. FIG. 2 is a cross-sectional view of a thermal chuck 40 in this embodiment and a block diagram showing a control system. FIG. 3 is an enlarged cross-sectional view of the thermal chuck 40 in this embodiment. FIG. 4 is a plan view of the thermal chuck 40 in this embodiment, and FIG. 5 is a plan view of the thermal chuck 40 in FIG. 4 with a frame member 44 and a heater unit 41 removed. For ease of understanding, the DUT 100 is shown separated from the thermal chuck 40 in FIG. 2, but in reality, the DUT 100 is held by the thermal chuck 40 and is in contact with the thermal chuck 40. FIG. 2 is also a cross-sectional view taken along line II-II in FIG. 4.

[0028] The semiconductor device test apparatus 1 in this embodiment is an apparatus for testing electrical characteristics of a DUT 100. The DUT 100 in this embodiment is, but is not limited to, a die formed by dicing a semiconductor wafer. The DUT 100 may be a device in which a die is packaged with a resin material.

[0029] 1, the semiconductor device testing apparatus 1 includes a tester 10, a probe card 20, and a handler 30. The handler 30 corresponds to an example of a "semiconductor device handling apparatus" in an aspect of the present invention.

[0030] 1, a tester 10 includes a test head 11 and a main frame (tester body) 12. The test head 11 is connected to the main frame 12 via a cable. A probe card 20 is electrically connected to the test head 11. The probe card 20 enters the inside of the handler 30 through an opening 32 formed in an upper base 31 of the handler 30.

[0031] Probe card 20 includes a wiring board 21 and a probe head 22 mounted on wiring board 21. As shown in Fig. 2, probe head 22 includes a plurality of probes 23 and a housing 24. Probe card 20 corresponds to an example of a "contact portion" in an aspect of the present invention.

[0032] The probe 23 is an electric probe that comes into contact with the terminal 111 of the DUT 100. The multiple probes 23 are arranged to correspond to the multiple terminals 111 of the DUT 100. Although not particularly limited, specific examples of the probe 23 include a pogo pin, a vertical probe needle, a cantilever probe needle, an anisotropic conductive rubber sheet, a bump on a membrane, or a contactor manufactured using MEMS technology.

[0033] Probe 23 is held in housing 24, and housing 24 is fixed to wiring board 21 by screws or the like, thereby mounting probe head 22 on wiring board 21. Note that wiring board 21 may directly hold probe 23, in which case housing 24 can be omitted.

[0034] 1 and 2, the handler 30 includes a thermal chuck 40, a first moving device 60, and a control device 70. The thermal chuck 40 corresponds to an example of a "holding unit" in an aspect of the present invention.

[0035] The thermal chuck 40 suction-holds the DUT 100 and adjusts the temperature of the DUT 100. As shown in Fig. 2 and Fig. 3, the thermal chuck 40 includes a heater section 41, a heat transfer member 42, a heat exchange section 43, a frame member 44, a fixing member 45, a suction hole 46, and a temperature sensor 49.

[0036] 2, the heater section 41 is in direct contact with the DUT 100 and directly heats the DUT 100. Examples of the heater section 41 include ceramic heaters such as an aluminum nitride heater, a silicon nitride heater, and a PTC heater, a polyimide heater, a cartridge heater, and a Peltier element. The heater section 41 is connected to the control device 70 via terminals (not shown) and generates heat by power supplied from the control device 70.

[0037] As shown in FIG. 3, the heater section 41 has a first portion 411 and a second portion 412. The first portion 411 includes a holding surface 41a that holds the DUT 100. As shown in FIG. 4, the holding surface 41a in this embodiment has a substantially rectangular planar shape. As shown in FIG. 3, the holding surface 41a protrudes in the +Z direction with respect to the frame member 44. Therefore, the DUT 100 placed on the holding surface 41a does not interfere with the frame member 44. The DUT 100 is heated via the holding surface 41a. The holding surface 41a corresponds to an example of the "first surface" in the aspect of the present invention, and the second portion 412 corresponds to an example of the "outer periphery" in the aspect of the present invention.

[0038] 3 and 4, the first portion 411 includes a plurality of first through holes 413 that penetrate the first portion 411 and open on the holding surface 41a. As shown in Fig. 2, the first through holes 413 are formed at positions facing the DUT 100 and form part of suction holes 46 described below. As shown in Fig. 4, the plurality of first through holes 413 in this embodiment are formed on a pair of diagonals DL1 and DL2 of the holding surface 41a of the heater section 41.

[0039] 3 and 4, the second portion 412 is provided around the first portion 411. The second portion 412 is formed integrally with the first portion 411 and has a rectangular frame shape. This second portion 412 is a portion that is pressed by a frame member 44 described below. By pressing this second portion 412 by the frame member 44, the heater section 41 is pressed toward the heat transfer member 42 and the heat exchange section 43 (toward the -Z direction in the figure).

[0040] 3, the height H2 of the second portion 412 is smaller than the height H1 of the first portion 411 (H2>H1). Therefore, the heater section 41 has a convex shape in which the first portion 411 protrudes relative to the second portion 412. By bringing the frame member 44 into contact with the second portion 412, the holding surface 41a can be protruded in the +Z direction relative to the frame member 44. Note that the heights H1 and H2 in this embodiment are heights from the upper surface of the heat transfer member 42.

[0041] The second portion 412 includes a plurality of pin holes 414. In this embodiment, the plurality of pin holes 414 are formed at the four corners of the second portion 412 of the heater section 41, and are formed on the diagonals DL1 and DL2. The pin holes 414 correspond to an example of a "fifth through hole" in this aspect of the present invention.

[0042] The pin holes 414 are through holes through which pins 435, which will be described later, are inserted, and have an elliptical shape (track shape, oval shape) extending along the extension direction of the diagonals DL1 and DL2. Here, the elliptical shape means a shape consisting of a pair of straight line parts extending parallel to each other and a pair of arc parts connecting the straight line parts to each other. The planar shape of the pin holes 414 is not particularly limited to the above, and may be an elliptical shape or a rectangular shape. In addition, a third gap 436 is formed between the inner wall 414a of the pin holes 414 and the pins 435 in the diagonal direction (extension direction of the diagonals DL1 and DL2). As a result, the heater unit 41 is held by the heat exchange unit 43 so as to be expandable and contractible in the diagonal direction.

[0043] The expansion and contraction of the heater section 41 in the diagonal direction occurs, for example, when the heater section 41 expands and contracts when the temperature of the heater section 41 rises and falls. Therefore, the pinhole 414 as described above allows deformation of the heater section 41 due to thermal expansion to be released in the diagonal direction, so that the center of expansion and contraction of the heater section 41 can be the center C1 of the heater section. Therefore, it is possible to suppress displacement of the DUT 100 held on the holding surface 41a of the heater section 41.

[0044] As shown in Fig. 3, the sheet-like heat transfer member 42 is in contact with a lower surface 41c opposite to the holding surface 41a of the heater unit 41, and is interposed between the heater unit 41 and the heat exchange unit 43. As shown in Fig. 5, the heat transfer member 42 in this embodiment has a substantially rectangular planar shape, although not particularly limited thereto. The lower surface 41c corresponds to an example of the "second surface" in this aspect of the present invention.

[0045] The heat transfer member 42 is made of a material having high thermal conductivity. Such heat transfer member 42 is in close contact with the lower surface 41c of the heater section 41 and the upper surface 431a of the heat exchange section 43, so that the heater section 41 and the heat exchange section 43 can efficiently exchange heat with each other.

[0046] For example, a thermal interface material (TIM) can be used as the heat transfer member 42. For example, a metal foil made of aluminum or copper, a graphite sheet, a silicone rubber sheet in which a thermally conductive filler is dispersed and held, a sheet containing carbon nanotubes (CNTs), a gel in which a thermally conductive filler is dispersed, etc. can be used as the TIM.

[0047] 3 and 5, the heat transfer member 42 includes a plurality of second through holes 423 and a plurality of intermediate holes 424. The intermediate holes 424 correspond to an example of a "fourth through hole" of an aspect of the present invention.

[0048] 3, the second through hole 423 penetrates the heat transfer member 42. The second through hole 423 is provided at a position facing the first through hole 413, and in this embodiment, is formed on the diagonals DL3 and DL4. The second through hole 423 also faces the first through hole 413 and communicates with the first through hole 413. The second through hole 423 also constitutes a part of the suction hole 46, similar to the first through hole 413.

[0049] As shown in Fig. 3, the intervening hole 424 penetrates the heat transfer member 42. An intervening member 434, which will be described later, is provided inside the intervening hole 424. As shown in Fig. 5, the intervening holes 424 in this embodiment are formed on an imaginary circle VC concentric with a center C2 of the heat transfer member 42, and are arranged at equal intervals in the circumferential direction of the imaginary circle VC. Note that in this embodiment, the center C2 is the intersection of diagonals DL3 and DL4 of the heat transfer member.

[0050] 3, the heat exchanger 43 is in contact with the heater 41 and the heat transfer member 42. The heat exchanger 43 exchanges heat with the heater 41 via the heat transfer member 42. The heat exchanger 43 has a main body 431, a plurality of intervening members 434, and a plurality of pins 435 (see FIG. 4).

[0051] As shown in FIG. 3 and FIG. 5, the main body 431 has a refrigerant flow passage 432 and a plurality of third through holes 433. The refrigerant flow passage 432 is formed at a position corresponding to the heat transfer member 42 inside the main body 431. As shown in FIG. 2, a refrigerant supply device 51 is connected to the refrigerant flow passage 432, and a refrigerant having a temperature lower than room temperature is supplied from the refrigerant supply device 51 to the refrigerant flow passage 432. The refrigerant passes through the refrigerant flow passage 432, thereby cooling the heater unit 41 via the heat transfer member 42. As the refrigerant flowing through the refrigerant flow passage 432, a liquid or a gas may be used. Although not particularly limited, examples of the liquid refrigerant include water and a fluorine-based inert liquid. On the other hand, examples of the gas refrigerant include air and nitrogen. The refrigerant flow passage 432 corresponds to an example of a "flow passage" in the embodiment of the present invention, and the refrigerant corresponds to an example of a "fluid" in the embodiment of the present invention.

[0052] 3 and 5, a plurality of third through holes 433 penetrate the main body 431. The third through holes 433 are provided at positions facing the second through holes 423. The third through holes 433 also face the second through holes 423 and communicate with the second through holes 423. The third through holes 433 also constitute a part of the suction hole 46, similar to the first and second through holes 413, 423.

[0053] 3 and 5, a plurality of intervening members 434 are erected on the upper surface 431a of the main body 431. The intervening members 434 suppress the heat transfer member 42 from being deformed more than necessary in the Z direction when the heat transfer member 42 is pressed against the heater section 41. This makes it possible to suppress the terminals 111 of the DUT 100 from being out of focus when an image is captured by a camera 82 (see FIG. 1) described later. The upper surface 431a corresponds to an example of a "third surface" of this aspect of the present invention.

[0054] The intervening member 434 is interposed between the heater unit 41 and the main body 431 of the heat exchange unit 43. The rigidity of the intervening member 434 is higher than that of the heat transfer member 42. In other words, the material constituting the heat transfer member 42 has a Young's modulus smaller than that of the material constituting the intervening member 434. The intervening member 434 in this embodiment is integrally formed with the main body 431 of the heat exchange unit 43, and is provided on the upper surface 431a of the main body 431 so as to be located inside the intervening hole 424. The intervening member 434 may be a separate member independent of the heat exchange unit 43. As shown in FIG. 3, the thickness T2 of the intervening member 434 is substantially the same as the thickness T1 of the heat transfer member 42 (T2=T1).

[0055] 5, like the intervening holes 424, in plan view, the intervening holes 42 are formed on an imaginary circle VC concentric with the center C2 of the heat transfer member 42 and are disposed at equal intervals in the circumferential direction of the imaginary circle VC. This makes it possible to suppress deformation of the entire heat transfer member 42.

[0056] The multiple pins 435 are erected on the upper surface 431a so as to surround the heat transfer member 42. As described above, the pins 435 are separated from the inner wall 414a of the pin hole 414 in the diagonal direction (the extension direction of the diagonals DL1 and DL2) via the third gap 436, so that the heater unit 41 is held by the heat exchange unit 43 so as to be expandable and contractable in the diagonal direction.

[0057] 3 and 5, a frame member 44 is provided on the outer periphery of the thermal chuck 40. The frame member 44 has a frame-like planar shape and an L-shaped cross section.

[0058] The frame member 44 contacts the second portion 412 in a direction (Z direction in the figure) perpendicular to the planar direction of the heater portion 41 (XY direction in the figure), and presses the second portion 412. By pressing the second portion 412 of the heater portion 41 with such frame member 44, the entire circumference of the heater portion 41 can be pressed, so that the entire heat transfer member 42 is crushed evenly, improving the adhesion between the heater portion 41 and the heat transfer member 42 and between the heat exchange portion 43 and the heat transfer member 42. This improves the heat exchange efficiency between the heater portion 41 and the heat exchange portion 43.

[0059] The frame member 44 is separated from the first portion 411 of the heater portion 41 in the planar direction of the heater portion 41. As a result, a first gap 47 is formed between the first portion 411 and the frame member 44 in the planar direction of the heater portion 41. Since deformation in the planar direction when the heater portion 41 expands can be released to this first gap 47, deformation such as warping of the heater portion 41 due to interference between the heater portion 41 and the frame member 44 can be suppressed. Similarly, a first gap 47 is also formed between the second portion 412 and the frame member 44. Therefore, deformation of the heater portion 41 can be released to the first gap when the second portion 412 expands, so deformation such as warping of the heater portion 41 can be suppressed.

[0060] Moreover, the frame member 44 is separated from the heat exchanger 43 in the Z direction. As a result, a second gap 48 is formed between the heat exchanger 43 and the frame member 44 in the Z direction. This second gap 48 can suppress heat exchange between the frame member 44 and the heat exchanger 43, thereby improving the heat exchange efficiency between the heater unit 41 and the heat exchanger 43.

[0061] The fixing members 45 are disposed at the four corners of the frame member 44 in a plan view. The fixing members 45 fix the frame member 44 to the heat exchange unit 43. A fastener such as a screw can be used as the fixing members 45. Although not particularly limited, the pressing force against the heater unit 41 and the length of the second gap 48 can be adjusted by adjusting the shaft diameter and tightening torque of the fastening portion.

[0062] The suction hole 46 penetrates the heat exchange section 43, the heat transfer member 42, and the heater section 41. The suction hole 46 is composed of the above-mentioned first to third through holes 413, 423, and 433. The suction hole 46 is connected to a pressure reducing device 52, and when the DUT 100 is placed on the holding surface 41a of the heater section 41, the suction hole 46 is sucked by the pressure reducing device 52, whereby the DUT 100 is held by suction to the heater section 41. A specific example of the pressure reducing device 52 is a vacuum pump.

[0063] Although not particularly limited, the temperature sensor 49 is embedded in the heater section 41. The temperature sensor 49 is provided inside the heater section 41 so as to be located in the vicinity of the holding surface 41a. This temperature sensor 49 detects the temperature of the DUT 100 via the holding surface 41a. The temperature sensor 49 is connected to the control device 70 so as to be able to output the detection result.

[0064] 1, the first moving device 60 is a device that moves the thermal chuck 40. The first moving device 60 includes a support member 61 and a moving mechanism 62 that moves the support member 61. The first moving device 60 aligns the DUT 100 with respect to the probe card 20 so that the multiple terminals 111 of the DUT 100 face the multiple probes 23 of the probe head 22, respectively.

[0065] The thermal chuck 40 is supported by a flat support member 61. The support member 61 is supported by a moving mechanism 62. The moving mechanism 62 is capable of moving the support member 61 in the X, Y and Z axis directions in the figure and rotating it about the Z axis (θz). The moving mechanism 62 is equipped with an X drive unit including an X direction rail 63, a Y drive unit including a Y direction rail 64, and a Z drive unit 65.

[0066] As shown in FIG. 1, the X-direction rail 63 is provided on the lower base 34 of the handler 30 and extends along the X-direction. The Y-direction rail 64 is slidably held on the X-direction rail 63 and can move along the X-direction. The Z-drive unit 65 is slidably held on the Y-direction rail 64 and can move along the Y-direction. The above-mentioned support member 61 is attached to the Z-drive unit 65. The Z-drive unit 65 can raise and lower the support member 61 and rotate the support member 61 around the Z-axis. As a result, the thermal chuck 40 supported by the support member 61 can be moved in the X, Y, and Z directions by the moving mechanism 62 and can be rotated around the Z-axis.

[0067] Although not particularly limited, the X drive unit, the Y drive unit, and the Z drive unit 65 of the moving mechanism 62 include, for example, an actuator, a transmission mechanism, and a guide mechanism. Although not particularly limited, a specific example of the actuator can be, for example, a motor including an electric motor or an electric actuator including the electric motor, a specific example of the transmission mechanism can be, for example, a ball screw mechanism, and a specific example of the guide mechanism can be, for example, a linear guide mechanism including a guide rail and a block that can slide on the guide rail.

[0068] The control device 70 shown in Fig. 2 is, for example, configured with a computer. Although not specifically shown, this computer is an electronic calculator equipped with a CPU (processor), a main storage device (RAM, etc.), an auxiliary storage device (hard disk, SSD, etc.), and an interface, etc. The control described below is functionally realized, for example, by the control device 70 executing a program. Note that the control device 70 may be configured with a circuit board instead of a computer.

[0069] The control device 70 is electrically connected to the heater unit 41, the temperature sensor 49, and the coolant supply device 51. The control device 70 adjusts the temperature of the DUT 100 via the heater unit 41 by controlling the heater unit 41 and the coolant supply device 51 based on the detection result of the temperature sensor 49. Although not particularly limited, as an example of the control method, the flow rate of the coolant supplied by the coolant supply device 51 may be controlled to be constant, and the output of the heater unit 41 may be controlled based on the detection result of the temperature sensor 49.

[0070] The control device 70 may control the heater unit 41 and the coolant supply device 51 based on the output of a temperature detection circuit included in the DUT 100 instead of the temperature sensor 49. Although not particularly limited, a specific example of the temperature detection circuit may be a circuit including a thermal diode included in the DUT 100.

[0071] The control device 70 is also electrically connected to the pressure reducing device 52. The control device 70 controls the pressure reducing device 52, causing the thermal chuck 40 to suction and hold the DUT 100 or release the DUT 100. The control device 70 is also connected to the first moving device 60 so as to be able to output a control signal thereto, and is therefore able to control the operation of the moving device 60.

[0072] A method for pressing the DUT 100 against the probe card 20 by the above-mentioned handler 30 will be described below with reference to FIG.

[0073] 1, the first moving device 60 moves the thermal chuck 40 so that the thermal chuck 40 is positioned below the opening 33 of the upper base 31 of the handler 30. In this state, the transport device 81 of the handler 30 picks up the untested DUT 100 from the tray or plate and transports the DUT 100 to the thermal chuck 40 through the opening 33.

[0074] A specific example of the transport device 81 is not particularly limited, but may be a pick-and-place device equipped with a suction pad. A specific example of the tray is not particularly limited, but may be a customer tray conforming to the Joint Electron Device Engineering Council (JEDEC) standard. An example of the plate is a buffer plate capable of holding the DUT 100. If the DUT 100 is a single die, the DUT 100 before testing may be held in a ring frame (wafer ring) instead of the tray or plate.

[0075] When the DUT 100 is placed on the holding surface 41a by the transport device 81, the control device 70 drives the pressure reducing device 52, and the thermal chuck 40 adsorbs and holds the DUT 100. In addition, when the DUT 100 is placed on the holding surface 41a, the control device 70 starts controlling the heater unit 41 and the coolant supply device 51 to adjust the temperature of the DUT 100.

[0076] 1, the first moving device 60 moves the thermal chuck 40 so that the DUT 100 faces the camera 82 held on the upper base 31 of the handler 30. The camera 82 then captures an image of the DUT 100 held on the thermal chuck 40. The camera 83 attached to the support member 61 of the first moving device 60 captures an image of the probe head 22 of the probe card 20 in advance, and the image processing function of the control device 70 recognizes the relative positional relationship between the terminal 111 of the DUT 100 and the probe 23 of the probe card 20 based on the images captured by the cameras 82 and 83. The timing for capturing an image of the probe card 20 by the camera 83 is, for example, when the probe card is replaced in response to a change in the type of the DUT 100.

[0077] 1, the first moving device 60 moves the thermal chuck 40 so that the DUT 100 faces the probe head 22 of the probe card 20. During this movement, the camera 83 may capture an image of the probe head 22 of the probe card 20.

[0078] Next, the position of the thermal chuck 40 is finely adjusted by the first moving device 60 based on the relative positional relationship between the terminals 111 of the DUT 100 and the probes 23 of the probe card 20 recognized by the cameras 82 and 83. As a result, the multiple terminals 111 of the DUT 100 face the multiple probes 23 of the probe head 22, respectively, and the DUT 100 is positioned with respect to the probe card 20.

[0079] Next, the first moving device 60 raises the thermal chuck 40 and presses the DUT 100 against the probe card 20 to electrically connect them. In this state, the multiple terminals 111 of the DUT 100 and the multiple probes 23 of the probe card 20 are in contact with each other.

[0080] Next, the tester 10 inputs an electrical signal to the DUT 100 via the electrical probe 23 and the terminal 111. Then, the tester 10 judges the quality and characteristics of the DUT 100 based on the electrical signal output from the DUT 100 via the terminal 111.

[0081] As described above, in the semiconductor device testing apparatus 1 of the present embodiment, the heater section 41 and the heat exchange section 43 exchange heat through the heat transfer member 42. On the other hand, when the heater section and the heat exchange section are in direct contact with each other without the heat transfer member, a small gap often occurs between the lower surface of the heater section and the upper surface of the heat exchange section, and air having a low thermal conductivity enters the gap, thereby deteriorating the heat exchange efficiency between the heater section and the heat exchange section. In contrast, the sheet-like heat transfer member 42 can be deformed according to the shape of the lower surface 41c of the heater section 41 and the shape of the upper surface 431a of the heat exchange section 43, and can be in close contact with the lower surface 41c and the upper surface 431a, thereby improving the heat exchange efficiency between the heater section 41 and the heat exchange section 43 compared to when the heater section and the heat exchange section are in direct contact with each other without the heat transfer member.

[0082] Furthermore, in the semiconductor device testing apparatus 1 of this embodiment, suction holes 46 are provided that penetrate the heat exchanger 43, the heat transfer member 42, and the heater 41. In this case, the sheet-like heat transfer member 42 can be in close contact with the lower surface 41c of the heater 41 and the upper surface 431a of the heat exchanger 43, as described above, so that the heat transfer member 42 can improve the heat exchange efficiency as described above and can also increase the airtightness of the suction holes 46. In particular, even if the heater 41 and the heat exchanger 43 are deformed due to expansion or contraction caused by a temperature change, the heat transfer member 42 interposed between them can follow the deformation, so that the heat exchange efficiency can be improved and the airtightness can be increased.

[0083] The above-described embodiments are described for the purpose of facilitating understanding of the present invention, and are not described for the purpose of limiting the present invention. Therefore, the elements disclosed in the above embodiments are intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0084] For example, the DUT 100 may be a semiconductor wafer. In this case, the thermal chuck 40 may be used as a wafer chuck. [Explanation of symbols]

[0085] 1. Semiconductor device testing equipment 10…Tester 11...Test head 12…Mainframe 20...Probe card 21...Wiring board 22…Probe head 23…Probe 24. Housing 30…Handler 31…Upper base 32,33…Aperture 34…Lower base 40…Thermal chuck 41…Heater section 41a...Holding surface 41b…Outer surface 41c…Bottom surface 411...First part 413...First through hole 412...Second part 414…Pin hole 414a…Inner wall 42...Heat transfer member 423...Second through hole 424…Intervening hole 43...Heat exchange section 431…Main body 431a...Top surface 432... Coolant flow path 433…Third through hole 434...Intervening member 435…Pin 436…Third gap 44...Frame member 45…Fixing member 46...Suction hole 47…First gap 48...Second gap 49...Temperature sensor 51... Refrigerant supply device 52...Decompression device 60...First moving device 61...Support member 62...Movement mechanism 63…X-direction rail 64…Y-direction rail 65…Z drive section 70...Control device 81...Transportation device 82...Camera 83...Camera 100…Die 101…Top surface 102…Bottom surface 111...Terminal 200...Semiconductor packages 300…wafer

Claims

1. A semiconductor device handling apparatus that moves a DUT to a contact section, comprising: The semiconductor device handling apparatus includes a holding unit that moves while holding the DUT, The holding unit includes: a heater portion having a first surface that contacts the DUT and a second surface opposite to the first surface; a sheet-like heat transfer member in contact with the second surface; a heat exchange section that has a flow path through which a fluid passes and a third surface that is in contact with the heat transfer member, and that exchanges heat with the heater section via the heat transfer member; a suction hole penetrating the heat exchange portion, the heat transfer member, and the heater portion.

2. 2. The semiconductor device handling apparatus of claim 1, The suction hole is A first through hole formed in the heater portion; a second through hole formed in the heat transfer member and communicating with the first through hole; a third through hole formed in the heat exchange portion and communicating with the second through hole.

3. 2. The semiconductor device handling apparatus of claim 1, The holding unit of the semiconductor device handling apparatus further includes an interposition member interposed between the heater section and the heat exchange section and having substantially the same thickness as the heat transfer member.

4. 4. The semiconductor device handling apparatus according to claim 3, the heat transfer member has a fourth through hole penetrating the heat transfer member, A semiconductor device handling apparatus, wherein the intervening member is provided in the fourth through hole.

5. 4. The semiconductor device handling apparatus according to claim 3, The holding unit includes a plurality of the interposition members, A semiconductor device handling apparatus in which the multiple intervening members are arranged concentrically with the center of the first surface and at equal intervals in the circumferential direction in a plan view.

6. 4. The semiconductor device handling apparatus according to claim 3, A semiconductor device handling apparatus, wherein the rigidity of the interposed member is higher than the rigidity of the heat transfer member.

7. 4. The semiconductor device handling apparatus according to claim 3, The semiconductor device handling apparatus, wherein the interposition member is integrally formed with the heat exchange portion.

8. 2. The semiconductor device handling apparatus of claim 1, The holding unit includes: a frame member that contacts and presses an outer periphery of the heater unit; a fixing member that fixes the frame member to the heat exchange portion.

9. 9. A semiconductor device handling apparatus according to claim 8, comprising: the frame member is spaced apart from the heater section in a planar direction of the heater section and is in contact with the outer circumferential portion in a direction perpendicular to the planar direction, A semiconductor device handling apparatus, wherein a first gap is formed between the heater portion and the frame member in the planar direction.

10. 9. A semiconductor device handling apparatus according to claim 8, comprising: A semiconductor device handling apparatus, wherein a second gap is formed between the heat exchange section and the frame member in a direction perpendicular to a planar direction of the heater section.

11. 9. A semiconductor device handling apparatus according to claim 8, comprising: The first surface protrudes relative to the frame member.

12. 12. A semiconductor device handling apparatus according to claim 11, The heater unit includes: a first portion having the first surface; a second portion provided around the first portion, The height of the second portion is less than the height of the first portion; The frame member presses the second portion toward the heat exchanger.

13. 2. The semiconductor device handling apparatus of claim 1, The heater portion has a rectangular planar shape, the heater portion includes a plurality of fifth through holes located diagonally at four corners of the heater portion, The holding unit further includes a plurality of pins inserted into the fifth through hole, A semiconductor device handling device in which a third gap is formed between the inner wall of the fifth through hole and the pin in the diagonal direction of the heater section, so that the heater section is held in the heat exchange section so as to be expandable and contractable in the diagonal direction.

14. 14. A semiconductor device handling apparatus according to claim 13, comprising: The plurality of pins are erected on the third surface so as to surround the heat transfer member.

15. 2. The semiconductor device handling apparatus of claim 1, The heater portion has a rectangular planar shape, the suction hole includes a plurality of first through holes provided in the first surface, A semiconductor device handling apparatus, wherein the plurality of first through holes are provided on diagonals of the first surface.

16. A semiconductor device test apparatus for testing a DUT, comprising: The contact portion; a tester electrically connected to the contact portion; A semiconductor device testing apparatus comprising: a semiconductor device handling apparatus according to any one of claims 1 to 15.

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