Inspection device for power module having DC test function and withstand voltage test function integrated therein, and inspection method using the same

Abstract

To provide an inspection device for a power module, capable of performing both of a DC test and a withstanding voltage test in electric characteristic tests in order to reduce a cycle time of a test process and an area occupied by test facilities for inspecting electric characteristics of the power module.SOLUTION: An inspection device for a power module according to one embodiment, may include: a first socket board including a first withstanding voltage test pin (test pin); a second socket board including a second withstanding voltage test pin and a DC test pin; a test unit configure to generate a withstanding voltage test signal to transmit it to the first withstanding voltage test pin and the second withstanding voltage test pin and generates a DC test signal to transmit it to the DC test pin; and a relay unit for blocking or permitting electric coupling between at least one of the first withstanding voltage test pin, the second withstanding voltage test pin and the DC test pin, and the test unit.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an inspection device for a power module having an integrated DC test function and a withstand voltage test function, and an inspection method using the same, and more specifically, to an inspection device and an inspection method for realizing a process that integrates a DC test and a withstand voltage test of a power module. [Background technology]

[0002] A power module is a device used to convert DC power to AC power when driving a motor of a hybrid vehicle, an electric vehicle, etc. Typically, a power module includes a substrate, a power semiconductor device which is a switching device bonded to the substrate, a power lead which applies power to the power semiconductor device, and a signal lead which provides a control signal to the power semiconductor device.

[0003] After being manufactured, the power modules are classified into good and bad products through an electrical characteristic test. The electrical characteristic test for the power module may be generally performed as an end-of-line (EOL) evaluation process, and may include a direct current (DC) test, an alternating current (AC) test, and a withstand voltage test.

[0004] In the conventional EOL evaluation process, the process for testing each electrical characteristic is separated, and therefore the test process and test equipment are all separate, which increases the cycle time (C / T) of the process, increases the footprint of the equipment required for the process, reduces the overall efficiency of the process, and makes it difficult to manage. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention aims to provide a power module inspection device that can perform both a DC test and a voltage withstand test among electrical characteristic tests in order to reduce the cycle time of a test process for inspecting the electrical characteristics of a power module and the area occupied by the test equipment. [Means for solving the problem]

[0006] An apparatus for testing a power module according to an embodiment of the present invention may include a first socket board including a first withstand voltage test pin, a second socket board including a second withstand voltage test pin and a DC test pin, a test unit configured to generate and transmit a withstand voltage test signal to the first withstand voltage test pin and the second withstand voltage test pin and to generate and transmit a DC test signal to the DC test pin, and a relay unit configured to interrupt or allow an electrical connection between at least one of the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin and the test unit.

[0007] In one embodiment, the power module includes a lower substrate, an upper substrate arranged parallel to the lower substrate, and a semiconductor device arranged between the lower substrate and the upper substrate, and the first socket board may be composed of an upper socket board arranged to face the upper substrate and a lower socket board arranged to face the lower substrate.

[0008] In one embodiment, the first withstand voltage test pin of the upper socket board may contact at least a portion of the upper substrate, and the first withstand voltage test pin of the lower socket board may contact at least a portion of the lower substrate.

[0009] In one embodiment, the power module further includes power leads and signal leads, at least a portion of which is exposed to the outside of a housing of the power module, and the second socket board may be configured such that the second withstand voltage test pin and the DC test pin are in contact with the power leads and the signal leads, respectively.

[0010] In one embodiment, the second socket board is composed of a power lead socket board corresponding to the power leads and a signal lead socket board corresponding to the signal leads, and the power lead socket board and the signal lead socket board may be disposed on both sides of the lower socket board.

[0011] In one embodiment, the second withstand voltage test pin and the DC test pin of the power lead socket board can contact at least a portion of the power lead, and the second withstand voltage test pin and the DC test pin of the signal lead socket board can contact at least a portion of the signal lead.

[0012] In one embodiment, the first socket board further includes a first plate, and the first withstand voltage test pin may be located on the first plate to face the power module.

[0013] In one embodiment, the second socket board further includes a second plate, the DC test pins are configured in a plurality of pieces and positioned on the second plate to face the power module, and the second withstand voltage test pin may be positioned between the plurality of DC test pins to face the power module.

[0014] In one embodiment, the inspection device can operate in a DC test mode or a voltage withstand test mode, and the relay unit can switch the inspection device to the DC test mode or the voltage withstand test mode by disconnecting the electrical connection between the DC test pin and the test unit and the electrical connection between the first and second voltage withstand test pins and the test unit.

[0015] In an embodiment, the relay unit may electrically connect the test unit to the DC test pin in the DC test mode.

[0016] In an embodiment, the relay unit may electrically connect the test unit to the first withstand voltage test pin and the second withstand voltage test pin in the withstand voltage test mode.

[0017] In an embodiment, the relay unit may include a plurality of relays connected between the first withstand voltage test pin and the test unit, between the second withstand voltage test pin and the test unit, and between the DC test pin and the test unit.

[0018] In one embodiment, in the DC test mode, the relays connected to the DC test pin may be closed, and the relays connected to the first withstand voltage test pin and the second withstand voltage test pin may be opened.

[0019] In one embodiment, in the withstand voltage test mode, the relays connected to the first withstand voltage test pin and the second withstand voltage test pin may be closed, and the relays connected to the DC test pin may be opened.

[0020] In one embodiment, the plurality of relays may include a cylinder relay.

[0021] A method for testing electrical characteristics of a power module according to an embodiment of the present invention includes the steps of mounting the power module on a testing device, operating the testing device in a DC test mode to perform a DC test on the power module, and operating the testing device in a withstand voltage test mode to perform a withstand voltage test on the power module, wherein the testing device includes a first socket board including a first withstand voltage test pin, a second socket board including a second withstand voltage test pin and a DC test pin, a test unit for generating withstand voltage test signals and DC test signals, and a relay unit for switching an operation mode of the testing device to the DC test mode or the withstand voltage test mode, and wherein in the step of mounting the power module on the testing device, the power module may come into contact with the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin.

[0022] In an embodiment, in the step of performing a DC test on the power module, the relay unit may electrically connect the test unit to the DC test pin.

[0023] In an embodiment, in the step of performing a withstand voltage test on the power module, the relay unit may electrically connect the test unit to the first withstand voltage test pin and the second withstand voltage test pin.

[0024] In an embodiment, the relay unit may include a plurality of relays connected between the first withstand voltage test pin and the test unit, between the second withstand voltage test pin and the test unit, and between the DC test pin and the test unit.

[0025] In one embodiment, in the DC test mode, the relays connected to the DC test pins are closed and the relays connected to the first withstand voltage test pin and the second withstand voltage test pin are opened, and in the withstand voltage test mode, the relays connected to the first withstand voltage test pin and the second withstand voltage test pin are closed and the relays connected to the DC test pins are opened. Effect of the Invention

[0026] According to an embodiment of the present invention, a DC test and a voltage resistance test for a power module can be performed in one device, thereby reducing the cycle time of the test process and the area occupied by the test equipment.

[0027] Furthermore, according to an embodiment of the present invention, the DC test and the voltage resistance test are integrated into one process, thereby reducing equipment costs and improving mass productivity of products. [Brief description of the drawings]

[0028] [Figure 1] FIG. 1 is a perspective view of a power module according to an embodiment of the present invention. [Diagram 2] 1 is a cross-sectional view of a power module according to an embodiment of the present invention. [Diagram 3] 1 is a diagram showing a power module and a power module inspection apparatus according to an embodiment of the present invention. [Figure 4] 2 is a diagram showing a first socket board of a power module inspection apparatus according to an embodiment of the present invention. [Diagram 5] 1 is a diagram showing a second socket board of a power module inspection apparatus according to an embodiment of the present invention. [Figure 6] 1 is a diagram showing positions between a power module, a first socket board, and a second socket board during testing using a power module testing apparatus according to an embodiment of the present invention. [Figure 7]4 is a diagram showing an electrical connection path for a withstand voltage test of a power module in a power module testing apparatus according to an embodiment of the present invention. [Figure 8a] 1 is a diagram showing a DC test circuit of a power module testing apparatus according to an embodiment of the present invention. [Figure 8b] 2 is a diagram showing a circuit for a withstand voltage test of a power module testing apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] Since the present invention can be modified in various ways and has various embodiments, specific embodiments are shown in the drawings and described in detail. However, this is not intended to limit the present invention to the specific embodiments, and it can be understood that the present invention includes all modifications, equivalents, and alternatives included in the spirit and technical scope of the present invention.

[0030] Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only to distinguish one component from another. For example, a first component may be named a second component, and similarly, the second component may be named a first component, without departing from the scope of the invention. The term "and / or" includes any combination of items listed in plural or any of items listed in plural.

[0031] The terms used in this application are merely used to describe specific embodiments and are not intended to limit the present invention. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this application, the terms "include" or "have" specify the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, and should be understood not to preclude the presence or additional possibility of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0032] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention pertains. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as having an ideal or overly formal meaning unless expressly defined in this application.

[0033] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0034] Fig. 1 is a perspective view of a power module 1 according to an embodiment of the present invention. Fig. 2 is a cross-sectional view of the power module 1 according to an embodiment of the present invention.

[0035] FIG. 2 is a cross-sectional view taken along line AA' of the power module 1 shown in FIG.

[0036] 1 and 2, a power module 1 according to one embodiment may include a housing 10, a lower substrate 20, an upper substrate 30, a semiconductor device 40, power leads 50, signal leads 60, wires 70, spacers 80, and solder members 90.

[0037] The housing 10 can accommodate therein at least some of the components constituting the power module 1. For example, the housing 10 can surround the components disposed between the lower substrate 20 and the upper substrate 30 such that at least some of the lower substrate 20, the upper substrate 30, the power leads 50, and the signal leads 60 are exposed to the outside of the housing 10. The housing 10 can be a molding part made of an insulating material that molds the components constituting the power module 1.

[0038] The lower substrate 20 may include an insulating layer 22 and metal layers 21, 23 disposed on both sides of the insulating layer 22. The metal layers 21, 23 may include a first metal layer 21 bonded to an upper surface of the insulating layer 22 and a second metal layer 23 bonded to a lower surface of the insulating layer 22. The first metal layer 21 of the lower substrate 20 may be in electrical contact with a lower surface of the semiconductor device 40. At least a portion (e.g., a lower surface) of the second metal layer 23 of the lower substrate 20 may be located outside the housing 10 and exposed. Although not shown, the second metal layer 23 of the lower substrate 20 may be in contact with a cooling channel for cooling the power module 1.

[0039] The upper substrate 30 may include an insulating layer 32 and metal layers 31, 33 disposed on both sides of the insulating layer 32. The metal layers 31, 33 may include a first metal layer 33 bonded to a lower surface of the insulating layer 32 and a second metal layer 31 bonded to an upper surface of the insulating layer 32. The first metal layer 33 of the upper substrate 30 may be in electrical contact with an upper surface of the semiconductor element 40 via a first spacer 81. At least a portion (e.g., an upper surface) of the second metal layer 31 of the upper substrate 30 may be located outside the housing 10 and exposed. Although not shown, the second metal layer 31 of the upper substrate 30 may be in contact with a cooling channel for cooling the power module 1.

[0040] The lower substrate 20 and the upper substrate 30 may be double bonded copper (DBC) substrates. For example, the upper substrate 30 and the lower substrate 20 may have insulating layers 22 and 32 made of a ceramic material and metal layers 21, 23, 31 and 33 made of a copper material, but are not limited thereto.

[0041] The lower substrate 20 and the upper substrate 30 may be electrically connected via a spacer 80. For example, the first metal layer 21 of the lower substrate 20 and the first metal layer 33 of the upper substrate 30 may be electrically connected via a second spacer 82. A portion of the first metal layer 21 of the lower substrate 20 electrically connected to the lower surface of the semiconductor device 40 and a portion of the first metal layer 21 of the lower substrate 20 electrically connected to the first metal layer 33 of the upper substrate 30 via the second spacer 82 may be configured to be electrically insulated.

[0042] The semiconductor device (or semiconductor chip) 40 may be disposed between the lower substrate 20 and the upper substrate 30. For example, the semiconductor device 40 may be bonded to a first metal layer 21 of the lower substrate 20 and positioned between the lower substrate 20 and the upper substrate 30. The semiconductor device 40 may be electrically connected to the upper substrate 30 and the lower substrate 20. For example, the semiconductor device 40 may have power terminals (not shown) formed on an upper surface and a lower surface, through which a current for power conversion is input and output, respectively, and the power terminal formed on the lower surface may be electrically connected to the lower substrate 20 and the power terminal formed on the upper surface may be electrically connected to the upper substrate 30. The semiconductor device 40 may be formed of, but is not limited to, an IGBT (Insulated Gate Bipolar Transistor) and a diode.

[0043] A lower surface of the semiconductor element 40 may be joined to the first metal layer 21 of the lower substrate 20 via a solder member 90. An upper surface of the semiconductor element 40 may be joined to the first spacer 81 via the solder member 90. For example, the semiconductor element 40 may be electrically connected to the first metal layer 33 of the upper substrate 30 via the first spacer 81. The semiconductor element 40 may be electrically connected to the signal lead 60 via a wire 70.

[0044] The power lead 50 is connected to the semiconductor element 40 to transmit and receive high voltage current. The power lead 50 may be electrically connected to the semiconductor element 40. The power lead 50 may be configured in a plurality of pieces. At least a portion of the power lead 50 may be electrically connected to the first metal layer 21 of the lower substrate 20 via a solder member 90. For example, the power lead 50 may be connected to an upper surface of the first metal layer 21 of the lower substrate 20 together with the semiconductor element 40. A portion of the power lead 50 may be exposed to the outside of the housing 10 to transmit and receive power to and from the outside of the power module 1. The power lead 50 may extend from the inside of the housing 10 to the outside of the housing 10 such that at least a portion of the power lead 50 is exposed to the outside of the housing 10.

[0045] The signal lead 60 may transmit a control signal for controlling the semiconductor device 40 from the outside of the power module 1. The signal lead 60 may be configured in plurality. The signal lead 60 may extend from the inside of the housing 10 to the outside of the housing 10 such that at least a portion of the signal lead 60 is exposed to the outside of the housing 10. The signal lead 60 may be electrically connected to the semiconductor device 40 via a wire 70.

[0046] The spacer 80 may include a first spacer 81 disposed between the upper substrate 30 and the semiconductor device 40 and a second spacer 82 disposed between the upper substrate 30 and the lower substrate 20 .

[0047] The first spacer 81 may have an upper surface bonded to the first metal layer 33 of the upper substrate 30 and a lower surface bonded to the semiconductor element 40, thereby forming an electrical connection between the upper substrate 30 and the semiconductor element 40. For example, the upper and lower surfaces of the first spacer 81 may be in electrical and physical contact with the first metal layer 33 of the upper substrate 30 and the upper surface of the semiconductor element 40 via the solder member 90, respectively.

[0048] The second spacer 82 may have an upper surface bonded to the first metal layer 33 of the upper substrate 30 and a lower surface bonded to the first metal layer 21 of the lower substrate 20 to form an electrical connection between the upper substrate 30 and the lower substrate 20. For example, the upper and lower surfaces of the second spacer 82 may be in electrical and physical contact with the first metal layer 33 of the upper substrate 30 (e.g., the lower surface of the first metal layer 33) and the first metal layer 21 of the lower substrate 20 (e.g., the upper surface of the first metal layer 21) via the solder member 90, respectively.

[0049] 1 and 2, the power module 1 according to an embodiment may be a double-sided cooling (DSC) power module configured to have a semiconductor device 40 disposed between an upper substrate 30 and a lower substrate 20. However, the structure of the power module 1 is not limited to the embodiment shown in the drawings, and may be modified in various ways within a range in which a structure in which the semiconductor device 40 is disposed between the upper and lower substrates 20 and heat generated by the semiconductor device 40 is cooled by a cooler (not shown) provided outside the two substrates can be realized.

[0050] Fig. 3 is a diagram illustrating a power module 1 and a power module inspection apparatus 100 according to an embodiment of the present invention. Fig. 4 is a diagram illustrating a first socket board 120 of the power module inspection apparatus 100 according to an embodiment of the present invention. Fig. 5 is a diagram illustrating a second socket board 130 of the power module inspection apparatus 100 according to an embodiment of the present invention. Fig. 6 is a diagram illustrating the positions between the power module 1, the first socket board 120, and the second socket board 130 during inspection by the power module inspection apparatus 100 according to an embodiment of the present invention.

[0051] FIG 3 is a diagram illustrating an operation of mounting the power module 1 in the power module inspection apparatus 100 for inspection of the power module 1. FIG 4 is a diagram illustrating a specific shape of the first socket board 120 shown in FIG 3. FIG 5 is a diagram illustrating a specific shape of the second socket board 130 shown in FIG 3. FIG 6 is a diagram illustrating the positional relationship between the power module 1, the first socket board 120, and the second socket board 130 in a state in which the power module 1 is mounted in the power module inspection apparatus 100.

[0052] 3 to 6, the power module inspection apparatus 100 according to an embodiment can contact the power module 1 while covering at least a portion of the power module 1 from the upper and lower parts. The power module inspection apparatus 100 is configured to perform both a DC test and a voltage resistance test on the power module 1. For example, the power module 1 can perform a DC test and a voltage resistance test together through the socket boards 120 and 130 included in the power module inspection apparatus 100 without a transfer process in a state where the power module 1 is seated or mounted in the power module inspection apparatus 100.

[0053] The power module inspection apparatus 100 according to an embodiment may include a base plate 110 , a first socket board 120 , a second socket board 130 , a relay section 140 , and a test section 150 .

[0054] The first socket board 120 and the second socket board 130 may be mounted on one surface of the base plate 110. For example, the base plate 110 may support the first socket board 120 and the second socket board 130. Although not shown, the base plate 110 may be disposed on an upper portion of a test head (not shown), in which the test head is electrically connected to the first socket board 120, the second socket board 130, and the relay unit 140, and may generate a test control signal and provide it to the test unit 150, and generate a relay control signal and provide it to the relay unit 140. According to various embodiments, the base plate 110 may be a part of the test head.

[0055] The first socket board 120 may be a test board for a withstand voltage test of the power module 1. The first socket board 120 may include a first plate 121 and a first withstand voltage test pin 123 arranged in a partial area of ​​the first plate 121. For example, the first withstand voltage test pin 123 may be arranged in a center part of one surface of the first plate 121. The first withstand voltage test pin 123 may include a pogo pin. The position and the number of the first withstand voltage test pin 123 are not limited to those in the illustrated embodiment.

[0056] The first socket board 120 is configured to be electrically connected to the power module 1 through the first withstand voltage test pin 123. For example, when the first withstand voltage test pin 123 contacts the power module 1, an electrical connection may be formed between the power module 1, the first socket board 120, and the test unit 150.

[0057] The first withstand voltage test pin 123 of the first socket board 120 may receive a test signal (e.g., an electrical signal for a withstand voltage test) from the test unit 150 and may be connected to the power module 1 to transmit the withstand voltage test signal to the power module 1. The first withstand voltage test pin 123 may be electrically connected to at least a portion of the plurality of relays included in the relay unit 140. The first withstand voltage test pin 123 of the first socket board 120 may be electrically connected to or disconnected from the test unit 150 based on a switching operation of the relay unit 140.

[0058] The first socket board 120 may be composed of two boards so as to contact the upper and lower parts of the power module 1, respectively. For example, the first socket board 120 may include a lower socket board 120a and an upper socket board 120b having the same shape. In the power module inspection apparatus 100, the lower socket board 120a and the upper socket board 120b may be provided so that the first withstand voltage test pins 123 face the power module 1. The lower socket board 120a may be disposed on the base plate 110 so that the first withstand voltage test pins 123 face the power module 1, and the upper socket board 120b may be disposed on the upper part of the power module 1 so that the first withstand voltage test pins 123 face the power module 1 when the power module 1 is mounted in the inspection apparatus 100. For example, when inspecting the power module 1, the first withstand voltage test pin 123 of the lower socket board 120a may be arranged to face the lower substrate 20 of the power module 1 and may come into contact with the lower substrate 20, and the first withstand voltage test pin 123 of the upper socket board 120b may be arranged to face the upper substrate 30 of the power module 1 and may come into contact with the upper substrate 30.

[0059] The first plate 121 of the first socket board 120 may include a heat source capable of applying heat to the power module 1 in order to test the power module 1 under high temperature conditions. For example, the first socket board 120 may be a heating block having a hot wire or heater disposed therein.

[0060] The second socket board 130 may be a test board for a withstand voltage test and a DC test of the power module 1. The second socket board 130 may include a second plate 131, a DC test pin 133 disposed in a partial area of ​​the second plate 131, and a second withstand voltage test pin 135 disposed between the DC test pins 133. The DC test pins 133 and the second withstand voltage test pins 135 may be disposed to cross each other. For example, the DC test pins 133 may be formed in a plurality over the entire area of ​​one surface of the second plate 131, and the second withstand voltage test pins 135 may be formed in a plurality to be positioned between the plurality of DC test pins 133. The DC test pins 133 and the second withstand voltage test pins 135 may include pogo pins. The positions and the numbers of the DC test pins 133 and the second withstand voltage test pins 135 are not limited to those in the illustrated embodiment.

[0061] The second socket board 130 is configured to be electrically connected to the power module 1 via the DC test pin 133 and the second withstand voltage test pin 135. For example, the DC test pin 133 and the second withstand voltage test pin 135 contact the power module 1, so that an electrical connection may be formed between the power module 1, the second socket board 130, and the test unit 150.

[0062] The DC test pin 133 and the second withstand voltage test pin 135 of the second socket board 130 may receive a test signal (e.g., an electrical signal for a withstand voltage test or an electrical signal for a DC test) from the test unit 150 and may be connected to the power module 1 to transmit the withstand voltage test signal or the DC test signal to the power module 1. Each of the DC test pin 133 and the second withstand voltage test pin 135 may be electrically connected to at least a portion of a plurality of relays included in the relay unit 140. Each of the DC test pin 133 and the second withstand voltage test pin 135 may be electrically connected to a plurality of relays in parallel. Each of the DC test pin 133 and the second withstand voltage test pin 135 of the second socket board 130 may be electrically connected to or disconnected from the test unit 150 based on a switching operation of the relay unit 140.

[0063] The DC test pin 133 and the second withstand voltage test pin 135 of the second socket board 130 may be selectively electrically connected to the test unit 150 by the relay unit 140. For example, when a DC test is performed on the power module 1, the DC test pin 133 of the second socket board 130 is electrically connected to the test unit 150 to transmit an electrical signal for the DC test to the power module 1, and the second withstand voltage test pin 135 is not electrically connected to the test unit 150. Conversely, when a withstand voltage test is performed on the power module 1, the second withstand voltage test pin 135 of the second socket board 130 is electrically connected to the test unit 150 to transmit an electrical signal for the withstand voltage test to the power module 1, and the DC test pin 133 is not electrically connected to the test unit 150.

[0064] The second socket board 130 may be configured to contact the power leads 50 and the signal leads 60 of the power module 1, respectively. For example, the second socket board 130 may be disposed at a position corresponding to the power leads 50 and the signal leads 60, and may be configured in a plurality of pieces so as to contact the power leads 50 and the signal leads 60. The second socket board 130 may be disposed on the base plate 110 so as to be located on both sides of the short side direction of the lower socket board 120a in correspondence with the positions of the power leads 50 and the signal leads 60. For example, the second socket board 130 may include a power lead socket board 130a corresponding to the power leads 50 and a signal lead socket board 130b corresponding to the signal leads 60. For example, when the power module 1 is mounted on the inspection device 100 for inspection of the power module 1, at least a portion of the plurality of DC test pins 133 and the plurality of second withstand voltage test pins 135 of the second socket board 130 may contact the power leads 50 and the signal leads 60 of the power module 1. However, the position and / or number of the second socket boards 130 are not limited to the illustrated embodiment.

[0065] The power lead socket board 130a may be configured such that the plurality of power leads 50 come into contact with the DC test pin 133 and the second withstand voltage test pin 135, respectively, when the power module 1 is seated or mounted on the power module inspection equipment 100. For example, the DC test pin 133 and the second withstand voltage test pin 135 may be disposed at positions such that the plurality of power leads 50 are simultaneously in contact with the DC test pin 133 and the second withstand voltage test pin 135 when the power module 1 is seated on the power module inspection equipment 100.

[0066] The socket board 130b for signal leads may be configured such that the plurality of signal leads 60 come into contact with the DC test pin 133 and the second withstand voltage test pin 135, respectively, when the power module 1 is seated or mounted on the power module inspection apparatus 100. For example, the DC test pin 133 and the second withstand voltage test pin 135 may be disposed at positions such that the plurality of signal leads 60 are simultaneously in contact with the DC test pin 133 and the second withstand voltage test pin 135 when the power module 1 is seated on the power module inspection apparatus 100.

[0067] The relay unit 140 can switch the operation mode of the power module inspection apparatus 100 according to the items (or electrical characteristics) to be evaluated for the power module 1. For example, the relay unit 140 can switch the operation mode of the power module inspection apparatus 100 between a withstand voltage test mode and a DC test mode by disconnecting the electrical connection between the test unit 150 and the test pins (withstand voltage test pins 123, 135 and DC test pin 133) through a switching operation. The relay unit 140 can include a cylinder relay, thereby reducing the influence of electrical noise. However, the type of the relay unit 140 is not limited to the above examples. According to various embodiments, the relay unit 140 can correspond to a switch unit.

[0068] The relay unit 140 may be electrically connected to the socket boards 120 and 130 and the test unit 150. The relay unit 140 may include a plurality of relays, which are connected between the test pins 123, 133, and 135 formed on the socket boards 120 and 130 and the test unit 150 to partially connect or disconnect an electrical path between the test pins 123, 133, and 135 and the test unit 150. For example, some of the multiple relays may be connected between the first withstand voltage test pin 123 of the first socket board 120 and the test unit 150 to interrupt (block or allow) the electrical connection therebetween, other parts may be connected between the second withstand voltage test pin 135 of the second socket board 130 and the test unit 150 to interrupt (block or allow) the electrical connection therebetween, and still other parts may be connected between the DC test pin 133 of the second socket board 130 and the test unit 150 to interrupt (block or allow) the electrical connection therebetween.

[0069] The connection between the plurality of relays included in the relay unit 140 and the test pins 123, 133, and 135 may be realized in various ways. For example, the first withstand voltage test pin 123 and the second withstand voltage test pin 135 may be connected to the test unit 150 using one relay, or each may be connected to the test unit 150 using a separate relay. Also, the plurality of DC test pins 133 may be divided into a plurality of groups, and the pins included in one group may be connected to the test unit 150 using one relay, or each of the plurality of DC test pins 133 may be connected to the test unit 150 using a separate relay. However, the above content is merely an example, and the connection / arrangement may be realized in various ways within a range in which the electrical connection between the withstand voltage test pins 123, 135 and the test unit 150 and between the DC test pin 133 and the test unit 150 can be selectively disconnected using the relay unit 140.

[0070] The relay unit 140 is configured such that in the DC test mode, a relay connected to the withstand voltage test pins 123 and 135 is opened (off state) and a relay connected to the DC test pin 133 is closed (on state) so that the DC test pin 133 is conductive and an electrical signal for the DC test generated by the test unit 150 can be transferred to the power module 1. Also, the relay unit 140 is configured such that in the withstand voltage test mode, a relay connected to the DC test pin 133 is opened (off state) and a relay connected to the withstand voltage test pins 123 and 135 is closed (on state) so that the withstand voltage test pins 123 and 135 are conductive and an electrical signal for the withstand voltage test generated by the test unit 150 can be transferred to the power module 1.

[0071] The test unit 150 may generate a test signal (or an electrical signal) for testing electrical characteristics of the power module 1 and transmit the test signal to the power module 1. The test unit 150 may generate an electrical signal for a DC test of the power module 1 and an electrical signal for a withstand voltage test. The DC test may be a test for evaluating whether the semiconductor element 40 in the power module 1 operates correctly by applying a preset voltage to the power module 1 and measuring DC characteristics such as open / short, input current, output voltage, and power supply current. The withstand voltage test may be a test for evaluating an electrical insulation state by applying a high voltage to the power module 1 and checking whether a leakage current falls below a certain level. However, the test method is not limited to the above examples.

[0072] Although not shown, the test unit 150 may include a DC test unit that generates a test signal for performing a DC test and a voltage resistance test unit that generates a test signal for a voltage resistance test. According to various embodiments, the test unit 150 may be included in a test head (not shown).

[0073] The test unit 150 can supply current or voltage to check whether the power module 1 is in normal contact with the withstand voltage test pins 123, 135 and the DC test pin 133, i.e., whether the power module 1 is normally connected to the socket boards 120, 130.

[0074] FIG. 7 is a diagram showing an electrical connection path for a withstand voltage test of a power module 1 in a power module testing apparatus 100 according to an embodiment of the present invention.

[0075] In describing FIG. 7, reference will also be made to the above-mentioned FIGS.

[0076] 7, the power module 1 may perform a withstand voltage test by electrically connecting the upper substrate 30 and the lower substrate 20 to the test unit 150 at a common node and electrically connecting the signal lead 60 and the power lead 50 to the test unit 150 at a common node. For example, the test unit 150 shown in FIG 7 may correspond to a withstand voltage test unit (or withstand voltage tester) for performing a withstand voltage test.

[0077] The upper substrate 30 and the lower substrate 20 of the power module 1 may be electrically connected to the test unit 150 via the first withstand voltage test pins 123 of the upper socket board 120b and the lower socket board 120a, and the power leads 50 and the signal leads 60 of the power module 1 may be electrically connected to the test unit 150 via the second withstand voltage test pins 135 of the second socket board 130.

[0078] The test unit 150 can apply a high voltage to the power module 1 to evaluate the insulation state and voltage resistance level of the power module 1. For example, the withstand voltage test can be performed by applying a high-voltage alternating current (AC) voltage waveform of about 3300V to the power module 1. By using the AC waveform, the withstand voltage in both + and - directions can be evaluated. However, the withstand voltage test method is not limited to the above examples.

[0079] 8a is a diagram showing a circuit for a DC test of the power module testing apparatus 100 according to an embodiment of the present invention, and FIG 8b is a diagram showing a circuit for a withstand voltage test of the power module testing apparatus 100 according to an embodiment of the present invention.

[0080] 8a and 8b are diagrams illustrating circuit connections when a DC test and a voltage withstand test are performed using a power module testing apparatus 100 according to an embodiment of the present invention.

[0081] Fig. 8a shows a circuit connection state when the power module inspection apparatus 100 is in a DC test mode for performing a DC test on the power module 1, and Fig. 8b shows a circuit connection state when the power module inspection apparatus 100 is in a withstand voltage test mode for performing a withstand voltage test on the power module 1. In describing Figs. 8a and 8b, reference will be made to Figs. 3 to 7 described above.

[0082] 8a and 8b, the power module inspection apparatus 100 according to an embodiment operates to configure the DC test circuit as a closed circuit and open the voltage withstand test circuit in the DC test mode, and to configure the voltage withstand test circuit as a closed circuit and open the DC test circuit in the voltage withstand test mode.

[0083] 8a, when the power module inspection apparatus 100 is in the DC test mode, the cylinder relay 141 connected to the DC test pin 133 is closed and the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is opened, so that the DC test circuit forms a closed circuit. As a result, only the DC test pin 133 is conductive and the withstand voltage test pins 123 and 135 are not conductive, so that the DC test signal generated by the test unit 150 can be applied to the power module 1 (particularly, the power lead 50 and the signal lead 60) via the DC test pin 133.

[0084] 8b, when the power module inspection apparatus 100 is in the withstand voltage test mode, the cylinder relay 141 connected to the DC test pin 133 is opened and the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is closed, so that the withstand voltage test circuit forms a closed circuit. As a result, only the withstand voltage test pins 123 and 135 are conductive and the DC test pin 133 is not conductive, so that the withstand voltage test signal generated by the test unit 150 can be applied to the power module 1 (particularly, the upper substrate 30, the lower substrate 20, the power lead 50, and the signal lead 60) through the withstand voltage test pins 123 and 135.

[0085] A method for testing the electrical characteristics of the power module 1 using the power module testing apparatus 100 according to an embodiment of the present invention will be described below.

[0086] First, in order to test the power module 1, the power module 1 is mounted on the power module inspection apparatus 100. When the power module 1 is mounted on the power module inspection apparatus 100, the power module 1 may be disposed on the upper socket board 120b and the lower socket board 120a. When mounted on the power module inspection apparatus 100, the power module 1 may be disposed such that the upper substrate 30 and the lower substrate 20 contact the first withstand voltage test pin 123 of the first socket board 120, and the power lead 50 and the signal lead 60 contact the second withstand voltage test pin 135 and the DC test pin 133 of the second socket board 130.

[0087] After the power module 1 is mounted, a small amount of current may be applied to check whether the power module 1 is electrically connected to the first socket board 120 and the second socket board 130.

[0088] After checking the installation and electrical connection state of the power module 1, the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is opened, and the cylinder relay 141 connected to the DC test pin 133 is closed, thereby performing a DC test on the power module 1.

[0089] After the DC test is completed, the cylinder relay 141 connected to the DC test pin 133 is opened, and the cylinder relay 143 connected to the withstand voltage test pins 123 and 135 is closed to perform the withstand voltage test on the power module 1.

[0090] That is, according to the power module inspection apparatus 100 of the present invention, since the DC test and the voltage withstand test on the power module 1 are performed with one equipment or process, separate processes and equipment are not required, thereby reducing the costs of the processes and equipment, and since there is no need to transport the power module 1 between the DC test and the voltage withstand test, the process can be simplified and mass productivity can be improved.

[0091] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope that does not deviate from the technical idea of ​​the present invention described in the claims.

[0092] In addition, in the embodiments of the present invention, some components may be omitted, and the configurations of the embodiments may be combined with each other. [Explanation of symbols]

[0093] 1 Power Module 10 housing 20 lower board 30 Upper substrate 40 Semiconductor element 50 Power Leads 60 Signal Leads 70 Wire 80 Spacer 90 Soldering materials 100 Power module inspection equipment 110 Base plate 120 First socket board 120a Lower Socket Board 120b Upper Socket Board 121 First plate 123 First voltage test pin 130 Second socket board 130a Power lead socket board 130b Socket board for signal leads 131 Second plate 133 DC test pin 135 Second voltage test pin 140 Relay section 141, 143 Cylinder relay 150 Testing Section

Claims

1. a first socket board including a first withstand voltage test pin; a second socket board including a second withstand voltage test pin and a DC test pin; a test unit configured to generate a withstand voltage test signal and transmit it to the first withstand voltage test pin and the second withstand voltage test pin, and to generate a DC test signal and transmit it to the DC test pin; and a relay unit for interrupting or allowing electrical connection between at least one of the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin and the test unit.

2. The power module comprises: a lower substrate, an upper substrate disposed next to the lower substrate, and a semiconductor device disposed between the lower substrate and the upper substrate, The first socket board includes:

2. The power module inspection apparatus of claim 1, further comprising: an upper socket board arranged to face the upper substrate; and a lower socket board arranged to face the lower substrate.

3. the first withstand voltage test pin of the upper socket board contacts at least a portion of the upper substrate; The power module inspection device according to claim 2 , wherein the first withstand voltage test pin of the lower socket board contacts at least a portion of the lower substrate.

4. The power module comprises: Further comprising power leads and signal leads, at least a portion of which is exposed to the outside of the housing of the power module; 4. The power module inspection apparatus according to claim 3, wherein the second socket board is provided such that the second withstand voltage test pin and the DC test pin are in contact with the power lead and the signal lead, respectively.

5. The second socket board includes: a power lead socket board corresponding to the power leads and a signal lead socket board corresponding to the signal leads, 5. The power module inspection apparatus according to claim 4, wherein the power lead socket board and the signal lead socket board are disposed on both sides of the lower socket board.

6. the second withstand voltage test pin and the DC test pin of the power lead socket board contact at least a part of the power lead; 6. The power module inspection device according to claim 5, wherein the second withstand voltage test pin and the DC test pin of the signal lead socket board contact at least a part of the signal lead.

7. the first socket board further includes a first plate; 2. The power module inspection device according to claim 1, wherein the first withstand voltage test pin is positioned on the first plate so as to face the power module.

8. the second socket board further includes a second plate; the DC test pin is composed of a plurality of DC test pins, and is positioned on the second plate so as to face the power module; 2. The power module inspection device according to claim 1, wherein the second withstand voltage test pin is positioned between a plurality of the DC test pins so as to face the power module.

9. The power module inspection apparatus is operable in a DC test mode or a voltage withstand test mode; The relay unit includes:

2. The power module inspection device according to claim 1, wherein the power module inspection device is switched to the DC test mode or the voltage withstand test mode by interrupting an electrical connection between the DC test pin and the test unit and an electrical connection between the first and second voltage withstand test pins and the test unit.

10. The relay unit includes: The power module inspection apparatus of claim 9 , wherein the test unit is electrically connected to the DC test pin in the DC test mode.

11. The relay unit includes: The power module inspection apparatus of claim 9 , wherein the test unit is electrically connected to the first withstand voltage test pins and the second withstand voltage test pins in the withstand voltage test mode.

12. The relay unit includes:

10. The power module inspection apparatus of claim 9, further comprising a plurality of relays connected between the first withstand voltage test pin and the test portion, between the second withstand voltage test pin and the test portion, and between the DC test pin and the test portion.

13. In the DC test mode, 13. The power module inspection device of claim 12, wherein a relay connected to the DC test pin among the plurality of relays is closed, and a relay connected to the first withstand voltage test pin and the second withstand voltage test pin among the plurality of relays is opened.

14. In the withstand voltage test mode, 13. The power module inspection device of claim 12, wherein among the plurality of relays, a relay connected to the first withstand voltage test pin and the second withstand voltage test pin is closed, and among the plurality of relays, a relay connected to the DC test pin is opened.

15. The power module inspection device according to claim 12 , wherein the plurality of relays includes a cylinder relay.

16. mounting the power module on an inspection device; operating the test device in a DC test mode to perform a DC test on the power module; and operating the inspection device in a withstand voltage test mode to perform a withstand voltage test on the power module; The inspection device includes: a first socket board including a first withstand voltage test pin; a second socket board including a second withstand voltage test pin and a DC test pin; A test unit that generates a withstand voltage test signal and a DC test signal; and a relay unit for switching an operation mode of the inspection device between the DC test mode and the withstand voltage test mode; A method for inspecting a power module, wherein, in the step of mounting the power module on an inspection device, the power module is configured to come into contact with the first withstand voltage test pin, the second withstand voltage test pin, and the DC test pin.

17. In the step of performing a DC test on the power module, The method of claim 16 , wherein the relay unit is configured to electrically connect the test unit to the DC test pin.

18. In the step of performing a voltage resistance test on the power module, The method of claim 16 , wherein the relay unit is configured to electrically connect the test unit to the first withstand voltage test pin and the second withstand voltage test pin.

19. The relay unit includes:

17. The method of claim 16, further comprising a plurality of relays connected between the first withstand voltage test pin and the test portion, between the second withstand voltage test pin and the test portion, and between the DC test pin and the test portion.

20. In the DC test mode, Among the plurality of relays, a relay connected to the DC test pin is closed, and among the plurality of relays, a relay connected to the first withstand voltage test pin and the second withstand voltage test pin is opened, In the withstand voltage test mode, 20. The method of claim 19, wherein among the plurality of relays, a relay connected to the first withstand voltage test pin and the second withstand voltage test pin is closed, and among the plurality of relays, a relay connected to the DC test pin is opened.

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