Multilayer electronic component

Abstract

To provide a multilayer electronic component which suppresses the occurrence of a crack due to stress generated in a ceramic firing process.SOLUTION: A multilayer electronic component 100 comprises: a main body that includes a dielectric layer and an internal electrode that are alternately arranged in a first direction, and includes a first surface 1 and a second surface 2 opposing each other in the first direction, a third surface 3 and a fourth surface 4 opposing each other in a second direction, and a fifth surface 5 and a sixth surface 6 opposing each other in a third direction; an insulation layer 140 that is arranged on the first surface, the second surface, the fifth surface, and the sixth surface, and includes at least one of Al2O3 and a BN; and an external electrode. Both of the first surface and the second surface of the main body, are concave into the main body. Thereby, a crack due to expansion in a thickness direction due to a reverse piezoelectric phenomenon may be prevented.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Multilayer ceramic capacitors can be used as components in various electronic devices due to their advantages of being small, having high capacitance, and being easy to mount. Recently, their range of use has been expanding, including servers and electronic components for automobiles. This has created a demand for the development of MLCCs with higher standards and reliability than previously required specifications. Summary of the Invention [Problem to be solved by the invention]

[0004] One of the various objects of the present invention is to provide a multilayer electronic component with improved reliability.

[0005] One of the various objects of the present invention is to provide a multilayer electronic component in which the occurrence of cracks is suppressed.

[0006] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0007] A multilayer electronic component according to one embodiment of the present invention includes a body including dielectric layers and internal electrodes alternately arranged in a first direction, the body including first and second sides facing each other in the first direction, third and fourth sides connected to the first and second sides and connected in the second direction, and fifth and sixth sides connected to the first to fourth sides and facing each other in the third direction, insulating layers disposed on the first, second, fifth, and sixth sides and including at least one of Al2O3 and BN, and an external electrode disposed on the body, and the first and second sides may be concave into the body.

[0008] A multilayer electronic component according to one embodiment of the present invention includes a body including dielectric layers and internal electrodes alternately arranged in a first direction, the body including first and second sides facing each other in the first direction, third and fourth sides connected to the first and second sides and connected in the second direction, and fifth and sixth sides connected to the first to fourth sides and facing each other in the third direction, insulating layers including BN and arranged on the first, second, fifth and sixth sides, and an external electrode arranged on the body. Effect of the Invention

[0009] One of the various advantages of the embodiments of the present invention is that the occurrence of cracks in a multilayer electronic component can be suppressed by controlling the shape of the main body by disposing an insulating layer on at least a portion of the surface of the main body.

[0010] However, the various and beneficial advantages and effects of the embodiments of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' of FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view taken along line II-II' of FIG. 1. [Figure 4]3 is an enlarged view of the K1 region in FIG. 2. [Diagram 5] 1 is a schematic diagram showing a WT cross section of a comparative example. [Figure 6] 5 is a diagram corresponding to FIG. 4 according to one embodiment. [Figure 7] 5 is a diagram corresponding to FIG. 4 according to another embodiment. [Figure 8] 5 is a view corresponding to FIG. 4 according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to ordinary skilled artisans. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0013] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Also, components having the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, this does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified to the contrary.

[0014] In the drawings, the first direction may be defined as a stacking direction or a thickness T direction, the second direction may be defined as a length L direction, and the third direction may be defined as a width W direction.

[0015] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line II' in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line II' in FIG. 1, and FIG. 4 is an enlarged view of area K1 in FIG. 2.

[0016] A multilayer electronic component 100 according to an embodiment of the present invention will be described in detail below with reference to Figures 1 to 4. Also, a multilayer ceramic capacitor (hereinafter, referred to as "MLCC") will be described as an example of the multilayer electronic component, but the present invention is not limited thereto and can be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, thermistors, and the like.

[0017] A multilayer electronic component 100 according to one embodiment of the present invention includes a body 110 including dielectric layers 111 and internal electrodes 121, 122 alternately arranged in a first direction, and including first and second surfaces 1, 2 facing each other in the first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and connected in the second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other in the third direction, insulating layers 140 arranged on the first, second, fifth and sixth surfaces, and external electrodes 131, 132 arranged on the body.

[0018] In one embodiment, the insulating layer 140 can be BN.

[0019] In one embodiment, the insulating layer 140 may include one or more of Al2O3 and BN, and the first and second surfaces may be concave into the body.

[0020] Regardless of the type of material, ceramics used as the material for the dielectric layer 111 will undergo permanent deformation such as viscous flow and firing deformation during the high-temperature firing process due to its characteristics. This means that it will cause deformation of the chip, and stress will occur accompanied by a change in volume due to the deformation. This stress includes a combination of mechanical stress and thermal stress, and such stress may cause cracks in the chip or destroy the chip.

[0021] Therefore, in the present invention, a ceramic material that has a different shrinkage rate than the main body during sintering is placed on the surface of the main body, thereby utilizing the deformation characteristics of the ceramic material to relieve stress during sintering, suppress the occurrence of cracks, and control the shape of the main body.

[0022] 5, in a conventional general body 10, which is a comparative example in which no insulating layer is disposed on the body surface, the internal electrode pattern shrinks during the sintering process, causing the body thickness to increase, and the cover portion has a convex shape, resulting in a cover convex phenomenon, and the margin portion has a concave shape, resulting in a margin concave phenomenon. When the cover portion is convex as in the conventional general body 10, when an electric field is applied to the MLCC chip, the chip expands in the T direction (thickness direction) due to the reverse piezoelectric phenomenon, and cracks may occur.

[0023] Meanwhile, according to an embodiment of the present invention, by disposing an insulating layer on the surface of the body, it is possible to suppress the cover convex phenomenon of the body 110 during the sintering process, thereby suppressing the occurrence of cracks.

[0024] Hereinafter, each component included in the multilayer electronic component 100 according to one embodiment of the present invention will be described.

[0025] The body 110 may include dielectric layers 111 and internal electrodes 121 and 122 that are alternately laminated.

[0026] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in the second direction, and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4, and facing each other in the third direction.

[0027] In an embodiment, the first and second surfaces 1 and 2 of the body 110 may be concave into the body. Since the first and second surfaces 1 and 2 of the body 110 are concave into the body, it is possible to prevent cracks from occurring due to expansion in the T direction (thickness direction) caused by the inverse piezoelectric phenomenon.

[0028] In one embodiment, in a cross section of the multilayer electronic component 100 cut in the first and third directions at the center in the second direction, when the minimum size in the first direction at the center of the multilayer electronic component 100 in the third direction is Tc and the maximum size in the first direction at the end portion in the third direction is Te, Tc / Te can be less than 1.000 and more than 0.950.

[0029] In the above first and third direction cross sections, the laminated electronic component 100 is divided into five equal parts in the third direction, and the first direction size is measured at five evenly spaced points in the first or fifth region, and the maximum size can be set to Te, and the first direction size is measured at five evenly spaced points in the third region, and the minimum size can be set to Tc.

[0030] In one embodiment, the fifth and sixth faces 5, 6 of the body 110 may be concave into the body.

[0031] In addition, in a cross section cut in the first and third directions from the center in the second direction of the multilayer electronic component 100, when the minimum size in the third direction at the center part of the multilayer electronic component 100 in the first direction is Wc and the maximum size in the third direction at the end part in the first direction is We, Wc / We can be less than 1.000 and more than 0.950.

[0032] In the above first and third direction cross sections, the laminated electronic component 100 is divided into five equal parts in the first direction, and the third direction size is measured at five evenly spaced points in the first or fifth region, and the maximum size can be defined as We, and the third direction size is measured at five evenly spaced points in the third region, and the minimum size can be defined as Wc.

[0033] In one embodiment, the third and fourth faces 3, 4 of the body 110 may be concave into the body.

[0034] Furthermore, in a cross section of laminated electronic component 100 cut in the first and second directions at the center in the third direction, when the minimum size in the second direction of main body 110 at the center in the first direction is Wc and the maximum size in the second direction at the end in the first direction is We, Wc / We can be less than 1.000 and more than 0.950.

[0035] In the above first and second direction cross sections, the laminated electronic component 100 is divided into five equal parts in the first direction, and the second direction size is measured at five evenly spaced points in the first or fifth region, and the maximum size can be Le, and the third direction size is measured at five evenly spaced points in the third region, and the minimum size can be Lc.

[0036] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of laminated dielectric layers is not particularly limited, and may be determined in consideration of the size of the laminated electronic component. For example, the body may be formed by laminating 400 or more dielectric layers.

[0037] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder can be used as the ceramic powder. More specifically, the ceramic powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0038] In one embodiment, the dielectric layer 111 can include one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1). Thereby, the difference in shrinkage rate during firing with the insulating layer 140 can be easily controlled, and the shape of the main body can be more easily controlled.

[0039] In one embodiment, the dielectric layer 111 may contain, as a main component, a material that has a smaller shrinkage rate during firing than the insulating layer 140. If the dielectric layer 111 has a larger shrinkage rate during firing than the insulating layer 140, the cover convex phenomenon may occur excessively during the sintering process, and the first and second surfaces are likely to have a convex shape. On the other hand, if the dielectric layer 111 has a smaller shrinkage rate during firing than the insulating layer 140, the cover convex phenomenon may be suppressed during the sintering process, and further, the first and second surfaces are likely to have a concave shape.

[0040] The average thickness of the dielectric layers 111 does not need to be particularly limited, but the average thickness of at least one of the dielectric layers 111 may be 0.1 μm or more and 10 μm or less. The average thickness of the dielectric layers 111 may be set arbitrarily depending on the desired characteristics and applications. For example, in the case of an electronic component for high-voltage electrical equipment, the average thickness of at least one of the dielectric layers 111 may be 0.5 μm or more, and in order to realize the capacitance of the multilayer electronic component, the average thickness of at least one of the dielectric layers 111 may be less than 2.8 μm.

[0041] The main body 110 is arranged inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 arranged opposite each other with a dielectric layer 111 between them, and may include a capacitance forming portion Ac in which a capacitance is formed, and cover portions 112, 113 formed at the upper and lower parts in a first direction of the capacitance forming portion Ac.

[0042] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly laminating a plurality of first and second internal electrodes 121, 122 with the dielectric layer 111 interposed therebetween.

[0043] The cover parts 112 and 113 may include an upper cover part 112 disposed on an upper part of the capacitance forming part Ac in a first direction, and a lower cover part 113 disposed on a lower part of the capacitance forming part Ac in the first direction.

[0044] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and may basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0045] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0046] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0047] The thickness of the cover parts 112, 113 does not need to be particularly limited. For example, the average thickness of the cover parts 112, 113 may be 300 μm or less, or 1 to 20% of the size of the main body in the first direction. Here, the average thickness of the cover parts 112, 113 means the average thickness of each of the upper cover part 112 and the lower cover part 113. The average thickness of the cover parts 112, 113 may mean the average size of the cover parts 112, 113 in the first direction, and may be an average value of the size in the first direction measured at five equally spaced points on the cross sections of the main body 110 in the first and second directions.

[0048] Moreover, margin portions 114 and 115 can be disposed on the side surfaces of the capacitance forming portion Ac.

[0049] The margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the ceramic body 110 in the width direction.

[0050] The margin portions 114, 115 may refer to the regions between both ends of the first and second internal electrodes 121, 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness WT direction, as shown in FIG. 3.

[0051] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0052] The margin parts 114 and 115 can be formed by forming internal electrodes by applying a conductive paste to the ceramic green sheet except for the areas where the margin parts are to be formed.

[0053] In addition, in order to suppress steps caused by the internal electrodes 121, 122, after lamination, the internal electrodes can be cut so as to be exposed on the fifth and sixth faces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side faces of the capacitance forming portion Ac to form margin portions 114, 115.

[0054] Meanwhile, there is no need to particularly limit the width of the marginal portions 114, 115. For example, the average width of the marginal portions 114, 115 may be 400 μm or less, or 1 to 15% of the size of the main body in the third direction.

[0055] The average width of the margin portions 114, 115 may mean the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and may be the average value of the third direction sizes of the margin portions 114, 115 measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0056] The internal electrodes 121, 122 may include first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 are alternately arranged to face each other with the dielectric layer 111 constituting the body 110 interposed therebetween, and may be exposed to third and fourth surfaces 3, 4 of the body 110, respectively.

[0057] The first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed through the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed through the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the body and connected to the second internal electrode 122.

[0058] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Thus, the first internal electrode 121 may be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 may be formed at a certain distance apart on the third surface 3. In addition, the first and second internal electrodes 121 and 122 may be disposed at a certain distance apart from the fifth and sixth surfaces of the body 110.

[0059] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0060] There is no particular limitation on the method for forming the internal electrodes 121 and 122. For example, the internal electrodes 121 and 122 may be formed by applying a conductive paste for internal electrodes containing a conductive metal onto a ceramic green sheet and firing the sheet. The method for applying the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0061] As another example, the internal electrodes 121 and 122 may be formed using a sputtering method, a vacuum deposition method, and / or a chemical vapor deposition method.

[0062] The average thickness of the internal electrodes 121, 122 does not need to be particularly limited, but may be, for example, 3.0 μm or less. The average thickness of the internal electrodes 121, 122 may be set arbitrarily according to the desired characteristics and applications. For example, in the case of an electronic component for high-voltage electrical equipment, the average thickness of at least one of the internal electrodes 121, 122 may be 0.1 μm or more, and in order to realize the capacity of the multilayer electronic component, the average thickness of at least one of the internal electrodes 121, 122 may be less than 1.0 μm.

[0063] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122 refer to the size of the dielectric layer 111 and the internal electrodes 121, 122 in the first direction, respectively. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122 may be measured by scanning the cross sections of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average thickness of the dielectric layer 111 may be measured by measuring the thickness at a number of points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then measuring the average value. Also, the average thickness of the internal electrodes 121, 122 may be measured by measuring the thickness at a number of points of one internal electrode 121, 122, for example, 30 points equally spaced in the second direction, and then measuring the average value. The 30 equally spaced points may be designated by a capacitance forming unit. On the other hand, if such average value measurements are performed on 10 dielectric layers 111 and 10 internal electrodes 121, 122, respectively, and then the average thicknesses are measured, the average thicknesses of the dielectric layers 111 and the internal electrodes 121, 122 can be further generalized.

[0064] The insulating layer 140 may be disposed on the first, second, fifth and sixth surfaces of the body 110. This allows the moisture resistance reliability to be improved by covering fine pores and cracks in the body 110, and allows the shape of the body 110 to be easily controlled by effectively controlling stress caused by heat.

[0065] In an embodiment, the insulating layer 140 may include a material having a larger shrinkage rate during firing than the dielectric layer 111. This may prevent the cover convex phenomenon of the body 110 during the sintering process, thereby preventing the occurrence of cracks.

[0066] In one embodiment, the insulating layer 140 may include at least one of Al2O3 (alumina) and BN (boron nitride). As a result, the insulating layer 140 has excellent adhesion to the body 110 and may suppress the cover convex phenomenon of the body 110 during the sintering process. Furthermore, the first and second surfaces of the body 110 may be easily controlled to be concave inside the body.

[0067] In one embodiment, the insulating layer 140 may include BN, which has a larger shrinkage rate than Al2O3 during the sintering process, and thus may more easily suppress the cover convex phenomenon.

[0068] The method of forming the insulating layer 140 is not particularly limited. For example, a coating liquid may be prepared by mixing a powder having a particle size of 3 μm with a water-based binder, and the coating liquid may be applied to the main body 110 using a brush after the calcination process and before the sintering process, and the insulating layer 140 may be formed through the sintering process. In addition to the method using a brush, the coating liquid may be applied to the main body using physical vapor deposition methods such as electron beam evaporation or sputtering. In addition, it is easiest to apply the coating liquid after the calcination process and before the sintering process in order to control the shape of the main body, but the present invention is not limited thereto. The coating liquid may be applied after applying a paste for forming an external electrode or before forming a plating layer, or before forming a conductive resin layer.

[0069] At this time, in the coating liquid, the content of BN powder may be 9 wt% or less, and the content of Al2O3 powder may be 18 wt% or less.

[0070] Referring to FIG. 4, the insulating layer 140 may not be disposed on the third and fourth sides of the body.

[0071] 6, in one embodiment, the insulating layer 140' may be disposed to extend to at least a portion of the third and fourth surfaces. In this case, the insulating layer 140' may be disposed so as not to cover the internal electrodes 121 and 122 on the third and fourth surfaces. This can improve moisture resistance reliability without reducing electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132, and can more easily control the shape of the body 110.

[0072] In one embodiment, the body 110 may include the material included in the insulating layer 140 in a region adjacent to the insulating layer 140. This is because the material included in the insulating layer 140 may diffuse into the body 110 during the sintering process.

[0073] Meanwhile, the average thickness of the insulating layer 140 is not particularly limited, and can be appropriately adjusted to obtain a body with a desired shape. For example, the average thickness of the insulating layer 140 can be 10 to 300 μm. The average thickness of the insulating layer 140 can be measured by scanning the first and third direction cross sections cut at the center of the second direction of the body 110 with a scanning electron microscope (SEM) at a magnification of 10,000, and the insulating layer 140 can be distinguished as a layer having a light-dark difference from the body 110. The average value of the insulating layer 140 can be measured by measuring the thickness at 30 equally spaced points at the center of the second surface in the third direction.

[0074] The external electrodes 131 , 132 can be disposed on the body 110 .

[0075] Meanwhile, in the present embodiment, the multilayer electronic component 100 has a structure including two external electrodes 131, 132, but the number and shapes of the external electrodes 131, 132 may be changed according to the shape of the internal electrodes 121, 122 and other purposes. For example, the external electrodes may include a first external electrode disposed on the third surface, a second external electrode disposed on the fourth surface, and a third external electrode disposed on at least one of the first, second, fifth, and sixth surfaces.

[0076] In one embodiment, the external electrodes 131, 132 may include first and second external electrodes 131, 132 disposed on the third and fourth surfaces 3, 4 of the body 110, respectively, and connected to the first and second internal electrodes 121, 122, respectively. The first and second external electrodes may be disposed extending to a portion of the first and second surfaces.

[0077] Furthermore, the external electrodes 131 and 132 can be disposed so as to cover both end surfaces of the side margin portions 114 and 115 in the second direction.

[0078] In one embodiment, the external electrodes 131 , 132 are disposed on the third and fourth surfaces and may be disposed on at least a portion of the insulating layer 140 .

[0079] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0080] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0081] The plating layers 131b and 132b serve to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0082] As a more specific example of the plating layers 131b, 132b, the plating layers 131b, 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a, 132a, or in a form in which a Sn plating layer, a Ni plating layer and a Sn plating layer are sequentially formed. Also, the plating layers 131b, 132b may include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0083] 7, in one embodiment, the first external electrode 131 includes an electrode layer 131a connected to the internal electrode 121 and a plating layer 131b disposed on the electrode layer, and an insulating layer 140'' may be disposed extending between the electrode layer 131a and the plating layer 131b. Although only the first external electrode 131 is illustrated in FIG. 7, the second external electrode 132 may also have a corresponding configuration.

[0084] As a more specific example of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be fired electrodes including conductive metal and glass, or resin-based electrodes including conductive metal and resin. Also, the electrode layer 131a may have a multi-layer structure including a base electrode layer including glass in contact with the internal electrode, and a conductive resin layer including resin disposed on the base electrode layer.

[0085] Also, the electrode layers 131a and 132a may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0086] The conductive metal contained in the electrode layers 131a and 132a may be any material having excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0087] 8, in one embodiment, the first external electrode 131 includes a base electrode layer 131a1 in contact with the first internal electrode 121 and including glass, and a conductive resin layer 131a2 disposed on the base electrode layer and including resin, and an insulating layer 140''' may be disposed extending between the base electrode layer 131a1 and the conductive resin layer 131a2. In addition, the second external electrode 132 may also have a configuration corresponding to the first external electrode 131.

[0088] (Embodiment) The ceramic green sheets on which the internal electrode patterns were printed were laminated and pressed, and then cut into unit chip sizes. After calcination, in the comparative example, a sintering process was carried out without disposing an insulating layer on the main body surface to produce a sample chip, in the inventive example 1, a coating liquid containing 9 wt% BN was applied to the main body surface after the calcination process and a sintering process was carried out to produce a sample chip, and in the inventive example 2, a coating liquid containing 18 wt% Al2O3 was applied to the main body surface after the calcination process and a sintering process was carried out to produce a sample chip. Five sample chips were produced for each of the comparative example, inventive example 1, and inventive example 2, and their thickness, width, and length were measured. In a cross section of the sample chip cut in the first and third directions at the center in the second direction, the minimum size in the first direction at the center of the sample chip in the third direction is Tc, and the maximum size in the first direction at the end in the third direction is Te, both of which are listed in Table 1 below.The minimum size in the third direction at the center of the sample chip in the first direction is Wc, and the maximum size in the first direction at the end in the third direction is We, both of which are listed in Table 2 below.

[0089] In addition, in a cross section of the sample chip cut in the first and second directions at the center in the third direction, the minimum size in the second direction at the center of the sample chip in the first direction is Tc, and the maximum size in the second direction at the end in the first direction is Te, which are listed in Table 3 below.

[0090] [Table 1]

[0091] Referring to Table 1, in the comparative example, none of the five sample chips had a Tc / Te of less than 1.000, and four samples had a Tc / Te of more than 1.000 and the first and second surfaces of the body were convex.

[0092] In the case of Example 1 in which an insulating layer containing BN was arranged, it was confirmed that the Tc / Te of the five sample chips was 0.972 to 0.989, and the first and second surfaces of the main body were concave.

[0093] In the case of Example 2 in which an insulating layer containing Al2O3 is arranged, it can be confirmed that four out of five sample chips have a value in the range of 0.995 to 0.998, and that the first and second surfaces of the main body are concave. Also, in the case of Test No. 5 of Example 2 in which an insulating layer containing Al2O3 is arranged, it can be confirmed that the first and second surfaces are suppressed from being convex, compared to Test No. 2 of the comparative example.

[0094] [Table 2]

[0095] Referring to Table 2, it was measured that in the comparative example, there were two sample chips with Wc / We less than 1.000, in the invention example 1, there were five sample chips with Wc / We less than 1.000, and in the invention example 2, there were three sample chips with Wc / We less than 1.000. Therefore, it can be confirmed that when an insulating layer containing at least one of Al2O3 and BN is arranged, the shape of the body in the width direction can also be controlled.

[0096] [Table 3]

[0097] Referring to Table 3, the comparative example, invention example 1, and invention example 2 all had concave shapes with Lc / Le less than 1.000. However, the Lc / Le values ​​were lower in invention examples 1 and 2 than in the comparative example, and it was confirmed that the longitudinal shape of the body can also be controlled when an insulating layer containing at least one of Al2O3 and BN is disposed.

[0098] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various substitutions, modifications and changes can be made by a person skilled in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0099] In addition, the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe unique features that are different from each other. However, the above-mentioned one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that contradicts or contradicts the matter in the other embodiment.

[0100] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, a singular expression includes a plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0101] 100: Multilayer electronic components 110: Main unit 111: Dielectric layer 112, 113: Cover part 114, 115: Margin 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Electrode layer 131b, 132b: plating layer 140: Insulating layer

Claims

1. a body including dielectric layers and internal electrodes alternately arranged in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and connected in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; Al ２ O ３ and an insulating layer comprising at least one of BN; an external electrode disposed on the body; The first and second faces are concave into the body.

2. 2. The multilayer electronic component according to claim 1, wherein the fifth and sixth faces are concave into the body.

3. 2. The multilayer electronic component according to claim 1, wherein the third and fourth faces are concave into the body.

4. The multilayer electronic component according to claim 1 , wherein the insulating layer is disposed so as to extend to at least a portion of the third and fourth faces.

5. 5. The multilayer electronic component according to claim 4, wherein the insulating layer is disposed so as not to cover the internal electrodes on the third and fourth faces.

6. The multilayer electronic component according to claim 1 , wherein the insulating layer contains BN.

7. The dielectric layer is BaTiO ３ , (Ba １－ｘ Ca ｘ ) TiO ３ (0<x<1), Ba(Ti １－ｙ Ca ｙ ) O ３ (0<y<1), (Ba １－ｘ Ca ｘ ) (Ti １－ｙ Zr ｙ ) O ３ (0<x<1, 0<y<1) and Ba(Ti １－ｙ Zr ｙ ) O ３ 2. The multilayer electronic component according to claim 1, wherein y is one or more of the following: (0<y<1).

8. 2. The multilayer electronic component according to claim 1, wherein the dielectric layers contain, as a main component, a material that has a smaller shrinkage rate when fired than the insulating layers.

9. The multilayer electronic component according to claim 1 , wherein the external electrodes are disposed on the third and fourth surfaces and on at least a portion of the insulating layer.

10. 2. The multilayer electronic component according to claim 1, wherein the external electrodes include electrode layers connected to the internal electrodes and plating layers disposed on the electrode layers, and the insulating layer is disposed to extend between the electrode layers and the plating layers.

11. 11. The multilayer electronic component according to claim 10, wherein the electrode layers include a basic electrode layer that is in contact with the internal electrodes and contains glass, and a conductive resin layer that contains resin and is disposed on the basic electrode layer.

12. 2. The multilayer electronic component according to claim 1, wherein the external electrodes include a base electrode layer that is in contact with the internal electrodes and contains glass, and a conductive resin layer that is disposed on the base electrode layer and contains resin, and the insulating layer is disposed extending between the base electrode layer and the conductive resin layer.

13. 2. The multilayer electronic component according to claim 1, wherein, in a cross section cut in the first and third directions at a center in the second direction of the multilayer electronic component, Tc is a minimum size in the first direction at a center part in the third direction of the multilayer electronic component, and Te is a maximum size in the first direction at an end part in the third direction, and Tc / Te is less than 1.000 and more than 0.

950.

14. 2. The multilayer electronic component according to claim 1, wherein in a cross section cut in the first and third directions at a center in the second direction of the multilayer electronic component, Wc / We is less than 1.000 and exceeds 0.950, where Wc is a minimum size in the third direction at a center part of the multilayer electronic component in the first direction and We is a maximum size in the first direction at an end part in the third direction.

15. In a cross section of the multilayer electronic component cut in the first and second directions at the center in the third direction, 2. The multilayer electronic component according to claim 1, wherein Lc / Le is less than 1.000 and more than 0.950, where Lc is a minimum size in the second direction at a central portion of the main body in the first direction and Le is a maximum size in the second direction at an end portion in the first direction.

16. The multilayer electronic component according to claim 1 , wherein the body includes a material contained in the insulating layer in a region adjacent to the insulating layer.

17. a body including dielectric layers and internal electrodes alternately arranged in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and connected in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; an insulating layer disposed on the first, second, fifth, and sixth surfaces and including BN; and an external electrode disposed on the body.

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