Display panel

Abstract

To provide a novel display panel with excellent convenience or reliability.SOLUTION: A display panel has a first region, a second region, and a display region. The second region includes a part of the display region. The second region includes a first member. The second region can bend the first member to the outside. The first member includes a first elastic body and a second elastic body. The second elastic body includes an end part that is covered partially or entirely with the first elastic body. The second elastic body has a higher elastic modulus than the first elastic body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] One embodiment of the present invention is a display panel, a display device, an input / output device, a data processing device, or a semiconductor device. Regarding.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. The technical field of one aspect relates to an article, a method, or a manufacturing method. One aspect of the present invention is a process, machine, manufacture, or composition. Therefore, the present invention more specifically disclosed herein The technical field of one embodiment of the present invention is a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, The driving method thereof or the manufacturing method thereof can be given as an example. [Background technology]

[0003] The device has a first surface, a second surface opposite to the first surface, and a neutral surface between the first surface and the second surface. A functional panel having a thickness of at least half the thickness of the functional layer in a region from the first surface to the neutral surface. A configuration is known in which a portion of a functional layer having a thickness is disposed (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-081051 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of one embodiment of the present invention is to provide a novel display panel that is highly convenient or reliable. Alternatively, the object of the present invention is to provide a novel display device that is highly convenient or reliable. Alternatively, the objective of the present invention is to provide a novel input / output device that is highly convenient or reliable. Another object of the present invention is to provide a novel information processing device that is highly convenient and reliable. The object is to provide a new display panel, a new display device, a new input / output device, a new It is an object of the present invention to provide a new data processing device or a new semiconductor device.

[0006] The description of these problems does not preclude the existence of other problems. It is not necessary for the embodiment to solve all of these problems. The above will become apparent from the description in the specification, drawings, claims, etc. It is possible to extract other issues from the descriptions in the patent, claims, etc. [Means for solving the problem]

[0007] (1) One aspect of the present invention is a display device including a first area 700A, a second area 700B, and a display area 23. 1 and a display panel having the same.

[0008] The first area 700A includes a portion of the display area 231.

[0009] The second area 700B includes another part of the display area 231, and the second area 700B includes the first part The second region 700B has a first member 791, and the second region 700B is curved so that the first member 791 faces outward. can.

[0010] The first member 791 includes a first elastic body 791A and a second elastic body 791C.

[0011] The second elastic body 791C has an end part that is partially or entirely covered by the first elastic body 791A, The second elastic body 791C has a greater elastic modulus than the first elastic body 791A.

[0012] This allows the ease of bending of the second region 700B to be adjusted. Alternatively, the radius of curvature may be greater than the predetermined radius of curvature. It can be curved so that it is not smaller than the radius of curvature. Or it can be curved with multiple curves of different radii of curvature. The portion can be formed in the second region 700B. Alternatively, it can be curved in a U-shape. Or, it can be repeatedly bent, or the formation of irreversible creases is suppressed. Alternatively, the display area that overlaps with the second area 700B can be protected. Alternatively, the strength of the second region 700B can be increased. As a result, the convenience or reliability can be improved. It is therefore possible to provide a novel display panel having excellent optical properties.

[0013] (2) In addition, in one aspect of the present invention, the display area 231 is provided with a first member 791. It is a display panel that has the function of displaying information in a direction opposite to the display.

[0014] This allows display without being obstructed by the first member 791. The formation of wrinkles in the second region 700B can be suppressed. As a result, the convenience or It is possible to provide a novel display panel with excellent reliability.

[0015] (3) In one aspect of the present invention, the second region 700B has a radius of curvature greater than 2 mm. It is a display panel that can be curved in a radial direction.

[0016] This allows the display panel to be repeatedly curved without causing any problems. For example, the thickness of the curved member can be reduced if the radius of curvature is 5 mm or more, preferably 2 mm. The curvature radius can be set to 1.0 mm or more, and more preferably 2 mm or more. It can be repeatedly bent more than 50,000 times. As a result, it is convenient and reliable. A novel display panel can be provided.

[0017] (4) In addition, in one aspect of the present invention, the second region 700B is The thickness is thinner than the thickness plus 100 μm, preferably thinner than the thickness plus 80 μm, More preferably, the display panel has a thickness thinner than the thickness added thereto of 50 μm.

[0018] This allows the thickness of the display panel to be reduced, resulting in improved convenience and reliability. It is therefore possible to provide a novel display panel having excellent image quality.

[0019] (5) In addition, in one aspect of the present invention, the first member 791 is It is a display panel having a shape that becomes thinner as the display panel is rotated.

[0020] This allows the rigidity of the first member 791 to be gradually reduced toward the end portion. Alternatively, the second region 700B may be formed so that the radius of curvature gradually decreases toward the end. As a result, a novel display panel with excellent convenience and reliability can be provided. It is possible.

[0021] (6) In one aspect of the present invention, the first member 791 is a strip that crosses the display area 231. The display panel has a rectangular shape.

[0022] This allows the display area to be folded in two along the first member 791. Alternatively, the outer shape of the display panel may be changed so that a part of the display area 231 faces another part of the display area 231. As a result, a novel display panel with excellent convenience and reliability can be provided. It can be provided.

[0023] (7) In addition, one embodiment of the present invention is a sealing material 705, a first base material 510, and a second base material 770. and a third region 700C.

[0024] The encapsulant 705 is sandwiched between the first substrate 510 and the second substrate 770 .

[0025] The second substrate 770 has an area that overlaps with the first substrate 510 .

[0026] The first region 700A includes a portion of the overlapping region, and the second region 700B includes a portion of the overlapping region. This includes other parts of the area.

[0027] The third region 700C is the overlapping region, the edge of the first substrate 510, the second substrate 770, and the and a second member 792.

[0028] The second member 792 covers the edge of the first base material 510, and the second member 792 is thicker than the sealing material 705. The display panel has low moisture permeability.

[0029] As a result, the functional layer 520 or the functional layer 520 between the first base material 510 and the second base material 770 can be externally The first can suppress the diffusion of impurities into the display element 550(i,j). The ends of the base material 510 and the second base material 770 can be protected. As a result, convenience and It is possible to provide a novel display panel having excellent reliability.

[0030] (8) Another embodiment of the present invention is a display panel including a pixel 702(i,j).

[0031] Pixel 702(i,j) comprises a functional layer 520 and a display element 550(i,j).

[0032] The functional layer 520 includes a pixel circuit 530(i,j), which is a display element. 550(i,j) is electrically connected to the

[0033] This allows electronic data to be displayed, resulting in a highly convenient and reliable It is possible to provide a novel display panel.

[0034] (9) In accordance with another aspect of the present invention, the display area 231 includes a group of pixels 702(i,1) to pixel 702(i,n), another set of pixels 702(1,j) to pixel 702(m,j). , scanning lines G2(i) and signal lines S2(j).

[0035] The group of pixels 702(i,1) through 702(i,n) includes pixel 702(i,j); A group of pixels 702(i,1) to 702(i,n) are arranged in a row direction.

[0036] Another group of pixels 702(1,j) through 702(m,j) includes pixel 702(i,j). The other group of pixels 702(1,j) to 702(m,j) are arranged in a column direction intersecting the row direction. The electrodes are disposed in a direction perpendicular to the axis of the optical axis.

[0037] The scan line G2(i) is electrically connected to a group of pixels 702(i,1) through 702(i,n). Connected.

[0038] The signal line S2(j) is electrically connected to another group of pixels 702(1,j) to 702(m,j). are connected to the network.

[0039] This allows image information to be provided to multiple pixels, resulting in increased convenience or reliability. It is possible to provide a novel display panel with excellent reliability.

[0040] (10) In addition, one aspect of the present invention is a display device having the above-mentioned display panel 700 and a control unit 238. It is a display device.

[0041] The control unit 238 is supplied with the image information V1 and the control information CI. 1, information V11 is generated, and the control unit 238 generates a control signal S based on the control information CI. P, and the control unit 238 supplies the information V11 and the control signal SP.

[0042] The display panel 700 is supplied with information V11 or a control signal SP, and the pixels are displayed based on the information. Show.

[0043] This allows image information to be displayed using the display element. This makes it possible to provide a novel display device with excellent reliability.

[0044] (11) Another embodiment of the present invention is an input / output device including an input unit 240 and a display unit 230. It is located.

[0045] The display unit 230 includes the display panel 700 described above.

[0046] The input unit 240 includes a detection area 241, and detects an object adjacent to the detection area 241. The detection area 241 has an area overlapping with the pixel 702(i,j).

[0047] As a result, while the image information is being displayed using the display unit, the area overlapping the display unit and the adjacent area can be easily viewed. Or, a finger or other object placed close to the display can be used as a pointer to indicate the position. Alternatively, the location information can be associated with the image information to be displayed on the display unit. As a result, a novel input / output device with excellent convenience and reliability can be provided. It is possible.

[0048] (12) Another embodiment of the present invention is a data processing device including an arithmetic device 210 and an input / output device 220. It is an information processing device.

[0049] The arithmetic unit 210 is supplied with input information II or detection information DS, and the arithmetic unit 210 outputs control information The information CI and image information V1 are supplied.

[0050] The input / output device 220 provides input information II and sensed information DS. The input / output device 220 controls The information CI and the image information V1 are supplied to the input / output device 220, which includes a display unit 230, an input unit 2 40 and a detection unit 250.

[0051] The display unit 230 includes the above-mentioned display panel 700, and the display unit 230 displays a display image based on the control information CI. Display image information V1.

[0052] The input unit 240 generates input information II, and the detection unit 250 generates detection information DS.

[0053] (13) Another aspect of the present invention is a keyboard, a hardware button, a pointing device, Devices, touch sensors, illuminance sensors, imaging devices, voice input devices, eye gaze input devices, posture detection and the display panel described above.

[0054] This allows the image information or control information to be generated based on information provided using various input devices. The information can be generated by a computing device. As a result, a novel method that is convenient or reliable can be provided. It is possible to provide an information processing device.

[0055] In the drawings accompanying this specification, components are classified by function and are shown as independent blocks. However, it is difficult to completely separate the components by function in the actual system. It is possible that one component may be involved in multiple functions.

[0056] In this specification, the source and drain of a transistor are used to indicate the polarity and The name changes depending on the potential applied to the terminal. Generally, n-channel In a transistor with a low potential, the terminal to which the low potential is applied is called the source, and the terminal to which the high potential is applied is called the The terminal to which the transistor is connected is called the drain. The terminal to which the high potential is applied is called the drain, and the terminal to which the high potential is applied is called the source. For convenience, let us assume that the source and drain are fixed. In some cases, the connection relationship between the source and drain is explained, but in reality, the connection between the source and drain is determined according to the above potential relationship. The way they are handled changes.

[0057] In this specification, the source of a transistor is a part of a semiconductor film that functions as an active layer. The term "transistor" refers to a source region connected to the semiconductor film, or a source electrode connected to the semiconductor film. The drain of the transistor is a drain region that is a part of the semiconductor film, or a region that is a part of the semiconductor film. "gate" means a gate electrode.

[0058] In this specification, the state in which transistors are connected in series refers to, for example, a first transistor Only one of the source or drain of one transistor is connected to the source or drain of the second transistor. It also means that the transistors are connected in parallel. The state where either the source or drain of the first transistor is connected to the second transistor and the source or drain of the first transistor is connected to one of the source and drain of the second transistor. This means that the other of the two transistors is connected to the other of the source or drain of the second transistor. do.

[0059] In this specification, the term "connection" refers to an electrical connection, and a current, voltage, or potential is supplied. Therefore, the connected state corresponds to a state in which the does not necessarily refer to the state in which a current, voltage or potential is available or transferable. The signals are transmitted through circuit elements such as wiring, resistors, diodes, and transistors. This also includes the state of being directly connected.

[0060] In this specification, even if components that are independent on the circuit diagram are connected to each other, However, in reality, for example, when a part of a wiring functions as an electrode, one conductive film may be connected to multiple In this specification, the term "connection" refers to such a connection. Cases in which one conductive film has the functions of multiple components are also included in this category.

[0061] In this specification, one of the first electrode and the second electrode of a transistor is a source the first electrode and the second electrode is the drain electrode. Effect of the Invention

[0062] According to one aspect of the present invention, there is provided a novel display panel which is highly convenient or reliable. Alternatively, a novel display device with excellent convenience or reliability can be provided. Alternatively, it is possible to provide a novel input / output device that is highly convenient and reliable. It is possible to provide a novel information processing device that is highly convenient or reliable. Novel display panel, novel display device, novel input / output device, novel information processing device or novel It is possible to provide a semiconductor device.

[0063] The description of these effects does not preclude the existence of other effects. An embodiment does not necessarily have to have all of these effects. Effects other than these may also be included. The above is self-evident from the description, drawings, claims, etc. Other effects can be extracted from the claims and other descriptions. [Brief description of the drawings]

[0064] [Figure 1] 1A to 1C illustrate a structure of a display panel according to an embodiment. [Diagram 2] 1A to 1C illustrate a structure of a display panel according to an embodiment. [Diagram 3] 1A to 1C illustrate a structure of a display panel according to an embodiment. [Figure 4] 1A to 1C illustrate a structure of a display panel according to an embodiment. [Diagram 5] FIG. 2 is a top view illustrating a structure of a display panel according to an embodiment. [Figure 6] 1A and 1B are a cross-sectional view and a circuit diagram illustrating a structure of a display panel according to an embodiment. [Figure 7] 1 is a cross-sectional view illustrating a structure of a display panel according to an embodiment. [Figure 8] 1 is a cross-sectional view illustrating a structure of a display panel according to an embodiment. [Figure 9] FIG. 2 is a block diagram illustrating a structure of a display panel according to an embodiment. [Figure 10] 1A to 1C illustrate a structure of a display device according to an embodiment. [Figure 11] FIG. 1 is a block diagram illustrating a configuration of an input / output device according to an embodiment. [Figure 12] 1A and 1B are a block diagram and a projection diagram illustrating a configuration of an information processing device according to an embodiment. [Figure 13] 4 is a flowchart illustrating a method for driving the information processing device according to the embodiment. [Figure 14] 1A to 1C are diagrams illustrating a method for driving an information processing device according to an embodiment. [Figure 15] 2 is a diagram for explaining an artificial intelligence unit of an information processing device according to an embodiment; [Figure 16] 10A to 10C are diagrams illustrating characteristics of a transistor according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0065] One embodiment of the present invention is a display panel having a first region, a second region, and a display region. Thus, the second region includes a portion of the display region, the second region includes a first member, and the second region The first member can be bent outward, and the first member includes a first elastic body and a second elastic body. the second elastic body has an end part that is partially or entirely covered by the first elastic body; The second elastic body has a greater elastic modulus than the first elastic body.

[0066] This allows the curve to bend with a radius of curvature larger than a predetermined value. It can be curved so that the diameter does not become smaller than a predetermined size. Or, it can be repeatedly curved. The formation of irreversible folds can be suppressed. It is thus possible to provide a novel display panel that is highly convenient and reliable.

[0067] The embodiment will be described in detail with reference to the drawings. However, the present invention is not limited to the following description. The present invention is not limited to the above embodiment, and various changes and modifications may be made in the form and details without departing from the spirit and scope of the present invention. It will be easily understood by those skilled in the art that the above-mentioned invention can be obtained by the following embodiments. The present invention should not be construed as being limited to the contents described below. The same reference numerals are used in different drawings to indicate the same parts or parts having similar functions. A repeated explanation thereof will be omitted.

[0068] (Embodiment 1) In this embodiment, a structure of a display panel according to one embodiment of the present invention will be described with reference to FIGS. He explains.

[0069] FIG. 1 illustrates a structure of a display panel according to one embodiment of the present invention. 1(B) is a side view of FIG. 1(A), and FIG. 1(C) is a perspective view of a display panel according to the embodiment. FIG. 1(A) is a top view of FIG.

[0070] FIG. 2 illustrates a structure of a display panel according to one embodiment of the present invention. 2(B) is a top view of the display panel of the embodiment, taken along the cutting line A1-A2 of FIG. 2(A). FIG. 2(C) is a cross-sectional view illustrating a curved state.

[0071] FIG. 3(A) is a cross-sectional view for explaining a part of FIG. 2(B), and FIG. 3(B) is a cross-sectional view for explaining a part of FIG. 2(B). FIG. 13 is a cross-sectional view of the bent state.

[0072] FIG. 4 illustrates a structure of a display panel according to one embodiment of the present invention. 4(B) is a top view of the display panel of the embodiment, taken along the cutting line A1-A2 of FIG. 4(A). FIG. 4(C) is a cross-sectional view illustrating a part of FIG. 4(B).

[0073] In this specification, variables whose values ​​are integers of 1 or more may be used as symbols. For example, let (p) contain a variable p whose value is an integer greater than or equal to 1, and specify any of the components up to p. For example, the variables m and m, which take integer values ​​of 1 or more, and variable n, (m,n) is treated as a code that identifies one of the maximum m × n components. It may be used in parts.

[0074] <Display panel configuration example 1.> The display panel 700 described in this embodiment has an area 700A, an area 700B, and a display area and region 231 (see FIGS. 1(A) and 1(C)).

[0075] Configuration example 1 of display area 231 The display area 231 has a function of displaying an image.

[0076] 《Area 700A》 Area 700A includes a portion of display area 231.

[0077] Example 1 of configuration for area 700B Area 700B includes another portion of display area 231.

[0078] The region 700B includes a member 791, and the region 700B is curved such that the member 791 faces outward. It is possible.

[0079] {Component 791 Configuration Example 1.} The member 791 includes an elastic body 791A and an elastic body 791C (see FIG. 1(B)).

[0080] The elastic body 791C has an end part that is partially or entirely covered by the elastic body 791A. Elastic body 791C has a larger elastic modulus than elastic body 791A. A. The breaking elongation is smaller than A. In the tensile test, the breaking elongation is The ratio of the length to the original length is called the elongation at break.

[0081] <<Example of configuration of elastic body 791A and elastic body 791C>> For example, resin, rubber, urethane rubber, silicone rubber, etc. are used as the elastic body 791A and the elastic body Can be used for 791C.

[0082] Specifically, a material having an elastic modulus of 0.1 MPa or more and 0.8 MPa or less is used for the elastic body 791A. In addition, a material with an elastic modulus of 0.8 MPa or more and 1.2 MPa or less can be used as the elastic body 79. Alternatively, a material with a breaking elongation rate of 350% can be used for the elastic body 791A. In addition, a material with a breaking elongation rate of 200% can be used for the elastic body 791C. do.

[0083] The elastic body 791C is less likely to bend than the elastic body 791A. When the elastic body 791C is bent, the radius of curvature R3 of the portion P3 overlapping the elastic body 791A is The radius of curvature R1 of the portion P1 is larger than the radius of curvature R1 of the portion P1 (see FIG. 3(A) and FIG. 3(B)). The radius of curvature R2 of the part where the elastic body 791C and the elastic body 791A overlap with the boundary P2 is Larger than R1 and smaller than radius of curvature R3.

[0084] This allows the ease of bending of the region 700B to be adjusted. The curved portion can be bent with a radius of curvature larger than the predetermined value. Or, it can be curved to have multiple curved sections with different radii of curvature. 700B, or it can be curved into a U-shape.

[0085] Alternatively, the region 700B may be repeatedly curved or may be irreversibly folded. The formation of eyes can be suppressed, or the display area 231 overlapping with the area 700B can be protected. Alternatively, the strength of the region 700B can be increased. It is possible to provide a novel display panel having excellent performance and reliability.

[0086] Configuration example 2 of display area 231 The display area 231 has a function of displaying in a direction in which the member 791 is not disposed. (See Figure 1(A)).

[0087] This allows the display to be performed without being obstructed by the member 791. The formation of wrinkles in the region 700B can be suppressed. As a result, the convenience or reliability can be improved. It is therefore possible to provide a novel display panel having excellent image quality.

[0088] Example 2 of configuration of area 700B Region 700B can be curved with a radius of curvature greater than 2 mm (see FIG. 1(B)). .

[0089] This allows the display panel to be repeatedly curved without causing any problems. For example, the thickness of the curved member can be reduced if the radius of curvature is 5 mm or more, preferably 2 mm. The curvature radius can be set to 1.0 mm or more, and more preferably 2 mm or more. It can be repeatedly bent more than 50,000 times. As a result, it is convenient and reliable. A novel display panel can be provided.

[0090] Example 3 of configuration of area 700B The region 700B is thinner than the thickness T21 of the member 791 plus 100 μm (see FIG. 3(A)). The thickness of the region 700B is 80 μm greater than the thickness T22 of the member 791. It is preferable that the thickness is thinner than the thickness T22, and more preferable that the thickness is thinner than the thickness T22 plus 50 μm.

[0091] This allows the thickness of the display panel to be reduced, resulting in improved convenience and reliability. It is therefore possible to provide a novel display panel having excellent image quality.

[0092] {Component 791 Configuration Example 2.} The member 791 has a shape in cross section that becomes thinner toward the end (see FIG. 3(A) and See Figure 3(B)).

[0093] This allows the rigidity of the member 791 to be gradually reduced toward the end. The region 700B may be curved such that the radius of curvature gradually decreases toward the end. As a result, a novel display panel with excellent convenience and reliability can be provided. do.

[0094] {Component 791 Configuration Example 3.} The member 791 has a strip-like shape that crosses the display area 231 (FIGS. 2(A) and 2(B)). )reference).

[0095] This allows the display area to be folded in two along the first member (see FIG. 2(C)). Or, a part of the display area can be made to face another part. As a result, a novel display panel with excellent convenience and reliability can be produced. can provide the following:

[0096] <Display panel configuration example 2.> The display panel 700 described in this embodiment includes a sealing material 705, a base material 510, and a base material 770 and region 700C (see FIG. 4(A) and FIG. 4(B)). 791 includes elastic body 791A, elastic body 791B, and elastic body 791C. Elastic body 791C has an end part that is partially covered by elastic body 791B, and elastic body 791C is elastic body 791 B. Alternatively, elastic body 791C has a smaller breaking point than elastic body 791B. For example, the material that can be used for the elastic body 791A is the material that can be used for the elastic body 791B. can be used.

[0097] <<Example of the composition of sealing material 705>> The encapsulant 705 is sandwiched between the first substrate 510 and the second substrate 770 .

[0098] <<Examples of configurations of the base material 510 and the base material 770>> Substrate 770 has an area that overlaps substrate 510 .

[0099] Region 700A includes a portion of the overlapping region, and region 700B includes the other portion of the overlapping region. Includes some.

[0100] The substrate 510 and the substrate 770 are flexible.

[0101] For example, organic materials such as resin, resin film, or plastic are used as the substrate 510 or the substrate 7. 70. Specifically, polyester, polyolefin, polyamide, Resin film or plate made of polyimide, polycarbonate, acrylic resin, etc. This allows the weight to be reduced or, for example, the risk of being dropped. This can reduce the frequency of occurrence of damage, etc.

[0102] For example, a metal plate, a thin glass plate, or a film of an inorganic material is laminated to a resin film, etc. A composite material having such a structure may be used for the substrate 510 or the substrate 770. For example, a fibrous or A composite material in which particulate metal, glass, or inorganic materials are dispersed in a resin film is used. For example, a fibrous or particulate resin or organic material can be dispersed in an inorganic material. A composite material having such a structure can be used.

[0103] In addition, a single layer material or a multi-layer laminated material may be used for the substrate 510 or substrate 770. For example, a substrate and an insulating film that prevents the diffusion of impurities contained in the substrate may be laminated. Specifically, the diffusion of impurities in glass and glass can be suppressed. A silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, or the like is selected from the group consisting of a silicon oxide layer, a silicon nitride layer, a silicon oxynitride layer, and the like. A material with multiple layers of films can be used. Or, a material with a resin and impurities that permeate the resin can be used. A silicon oxide film, a silicon nitride film, a silicon oxynitride film, or the like is laminated to prevent the diffusion of Materials can be used.

[0104] Specifically, polyester, polyolefin, polyamide (nylon, aramid, etc.), Polyimide, polycarbonate, polyurethane, acrylic resin, epoxy resin or silicone A material containing a resin having a siloxane bond such as corn is used as the substrate 510 or substrate 770. For example, a resin film, a resin plate, or a laminated material containing these resins can be used. It can be used.

[0105] Specifically, polyethylene terephthalate (PET), polyethylene naphthalate (PE N), polyethersulfone (PES), cycloolefin polymer (COP) or Cycloolefin copolymer (COC) or the like can be used for the substrate 510 or substrate 770. can.

[0106] Also, paper or wood may be used for the substrate 510 or substrate 770 .

[0107] For example, a flexible material can be used for substrate 510 or substrate 770 .

[0108] Note that a method of forming a transistor, a capacitor, or the like directly on a substrate can be used. Alternatively, a transistor or a capacitor may be attached to a substrate for a process that is resistant to heat applied during the manufacturing process. The formed transistor or capacitance element is then attached to, for example, a substrate 510 or A method of transferring the substrate 770 to the substrate 770 can be used. A transistor or a capacitor element, etc. can be formed on the plate.

[0109] 《Area 700C》 The region 700C includes the overlapping region, the edge of the substrate 510, the substrate 770, and the member 792. (See Figure 4(C)).

[0110] 《Item 792》 The member 792 covers the edge of the substrate 510, and the member 792 has a lower moisture permeability than the sealing material 705. do.

[0111] For example, a part of the member 791 can be used as the member 792. 1A or elastic body 791B can be used for member 792.

[0112] Alternatively, a membrane or laminated membrane can be used for the member 792. Specifically, the moisture permeability can be 10 -5 g / (m 2 ·day) or less, preferably 10 -6 g / (m 2 · day) The following materials For example, a material including an inorganic film or an organic film can be used for the member 792. Specifically, it can be used for a metal film, a film containing a metal and oxygen, a film containing a metal and nitrogen, etc. The member 792 may be a membrane comprising a cross-linked polymer, or the like.

[0113] Alternatively, the member 792 may be made of a material having an elastic modulus equal to or greater than that of the elastic body 791A. Alternatively, the member 792 may be made of a material having an elastic modulus equal to or greater than that of the elastic body 791B. A material having a breaking elongation rate equal to or less than that of the elastic body 791A can be used for the member 792. For member 792, a material having a breaking elongation rate equal to or less than that of elastic body 791B can be used. Alternatively, a material having a rigidity equal to or greater than that of member 791 can be used for member 792 .

[0114] As a result, the functional layer 520 or the functional layer 520 between the first base material 510 and the second base material 770 can be externally The first can suppress the diffusion of impurities into the display element 550(i,j). The ends of the base material 510 and the second base material 770 can be protected. As a result, convenience and It is possible to provide a novel display panel having excellent reliability.

[0115] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0116] (Embodiment 2) In this embodiment, a structure of a display panel according to one embodiment of the present invention will be described with reference to FIGS. He explains.

[0117] FIG. 5 illustrates a structure of a display panel according to one embodiment of the present invention. 5(B) and 5(C) are top views of a pixel of the display panel shown in FIG. 5(A). FIG.

[0118] Figure 6(A) corresponds to the cutting lines X1-X2, X3-X4, and X9-X10 of Figure 5(A). FIG. 6B is a cross-sectional view illustrating the configuration of a pixel circuit provided in a display panel. FIG.

[0119] FIG. 7A illustrates a pixel configuration of a display panel according to one embodiment of the present invention. 7(A) is a cross-sectional view illustrating a part of the pixel shown in FIG.

[0120] <Display panel configuration example 3.> The display panel 700 described in this embodiment has a pixel 702(i,j) (FIG. 5(A) )reference).

[0121] <<Configuration example 1 of pixel 702(i,j)>> The pixel 702(i,j) includes a functional layer 520 and a display element 550(i,j) (FIG. 6 (See (A)).

[0122] <<Configuration example 1 of functional layer 520>> The functional layer 520 includes pixel circuits 530(i,j).

[0123] Configuration example 1 of pixel circuit 530(i,j) Pixel circuit 530(i,j) is electrically connected to display element 550(i,j) (FIG. 6(A) ) and Figure 6(B)).

[0124] For example, pixel circuit 530(i,j) has display element 550(i,j) at opening 591A. j) (see FIG. 7(A)).

[0125] For example, a switch, a transistor, a diode, a resistive element, an inductor, or a capacitive element. can be used for pixel circuit 530(i,j).

[0126] The pixel circuit 530(i,j) includes a switch SW2, a transistor M, and a capacitance element C21. include.

[0127] For example, a transistor can be used for the switch SW2 (FIG. 6(B) and FIG. 7(A)). and Figure 7(B)).

[0128] Configuration example 1 of display element 550(i,j) Display element 550(i,j) has a function of emitting light.

[0129] Display element 550(i,j) includes layer 553(j) containing a light-emitting material (FIG. 7(A) reference).

[0130] For example, a display element having a function of emitting light may be used as the display element 550(i, j). Specifically, organic electroluminescence elements, inorganic electroluminescence elements, The LEDs, light emitting diodes, or QDLEDs (Quatum Dot LEDs) are displayed. It can be used for element 550(i,j).

[0131] Example 1 of the configuration of layer 553(j) containing a luminescent material For example, a strip-shaped laminate material that is long in the column direction along the signal line S2(j) is It may be used for layer 553(j).

[0132] Specifically, a layer 553(j) containing a light-emitting material, a layer 553(j+1 ) and a layer 553(j+2) containing a light-emitting material, As a result, for example, the light emitted by the display element 550(i,j) can be The hue can be different for each row.

[0133] For example, a material that emits blue light, a material that emits green light, and a material that emits red light may be It can be used for materials that emit light of different hues.

[0134] Example 2 of the layer 553(j) containing a luminescent material For example, a layer of laminated material that emits white light may be formed by laminating a layer 553 containing a light-emitting material. (j) can be used.

[0135] Specifically, materials that emit light of different hues are arranged in layers 553(j) containing luminescent materials. can be used.

[0136] For example, a layer containing a luminescent material including a fluorescent material that emits blue light and a layer containing a fluorescent material that emits green and red light A laminated material in which a layer containing a material other than a fluorescent material that emits light is laminated is laminated with a layer containing a luminescent material. 553(j) or luminescent material that emits blue light. A layer including the material and a layer including a material other than the fluorescent material that emits yellow light are laminated. Materials may be used in layer 553(j) that includes light-emissive materials.

[0137] For example, a light-emitting unit can be used in layer 553(j) that includes a light-emitting material. The unit has one region where electrons injected from one side recombine with holes injected from the other side. The light-emitting unit includes a light-emitting material, and the light-emitting material is a material that is capable of reacting with electrons and holes. The energy produced by the combination is released as light.

[0138] For example, multiple light-emitting units and intermediate layers may be used in the layer 553(j) that contains the light-emitting material. The intermediate layer has a region sandwiched between two light-emitting units. The intermediate layer supplies holes to the light-emitting unit arranged on the cathode side and supplies electrons to the light-emitting unit arranged on the anode side. The device has a function of supplying electrons to the light-emitting units. A configuration including a first layer and an intermediate layer is sometimes called a tandem light emitting device.

[0139] For example, a light-emitting unit including a material that emits light of one hue and a material that emits light of another hue may be used. The light-emitting unit containing the emissive material may be used in layer 553(j).

[0140] For example, high molecular weight compounds (oligomers, dendrimers, polymers, etc.), medium molecular weight compounds (low molecular weight compounds), Compounds in the intermediate region between molecules and polymers (molecular weight 400 to 4000) and other luminescent materials It is possible to use a layer 553(j) containing

[0141] 《Electrode 551(i,j), electrode 552》 The electrode 551(i,j) is connected to the pixel circuit 530(i,j) through the opening 591A(i,j). ) are electrically connected to each other (see FIG. 7(A)).

[0142] For example, a material that can be used for wiring or the like is used for the electrode 551(i, j) or the electrode 552. Specifically, a material having transparency to visible light can be used as the electrodes 551 (i, j) or electrode 552.

[0143] For example, conductive oxides or conductive oxides containing indium, indium oxide, indium The materials used are indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide doped with gallium. Alternatively, a metal film that is thin enough to transmit light can be used. A material that is transparent to visible light can be used.

[0144] For example, a metal film that transmits part of the light and reflects the other part of the light may be used as the electrode 551(i, j) or can be used for electrode 552. This allows, for example, electrodes 551(i,j) and The distance between the electrodes 552 can be adjusted. 0(i,j). Or, light of a certain wavelength can be captured more efficiently than other light. Or, light with a narrow half-width spectrum can be extracted. It can emit bright colored light.

[0145] For example, a film that efficiently reflects light can be used for the electrode 551(i, j) or the electrode 552. Specifically, a material containing silver and palladium, etc. or a material containing silver and copper, etc. The material can be used for the metal film.

[0146] Configuration example 2 of pixel circuit 530(i,j) The pixel circuit 530(i,j) includes a switch SW2, a transistor M, and a capacitance element C21. For example, a transistor can be used for switch SW2.

[0147] <<Switch SW2 Configuration Example 1.>> The transistor used in the switch SW2 includes a semiconductor (see FIG. 7B).

[0148] The transistor includes a semiconductor film 508, a conductive film 504, a conductive film 512A, and a conductive film 512B. (See FIG. 7(B)).

[0149] The semiconductor film 508 includes a region 508A electrically connected to the conductive film 512A, a region 508B electrically connected to the conductive film 512B, and a region 508C electrically connected to the conductive film 512C. The semiconductor film 508 includes a region 508A and a region 508B that are electrically connected to the Between the regions 508B is a region 508C.

[0150] The conductive film 504 has a region overlapping with the region 508C, and the conductive film 504 has a function of a gate electrode. can.

[0151] The insulating film 506 includes a region sandwiched between the semiconductor film 508 and the conductive film 504. The film 506 functions as a gate insulating film.

[0152] The conductive film 512A has either a function of a source electrode or a function of a drain electrode, and the conductive film 51 2B has the other of the source electrode function and the drain electrode function.

[0153] {Example 1 of transistor M configuration} For example, a semiconductor film that can be formed in the same process is used for the switch SW2. The same configuration can be used for the switch SW2. It can be used for the transistors used and transistor M.

[0154] The conductive film 524 can be used for a transistor. The conductive film 524 has a region sandwiching the semiconductor film 508 between the conductive film 524 and the second gate electrode. The conductive film 524 can be electrically connected to the conductive film 504, for example.

[0155] For example, a semiconductor film that can be formed in the same process may be used for the driver circuit and the pixel circuit. It can be used in transistors.

[0156] For example, a bottom gate transistor or a top gate transistor is used as a pixel transistor. It can be used for the circuit 530(i,j) or for the transistor of the driver circuit. It is possible.

[0157] Configuration example 1 of semiconductor film 508 For example, a semiconductor containing a group 14 element can be used for the semiconductor film 508. The semiconductor film 508 can be made of a semiconductor containing silicon.

[0158] [Hydrogenated amorphous silicon] For example, hydrogenated amorphous silicon can be used for the semiconductor film 508. Microcrystalline silicon or the like can be used for the semiconductor film 508. Provides a display panel with less display unevenness than a display panel that uses silicon for the semiconductor film 508 Also, it is easy to increase the size of the display panel.

[0159] [Polysilicon] For example, polysilicon can be used for the semiconductor film 508. This allows, for example, The transistor has a higher efficiency than the transistor using amorphous silicon for the semiconductor film 508. The field effect mobility can be increased. Alternatively, for example, hydrogenated amorphous silicon The driving capability of the transistor can be improved as compared with a transistor using the semiconductor film 508. For example, a transistor using hydrogenated amorphous silicon for the semiconductor film 508 can be used to The aperture ratio can be improved.

[0160] Alternatively, for example, a transistor using hydrogenated amorphous silicon for the semiconductor film 508 may be used. This can improve the reliability of the transistor.

[0161] Alternatively, the temperature required for manufacturing a transistor may be, for example, a temperature required for manufacturing a transistor using single crystal silicon. It can be made lower than the standard.

[0162] Alternatively, a semiconductor film used for a transistor in a driver circuit may be used for a transistor in a pixel circuit. The insulating film can be formed in the same process as the semiconductor film. A driver circuit can be formed on the substrate. Alternatively, the number of components constituting the electronic device can be reduced. It is possible.

[0163] [Single crystal silicon] For example, single crystal silicon can be used for the semiconductor film 508. Higher definition than display panels using hydrogenated amorphous silicon for the semiconductor film 508 Alternatively, for example, a display panel using polysilicon for the semiconductor film 508 can be used. In this way, it is possible to provide a display panel with less display unevenness. A head mounted display or head mounted display can be provided.

[0164] Configuration example 2 of semiconductor film 508 For example, a metal oxide can be used for the semiconductor film 508. In comparison with a pixel circuit using a transistor in which silicon is used as the semiconductor film 508, The time that the flip-flop can hold the image signal can be increased. The selection signal is set to a frequency of less than 30 Hz, preferably less than 1 Hz, more preferably less than 10 Hz, while suppressing the generation of noise. Or, the frequency can be less than once per minute. As a result, the user of the information processing device This reduces the fatigue that accumulates in the driver. It also reduces the power consumption associated with driving. Cut.

[0165] For example, a transistor including an oxide semiconductor can be used. An oxide semiconductor containing indium or an oxide semiconductor containing indium, gallium, and zinc is used as a semiconductor. It can be used for the body membrane 508.

[0166] For example, the leakage current in the off state is A transistor smaller than that using an oxide semiconductor can be used. A transistor in which a nitride semiconductor is used for the semiconductor film 508 can be used.

[0167] For example, a 25 nm thick film containing indium, gallium and zinc is applied to the semiconductor film 508. It can be used.

[0168] A 10 nm thick film containing tantalum and nitrogen and a 300 nm thick film containing copper are stacked. A conductive film containing copper can be used as the conductive film 504. and a region sandwiching a film containing tantalum and nitrogen therebetween.

[0169] For example, a 400 nm thick film containing silicon and nitrogen and a 400 nm thick film containing silicon, oxygen and nitrogen A laminated film in which a film having a thickness of 200 nm including a fluorine atom and a fluorine atom is laminated can be used as the insulating film 506. Note that the film containing silicon and nitrogen has silicon, oxygen, and It has a region sandwiching a film containing nitrogen.

[0170] For example, a 50 nm thick film containing tungsten and a 400 nm thick film containing aluminum A conductive film in which a conductive film and a titanium-containing film having a thickness of 100 nm are laminated in this order is called a conductive film 512. A film containing tungsten can be used as the conductive film 512B. It has an area in contact with the membrane 508 .

[0171] By the way, for example, a bottom-gate transistor using amorphous silicon as a semiconductor The production line for bottom-gate transistors uses oxide semiconductors as the semiconductor. It can be easily modified into a production line. Also, for example, a top-gate type that uses polysilicon as a semiconductor The transistor production line is a top-gate transistor that uses oxide semiconductors as the semiconductor. Both modifications can be easily made to existing production lines, making effective use of existing production lines. It can be used.

[0172] This makes it possible to suppress flickering or reduce power consumption. Or, you can display fast-moving videos smoothly. Or, you can take pictures with rich gradations. As a result, a novel display panel with excellent convenience and reliability can be provided. can be provided.

[0173] Configuration example 3 of semiconductor film 508 For example, compound semiconductors can be used as the semiconductors of transistors. A semiconductor containing arsenic can be used.

[0174] For example, organic semiconductors can be used as the semiconductor of transistors. Organic semiconductors including cesene or graphene can be used for the semiconductor film.

[0175] <<Configuration example 2 of pixel 702(i,j)>> The display area 231 includes a plurality of pixels. For example, the display area 231 may have a function of displaying colors having different hues. The pixel having the above may be used in the display area 231. ,To display colors that cannot be displayed by each pixel by additive or subtractive color mixing. can be done.

[0176] In addition, when a plurality of pixels capable of displaying colors with different hues are used for color mixing, Each pixel can be called a sub-pixel. In addition, a group of multiple sub-pixels can be called This can be rephrased as a pixel.

[0177] For example, pixel 702(i,j) can be referred to as a subpixel, and pixel 702(i,j) , pixel 702(i,j+1) and pixel 702(i,j+2) are grouped together, and pixel 703 This can be rephrased as (i, k) (see Figure 5(C)).

[0178] In addition, the pixel 702(i,j) can be referred to as a sub-pixel. Pixel 702(i,j+1), pixel 702(i+1,j) and pixel 702(i+1,j+ 1) can be referred to as pixel 703(i,k) (see FIG. 5(E)). .

[0179] Specifically, a sub-pixel that displays blue, a sub-pixel that displays green, and a sub-pixel that displays red can be used for pixel 703(i,k) as a set. A pixel 7, a sub-pixel displaying magenta, and a sub-pixel displaying yellow are grouped together to form a pixel 7. It can be used for 03(i,k).

[0180] In addition, for example, a sub-pixel that displays white or the like can be added to the above set and used in the pixel. do.

[0181] <<Configuration example 2 of functional layer 520>> The functional layer 520 includes pixel circuits 530(i,j) and an insulating film 516. An insulating film having an upper surface facing a lower surface can be used as the insulating film 516.

[0182] Specifically, the lower surface contacting the semiconductor film 508 and the upper surface contacting the semiconductor film 508(2) are provided. An insulating film having such a structure can be used as the insulating film 516 (see FIGS. 8B and 8C). .

[0183] For example, a stacked film can be used for the insulating film 516. A part of the insulating film 516 is formed, another part of the insulating film 516 is formed on the part, and the other part of the insulating film 516 is formed on the part. A semiconductor film 508(2) can be formed on this portion.

[0184] Configuration example 3 of pixel circuit 530(i,j) The pixel circuit 530(i,j) includes a switch SW2, a transistor M, and a capacitance element C21. include.

[0185] For example, a semiconductor film formed in a process different from the process for forming the semiconductor film used in the transistor M A transistor having a thin film can be used for the switch SW2 (FIG. 8(A), FIG. 8(B)). 8B) and FIG. 8C). Alternatively, the composition of the semiconductor film used in the transistor M may be different. A transistor having a semiconductor film of this composition can be used for the switch SW2.

[0186] Specifically, a transistor having a semiconductor film 508 is used as the switch SW2, and a semiconductor film 5 A transistor having the transistor 08(2) can be used for transistor M.

[0187] As a result, for example, the current of the transistor M is increased by the transistor used for the switch SW2. The drive capacity can be increased. The source electrode or drain electrode can be used as the gate electrode of the transistor M. The semiconductor film 508 of the transistor used in the switch SW2 and the semiconductor film of the transistor M The distance between the transistors 508(2) can be shortened. The area occupied by the transistor M and the pixel opening can be reduced. The image quality can be increased. Or the pixels can be made finer. Or high definition It is possible to provide a display panel that can increase the degree of freedom in the layout of pixel circuits. Alternatively, the number of transistors arranged in a fine pixel can be increased.

[0188] Although not shown, other configurations include, for example, a transistor having a semiconductor film 508(2). A transistor having a semiconductor film 508 is used as the transistor M It may also be used.

[0189] <Display panel configuration example 4.> The display panel 700 also has a display region 231 (see FIG. 5A).

[0190] The display area 231 includes scanning lines G2(i) and signal lines S2(j).

[0191] Configuration example 3 of display area 231 The display area 231 includes pixels 702(i,j), 702(i,j+1), and 702(i,j+2). (i, j+2) (see FIG. 5(C)).

[0192] Pixel 702(i,j) has a chromaticity x in the CIE 1931 chromaticity coordinates greater than 0.680. The color of the light emitted is less than 0.720 and the chromaticity y is between 0.260 and 0.320.

[0193] Pixel 702(i,j+1) has a chromaticity x of 0.130 or more in the CIE 1931 chromaticity coordinates. It emits light of a color with a chromaticity of 0.250 or less and a chromaticity y of greater than 0.710 and less than 0.810.

[0194] Pixel 702(i,j+2) has a chromaticity x of 0.120 or more in the CIE 1931 chromaticity coordinates. The color of the light emitted is 0.170 or less, and the chromaticity y is 0.020 or more and less than 0.060.

[0195] In addition, pixels 702(i,j), 702(i,j+1), and 702(i,j+2 ) is determined so that the area ratio of the BT.2020 gamut in the CIE chromaticity diagram (x, y) is 80% or more. On the other hand, the coverage rate of the color gamut is set to 75% or more. Prepare to have a loading ratio of 90% or more, or a coverage rate of 85% or more.

[0196] <Display panel configuration example 5.> The display panel 700 also includes a base material 510, a base material 770, and an insulating film 501C (see FIG. 7(A)).

[0197] The insulating film 501C has a region sandwiched between the base material 510 and the base material 770, and the functional layer 52 0 comprises a region sandwiched between insulating film 501C and base material 770.

[0198] <<Configuration example 3 of functional layer 520>> The functional layer 520 includes an insulating film 521, an insulating film 518, an insulating film 516, an insulating film 506, and an insulating film 518. It is provided with a membrane 501C, etc.

[0199] [Insulating film 521] The insulating film 521 is sandwiched between the pixel circuit 530(i,j) and the display element 550(i,j). The area is provided with a space for storing the signal (see FIG. 7(A)).

[0200] For example, insulating inorganic materials, insulating organic materials, or insulating materials containing inorganic and organic materials. The insulating film 521 can be formed using a composite material.

[0201] Specifically, an inorganic oxide film, an inorganic nitride film, an inorganic oxynitride film, or the like, or a film selected from these. A laminated material in which a plurality of such layers are stacked can be used for the insulating film 521.

[0202] For example, a silicon oxide film, a silicon nitride film, a silicon oxynitride film, an aluminum oxide film, etc. Alternatively, a film containing a laminated material in which a plurality of materials selected from these are laminated may be used for the insulating film 521. In addition, the silicon nitride film is a dense film and has an excellent function of suppressing the diffusion of impurities. can be.

[0203] For example, polyester, polyolefin, polyamide, polyimide, polycarbonate, Polysiloxane or acrylic resin, or a laminate of multiple resins selected from these A photosensitive material, a composite material, or the like can be used for the insulating film 521. In this way, the insulating film 521 may be formed by using, for example, This makes it possible to flatten steps resulting from various structures.

[0204] Polyimide has many advantages, including thermal stability, insulation, toughness, low dielectric constant, low coefficient of thermal expansion, and chemical resistance. It has superior properties compared to other organic materials. This makes it particularly suitable for polyimide. It can be suitably used for the insulating film 521 and the like.

[0205] For example, a film formed using a photosensitive material can be used as the insulating film 521. Specifically, a film formed using photosensitive polyimide or photosensitive acrylic resin, etc. The insulating film 521 can be formed using a material other than silicon.

[0206] For example, a light-transmitting material can be used for the insulating film 521. Silicon can be used for the insulating film 521.

[0207] [Insulating film 518] The insulating film 518 has a region sandwiched between the pixel circuit 530(i, j) and the insulating film 521. Note that a stacked film can be used for the insulating film 518 (see FIG. 7B).

[0208] For example, the material that can be used for the insulating film 521 can be used for the insulating film 518.

[0209] For example, it has the function of suppressing the diffusion of oxygen, hydrogen, water, alkali metals, alkaline earth metals, etc. A material capable of achieving this can be used for the insulating film 518. Specifically, a nitride insulating film can be used for the insulating film 51. 8. For example, silicon nitride, silicon oxynitride, aluminum nitride In this case, aluminum oxide nitride or the like can be used for the insulating film 518. This makes it possible to suppress the diffusion of impurities into the semiconductor film of the sta.

[0210] [Insulating film 516] The insulating film 516 has a region sandwiched between the pixel circuit 530(i, j) and the insulating film 518. Note that a stacked film can be used for the insulating film 516. In the present embodiment, the insulating film 516 is formed by stacking the insulating film 516A and the insulating film 516B. can be done.

[0211] For example, the material that can be used for the insulating film 521 can be used for the insulating film 516 . Specifically, a film formed by a method different from that of the insulating film 518 can be used as the insulating film 516. .

[0212] [Insulating film 506, insulating film 501D] The insulating film 506 has a region sandwiched between the semiconductor film 508 and the conductive film 504E (FIG. 7(B)). The insulating film 501D is sandwiched between the semiconductor film 508 and the conductive film 524. It has an area where

[0213] For example, the material that can be used for the insulating film 521 can be used for the insulating film 506 or the insulating film 501D. Specifically, a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, Kon film, silicon nitride film, aluminum oxide film, hafnium oxide film, yttrium oxide film , zirconium oxide film, gallium oxide film, tantalum oxide film, magnesium oxide film, laminar oxide film The insulating film 506 may be a film containing titanium oxide, cerium oxide, or neodymium oxide. can.

[0214] [Insulating film 501C] The insulating film 501C has an area sandwiched between the pixel circuit 530(i, j) and the base material 510. (See FIG. 7(A)).

[0215] For example, the material that can be used for the insulating film 521 can be used for the insulating film 501C. Specifically, a material containing silicon and oxygen can be used for the insulating film 501C. This makes it possible to suppress the diffusion of impurities into the pixel circuits, display elements, and the like.

[0216] [Insulating film 528] The insulating film 528 has a region sandwiched between the insulating film 521 and the base material 770, and An opening is provided in the area overlapping with electrode 551(i,j) (see FIG. 7(A)). The insulating film 528 formed along the periphery of the electrodes 551(i, j) and 552 Prevents short circuits.

[0217] For example, the material that can be used for the insulating film 521 can be used for the insulating film 528. Specifically, a silicon oxide film, a film containing an acrylic resin, or a film containing polyimide is used as the insulating film. Can be used for 528.

[0218] "Sealing material 705" The encapsulant 705 has an area sandwiched between the functional layer 520 and the substrate 770, and 0 and the substrate 770.

[0219] The sealing material 705 may be an inorganic material, an organic material, or a composite material of an inorganic material and an organic material. can be done.

[0220] For example, an organic material such as a heat-melting resin or a hardening resin may be used for the sealing material 705. can be done.

[0221] For example, reactive curing adhesives, photocuring adhesives, heat curing adhesives and / or anaerobic adhesives. An organic material such as a sealant can be used for the sealant 705 .

[0222] Specifically, epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, etc. resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyrate) Adhesives containing Ethylene Vinyl Acetate (EVA) resin, etc. are used as sealing material 705. There can be.

[0223] <Functional Layer 720> The functional layer 720 includes a colored film CF1, an insulating film 771, and a light-shielding film BM.

[0224] The colored film CF1 has an area sandwiched between the substrate 770 and the display element 550(i, j). do.

[0225] The light shielding film BM has an opening in a region overlapping with the pixel 702(i,j).

[0226] 《Functional membrane 770P, etc.》 The functional film 770P has an area that overlaps with the display element 550(i,j).

[0227] For example, anti-reflection films, polarizing films, retardation films, light diffusion films or light condensing films. A film or the like can be used for the functional film 770P.

[0228] Specifically, a circularly polarizing film can be used for the functional film 770P.

[0229] In addition, antistatic coatings that prevent dust from adhering, water-repellent coatings that make it difficult for dirt to adhere, and anti-reflection coatings Anti-reflection film, non-glossy film (anti-glare film), scratches caused by use A hard coat film that suppresses the generation of the oxide can be used for the functional film 770P.

[0230] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0231] (Embodiment 3) In this embodiment, the present invention can be used for a semiconductor film of a transistor disclosed in one embodiment of the present invention. In addition, a metal oxide is used for the semiconductor film of a transistor. In this case, the metal oxide may be interpreted as an oxide semiconductor.

[0232] Oxide semiconductors are classified into single-crystal oxide semiconductors and non-single-crystal oxide semiconductors. As a crystalline oxide semiconductor, CAAC-OS (c-axis-aligned crystal-like oxide semiconductor) talline oxide semiconductor), polycrystalline oxide semiconductor, n c-OS(nanocrystalline oxide semiconductor ), pseudo-amorphous oxide semiconductor (a-like OS) xide semiconductor, and amorphous oxide semiconductor.

[0233] Semi-crystalline oxide semiconductors are one type of non-single-crystal oxide semiconductor. The oxide semiconductor is called "talline oxide semiconductor." Semicrystalline oxide semiconductors include single-crystal oxide semiconductors and amorphous oxide semiconductors. A semicrystalline oxide semiconductor has a structure intermediate between the above. For example, the semi-crystalline oxide semiconductor has a CAAC structure and is There is an oxide semiconductor with a C-Cloud-Aligned Composite (C-Aligned Composite) structure. Details of AC are explained below.

[0234] In addition, the semiconductor film of the transistor disclosed in one embodiment of the present invention may include CAC-OS (Clo ud-Aligned Composite oxide semiconductor ) may also be used.

[0235] Note that the semiconductor film of the transistor disclosed in one embodiment of the present invention is a semiconductor film formed of the above-described non-single-crystal oxide. In addition, a non-single-crystal oxide semiconductor or a CAC-OS can be preferably used. As the OS, nc-OS or CAAC-OS can be preferably used.

[0236] Note that in one embodiment of the present invention, a CAC-OS is preferably used as a semiconductor film of a transistor. By using CAC-OS, it is possible to provide transistors with high electrical characteristics and high reliability. It can be granted.

[0237] The following provides details about CAC-OS.

[0238] CAC-OS or CAC-metal oxide is a material that has the function of electrical conductivity. A part of the material has an insulating function, and the material as a whole has a semiconductor function. Note that CAC-OS or CAC-metal oxide is used as the channel of a transistor. When used in a forming region, the conductive function is to allow the flow of electrons (or holes) that serve as carriers. The insulating function is to prevent the flow of electrons, which act as carriers. The function of switching (O Add the function to turn the power on / off to CAC-OS or CAC-metal oxide. In the case of CAC-OS or CAC-metal oxide, By separating these functions, the functionality of both can be maximized.

[0239] In addition, CAC-OS or CAC-metal oxide has a conductive region and an insulating region. The conductive region has the above-mentioned conductive function, and the insulating region has the above-mentioned insulating function. In addition, the conductive and insulating regions in the material are formed at the nanoparticle level. In addition, the conductive and insulating regions may be separated by a metal. In addition, the conductive area may be observed as a cloud-like connected area with a blurred periphery. There may be cases where this occurs.

[0240] In addition, in the CAC-OS or CAC-metal oxide, the conductive region and the insulating region are The peripheral region is 0.5 nm to 10 nm, preferably 0.5 nm to 3 nm. The following sizes may be present in the material:

[0241] In addition, CAC-OS or CAC-metal oxide has different band gaps. For example, CAC-OS or CAC-metal oxi de is a component with a wide gap due to the insulating region and a component with a narrow gap due to the conductive region. In the case of this configuration, when a carrier flows, In the narrow gap component, carriers mainly flow. The component having a narrow gap acts complementary to the component having a wide gap. Carriers also flow to the wide gap component in conjunction with the component with a large gap. AC-OS or CAC-metal oxide is placed in the channel formation region of the transistor. When used, the transistor has a high current driving force in the on-state, i.e., a large on-current. And high field effect mobility can be obtained.

[0242] That is, CAC-OS or CAC-metal oxide is a matrix composite material. (matrix composite) or metal matrix composite (metal matrix It can also be called atrix composite.

[0243] For example, the elements constituting the metal oxide in the CAC-OS are 0.5 nm or more and 10 nm or less. Preferably, the material is unevenly distributed in a size range of 1 nm to 2 nm or in the vicinity thereof. In the following, it is assumed that one or more metal elements are unevenly distributed in a metal oxide. The region having the metal element has a size of 0.5 nm to 10 nm, preferably 1 nm to 2 nm. A mixed state in which the size is less than or close to one m is also called a mosaic or patch pattern.

[0244] The metal oxide preferably contains at least indium. It is preferable that the metal contains zinc. In addition to the above, aluminum, gallium, yttrium, Aluminum, copper, vanadium, beryllium, boron, silicon, titanium, iron, nickel, germanium nium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum One or more of the following are included: tungsten, magnesium, etc. It's fine.

[0245] For example, CAC-OS made of In-Ga-Zn oxide (In-Ga-Zn oxide is one of the CAC-OS) a-Zn oxide may be specifically referred to as CAC-IGZO. (Hereinafter, InO X1 (X1 is a real number greater than 0.) or indium zinc oxide In X2 Zinc Y2 O Z2 (X2, Y2, and Z2 are real numbers greater than 0) ) and gallium oxide (GaO X3 (X3 is a real number greater than 0). ), or gallium zinc oxide (Ga X4 ZincY4 O Z4 (X4, Y4, and Z4 (is a real number greater than 0).) The material is separated into a mosaic shape, Mosaic InO X1 , or In X2 Zinc Y2 O Z2 is uniformly distributed in the film (Hereinafter, this will also be referred to as cloud-like.)

[0246] In other words, CAC-OS is X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 A composite metal oxide having a structure in which a region in which In this specification, for example, the atomic ratio of In to the element M in the first region is The first region has an atomic ratio of In to the element M in the second region that is greater than the atomic ratio of In in the second region. The concentration of In is higher than in the region

[0247] Note that IGZO is a common name and refers to a compound made of In, Ga, Zn, and O. A typical example is InGaO3(ZnO). m1 (m1 is a natural number), or In (1 +x0) Ga (1-x0) O3(ZnO) m0 (-1≦x0≦1, m0 is an arbitrary number) Examples of such crystalline compounds include those that are

[0248] The crystalline compounds may have a single crystal structure, a polycrystalline structure, or a c-axis aligned crystal structure (CAAC). The CAAC structure is a structure in which multiple IGZO The nanocrystals have a c-axis orientation and are connected in ab-plane without being oriented. do.

[0249] On the other hand, CAC-OS is a material structure of metal oxide. CAC-OS is a material structure of In, Ga In the material composition containing Zn, and O, nanoparticles mainly composed of Ga were observed in some parts. The regions where the In is mainly contained are observed as nanoparticles, and the regions where the In is mainly contained as nanoparticles are observed. Therefore, in the CAC-OS, the crystal structure is a secondary element.

[0250] It should be noted that the CAC-OS does not include a laminated structure of two or more films having different compositions. For example, a structure consisting of two layers, a film mainly made of In and a film mainly made of Ga, is not included. do not have.

[0251] In addition, GaO X3 The region where In is the main component and X2 Zinc Y2 O Z2 , or InO X1 but In some cases, it may be difficult to observe a clear boundary between the region that is the main component and the region that is the main component.

[0252] Instead of gallium, aluminum, yttrium, copper, vanadium, and beryllium can be used. , boron, silicon, titanium, iron, nickel, germanium, zirconium, molybdenum , lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, or magnesium If one or more selected from the group consisting of uranium, sodium, etc. are included, CAC-OS will The region observed is a nanoparticle of the metal element as the main component, and the region observed is a nanoparticle of In as the main component. The nanoparticle-like regions are randomly distributed in a mosaic pattern. say.

[0253] CAC-OS is formed by sputtering without intentionally heating the substrate. In addition, when the CAC-OS is formed by a sputtering method, the deposition gas and The gas to be used should be selected from an inert gas (typically argon), oxygen gas, and nitrogen gas. In addition, the ratio of oxygen gas to the total flow rate of the deposition gas during deposition may be For example, the flow rate ratio of oxygen gas is preferably 0% or more and less than 30%. It is preferable that the content be 0% or more and 10% or less.

[0254] CAC-OS is a type of X-ray diffraction (XRD) measurement method. When measured using the θ / 2θ scan by the out-of-plane method, In other words, no clear peaks are observed from the X-ray diffraction measurement. It can be seen that no orientation in the ab plane direction or the c-axis direction of the region is observed.

[0255] In addition, the CAC-OS uses an electron beam with a probe diameter of 1 nm (also called a nano-beam electron beam). In the electron beam diffraction pattern obtained by irradiating the sample with electrons, a ring-shaped region of high brightness and the Therefore, the electron diffraction pattern indicates that the CAC-OS The crystal structure is nc (nano-crystal) which has no orientation in the planar direction and cross-sectional direction. It can be seen that it has a crystalline structure.

[0256] For example, in the case of CAC-OS made of In-Ga-Zn oxide, energy dispersive X-ray Spectroscopy (EDX: Energy Dispersive X-ray spectroscopy) The EDX mapping obtained using a GaO X3 The region where is the main component and , InX2 Zinc Y2 O Z2 , or InO X1 The areas where the main component is It can be confirmed that the compound has the structure shown in FIG.

[0257] CAC-OS has a structure different from that of IGZO compounds in which metal elements are uniformly distributed. It has different properties from ZO compounds. That is, CAC-OS is GaO X3 The main ingredients are In a certain area, X2 Zinc Y2 O Z2 , or InO X1 The region where is the main component and The phase is separated into two layers, and the regions each containing one element as a main component are arranged in a mosaic pattern.

[0258] Here, In X2 Zinc Y2 O Z2 , or InO X1 The area where GaO is the main component X3 This region has a higher electrical conductivity than the region where In is the main component. X2 Zinc Y 2O Z2 , or InO X1 The carriers flow through the area where the main component is oxidized. Therefore, the conductivity of In is expressed as a semiconductor. X2 Zinc Y2 O Z2 , or InO X The region where 1 is the main component is distributed in a cloud-like shape in the oxide semiconductor, which results in a high electric field effect. Mobility (μ) can be achieved.

[0259] On the other hand, GaO X3 The region where the main components are In X2 Zinc Y2 O Z2 , or InO X This region has higher insulating properties than the region where GaO X3 etc. The distribution of the main component in the oxide semiconductor suppresses leakage current and provides good switching performance. Switching operation can be achieved.

[0260] Therefore, when CAC-OS is used in a semiconductor device, GaO X3 Insulation caused by In X2 Zinc Y2 O Z2 , or InO X1 The conductivity caused by the This results in a high on-state current (I on ) and high field-effect mobility (μ) can be achieved. Cut.

[0261] In addition, semiconductor devices using CAC-OS have high reliability. It is ideal for a variety of semiconductor devices, including display panels.

[0262] This embodiment mode can be combined with other embodiment modes as appropriate.

[0263] (Embodiment 4) In this embodiment, a structure of a display panel according to one embodiment of the present invention will be described with reference to FIGS. He explains as he goes.

[0264] FIG. 9 illustrates a structure of a display panel according to one embodiment of the present invention.

[0265] <Display panel configuration example 6.> A display panel 700 described in this embodiment has a display area 231 (see FIG. 9).

[0266] <<Configuration Example 5 of Display Area 231>> The display area 231 includes a group of pixels 702(i,1) through 702(i,n) and another group of pixels 702(i,1) through 702(i,n). The pixels 702(1,j) to 702(m,j), the scanning line G2(i), and the signal line S2 (j) (see FIG. 9 ), where i is an integer between 1 and m, and j is an integer between 1 and n. where m and n are integers of 1 or greater.

[0267] Although not shown, the display area 231 has a conductive film VCOM2 and a conductive film ANO. .

[0268] The group of pixels 702(i,1) through 702(i,n) includes pixel 702(i,j); A group of pixels 702(i,1) to 702(i,n) are arranged in the row direction (indicated by arrow R1 in the figure). The sensors are arranged in a direction perpendicular to the axis of the optical axis.

[0269] Another group of pixels 702(1,j) through 702(m,j) includes pixel 702(i,j). Another group of pixels 702(1,j) through 702(m,j) are arranged in a column direction that intersects with the row direction. The electrodes are disposed in a direction indicated by an arrow C1 in the drawing.

[0270] The scanning line G2(i) is a group of pixels 702(i,1) to 702(i,2) arranged in the row direction. i, n).

[0271] The signal line S2(j) is connected to another group of pixels 702(1,j) to 70 2(m,j) is electrically connected to

[0272] This allows image information to be provided to multiple pixels, resulting in increased convenience or reliability. It is possible to provide a novel display panel with excellent reliability.

[0273] Display area 231 has over 600 pixels per inch.

[0274] This makes it possible to increase the aperture ratio while maintaining the pixel definition. This allows the pixel definition to be increased while maintaining the same image quality. As a result, the convenience or reliability is improved. It is possible to provide a novel display panel having such a structure.

[0275] Configuration example 6 of display area 231 The display area 231 has 7600 or more pixels in the row direction, and the display area 231 has 4300 or more pixels in the row direction. For example, 7680 pixels are arranged in the row direction, and 4320 pixels are arranged in the column direction. The elements are arranged in a row direction.

[0276] <Display panel configuration example 7.> The display area 231 includes pixels 702(i,j), 702(i,j+1), and 702(i,j+2). (i, j+2) (see FIG. 5(C)).

[0277] Pixel 702(i,j) has a chromaticity x in the CIE 1931 chromaticity coordinates greater than 0.680. It displays colors with a chromaticity of <0.720 and a chromaticity of y between 0.260 and 0.320.

[0278] Pixel 702(i,j+1) has a chromaticity x of 0.130 or more in the CIE 1931 chromaticity coordinates. 0.250 or less, and chromaticity y is greater than 0.710 and less than 0.810.

[0279] Pixel 702(i,j+2) has a chromaticity x of 0.120 or more in the CIE 1931 chromaticity coordinates. 0.170 or less, and colors with chromaticity y between 0.020 and 0.060.

[0280] In addition, pixels 702(i,j), 702(i,j+1), and 702(i,j+2 ) is determined so that the area ratio of the BT.2020 gamut in the CIE chromaticity diagram (x, y) is 80% or more. On the other hand, the coverage rate of the color gamut is set to 75% or more. Prepare to have a loading ratio of 90% or more, or a coverage rate of 85% or more.

[0281] <Display panel configuration example 8.> The display panel 700 described in this embodiment may include a plurality of driver circuits. For example, the driver circuit GDA, the driver circuit GDB, or the driver circuit SD may be provided. (See Figure 9).

[0282] <Drive circuit GDA, drive circuit GDB> The driver circuits GDA and GDB have the function of supplying a selection signal based on control information. Yes.

[0283] For example, based on control information, the frequency is 30 Hz or more, and preferably 60 Hz or more. This allows smooth display of moving images. It is possible.

[0284] For example, based on the control information, the frequency is set to less than 30 Hz, preferably less than 1 Hz, and more preferably less than 1 Hz. It has a function to supply a selection signal to one scan line at a frequency of less than once per minute. A still image can be displayed with the browser suppressed.

[0285] In the case of providing a plurality of driving circuits, for example, the frequency with which the driving circuit GDA supplies a selection signal and the driving The frequency at which the static circuit GDB supplies the selection signal can be made different. A moving image is displayed at a frequency higher than the frequency at which a selection signal is supplied to one area displaying a still image. A selection signal can be supplied to the other area, which reduces flicker in one area. In this state, a still image can be displayed, and a moving image can be displayed smoothly in another area.

[0286] Alternatively, the progressive method can be used to display at a frame rate of 120Hz. Alternatively, the international standard Recommendation ITU-R BT.2 020-2, it is possible to display extremely high resolution. It is possible to display the information in a simple manner.

[0287] 《Drive circuit SD(1)》 The driving circuit SD(1) has a function of supplying an image signal based on information V11 (see FIG. 9). (see).

[0288] The driving circuit SD(1) has a function of generating an image signal and a function of transmitting the image signal to a display element. The pixel circuitry is provided with a function of supplying a signal to a pixel circuit that is connected to the pixel circuitry.

[0289] For example, various sequential circuits such as shift registers can be used for the driver circuit SD(1). can.

[0290] For example, an integrated circuit formed on a silicon substrate can be used for the driver circuit SD(1). do.

[0291] For example, the COG (Chip on Glass) method or the COF (Chip on Fi The lm) method can be used to mount integrated circuits on the terminals. can be used to mount an integrated circuit to the terminals.

[0292] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0293] (Embodiment 5) In this embodiment, a structure of a display device according to one embodiment of the present invention will be described with reference to FIG. Reveal.

[0294] FIG. 10 is a block diagram illustrating a structure of a display device according to one embodiment of the present invention.

[0295] <Example of display device configuration> The display device described in this embodiment has a control unit 238 and a display panel 700 (see FIG. 10).

[0296] Example of the configuration of the control unit 238 The control unit 238 is supplied with image information V1 and control information CI. For example, a clock signal Alternatively, a timing signal or the like can be used as the control information CI.

[0297] The control unit 238 generates information V11 based on the image information V1 and The control unit 238 also supplies the information V11 and the control signal SP. For example, the information V11 includes gradations of 8 bits or more, preferably 12 bits or more.

[0298] Specifically, the control unit 238 controls the control circuit 233, the expansion circuit 234, and the image processing circuit 23 Equipped with 5.

[0299] <<Control circuit 233>> The control circuit 233 has a function of generating and supplying a control signal SP.

[0300] The control circuit 233 has a function of supplying a control signal SP. For example, a clock signal or a time signal A timing signal or the like can be used as the control signal SP. 1) or the start pulse that starts the operation of the driver circuit SDA(1), etc. is used as the control signal SP. This allows the operations of a plurality of drive circuits to be synchronized.

[0301] For example, a timing controller can be used in the control circuit 233 .

[0302] The control circuit 233 may be included in the display panel. For example, the control circuit 233 may be mounted on a rigid substrate. The control circuit 233 thus constructed can be used in a display panel. The control circuit 233 is electrically connected to the drive circuit using a flexible printed circuit board. It is possible.

[0303] Specifically, the driver circuit GDA(1), the driver circuit GDB(1), the driver circuit GDA(2) and and the driver circuit GDB(2). Also, the driver circuit SDA(1) , drive circuit SDB(1), drive circuit SDC(1), drive circuit SDA(2), drive circuit SD B(2) and the driving circuit SDC(2).

[0304] 《Extension circuit 234》 The decompression circuit 234 has a function of decompressing the image information V1 that is supplied in a compressed state. The decompression circuit 234 includes a storage unit. The storage unit has a function of storing, for example, the decompressed image information. It has Noh.

[0305] "Image processing circuit 235" The image processing circuit 235 includes, for example, a storage area. The storage area stores, for example, image information V1 It has the function of storing the information contained in

[0306] The image processing circuit 235 corrects the image information V1 based on a predetermined characteristic curve, for example, to obtain information It has a function for generating V11 and a function for supplying information V11.

[0307] Example of display panel configuration The display panel 700 is supplied with information V11 or a control signal SP. The driving circuit is Operating based on P, pixel 702(i,j) displays based on information V11.

[0308] For example, the display panel described in any of the first to fourth embodiments can be used. do.

[0309] For example, the driver circuit GDA(1), the driver circuit GDB(1), the driver circuit GDA(2) and the driver The operation circuit GDB(2) has a function of supplying a selection signal based on a control signal SP.

[0310] For example, the drive circuit SDA(1), the drive circuit SDB(1), the drive circuit SDC(1), The circuit SDA(2), the driver circuit SDB(2) and the driver circuit SDC(2) provide a control signal SP. and supplies information V11.

[0311] This allows image information to be displayed using the display element. This makes it possible to provide a novel display device with excellent reliability.

[0312] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0313] (Embodiment 6) In this embodiment, a configuration of an input / output device of one embodiment of the present invention will be described with reference to FIG. explain.

[0314] FIG. 11 is a block diagram illustrating a configuration of an input / output device of one embodiment of the present invention.

[0315] <Example of I / O device configuration> The input / output device described in this embodiment has an input unit 240 and a display unit 230 (see FIG. 11).

[0316] 《Display section 230》 For example, the display panel 700 described in the first or second embodiment may be used for the display unit 230. The configuration having the input unit 240 and the display unit 230 may be referred to as an input / output panel. It can be said that it is 700TP.

[0317] Configuration example 1 of input unit 240 The input unit 240 includes a detection area 241. The input unit 240 is adjacent to the detection area 241. It has the function to detect.

[0318] The sensing region 241 comprises the area that overlaps with pixel 702(i,j).

[0319] As a result, while the image information is being displayed using the display unit, the area overlapping the display unit and the adjacent area can be easily viewed. Or, a finger or other object placed close to the display can be used as a pointer to indicate the position. Alternatively, the location information can be associated with the image information to be displayed on the display unit. As a result, a novel input / output device with excellent convenience and reliability can be provided. It is possible.

[0320] Configuration example 2 of input unit 240 The input section 240 may include an oscillator circuit OSC and a detection circuit DC (see FIG. 11). .

[0321] "Detection Area 241" Sensing region 241 may, for example, comprise one or more sensing elements.

[0322] The sensing region 241 includes a group of sensing elements 775(g,1) through 775(g,q); and another group of detector elements 775(1,h) through 775(p,h). , g is an integer of 1 or more and p or less, h is an integer of 1 or more and q or less, and p and q are 1 or more and is an integer.

[0323] A group of detector elements 775(g,1) to 775(g,q) are detector elements 775(g , h) and are arranged in the row direction (the direction indicated by the arrow R2 in the figure). The direction in which the rotation is performed may be the same as the direction indicated by the arrow R1, or may be different.

[0324] In addition, another group of detector elements 775(1,h) to 775(p,h) are detector elements 775(g,h) and arranged in the column direction (indicated by the arrow C2 in the figure) intersecting the row direction. will be done.

[0325] Detector Element The sensing element has the function of detecting a nearby pointer. For example, a finger or a stylus pen. It can be used for pointers. For example, a metal piece or coil can be used for a stylus pen. There can be.

[0326] Specifically, there are capacitive proximity sensors, electromagnetic induction proximity sensors, and optical proximity sensors. A sensor using a resistive film or a proximity sensor using a resistive film can be used as the detection element.

[0327] In addition, it is possible to use multiple types of sensing elements together. For example, a sensing element that detects a finger and , a detection element for detecting a stylus pen can be used in combination.

[0328] This makes it possible to determine the type of the pointer. Based on this, different instructions can be associated with the sensed information. If it is determined that a finger was used, the detection information can be associated with a gesture. If it determines that a stylus pen is used as a pointer, it associates the detection information with the drawing process. It can be attached.

[0329] Specifically, a finger can be detected using a capacitance or optical proximity sensor. Alternatively, a stylus pen can be detected using an electromagnetic induction or optical proximity sensor. It can be known.

[0330] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. .

[0331] (Embodiment 7) In this embodiment, a configuration of a data processing device according to one embodiment of the present invention will be described with reference to FIGS. The explanation will be given with reference to the above.

[0332] FIG. 12A is a block diagram illustrating a configuration of a data processing device of one embodiment of the present invention. FIG. 2(B) is a projection view illustrating an example of the external appearance of an information processing device.

[0333] FIG. 13 is a flowchart illustrating a program according to one embodiment of the present invention. FIG. 13 is a flowchart for explaining the main process of a program according to an embodiment of the present invention. 4B) is a flowchart illustrating an interrupt process.

[0334] FIG. 14 is a diagram illustrating a program according to one embodiment of the present invention. 14 is a flowchart illustrating an interrupt process of a program according to an embodiment. 14A is a schematic diagram illustrating an operation of an information processing device according to one embodiment of the present invention, and FIG. 4 is a timing chart illustrating an operation of the information processing device.

[0335] FIG. 15 is a diagram illustrating an artificial intelligence unit according to one embodiment of the present invention. FIG. 15B is a block diagram illustrating an artificial intelligence unit of the neural network according to one embodiment of the present invention. FIG. 15(C) is a block diagram illustrating a neural network according to one embodiment of the present invention. FIG. 1 is a block diagram illustrating a switching circuit.

[0336] <Configuration example 1 of information processing device> The information processing device 200 described in this embodiment includes a calculation device 210, an input / output device 220, and 12A. Note that the input / output device 220 is electrically connected to the arithmetic device 210. The information processing device 200 may also include a housing (see FIG. 12(B)). see).

[0337] Configuration example 1 of the arithmetic device 210 The computing device 210 is supplied with input information II or detection information DS. The computing device 210 is a control It supplies information CI and image information V1.

[0338] The calculation device 210 includes a calculation unit 211 and a storage unit 212. The calculation unit 211 includes: It includes a transmission path 214 and an input / output interface 215 .

[0339] The transmission line 214 includes a calculation unit 211, a storage unit 212, and an input / output interface 215. are electrically connected.

[0340] 《Calculation section 211》 The calculation unit 211 has a function of executing a program, for example.

[0341] 《Storage section 212》 The storage unit 212 stores, for example, a program executed by the calculation unit 211, initial information, setting information, or It has the function of storing images, etc.

[0342] Specifically, a hard disk, a flash memory, or a transistor including an oxide semiconductor A memory using the above-mentioned method can be used.

[0343] Input / output interface 215, transmission path 214 The input / output interface 215 includes terminals or wiring, and supplies and receives information. For example, it can be electrically connected to the transmission line 214. It can be electrically connected to the device 220 .

[0344] The transmission path 214 has wiring and functions to supply information and to receive information. The output interface 215 can be electrically connected to the calculation unit 211. It can be electrically connected to the memory 212 or the input / output interface 215.

[0345] Example of the configuration of the input / output device 220 The input / output device 220 provides input information II and detection information DS. , control information CI and image information V1 are supplied (see FIG. 12(A)).

[0346] For example, keyboard scan codes, location information, button operation information, voice information or image information Image information or the like can be used as the input information II. Illuminance information, posture information, acceleration information, direction information, pressure information, temperature information, etc. of the environment in which it is used Alternatively, humidity information or the like can be used as the detection information DS.

[0347] For example, a signal for controlling the luminance of the image information V1, a signal for controlling the saturation, a signal for controlling the hue, A signal for controlling the display of a part of the image information V1 can be used as the control information CI. The signal to be changed can be used for control information CI.

[0348] The input / output device 220 includes a display unit 230, an input unit 240, and a detection unit 250. For example, In this case, the input / output device described in the sixth embodiment can be used.

[0349] The display unit 230 displays the image information V1 based on the control information CI.

[0350] The input unit 240 generates input information II.

[0351] The detector 250 generates detection information DS.

[0352] 《Display section 230》 The display unit 230 has a function of displaying an image based on the image information V1. It has the function of displaying images based on the information CI.

[0353] The display unit 230 includes a control unit 238, a drive circuit GDA(1), a drive circuit SDA(1), For example, the display panel 700 may be the same as that described in the fifth embodiment. A display device can be used for the display unit 230.

[0354] <<Input section 240>> The input unit 240 has a function of supplying position information. A chair or the like can be used as the input unit 240 (see FIG. 12(A)).

[0355] For example, keyboards, hardware buttons, pointing devices, touch sensors, An image input device, a voice input device, a gaze input device, a posture detection device, a microphone or a camera, etc. are included in the input unit 2. 40. In addition, a touch sensor having an area overlapping the display unit 230 may be used. The display unit 230 and the touch sensor having an area overlapping the display unit 230 may be provided. An input / output device that can display a touch screen can be called a touch panel or touch screen.

[0356] For example, a user can perform various gestures (tabbing) using a finger as a pointer on a touch panel. You can move the cursor around the screen in various ways (such as clicking, dragging, swiping or pinching in).

[0357] For example, the computing device 210 analyzes information such as the position or trajectory of a finger touching the touch panel. When the analysis result meets a certain condition, it can be said that a specific gesture has been provided. This allows the user to select a specific gesture that is pre-associated with the specific gesture. Operation instructions can be provided using the gestures.

[0358] For example, the user may issue a "scroll command" to change the display position of image information by tapping. The gesture can be provided by moving a finger along the touch panel. .

[0359] <Detection unit 250> The detection unit 250 has a function of supplying detection information DS. The detection unit 250 is, for example, an information processing The device 200 has a function of detecting the illuminance of the environment in which the device 200 is used, and a function of supplying illuminance information. Prepare.

[0360] The detection unit 250 has a function of detecting the surrounding state and supplying detection information. Illuminance information, posture information, acceleration information, direction information, pressure information, temperature information, humidity information, etc. Can be provided.

[0361] For example, photodetectors, illuminance sensors, attitude detectors, acceleration sensors, orientation sensors, GPS (Gl Obal Positioning System) signal receiving circuit, pressure sensor, temperature sensor The detection unit 250 can be a temperature sensor, a humidity sensor, a camera, or the like.

[0362] 《Communication Section 290》 The communication unit 290 has a function of supplying information to the network and acquiring information from the network. Prepare.

[0363] 《Case》 The housing has a function of housing the input / output device 220 or the arithmetic unit 210. The housing has a function of supporting the display unit 230 or the computing device 210 .

[0364] Thereby, the information processing device can detect the The device can operate by detecting the intensity of light received by the housing. As a result, new information that is convenient or reliable can be displayed. It is possible to provide an information processing device.

[0365] In addition, these configurations cannot be clearly separated, and one configuration may serve as another configuration or may be used in combination with another configuration. For example, a touch panel in which a touch sensor is superimposed on a display panel may include a part of the , which serves as both a display unit and an input unit.

[0366] Configuration example 2 of the arithmetic device 210 The arithmetic device 210 includes an artificial intelligence unit 213 (see FIG. 12(A)).

[0367] {Configuration Example 1 of Artificial Intelligence Unit 213} The artificial intelligence unit 213 generates control information CI based on the input information II or the detection information DS. (See FIG. 15(A)).

[0368] The artificial intelligence unit 213 includes a semiconductor device 90 .

[0369] [Natural language processing for input information II] Specifically, the artificial intelligence unit 213 performs natural language processing on the input information II to extract a sentence from the entire input information II. For example, the artificial intelligence unit 213 can extract one feature from the input information II. It is possible to infer emotions and other characteristics that are suitable for the characteristics. The artificial intelligence unit 213 can infer the color, pattern, font, etc. that is perceived by the user. generates information specifying the color, pattern or font of characters, and information specifying the color or pattern of the background. This can be used for control information CI.

[0370] Specifically, the artificial intelligence unit 213 processes the input information II in natural language and For example, the artificial intelligence unit 213 can extract some words that are likely to be used in the sentence. The artificial intelligence unit 213 can extract expressions including false positives or emotions. Generate control information CI that displays the output part in a different color, pattern, or font from the other part. and can be used for control information CI.

[0371] [Image processing for input information II] Specifically, the artificial intelligence unit 213 performs image processing on the input information II to obtain one For example, the artificial intelligence unit 213 may extract features of the input information II. The era, whether the environment in which the input information II was taken was indoors or outdoors, It is possible to infer whether the environment in which the image was taken is daytime or nighttime, and to characterize it. In addition, it is possible to infer a color tone that is empirically felt to be suitable for the characteristic, and to display the color tone. Specifically, the control information CI used to express the shading can be generated. The control information CI is used to specify the color (for example, full color, black and white, or brown, etc.) to be used. It is possible.

[0372] Specifically, the artificial intelligence unit 213 performs image processing on the input information II to A portion of the image can be extracted. For example, a boundary between the extracted portion of the image and another portion of the image can be omitted. Specifically, the control information CI that displays the extracted image can be generated by enclosing a part of the image. It is possible to generate control information CI that displays a rectangle including the

[0373] [Inference using detection information DS] Specifically, the artificial intelligence unit 213 uses the detection information DS as the information IN to generate an inference RI. Alternatively, based on the inference RI, it is possible to determine whether the user of the information processing device 200 is comfortable. It is possible to generate control information CI for making the user feel that way.

[0374] Specifically, based on the illuminance of the environment, the artificial intelligence unit 213 determines whether the display brightness is comfortable. It is possible to generate control information CI that adjusts the brightness of the display so that the user feels that the display is brighter than usual. Alternatively, the artificial intelligence unit 213 may determine the size of the room based on the noise level of the environment. In addition, control information CI for adjusting the volume can be generated.

[0375] The clock signal or timing signal supplied to the control unit 238 of the display unit 230 The above can be used as the control information CI. A clock signal or a timing signal corresponding to the control signal CI can be used as the control information CI.

[0376] Semiconductor device 90 The semiconductor device 90 supplies control information CI based on the input information II or the detection information DS. .

[0377] The semiconductor device 90 is supplied with information IN and supplies inference RI (FIG. 15(A), FIG. 15(B) For example, the input information II or the sensed information DS can be used as the information IN. Or, for example, the inference RI can be used for the control information CI.

[0378] For example, the semiconductor device 90 can extract features from the input information II or the detected information DS. The semiconductor device 90 can generate control information CI based on the extracted features. Cut.

[0379] For example, the semiconductor device 90 can extract a part of the input information II or the detection information DS. The semiconductor device 90 can display the extracted part in a different way from the other part. Information CI can be generated.

[0380] This makes it possible to generate control information that is displayed in a way that is perceived as appropriate. Or, it can be displayed in a way that is perceived as suitable. Or, it can be displayed in a way that is perceived as comfortable. It is possible to generate control information that is displayed in a way that makes it easy to see what is happening or that is comfortable to see. As a result, a novel information processing method that is highly convenient and reliable can be realized. A management device can be provided.

[0381] Configuration Example 2 of Semiconductor Device 90 The semiconductor device 90 includes a neural network 80 (see FIG. 15(A)).

[0382] "Neural Network 80" The neural network 80 includes an input layer 81, an intermediate layer 82, and an output layer 83 (see FIG. For example, a convolutional neural network can be used as a neural network. 80. Alternatively, a recurrent neural network can be used as a neural network. It can be used for the workpiece 80.

[0383] The input layer 81 comprises a first set of neuron circuits.

[0384] The hidden layer 82 comprises a second set of neuron circuits.

[0385] The output layer 83 comprises a third set of neuron circuits.

[0386] The second group of neuron circuits includes a first neuron circuit 71 and a second neuron circuit Includes 72.

[0387] The first neuron circuit 71 is electrically connected to a first group of neuron circuits.

[0388] The second neuron circuit 72 is electrically connected to a third group of neuron circuits.

[0389] The first group of neuron circuits is supplied with information IN. For example, input information II or detection The information DS can be used for the information IN.

[0390] A third set of neuronal circuits supplies inference RI, i.e., control information CI can be used.

[0391] "Neuron Circuit 71" The neuron circuit 71 includes a multiply-and-accumulate unit 10 and a converter 30 (see FIG. 15(C)).

[0392] <<Multiply-and-accumulate unit 10>> The multiply-and-accumulate unit 10 is supplied with a group of input signals X[1] through X[N]. The weight information unit 10 is supplied with a set of weight information W[1] to W[N]. 10 is supplied with a bias signal B.

[0393] The multiply-and-accumulate unit 10 receives a group of input signals X[1] through X[N] and weight information W[1]. or generating a product-sum signal u based on the product-sum value of the weight information W[N] and a bias signal B, and providing For example, a memory using a transistor including an oxide semiconductor is provided with weight information W[1 ] to weight information W[N]. A transistor including an oxide semiconductor containing indium, gallium, and zinc The transistor can be used as a memory. Also, for example, an analog arithmetic circuit can be used as a multiply-accumulate This allows the circuit scale to be smaller than that of a digital arithmetic circuit. Alternatively, the power consumption can be reduced.

[0394] Converter 30 The converter 30 is electrically connected to the sum-of-products calculator 10. The converter 30 outputs a sum-of-products signal u An output signal f(u) is generated and provided.

[0395] <Configuration example 3 of information processing device> Another configuration of a data processing device of one embodiment of the present invention is shown in FIG. The explanation will be given with reference to the above.

[0396] "program" A program according to one embodiment of the present invention has the following steps (see FIG. 13(A)).

[0397] [First step] In the first step, the settings are initialized (see FIG. 13(A)(S1)).

[0398] For example, predetermined image information to be displayed at the time of startup, and a predetermined mode in which the image information is displayed; and information for specifying a predetermined display method for displaying the image information, from the storage unit 212. Specifically, one still image or other moving image information may be used as the predetermined image information. Also, the first mode or the second mode can be used for a given mode.

[0399] [Second step] In the second step, interrupt processing is permitted (see FIG. 13(A)(S2)). The processor that is enabled to process an interrupt can process the interrupt in parallel with the main process. The processor that has returned from interrupt processing to the main processing can use the results obtained from the interrupt processing. This can be reflected in the main processing.

[0400] When the counter value is the initial value, the arithmetic unit is caused to perform an interrupt process. When returning from the program, the counter may be set to a value other than the initial value. After starting, you can always have the interrupt process.

[0401] [Third step] In a third step, a predetermined The image information is displayed using the mode or a predetermined display method (see FIG. 13(A)(S3)). The predetermined mode specifies the mode in which information is displayed, and the predetermined display method specifies the image information. Also, for example, image information V1 can be used as information to be displayed. Cut.

[0402] For example, one way of displaying image information V1 may be associated with a first mode. Alternatively, other ways of displaying the image information V1 can be associated with the second mode. This allows the display method to be selected based on the selected mode.

[0403] First mode Specifically, a selection signal is provided to one scanning line at a frequency of 30 Hz or more, preferably 60 Hz or more. A method of providing a display based on the selection signal can be associated with the first mode.

[0404] For example, when a selection signal is supplied at a frequency of 30 Hz or more, preferably 60 Hz or more, a moving image The movement of the subject can be displayed smoothly.

[0405] For example, if the image is updated at a frequency of 30 Hz or more, and preferably at a frequency of 60 Hz or more, the user's operation The image that changes smoothly in accordance with the user's operation is displayed on the information processing device 200 that the user is operating. It can be shown.

[0406] Second Mode Specifically, the frequency is less than 30 Hz, preferably less than 1 Hz, and more preferably less than once per minute. A method of supplying a selection signal to one scanning line at a time and displaying based on the selection signal is called the second mode. It can be associated with a

[0407] A selection signal at a frequency of less than 30 Hz, preferably less than 1 Hz, and more preferably less than once per minute. By supplying the above, it is possible to suppress flicker or blinking when displaying. Power consumption can be reduced.

[0408] For example, when the information processing device 200 is used in a clock, the frequency is once per second or once per minute. The display can be updated with frequency, etc.

[0409] By the way, when a light emitting element is used as a display element, the light emitting element is made to emit light in a pulsed manner. Specifically, the organic EL element is made to emit light in a pulsed manner, so that image information can be displayed. The afterglow can be used for display. Organic EL elements have excellent frequency characteristics. In this case, the time for driving the light-emitting element can be shortened, and power consumption can be reduced. In this case, heat generation is suppressed, and therefore deterioration of the light-emitting element can be reduced in some cases.

[0410] [Fourth step] In the fourth step, if a termination command is provided, the process proceeds to the fifth step. If not supplied, select to proceed to the third step (FIG. 13(A)(S4) reference).

[0411] For example, the end command supplied in the interrupt process may be used for the judgment.

[0412] [5th ​​step] In the fifth step, the process ends (see FIG. 13(A)(S5)).

[0413] <<Interrupt Processing>> The interrupt process includes the following sixth to eighth steps (see FIG. 13(B)). .

[0414] [Sixth step] In a sixth step, for example, the detection unit 250 is used to detect whether the information processing device 200 is being used. The illuminance of the environment in which the subject is placed is detected (see FIG. 13(B)(S6)). The color temperature and chromaticity of the ambient light may also be detected.

[0415] [Seventh step] In the seventh step, a display method is determined based on the detected illuminance information (FIG. 13(B) ) (see S7)). For example, the brightness of the display should be adjusted to ensure it is not too dark or too bright. is decided.

[0416] In addition, if the color temperature or chromaticity of the ambient light is detected in the sixth step, the display The color may be adjusted.

[0417] [8th step] In the eighth step, the interrupt process ends (see FIG. 13(B) (S8)).

[0418] <Configuration example 3 of information processing device> Another configuration of the data processing device of one embodiment of the present invention will be described with reference to FIG.

[0419] FIG. 14A is a flowchart illustrating a program according to one embodiment of the present invention. (A) is a flow chart illustrating an interrupt process different from the interrupt process shown in FIG. 13(B). It is a chart.

[0420] In addition, the third example of the information processing device changes the mode based on a given event. The fact that the interrupt process includes a step for performing the above-mentioned operation is the same as that of the interrupt process described with reference to FIG. This section describes the differences in detail and explains how to use a similar configuration. The above explanation will be used to explain the parts that can be used.

[0421] <<Interrupt Processing>> The interrupt process includes the following sixth to eighth steps (see FIG. 14(A)). .

[0422] [Sixth step] In the sixth step, if a predetermined event is provided, the seventh step is performed; If the predetermined event is not provided, proceed to the eighth step (FIG. 14(A) (U6 For example, a condition can be whether a specific event was provided within a specific period of time. Specifically, it is possible to perform the above-mentioned operation for 5 seconds or less, 1 second or less, or 0.5 seconds or less, preferably 0.1 seconds or less. The predetermined period may be a period longer than 0 seconds.

[0423] [Seventh step] In the seventh step, the mode is changed (see FIG. 14(A)(U7)). Specifically, If you have selected the first mode, select the second mode, and then select the second mode. If so, the first mode is selected.

[0424] For example, the display mode of a part of the display unit 230 can be changed. Specifically, the display unit 230 includes the drive circuits GDA, GDB, and GDC. The display mode can be changed for an area to which one drive circuit supplies a selection signal ( See Figure 14(B).

[0425] For example, in the input section 240 in the area overlapping the area where the driving circuit GDB supplies the selection signal, When a specific event is supplied, the driver GDB supplies a selection signal to the display model of the area. The mode can be changed (see Fig. 14(B) and Fig. 14(C)). The driver circuit GDB supplies a "tap" event to the touch panel using the The frequency of the selection signal can be changed.

[0426] The signal GCLK is a clock signal that controls the operation of the driving circuit GDB, and the signal PWC Signals PWC1 and PWC2 are pulse width control signals that control the operation of the driver circuit GDB. The circuit GDB outputs a selection signal based on the signals GCLK, PWC1 and PWC2. are supplied to the scanning lines G2(m+1) through G2(2m).

[0427] This allows, for example, the driver circuits GDA and GDC to supply a selection signal. Alternatively, the driver circuit GDA and the driver circuit GDB may supply the selection signal. The driver circuit GDB selects the area without changing the display of the area to which the driver circuit GDC supplies the selection signal. The display of the area to which the select signal is supplied can be updated. can be suppressed.

[0428] [8th step] In the eighth step, the interrupt process is ended (see FIG. 14(A)(U8)). Alternatively, the interrupt process may be repeatedly executed during the execution of the main process.

[0429] 《Specified Event》 For example, "clicking" and "dragging" provided using a pointing device such as a mouse Events such as "tap" and "drag" are supplied to the touch panel using a finger as a pointer. Events such as "click" or "swipe" can be used.

[0430] Also, for example, the position of the slide bar pointed to by the pointer, the speed of the swipe, the speed of the drag, The degree or the like can be used to provide arguments for the command associated with a given event.

[0431] For example, the information detected by the detection unit 250 is compared with a preset threshold value, and the comparison result is can be used for events.

[0432] Specifically, a pressure-sensitive detector that contacts a button or the like that is arranged so that it can be pressed into the housing. etc. can be used for the detection unit 250.

[0433] Commands associated with specific events For example, a termination command may be associated with a particular event.

[0434] For example, a "page turn" function is used to switch the display from one image to another. The "page turn command" can be associated with a specific event. The arguments that determine the page turning speed and other parameters used during execution are sent using a specified event. Can be given.

[0435] For example, the display position of a part of one image information is moved to display a part of the image information that is continuous with the part. You can associate a "scroll command" to display other parts with a specified event. In addition, it determines the speed at which the display moves when executing the "scroll command." Arguments can be provided with a given event.

[0436] For example, a command to set a display method or a command to generate image information is generated by a predetermined event. It is possible to associate the argument that determines the brightness of the generated image with a given event. In addition, the argument that determines the brightness of the generated image can be associated with the detection unit 2. The determination may be based on the brightness of the environment detected by 50.

[0437] For example, information distributed using a push-type service is acquired using the communication unit 290. An instruction to execute a command or the like can be associated with a given event.

[0438] The qualification to obtain information is determined using the location information detected by the detection unit 250. Specifically, the person may be in a specific classroom, school, conference room, company, building, or other area. This may allow, for example, a school or The information processing device 200 can be used as a textbook or the like by receiving teaching materials distributed in classrooms at universities, etc. (See Figure 12(B)). Or, you can receive materials distributed in a conference room of a company, etc. , can be used for meeting materials.

[0439] Note that this embodiment mode can be appropriately combined with other embodiment modes described in this specification. . [Example]

[0440] In this example, a transistor that can be used for a display panel of one embodiment of the present invention was fabricated. The results will be described with reference to FIG. 8 and FIG.

[0441] FIG. 16 is a diagram illustrating the characteristics of the fabricated transistor. The transistor has a configuration similar to that of the transistor shown in FIG.

[0442] <Production method> First, an insulating film 501C is formed, and then a conductive film 504 is formed on the insulating film 501C. Then, an insulating film 506 is formed on the conductive film 504, and a semiconductor film 508 is formed on the insulating film 506. An opening was formed in the insulating film 506. Next, the conductive film 512A and Then, a conductive film 512B was formed, and an insulating film 516 was formed. Thus, a conductive film 512C was formed in the transistor SW2. The channel width W of the transistor used in the switch SW2 was set to 3 μm. The channel length was set to 3 μm.

[0443] Next, a semiconductor film 508(2) is formed on the insulating film 516, and an opening is formed in the insulating film 516. Next, a conductive film 512D and a conductive film 512E in contact with the semiconductor film 508(2) were formed. Then, an insulating film 516(2) was formed. This completed the transistor M. The channel width W of the transistor M was set to 50 μm and the channel length to 3 μm.

[0444] Note that an oxide semiconductor film was used for the semiconductor film 508 and the semiconductor film 508(2).

[0445] <Evaluation> The characteristics of the fabricated transistor M are shown below. Specifically, the voltage between the source and drain (Vd When the gate voltage (I s) is set to 0.1 V and 20 V, D-VG) characteristics are shown (see FIG. 16(a)).

[0446] The characteristics of the transistor used in the fabricated switch SW2 are shown below. Specifically, the source and drain When the voltage between the drain and the input (Vds) is set to 0.1V and 20V, The current-gate voltage (ID-VG) characteristics are shown (see FIG. 16(b)).

[0447] All of them had good transistor characteristics.

[0448] For example, in the present specification, when it is explicitly stated that X and Y are connected, In this case, X and Y are electrically connected, and X and Y are functionally connected. The case where X and Y are directly connected is also considered to be disclosed in the present specification. Therefore, the present invention is not limited to a specific connection relationship, for example, a connection relationship shown in a drawing or a sentence. Any connection relationship other than that shown in the drawings or text is also considered to be disclosed in the drawings or text. do.

[0449] Here, X and Y are objects (e.g., devices, elements, circuits, wiring, electrodes, terminals, conductive films, layers, etc.). , etc.).

[0450] An example of a direct connection between X and Y is a circuit that allows electrical connection between X and Y. The elements to be considered (e.g., switches, transistors, capacitance elements, inductors, resistance elements, When a resistor (such as an electrode, display element, light-emitting element, or load) is not connected between X and Y, The elements that allow electrical connection between X and Y (e.g., switches, transistors, capacitors, etc.) elements, inductors, resistors, diodes, display elements, light-emitting elements, loads, etc.) , X and Y are connected.

[0451] An example of a case where X and Y are electrically connected is The elements to be considered (e.g., switches, transistors, capacitance elements, inductors, resistance elements, One or more elements (such as an electrode, a display element, a light-emitting element, or a load) can be connected between X and Y. It is possible. The switch has a function that allows it to be turned on and off. A switch can be in a conductive state (on state) or a non-conductive state (off state) and can either pass current or not. The switch has the function of controlling whether or not current flows. When X and Y are electrically connected, This includes the case where Y is directly connected.

[0452] An example of a case where X and Y are functionally connected is a case where a functional connection between X and Y is possible. Circuits that perform the above functions (for example, logic circuits (inverters, NAND circuits, NOR circuits, etc.), signal conversion conversion circuits (DA conversion circuits, AD conversion circuits, gamma correction circuits, etc.), potential level conversion circuits ( power supply circuits (voltage boost circuits, voltage drop circuits, etc.), level shifter circuits that change the potential level of signals, etc.) , voltage sources, current sources, switching circuits, amplifier circuits (which can increase the signal amplitude or current amount, etc.) circuits, operational amplifiers, differential amplifier circuits, source follower circuits, buffer circuits, etc.), signal generation One or more devices (such as a memory circuit, a control circuit, etc.) can be connected between X and Y. For example, even if another circuit is inserted between X and Y, the signal output from X If X is transmitted to Y, then X and Y are considered to be functionally connected. When X and Y are functionally connected, there are cases where X and Y are directly connected and cases where X and Y are functionally connected. and the case where they are electrically connected to each other.

[0453] In addition, if it is explicitly stated that X and Y are electrically connected, are electrically connected (i.e., there is another element or circuit between X and Y) When X and Y are functionally connected (i.e., when X and Y are connected), (When there is a functional connection between X and Y via another circuit in between) and when X and Y are directly connected (i.e., when X and Y are connected without any other element or circuit between them) is deemed to be disclosed in the present specification. If it is explicitly stated that it is connected, The same contents are deemed to be disclosed in the present specification and the like.

[0454] For example, the source (or the first terminal, etc.) of the transistor is connected via Z1 (or The drain (or second terminal, etc.) of the transistor is electrically connected to Z 2 (or not), it may be electrically connected to Y, or the source of the transistor (or the first terminal, etc.) is directly connected to a part of Z1, and another part of Z1 is directly connected to X. The drain (or second terminal, etc.) of the transistor is directly connected to a part of Z2. and another part of Z2 is directly connected to Y, It is possible to do so.

[0455] For example, "X and Y and the source (or first terminal, etc.) and drain (or second terminal, etc.) of a transistor The terminals of the transistor (or the first terminal, etc.) are electrically connected to each other, and X, the source of the transistor (or the first terminal, etc.) 1 terminal, etc.), the drain (or second terminal, etc.) of the transistor, and Y. "The source (or the third) of the transistor is connected to the The drain (or second terminal, etc.) of the transistor is electrically connected to X. The transistor source (or first terminal, etc.) is electrically connected to Y, and the transistor source (or first terminal, etc.) is electrically connected to X. The drain (or second terminal, etc.) of the transistor, Y, is electrically connected in this order. " Alternatively, "X is the source (or first terminal, etc.) of a transistor. The transistor is electrically connected to Y via a drain (or a second terminal, etc.) and a transistor is electrically connected to X via a drain (or a second terminal, etc.). The source (or first terminal, etc.) of a resistor, the drain (or second terminal, etc.) of a transistor, ), Y is provided in this connection order. By using a simple expression method and specifying the order of connections in the circuit configuration, Distinguish between the source (or first terminal, etc.) and the drain (or second terminal, etc.) of a transistor. The technical scope can be determined based on the above.

[0456] Or, as another way of expressing it, for example, "the source (or first terminal, etc.) of a transistor is electrically connected to X through at least a first connection path, and the first connection path is , the second connection path does not have a second connection path, and the second connection path is a transistor The source (or first terminal, etc.) of the transistor and the drain (or second terminal, etc.) of the transistor The first connection path is a path via Z1, and the second connection path is a path between the transistor The drain (or second terminal, etc.) of the capacitor is electrically connected to Y through at least a third connection path. The third connection path does not include the second connection path, and the third connection path The connection path is the path through Z2. The source (or the first terminal, etc.) of the resistor is connected to the resistor via Z1 by at least the first connection path. and X is electrically connected to the first connection path, and the first connection path does not have a second connection path; The second connection path includes a connection path through a transistor, and the second connection path includes a drain of the transistor. (or the second terminal, etc.) is connected to Y via Z2 by at least a third connection path. The third connection path does not have the second connection path. Alternatively, the source (or the first terminal, etc.) of the transistor may be at least The first electrical path is electrically connected to X through Z1, and the first electrical path is The primary path does not have a second electrical path, and the second electrical path is a From the source (or first terminal, etc.) to the drain (or second terminal, etc.) of the transistor The drain (or second terminal, etc.) of the transistor is connected to at least a third The third electrical path is electrically connected to Y through Z2. , the fourth electrical path is not included, and the fourth electrical path is a drain of the transistor (or second terminal, etc.) to the source (or first terminal, etc.) of the transistor. Using the same expression as these examples, the circuit configuration By defining the connection path in Distinguish between the first terminal (or the second terminal, etc.) and the drain (or the second terminal, etc.) to determine the technical scope. can be done.

[0457] Note that these expression methods are merely examples, and the present invention is not limited to these expression methods. , Y, Z1, and Z2 are objects (e.g., devices, elements, circuits, wiring, electrodes, terminals, conductive films, layer, etc.).

[0458] In addition, the circuit diagram shows independent components as if they are electrically connected to each other. Even if the components are the same, one component may have the functions of multiple components. For example, when a part of the wiring also functions as an electrode, one conductive film has the function of the wiring and The electrode functions as both components. The term "electrochemically connected" refers to a case where one conductive film has the functions of multiple components. This also falls within the scope of the above. [Explanation of symbols]

[0459] ANO: Conductive film, B: Bias signal, C21: Capacitive element, CI: Control information, DS: Detection information information, G2: scanning line, GDA: driving circuit, GDB: driving circuit, GDC: driving circuit, GCLK : signal, II: input information, IN: information, P1: part, P2: boundary, P3: part, PWC1 : Signal, PWC2: Signal, R1: Radius of curvature, R2: Radius of curvature, R3: Radius of curvature, S2: Signal Line, SD: drive circuit, SDA: drive circuit, SDB: drive circuit, SDC: drive circuit, SP : Control signal, SW2: Switch, U: Product-sum signal, V1: Image information, V11: Information, VCO M2: Conductive film, W: Information, 10: Product-sum calculator, 30: Converter, 71: Neuron circuit, 7 2: Neuron circuit, 80: Neural network, 81: Input layer, 82: Hidden layer, 8 3: output layer, 90: semiconductor device, 200: information processing device, 210: arithmetic device, 211: Calculation unit, 212: memory unit, 213: artificial intelligence unit, 214: transmission path, 215: input / output interface Face, 220: Input / Output device, 230: Display unit, 231: Display area, 233: Control circuit , 234: decompression circuit, 235: image processing circuit, 238: control unit, 240: input unit, 241 : detection region, 248: control unit, 250: detection unit, 290: communication unit, 400: molecular weight, 50 1C: insulating film, 504: conductive film, 506: insulating film, 508: semiconductor film, 508A: region, 508B: Area, 508C: Area, 510: Base material, 512A: Conductive film, 512B: Conductive film , 512C: conductive film, 512D: conductive film, 512E: conductive film, 516: insulating film, 516A : insulating film, 516B: insulating film, 518: insulating film, 520: functional layer, 521: insulating film, 52 4: conductive film, 528: insulating film, 530: pixel circuit, 550: display element, 551: electrode, 5 52: electrode, 553: layer, 591A: opening, 700: display panel, 700A: area, 7 00B: Area, 700C: Area, 700TP: Input / Output Panel, 702: Pixel, 703: Image Element, 720: functional layer, 770: substrate, 770P: functional film, 771: insulating film, 775: detection Element, 791: member, 791A: elastic body, 791B: elastic body, 791C: elastic body, 792 :Material

Claims

[Claim 1] A display device having a first region, a second region, and a display region. the first area includes a portion of the display area, the second area includes another part of the display area, the second region comprises a first member; The second region may curve outwardly of the first member; The first member includes a first elastic body and a second elastic body, the second elastic body has an end part that is partially or entirely covered by the first elastic body; A display panel, wherein the second elastic body has a greater elastic modulus than the first elastic body.

Images