Substrate holding part, substrate processing system, and substrate transfer method

Abstract

To provide a technique capable of selectively receiving a substrate from a plurality of substrates with a vertical posture arranged in parallel along a horizontal direction.SOLUTION: A substrate holding part according to an aspect of the present disclosure, includes: a main body having a first arm part and a second arm part in which a tip end part is separated and a base end part is communicated; a first holding guide that is fixed to the tip end part of the first arm part, and holds a peripheral edge part of the substrate; and a second holding guide that is fixed to the tip end part of the second arm part, and holds the peripheral edge part of the substrate. The length between the first and second holding guides is shorter than a diameter of the substrate. In the same flat surface of the first and second arm parts, both of the first and second arm parts and both of the first and second holding guides are positioned to an outside of a radial direction from the substrate in a state where the substrate is positioned near from the base end part from a position where it is held by the first and second holding guides.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a substrate holder, a substrate processing system, and a substrate transport method. [Background technology]

[0002] A substrate transfer device that takes out and transfers a substrate held in a vertical position is known (see, for example, Patent Documents 1 and 2). A transfer robot that holds a substrate placed on a hand by clamping it with a pusher is known (see, for example, Patent Document 3). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-57798 [Patent Document 2] Japanese Patent Application Publication No. 9-162157 [Patent Document 3] JP 2009-200476 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique capable of selectively receiving a substrate from a plurality of substrates in a vertical orientation that are arranged side by side along a horizontal direction. [Means for solving the problem]

[0005] A substrate holding portion according to one embodiment of the present disclosure comprises a main body having a first arm and a second arm whose tips are spaced apart and whose base ends are connected, a first holding guide fixed to the tip of the first arm and holding a peripheral edge of a substrate, and a second holding guide fixed to the tip of the second arm and holding a peripheral edge of the substrate, wherein the length between the first holding guide and the second holding guide is shorter than the diameter of the substrate, and when the substrate is located closer to the base end than the position held by the first holding guide and the second holding guide on the same plane as the first arm and the second arm, the first arm, the second arm and the first holding guide and the second holding guide are positioned radially outward from the substrate. Effect of the Invention

[0006] According to the present disclosure, a substrate can be selectively received from a plurality of substrates in a vertical orientation that are arranged side by side along the horizontal direction. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view showing a substrate processing system according to an embodiment. [Diagram 2] FIG. 2 is a schematic perspective view (1) showing the second interface portion. [Diagram 3] FIG. 3 is a schematic perspective view (2) showing the second interface portion. [Figure 4] FIG. 4 is a flowchart showing a substrate processing method according to the embodiment. [Diagram 5] FIG. 5 is a perspective view showing the third transfer arm. [Figure 6] FIG. 6 is a diagram for explaining the end holding position. [Figure 7] FIG. 7 is a diagram for explaining the rear surface holding position. [Figure 8] FIG. 8 is a diagram for explaining the substrate passing position. [Figure 9] FIG. 9 is a diagram (1) showing the substrate receiving operation. [Figure 10] FIG. 10 is a diagram (2) showing the substrate receiving operation. [Figure 11] FIG. 11 is a diagram (3) showing the substrate receiving operation. [Figure 12] FIG. 12 is a diagram (4) showing the substrate receiving operation. [Figure 13] FIG. 13 is a diagram (5) showing the substrate receiving operation. [Figure 14] FIG. 14 is a diagram (1) showing the substrate transfer operation. [Figure 15] FIG. 15 is a diagram (2) showing the substrate transfer operation. [Figure 16] FIG. 16 is a diagram (3) showing the substrate transfer operation. [Figure 17] FIG. 17 is a diagram (4) showing the substrate transfer operation. [Figure 18] FIG. 18 is a diagram (5) showing the substrate transfer operation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, non-limiting exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings. In all the accompanying drawings, the same or corresponding members or parts are denoted by the same or corresponding reference symbols, and duplicated descriptions are omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical.

[0009] [Substrate Processing System] A substrate processing system according to an embodiment will be described with reference to Fig. 1 to Fig. 3. As shown in Fig. 1, the substrate processing system 1 includes a loading / unloading section 2, a first interface section 3, a batch processing section 4, a second interface section 5, a single wafer processing section 6, and a control device 9.

[0010] The loading / unloading section 2 serves as both a loading section and an unloading section, which makes it possible to reduce the size of the substrate processing system 1. The loading / unloading section 2 has a load port , a stocker 22, a loader , and a cassette transport device .

[0011] The load port 21 is arranged on the negative side in the X-axis direction of the loading / unloading section 2. Multiple (e.g., four) load ports 21 are arranged along the Y-axis direction. However, the number of load ports 21 is not particularly limited. A cassette C is placed on the load port 21. The cassette C contains multiple (e.g., 25) substrates W, and is loaded into and unloaded from the load port 21. Inside the cassette C, the substrates W are held horizontally and held in the vertical direction at a second pitch P2 (P2=N×P1) that is N times the first pitch P1. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.

[0012] A plurality of stockers 22 (e.g., four) are arranged along the Y-axis direction at the center of the load-unload section 2 in the X-axis direction. A plurality of stockers 22 (e.g., two) are arranged adjacent to the first interface section 3 along the Y-axis direction on the positive side of the load-unload section 2 in the X-axis direction. The stockers 22 may be arranged in multiple stages in the vertical direction. The stockers 22 temporarily store cassettes C containing substrates W before cleaning processing, cassettes C that have been emptied after the substrates W have been removed, etc. The number of stockers 22 is not particularly limited.

[0013] The loader 23 is adjacent to the first interface section 3, and is disposed on the positive side of the loader / unloader section 2 in the X-axis direction. The cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. There may be multiple loaders 23. The loaders 23 may be disposed in multiple stages in the vertical direction.

[0014] The cassette transport device 24 is, for example, an articulated transport robot, and transports the cassette C between the load port 21, the stocker 22, and the loader 23.

[0015] The first interface section 3 is disposed on the positive side in the X-axis direction of the load / unload section 2. The first interface section 3 transports substrates W between the load / unload section 2, the batch processing section 4, and the single wafer processing section 6. The first interface section 3 has a substrate transfer device 31, a lot formation section 32, and a first delivery table 33.

[0016] The substrate transfer device 31 transports substrates W between the cassette C placed on the loader 23, the lot formation section 32, and the first transfer table 33. The substrate transfer device 31 is composed of a multi-axis (e.g., six-axis) arm robot, and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has multiple holding claws (not shown) capable of holding multiple (e.g., 25) substrates W. The substrate holding arm 31a can take any position and posture in three-dimensional space while holding the substrates W with the holding claws.

[0017] The lot forming section 32 is disposed on the positive side in the X-axis direction of the first interface section 3. The lot forming section 32 forms a lot L by holding a plurality of substrates W at a first pitch P1.

[0018] The first delivery table 33 is adjacent to the single wafer processing unit 6, and is disposed on the Y-axis direction positive side of the first interface unit 3. The first delivery table 33 receives the substrate W from the fourth transport device 61, and temporarily stores it until it is handed over to the load / unload unit 2.

[0019] The batch processing unit 4 is disposed on the positive side of the X-axis direction of the first interface unit 3. That is, the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are disposed in this order from the negative side of the X-axis direction toward the positive side of the X-axis direction. The batch processing unit 4 collectively processes a lot L including a plurality of (e.g., 50 or 100) substrates W arranged at a first pitch P1. One lot L is composed of substrates W in, for example, M cassettes C. M is a natural number equal to or greater than 2. M may be the same natural number as N, or may be a natural number different from N. The batch processing unit 4 has a chemical liquid tank 41, a rinse liquid tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0020] The chemical liquid tank 41 and the rinse liquid tank 42 are arranged along the X-axis direction. For example, the chemical liquid tank 41 and the rinse liquid tank 42 are arranged in this order from the positive side in the X-axis direction to the negative side in the X-axis direction. The chemical liquid tank 41 and the rinse liquid tank 42 are also collectively referred to as a processing tank. The number of chemical liquid tanks 41 and rinse liquid tanks 42 is not limited to that shown in FIG. 1. For example, although there is one set of the chemical liquid tank 41 and the rinse liquid tank 42 in FIG. 1, there may be multiple sets.

[0021] The chemical tank 41 stores a chemical in which the lot L is immersed. The chemical is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film among the silicon oxide film and the silicon nitride film. The chemical is not limited to an aqueous phosphoric acid solution. For example, DHF (dilute hydrofluoric acid), BHF (mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (mixture of ammonia, hydrogen peroxide, and water), SC2 (mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (mixture of tetramethylammonium hydroxide and water), plating liquid, etc. may be used. The chemical may be used for stripping or plating. The number of chemicals is not particularly limited and may be more than one.

[0022] The rinsing liquid tank 42 stores a first rinsing liquid in which the lot L is immersed. The first rinsing liquid is pure water for removing chemicals from the substrate W, and is, for example, DIW (deionized water).

[0023] The first transfer device 43 has a guide rail 43a and a first transfer arm 43b. The guide rail 43a is disposed on the Y-axis negative side of the processing tank. The guide rail 43a extends in the horizontal direction (X-axis direction) from the first interface unit 3 to the batch processing unit 4. The first transfer arm 43b moves in the horizontal direction (X-axis direction) along the guide rail 43a. The first transfer arm 43b may move in the vertical direction or rotate around the vertical axis. The first transfer arm 43b transfers the lots L in a batch between the first interface unit 3 and the batch processing unit 4.

[0024] The processing tool 44 receives and holds the lot L from the first transport arm 43b. The processing tool 44 holds the plurality of substrates W at a first pitch P1 in the Y-axis direction, and holds each of the plurality of substrates W vertically.

[0025] The driving device 45 moves the processing tool 44 in the X-axis direction and the Z-axis direction. The processing tool 44 immerses the lot L in the chemical liquid stored in the chemical liquid tank 41, then immerses the lot L in the first rinsing liquid stored in the rinsing liquid tank 42, and then transfers the lot L to the first transfer device 43.

[0026] The number of units, that is, the processing tool 44 and the driving device 45, is one in this embodiment, but may be more than one. In the latter case, one unit immerses the lot L in the chemical liquid stored in the chemical liquid tank 41, and another unit immerses the lot L in the first rinsing liquid stored in the rinsing liquid tank 42. In this case, the driving device 45 only needs to move the processing tool 44 in the Z-axis direction, and does not need to move the processing tool 44 in the X-axis direction.

[0027] The second interface unit 5 is disposed on the Y-axis direction positive side of the batch processing unit 4. The second interface unit 5 transports substrates W between the batch processing unit 4 and the single wafer processing unit 6. The second interface unit 5 has an immersion tank 51, a second transport device 52, a third transport device 53, a second delivery table 54, and a pressing member 55.

[0028] The immersion tank 51 is disposed outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is disposed at a position shifted to the positive side in the Y-axis direction with respect to the processing tank. The immersion tank 51 stores a second rinse liquid in which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is pulled up from the second rinse liquid by the third transport device 53. Since the substrate W exists below the liquid level of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, and the collapse of the concave-convex pattern of the substrate W can be prevented. The immersion tank 51 may be configured to be movable in the X-axis direction. In this case, when the lot L is immersed in the immersion tank 51, the positional deviation in the X-axis direction between the immersion tank 51 and the lot L can be corrected. An X-axis drive device (not shown) that moves the immersion tank 51 in the X-axis direction is attached to, for example, the lower surface of the immersion tank 51.

[0029] The second transfer device 52 has a Y-axis driving device 52a, a Z-axis driving device 52b, and a second transfer arm 52c.

[0030] The Y-axis drive device 52a is disposed on the X-axis direction positive side of the second interface unit 5. The Y-axis drive device 52a extends horizontally (in the Y-axis direction) from the second interface unit 5 to the batch processing unit 4. The Y-axis drive device 52a moves the Z-axis drive device 52b and the second transport arm 52c in the Y-axis direction. The Y-axis drive device 52a may include a ball screw. The Y-axis drive device 52a is an example of a horizontal drive device.

[0031] The Z-axis driving device 52b is movably attached to the Y-axis driving device 52a. The Z-axis driving device 52b moves the second transport arm 52c in the Z-axis direction. The Z-axis driving device 52b may include a ball screw. The Z-axis driving device 52b is an example of a vertical driving device.

[0032] The second transport arm 52c is movably attached to the Z-axis drive device 52b. The second transport arm 52c is configured to hold a plurality of substrates W at intervals. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds the plurality of substrates W at a first pitch P1 in the Y-axis direction. The second transport arm 52c holds each of the plurality of substrates W in a vertical position. The second transport arm 52c is an example of a vertical holding unit. The second transport arm 52c moves in the Y-axis direction and the Z-axis direction by the Y-axis drive device 52a and the Z-axis drive device 52b. The second transport arm 52c is configured to be movable between a plurality of positions including a transfer position, an immersion position, and a standby position. The second transport arm 52c may be configured to be movable in the X-axis direction. In this case, when the lot L is immersed in the immersion tank 51, the positional deviation in the X-axis direction between the immersion tank 51 and the lot L can be corrected. An X-axis driving device (not shown) that moves the second transport arm 52c in the X-axis direction is movably attached to, for example, the Z-axis driving device 52b. In this case, the second transport arm 52c is movably attached to the X-axis driving device.

[0033] The transfer position is a position where the lot L is transferred between the first transfer arm 43b and the second transfer arm 52c. The transfer position is a position on the negative side in the Y axis direction and on the positive side in the Z axis direction.

[0034] The immersion position is a position where the lot L is immersed in the immersion tank 51. The immersion position is a position on the positive side in the Y axis direction and on the negative side in the Z axis direction from the delivery position.

[0035] The standby position is a position where the second transport arm 52c waits when the lot L is not being transferred or immersed in the immersion tank 51. The standby position is directly below the transfer position (negative side in the Z-axis direction) and is a position that does not hinder the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position only by moving upward (positive side in the Z-axis direction), so that the throughput is improved. The standby position may be the same position as the immersion position. In this case, it is possible to prevent particles that may be generated by the operation of the first transport device 43 from adhering to the second transport arm 52c. The standby position may be a position directly above the immersion position (positive side in the Z-axis direction). In this way, by setting the standby position to a position different from the transfer position, it is possible to prevent contact between the first transport arm 43b and the second transport arm 52c.

[0036] The second transfer device 52 moves the second transfer arm 52c to the immersion position or the standby position while the first transfer device 43 is operating. In this case, contact between the first transfer arm 43b and the second transfer arm 52c can be prevented.

[0037] The third transfer device 53 is composed of a multi-axis (for example, six-axis) arm robot. The third transfer device 53 has a third transfer arm 53a at its tip. The third transfer arm 53a is configured to hold the substrate W. The third transfer arm 53a can take any position and posture in three-dimensional space while holding the substrate W. The third transfer device 53 transfers the substrate W between the second transfer arm 52c at the immersion position and the second transfer table 54. Specifically, first, as shown in FIG. 2, the third transfer arm 53a receives the substrate W in a vertical posture held by the second transfer arm 52c at the immersion position. Next, as shown in FIG. 3, the third transfer arm 53a changes the substrate W from the vertical posture to a horizontal posture. Next, the third transfer arm 53a transfers the substrate W in the horizontal posture to the second transfer table 54. At this time, since the immersion tank 51 is disposed outside the movement range of the first transfer arm 43b, the first transfer arm 43b and the third transfer arm 53a do not interfere with each other. This allows one of the first transfer device 43 and the third transfer device 53 to operate independently regardless of the operating state of the other. Therefore, the first transfer device 43 and the third transfer device 53 can be operated at any timing, thereby shortening the time required to transfer the substrate W. As a result, the productivity of the substrate processing system 1 is improved.

[0038] The second transfer stage 54 is adjacent to the single wafer processing unit 6 and is disposed on the negative side of the X-axis direction of the second interface unit 5. The second transfer stage 54 receives the substrate W from the third transfer device 53 and temporarily stores it until it is handed over to the single wafer processing unit 6. The substrate W taken out from the immersion bath 51 is placed on the second transfer stage 54. The second transfer stage 54 holds the substrate W in a horizontal position. The second transfer stage 54 is an example of a horizontal holding unit. The substrate W placed on the second transfer stage 54 is preferably in a state where the surface is wet with the second rinsing liquid, for example. In this case, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the concave-convex pattern of the substrate W can be suppressed. The second transfer stage 54 may be disposed in multiple stages (for example, two stages) in the vertical direction.

[0039] The second transfer table 54 has a mounting plate 54a and three pins 54b. The mounting plate 54a has, for example, a rectangular plate shape. The mounting plate 54a may have a disk shape. The pins 54b are provided on the mounting plate 54a. In this embodiment, the number of pins 54b is three, but it may be four or more. The three pins 54b are arranged to form an equilateral triangle in a plan view. The pins 54b support the substrate W from below above the mounting plate 54a.

[0040] The pressing member 55 is provided for each second transfer table 54. The pressing member 55 is disposed above each mounting plate 54a and on the negative side of the X-axis direction of each mounting plate 54a. In this case, the movement distance of the third transport arm 53a from the position where the substrate W is pressed against the pressing member 55 to the position where the substrate W is transferred to the second transfer table 54 is shortened. The position where the pressing member 55 is provided is not limited to this. The pressing member 55 may be provided at another position as long as the third transport arm 53a can access it. For example, the pressing member 55 may be disposed between the second transfer tables 54 adjacent to each other in the vertical direction and on the positive side of the X-axis direction of the second transfer table 54. In this case, the number of pressing members 55 can be reduced compared to the case where the pressing member 55 is provided for each second transfer table 54. The pressing member 55 contacts the substrate W held by the third transport arm 53a to horizontally move the substrate W relative to the third transport arm 53a.

[0041] The single wafer processing unit 6 is disposed on the negative side in the X-axis direction of the second interface unit 5 and on the positive side in the Y-axis direction of the load / unload unit 2, the first interface unit 3, and the batch processing unit 4. The single wafer processing unit 6 processes substrates W one by one. The single wafer processing unit 6 has a fourth transfer device 61, a liquid processing device 62, and a drying device 63.

[0042] The fourth transfer device 61 has a guide rail 61a and a fourth transfer arm 61b. The guide rail 61a is disposed on the Y-axis negative side of the single wafer processing unit 6. The guide rail 61a extends in the horizontal direction (X-axis direction) in the single wafer processing unit 6. The fourth transfer arm 61b moves in the horizontal direction (X-axis direction) and vertical direction along the guide rail 61a and rotates around the vertical axis. The fourth transfer arm 61b transfers the substrate W between the second transfer table 54, the liquid processing device 62, the drying device 63, and the first transfer table 33. The number of the fourth transfer arm 61b may be one or more, and in the latter case, the fourth transfer device 61 transfers multiple (e.g., five) substrates W at once.

[0043] The liquid processing device 62 is disposed on the positive side in the X-axis direction and the positive side in the Y-axis direction of the single wafer processing device 6. The liquid processing device 62 is of a single wafer type, and processes the substrates W one by one with a processing liquid. The liquid processing device 62 is disposed in multiple stages (e.g., three stages) in the vertical direction (Z-axis direction). This allows multiple substrates W to be processed simultaneously with the processing liquid. There may be multiple processing liquids, and for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, an alcohol such as IPA (isopropyl alcohol).

[0044] The drying device 63 is disposed adjacent to the liquid processing device 62 on the negative side in the X-axis direction. In this case, the end face of the single wafer processing device 6 on the positive side in the Y-axis direction can be disposed flush or approximately flush with the end face of the second interface section 5 on the positive side in the Y-axis direction. For this reason, almost no dead space is generated, and the footprint of the substrate processing system 1 can be reduced. In contrast, if the drying device 63 is disposed adjacent to the liquid processing device 62 on the positive side in the Y-axis direction, the end face of the single wafer processing device 6 on the positive side in the Y-axis direction protrudes beyond the end face of the second interface section 5 on the positive side in the Y-axis direction, and a dead space may be generated. The drying device 63 is of a single wafer type, and dries the substrates W one by one with a supercritical fluid. The drying devices 63 are disposed in multiple stages (for example, three stages) in the vertical direction. This allows multiple substrates W to be dried simultaneously.

[0045] Both the liquid processing apparatus 62 and the drying apparatus 63 do not have to be of the single wafer type, and the liquid processing apparatus 62 may be of the single wafer type and the drying apparatus 63 of the batch type. The drying apparatus 63 may dry a plurality of substrates W collectively with a supercritical fluid. The number of substrates W collectively processed in the drying apparatus 63 may be equal to or greater than the number of substrates W collectively processed in the liquid processing apparatus 62, but may also be less. Apparatus other than the liquid processing apparatus 62 and the drying apparatus 63 may be arranged in the single wafer processing apparatus 6.

[0046] The control device 9 is, for example, a computer. The control device 9 includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as a memory. The recording medium 92 stores programs for controlling various processes executed in the substrate processing system 1. The control device 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the recording medium 92. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives signals from the outside via the input interface 93 and transmits signals to the outside via the output interface 94.

[0047] The above program is stored in, for example, a computer-readable recording medium and installed from the recording medium into the recording medium 92 of the control device 9. Examples of computer-readable recording media include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card. The program may be downloaded from a server via the Internet and installed into the recording medium 92 of the control device 9.

[0048] In the substrate processing system 1, the substrate W is transported from the load / unload section 2 to the first interface section 3, the batch processing section 4, the second interface section 5 and the single wafer processing section 6 in this order, and then returned to the load / unload section 2.

[0049] [Operation of the Substrate Processing System] The operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described with reference to Fig. 4. The process shown in Fig. 4 is performed under the control of a control device 9.

[0050] First, the cassette C containing a plurality of substrates W is loaded into the load / unload section 2 and placed on the load port 21. Inside the cassette C, the substrates W are held horizontally and held in the vertical direction at a second pitch P2 (P2=N×P1). N is a natural number of 2 or more, which is 2 in this embodiment, but may be 3 or more.

[0051] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. The lid of the cassette C transported to the loader 23 is opened by the lid opening / closing mechanism.

[0052] Next, the substrate transfer device 31 receives the substrates W accommodated in the cassette C (S101 in FIG. 4), and transports them to the lot formation section 32.

[0053] Next, the lot formation unit 32 holds the multiple substrates W at a first pitch P1 (P1=P2 / N) to form a lot L (S102 in FIG. 4). One lot L is composed of substrates W in, for example, M cassettes C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W to be processed at once can be increased.

[0054] Next, the first transport device 43 receives the lot L from the lot formation unit 32 and transports it to the processing tool 44.

[0055] Next, the processing tool 44 descends from above the chemical liquid tank 41, immerses the lot L in the chemical liquid, and performs chemical processing (S103 in FIG. 4). After that, the processing tool 44 rises to pull the lot L out of the chemical liquid, and then moves horizontally (to the negative side in the X-axis direction) toward above the rinsing liquid tank 42.

[0056] Next, the processing tool 44 descends from above the rinsing liquid tank 42, immerses the lot L in the first rinsing liquid, and performs the rinsing liquid processing (S103 in FIG. 4). After that, the processing tool 44 ascends to lift the lot L from the first rinsing liquid. Next, the first transfer device 43 receives the lot L from the processing tool 44 and transfers it to the second transfer device 52.

[0057] Next, the second transfer arm 52c of the second transfer device 52 moves horizontally (to the positive side in the Y-axis direction) and descends from above the immersion tank 51 to immerse the lot L in the second rinsing liquid (S104 in FIG. 4). The multiple substrates W of the lot L are held in the second rinsing liquid until they are lifted up from the second rinsing liquid by the third transfer device 53. Since the substrates W are present below the liquid level of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, and the concave-convex pattern of the substrates W can be prevented from collapsing.

[0058] Next, the third transfer device 53 transfers the substrates W of the lot L held by the second transfer arm 52c in the second rinsing liquid to the second transfer table 54. The third transfer device 53 transfers the substrates W to the second transfer table 54 one by one.

[0059] Next, the fourth transfer device 61 receives the substrate W from the second transfer table 54 and transfers it to the liquid treatment device 62.

[0060] Next, the liquid processing device 62 processes the substrates W one by one with liquid (S105 in FIG. 4). There may be multiple liquids, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, alcohol such as IPA. The liquid processing device 62 supplies the pure water and the drying liquid in this order onto the upper surface of the substrate W to form a liquid film of the drying liquid.

[0061] Next, the fourth transfer device 61 receives the substrate W from the liquid processing device 62, and holds the substrate W horizontally with the film of the drying liquid facing upward. The fourth transfer device 61 transfers the substrate W from the liquid processing device 62 to the drying device 63.

[0062] Next, the drying device 63 dries the substrates W one by one with a supercritical fluid (S105 in FIG. 4). The drying liquid can be replaced with the supercritical fluid, and collapse of the uneven pattern of the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure-resistant container, single-wafer processing is performed instead of batch processing in order to reduce the size of the pressure-resistant container.

[0063] In this embodiment, the drying apparatus 63 is of a single-wafer type, but as described above, it may be of a batch type. The batch-type drying apparatus 63 dries a plurality of substrates W on which a liquid film has been formed, all at once, with a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm for holding the substrates W, the batch-type drying apparatus 63 has multiple transport arms.

[0064] Next, the fourth transfer device 61 receives the substrate W from the drying device 63 and transfers it to the first transfer table 33.

[0065] Next, the substrate transfer device 31 receives the substrate W from the first delivery table 33, and stores it in the cassette C (S106 in FIG. 4). The cassette C is carried out from the carry-in / out section 2 with the plurality of substrates W stored therein.

[0066] [Third transport arm] The third transport arm 53a will be described with reference to Figs. 5 to 8. Fig. 5 is a perspective view showing the third transport arm 53a. Fig. 6 is a view explaining the end holding position. Fig. 6(a) is a view when viewed from a direction perpendicular to the front surface Wa of the substrate W. Fig. 6(b) is a cross-sectional view taken along the line 6B-6B in Fig. 6(a). Fig. 6(c) is a perspective view showing an enlarged view of the first holding guide 120. Fig. 7 is a view explaining the back surface holding position. Fig. 7(a) is a view when viewed from a direction perpendicular to the front surface Wa of the substrate W. Fig. 7(b) is a cross-sectional view taken along the line 7B-7B in Fig. 7(a). Fig. 7(c) is a perspective view showing an enlarged view of the first holding guide 120. Fig. 8 is a view explaining the substrate passing position. Fig. 8(a) is a view when viewed from a direction perpendicular to the front surface Wa of the substrate W. Fig. 8(b) is a cross-sectional view taken along the line 8B-8B in Fig. 8(a).

[0067] The third transport arm 53a is an example of a substrate holding unit. The third transport arm 53a has a main body 110, a first holding guide 120, a second holding guide 130, a first clamp member 140, a second clamp member 150, and a back surface holding mechanism 160.

[0068] The main body 110 has a substantially U-shape. The main body 110 has a first surface 110a and a second surface 110b. The second surface 110b is the surface opposite to the first surface 110a. The main body 110 has a first arm 111 and a second arm 112. The first arm 111 includes a tip end 111a and a base end 111b. The second arm 112 includes a tip end 112a and a base end 112b. The tip end 111a of the first arm 111 and the tip end 112a of the second arm 112 are separated from each other. The base end 111b of the first arm 111 and the base end 112b of the second arm 112 are connected to each other.

[0069] The first holding guide 120 is fixed to the inside of the tip 111a of the first arm 111. The first holding guide 120 holds the peripheral portion of the substrate W. The first holding guide 120 has a first surface 120a and a second surface 120b. The second surface 120b is the surface opposite to the first surface 120a. The first holding guide 120 has a support groove 121 and a support surface 122. The support groove 121 supports the peripheral portion of the substrate W from both the front surface Wa and the back surface Wb of the substrate W. The support groove 121 widens from the bottom toward the opening. In this case, the peripheral portion of the substrate W easily enters the support groove 121. The support surface 122 is provided closer to the center of the substrate W than the support groove 121. The support surface 122 supports the peripheral portion of the substrate W from the back surface Wb of the substrate W. The support surface 122 inclines from the first surface 120a side to the second surface 120b side as it moves away from the support groove 121.

[0070] The second holding guide 130 is fixed to the inside of the tip 112a of the second arm 112. The second holding guide 130 holds the peripheral portion of the substrate W. The second holding guide 130 has a first surface 130a and a second surface 130b. The second surface 130b is the surface opposite to the first surface 130a. The second holding guide 130 has a support groove 131 and a support surface 132. The support groove 131 supports the peripheral portion of the substrate W from both the front surface Wa and the back surface Wb of the substrate W. The support groove 131 widens from the bottom toward the opening. In this case, the peripheral portion of the substrate W easily enters the support groove 131. The support surface 132 is provided closer to the center of the substrate W than the support groove 131. The support surface 132 supports the peripheral portion of the substrate W from the back surface Wb of the substrate W. The support surface 132 inclines from the first surface 130a side to the second surface 130b side as it moves away from the support groove 131.

[0071] The length L1 between the first holding guide 120 and the second holding guide 130 is shorter than the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0072] The first clamp member 140 is provided at the base end 111b. The first clamp member 140 is configured to be movable between a closed position (position indicated by a dashed line in FIG. 6(a)) in which the peripheral edge of the substrate W is clamped, and an open position (position indicated by a solid line in FIG. 6(a)) in which the clamping of the substrate W is released. The first clamp member 140 is driven by a first cylinder 141.

[0073] The second clamp member 150 is provided at the base end 112b. The second clamp member 150 is configured to be movable between a closed position (position indicated by a dashed line in FIG. 6(a)) in which the peripheral edge of the substrate W is clamped, and an open position (position indicated by a solid line in FIG. 6(a)) in which the clamping of the substrate W is released. The second clamp member 150 is driven by a second cylinder 151.

[0074] The back surface holding mechanism 160 is provided at the base end portions 111b, 112b. The back surface holding mechanism 160 is provided between the first clamp member 140 and the second clamp member 150. The back surface holding mechanism 160 is configured to be movable between a closed position (position indicated by a dashed line in FIG. 6(a)) in which the substrate W is held from its back surface, and an open position (position indicated by a solid line in FIG. 6(a)) radially outward from the substrate W. The back surface holding mechanism 160 is driven by a cylinder 161.

[0075] The main body 110 is configured to be movable between an end holding position, a back surface holding position, and a substrate passing position.

[0076] The end holding position is a position where the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130 support the peripheral portion of the substrate W from both the front surface Wa and back surface Wb of the substrate W, as shown in Figures 6(a), 6(b) and 6(c).

[0077] 7(a), 7(b), and 7(c), the back surface holding position is a position where the support surface 122 of the first holding guide 120 and the support surface 132 of the second holding guide 130 support the peripheral portion of the substrate W from the back surface Wb of the substrate W. The back surface holding position is a position where the base ends 111b, 112b of the main body 110 are closer to the center of the substrate W by a first distance than the end holding positions. The first distance is, for example, 10 mm to 20 mm, and is 12 mm in this embodiment.

[0078] As shown in Fig. 8(a) and Fig. 8(b), the substrate passing position is a position where the first holding guide 120 and the second holding guide 130 do not hold the substrate W. The substrate passing position is a position where the base ends 111b, 112b of the main body 110 are closer to the center of the substrate W than the back surface holding position. The substrate passing position is a position where the base ends 111b, 112b of the main body 110 are closer to the center of the substrate W by a second distance than the end holding position. The second distance is, for example, 20 mm to 40 mm, and is 30 mm in this embodiment. At the substrate passing position, the first arm 111, the second arm 112, the first holding guide 120, and the second holding guide 130 are located radially outward from the substrate W on the same plane as the main body 110. At the substrate passing position, when viewed in a plan view from a direction perpendicular to the surface Wa of the substrate W, the first arm 111, the second arm 112, the first holding guide 120, and the second holding guide 130 do not overlap with the substrate W. Therefore, at the substrate passing position, the main body 110 can move in a direction perpendicular to the surface Wa of the substrate W without coming into contact with the substrate W.

[0079] [Substrate transport method] A substrate transport method will be described in which the third transport arm 53a receives the substrate W in a vertical position held by the second transport arm 52c, changes the substrate W from the vertical position to a horizontal position, and transfers it to the second transfer table 54, thereby transporting the substrate W from the second transport arm 52c to the second transfer table 54.

[0080] (Board receiving operation) 9 to 13, an operation in which the third transport arm 53a receives substrates W of a lot L held by the second transport arm 52c in the second rinsing liquid (hereinafter referred to as a "substrate receiving operation") will be described. The substrate receiving operation is performed under the control of the control device 9. As shown in Fig. 9(b), the second transport arm 52c holds substrates W1 with their front surfaces Wa facing the positive side in the Y axis direction and substrates W2 with their back surfaces Wb facing the positive side in the Y axis direction alternately at a first pitch P1.

[0081] First, as shown in Figures 9(a) and 9(b), the main body 110 moves to a substrate passing position on the negative side of the Y-axis direction relative to the second transport arm 52c with the first surface 110a parallel to the front surface Wa and back surface Wb of the substrates W1 and W2.

[0082] 10(a) and 10(b), the main body 110 moves in the Y-axis direction positive side and stops on the same plane as the substrate W1 to be received. At the substrate passing position, the first arm 111, the second arm 112, the first holding guide 120, and the second holding guide 130 do not overlap with the substrates W1 and W2 when viewed in a plan view from the Y-axis direction. Therefore, at the substrate passing position, the main body 110 can move horizontally in the Y-axis direction positive side until it is on the same plane as the substrate W1 to be received without coming into contact with the substrates W1 and W2.

[0083] 11(a) and 11(b), the main body 110 moves to the positive side in the Z axis direction and stops at the end holding position. As a result, the peripheral portion of the substrate W1 is supported from both the front surface Wa and the back surface Wb of the substrate W1 by the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130.

[0084] Next, as shown in Fig. 12, the first clamp member 140 and the second clamp member 150 each move from the open position to the closed position. As a result, the peripheral edge of the substrate W1 is clamped by the first clamp member 140 and the second clamp member 150. Also, as shown in Fig. 12, the back surface holding mechanism 160 moves from the open position to the closed position.

[0085] 13, the main body 110 moves to the Z axis direction positive side, whereby the third transport arm 53a receives the substrate W1 held by the second transport arm 52c.

[0086] This completes the substrate receiving operation for one substrate W1. In the substrate receiving operation, the main body 110 moves to a desired position in the Y-axis direction positive side at the substrate passing position, thereby selectively receiving any substrate W1, W2 of the lot L held by the second transport arm 52c.

[0087] (Substrate handover operation) 14 to 18, an operation of the third transport arm 53a to deliver the substrate W to the second delivery table 54 (hereinafter referred to as the “substrate delivery operation”) will be described. The substrate delivery operation is performed under the control of the control device 9.

[0088] 14, the third transport arm 53a changes the substrate W received from the second transport arm 52c from a vertical position to a horizontal position. At this time, the substrate W is supported by the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130, and is clamped by the first clamp member 140 and the second clamp member 150. Therefore, even if the substrate W is changed from the vertical position to the horizontal position, the substrate W does not fall from the main body 110.

[0089] 15, the first clamp member 140 and the second clamp member 150 move from the closed position to the open position. This releases the clamping of the substrate W by the first clamp member 140 and the second clamp member 150. As a result, the peripheral portion of the substrate W is supported by the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130, and the substrate W is held from the back surface by the back surface holding mechanism 160.

[0090] Next, as shown in FIG. 16, the main body 110 moves to the negative side in the X-axis direction to press the substrate W against the pressing member 55, thereby moving the substrate W from the position supported by the support grooves 121 and 131 to the position supported by the support surfaces 122 and 132. That is, the main body 110 moves from the end holding position to the back surface holding position. The substrate W supported by the support surfaces 122 and 132 is likely to be displaced when the main body 110 moves at high speed. For this reason, when the main body 110 supports the substrate W on the support surfaces 122 and 132, it moves at a low speed. If the moving distance of the main body 110 from the position where the substrate W is pressed against the pressing member 55 to the position where the substrate W is transferred to the second transfer table 54 becomes short, the distance that the main body 110 moves at a low speed becomes short, and therefore the transport time of the substrate W can be shortened. For this reason, it is preferable that the pressing member 55 is disposed above each mounting plate 54a and on the negative side of each mounting plate 54a in the X-axis direction.

[0091] 17, the main body 110 moves to the positive side in the X-axis direction to move the substrate W to just above the position where it is to be placed on the second transfer stage 54. Next, the main body 110 moves to the negative side in the Z-axis direction. As a result, the substrate W supported by the supporting surfaces 122, 132 and the back surface holding mechanism 160 is transferred to the three pins 54b of the second transfer stage 54.

[0092] Next, the main body 110 moves to the X-axis direction positive side, as shown in Fig. 18. With the above, the substrate transfer operation for one substrate W is completed.

[0093] In the above substrate transport method, the substrate W held by the main body 110 is pressed against the pressing member 55 to move the substrate W from the position supported by the support grooves 121, 131 to the position supported by the support surfaces 122, 132. However, the present invention is not limited to this. For example, instead of the pressing member 55, a suction line may be provided in the rear surface holding mechanism 160. In this case, the substrate W can be moved from the position supported by the support grooves 121, 131 to the position supported by the support surfaces 122, 132 by sucking the substrate W with the suction line.

[0094] In the above substrate transport method, the third transport arm 53a has one main body 110, and transports the substrates W one by one from the second transport arm 52c to the second transfer stage 54, but the present invention is not limited to this. For example, the third transport arm 53a may have multiple main bodies 110, and transport multiple substrates W simultaneously from the second transport arm 52c to the second transfer stage 54.

[0095] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The above-described embodiments may be omitted, substituted, or modified in various forms without departing from the scope and spirit of the appended claims. [Explanation of symbols]

[0096] 53a Third transport arm 110 Main unit 111 1st arm 111a Tip 112 Second arm 112a Tip 120 First Retaining Guide 130 Second Retaining Guide W substrate

Claims

1. a main body having a first arm and a second arm whose distal end is spaced apart and whose proximal end is connected; a first holding guide fixed to the tip of the first arm and configured to hold a peripheral edge of the substrate; a second holding guide fixed to the tip of the second arm and configured to hold a peripheral portion of the substrate; having a length between the first holding guide and the second holding guide is shorter than a diameter of the substrate; in a state where the substrate is located closer to the base end than a position where the substrate is held by the first holding guide and the second holding guide on the same plane as the first arm portion and the second arm portion, the first arm portion, the second arm portion, the first holding guide and the second holding guide are located radially outward from the substrate. Board holder.

2. A clamp member is provided at the base end, the clamping members are movable between a closed position in which the clamping members clamp a peripheral edge of the substrate and an open position in which the clamping members release the clamping of the substrate. The substrate holder of claim 1 .

3. A back surface holding mechanism is provided at the base end portion, the rear surface holding mechanism is movable between a closed position in which the rear surface of the substrate is held and an open position radially outward from the substrate. The substrate holder of claim 1 .

4. Each of the first holding guide and the second holding guide is a support groove that supports a peripheral portion of the substrate from both the front and back surfaces of the substrate; a support surface that is provided closer to the center of the substrate than the support groove and that supports a peripheral portion of the substrate from a rear surface of the substrate; The substrate holder of claim 1 , further comprising:

5. a vertical holder for holding the substrate in a vertical position; a horizontal holding part for holding the substrate in a horizontal position; a transport device that transports the substrate held by the vertical holding unit to the horizontal holding unit; Equipped with the transport device has a substrate holding unit that holds the substrate, The substrate holder includes: a main body having a first arm and a second arm whose distal end is spaced apart and whose proximal end is connected; a first holding guide fixed to the tip of the first arm and configured to hold a peripheral edge of the substrate; a second holding guide fixed to the tip of the second arm and configured to hold a peripheral portion of the substrate; having a length between the first holding guide and the second holding guide is shorter than a diameter of the substrate; in a state where the substrate is located closer to the base end than a position where the substrate is held by the first holding guide and the second holding guide on the same plane as the first arm portion and the second arm portion, the first arm portion, the second arm portion, the first holding guide and the second holding guide are located radially outward from the substrate. Substrate processing system.

6. A control device for controlling the conveying device is provided, The control device includes: the substrate holder receiving the substrate held by the vertical holder; the substrate holder changing the substrate from a vertical position to a horizontal position; the substrate holder transferring the substrate in a horizontal position to a transfer table; Execute The substrate processing system of claim 5 .

7. A clamp member is provided at the base end, the clamping members are movable between a closed position in which the clamping members clamp a peripheral edge of the substrate and an open position in which the clamping members release the clamping of the substrate. The substrate processing system of claim 6 .

8. the control device moves the clamp members to the closed position before changing the substrate from a vertical position to a horizontal position; The substrate processing system of claim 7 .

9. A back surface holding mechanism is provided at the base end portion, the rear surface holding mechanism is movable between a closed position in which the rear surface of the substrate is held and an open position radially outward from the substrate. The substrate processing system of claim 6 .

10. the control device moves the back surface holding mechanism to the closed position before changing the substrate from a vertical position to a horizontal position. The substrate processing system of claim 9 .

11. Each of the first holding guide and the second holding guide is a support groove that supports a peripheral portion of the substrate from both the front and back surfaces of the substrate; a support surface that is provided closer to the center of the substrate than the support groove and that supports a peripheral portion of the substrate from a rear surface of the substrate; The substrate processing system according to claim 6 , further comprising:

12. a pressing member that contacts an edge of the substrate held in a horizontal position by the substrate holding unit and moves the substrate from a position supported by the support groove to a position supported by the support surface, The substrate processing system of claim 11 .

13. the substrate holding unit transferring the substrate in a horizontal position to the transfer table includes moving the substrate from a position supported by the support groove to a position supported by the support surface by pressing the substrate against the pressing member through horizontal movement of the substrate holding unit. The substrate processing system of claim 12.

14. The vertical holding portion is configured to hold the plurality of substrates at intervals from one another, The substrate holder receiving the substrate held by the vertical holder includes: moving the substrate holder in a direction perpendicular to a surface of the substrate until the substrate is flush with the substrate; moving the substrate holding part upward so that the substrate is held by the first holding guide and the second holding guide; Including, The substrate processing system of claim 6 .

15. The vertical holding portion is configured to hold the plurality of substrates at intervals from one another, the transport device has a plurality of the substrate holders, The substrate holder receiving the substrate held by the vertical holder includes simultaneously receiving a plurality of the substrates held by the vertical holder by a plurality of the substrate holders. The substrate processing system of claim 6 .

16. A substrate transport method in which a transport device transports a substrate from a vertical holding part that holds the substrate in a vertical position to a horizontal holding part that holds the substrate in a horizontal position, comprising: the transport device has a substrate holding unit that holds the substrate, The substrate holder includes: a main body having a first arm and a second arm whose distal end is spaced apart and whose proximal end is connected; a first holding guide fixed to the tip of the first arm and configured to hold a peripheral edge of the substrate; a second holding guide fixed to the tip of the second arm and configured to hold a peripheral portion of the substrate; having a length between the first holding guide and the second holding guide is shorter than a diameter of the substrate; in a state where the substrate is located closer to the base end than a position where the substrate is held by the first holding guide and the second holding guide on the same plane as the first arm portion and the second arm portion, the first arm portion, the second arm portion, the first holding guide and the second holding guide are located radially outward from the substrate, the substrate holder receiving the substrate held by the vertical holder; the substrate holder changing the substrate from a vertical position to a horizontal position; the substrate holder transferring the substrate in a horizontal position to a transfer table; having A method for transporting substrates.

Images