Manufacturing method of scale, encoder, and scale

Abstract

To provide a scale capable of forming a conductor pattern in a short time while suppressing the use of chemicals with a high environmental load, an encoder, and a manufacturing method for a scale.SOLUTION: The manufacturing method of a scale includes the processes of: forming a metal-containing layer, having a light permeability, on a resin layer of a base material in which at least a first surface of the base material is provided with the resin layer; forming a pattern contour on the metal-containing layer by irradiating the metal-containing layer with a first laser beam from the opposite side of the base material; irradiating a blank area outside the contour in the metal-containing layer with a second laser beam from the second side opposite to the first side of the base material; and peeling off an area corresponding to the blank area in the metal-containing layer.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a scale, an encoder, and a method for manufacturing a scale. [Background technology]

[0002] Scales in which a conductive pattern is formed on a substrate have been disclosed (see, for example, Patent Documents 1 to 3). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-031777 A [Patent Document 2] JP 2003-241392 A [Patent Document 3] JP 2016-044967 A Summary of the Invention [Problem to be solved by the invention]

[0004] For example, conductor patterns can be formed by processing the thick copper foil on the surface of a material such as a printed circuit board using lithography and wet etching. However, wet etching uses chemicals that have a high environmental impact. Therefore, it is possible to form conductor patterns using laser processing. However, forming conductor patterns using laser processing takes a long time.

[0005] In one aspect, the present invention aims to provide a scale, an encoder, and a method for manufacturing a scale, which are capable of forming a conductive pattern in a short period of time while reducing the use of chemicals that have a high environmental impact. [Means for solving the problem]

[0006] In one aspect, a method for manufacturing a scale according to the present invention is characterized in that it includes the steps of: forming a metal-containing layer on a resin layer of a substrate having optical transparency and having a resin layer on at least a first surface thereof; irradiating the metal-containing layer with a first laser from the side opposite the substrate to form a contour of a pattern in the metal-containing layer; irradiating a margin portion outside the contour in the metal-containing layer with a second laser from a second surface side of the substrate opposite the first surface; and peeling off a region of the metal-containing layer corresponding to the margin portion.

[0007] In the above-described method for manufacturing a scale, an ultrashort pulse laser may be used as the first laser, and a short pulse laser may be used as the second laser.

[0008] In the above-described method for producing a scale, the base material may be made of a resin.

[0009] In the above-described method for producing a scale, the base material may have a structure including the resin layer on a glass substrate.

[0010] In the above-described method for manufacturing a scale, the contour may be formed by forming a groove that reaches the resin layer when irradiating the first laser.

[0011] In the above-mentioned method for manufacturing a scale, the base material may have a structure comprising the resin layer on a glass substrate, and the contour may be formed by forming a groove that reaches the glass substrate when irradiating the first laser.

[0012] In the above-described method for manufacturing a scale, the substrate may have a flat plate shape.

[0013] In the above-described method for manufacturing a scale, the substrate may have a spherical or cylindrical shape.

[0014] The scale of the present invention comprises a light-transmitting substrate having a resin layer on at least a first surface thereof, and a conductor pattern formed on the resin layer and having a plurality of metal grids arranged at a predetermined interval, and is characterized in having a spotted pattern formed in an area of ​​the resin layer other than the conductor pattern so as to be arranged at a predetermined interval in a two-dimensional direction.

[0015] In the above scale, the spotted pattern may be unevenness formed on the surface of the resin layer.

[0016] An encoder according to the present invention is characterized by comprising the above-mentioned scale. Effect of the Invention

[0017] This reduces the use of chemicals that have a high environmental impact and enables conductor patterns to be formed in a short period of time. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1A is a diagram illustrating an example of the configuration of an electromagnetic induction encoder 1000 with a scale according to a first embodiment, FIG. 1B is a diagram illustrating a sine wave signal having the same period as the fundamental period λ, and FIG. 1C is a diagram illustrating a transmitting coil and a receiving coil provided in a detection head. [Diagram 2] FIG. 2A is a plan view illustrating the scale according to the first embodiment, and FIG. 2B is a cross-sectional view taken along line AA in FIG. [Diagram 3] 1(a) to 1(f) are diagrams illustrating a method for producing scale. [Figure 4] FIG. 2 is a plan view of the scale as viewed from the top side. [Diagram 5] FIG. 13 is a diagram illustrating a spotted pattern. [Figure 6] 1(a) to 1(f) are diagrams illustrating a method for producing scale. [Figure 7] FIG. 10A is a plan view illustrating a scale according to a second embodiment, and FIG. 10B is a cross-sectional view taken along line AA in FIG. [Figure 8]1(a) to 1(d) are diagrams illustrating a method for producing scale. [Figure 9] FIG. 4 is a plan view illustrating a scale. [Figure 10] FIG. 13 is a diagram illustrating an example of a scale. [Figure 11] FIG. 13 is a diagram illustrating an example of a scale. [Figure 12] FIG. 13 is a diagram illustrating an example of a scale. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Hereinafter, an embodiment will be described with reference to the drawings.

[0020] (First embodiment) FIG. 1(a) is a diagram illustrating the configuration of an electromagnetic induction type encoder 1000 including a scale 100 according to the first embodiment. As illustrated in FIG. 1(a), the electromagnetic induction type encoder 1000 includes a scale 100 and a detection head 40 that moves relatively in a measurement axis direction. The scale 100 and the detection head 40 each have a substantially flat plate shape and are arranged facing each other with a predetermined gap therebetween. The electromagnetic induction type encoder 1000 also includes a transmission signal generating unit 50 and a displacement amount measuring unit 60. In FIG. 1(a), the X-axis represents the displacement direction (measurement axis) of the detection head 40. In the plane formed by the scale 100, the direction perpendicular to the X-axis is defined as the Y-axis. The direction perpendicular to the plane formed by the scale 100 is defined as the Z-axis.

[0021] The detection head 40 is provided with a transmitting coil 42, a receiving coil 44, etc. The transmitting coil 42 is a rectangular coil having a length direction in the X-axis direction. The receiving coil 44 is disposed inside the transmitting coil 42.

[0022] The scale 100 has a plurality of conductor patterns 23 made of a conductor provided on a first surface of a substrate 21. The plurality of conductor patterns 23 are arranged with a fundamental period λ along the X-axis direction. The fundamental period λ corresponds to the distance between the centers of two adjacent conductor patterns 23 in the X-axis direction. The conductor pattern 23 is, for example, a plate-like pattern without holes or a closed loop coil. The conductor pattern 23 is electromagnetically coupled to a transmitting coil 42 and also to a receiving coil 44.

[0023] The transmission signal generating unit 50 generates a single-phase AC transmission signal and supplies it to the transmission coil 42. In this case, a magnetic flux is generated in the transmission coil 42. This generates an electromotive current in the multiple conductor patterns 23. The multiple conductor patterns 23 generate a magnetic flux that changes in a predetermined spatial period in the X-axis direction by electromagnetically coupling with the magnetic flux generated by the transmission coil 42. The magnetic flux generated by the conductor pattern 23 generates an electromotive current in the reception coil 44. The electromagnetic coupling between the conductor pattern 23 and the reception coil 44 changes depending on the displacement amount of the detection head 40. This allows a sinusoidal signal with the same period as the fundamental period λ to be obtained, as exemplified in FIG. 1(b). Therefore, the reception coil 44 detects the phase of the magnetic flux generated by the multiple conductor patterns 23.

[0024] The displacement measuring unit 60 can use this sine wave signal as a digital amount with minimum resolution by electrically interpolating it, and measures the displacement of the detection head 40. In FIG. 1(b), the horizontal axis represents the displacement of the detection head 40, and the vertical axis represents the output voltage of the receiving coil 44.

[0025] The transmitting coil 42, the receiving coil 44, and the conductor pattern 23, which are electromagnetically coupled to each other, form one track. Therefore, in this embodiment, the electromagnetic induction encoder 1000 has one track. Note that the electromagnetic induction encoder 1000 may have two tracks arranged at a predetermined interval in the Y-axis direction. In this case, the fundamental period λ may be different between the two tracks. This allows the encoder to function as an absolute (ABS) encoder.

[0026] Fig. 1(c) is a diagram illustrating the transmitting coil 42 and the receiving coil 44 provided in the detection head 40. As illustrated in Fig. 1(c), the receiving coil 44 is disposed inside the transmitting coil 42 which constitutes a rectangular coil. The receiving coil 44 is, for example, a circular coil, but may have other configurations.

[0027] FIG. 2(a) is a plan view illustrating the scale 100 according to the first embodiment. FIG. 2(b) is a cross-sectional view taken along the line AA in FIG. 2(a). As illustrated in FIG. 2(a) and FIG. 2(b), a resin layer 22 is formed on a first surface of a substrate 21. A conductor pattern 23 is formed on the resin layer 22, in which a plurality of metal lattices are arranged at predetermined intervals along the X-axis direction. The plurality of conductor patterns 23 have a substantially rectangular shape with the Y-axis direction being the longitudinal direction in a plan view seen from the +Z direction. The metal lattices are spaced apart from each other. The resin layer 22 may cover the entire first surface of the substrate 21. It is preferable that the resin layer 22 covers at least the entire region in which the conductor patterns 23 are provided. The conductor pattern 23 may be covered by a protective film or the like, or may be exposed to the atmosphere.

[0028] The substrate 21 is not particularly limited as long as it has optical transparency. The substrate 21 is, for example, glass. As the glass, for example, quartz glass, soda lime glass, non-alkali glass, etc. can be used. Quartz glass is essentially silicon dioxide (SiO 2 Soda lime glass is made of silicon dioxide (SiO 2 ) as the main component, and sodium oxide (Na 2 O) and calcium oxide (CaO). Non-alkali glass is a glass that contains silicon dioxide (SiO 2 ) as a main component, and does not contain alkaline components such as sodium, potassium, etc. The thickness of the substrate 21 is, for example, about 0.4 mm or more and 6.0 mm or less.

[0029] The resin layer 22 is not particularly limited as long as it is an adhesive resin having optical transparency, and examples of the resin layer 22 include epoxy resin, polyimide, urethane, and acrylic.

[0030] The conductor pattern 23 is not particularly limited as long as it is made of a metal. The conductor pattern 23 is formed of a conductor such as copper, silver, gold, or aluminum. The thickness of the conductor pattern 23 is, for example, about 3 μm to 30 μm. The width of the conductor pattern 23 in the X-axis direction is, for example, about 500 μm to 3000 μm. The interval between the conductor patterns 23 (from one end of the conductor pattern 23 to the other end of the adjacent conductor pattern 23) is also, for example, about 500 μm to 3000 μm.

[0031] Next, a method for manufacturing the scale 100 will be described. First, as illustrated in Fig. 3(a), an adhesive resin is applied to a first surface on the upper side of the base material 21 to form a resin layer 22. As an example, the resin layer 22 is formed to a thickness of 30 µm. For example, a liquid adhesive resin may be applied uniformly to the first surface of the base material 21, or a sheet-like adhesive resin may be laminated. Thereafter, a metal foil 24 (metal-containing layer) is attached onto the resin layer 22 by heat lamination or heat pressing.

[0032] Alternatively, a flexible printed circuit board material in which the resin layer 22 and the metal foil 24 are bonded together to form an integral structure may be attached to the base material 21. As the metal foil 24, for example, a copper foil having a thickness of 12 μm can be used.

[0033] Next, as illustrated in FIG. 3(b), the metal foil 24 is irradiated with an ultrashort pulse laser (first laser) from the opposite side of the substrate 21 with a width of about 10 μm to 50 μm, thereby performing ultrashort pulse laser processing. The ultrashort pulse laser is a laser with a very short pulse width (time width) of the picosecond to femtosecond order, and can be irradiated at equal intervals in time with a repetition frequency of, for example, 10 kHz to 4 MHz. By the ultrashort pulse laser processing, a groove 25 corresponding to the contour of the conductor pattern 23 is formed in the metal foil 24, as illustrated in FIG. 3(c). For example, the ultrashort pulse laser processing may be performed using a galvano scanner, or the ultrashort pulse laser processing may be performed by moving the workpiece on a precision stage to change the laser spot position on the workpiece. The processed end surface is smooth and tapered, so that the cross section of the groove 25 has a V-groove structure. The groove 25 reaches the resin layer 22. Alternatively, the grooves 25 may be formed to reach the upper surface of the base material 21 and to be deeper than the upper surface of the base material 21 .

[0034] Next, as illustrated in FIG. 3(d), a short-pulse laser having a wavelength that transmits glass or resin is focused and irradiated from the second surface of the substrate 21 opposite to the first surface to the interface between the resin layer 22 and the metal foil 24. The short-pulse laser is a laser having a pulse width (time width) of 1 to 100 nanoseconds and repeatedly irradiated at time intervals of 10 kHz to 1 MHz. For example, an infrared nanosecond laser can be used as the short-pulse laser. When the short-pulse laser is scanned on the outside (margin) of the contour formed by the groove 25, heat is generated mainly at the interface between the resin layer 22 and the metal foil 24 in the margin, and the surface of the resin layer 22 is denatured and the adhesive force is lost. As a result, a gap may be generated between the resin layer 22 and the metal foil 24 in the margin, as illustrated in FIG. 3(e).

[0035] The energy required for modifying the resin layer 22 is smaller than the energy required for removing the metal foil 24, and the processing can be performed faster and with lower energy than directly removing the metal foil 24. Also, when positioning the scanning position with the short pulse laser, it does not matter if the laser slightly protrudes to the width of the groove around the margin, so the positioning of the short pulse laser may be performed using a low-precision galvano scanner.

[0036] In addition, since a short-pulse laser with a large spot that reduces the energy density of the irradiated pulse can be used, removal processing can be easily performed at high speed. For example, when removing grooves by laser ablation using an expensive ultrashort pulse laser from the front surface to remove pattern contours of 5% of the total area, pulse irradiation with a laser output of 20 W and a Φ20 μm spot at a 5 μm pitch in the XY direction must be repeated 10 times. On the other hand, when a low-output, inexpensive infrared short-pulse laser is used to perform peeling processing by scanning and irradiating from the back surface at the same speed as the ultrashort pulse laser, even if the area of ​​the margin is 50%, which is 10 times the area of ​​the grooves, if the energy is 5 W, the spot diameter is Φ40 μm, and the pitch is 30 μm in the XY direction, the number of pulse irradiations can be one time and peeling can be completed with 1 / 360 times fewer irradiations per area, so the peeling work can be completed about 36 times faster than removal processing. Therefore, processing can be performed with good productivity using low-cost production equipment.

[0037] In addition, by using the peeling process from the back surface, it is possible to shorten the etching process time required for the grooves on the front surface. In order to speed up the takt time, it is not necessary to carry out processes with low productivity, such as dividing the etching process for a large area by using multiple ultra-short pulse lasers, which are time-consuming and require high equipment costs.

[0038] Furthermore, after removal processing, the surface is prone to stains and defects that are difficult to remove, such as scorching due to strong pulse energy, alteration of the circuit surface, and spattering of dust, glass powder, and molten material. If a large area is entirely removed, a large amount of stains and defects are likely to occur in proportion to the area. With peeling processing, peeling is performed with a single weak pulse, and there is only a slight alteration of the resin surface, and no scorching or staining occurs, so there are almost no defects. The area of ​​the groove processing performed on the surface before peeling is small, so alteration and staining can be reduced.

[0039] Next, as illustrated in Fig. 3(f), the metal foil 24 in the blank area scanned with the short pulse laser is peeled off. This allows the conductive pattern 23 to be formed. For example, the metal foil 24 in the blank area may be peeled off by directly applying an adhesive tape to the blank area. Alternatively, the metal foil 24 in the blank area may be peeled off by cleaning with a brush, blowing with high-pressure air, ultrasonic cleaning with pure water, or the like. The peeled off metal can be collected and used as a recycled resource.

[0040] Fig. 4 is a plan view of the scale 100 as viewed from the top side. As illustrated in Fig. 4, on the top surface of the scale 100, a spotted pattern 27 resulting from irradiation with a short-pulse laser is seen on the top surface of the resin layer 22. For example, when a circular spot light is irradiated as the short-pulse laser, the circular spotted pattern 27 appears arranged at a predetermined interval in two-dimensional directions in the X-axis direction and the Y-axis direction. For example, the spotted pattern 27 appears at a predetermined interval (for example, 10 µm to 100 µm) along the X-axis direction, and at a predetermined interval (for example, 10 µm to 100 µm) along the Y-axis direction.

[0041] For example, the spotted pattern 27 may be a visual pattern appearing on the upper surface of the resin layer 22, or may be unevenness appearing on the upper surface of the resin layer 22, as exemplified in Fig. 5. The planar shape of the spotted pattern 27 is affected by the shape of the spot light of the short pulse laser. Therefore, if the spot light of the short pulse laser has a substantially circular shape, the planar shape of the spotted pattern 27 will also be substantially circular. If the spot light of the short pulse laser has a substantially rectangular shape, the planar shape of the spotted pattern 27 will also be substantially rectangular.

[0042] Next, another manufacturing method of the scale 100 will be described. First, as illustrated in Fig. 6(a), a primer resin adhesive is applied to a first surface on the upper surface side of the substrate 21 to form a resin layer 22. As an example, the resin layer 22 is formed to a thickness of 5 µm.

[0043] Thereafter, a metal paste 26 (metal-containing layer) having high adhesion to the primer resin is screen-printed on the resin layer 22. As an example, a silver paste having a thickness of 10 μm can be used as the metal paste 26. The edges of the printed pattern have poor processing accuracy because the ink spreads, and film thickness distribution, edge roughness, and printing distortion are likely to occur, but a metal film with a relatively flat and uniform thickness can be obtained near the center of the printed pattern. If the pattern is printed slightly larger than the pattern required for the finished product, including the part that will peel off, a pattern with a uniform thickness can be obtained. A rough conductive pattern can be obtained by firing after printing. In the case of parts with complex shapes for which screen printing cannot be used, a conductive solid pattern such as metal foil can be obtained by spraying or brushing the paste agent.

[0044] Next, as shown in FIG. 6(b), an ultrashort pulse laser is irradiated to a location inside the edge of the print pattern, where the film thickness is uniform, with a width of about 10 μm to 50 μm, to perform ultrashort pulse laser processing. As shown in FIG. 6(c), ultrashort pulse laser processing forms a groove 25 corresponding to the contour of the conductor pattern 23 in the metal paste 26. For example, the ultrashort pulse laser processing may be performed using a galvano scanner, or the ultrashort pulse laser processing may be performed by processing the workpiece on a precision stage while changing the laser spot position. Since the processed end surface is smooth and tapered, the cross section of the groove 25 has a V-groove structure. The groove 25 reaches the resin layer 22. Alternatively, the groove 25 may reach the top surface of the substrate 21 and be formed deeper than the top surface of the substrate 21.

[0045] Next, as illustrated in Fig. 6(d), a short-pulse laser having a wavelength that transmits glass or resin is focused and irradiated from the second surface opposite to the first surface of the substrate 21 onto the interface between the resin layer 22 and the metal paste 26. When the short-pulse laser is scanned over the marginal area (area other than the conductive pattern 23) separated by the groove 25, heat is generated mainly at the interface between the resin layer 22 and the metal paste 26 in the marginal area, and the surface of the resin layer 22 is altered, causing a loss of adhesive force. This can result in a gap being generated between the resin layer 22 and the metal paste 26 in the marginal area, as illustrated in Fig. 6(e).

[0046] The energy required for the modification of the resin layer 22 is smaller than that required for the removal processing of the metal paste 26, and the processing can be performed at a higher speed and with lower energy than directly removing the metal paste 26. In addition, since it is acceptable for the short pulse laser to slightly protrude to the width of the groove, a low-precision galvano scanner may be used to position the short pulse laser. Since defects are unlikely to occur even if the part without the silver paste pattern is irradiated, it is acceptable to irradiate a wide range taking into consideration the edge position variation of the paste pattern. If an attempt is made to remove the part without the paste from the surface or the part with a film thickness distribution, the processing depth will vary over a wide range, and strong energy will be applied to the part only of the resin, which will cause the resin to burn or peel off. The peeling process can reduce the probability of defects compared to the case of processing only by removal processing. In addition, it is acceptable to use a short pulse laser with a large spot that reduces the energy density, making it easy to process at high speed.

[0047] Next, as illustrated in Fig. 6(f), the metal paste 26 in the marginal area scanned with the short pulse laser is peeled off. For example, the metal paste 26 in the marginal area may be peeled off by directly applying an adhesive tape to the marginal area. Alternatively, the metal paste 26 in the marginal area may be peeled off by performing brush cleaning, blowing with high-pressure air, ultrasonic cleaning with pure water, or the like. The peeled off metal can be collected and used as a recycled resource.

[0048] According to this embodiment, since lithography, chemical etching, plating, etc. can be omitted, chemical solution management and waste liquid treatment are not required, and the number of processes can be reduced. In addition, since processing can be performed by direct drawing with a laser, circuits can be formed with good productivity even for components with complex shapes for which it is difficult to use a lithography process using a photomask.

[0049] Second embodiment In the first embodiment, a scale having a structure in which a resin layer 22 is formed on a substrate 21 has been described, but in the second embodiment, a case in which the substrate is made of resin will be described.

[0050] FIG. 7(a) is a plan view illustrating a scale 100a according to the second embodiment. FIG. 7(b) is a cross-sectional view taken along line AA in FIG. 7(a). As illustrated in FIG. 7(a) and FIG. 7(b), a conductor pattern 23 is formed on a first surface of a substrate 21, in which a plurality of metal gratings are arranged at predetermined intervals along the X-axis direction. In this embodiment, the substrate 21 is made of a resin having optical transparency. In this manner, the entire substrate 21 may be made of resin. In this embodiment, the thickness of the substrate 21 is, for example, about 0.1 mm or more and 100 mm or less.

[0051] Resins often have a higher coefficient of thermal expansion than glass and the like, but they have the advantages of being less likely to break, being lightweight, thin, and allowing freedom in their complex shapes. Therefore, the scale 100a according to this embodiment has the advantages of being less likely to break, being lightweight, and allowing freedom in their shapes. For example, scale processing can be performed even on a part that has a shape in which a flat scale and a spindle to which it is attached are integrated.

[0052] Next, a method for manufacturing the scale 100a will be described. First, as shown in Fig. 8(a), a metal foil 24 (metal-containing layer) is attached to a first surface on the upper side of a base material 21 made of resin by thermal lamination or thermal pressing.

[0053] 8(b), the metal foil 24 is irradiated with an ultrashort pulse laser (first laser) from the side opposite to the substrate 21 with a width of about 10 μm to 50 μm, thereby performing ultrashort pulse laser processing. The grooves formed by the ultrashort pulse laser processing reach the substrate 21. Alternatively, the grooves may reach the upper surface of the substrate 21 and be formed deeper than the upper surface of the substrate 21.

[0054] 8(c), a short-pulse laser having a wavelength that transmits through glass or resin is focused and irradiated onto the interface between the substrate 21 and the metal foil 24 from a second surface opposite to the first surface of the substrate 21. When the short-pulse laser is scanned onto the outside of the contour formed by the groove (margin), heat is generated mainly at the interface between the substrate 21 and the metal foil 24 in the margin, and the surface of the substrate 21 is altered, causing a loss of adhesive force.

[0055] Next, as illustrated in Fig. 8(d), the metal foil 24 in the blank area scanned with the short pulse laser is peeled off. This allows the conductive pattern 23 to be formed. For example, the metal foil 24 in the blank area may be peeled off by directly applying an adhesive tape to the blank area. Alternatively, the metal foil 24 in the blank area may be peeled off by cleaning with a brush, blowing with high-pressure air, ultrasonic cleaning with pure water, or the like. The peeled off metal can be collected and used as a recycled resource.

[0056] In this embodiment, since lithography, chemical etching, plating, etc. can be omitted, chemical solution management and waste liquid treatment are not required, and the number of processes can be reduced. In addition, since processing can be performed by laser, it is possible to form with good productivity even parts with complex shapes for which it is difficult to use lithography processes, or resins that are not resistant to chemicals used in lithography, such as those that dissolve or deform in the chemicals used.

[0057] Resin can be easily molded into a variety of shapes using injection molding or a 3D printer. Therefore, resin can be processed into various shapes such as a cylinder, a cylinder, a disk, or a sphere. Scales having these shapes can form encoders used in, for example, robot joints. Note that even structures that have a resin layer on glass can be processed into these shapes.

[0058] For example, the scale 100a may have a substantially circular shape in plan view. FIG. 9 is a plan view illustrating the scale 100a in this case. As illustrated in FIG. 9, in the scale 100a, the base material 21 has a substantially circular shape in plan view. The multiple conductor patterns 23 are arranged at predetermined intervals along the outer periphery on the first surface on the upper surface side of the base material 21, inside the outer periphery. In FIG. 7, the conductor patterns 23 are arranged along a dashed line. The cross-sectional shape along this dashed line is as described in FIG. 7(b).

[0059] Alternatively, the scale 100a may have a substantially cylindrical shape. Fig. 10 is a diagram illustrating the scale 100a in this case. As illustrated in Fig. 10, in the scale 100a, the base material 21 has a cylindrical shape. On the inner surface of this cylinder, a plurality of conductor patterns 23 are arranged at predetermined intervals. For example, the plurality of conductor patterns 23 are arranged along the circumferential direction on the inner surface of the cylinder.

[0060] Alternatively, the scale 100a may have a substantially cylindrical shape. Fig. 11 is a diagram illustrating the scale 100a in this case. As illustrated in Fig. 11, in the scale 100a, the base material 21 has a cylindrical shape. On the outer surface of this cylindrical shape, a plurality of conductor patterns 23 are arranged at predetermined intervals. For example, the plurality of conductor patterns 23 are arranged along the axial direction of the cylindrical shape.

[0061] Alternatively, the scale 100a may have a substantially spherical shape. Fig. 12 is a diagram illustrating the scale 100a in this case. As illustrated in Fig. 12, in the scale 100a, the base material 21 has a spherical shape. A plurality of conductor patterns 23 are arranged at predetermined intervals on the outer periphery of this sphere. For example, the plurality of conductor patterns 23 are arranged along a predetermined circumference of the sphere.

[0062] Although the embodiment of the present invention has been described in detail above, the present invention is not limited to such specific embodiment, and various modifications and variations are possible within the scope of the gist of the present invention described in the claims. [Explanation of symbols]

[0063] 21 Base material 22 Resin layer 23 Conductor Pattern 24 Metal foil 25 groove 26 Metal Paste 27 Spotted 40 Detection head 42 Transmitting coil 44 Receiver coil 50 Transmission signal generator 60 Displacement measurement section 100,100a scale 1000 Electromagnetic Inductive Encoder

Claims

1. A step of forming a metal-containing layer on a resin layer of a substrate having optical transparency and having a resin layer on at least a first surface of the substrate; irradiating the metal-containing layer from a side opposite the substrate with a first laser to form a pattern outline in the metal-containing layer; irradiating a margin portion outside the contour of the metal-containing layer with a second laser from a second surface side opposite to the first surface of the base material; and peeling off a region of the metal-containing layer that corresponds to the marginal portion.

2. An ultrashort pulse laser is used as the first laser, 2. The method for manufacturing a scale according to claim 1, wherein a short pulse laser is used as the second laser.

3. The method for manufacturing a scale according to claim 1, wherein the base material is made of a resin.

4. The method for manufacturing a scale according to claim 1, wherein the base material has a structure comprising a glass substrate and the resin layer on the glass substrate.

5. 2. The method for manufacturing a scale according to claim 1, wherein the contour is formed by forming a groove that reaches the resin layer when irradiating the first laser.

6. The base material has a structure including the resin layer on a glass substrate, 2. The method for manufacturing a scale according to claim 1, wherein the contour is formed by forming a groove that reaches the glass substrate when irradiating the first laser.

7. The method for manufacturing a scale according to claim 1 , wherein the substrate has a flat plate shape.

8. The method for manufacturing a scale according to claim 1, wherein the substrate has a spherical or cylindrical shape.

9. A substrate having optical transparency and including a resin layer on at least a first surface thereof; a conductor pattern formed on the resin layer and including a plurality of metal grids arranged at predetermined intervals; A scale comprising: a speckled pattern formed in an area of ​​said resin layer other than said conductor pattern, said speckled pattern being arranged at predetermined intervals in two-dimensional directions.

10. 10. The scale according to claim 9, wherein the spotted pattern is an unevenness formed on the surface of the resin layer.

11. An encoder comprising the scale according to claim 9 or 10.

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