Device

Abstract

To provide a technique for preventing a sealing material from flowing into a housing of a connector.SOLUTION: There is no corner which is recessed inward on a peripheral wall of a spacer 130 interposed between a circuit board 110 and a connector 120, such that a capillary phenomenon hardly occurs in the case of sealing and a sealing material can be prevented from creeping up along an outer surface of the peripheral wall. There is a space 130s between a front wall part 122a of a housing and a high floor part 130g of the spacer but a distance to some extent is secured between a lower end level of a slit 122b and a top face level of the high floor part 130g or between the front wall part 122a of the housing and a front wall part 130c and a corner wall part 130d of the spacer. Thus, even in a case where the sealing material creeps up from the space 130s, the sealing material can be guided to an upper side of the high floor part 130g and stopped at a lower level than the lower end of the slit 122b, and the sealing material can be prevented from flowing from the slit 122b into the housing 122.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a device incorporating a circuit board, and more particularly to a device in which the incorporated circuit board is encapsulated with an encapsulating material. [Background technology]

[0002] In the process of manufacturing a device that incorporates a circuit board, a molten resin or other material is usually filled into the target area in order to seal the circuit board in a case or to join components together. If there is a gap or a narrow recess, the molten material may creep up along the gap due to capillary action, which may affect the performance of the device. Therefore, various measures have been taken in the past to prevent the material from creeping up the target area (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-135449 A [Patent Document 2] Patent No. 7239823 Summary of the Invention [Problem to be solved by the invention]

[0004] An internal board mounted on a device may be equipped with a connector to facilitate connection to an external device or board (external board). In such a device, a connector having a connection terminal connected to the external board (hereinafter referred to as an "external connector") is inserted into the connector exposed from the case, and the connection terminals of both come into contact with each other, establishing a connection between the internal board and the external board.

[0005] Capillary action also occurs when sealing a circuit board on which a connector is mounted, and the molten sealing material can creep up along the outer surface of the connector housing. If the sealing material creeps up and reaches the inside of the housing, it cannot accept the external connector in the expected manner, which can cause poor contact of the connection terminals, and so measures are being sought to prevent this.

[0006] Therefore, an object of the present invention is to provide a technique for preventing the inflow of sealing material into the inside of a connector housing. [Means for solving the problem]

[0007] In order to solve the above problems, the present invention employs the following device. Note that the words in parentheses below are merely examples, and the present invention is not limited thereto.

[0008] In other words, the device of the present invention is a device in which an internal circuit board is sealed with a sealing material, and comprises a connector having a housing and one or more connection terminals that penetrate and are fixed to the bottom of the housing, a spacer which has a cylindrical shape with a partial bottom and no recessed corners in the surrounding wall and receives the connector and supports it on a first bottom (floor plate portion), while inserting the connection terminal into an opening surrounded by the first bottom and a second bottom (raised floor portion) connected to it, and a circuit board on which the spacer is seated and the connector is mounted.

[0009] According to the device of this aspect, since the connector is mounted on the circuit board via the spacer, it is possible to prevent the molten sealing material filled during the manufacturing process of the device from flowing directly around the periphery of the connector housing and into the inside of the housing. In addition, since the spacer supporting the connector does not have a recessed corner on its peripheral wall, capillary action is unlikely to occur on the peripheral wall of the spacer when the molten sealing material is filled during the manufacturing process of the device, it is possible to suppress the sealing material from creeping up along the outer surface of the peripheral wall of the spacer during sealing.

[0010] More preferably, in the device of the above-mentioned aspect, the connector has a slit cut downward from the upper end of a specific wall portion of the housing, and the spacer has an opposing wall portion (front wall portion and corner wall portion of the spacer) that forms a portion opposing the specific wall portion (front wall portion of the housing) in the peripheral wall portion, which is connected to the second bottom, the second bottom is close to the specific wall portion, and a distance is secured between the height of the upper surface of the second bottom and the height of the lower end of the slit, and between the specific wall portion and the opposing wall portion.

[0011] According to the device of this embodiment, a distance is maintained between the height of the lower end of the slit formed in a specific wall portion of the housing and the height of the upper surface of the second bottom portion of the spacer adjacent to the specific wall portion, so that if sealing material creeps up from the gap between the specific wall portion of the housing and the second bottom portion of the spacer during sealing, the sealing material can be prevented from flowing beyond the lower end of the slit into the interior of the housing.

[0012] In addition, since a distance is maintained between a specific wall portion of the housing and the opposing wall portion of the spacer, if the sealing material creeps up from the above-mentioned gap during sealing, the sealing material can be guided into the space above the second floor portion and a certain amount of the sealing material can be retained there, thereby preventing the sealing material from flowing into the inside of the housing.

[0013] More preferably, in the device of the above aspect, the second bottom of the spacer is provided at a higher position than the first bottom, and the lower part of the part that is smaller in height dimension than the other parts that form the opposing wall is connected to the second bottom. Also, the spacer is provided with a leg at least at one point on the lower side of the second bottom, the leg having a height up to the height of the lower surface of the first bottom.

[0014] In the device of this aspect, when the connector is mounted on the circuit board, the spacer lands on the connector, forming an opening surrounded by the upper surface of the circuit board and the second bottom of the spacer, and the inside of the spacer can be seen through this opening. Therefore, according to the configuration of this device, when the connector is mounted, soldering can be performed while checking the state of the solder from the opening, which contributes to ensuring the quality of the product. Effect of the Invention

[0015] As described above, according to the present invention, it is possible to prevent the inflow of sealing material into the inside of the housing of the connector. [Brief description of the drawings]

[0016] [Figure 1] 1 is a perspective view of a current sensor 100 according to an embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the current sensor 100. [Diagram 3] 2 is an exploded perspective view showing an enlarged view of a connector 120 and its surrounding area. FIG. [Figure 4] FIG. [Diagram 5] 1A and 1B are plan, front and bottom views of a spacer 130. [Figure 6] 1A and 1B are a perspective view and a plan view showing a state in which a connector 120 is mounted on a circuit board 110 via a spacer 130. [Figure 7] 1 is a front view showing a state in which a connector 120 is mounted on a circuit board 110 via a spacer 130. FIG. [Figure 8] 1 is a vertical cross-sectional view showing a state in which a connector 120 is mounted on a circuit board 110 via a spacer 130. FIG. [Figure 9] FIG. 13 is a diagram showing a spacer 130' as a comparative example. [Figure 10] 11 is a photograph showing, in comparison with one another, verification results of a spacer 130 according to an embodiment and a spacer 130' according to a comparative example. [Figure 11] 13 is a plan view showing modified spacers 230 and 330. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings, taking a current sensor as an example of a device in which a built-in circuit board is sealed with a sealing material.

[0018] FIG. 1 is a perspective view of a current sensor 100 according to one embodiment. The current sensor 100 includes a case body 102 having a substantially rectangular ring shape. The case body 102 is roughly divided into an accommodation portion 102a formed in advance from a material such as resin to form an accommodation space for components such as a magnetic core and a circuit board, and a sealing portion 102b formed by hardening a sealing material (e.g., urethane resin) filled in the accommodation portion 102a after the components are accommodated therein. A connector 120 for connecting an external connector to the current sensor 100 is mounted on the sealed circuit board. The connector 120 is exposed from a corner of the sealing portion 102b.

[0019] Two mounting plates 104 are provided at the ends of the case body 102, and each mounting plate 104 has a fastening hole 104a. The current sensor 100 is fixed to an installation site with a fastening member via the mounting plates 104 and the fastening holes 104a.

[0020] FIG. 2 is an exploded perspective view of the current sensor 100. For ease of explanation, Fig. 2 shows the current sensor 100 in an exploded state rotated 90 degrees from the state shown in Fig. 1 and laid on its side with the connector 120 facing upward. Also, the sealing portion 102b and small components are omitted from the illustration.

[0021] First, two U-shaped magnetic cores 106 are accommodated in the accommodation section 102a with their open end faces facing each other and a gap 107 of a predetermined size between them. Next, the partition plate 108 is inserted. The partition plate 108 has claws 108b at the tips of the portions extending downward from four points at the end of the rectangular frame portion 108a, and these claws 108b engage with claw receivers provided on the inner circumferential surface of the accommodation section 102a (positions not visible in FIG. 2), thereby fixing the partition plate 102a to the accommodation section 102a. The partition plate 108 also has a rectangular hole 108c at a position overlapping the gap 107 in the rectangular frame portion 108a.

[0022] Two ICs 112 (e.g., Hall ICs) with built-in magnetic sensing elements are mounted on the circuit board 110 at positions that will fit into the gap 107 when assembled, and a plurality of terminals connected to the ICs 112 protrude through through holes to the upper part of the circuit board 110. Also, a connector 120 is mounted on a corner of the circuit board 110 via a spacer 130. The shape of the spacer 130 and the mounting of the connector 120 via the spacer 130 will be described in detail later with reference to another drawing.

[0023] The circuit board 110 is placed on the partition plate 108 so that the protrusion 102c provided on the inner peripheral surface of the accommodating portion 102a fits into the notch 110a formed near the mounting position of the connector 120. Accordingly, the IC 112 is placed in the gap 107 through the rectangular hole 108c. Finally, the accommodating portion 102a is filled with a sealing material, which is solidified to form the sealing portion 102b.

[0024] FIG. 3 is an exploded perspective view showing the connector 120 and its surrounding area in an enlarged scale. For ease of understanding of the invention, the vertical and front-rear directions in Fig. 3 are defined as the vertical and front-rear directions of each component, and their shapes and structures will be described below. Note that the circuit board 110 is shown with the exception of the mounting area of ​​the connector 120, and the circuits and lands are also omitted (this also applies to the following figures).

[0025] The connector 120 is a male connector in which four connection terminals 124 penetrate and are fixed to the bottom of a housing 122 made of an insulating material. Although not visible in Fig. 3, the bottom of the housing 122 is closed. The spacer 130 is also made of an insulating material and has an opening 130a and a floor plate portion 130b at its bottom. The spacer 130 receives the connector 120 and supports it with the floor plate portion 130b while the connection terminals 124 are inserted into the opening 130a.

[0026] Four through holes 110b are formed in the circuit board 110 corresponding to the number of connection terminals 124. The connector 120 is positioned relative to the circuit board 110 while inserting the lower ends of the four connection terminals 124 into the four through holes, and the spacer 130 supporting the connector 120 is landed on the circuit board 110. Then, the back side of the circuit board 110 is soldered, and the connector 120 is mounted on the circuit board 110.

[0027] In the illustrated example, the two through holes 110b2 sandwiched between them have a larger diameter than the two through holes on either side, but the diameter of each through hole can be changed as appropriate depending on the situation. Also, the number of connection terminals and the corresponding number of through holes can be changed as appropriate.

[0028] 4 and 5 show the spacer 130. Fig. 4(A) is an upper perspective view thereof, Fig. 4(B) is a lower perspective view thereof, Fig. 5(A) is a plan view thereof, Fig. 5(B) is a front view thereof, and Fig. 5(C) is a bottom view thereof.

[0029] As shown in FIG. 4A, the spacer 130 has a rectangular tube shape with a bottom. Specifically, the peripheral wall of the rectangular tube is formed such that the corner wall 130d is connected to both sides of the front wall 130c at an obtuse angle, the side wall 130e is connected to the corner wall 130d at an obtuse angle, and the side wall 130e is connected to both sides of the rear wall 130f at an approximately right angle. From another perspective, the spacer 130 has a shape in which, in a rectangular tube shape with a bottom and having an approximately rectangular outline in a plan view, two of the four corners included in the outline are cut and connected by a flat wall, specifically, the approximately right-angled corners formed when the front wall 130c and the side wall 130e are directly connected are chamfered, and the corner wall 130d is connected between the front wall 130c and the side wall 130e.

[0030] As shown in FIG. 4B, at the bottom of the spacer 130, a floor plate portion 130b with a large cutout in the front area is connected to the lower end of each part forming the peripheral wall. The front wall portion 130c has a smaller height dimension than the other parts forming the peripheral wall, and a raised floor portion 130g is connected to its lower end. The bottom surface of the raised floor portion 130g is located higher than the bottom surface of the floor plate portion 130b, and three legs 130h extend downward from the raised floor portion 130g. As a result, four inverted groove-shaped portions (hereinafter referred to as "inverted grooves") 130k that run through the front-rear direction are formed on the underside of the raised floor portion 130g.

[0031] As shown in FIG. 4B and FIG. 5A, the high floor portion 130g is connected to the front wall portion 130c and the corner wall portion 130d, and is connected to the floor plate portion 130b near the corner wall portion 130d. The floor plate portion 130b and the high floor portion 130g are connected to each other to form an opening 130a surrounded by them. Also, as shown in FIG. 5B, the three legs 130h and the four inverted grooves 130k are provided at approximately equal intervals in the width direction. The floor plate portion 130b can be seen from each inverted groove 130k. From this, it can be seen that the height of the legs 130h, i.e., the depth of the inverted grooves 130k, is greater than the thickness of the floor plate portion 130b.

[0032] 6 and 7 show a state in which the connector 120 is mounted on the circuit board 110 via the spacer 130. Fig. 6(A) is a perspective view thereof, Fig. 6(B) is a plan view thereof, Fig. 7(A) is a front view thereof, and Fig. 7(B) shows an enlarged portion of the front view.

[0033] 6A, the housing 122 has two slits 122b cut downward from the upper end of the front wall 122a, and has a claw 122c between the two slits 122b. The slits 122b and the claws 122c are designed to match the shape of the female external connector that is inserted into the connector 120 when the current sensor 100 is in use, and the presence of the claws 122c allows the connectors to be securely fitted together. In addition, the claws 122c bend slightly forward in response to the insertion of the external connector, but since a space is secured in front of the claws 122c, the spacer 130 does not interfere with the claws 122c.

[0034] Incidentally, in connector 120, the lower end of slit 122b is located at a height that is approximately 1 / 3 of the height of front wall portion 122a (see FIG. 3). This height is lower than the surface level of the sealing material filled on circuit board 110 in accommodation portion 102a of case body 102. Therefore, if connector 120 were to be mounted by directly landing it on circuit board 110, the sealing material would flow into housing 122 from slit 122b, preventing connection between connector 120 and an external connector.

[0035] One possible solution to this problem would be to make the entire peripheral wall of the housing, including the front wall, taller while maintaining the depth of the slit. However, this solution is not preferable because making the peripheral wall taller would increase the degree to which the connector protrudes, thereby expanding the maximum outer shape of the product.

[0036] Therefore, in this embodiment, in order to reliably prevent the inflow of the sealing material into the connector housing while minimizing the expansion of the outermost shape of the product, the connector 120 is mounted on the circuit board 110 via the spacer 130 having the above-mentioned shape. Due to the presence of the spacer 130, the position of the slit 122b is elevated by the thickness of the floor plate portion of the spacer 130 that supports the connector 120. As shown in Fig. 7(A), in the mounted state of the connector 120, the lower end of the slit 122b is shielded by the front wall portion 130c of the spacer.

[0037] Furthermore, by the spacer 130 landing on the circuit board 110, an opening surrounded by the inverted groove 130k and the upper surface 110c of the circuit board 110 is formed, and the inside of the spacer 130 can be seen through this opening. The connection terminals 124 passed through the through holes are soldered from the back side (lower surface 110d side) of the circuit board 110, and at that time, the work can be performed while checking the state of the soldering by looking into the inside of the spacer 130 through the above-mentioned opening.

[0038] In order to facilitate understanding of the invention, Fig. 7B shows the soldering operation by enlarging the area surrounded by line VII in Fig. 7A. The through-hole 110b2 on the left side is in a state where soldering has been completed, and the through-hole 110b1 on the right side is in a state where soldering is in progress. In this embodiment, soldering can be performed while checking whether the solder is sufficient from the opening (bold framed part in the figure) surrounded by the inverted groove 130k and the upper surface 110c of the circuit board 110, so that the solder SD can be sufficiently distributed inside the through-hole 110b and the land (not shown).

[0039] 8 is a vertical cross-sectional view showing a state in which the connector 120 is mounted on the circuit board 110 via the spacer 130. In FIG. 8(A), VIII in FIG. A -VIII A FIG. 8B is a cross-sectional view taken along line VIII in FIG. 6. B -VIII B FIG.

[0040] The raised floor 130g of the spacer 130 is close to the front wall 122a of the housing 122 with a small gap 130s between them. A distance D1 is ensured between the upper surface level of the raised floor 130g and the level of the lower end 122d of the slit 122b. A distance D2 that is much larger than the gap 130s is ensured between the front wall 122a of the housing and the front wall 130c of the spacer. A distance D3 that varies in size depending on the position is ensured between the front wall 122a of the housing and the corner wall 130d of the spacer. When the product is sealed, the sealing material is filled up to a level FL that is higher than the level of the lower end 122d of the slit 122b and lower than the upper end level of the front wall 130c of the spacer.

[0041] The sealing material may flow around and under the spacer 130 along the circuit board 110, and also flow through the inverted groove 130k of the spacer to the underside of the housing 122, and creep up the gap 130s. In this embodiment, the distance D1 is ensured between the upper surface level of the raised floor portion 130g and the level of the lower end 122d of the slit 122b, so that the sealing material that creeps up from the gap 130s can be prevented from reaching the slit 122b as it is.

[0042] In addition, since the distance D2 is ensured between the front wall 122a of the housing and the front wall 130c of the spacer, and the distance D3 is ensured between the front wall 122a of the housing and the corner wall 130d of the spacer, even if the sealing material creeps up from the gap 130s, the sealing material can be guided to the upper space 130t of the high floor portion 130g. A certain amount of sealing material can be retained in the upper space 130t, and even if the sealing material is filled up to the level FL, the amount of sealing material retained in the upper space 130t does not exceed the level of the lower end 122d of the slit 122b. Therefore, the sealing material creeping up from the gap 130s can be prevented from flowing into the inside of the housing 122.

[0043] Fig. 9 shows a spacer 130' as a comparative example. Fig. 9(A) is a plan view of the spacer 130', and Fig. 9(B) and (C) are vertical cross-sectional views of the connector 120 mounted on the circuit board 110 via the spacer 130'. Fig. 9(B) and (C) show cross-sectional views of Fig. 8(A) and (B), respectively, in which the spacer 130 of the embodiment is replaced with the spacer 130' of the comparative example.

[0044] 9A, in the spacer 130' of the comparative example, a corner wall portion 130d' ​​forming a substantially right-angled recess is connected between a front wall portion 130c' and a side wall portion 130e'. The spacer 130' has a shape that ensures a space for receiving the connector 120 and a minimum space required to prevent interference between the tabs on the front of the connector and the front wall portion 130c'.

[0045] 9B, when the spacer 130' of the comparative example is used, the raised floor portion 130g' of the spacer 130' is close to the front wall portion 122a of the housing 122 with a small gap 130s' therebetween. Since the raised floor portion 130g' is located at a high position and the upper surface level of the raised floor portion 130g' is roughly the same as the level of the lower end 122d of the slit 122b, when the sealing material creeps upward from the gap 130s', it is difficult to guide the sealing material to the space 130t' above the raised floor portion 130g', and there is a risk that the sealing material will flow into the inside of the housing 122 from the slit 122b.

[0046] Furthermore, as shown in FIG. 9C, when the spacer 130' of the comparative example is used, there is only a gap 130s' between the front wall portion 122a of the housing and the corner wall portion 130d' ​​of the spacer, so if the sealing material gets into this gap, it is likely to creep up.

[0047] 10 is a photograph-substitute drawing showing the comparison of the verification results for the spacer 130 of the embodiment and the spacer 130' of the comparative example. Since it is difficult to illustrate the state of the sealing material creeping up for each spacer (the occurrence of capillary action), the photograph is used instead of the drawing.

[0048] As shown in Fig. 10 (B-1), in the spacer 130' of the comparative example, noticeable creeping up of the sealing material is observed in the recessed portion of the corner wall portion 130d'. In contrast, as shown in Fig. 10 (A-1), in the spacer 130 of the embodiment, there are no recessed portions in the entire peripheral wall, and creeping up of the sealing material is effectively prevented.

[0049] Also, the area surrounded by the dashed line in (A-2) of Fig. 10 is enlarged and shown in (A-3) of Fig. 10, and the area surrounded by the dashed line in (B-2) of Fig. 10 is enlarged and shown in (B-3) of Fig. 10. From (B-3) of Fig. 10, it can be seen that in the comparative example, the sealing material creeps up the gap between the front wall portion 122a of the housing and the raised floor portion 130g' and comes very close to the bottom end 122d of the slit, and also creeps up into the gap between the front wall portion 122a of the housing and the corner wall portion 130d'.

[0050] In contrast, from (A-3) in Figure 10, it can be seen that in the embodiment, the raised floor portion 130g is located in a position that cannot be seen in the photograph, there is absolutely no creeping of the sealing material near the lower end 122d of the slit, and there is also almost no creeping of the sealing material in the gap between the spacer 130 and the front wall portion 122a of the housing. From a comparison of such verification results, the superiority of the spacer 130 of the embodiment is clear.

[0051] FIG. 11 is a plan view showing modified spacers 230 and 330. As shown in FIG. In the spacer 130 of the embodiment described above, a flat corner wall portion 130d is connected between the front wall portion 130c and the side wall portion 130e, but the shape of the connection point between the front wall portion and the side wall portion is not limited to this, and it is sufficient that the peripheral wall has a shape that does not have a corner portion that is recessed inward (in the direction of the central axis of the tube).

[0052] For example, as in the spacer 230 of the first modification shown in Fig. 11(A), the front wall portion 230c and the side wall portion 230e may be connected by a curved surface. Alternatively, if there are no spatial restrictions around the mounting location of the connector, the front wall portion 330c and the side wall portion 330e may be directly connected as in the spacer 330 of the second modification shown in Fig. 11(B). Spacers of these shapes can also effectively prevent the sealing material from creeping up along the wall surface.

[0053] By mounting the connector 120 on the circuit board 110 via the spacer 130 of the above-described embodiment or the spacers 230 and 330 of the modified examples, the following advantages are obtained.

[0054] (1) The spacer has a cylindrical shape with a bottom and its peripheral wall does not have a corner that is recessed inward (toward the central axis of the cylinder). This prevents the sealing material from creeping up along the outer surface of the peripheral wall when sealing the product with the sealing material.

[0055] (2) An inverted groove is provided at the bottom of the spacer. When the spacer lands on the circuit board, an opening is formed between the inverted groove and the top surface of the circuit board. The inside of the spacer can be seen from this opening. Therefore, when soldering to the connection terminal of the connector passed through the through hole of the circuit board, the condition of the solder can be checked while working, and the quality of the soldering can be maintained.

[0056] (3) When the spacer receives the connector, the front wall of the connector's housing and the high floor of the spacer are close to each other with a small gap between them, but a certain amount of distance is maintained between the lower end level of the slit formed in the front wall of the housing and the upper surface level of the high floor of the spacer, and also between the front wall of the housing and the front wall and corner wall of the spacer (the wall of the spacer that faces the front wall of the housing). Therefore, even if sealing material creeps up from the above-mentioned gap when the product is sealed, the sealing material can be guided into the space above the high floor and kept at a level lower than the lower end of the slit, preventing the sealing material from flowing into the housing from the slit.

[0057] The present invention is not limited to the above-described embodiment and modified examples, and can be implemented in various ways.

[0058] In order to match the shape of the connector 120, which has a substantially rectangular outline in plan view, the spacer 130 of the embodiment and the spacers 230 and 330 of the modified examples are both shaped so that the outline in plan view includes multiple corners, but the peripheral wall does not have any corners recessed inward, but the shape of the spacer can be appropriately changed according to the shape of the connector. For example, the spacer may be shaped so that the outline in plan view is substantially circular or elliptical (having no corners in the outline in plan view).

[0059] In the embodiment of the spacer 130, three legs 130h are provided at approximately equal intervals on the lower side of the raised floor portion 130g, but the number and positions of the legs 130h are not limited to this and can be changed as appropriate. For example, only one leg 130h may be provided at the center in the width direction of the raised floor portion 130g.

[0060] The shape and structure of the spacer 130 interposed between the circuit board 110 and the connector 120 when mounting the two in the current sensor 100 can be applied to various devices other than current sensors having a structure in which the circuit board is sealed with a sealing material.

[0061] In addition, the structures illustrated in the embodiments are merely preferred examples, and it goes without saying that the present invention can be suitably implemented by adding various elements to the basic structure or by substituting parts thereof. [Explanation of symbols]

[0062] 100 Current sensor (device) 102 Case body 110 Circuit Board 120 Connector 122 Housing 122a Front wall (certain wall) 122b Slit 124 Connection terminal 130 Spacer 130a aperture 130b Floor plate part (1st bottom part) 130c Front wall (opposite wall) 130d Corner wall (opposing wall) 130g High floor (second bottom) 130h legs 130k Reverse Groove

Claims

1. A device in which a built-in circuit board is sealed with a sealing material, a connector having a housing and one or more connection terminals fixed to a bottom portion of the housing; a spacer having a cylindrical shape with no recessed corners on a peripheral wall portion and partially closed at a bottom, which receives the connector and supports it with a first bottom portion, and allows the connection terminal to be inserted into an opening surrounded by the first bottom portion and a second bottom portion connected thereto; a circuit board on which the spacer is seated and on which the connector is mounted; An apparatus comprising:

2. 2. The apparatus of claim 1, The connector includes: A slit is formed in a specific wall portion of the housing, the slit being cut downward from an upper end thereof, The spacer is An apparatus characterized in that an opposing wall portion that forms a portion of the peripheral wall portion facing the specific wall portion is connected to the second bottom, the second bottom is close to the specific wall portion, and a distance is secured between the height of the upper surface of the second bottom and the height of the lower end of the slit, and between the specific wall portion and the opposing wall portion.

3. 3. The apparatus according to claim 2, The spacer is The device is characterized in that the second bottom is located at a higher position than the first bottom, and a lower portion of a portion that forms part of the opposing wall and has a height dimension smaller than other portions of the opposing wall is connected to the second bottom.

4. 4. The apparatus according to claim 3, The spacer is A device characterized in that a leg having a height up to the lower surface height of the first bottom is provided at at least one location on the underside of the second bottom.

Images