Wear detection device, wear detection method, substrate cleaning device and substrate cleaning method

Abstract

To detect wear of a substrate cleaning tool or perform substrate cleaning in accordance with the wear of the substrate cleaning tool.SOLUTION: A wear detection device comprises: one or more sensors that output a measured value according to the wear of a substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the sensor; and a determination part that determines whether or not the substrate cleaning tool needs to be replaced, depending on the measured value output by the sensor.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a wear detection device, a wear detection method, a substrate cleaning device, and a substrate cleaning method. [Background technology]

[0002] Various substrate cleaning devices are known (Patent Documents 1 and 2). The substrate cleaning tools used in these substrate cleaning devices clean the substrate by contacting the substrate. Therefore, the substrate cleaning tools wear out when cleaning is performed. When the wear becomes severe, it becomes difficult to properly clean the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2022-124016 [Patent Document 2] JP 2019-87762 A Summary of the Invention [Problem to be solved by the invention]

[0004] It is an object of the present invention to detect wear in a substrate cleaning tool or to perform substrate cleaning in response to wear in the substrate cleaning tool. [Means for solving the problem]

[0005] By way of example, the following solution is provided:

[0006] [1] one or more sensors that provide measurements in response to wear of the substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the sensor; and a determination unit that determines whether or not the substrate cleaning tool needs to be replaced based on a measurement value obtained by the sensor.

[0007] [2] one or more sensors that provide measurements in response to wear of the substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the sensor; a determination unit that determines whether or not cleaning parameters need to be changed when cleaning a substrate using the substrate cleaning tool based on a measurement value obtained by the sensor.

[0008] [3] the one or more sensors are a plurality of sensors; The wear detection device according to [1] or [2], wherein the determination unit makes a determination depending on whether or not measurement values ​​from the multiple sensors satisfy predetermined conditions.

[0009] [4] The substrate cleaning tool has a cleaning surface that comes into contact with the substrate during substrate cleaning, The plurality of sensors include a first sensor pressed to a first position different from the center of the cleaning surface; a second sensor pressed to a second position different from the center of the cleaning surface and different from the first position; and a third sensor pressed against approximately the center of the cleaning surface.

[0010] [5] The wear detection device according to any one of [1] to [4], wherein the judgment unit makes a judgment based on a comparison between a measurement value by the sensor and a predetermined threshold value.

[0011] [6] The wear detection device according to [5], wherein the threshold value is a value corresponding to a measurement value by the sensor when the substrate cleaning tool is pressed against the sensor before the substrate cleaning tool is used for substrate cleaning.

[0012] [7] a plurality of sensors outputting measurements corresponding to wear of the substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the plurality of sensors; According to the measurement values ​​by the plurality of sensors, determining whether the substrate cleaning tool needs to be replaced; and a determination unit that determines whether or not a cleaning parameter needs to be changed when cleaning a substrate using the substrate cleaning tool.

[0013] [8] The determination unit is If the measured values ​​of the sensors satisfy a first condition, it is determined that there is no need to replace the substrate cleaning tool and that there is no need to change the cleaning parameters. If the measured values ​​by the plurality of sensors satisfy a second condition, it is determined that the substrate cleaning tool does not need to be replaced, but the cleaning parameters need to be changed; The wear detection device according to [7], further comprising: determining that the substrate cleaning tool needs to be replaced when the measurement values ​​from the plurality of sensors satisfy a third condition.

[0014] [9] the first condition is that all of the measurement values ​​by the plurality of sensors exceed a threshold value; the second condition is that all of the measurement values ​​by the plurality of sensors are below the threshold value; The wear detection device according to [8], wherein the third condition is that only a portion of the measurement values ​​obtained by the multiple sensors are below the threshold value.

[0015]

[10] The wear detection device described in any of [7] to [9], wherein the judgment unit changes the cleaning parameters in accordance with the measurement values ​​when it is determined that the cleaning parameters need to be changed.

[0016]

[11] The wear detection device described in

[10] , wherein the judgment unit has previously learned the relationship between the measurement value and an appropriate value of the cleaning parameter, and changes the cleaning parameter based on the results of the learning.

[0017]

[12] Cleaning the substrate includes pressing the substrate cleaning tool against the substrate by a predetermined stroke amount; The cleaning parameter is the stroke amount, The wear detection device according to

[10] or

[11] , wherein the determination unit changes the stroke amount so that the pressing force of the substrate cleaning tool against the substrate becomes a target value.

[0018]

[13] The substrate cleaning tool has a cleaning surface that comes into contact with the substrate during substrate cleaning, The plurality of sensors include a first sensor pressed to a first position different from the center of the cleaning surface; a second sensor pressed to a second position different from the center of the cleaning surface and different from the first position; The wear detection device described in any of [7] to

[12] , further comprising a third sensor pressed against approximately the center of the cleaning surface.

[0019]

[14] Cleaning the substrate includes pressing the substrate cleaning tool against the substrate by a predetermined stroke amount; The wear detection device according to any one of [2], [7] to

[13] , wherein the cleaning parameter is the stroke amount.

[0020]

[15] The wear detection device according to any one of [1] to

[14] , wherein the sensor is a pressure sensor or a strain sensor.

[0021]

[16] A substrate cleaning tool; a self-cleaning device for performing self-cleaning of the substrate; [1] to

[14] , and a wear detection device according to any one of the above. A substrate cleaning apparatus, wherein a sensor of the wear detection device is provided at or near the self-cleaning device.

[0022]

[17] the sensor is a pressure sensor; The self-cleaning device has a cleaning plate equipped with a pressure distribution sensor having a plurality of pressure sensors; The substrate cleaning apparatus according to

[16] , wherein the pressing mechanism of the wear detection device presses the substrate cleaning tool against the cleaning plate, thereby causing the substrate cleaning tool to self-clean and measurement by the pressure sensor.

[0023]

[18] A substrate cleaning tool; [1] to

[15] , and a wear detection device according to any one of the above. A substrate cleaning apparatus, wherein the pressing mechanism of the wear detection device presses the substrate cleaning tool against the substrate for substrate cleaning, and presses the substrate cleaning tool against the sensor for determination by the determination unit.

[0024]

[19] A substrate cleaning tool;

[10] to

[12] , and a wear detection device according to any one of the above. A control unit that performs control to press the substrate cleaning tool against the substrate during substrate cleaning in accordance with cleaning parameters changed by a determination unit of the wear detection device.

[0025]

[20] a substrate polishing apparatus for polishing a substrate; A substrate processing apparatus comprising: a substrate cleaning apparatus according to any one of

[16] to

[19] , which cleans a polished substrate.

[0026] [twenty one] a first step of pressing the substrate cleaning tool against one or more sensors that provide a measurement in response to wear of the substrate cleaning tool; and a second step of determining whether or not the substrate cleaning tool needs to be replaced depending on the measurement value by the sensor.

[0027] [twenty two] a first step of pressing the substrate cleaning tool against one or more sensors that provide a measurement in response to wear of the substrate cleaning tool; and a second step of determining whether or not it is necessary to change cleaning parameters when cleaning a substrate using the substrate cleaning tool, based on the measurement value by the sensor.

[0028] [twenty three] a first step of pressing the substrate cleaning tool against a plurality of sensors that output measurements corresponding to wear of the substrate cleaning tool; and a second step of determining whether or not the substrate cleaning tool needs to be replaced and whether or not cleaning parameters need to be changed when cleaning a substrate using the substrate cleaning tool based on the measurement values ​​from the multiple sensors.

[0029] [twenty four] The wear detection method described in

[22] or

[23] , further comprising a third step of changing the cleaning parameters in accordance with the measurement values ​​if it is determined that the cleaning parameters need to be changed.

[0030] [twenty five] A step of carrying out the wear detection method according to

[21] or

[23] ; performing substrate cleaning without replacing the substrate cleaning tool when it is determined in the second step that the substrate cleaning tool does not need to be replaced; If it is determined in the second step that the substrate cleaning tool needs to be replaced, a step of replacing the substrate cleaning tool and cleaning the substrate using a new substrate cleaning tool.

[0031]

[26]

[24] Executing the wear detection method according to the present invention; and pressing the substrate cleaning tool against the substrate to clean the substrate in accordance with the cleaning parameters changed in the third step.

[0032]

[27] a first step of learning a relationship between a measurement value by one or more sensors that outputs a measurement value corresponding to wear of the substrate cleaning tool when the substrate cleaning tool is pressed against the sensor and an appropriate value of a cleaning parameter when cleaning a substrate using the substrate cleaning tool; a second step of pressing the substrate cleaning tool against the one or more sensors; a third step of changing the cleaning parameters in accordance with the measurement values ​​obtained by the sensor in the second step based on the results of the learning in the first step; and a fourth step of cleaning the substrate based on the changed cleaning parameters. Effect of the Invention

[0033] Wear on the substrate cleaning tool can be detected or substrate cleaning can be performed in response to wear on the substrate cleaning tool. [Brief description of the drawings]

[0034] [Figure 1] FIG. 5 is a schematic configuration diagram of a substrate processing apparatus 500. [Diagram 2] FIG. 2 is a schematic perspective view showing an example of a substrate cleaning apparatus 4. [Diagram 3] FIG. 4 is a front view showing a support structure for the roll-type cleaning member 81a. [Figure 4] 4 is a side view showing the movement of the roll cleaning member 81. FIG. [Diagram 5] FIG. 2 is a block diagram showing a schematic configuration of a wear detection device. [Figure 6A] 9A and 9B are diagrams illustrating exemplary arrangements of pressure sensors 91 in a pressure distribution sensor 910. [Figure 6B] 9A and 9B are diagrams showing schematic diagrams of other examples of arrangement of pressure sensors 91 in a pressure distribution sensor 910. [Figure 7] FIG. 9 is a diagram showing a schematic example of an arrangement of a pressure distribution sensor 910. [Figure 8] 6 is a flowchart showing a first example of a determination process by a determination unit 92. [Figure 9] FIG. 11 is a diagram for explaining a second example of the determination process. [Figure 10]10 is a flowchart showing a second example of the determination process by the determination unit 92. [Figure 11] FIG. 11 is a diagram for explaining a third example of the determination process. [Figure 12] 10 is a flowchart showing a third example of the determination process by the determination unit 92. [Figure 13A] FIG. 13 is a diagram showing a schematic example of an arrangement of a pen-shaped cleaning member 81′ when a pressure distribution sensor 910 is used. [Figure 13B] FIG. 13 is a diagram showing a schematic diagram of another example of the arrangement of the pen-shaped cleaning member 81′ when the pressure distribution sensor 910 is used. [Figure 14A] FIG. 13 is a schematic diagram showing an example of arrangement in which a strain sensor 91′ is used and the substrate cleaning tool is a roll cleaning member 81. [Figure 14B] FIG. 13 is a diagram showing a schematic diagram of another example of arrangement in which a strain sensor 91′ is used and the substrate cleaning tool is a roll cleaning member 81. [Figure 15A] FIG. 13 is a diagram showing a schematic arrangement example in which a strain sensor 91' is used and the substrate cleaning tool is a pen-type cleaning member 81'. [Figure 15B] FIG. 13 is a schematic diagram showing another example of arrangement in which a strain sensor 91' is used and the substrate cleaner is a pen-type cleaning member 81'. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawings.

[0036] 1 is a schematic diagram of a substrate processing apparatus 500. The substrate processing apparatus 500 is, for example, a CMP apparatus, and includes a substantially rectangular housing 1 and a load port 2 disposed adjacent to the housing 1.

[0037] A substrate cassette (not shown) for stocking a plurality of substrates W is placed on the load port 2. An example of the substrate W may be a semiconductor wafer. However, the substrate W to be processed is not limited to a semiconductor wafer, and may be other types of substrates used in the manufacture of semiconductor devices, such as a glass substrate or a ceramic substrate. Furthermore, at least one surface of the substrate W has a semiconductor film, a metal film, or the like formed thereon.

[0038] The substrate processing apparatus 500 includes one or more (four in FIG. 1) substrate polishing apparatuses 3a-3d (which may be collectively referred to as "substrate polishing apparatuses 3" when no particular distinction is made), one or more (two in FIG. 1) substrate cleaning apparatuses 4a, 4b (which may be collectively referred to as "substrate cleaning apparatus 4" when no particular distinction is made), and one or more (one in FIG. 1) substrate drying apparatuses 5, which are arranged inside a housing 1.

[0039] As an example, substrate polishing apparatuses 3a-3d are arranged along one longitudinal side of housing 1. Substrate cleaning apparatuses 4a and 4b and substrate drying apparatus 5 are arranged along the other longitudinal side of housing 1.

[0040] The substrate polishing apparatus 3 polishes the surface of the substrate W. More specifically, the substrate polishing apparatus 3 supplies slurry onto the substrate W while rotating the substrate W, and polishes the surface of the substrate W by pressing a polishing member (not shown) against the surface of the substrate W. Polishing debris and slurry may remain on the substrate W after polishing.

[0041] The substrate cleaning apparatus 4 cleans the surface of the substrate W after polishing. More specifically, the substrate cleaning apparatus 4 cleans the surface of the substrate W by pressing a substrate cleaning tool (not shown in FIG. 1) against the surface of the substrate W while rotating the substrate W. The substrate cleaning tool may be contaminated by polishing debris and slurry remaining on the substrate W after polishing. Furthermore, when a chemical solution is supplied onto the substrate W during cleaning, the substrate cleaning tool may be contaminated by the chemical solution.

[0042] For this reason, a device for cleaning the substrate cleaning tool (hereinafter referred to as a "self-cleaning device", and cleaning the substrate cleaning tool may be referred to as "self-cleaning") is provided in substrate cleaning apparatus 4. An example of the configuration of substrate cleaning apparatus 4 will be described later.

[0043] Furthermore, when the substrate cleaning tool is used to clean the substrate, the substrate cleaning tool wears out. When the substrate cleaning tool becomes worn out, it becomes difficult to properly clean the substrate. For this reason, in this embodiment, a wear detection device is provided. The details will be described later.

[0044] The substrate drying apparatus 5 dries the surface of the cleaned substrate W. For example, the substrate drying apparatus 5 is a spin drying apparatus that sprays isopropyl alcohol vapor from a spray nozzle onto the rotating substrate W to dry the substrate W, while rotating the substrate W at high speed to dry the substrate W by centrifugal force.

[0045] Furthermore, substrate processing apparatus 500 is equipped with substrate transfer devices 6a to 6d (which may be collectively referred to as “substrate transfer devices 6” when no particular distinction is required), which are disposed inside housing 1.

[0046] The substrate transport device 6a is disposed adjacent to the load port 2. The substrate transport device 6a receives an unprocessed substrate W from the load port 2 and passes it to the substrate transport device 6b, and receives a processed substrate W from the substrate transport device 6b.

[0047] Substrate transport device 6b extends in the longitudinal direction in the center of housing 1. Substrate transport device 6b receives an unprocessed substrate W from substrate transport device 6a and transports it to one of the substrate polishing devices 3a-3d, receives a polished substrate W from the substrate polishing devices 3a-3d and passes it to substrate transport device 6c, and receives a dried substrate W from substrate transport device 6d and passes it to substrate transport device 6a.

[0048] The substrate transport device 6c is disposed between the substrate cleaning devices 4a and 4b. The substrate transport device 6c receives the polished substrate W from the substrate transport device 6b and transports it to either of the substrate cleaning devices 4a or 4b, and receives the cleaned substrate W from the substrate cleaning device 4a and transports it to the substrate cleaning device 4b.

[0049] The substrate transport device 6d is disposed between the substrate cleaning device 4b and the substrate drying device 5. The substrate transport device 6d receives the cleaned substrate W from the substrate cleaning device 4b and transports it to the substrate drying device 5, and receives the dried substrate W from the substrate drying device 5 and passes it to the substrate transport device 6b.

[0050] The arrangement of the substrate polishing apparatus 3, the substrate cleaning apparatus 4, the substrate drying apparatus 5 and the substrate transport apparatus 6 is merely an example. It is sufficient that one or more substrate transport apparatuses 6 are provided so that the substrate W can be transported through the substrate polishing apparatus 3, the substrate cleaning apparatus 4 and the substrate drying apparatus 5 in this order.

[0051] 2 is a schematic perspective view showing an example of the substrate cleaning apparatus 4. The substrate cleaning apparatus 4 includes a rotation mechanism 80 and a roll cleaning member 81 which is an example of a substrate cleaning tool.

[0052] The rotation mechanism 80 rotates the substrate W in a horizontal plane. More specifically, the rotation mechanism 80 has a number of holding rollers 80a, which hold the outer periphery of the substrate W and rotate it around an axis extending in the vertical direction. The holding rollers 80a are connected to an electric drive unit (not shown) such as a motor and rotate horizontally. The holding rollers 80a are also configured to be movable up and down by an air drive unit such as an air cylinder. The rotation mechanism 80 may also be one that holds and rotates the substrate W in the vertical direction.

[0053] The roll cleaning member 81 has a roll cleaning member 81a that comes into contact with the upper surface W1 (polished surface) of the substrate W, and a roll cleaning member 81b that comes into contact with the lower surface W2 of the substrate W. The roll cleaning members 81a and 81b are connected to an electric drive unit (not shown) such as a motor to rotate. The upper roll cleaning member 81a is configured to be movable up and down by an air drive unit (lifting device 70 described later) such as an air cylinder. The lower roll cleaning member 81b may be similarly configured to be movable up and down, or may be held at a constant height.

[0054] When setting the substrate W, first, the upper roll cleaning member 81a and the holding roller 80a are raised. Next, the raised holding roller 80a holds the substrate W in a horizontal position, and then the holding roller 80a is lowered until the lower surface W2 of the substrate W comes into contact with the lower roll cleaning member 81b. Then, the upper roll cleaning member 81a is lowered to come into contact with the upper surface W1 of the substrate W.

[0055] The roll cleaning member 81 has a cylindrical roll sponge 82 extending horizontally, and a roll shaft 83 supporting the roll sponge 82 from the inside. A plurality of cylindrical protrusions 82b are formed on a peripheral surface 82a of the roll sponge 82. The protrusions 82b are arranged in a row along a rotation axis L1 along which the roll shaft 83 extends. The material of the roll sponge 82 may be a porous PVA sponge, urethane foam, or the like.

[0056] The roll cleaning member 81 may be manufactured and distributed only with the roll sponge 82, and the roll shaft 83 may be inserted when in use, or may be molded and distributed integrally with the roll shaft 83. The roll sponge 82 may be distributed either in a dry state or in a wet state.

[0057] The substrate cleaning device 4 sprays a chemical solution and / or pure water (outer rinse) from a nozzle (not shown) toward the upper surface W1 of the substrate W, and rotates the roll cleaning members 81a, 81b while bringing the peripheral surfaces of the roll cleaning members 81a, 81b into contact with the substrate W, thereby cleaning the substrate W. As the chemical solution, SC1 (ammonia / hydrogen peroxide mixed aqueous solution) or the like can be used. During substrate cleaning, the roll cleaning members 81a, 81b come into contact with the substrate W. Therefore, the roll cleaning members 81a, 81b are worn down by the substrate cleaning.

[0058] Fig. 3 is a front view showing the support structure of the roll-type cleaning member 81a, and Fig. 4 is a side view showing the movement of the roll-type cleaning member 81.

[0059] The substrate cleaning device 4 includes a control device 50, a holder 60 that supports both ends of the roll cleaning member 81 so that it can rotate freely around a rotation axis L1, a lifting device 70 that raises and lowers the holder 60, a horizontal movement device 71 that moves the holder 60 horizontally, and a self-cleaning device 100 (Figure 4).

[0060] The lifting device 70 has a lifting device main body 70a that is lifted by an air drive unit (not shown) such as an air cylinder, and a lifting arm 70b supported by the lifting device main body 70a. The lifting arm 70b extends horizontally from the upper end of the lifting device main body 70a, and supports the holder 60 at its horizontally extending tip. The lifting device 70 lifts and lowers the lifting arm 70b using the lifting device main body 70a, thereby lifting and lowering the holder 60 and the roll cleaning member 81. Note that, in addition to the air cylinder, a cylinder driven by an electric motor, such as a ball screw, a belt, a nut rotation type, or a linear motor, may be used.

[0061] The holder 60 is suspended from a tip 70c of the lifting arm 70b. The holder 60 has a holder body 61 extending horizontally and a pair of roll support parts 62 protruding downward from both ends of the holder body 61 in the extending direction. The pair of roll support parts 62 accommodate bearings (not shown) and support both ends of the roll cleaning member 81 rotatably around a rotation axis L1. The holder 60 is fitted with a rotation device 63 which is an electric drive part such as a motor that is connected to one shaft end of the roll cleaning member 81 and drives the roll cleaning member 81 to rotate.

[0062] 4, the horizontal movement device 71 horizontally moves the roll cleaning member 81 from directly above the substrate W to directly above the self-cleaning device 100. The horizontal movement device 71 is composed of a well-known linear slider or the like.

[0063] The self-cleaning device 100 has a cleaning plate 100a against which the roll cleaning member 81 is pressed. The cleaning plate 100a is formed in a flat shape from, for example, quartz. The material and shape of the cleaning plate 100a may be appropriately changed according to the material and shape of the roll cleaning member 81. For example, polyvinyl chloride (PVC) may be used as the material for forming the cleaning plate 100a.

[0064] The cleaning of the roll-type cleaning member 81 in the self-cleaning device 100 is performed by lowering the lifting device 70 to press the roll-type cleaning member 81 against the cleaning plate 100a. If necessary, the roll-type cleaning member 81a may be rotated when pressing the roll-type cleaning member 81 against the cleaning plate 100a, or a chemical solution may be sprayed toward the roll-type cleaning member 81.

[0065] 4, the lifting device 70 and the horizontal movement device 71 move the roll-type cleaning member 81 to a cleaning position P1 directly above the substrate W, a touchdown position P2 on the substrate W, a standby position P3 directly above the self-cleaning device 100, and a touchdown position P4 on the self-cleaning device 100. The movement of the roll-type cleaning member 81 between the cleaning position P1 and the touchdown position P2 can be achieved by a lowering operation M1 and a lifting operation M2 by the lifting device 70. The movement of the roll-type cleaning member 81 between the cleaning position P1 and the standby position P3 can be achieved by horizontal operations M3 and M6 by the horizontal movement device 71. In addition, the movement of the roll-type cleaning member 81 between the standby position P3 and the touchdown position P4 can be achieved by a lowering operation M4 and a lifting operation M5 by the lifting device 70.

[0066] The operations of the lifting device 70 and the horizontal moving device 71 described above are controlled by the control device 50. The control device 50 is a computer that controls the overall operation of the substrate cleaning device 4. As shown in FIG. 3, the control device 50 is connected to a sensor 72 attached to the holder 60. The sensor 72 in this embodiment is a load cell that measures the pressing load of the roll sponge 82 and performs feedback control to achieve a target pressing force (pressing load, for example, 1 N). The load cell is disposed on a straight line L2 perpendicular to the rotation axis L1 of the roll cleaning member 81, and measures the load of the holder 60 at the tip 70c of the lifting arm 70b. The sensor 72 is not limited to a load cell, and may be an acceleration sensor, an optical sensor that optically detects the rotational shake of the roll cleaning member 81, or a camera, as long as it measures information related to vibration during rotation of the roll cleaning member 81.

[0067] In this embodiment, the lifting device main body 70a presses the roll cleaning member 81 supported by the holder 60 against the substrate W with a predetermined stroke amount. The pressing force of the roll cleaning member 81 against the substrate corresponds to the stroke amount. As an example, the longer the stroke amount of the air cylinder that lifts and lowers the lifting device main body 70a, the stronger the pressing force. This pressing force is detected by a sensor 72 such as a load cell and transmitted to the control device 50.

[0068] One of the features of this embodiment is that a wear detection device that detects wear of the roll cleaning member 81 is provided in the substrate cleaning apparatus 4. The wear detection device may be provided in the substrate cleaning apparatus 4, or may be a device separate from the substrate cleaning apparatus 4. The wear detection device will be described in detail below.

[0069] 5 is a block diagram showing a schematic configuration of the wear detection device. The wear detection device includes a pressing mechanism 90, one or more pressure sensors 91, and a determination unit 92.

[0070] The pressing mechanism 90 presses the roll-type cleaning member 81 against the pressure sensor 91. The pressing mechanism 90 may be the lifting device 70 shown in Figures 3 and 4. According to this configuration, the lifting device 70 serving as the pressing mechanism 90 presses the roll-type cleaning member 81 against the substrate W when cleaning the substrate W, and presses the roll-type cleaning member 81 against the pressure sensor 91 when wear is detected.

[0071] When the roll-type cleaning member 81 is pressed, the pressure sensor 91 outputs a pressure corresponding to the wear of the roll-type cleaning member 81. The pressure sensor 91 is connected to the determination unit 92 by wire or wirelessly, and the output measurement value (pressure) is transmitted to the determination unit 92. Even if the pressing force by the pressing mechanism 90 is constant, the greater the amount of wear of the roll-type cleaning member 81, the smaller the output pressure becomes.

[0072] As a specific configuration example, a pressure distribution sensor 910 provided with a plurality of pressure sensors 91 can be used.

[0073] 6A is a diagram showing a schematic arrangement example of pressure sensors 91 in a pressure distribution sensor 910. The pressure distribution sensor 910 in the figure is rectangular. The pressure distribution sensor 910 preferably has a pressure sensor 91a pressed against approximately the center of the cleaning surface (the surface that comes into contact with the substrate W during cleaning) of the roll cleaning member 81, and two pressure sensors 91b and 91c pressed against at least two positions different from the center.

[0074] 6B is a diagram showing a schematic diagram of another example of the arrangement of the pressure sensors 91 in the pressure distribution sensor 910. The pressure distribution sensor 910 in the figure is circular. The pressure distribution sensor 910 preferably has a pressure sensor 91a pressed against the center of the roll cleaning member 81, and two pressure sensors 91b and 91c pressed against at least two positions different from the center.

[0075] Furthermore, the pressure sensor 91 may be disposed anywhere, but is preferably disposed in or near the self-cleaning device 100. This allows the time required to move the roll-type cleaning member 81 to be shortened.

[0076] 7, a pressure distribution sensor 910 having a plurality of pressure sensors 91 is mounted on the cleaning plate 100a of the self-cleaning device 100. With this configuration, the lifting device 70 serving as the pressing mechanism 90 presses the roll-shaped cleaning member 81 against the cleaning plate 100a, thereby performing self-cleaning of the roll-shaped cleaning member 81 and also performing measurement by the pressure sensor 91, thereby improving efficiency.

[0077] 5, the determination unit 92 performs a predetermined determination (described later) according to the measurement value by the pressure sensor 91. The determination unit 92 may be located within the control device 50. Furthermore, at least a part of the functions of the determination unit 92 may be realized by a processor executing a predetermined program.

[0078] 8 is a flowchart showing a first example of the determination process by the determination unit 92. This determination process is for determining, based on the value measured by the pressure sensor 91, whether or not the roll cleaning member 81 needs to be replaced.

[0079] First, for an unused roll-type cleaning member 81, the pressing mechanism 90 presses the roll-type cleaning member 81 against the pressure sensor 91 with a predetermined pressing force. Then, the determination unit 92 acquires the pressure value measured by the pressure sensor 91 (step S1). This pressure is set as an initial value.

[0080] Then, the determination unit 92 sets a threshold value based on the initial value (step S2). As an example, the threshold value may be a value obtained by subtracting a predetermined value from the initial value, or may be a value obtained by multiplying the initial value by a coefficient smaller than 1. In either case, the threshold value is smaller than the initial value.

[0081] After the start of use of the roll-type cleaning member 81, the pressing mechanism 90 presses the roll-type cleaning member 81 against the pressure sensor 91 with a predetermined pressing force. Then, the determination unit 92 acquires the pressure value measured by the pressure sensor 91 (step S3).

[0082] If the measured pressure value satisfies a predetermined replacement condition (YES in step S4), the determination unit 92 determines that the roll-type cleaning member 81 needs to be replaced (step S5). If necessary, the determination unit 92 may issue an alert. In this case, the roll-type cleaning member 81 is replaced, and the substrate is cleaned using the new roll-type cleaning member 81.

[0083] The above-mentioned replacement condition is, for example, that the pressure value measured in step S3 falls below the threshold value set in step S2. This is because when wear is severe, the measured pressure becomes small even if the pressing force by the pressing mechanism 90 is constant. When there are multiple pressure sensors 91, the determination unit 92 may make a determination based on the distribution of the multiple measured pressure values. As a specific example, the replacement condition may be that all of the multiple measured pressure values ​​fall below the threshold value, that only some of the pressure values ​​fall below the threshold value, or that at least some of the pressure values ​​fall below the threshold value.

[0084] If the measured pressure value does not satisfy the replacement condition (NO in step S4), the determination unit 92 determines that there is no need to replace the roll-type cleaning member 81 (step S7). In this case, the roll-type cleaning member 81 is not replaced, and the same roll-type cleaning member 81 continues to be used to clean substrates. Until it is determined that replacement is necessary, pressure measurement (step S3) and determination as to whether the replacement condition is satisfied (step S4) are repeated. The pressure measurement and determination may be performed at predetermined intervals (for example, one week) or every time a predetermined number of substrates are cleaned.

[0085] By the above-described determination process, the replacement time of the roll cleaning member 81 can be appropriately determined.

[0086] Next, a description will be given of a second example of the determination process by the determination unit 92. This determination process determines whether or not it is necessary to change the cleaning parameters when cleaning a substrate using the roll cleaning member 81, based on the measurement value by the pressure sensor 91, and changes the cleaning parameters as necessary.

[0087] The cleaning parameters are parameters that affect the pressing force F of the roll cleaning member 81 against the substrate W during substrate cleaning. It can be said that the pressing force F is determined with the cleaning parameters as one of the factors. In the following, the cleaning parameter is defined as the stroke amount L when the roll cleaning member 81 is pressed against the substrate W during substrate cleaning. The control device 50 raises and lowers the lifting device main body 70a in accordance with this stroke amount L. Then, a pressing force F according to the stroke amount L is generated.

[0088] 9 is a diagram illustrating a second example of the determination process. The horizontal axis indicates the passage of time, which corresponds to the wear of the roll-type cleaning member 81.

[0089] 9(a) shows a schematic diagram of the pressure value P measured by the pressure sensor 91 when the pressing mechanism 90 presses the roll cleaning member 81 against the pressure sensor 91 with a predetermined pressing force at each time t. As time passes, in other words, as the roll cleaning member 81 wears, the measured pressure value P decreases.

[0090] The vertical axis in FIG. 9(b) schematically shows the stroke amount L at each time t. The dashed line in the figure is an example where the stroke amount L remains unchanged from the initial value L0, and the solid line indicates that the stroke amount L is changed by this determination process.

[0091] The vertical axis in FIG. 9(c) schematically shows the pressing force F of the roll cleaning member 81 against the substrate W at each time t. The dashed line in the figure is the pressing force F when the stroke amount L remains unchanged from the initial value L0, and the solid line is the pressing force F when the stroke amount L is changed by this determination process.

[0092] A predetermined target value F0 (for example, 1 N) is set for the pressing force F of the roll cleaning member 81 against the substrate W. When the wear of the roll cleaning member 81 is small (t < t1), the pressing force becomes the target value F0 when the stroke amount L is the initial value L0. However, when the wear of the roll cleaning member 81 progresses (t1 < t), if the stroke amount L remains at the initial value L0, the pressing force F becomes weaker than the target value F0 (the dashed lines in FIGS. 9(b) and (c)). Therefore, in this determination process, the stroke amount L is changed to become longer according to the wear of the roll cleaning member 81. Thereby, even if the roll cleaning member 81 wears, the pressing force F can be maintained at the target value F0.

[0093] FIG. 10 is a flowchart showing a second example of the determination process by the determination unit 92. Since steps S11 to S13 are the same as steps S1 to S3 in FIG. 8 respectively, the description is omitted.

[0094] When the pressure value P measured in step S13 satisfies a predetermined parameter change condition (YES in step S14), the determination unit 92 determines that it is necessary to change the stroke amount L (step S15).

[0095] The parameter change condition is, for example, that the measured pressure value P falls below the threshold value Pth set in step S12. This is because when wear is severe, the measured pressure becomes small even if the pressing force by the pressing mechanism 90 is constant. When there are multiple pressure sensors 91, the determination unit 92 may make a determination based on the distribution of the multiple measured pressure values. As a specific example, the parameter change condition may be that all of the multiple measured pressure values ​​fall below the threshold value, that only some of the pressure values ​​fall below the threshold value, or that at least some of the pressure values ​​fall below the threshold value.

[0096] If it is determined that the stroke amount L needs to be changed, the determination unit 92 determines whether or not the stroke amount L can be changed based on the pressure value P (step S16). This is because if the wear is severe, appropriate cleaning cannot be performed even if the stroke amount L is changed. This determination may be made, for example, based on whether or not the pressure value P is below another threshold value that is smaller than the threshold value Pth set in step S12.

[0097] If it is determined that the stroke amount L needs to be changed and can be changed (YES in step S16), the determination unit 92 changes the stroke amount L in accordance with the pressure value P0 (step S17). There is no particular limitation on the method of change.

[0098] For example, a relationship between the measured pressure value P and the stroke amount L at which the pressing force F reaches the target value F0 may be set in advance, and the determination unit 92 may change the stroke amount L based on this relationship. This relationship may be in the form of a table, for example, or may be expressed by a mathematical formula.

[0099] Alternatively, the relationship between the measured pressure value P and the stroke amount L at which the pressing force F becomes the target value F0 may be learned in advance (for example, by machine learning), and the determination unit 92 may change the stroke amount L based on the learning result.

[0100] In either case, during substrate cleaning, the determination unit 92 changes the stroke amount L so that the pressing force of the roll cleaning member 81 against the substrate W becomes the target value F0.

[0101] Such advance setting or learning can be performed in advance by adjusting the stroke amount L so that the pressing force detected by the sensor 72 (load cell) in FIG. 3 for the roll cleaning member 81 when the measured pressure value is P becomes the target value F0.

[0102] Thereafter, during substrate cleaning, the control device 50 controls the lifting device 70 in accordance with the changed stroke amount L to press the roll cleaning member 81 against the substrate W. By appropriately changing the stroke amount L in accordance with wear of the roll cleaning member 81, the pressing force F can be maintained at the target value F0 even if the roll cleaning member 81 is worn.

[0103] On the other hand, if the measured pressure value P does not satisfy the parameter change condition (NO in step S14), the determination unit 92 determines that there is no need to change the stroke amount L (step S18). In this case, the control device 50 controls the lifting device 70 to press the roll cleaning member 81 against the substrate W according to the unchanged stroke amount L. Pressure measurement (step S13) and determination (step S14) are repeated until it is determined that a change is necessary. The pressure measurement and determination may be performed at predetermined intervals (for example, one week) or every time a predetermined number of substrates are cleaned.

[0104] By the above-described determination process, cleaning parameters such as the stroke amount L can be appropriately adjusted, and even if the roll cleaning member 81 is worn, the substrate can be cleaned with a constant pressing force.

[0105] Next, a description will be given of a third example of the determination process by the determination unit 92. This determination process is for determining whether or not the cleaning parameters need to be changed and whether or not the roll-type cleaning member 81 needs to be replaced, based on the measurement value by the pressure sensor 91.

[0106] 11 is a diagram for explaining a third example of the determination process. This determination process is intended to use a plurality of pressure sensors 91 (hereinafter, referred to as pressure sensors 91a to 91c shown in FIG. 6A or 6B). The horizontal axis of FIG. 11(a) to (c) represents the pressure sensors 91a to 91c, and the vertical axis represents each pressure value P measured by the pressure sensors 91a to 91c.

[0107] 11(a), when the pressing mechanism 90 presses the roll-type cleaning member 81 against the pressure sensors 91a-91c with a predetermined pressing force, the measured pressure values ​​P are all approximately the initial value and higher than the threshold value Pth. With such a pressure distribution, there is no need to replace the roll-type cleaning member 81 or change the cleaning parameters.

[0108] If the roll-type cleaning member 81 is worn overall (for example, if the central portion corresponding to the pressure sensor 91a and the portions other than the center corresponding to the pressure sensors 91b and 91c are worn almost evenly), when the pressing mechanism 90 presses the roll-type cleaning member 81 against the pressure sensors 91a to 91c with a predetermined pressing force, all of the measured pressure values ​​P will be lower than the threshold value Pth, as shown in Fig. 11(b). With such a pressure distribution, it is only necessary to change the cleaning parameters to adjust the pressing force during cleaning, and there is no need to replace the roll-type cleaning member 81.

[0109] If the roll-type cleaning member 81 is partially worn (for example, the central portion corresponding to the pressure sensor 91a is significantly worn, but the portions other than the center corresponding to the pressure sensors 91b and 91c are not so worn), when the pressing mechanism 90 presses the roll-type cleaning member 81 against the pressure sensors 91a to 91c with a predetermined pressing force, only a portion of the measured pressure value P becomes lower than the threshold value Pth, as shown in FIG. 11(c). With such a pressure distribution, it is difficult to change the cleaning parameters to adjust only a portion of the pressing force during cleaning. Therefore, in such a case, it is determined that the roll-type cleaning member 81 needs to be replaced.

[0110] Fig. 12 is a flowchart showing a third example of the determination process by the determination unit 92. Steps S21 to S23 are the same as steps S1 to S3 in Fig. 8, respectively, and therefore will not be described.

[0111] If the pressure value P measured in step S23 satisfies a predetermined continuation condition (YES in step S24), the determination unit 92 determines that it is not necessary to replace the roll cleaning member 81 and that it is also not necessary to change the stroke amount L (step S25). This continuation condition is that all of the measured pressure values ​​P exceed the threshold value Pth, as shown in FIG. 11(a), for example. In this case, the roll cleaning member 81 is not replaced, and the same roll cleaning member 81 continues to be used to perform substrate cleaning. Furthermore, substrate cleaning is performed according to the unchanged stroke amount L.

[0112] On the other hand, if the measured pressure values ​​P do not satisfy the continuation condition (NO in step S24) and also satisfy the predetermined parameter change condition (YES in step S26), the determination unit 92 determines that it is not necessary to replace the roll cleaning member 81, but that it is necessary to change the stroke amount L (step S27). This parameter change condition is that all of the measured pressure values ​​P are lower than the threshold value Pth, for example, as shown in Fig. 11(b).

[0113] If it is determined that the stroke amount L needs to be changed, the determination unit 92 determines whether the stroke amount L can be changed according to the pressure value P (step S28). If it is determined that the stroke amount L needs to be changed and can be changed (YES in step S28), the determination unit 92 changes the stroke amount L according to the pressure value P0 (step S29). Then, the substrate is cleaned according to the changed stroke amount L. There is no particular restriction on the method of change. Steps S28 and S29 may be the same as steps S16 and S17 in FIG. 10.

[0114] If the parameter change condition is met (YES in step S26) but cannot be changed (NO in step S28), the determination unit 92 determines that the roll cleaning member 81 needs to be replaced (step S29). This is because the roll cleaning member 81 is severely worn and cannot perform proper cleaning even if the stroke amount L is changed. In this case, the roll cleaning member 81 is replaced, and the substrate is cleaned using the new roll cleaning member 81.

[0115] Furthermore, if the continuation condition is not satisfied (NO in step S24) but the parameter change condition is also not satisfied, the determination unit 92 determines that the roll cleaning member 81 needs to be replaced (step S29). In this case as well, the roll cleaning member 81 is replaced, and substrate cleaning is performed using the new roll cleaning member 81. A case in which neither the continuation condition nor the parameter change condition is satisfied occurs when only a part of the measured pressure value falls below the threshold value Pth, as shown in FIG. 11(c), for example.

[0116] In summary, when the distribution of pressure values ​​P measured by the multiple pressure sensors 91 satisfies a certain condition, the determination unit 92 determines that there is no need to replace the roll cleaning member 81 or change the stroke amount L. This condition is, for example, that all of the pressure values ​​P measured by the multiple pressure sensors 91 exceed the threshold value Pth.

[0117] Furthermore, when the distribution of the pressure values ​​P measured by the multiple pressure sensors 91 satisfies a certain condition, the determination unit 92 determines that it is not necessary to replace the roll cleaning member 81, but it is necessary to change the stroke amount L. This condition is, for example, that all of the pressure values ​​P measured by the multiple pressure sensors 91 are below the threshold value Pth.

[0118] Furthermore, the determination unit 92 determines that it is necessary to replace the roll cleaning member 81 when the distribution of the pressure values ​​P measured by the multiple pressure sensors 91 satisfies a certain condition. This condition is, for example, that only some of the pressure values ​​P measured by the multiple pressure sensors 91 are below the threshold value Pth.

[0119] By the above-described determination process, when the roll-type cleaning member 81 is worn, it can be appropriately determined whether the roll-type cleaning member 81 should be replaced or whether a cleaning parameter such as the stroke amount L should be adjusted without replacing the roll-type cleaning member 81.

[0120] In the above embodiment, the roll cleaning member 81 having a cylindrical shape extending in the horizontal direction is exemplified as the substrate cleaning tool, but the substrate cleaning tool may be a pen-type cleaning member having a cylindrical shape extending in the vertical direction. An example of the arrangement of the pen-type cleaning member 81' when the pressure distribution sensor 910 is used is shown in Figures 13A and 13B.

[0121] Moreover, a strain sensor 91' may be used instead of the pressure sensor 91. Even if the pressing force by the pressing mechanism 90 is constant, the greater the amount of wear of the roll-type cleaning member 81, the smaller the strain that is output. Therefore, the pressure sensor 91 can be replaced with a strain sensor 91'.

[0122] 14A and 14B show an example of arrangement when the strain sensor 91' is used and the substrate cleaning tool is a roll cleaning member 81. Also, Fig. 15A and 15B show an example of arrangement when the strain sensor 91' is used and the substrate cleaning tool is a pen-type cleaning member 81'.

[0123] In either arrangement, it is preferable to provide the sensors 91, 91' such that the sensor 91, 91' is pressed substantially at the center of the cleaning surface of the substrate cleaning tool, and two pressure sensors 91, 91' are pressed respectively at at least two positions different from the center.

[0124] In addition to the pressure sensor 91 and the strain sensor 91', other sensors that output measurement values ​​corresponding to the wear of the substrate cleaning tool may be used.

[0125] Any part or all of the functional units described in this specification may be realized by a program. The program mentioned in this specification may be distributed in a non-temporary manner recorded on a computer-readable recording medium, or may be distributed via a communication line (including wireless communication) such as the Internet, or may be distributed in a state in which it is installed on any terminal.

[0126] Based on the above description, a person skilled in the art may be able to conceive additional effects and various modifications of the present invention, but the aspects of the present invention are not limited to the individual embodiments described above. Various additions, modifications, and partial deletions are possible within the scope of the conceptual idea and intent of the present invention derived from the contents defined in the claims and their equivalents.

[0127] For example, what is described in this specification as one device (or member, the same applies below) (including what is depicted in the drawings as one device) may be realized by multiple devices. Conversely, what is described in this specification as multiple devices (including what is depicted in the drawings as multiple devices) may be realized by one device. Alternatively, some or all of the means or functions included in one device may be included in another device.

[0128] Furthermore, not all of the features described in this specification are essential requirements, and in particular, features described in this specification but not included in the claims may be considered optional additional features.

[0129] It should be noted that the applicant is merely aware of the inventions disclosed in the documents in the "Prior Art Documents" column of this specification, and the present invention does not necessarily aim to solve the problems of the inventions disclosed in the documents. The problems that the present invention aims to solve should be identified by taking into consideration the entire specification. For example, if the specification states that a specific configuration provides a specific effect, it can also be said that the present invention solves a problem that is the reverse of the specific effect. However, it is not necessarily intended that such a specific configuration be a required requirement. [Explanation of symbols]

[0130] 500 Substrate Processing Equipment 1. Housing 2 Loading port 3,3a~3d Substrate polishing equipment 4, 4a, 4b Substrate cleaning equipment 5 Substrate drying equipment 6, 6a to 6d Substrate transport device 50 Control device 60 Holder 61 Holder body 62 Roll support part 70 Lifting device 70a Lifting device body 70b Lifting arm 71 Horizontal movement device 80 Rotation mechanism 80a Holding roller 81, 81a, 81b Roll cleaning member 81' Pen-type cleaning material 82 Roll Sponge 83 Roll shaft 90 Pressing mechanism 91,91a~91c Pressure sensors 91' Strain Sensor 910 Pressure distribution sensor 92 Judgment section 100 Self-cleaning device 100a Washing plate

Claims

1. one or more sensors that provide measurements in response to wear of the substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the sensor; and a determination unit that determines whether or not the substrate cleaning tool needs to be replaced based on a measurement value obtained by the sensor.

2. one or more sensors that provide measurements in response to wear of the substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the sensor; a determination unit that determines whether or not cleaning parameters need to be changed when cleaning a substrate using the substrate cleaning tool based on a measurement value obtained by the sensor.

3. the one or more sensors are a plurality of sensors; The wear detection device according to claim 1 , wherein the determination unit makes a determination depending on whether or not the measurement values ​​obtained by the plurality of sensors satisfy a predetermined condition.

4. The substrate cleaning tool has a cleaning surface that comes into contact with the substrate during substrate cleaning, The plurality of sensors include a first sensor that is pressed to a first position different from the center of the cleaning surface; a second sensor that is pressed to a second position different from the center of the cleaning surface and different from the first position; and a third sensor pressed against approximately the center of the cleaning surface.

5. The wear detection device according to claim 1 , wherein the determination unit makes a determination based on a comparison between a value measured by the sensor and a predetermined threshold value.

6. The wear detection device according to claim 5 , wherein the threshold value is a value corresponding to a measurement value by the sensor when the substrate cleaning tool is pressed against the sensor before the substrate cleaning tool is used for cleaning a substrate.

7. a plurality of sensors outputting measurements corresponding to wear of the substrate cleaning tool; a pressing mechanism that presses the substrate cleaning tool against the plurality of sensors; According to the measurement values ​​by the plurality of sensors, determining whether the substrate cleaning tool needs to be replaced; and a determination unit that determines whether or not a cleaning parameter needs to be changed when cleaning a substrate using the substrate cleaning tool.

8. The determination unit is If the measured values ​​of the sensors satisfy a first condition, it is determined that there is no need to replace the substrate cleaning tool and that there is no need to change the cleaning parameters; If the measured values ​​of the sensors satisfy a second condition, it is determined that the substrate cleaning tool does not need to be replaced, but the cleaning parameters need to be changed; The wear detection device according to claim 7 , further comprising: determining that the substrate cleaning tool needs to be replaced when the measured values ​​by the plurality of sensors satisfy a third condition.

9. the first condition is that all of the measurement values ​​by the plurality of sensors exceed a threshold value; the second condition is that all of the measurement values ​​by the plurality of sensors are below the threshold value; The wear detection device according to claim 8 , wherein the third condition is that only some of the measurement values ​​obtained by the plurality of sensors are below the threshold value.

10. The wear detection device according to claim 7 or 8, wherein the determination unit changes the cleaning parameters in response to the measurement values ​​when it is determined that the cleaning parameters need to be changed.

11. The wear detection device according to claim 10 , wherein the determination unit learns in advance a relationship between the measurement value and an appropriate value of the cleaning parameter, and changes the cleaning parameter based on a result of the learning.

12. Cleaning the substrate includes pressing the substrate cleaning tool against the substrate by a predetermined stroke amount; The cleaning parameter is the stroke amount, The wear detection device according to claim 10 , wherein the determination unit changes the stroke amount so that a pressing force of the substrate cleaning tool against the substrate becomes a target value.

13. The substrate cleaning tool has a cleaning surface that comes into contact with the substrate during substrate cleaning, The plurality of sensors include a first sensor that is pressed to a first position different from the center of the cleaning surface; a second sensor that is pressed to a second position different from the center of the cleaning surface and different from the first position; and a third sensor pressed against approximately the center of the cleaning surface.

14. Cleaning the substrate includes pressing the substrate cleaning tool against the substrate by a predetermined stroke amount; The wear detection device according to claim 2 or 7, wherein the cleaning parameter is the stroke amount.

15. 8. The wear detection device according to claim 1, 2 or 7, wherein the sensor is a pressure sensor or a strain sensor.

16. A substrate cleaning tool; a self-cleaning device for performing self-cleaning of the substrate; The wear detection device according to claim 1, 2 or 7, A substrate cleaning apparatus, wherein a sensor of the wear detection device is provided at or near the self-cleaning device.

17. the sensor is a pressure sensor; The self-cleaning device has a cleaning plate equipped with a pressure distribution sensor having a plurality of pressure sensors; The substrate cleaning apparatus of claim 16 , wherein a pressing mechanism of the wear detection device presses the substrate cleaning tool against the cleaning plate, thereby causing the substrate cleaning tool to self-clean and measurement by the pressure sensor.

18. A substrate cleaning tool; The wear detection device according to claim 1, 2 or 7, A substrate cleaning apparatus, wherein the pressing mechanism of the wear detection device presses the substrate cleaning tool against the substrate for substrate cleaning, and presses the substrate cleaning tool against the sensor for determination by the determination unit.

19. A substrate cleaning tool; A wear detection device according to claim 10; A control unit that performs control to press the substrate cleaning tool against the substrate during substrate cleaning in accordance with cleaning parameters changed by a determination unit of the wear detection device.

20. a substrate polishing apparatus for polishing a substrate; A substrate processing apparatus comprising: the substrate cleaning apparatus according to claim 16 for cleaning a substrate after polishing.

21. a first step of pressing the substrate cleaning tool against one or more sensors that provide a measurement in response to wear of the substrate cleaning tool; and a second step of determining whether or not the substrate cleaning tool needs to be replaced depending on the measurement value by the sensor.

22. a first step of pressing the substrate cleaning tool against one or more sensors that provide a measurement in response to wear of the substrate cleaning tool; and a second step of determining whether or not it is necessary to change cleaning parameters when cleaning a substrate using the substrate cleaning tool, based on the measurement value by the sensor.

23. a first step of pressing the substrate cleaning tool against a plurality of sensors that output measurements corresponding to wear of the substrate cleaning tool; and a second step of determining whether or not the substrate cleaning tool needs to be replaced and whether or not cleaning parameters need to be changed when cleaning a substrate using the substrate cleaning tool based on the measurement values ​​from the multiple sensors.

24. The wear detection method according to claim 22 or 23, further comprising a third step of changing the cleaning parameters in response to the measurement values ​​if it is determined that the cleaning parameters need to be changed.

25. carrying out the wear detection method according to claim 21 or 23; performing substrate cleaning without replacing the substrate cleaning tool when it is determined in the second step that the substrate cleaning tool does not need to be replaced; If it is determined in the second step that the substrate cleaning tool needs to be replaced, a step of replacing the substrate cleaning tool and cleaning the substrate using a new substrate cleaning tool.

26. carrying out the wear detection method of claim 24; and pressing the substrate cleaning tool against the substrate to clean the substrate in accordance with the cleaning parameters changed in the third step.

27. a first step of learning a relationship between a measurement value by one or more sensors that outputs a measurement value corresponding to wear of the substrate cleaning tool when the substrate cleaning tool is pressed against the sensor and an appropriate value of a cleaning parameter when cleaning a substrate using the substrate cleaning tool; a second step of pressing the substrate cleaning tool against the one or more sensors; a third step of changing the cleaning parameters in accordance with the measurement values ​​obtained by the sensor in the second step based on the results of the learning in the first step; and a fourth step of cleaning the substrate based on the changed cleaning parameters.

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