Multilayer electronic component

Abstract

To provide a multilayer electronic component having excellent durability against heat or mechanical deformation generated by a substrate.SOLUTION: A multilayer electronic component is provided, the multilayer electronic component including: a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; an external electrode disposed externally on the body; and a frame terminal including a connection portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction, intersecting the first direction, and a linking portion connecting the connection portion and the mounting portion. The linking portion includes an inward portion extending inwardly from one end of the connection portion in the second direction and an outward portion extending outwardly from one end of the inward portion in the second direction. When an angle formed by the inward portion and the outward portion is defined as θ, the angle θ satisfies 10°≤θ≤150°.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-Layered Ceramic Capacitor (MLCC), a type of multi-layered electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small yet high capacity and easy to mount, and can be used as components of various electronic devices. In recent years, the rapid rise of environmentally friendly automobiles and electric automobiles has led to an increase in the number of electric drive systems in automobiles, and thus, the demand for multilayer ceramic capacitors required for electric drive systems in automobiles has also increased.

[0004] As the environment in which multilayer ceramic capacitors are used becomes more severe, cracks are more likely to occur due to vibrations and mechanical deformation of the mounting board. Conventional multilayer ceramic capacitors are mounted on a board in such a way that the body of the multilayer ceramic capacitor and the board are in direct contact with each other through the solder, and heat and mechanical deformation generated in the board and adjacent parts are directly transferred to the multilayer ceramic capacitor, making it difficult to ensure a high level of reliability.

[0005] As a result, a method has recently been proposed in which a metal frame is bonded to the side of the multilayer ceramic capacitor to ensure a gap between the multilayer ceramic capacitor and the mounting board, thereby preventing thermal and mechanical stress from the board from being directly transmitted to the multilayer ceramic capacitor.

[0006] However, further research is needed to develop a multilayer ceramic capacitor that has good durability such as warp strength, equivalent series resistance (ESR), and acoustic noise within a limited mounting area. Summary of the Invention [Problem to be solved by the invention]

[0007] One of the various objects of the present invention is to provide a multilayer electronic component that is highly durable against heat and mechanical deformation generated in the substrate.

[0008] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] According to one embodiment of the present invention, there is provided a multilayer electronic component comprising: a main body including dielectric layers and internal electrodes arranged alternately with the dielectric layers; external electrodes arranged outside the main body; and a frame terminal including a connection portion arranged on the external electrodes and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction intersecting the first direction, and a connecting portion connecting the connection portion and the mounting portion, wherein the connecting portion includes an inward portion extending inward in the second direction from one end of the connection portion and an outward portion extending outward in the second direction from one end of the inward portion, and when an angle formed between the inward portion and the outward portion is θ, θ satisfies 10°≦θ≦150°.

[0010] Another embodiment of the present invention provides a multilayer electronic component including a main body including dielectric layers and internal electrodes arranged alternately with the dielectric layers, an external electrode arranged outside the main body, and a frame terminal including a connection portion arranged on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction intersecting the first direction, and a connecting portion connecting the connection portion and the mounting portion, wherein the connecting portion includes an inner protrusion protruding inward in the second direction, and an outer protrusion connected to the inner protrusion and protruding outward in the second direction. Effect of the Invention

[0011] One of the various effects of the present invention is that it can provide a multilayer electronic component that is excellent in durability against heat and mechanical deformation generated in the substrate. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a schematic configuration of a multilayer electronic component according to a first embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view showing a schematic configuration of the multilayer capacitor shown in FIG. [Diagram 3] FIG. 3 is an exploded perspective view showing a schematic exploded view of the main body of FIG. 2. [Figure 4] 2 is a cross-sectional view that shows a schematic cross section taken along line II' in FIG. 1. [Diagram 5] FIG. 5 is an enlarged view of a region K1 in FIG. [Figure 6] FIG. 5 is a cross-sectional view showing a schematic configuration of a multilayer electronic component according to a second embodiment of the present invention, which is a modification of FIG. [Figure 7] FIG. 7 is an enlarged view of region K2 in FIG. [Figure 8] FIG. 11 is a perspective view showing a schematic configuration of a multilayer electronic component according to a third embodiment of the present invention. [Figure 9] 9 is a cross-sectional view that shows a schematic cross section taken along line II-II' in FIG. 8. [Figure 10] FIG. 10 is a cross-sectional view showing a schematic configuration of a multilayer electronic component according to a fourth embodiment of the present invention, which is a modification of FIG. 9. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0014] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0015] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0016] (First embodiment) FIG. 1 is a perspective view showing a multilayer electronic component according to a first embodiment of the present invention, FIG. 2 is a perspective view showing a multilayer capacitor of FIG. 1, FIG. 3 is an exploded perspective view showing a main body of FIG. 2, FIG. 4 is a cross-sectional view showing a cross-section along line II' of FIG. 1, and FIG. 5 is an enlarged view of area K1 of FIG. 4.

[0017] 1 to 5, a multilayer electronic component 1000 according to a first embodiment of the present invention may include a multilayer capacitor 100 and frame terminals 310, 320. The multilayer capacitor 100 may include a body 110 and external electrodes 131, 132 disposed outside the body 110.

[0018] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process and grinding of the edges, the body 110 may not be a hexahedral shape with perfectly straight lines, but may have a substantially hexahedral shape.

[0019] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the fourth surface 1, the fourth surface 2, the fifth surface 3 and the sixth surface 4 and facing each other in a third direction.

[0020] The body 110 may include dielectric layers 111 and internal electrodes 121, 122 alternately arranged with the dielectric layers 111. The plurality of dielectric layers 111 forming the body 110 are in a sintered state, and the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to see without using a scanning electron microscope (SEM).

[0021] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. As examples of the ceramic powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. can be mentioned.

[0022] The average thickness of the dielectric layer 111 does not particularly need to be limited, but at least one average thickness of the dielectric layer 111 may be 0.1 μm or more and 10 μm or less. Also, the average thickness of the dielectric layer 111 can be arbitrarily set according to desired characteristics and applications. For example, in the case of electronic components for high-voltage electric fields, at least one average thickness of the dielectric layer 111 can be 0.5 μm or more, and in order to realize the capacitance of multilayer electronic components, at least one average thickness of the dielectric layer 111 can be less than 2.8 μm.

[0023] The internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111. For example, a first internal electrode 121 and a second internal electrode 122, which are a pair of electrodes having different polarities from each other, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0024] The first internal electrode 121 may be disposed to be spaced apart from the fourth surface 4 and connected to the first external electrode 131 on the third surface 3 side. Also, the second internal electrode 122 may be disposed to be spaced apart from the third surface 3 and connected to the second external electrode 132 on the fourth surface 4 side.

[0025] The conductive metal contained in the internal electrodes 121, 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and the internal electrodes 121, 122 may contain, for example, Ni as a main component, but the present invention is not limited thereto.

[0026] The internal electrodes 121 and 122 may be formed by applying a conductive paste for internal electrodes, which contains a conductive metal, to a ceramic green sheet to a predetermined thickness and then firing the sheet. The method for printing the conductive paste for internal electrodes may be a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0027] The average thickness of the internal electrodes 121, 122 does not need to be particularly limited, but may be, for example, 0.05 μm or more and 3.0 μm or less. The average thickness of the internal electrodes 121, 122 can be set arbitrarily according to the desired characteristics and applications. For example, in the case of an electronic component for a high voltage electric field, the average thickness of at least one of the internal electrodes 121, 122 can be 0.1 μm or more, and the average thickness of at least one of the internal electrodes 121, 122 can be less than 1.0 μm to realize the capacity of the multilayer electronic component.

[0028] The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122 refer to the size of the dielectric layer 111 and the internal electrodes 121, 122 in the first direction, respectively. The average thickness of the dielectric layer 111 and the average thickness of the internal electrodes 121, 122 may be measured by scanning the cross sections of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) at a magnification of 10,000. More specifically, the average thickness of the dielectric layer 111 may be measured by measuring the thickness at a number of points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then measuring the average value. Also, the average thickness of the internal electrodes 121, 122 may be measured by measuring the thickness at a number of points of one internal electrode 121, 122, for example, 30 points equally spaced in the second direction, and then measuring the average value. The 30 equally spaced points may be designated by a capacitance forming unit, which will be described later. Meanwhile, by performing such average value measurements on 10 dielectric layers 111 and 10 internal electrodes 121, 122, respectively, and then measuring the average values, the average thickness of the dielectric layers 111 and the average thickness of the internal electrodes 121, 122 can be further generalized.

[0029] The body 110 may include a capacitance forming part including first and second internal electrodes 121 and 122 arranged alternately with a dielectric layer 111 therebetween to form a capacitance, and a first cover part 112 and a second cover part 113 respectively arranged on both sides of the capacitance forming part facing each other in a first direction. The cover parts 112 and 113 may basically serve to prevent damage to the internal electrodes due to physical or chemical stress. The cover parts 112 and 113 may have the same configuration as the dielectric layer 111, except that they do not include internal electrodes.

[0030] The thickness of the cover parts 112, 113 is not particularly limited. However, in order to reduce the size and increase the capacity of the multilayer electronic component, the average thickness of the cover parts 112, 113 may be 100 μm or less, 50 μm or less, or 20 μm or less. Here, the average thickness of the cover parts 112, 113 means the average thickness of each of the first cover part 112 and the second cover part 113. The average thickness of the cover parts 112, 113 may mean the average size of the cover parts 112, 113 in the first direction, and may be an average value of the size in the first direction measured at five equally spaced points on the cross section of the body 110 in the first and second directions.

[0031] The external electrodes 131, 132 may be disposed outside the body 110 and connected to the internal electrodes 121, 122. Specifically, the external electrodes 131, 132 may include first and second external electrodes 131, 132 disposed on both sides of the body 110 facing each other in the second direction. The first external electrode 131 may be connected to the first internal electrode 121, and the second external electrode 132 may be connected to the second internal electrode 122.

[0032] The first external electrode 131 may include a first head 131a disposed on the third surface 3 and connected to the first internal electrode 121, and a first band portion 131b extending from the first head 131a onto parts of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110. The second external electrode 132 may include a second head 132a disposed on the fourth surface 4 and connected to the second internal electrode 122, and a second band portion 132b extending from the second head 132a onto parts of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110.

[0033] The external electrodes 131, 132 may include a base electrode and a terminal electrode disposed on the base electrode. That is, the first external electrode 131 may include a first base electrode in contact with the third surface 3 and a first terminal electrode disposed on the first base electrode. The second external electrode 132 may include a second base electrode in contact with the fourth surface 4 and a second terminal electrode disposed on the second base electrode.

[0034] The base electrode may include metal and glass. The metal included in the base electrode may ensure electrical connectivity, and the glass may improve bonding strength with the body 110.

[0035] The metal contained in the base electrode may be formed using any material having electrical conductivity, and a specific material may be determined in consideration of electrical properties, structural stability, etc. For example, the metal contained in the base electrode may be one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and the metal contained in the base electrode may be mainly composed of Cu, but the present invention is not limited thereto.

[0036] Meanwhile, the base electrode may be formed of only one layer including metal and glass, but the present invention is not limited thereto, and the base electrode may have a multi-layer structure.

[0037] For example, the base electrode may include a first layer including metal and glass, and a second layer including metal and resin disposed on the first layer. When the base electrode includes the second layer, the warpage strength of the multilayer electronic component 1000 can be improved.

[0038] The metal contained in the second layer is not particularly limited and may include one or more selected from the group consisting of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof. The metal contained in the second layer may include, for example, one or more of spherical particles and flake particles.

[0039] The resin contained in the second layer may play a role of ensuring adhesion and absorbing shock. The resin is not particularly limited as long as it has adhesion and shock absorption properties and can be mixed with the metal powder to form a paste, and may include at least one selected from the group consisting of epoxy resin, acrylic resin, ethyl cellulose, etc.

[0040] The terminal electrode can improve mounting characteristics. The type of the terminal electrode is not particularly limited, and may be a plating layer containing Ni, Sn, Pd and / or an alloy containing these, and may be formed of multiple layers. The terminal electrode may be, for example, a Ni plating layer or a Sn plating layer, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed. The terminal electrode may also include multiple Ni plating layers and / or multiple Sn plating layers.

[0041] In the drawings, the multilayer electronic component 1000 is shown to have a structure having two external electrodes 131, 132, but this is not limited to this, and the number and shape of the external electrodes 131, 132 can be changed depending on the shape of the internal electrodes 121, 122 or other purposes.

[0042] There is no need to particularly limit the size of the multilayer capacitor 100. For example, the maximum size of the multilayer capacitor 100 in the second direction may be 0.1 mm to 4.5 mm, the maximum size of the multilayer capacitor 100 in the third direction may be 0.05 mm to 3.2 mm, and the maximum size of the multilayer capacitor 100 in the first direction may be 0.05 mm to 2.5 mm.

[0043] According to the first embodiment of the present invention, the frame terminals 310 and 320 may be disposed on the outer sides in the second direction of the multilayer capacitor 100. Specifically, the frame terminals 310 and 320 may include a first frame terminal 310 connected to the first external electrode 131 and a second frame terminal 320 connected to the second external electrode 132.

[0044] The frame terminals 310, 320 may include Ni, Fe, Cu, Ag, Cr, or alloys thereof. For example, the frame terminals 310, 320 may be an Fe-42Ni alloy or an Fe-18Cr alloy. The thickness of the frame terminals 310, 320 does not need to be particularly limited, but may be, for example, 0.05 mm to 0.5 mm.

[0045] The frame terminals 310, 320 may include connection parts 311, 321 disposed on the external electrodes 131, 132 and extending in a first direction, mounting parts 312, 322 spaced apart from the connection parts 311, 321 and extending in a second direction intersecting the first direction, and connecting parts 313, 323 connecting the connection parts 311, 321 to the mounting parts 312, 322. That is, the first frame terminal 310 may include a first connection part 311 disposed on the first external electrode 131 and extending in the first direction, a first mounting part 312 spaced apart from the first connection part 311 and extending in the second direction, and a first connecting part 313 connecting the first connection part 311 to the first mounting part 312. The second frame terminal 320 is arranged on the second external electrode 132 and may include a second connection portion 321 extending in a first direction, a second mounting portion 322 spaced apart from the second connection portion 321 and extending in a second direction, and a second connecting portion 323 connecting the second connection portion 321 and the second mounting portion 322.

[0046] The frame terminals 310, 320 basically secure a gap between the multilayer capacitor 100 and the substrate, and prevent heat and vibrations generated from the substrate from being directly transmitted to the multilayer capacitor 100, thereby improving the thermal reliability and mechanical durability of the multilayer electronic component 1000.

[0047] The connection parts 311 and 321 are connected to the heads 131 a and 132 a of the external electrodes 131 and 132 , thereby serving to electrically connect the external electrodes 131 and 132 to the frame terminals 310 and 320 .

[0048] In an embodiment, the multilayer electronic component 1000 may include conductive adhesive parts 510, 520 disposed between the external electrodes 131, 132 and the frame terminals 310, 320. Specifically, the first conductive adhesive part 510 may be disposed between the first external electrode 131 and the first frame terminal 310, and the second conductive adhesive part 520 may be disposed between the second external electrode 132 and the second frame terminal 320. The conductive adhesive parts 510, 520 may serve to improve electrical and physical connectivity between the external electrodes 131, 132 and the frame terminals 310, 320.

[0049] The first and second conductive adhesives 510 and 520 may include, for example, a conductive adhesive such as solder or conductive resin paste, etc. The solder may include, for example, Sn-Sb-based, Sn-Ag-Cu-based, Sn-Cu-based, and / or Sn-Bi-based solder.

[0050] The connecting portions 313 and 323 may include inward portions 313a and 323a extending inward in the second direction from one end of the connecting portion 311 and 321, and outward portions 313b and 323b extending outward in the second direction from one end of the inward portions 313a and 323a. That is, the first connecting portion 313 may include a first inward portion 313a extending inward in the second direction from one end of the first connecting portion 311 and a first outward portion 313b extending outward in the second direction from one end of the first inward portion 313a, and the second connecting portion 323 may include a second inward portion 323a extending inward in the second direction from one end of the second connecting portion 321 and a second outward portion 323b extending outward in the second direction from one end of the second inward portion 323a. That is, the connecting portions 313 and 323 may have a shape bent inward in the second direction, thereby improving the warpage strength of the multilayer electronic component 1000.

[0051] According to the first embodiment of the present invention, when the angle between the inwardly facing portions 313a, 323a and the outwardly facing portions 313b, 323b is θ, the angle satisfies 10°≦θ≦150°. If the angle θ exceeds 150°, the effect of improving the warpage strength of the present invention may be slight. If the angle θ is less than 10°, the distance between the first connecting portion 313 and the second connecting portion 323 may be shortened, which may result in a side effect of excessively increasing the ESR and acoustic noise of the multilayer electronic component 1000. Meanwhile, from the viewpoint of ensuring the electrical characteristics of the multilayer electronic component 1000, the angle θ preferably satisfies 60°≦θ≦150°, but the present invention is not limited thereto.

[0052] 5, on the outer surface of the first frame terminal 310, a first bending point P may be present between the first connection portion 311 and the first inward portion 313a, a second bending point Q may be present between the first inward portion 313a and the first outward portion 313b, and a third bending point R may be present between the first outward portion 313b and the first mounting portion 312. The angle θ may refer to the smaller of two angles formed by a straight line connecting the first bending point P and the second bending point Q and a straight line connecting the second bending point Q and the third bending point R, for example.

[0053] In one embodiment, when the maximum distance in the second direction between the outer surface of the first external electrode 131 and the outer surface of the second external electrode 132 is L1, and the minimum distance in the second direction between the first connecting portion 313 of the first frame terminal 310 and the second connecting portion 323 of the second frame terminal 320 is L2, the above L1 and L2 can satisfy L2 ≧ 0.1 × L1. If the above L2 is less than 0.1 × L1, the distance between the first frame terminal 310 and the second frame terminal 320 may become too close, which may cause an arc discharge. There is no need to particularly limit the upper limit of the above L2, and it may be set to, for example, L2 <L1であることができる。

[0054] The mounting portions 312, 322 may, for example, function as terminals when mounted on a substrate, and may be joined to land patterns of the substrate by solder, etc. Meanwhile, when the multilayer electronic component 1000 is mounted on a substrate, in order to ensure a gap between the multilayer capacitor 100 and the substrate, it is preferable that 0.2×T≦T1≦T be satisfied, where T is the maximum size of the main body 110 in the first direction, and T1 is the minimum distance in the first direction between the main body 110 and the mounting portions 312, 322.

[0055] The mounting portions 312, 322 may extend in the second and / or third directions parallel to the mounting surface to serve as terminals when mounted on a substrate. However, in one embodiment, the mounting portions 312, 322 may extend inward in the second direction from one end of the connecting portions 313, 323. By extending inward in the second direction from one end of the connecting portions 313, 323, the mounting portions 312, 322 can reduce the mounting area compared to a structure in which the mounting portions extend outward in the second direction.

[0056] (Experimental Example) <Warping strength evaluation> A multilayer capacitor was provided that was 3.2 mm in the second direction and 2.5 mm in the third direction, satisfied the X7R standard, had a capacitance of 4.7 μF, and had a rated voltage of 50 V. Frame terminals were formed to be connected to the external electrodes of the multilayer capacitor, and sample chips Nos. 1 to 6 were provided in which the angle θ between the inward and outward portions of the connection portion was different.

[0057] Next, a measuring plate was provided to evaluate the warpage strength. The measuring plate was supported by two supports separated from each other, and the distance between the two supports was 9.0 cm. After that, the sample chips of sample numbers 1 to 6 were mounted on the substrate, and the substrate on which the sample chips were mounted was moved toward the middle between the two supports at a speed of 1 m / s. Then, the substrate was moved until a crack occurred in the sample chip, and the distance moved from the initial position of the center when the crack occurred in the sample chip was measured. Meanwhile, 30 sample chips each of sample numbers 1 to 6 were mounted horizontally (mounting surface and internal electrode parallel) and 30 sample chips were mounted vertically (mounting surface and internal electrode perpendicular) on the substrate to evaluate the warpage strength, and the average, maximum, minimum and standard deviation of the distance moved from the initial position of the center are shown in Table 1 below.

[0058] [Table 1]

[0059] Referring to the minimum value of the warpage strength in Table 1 above, it can be confirmed that for sample numbers 1 to 5, the warpage strength is guaranteed to be 6 mm or more during the warpage strength evaluation. It can be confirmed that as the above θ increases, the warpage strength decreases, and for sample number 6, the warpage strength is not guaranteed to be 6 mm or more.

[0060] <ESR Evaluation> The ESR of sample numbers 1 to 6 was measured using an LCR meter (E49980A). After measuring the ESR of a total of 60 samples per sample number under the condition of a frequency of 500 kHz using an SMD Fixture type probe, the average value, maximum value, and minimum value were listed in Table 2 below.

[0061]

Table 2

[0062] Referring to Table 2 above, it can be confirmed that as the above θ increases, the ESR decreases. This is because the smaller the θ, the shorter the distance between the first frame terminal and the second frame terminal. On the other hand, although the ESR of sample numbers 2 to 6 is good, it can be confirmed that the average ESR value of sample number 1 is 10.50 mΩ, exceeding 10 mΩ, which is the ESR value of a normally required multilayer capacitor.

[0063] <Acoustic Noise Evaluation> After mounting the samples of sample numbers 1 to 6 on a substrate to measure the acoustic noise, the substrate was attached to a measurement jig. Then, a DC voltage and voltage fluctuation were applied to the samples attached to the measurement jig using a DC power supply and a function generator. After that, the acoustic noise was measured through a microphone provided immediately above the substrate.

[0064] The acoustic noise was measured for a total of 60 samples for each sample number, and the average, maximum and minimum acoustic noise values ​​were calculated and shown in Table 3 below.

[0065] [Table 3]

[0066] Referring to Table 3, it can be seen that the larger the θ, the more the acoustic noise is reduced. Meanwhile, samples 2 to 6 have good average acoustic noise values, but the average acoustic noise value of sample 1 is 39.0 dB, which exceeds the acoustic noise value of 38.0 dB normally required for a multilayer capacitor.

[0067] On the other hand, it can be confirmed that for samples 3 to 6, the minimum measured acoustic noise value does not exceed 30.0 dB, and from the viewpoint of reducing acoustic noise, it can be confirmed that the above θ is preferably 10° or more, and more preferably 60° or more.

[0068] Second embodiment Fig. 6 is a cross-sectional view showing a multilayer electronic component according to a second embodiment of the present invention, which is a modification of Fig. 4. Fig. 7 is an enlarged view of the K2 region in Fig. 6.

[0069] A multilayer electronic component 2000 according to a second embodiment of the present invention will be described below with reference to Fig. 6 and Fig. 7. Among the configurations of the multilayer electronic component 2000 according to the second embodiment, configurations similar to those of the first embodiment are denoted by the same reference numerals, and descriptions overlapping with the above-described first embodiment of the present invention will be omitted.

[0070] According to the second embodiment of the present invention, the frame terminals 310', 320' may be disposed on the outer sides in the second direction of the multilayer capacitor 100. Specifically, the frame terminals 310', 320' may include a first frame terminal 310' connected to the first external electrode 131 and a second frame terminal 320' connected to the second external electrode 132.

[0071] The frame terminals 310', 320' may include connection parts 311', 321' disposed on the external electrodes 131, 132 and extending in a first direction, mounting parts 312', 322' spaced apart from the connection parts 311', 321' and extending in a second direction intersecting the first direction, and connecting parts 313', 323' connecting the connection parts 311', 321' to the mounting parts 312', 322'. That is, the first frame terminal 310' may include a first connection part 311' disposed on the first external electrode 131 and extending in the first direction, a first mounting part 312' spaced apart from the first connection part 311' and extending in the second direction, and a first connecting part 313' connecting the first connection part 311' to the first mounting part 312'. The second frame terminal 320' is disposed on the second external electrode 132 and may include a second connection portion 321' extending in a first direction, a second mounting portion 322' spaced apart from the second connection portion 321' extending in a second direction, and a second connecting portion 323' connecting the second connection portion 321' and the second mounting portion 322'.

[0072] The connecting portions 313', 323' may include inward portions 313a', 323a' extending inward in the second direction from one end of the connecting portions 311', 321' and outward portions 313b', 323b' extending outward in the second direction from one end of the inward portions 313a', 323a'.

[0073] According to the second embodiment of the present invention, when the multilayer electronic component 1000 is viewed in the third direction, the inward-facing portions 313a', 323a' and the outward-facing portions 313b', 323b' may have curved surfaces that are convex inward in the second direction. That is, when viewed in the third direction, the connecting portions 313', 323' may have a shape that is convex inward in the second direction, for example, a semicircular arc shape. Since the inward-facing portions 313a', 323a' and the outward-facing portions 313b', 323b' have curved surfaces that are convex inward in the second direction, the warpage strength improving effect of the present invention may become more remarkable.

[0074] Similarly, in the multilayer electronic component 2000 according to the second embodiment, the angle θ formed between the inward-facing portions 313a', 323a' and the outward-facing portions 313b', 323b' can satisfy 10°≦θ≦150°. Also, the angle θ formed between the inward-facing portions 313a', 323a' and the outward-facing portions 313b', 323b' can satisfy 60°≦θ≦150°.

[0075] 7, a first bending point X may be present between the first connection portion 311' and the first inward portion 313a' on the outer surface of the first frame terminal 310', and a third bending point Z may be present between the first outward portion 313b' and the first mounting portion 312'. Also, a second point Y may be present on the outer surface of the first frame terminal 310', at which the distance in the second direction from a line connecting the first bending point X and the third bending point Z is maximum. The angle θ may refer to, for example, the smaller of two angles formed by the line connecting the first bending point X and the second point Y and the line connecting the second point Y and the third bending point Z.

[0076] Third embodiment Fig. 8 is a perspective view that shows a schematic cross section of a multilayer electronic component 3000 according to a third embodiment of the present invention, and Fig. 9 is a cross section that shows a schematic cross section taken along line II-II' in Fig. 8.

[0077] Hereinafter, a multilayer electronic component 3000 according to a third embodiment of the present invention will be described with reference to Fig. 8 and Fig. 9. Among the configurations of the multilayer electronic component 3000 according to the third embodiment, configurations similar to those of the first embodiment are denoted by the same reference numerals, and descriptions overlapping with the above-described first embodiment of the present invention will be omitted.

[0078] According to the third embodiment of the present invention, the frame terminals 710 and 720 may be disposed on the outer sides in the second direction of the multilayer capacitor 100. Specifically, the frame terminals 710 and 720 may include a first frame terminal 710 connected to the first external electrode 131 and a second frame terminal 720 connected to the second external electrode 132.

[0079] Furthermore, the multilayer electronic component 3000 according to the third embodiment of the present invention may include conductive adhesive parts 510 and 520 disposed between the external electrodes 131 and 132 and the frame terminals 710 and 720 .

[0080] The frame terminals 710, 720 may include connection parts 711, 721 disposed on the external electrodes 131, 132 and extending in a first direction, mounting parts 712, 722 spaced apart from the connection parts 711, 721 and extending in a second direction intersecting the first direction, and connecting parts 713, 723 connecting the connection parts 711, 721 to the mounting parts 712, 722. That is, the first frame terminal 710 may include a first connection part 711 disposed on the first external electrode 131 and extending in the first direction, a first mounting part 712 spaced apart from the first connection part 711 and extending in the second direction, and a first connecting part 713 connecting the first connection part 711 to the first mounting part 712. The second frame terminal 720 is arranged on the second external electrode 132 and may include a second connection portion 721 extending in a first direction, a second mounting portion 722 spaced apart from the second connection portion 721 and extending in a second direction, and a second connecting portion 723 connecting the second connection portion 721 and the second mounting portion 722.

[0081] According to the third embodiment of the present invention, the connecting parts 713 and 723 may include inner protrusions 713a and 723a protruding inward in the second direction and outer protrusions 713b and 723b connected to the inner protrusions 713a and 723a and protruding outward in the second direction. Specifically, the first connecting part 713 may include a first inner protrusion 713a protruding inward in the second direction and a first outer protrusion 713b connected to the first inner protrusion 713a and protruding outward in the second direction, and the second connecting part 723 may include a second inner protrusion 723a protruding inward in the second direction and a second outer protrusion 723b connected to the second inner protrusion 723a and protruding outward in the second direction.

[0082] According to the third embodiment of the present invention, the connecting parts 713 and 723 for securing a space between the multilayer capacitor 100 and the substrate include inner protrusions 713a and 723a and outer protrusions 713b and 723b protruding in opposite directions, thereby more effectively improving warpage strength. The inner protrusions 713a and 723a may be connected to the connecting parts 711 and 721, and the outer protrusions 713b and 723b may be connected to the mounting parts 712 and 722, for example.

[0083] In one embodiment, when the maximum distance in the second direction between the outer surface of the first external electrode 131 and the outer surface of the second external electrode 132 is L3, and the maximum distance in the second direction between the first outer protrusion 713b of the first frame terminal 710 and the second outer protrusion 723b of the second frame terminal 720 is L4, L3 and L4 may satisfy L4>L3. In addition, in consideration of the mounting stability and mounting area of ​​the multilayer electronic component 3000, L4 / L3 may be 1.1 or more and 1.5 or less, but the present invention is not limited thereto.

[0084] In one embodiment, the inner protrusions 713a, 723a may be concave toward the outside in the second direction, and the outer protrusions 713b, 723b may be convex toward the outside in the second direction. That is, the inner protrusions 713a, 723a and the outer protrusions 713b, 723b may be curved in opposite directions to each other, thereby more effectively improving the warpage strength of the multilayer electronic component 3000.

[0085] In one embodiment, when viewed in a third direction intersecting the first and second directions, the inner protrusions 713a, 723a and the outer protrusions 713b, 723b may each have a semicircular arc shape. The inner protrusions 713a, 723a and the outer protrusions 713b, 723b having a semicircular arc shape may have excellent elasticity and may have a more significant effect of improving warpage strength.

[0086] In one embodiment, the centers of curvature C1, C2 of the inner protrusions 713a, 723a and the outer protrusions 713b, 723b can be located outside in the second direction relative to the main body 110. When the centers of curvature C1, C2 of the inner protrusions 713a, 723a and the outer protrusions 713b, 723b are located outside in the second direction relative to the main body 110, the mounting stability of the multilayer electronic component 3000 can be ensured.

[0087] On the other hand, when mounting the multilayer electronic component 3000 on a substrate, in order to ensure a gap between the multilayer capacitor 100 and the substrate, it is preferable to satisfy 0.5×T≦T2≦1.5×T, where T is the maximum size of the main body 110 in the first direction and T2 is the minimum distance in the first direction between the main body 110 and the mounting portions 712, 722.

[0088] Furthermore, the mounting portions 712, 722 may extend in the second and / or third directions parallel to the mounting surface to serve as terminals when mounted on a substrate, and it is preferable that the mounting portions 712, 722 extend inward in the second direction from one end of the connecting portions 713, 723. By extending the mounting portions 712, 722 inward in the second direction from one end of the connecting portions 713, 723, the mounting area can be reduced compared to a structure in which the mounting portions extend outward in the second direction.

[0089] (Fourth embodiment) FIG. 10 is a cross-sectional view that shows a schematic modification of FIG. 9, a multilayer electronic component 4000 according to a fourth embodiment of the present invention.

[0090] Hereinafter, a multilayer electronic component 4000 according to a fourth embodiment of the present invention will be described with reference to Fig. 10. Among the configurations of the multilayer electronic component 4000 according to the fourth embodiment, configurations similar to those of the first embodiment are denoted by the same reference numerals, and descriptions that overlap with the descriptions of the first and third embodiments of the present invention described above will be omitted.

[0091] According to the fourth embodiment of the present invention, the frame terminals 710', 720' are disposed on the external electrodes 131, 132 and may include connection portions 711', 721' extending in a first direction, mounting portions 712', 722' spaced apart from the connection portions 711', 721' extending in a second direction intersecting the first direction, and connecting portions 713', 723' connecting the connection portions 711', 721' to the mounting portions 712', 722'.

[0092] According to the fourth embodiment of the present invention, the connecting portions 713', 723' may include inner protrusions 713a', 723a' protruding inward in the second direction and outer protrusions 713b', 723b' connected to the inner protrusions 713a', 723a' and protruding outward in the second direction.

[0093] In the fourth embodiment of the present invention, the inner protrusions 713a', 723a' may be connected to the mounting portions 712, 722, and the outer protrusions 713b', 723b' may be connected to the connecting portions 711, 721. The connecting portions 713', 723' for securing a space between the multilayer capacitor 100 and the substrate include the inner protrusions 713a', 723a' and the outer protrusions 713b', 723b' protruding in opposite directions to each other, thereby more effectively improving the warpage strength.

[0094] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, within the scope of the technical idea of ​​the present invention described in the claims, various substitutions, modifications, and changes are possible by a person having ordinary knowledge in the art, and these also belong to the scope of the present invention.

[0095] In addition, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0096] In the present disclosure, the term "connected" refers not only to being directly connected, but also to being indirectly connected via an adhesive layer or the like. The term "electrically connected" refers to being physically connected and not connected. Furthermore, the terms "first" and "second" are used to distinguish one component from another, and do not limit the order and / or importance of the corresponding components. In some cases, the first component may be named the second component, and the second component may be named the first component, without departing from the scope of the right. [Explanation of symbols]

[0097] 1000, 2000, 3000, 4000 Multilayer electronic components 100 Multilayer capacitor 110 Body 111 Dielectric layer 112, 113 Cover portion 121, 122 Internal electrode 131, 132 External electrode 310, 320, 310', 320', 710, 720, 710', 720' Frame Terminals 311, 321, 311', 321', 711, 721, 711', 721' Connection parts 312, 322, 312', 322', 712, 722, 712', 722' Mounting parts 313, 323, 313', 323', 713, 723, 713', 723' Linking parts 313a, 323a, 313a', 323a' Inward parts 313b, 323b, 313b', 323b' Outward parts 713a, 723a, 713a', 723a' Inner protruding parts 713b, 723b, 713b', 723b' Outer protruding parts

Claims

1. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an external electrode disposed outside the body; a frame terminal including a connection portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction intersecting the first direction, and a connecting portion connecting the connection portion and the mounting portion, the coupling portion includes an inward portion extending inward in the second direction from one end of the connection portion, and an outward portion extending outward in the second direction from one end of the inward portion, a multilayer electronic component, wherein an angle formed between the inward facing portion and the outward facing portion is θ, and the angle θ satisfies 10°≦θ≦150°.

2. 2. The multilayer electronic component according to claim 1, wherein the angle θ satisfies 60°≦θ≦150°.

3. The external electrodes include first and second external electrodes disposed on both surfaces of the body facing each other in the second direction, the frame terminals include a first frame terminal connected to the first external electrode and a second frame terminal connected to the second external electrode; When a maximum distance in a second direction between an outer surface of the first external electrode and an outer surface of the second external electrode is L1, and a minimum distance in the second direction between a connecting portion of the first frame terminal and a connecting portion of the second frame terminal is L2, 2. The multilayer electronic component according to claim 1, wherein L1 and L2 satisfy L2 ≥ 0.1 x L1.

4. The multilayer electronic component according to claim 1 , wherein the inward facing portion and the outward facing portion each have a curved surface that is convex inward in the second direction.

5. 2. The multilayer electronic component according to claim 1, wherein T is a maximum size of the main body in a first direction and T1 is a minimum distance in the first direction between the main body and a mounting portion, and T1 satisfies 0.2×T≦T1≦T.

6. The multilayer electronic component according to claim 1 , wherein the mounting portion extends inward in the second direction from one end of the connecting portion.

7. The multilayer electronic component according to claim 1 , further comprising a conductive adhesive portion disposed between the external electrode and a frame terminal.

8. a body including dielectric layers and internal electrodes interleaved with the dielectric layers; an external electrode disposed outside the body; a frame terminal including a connection portion disposed on the external electrode and extending in a first direction, a mounting portion spaced apart from the connection portion and extending in a second direction intersecting the first direction, and a connecting portion connecting the connection portion and the mounting portion, The connecting portion includes an inner protruding portion protruding inward in the second direction, and an outer protruding portion connected to the inner protruding portion and protruding outward in the second direction.

9. The inner protrusion is concave in an outward direction in the second direction, The multilayer electronic component according to claim 8 , wherein the outer protrusion is convex outward in the second direction.

10. The inner protrusion is connected to the connection portion, The multilayer electronic component according to claim 8 , wherein the outer protrusion is connected to the mounting portion.

11. The inner protrusion is connected to the mounting portion, The multilayer electronic component according to claim 8 , wherein the outer protrusion is connected to the connection portion.

12. When viewed in a third direction intersecting the first direction and the second direction, 9. The multilayer electronic component according to claim 8, wherein the inner protrusion and the outer protrusion each have a semicircular arc shape.

13. The multilayer electronic component according to claim 12 , wherein the centers of curvature of the inner protrusion and the outer protrusion are each located outside the main body in the second direction.

14. The external electrodes include first and second external electrodes disposed on both surfaces of the body facing each other in the second direction, the frame terminals include a first frame terminal connected to the first external electrode and a second frame terminal connected to the second external electrode; When a maximum distance in a second direction between an outer surface of the first external electrode and an outer surface of the second external electrode is L3, and a maximum distance in the second direction between an outer protrusion of the first frame terminal and an outer protrusion of the second frame terminal is L4, 9. The multilayer electronic component according to claim 8, wherein L3 and L4 satisfy L4>L3.

15. 9. The multilayer electronic component according to claim 8, wherein T is a maximum size of the main body in a first direction and T2 is a minimum distance in the first direction between the main body and a mounting portion, and T2 satisfies 0.5×T≦T2≦1.5×T.

16. The multilayer electronic component according to claim 8 , wherein the mounting portion extends inward in the second direction from one end of the connecting portion.

17. 9. The multilayer electronic component according to claim 8, further comprising a conductive adhesive portion disposed between the external electrode and a frame terminal.

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