Mounting device for electronic component

Abstract

To provide a mounting device for an electronic component that can accurately mount an electronic component while reducing the generation of dust.SOLUTION: A mounting device 1 of an embodiment has: a mounting mechanism 3 that mounts an electronic component C on a substrate S; a substrate support mechanism 2 that supports the substrate on which the electronic component is mounted; a mounting head 31 that is provided on the mounting mechanism, and has a transmission part through which a mark on the substrate can be recognized while holding the electronic component; a first imaging unit 4 that is arranged below the substrate support mechanism at a mounting position where the mounting head mounts the electronic component on the substrate, and picks up an image of a mark on the electronic component held by the mounting head, in a state where the substrate is retreated from the mounting position; a second imaging unit 5 that is arranged above the mounting head at the mounting position, and picks up an image of the mark on the substrate through the transmission part; and a positioning mechanism (driving mechanism 22) that performs positioning of the substrate and the electronic component, on the basis of the positions of the substrate and the electronic component determined from the images of the marks picked up by the first imaging unit and the second imaging unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electronic component mounting apparatus. [Background technology]

[0002] There are two methods for mounting a semiconductor chip, an electronic component, onto a substrate: face-up and face-down. The surface of a semiconductor chip on which the semiconductor layer is formed is called the face. Face-up mounting is a method of mounting with this face side facing away from the substrate. For example, face-up mounting is used when a semiconductor chip is mounted on a lead frame and wires are used to connect the electrodes to the frame.

[0003] Face-down mounting is a method of mounting a semiconductor device with its face side facing the substrate. For example, in the case of flip-chip connection, in which bump electrodes are provided on the surface of the semiconductor layer and the bump electrodes are pressed against the wiring on the substrate to fix and electrically connect the device, face-down mounting is used.

[0004] When mounting electronic components such as semiconductor chips on a board, the electronic components must be precisely positioned relative to the board. To address this issue, for example, a camera capable of simultaneously capturing images in both the upward and downward directions is inserted between the board and a mounting tool that holds the electronic components by suction. The horizontal relative positions between the board and the electronic components are recognized based on the images captured by this camera. Then, the position of the mounting tool is corrected based on the recognized relative positions, and the electronic components are mounted on the board. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2010-129913 A Summary of the Invention [Problem to be solved by the invention]

[0006] In recent years, 3D packaging and hybrid bonding, which increase integration by arranging semiconductor chips in multiple layers, require bonding electrodes with a very narrow pitch. For this reason, higher precision, for example, submicron order precision, is required when mounting electronic components on a board. Furthermore, during mounting, errors due to the operation of the mounting mechanism and dust generated by the operation can lead to poor bonding, so it is preferable to minimize the distance over which the mechanism operates.

[0007] However, when using an imaging camera that can capture images in both the up and down directions at the same time, the camera needs to be inserted between the board and the electronic component when recognizing the relative horizontal positions of the two, so a large distance needs to be kept between them. This means that the electronic component needs to be moved a longer distance after the relative positions of the two are recognized. The longer the movement distance, the higher the risk of horizontal misalignment, making it difficult to achieve high mounting accuracy. In addition, the longer the movement distance of the mechanical parts, the greater the amount of dust that is generated.

[0008] The present invention has been proposed to solve the above-mentioned problems, and has an object to provide an electronic component mounting apparatus that can perform mounting with high accuracy while suppressing the amount of dust generated. [Means for solving the problem]

[0009] The electronic component mounting apparatus of the present invention includes a mounting mechanism that mounts an electronic component on a substrate, a substrate support mechanism that supports the substrate on which the electronic component is to be mounted, a mounting head provided in the mounting mechanism and having a transparent portion that allows the mark on the substrate to be recognized through a transmission portion while holding the electronic component, a first imaging unit that is arranged below the substrate support mechanism at a mounting position where the mounting head mounts the electronic component on the substrate and images the mark of the electronic component held by the mounting head while the substrate is retracted from the mounting position, a second imaging unit that is arranged above the mounting head at the mounting position and images the mark on the substrate through the transparent portion, and a positioning mechanism that positions the substrate and the electronic component based on the positions of the substrate and the electronic component determined from images of the marks captured by the first imaging unit and the second imaging unit. Effect of the Invention

[0010] The present invention can provide an electronic component mounting apparatus capable of performing mounting with high accuracy while suppressing the amount of dust generated. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a front view showing a schematic configuration of a mounting apparatus according to an embodiment; [Diagram 2] Plan view showing electronic components and board [Diagram 3] Plan view of the mounting device (A), and enlarged plan view of the mounting area (B) [Figure 4] An explanatory diagram showing the mounting procedure of the mounting device. [Diagram 5] Flowchart showing the mounting procedure of the mounting device [Figure 6] FIG. 13 is an explanatory diagram showing a mounting method in a mounting device according to another embodiment. [Figure 7] 7 is a flowchart showing the implementation procedure of the embodiment of FIG. [Figure 8] FIG. 13 is an explanatory diagram showing a mounting method in a mounting device according to another embodiment. [Figure 9] 9 is a flowchart showing the implementation procedure of the embodiment of FIG. 8. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. As shown in Fig. 1 and Fig. 2, this embodiment is a mounting device 1 that mounts an electronic component C on a substrate S. Fig. 1 is a front view showing a schematic configuration of the mounting device 1. Fig. 2 is a plan view showing the electronic component C and the substrate S. Note that the drawings are schematic, and the size (hereinafter also referred to as dimensions), shape, and relative size ratios of each part may differ from the actual ones.

[0013] [Electronic components] First, the electronic component C to be mounted in this embodiment can be, for example, a semiconductor element such as an IC or an LSI.

[0014] In this embodiment, as shown in Fig. 2, a rectangular parallelepiped semiconductor chip is used as the electronic component C. Each semiconductor chip is a bare chip that is separated by dicing a semiconductor wafer into individual chips. The bare chip has bump or bumpless electrodes on the exposed semiconductor, and is mounted by flip-chip connection to pads on the substrate S.

[0015] The electronic component C is provided with a plurality of marks m for positioning. In this embodiment, two marks m are provided, one at each of a pair of diagonal corners of the rectangular electronic component C. The marks m are provided on a surface of the electronic component C on which electrodes are formed, that is, on the face. This embodiment is an example of an apparatus for face-down mounting in which the face side faces the board S for mounting.

[0016] [substrate] In this embodiment, the substrate S on which the electronic component C is mounted is a plate-like member made of resin or the like on which printed wiring or the like is formed, or a silicon substrate on which a circuit pattern is formed, as shown in Fig. 2. The substrate S is provided with a mounting area B in which the substrate S is mounted, and a plurality of marks M for positioning are provided outside the mounting area B. In this embodiment, two marks M are provided at positions outside the mounting area B and corresponding to the mark m of the electronic component C. That is, one mark M is provided on each of the outsides of a pair of diagonal corners of the mounting area B, which is set to have the same shape and size as the rectangular electronic component C.

[0017] [Mounting equipment] The mounting apparatus 1 of this embodiment is capable of realizing high-precision mounting, for example, with a mounting accuracy of ±0.2 μm or less, and as shown in Fig. 1 and Fig. 3, has a substrate support mechanism 2, a mounting mechanism 3, a first imaging unit 4, a second imaging unit 5, and a control device 6. Fig. 3(A) is a plan view of the mounting apparatus 1, and Fig. 3(B) is a plan view showing a mark M transmitted through a mounting head 31 described later.

[0018] In the following description, the direction in which the mounting mechanism 3 moves the electronic component C to mount it on the substrate S is referred to as the Z axis, and the two axes perpendicular to each other in a plane perpendicular to the Z axis are referred to as the X axis and the Y axis. In this embodiment, the Z axis is vertical, the direction following gravity is referred to as the downward direction, and the direction against gravity is referred to as the upward direction, and the position on the Z axis is referred to as the height. The X axis and the Y axis are on a horizontal plane, and when viewed from the front side of FIG. 1, the X axis is the left-right direction, and the Y axis is the depth direction. However, the present invention is not limited to this installation direction. Regardless of the installation direction, the side on which the electronic component C is mounted is referred to as the upper side and the opposite side is referred to as the lower side with respect to the substrate S or the substrate support mechanism 2.

[0019] The substrate support mechanism 2 is a mechanism for supporting a substrate S on which an electronic component C is to be mounted, and is a so-called substrate stage. The mounting mechanism 3 is a mechanism for mounting the electronic component C on the substrate S. The mounting mechanism 3 has a mounting head 31. The mounting head 31 has a transmitting portion that allows a mark M on the substrate S facing the electronic component C to be recognized through transmission while holding the electronic component C.

[0020] The first imaging unit 4 is disposed below the board support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the board S, and captures an image of the mark m of the electronic component C held by the mounting head 31 from a position facing the electronic component C, that is, from below, when the board S is retracted from the mounting position OA by the board support mechanism 2. The mounting position OA is the position where the electronic component C is mounted on the board S, and is indicated in the figure by a dashed line in the direction along the Z axis passing through a point (for example, a center point) on the XY coordinate system within the area of ​​the electronic component C to be mounted. The mounting position OA coincides with the optical axes of the cameras of the first imaging unit 4 and the second imaging unit 5, as described later. The second imaging unit 5 is disposed above the mounting head 31 at the mounting position OA, and captures an image of the mark M of the board S through a transparent portion of the mounting head 31 (hereinafter, this is referred to as "capturing an image through the mounting head 31"). The control device 6 controls the operation of the mounting device 1.

[0021] The board support mechanism 2 and the mounting mechanism 3 each have a positioning mechanism. The positioning mechanism performs positioning of the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks M and m captured by the first imaging unit 4 and the second imaging unit 5. Each part of the mounting device 1 as described above is mounted on a support base 11 installed on an installation surface. The top surface of the support base 11 is a horizontal plane. Each part will be described in detail below.

[0022] (Substrate support mechanism) As shown in FIG. 1 and FIG. 3(A), the substrate support mechanism 2 is disposed on the support base 11, and includes a stage 21 and a drive mechanism 22. The stage 21 is a plate-shaped member on which the substrate S is placed. The drive mechanism 22 is, for example, a two-axis movement mechanism having a pair of guide rails 22a in the X-axis direction and a pair of guide rails 22b in the Y-axis direction, and moves the stage 21 in a horizontal plane by a belt or a ball screw using a motor (not shown) as a drive source. The pair of guide rails 22a and the pair of guide rails 22b are disposed symmetrically with respect to the mounting position OA. The drive mechanism 22 functions as a positioning mechanism for positioning the substrate S. Although not shown, the drive mechanism 22 includes a θ drive mechanism for rotating and moving the stage 21 in a horizontal plane.

[0023] The driving mechanism 22 includes a moving plate 23 that moves in the Y-axis direction along a guide rail 22b. A through hole 23a is formed in the moving plate 23 so that the first imaging unit 4 can image the electronic component C.

[0024] Although not shown, a loader / unloader that supplies / stores the substrate S to / from the stage 21 is provided at one of the moving ends in the X-axis direction of the stage 21 of the substrate support mechanism 2 (specifically, the moving end on the right side in the figure). With the stage 21 moved to the moving end, the substrate support mechanism 2 receives the substrate S from the loader and passes the substrate S to the unloader.

[0025] (Mounting mechanism) The mounting mechanism 3 includes a mounting head 31 and a drive mechanism 32. The mounting head 31 is roughly cuboid-shaped, and includes a hollow portion 31a and a holding portion 31b as a transmission portion. The hollow portion 31a is a cylindrical through-hole formed with the Z-axis direction as its axis. The holding portion 31b is a plate-like member that can transmit light for imaging, and is attached so as to cover the opening of the hollow portion 31a on the side facing the substrate S. For example, a transparent glass plate is used as the holding portion 31b. The holding portion 31b is a so-called mounting tool, and holds the electronic component C.

[0026] As shown in FIG. 3B, the center of the holding portion 31b is provided with a suction area D for suctioning and holding the electronic component C. Although not shown, the suction area D has a suction hole formed therein. A flow path is formed inside the holding portion 31b for connecting the suction hole to a negative pressure source, and the electronic component C can be suctioned and held by generating negative pressure in the suction hole. The periphery of the suction area D of the holding portion 31b is a transparent area T that can transmit and image the mark M of the board S even when the electronic component C is suctioned. In other words, the mounting head 31 has a transparent portion so that the mark M of the board S can be imaged by the second imaging unit 5. The holding surface (suction surface) of the holding portion 31b that holds the electronic component C is called the lower end surface.

[0027] The driving mechanism 32 includes movable bodies 33, 34, and 35, and is a mechanism for driving the mounting head 31. The movable body 33 is provided movably along a Y-axis guide rail 33a provided on the support base 11. The movable body 34 is provided movably along an X-axis guide rail 34a provided on the top surface of the movable body 33. The movable body 35 is provided movably along a Z-axis guide rail 35a provided on the front surface of the movable body 34. The movable body 35 is formed in a generally concave shape in a plan view. These movable bodies 33, 34, and 35 are driven by a ball screw, a linear motor, a cylinder, or the like, which uses a motor as a drive source.

[0028] The mounting head 31 is provided under a movable body 35 that moves in the Z-axis direction. Therefore, the movable body 35 performs an operation for mounting the electronic component C held by the holding portion 31b of the mounting head 31 onto the board S. Furthermore, the movable body 35 on which the mounting head 31 is provided moves in the X-axis direction and the Y-axis direction by the movement of the movable bodies 33 and 34. Therefore, the driving mechanism 32 functions as a positioning mechanism that positions the electronic component C held by the mounting head 31. Although not shown, the driving mechanism 32 includes a θ driving mechanism that rotates and moves the mounting head 31 in a horizontal plane.

[0029] In this embodiment, it is preferable to set the movement amount in the X-axis direction, the Y-axis direction, and the Z-axis direction by the driving mechanism 32 as short as possible in order to prevent movement errors. For example, the movement amount in the X-axis direction and the Y-axis direction by the moving bodies 33 and 34 is set to several mm to several tens of mm, respectively. The movement amount in the Z-axis direction by the moving body 35 is also set to about several mm to several tens of mm. That is, the mounting head 31 receives the electronic component C and captures an image of the mark m of the received electronic component C at a height position where the lower end surface of the holding part 31b is spaced apart from the upper surface of the board S placed on the stage 21 by a facing distance (vertical separation distance) of several mm, for example, 1 to 2 mm. Therefore, with regard to the movement amount in the Z-axis direction of the moving body 35, it is sufficient to ensure at least a movement amount that can mount the electronic component C held by the holding part 31b on the board S by applying a predetermined pressure force from this height position.

[0030] Although not shown, the mounting apparatus 1 is provided with a supply section for electronic components C, such as a wafer stage or a tray stage, and a transfer mechanism that individually receives the electronic components C from the supply section and transfers the electronic components C to the mounting head 31 of the mounting mechanism 3.

[0031] (First imaging unit) The first imaging unit 4 has a camera, a lens, a lens barrel, a light source, etc., and is provided in the receiving hole 11a provided in the support base 11. The first imaging unit 4 is arranged in a direction in which the optical axis of the camera can capture an image of the mark m of the electronic component C held by the mounting head 31. Specifically, the first imaging unit 4 is arranged so that the optical axis is vertical. The first imaging unit 4 is provided so that the mark m does not deviate from the imaging field of view within the range in which the mark m of the electronic component C held by the mounting head 31 can move to the maximum. There is variation in the holding position of the electronic component C handed over to the mounting head 31. That is, the position of the electronic component C varies with respect to the mounting position OA. Therefore, the position of the mark m of the electronic component C also varies. The maximum range of this variation is the range in which the mark m of the electronic component C can move to the maximum. The first imaging unit 4 is designed to capture images with sufficient magnification to ensure the required mounting accuracy, and with brightness required for illuminance of the light source and position recognition. Furthermore, the maximum range in which the above-mentioned mark m can move is also taken into consideration, and an imaging field of view (field of view range) is determined from these conditions. The first imaging unit 4 is provided at an initial position where the center of this imaging field of view coincides with the mounting position OA. This position remains the same whether the first imaging unit 4 is provided fixedly or movably. The first imaging unit 4 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with the movement of these.

[0032] In this embodiment, the first imaging unit 4 is immovable with respect to the mounting position OA of the electronic component C. That is, in this embodiment, the first imaging unit 4 is disposed facing upward in the accommodation hole 11a of the support base 11, which is a position below the board support mechanism 2, with the optical axis of the camera aligned with the mounting position OA. The first imaging unit 4 is fixed to the support base 11 with a size and positional relationship such that the two marks m do not deviate from the imaging field of view even if the electronic component C moves to the maximum for positioning. The imaging field of view of the first imaging unit 4 is set in consideration of the range in which the two marks m of the electronic component C can move to the maximum for positioning, with the optical axis (center of the imaging field of view) aligned with the mounting position OA and fixed.

[0033] (Second imaging unit) The second imaging unit 5 has a camera, a lens, a lens barrel, a light source, etc., and is provided on the support table 11 at a position above the support table 11, more specifically, above the mounting head 31, supported by a frame (not shown) or the like. The second imaging unit 5 is arranged in a direction in which the optical axis of the camera passes through the holding portion 31b of the mounting head 31 and can capture an image of the mark M around the mounting area B of the substrate S. Specifically, the optical axis is arranged in a vertical direction. The second imaging unit 5 is arranged so that the mark M does not fall out of the imaging field of view within the range in which the mark M of the substrate S can move to the maximum extent through the holding portion 31b. There is variation in the support position of the substrate S placed on the stage 21. That is, the position of the substrate S varies with respect to the mounting position OA. Therefore, the position of the mark M of the substrate S also varies. The maximum range of this variation is the range in which the mark M of the substrate S can move to the maximum extent. The second imaging unit 5 is designed to have sufficient magnification to ensure the required mounting accuracy, and to capture images with the illuminance of the light source and the brightness required for position recognition. Furthermore, the maximum range in which the above-mentioned mark M can move is also taken into consideration, and the second imaging unit 5 has an imaging field of view (field of view range) determined from these conditions. The second imaging unit 5 is provided at an initial position where the center of the imaging field of view coincides with the mounting position OA. This position remains the same whether the second imaging unit 5 is provided fixedly or movably. The second imaging unit 5 is provided independently of the mounting head 31 and the stage 21 so as not to interfere with their movement.

[0034] In this embodiment, the second imaging unit 5 is disposed directly above the mounting head 31, facing downward, with the optical axis (center of the imaging field) of the camera aligned with the mounting position OA as described above. The second imaging unit 5 is immobile relative to the mounting position OA of the electronic component C, similar to the first imaging unit 4. That is, the imaging field of the second imaging unit 5 is set in consideration of the maximum range in which the two marks M affixed to the mounting area B of the board S can move for positioning. For this reason, the size of the transmission portion of the mounting head 31 is set in accordance with the imaging field of the second imaging unit 5.

[0035] Here, the arrangement of the first imaging unit 4 and the second imaging unit 5 in this embodiment will be described. As described above, the first imaging unit 4 and the second imaging unit 5 are arranged independently of the mounting head 31 and the stage 21 so as not to interfere with the movement of these units. In other words, the first imaging unit 4 and the second imaging unit 5 are independently provided on the support base 11. Therefore, when capturing images of the marks m and M or when positioning the marks m and M, the first imaging unit 4 and the second imaging unit 5 do not move integrally with the mounting head 31 and the stage 21.

[0036] For example, the first imaging unit 4 and the second imaging unit 5 are fixed to the support base 11 independently. Alternatively, the first imaging unit 4 and the second imaging unit 5 are provided with a driving device in the X-axis direction (horizontal direction) and a driving device in the Z-axis direction (vertical direction), and are arranged to be movable (movable) in the horizontal direction and the vertical direction. This movement is performed to adjust the horizontal position and the vertical position of the imaging units 4 and 5 (the first imaging unit 4 and the second imaging unit 5) as a preparation work for the operation of the device, or to move between the marks when imaging multiple marks m and M, as described later.

[0037] As described above, the first imaging unit 4 and the second imaging unit 5 are provided movably, independently of the mounting head 31 and the stage 21. Therefore, being immovable with respect to the above-mentioned mounting position OA means that the first imaging unit 4 and the second imaging unit 5 do not move together with the mounting head 31 and the stage 21 when taking images of the marks m and M or when positioning. For example, the imaging units 4 and 5 are provided movably, independently of the mounting head 31 and the stage 21, and adjustment of the horizontal position and the vertical position of the imaging units 4 and 5 as preparation work for the operation of the device is also included in being immovable with respect to the mounting position OA. Alternatively, the first imaging unit 4 and the second imaging unit 5 moving between the marks to take images of the marks m and M is also included in being immovable with respect to the mounting position OA.

[0038] Moreover, it is preferable that the mounting device 1 of this embodiment obtains a mounting accuracy of 0.2 μm or less. To achieve this, the first imaging unit 4 and the second imaging unit 5 need to have a performance capable of capturing images at a high magnification and with high resolution that matches the accuracy.

[0039] It is generally known that to capture a high-definition image, it is necessary to place the imaging unit in a position close to the electronic component C or the board S that is the subject of the image capture. Therefore, it is preferable to place the first imaging unit 4 and the second imaging unit 5 as close as possible to the electronic component C or the board S, that is, to shorten the imaging distance.

[0040] However, in the mounting apparatus 1 of this embodiment, in order to minimize the amount of downward movement of the electronic component C during mounting, the mark m of the electronic component C and the mark M of the board S are imaged in a state in which the electronic component C is positioned at a position close to the height of the upper surface of the board S. Therefore, the stage 21 and the moving plate 23 of the drive mechanism 22 are present between the first imaging unit 4 and the electronic component C, and the mounting head 31 is present between the second imaging unit 5 and the board S. Then, since it is necessary to avoid interference between the moving plate 23 and the mounting head 31, there is a limit to shortening the distance between the first imaging unit 4 and the electronic component C and the distance between the second imaging unit 5 and the board S.

[0041] Therefore, the inventors of the present application have studied the maximum imaging distance (so-called work distance) at which an image that can realize the above mounting accuracy can be captured. As a result, they have derived that it is approximately 100 mm. From this result, in this embodiment, the first imaging unit 4 is fixedly disposed at a height position where the imaging distance from the electronic component C is within 100 mm, and the second imaging unit 5 is fixedly disposed at a height position where the imaging distance from the board S is within 100 mm.

[0042] The mounting head 31 located between the second imaging unit 5 and the substrate S is a member with a relatively large height dimension (dimension in the Z-axis direction) for reasons such as ensuring rigidity. Therefore, interference is expected to occur in a normal configuration. As a result of extensive investigation, the inventors of the present application have succeeded in minimizing the height dimension while maintaining the functionality and rigidity required of the mounting head 31. Specifically, the height dimension of the mounting head 31 (the dimension from the lower end of the holding portion 31b to the upper opening of the hollow portion 31a) is set to about 70 mm. This makes it possible to arrange the second imaging unit 5 at a height position of 100 mm or less with respect to the substrate S.

[0043] (Control device) The control device 6 controls the positioning mechanism so that the board S and the electronic component C are positioned based on the marks m and M captured by the first imaging unit 4 and the second imaging unit 5. The coordinates of each of the imaging units 4 and 5 are adjusted to match the coordinates of the mounting device 1. Specifically, the coordinates of the control device 6 are the XY coordinates in the design of the mounting device 1, and the origin of the coordinates can be the mounting position OA. The coordinates of each of the imaging units 4 and 5 are set, for example, so that the imaging center is the origin of the XY coordinates and coincides with the mounting position OA as mechanical or calculable information. Therefore, in this case, the reference position on the XY coordinates in the mounting device 1 is the mounting position OA, and the imaging centers of each of the imaging units 4 and 5 are also the same reference position.

[0044] In addition, the coordinates of the imaging units 4 and 5, which are adjusted to match the coordinates of the mounting device 1, actually contain errors in assembling each unit of the device. Moreover, information on the shapes of the marks m and M, design information showing the positional relationship between the electronic component C and the mark m, and design information showing the positional relationship between the mounting area B of the board S and the mark M are stored in advance in the control device 6. Each imaging unit 4 and 5 has an image recognition unit. The image recognition unit recognizes the marks m and M, which are stored in advance in the control device 6, from the captured image by a well-known image recognition process, and calculates the position on the coordinates that are the reference of the mounting device 1. That is, the image recognition unit of the first imaging unit 4 calculates the position information (X, Y, θ) of the electronic component C held by the mounting head 31 from the recognized mark m on the adjusted coordinates. The image recognition unit of the second imaging unit 5 similarly calculates the position information (X, Y, θ) of the mounting area B of the board S placed on the stage 21 for the mark M. Such position information is calculated based on the information indicating the positional relationship between the electronic component C and the mark m, and the information indicating the positional relationship between the mounting area B and the mark M, which are stored in advance by the control device 6 as described above.

[0045] The control device 6 determines the amount of deviation between the position information of the electronic component C and the position information of the mounting area B calculated in this manner and the reference position (the coordinate origin of each imaging unit 4, 5) and the XY axis directions, and controls the positioning mechanism (driving mechanism 22 and driving mechanism 32) so that the electronic component C or the board S moves in a direction and by an amount of movement that corrects the deviation and brings the electronic component C and the mounting area B into agreement.

[0046] [Operation] The operation of this embodiment as described above will be described with reference to the explanatory diagram of Fig. 4 and the flowchart of Fig. 5. In the initial state, the substrate S is transferred from the loader to the stage 21 of the substrate support mechanism 2, but is retracted from the position facing the mounting head 31, that is, from the mounting position OA.

[0047] First, the center of the holding unit 31b of the mounting head 31 in the mounting mechanism 3 is located directly below the second imaging unit 5. That is, the center of the holding unit 31b is positioned on the mounting position OA. In this state, the transfer mechanism receives the electronic component C from a supply unit (neither of which are shown in the figures) and transfers it to the mounting head 31 (step S101). As shown in FIG. 4(A), the holding unit 31b of the mounting head 31 receives the electronic component C from the transfer mechanism and adsorbs and holds it by negative pressure (step S102). Note that the transfer mechanism transfers the electronic component C to the holding unit 31b at the mounting position OA, and therefore the stage 21 remains retracted during the transfer to avoid interference with the transfer mechanism.

[0048] The first imaging unit 4 captures an image of the mark m of the electronic component C held by the mounting head 31 (step S103). At this time, the stage 21 is retracted from the mounting position OA, and the through hole 23a provided in the moving plate 23 is positioned directly above the first imaging unit 4. The first imaging unit 4 captures an image of the mark m through the through hole 23a. The image recognition unit of the first imaging unit 4 recognizes the mark m from the image captured by the first imaging unit 4, and calculates position information of the electronic component C. The control device 6 determines the amount of deviation between the position information of the electronic component C and the reference position and the XY axis directions, and operates the driving mechanism 32 to position the electronic component C so as to eliminate the deviation (step S104).

[0049] Next, as shown in Fig. 4(B), the board support mechanism 2 moves the stage 21 so that the mounting area B of the board S (the mounting area B where the electronic component C is to be mounted this time) faces the electronic component C held by the mounting head 31, that is, so that the center of the mounting area B is at the mounting position OA (step S105). Then, as shown in Fig. 3(B), the second imaging unit 5 captures an image of the mark M of the board S visible in the transparent area T around the electronic component C through the mounting head 31 (step S106). The image recognition unit of the second imaging unit 5 recognizes the mark M from the image captured by the second imaging unit 5 and calculates position information of the mounting area B.

[0050] Note that, in step S106, the imaging of the mark M on the board S by the second imaging unit 5 may be performed while the mounting head 31 holding the electronic component C remains at the height position where the electronic component C was received, or may be performed after moving the mounting head 31 to a predetermined height position closer to the board S. When imaging at a closer height position, the amount of downward movement for mounting after imaging can be made smaller, and therefore movement errors can be further suppressed.

[0051] The control device 6 obtains the position information of the mounting area B and the amount of deviation from the reference position and the XY axis directions, and operates the driving mechanism 22 to position the board S so as to eliminate the deviation (step S107). Furthermore, as shown in Fig. 4(C), the driving mechanism 32 drives the mounting head 31 toward the board S, and the electronic component C held by the mounting head 31 is mounted on the board S (step S108).

[0052] In this manner, by repeating the operations of transferring the electronic components C, positioning the electronic components C and the board S, and mounting, the electronic components C are sequentially mounted in each mounting area B of the board S. The board S on which a predetermined number of electronic components C have been mounted is transported by the board support mechanism 2 and stored in the unloader.

[0053] [Effects] The mounting apparatus 1 of this embodiment includes a mounting mechanism 3 that mounts an electronic component C on a substrate S, a substrate support mechanism 2 that supports the substrate S on which the electronic component C is mounted, and a mounting head 31 provided on the mounting mechanism 3 and having a transparent portion that allows the mark M on the substrate S to be recognized through transmission while holding the electronic component C.

[0054] The mounting apparatus 1 also has a first imaging unit 4 that is positioned below the board support mechanism 2 at the mounting position OA where the mounting head 31 mounts the electronic component C on the board S, and that images the mark m of the electronic component C held by the mounting head 31 when the board S is retracted from the mounting position OA, a second imaging unit 5 that is positioned above the mounting head 31 at the mounting position OA and images the mark M of the board S through a transparent portion, and a positioning mechanism that positions the board S and the electronic component C based on the positions of the board S and the electronic component C determined from the images of the marks m and M captured by the first imaging unit 4 and the second imaging unit 5.

[0055] According to this embodiment, the electronic component C held by the mounting head 31 is imaged by the first imaging unit 4 arranged below the board support mechanism 2 at the mounting position OA with the board S retracted from the mounting position OA, and the board S supported by the board support mechanism 2 is imaged through the transparent portion of the mounting head 31 by the second imaging unit 5 arranged above the mounting head 31 at the mounting position OA, so that it is possible to image the mark m of the electronic component C and the mark M of the board S with the electronic component C and the board S as close together as possible.

[0056] Therefore, the movement amount of the electronic component C (mounting head 31) and the board S (board support mechanism 2) when capturing the marks m and M, and the relative movement amount of the electronic component C (mounting head 31) and the board S (board support mechanism 2) after capturing the marks m and M can be shortened as much as possible. Therefore, the increase in error caused by moving the mounting head 31 and the board support mechanism 2 over a long distance can be suppressed. In addition, the longer the movement distance of the mechanism, the more dust is generated. In this embodiment, the movement distance can be suppressed, so that it is possible to prevent the cleanliness from decreasing due to dust and the occurrence of poor bonding. In particular, when the board S is positioned on the mounting position OA, the movement amount of the mounting head 31 and the second imaging unit 5 positioned on the board S can be shortened as much as possible, so that it is possible to suppress the dust from falling and adhering to the board S. Note that when the mounting head 31 moves to transfer the electronic component C between the supply unit, the dust falls below it. However, in this embodiment, the mounting head 31 does not move to receive the electronic component C. When the mounting head 31 delivers the electronic components C to and from the transfer mechanism, the board S is retracted. Therefore, dust does not fall onto and adhere to the board S.

[0057] Also, for example, when the electronic component C on the mounting position OA and the mounting area B of the board S are recognized at the same time by an imaging camera capable of simultaneously imaging the up and down directions, it is necessary to insert the camera between the electronic component C and the board S when imaging. Therefore, the electronic component C and the board S must be separated so as not to interfere with the camera. Therefore, the distance that the electronic component C is moved to the board S during mounting becomes long. Also, during mounting, it is necessary to retreat the camera to a position where it does not interfere with the mounting head 31. According to the mounting device 1 of this embodiment, since the camera is not inserted between the electronic component C and the board S, the electronic component C and the board S can be imaged as close as possible. Therefore, the distance that the electronic component C moves to the board S during mounting after imaging can be shortened. Also, the camera is not moved significantly on the board S before and after imaging. Therefore, errors and dust generation associated with these movements can be suppressed.

[0058] As described above, the first imaging unit 4 and the second imaging unit 5 are disposed independently of the mounting head 31 and the stage 21 so as not to interfere with the movement of these units. Therefore, when positioning the electronic component C and the mounting area B of the board S, only the mounting head 31, only the stage 21, or both move, but since all of them are independent of the imaging units 4 and 5, the moving parts can be made lighter and movement errors can also be reduced compared to when they are not independent of the imaging units 4 and 5.

[0059] In comparison with this embodiment, for example, when the mark on the board S is imaged by the imaging unit integrally provided with the mounting head 31, the imaging unit is first positioned on the mounting position OA and imaged, the position of the board S is recognized based on the imaging result, and the electronic component C held by the mounting head 31 is positioned and mounted at a position that is positioned so as to align with the position of the electronic component C recognized separately. In this case, when the board S is imaged and mounted, the imaging unit and the mounting head 31 provided integrally with the mounting position OA move relative to the mounting position OA, which may increase the possibility of errors and dust generation. In the mounting device 1 of this embodiment, the mounting head 31, the mounting area B of the board S, the first imaging unit 4, and the second imaging unit 5 are independently disposed on the mounting position OA, so that only a slight movement is required for positioning, and the electronic component C and the board S are not moved together with the camera every time the imaging units 4 and 5 are used to image them. Therefore, mounting can be performed with high accuracy and dust generation can be suppressed.

[0060] Moreover, in order to achieve the high required accuracy, it is necessary to use a high-magnification camera. As in this embodiment, it is not practically possible to achieve the high required accuracy by arranging the second imaging unit 5 above the mounting head 31 and imaging the mark M through the mounting head 31, that is, by imaging the mark M through the transparent holding unit 31b, but by imaging the mark M with a camera provided on the mounting head 31 adjacent to the mounting head 31. First, the outer shape of the mounting head 31 must be larger than the electronic component C to be mounted. And the area on the board S where the mark M is applied is only a few millimeters larger than the area where the electronic component C is mounted. Therefore, the area where the mark M is applied is closer to the center of the mounting head 31 than the outer shape of the mounting head 31. For this reason, even if the lens barrel of the camera is arranged adjacent to the mounting head 31, when the mounting head 31 is positioned at the mounting position OA, the mark M does not fall within the field of view of the camera, and the mark M cannot be imaged by the camera. For this reason, the mounting head 31 must be shifted from the mounting position OA, and an image must be taken at a position where the mark M falls within the field of view of the camera.

[0061] Generally, the higher the magnification of the objective lens, the darker the image. The brightness of the image is proportional to the square of the numerical aperture (NA) and inversely proportional to the square of the total magnification (M). In other words, the larger the numerical aperture, the brighter the image, and the higher the magnification, the darker the image. Therefore, when high magnification is required, the numerical aperture must be large, and an objective lens with a large diameter must be used. For example, a lens barrel including an objective lens of a high-magnification camera that requires high-precision positioning usually requires an aperture of 10 mm or more. If the location where the optimal image can be obtained is the center of the lens, a camera installed in a position adjacent to the mounting head 31 will view a location 5 mm or more away from the edge of the mounting head 31. In this case, it is only possible to image a location away from the mounting head 31. For this reason, whether a single camera or multiple cameras are used, it is not possible to image the mark M of the substrate S when the center of the mounting head 31 is positioned at the mounting position OA. Therefore, in order to image the mark M of the substrate S, the camera needs to be positioned on the mark M of the substrate S.

[0062] That is, in order to capture an image of the mark M on the board S within the field of view, it is necessary to move the mounting head 31 and position the camera directly above the mark M, and errors will occur during this movement. For example, when recognizing the mark M on the board S after recognizing the mark m of the electronic component C and obtaining position information for positioning, it is necessary to move the camera together with the mounting head 31 in order to recognize the mark M, and even if the camera is then returned to its original position, errors associated with this movement may cause a shift in the position of the electronic component C. There is also a possibility of increased dust generation.

[0063] Furthermore, when only one of the multiple (two) marks M on the substrate S falls within the imaging field of view, in order to image the multiple (two) marks M on the substrate S, it is necessary to move the camera between the marks M to image them. In other words, in a camera provided on the mounting head 31 so as to be adjacent to the mounting head 31, it is necessary to move the camera (mounting head 31) by a distance greater than the separation distance between the two marks M, which may result in even larger errors or increased dust generation.

[0064] This is true whether there is a single camera or multiple cameras. Even if two cameras are arranged adjacent to the mounting head 31 so as to correspond to the two marks M, the field of view can only cover areas farther away than the distance between the two diagonally arranged marks M, so the cameras must be moved together with the mounting head 31, which similarly results in a misalignment.

[0065] Also, for example, when mark M on the board S is recognized first, and then mark m on the electronic component C is recognized, the electronic component C is hidden by a camera that captures the mark m of the electronic component C held by the mounting head 31 provided at the mounting position OA when the board S is in the position to be mounted (mounting position OA), and the position cannot be recognized. Therefore, after obtaining the position information for positioning, the board S must be moved to capture the image of mark m, and then returned to its original position, and this movement causes the board S to shift in position. In addition, dust generation increases.

[0066] It is also possible to prepare a template with a mark corresponding to the mark M on the board S at a position different from the position where the electronic component C is to be mounted, and to perform positioning based on the relative position between the mark on the template and the mark M on the board S. However, in this case, the mounting head 31 and the camera must be moved to recognize the mark on the template every time an electronic component C is mounted. This results in increased time required for recognizing the mark on the template and for positioning, which reduces productivity. In addition, the movement distance of the mechanism increases, which increases the amount of dust generated and the error associated with the movement.

[0067] In this embodiment, after the images of the marks m and M are captured, the moving distance of the electronic component C and the board S can be reduced, so that positional deviation, reduction in productivity, and amount of dust generation can all be reduced.

[0068] The transmission portion has a transparent plate-like member, so that it is possible to hold the electronic component C and ensure transparent imaging of the mark M on the board S in a narrow area corresponding to the size of the micro electronic component C.

[0069] The first imaging unit 4 and the second imaging unit 5 are provided immovably with respect to the mounting position OA. Therefore, there is no misalignment between the imaging area of ​​the first imaging unit 4 and the imaging area of ​​the second imaging unit 5, and dust generation due to movement can be prevented.

[0070] The stage 21 includes a driving mechanism 22 that functions as a positioning mechanism, and the driving mechanism 22 includes a two-axis moving mechanism that moves the stage 21 in a horizontal plane, and the two-axis moving mechanism includes a pair of guide rails 22a and a pair of guide rails 22b in a direction perpendicular to the pair of guide rails 22a and 22b, which are respectively arranged symmetrically with respect to the mounting position OA. Therefore, deformation of the stage 21 is suppressed when mounting an electronic component C on the board S positioned at the mounting position OA, and high-precision mounting is possible. Of course, since deformation can be suppressed by arranging the pair of guide rails 22a, 22b on either side of the mounting position OA, they are not necessarily limited to being arranged symmetrically with respect to the mounting position OA.

[0071] The driving mechanism 22 includes a movable plate 23 that moves along a guide rail 22b, and a through hole 23a is formed in the movable plate 23 so that the first imaging unit 4 can image the electronic component C. Therefore, the first imaging unit 4 can image the electronic component C without being hindered by a mechanism that positions the board S. Note that, as long as the first imaging unit 4 can image the board S, a light-transmitting member may be fitted in the through hole 23a, or a part or all of the movable plate 23 may be made of a light-transmitting member.

[0072] [Variations] (1) The mounting head 31 may be configured such that the second imaging unit 5 can capture an image of the mark M on the substrate S. Therefore, the transmissive portion of the mounting head 31 may not be made of a transparent material, and a through hole may be formed at a location corresponding to the mark M. More specifically, the holding portion 31b may be made of an opaque material, and a through hole may be formed at a location corresponding to the mark M, or the hollow portion 31a may not exist, the holding portion 31b may be made of an opaque material, and a through hole may be formed at a location corresponding to the mark M of the mounting head 31 and the holding portion 31b. In other words, such a through hole is also a transmissive portion of the mounting head 31.

[0073] (2) The imaging fields of view of the first imaging unit 4 and the second imaging unit 5 may be as follows. (A) Single-panel imaging field The collective imaging field of view is a field of view in which multiple marks m or multiple marks M can be imaged collectively. For example, the position of the electronic component C when it is handed over to the mounting head 31 varies within a certain range. For this reason, if the first imaging unit 4 has an imaging field of view in a range in which it can image the two marks m of the electronic component C even if their positions vary, it is not necessary to move the first imaging unit 4 in order to image the two marks m. Note that, if the second imaging unit 5 has a collective imaging field of view, it is also not necessary to move it in order to image the two marks M.

[0074] (B) Individual imaging fields The individual imaging field of view is an imaging field of view in which the multiple marks m or the multiple marks M are each individually imaged, that is, a field of view range in which one mark m or one mark M can be imaged.

[0075] In the above embodiment, a case has been described in which the first imaging unit 4 and the second imaging unit 5 can image the mounting area B of the electronic component C and the board S within one imaging field while being able to image the mark M through the mounting head 31. However, depending on the required mounting accuracy, a higher magnification may be used. In such a case, there is a risk that the mounting area B of the electronic component C and the board S cannot be imaged within one imaging field. In other words, the first imaging unit 4 and the second imaging unit 5 may only have individual imaging fields. In this case, as described above, it is necessary to move the imaging field between multiple marks to image the marks.

[0076] For example, the movement between marks in the imaging field of view is achieved by moving the mounting head 31 between two marks m provided at diagonal corners of the electronic component C relative to the first imaging unit 4 that images the electronic component C. The mounting head 31 is capable of XY movement, and so can be applied as is. Even when such movement between marks in the imaging field of view is necessary, only the mounting head 31 is moved, and the movement distance is limited to the range of the size of the electronic component C, so that a short movement distance is sufficient, thereby suppressing errors and dust generation.

[0077] Also, the movement between the marks m in the imaging field of view may be performed by moving the first imaging unit 4. That is, the first imaging unit 4 may be provided movably at the position (mounting position OA) where the electronic component C is mounted. When the first imaging unit 4 is made movable, a moving device for moving it is provided, and the first imaging unit 4 is fixed to the moving device. In this case, only the first imaging unit 4 moves, and the mounting head 31 does not move. Furthermore, the moving distance is limited to the range of the size of the electronic component C, and only a short moving distance is required. Therefore, errors and dust generation can be suppressed. Also, since the first imaging unit 4 is disposed below the board S, even if dust is generated, adhesion of dust to the surface of the board S can be suppressed.

[0078] Similarly, for example, in order to image two marks M provided at diagonal corners of a rectangular area near the mounting area B of the substrate S, the imaging field of view is moved between the marks M. In this case, the stage 21 is moved between the marks M relative to the second imaging unit 5 that images the substrate S. The stage 21 can be moved in the XY directions, so it can be applied as is. Even in this case, it is only the stage 21 that is moved, and the moving distance is limited to the range of the size of the vicinity of the mounting area B of the substrate S, so that the moving distance is short, and therefore errors and dust generation can be suppressed. The driving mechanism 22 of the stage 21 is disposed below the substrate S, so even if dust is generated, the dust will not adhere to the surface of the substrate S.

[0079] Also, the movement between the marks M may be performed by moving the second imaging unit 5. That is, the second imaging unit 5 may be provided movably at the position (mounting position OA) where the electronic component C is mounted. When the second imaging unit 5 is made movable, a moving device for moving it is provided, and the second imaging unit 5 is fixed to the moving device. In this case, only the second imaging unit 5 moves, and the mounting head 31 and the stage 21 do not move. Furthermore, the movement distance is limited to the range of the size of the vicinity of the mounting area B of the board S, and the movement distance is short. Therefore, errors and dust generation can be suppressed.

[0080] (3) In the above embodiment, positioning is performed so that the calculated position of the electronic component C and the position of the mounting area B of the board S are aligned with their respective reference positions, but this is not limited to this, and positioning may be performed so that the position of the mounting area B is aligned with the position of the electronic component C, or the position of the electronic component C is aligned with the position of the mounting area B. The point is that it is sufficient to be able to align the position of the mounting area B of the board S with the position of the electronic component C.

[0081] (4) In the above embodiment, the control device 6 controls the substrate S to move in order to position the electronic component C and the substrate S. However, the substrate S does not need to be moved in order to correct the positioning, i.e., the alignment. In this case, the electronic component C is moved by the mounting head 31. In many cases, a plurality of electronic components C are mounted on the substrate S as shown in FIG. 2. In such a substrate S, the moving range of the stage 21 for positioning each mounting area B at the mounting position OA becomes large. In this case, the positioning error often varies depending on the location within the movable range of the stage 21, and there is a risk that the recognition result of the substrate position by the camera (second imaging unit 5) that captures the substrate S may not be correctly reflected. Therefore, the deviation of the substrate position (mounting position OA=position of the mark M) from the reference position is positioned by moving the mounting head 31, so that the electronic component C and the substrate S can be more accurately positioned. In addition, by moving the smaller and lighter mounting head 31 instead of moving the large and heavy stage 21, the movement error can be further suppressed. In this case, the substrate positioning in step S107 in FIG.

[0082] (5) The transfer of the substrate S to the stage 21 of the substrate support mechanism 2 may be performed at the mounting position OA. In this case, after the substrate S is supplied to the stage 21, the substrate S may be retracted from the mounting position OA before the first imaging unit 4 captures an image of the mark m of the electronic component C.

[0083] (6) In the above embodiment, face-down mounting is performed. That is, in the case of face-down mounting, the surface (face) on which the semiconductor layer is formed of each individual electronic component C before being separated from the wafer faces upward, that is, face-up. The picked-up electronic component C is inverted and faces downward, that is, face-down. The transfer mechanism that receives it passes it to the mounting head 31 in a downward state, so that the mounting head 31 holds the electronic component C facing downward. The face (including the mark m) of the electronic component C is imaged by the first imaging unit 4 from below the mounting head 31. The board S moves below the mounting head 31. The face (including the mark M) of the board S is imaged by the second imaging unit 5 from above the mounting head 31 through the transmission part. The electronic component C held by the mounting head 31 is positioned relative to the board S and mounting is performed.

[0084] On the other hand, the mounting apparatus 1 in the above embodiment can also perform face-up mounting. In the case of face-up mounting, the first imaging unit 4 is not used because it cannot image the face of the electronic component C, and the face of the electronic component C is imaged by the second imaging unit 5. That is, the electronic component C picked up from the wafer is not inverted but faces upward. The transfer mechanism that receives it passes it to the mounting head 31 in an upward state, so that the mounting head 31 holds the electronic component C facing upward. From above the mounting head 31, the face (including the mark m) of the upward facing electronic component C is imaged by the second imaging unit 5 through the transmission part. The board S moves below the mounting head 31. From above the mounting head 31, the face (including the mark M) of the board S is imaged by the second imaging unit 5 through the transmission part. The electronic component C held by the mounting head 31 is positioned relative to the board S and mounting is performed.

[0085] When performing face-up mounting in this manner, the mounting head 31 may be positioned relative to the reference position of the electronic component C based on the imaging result of the mark m of the electronic component C, prior to positioning the electronic component C and the board S. If the electronic component C held by the mounting head 31 is significantly displaced from the reference position, the mark M of the board S may be hidden by the electronic component C, but this positioning can prevent such a situation. This is similar to the primary correction when the cameras of the first imaging unit 4 and the second imaging unit 5 described below are infrared cameras. As a result, the mounting apparatus 1 can be applied to face-up mounting while achieving the same effects as the above embodiment.

[0086] (7) The second imaging unit 5 may be a camera capable of capturing an image of the mark m of the electronic component C transparently. For example, the camera of the second imaging unit 5 capturing an image of the mark M of the board S may be an infrared camera. As a result, the mark m of the electronic component C held by the holder 31b is captured by the second imaging unit 5 through the holder 31b. The positioning mechanism performs positioning of the board S and the electronic component C based on the mark M of the board S and the mark m of the electronic component C captured by the second imaging unit 5. Prior to this, the positioning mechanism performs positioning of the electronic component C based on the position of the electronic component C obtained from the image of the mark m of the electronic component C captured by the first imaging unit 4.

[0087] That is, as described above, after the mark m of the electronic component C is imaged by the first imaging unit 4, the electronic component C is positioned at a reference position (first correction). Then, the mounting head 31 is moved to bring the electronic component C close to the board S, and the mark M of the board S and the electronic component C are simultaneously and transparently imaged by the second imaging unit 5, the board S is positioned (second correction), and the electronic component C is mounted on the board S. After the imaging by the second imaging unit 5, the mounting head 31 for mounting only needs to move downward a very short distance, further suppressing positional deviation.

[0088] This positioning operation will be specifically described with reference to the explanatory diagram in Fig. 6 and the flowchart in Fig. 7. The upper parts of Fig. 6(A) to (C) are side views showing the positions of the first imaging unit 4, the mounting head 31, and the second imaging unit 5, and the lower parts are plan views showing the positions of the electronic component C and mark m to be imaged, and the mark M on the board S.

[0089] The operations from the transfer of the electronic component C to the movement of the board S are the same as S101 to S105 described above (S201 to S205). That is, as shown in Fig. 6(A), the holder 31b for the electronic component C holds the electronic component C with the face with the mark m facing the first imaging unit 4. In this state, the first imaging unit 4 captures an image of the mark m to recognize its position, and performs a primary correction to align the electronic component C to a reference position.

[0090] Then, as shown in FIG. 6(B), the stage 21, which had been retracted, moves to the mounting position OA, i.e., below the second imaging unit 5 (step S205), and the mounting head 31 descends toward the placed board S, so that the electronic component C and the board S are positioned such that there is a gap of, for example, about 10 μm between them (step S206).

[0091] In this state, the second imaging unit 5 images the mark M of the board S through the transparent portion of the holder 31b (step S207). At the same time, the second imaging unit 5 images the mark m of the electronic component C held by the holder 31b through the transparent portion of the holder 31b and the electronic component C. As shown in Fig. 6(C), the second imaging unit 5 recognizes the positions of the marks m and M by imaging them, and positions the electronic component C and the board S (secondary correction) (step S208), and then lowers the mounting head 31 to mount the electronic component C on the board S (step S209).

[0092] As described above, the positions of the electronic component C and the board S are recognized simultaneously by the same imaging unit while the board S and the electronic component C are placed close to each other, so there is no position error between the imaging units that occurs when using position recognition results from multiple imaging units. This makes it possible to improve the accuracy of positioning the electronic component C and the board S compared to the above embodiment. In addition, because the distance of descent after positioning the electronic component C and the board S is small, positional deviations that occur due to descent movement are also suppressed, improving the accuracy of positioning.

[0093] When the second imaging unit 5 simultaneously recognizes the positions of the electronic component C and the board S, it is only necessary for the second imaging unit 5 to capture images of the mark m of the electronic component C and the mark M of the board S with a degree of recognition accuracy that ensures the necessary accuracy, and it is not necessarily necessary to perform the task of bringing the electronic component C and the board S close to each other in step S206. In this case, the downward movement of the electronic component C is not divided, and therefore the processing time can be shortened.

[0094] If the electronic component C held by the mounting head 31 is significantly deviated from the reference position, there is a possibility that the mark M of the board S will be hidden by the electronic component C, but this can be avoided by having the second imaging unit 5 recognize its position by imaging the marks m and M, and then performing a primary correction to align the electronic component C to the reference position by using the first imaging unit 4 to image and recognize the position, prior to a secondary correction to position the electronic component C and the board S. Note that if the positional deviation when the electronic component C is transferred to the mounting head 31 is within an acceptable range, it is not necessary to perform the primary correction.

[0095] Furthermore, such primary correction can also be applied to face-up mounting if a camera capable of capturing transparent images is used as the first imaging unit 4. That is, the first imaging unit 4 may have a camera capable of capturing transparent images of the mark m of the electronic component C, and the positioning mechanism may position the electronic component C based on the position of the electronic component C determined from the image of the mark m of the electronic component C captured by the first imaging unit 4, and then position the board S and the electronic component C based on the mark M of the board S and the mark m of the electronic component C captured by the second imaging unit 5. In this case, the second imaging unit 5 does not necessarily have to be a camera capable of capturing transparent images of the mark m of the electronic component C.

[0096] (8) A reference mark can be provided on the mounting head 31, which is a mounting tool. The mark provided on the mounting head 31 is provided so that it can be imaged by both the first imaging unit 4 and the second imaging unit 5. The positioning mechanism performs positioning of the board S and the electronic component C based on the positions of the board S and the electronic component C obtained from the images of the mark m of the electronic component C, the mark M of the board S, and the mark of the mounting head 31, which are imaged by the first imaging unit 4 and the second imaging unit 5. In this case, the mark of the mounting head 31 is imaged in advance by each of the first imaging unit 4 and the second imaging unit 5, and the positioning (reference alignment) of each camera of the first imaging unit 4 and the second imaging unit 5 is performed based on the mark of the mounting head 31. This can suppress the deviation of the position detection results between the cameras, and thus the position deviation of the mounting is further suppressed. In addition, the deviation due to the change in the position of each camera over time can also be suppressed.

[0097] For example, it is possible to use a jig prepared separately from the mounting head 31 to align the two cameras, but such a jig needs to be attached to the device when adjustment of the alignment between the cameras is necessary, and needs to be removed when imaging is completed. Since the jig needs to be set every time an adjustment is made, maintainability and productivity are poor. In addition, dust generation increases when the jig is installed and removed. It is also difficult to track changes over time in real time. In this embodiment, there is no need to bother with installing and removing the jig. Time-dependent adjustments can be made in real time during operation, achieving high mounting accuracy and suppressing dust generation.

[0098] Furthermore, because the mark on the mounting head 31 is used as the reference, no extra movement and time is required to recognize the mark, compared to, for example, using a mark on a template (jig) prepared separately from the mounting head 31 within the device, thereby suppressing reduced productivity, increased dust generation, and errors associated with movement.

[0099] This positioning operation will be specifically described with reference to the explanatory diagram in Fig. 8 and the flowchart in Fig. 9. The upper parts of Fig. 8(A) to (C) are side views showing the positions of the first imaging unit 4, mounting head 31, and second imaging unit 5, while the lower parts are plan views showing the positions of the electronic component C and mark m, mark M on the board S, and mark ma on the mounting head 31.

[0100] First, the mark ma of the mounting head 31 is provided on the lower end surface of the holding portion 31b at a position that does not overlap with the holding position of the electronic component C and can be imaged through the transmission portion. For example, as shown in FIG. 8(A), two marks ma are provided diagonally so as to be located outside the mark m of the electronic component C. Before the mounting head 31 holds the electronic component C, the mark ma of the mounting head 31 is imaged by the first imaging unit 4 and the second imaging unit 5, and a correction value that is the amount of deviation (including the tilt in the horizontal plane) of the position of the mark ma from each reference position is registered (step S301). The transport mechanism transports the electronic component C (step S302), and the mounting head 31 holds the electronic component C (step S303).

[0101] The first imaging unit 4 simultaneously captures the mark m of the electronic component C and the mark ma of the mounting head 31, and calculates the positional relationship between them (step S304). As shown in FIG. 8B, the board S moves to the mounting position OA (step S305), and the second imaging unit 5 simultaneously captures the mark M of the board S and the mark ma of the mounting head 31, and calculates the positional relationship between them (step S306). The positioning mechanism performs positioning of the electronic component C and the board S based on the mark ma of the mounting head 31 based on the registered correction values ​​of the first imaging unit 4 and the second imaging unit 5, the positional relationship between the mark m of the electronic component C and the mark ma of the mounting head 31, and the positional relationship between the mark M of the board S and the mark ma of the mounting head 31 (step S307). As shown in FIG. 8C, after positioning, the mounting head 31 is lowered to mount the electronic component C on the board S (step S308).

[0102] As described above, the positional relationship between the first imaging unit 4 and the second imaging unit 5 can be grasped using the mark ma provided on the mounting head 31 as a reference, and the electronic component C and the board S can be aligned. Since the positional error between the multiple imaging units can be suppressed, the positioning accuracy between the electronic component C and the board S can be further improved than in the above embodiment. Furthermore, even if the positional relationship between the multiple imaging units changes over time, the positioning accuracy between the electronic component C and the board S can be maintained, so the positioning accuracy is improved. Furthermore, in the above embodiment, it takes time to assemble the mounting device 1 in order to bring the positions of the first imaging unit 4 and the second imaging unit 5 as close as possible to the reference position (design position), but in this embodiment, high accuracy is not required for the positions of the first imaging unit 4 and the second imaging unit 5 relative to the reference position during assembly, which saves labor during manufacturing and maintenance of the device.

[0103] The mark ma provided on the mounting head 31 may be a feature point (mark) that can be imaged by the first imaging unit 4 and the second imaging unit 5. The feature point may be a printed or engraved pattern, a recess, or a through hole. When the holding unit 31b on which the mark ma is provided is made of a transparent plate material such as glass, the mark ma does not necessarily need to be provided on the lower end surface of the holding unit 31b, and the mark ma may be provided on the surface of the holding unit 31b opposite to the surface that holds the electronic component C. Even in this case, the first imaging unit 4 and the second imaging unit 5 can similarly image the mark ma, and errors can be suppressed. Furthermore, if the mark ma is a through hole, one hole can be imaged by the first imaging unit 4 and the second imaging unit 5 even if the holding unit 31b is not made of a transparent material, so errors can also be suppressed.

[0104] Also, instead of providing a mark on the mounting head 31, for example, the through hole 23a formed in the moving plate 23 of the board support mechanism 2 may be a translucent member such as a transparent glass plate, and the mark may be provided on the translucent member. The through hole 23a is a portion for capturing an image of the electronic component C by the first imaging unit 4, and therefore does not interfere with the board S.

[0105] [Other embodiments] Although the embodiment of the present invention and the modified examples of each part have been described above, these embodiments and the modified examples of each part are presented as examples and are not intended to limit the scope of the invention. These novel embodiments described above can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the invention described in the claims. [Explanation of symbols]

[0106] 1 Mounting equipment 2 Board support mechanism 3. Mounting mechanism 4 First imaging unit 5 Second imaging unit 6. Control device 11 Support stand 11a Receiving hole 21 Stage 22 Drive mechanism 22a, 22b, 33a, 34a, 35a Guide rails 23 Moving Board 23a Through hole 31 Mounting head 31a Hollow part 31b Holding part 32 Drive mechanism 33, 34, 35 Mobile C Electronic components S-substrate m, M, ma marks

Claims

1. A mounting mechanism for mounting electronic components on a substrate; a substrate support mechanism for supporting the substrate on which the electronic components are mounted; a mounting head provided in the mounting mechanism and having a transmission portion that allows the mark on the board to be recognized through transmission while the electronic component is being held; a first imaging unit that is disposed below the board support mechanism at a mounting position where the mounting head mounts the electronic component on the board, and that images an image of a mark of the electronic component held by the mounting head in a state where the board is retracted from the mounting position; a second imaging unit that is disposed above the mounting head at the mounting position and that images the mark on the board through the transmission unit; a positioning mechanism that performs positioning of the board and the electronic component based on positions of the board and the electronic component obtained from images of marks captured by the first imaging unit and the second imaging unit; An electronic component mounting device comprising:

2. 2. The electronic component mounting apparatus according to claim 1, wherein the first imaging section and the second imaging section are provided immovably with respect to the mounting position.

3. the second imaging unit has a camera capable of capturing an image of the mark of the electronic component through a transparent manner, 2. The electronic component mounting apparatus according to claim 1, wherein the positioning mechanism positions the board and the electronic component based on the marks on the board and the marks on the electronic component captured by the second imaging unit.

4. The electronic component mounting device according to claim 3, characterized in that the positioning mechanism positions the electronic component based on the position of the electronic component determined from the image of the mark of the electronic component captured by the first imaging unit, prior to positioning the board and the electronic component based on the mark of the board and the mark of the electronic component captured by the second imaging unit.

5. the first imaging unit has a camera capable of capturing an image of a mark of the electronic component through a transparent manner, The electronic component mounting device according to claim 1, characterized in that the positioning mechanism positions the electronic component based on the position of the electronic component determined from the image of the mark of the electronic component captured by the first imaging unit, and then positions the board and the electronic component based on the mark of the board and the mark of the electronic component captured by the second imaging unit.

6. the mounting head is provided with a mark that can be imaged by the first imaging unit and that can be imaged by the second imaging unit; The electronic component mounting device according to claim 1, characterized in that the positioning mechanism positions the board and the electronic component based on positions of the board and the electronic component determined from images of the mark of the electronic component, the mark of the board, and the mark of the mounting head captured by the first imaging unit and the second imaging unit.

7. 2. The electronic component mounting apparatus according to claim 1, wherein the transmitting portion has a transparent plate-like member.

8. 8. The electronic component mounting apparatus according to claim 1, further comprising a transfer mechanism for transferring the electronic component to the mounting head at the mounting position.

Images