Thermal management system and switching device

Abstract

To provide a thermal management system capable of adjusting pressure of a heating medium in each of a first closed circuit and a second closed circuit while suppressing a change of a flow rate of the heating medium in each of the first closed circuit and the second closed circuit by using a pressure adjustment mechanism.SOLUTION: A thermal management system includes: a five-way valve 180 (switching device) that switches a flowing path of a heating medium in a plurality of paths (130a, 130b, 170a, 170b) (external flow passages); and a reservoir tank 175 (pressure adjustment mechanism). The five-way valve 180 enables switching so as to form a path 181 (first path) for forming a closed circuit 190 (first closed circuit) in which the reservoir tank is provided, a path 182 (second path) for forming a closed circuit 191 (second closed circuit) in which the reservoir tank is not provided and a communication passage 184 for communicating the closed circuit 190 and the closed circuit 191. A flow passage area of the communication passage 184 is smaller than that of each of the path 181 and the path 182.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to thermal management systems and switching devices. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2017-150352 (Patent Document 1) discloses a thermal management system for a vehicle including a reserve tank and a plurality of heat medium circuits connected to the reserve tank. A valve for controlling the flow of the heat medium is provided between the reserve tank and each of the plurality of heat medium circuits. The heat medium circuit connected to the reserve tank is switched by switching the valve. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-150352 A Summary of the Invention [Problem to be solved by the invention]

[0004] Although not specified in the above Patent Document 1, when one of the heat medium circuits (first closed circuit) is in communication with the reserve tank (pressure adjustment mechanism), it is also possible to connect the reserve tank to another of the heat medium circuits (second closed circuit). In this case, since the first closed circuit and the second closed circuit are connected via the reserve tank, it is considered that the flow rate of the heat medium in each of the first closed circuit and the second closed circuit changes.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has as its objective to provide a thermal management system and a switching device that are capable of adjusting the pressure of the heat medium in each of the first closed circuit and the second closed circuit using a pressure adjustment mechanism while suppressing changes in the flow rate of the heat medium in each of the first closed circuit and the second closed circuit. [Means for solving the problem]

[0006] A thermal management system according to a first aspect of the present disclosure is provided in an electric device, and includes a plurality of external flow paths through which a heat medium flows, a switching device that switches the connection state of the plurality of external flow paths to switch the flow path of the heat medium in the plurality of external flow paths, and a pressure adjustment mechanism that is provided in the plurality of external flow paths to adjust the pressure of the heat medium. The switching device is configured to be switchable to form a first path for forming a first closed circuit in which the pressure adjustment mechanism is provided, a second path for forming a second closed circuit in which the pressure adjustment mechanism is not provided, and a communication path that communicates the first closed circuit and the second closed circuit. The flow path area of ​​the communication path is smaller than the flow path area of ​​at least one of the first path and the second path.

[0007] In the thermal management system according to the first aspect of the present disclosure, as described above, the flow path area of ​​the communication passage that communicates the first closed circuit and the second closed circuit is smaller than the flow path area of ​​at least one of the first path and the second path. This allows the flow rate of the heat medium flowing through the communication passage to be reduced compared to when the flow path area of ​​the communication passage is larger than the flow path area of ​​both the first path and the second path. As a result, the first closed circuit and the second closed circuit can be communicated through the communication passage while minimizing the movement of the heat medium from the first closed circuit to the second closed circuit. This allows the pressure adjustment mechanism to adjust the pressure of the heat medium in each of the first closed circuit and the second closed circuit while suppressing changes in the flow rate of the heat medium in each of the first closed circuit and the second closed circuit.

[0008] In the thermal management system according to the first aspect, the communication passage is preferably configured to enable the pressure adjustment mechanism to adjust the pressure of each of the first closed circuit and the second closed circuit while suppressing a change in the flow rate of the heat medium in each of the first closed circuit and the second closed circuit. With this configuration, the flow rate of the heat medium in each of the first closed circuit and the second closed circuit can be kept constant, and pressure changes in each of the first closed circuit and the second closed circuit can be suppressed.

[0009] In the thermal management system according to the first aspect, the plurality of external flow paths preferably include a first flow path through which a heat medium that exchanges heat with the power storage device flows, a second flow path through which a heat medium that exchanges heat with a drive device capable of generating a drive force flows, a third flow path provided with a radiator, a fourth flow path provided with a chiller device, and a bypass path that bypasses the power storage device. The switching device is configured to be able to switch between a state in which a first closed circuit in which the first flow path and the fourth flow path are connected and a second closed circuit in which the second flow path and the third flow path are connected are formed, and a state in which a first closed circuit in which the bypass path and the fourth flow path are connected and a second closed circuit in which the second flow path and the third flow path are connected are formed. With this configuration, in each of the two states that can be switched by the switching device, the pressure of the heat medium in each of the first closed circuit and the second closed circuit can be adjusted by the pressure adjustment mechanism while suppressing a change in the flow rate of the heat medium in each of the first closed circuit and the second closed circuit.

[0010] In this case, the pressure adjustment mechanism is preferably provided at a junction of the first flow path and the bypass path. With this configuration, the pressure adjustment mechanism can adjust the pressure in both the first closed circuit and the second closed circuit, regardless of whether the first closed circuit includes the first flow path or the bypass.

[0011] A switching device according to a second aspect of the present disclosure includes a case, a first flow pipe, a second flow pipe, a third flow pipe, a fourth flow pipe, and a fifth flow pipe connected to the case, and a valve body unit provided in the case. The interior space of the case is divided into a first space and a second space by the valve body unit. The valve body unit includes a disk-shaped first valve body provided on the first space side in the case, and a cylindrical second valve body provided rotatably around a rotation center line relative to the first valve body and arranged on the second space side. The first valve body includes an outer peripheral wall extending annularly around the rotation center line, an inner peripheral wall extending annularly around the rotation center line and formed on the rotation center line side of the outer peripheral wall, and a plurality of partition walls formed to connect the inner peripheral wall and the outer peripheral wall. The first valve body is formed with a plurality of fan-shaped partition through holes formed by the plurality of partition walls between the outer peripheral wall and the inner peripheral wall, and a central through hole formed by the inner peripheral wall. The second valve body has a second valve body through hole penetrating in the direction of the rotation center line and a communication groove opening toward the first space. The second valve body through hole is formed so as to overlap at least one of the multiple partition through holes in the direction of the rotation center line. The communication groove includes a central groove overlapping with the central through hole in the direction of the rotation center line and an outer peripheral groove communicating with the central groove and overlapping with at least one of the multiple partition through holes in the direction of the rotation center line. The multiple partition through holes include a first partition through hole communicating with the first flow pipe, a second partition through hole communicating with the second flow pipe, and a third partition through hole communicating with the third flow pipe. The central through hole communicates with the fourth flow pipe. The second valve body through hole communicates with the fifth flow pipe. When the second valve body side through hole overlaps with the first partition through hole in the direction along which the rotation center line extends, the outer peripheral groove overlaps with the second partition through hole and the third partition through hole in the direction along which the rotation center line extends, and when the outer peripheral groove overlaps with the third partition through hole in the direction along which the rotation center line extends, the second valve body side through hole overlaps with the second partition through hole and the third partition through hole in the direction along which the rotation center line extends.

[0012] In the switching device according to the second aspect of the present disclosure, as described above, the outer peripheral groove overlaps with the second partition through hole and the third partition through hole in the direction in which the rotation center line extends. This allows the overlapping area between the outer peripheral groove and each of the second partition through hole and the third partition through hole to be adjusted. As a result, for example, the overlapping area between the outer peripheral groove and the second partition through hole can be made smaller than the overlapping area between the outer peripheral groove and the third partition through hole. This allows the movement of the heat medium between the closed circuit communicating with the third partition through hole (hereinafter, the first closed circuit) and the closed circuit communicating with the second partition through hole (hereinafter, the second closed circuit) to be suppressed as much as possible through the communication passage formed by the outer peripheral groove and the second partition through hole overlapping. In addition, if a pressure adjustment mechanism is provided in either the first closed circuit or the second closed circuit, the pressure of each of the first closed circuit and the second closed circuit can be adjusted by the pressure adjustment mechanism through the communication passage. Therefore, it is possible to adjust the pressure of the heat medium in each of the first closed circuit and the second closed circuit while suppressing a change in the flow rate of the heat medium in each of the first closed circuit and the second closed circuit. Effect of the Invention

[0013] According to the present disclosure, the pressure of the heat medium in each of the first closed circuit and the second closed circuit can be adjusted by the pressure adjustment mechanism while suppressing changes in the flow rate of the heat medium in each of the first closed circuit and the second closed circuit. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 illustrates a configuration of a thermal management system according to one embodiment. [Diagram 2] FIG. 2 illustrates a thermal management circuit configuration according to one embodiment. [Diagram 3] FIG. 1 is a perspective view showing a configuration of a five-way valve according to one embodiment. [Figure 4] FIG. 2 is a perspective view showing the configuration of a valve body unit of a five-way valve according to one embodiment. [Diagram 5] FIG. 2 is a plan view showing a configuration when the valve body unit according to the embodiment is disassembled. [Figure 6]FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] FIG. 2 illustrates a first communication mode according to one embodiment. [Figure 8] FIG. 11 illustrates a second communication mode according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and the description thereof will not be repeated. In the drawings, the Z axis indicates the vertical upward direction.

[0016] In the following, a configuration in which the thermal management system 1 according to the present disclosure is mounted on an electric vehicle 200 will be described as an example. The electric vehicle 200 is preferably a vehicle equipped with a battery for driving. The electric vehicle 200 may be, for example, a BEV (Battery Electric Vehicle), a HEV (Hybrid Electric Vehicle), a PHEV (Plug-in Hybrid Electric Vehicle), or a FCEV (Fuel Cell Electric Vehicle). However, the thermal management system of the present disclosure may be applied to a vehicle other than an electric vehicle (for example, a stationary power storage device). The electric vehicle 200 is an example of an "electrical device" of the present disclosure.

[0017] <Overall composition> 1 is a diagram illustrating an example of an overall configuration of a thermal management system 1 according to an embodiment of the present disclosure. The thermal management system 1 includes a thermal management circuit 100, an electronic control unit (ECU) 500, and an HMI (Human Machine Interface) 600.

[0018] A heat medium flows through the thermal management circuit 100. The thermal management circuit 100 includes, for example, a high temperature circuit 110, a radiator 120, a low temperature circuit 130, a condenser 140, a refrigeration cycle 150, a chiller 160, a battery circuit 170, and a five-way valve 180.

[0019] The high temperature circuit 110 includes, for example, a water pump (W / P) 111, an electric heater 112, a three-way valve 113, a heater core 114, and a reservoir tank (R / T) 115. The radiator 120 is connected (i.e., shared) to both the high temperature circuit 110 and the low temperature circuit 130. The radiator 120 includes a high temperature (HT) radiator 121 and a low temperature (LT) radiator 122 (both see FIG. 2).

[0020] The low temperature circuit 130 includes, for example, a water pump 131, a smart power unit (SPU) 132, a power control unit (PCU) 133, an oil cooler (O / C) 134, and a step-up / step-down converter 135. The capacitor 140 is connected to both the high temperature circuit 110 and the refrigeration cycle 150.

[0021] The refrigeration cycle 150 includes, for example, a compressor 151, an expansion valve 152, an evaporator 153, an evaporative pressure regulator (EPR) 154, and an expansion valve 155. The chiller 160 is connected to both the refrigeration cycle 150 and the battery circuit 170.

[0022] The battery circuit 170 includes, for example, a water pump 171, an electric heater 172, a battery 173, a bypass path 174, and a reservoir tank (R / T) 175. The five-way valve 180 is connected to the low-temperature circuit 130 and the battery circuit 170. The bypass path 174 and the reservoir tank 175 are examples of the "external flow path" and the "pressure adjustment mechanism" of the present disclosure, respectively. The five-way valve 180 is an example of the "switching device" of the present disclosure.

[0023] The ECU 500 controls the thermal management circuit 100. The ECU 500 includes a processor 501, a memory 502, a storage 503, and an interface 504.

[0024] The processor 501 is, for example, a central processing unit (CPU) or a micro-processing unit (MPU). The memory 502 is, for example, a random access memory (RAM). The storage 503 is a rewritable non-volatile memory such as a hard disk drive (HDD), a solid state drive (SSD), or a flash memory. The interface 504 controls communication between the ECU 500 and the components of the thermal management circuit 100.

[0025] The ECU 500 generates a control command based on sensor values ​​(e.g., temperatures at various locations) acquired from various sensors (not shown) included in the thermal management circuit 100, user operations accepted by the HMI 600, and the like, and outputs the generated control command to the thermal management circuit 100. The ECU 500 may be divided into multiple ECUs for each function. Although an example in which the ECU 500 includes one processor 501 is shown in FIG. 1, the ECU 500 may include multiple processors. The same applies to the memory 502 and the storage 503.

[0026] The HMI 600 is a display with a touch panel, an operation panel, a console, etc. The HMI 600 accepts a user operation for controlling the thermal management system 1. The HMI 600 outputs a signal indicating the user operation to the ECU 500.

[0027] <Thermal management circuit configuration> 2 is a diagram showing an example of the configuration of the thermal management circuit 100 in this embodiment. The heat medium (usually hot water) circulating in the high-temperature circuit 110 flows through one or both of a first path of the water pump 111-condenser 140-electric heater 112-three-way valve 113-heater core 114-reservoir tank 115-water pump 111 and a second path of the water pump 111-condenser 140-electric heater 112-three-way valve 113-high-temperature radiator 121-reservoir tank 115-water pump 111.

[0028] The water pump 111 circulates the heat medium in the high-temperature circuit 110 in accordance with a control command from the ECU 500. The electric heater 112 heats the heat medium in accordance with a control command from the ECU 500. The three-way valve 113 switches between the first path and the second path in accordance with a control command from the ECU 500.

[0029] The heat medium (coolant) circulating through the low-temperature circuit 130 flows through a path of the water pump 131-SPU 132-PCU 133-oil cooler 134-boost / step-down converter 135-five-way valve 180-low-temperature radiator 122-water pump 131. The low-temperature circuit 130 is composed of a path 130a of the water pump 131-SPU 132-PCU 133-oil cooler 134-boost / step-down converter 135-five-way valve 180 and a path 130b of the five-way valve 180-low-temperature radiator 122-water pump 131. The paths 130a and 130b are examples of the "second flow path" and "third flow path" of the present disclosure, respectively.

[0030] The water pump 131 circulates the heat medium in the low-temperature circuit 130 in accordance with a control command from the ECU 500. The SPU 132 controls the charging and discharging of the battery 173 in accordance with a control command from the ECU 500. The PCU 133 converts the DC power supplied from the battery 173 into AC power in accordance with a control command from the ECU 500, and supplies the AC power to a motor (not shown) built into the transaxle. The step-up / step-down converter 135 increases / decreases the voltage of the battery 173 in accordance with a control command from the ECU 500. The five-way valve 180 switches the paths of the heat medium in the low-temperature circuit 130 and the battery circuit 170 in accordance with a control command from the ECU 500. The low-temperature radiator 122 is disposed near the high-temperature radiator 121, and exchanges heat with the high-temperature radiator 121.

[0031] The heat medium (gas phase refrigerant or liquid phase refrigerant) circulating through the refrigeration cycle 150 flows through one or both of a first path of the compressor 151-condenser 140-expansion valve 152-evaporator 153-EPR 154-compressor 151 and a second path of the compressor 151-condenser 140-expansion valve 155-chiller 160-compressor 151.

[0032] The heat medium (coolant) circulating through the battery circuit 170 flows through one or both of a first path of the water pump 171-chiller 160-five-way valve 180-electric heater 172-battery 173-reservoir tank 175-water pump 171 and a second path of the water pump 171-chiller 160-five-way valve 180-bypass path 174-reservoir tank 175-water pump 171. The first path is composed of a path 170a of the reservoir tank 175-water pump 171-chiller 160-five-way valve 180 and a path 170b of the five-way valve 180-electric heater 172-battery 173-reservoir tank 175. The paths 170a and 170b are examples of the "fourth flow path" and the "first flow path", respectively.

[0033] The water pump 171 circulates the heat medium in the battery circuit 170 in accordance with a control command from the ECU 500. The electric heater 172 heats the heat medium in accordance with a control command from the ECU 500. The bypass path 174 is provided so that the heat medium bypasses the electric heater 172 and the battery 173. When the heat medium flows through the bypass path 174, a change in temperature of the heat medium caused by heat absorption / dissipation between the heat medium and the battery 173 can be suppressed.

[0034] The reservoir tank 175 stores a portion of the heat medium in the battery circuit 170, thereby maintaining the pressure and amount of the heat medium in the battery circuit 170. The reservoir tank 175 is provided at a junction 175a where the path 170b and the bypass path 174 join together.

[0035] <Five-way valve> FIG. 3 is a perspective view showing an example of the external configuration of the five-way valve 180. The five-way valve 180 includes a case 91. The case 91 has a hollow columnar shape (cylindrical shape) extending in the vertical direction (Z direction) and accommodates a valve body 92 (see FIG. 4). Five ports P1 to P5 are provided in the case 91. The ports P1 to P5 are examples of the "fifth flow pipe," the "first flow pipe," the "fourth flow pipe," the "second flow pipe," and the "third flow pipe" of the present disclosure, respectively. The valve body 92 is an example of the "valve body unit" of the present disclosure. The Z direction is an example of the "direction in which the rotation center line extends" of the present disclosure.

[0036] The port P1 is an inlet port through which the heat medium flows in from the chiller 160. The port P2 is an outlet port through which the heat medium flows out toward the electric heater 172 and the battery 173 (battery 173 is shown representatively) of the battery circuit 170. The port P3 is an inlet port through which the heat medium flows in from the SPU 132, the PCU 133, the oil cooler 134, and the step-up / step-down converter 135 (PCU 133 is shown representatively) of the low-temperature circuit 130. The port P4 is an outlet port through which the heat medium flows out toward the bypass path 174 of the battery circuit 170. The port P5 is an outlet port through which the heat medium flows out toward the low-temperature radiator 122.

[0037] The ports P2, P3, P4, and P5 are disposed on the upper part (Z1 side) of the case 91. On the other hand, the port P1 is disposed on the lower part (Z2 side) of the case 91.

[0038] FIG. 4 is a perspective view showing an example of the configuration of the valve body 92. The valve body 92 has a cylindrical shape extending in the vertical direction. The valve body 92 includes a disk-shaped fixed part 93 and a cylindrical driving part 94. The driving part 94 is driven to rotate around a rotation axis AX, while the fixed part 93 is always fixed while ensuring slidability between the fixed part 93 and the driving part 94. The fixed part 93 and the driving part 94 are examples of the "first valve body" and the "second valve body", respectively, of the present disclosure. The rotation axis AX is also an example of the "rotation center line" of the present disclosure.

[0039] The fixed portion 93 is provided on an upper space U side (Z1 side) described below within the case 91. The drive portion 94 is provided on a lower space L side (Z2 side) described below within the case 91. That is, the fixed portion 93 is disposed (placed) on the Z1 side of the drive portion 94.

[0040] The fixed portion 93 includes an outer peripheral wall 93a extending in an annular shape centered on the rotation axis AX. The fixed portion 93 also includes an inner peripheral wall 93b extending in an annular shape centered on the rotation axis AX and formed on the rotation axis AX side (radially inward) of the outer peripheral wall 93a. The fixed portion 93 also includes a plurality of (three in this embodiment) partition walls 93c formed to connect the inner peripheral wall 93b and the outer peripheral wall 93a. Each of the plurality of partition walls 93c is formed to extend in the radial direction at a different position from each other in the circumferential direction of the fixed portion 93.

[0041] The fixing portion 93 is provided with three sector-shaped holes 931, 932, and 933. Each of the holes 931, 932, and 933 is formed by a plurality of partition walls 93c between the outer peripheral wall 93a and the inner peripheral wall 93b. That is, each of the holes 931, 932, and 933 is surrounded by the outer peripheral wall 93a, the inner peripheral wall 93b, and the two partition walls 93c. Each of the holes 931, 932, and 933 is provided so as to extend along the outer peripheral edge of the fixing portion 93. Each of the holes 931, 932, and 933 is an example of a "partition through hole" of the present disclosure. Also, the holes 931, 932, and 933 are examples of a "first partition through hole", a "second partition through hole", and a "third partition through hole" of the present disclosure, respectively.

[0042] The fixing portion 93 has a circular hole 934. The hole 934 is formed by the inner circumferential wall 93b. The hole 934 is provided in the center of the fixing portion 93. Therefore, the hole 934 is provided so as to be surrounded by the holes 931, 932, and 933. The hole 934 is an example of a "central through hole" in the present disclosure.

[0043] The four holes 931, 932, 933, and 934 respectively correspond to (are in communication with) the four ports P2, P4, P5, and P3 arranged in the upper part of the case 91. Each of the holes 931 to 934 is a through hole that penetrates the fixing portion 93 in the Z direction.

[0044] The drive portion 94 is provided with a communication groove 941 and a vertical through hole 942. The communication groove 941 is open toward the upper space U side (Z1 side) but is not open toward the lower space L side (Z2 side). The communication groove 941 includes a central groove 941a and an outer peripheral groove 941b. The vertical through hole 942 is an example of a "second valve body side through hole" of the present disclosure.

[0045] 5, when viewed from the Z1 side, the central groove 941a is provided in the center of the drive portion 94. When viewed from the Z1 side, the central groove 941a has a circular shape.

[0046] The outer circumferential groove 941b is formed continuously with the central groove 941a. The outer circumferential groove 941b is provided radially outward of the central groove 941a and is formed so as to extend in the circumferential direction of the drive portion 94. The outer circumferential groove 941b has a sector shape when viewed from the Z1 side.

[0047] The vertical through hole 942 penetrates the drive portion 94 in the Z direction. The vertical through hole 942 corresponds to (communicates with) the port P1. The vertical through hole 942 has a sector shape when viewed from the Z1 side.

[0048] The central groove 941a overlaps with the hole 934 of the fixed portion 93 in the Z direction regardless of the rotation angle of the drive portion 94. The outer circumferential groove 941b overlaps with one or two of the holes 931, 932, and 933 of the fixed portion 93 in the Z direction. The vertical through hole 942 overlaps with one or two of the holes 931, 932, and 933 of the fixed portion 93 in the Z direction. In other words, the holes (931 to 933) that overlap with each of the outer circumferential groove 941b and the vertical through hole 942 in the Z direction change depending on the rotation angle of the drive portion 94.

[0049] Fig. 6 is a schematic cross-sectional view of the case 91 and the valve body 92 cut along a plane including the rotation axis AX. As shown in Fig. 6, the internal space of the case 91 is divided into an upper space U and a lower space L by the valve body 92. The upper space U and the lower space L are provided on the Z1 side and the Z2 side of the valve body 92, respectively. The upper space U and the lower space L are examples of the "first space" and the "second space" of the present disclosure, respectively.

[0050] The heat medium that flows into the case 91 from the port P3 passes through an internal flow path 95 of the case 91 that communicates with the port P3, and then passes through a hole 934 of the fixed part 93. The heat medium that passes through the hole 934 flows into a central groove 941a of the drive part 94. The heat medium that flows into the central groove 941a flows from the central groove 941a to the outer circumferential groove 941b. The heat medium that flows into the outer circumferential groove 941b passes through any one (one or two) of the holes 931 to 933 of the fixed part 93, and flows out from the port (P2, P4, or P5) corresponding to the hole (931 to 933) through which it passed.

[0051] The heat medium that flows into the case 91 from the port P1 passes through the lower space L and then through the vertical through-hole 942 of the drive part 94. The heat medium that has passed through the vertical through-hole 942 passes through any (one or two) of the holes 931-933 of the fixed part 93, and flows out from the port (P2, P4, or P5) corresponding to the hole (931-933) through which the heat medium passed.

[0052] 7 is a diagram showing the first communication mode of the thermal management circuit 100. In the first communication mode, a path 181 is formed in the five-way valve 180, which communicates between the port P1 and the port P2, thereby forming a closed circuit 190. The closed circuit 190 is a circuit that connects the battery 173 (path 170b) and the chiller 160 (path 170a). The closed circuit 190 and the path 181 are examples of the "first closed circuit" and the "first path" of the present disclosure, respectively.

[0053] In the first communication mode, a path 182 is formed in the five-way valve 180, connecting the port P3 and the port P5, thereby forming a closed circuit 191. The closed circuit 191 is a circuit that connects the low-temperature radiator 122 (path 130b) and the PCU 133 (path 130a). The closed circuit 190 is provided with a reservoir tank 175, whereas the closed circuit 191 is not provided with a reservoir tank. The closed circuit 191 and the path 182 are examples of a "second closed circuit" and a "second path" of the present disclosure, respectively.

[0054] 8 is a diagram showing the second communication mode of the thermal management circuit 100. In the second communication mode, a path 183 is formed in the five-way valve 180, which communicates between the port P1 and the port P4, thereby forming a closed circuit 192. The closed circuit 192 is a circuit that connects the bypass path 174 and the chiller 160 (path 170a). In the second communication mode, a closed circuit 191 is also formed. The closed circuit 192 is provided with a reservoir tank 175. The closed circuit 192 and the path 183 are examples of the "first closed circuit" and the "first path" of the present disclosure, respectively.

[0055] Here, in conventional thermal management systems, when one of a plurality of heat medium circuits (first closed circuit) is connected to a reservoir tank (pressure adjustment mechanism), no consideration is given to adjusting the pressure of the heat medium in the other heat medium circuit (second closed circuit) by the reservoir tank without changing the flow rate of the heat medium in the other heat medium circuit.

[0056] Therefore, in this embodiment, a communication passage 184 is formed to communicate the closed circuit 190 and the closed circuit 191 in the example shown in FIG. 7. The closed circuit 190 and the closed circuit 191 are indirectly communicated via the bypass path 174. The flow path area of ​​the communication passage 184 is smaller than the flow path area of ​​the path 181 and the flow path area of ​​the path 182. The flow path area of ​​the communication passage 184 is the area of ​​the portion where the outer peripheral groove 941b and the hole 932 overlap in the Z direction (the hatched portion in FIG. 7). The flow path area of ​​the path 181 is the area of ​​the portion where the vertical through hole 942 and the hole 931 overlap in the Z direction. The flow path area of ​​the path 182 is the area of ​​the portion where the outer peripheral groove 941b and the hole 933 overlap in the Z direction. The flow path area of ​​the communication passage 184 may be, for example, 1% to 20% of each of the flow path area of ​​the path 181 and the flow path area of ​​the path 182.

[0057] The communication passage 184 is formed by overlapping in the Z direction between the vicinity of the circumferential end 941c of the outer circumferential groove 941b and the vicinity of the circumferential end 932a of the hole 932. Note that the vicinity of the end means a region very close to the end, for example, about several mm from the end.

[0058] In the example shown in Fig. 8, a communication passage 185 is formed to communicate the closed circuit 191 and the closed circuit 192. The flow path area of ​​the communication passage 185 is smaller than each of the flow path areas of the path 182 and the path 183. The flow path area of ​​the communication passage 185 is the area of ​​a portion where the vertical through hole 942 and the hole 933 overlap in the Z direction (the hatched portion in Fig. 8). The flow path area of ​​the path 183 is the area of ​​a portion where the vertical through hole 942 and the hole 932 overlap in the Z direction. The flow path area of ​​the communication passage 185 may be, for example, 1% to 20% of each of the flow path areas of the path 182 and the path 183.

[0059] The communication passage 185 is formed by overlapping the vicinity of the circumferential end 942a of the vertical through hole 942 and the vicinity of the circumferential end 933a of the hole 933 in the Z direction.

[0060] 7, since the flow path area of ​​the communication passage 184 is relatively small, the pressure of each of the closed circuits 190 and 191 is adjusted by the reservoir tank 175 while suppressing changes in the flow rate of the heat medium in each of the closed circuits 190 and 191. That is, the pressure of the closed circuit 191 is adjusted by the reservoir tank 175 provided in the closed circuit 190 that communicates with the closed circuit 191 through the communication passage 184.

[0061] The same is true in Fig. 8. Specifically, since the flow path area of ​​the communication passage 185 is relatively small, the pressure of each of the closed circuits 191 and 192 is adjusted by the reservoir tank 175 while suppressing changes in the flow rate of the heat medium in each of the closed circuits 191 and 192. That is, the pressure of the closed circuit 191 is adjusted by the reservoir tank 175 provided in the closed circuit 192 that communicates with the closed circuit 191 through the communication passage 185.

[0062] As described above, in this embodiment, the flow path area of ​​the communication passage 184 (185) that communicates the closed circuits (190 / 191, 191 / 192) is smaller than the flow path area of ​​the closed circuits. This makes it possible to easily limit the flow rate of the heat medium flowing through the communication passage 184 (185). As a result, the pressure of each of the two closed circuits can be adjusted by the reservoir tank 175 through the communication passage 184 (185) while minimizing changes in the flow rate in the closed circuits caused by the movement of the heat medium through the communication passage 184 (185).

[0063] In this embodiment, in each of the first communication pattern (see FIG. 7) and the second communication pattern (see FIG. 8), the pressure of each of the two closed circuits can be adjusted by one reservoir tank 175. Furthermore, compared to the case where a reservoir tank is provided for each of the two closed circuits, the number of parts can be reduced and the configuration of the thermal management circuit can be simplified. As a result, the space occupied by the thermal management circuit 100 can be reduced.

[0064] In the above embodiment, the thermal management circuit 100 provided with the five-way valve 180 is shown as an example, but the present disclosure is not limited to this. The above configuration of communicating the closed circuits with each other may also be applied to a thermal management circuit provided with a switching valve other than a five-way valve (for example, an eight-way valve).

[0065] In the above embodiment, the reservoir tank 175 is provided at the junction 175a of the path 170b of the battery 173 and the bypass path 174, but the present disclosure is not limited to this. For example, the reservoir tank may be provided in the path 130b that passes through the low-temperature radiator 122.

[0066] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, not by the description of the embodiments described above, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0067] 1 Thermal management system, 91 Case, 92 Valve body (valve body unit), 93 Fixation part (first valve body), 93a Outer wall, 93b Inner wall, 93c Partition wall, 94 Drive part (second valve body), 130a Path (second flow path) (external flow path), 130b Path (third flow path) (external flow path), 170a Path (fourth flow path) (external flow path), 170b Path (first flow path) (external flow path), 174 Bypass path (external flow path), 175 Reservoir tank (pressure adjustment mechanism), 180 Five-way valve (switching device), 181, 183 Path (first path), 182 Path (second path), 184, 185 Communication passage, 190 Closed circuit (first closed circuit), 191 Closed circuit (second closed circuit), 192 Closed circuit (first closed circuit), 200 Electric vehicle (electrical equipment), 931 hole (compartment through hole) (first compartment through hole), 932 hole (compartment through hole) (second compartment through hole), 933 hole (compartment through hole) (third compartment through hole), 934 hole (central through hole), 941 communicating groove, 941a central groove, 941b outer circumferential groove, 942 vertical through hole (second valve body side through hole), AX rotation axis (rotation center line), L lower space (second space), P1 port (fifth flow pipe), P2 port (first flow pipe), P3 port (fourth flow pipe), P4 port (second flow pipe), P5 port (third flow pipe), U upper space (first space), Z direction (direction of extension of rotation center line).

Claims

1. A thermal management system provided in an electrical device, comprising: A plurality of external flow paths through which a heat transfer medium flows; A switching device that switches a flow path of the heat medium in the plurality of external flow paths by switching a connection state between the plurality of external flow paths; a pressure adjustment mechanism provided in the plurality of external flow paths to adjust a pressure of the heat medium; the switching device is configured to be switchable so as to form a first path for forming a first closed circuit in which the pressure adjustment mechanism is provided, a second path for forming a second closed circuit in which the pressure adjustment mechanism is not provided, and a communication path that communicates the first closed circuit and the second closed circuit, A thermal management system, wherein a flow path area of ​​the communication passage is smaller than a flow path area of ​​at least one of the first path and the second path.

2. 2. The thermal management system according to claim 1, wherein the communication passage is configured to enable pressure adjustment of each of the first closed circuit and the second closed circuit by the pressure adjustment mechanism while suppressing a change in a flow rate of the heat medium in each of the first closed circuit and the second closed circuit.

3. The plurality of external flow paths include a first flow path through which the heat medium that exchanges heat with the power storage device flows; a second flow path through which the heat medium flows and which exchanges heat with a driving device capable of generating a driving force; a third flow path provided with a radiator; a fourth flow path provided with a chiller device; a bypass path that bypasses the power storage device, The switching device is a state in which the first closed circuit in which the first flow path and the fourth flow path are connected, and the second closed circuit in which the second flow path and the third flow path are connected are formed; 3. The thermal management system according to claim 1, wherein the bypass path and the fourth flow path are connected to each other, and the second closed circuit is formed in a state in which the second flow path and the third flow path are connected to each other.

4. The thermal management system according to claim 3 , wherein the pressure adjustment mechanism is provided at a junction of the first flow path and the bypass path.

5. Case and a first flow pipe, a second flow pipe, a third flow pipe, a fourth flow pipe, and a fifth flow pipe connected to the case; a valve body unit provided in the case, The internal space of the case is divided into a first space and a second space by the valve body unit, the valve body unit includes a disk-shaped first valve body provided on the first space side in the case, and a cylindrical second valve body provided to be rotatable relative to the first valve body about a rotation center line and disposed on the second space side, The first valve body is An outer peripheral wall extending annularly about the rotation center line; an inner circumferential wall extending annularly about the rotation center line and formed closer to the rotation center line than the outer circumferential wall; a plurality of partition walls formed to connect the inner peripheral wall and the outer peripheral wall, The first valve body is provided with a plurality of sector-shaped partition through holes formed by the plurality of partition walls between the outer peripheral wall and the inner peripheral wall, and a central through hole formed by the inner peripheral wall, The second valve body has a second valve body through hole penetrating in a direction in which the rotation center line extends, and a communication groove opening toward the first space, The second valve body side through hole is formed so as to overlap with at least one of the plurality of partition through holes in a direction in which the rotation center line extends, the communication groove includes a central groove overlapping with the central through hole in the direction along which the rotation center line extends, and a peripheral groove communicating with the central groove and overlapping with at least one of the plurality of partition through holes in the direction along which the rotation center line extends, The plurality of partition through holes include A first partition through hole communicating with the first flow pipe; A second partition through hole communicating with the second flow pipe; a third partition through-hole communicating with the third flow pipe; The central through hole communicates with the fourth flow pipe, The second valve body side through hole communicates with the fifth flow pipe, In a state in which the second valve body side through hole overlaps with the first partition through hole in the direction in which the rotation center line extends, the outer circumferential groove overlaps with the second partition through hole and the third partition through hole in the direction in which the rotation center line extends, and A switching device wherein, when the outer circumferential groove overlaps with the third partition through hole in the direction in which the rotation center line extends, the second valve body side through hole overlaps with the second partition through hole and the third partition through hole in the direction in which the rotation center line extends.

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