Electronic component

Abstract

To provide an electronic component capable of suppressing peeling of a conductive resin layer.SOLUTION: A multilayer capacitor C1 includes an element body 3 including a side surface 3e, and an external electrode disposed on the side surface 3e. The external electrode includes a second electrode layer E2. A protrusion R1 is formed on the second electrode layer E2 along one direction on the side surface 3e. The second electrode layer E2 includes a region E2b on the side surface 3e that has a thickness smaller than the thickness of the protrusion R1.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] A known electronic component includes an element body and external electrodes disposed on side surfaces of the element body (see, for example, Patent Document 1). The external electrodes include conductive resin layers. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 5-144665 Summary of the Invention [Problem to be solved by the invention]

[0004] The conductive resin layer generally contains a resin and conductive particles. The resin has a tendency to absorb moisture. When an electronic component is soldered to an electronic device, the moisture absorbed in the resin may gasify and expand in volume. In this case, stress acts on the conductive resin layer, which may cause the conductive resin layer to peel off. The electronic device may include, for example, a circuit board or an electronic component.

[0005] An object of one aspect of the present invention is to provide an electronic component capable of suppressing peeling of a conductive resin layer. [Means for solving the problem]

[0006] An electronic component according to one aspect of the present invention includes an element body including a side surface, and an external electrode disposed on the side surface and including a conductive resin layer. The conductive resin layer has ridges formed on the side surface in at least one direction. The conductive resin layer includes a region on the side surface that has a thickness smaller than the thickness of the ridges.

[0007] In the conductive resin layer, for example, due to the process of forming the conductive resin layer, continuous bubbles tend to form that reach the edge of the conductive resin layer. These continuous bubbles can form a migration path for gas generated from moisture. When the gas reaches the edge of the conductive resin layer, it can migrate out of the conductive resin layer. A configuration in which the conductive resin layer is thicker increases the migration path for gas compared to a configuration in which the conductive resin layer is thin. In one embodiment, the conductive resin layer located on the side surface has ribs formed thereon. The conductive resin layer tends to have an increased thickness in the region where the ribs are located. Therefore, the conductive resin layer has an increased number of gas migration paths in the region where the ribs are located. The ridges are formed on the side surface along at least one direction. Therefore, even if moisture absorbed in the resin in the conductive resin layer located on the side surface is gasified, the gas generated from the moisture is likely to move in at least one direction in the region where the ridges are located. In the conductive resin layer, the gas moving in the region where the ridges are located is likely to move toward a position corresponding to the edge of the side surface. In the conductive resin layer, the position corresponding to the edge of the side surface is closer to the edge of the conductive resin layer than the position corresponding to the center of the side surface. That is, the one aspect above makes it easier for the gas generated from the moisture to move to a position closer to the edge of the conductive resin layer. Therefore, the one aspect above increases the possibility of moving the gas outside the conductive resin layer compared to a configuration in which the ridges are not formed on the conductive resin layer. As a result, the above-mentioned one embodiment can suppress peeling of the conductive resin layer.

[0008] The conductive resin layer has an electrical resistance greater than the electrical resistance of an electrode layer that does not contain resin. A configuration in which the conductive resin layer is thick has a greater electrical resistance than a configuration in which the conductive resin layer is thin. In the above-mentioned one embodiment, the conductive resin layer includes a region on the side surface that has a thickness smaller than the thickness at the protrusion, and therefore, the above-mentioned one embodiment suppresses an increase in the ESR (equivalent series resistance) of the conductive resin layer.

[0009] In the above-mentioned one aspect, the protrusion may overlap the center of the side surface when viewed from a direction perpendicular to the side surface. The configuration in which the protrusion overlaps with the center of the side surface makes it easy for gas generated from moisture to move from a position corresponding to the center of the side surface to a position corresponding to the edge of the side surface, and therefore this configuration can reliably suppress peeling of the conductive resin layer.

[0010] In the one aspect, the side surface may have a rectangular shape. The at least one direction may include a direction parallel to one side of the rectangular side surface. In the configuration in which the at least one direction includes a direction parallel to one side of the rectangular side surface, the gas generated from the moisture is likely to move toward a position corresponding to the edge of the side surface, and therefore, this configuration can reliably suppress peeling of the conductive resin layer.

[0011] In the one aspect, the side surface may have a rectangular shape. The at least one direction may include a direction along a diagonal line of the rectangular side surface. In the configuration in which the at least one direction includes a direction along a diagonal line of the rectangular side surface, the gas generated from the moisture is likely to move toward a position corresponding to the edge of the side surface, and therefore, this configuration can reliably suppress peeling of the conductive resin layer.

[0012] In the one aspect, the protrusions may be formed on the side surface along a plurality of directions that include the at least one direction and intersect with each other. In a configuration in which the ridges are formed in multiple directions that intersect with each other, gas generated from moisture can be easily moved toward multiple positions corresponding to the edges of the side surfaces, and therefore, this configuration can more reliably suppress peeling of the conductive resin layer.

[0013] In the one aspect, the side surface may be rectangular. The protrusion may have a length in the at least one direction that is equal to or greater than half the length of a diagonal of the rectangular side surface and equal to or less than the length of the diagonal. The configuration in which the protrusions have the above length facilitates the movement of gas generated from moisture along at least one of the above directions toward a position corresponding to the edge of the side surface, and therefore this configuration can reliably suppress peeling of the conductive resin layer.

[0014] In the one aspect described above, the protrusion may have a shape in which, in a cross section obtained by cutting the protrusion along a plane parallel to the side surface, the width in the at least one direction is greater than the width in a direction perpendicular to the at least one direction. In the configuration in which the protrusions have the above-mentioned shape, the gas generated from the moisture can be easily moved along the at least one direction toward the position corresponding to the edge of the side surface, and therefore, this configuration can reliably suppress peeling of the conductive resin layer.

[0015] In the above aspect, the protrusion may have an oval shape when viewed from a direction perpendicular to the side surface. The configuration in which the protrusions have the above-mentioned oval shape facilitates the movement of gas generated from moisture along the at least one direction toward a position corresponding to the edge of the side surface, and therefore this configuration can reliably suppress peeling of the conductive resin layer.

[0016] In one of the above aspects, the protrusion may have a shape that includes many flat regions with gradual changes in height in a cross section cut along a plane perpendicular to the side surface and along the at least one direction, compared to a cross section cut along a plane perpendicular to the side surface and the at least one direction. The configuration in which the protrusions have the above-mentioned shape facilitates the movement of gas generated from moisture along at least one of the above-mentioned directions toward a position corresponding to the edge of the side surface, and therefore this configuration can reliably suppress peeling of the conductive resin layer.

[0017] In one of the above aspects, the protrusion may have a shape in which the change in height in a cross section cut in a plane perpendicular to the side surface and the at least one direction is steeper than the change in height in a cross section cut in a plane perpendicular to the side surface and along the at least one direction. In the configuration in which the protrusion has the above-mentioned shape, the change in height of the protrusion in a cross section cut along a plane perpendicular to the side surface and along the at least one direction is more gradual than the change in height in a cross section cut along a plane perpendicular to the side surface and the at least one direction. Therefore, this configuration makes it easy to move the protrusion along the at least one direction toward a position corresponding to the edge of the side surface. As a result, this configuration can reliably suppress peeling of the conductive resin layer. Effect of the Invention

[0018] One aspect of the present invention provides an electronic component capable of suppressing peeling of a conductive resin layer. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a perspective view showing an electronic component according to a first embodiment. [Diagram 2] FIG. 2 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Diagram 3] FIG. 3 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing a cross-sectional configuration of the electronic component according to the first embodiment. [Diagram 5] FIG. 5 is a plan view showing the second electrode layer. [Figure 6] FIG. 6 is a plan view showing the second electrode layer. [Figure 7] FIG. 7 is a plan view showing the second electrode layer. [Figure 8] FIG. 8 is a plan view showing the second electrode layer. [Figure 9] FIG. 9 is a diagram showing an electronic component device according to the second embodiment. [Figure 10] FIG. 10 is a diagram showing an electronic component device according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an embodiment and a modified example of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same functions will be denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0021] First embodiment The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described with reference to Figs. 1 to 5. Fig. 1 is a perspective view of the multilayer capacitor in accordance with the first embodiment. Figs. 2 to 4 are views showing a cross-sectional configuration of the multilayer capacitor in accordance with the first embodiment. Fig. 5 is a plan view showing a second electrode layer. In the first embodiment, the electronic component is, for example, a multilayer capacitor C1. The configuration of the multilayer capacitor C1 in accordance with the first embodiment will be described below.

[0022] 1, the multilayer capacitor C1 includes a rectangular parallelepiped element body 3 and a plurality of external electrodes 5. The plurality of external electrodes 5 are arranged on the element body 3. The plurality of external electrodes 5 are spaced apart from one another. The multilayer capacitor C1 includes, for example, a pair of external electrodes 5. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and edges, or a rectangular parallelepiped shape with rounded corners and edges.

[0023] The element body 3 includes a pair of side surfaces 3a facing each other, a pair of side surfaces 3c facing each other, and a pair of side surfaces 3e facing each other. Each of the side surfaces 3a, 3b, 3c, and 3e has a rectangular shape. The rectangular shape includes, for example, a shape in which each corner is chamfered or a shape in which each corner is rounded. The pair of side surfaces 3a face each other in direction D1. The pair of side surfaces 3c face each other in direction D2. The side surfaces 3e face each other in direction D3. The direction D1 intersects with the direction D2 and also with the direction D3. The direction D2 intersects with the direction D3, for example. For example, the directions D1, D2, and D3 are perpendicular to each other. The side surfaces 3a are perpendicular to the direction D1. The side surfaces 3c are perpendicular to the direction D2. The side surfaces 3e are perpendicular to the direction D3. The multilayer capacitor C1 is solder-mounted on an electronic device. The electronic device includes, for example, a circuit board or another electronic component. In the multilayer capacitor C1, one of the four side surfaces 3a, 3c faces the electronic device. One of the four side surfaces 3a, 3c is disposed so as to form a mounting surface. One of the four side surfaces 3a, 3c is the mounting surface.

[0024] The side surface 3e extends in the direction D1 so as to connect the pair of side surfaces 3a. The side surface 3e extends in the direction D2 so as to connect the pair of side surfaces 3c. The side surface 3a extends in the direction D3 so as to connect the pair of side surfaces 3e. The side surface 3c extends in the direction D3 so as to connect the pair of side surfaces 3e. The length of element body 3 in direction D1 is, for example, 0.1 to 6.3 mm. The length of element body 3 in direction D2 is, for example, 0.1 to 3.2 mm. The length of element body 3 in direction D3 is, for example, 0.2 to 7.5 mm. For element body 3, direction D3 is, for example, the longitudinal direction. The length of element body 3 in direction D1 is the height of element body 3. The length of element body 3 in direction D2 is the width of element body 3. The length of element body 3 in direction D3 is the length of element body 3.

[0025] The element body 3 is configured by stacking a plurality of dielectric layers in the direction D1. The element body 3 includes a plurality of dielectric layers stacked together. In the element body 3, the stacking direction of the plurality of dielectric layers coincides with the direction D1. Each dielectric layer is, for example, configured from a sintered body of a ceramic green sheet including a dielectric material. The dielectric material includes, for example, a BaTiO3-based, Ba(Ti,Zr)O3-based, or (Ba,Ca)TiO3-based dielectric ceramic. In the actual element body 3, the dielectric layers are integrated to such an extent that the boundaries between the dielectric layers are not visible. In the element body 3, the stacking direction of the plurality of dielectric layers may coincide with the direction D2.

[0026] As shown in Figs. 1 to 4, a pair of external electrodes 5 are arranged at both ends of the element body 3 in the direction D3. Each of the pair of external electrodes 5 is arranged on a corresponding one of a pair of side faces 3e. Each of the pair of external electrodes 5 is arranged on the side face 3e and the side faces 3a and 3c. Each of the pair of external electrodes 5 may be arranged on the ridge between the side face 3e and the side face 3a, the ridge between the side face 3e and the side face 3c, and the ridge between the side face 3a and the side face 3c. The external electrode 5 includes a plurality of electrode portions 5a, 5c, and 5e. The electrode portion 5a is located on the side surface 3a. The electrode portion 5c is located on the side surface 3c. The electrode portion 5e is located on the side surface 3e. The external electrode 5 may include an electrode portion arranged on an edge portion between the side surface 3e and the side surface 3a, an electrode portion arranged on an edge portion between the side surface 3e and the side surface 3c, and an electrode portion arranged on an edge portion between the side surface 3a and the side surface 3c.

[0027] The external electrode 5 is formed on five surfaces, namely, a pair of side surfaces 3a, one side surface 3e, and a pair of side surfaces 3c. The electrode portions 5a, 5c, and 5e adjacent to each other are connected and electrically connected. The external electrode 5 includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. For example, each of the electrode portions 5a, 5c, and 5e includes a first electrode layer E1, a second electrode layer E2, and a third electrode layer E3. The third electrode layer E3 constitutes the outermost layer of the external electrode 5. The first electrode layer E1 of the electrode unit 5a is disposed on the side surface 3a. The first electrode layer E1 of the electrode unit 5a is formed so as to cover a portion of the side surface 3a. That is, the first electrode layer E1 of the electrode unit 5a also contacts a portion of the side surface 3a. The portion of the side surface 3a is, for example, a portion closer to the corresponding side surface 3e. The first electrode layer E1 is disposed on the ridge portion between the side surface 3a and the side surface 3e. The first electrode layer E1 does not have to be disposed on the side surface 3a. The second electrode layer E2 of the electrode unit 5a is disposed on the side surface 3a. The second electrode layer E2 is in contact with a portion of the side surface 3a. The portion of the side surface 3a is, for example, a portion of the side surface 3a closer to the corresponding side surface 3e. The second electrode layer E2 of the electrode unit 5a is formed so as to cover a portion of the side surface 3a. The second electrode layer E2 of the electrode unit 5a directly covers a portion of the side surface 3a. The third electrode layer E3 of the electrode unit 5a is disposed on the second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in contact with the entire second electrode layer E2. In the electrode unit 5a, the third electrode layer E3 is in direct contact with the second electrode layer E2. Even when the first electrode layer E1 is disposed on the side surface 3a. In the electrode unit 5a, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The electrode unit 5a has a two-layer structure including the second electrode layer E2 and the third electrode layer E3 on the side surface 3a. When the first electrode layer E1 of the electrode unit 5a is disposed on the side surface 3a, the electrode unit 5a has a three-layer structure on the side surface 3a.

[0028] The first electrode layer E1 of the electrode unit 5c is disposed on the side surface 3c. The first electrode layer E1 of the electrode unit 5c is formed so as to cover a portion of the side surface 3c. That is, the first electrode layer E1 of the electrode unit 5c also contacts a portion of the side surface 3c. The portion of the side surface 3c is, for example, a portion closer to the corresponding side surface 3e. The first electrode layer E1 is disposed on the ridge portion between the side surfaces 3c and 3e. The first electrode layer E1 does not have to be disposed on the side surface 3c. The second electrode layer E2 of the electrode unit 5c is disposed on the side surface 3c. The second electrode layer E2 is in contact with a portion of the side surface 3c. The portion of the side surface 3c is, for example, a portion of the side surface 3c closer to the corresponding side surface 3e. The second electrode layer E2 of the electrode unit 5c is formed so as to cover a portion of the side surface 3c. The second electrode layer E2 of the electrode unit 5c directly covers a portion of the side surface 3c. The third electrode layer E3 of the electrode portion 5c is disposed on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. Even when the first electrode layer E1 is disposed on the side surface 3c. In the electrode portion 5c, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The electrode portion 5c has a two-layer structure including the second electrode layer E2 and the third electrode layer E3 on the side surface 3c. When the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c, the electrode portion 5c has a three-layer structure on the side surface 3c.

[0029] The second electrode layer E2 of the electrode unit 5c is disposed on the side surface 3c. The second electrode layer E2 is in contact with a portion of the side surface 3c. The portion of the side surface 3c is, for example, a portion of the side surface 3c closer to the corresponding side surface 3e. The second electrode layer E2 of the electrode unit 5c is formed so as to cover a portion of the side surface 3c. The second electrode layer E2 of the electrode unit 5c directly covers a portion of the side surface 3c.

[0030] The third electrode layer E3 of the electrode portion 5c is disposed on the second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in contact with the entire second electrode layer E2. In the electrode portion 5c, the third electrode layer E3 is in direct contact with the second electrode layer E2. Even when the first electrode layer E1 is disposed on the side surface 3c. In the electrode portion 5c, the third electrode layer E3 is not in direct contact with the first electrode layer E1. The electrode portion 5c has a two-layer structure including the second electrode layer E2 and the third electrode layer E3 on the side surface 3c. When the first electrode layer E1 of the electrode portion 5c is disposed on the side surface 3c, the electrode portion 5c has a three-layer structure on the side surface 3c.

[0031] The first electrode layer E1 of the electrode portion 5e is disposed on the side surface 3e. The entire side surface 3e is covered with the first electrode layer E1. The first electrode layer E1 of the electrode portion 5e is in contact with the entire side surface 3e. The second electrode layer E2 of the electrode unit 5e is disposed on the first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 is in contact with the entire first electrode layer E1. The second electrode layer E2 of the electrode unit 5e is formed so as to cover the entire side surface 3e. The second electrode layer E2 of the electrode unit 5e indirectly covers the entire side surface 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3e. The second electrode layer E2 of the electrode unit 5e directly covers the entire first electrode layer E1. In the electrode unit 5e, the second electrode layer E2 may cover a part of the side surface 3e. The part of the side surface 3e covered by the second electrode layer E2 is located, for example, closer to the side surface 3a. In this case, in the electrode unit 5e, the second electrode layer E2 indirectly covers a part of the side surface 3e such that the first electrode layer E1 is located between the second electrode layer E2 and the side surface 3e. In the electrode unit 5e, the second electrode layer E2 directly covers a part of the first electrode layer E1. That is, the electrode unit 5e includes a region where the first electrode layer E1 is exposed from the second electrode layer E2 and a region where the first electrode layer E1 is covered by the second electrode layer E2.

[0032] The third electrode layer E3 of the electrode unit 5e is disposed on the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 covers the entire second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is in contact with the entire second electrode layer E2. That is, in the electrode unit 5e, the third electrode layer E3 is in direct contact with the second electrode layer E2. In the electrode unit 5e, the third electrode layer E3 is not in direct contact with the first electrode layer E1.

[0033] The second electrode layer E2 has a protrusion R1 formed on the side surface 3e. The second electrode layer E2 includes a region E2a and a region E2b excluding the region E2a. The protrusion R1 is formed along a direction D2. The protrusion R1 is formed along a direction parallel to the side surface 3a. When viewed from the direction D3, the protrusion R1 overlaps with a center 3e1 of the side surface 3e. When viewed from the direction D3, the protrusion R1 has an oval shape. The oval shape of the protrusion R1 includes an elliptical shape or a rounded rectangular shape. The protrusion R1 may have a rectangular shape. In the first embodiment, the longitudinal direction of the oval shape of the protrusion R1 is the direction D2. The protrusion R1 may be formed along the direction D1. In this case, the protrusion R1 is formed along a direction parallel to the side surface 3c.

[0034] 5, the protrusion R1 has a length L2 in the direction D2 that is equal to or greater than half the length L1 of the diagonal DL1 of the side surface 3e and is equal to or less than the length L1 of the diagonal. The length L1 of the diagonal DL1 is defined, for example, as follows. In an element body 3 in which the side 3e is included in a single plane including the edge of the side 3e, the length L1 of the diagonal DL1 is defined at the side 3e. In an element body 3 in which the side 3e is not included in a single plane including the edge of the side 3e, the length L1 of the diagonal DL1 is defined in an area defined by four planes that include the side 3e and are perpendicular to the four planes that include each of the four side surfaces 3a, 3c.

[0035] In the protrusion R1, the rate of increase in the thickness of the second electrode layer E2 is larger in the central region including the center 3e1 of the side surface 3e than in the peripheral region other than the central region including the center 3e1, so that the second electrode layer E2 protrudes toward the outside of the element body 3. In the second electrode layer E2, the rate of increase is different between the region E2a and the region E2b excluding the region E2a. The rate of increase in the region E2b excluding the region E2a is larger than the rate of increase in the region E2a. Due to this difference in the rate of increase, the protrusion R1 is formed in the second electrode layer E2. The protrusion R1 includes a region that protrudes from a point where the rate of increase in the thickness of the second electrode layer E2 changes toward the center of the second electrode layer E2. The outer edge of the protrusion R1 is a position where the rate of increase in the thickness of the second electrode layer E2 changes. As shown in FIG. 3 and FIG. 4, the region E2b has a thickness T2 that is smaller than the thickness T1 in the region E2a. The thickness T1 indicates the thickness of the region E2a. A thickness T2 indicates the thickness of region E2b. Region E2b overlaps with the region of side surface 3e other than the region overlapping with region E2a. The third electrode layer E3 has an outer shape that matches the outer shape of the second electrode layer E2, and the third electrode layer E3 located on the protrusion R1 protrudes toward the outside of the element body 3.

[0036] The ridge R1 has a shape in which the width W1 is greater than the width W2. The width W1 is the width of the ridge R1 in the direction D2 in a cross section of the ridge R1 cut by the plane PL1. The width W2 is the width of the ridge R1 in the direction D1 in a cross section of the ridge R1 cut by the plane PL1. In the first embodiment, the maximum value of the width W1 corresponds to the length L2. The plane PL1 includes a plane that is parallel to a plane including the side surface 3e and is a predetermined distance away from the side surface 3e. The width W1 and the width W2 are determined, for example, through the following process. A cross-sectional photograph of the multilayer capacitor C1 including the second electrode layer E2 is obtained. The cross-sectional photograph is, for example, a photograph obtained by taking a cross section of the multilayer capacitor C1 cut along a plane PL1 parallel to a central region including the center 3e1 of the side surface 3e. Software is used to perform image processing of the obtained cross-sectional photograph. Based on the results of this image processing, the boundary of the second electrode layer E2 is determined, and the widths W1 and W2 on the obtained cross-sectional photograph are calculated. The widths W1 and W2 may be, for example, average values ​​of the results of multiple measurements.

[0037] As shown in Figures 3 and 4, the protrusion R1 has a shape including many flat regions with a gradual change in height in a cross section cut along a plane perpendicular to the side surface 3e and along the direction D2, compared to a cross section cut along a plane perpendicular to the side surface 3e and the direction D2. Figure 3 shows a cross section cut along a plane perpendicular to the side surface 3e and along the direction D2. Figure 4 shows a cross section cut along a plane perpendicular to the side surface 3e and along the direction D2. The protrusion R1 has a shape in which the change in height in a cross section cut along a plane perpendicular to the side surface 3e and along the direction D2 is steeper than the change in height in a cross section cut along a plane perpendicular to the side surface 3e and along the direction D2.

[0038] The first electrode layer E1 is formed by baking a conductive paste applied to the surface of the element body 3. The first electrode layer E1 is formed so as to cover one side surface 3e. The first electrode layer E1 is formed by sintering a metal component contained in the conductive paste, i.e., a metal powder. The first electrode layer E1 is a sintered metal layer. The first electrode layer E1 is a sintered metal layer formed on the element body 3. In the first embodiment, the first electrode layer E1 includes a sintered metal layer containing Cu. The first electrode layer E1 may be a sintered metal layer containing Ni. The first electrode layer E1 includes a base metal. The conductive paste includes, for example, a powder containing Cu or Ni, a glass component, an organic binder, and an organic solvent. The first electrode layer E1 included in each of the electrode portions 5a, 5c, and 5e is integrally formed.

[0039] The second electrode layer E2 is formed by hardening a conductive resin paste applied onto the first electrode layer E1. The second electrode layer E2 is formed over the first electrode layer E1 and the element body 3. The first electrode layer E1 is a base metal layer for forming the second electrode layer E2. The second electrode layer E2 includes a conductive resin layer covering the first electrode layer E1. The conductive resin paste includes, for example, a curable resin, a conductive material, and an organic solvent. The curable resin includes, for example, a thermosetting resin. The conductive material includes, for example, a metal powder. The metal powder includes, for example, Ag powder or Cu powder. The thermosetting resin includes, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, or a polyimide resin. The second electrode layer E2 included in each of the electrode portions 5a, 5c, and 5e is integrally formed.

[0040] The application of the conductive resin paste includes, for example, the following steps. One process includes forming a layer of a predetermined thickness made of conductive resin paste on the base body 3, and applying the conductive resin paste to an area of ​​the layer of the predetermined thickness located on the side surface 3e where the protrusion R1 is to be formed. Another process includes forming a layer of a predetermined thickness made of conductive resin paste on the base body 3, and removing a portion of the conductive resin paste located on the side surface 3e in the layer of the predetermined thickness except for the area in which the protrusion R1 is to be formed. By either process, the protrusion R1 can be formed on the side surface 3e of the second electrode layer E2.

[0041] As described above, the conductive resin paste is a resin composition containing a curable resin and an organic solvent. In this resin composition, the organic solvent vaporizes. The vaporization of the organic solvent generates gas in the conductive resin paste. The gas generated by the vaporization of the organic solvent reaches directly to the surface of the conductive resin paste from every location in the conductive resin paste where the organic solvent is present, and escapes from the conductive resin paste. In the conductive resin paste, voids are formed in every location in the conductive resin paste as a gas passage by the vaporization of the organic solvent, and continuous bubbles connecting these voids are formed. The gas generated by the evaporation of the organic solvent is released from the surface of the conductive resin paste before hardening to the outside of the conductive resin paste. Openings continuous to the continuous cells are formed on the surface of the conductive resin layer paste. The continuous cells are formed so as to communicate the above-mentioned openings formed in the conductive resin layer paste with a plurality of voids formed by the evaporation of the organic solvent at every location where the organic solvent is present. The above-mentioned openings formed on the surface of the second electrode layer E2 are also formed corresponding to every location where the organic solvent is present. Therefore, the continuous cells can also open at the edge of the second electrode layer E2. The formation of voids and open cells in the second electrode layer E2 can be controlled, for example, by the type and content ratio of the organic solvent used and the hardening conditions of the conductive resin layer paste. The hardening conditions of the conductive resin layer paste include, for example, the temperature and air pressure of the atmosphere. The formation of voids and open cells in the conductive resin paste is generally known to those skilled in the art, and further detailed description will be omitted.

[0042] The third electrode layer E3 is formed on the second electrode layer E2 by a plating method. The third electrode layer E3 may have a multi-layer structure. In this case, the third electrode layer E3 includes, for example, a Ni plating layer and a solder plating layer. The Ni plating layer is formed on the second electrode layer E2. The solder plating layer is formed on the Ni plating layer. The solder plating layer covers the Ni plating layer. The Ni plating layer has better solder leach resistance than the metal included in the second electrode layer E2. The third electrode layer E3 may have a Sn plating layer, a Cu plating layer, or a Au plating layer instead of the Ni plating layer. The solder plating layer includes, for example, a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. The third electrode layer E3 of each electrode portion 5a, 5c, 5e is integrally formed.

[0043] The third electrode layer E3 is formed by a so-called electrolytic plating method. When a plating layer is formed by an electrolytic plating method, the metal constituting the plating layer is precipitated, for example, on a conductive material as a base and grows into a plating film. When a plating layer is formed on the second electrode layer E2, the metal constituting the plating layer is precipitated, for example, on a conductive material exposed on the surface of the second electrode layer E2 among the conductive materials contained in the second electrode layer E2, and grows into a plating film. The plating film grows on and along the surface of the second electrode layer E2, starting from the conductive material exposed on the surface of the second electrode layer E2. Since the element body 3 is unlikely to be conductive, the plating film, i.e., the third electrode layer E3, is not in close contact with the element body 3. A gap exists between the third electrode layer E3 and the element body 3. The gap between the third electrode layer E3 and the element body 3 communicates with the openings located at and near the edges of the second electrode layer E2, among the openings formed in the second electrode layer E2. Therefore, the gap between the third electrode layer E3 and the element body 3 communicates with the open bubbles formed in the second electrode layer E2. The formation of the plating layer can be controlled by the temperature and current value during plating, as well as the plating time. The formation of the plating layer is generally known to those skilled in the art, and therefore further detailed description will be omitted.

[0044] 2, the multilayer capacitor C1 includes a plurality of internal electrodes 7. Each of the plurality of internal electrodes 7 is an internal conductor disposed within the element body 3. Each of the plurality of internal electrodes 7 is disposed at a different position (layer) in the direction D1. Each of the plurality of internal electrodes 7 is disposed alternately within the element body 3 so as to face each other at an interval in the direction D1. The external electrodes 5 are electrically connected to corresponding ones of the plurality of internal electrodes 7. The internal electrodes 7 include one ends exposed on the corresponding one of the pair of side surfaces 3e. The electrode portion 5e entirely covers one end of the internal electrode 7 exposed on the side surface 3e on which the electrode portion 5e is disposed. The electrode portion 5e is directly connected to the corresponding internal electrode 7. In the electrode portion 5e, the first electrode layer E1 is formed on the side surface 3e so as to be connected to one end of the corresponding internal electrode 7. The internal electrodes 7 include electrodes having polarities different from one another. The internal electrodes 7 having polarities different from one another are arranged alternately. The internal electrodes 7 having polarities different from one another are arranged at different positions (layers) in the direction D1. Each of the internal electrodes 7 includes one end exposed to the corresponding side surface 3e. The internal electrode 7 includes a conductive material that is typically used as an internal electrode for a multilayer electronic component. The conductive material includes, for example, a base metal. The conductive material includes, for example, Ni or Cu. The internal electrode 7 is configured as a sintered body of a conductive paste including the conductive material. In the first embodiment, the internal electrode 7 includes Ni.

[0045] In the multilayer capacitor C1, for example, due to the process of forming the second electrode layer E2, as described above, continuous bubbles tend to form in the second electrode layer E2, reaching the edge of the second electrode layer E2. These continuous bubbles can form a migration path for gas generated from moisture. When the gas reaches the edge of the second electrode layer E2, it can migrate out of the second electrode layer E2. A configuration in which the second electrode layer E2 is thicker increases the migration path for gas compared to a configuration in which the second electrode layer E2 is thin. In the multilayer capacitor C1, the second electrode layer E2 included in the electrode portion 5e is formed with the protrusions R1. The second electrode layer E2 of the electrode portion 5e tends to have an increased thickness in the region E2a. Therefore, in the second electrode layer E2 of the electrode portion 5e, the number of migration paths for gas generated from moisture absorbed by the resin increases in the region E2a. The protrusions R1 are formed along at least one direction on the side surface 3e. Therefore, even if moisture absorbed by the resin is gasified in the second electrode layer E2 of the electrode portion 5e, the gas generated from the moisture is likely to move in at least one direction in the region E2a. In the second electrode layer E2, the gas moving in the region E2a is likely to move toward a position corresponding to the edge of the side surface 3e. In the second electrode layer E2, the position corresponding to the edge of the side surface 3e is closer to the edge of the second electrode layer E2 than the position corresponding to the center of the side surface 3e. That is, the multilayer capacitor C1 is likely to move the gas generated from the moisture to a position close to the edge of the second electrode layer E2. Therefore, the multilayer capacitor C1 increases the possibility of moving the gas out of the second electrode layer E2 compared to a configuration in which the protrusions R1 are not formed on the second electrode layer E2. As a result, the multilayer capacitor C1 can suppress peeling of the second electrode layer E2.

[0046] The resin contained in the second electrode layer E2 may form a path for moisture to move. When moisture reaches an edge of the second electrode layer E2, it may, for example, be gasified and move out of the second electrode layer E2. A configuration in which the second electrode layer E2 is thicker increases the number of paths for moisture to move compared to a configuration in which the second electrode layer E2 is thin. As described above, the second electrode layer E2 of the electrode unit 5e tends to have an increased thickness in the region E2a, and therefore the number of moisture transfer paths increases in the region E2a of the second electrode layer E2 of the electrode unit 5e. Moisture contained in the resin contained in the second electrode layer E2 of the electrode portion 5e tends to move in at least one direction in the region E2a. In the second electrode layer E2, moisture moving in the region E2a tends to move toward a position corresponding to the edge of the side surface 3e. The multilayer capacitor C1 tends to move moisture to a position close to the edge of the second electrode layer E2. Therefore, the multilayer capacitor C1 increases the possibility of moving moisture out of the second electrode layer E2 compared to a configuration in which the second electrode layer E2 does not have the protrusion R1 formed thereon. These results also show that the multilayer capacitor C1 can suppress peeling of the second electrode layer E2.

[0047] The second electrode layer E2 has a higher electrical resistance than an electrode layer that does not contain resin. A configuration in which the second electrode layer E2 is thick has a higher electrical resistance than a configuration in which the second electrode layer E2 is thin. Thus, in the multilayer capacitor C1, the second electrode layer E2 includes a region E2b on the side surface 3e that has a thickness smaller than the thickness at the protrusion R1. As a result, the multilayer capacitor C1 suppresses an increase in the ESR (equivalent series resistance) of the second electrode layer E2. Gas generated from moisture in the second electrode layer E2 can ultimately be discharged to the outside of the external electrode 5 through the gap between the element body 3 and the third electrode layer E3.

[0048] In the multilayer capacitor C1, the protrusion R1 overlaps with the center 3e1 of the side surface 3e when viewed from a direction perpendicular to the side surface 3e. Therefore, the multilayer capacitor C1 can easily move gas generated from moisture from a position corresponding to the center 3e1 of the side surface 3e to a position corresponding to the edge of the side surface 3e. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0049] In the multilayer capacitor C1, the side surface 3e has a rectangular shape. The protrusion R1 is formed on the side surface 3e in a direction parallel to one side of the side surface 3e. The at least one direction includes a direction parallel to one side of the rectangular side surface 3e. The at least one direction includes the direction D2. Therefore, the multilayer capacitor C1 can easily move gas generated from moisture toward a position corresponding to the edge of the side surface 3e. Therefore, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0050] In the multilayer capacitor C1, the side surface 3e has a rectangular shape. The protrusion R1 has a length in at least one direction parallel to one side of the side surface 3e that is more than half the length L1 of the diagonal line DL1 of the rectangular side surface 3e and less than the length L1 of the diagonal line DL1. Therefore, in the multilayer capacitor C1, gas generated from moisture can be easily moved toward a position corresponding to the edge of the side surface 3e along the direction parallel to one side of the side surface 3e. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0051] In the multilayer capacitor C1, the protrusion R1 has a shape in which the width W1 is larger than the width W2. Therefore, in the multilayer capacitor C1, the gas generated from moisture can be easily moved along the direction parallel to one side of the side surface 3e toward a position corresponding to the edge of the side surface 3e. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0052] In the multilayer capacitor C1, the protrusion R1 has an oval shape when viewed from a direction perpendicular to the side surface 3e. Therefore, the multilayer capacitor C1 can easily move gas generated from moisture along the direction parallel to one side of the side surface 3e toward a position corresponding to the edge of the side surface 3e. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0053] In the multilayer capacitor C1, the protrusion R1 has a shape including many flat regions with a gradual change in height in a cross section cut along a plane perpendicular to the side surface 3e and along the above-mentioned direction parallel to one side of the side surface 3e, compared to a cross section cut along a plane perpendicular to the side surface 3e and the at least one direction. Therefore, the multilayer capacitor C1 can easily move gas generated from moisture along the above-mentioned direction parallel to one side of the side surface 3e toward a position corresponding to the edge of the side surface 3c. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0054] In the multilayer capacitor C1, the ridge R1 may have a shape in which the change in height in a cross section cut along a plane perpendicular to the side surface 3e and the direction D2 is steeper than the change in height in a cross section cut along a plane perpendicular to the side surface 3e and parallel to one side of the side surface 3e. Therefore, in the multilayer capacitor C1, the ridge R1 has a shape in which the change in height in a cross section cut along a plane perpendicular to the side surface 3e and parallel to one side of the side surface 3e is gentler than the change in height in a cross section cut along a plane perpendicular to the side surface 3e and parallel to the one side of the side surface 3e. The multilayer capacitor C1 is easily moved toward a position corresponding to the edge of the side surface 3e along the direction parallel to one side of the side surface 3e. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0055] A multilayer capacitor C1 according to a first modified example of the first embodiment will be described with reference to Fig. 6. Fig. 6 is a plan view showing the second electrode layer. The multilayer capacitor C1 is generally similar to or the same as the multilayer capacitor C1 according to the above-mentioned first embodiment, but the multilayer capacitor C1 according to the first modified example differs from the multilayer capacitor C1 according to the first embodiment in terms of the configuration of the external electrodes 5. The following mainly describes the differences from the multilayer capacitor C1 according to the first embodiment.

[0056] The second electrode layer E2 has a protrusion R1 formed on the side surface 3e. The protrusion R1 is formed along the diagonal line DL1. When viewed from the direction D3, the protrusion R1 has an oval shape. The longitudinal direction of the oval shape of the protrusion R1 is the extension direction of the diagonal line DL1. The protrusion R1 may be formed along a direction intersecting the extension direction of the diagonal line DL1 illustrated in FIG. 6. In the first modified example, the protrusion R1 has a length L2 in the extension direction of the diagonal DL1 that is half or more of the length L1 of the diagonal DL1 and is equal to or less than the length L1 of the diagonal DL1.

[0057] In the multilayer capacitor C1, the side surface 3e has a rectangular shape. The at least one direction includes a direction along a diagonal line DL1 of the rectangular side surface 3e. Therefore, the multilayer capacitor C1 can easily move gas generated from moisture toward a position corresponding to the edge of the side surface 3e. As a result, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2.

[0058] A multilayer capacitor C1 according to a second modified example of the first embodiment will be described with reference to Fig. 7. Fig. 7 is a plan view showing the second electrode layer. The multilayer capacitor C1 is generally similar to or the same as the multilayer capacitor C1 according to the above-mentioned first embodiment, but the multilayer capacitor C1 according to the second modified example differs from the multilayer capacitor C1 according to the first embodiment in terms of the configuration of the external electrodes 5. The following mainly describes the differences from the multilayer capacitor C1 according to the first embodiment.

[0059] The multilayer capacitor C1 in accordance with the second modification includes a pair of external electrodes 5. The second electrode layer E2 has a rib R1 formed on the side surface 3e. The rib R1 is formed along the direction D1 and the direction D2. The rib R1 includes a rib R1a and a rib R1b. The rib R1a is formed along the direction D2, and the rib R1b is formed along the direction D1. The rib R1a and the rib R1b intersect with each other. When viewed from the direction D3, the rib R1a and the rib R1b each have an oval shape. The longitudinal direction of the oval shape of the rib R1a is the direction D2. The longitudinal direction of the oval shape of the rib R1b is the direction D1. The protrusion P1a has a length L2a in the direction D2 that is half or more of the length L1 of the diagonal DL1 but is equal to or less than the length L1 of the diagonal DL1. The protrusion P1b has a length L2b in the direction D1 that is half or more of the length L1 of the diagonal DL1 but is equal to or less than the length L1 of the diagonal DL1.

[0060] In the multilayer capacitor C1, the protrusions R1 are formed on the side surface 3e along a plurality of directions that include at least one of the directions and intersect with each other. Therefore, in the multilayer capacitor C1, gas generated from moisture can be easily moved toward a plurality of positions corresponding to the edge of the side surface 3e. As a result, the multilayer capacitor C1 can more reliably suppress peeling of the second electrode layer E2.

[0061] A multilayer capacitor C1 according to a third modified example of the first embodiment will be described with reference to Fig. 8. Fig. 8 is a plan view showing the second electrode layer. The multilayer capacitor C1 is generally similar to or the same as the multilayer capacitor C1 according to the above-mentioned first embodiment, but the multilayer capacitor C1 according to the third modified example differs from the multilayer capacitor C1 according to the first embodiment in terms of the configuration of the external electrodes 5. The following mainly describes the differences from the multilayer capacitor C1 according to the first embodiment.

[0062] The second electrode layer E2 has a protrusion R1 formed on the side surface 3e. The protrusion R1 is formed along the extension direction of the diagonal DL1 and along a direction intersecting the extension direction of the diagonal DL1. The protrusion R1 includes a protrusion R1a and a protrusion R1b. The protrusion R1a is formed along the extension direction of the diagonal DL1, and the protrusion R1b is formed along a direction intersecting the extension direction of the diagonal DL1. When viewed from the direction D3, the protrusion R1a and the protrusion R1b each have an oval shape. The longitudinal direction of the oval shape of the protrusion R1a is the extension direction of the diagonal DL1. The longitudinal direction of the oval shape of the protrusion R1b is the direction intersecting the extension direction of the diagonal DL1. The protrusion P1a has a length L2a in the extension direction of the diagonal DL1. The protrusion P1b has a length L2b. Each of the lengths L2a and L2b is half or more of the length L1 of the diagonal DL1 and is equal to or less than the length L1 of the diagonal DL1.

[0063] Second Embodiment The configuration of an electronic component device ECD according to the second embodiment will be described with reference to Fig. 9. Fig. 9 is a diagram showing the electronic component device according to the second embodiment. In the second embodiment, the electronic component device ECD includes the multilayer capacitor C1 according to the first embodiment and an electronic device ED. The multilayer capacitor C1 is mounted on the electronic device ED. The multilayer capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED includes, for example, a circuit board or an electronic component.

[0064] The electronic device ED includes a principal surface EDa. The electronic device ED includes a pair of pad electrodes PE arranged on the principal surface EDa. The pair of pad electrodes PE are electrically connected to the multilayer capacitor C1. Each of the pair of pad electrodes PE1 is electrically connected to a corresponding one of the pair of external electrodes 5. The pair of pad electrodes PE are spaced apart from each other in a direction D3. The multilayer capacitor C1 is arranged in the electronic device ED such that the principal surface EDa and a side surface 3c face each other. The side surface 3c is a mounting surface. In FIG. 9, one of the pair of pad electrodes PE is illustrated.

[0065] When the multilayer capacitor C1 is solder-mounted, the molten solder wets and rises up the external electrodes 5. The molten solder wets and rises up the third electrode layer E3 that constitutes the outermost layer of the external electrodes 5. The protrusions R1 are formed along the direction D2. The third electrode layer E3 located on the protrusions R1 includes an area that protrudes toward the outside of the element body 3 along the direction D2. The molten solder wets and rises up the third electrode layer E3 in the direction in which the protrusions R1 are formed, i.e., along the direction D2. The molten solder easily wets and rises up the third electrode layer E3 located on the area E2b, but does not easily wet and rise up the third electrode layer E3 located on the protrusions R1. The height in the direction D2 where the molten solder wets and rises up the third electrode layer E3 located on the area E2b is greater than the height in the direction D2 where the molten solder wets and rises up the third electrode layer E3 located on the protrusions R1. The molten solder wets the third electrode layer E3 and then solidifies to form a solder fillet SF. The solder fillet SF is formed on the external electrode 5. The corresponding external electrode 5 and pad electrode PE1 are connected via the solder fillet SF. The multilayer capacitor C1 and electronic device ED are electrically connected. The electronic component device ECD includes the multilayer capacitor C1 and electronic device ED, and the multilayer capacitor C1 and electronic device ED are electrically connected via the solder fillet SF. In the electronic component device ECD, the protrusions R1 are formed, for example, along the direction D1, and the molten solder wets and rises up the third electrode layer E3 located on the protrusions R1 along the direction D1. The multilayer capacitor C1 can be firmly solder-mounted to the electronic device ED.

[0066] Third embodiment The configuration of an electronic component device ECD according to the third embodiment will be described with reference to Fig. 10. Fig. 10 is a diagram showing the electronic component device according to the third embodiment. In the third embodiment, the electronic component device ECD includes a multilayer capacitor C1 according to the modified example of the first embodiment and an electronic device ED. The electronic component device ECD according to the third embodiment differs from the electronic component device ECD according to the second embodiment in terms of the mounted multilayer capacitor C1. The following mainly describes the differences between the electronic component device ECD according to the third embodiment and the electronic component device ECD according to the second embodiment.

[0067] In the third embodiment, the multilayer capacitor C1 is disposed in the electronic device ED such that the main surface EDa faces the side surface 3a. The side surface 3a is a mounting surface. The side surface 3c may be a mounting surface. In Fig. 10, one of a pair of pad electrodes PE is illustrated. In the third embodiment, as in the second embodiment, the molten solder is likely to wet and rise up the third electrode layer E3 located on the region E2b, but is unlikely to wet and rise up the third electrode layer E3 located on the protrusion R1. In the multilayer capacitor C1 mounted on the electronic device ED, the protrusion R1 is located to include a first end away from the electronic device ED and a second end close to the electronic device ED. The molten solder is likely to wet and rise up the third electrode layer E3 until it reaches the first end of the protrusion R1. The molten solder is unlikely to wet and rise up the third electrode layer E3 beyond the second end of the protrusion R1. The height to which the molten solder rises up to the first end of the protrusion R1 is greater than the height to which the molten solder rises beyond the second end of the protrusion R1. In the electronic component device ECD, the protrusions R1 are formed, for example, along a diagonal line DL1, and the molten solder wets and rises along the diagonal line DL1 on the third electrode layer E3 located on the protrusions R1. The multilayer capacitor C1 can be firmly solder-mounted to the electronic device ED.

[0068] The above describes the embodiments and modifications of the present invention, but the present invention is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible without departing from the spirit of the present invention.

[0069] When viewed from a direction perpendicular to the side surface 3e, the protrusion R1 does not have to overlap with the center 3e1 of the side surface 3e. When viewed from a direction perpendicular to the side surface 3e, the configuration in which the protrusion R1 overlaps with the center 3e1 of the side surface 3e facilitates the movement of gas generated from moisture from a position corresponding to the center 3e1 of the side surface 3e to a position corresponding to the edge of the side surface 3e, as described above. Therefore, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2. The at least one direction does not have to include a direction parallel to one side of the rectangular side surface 3e. As described above, a configuration in which the at least one direction includes a direction parallel to one side of the rectangular side surface 3e makes it easy to move gas generated from moisture toward a position corresponding to the edge of the side surface 3e. Therefore, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2. The at least one direction does not have to include a direction along the diagonal line DL1 of the rectangular side surface 3e. As described above, a configuration in which the at least one direction includes a direction along the diagonal line DL1 of the rectangular side surface 3e makes it easy to move gas generated from moisture toward a position corresponding to the edge of the side surface 3e. Therefore, the multilayer capacitor C1 can reliably suppress peeling of the second electrode layer E2. For example, the protrusion R1 may be formed on the side surface 3e in a direction intersecting with a diagonal line DL1 of the rectangular side surface 3e. In each of the modified examples shown in Figures 7 and 8, the protrusions R1 are formed along two directions that intersect with each other, but the protrusions R1 may be formed along three or more directions that intersect with each other. In each modified example shown in Figures 7 and 8, the protrusion R1 is formed along four directions from the center 3e1 of the side 3e when viewed from a direction perpendicular to the side 3e, but the protrusion R1 may be formed along three directions or five or more directions from the center 3e1 of the side 3e when viewed from a direction perpendicular to the side 3e.

[0070] In the above-described embodiments and modifications, a multilayer capacitor has been described as an example of an electronic component, but applicable electronic components are not limited to multilayer capacitors. Applicable electronic components include, for example, multilayer electronic components such as multilayer inductors, multilayer varistors, multilayer piezoelectric actuators, multilayer thermistors, multilayer solid-state battery components, and multilayer composite components, or electronic components other than multilayer electronic components.

[0071] As will be understood from the above description of the embodiments and modifications, this specification includes disclosure of the following aspects. (Appendix 1) A body including a side surface; an external electrode disposed on the side surface and including a conductive resin layer; Equipped with The conductive resin layer has a protrusion formed on the side surface along at least one direction, the conductive resin layer includes a region on the side surface having a thickness smaller than a thickness at the protrusion. (Appendix 2) 2. The electronic component of claim 1, wherein the protrusion overlaps with a center of the side surface when viewed from a direction perpendicular to the side surface. (Appendix 3) The side surface has a rectangular shape, 3. The electronic component according to claim 1, wherein the at least one direction includes a direction parallel to one side of the rectangular side surface. (Appendix 4) The side surface has a rectangular shape, 4. The electronic component according to claim 1, wherein the at least one direction includes a direction along a diagonal of the side surface of the rectangular shape. (Appendix 5) 4. The electronic component according to claim 1, wherein the protrusions are formed on the side surfaces along a plurality of directions that include the at least one direction and intersect with each other. (Appendix 6) The side surface has a rectangular shape, The electronic component according to any one of claims 1 to 5, wherein the protrusion has a length in at least one direction that is equal to or greater than half the length of a diagonal of the rectangular side surface and equal to or less than the length of the diagonal. (Appendix 7) The electronic component according to any one of claims 1 to 6, wherein the protrusion has a shape in which, in a cross section of the protrusion cut by a plane parallel to the side surface, the width in the at least one direction is greater than the width in a direction perpendicular to the at least one direction. (Appendix 8) 8. The electronic component of claim 7, wherein the protrusion has an oval shape when viewed from a direction perpendicular to the side surface. (Appendix 9) The electronic component according to any one of appendixes 1 to 8, wherein the protrusion has a shape including many flat regions with a gradual change in height in a cross section taken along a plane perpendicular to the side surface and along the at least one direction, compared to a cross section taken along a plane perpendicular to the side surface and the at least one direction. (Appendix 10) The electronic component described in any one of Appendices 1 to 9, wherein the protrusion has a shape in which a change in height in a cross section taken along a plane perpendicular to the side surface and the at least one direction is steeper than a change in height in a cross section taken along a plane perpendicular to the side surface and along the at least one direction. [Explanation of symbols]

[0072] 3...element body, 3e...side surface, 3e1...center of side surface, 5...external electrode, C1...multilayer capacitor, DL1...diagonal line, E2...second electrode layer, R1...projection.

Claims

1. A body including a side surface; an external electrode disposed on the side surface and including a conductive resin layer; Equipped with The conductive resin layer has a protrusion formed on the side surface along at least one direction, the conductive resin layer includes a region on the side surface having a thickness smaller than a thickness at the protrusion.

2. The electronic component according to claim 1 , wherein the protrusion overlaps a center of the side surface when viewed from a direction perpendicular to the side surface.

3. The side surface has a rectangular shape, The electronic component according to claim 1 , wherein the at least one direction includes a direction parallel to one side of the rectangular shape.

4. The side surface has a rectangular shape, The electronic component according to claim 1 , wherein the at least one direction includes a direction along a diagonal of the side surface of the rectangular shape.

5. The electronic component according to claim 1 , wherein the protrusions are formed on the side surfaces along a plurality of directions that include the at least one direction and intersect with each other.

6. The side surface has a rectangular shape, 3 . The electronic component according to claim 1 , wherein the protrusion has a length in at least one direction that is equal to or greater than half the length of a diagonal of the rectangular side surface and is equal to or less than the length of the diagonal.

7. 3. The electronic component according to claim 1, wherein the protrusion has a shape in which a width in the at least one direction is greater than a width in a direction perpendicular to the at least one direction in a cross section of the protrusion cut by a plane parallel to the side surface.

8. The electronic component according to claim 7 , wherein the protrusion has an oval shape when viewed in a direction perpendicular to the side surface.

9. 3. The electronic component according to claim 1, wherein the protrusion has a shape including many flat regions with a gradual change in height in a cross section cut along a plane perpendicular to the side surface and along the at least one direction, compared to a cross section cut along a plane perpendicular to the side surface and the at least one direction.

10. 3. The electronic component according to claim 1, wherein the protrusion has a shape in which a change in height in a cross section taken along a plane perpendicular to the side surface and the at least one direction is steeper than a change in height in a cross section taken along a plane perpendicular to the side surface and along the at least one direction.

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