Wafer test box

Abstract

To provide a method for improving use effect of a wafer test box through revamp of a structural design.SOLUTION: A wafer test box 1A includes a first housing 11, a second housing 12, and a magnetic shield 15A. The first housing 11 has a first magnetic member 111, and the second housing 12 has a second magnetic member 121 disposed correspondingly to the first magnetic member 111. A housing space is formed between the first housing 11 and the second housing 12 when the first housing 11 and the second housing 12 correspondingly come into contact with each other. The magnetic shield 15A is used to reduce or cancel magnetic attraction force before the first housing 11 and the second housing 12 come into contact with each other. When the first housing 11 and the second housing 12 correspondingly come into contact with each other, the impact of the magnetic shield 15A is cancelled so that the first housing 11 and the second housing 12 are closely coupled to each other by magnetic attraction force. Further, the first housing 11 and the second housing 12 are separated from each other by reducing the magnetic attraction force with the use of the magnetic shield 15A.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a wafer test box, and more particularly to a wafer test box with a magnetic fixing structure. [Background technology]

[0002] When a wafer completes the design of an integrated circuit, the wafer needs to undergo a pre-burn test and an electrical test. Conventionally, when a wafer is used for pre-burn and reliability test, each wafer is tested individually using a test machine and a probe card. Each wafer is placed on a carrier and the probe of the probe card is electrically contacted to complete the test, so the more wafers there are, the more test machines and probe cards are required, and the more time and equipment costs are required for the test process.

[0003] In the existing technology, in order to improve the efficiency of the pre-burn test, a composite test unit system capable of simultaneously performing the pre-burn test on multiple wafers has been developed. The above-mentioned system has multiple test unit arrays in one test device, each wafer is individually placed in each test unit array, and at least one cassette fixes the wafer in each test unit, and the wafer is subjected to the pre-burn test and electrical test through the test machine.

[0004] Meanwhile, a wafer test box has been developed recently, in which the probe card and wafer are positioned in advance and placed in the wafer test box, and the wafer test box is directly electrically connected to a test machine, and the wafer test box is placed in a test unit to perform pre-burn tests and electrical tests. Existing wafer test boxes use an engagement or vacuum type to combine the upper and lower cases. The engagement type has a limited effect of fixing the upper and lower cases together, and there are problems with uneven force and deformation. The vacuum type has problems with the vacuum being easily lost when the wafer test box is subjected to external force, and the vacuum effect is reduced due to aging of the sealing material. Summary of the Invention [Problem to be solved by the invention]

[0005] Therefore, how to improve the use effect of the wafer test box through improving the structural design and overcome the above-mentioned shortcomings has become one of the important issues that the industry wants to solve. [Means for solving the problem]

[0006] The technical problem to be solved by the present invention is to provide a wafer test box to compensate for the deficiencies of the existing technology. The wafer test box includes a first housing, a second housing, and a magnetic shielding part. The first housing has at least one first magnetic member. The second housing has at least one second magnetic member, and the second magnetic member is installed corresponding to the first magnetic member. When the first housing and the second housing are in corresponding contact with each other, a storage space is formed between the first housing and the second housing. The magnetic shielding member is arranged to be connected to the first housing or the second housing, and is used to reduce or release the magnetic attraction force generated between the first magnetic member and the second magnetic member. The magnetic shielding part is used to reduce or release the magnetic attraction force before the first housing and the second housing are in contact with each other. When the first housing and the second housing are in corresponding contact with each other, the influence of the magnetic shielding part is released, and the first housing and the second housing are closely coupled by the magnetic attraction force. The first housing and the second housing, which are closely coupled by the magnetic attraction force, can be separated by using the magnetic shielding component to reduce the magnetic attraction force. [Brief description of the drawings]

[0007] [Figure 1] 1 is a first schematic diagram of a wafer test box according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a second schematic diagram of the wafer test box according to the first embodiment of the present invention. [Diagram 3]1 is a three-dimensional view of a wafer test box according to a first embodiment of the present invention. [Figure 4] FIG. 2 is a schematic external view of a first housing and a second housing according to the first embodiment of the present invention. [Diagram 5] FIG. 11 is a schematic diagram of a wafer test box according to a second embodiment of the present invention. [Figure 6] FIG. 13 is a schematic diagram of a wafer test box according to a third embodiment of the present invention. [Figure 7A] FIG. 11 is a first schematic diagram of a wafer test box according to a fourth embodiment of the present invention. [Figure 7B] FIG. 13 is a second schematic diagram of a wafer test box according to the fourth embodiment of the present invention. [Figure 7C] FIG. 13 is a third schematic diagram of a wafer test box according to a fourth embodiment of the present invention. [Figure 8A] FIG. 13 is a first schematic diagram of a wafer test box according to a fifth embodiment of the present invention. [Figure 8B] FIG. 13 is a second schematic diagram of a wafer test box according to the fifth embodiment of the present invention. [Figure 8C] FIG. 13 is a third schematic diagram of a wafer test box according to the fifth embodiment of the present invention. [Figure 9] FIG. 13 is a schematic diagram of a wafer test box according to a sixth embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Please refer to Figures 1, 2, 3 and 4. Figure 1 is a first schematic diagram showing a wafer test box according to a first embodiment of the present invention. Figure 2 is a second schematic diagram showing a wafer test box according to the first embodiment of the present invention, and Figure 3 is a three-dimensional view of the first embodiment of the present invention. Figure 4 is a schematic view showing the external appearance of a first housing and a second housing of the first embodiment of the present invention.

[0009] The wafer test box 1A includes a first housing 11 and a second housing 12. The first housing 11 includes a first magnetic member 111, and the second housing 12 includes a second magnetic member 121. 1 and 2 show the wafer test box 1A of this embodiment from a side view point.

[0010] In this embodiment, the shape of the wafer test box 1A is square, circular or other shapes, which can be adjusted according to actual needs and is not limited by the present invention.

[0011] 1 and 2, the wafer test box 1A includes at least one pair of a first magnetic member 111 and a second magnetic member 121 that correspond to each other. The first magnetic member 111 is installed around the first housing 11, and the second magnetic member 121 is installed around the second housing 12. The first magnetic member 111 and the second magnetic member 121 in each pair are installed so as to correspond to each other. That is, the position where the first magnetic member 111 is installed on the first housing 11 corresponds to the position where the second magnetic member 121 is installed on the second housing 12.

[0012] When the first housing 11 and the second housing 12 in the wafer test box 1A are coupled, a servo motor or a stepping motor can be used as a drive device for the first housing 11 and the second housing 12. The servo motor or the stepping motor provides a more precise driving force and provides a stable coupling process when the first housing 11 and the second housing 12 approach each other.

[0013] When mounting, when the first housing 11 and the second housing 12 approach each other, the first magnetic member 111 and the second magnetic member 121 attract each other and generate a magnetic attraction force. However, an excessively strong magnetic attraction force may damage the probe or the wafer due to the contact force between the first housing 11 and the second housing 12 being too strong, so the wafer test box of the present invention includes a magnetic barrier component. This magnetic barrier component is connected to the first housing 11 or the second housing 12 and is used to reduce or nullify the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 before the second housing 12 comes into contact.

[0014] In this embodiment, the first magnetic member 111 and the second magnetic member 121 are magnetizable objects, such as permanent magnets, non-permanent magnets, or magnetic conductive bodies having no magnetism.

[0015] When the first magnetic member 111 and the second magnetic member 121 are both permanent magnets, or when one of the first magnetic member 111 and the second magnetic member 121 is a non-permanent magnet and the other is a permanent magnet, the two opposing ends of the first magnetic member 111 and the second magnetic member 121 have different polarities in order to generate a magnetic attraction force.

[0016] Also, according to certain embodiments, one of the first magnetic member 111 and the second magnetic member 121 is a non-permanent magnet, such as an electromagnet, and the other is a paramagnetic object, such as a magnetically conductive object, such as iron, cobalt, nickel, etc. According to certain embodiments, the paramagnetic object is a permanent magnet, and may be an electromagnet.

[0017] In FIG. 1 and FIG. 2, the first magnetic member 111 and the second magnetic member 121 are respectively installed in the first housing 11 and the second housing 12. According to a specific embodiment, the first housing 11 includes at least one first positioning portion, and the second housing 12 includes at least one second positioning portion. For example, the first positioning portion can include a first convex portion 11F extending downward around the first housing 11. Similarly, the second positioning portion can include a second convex portion 12F extending upward around the second housing 12. In this embodiment, the first magnetic member 111 is installed in the first convex portion 11F. The second magnetic member 121 is installed in the second convex portion 12F. However, the present invention is not limited thereto. The first convex portion 11F and the second convex portion 12F are installed correspondingly. When the first housing 11 and the second housing 12 are closely coupled via the first magnetic member 111 and the second magnetic member 121, the first convex portion 11F is closely coupled to the second convex portion 12F. In a specific embodiment, the first magnetic member 111 and the second magnetic member 121 are one or more, and are installed corresponding to each other. In other words, the first magnetic member 111 and the second magnetic member 121 are installed at any positions of the first housing 11 and the second housing 12, respectively, and the positions of both correspond to each other. According to the embodiment shown in FIG. 3, the first magnetic member 111 and the second magnetic member 121 are multiple. As shown in FIG. 1 and FIG. 2, the first housing 11 and the second housing 12 of the wafer test box 1A are coupled and fixed by the magnetic attraction force generated by the first magnetic member 111 and the second magnetic member 121. In this embodiment, the attachment of the first magnetic member 111 and the second magnetic member 121 generates a magnetic force that attracts them to each other (as described above, the surfaces of the first magnetic member 111 and the second magnetic member 121 facing each other have opposite polarities). In other words, in the present invention, the first magnetic member 111 and the second magnetic member 121 do not necessarily have to face each other, and the present invention protects the fact that the first housing 11 and the second housing 12 are fixed together by generating a magnetic attraction force between them. Furthermore, when the first housing 11 and the second housing 12 come into contact with each other, a storage space S is formed between the first housing 11 and the second housing 12.

[0018] According to the embodiment shown in FIG. 1 and FIG. 2, the first magnetic member 111 and the second magnetic member 121 are located around the first housing 11 and the second housing 12 (i.e., on both sides of the storage space S). However, in a specific embodiment, another set of the first magnetic member 111 and the second magnetic member 121 (e.g., located above and below the storage space S) can be installed in other positions of the wafer test box 1A. The user can adjust the magnitude and distribution position of the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 according to needs (e.g., the sealing property between the first housing 11 and the second housing 12), and the present invention is not limited thereto.

[0019] In a particular embodiment, there is an engagement portion (e.g., a male / female engagement portion) between the first housing 11 and the second housing 12 so that the first housing 11 and the second housing 12 can be matched. In this embodiment shown in FIG. 1 and FIG. 2, the first protrusion 11F of the first housing 11 has an engagement structure 11FP, and the second protrusion 12F of the second housing 12 has another corresponding engagement structure 12FP. The engagement structure 11FP may or may not be disposed corresponding to the first magnetic member 111, and similarly, the engagement structure 12FP may or may not be disposed corresponding to the second magnetic member 121. However, the present invention is not limited to the fact that the engagement structure needs to be disposed on the first protrusion 11F of the first housing 11 and the second protrusion 12F of the second housing 12. According to a particular embodiment, the engagement structure 11FP and the engagement structure 12FP are located on the lower surface of the first housing 11 and the upper surface of the second housing 12, respectively, and according to the embodiment shown in FIG. 4, the engagement structure 11FP and the engagement structure 12FP are installed within the storage space S.

[0020] According to some embodiments, the first housing 11 and the second housing 12 are provided with an engagement portion (e.g., the aforementioned engagement portion 11FP and the corresponding engagement portion 12FP), and after the first housing 11 and the second housing 12 are positioned, the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 couples and fixes the first housing 11 and the second housing 12, achieving an effect as if they were locked together.

[0021] As shown in FIG. 1 to FIG. 4, in the application of a permanent magnet, the magnetic barrier component functions as a magnetic shield 15A, and shields the second magnetic member 121 by lateral movement, and interrupts the magnetic attraction between the first magnetic member 111 and the second magnetic member 121. However, in a specific embodiment, in the application of an electromagnet, the magnetic barrier component can be a switch or a microprocessor. In other embodiments, the magnetic barrier component is also a magnetic generating component (e.g., an electromagnet). According to the embodiment shown in FIG. 1, a probe card 112 is installed in the first housing 11. The probe card 112 includes one or more probes 1121. When the first housing 11 and the second housing 12 are coupled, the one or more probes 1121 protrude toward the second housing 12. More specifically, in this embodiment, a wafer 13 is installed in the wafer test box 1A, and the second housing 12 carries the wafer 13. When the first housing 11 and the second housing 12 are joined, one or more probes 1121 protrude into the second housing and abut against the wafer 13 such that the probes 1121 are in electrical contact with the solder pads (test contacts) of the wafer 13. In other words, the probe card 112 and the wafer 13 are placed in the accommodation space S. According to a specific embodiment, the wafer 13 is electrically connected to the second housing 12.

[0022] In this embodiment, the first housing 11 includes some mechanism parts for fixing the probe card 112. For example, the first fixing member 112F. Here, the first fixing member 112F is installed on the side of the first housing, facing the probe card 112, and is used to fix and engage the probe card 112. In this embodiment, the first fixing member 112F is installed on the outside of the probe card 112. In order to closely engage with the probe card 112, the first fixing member 112F may be designed in the joint area of ​​the probe card 112 and the first housing 11.

[0023] The second housing 12 also includes some mechanical parts for fixing the wafer 13. For example, the second fixing member 13F. In this embodiment, the second fixing member 13F is used to fix the outer edge of the wafer 13. The first fixing member 112F and the second fixing member 13F in this embodiment may be achieved by using other fixing structures, and are not limited in the present invention.

[0024] That is, before the second housing 12 is assembled, the probe card 112 and the wafer 13 are already aligned, and when assembled, at least one probe 1121 on the probe card 112 contacts the solder pads of the wafer 13.

[0025] Please refer to FIG. 5. The wafer test box 1B in FIG. 5 includes a seal member 16, which is located between the first housing 11 and the second housing 12. In a specific embodiment, the seal member 16 is an O-ring. The seal member 16 is used to enhance the sealing after the first housing 11 and the second housing 12 are bonded. In a specific embodiment, the seal member 16 is installed on the first convex portion 11F or the second convex portion 12F, but the user can adjust according to the actual needs, and the present invention does not limit the installation position of the seal member 16. When the seal member 16 is installed between the first convex portion 11F and the second convex portion 12F, when the first housing 11 and the second housing 12 are bonded by the magnetic attraction of the first magnetic member 111 and the second magnetic member 121, the first housing 11 and the second housing 12 will be in a tightly bonded state.

[0026] Please refer to FIG. 6. The second housing 12 includes two second magnetic members 121 on each side, and the first housing 11 includes two first magnetic members 111 on each side, and the second magnetic members 121 and the first magnetic members 111 are arranged facing each other. In addition, the polarity settings and the magnitude of the magnetic attraction between the two first magnetic members 111 and the second magnetic members 121 can be different. In this embodiment, the magnetic attraction between the first magnetic member 111 and the second magnetic member 121 near the inner edge of the wafer test box 1C is stronger than the magnetic attraction between the first magnetic member 111 and the second magnetic member 121 near the outer edge of the wafer test box 1C. In addition, the first magnetic member 111 near the inner edge of the wafer test box 1C has an N pole on top and an S pole on the bottom, and the corresponding second magnetic member 121 is also arranged with an N pole on top and an S pole on the bottom. Furthermore, the first magnetic member 111 near the outer edge of the wafer test box 1C has a north pole at the bottom and a south pole at the top, while the corresponding second magnetic member 121 has a reversed configuration with a south pole at the bottom and a north pole at the top. In this case, if there is no interference from the magnetic shield 15A, the first housing and the second housing are tightly coupled by the magnetic attraction between the first magnetic member 111 near the inner edge of the wafer test box 1C and the second magnetic member 121. When the magnetic shield 15A is used to shield the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 near the inner edge of the wafer test box 1C, the magnetic repulsion force between the first magnetic member 111 and the second magnetic member 121 near the outer edge of the wafer test box 1C becomes similar to the magnetic attraction force between the first magnetic member 111 and the second magnetic member 121 near the inner edge of the wafer test box 1C, and the magnetic attraction force of the inner edge of the wafer test box 1C and the repulsion force of the outer edge of the wafer test box 1C are canceled out, making it possible to separate the second housing 12.

[0027] Please refer to Figures 7A to 7C. Figure 7A is a first schematic diagram showing a wafer test box according to a fourth embodiment of the present invention. Figure 7B is a second schematic diagram showing a wafer test box according to the fourth embodiment of the present invention. Figure 7C is a third schematic diagram showing a wafer test box according to the fourth embodiment of the present invention.

[0028] In this embodiment, the structure and function of the wafer test box 1D are similar to those of the wafer test box 1A of the first embodiment. The first magnetic member 111C of the wafer test box 1D of this embodiment is a permanent magnet, and the second magnetic member 121C is a paramagnetic material. The paramagnetic material may be, for example, a magnetic conductive material such as iron, cobalt, or nickel. The paramagnetic material may also be a permanent magnet.

[0029] First, in the process in which the first housing 11 and the second housing 12 of the wafer test box 1D gradually approach each other, the first housing 11 and the second housing 12 finally come into contact with each other through their respective driving devices, such as but not limited to servo motors or stepping motors, and can be tightly coupled through magnetic force.

[0030] Then, after the wafer 13 has been subjected to the test procedure of the probe card 112 and the pre-baking procedure, the first housing 11 and the second housing 12 can be separated from each other through a gradually increasing force by their respective driving devices, such as but not limited to a servo motor or a stepping motor.

[0031] For further detailed description, as shown in FIG. 7A, the magnetic barrier component of the wafer test box 1D is a magnetic shield 15A, which can be installed on the side of the first magnetic member 111C or the second magnetic member 121C. In this embodiment, the magnetic shield 15A is located on the side of the second magnetic member 121C. The magnetic shield 15A can move to shield the second magnetic member 121C, thereby reducing or blocking the magnetic attraction force between the first magnetic member 111C and the second magnetic member 121C. When the first housing 11 and the second housing 12 approach each other, the magnetic shield 15A shields the second magnetic member 121C, so that the first housing 11 and the second housing 12 can contact (couple) with less effort, and the above-mentioned magnetic attraction force can be excessively large to avoid damage to the wafer 13 and the probe card 112 in the wafer test box 1D.

[0032] As shown in FIG. 7B, when the first housing 11 and the second housing 12 come into contact, the magnetic shield 15A moves (along direction D1) away from the second magnetic member 121C, and the magnetic attraction force generated between the first magnetic member 111C and the second magnetic member 121C causes the first housing 11 and the second housing 12 to be tightly coupled together.

[0033] 7C, when the wafer test box 1D completes the test, the magnetic shield 15A moves to shield the second magnetic member 121C, thereby eliminating or reducing the magnetic attraction force. At this time, the coupling force between the first housing 11 and the second housing 12 is weakened, and the first housing 11 and the second housing 12 can be separated more easily.

[0034] Please refer to Figures 8A, 8B and 8C. Figure 8A is a first schematic diagram showing a wafer test box according to a fifth embodiment of the present invention. Figure 8B is a second schematic diagram showing a wafer test box according to a fifth embodiment of the present invention. Figure 8C is a fifth schematic diagram showing a wafer test box according to a third embodiment of the present invention.

[0035] In this embodiment, the structure and function of the wafer test box 1E are similar to those of the wafer test boxes 1A to 1C of the first embodiment. The first magnetic member 111E of the wafer test box 1E of this embodiment is a permanent magnet, the second magnetic member 121E is a non-permanent magnet (electromagnet), and the magnetic barrier component is a current switch 15B connected to a power source P.

[0036] As shown in FIG. 8A, the current switch 15B is in an on mode, and no magnetic attraction is generated between the first magnetic member 111 and the second magnetic member 121. At this time, the first housing 11 and the second housing 12 approach each other and come into contact with each other. As shown in FIG. 8B, when the first housing 11 and the second housing 12 come into contact with each other (coupled), the current switch 15B is in an off mode, and at this time, a magnetic attraction is generated between the first magnetic member 111 and the second magnetic member 121, and the first housing 11 and the second housing 12 are closely coupled, and the effect of the first housing 11 and the second housing 12 being locked to each other is generated. As shown in FIG. 8C, after the wafer 13 has completed the test program, the current switch 15B is again in an open mode, and the magnetic attraction between the first magnetic member 111 and the second magnetic member 121 is eliminated. This allows the first housing 11 and the second housing 12 to be separated from each other in a relatively energy-saving manner.

[0037] In a specific embodiment, the first magnetic member 111 is a non-permanent magnet (electromagnet), and the second magnetic member 121 is also a non-permanent magnet (electromagnet). The first magnetic member 111 and the second magnetic member 121 are each connected to a magnetic barrier component, which is a current switch 15B. In other words, there are a plurality of current switches 15B, each of which is electrically connected to the first magnetic member 111 and the second magnetic member 121. Similarly, as shown in the embodiment of FIG. 8A to FIG. 8C, a user can open and close the current switch 15B to generate or cut (erase) the magnetic attraction between the first magnetic member 111 and the second magnetic member 121, thereby allowing the first housing 11 and the second housing 12 to approach, contact, and position each other with less effort. After the first housing 11 and the second housing 12 are positioned, a magnetic attraction force is generated to tightly bond them together, and after the test program for the wafer 13 is completed, the magnetic attraction force is again cut (erased) to enable the first housing 11 and the second housing 12 to be easily separated.

[0038] According to a particular embodiment, the magnetic barrier component is a processor and is connected to a power source P. The processor modifies the strength of the magnetic field by increasing or decreasing the strength of the current, thereby eliminating or weakening the aforementioned magnetic attraction (when the first and second housings 11 and 12 are relatively close and in contact) or creating or strengthening the aforementioned magnetic attraction (when it is desired to closely couple the first and second housings 11 and 12). After the test program of the wafer 13 is completed, the processor reduces the strength of the current, reducing or eliminating the magnetic attraction, so that the first and second housings 11 and 12 can be separated. In this embodiment, the power source P is a battery or a DC power generation circuit, which supplies power to the first magnetic member 111E or the second magnetic member 121E. If the power source P is a battery, it may be a lithium-ion battery, a lithium-manganese battery, a lithium-polymer battery, or a nickel-metal hydride battery.

[0039] Please refer to FIG. 9. In this embodiment, the magnetic barrier component is a magnetic field generating component 15C (e.g., an electromagnet), which is installed between the first magnetic member 111E and the second magnetic member 121E. The magnetic field generating component 15C is used to shield or adjust the magnetic attraction force between the first magnetic member 111E and the second magnetic member 121E. Here, the first magnetic member 111E and the second magnetic member 121E may be permanent magnets or non-magnetic conductive bodies. In this embodiment, the magnetic field generating component 15C is installed in the second housing 12. The magnetic field generating component 15C is connected to a control circuit CRT and an external power source P2.

[0040] Based on the embodiment of Figure 9, the polarity of the surface of the magnetic field generating component 15C facing the first magnetic member 111E is the same as the polarity of the first magnetic member 111E (e.g., a north pole), and the polarity of the surface of the magnetic field generating component 15C facing the second magnetic member 121E is the same as the polarity of the second magnetic member 121E (e.g., a south pole).

[0041] When the first housing 11 and the second housing 12 approach each other and are about to come into contact with each other, the control circuit CRT controls the magnitude of the current of the magnetic generating component 15C so that the magnetic generating component 15C makes the repulsive force between the first magnetic member 111E and the second magnetic member 121E smaller or slightly smaller than the magnetic attractive force between the first magnetic member 111E and the second magnetic member 121E. After the first housing 11 and the second housing 12 come into accurate contact with each other, the control circuit CRT gradually reduces the current of the magnetic generating component 15C so that the magnetic generating component 15C reduces or eliminates the repulsive force between the first magnetic member 111E and the second magnetic member 121E. This allows the first housing 11 and the second housing 12 to be tightly coupled. After the test program of the wafer 13 is completed, the control circuit CRT increases the current of the magnetic field generating component 15C, so that the magnetic field generating component 15C strengthens or generates a repulsive force between the first magnetic member 111E and the second magnetic member 121E, which is greater than the magnetic attractive force between the first magnetic member 111E and the second magnetic member 121E. In this way, the first housing 11 and the second housing 12 become easily separable.

[0042] [Beneficial Effects of the Embodiments] One beneficial effect of the present invention is that the wafer test box provided by the present invention uses the following technical means to strengthen the structure of the wafer test box, strengthen the coupling and fixing ability of the first and second housings, improve the alignment accuracy during coupling, and further improve the fixing effect of the wafer: "the wafer test box includes a first housing and a second housing", "the first housing has a first magnetic member", "the second housing has a second magnetic member", "when the first magnetic member of the first housing and the second magnetic member of the second housing approach each other, a magnetic attraction force is generated between the first magnetic member and the second magnetic member, thereby coupling and fixing the first housing and the second housing", and "the magnetic barrier component reduces or cuts the magnetic attraction force generated between the first magnetic member and the second magnetic member, thereby enabling the first housing and the second housing to be separated". [Explanation of symbols]

[0043] 1A, 1B, 1C, 1D, 1E Wafer Test Box 11 First Case 11F First protrusion 11FP Engagement part 111, 111C, 111E First magnetic member 112 Probe Card 1121 Probe 112F First fixing member 12 Second housing 121, 121C, 121E Second magnetic member 12F 2nd protrusion 12FP engaging part 13 Wafer 13F Second fixing member 15A Magnetic Shield 15B Current Switch 15C Magnetic generating parts 16 Sealing material CRT control circuit D1 direction S Storage space P power supply P2 External power supply

Claims

1. a first housing having at least one first magnetic member; a second housing having at least one second magnetic member arranged corresponding to the first magnetic member, and forming an accommodation space between the second housing and the first housing when the second magnetic member comes into corresponding contact with the first housing; a magnetic barrier component arranged to be connected to the first housing or the second housing, and configured to reduce or eliminate a magnetic attraction force generated between the first magnetic member and the second magnetic member; A wafer test box comprising: the magnetic barrier component is used to reduce or eliminate the magnetic attraction force before the first housing and the second housing come into contact; When the first housing and the second housing come into corresponding contact with each other, the influence of the magnetic barrier component is released, and the first housing and the second housing are intimately coupled through the magnetic attraction force; The first housing and the second housing are closely coupled through the magnetic attraction force, and the magnetic barrier component is used to reduce the magnetic attraction force, so that the first housing and the second housing can be separated. A wafer test box comprising:

2. 2. The wafer test box of claim 1, wherein the first magnetic member is a permanent magnet, the second magnetic member is a permanent magnet or a non-magnetic conductive material, the magnetic barrier component is movably installed in the first housing or the second housing and is positioned between the first magnetic member and the second magnetic member, and when the magnetic barrier component moves to a position shielding the first magnetic member or the second magnetic member, the magnetic attraction force generated between the first magnetic member and the second magnetic member is reduced.

3. The wafer test box of claim 2 , wherein the magnetic barrier component is a magnetic shield or a magnetic field generating component.

4. 4. The wafer test box of claim 3, wherein the magnetic barrier component is the magnetic generating component, and the magnetic generating component adjusts the magnetic attraction force between the first magnetic member and the second magnetic member so that the first housing and the second housing are closely coupled or separated.

5. 2. The wafer test box of claim 1, wherein the first magnetic member is a non-permanent magnet, the second magnetic member is a paramagnetic material, the magnetic barrier component controls whether the first magnetic member generates magnetism, the magnetic barrier component is connected to the first magnetic member, and the magnetic barrier component is a switch or a microprocessor.

6. 2. The wafer test box of claim 1, wherein the first magnetic member is a plurality of members, the second magnetic member is also a plurality of members, and the number of the first magnetic members is the same as the number of the second magnetic members.

7. The wafer test box of claim 1 , further comprising a seal member disposed around the storage space, the storage space being defined by the first housing, the second housing and the seal member.

8. 2. The wafer test box of claim 1, wherein the first housing includes at least one first positioning portion, the second housing includes at least one second positioning portion, and the first positioning portion and the second positioning portion are configured to correspond to each other so that the first housing and the second housing can come into corresponding contact with each other.

9. 9. The wafer test box of claim 8, wherein the first positioning portion is included on a side of the first housing, the second positioning portion is included on a side of the second housing, the first positioning portion is a first convex portion, the second positioning portion is a second convex portion, the first convex portion and the second convex portion are installed to correspond to each other, and when the first housing and the second housing are closely joined, the first convex portion and the second convex portion are closely joined.

10. 2. The wafer test box of claim 1, wherein a first convex portion is included on a side of the first housing and a second convex portion is included on a side of the second housing, the first convex portion and the second convex portion are installed to correspond to each other, and when the first housing and the second housing are closely joined, the first convex portion and the second convex portion are closely joined.

11. The wafer test box according to claim 10 , wherein the storage space is defined by the first housing, the first protrusion, the second housing, and the second protrusion.

12. The wafer test box of claim 1 , further comprising a probe card and a wafer, the probe card and the wafer being placed in the receiving space.

13. 13. The wafer test box of claim 12, wherein the first housing carries the probe card, the probe card including at least one probe, the probe protruding toward the second housing when the first housing and the second housing are mated, the wafer having at least one solder pad, the second housing carries the wafer, and the at least one probe is in electrical contact with the at least one solder pad of the wafer when the first housing and the second housing are mated.

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