Substrate processing apparatus and substrate processing method

Abstract

To provide a technology for suppressing damage to an electrolytic cell during substrate processing.SOLUTION: A substrate processing apparatus according to the technology disclosed in the present specification includes a substrate processing portion, a supply tank, a generation portion, a recovery portion, a first supply path that supplies the processing liquid generated in the generation portion to the supply tank, and a second supply path that supplies the processing liquid generated in the generation portion to the recovery portion, and the recovery portion supplies post-processing liquid to the generation portion after mixing the processing liquids supplied via the second supply path.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a substrate processing technology. Substrates to be processed include, for example, semiconductor wafers, glass substrates for liquid crystal display devices, substrates for flat panel displays (FPDs) such as organic electroluminescence (EL) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, glass substrates for photomasks, ceramic substrates, substrates for field emission displays (FEDs), and substrates for solar cells. [Background technology]

[0002] Conventionally, a mixed solution of sulfuric acid and hydrogen peroxide (SPM) has been used as a processing liquid for substrate processing (see, for example, Patent Document 1). SPM is a processing liquid that generates oxidizing power by mixing sulfuric acid with hydrogen peroxide, and is mainly used for substrate processing such as removing resist formed on the upper surface of a substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-163977 A Summary of the Invention [Problem to be solved by the invention]

[0004] On the other hand, instead of using SPM, which generates a large amount of waste liquid, electrolytic sulfuric acid can be used as the processing liquid for substrate processing. Since electrolytic sulfuric acid can be reused as a processing liquid by electrolyzing it again even after it has been used for substrate processing, the amount of waste liquid can be reduced.

[0005] However, when electrolyzing the electrolytic sulfuric acid again after being used for substrate processing, if resist or the like produced during the substrate processing remains in the solution, the electrolytic cell may be damaged and worn out.

[0006] The technology disclosed in the present specification has been made in consideration of the problems described above, and is a technology for suppressing damage to an electrolytic cell during substrate processing. [Means for solving the problem]

[0007] A substrate processing apparatus that is a first aspect of the technology disclosed in the present specification includes a substrate processing unit for processing a substrate using a processing liquid, a supply tank for storing the processing liquid to be supplied to the substrate processing unit, a generation unit for generating the processing liquid by electrolysis, a recovery unit for recovering a post-processing liquid, which is the processing liquid supplied to the substrate processing unit, and supplying the post-processing liquid to the generation unit, a first supply path for supplying the processing liquid generated in the generation unit to the supply tank, and a second supply path that is a path different from the first supply path for supplying the processing liquid generated in the generation unit to the recovery unit, and the recovery unit supplies the post-processing liquid after mixing the processing liquid supplied via the second supply path to the generation unit. A substrate processing apparatus which is a second aspect of the technology disclosed in the present specification is related to the substrate processing apparatus which is the first aspect, and further includes a first measurement unit which measures the amount of the post-processing liquid in the recovery section and outputs the measurement result, and the generation unit controls the flow rate of the processing liquid supplied to the recovery section based on the measurement result. A substrate processing apparatus which is a third aspect of the technology disclosed in the present specification is related to the substrate processing apparatus which is the first or second aspect, and the generation unit includes a first temperature adjustment unit for adjusting the post-processing liquid and the generated processing liquid to an electrolysis temperature, which is a temperature for generating the processing liquid by electrolysis. A substrate processing apparatus which is a fourth aspect of the technology disclosed in the present specification is related to a substrate processing apparatus which is any one of the first to third aspects, and the recovery unit is provided with a second temperature adjustment unit for adjusting the post-processing liquid to an electrolysis temperature, which is a temperature for generating the processing liquid by electrolysis. A substrate processing apparatus which is a fifth aspect of the technology disclosed in the present specification is related to a substrate processing apparatus which is any one of the first to fourth aspects, and further includes a second measurement unit which measures the TOC concentration of the post-processing liquid in the recovery section and outputs the measurement result, and the generation unit controls the flow rate of the processing liquid supplied to the recovery section based on the measurement result. A substrate processing method that is a sixth aspect of the technology disclosed in the present specification is a substrate processing method for processing a substrate using a processing liquid, the method comprising the steps of: storing the processing liquid in a supply tank to be supplied to a substrate processing unit; processing the substrate using the processing liquid in the substrate processing unit; recovering a post-processing liquid, which is the processing liquid supplied to the substrate processing unit, in a recovery unit and further supplying it to a generation unit; and generating the processing liquid from a liquid containing the post-processing liquid by electrolysis in the generation unit, the method comprising: a first supply path for supplying the processing liquid generated in the generation unit to the supply tank; and a second supply path, which is a path different from the first supply path, for supplying the processing liquid generated in the generation unit to the recovery unit, the step of supplying the post-processing liquid to the generation unit being a step of supplying the post-processing liquid obtained by mixing the processing liquid supplied via the second supply path to the generation unit. Effect of the Invention

[0008] According to at least the first and sixth aspects of the technology disclosed in the present specification, the decomposition of resist and the like remaining in the liquid can be promoted by supplying the processing liquid from a generation tank, and thus the post-processing liquid can be supplied to the electrolytic cell to reduce damage to the electrolytic cell during electrolysis.

[0009] Furthermore, objects, features, aspects and advantages associated with the technology disclosed herein will become more apparent from the detailed description set forth below and the accompanying drawings. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] 2 is a diagram conceptually illustrating an example of the configuration of a control unit whose example is shown in FIG. 1; FIG. [Diagram 3] FIG. 2 is a diagram illustrating an example of a processing unit and a related configuration in a substrate processing apparatus according to an embodiment. [Figure 4] 4 is a cross-sectional view showing an example of the internal structure of a discharge nozzle. FIG. [Diagram 5] 13A and 13B are diagrams illustrating an example of the configuration of a substrate processing apparatus in a circulation state of discharge nozzles. [Figure 6] 1A and 1B are diagrams illustrating an example of the configuration of a substrate processing apparatus in a discharge state of a discharge nozzle. [Figure 7] 13A and 13B are diagrams illustrating an example in which the post-processing liquid is circulated in the recovery tank in a discharge state of the discharge nozzle. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described with reference to the accompanying drawings. In the following embodiments, detailed features are shown for the purpose of explaining the technology, but they are merely examples and are not necessarily essential features for enabling the embodiments to be implemented.

[0012] The drawings are schematic, and for the sake of convenience, configurations may be omitted or simplified as appropriate. The size and positional relationship of the configurations shown in different drawings are not necessarily described accurately, and may be changed as appropriate. Hatching may be used in drawings such as plan views that are not cross-sectional views to facilitate understanding of the contents of the embodiments.

[0013] In the following description, the same components are denoted by the same reference numerals, and their names and functions are also the same. Therefore, detailed descriptions thereof may be omitted to avoid duplication.

[0014] Furthermore, in the description in this specification, when a certain component is described as "comprising," "including," or "having," unless otherwise specified, this is not an exclusive expression that excludes the presence of other components.

[0015] Furthermore, even if ordinal numbers such as "first" or "second" are used in the description of this specification, these terms are used for convenience to facilitate understanding of the contents of the embodiments, and the contents of the embodiments are not limited to the orders that may result from these ordinal numbers.

[0016] Furthermore, although the descriptions in this specification may use terms indicating specific positions or directions, such as "top," "bottom," "left," "right," "side," "bottom," "front," or "back," these terms are used for convenience to facilitate understanding of the contents of the embodiments, and do not relate to the positions or directions in which the embodiments are actually implemented.

[0017] In addition, in the description of the present specification, when "the upper surface of ..." or "the lower surface of ..." is stated, it is intended to include not only the upper surface or lower surface of the target component itself, but also a state in which another component is formed on the upper surface or lower surface of the target component. In other words, for example, when it is stated that "B is provided on the upper surface of A," it does not prevent another component "C" from being interposed between A and B.

[0018] <Embodiment Mode> A substrate processing apparatus and a substrate processing method according to the present embodiment will be described below.

[0019] <Configuration of the substrate processing apparatus> Fig. 1 is a diagram showing an example of the configuration of a substrate processing apparatus according to the present embodiment. As shown in Fig. 1, the substrate processing apparatus 1 includes a plurality of processing units 600, a supply tank 10, a production tank 20A and a production tank 20B, an electrolytic cell 21A and an electrolytic cell 21B, a recovery tank 30, a drainage tank 40 for draining processing liquid and the like, and a control unit 90.

[0020] The processing unit 600 processes the substrate using the supplied processing liquid. A detailed configuration of the processing unit 600 will be described later. The number of processing units 600 is not limited to the number shown in FIG.

[0021] The supply tank 10 stores the processing liquid supplied from the generation tank 20A or 20B via the supply pipe 100. The supply tank 10 supplies the processing liquid to the processing unit 600. The supply tank 10 is also supplied with pure water (DIW), hydrogen peroxide water, or ozone water from a pure water supply source 12. The flow rate of the pure water or the like supplied from the pure water supply source 12 can be adjusted by controlling a valve 12A with a control unit 90. The pure water supply source 12 does not necessarily have to be provided.

[0022] The piping for supplying the processing liquid from the supply tank 10 includes a circulation piping 102 connected to the supply tank 10 and circulating the processing liquid through the supply tank 10, a measurement piping 104 branching off from the circulation piping 102 and returning the processing liquid to the supply tank 10, a supply piping 106 branching off from the circulation piping 102 and supplying the processing liquid to each processing unit 600, a return piping 108 branching off at the downstream end of each supply piping 106 and returning the processing liquid to the supply tank 10, and a circulation piping 110 returning the processing liquid joining each return piping 108 to the supply tank 10.

[0023] A flowmeter 112 for measuring the flow rate of the treatment liquid, a pump 114 for flowing the treatment liquid, a heater 116 for heating the treatment liquid, a thermometer 117 for measuring the temperature of the treatment liquid, a heat exchanger 116A for cooling the treatment liquid, a thermometer 117A for measuring the temperature of the treatment liquid, and an electrolytic cell 118 for electrolyzing the treatment liquid are provided upstream of the position where the circulation pipe 102 branches into the measurement pipe 104. Note that the electrolytic cell 118 does not need to be provided if autolysis of the treatment liquid is sufficiently suppressed. Also, the heater may be replaced with a mechanism capable of adjusting the temperature, including cooling, and is not limited to heating. The same applies to the heaters described below.

[0024] The measurement pipe 104 is provided with a concentration meter 120 for measuring the concentration (for example, total organic carbon concentration, i.e., TOC concentration) of the treatment liquid flowing through the measurement pipe 104. When the concentration of the treatment liquid measured by the concentration meter 120 is higher than the desired concentration, the control unit 90 controls the supply tank 10 to supply pure water or the like from the pure water supply source 12, thereby decreasing the concentration of the treatment liquid. When the concentration of the treatment liquid measured by the concentration meter 120 is lower than the desired concentration, the control unit 90 controls the electrolysis cell 118 to electrolyze the treatment liquid and simultaneously electrolyze water, thereby increasing the concentration of the treatment liquid. The water generated by electrolysis can also be used as the imparting water.

[0025] Downstream of the point where the circulation pipe 102 branches off to the measurement pipe 104, there are provided a filter 119 for removing particles and the like from the processing liquid, and a valve 102A that can adjust the flow rate of the processing liquid circulating through the circulation pipe 102 by controlling the control unit 90.

[0026] The supply pipe 106 is provided with a valve 106A that can adjust the flow rate of the processing liquid flowing through the supply pipe 106 by controlling the control unit 90. A part of the flow rate of the processing liquid flowing through the circulation pipe 102 flows through the supply pipe 106.

[0027] The return pipe 108 is provided with a valve 108A that can adjust the flow rate of the processing liquid flowing through the return pipe 108 by controlling the control unit 90.

[0028] In addition, the point where the return pipe 108 branches off from the supply pipe 106 is provided inside the discharge nozzle 106B in the processing unit 600, and the discharge nozzle 106B is further connected to a mixing pipe 200 that mixes the application water, which is deionized water (DIW), hydrogen peroxide water, or ozone water, with the processing liquid in the supply pipe 106. The mixing pipe 200 is provided with a valve 200A that can adjust the flow rate of the application water flowing through the mixing pipe 200 by controlling the control unit 90.

[0029] The imparting water supplied to the mixing pipe 200 may be supplied from the pure water supply source 12, or may be supplied from a supply source prepared separately.

[0030] The piping for recovering the processing liquid from the processing unit 600 includes a drainage pipe 122 connected to each processing unit 600 and draining the processing liquid (post-processing liquid) used in the substrate processing, a recovery pipe 124 for supplying the post-processing liquid joining the drainage pipes 122 to the recovery tank 30, a recovery pipe 126 connected to the recovery tank 30 and supplying the post-processing liquid to the generation tank 20A or the generation tank 20B, a circulation pipe 128 for circulating the processing liquid between the generation tank 20A and the electrolytic cell 21A, a circulation pipe 130 for circulating the processing liquid between the generation tank 20B and the electrolytic cell 21B, a supply pipe 132 for joining the processing liquid from the generation tank 20A to the supply pipe 100, and a supply pipe 134 for joining the processing liquid from the generation tank 20B to the supply pipe 100. The drainage pipe 122 is provided with a valve 122A for adjusting the flow rate of the drainage liquid from the processing unit 600 by controlling it with the control unit 90.

[0031] Here, a plurality of recovery tanks 30 may be provided in parallel. That is, the processed liquid from the recovery pipe 124 may be selectively supplied to a plurality of recovery tanks, and the time until the processed liquid is supplied from the recovery tank to the generation tank may be extended. In addition, the recovery tank 30 is provided with a level sensor 190 for measuring the amount of the processed liquid stored in the recovery tank 30.

[0032] The recovery piping 126 is provided with a pump 136 for sending the processed liquid stored in the recovery tank 30 to the generation tank 20A or the generation tank 20B, a heater 180 for heating the processed liquid, a thermometer 181 for measuring the temperature of the processed liquid, a heat exchanger 180A for cooling the processed liquid, a thermometer 181A for measuring the temperature of the processed liquid, a concentration meter 184 for measuring the concentration of the processed liquid (e.g., total organic carbon concentration, i.e., TOC concentration), a valve 126A that can be adjusted by controlling the flow rate of the processed liquid sent to the generation tank 20A with the control unit 90, and a valve 126B that can be adjusted by controlling the flow rate of the processed liquid sent to the generation tank 20B with the control unit 90.

[0033] In addition, a circulation pipe 183 is provided branching off from the recovery pipe 126. The circulation pipe 183 returns and circulates the post-processing liquid to the recovery tank 30. A valve 182A is provided downstream of the point where the recovery pipe 126 branches off from the circulation pipe 183, for controlling the flow rate of the post-processing liquid flowing into the recovery pipe 126 with the control unit 90. In addition, a valve 182B is provided upstream of the circulation pipe 183, for controlling the flow rate of the post-processing liquid flowing into the circulation pipe 183 with the control unit 90.

[0034] Contrary to the recovery pipe 126, a supply pipe 170 for sending the treatment liquid stored in the generation tank 20A or the generation tank 20B to the recovery tank 30 is provided to connect the generation tank 20A and the generation tank 20B to the recovery tank 30. The supply pipe 170 is provided as a pipe separate from the supply pipe 100.

[0035] The supply piping 170 is provided with a valve 170A for adjusting the flow rate of the processing liquid flowing from the generation tank 20A into the supply piping 170 by controlling it with the control unit 90, a pump 172 for transporting the processing liquid flowing from the generation tank 20A into the supply piping 170, a valve 170B for adjusting the flow rate of the processing liquid flowing from the generation tank 20B into the supply piping 170 by controlling it with the control unit 90, a pump 174 for transporting the processing liquid flowing from the generation tank 20B into the supply piping 170, and a valve 170C for adjusting the flow rate of the processing liquid flowing from the supply piping 170 into the recovery tank 30 by controlling it with the control unit 90.

[0036] The circulation pipe 128 is provided with a valve 128A for adjusting the flow rate of the treatment liquid flowing through the circulation pipe 128 by controlling the control unit 90, a concentration meter 138 for measuring the concentration of the treatment liquid flowing through the circulation pipe 128 (e.g., total organic carbon concentration, i.e., TOC concentration), a pump 140 for pumping the treatment liquid flowing through the circulation pipe 128, a heater 142 for heating the treatment liquid, a thermometer 143 for measuring the temperature of the treatment liquid, a heat exchanger 142A for cooling the treatment liquid, a thermometer 143A for measuring the temperature of the treatment liquid, and a filter 144 for removing particles and the like from the treatment liquid.

[0037] The circulation pipe 130 is provided with a valve 130A for adjusting the flow rate of the treatment liquid flowing through the circulation pipe 130 by controlling it with the control unit 90, a concentration meter 146 for measuring the concentration of the treatment liquid flowing through the circulation pipe 130 (for example, total organic carbon concentration, i.e., TOC concentration), a pump 148 for pumping the treatment liquid flowing through the circulation pipe 130, a heater 150 for heating the treatment liquid, a thermometer 151 for measuring the temperature of the treatment liquid, a heat exchanger 150A for cooling the treatment liquid, a thermometer 151A for measuring the temperature of the treatment liquid, and a filter 152 for removing particles and the like from the treatment liquid.

[0038] The supply pipe 132 is provided with a valve 132A that can adjust the flow rate of the processing liquid flowing through the supply pipe 132 by controlling the control unit 90.

[0039] The supply pipe 134 is provided with a valve 134A that can adjust the flow rate of the processing liquid flowing through the supply pipe 134 by controlling the control unit 90.

[0040] The supply pipe 100 is provided with a pump 154 ​​for pumping the processing liquid flowing through the supply pipe 100, a heater 156 for heating the processing liquid, a filter 158 for removing particles and the like from the processing liquid, and a valve 100A for adjusting the flow rate of the processing liquid flowing through the supply pipe 100 by controlling it with the control unit 90.

[0041] Further, the generation tank 20A and the generation tank 20B are supplied with pure water (DIW), hydrogen peroxide water or ozone water from the pure water supply source 14. The flow rate of the pure water, etc. supplied from the pure water supply source 14 to the generation tank 20A can be adjusted by controlling the valve 14A with the control unit 90. Further, the flow rate of the pure water, etc. supplied from the pure water supply source 14 to the generation tank 20B can be adjusted by controlling the valve 14B with the control unit 90. Note that the pure water supply source 14 does not necessarily have to be provided.

[0042] The production tank 20A and the production tank 20B are supplied with sulfuric acid (H 2 SO 4 ) is supplied. The flow rate of sulfuric acid supplied from the sulfuric acid supply source 16 to the generation tank 20A can be adjusted by controlling the valve 16A with the control unit 90. The flow rate of sulfuric acid supplied from the sulfuric acid supply source 16 to the generation tank 20B can be adjusted by controlling the valve 16B with the control unit 90. The sulfuric acid supply source 16 does not necessarily have to be provided.

[0043] The piping for draining the processing liquid and post-processing liquid includes drainage piping 160 for draining the post-processing liquid from each processing unit 600 to the drainage tank 40, drainage piping 162 for draining the processing liquid from the supply tank 10 to the drainage tank 40, and drainage piping 164 for draining the processing liquid or post-processing liquid from the formation tank 20A, the formation tank 20B and the recovery tank 30 to the drainage tank 40. The drainage piping 160 is provided with a valve 160A for adjusting the flow rate of the drainage liquid from the processing unit 600 under the control of the control unit 90. The drainage piping 162 is provided with a valve 162A for adjusting the flow rate of the drainage liquid from the supply tank 10 under the control of the control unit 90. The drainage piping 164 is provided with a valve 164A that adjusts the flow rate of drainage from the generation tank 20A under the control of the control unit 90, a valve 164B that adjusts the flow rate of drainage from the generation tank 20B under the control of the control unit 90, and a valve 164C that adjusts the flow rate of drainage from the recovery tank 30 under the control of the control unit 90.

[0044] Fig. 2 is a diagram conceptually illustrating an example of the configuration of the control unit 90 illustrated in Fig. 1. The control unit 90 may be configured by a general computer having an electric circuit. Specifically, the control unit 90 includes a central processing unit (CPU) 91, a read only memory (ROM) 92, a random access memory (RAM) 93, a storage device 94, an input unit 96, a display unit 97, and a communication unit 98, and a bus line 95 that interconnects these units.

[0045] The ROM 92 stores a basic program. The RAM 93 is used as a working area when the CPU 91 performs a predetermined process. The storage device 94 is composed of a non-volatile storage device such as a flash memory or a hard disk drive. The input unit 96 is composed of various switches or a touch panel, and receives input setting instructions such as processing recipes from an operator. The display unit 97 is composed of, for example, a liquid crystal display device and lamps, and displays various information under the control of the CPU 91. The communication unit 98 has a data communication function via a local area network (LAN) or the like.

[0046] A plurality of modes for controlling each component in the substrate processing apparatus 1 of FIG. 1 are preset in the storage device 94. When the CPU 91 executes the processing program 94P, one of the above-mentioned modes is selected, and each component is controlled in that mode. The processing program 94P may be stored in a recording medium. By using this recording medium, the processing program 94P can be installed in the control unit 90. In addition, some or all of the functions executed by the control unit 90 do not necessarily need to be realized by software, and may be realized by hardware such as a dedicated logic circuit.

[0047] Fig. 3 is a diagram illustrating an example of a processing unit 600 and related configurations in a substrate processing apparatus according to the present embodiment. Note that Fig. 3 illustrates an example of the configuration of the processing unit 600 disposed downstream of one of the supply pipes 106 in Fig. 1, but the configurations of the processing units 600 disposed downstream of other supply pipes 106 are similar to the example illustrated in Fig. 3.

[0048] As shown in an example in Figure 3, the processing unit 600 comprises a box-shaped chamber 80 having an internal space, a spin chuck 251 that holds one substrate W in a horizontal position within the chamber 80 and rotates the substrate W about a vertical rotation axis Z1 passing through the center of the substrate W, and a cylindrical processing cup 511 that surrounds the spin chuck 251 about the rotation axis Z1 of the substrate W.

[0049] The chamber 80 is surrounded by a box-shaped wall 250 A. An opening 250 B for carrying the substrate W into and out of the chamber 80 is formed in the wall 250 A.

[0050] Opening 250B is opened and closed by shutter 250C. Shutter 250C is raised and lowered by a shutter lifting mechanism (not shown here) between a closed position (shown by a two-dot chain line in FIG. 3) where it covers opening 250B and an open position (shown by a solid line in FIG. 3) where it opens opening 250B.

[0051] As shown in an example in Figure 3, the spin chuck 251 includes a disk-shaped spin base 251A arranged opposite the substrate W in a horizontal position, a plurality of chuck pins 251B protruding upward from the outer periphery of the upper surface of the spin base 251A and clamping the peripheral portion of the substrate W, a rotation shaft 251C extending downward from the center of the spin base 251A, and a spin motor 251D that rotates the substrate W adsorbed to the spin base 251A by rotating the rotation shaft 251C.

[0052] The spin chuck 251 is not limited to the clamping type chuck shown in FIG. 3, but may be, for example, a vacuum suction type chuck having a spin base that vacuum-sucks the lower surface of the substrate W.

[0053] The processing unit 600 may be connected to a nozzle for discharging liquid for other purposes (for example, a nozzle for discharging other chemical liquid, or a nozzle for discharging a rinsing liquid, etc.).

[0054] 3, a discharge nozzle 106B that discharges a processing liquid is connected to the tip of the supply pipe 106 that is connected to the processing unit 600. The discharge nozzle 106B discharges the processing liquid toward a predetermined portion inside the chamber 80 (for example, the spin base 251A).

[0055] Processing cup 511 is provided to surround the periphery of spin chuck 251, and is raised and lowered in the vertical direction by a lifting mechanism (such as a motor or a cylinder) not shown. The upper part of processing cup 511 is raised and lowered between an upper position where its upper end is above substrate W held by spin base 251A, and a lower position where its upper end is below substrate W.

[0056] The processing liquid splashed outward from the upper surface of substrate W is received on the inner surface of processing cup 511. The processing liquid received in processing cup 511 is then appropriately drained to the outside of chamber 80 via drainage pipes 122 and 160 provided at the bottom of chamber 80 and inside processing cup 511. The atmosphere inside processing cup 511 is exhausted by a cup exhaust mechanism (not shown).

[0057] Further, an exhaust port 515 is provided on the side of the chamber 80. The atmosphere inside the chamber 80 is appropriately exhausted to the outside of the chamber 80 through the exhaust port 515.

[0058] FIG. 4 is a cross-sectional view showing an example of the internal structure of the discharge nozzle 106B.

[0059] The discharge nozzle 106B comprises a main body 36 in which a flow path 35 for guiding the treatment liquid is formed, a valve body 37 for opening and closing the flow path 35, a pneumatic actuator 38 for moving the valve body 37 back and forth in the axial direction X1 to open and close the flow path 35, a mixing pipe 200 that merges with the flow path 35 at a position downstream of the valve body 37 (flow path 35c), and a discharge port 31.

[0060] The main body 36 includes a cylinder 39 that constitutes a pneumatic actuator 38, a valve chamber 40A that moves the valve element 37 back and forth, a flow path 35a that communicates with the supply piping 106 and leads to the valve chamber 40A, a flow path 35b that communicates with the return piping 108 and is connected to the flow path 35a at a position upstream of the valve chamber 40A of the flow path 35a, and a flow path 35c that leads from the valve chamber 40A to the discharge port 31.

[0061] The cylinder 39 and the valve chamber 40A are aligned in the axial direction X1. The cylinder 39 and the valve chamber 40A are separated by a partition wall 41. The flow paths 35a and 35c correspond to a part of a supply pipe 106 that guides the treatment liquid supplied from the supply tank 10 toward the discharge port 31. The flow path 35b corresponds to a part of a return pipe 108 that returns the treatment liquid to the supply tank 10.

[0062] The pneumatic actuator 38 includes a cylinder 39, a piston 42, a spring 43, and a rod 44. The cylinder 39 is separated by the piston 42 into a front chamber on the partition wall 41 side and a rear chamber on the opposite side in the axial direction X1 across the piston 42. Joints 47 for connecting tubes that transmit air pressure separately to the front chamber and the rear chamber of the cylinder 39 are connected to the main body 36. The piston 42 advances and retreats within the cylinder 39 along the axial direction X1 by transmitting air pressure to either the front chamber or the rear chamber of the cylinder 39 via the tube and the joint 47.

[0063] The spring 43 is interposed between the piston 42 and the main body 36 on the rear chamber side of the cylinder 39 , and presses the piston 42 in the direction of the partition wall 41 .

[0064] The rod 44 has a base connected to the piston 42 and a tip penetrating the partition wall 41 and protruding into the valve chamber 40A. The valve element 37 is connected to the tip of the rod 44 protruding into the valve chamber 40A. The valve element 37 is formed in a disk shape and is connected to the tip of the rod 44 with its radial direction perpendicular to the axial direction X1. When the piston 42 advances and retreats along the axial direction X1 within the cylinder 39, the valve element 37 advances and retreats along the axial direction X1 within the valve chamber 40A via the rod 44.

[0065] The valve chamber 40A faces the partition wall 41 and includes an annular valve seat surface 46 perpendicular to the axial direction X1, and the flow path 35a opens concentrically at the center of the valve seat surface 46. The flow path 35c opens to the side of the valve chamber 40A in the advancing and retreating direction of the valve element 37 (the axial direction X1).

[0066] The main body 36 includes a cylindrical portion 49 having a discharge port 31 formed at its tip and protruding downward from the lower surface of the nozzle head 26. In addition, the mixing pipe 200 is inserted from the side of the cylindrical portion 49, and the mixing pipe 200 is connected to the flow path 35c located downstream of the valve chamber 40A.

[0067] When air pressure is not applied to either the front or rear chamber of the cylinder 39 and the pneumatic actuator 38 is not operated, the piston 42 is pressed by the spring 43 to a forward position within the cylinder 39, that is, to a position close to the partition wall 41 side as shown in an example in FIG. 4, whereby the valve element 37 is brought into contact with the valve seat surface 46 within the valve chamber 40A and the opening of the flow path 35a is closed.

[0068] Therefore, the passage between flow paths 35a and 35c is closed, and the processing liquid supplied from supply tank 10 through supply pipe 106 and flow path 35a is returned to supply tank 10 through flow path 35b and return pipe 108 (circulation state).

[0069] In this circulation state, when air pressure is transmitted to the front chamber of cylinder 39 and piston 42 is moved backward toward the rear chamber of cylinder 39 against the pressing force of spring 43, valve element 37 moves away from valve seat surface 46 in valve chamber 40A, and the opening of flow path 35a is released to valve chamber 40A. Therefore, flow paths 35a and 35c are connected via valve chamber 40A, and the treatment liquid supplied from supply tank 10 through supply pipe 106 and flow path 35a is discharged from discharge port 31 through flow path 35c (discharge state).

[0070] In this discharge state, when the transmission of air pressure to the front chamber of cylinder 39 is stopped and instead air pressure is transmitted to the rear chamber of cylinder 39, and piston 42 advances toward the front chamber of cylinder 39, i.e., toward partition wall 41, together with the pressing force of spring 43, valve element 37 comes into contact with valve seat surface 46 in valve chamber 40A, and the opening of flow path 35a is closed. Therefore, the passage between flow paths 35a and 35c is closed, and a circulation state is restored in which the treatment liquid supplied from supply tank 10 through supply pipe 106 and flow path 35a is returned to supply tank 10 through flow path 35b and return pipe 108.

[0071] In the above discharge state, when the valve 200A is opened and the applied water is mixed with the treatment liquid from the mixing pipe 200, the temperature of the treatment liquid containing electrolytic sulfuric acid increases due to reaction heat. Specifically, the temperature of the treatment liquid increases to the temperature (treatment temperature) at which the treatment liquid is used for substrate treatment.

[0072] <Operation of the substrate processing apparatus> Next, the operation of the substrate processing apparatus will be described. The substrate processing method by the substrate processing apparatus according to this embodiment includes a step of performing substrate processing by discharging a processing liquid onto the substrate W transferred to the processing unit 600, a step of cleaning the substrate W after the substrate processing, a step of rotating and drying the cleaned substrate W, and a step of unloading the dried substrate W from the processing unit 600.

[0073] The substrate processing included in the operation of the above-mentioned substrate processing apparatus will be described below with reference to Fig. 5 and Fig. 6. Fig. 5 is a diagram showing an example of the configuration of the substrate processing apparatus in a circulation state of the discharge nozzle 106B. Fig. 6 is a diagram showing an example of the configuration of the substrate processing apparatus in a discharge state of the discharge nozzle 106B. In Fig. 5 and Fig. 6, valves in an open state are shown in black. The operations described below are performed by the control unit 90 controlling the operation of each component (pump, heater, valve, spin motor, etc.) in the substrate processing apparatus 1.

[0074] First, sulfuric acid (H 2 SO 4 ) is circulated to generate a treatment solution containing electrolytic sulfuric acid. Here, electrolytic sulfuric acid is persulfuric acid (peroxodisulfuric acid, or H 2 S 2 O 8 ) at the same temperature. 2 SO 5 ) has a stronger oxidizing power than

[0075] To the production tank 20A, sulfuric acid is appropriately supplied from the sulfuric acid supply source 16 under the control of a valve 16A by the control unit 90. In addition, pure water (DIW) or the like is appropriately supplied from the pure water supply source 14 under the control of a valve 14A by the control unit 90. In addition, as described below, to the production tank 20A, post-processing liquid is supplied from the recovery tank 30 under the control of a valve 126A by the control unit 90.

[0076] With the valve 128A open, the treatment liquid stored in the generation tank 20A is adjusted in temperature to, for example, 60°C or less by the heater 142 and heat exchanger 142A in the circulation pipe 128, particles and the like are appropriately removed by the filter 144, and the liquid is sent to the electrolytic cell 21A by the pump 140. Since heat may be generated during the electrolytic process (electrolysis) in the electrolytic cell 21A, it is desirable to provide a heat exchanger 142A in order to adjust the temperature of the treatment liquid to 60°C or less. By adjusting the temperature of the treatment liquid to 60°C or less (electrolysis temperature), the production rate of electrolytic sulfuric acid when sulfuric acid is electrolyzed increases. In addition, by adjusting the temperature of the treatment liquid to 60°C or less, the electrolytic sulfuric acid is reduced in amount and the amount of Caro's acid (H 2 SO 5 ) and OH radicals.

[0077] Then, the temperature-adjusted sulfuric acid is electrolyzed in the electrolytic cell 21A, whereby a treatment solution containing electrolytic sulfuric acid and sulfuric acid is generated. Here, when sulfuric acid is electrolyzed, the water molecules in the treatment solution are also electrolyzed, so the concentration of the treatment solution increases as the electrolysis proceeds. The concentration of the treatment solution containing electrolytic sulfuric acid is measured by the concentration meter 138, and the control unit 90 controls the flow rate of the treatment solution sent to the electrolytic cell 21A based on the measured concentration (i.e., by controlling the opening and closing of the valve 128A, the flow rate of the treatment solution is increased when the measured concentration is low, and the flow rate of the treatment solution is decreased when the measured concentration is high). Note that lowering the concentration of electrolytic sulfuric acid increases the generation efficiency of persulfuric acid.

[0078] The above-mentioned production tank 20A is redundantly configured with the production tank 20B. Therefore, similarly to the production tank 20A, sulfuric acid (H 2 SO 4 ) is circulated to produce a treatment liquid containing electrolytic sulfuric acid.

[0079] To the production tank 20B, sulfuric acid is appropriately supplied from the sulfuric acid supply source 16 under the control of a valve 16B by the control unit 90. In addition, pure water (DIW) or the like is appropriately supplied from the pure water supply source 14 under the control of a valve 14B by the control unit 90. In addition, to the production tank 20B, post-processing liquid is supplied from the recovery tank 30 under the control of a valve 126B by the control unit 90, as described later.

[0080] With valve 130A open, the treatment liquid stored in generation tank 20B is adjusted in temperature to the electrolysis temperature (for example, 60°C or less) by heater 150 and heat exchanger 150A in circulation pipe 130, particles and the like are appropriately removed by filter 152, and the liquid is sent to electrolytic cell 21B by pump 148. Since heat may be generated during the electrolytic process (electrolysis) in electrolytic cell 21B, it is desirable to provide heat exchanger 150A in order to adjust the temperature of the treatment liquid to 60°C or less.

[0081] Then, the temperature-adjusted sulfuric acid is electrolyzed in the electrolytic cell 21B to generate electrolytic sulfuric acid and a treatment solution containing sulfuric acid. The concentration of the treatment solution containing electrolytic sulfuric acid is measured by the concentration meter 146, and the control unit 90 adjusts the flow rate of the treatment solution sent to the electrolytic cell 21B based on the measured concentration by controlling the opening and closing of the valve 130A.

[0082] The production tank 20A and the production tank 20B can switchably supply the treatment liquid to the supply tank 10. For example, as shown in FIG. 5, the valve 128A is opened to circulate the treatment liquid through the circulation pipe 128, while the valve 132A is opened to supply the treatment liquid from the production tank 20A to the supply tank 10, and during that time, the valves 130A and 134A can be closed to store the treated liquid from the recovery tank 30 in the production tank 20B. Alternatively, when the concentration of the electrolytic sulfuric acid stored in the production tank 20A has not reached the desired concentration, the valve 128A can be opened and the valve 132A closed to continue circulating the treatment liquid through the circulation pipe 128 to increase the concentration of the treatment liquid by electrolysis of sulfuric acid, while the valves 130A and 134A can be opened to supply the treatment liquid circulating through the circulation pipe 130 and having reached the desired concentration from the production tank 20B to the supply tank 10. That is, even if the treatment liquid is being generated in one production tank (electrolytic cell), the treatment liquid can be continuously supplied from the other production tank.

[0083] The processing liquid supplied from either (or both) of the generation tanks is adjusted in temperature to, for example, 60°C or less by a heater 156 in the supply pipe 100, particles and the like are appropriately removed by a filter 158, and the liquid is sent to the supply tank 10 by a pump 154 ​​via an open valve 100A.

[0084] The supply tank 10 stores the processing liquid supplied from the purification tank via a supply pipe 100. Furthermore, pure water (DIW) or the like is appropriately supplied to the supply tank 10 from a pure water supply source 12, and the concentration of the processing liquid is adjusted.

[0085] The processing liquid sent from the supply tank 10 through the circulation pipe 102 has its temperature adjusted by a heater 116 so that the temperature measured by a thermometer 117 in the circulation pipe 102 is, for example, 60° C. or less, particles and the like are appropriately removed by a filter 119, and the processing liquid is sent again by a pump 114 so as to return to the supply tank 10. The control unit 90 refers to the processing recipe to grasp the substrate processing performed in the processing unit 600, and adjusts the flow rate of the processing liquid circulating through the circulation pipe 102 by opening and closing a valve 102A or the like so that the flow rate of the processing liquid measured by a flowmeter 112 is sufficient for the substrate processing.

[0086] Measurement pipe 104 branching off from circulation pipe 102 is provided with a valve 104A that adjusts the flow rate under the control of control unit 90, and a concentration meter 120. Control unit 90 refers to the concentration of the treatment liquid measured by concentration meter 120 and performs control such as opening valve 12A to supply pure water or the like from pure water supply source 12 to supply tank 10, or electrolyzing the treatment liquid in electrolytic cell 118 to increase the concentration of the treatment liquid.

[0087] Downstream of the circulation pipe 102, supply pipes 106 branching off to each processing unit 600 are provided, and by opening corresponding valves 106A under the control of the control unit 90, the processing liquid can be supplied to the processing units 600 as appropriate.

[0088] In the circulation state of the discharge nozzle 106B (a state in which the valve body 37 in FIG. 4 is in contact with the valve seat surface 46), the valves 106A and 108A are opened, and the processing liquid supplied from the circulation pipe 102 to the supply pipe 106 and further to the return pipe 108 merges with the circulation pipe 110 and is returned to the supply tank 10. In this way, the processing liquid flows to the inside of the discharge nozzle 106B in the supply pipe 106 and circulates, so that when the processing liquid is discharged to perform substrate processing, a temperature change of the processing liquid caused by a temperature difference between the pipe and the processing liquid can be suppressed. Note that, in the circulation state, the flow rate of the processing liquid supplied via the return pipe 108 is desirably kept to a minimum required to maintain the temperature of the pipe.

[0089] In the discharge state of the discharge nozzle 106B (a state in which the valve body 37 in FIG. 4 is separated from the valve seat surface 46), the valve 106A is opened while the valve 108A is closed, and the processing liquid is discharged from the discharge port 31 of the discharge nozzle 106B toward the upper surface of the substrate W. Then, the substrate processing is performed.

[0090] Here, just before the treatment liquid is discharged from the discharge port 31, the treatment liquid in the flow path 35c is mixed with the imparted water from the mixing pipe 200, in which the valve 200A is in an open state. When the treatment liquid containing electrolytic sulfuric acid is mixed with the imparted water such as pure water, the temperature of the treatment liquid rises due to the heat of reaction, and reaches, for example, about 90°C.

[0091] By increasing the temperature of electrolytic sulfuric acid with the addition water, the oxidizing power of the electrolytic sulfuric acid is increased, and the processing liquid can be used for substrate processing (e.g., resist stripping processing) with high efficiency without increasing the temperature with a heater, etc. In addition, when ozone water is mixed with electrolytic sulfuric acid as the addition water, the oxidizing power of the ozone water itself is also added, and there is a possibility that the processing liquid will have a stronger oxidizing power.

[0092] In addition, since electrolytic sulfuric acid contains both persulfuric acid and Caro's acid, the treatment solution can exhibit a higher oxidizing power than when substrates are treated with Caro's acid alone at the same temperature.

[0093] The processing liquid discharged onto the substrate W and used for processing the substrate flows into the drain pipe 122 through the open valve 122A as a post-processing liquid. The post-processing liquid contains sulfate ions (SO 4 2- The post-processing liquid then joins the recovery pipe 124 and is recovered in the recovery tank 30.

[0094] The electrolytic sulfuric acid can be recovered and electrolyzed again to be reused in substrate processing, so that by performing substrate processing using a processing solution containing electrolytic sulfuric acid, it is possible to reduce the amount of wastewater resulting from substrate processing.

[0095] The post-processing liquid stored in the recovery tank 30 can be selectively pumped (i.e., to one or both) by pump 136 via the recovery piping 126 to the production tank 20A by opening valve 126A, or to the production tank 20B by opening valve 126B.

[0096] In addition, by selectively opening and closing valves 182A and 182B in recovery pipe 126, it is possible to switch between sending the processed liquid to the generation tank side and circulating the processed liquid via recovery tank 30.

[0097] FIG. 7 is a diagram showing an example in which the post-processing liquid is circulated in the recovery tank 30 in the discharge state of the discharge nozzle 106B.

[0098] In cases where the temperature of the post-processing liquid has not yet dropped sufficiently after the substrate processing, the valve 182B is opened to circulate the post-processing liquid as shown in Fig. 7, thereby providing an opportunity for further temperature adjustment of the post-processing liquid by the heater 180 and the heat exchanger 180A. This circulation also ensures time for decomposition of the resist, which will be described later.

[0099] Here, the post-processing liquid supplied from the recovery tank 30 to the generation tank 20A or the generation tank 20B contains residual resist and the like that has been peeled off from the substrate during the substrate processing.

[0100] On the other hand, the diamond electrode electrolysis cell is 2 The surface is oxidized by oxidation (organic → CO 2 +nH + It is known that during this process, oxygen atoms on the surface of the electrolytic cell are abstracted as well as carbon atoms that form the electrolytic cell.

[0101] In this case, the electrolytic cell is damaged by electrolysis of the post-processing solution containing residual resist, etc. The residual resist is decomposed by the oxidizing power of the post-processing solution, but if the decomposition is insufficient, the electrolytic cell is damaged (worn out).

[0102] In contrast to this, in the present embodiment, by providing the supply pipe 170, the treatment liquid stored in the production tank 20A or the production tank 20B can be sent to the recovery tank 30. For example, as shown in Fig. 7, by opening the valve 170A, the treatment liquid stored in the production tank 20A can be sent to the recovery tank 30 via the supply pipe 170. By sending the treatment liquid stored in the production tank 20A or the production tank 20B to the recovery tank 30, the treatment liquid generated at a sufficiently high concentration by electrolysis in the electrolytic cell can be mixed with the post-treatment liquid recovered in the recovery tank 30 via the drain pipe 122.

[0103] This increases the oxidizing power of the processed liquid stored in the recovery tank 30, accelerating the decomposition of resist and the like remaining in the liquid. As a result, the amount of resist and the like remaining in the processed liquid supplied to the generation tank via the recovery pipe 126 decreases, and the processed liquid can be supplied to the electrolytic cell, thereby reducing damage to the electrolytic cell during electrolysis.

[0104] The temperature of the processing liquid stored in the generation tank 20A or 20B is sufficiently adjusted by the heater 142, the heat exchanger 142A, the heater 150, and the heat exchanger 150A to, for example, 60° C. or less. Therefore, by mixing the processing liquid with the processed liquid stored in the recovery tank 30, the temperature of the processed liquid stored in the recovery tank 30 can be lowered. This can offset the heat generated during the decomposition of the resist, and can also reduce the range of temperature adjustment when the processing liquid is circulated through the circulation pipe 128 or the circulation pipe 130 to adjust the temperature.

[0105] Here, the amount of processing liquid supplied through the supply pipe 170 is controlled by the control unit 90 with reference to the measurement results of the level sensor 190 in the recovery tank 30 so that the mixed processed liquid has the desired concentration and temperature.

[0106] By controlling the valves 132A, 134A, 170A, and 170B, the supply pipe 170 and the supply pipe 100 can supply the processing liquid to either one or both of them.

[0107] <Effects of the above-described embodiment> Next, examples of effects produced by the above-described embodiments are shown. In the following description, the effects are described based on the specific configurations shown as examples in the above-described embodiments, but they may be replaced with other specific configurations shown as examples in the present specification as long as the same effects are produced. In other words, for convenience, only one of the corresponding specific configurations may be described as a representative below, but the representatively described specific configuration may be replaced with another corresponding specific configuration.

[0108] According to the embodiment described above, the substrate processing apparatus includes a substrate processing section, a supply tank 10, a generation section, a recovery section, a first supply path, and a second supply path. Here, the substrate processing section corresponds to, for example, a processing unit 600 including the discharge nozzle 106B. The generation section corresponds to, for example, the generation tank 20A, the generation tank 20B, the electrolytic cell 21A, the electrolytic cell 21B, and the like. The recovery section corresponds to, for example, a recovery tank 30 including the recovery pipe 124 and the recovery pipe 126, and the like. The first supply path corresponds to, for example, the supply pipe 100, and the like. The second supply path corresponds to, for example, the supply pipe 170, and the like. The processing unit 600 processes a substrate using a processing liquid. The supply tank 10 stores the processing liquid to be supplied to the processing unit 600. The generation section generates the processing liquid by electrolysis. The recovery tank 30 recovers the post-processing liquid, which is the processing liquid supplied to the processing unit 600. The recovery tank 30 then supplies the post-processing liquid to the generation section. The supply pipe 100 is a pipe that supplies the processing liquid generated in the generation section to the supply tank 10. The supply pipe 170 is a pipe that supplies the processing liquid generated in the generation section to the recovery tank 30. The supply pipe 170 is a pipe (path) different from the supply pipe 100. Here, the generation section supplies the processing liquid from at least one of the supply pipe 100 and the supply pipe 170. The recovery tank 30 also supplies the post-processing liquid obtained by mixing the processing liquids supplied via the supply pipe 170 to the generation section.

[0109] According to this configuration, by supplying the processing liquid from the generation tank, the oxidizing power of the processed liquid stored in the recovery tank 30 can be increased, and decomposition of resist and the like remaining in the liquid can be promoted. Therefore, by supplying the processed liquid to the electrolytic cell, damage to the electrolytic cell during electrolysis can be reduced.

[0110] Furthermore, the same effect can be achieved even if other configurations, examples of which are shown in this specification, are appropriately added to the above configuration, i.e., even if other configurations in this specification that were not mentioned as the above configuration are appropriately added.

[0111] According to the embodiment described above, the substrate processing apparatus includes a measuring unit that measures the amount of the post-processing liquid in the recovery tank 30 and outputs the measurement result. Here, the measuring unit corresponds to, for example, the level sensor 190. Then, the generating unit controls the flow rate of the processing liquid supplied to the recovery tank 30 based on the measurement result. According to such a configuration, the amount of the processing liquid supplied through the supply pipe 170 can be adjusted so that the post-processing liquid after mixing has a desired concentration and temperature. According to the embodiment described above, the substrate processing apparatus includes a measuring unit that measures the TOC concentration of the post-processing liquid in the recovery tank 30 and outputs the measurement result. Here, the measuring unit corresponds to, for example, the concentration meter 184. Then, the generating unit controls the flow rate of the processing liquid supplied to the recovery tank 30 based on the measurement result. According to such a configuration, the amount of the processing liquid supplied through the supply pipe 170 can be adjusted so that the post-processing liquid after mixing has a desired concentration and temperature.

[0112] According to the embodiment described above, the generation unit includes a first temperature adjustment unit for adjusting the post-treatment liquid and the generated treatment liquid to an electrolysis temperature, which is a temperature for generating a treatment liquid by electrolysis. Here, the first temperature adjustment unit corresponds to, for example, the heater 142, the heat exchanger 142A, the heater 150, the heat exchanger 150A, etc. According to such a configuration, the temperature can be maintained at a temperature at which the deactivation of the electrolytic sulfuric acid is suppressed. In addition, the heat that may be generated during electrolysis can be effectively offset.

[0113] Moreover, according to the embodiment described above, the recovery tank 30 includes a second temperature adjustment unit for adjusting the post-processing liquid to an electrolysis temperature, which is a temperature for generating the processing liquid by electrolysis. Here, the second temperature adjustment unit corresponds to, for example, the heater 180, the heat exchanger 180A, and the like. According to such a configuration, by adjusting the temperature with the heater 180 and the heat exchanger 180A, it is possible to lower the temperature of the post-processing liquid, which has become hot due to the substrate processing, and to suppress the deactivation of the electrolytic sulfuric acid. In addition, it is possible to reduce the range of temperature adjustment required in the generation tank.

[0114] According to the embodiment described above, in the substrate processing method, the supply tank 10 stores the processing liquid to be supplied to the processing unit 600. Then, in the processing unit 600, the substrate W is processed using the processing liquid. Then, the post-processing liquid, which is the processing liquid supplied to the processing unit 600, is collected in the recovery tank 30 and further supplied to the generation section. Then, in the generation section, the processing liquid is generated from a liquid containing the post-processing liquid by electrolysis. Here, the substrate processing apparatus that performs the substrate processing includes a supply pipe 100 for supplying the processing liquid generated in the generation section to the supply tank 10, and a supply pipe 170, which is a path different from the supply pipe 100, for supplying the processing liquid generated in the generation section to the recovery tank 30. Then, the step of supplying the post-processing liquid to the generation section is a step of supplying the post-processing liquid after mixing the processing liquid supplied via the supply pipe 170 to the generation section.

[0115] According to this configuration, by supplying the processing liquid from the generation tank, the oxidizing power of the processed liquid stored in the recovery tank 30 can be increased, and decomposition of resist and the like remaining in the liquid can be promoted. Therefore, by supplying the processed liquid to the electrolytic cell, damage to the electrolytic cell during electrolysis can be reduced.

[0116] Unless otherwise specified, the order in which the processes are performed may be changed.

[0117] Furthermore, even if other configurations, examples of which are shown in this specification, are appropriately added to the above configuration, i.e., even if other configurations in this specification that were not mentioned as the above configuration are appropriately added, the same effect can be produced.

[0118] <Modifications of the above-described embodiments> In the embodiment described above, the substrate is processed using electrolytic sulfuric acid, but the processing liquid may be, for example, a mixed solution of sulfuric acid and hydrogen peroxide (SPM).

[0119] Even in this case, the electrolytic sulfuric acid is generated in the generation tank and heated to high temperature sulfuric acid at the stage of supplying the electrolytic sulfuric acid to the supply tank 10, or at the stage of supplying the electrolytic sulfuric acid from the supply tank 10 to each processing unit 600, or at both stages. Furthermore, by mixing the electrolytic sulfuric acid with hydrogen peroxide water as the applied water from the mixing pipe 200, it is possible to obtain a processing liquid for substrate processing.

[0120] Even when SPM is used as the treatment liquid, the water molecules in the treatment liquid are electrolyzed when sulfuric acid is electrolyzed, increasing the concentration that was reduced by the addition of water, thereby generating electrolyzed sulfuric acid.

[0121] In addition, in the embodiments described above, the material, composition, dimensions, shape, relative positional relationship, or implementation conditions of each component may be described, but these are merely examples in all aspects and are not limiting.

[0122] Thus, numerous variations and equivalents not shown are contemplated within the scope of the technology disclosed herein, including, for example, modifying, adding, or omitting at least one component.

[0123] In addition, in at least one of the embodiments described above, when a material name or the like is stated without being specifically specified, it is understood that the material in question may include other additives, such as alloys, unless a contradiction arises. [Explanation of symbols]

[0124] 1. Substrate Processing Equipment 10 Supply Tank 21A Electrolysis Cell 21B Electrolytic Cell 118 Electrolysis Cell 170 Supply piping

Claims

1. a substrate processing section for processing a substrate using a processing liquid; a supply tank for storing the processing liquid to be supplied to the substrate processing unit; A generating unit for generating the treatment liquid by electrolysis; a recovery unit for recovering a post-processing liquid, which is the processing liquid supplied to the substrate processing unit, and supplying the post-processing liquid to the generation unit; a first supply path for supplying the treatment liquid generated in the generation unit to the supply tank; a second supply path, which is a path different from the first supply path, for supplying the treatment liquid generated in the generation part to the recovery part; The recovery unit supplies the post-processing liquid obtained by mixing the processing liquid supplied via the second supply path to the production unit. Substrate processing equipment.

2. The substrate processing apparatus according to claim 1 , a first measuring unit that measures the amount of the post-processing liquid in the recovery unit and outputs a measurement result, The generating unit controls a flow rate of the processing liquid supplied to the collecting unit based on the measurement result. Substrate processing equipment.

3. 3. The substrate processing apparatus according to claim 1, The generation unit includes a first temperature adjustment unit for adjusting the post-treatment liquid and the generated treatment liquid to an electrolysis temperature, which is a temperature for generating the treatment liquid by electrolysis. Substrate processing equipment.

4. 3. The substrate processing apparatus according to claim 1, The recovery unit includes a second temperature adjustment unit for adjusting the treated liquid to an electrolysis temperature, which is a temperature for generating the treated liquid by electrolysis. Substrate processing equipment.

5. 3. The substrate processing apparatus according to claim 1, a second measurement unit that measures a TOC concentration of the treated liquid in the recovery unit and outputs a measurement result; The generating unit controls a flow rate of the processing liquid supplied to the collecting unit based on the measurement result. Substrate processing equipment.

6. A substrate processing method for processing a substrate using a processing liquid, comprising: storing the processing liquid in a supply tank to be supplied to a substrate processing unit; processing the substrate using the processing liquid in the substrate processing section; recovering the post-processing liquid, which is the processing liquid supplied to the substrate processing unit, in a recovery unit and further supplying it to a generation unit; generating the treatment liquid from a liquid containing the post-treatment liquid by electrolysis in the generation unit, a first supply path for supplying the treatment liquid generated in the generation unit to the supply tank; a second supply path, which is a path different from the first supply path, for supplying the treatment liquid generated in the generation part to the recovery part; the step of supplying the post-processing liquid to the generation section is a step of supplying the post-processing liquid obtained by mixing the processing liquid supplied via the second supply path to the generation section; A method for processing a substrate.

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