Touch sensor

Abstract

To provide a touch sensor in which a trouble in a peripheral wire due to separation of a metal plating layer can be prevented.SOLUTION: A touch sensor includes a base material and a conductive layer formed on the base material. The conductive layer includes a touch detection electrode (11), a first electrode pad (12) formed in the touch detection electrode (11), a peripheral wire (13) extracted from the first electrode pad (12), and a second electrode pad (14) connected to the peripheral wire (13). The touch detection electrode (11), the first electrode pad (12), the peripheral wire (13), and the second electrode pad (14) include a plated layer (3) and a metal plating layer (4) covering the plated layer (3). The peripheral wire (13) includes two or more plated layers (13A, 13B) that are apart from each other in a width direction of the peripheral wire (13) in at least one position.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a touch sensor that detects a touch operation. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in various electronic devices including tablet computers, smartphones, and other portable information devices, touch sensors are used that detect a so-called touch operation in which a finger, a stylus pen, or the like is brought into contact with or close to a screen.

[0003] Such a touch sensor often has a mesh-shaped touch detection electrode formed of a plurality of thin metal wires, peripheral wiring drawn from the touch detection electrode, and an electrode pad connected to the peripheral wiring, as disclosed in Patent Document 1. In Patent Document 1, the touch detection electrode, the peripheral wiring, and the electrode pad are formed by a so-called plating method. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5876351 Summary of the Invention [Problem to be solved by the invention]

[0005] As disclosed in Patent Document 1, when the touch detection electrodes, peripheral wiring, and electrode pads are formed by plating, for example, a plated layer having a pattern corresponding to the touch detection electrodes, peripheral wiring, and electrode pads is formed on a base material, and then the base material is immersed in a plating solution to form a metal plating layer covering the plated layer. When the peripheral wiring is formed by plating in this manner, the adhesion between the plated layer and the metal plating layer is reduced due to the stress of the metal plating layer, and a failure in which the metal plating layer peels off may occur.

[0006] The present invention has been made to solve such problems, and has an object to provide a touch sensor that can prevent damage to the surrounding wiring caused by peeling of the metal plating layer. [Means for solving the problem]

[0007] The above object can be achieved by the following configuration. [1] A substrate; A conductive layer is formed on a substrate, The conductive layer is A plurality of mesh-shaped touch detection electrodes formed by a plurality of thin metal wires; a plurality of first electrode pads formed on at least one end of the plurality of touch detection electrodes; a plurality of peripheral wirings extending from the first electrode pads; a plurality of second electrode pads electrically connected to the plurality of peripheral wirings; The touch detection electrodes, the first electrode pads, the peripheral wirings, and the second electrode pads each have a plated layer and a metal plating layer covering the plated layer; Each of the plurality of peripheral wirings includes, at least in one location, two or more plated layers spaced apart from each other in the width direction of the peripheral wiring. Touch sensor. [2] The touch sensor according to [1], wherein each of the multiple peripheral wirings includes two or more plated layers connecting the first electrode pad and the second electrode pad. [3] The line width of the multiple peripheral wiring is W1, and the width of the plated layer in the multiple peripheral wiring is A. W1 / A>2 is satisfied A touch sensor according to [1] or [2]. [4] The line width W2 of the multiple metal thin lines of the multiple touch detection electrodes is 1.0 to 5.0 μm. The touch sensor according to any one of [1] to [3]. [5] The ratio SM / ST of the area SM occupied by the metal plating layer of each of the multiple peripheral wirings in a plan view to the area ST surrounded by the outlines of each of the multiple peripheral wirings in a plan view is SM / ST≧0.9 The touch sensor according to any one of [1] to [4]. Effect of the Invention

[0008] According to this invention, a touch sensor includes a substrate and a conductive layer formed on the substrate, the conductive layer having a plurality of mesh-shaped touch detection electrodes formed from a plurality of fine metal wires, a plurality of first electrode pads formed on at least one end of the plurality of touch detection electrodes, a plurality of peripheral wirings drawn out from the plurality of first electrode pads, and a plurality of second electrode pads electrically connected to the plurality of peripheral wirings, wherein the plurality of touch detection electrodes, the plurality of first electrode pads, the plurality of peripheral wirings, and the plurality of second electrode pads have a plated layer and a metal plating layer covering the plated layer, and each of the plurality of peripheral wirings includes, at least at one location, two or more plated layers spaced apart from each other in the width direction of the peripheral wiring, thereby preventing failure of the peripheral wiring due to peeling of the metal plating layer. [Brief description of the drawings]

[0009] [Figure 1] 1 is a partial cross-sectional view of a touch sensor according to an embodiment; [Diagram 2] FIG. 2 is a plan view of a touch sensor according to the embodiment. [Diagram 3] 4 is an enlarged plan view showing a part of a touch detection electrode according to the embodiment. FIG. [Figure 4] 3 is an enlarged cross-sectional view showing a portion of a first conductive layer in the embodiment. FIG. [Diagram 5] FIG. 2 is an enlarged plan view showing peripheral wiring according to the embodiment. [Figure 6] FIG. 1 is an enlarged plan view showing an example of conventional peripheral wiring. [Figure 7] 4 is a cross-sectional view of a plated layer of a peripheral wiring before a plating process. FIG. [Figure 8] 4 is a cross-sectional view of a layer to be plated and a metal plating layer of a peripheral wiring during a plating process. FIG. [Figure 9] 4 is a cross-sectional view of a peripheral wiring according to the embodiment; [Figure 10] 13 is an enlarged plan view showing peripheral wiring in a first modified example of the embodiment. FIG. [Figure 11] FIG. 11 is an enlarged plan view showing peripheral wiring in a second modified example of the embodiment. [Figure 12] FIG. 13 is an enlarged plan view showing peripheral wiring in a third modified example of the embodiment. [Figure 13] FIG. 13 is an enlarged plan view showing peripheral wiring in a fourth modified example of the embodiment. [Figure 14] FIG. 13 is an enlarged plan view showing peripheral wiring in a fifth modified example of the embodiment. [Figure 15] FIG. 13 is an enlarged plan view showing peripheral wiring in a sixth modified example of the embodiment. [Figure 16] FIG. 13 is an enlarged plan view showing peripheral wiring in a comparative example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a conductive member for a touch panel and a touch panel according to the present invention will be described in detail based on preferred embodiments shown in the accompanying drawings. In the following, the notation "~" indicating a numerical range includes the numerical values ​​written on both sides. For example, "s is a number between t1 and t2" means that the range of s includes the numerical values ​​t1 and t2, which is expressed in mathematical notation as t1≦s≦t2. Unless otherwise specified, angles including "perpendicular" and "parallel" include a generally acceptable error range in the technical field. "Transparent" means that the light transmittance is at least 40% or more in the visible light wavelength range of 400 nm to 800 nm, preferably 75% or more, more preferably 80% or more, and even more preferably 90% or more. The light transmittance is measured according to "Plastics--Determination of total light transmittance and total light reflectance" as specified in JIS K 7375:2008.

[0011] Embodiment FIG. 1 shows a configuration of a touch sensor according to an embodiment of the present invention. The touch sensor includes a substrate 1 having a first surface 1A and a second surface 1B that form a front and a back surface of the substrate, a first conductive layer 2A disposed on the first surface 1A of the substrate 1, and a second conductive layer 2B disposed on the second surface 1B of the substrate 1. The substrate 1 has insulating properties, and the first conductive layer 2A and the second conductive layer 2B are electrically insulated from each other. The substrate 1 has flexibility, and the touch sensor has flexibility equivalent to that of the substrate 1. The substrate 1 is made of a transparent material.

[0012] The touch sensor can be used as a touch panel display device (not shown) by adhering a cover member (not shown) to the surface on the first conductive layer 2A side and a display module (not shown) to the surface on the second conductive layer 2B side. At this time, a user's finger, stylus pen, or the like in contact with or close to the cover member is detected, and a touch operation by the user is detected.

[0013] FIG. 2 shows a plan view of the touch sensor. The first conductive layer 2A has a plurality of touch detection electrodes 11 for detecting a touch operation, which extend along a defined Y direction and are arranged along an X direction perpendicular to the Y direction, a plurality of first electrode pads 12 formed at one end of the plurality of touch detection electrodes 11, a plurality of peripheral wirings 13 drawn from the plurality of first electrode pads 12, and a plurality of second electrode pads 14 connected to the plurality of peripheral wirings 13. The plurality of second electrode pads 14 are used for electrical connection to an external device (not shown).

[0014] The second conductive layer 2B has a plurality of touch detection electrodes 21 for detecting a touch operation, which extend along the X direction and are arranged along the Y direction, a plurality of first electrode pads 22 formed on both ends of the plurality of touch detection electrodes 21, a plurality of peripheral wirings 23 drawn from the plurality of first electrode pads 22, and a plurality of second electrode pads 24 connected to the plurality of peripheral wirings 23. The plurality of second electrode pads 24 are used for electrically connecting to an external device (not shown). Note that the plurality of first electrode pads 22 are formed on both ends of the plurality of touch detection electrodes 21, but the plurality of first electrode pads 22 may be formed only on one end of the plurality of touch detection electrodes 21.

[0015] The region in which the multiple touch detection electrodes 11 of the first conductive layer 2A are arranged and the region in which the multiple touch detection electrodes 21 of the second conductive layer 2B are arranged overlap with each other across the substrate 1 in the Z direction perpendicular to both the X direction and the Y direction.

[0016] 3, the touch detection electrode 11 in the first conductive layer 2A is configured of a plurality of thin metal wires M forming a mesh shape. In order to suppress the occurrence of so-called moire when an observer visually recognizes the touch detection electrode 11 arranged on a display module (not shown), the average value of the line width W2 of the plurality of thin metal wires M is preferably within a range of 1.0 μm to 5.0 μm.

[0017] The first conductive layer 2A is formed by a so-called plating method. As shown in Fig. 4, the first conductive layer 2A has a plated layer 3 formed on the first surface 1A of the base material 1, and a metal plating layer 4 formed by plating the plated layer 3 and covering the plated layer 3. That is, the plurality of touch detection electrodes 11, the plurality of first electrode pads 12, the plurality of peripheral wirings 13, and the plurality of second electrode pads 14 each have the plated layer 3 and the metal plating layer 4.

[0018] When plating the layer 3 to be plated, the substrate 1 on which the layer 3 to be plated is formed is immersed in a plating solution containing the metal ions to be deposited and a reducing agent for reducing the metal ions to metal. In this case, the thickness of the metal plating layer 4 is adjusted by the composition of the plating solution, the plating temperature, the plating time, etc.

[0019] 5, the peripheral wiring 13 has two plated layers 13A and 13B that are spaced apart in the width direction of the peripheral wiring 13 and connect the first electrode pad 12 and the second electrode pad 14. The metal plating layer 4 of the peripheral wiring 13 is formed so as to cover both of the two plated layers 13A and 13B. The peripheral wiring 13 has a line width W1. Furthermore, the plated layers 13A and 13B each have a width A.

[0020] Here, the line width W1 of the peripheral wiring 13 refers to the dimension of the peripheral wiring 13 in a direction perpendicular to the direction in which the peripheral wiring 13 extends. Also, the width A of the plated layers 13A and 13B refers to the dimension of the plated layers 13A and 13B in a direction perpendicular to the direction in which the plated layers 13A and 13B extend. In the example of Fig. 5, the direction in which the peripheral wiring 13 extends and the direction in which the plated layers 13A and 13B extend coincide with each other. In FIG. 5, for the sake of simplicity, the plated layer 3 and the metal plating layer 4 of the touch detection electrode 11 are omitted.

[0021] Incidentally, when peripheral wiring 13 is usually formed by plating, one plated layer 3 corresponding to one peripheral wiring 13 is formed, and a metal plating layer 4 is formed to cover this plated layer 3, as shown in Fig. 6 for example. In this case, the adhesion between the plated layer 3 and the metal plating layer 4 is reduced due to the stress of the metal plating layer 4, and the peripheral wiring 13 may be rubbed by other touch sensors or the like during or after the manufacture of the peripheral wiring 13, resulting in a failure in which the metal plating layer 4 peels off.

[0022] In the touch sensor according to the embodiment of the present invention, peripheral wiring 13 includes two plated layers 13A and 13B, so that the contact area between plated layer 13A and metal plating layer 4 and the contact area between plated layer 13B and metal plating layer 4 are each sufficiently small. Therefore, the stress between plated layer 13A and metal plating layer 4 and the stress between plated layer 13B and metal plating layer 4 are sufficiently small, and good adhesion is obtained between plated layer 13A and metal plating layer 4 and between plated layer 13B and metal plating layer 4, and failure due to peeling of metal plating layer 4 can be prevented.

[0023] Here, it is preferable that the width W1 of peripheral wiring 13 and the width A of plated layers 13A and 13B in peripheral wiring 13 satisfy W1 / A>2. By satisfying this inequality, the stress of metal plating layer 4 covering plated layer 13A and the stress of metal plating layer 4 covering plated layer 13B can be sufficiently suppressed, and the adhesion between plated layers 13A and 13B and metal plating layer 4 can be improved.

[0024] Although not shown, the touch detection electrodes 21 in the second conductive layer 2B are also configured of a plurality of thin metal wires M forming a mesh shape, similar to the touch detection electrodes 11 in the first conductive layer 2A. The average value of the line widths W1 of the plurality of thin metal wires M in the second conductive layer 2B is also preferably within a range of 1.0 μm to 5.0 μm in order to suppress the occurrence of so-called moire when an observer visually recognizes the touch detection electrodes 21 arranged on a display module (not shown).

[0025] Similarly to the first conductive layer 2A, the second conductive layer 2B is also formed by a plating method and has a plated layer and a metal plating layer. The plated layer and the metal plating layer in the second conductive layer 2B have the same configurations as the plated layer 3 and the metal plating layer 4 in the first conductive layer 2A, and therefore detailed description thereof will be omitted.

[0026] As described above, according to the touch sensor of the embodiment of the present invention, each of the multiple peripheral wirings 13 includes two plated layers 13A and 13B spaced apart in the width direction of the peripheral wiring 13, thereby improving the adhesion between the plated layer 13A and the metal plating layer 4 and between the plated layer 13B and the metal plating layer 4, and preventing failure of the peripheral wiring 13 due to peeling off of the metal plating layer 4.

[0027] It has been described that each of the multiple peripheral wirings 13 includes two plated layers 13A and 13B spaced apart in the width direction of the peripheral wiring 13 throughout the entire wiring. However, if each of the multiple peripheral wirings 13 includes, at least in one location, two or more plated layers 3 spaced apart in the width direction of the peripheral wiring 13, failure of the peripheral wiring 13 in which the metal plating layer 4 peels off can be prevented.

[0028] However, from the viewpoint of preventing breakdowns in the peripheral wiring 13, it is preferable that each of the multiple peripheral wirings 13 includes two or more layers to be plated 3 in the width direction of the peripheral wiring 13 in its entirety.

[0029] 10 and 11 show an example in which the peripheral wiring 13 includes three or more plated layers 3 in its width direction. In the example of FIG. 10, the peripheral wiring 13 includes three plated layers 13A, 13B, and 13C in its width direction. The plated layers 13A, 13B, and 13C respectively connect the first electrode pad 12 and the second electrode pad 14. The metal plating layer 4 is formed so as to cover the three plated layers 13A, 13B, and 13C and to fill the spaces between the plated layers 13A, 13B, and 13C.

[0030] 11, the peripheral wiring 13 includes four plated layers 13A, 13B, 13C, and 13D in the width direction. The plated layers 13A, 13B, 13C, and 13D respectively connect the first electrode pad 12 and the second electrode pad 14. The metal plating layer 4 is formed so as to cover the four plated layers 13A, 13B, 13C, and 13D and to fill in the spaces between the plated layers 13A, 13B, 13C, and 13D.

[0031] In this way, the peripheral wiring 13 includes multiple plated layers 3 in its width direction, and the narrower the width A of the plated layers 3, the smaller the contact area between each plated layer 3 and the metal plating layer 4, thereby reducing the stress in the metal plating layer 4, and thereby improving the adhesion between each plated layer 3 and the metal plating layer 4.

[0032] Although the example has been described in which the multiple plated layers 3 in the peripheral wiring 13 each have the same width A, the widths A of the multiple plated layers 3 may be different from each other. In this case, it is preferable that the maximum width A among the widths A of the multiple plated layers 3 in the peripheral wiring 13 satisfies the relationship W1 / A>2 with respect to the line width W1 of the peripheral wiring 13.

[0033] 12, the peripheral wiring 13 may also include an island-shaped plated layer 13E isolated from the surrounding plated layers 13A and 13B. In this example, the metal plating layer 4 is formed to cover the plated layers 13A, 13B and the island-shaped multiple plated layers 13E and to fill in the spaces between the plated layers 13A, 13B and the island-shaped multiple plated layers 13E. By sufficiently reducing the area of ​​the island-shaped plated layer 13E in a plan view, i.e., when viewed from the Z direction, the stress of the portion of the metal plating layer 4 that contacts the plated layer 13E can be sufficiently reduced, and the adhesion between the plated layer 13E and the metal plating layer 4 can be improved.

[0034] 13, the peripheral wiring 13 may also include a plurality of linear plated layers 13F forming a mesh shape. In this example, the metal plating layer 4 is formed so as to cover the plurality of plated layers 13F and fill the gaps between the plurality of plated layers 13F. In this case, the width A of the plurality of plated layers 13F forming the mesh shape can be made sufficiently narrower than the line width W1 of the peripheral wiring 13, so that the stress of the metal plating layer 4 in contact with the plated layer 13F can be sufficiently reduced, and the adhesion between the plated layer 13F and the metal plating layer 4 can be improved.

[0035] In addition, as shown in FIG. 14, the peripheral wiring 13 may include two plated layers 13A and 13B extending along the direction in which the peripheral wiring 13 extends, and a plurality of plated layers 13G extending along the width direction of the peripheral wiring 13 and connecting the plated layers 13A and 13B. The plated layers 13A, 13B and the plurality of plated layers 13G form a so-called ladder-like shape. In this example, the metal plating layer 4 is formed so as to cover the plated layers 13A, 13B and the plurality of plated layers 13G and to fill the gaps between the plated layers 13A, 13B and the plurality of plated layers 13G. In this case, by sufficiently reducing the width A of the plurality of plated layers 13G, the stress of the metal plating layer 4 in contact with each of the plurality of plated layers 13G can be sufficiently reduced, thereby improving the adhesion between each of the plurality of plated layers 13G and the metal plating layer 4.

[0036] In the example of Figure 14, the peripheral wiring 13 includes two plated layers 13A and 13B extending along the direction in which the peripheral wiring 13 extends, but it may also include three or more plated layers 3 extending along the direction in which the peripheral wiring 13 extends.

[0037] Moreover, by making the intervals between the multiple plated layers 13G sufficiently wide so that the metal plating layers 4 deposited on the multiple plated layers 13G are not bonded to each other, it is possible to form multiple openings Q located between the multiple plated layers 13G in the metal plating layer 4, as shown in Fig. 15. Even in this case, similarly to the example shown in Fig. 14, by making the width A of the multiple plated layers 13G sufficiently small, the stress of the metal plating layer 4 in contact with each of the multiple plated layers 13G can be sufficiently reduced, thereby improving the adhesion between each of the multiple plated layers 13G and the metal plating layer 4.

[0038] In order to ensure sufficient conductivity of the peripheral wiring 13 and sufficient adhesion of the metal plating layer 4 to the plated layers 13A, 13B, and 13G, it is preferable that the ratio SM / ST of the area SM occupied by the metal plating layer 4 of the peripheral wiring 13 in a plan view to the area ST of the portion surrounded by the contour C of the peripheral wiring 13 in a plan view satisfies SM / ST≧0.9. Here, the area SM occupied by the metal plating layer 4 of the peripheral wiring 13 in a plan view is the same as the area ST of the portion surrounded by the contour C in a plan view minus the area of ​​the multiple openings Q.

[0039] A method for manufacturing the touch sensor according to the embodiment will be described below.

[0040] First, a transparent base material 1 is prepared, and a plated layer 3 corresponding to the plurality of touch detection electrodes 11, the plurality of first electrode pads 12, the plurality of peripheral wirings 13, and the plurality of second electrode pads 14 is formed on a first surface 1A of the base material 1 using, for example, a photolithography method. The plated layer 3 corresponding to each of the plurality of peripheral wirings 13 includes two plated layers 13A and 13B adjacent to each other in the width direction of the peripheral wiring 13, as shown in, for example, FIGS. 5 and 7.

[0041] Furthermore, on the second surface 1B of the base material 1, the plated layers 3 corresponding to the plurality of touch detection electrodes 21, the plurality of first electrode pads 22, the plurality of peripheral wirings 23, and the plurality of second electrode pads 24 are formed by a method similar to the method for creating the plated layers 3 formed on the first surface 1A of the base material 1. The plated layers 3 corresponding to the respective peripheral wirings 23 include, for example, two plated layers 3 adjacent to each other in the width direction of the peripheral wirings 23.

[0042] Next, the base material 1, on which the plated layers 3 are formed on the first surface 1A and the second surface 1B, is immersed in a plating solution and a plating process is performed on the plated layers 3. As a result, metal is precipitated on the plated layers 3, forming metal plating layers 4. At this time, as shown in FIG. 8, for example, metal is precipitated on each of the two plated layers 13A and 13B in the peripheral wiring 13, forming metal plating layers 4. The metal plating layers 4 precipitated on the plated layers 13A and 13B gradually increase in thickness in the plating process, thereby reducing the distance between them. Until the plating process further progresses and the metal plating layers 4 precipitated on the plated layers 13A and 13B come into contact with each other, the plated layers 13A and 13B can be plated independently of each other. Finally, as shown in FIG. 9, the plated layers 13A and 13B are bonded to each other so as to cover both of them, completing a touch sensor as shown in FIG. 2.

[0043] Each component constituting the touch sensor of the embodiment will be described below. <Base material 1> The type of substrate 1 is not particularly limited as long as it is a member capable of supporting first conductive layer 2A and second conductive layer 2B. Examples of the substrate 1 include plastic substrates, glass substrates, and metal substrates, with plastic substrates being preferred. A flexible substrate is preferable for the substrate 1 because of its excellent foldability. Examples of the flexible substrate include the above-mentioned plastic substrates. The thickness of the substrate 1 is not particularly limited, and is often 25 μm to 500 μm.

[0044] Materials constituting the substrate 1 are preferably resins having a melting point of about 290°C or less, such as polyethylene terephthalate (PET) (258°C), polycycloolefin (134°C), polycarbonate (250°C), acrylic film (128°C), polyethylene naphthalate (269°C), polyethylene (135°C), polypropylene (163°C), polystyrene (230°C), polyvinyl chloride (180°C), polyvinylidene chloride (212°C), and triacetyl cellulose (290°C), and more preferably PET, polycycloolefin, or polycarbonate. Among them, PET is particularly preferable because of its excellent adhesion to the first conductive layer 2A and the second conductive layer 2B. The values ​​in parentheses above are melting points or glass transition temperatures. The total light transmittance of the substrate 1 is preferably 85% to 100%. The total light transmittance is measured according to "Plastics - Determination of total light transmittance and total light reflectance" defined in JIS (Japanese Industrial Standards) K 7375:2008.

[0045] One of the preferred embodiments of the substrate 1 is a treated substrate that has been subjected to at least one treatment selected from the group consisting of atmospheric plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By performing the above-mentioned treatment, hydrophilic groups such as OH groups are introduced into the surface of the treated substrate 1, improving the adhesion between the substrate 1 and the first conductive layer 2A and between the substrate 1 and the second conductive layer 2B. Among the above-mentioned treatments, atmospheric plasma treatment is preferred in that it further improves the adhesion between the substrate 1 and the first conductive layer 2A and between the substrate 1 and the second conductive layer 2B.

[0046] <Undercoat layer> In order to improve the adhesion between the substrate 1 and the first conductive layer 2A and between the substrate 1 and the second conductive layer 2B, an undercoat layer can be disposed between the substrate 1 and the first conductive layer 2A and between the substrate 1 and the second conductive layer 2B. This undercoat layer contains a polymer, and further improves the adhesion between the substrate 1 and the first conductive layer 2A and between the substrate 1 and the second conductive layer 2B.

[0047] The method for forming the undercoat layer is not particularly limited, but for example, a method of applying a composition for forming the undercoat layer containing a polymer onto a substrate and subjecting it to a heat treatment as necessary can be mentioned. In addition, gelatin, acrylic resin, urethane resin, acrylic-styrene-based latex containing inorganic or polymeric fine particles, etc. may be used as the composition for forming the undercoat layer containing a polymer.

[0048] If necessary, the touch sensor may have a refractive index adjustment layer between the substrate 1 and the first conductive layer 2A and between the substrate 1 and the second conductive layer 2B, in addition to the undercoat layer described above. As the refractive index adjustment layer, for example, an organic layer to which particles of a metal oxide such as zirconium oxide that adjusts the refractive index are added can be used.

[0049] <First conductive layer and second conductive layer> The first conductive layer 2A and the second conductive layer 2B can be formed from a metal or alloy, for example, silver, copper, gold, aluminum, nickel, chromium, molybdenum, or tungsten. The first conductive layer 2A and the second conductive layer 2B preferably contain copper, but may contain a metal other than copper, for example, gold, silver, etc. Also, they may have a laminated structure of a metal and a metal compound, and thin metal wires with a laminated structure such as copper / copper oxide or copper / copper sulfide can be used.

[0050] Next, a method for forming the first conductive layer 2A and the second conductive layer 2B will be described. A plating method can be appropriately used as the method for forming these layers. A method for forming the first conductive layer 2A and the second conductive layer 2B by plating will be described below. Examples include a method of plating a plated layer 3 obtained by patterning a photosensitive polymer containing plating catalyst metal particles by photolithography, and a method of patterning a photosensitive polymer having functional groups such as carboxyl groups by photolithography, and then treating the layer 3 with a solution containing catalyst metal ions to carry the catalyst metal on the functional groups. EXAMPLES

[0051] Example 1 The present invention will be described in more detail below with reference to examples. The materials, amounts, ratios, processing contents and processing procedures shown in the following examples can be appropriately changed without departing from the gist of the present invention, and the scope of the present invention should not be interpreted as being limited by the following examples.

[0052] (Preparation of composition for forming plated layer) The following components were mixed to obtain a composition for forming a plateable layer. Isopropanol 38 parts by weight Polybutadiene maleic acid (butadiene-maleic acid alternating copolymer, butadiene-derived repeating unit: maleic acid-derived repeating unit = 1:1 (molar ratio), manufactured by Polysciences Co., Ltd.) 4 parts by mass FAM-201 (bifunctional acrylamide, manufactured by Fujifilm Corporation) 1 part by mass IRGACURE-OXE02 (oxime ester polymerization initiator, manufactured by BASF) 0.05 parts by mass

[0053] (Preparation of substrate with plating layer precursor layer) A polyester film with adhesive layers on both sides and a thickness of 50 μm (Cosmoshine (registered trademark) A4360, manufactured by Toyobo Co., Ltd.) was prepared as the substrate. The above-mentioned composition for forming a plateable layer was bar-coated on one side of the substrate to a thickness of about 0.3 μm. After coating, the substrate was dried at a temperature of 120° C. for 1 minute to obtain a substrate with a plateable layer precursor layer. Then, a polypropylene protective film with a thickness of 12 μm was immediately attached to the surface of the plateable layer precursor layer.

[0054] (Preparation of substrate with plating layer) An exposure mask having exposure patterns corresponding to a plurality of touch detection electrodes 11, a plurality of first electrode pads 12, a plurality of peripheral wirings 13, and a plurality of second electrode pads 14 as shown in Fig. 2 was placed on the substrate with the plating layer precursor to which the protective film was attached. Here, each exposure pattern corresponding to the plurality of peripheral wirings 13 is composed of two linear patterns parallel to each other, connecting an exposure pattern corresponding to one first electrode pad 12 and an exposure pattern corresponding to one second electrode pad 14, as shown in Fig. 5.

[0055] In the exposure pattern corresponding to the touch detection electrodes 11, the line width of the pattern corresponding to the multiple thin metal wires M was set to 1.3 μm. The exposure pattern corresponding to the touch detection electrodes 11 had a square mesh-shaped opening pattern (pitch 300.0 μm). The exposure pattern corresponding to the touch detection electrodes 11 had a rectangular shape with a width of 2.0 mm and a length of 100.0 mm. The exposure pattern corresponding to the first electrode pad 12 had a rectangular shape with a width of 5.0 μm and a length of 2.0 mm. The line width of the two exposure patterns corresponding to the peripheral wiring 13 was set to 7.0 μm and the length was set to 50.0 mm. The exposure pattern corresponding to the second electrode pad 14 had a width of 50.0 μm and a length of 500.0 μm. In addition, exposure patterns corresponding to the conductive pattern portion E1 constituted by the touch detection electrodes 11, the first electrode pads 12, the peripheral wiring 13 and the second electrode pads 14 were arranged such that 50 exposure patterns corresponding to the touch detection electrodes 11 were arranged at intervals of 50.0 μm.

[0056] Next, the substrate with the plating layer precursor layer was exposed to 30 mJ / cm 2 of high-pressure mercury lamp through an exposure mask. 2The substrate was irradiated with UV light at 1000 nm. After irradiation with UV light, the protective film was peeled off from the substrate with the plated layer precursor layer. The substrate with the plated layer precursor layer from which the protective film had been peeled off was shower washed with a 1 mass % aqueous sodium carbonate solution and subjected to an alkali developing treatment to obtain a substrate with a mesh-shaped plated layer. As shown in FIG. 5, the formed plated layer had a portion corresponding to the touch detection electrode 11, a portion corresponding to the first electrode pad 12, two plated layers 13A and 13B corresponding to the peripheral wiring 13, and a portion corresponding to the second electrode pad 14.

[0057] Here, the width A of the plated layers 13A and 13B corresponding to the peripheral wiring 13 was 7.0 μm. Here, 10 arbitrary points were selected in each of the plated layers 13A and 13B corresponding to the multiple peripheral wirings 13, and the widths of the plated layers 13A and 13B shown in the images taken using a scanning electron microscope were measured at each selected point to obtain the widths of the 10 points of the plated layers 13A and 13B. Furthermore, the average value of the widths of the 10 points was calculated for each of the plated layers 13A and 13B. The larger of the average line width of the plated layer 13A and the average width of the plated layer 13B was selected as the width of the plated layers 13A and 13B.

[0058] <Preparation of substrate with copper plating layer (touch sensor)> The Pd catalyst solution Omni-Shield 1573 Activator (Rohm and Haas Electronic Materials Co., Ltd.) was diluted with pure water to 3.6% by volume, and the pH (hydrogen ion exponent) was adjusted to 4 with 0.1 N hydrochloric acid. The substrate with the plated layer was immersed in this solution at a temperature of 45°C for 5 minutes. It was then washed twice with pure water.

[0059] Next, the substrate with the plated layer was immersed in a 0.8% by volume aqueous solution of the reducing agent CIRCUPOSIT PB Oxide Converter 60C (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at a temperature of 30°C for 5 minutes. After that, it was washed twice with pure water and subjected to Pd catalyst treatment. Next, the substrate with the plated layer subjected to the Pd catalyst treatment was immersed in an electroless plating solution containing 12% by volume of M agent, 6% by volume of A agent, and 10% by volume of B agent of CIRCUPOSIT 4500 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at a temperature of 45°C for 35 minutes. After that, by washing with pure water, a copper plating layer covering the plated layer was formed as a metal plating layer, and a substrate with a copper plating layer (touch sensor) was obtained. The touch sensor obtained in this way had a first conductive layer 2A including a plurality of touch detection electrodes 11, a plurality of first electrode pads 12, a plurality of peripheral wirings 13, and a plurality of second electrode pads 14, as shown in FIG. 2, for example.

[0060] The line width W2 of the metal thin wire M of the touch detection electrode 11 in the obtained touch sensor was 2.0 μm. Here, when calculating the line width W2 of the metal thin wire M, first, 10 arbitrary points on the touch detection electrode 11 were selected, and the line width W1 of the metal thin wire M shown in an image taken with a scanning electron microscope was measured at each selected point, thereby obtaining the line width W2 of the metal thin wire M at 10 points on the metal thin wire M. Furthermore, the average value of the line widths W2 of the 10 points on the metal thin wire M was calculated, and this was adopted as the line width W2 of the metal thin wire M. Here, the maximum value of the line width W2 in the cross section of the metal thin wire M at each point was used for calculation.

[0061] The ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layers 13A and 13B of the peripheral wiring 13 was 2.6.

[0062] Example 2 The touch sensor of Example 2 was manufactured in the same manner as Example 1, except that in the process of manufacturing the base material with the plated layer, an exposure mask having three parallel linear patterns as shown in Fig. 10 was used as an exposure pattern corresponding to the multiple peripheral wirings 13. The width A of the plated layers 13A, 13B, and 13C of the peripheral wiring 13 was 4.0 μm, the line width W1 of the peripheral wiring 13 was 18.0 μm, and the line width W2 of the thin metal wire M of the touch detection electrode 11 was 2.0 μm. Therefore, the ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layers 13A, 13B, and 13C of the peripheral wiring 13 was 4.5.

[0063] Example 3 The touch sensor of Example 3 was manufactured in the same manner as in Example 2, except that the central linear pattern among the three linear patterns in the exposure mask used in Example 2 was made thinner than the linear patterns at both ends to reduce the distance between the linear patterns at both ends. The width A of the plated layers 13A, 13B, and 13C of the peripheral wiring 13 was 4.0 μm, the line width W1 of the peripheral wiring 13 was 17.0 μm, and the line width W2 of the thin metal wire M of the touch detection electrode 11 was 2.0 μm. Therefore, the ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layers 13A, 13B, and 13C of the peripheral wiring 13 was 4.3.

[0064] Example 4 In the process of producing a substrate with a plated layer, an exposure mask having a ladder-shaped pattern as shown in FIG. 15 was used as an exposure pattern corresponding to the multiple peripheral wirings 13. The metal plating layer 4 in the peripheral wiring 13 of the produced touch sensor had multiple openings Q. The width A of the plated layers 13A, 13B, and 13G of the peripheral wiring 13 was 4.0 μm, the line width W1 of the peripheral wiring 13 was 18.0 μm, and the line width W2 of the metal thin wire M of the touch detection electrode 11 was 2.0 μm. Therefore, the ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layers 13A, 13B, and 13G of the peripheral wiring 13 was 4.5.

[0065] In addition, the ratio SM / ST of the area SM of the metal plating layer 4 of the peripheral wiring 13 in a planar view to the area ST of the portion surrounded by the contour C of the peripheral wiring 13 in a planar view was 0.8. Here, 10 peripheral wirings 13 were arbitrarily selected, and images of each of these 10 peripheral wirings 13 were taken using a scanning electron microscope from a viewpoint seen from the Z direction. Furthermore, in each of the images of the 10 peripheral wirings 13, the area ST of the portion surrounded by the contour C of the peripheral wiring 13 and the area SM of the metal plating layer 4 of the peripheral wiring 13 were calculated, and the ratio SM / ST was calculated. Finally, the 10 values ​​of the ratio SM / ST were averaged to obtain the final value of the ratio SM / ST.

[0066] Example 5 The touch sensor of Example 5 was manufactured in the same manner as in Example 1, except that in the process of manufacturing the base material with the plated layer, an exposure mask having four parallel linear patterns as shown in FIG. 11 was used as an exposure pattern corresponding to the multiple peripheral wirings 13. The width A of the plated layers 13A, 13B, 13C, and 13D of the peripheral wiring 13 was 2.0 μm, the line width W1 of the peripheral wiring 13 was 17.0 μm, and the line width W2 of the thin metal wire M of the touch detection electrode 11 was 2.0 μm. Therefore, the ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layers 13A, 13B, 13C, and 13D of the peripheral wiring 13 was 8.5.

[0067] Comparative Example 1 A touch sensor of Comparative Example 1 was manufactured in the same manner as in Example 1, except that in the process of manufacturing a base material with a plated layer, an exposure mask having one linear pattern as shown in Fig. 6 was used as an exposure pattern corresponding to a plurality of peripheral wirings 13. The width A of the plated layer 3 of the peripheral wiring 13 was 16.0 μm, the line width W1 of the peripheral wiring 13 was 18.0 μm, and the line width W2 of the thin metal wire M of the touch detection electrode 11 was 2.0 μm. Therefore, the ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layer 3 of the peripheral wiring 13 was 1.1.

[0068] Comparative Example 2 A touch sensor of Comparative Example 2 was manufactured in the same manner as Comparative Example 1, except that the width A of one linear pattern in the exposure mask used in Comparative Example 1 was narrowed as shown in Fig. 16. The width A of the plated layer 3 of the peripheral wiring 13 was 2.0 µm, the line width W1 of the peripheral wiring 13 was 4.0 µm, and the line width W2 of the thin metal wire M of the touch detection electrode 11 was 2.0 µm. Therefore, the ratio W1 / A of the line width W1 of the peripheral wiring 13 to the width A of the plated layer 3 of the peripheral wiring 13 was 2.0.

[0069] The thus-manufactured touch sensors of Examples 1 to 5 and Comparative Examples 1 and 2 were subjected to the following evaluations of electrical conductivity, adhesion, and scratch resistance. (Conductivity evaluation) The linear resistance value of the peripheral wiring 13 randomly selected from the multiple peripheral wirings 13 was measured. At this time, four microprobes (tungsten probes manufactured by Micro Support Co., Ltd., diameter 0.5 μm) were brought into contact with four different points along the extension direction of the selected peripheral wiring 13. Next, a constant current was applied to the two microprobes located at both ends of the outside so that the voltage between the two microprobes located inside was 5 mV using a source meter (KEITHLEY 2400 general-purpose source meter), and the resistance value between the two microprobes located inside was measured. Furthermore, the linear resistance value of the peripheral wiring 13 was calculated by dividing the measured resistance value by the distance between the two microprobes located inside. The calculated line resistance value of the peripheral wiring 13 was evaluated based on the following evaluation criteria: A indicates excellent conductivity, B indicates that the conductivity is practically acceptable, and C indicates that the conductivity is problematic. A: The linear resistance is less than 80 Ω / mm. B: The wire resistance is 80 Ω / mm or more and less than 100 Ω / mm. C: The wire resistance is 100 Ω / mm or more.

[0070] (Adhesion evaluation) The line resistance value of the peripheral wiring 13 was measured using the same method as that used to measure the line resistance value of the peripheral wiring 13 in the conductivity evaluation. Next, adhesive tape "610" manufactured by 3M was attached to the entirety of the multiple peripheral wirings 13, and then the adhesive tape was peeled off from the multiple peripheral wirings 13. Next, the line resistance value of the peripheral wiring 13 after peeling off the adhesive tape was measured using the same method as that used to measure the line resistance value of the peripheral wiring 13 before the adhesive tape was attached to the multiple peripheral wirings 13.

[0071] Finally, the resistance increase rate of the peripheral wiring 13 was calculated by calculating (line resistance value of the peripheral wiring 13 after peeling off the adhesive tape) / (line resistance value of the peripheral wiring 13 before applying the adhesive tape)×100%. The calculated resistance increase rate was evaluated based on the following evaluation criteria. Evaluation A indicates that the adhesion of the metal plating layer 4 of the peripheral wiring 13 to the plated layer 3 is excellent, evaluation B indicates that there is no practical problem with the adhesion of the metal plating layer 4 of the peripheral wiring 13 to the plated layer 3, and evaluation C indicates that the adhesion of the metal plating layer 4 of the peripheral wiring 13 to the plated layer 3 is poor and there is a practical problem. A: Resistance increase rate is less than 5%. B: Resistance increase rate is 5% or more but less than 10%. C: Resistance increase rate is 10% or more.

[0072] (Scratch resistance evaluation) The line resistance value of the peripheral wiring 13 was measured using the same method as that used to measure the line resistance value of the peripheral wiring 13 in the conductivity evaluation. Next, the touch sensor was placed on a flat table, and dust-free paper (RN72 light blue, manufactured by Oji F-Tex Co., Ltd.) was placed on the multiple peripheral wirings 13. Next, a weight was placed on the dust-free paper, so that a weight of 100 g / cm was applied to the multiple peripheral wirings 13 via the dust-free paper. 2 Next, the dust-free paper and the weight were moved back and forth five times over a predetermined distance along the horizontal direction at a speed of 5 cm / sec so as to pass over the peripheral wirings 13, thereby scrubbing the surfaces of the peripheral wirings 13.

[0073] Next, the line resistance value of the peripheral wiring 13 rubbed by the loaded dust-free paper was measured using a method similar to the method for measuring the line resistance value of the peripheral wiring 13 before rubbing the multiple peripheral wirings 13. Finally, the resistance increase rate of the peripheral wiring 13 was calculated by calculating (line resistance value of the peripheral wiring 13 after the rubbing test) / (line resistance value of the peripheral wiring 13 before the rubbing test)×100%. The calculated resistance increase rate was evaluated based on the following evaluation criteria. Evaluation A indicates that the adhesion of the metal plating layer 4 in the peripheral wiring 13 to the plated layer 3 is excellent, evaluation B indicates that there is no practical problem in the adhesion of the metal plating layer 4 in the peripheral wiring 13 to the plated layer 3, and evaluation C indicates that the adhesion of the metal plating layer 4 in the peripheral wiring 13 to the plated layer 3 is poor and there is a practical problem. A: Resistance increase rate is less than 5%. B: Resistance increase rate is 5% or more but less than 10%. C: Resistance increase rate is 10% or more.

[0074] Table 1 shows the evaluation results for Examples 1 to 5 and Comparative Examples 1 and 2. [Table 1]

[0075] As shown in Table 1, the touch sensors of Examples 1 to 5 were evaluated as A or B in terms of conductivity, adhesion, and abrasion resistance, and it is understood that the peripheral wiring 13 has good conductivity while the metal plating layer 4 of the peripheral wiring 13 has excellent adhesion to the plated layer 3, making the peripheral wiring 13 less likely to break down. The touch sensors of Examples 1 to 5 have two or more plated layers 3 adjacent to one peripheral wiring 13 in the width direction of the peripheral wiring 13, and therefore the stress of the metal plating layer 4 is distributed to each plated layer 3, and therefore the metal plating layer 4 is thought to have excellent adhesion to the plated layer 3.

[0076] On the other hand, the touch sensor of Comparative Example 1 received an electrical conductivity rating of A, but received adhesion ratings and abrasion resistance ratings of C. The touch sensor of Comparative Example 1 has only one plateable layer 3 for one peripheral wiring 13, so the contact area between the plateable layer 3 and the metal plating layer 4 in the peripheral wiring 13 is large, and the stress of the metal plating layer 4 is also large. Therefore, it is considered that the adhesion of the metal plating layer 4 to the plateable layer 3 in Comparative Example 1 was poor enough to cause practical problems.

[0077] The touch sensor of Comparative Example 2 was rated A for adhesion, but C for conductivity and abrasion resistance. In the touch sensor of Comparative Example 2, the line width W1 of the peripheral wiring 13 is 4.0 μm, which is very thin, and is therefore considered to have low conductivity. In the touch sensor of Comparative Example 2, the line width W1 of the peripheral wiring 13 is very thin, and therefore, although the adhesion of the metal plating layer 4 to the plated layer 3 is excellent, it is considered that the metal plating layer 4 cannot withstand friction.

[0078] Here, comparing the results of the conductivity evaluation and the abrasion resistance evaluation of Examples 1 to 5, Examples 1 to 3 and 5 were all rated A, but Example 4 was all rated B. This is thought to be because the peripheral wiring 13 in Example 4 has a plurality of openings Q. However, in Example 4, the ratio SM / ST of the area ST of the portion surrounded by the outline C of the peripheral wiring 13 to the area SM of the metal plating layer 4 of the peripheral wiring 13 is 0.8, and the proportion of the area occupied by the metal plating layer 4 compared to the openings Q is sufficiently large, so sufficient conductivity and abrasion resistance are obtained.

[0079] The present invention is basically configured as described above. Although the touch sensor of the present invention has been described in detail above, the present invention is not limited to the above-mentioned embodiment, and various improvements or modifications may be made without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0080] 1 substrate, 1A first surface, 1B second surface, 2A first conductive layer, 2B second conductive layer, 3, 13A, 13B, 13C, 13D, 13E, 13F, 13G plated layer, 4 metal plating layer, 11, 21 touch detection electrode, 12, 22 first electrode pad, 13, 23 peripheral wiring, 14, 24 second electrode pad, A width, C contour, M thin metal wire, Q opening, W1, W2 line width.

Claims

1. A substrate; A conductive layer is formed on the substrate, The conductive layer is A plurality of mesh-shaped touch detection electrodes formed by a plurality of thin metal wires; A plurality of first electrode pads are formed on at least one end of the plurality of touch detection electrodes; A plurality of peripheral wirings extending from the first electrode pads; a plurality of second electrode pads electrically connected to the plurality of peripheral wirings; the touch detection electrodes, the first electrode pads, the peripheral wirings, and the second electrode pads each have a plated layer and a metal plating layer covering the plated layer; Each of the plurality of peripheral wirings includes, at least in one location, two or more of the plated layers spaced apart from each other in the width direction of the peripheral wiring. Touch sensor.

2. The touch sensor according to claim 1 , wherein each of the plurality of peripheral wirings includes two or more of the plated layers connecting between the first electrode pad and the second electrode pad.

3. The line width of the plurality of peripheral wirings is W1, and the width of the plated layer in the plurality of peripheral wirings is A, W1 / A>2 is satisfied. The touch sensor according to claim 1 .

4. The line width W2 of the plurality of thin metal wires of the plurality of touch detection electrodes is 1.0 to 5.0 μm. The touch sensor according to claim 1 .

5. a ratio SM / ST of an area SM occupied by the metal plating layer of each of the plurality of peripheral wirings in a plan view to an area ST surrounded by the outline of each of the plurality of peripheral wirings in a plan view; SM / ST≧0.9 The touch sensor according to claim 1 .

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