Management device and management method

Abstract

To provide a technique for easily leveling tact balance between component mounters.SOLUTION: A management device for managing a plurality of component mounters constituting a component mounting line includes an allocation unit for allocating, for each component mounter, a plurality of components to be mounted on a board to a component group to be mounted on a board by the component mounter, a supply information acquisition unit for acquiring supply information regarding a time required for a supply process to supply new components to a component supply unit of the component mounter when a component group allocated to each component mounter by the allocation unit is mounted on the board by the component mounter, and an adjustment unit for adjusting the number of components in the component group allocated to each component mounter by the allocation unit based on the supply information acquired by the supply information acquisition unit so as to reduce the difference in cycle time required for the mounting process of each component mounter.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a technology for managing a plurality of component mounting machines that make up a component mounting line. [Background technology]

[0002] Patent Document 1 discloses a technology in which components are allocated to each of multiple component mounters, and then information such as the number of components supplied for each component under the allocation conditions is used to simulate the number of times each mounter will run out of components, thereby leveling out the number of times components will run out among each mounter. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 09-046094 Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology of Patent Document 1, in order to level out the number of times components run out among each mounter, the number of cassettes of components that run out frequently is increased in a mounter that runs out frequently. This reduces the number of times components run out in that mounter. In Patent Document 1, for example, if it is difficult to increase the number of cassettes in a mounter that runs out frequently, it is not possible to reduce the number of times components run out. In this case, the tact balance between mounters is not leveled.

[0005] The present specification provides a technique that can more easily achieve an equalization of the tact balance between component mounters than the conventional techniques. [Means for solving the problem]

[0006] This specification discloses a management device that manages a plurality of component mounters that constitute a component mounting line. Each of the component mounters includes a component supply unit that can arrange a component supply device that accommodates components, and a mounting unit that executes a mounting process to mount the components accommodated in the component supply device arranged in the component supply unit at a mounting position on a board. The management device includes an allocation unit that allocates a plurality of components to be mounted on the board to a component group to be mounted on the board by the component mounter for each of the component mounters, a supply information acquisition unit that acquires supply information related to a time required for a supply process to supply new components to the component supply unit of the component mounter when the component group allocated to each of the component mounters by the allocation unit is mounted on the board by the component mounter, and an adjustment unit that adjusts the number of components in the component group allocated to each of the component mounters by the allocation unit based on the supply information acquired by the supply information acquisition unit so as to reduce a difference in cycle time required for the mounting process of each of the component mounters.

[0007] The above-mentioned management device adjusts the number of components in a component group for each mounter based on the supply information related to the time required for the supply process so as to reduce the difference in cycle time between mounters. Therefore, a component group having a number of components adjusted taking into account the time required for the supply process is mounted by each mounter. This makes it easier to level out the tact balance between mounters compared to the conventional technology.

[0008] The management method for managing a plurality of mounters constituting a component mounting line, which is executed by the above-mentioned management device, is also novel and useful. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a front view of a component mounting system including a management device according to an embodiment. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] 11 is a flowchart of a part quantity adjustment process executed by the management device. [Diagram 5] 13 is a flowchart of a part quantity readjustment process executed by the management device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The main features of the embodiment described below are listed below. Note that the technical elements described below are independent technical elements that exhibit technical usefulness alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing.

[0011] In the management device disclosed in this specification, the supply information acquisition unit may acquire the supply information based on a supply frequency of the new part in the supply process.

[0012] As the supply frequency increases, the time required for the supply process increases. With this configuration, the management device can adjust the number of components in the component group for each mounter based on the supply information based on the supply frequency so as to reduce the difference in cycle time of each mounter. However, in another embodiment, the supply information acquisition unit may acquire supply information based on, for example, the time required for one supply process instead of the supply frequency.

[0013] The management device disclosed in this specification may further include a mounting time acquisition unit that acquires the mounting time required for the mounting process of the adjusted component group adjusted by the adjustment unit after each of the component mounters executes the mounting process of the adjusted component group adjusted by the adjustment unit, and a readjustment unit that readjusts the number of components in the adjusted component group for each of the component mounters so as to reduce a difference in the mounting times of each of the component mounters acquired by the mounting time acquisition unit.

[0014] With this configuration, the number of components in each component group for each component mounter is readjusted based on the mounting time actually required for the mounting process in each component mounter, thereby making it possible to more reliably level out the tact balance between component mounters.

[0015] The management device disclosed in this specification may further be capable of communicating with a component supplying device that supplies a new component supplying device storing the new components to the component supplying units of each of the multiple component mounters. In this case, the readjustment unit may use the component supplying device to move a first component supplying device disposed in the first component supplying unit of a first component mounter for which a first mounting time has been acquired to a second component supplying unit of a second component mounter for which a second mounting time shorter than the first mounting time has been acquired, thereby readjusting the number of components in the component group for each of the adjusted component mounters.

[0016] According to this configuration, the time required for the mounting process of the first component mounter that required the first mounting time for the mounting process is reduced, and the time required for the mounting process of the second component mounter that required the second mounting time for the mounting process is increased, thereby making it possible to level out the tact balance between the first component mounter and the second component mounter.

[0017] In the management device disclosed in the present specification, the mounting unit of the first component mounter may include a first component holding unit that holds a first component accommodated in a first component supply device arranged in a first component supply unit of the first component mounter from the first component supply unit to the mounting position on the board. Furthermore, the mounting unit of the second component mounter may include a second component holding unit that holds a second component accommodated in a second component supply device arranged in a second component supply unit of the second component mounter from the second component supply unit to the mounting position on the board. In this case, the readjustment unit may use the component replenishing device to move the first component supply device to the second component supply unit when the second component holding unit is capable of holding the first component, and may not move the first component supply device to the second component supply unit when the second component holding unit is not capable of holding the first component.

[0018] According to this configuration, when the first component can be held by the second component holding unit of the second component mounter, the first component supply device is moved to the second component supply unit of the second component mounter, so that the first component can be reliably mounted on the board by utilizing the second component holding unit of the second component mounter.

[0019] The management device disclosed in this specification may further be capable of communicating with a component supplying device that supplies a new component supplying device that accommodates the new components to the component supplying units of each of the multiple component mounters. In this case, the readjustment unit may use the component supplying device to supply a new first component supplying device that accommodates the same type of components as the components accommodated in the first component supplying device arranged in the first component supplying unit of the first component mounter for which the first mounting time has been acquired, to a second component supplying unit of a second component mounter for which a second mounting time shorter than the first mounting time has been acquired, thereby readjusting the number of components in the component group for each of the component mounters that has already been adjusted.

[0020] According to this configuration, the time required for the mounting process of the first component mounter that required the first mounting time for the mounting process is reduced, and the time required for the mounting process of the second component mounter that required the second mounting time for the mounting process is increased, thereby making it possible to level out the tact balance between the first component mounter and the second component mounter.

[0021] In the management device disclosed in the present specification, the mounting unit of the first component mounter may include a first component holding unit that holds a first component accommodated in a first component supply device arranged in a first component supply unit of the first component mounter from the first component supply unit to the mounting position on the board. Furthermore, the mounting unit of the second component mounter may include a second component holding unit that holds a second component accommodated in a second component supply device arranged in a second component supply unit of the second component mounter from the second component supply unit to the mounting position on the board. In this case, the readjustment unit may use the component resupply device to resupply a new first component supply device to the second component supply unit when the second component holding unit is capable of holding the first component, and may not resupply the new first component supply device to the second component supply unit when the second component holding unit is not capable of holding the first component.

[0022] According to this configuration, when the first component can be held by the second component holding unit of the second component mounter, the first component supply device supplies the second component supply unit of the second component mounter with the first component, so that the first component can be mounted on the board by using the second component holding unit of the second component mounter.

[0023] (First embodiment) The management device 30 of the first embodiment will be described with reference to the drawings. FIG. 1 shows a front view of a component mounting system 100 including the management device 30. The component mounting system 100 includes a component mounting line 10 in addition to the management device 30. The management device 30 is a computer located away from the component mounting line 10 and manages the operation of the component mounting line 10. The management device 30 is connected to the component mounting line 10 so as to be able to communicate with the component mounting line 10. The management device 30 may be connected to the component mounting line 10 by wire or wirelessly.

[0024] The component mounting line 10 includes a plurality of component mounters 10A-10C, a loader 20, and a storage 22. Each of the component mounters 10A-10C is a device that mounts components on a board, and is also called an electronic component placement device or a chip mounter. When the component mounter 10A completes mounting components on a board, it transports the board to the component mounter 10B. Similarly, when the component mounter 10B completes mounting components on a board transported from the component mounter 10A, it transports the board to the component mounter 10C. The component mounter 10C mounts components on the board, completing the mounting process of the components on the board. In this way, the component mounting line 10 transports the board in the +X direction (i.e., the right direction on the paper in FIG. 1). Hereinafter, the +X direction may be described as the downstream of the component mounting line 10, and the -X direction may be described as the upstream of the component mounting line 10.

[0025] Each of the component mounters 10A to 10C has the same configuration, except for the nozzle size, which will be described later. Therefore, in this specification, the component mounter 10A, which is located most upstream among the component mounters 10A to 10C, will be mainly described. The component mounter 10A includes a feeder holding unit 42A and a touch panel 44A. A plurality of feeders 40 are arranged above the feeder holding unit 42A. As a result, the feeder holding unit 42A holds the feeders 40. The feeders 40 are component supply devices for supplying components to each of the component mounters 10A to 10C. The feeders 40 are tape-type feeders that accommodate a plurality of components on a rolled tape. Although details will be described later with reference to FIG. 2, each of the plurality of feeders 40 accommodates a plurality of components 4 of the same type (see FIG. 2). Different types of components 4 are accommodated in different feeders 40. The touch panel 44A is a display device that provides the worker with various information about the component mounter 10A, and is also an input device that receives instructions and information from the worker.

[0026] The loader 20 is a device that automatically attaches and detaches the feeder 40 to and from the feeder holding units 42A-42C of the component mounters 10A-10C. As shown by the arrow in FIG. 1, the loader 20 can move between the storage 22 and the component mounting line 10 while holding the feeder 40. Based on an instruction from the management device 30, the loader 20 removes the feeder 40 stored in the storage 22 from the storage 22, and moves, for example, to the front of the component mounter 10A (i.e., toward the front of the paper in FIG. 1) while holding the feeder 40. Then, the loader 20 supplies the feeder 40 to the feeder holding unit 42A of the component mounter 10A. Furthermore, for example, loader 20 removes feeder 40 placed in feeder holding unit 42A of component mounter 10A from feeder holding unit 42A, moves feeder 40 to a storage unit while holding the feeder, and attaches the feeder to storage unit 22. Also, loader 20 can move feeder 40 placed in feeder holding unit 42A of component mounter 10A to a feeder holding unit of another component mounter (for example, component mounter 10B).

[0027] The storage 22 is located at the most upstream of the component mounting line 10. The storage 22 accommodates and stores a plurality of feeders 40. The storage 22 accommodates a plurality of feeders 40 on a plurality of pallets (not shown). The pallets are detachably accommodated in the storage 22. The storage 22 accommodates the feeders 40 before they are placed in the feeder holding units 42A-42C. Furthermore, the storage 22 accommodates the feeders 40 after they have been placed in the feeder holding units 42A-42C of each of the component mounters 10A-10C (i.e., after components have been supplied). The storage 22 transmits information such as the number and type of components 4 accommodated in the feeders 40 it accommodates to the management device 30.

[0028] The detailed structure of the component mounter 10A will be described with reference to Fig. 2. In addition to the feeder holding unit 42A and the touch panel 44A, the component mounter 10A further includes a board conveyor 47A, a mounting unit 45A, and a control device 49A.

[0029] The feeder holding unit 42A has a plurality of slots, and the feeder 40 can be detachably arranged in each of the plurality of slots. The feeder holding unit 42A may be fixed to the component mounter 10A, or may be detachably attached to the component mounter 10A. The mounting unit 45A has a mounting head 46A and a head moving device 48A. The mounting unit 45A mounts the components 4 of the feeder 40 arranged in the feeder holding unit 42A at the mounting position of the board 2. The mounting head 46A detachably holds one or a plurality of nozzles 43A. The nozzle 43A has a cylindrical shape, and the inside of the nozzle 43A is maintained at negative pressure by a vacuum pump (not shown). As a result, the nozzle 43A picks up the components 4 supplied by the feeder 40 by adsorbing them to the lower end of the nozzle 43A. With the component 4 held at the lower end of the nozzle 43A, the head moving device 48A moves the mounting head 46A to a predetermined mounting position on the board 2. After that, the nozzle 43A descends toward the board 2, and the suction by the vacuum pump is turned off to change the inside of the nozzle 43A to a positive pressure. As a result, the component 4 is mounted at the mounting position on the board 2. In this manner, the component mounter 10A executes the mounting process of the component 4 by the mounting unit 45A. The board conveyor 47A carries out the board 2 on which the component 4 is mounted, toward the downstream component mounter 10B. Furthermore, the board conveyor 47A carries in the board 2 from outside and supports the carried-in board 2 from below during the mounting process.

[0030] The control device 49A is a computer including a CPU and a memory. The control device 49A is connected to the management device 30 so as to be able to communicate with it. The control device 49A controls the operation of each part of the component mounter 10A based on the production program (mounting data) transmitted from the management device 30. As a result, the component mounter 10A executes a mounting process in accordance with the production program. In addition, when the control device 49A executes the mounting process, it measures the time actually required for the mounting process (mounting time). Furthermore, the control device 49A transmits to the management device 30 information indicating the nozzle size of the nozzle 43A and information such as the number and type of components currently accommodated in the feeder 40 arranged in the feeder holding unit 42A of the component mounter 10A.

[0031] The control configuration of the management device 30 will be described with reference to Fig. 3. The management device 30 includes an operation unit 32, a display unit 34, a CPU 36, and a memory 38. The operation unit 32 is an interface that accepts various inputs from an operator. The display unit 34 is a display that displays various information related to the component mounting line 10. The memory 38 is composed of a volatile memory, a non-volatile memory, etc. The memory 38 stores a program P1, a load factor table T1, and a nozzle table T2. The CPU 36 executes various processes according to the program P1 stored in the memory 38.

[0032] As shown in FIG. 3, the load factor table T1 stores the supply frequency and the load factor in association with each other. The load factor table T1 is a table for calculating the load factor based on the supply frequency. The supply frequency indicates the frequency (number of times) at which a new feeder 40 that stores the components 4 is supplied from the storage 22 to the feeder holding unit 42A of the component mounter 10A during a predetermined time for mounting the components 4 on the board 2 in the component mounter 10A, for example. The load factor indicates the degree of influence that a supply process for supplying a new feeder 40 from the storage 22 to, for example, the feeder holding unit 42A of the component mounter 10A has on the mounting time required for the mounting process of the component mounter 10A. For example, in this embodiment, when the supply frequency is 0 to 5 times, a load factor of 5% is applied, and when the supply frequency is 6 to 10 times, a load factor of 15% is applied. As the component supply frequency increases, the applied load factor also increases. The load factor table T1 is calculated based on the actual mounting time in the component mounter 10A, the time during which the mounting process is interrupted for replenishment processing, and performance values, etc. In this embodiment, the load factor table T1 is stored in the memory 38 at the time of shipment of the management device 30, but in a modified example, the load factor table T1 may be stored in the memory 38 by an operator after shipment. Furthermore, the contents of the load factor table T1 may be adjusted ex post by an operator. In another modified example, the memory 38 may store a calculation formula for calculating the load factor from the replenishment frequency instead of the load factor table T1. In that case, the load factor may be calculated based on the calculation formula.

[0033] The nozzle table T2 stores the size of the nozzles provided in each of the component mounters 10A to 10C in association with the components that each nozzle can hold. In the component mounting line 10 of this embodiment, the component mounter 10A has a nozzle 43A with a nozzle size of "small", the component mounter 10B has a nozzle with a nozzle size of "medium", and the component mounter 10C has a nozzle with a nozzle size of "large". The types of components that can be held differ depending on the nozzle size. In this embodiment, three types of components 4 (components 4A, 4B, and 4C) are mounted on the board 2. As shown in FIG. 3, the nozzle 43A of the component mounter 10A can hold the components 4A and 4C, but cannot hold the component 4B. In contrast, the nozzles of the component mounters 10B and 10C can hold the components 4A to 4C. In this way, in the component mounting line 10 of this embodiment, the nozzles used by the component mounters 10A to 10C are different, and therefore the types of components that can be held by the component mounters 10A to 10C differ. In this embodiment, the nozzle table T2 is stored in the memory 38 at the time of shipment of the management device 30, but in a modified example, the nozzle table T2 may be stored in the memory 38 by an operator after shipment. Furthermore, the contents of the nozzle table T2 may be adjusted afterwards by an operator.

[0034] 4, a component number adjustment process executed by the CPU 36 of the management device 30 in accordance with the program P1 in the memory 38 will be described. The component number adjustment process is executed in response to the management device 30 receiving a production program from a higher-level production management device (not shown). Here, the production program includes, for example, the number of mounted boards indicating the number of boards 2 on which components 4 are mounted in the component mounting line 10, the number of mounted components indicating the number of components 4 to be mounted on one board 2, mounted component types indicating the types of components to be mounted, and the mounting positions of each mounted component.

[0035] First, the CPU 36 calculates a target cycle time based on the production program (S10). Here, the target cycle time is a target value of the mounting time of each of the component mounters 10A to 10C in the mounting process executed on one board 2. The CPU 36 calculates the target cycle time of each of the component mounters 10A to 10C based on the number of mounted components, the type of mounted components, and the mounting position included in the production program. As described above, in the component mounting line 10, the component mounters 10A to 10C mount the components 4 on the board 2 in the order of the component mounters 10A to 10C. Therefore, the same target cycle time is calculated for each of the component mounters 10A to 10C. For example, the time required to mount all the components on the board 2 can be calculated based on the number of mounted components, the type of mounted components, and the mounting position included in the production program, so that the calculated time is equally shared by each of the component mounters 10A to 10C, and the target cycle time of each of the component mounters 10A to 10C is calculated. By each of the mounters 10A-10C executing the mounting process at the same cycle time, the tact balance of each of the mounters 10A-10C is leveled out. As a result, the bottleneck of the component mounting line 10 is eliminated, and mounting efficiency can be improved. To facilitate understanding, a table showing an example of each value calculated by the process of FIG. 4 is provided below FIG. 4. In the example of FIG. 4, the target cycle time is calculated to be, for example, 30 seconds.

[0036] Next, the CPU 36 allocates the number of components to be mounted included in the production program to a group of components to be mounted in each of the component mounters 10A to 10C based on the target cycle time calculated in S10 (S12). The CPU 36 calculates the total number of components to be mounted from the number of boards to be mounted and the number of components to be mounted included in the production program, and allocates them to each of the component mounters 10A to 10C. In the example of FIG. 4, the number of boards to be mounted is 300, and the types of components to be mounted are three types: components 4A, 4B, and 4C. The numbers written on each of the components 4A to 4C indicate the number of the component to be mounted on one board 2. That is, in the example of FIG. 4, five components 4A are mounted on one board 2. Similarly, two components 4B are mounted on one board 2, and three components 4C are mounted on one board 2. As a result, the component mounting line 10 uses the component mounters 10A-10C to mount 1500 components 4A on 300 boards 2. Similarly, the component mounting line 10 mounts 600 components 4B and 900 components 4C on 300 boards 2. The CPU 36 allocates the respective numbers of components 4A-4C to the component mounters 10A-10C so that the target cycle times of the component mounters 10A-10C are the same. Here, as described with reference to the nozzle table T2 in FIG. 3, the nozzle 43A of the component mounter 10A cannot hold the component 4B. For this reason, the CPU 36 does not allocate the component 4B to the component mounter 10A. 4, the CPU 36 allocates, based on the target cycle time, 1,500 components 4A into a group of 400 components to be mounted by the component mounter 10A, a group of 500 components to be mounted by the component mounter 10B, and a group of 600 components to be mounted by the component mounter 10C. Similarly, the CPU 36 allocates 600 components 4B into a group of 200 components to be mounted by the component mounter 10B and a group of 400 components to be mounted by the component mounter 10C, and allocates 900 components 4C into a group of 200 components to be mounted by the component mounter 10A, a group of 300 components to be mounted by the component mounter 10B, and a group of 400 components to be mounted by the component mounter 10C.

[0037] Furthermore, the CPU 36 calculates the supply frequency in the mounting process of each component group allocated in S12 (S14). The CPU 36 calculates the supply frequency based on the number of components in each component group, the number of feeders 40 that can be arranged in the feeder holding units 42A-42C of each mounter 10A-10C, and the number of components 4A-4C that can be accommodated in one feeder 40. For example, the supply frequency of the component 4A in the mounter 10A is calculated by dividing the number of component groups of the components 4A allocated to the mounter 10A (400 in the example of FIG. 4) by the number of feeders 40 arranged in the feeder holding unit 42A of the mounter 10A and the number of components 4A that can be accommodated in the feeder 40. The same applies to the other mounters 10B and 10C. In the example of FIG. 4, a supply frequency of three times is calculated for the component groups of the components 4A and 4C in the mounter 10A. Similarly, for the component mounter 10B, a replenishment frequency of 15 times is calculated for the component group of components 4A to 4C, and for the component mounter 10C, a replenishment frequency of 30 times is calculated. In this way, the greater the number of mounted components, the greater the replenishment frequency.

[0038] Based on the supply frequency calculated in S14, the CPU 36 uses the load factor table T1 (see FIG. 3) to calculate the load factor of each of the mounters 10A to 10C (S16). In the example of FIG. 4, a load factor of 5% is calculated for the mounter 10A, a load factor of 25% is calculated for the mounter 10B, and a load factor of 50% is calculated for the mounter 10C.

[0039] The CPU 36 uses the load factors of the component mounters 10A to 10C calculated in S16 to calculate an average load factor of each of the component mounters 10A to 10C (S18).

[0040] The CPU 36 compares the load factor of each mounter 10A-10C calculated in S16 with the average load factor calculated in S18, and judges whether the difference between the two is equal to or greater than the load factor threshold (S20). If there is a load factor where the difference between the two is a load factor abnormality (i.e., a load factor equal to or greater than the load factor threshold) (YES in S20), the CPU 36 proceeds to S30. If there is no load factor where the difference between the two is equal to or greater than the load factor threshold (NO in S20), the CPU 36 ends the process of FIG. 4. The load factor threshold is a value for judging whether the load factor affects the tact balance of each mounter 10A-10C, and is stored in advance in the memory 38. The load factor threshold can be adjusted afterwards by the operator. In a modified example, in S20, instead of comparing the average value with each load rate, the CPU 36 may compare the highest load rate (50% in the example of FIG. 4) with the lowest load rate (5% in the example of FIG. 4), and proceed to S30 if the difference between the two is equal to or greater than a predetermined value.

[0041] The CPU 36 calculates the adjusted cycle time (S30). Here, the adjusted cycle time indicates a target cycle time adjusted taking into account the load factor calculated in S16. Therefore, in a mounter with a high load factor (the mounter 10C in the example of FIG. 4), an adjusted cycle time (28.5 seconds in the example of FIG. 4) shorter than the target cycle time calculated in S10 is calculated. On the other hand, in a mounter with a low load factor (the mounter 10A in the example of FIG. 4), an adjusted cycle time (30.5 seconds in the example of FIG. 4) longer than the target cycle time calculated in S10 is calculated. In this way, the CPU 36 of this embodiment calculates the adjusted cycle time using the load factor calculated based on the supply frequency. This makes it possible to reduce the difference in cycle time between the mounters 10A to 10C taking into account the supply frequency.

[0042] The CPU 36 adjusts the number of component groups allocated in S12 based on the adjusted cycle time calculated in S30 (S32). As a result, the number of component groups to be mounted is reduced in a mounter with a high load factor (mounter 10C in the example of FIG. 4). As a result, the mounter requires less time for mounting, and the impact of a high load factor on mounting time can be reduced. On the other hand, the mounter with a low load factor (mounter 10A in the example of FIG. 4) increases the number of component groups to be mounted. As a result, the mounter can mount more components because of its low load factor. As a result, the tact balance of each of the mounters 10A to 10C is equalized.

[0043] 5, a component number readjustment process executed by the CPU 36 in accordance with the program P1 in the memory 38 will be described. The CPU 36 executes the process of FIG. 5, for example, in response to the completion of the mounting process for one board 2.

[0044] First, the CPU 36 acquires the mounting time required for the mounting process of one board 2 from each of the component mounters 10A to 10C (S40).

[0045] The CPU 36 uses the mounting times acquired in S40 to calculate the average mounting time of each of the mounters 10A to 10C (S42).

[0046] The CPU 36 compares the mounting time of each mounter 10A-10C acquired in S40 with the average mounting time calculated in S42, and judges whether the difference between the two is equal to or greater than the mounting time threshold (S50). If there is a mounting time for which the difference between the two is equal to or greater than the mounting time threshold (YES in S50), the CPU 36 proceeds to S60, and if there is no mounting time for which the difference between the two is equal to or greater than the mounting time threshold (NO in S50), the CPU 36 ends the processing of FIG. 5. The mounting time threshold is a value for judging whether the actual mounting times of the mounters 10A-10C are equalized, and is stored in advance in the memory 38. The mounting time threshold can be adjusted afterwards by the operator.

[0047] The CPU 36 identifies the component mounter from which the longest mounting time was obtained among the mounting times obtained in S40 (hereinafter referred to as the maximum component mounter), and the component mounter from which the shortest mounting time was obtained among the mounting times obtained in S40 (hereinafter referred to as the minimum component mounter) (S52).

[0048] Next, the CPU 36 judges whether the maximum component mounter and the minimum component mounter identified in S52 are compatible (S60). Specifically, the CPU 36 judges whether the component type accommodated by the feeder placed in the feeder holding section of the maximum actual component mounter includes a component type that can be mounted by the nozzle of the minimum component mounter, using information on the nozzle size received from the minimum component mounter and the nozzle table T2 described in FIG. 3. If the component type accommodated by the feeder placed in the feeder holding section of the maximum actual component mounter includes a component type that can be mounted by the nozzle of the minimum component mounter (YES in S60), the CPU 36 identifies the component type and proceeds to S70. If the component type accommodated by the feeder placed in the feeder holding section of the maximum actual component mounter does not include a component type that can be mounted by the nozzle of the minimum component mounter (NO in S60), the CPU 36 proceeds to S80.

[0049] The CPU 36 executes a notification process (S80). The CPU 36 displays information indicating that the mounting times of the mounters 10A-10C on the component mounting line 10 are not equalized on the display unit 34 (see FIG. 3). This allows the worker to recognize that the actual mounting times of the mounters 10A-10C on the component mounting line 10 are not equalized, and that there is a possibility that the mounting efficiency of the component mounting line 10 is decreasing. This allows the worker to, for example, confirm the cause of the difference in mounting time and take measures.

[0050] CPU 36 uses loader 20 to move the feeders containing the component types identified in S60 that are placed in the feeder holding section of the maximum component mounter to the feeder holding section of the minimum component mounter (S70). This reduces the number of feeders in the maximum component mounter and increases the number of feeders in the minimum component mounter.

[0051] The CPU 36 adjusts the number of components in the component group adjusted in S32 based on the information on the moved feeder (S72). Specifically, the CPU 36 reduces the number of components of the component type accommodated in the moved feeder in the mounting process of the largest component mounter, and increases the number of components of the component type accommodated in the moved feeder in the mounting process of the smallest component mounter. This reduces the difference between the mounting time of the largest component mounter and the mounting time of the smallest component mounter. The CPU 36 further adjusts the number of components in the component group adjusted in S32 based on the actual mounting time of each of the component mounters 10A to 10C acquired in S40. This makes it possible to more reliably equalize the tact balance between the component mounters 10A to 10C. In addition, when the largest component mounter and the smallest component mounter are compatible (YES in S60), the CPU 36 moves the feeder from the largest component mounter to the smallest component mounter. This ensures that the components accommodated in the moved feeder are mounted by the nozzle of the smallest component mounter.

[0052] (Effects of this embodiment) The management device 30 of this embodiment adjusts the number of components in the component group of each of the component mounters 10A-10C based on the load factor calculated based on the replenishment frequency so as to reduce the difference in cycle time required for mounting processing by each of the component mounters 10A-10C (S32). The component group with the number of components adjusted taking into account the load factor is mounted by each of the component mounters 10A-10C. This makes it easier to level out the tact balance between component mounters compared to the prior art.

[0053] The correspondence in this embodiment is as follows: The feeder 40 is an example of a "component supply device." The feeder holding unit 42A is an example of a "component supply unit." The load rate is an example of "supply information."

[0054] The process of S12 is an example of a process executed by an "allocation unit." The process of S16 is an example of a process executed by a "supply information acquisition unit." The processes of S30 and S32 are an example of a process executed by an "adjustment unit." The process of S40 is an example of a process executed by a "mounting time acquisition unit." The processes of S70 and S72 are an example of a process executed by a "readjustment unit."

[0055] (Second Example) Compared to the first embodiment described above, this embodiment differs in the process executed in S70 of Fig. 5. However, in other respects, this embodiment is similar to the first embodiment.

[0056] In S70, CPU 36 uses loader 20 to supply a new feeder containing components of the component type identified in S60 from storage 22 to the minimum component mounter. As a result, the new feeder containing components of the component type identified in S60 is placed in the feeder holding unit of the minimum component mounter.

[0057] In this case, CPU 36 adjusts the number of components in the component group adjusted in S32 based on information about the replenished feeder (S72). Specifically, CPU 36 reduces the number of components to be mounted in the replenished feeder in the mounting process of the maximum component mounter, and increases the number of components to be mounted in the replenished feeder in the mounting process of the minimum component mounter. This reduces the difference between the mounting time of the maximum component mounter and the mounting time of the minimum component mounter.

[0058] Points to note about this embodiment are described below. Instead of calculating the load factor in S16 of Fig. 4, the CPU 36 may accept input of information such as the time required for the resupply process and the difficulty of the work from the worker. In this modification, accepting input of the information from the worker is an example of processing executed by the "resupply information acquisition unit".

[0059] The CPU 36 does not have to execute the process of S20 in Fig. 4. In this modification, the CPU 36 may calculate the adjusted cycle time regardless of whether the difference between the load factor and the average value is equal to or greater than the load factor threshold value.

[0060] The CPU 36 does not have to execute the process of Fig. 5. In this modified example, the "mounting time acquisition unit" and the "readjustment unit" can be omitted.

[0061] CPU 36 may not execute the process of S50 in Fig. 5. In this modification, CPU 36 may identify the maximum mounter and the minimum mounter regardless of whether the difference between the mounting time and the average value is equal to or greater than the mounting time threshold. In another modification, CPU 36 may not execute the process of S52 in Fig. 5. In this modification, the feeders of all mounters for which mounting times equal to or greater than the average mounting time have been acquired may be moved to the feeder holding units of all mounters for which mounting times shorter than the average mounting time have been acquired.

[0062] CPU 36 does not have to execute the processes of S60 and S70 in Fig. 5. In this modification, CPU 36 may calculate a readjustment cycle time and adjust the number of components in the component group so that the difference in mounting time between each of component mounters 10A to 10C is reduced. In this modification, calculating the readjustment cycle time and adjusting the number of components in the component group is an example of a process executed by the "readjustment unit".

[0063] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings achieves multiple objectives simultaneously, and achieving one of the objectives itself has technical utility.

[0064] This specification also discloses the technical idea of ​​changing "the management device according to claim 1" to "the management device according to claim 1 or 2" in claim 3. Also, the technical idea of ​​changing "the management device according to claim 3" to "the management device according to any one of claims 3 to 5" in claim 6 is also disclosed. [Explanation of symbols]

[0065] 2: Substrate 4, 4A, 4B, 4C: Parts 10: Component mounting line 10A, 10B, 10C: Component mounting machines 20: Loader 22: Storage 30: Management device 32:Operation unit 34: Display section 36 :CPU 38: Memory 40: Feeder 42A, 42B, 42C: Feeder holding part 43A: Nozzle 44A: Touch panel 45A: Mounting section 46A: Placement head 47A: PCB conveyor 48A: Head moving device 49A: Control device 100: Component mounting system P1: Program T1: Load factor table T2: Nozzle table

Claims

1. A management device for managing a plurality of mounters constituting a component mounting line, Each of the plurality of component mounters includes: a component supply unit in which a component supply device storing components can be disposed; a mounting unit that executes a mounting process for mounting the components accommodated in the component supply device disposed in the component supply unit to mounting positions on a board; Equipped with The management device includes: an allocating unit that allocates, for each of the mounters, a plurality of components to be mounted on the board to a group of components to be mounted on the board by the mounter; a supply information acquisition unit that acquires supply information related to a time required for a supply process of supplying new components to the component supply unit of the component mounter when the component group allocated to each of the component mounters by the allocation unit is mounted on the board by the component mounter; an adjustment unit that adjusts the number of components in the component group allocated to each of the component mounters by the allocation unit based on the supply information acquired by the supply information acquisition unit so as to reduce a difference in cycle time required for the mounting process of each of the component mounters; Equipped with Management device.

2. The management device according to claim 1 , wherein the supply information acquisition unit acquires the supply information based on a supply frequency of the new part in the supply process.

3. The management device further comprises: a mounting time acquisition unit that acquires a mounting time required for each of the component mounters to perform a mounting process of a group of components adjusted by the adjustment unit; a readjustment unit that readjusts the number of components in the adjusted component group for each of the component mounters so as to reduce a difference in the mounting time of each of the component mounters acquired by the mounting time acquisition unit; Equipped with The management device according to claim 1 .

4. the management device is further capable of communicating with a component supply device that supplies a new component supply device that accommodates the new component to the component supply units of each of the component mounters; the readjustment unit uses the component replenishing device to move a first component supply device disposed in a first component supply unit of a first component mounter for which a first mounting time has been acquired to a second component supply unit of a second component mounter for which a second mounting time shorter than the first mounting time has been acquired, thereby readjusting the number of components in the component group for each of the component mounters that has been adjusted. The management device according to claim 3 .

5. the mounting unit of the first component mounter includes a first component holding unit that holds a first component accommodated in a first component supply device disposed in a first component supply unit of the first component mounter from the first component supply unit to the mounting position on the board; the mounting unit of the second component mounter includes a second component holding unit that holds a second component accommodated in a second component supply device disposed in a second component supply unit of the second component mounter from the second component supply unit to the mounting position on the board, The readjustment unit is when the second component holding unit is capable of holding the first component, using the component supply device to move the first component supply device to the second component supply unit; when the second component holding unit is not capable of holding the first component, the first component supply device is not moved to the second component supply unit. The management device according to claim 4.

6. the management device is further capable of communicating with a component supply device that supplies a new component supply device that accommodates the new component to the component supply units of each of the component mounters; the readjustment unit utilizes the component supply device to supply a new first component supply device that accommodates the same type of components as those accommodated in the first component supply device disposed in the first component supply unit of the first component mounter for which the first mounting time has been acquired, to a second component supply unit of a second component mounter for which a second mounting time shorter than the first mounting time has been acquired, thereby readjusting the number of components in the component group for each of the component mounters that has already been adjusted. The management device according to claim 3 .

7. the mounting unit of the first component mounter includes a first component holding unit that holds a first component accommodated in a first component supply device disposed in a first component supply unit of the first component mounter from the first component supply unit to the mounting position on the board; the mounting unit of the second component mounter includes a second component holding unit that holds a second component accommodated in a second component supply device disposed in a second component supply unit of the second component mounter from the second component supply unit to the mounting position on the board, The readjustment unit is When the second component holding unit is capable of holding the first component, the component supply device supplies the new first component supply unit to the second component supply unit using the component supply device; when the second component holding unit is not capable of holding the first component, the new first component supply device is not supplied to the second component supply unit. The management device according to claim 6.

8. A management method for managing a plurality of mounters constituting a component mounting line, comprising the steps of: Each of the plurality of component mounters includes: a component supply unit in which a component supply device storing components can be disposed; a mounting unit that executes a mounting process for mounting the components accommodated in a component supply device disposed in the component supply unit to mounting positions on a board; Equipped with The management method includes: an allocating step of allocating, for each of the component mounters, a plurality of components to be mounted on the board to a component group to be mounted on the board by the component mounter; a supply information acquisition step of acquiring supply information relating to a time required for a supply process of supplying new components to the component supply unit of each of the component mounters when the component mounters mount the group of components allocated to the respective component mounters by the allocation step on the board; an adjustment unit process for adjusting the number of components in the component group for each of the component mounters allocated by the allocation process based on the supply information acquired by the supply information acquisition process so as to reduce a difference in cycle time required for the mounting process of each of the component mounters; Including, Management method.

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