Nozzle position adjuster, nozzle position adjustment method, and nozzle position adjustment holder

Abstract

To provide a nozzle position adjuster that can accurately adjust the position of nozzles.SOLUTION: A nozzle position adjuster is used in a substrate cleaning apparatus having a substrate support section that supports the substrate and a nozzle that sprays cleaning liquid toward the substrate. The nozzle position adjuster has a position confirmation plate on which a position indication is formed and installed on the substrate support section, and a positioning mechanism that extends from the nozzle toward the position confirmation plate. The positioning mechanism uses the position indication to determine the position of the nozzle relative to the position confirmation plate.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a nozzle position adjustment device, a nozzle position adjustment method, and a nozzle position adjustment holder. [Background technology]

[0002] 2. Description of the Related Art In a substrate cleaning apparatus equipped with a nozzle for spraying a cleaning liquid onto a substrate such as a semiconductor wafer, a device for adjusting the position of the nozzle is used (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-183595 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, with such an apparatus, it is not easy to adjust the nozzle position with high precision, and therefore there are cases where the liquid cannot be sprayed onto the substrate at a precise position.

[0005] An object of one aspect of the present invention is to provide a nozzle position adjustment device, a nozzle position adjustment method, and a nozzle position adjustment holder that are capable of adjusting the position of a nozzle with high precision. [Means for solving the problem]

[0006] A nozzle position adjustment device according to a first aspect of the present invention is a nozzle position adjustment device used in a substrate cleaning apparatus comprising a substrate support part for supporting a substrate and a nozzle for spraying a cleaning liquid toward the substrate, the nozzle position adjustment device comprising: a position confirmation plate having a position indication formed thereon and installed on the substrate support part; and a positioning mechanism extending from the nozzle toward the position confirmation plate, the positioning mechanism using the position indication to determine the position of the nozzle relative to the position confirmation plate.

[0007] A nozzle position adjustment device according to a second aspect of the present invention is the nozzle position adjustment device of the first aspect, wherein the positioning mechanism includes a holder and a rod held by the holder so as to be extendable and retractable in a direction approaching and moving away from the position confirmation plate, The nozzle is positioned based on the position of the tip of the rod relative to the position indicia.

[0008] A nozzle position adjustment device according to aspect 3 of the present invention is the nozzle position adjustment device of aspect 2, wherein one or more engagement recesses are formed in the position confirmation plate, the tip of the rod is engageable with the engagement recesses, and the positioning mechanism determines the position of the rod by engaging the tip with the engagement recess.

[0009] A nozzle position adjusting device according to a fourth aspect of the present invention is the nozzle position adjusting device of the third aspect, wherein the position indication has lattice-like reference lines, and the engagement recesses are formed at the intersections of the reference lines.

[0010] A nozzle position adjustment method according to aspect 5 of the present invention involves, prior to cleaning a substrate using a substrate cleaning apparatus having a substrate support part for supporting a substrate and a nozzle for spraying a cleaning liquid toward the substrate, placing a position confirmation plate, which has a position indication written on it, on the substrate support part, and using a positioning mechanism extending from the nozzle toward the position confirmation plate to determine the position of the nozzle relative to the position confirmation plate using the position indication.

[0011] A nozzle position adjustment holder according to a sixth aspect of the present invention is a nozzle position adjustment holder used in a substrate cleaning apparatus comprising a substrate support part for supporting a substrate and a nozzle for spraying cleaning liquid toward the substrate, and is used in a nozzle position adjustment device comprising a position confirmation plate having a position indication and installed on the substrate support part, and a positioning mechanism having a rod and extending from the nozzle toward the position confirmation plate, and holds the rod so that it can be extended and contracted in directions approaching and moving away from the position confirmation plate. Effect of the Invention

[0012] According to one aspect of the present invention, it is possible to provide a nozzle position adjustment device, a nozzle position adjustment method, and a nozzle position adjustment holder that are capable of adjusting the position of a nozzle with high precision. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view of the substrate cleaning apparatus. [Diagram 2] FIG. 2 is a plan view of the substrate cleaning apparatus. [Diagram 3] FIG. 2 is a front view of the substrate cleaning apparatus. [Figure 4] FIG. 2 is a perspective view of a nozzle of the substrate cleaning apparatus. [Diagram 5] 2 is a cross-sectional view of a base of a nozzle of the substrate cleaning apparatus. [Figure 6] FIG. 2 is a front view of the nozzle position adjustment device according to the first embodiment. [Figure 7] 2 is an enlarged front view of a portion of the nozzle position adjustment device according to the first embodiment. FIG. [Figure 8] 2 is an enlarged front view of a portion of the nozzle position adjustment device according to the first embodiment. FIG. [Figure 9] FIG. 4 is a plan view of the position confirmation plate. [Figure 10] FIG. 4 is an enlarged plan view of a portion of the position confirmation plate. [Figure 11] FIG. 11 is a front view of a nozzle position adjustment device according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a nozzle position adjusting device, a nozzle position adjusting method, and a nozzle position adjusting holder according to the present invention will be described with reference to the drawings.

[0015] [Substrate cleaning equipment] Fig. 1 is a perspective view of a substrate cleaning apparatus. Fig. 2 is a plan view of the substrate cleaning apparatus. Fig. 3 is a front view of the substrate cleaning apparatus. Fig. 4 is a perspective view of a nozzle of the substrate cleaning apparatus. Fig. 5 is a cross-sectional view of a base of a nozzle of the substrate cleaning apparatus.

[0016] 1 to 3, a substrate cleaning apparatus 50 (substrate processing apparatus) cleans the surface of a substrate W while rotating the substrate W about the central axis of the substrate W in the presence of a cleaning liquid. An example of the substrate W is a semiconductor wafer.

[0017] The substrate cleaning apparatus 50 includes a substrate support section 51, a plurality of liquid supply sections 52, a support section 53, and a cleaning member (not shown). The substrate support portion 51 includes a plurality of spindles 54 (holding portions) that hold the peripheral portion of the substrate W. The spindles 54 support the substrate W rotatably in the circumferential direction. The substrate support portion 51 can support the substrate W in a horizontal position, for example. The number of spindles 54 is, for example, four.

[0018] In the following description, an XYZ Cartesian coordinate system may be used. The X and Y directions are directions along a plane defined by the multiple spindles 54. The X and Y directions are mutually perpendicular. The Z direction is perpendicular to the X and Y directions. Planar view is viewing from the Z direction. A plane along the X and Y directions is called an "XY plane." The XY plane is, for example, a horizontal plane. A plane along the X and Z directions is called an "XZ plane."

[0019] The support section 53 includes a support frame 58 and supports 59 and 60. The support frame 58 has, for example, an L-shaped cross section and extends in the Y direction. The upper surface of the support frame 58 is, for example, parallel to the XY plane. The supports 59 and 60 are a first support 59 and a second support 60. The supports 59 and 60 are provided on the upper surface of the support frame 58. The first support 59 and the second support 60 are provided at different positions in the length direction (Y direction) of the support frame 58.

[0020] 4, the first support 59 supports the first liquid supply unit 55. The first support 59 includes a first base portion 61 and a first attachment portion 62. The first base portion 61 is plate-shaped. The first base portion 61 is attached to the upper surface of the support frame 58. The first base portion 61 is parallel to, for example, the XY plane.

[0021] The first mounting portion 62 is plate-shaped. The first mounting portion 62 is provided upright on the first base portion 61. The first mounting portion 62 is, for example, perpendicular to the first base portion 61. The first mounting portion 62 is, for example, parallel to the XZ plane.

[0022] The second support 60 supports the second liquid supply unit 56. The second support 60 includes a second base portion 63 and a second mounting portion 64. The second base portion 63 is plate-shaped. The second base portion 63 is mounted on the upper surface of the support frame 58. The second base portion 63 is parallel to, for example, the XY plane.

[0023] The second mounting portion 64 is plate-shaped. The second mounting portion 64 stands on the second base portion 63. The second mounting portion 64 is, for example, perpendicular to the second base portion 63. The second mounting portion 64 is, for example, parallel to the XZ plane.

[0024] The cleaning member is, for example, a roll cleaning member, a pencil cleaning member, or the like.

[0025] The plurality of liquid supply units 52 include a first liquid supply unit 55 and a second liquid supply unit 56 . The first liquid supply unit 55 supplies cleaning liquid to the center of the substrate W (see FIG. 1). The second liquid supply unit 56 supplies cleaning liquid to a wide area from the center to the periphery of the substrate W. The "cleaning liquid" may be a chemical liquid or a rinsing liquid. Examples of the chemical liquid include ammonia hydrogen peroxide (SC1), hydrochloric acid hydrogen peroxide (SC2), sulfuric acid hydrogen peroxide (SPM), sulfuric acid water, hydrofluoric acid, etc. Examples of the rinsing liquid include ultrapure water, pure water (DIW), etc.

[0026] The first liquid supply unit 55 includes nozzles 71 and 72. The nozzles 71 and 72 are a first nozzle 71 and a second nozzle 72. The first nozzle 71 includes a first base 73 (base) and a first tip 74 (tip). The first base 73 is rectangular parallelepiped. The first base 73 is formed with two insertion holes 73a and 73b penetrating in the thickness direction (see FIG. 5). The two insertion holes 73a and 73b are formed at different positions in the length direction of the first base 73.

[0027] The first base 73 is fixed to one surface of the first mounting portion 62 by two fasteners 75, 76. The fasteners 75, 76 have, for example, heads 75a, 76a and shafts 75b, 76b (for example, screw shafts) extending from the heads 75a, 76a. The shafts 75b, 76b are inserted into the insertion holes 73a, 73b of the first base 73, respectively (see FIG. 5). The shafts 75b, 76b extend in the Y direction. The tips of the shafts 75b, 76b are fixed to the first mounting portion 62. The outer diameters of the shafts 75b, 76b are smaller than the outer diameters of the heads 75a, 76a. The first base 73 is fixed to the first mounting portion 62 by being pressed by the heads 75a, 76a of the fasteners 75, 76.

[0028] The inner diameter of insertion hole 73a through which fixture 75 is inserted is larger than the outer diameter of shaft portion 75b of fixture 75. Therefore, the orientation of first nozzle 71 can be adjusted by rotating it about fixture 76 (see the arrow in FIG. 5). The first tip 74 protrudes from the first base 73. The first tip 74 sprays the chemical liquid supplied from the first supply pipe 77 toward the substrate W. The spray direction of the chemical liquid is determined by the orientation of the first nozzle 71.

[0029] The second nozzle 72 includes a second base 83 (base) and a second tip portion 84 (tip portion). The second base 83 has a rectangular parallelepiped shape. Two insertion holes are formed in the second base 83. The two insertion holes are formed at different positions in the length direction of the second base 83.

[0030] The second base 83 is fixed to one surface of the first mounting portion 62 by two fasteners 85, 86. The fasteners 85, 86 have, for example, a head and a shaft portion (for example, a screw shaft) extending from the head. The shaft portion is inserted into an insertion hole of the second base 83. The tip portion of the shaft portion is fixed to the first mounting portion 62. The second base 83 is fixed to the first mounting portion 62 by being pressed by the heads of the fasteners 85, 86.

[0031] The inner diameter of the insertion hole through which the fixture 85 is inserted is larger than the outer diameter of the shaft portion of the fixture 85. Therefore, the orientation of the second nozzle 72 can be adjusted by rotating the second nozzle 72 around the fixture 86. The second tip portion 84 protrudes from the second base 83. The second tip portion 84 sprays the rinsing liquid supplied from the second supply pipe 87 toward the substrate W. The spray direction of the rinsing liquid is determined by the orientation of the second nozzle 72.

[0032] The second liquid supply unit 56 includes nozzles 71 and 72 . A first base 73 of the first nozzle 71 is fixed to one surface of the second attachment portion 64 by two fasteners 75, 76. The orientation of the first nozzle 71 can be adjusted by rotating the first nozzle 71 around the fastener 76. The first tip portion 74 sprays the chemical liquid supplied from the first supply pipe 78 toward the substrate W.

[0033] The second base 83 of the second nozzle 72 is fixed to one surface of the second attachment portion 64 by two fasteners 85, 86. The second nozzle 72 can be rotated about the fastener 86 to adjust its orientation. The second tip portion 84 sprays the rinsing liquid supplied from the second supply pipe 88 toward the substrate W.

[0034] [Nozzle position adjustment device] (First embodiment) Fig. 6 is a front view of the nozzle position adjustment device 10 according to the first embodiment. Fig. 7 is a front view of a portion of the nozzle position adjustment device 10 on an enlarged scale. Fig. 8 is a front view of a portion of the nozzle position adjustment device 10 on an enlarged scale. Fig. 9 is a plan view of the position confirmation plate 1. Fig. 10 is a plan view of a portion of the position confirmation plate 1 on an enlarged scale. Fig. 10 is an enlarged view of an area A shown in Fig. 9.

[0035] As shown in FIG. 6, the nozzle position adjustment device 10 includes a position confirmation plate 1 and one or more positioning mechanisms 2. 9, the position confirmation plate 1 is formed, for example, in a rectangular shape. The thickness of the position confirmation plate 1 is, for example, the same as the thickness of the substrate W. The position confirmation plate 1 can be installed on a substrate support part 51 in place of the substrate W (see FIG. 1). The position confirmation plate 1 is held, for example, by spindles 54 at each of its four corners.

[0036] As shown in Figures 9 and 10, position indications 11 formed in a grid pattern and scales 12 (see Figure 10) are formed on the first main surface 1a (one surface) of the position confirmation plate 1. The position indications 11 have a plurality of first reference lines 11A (reference lines) along the X direction and a plurality of second reference lines 11B (reference lines) along the Y direction. The plurality of first reference lines 11A are formed side by side at intervals in the Y direction. The plurality of second reference lines 11B are formed side by side at intervals in the X direction.

[0037] The multiple first reference lines 11A are formed, for example, at equal intervals. The multiple first reference lines 11A are formed, for example, at equal intervals. The interval between adjacent first reference lines 11A is equal to the interval between adjacent second reference lines 11B. The first reference lines 11A and the second reference lines 11B are formed, for example, in a grid shape. The position indication 11 indicates, for example, coordinates on the first main surface 1a. The scale 12 indicates, for example, a position in the coordinates.

[0038] A plurality of engagement recesses 13 are formed in the first main surface 1a. It is desirable that the engagement recesses 13 are formed so as to be associated with the position indicators 11. For example, the engagement recesses 13 are formed at the intersections of the first reference lines 11A and the second reference lines 11B. The engagement recesses 13 are, for example, circular in plan view. The engagement recesses 13 are, for example, hemispherical recesses. The engagement recesses 13 also function as position indicators.

[0039] 6, the positioning mechanism 2 can be attached to nozzles 71 and 72. The positioning mechanism 2 extends from the attached nozzle towards the position confirmation plate 1. The positioning mechanism 2 is inclined so as to descend towards its tip.

[0040] The positioning mechanism 2 includes a holder 16 and a rod 17. The holder 16 includes an attachment portion 18 and a rod holding portion 19. The holder 16 is an example of a "nozzle position adjustment holder."

[0041] 7, the mounting portion 18 has a base portion 21 and an extension portion 22 extending from the base portion 21. The mounting portion 18 is formed, for example, in the shape of a plate parallel to the XY plane.

[0042] The base 21 is formed in a rectangular shape. Two insertion holes are formed penetrating the base 21. In the positioning mechanism 2 attached to the first nozzle 71, the base 21 is fixed to the outer surface of the first base 73 by fixtures 23, 24. The fixtures 23, 24 have, for example, a head and a shaft portion (for example, a screw shaft) extending from the head. The shaft portion is inserted into the insertion hole of the base 21. The shaft portion is fixed to the first base 73. The outer diameter of the shaft portion is smaller than the outer diameter of the head. The base 21 is fixed to the first base 73 by being pressed by the head of the fixture.

[0043] In the positioning mechanism 2 attached to the second nozzle 72, the base 21 is fixed to the outer surface of the second base 83 by fasteners 23 and 24.

[0044] The rod holding portion 19 is formed in a rectangular column shape. The rod holding portion 19 extends from the tip of the attachment portion 18 (the tip of the extension portion 22). The rod holding portion 19 is inclined so as to descend toward the tip.

[0045] As shown in Fig. 8, an insertion hole 25 is formed in the rod holding portion 19. The insertion hole 25 is formed along the longitudinal direction of the rod holding portion 19. The insertion hole 25 opens to a tip surface 19a of the rod holding portion 19. A cross section of the insertion hole 25 perpendicular to the longitudinal direction of the rod holding portion 19 is, for example, circular. One or more insertion holes 19b, 19c penetrating from the outer surface to the inner surface of the insertion hole 25 are formed in the side portion of the rod holding portion 19.

[0046] A portion including the tip of rod 17 protrudes from the tip of holder 16. The extending direction of rod 17 is the same as the longitudinal direction of rod holding portion 19. Rod 17 is inclined so as to descend toward the tip.

[0047] The rod 17 includes a main body 31, a reduced diameter portion 32, and a tip protrusion 33. The main body 31 is formed, for example, in a cylindrical shape. The outer diameter of the main body 31 is the same as or smaller than the inner diameter of the insertion hole 25. Therefore, the main body 31 can be inserted into the insertion hole 25. A scale 34 is formed on the outer circumferential surface of the main body 31. The scale 34 indicates the protruding length of the rod 17 from the rod holding portion 19.

[0048] The reduced diameter portion 32 protrudes while decreasing in diameter from the tip of the main body portion 31. The reduced diameter portion 32 is formed, for example, in a conical shape. The tip protrusion 33 protrudes from the tip of the reduced diameter portion 32 in the longitudinal direction of the rod 17. The tip protrusion 33 is formed, for example, in a cylindrical shape. The outer diameter of the tip protrusion 33 is smaller than the outer diameter of the main body portion 31.

[0049] The tip 33a of the tip protrusion 33 is the tip of the rod 17. The tip 33a of the tip protrusion 33 is formed, for example, in a hemispherical shape. The tip 33a is engageable with the engagement recess 13 of the position confirmation plate 1. For example, the tip 33a engages with the engagement recess 13 in a state where at least a portion of the tip 33a is inserted therein.

[0050] The rod 17 is movable in the length direction of the rod holding portion 19. The rod 17 is extendable relative to the holder 16. The length of the rod 17 protruding from the tip of the rod holding portion 19 is adjustable. The rod 17 is held by the holder 16 (rod holding portion 19) so as to be extendable in the direction approaching and moving away from the position confirmation plate 1.

[0051] The rod 17 is fixed to the holder 16 by the fixing devices 26 and 27. The fixing device 26 has a head 26a and a shaft portion 26b (e.g., a screw shaft) extending from the head 26a. The fixing device 27 has a head 27a and a shaft portion 27b (e.g., a screw shaft) extending from the head 27a. The shaft portions 26b and 27b are inserted into the insertion holes 19b and 19c of the rod holding portion 19. The tips of the shaft portions 26b and 27b are abutted against the outer surface of the main body portion 31. The rod 17 is fixed to the holder 16, for example, in a state where it is sandwiched between the fixing devices 26 and 27.

[0052] [Nozzle position adjustment method] (First embodiment) Prior to cleaning the substrate W using the substrate cleaning apparatus 50, the positions of the nozzles 71, 72 can be adjusted using the nozzle position adjustment device 10. An example of a method for adjusting the positions of the nozzles 71, 72 will now be described.

[0053] (Step 1: Installing the location confirmation plate) 9, the position confirmation plate 1 is placed on a substrate support portion 51. The position confirmation plate 1 is held by, for example, four corners thereof on spindles 54, respectively.

[0054] (Second step: Installation of positioning mechanism) As shown in Fig. 6, when adjusting the position of the first nozzle 71, the positioning mechanism 2 is attached to the first nozzle 71. More specifically, as shown in Fig. 7, the base 21 of the holder 16 is fixed to the first base 73 by fasteners 23 and 24.

[0055] (Third step: Adjusting the nozzle position) As shown in Fig. 6, the orientation of the first nozzle 71 is adjusted so that the tip of the rod 17 (tip 33a of tip protrusion 33 (see Fig. 8)) engages with a predetermined engagement recess 13 (see Fig. 5). For example, to adjust the position of the first nozzle 71 of the first liquid supply unit 55, the orientation of the first nozzle 71 is adjusted so that the tip of the rod 17 engages with the engagement recess 13 formed in the position indicator 11 at a position corresponding to the center of the substrate W. The first nozzle 71 whose orientation has been adjusted is fixed to the supports 59, 60 by fixtures 75, 76.

[0056] When adjusting the orientation of the first nozzle 71, the rod 17 is extended or retracted relative to the holder 16 as necessary. If the position of the tip of the rod 17 is deviated from the intended engagement recess 13, the adjustment of the first nozzle 71 can be readjusted. This allows the position of the first nozzle 71 to be determined using the position indicator 11.

[0057] Similarly, in the case of the second nozzle 72, the positioning mechanism 2 is attached to the second nozzle 72, and the orientation of the second nozzle 72 is adjusted so that the tip of the rod 17 engages with a predetermined engagement recess 13 (see FIG. 5). The second nozzle 72 is fixed to the supports 59, 60 by fasteners 85, 86. This makes it possible to determine the position of the second nozzle 72 using the position indicator 11.

[0058] When adjusting the positions of the nozzles 71, 72 in this process, it is possible to record whether the position of the tip of the rod 17 relative to the position indicator 11 matches the design value. This record is useful for management in a later process (e.g., a cleaning process using the substrate cleaning apparatus 50). For example, if the position of the tip of the rod 17 matches the design value but a deviation occurs in the position where the liquid hits the substrate in the cleaning process, it can be assumed that the deviation occurred due to a cause other than the positions of the nozzles 71, 72. Possible causes other than the positions of the nozzles 71, 72 include, for example, the support position of the substrate by the substrate support unit, the flow rate of the liquid, and the like.

[0059] After the adjustment of the positions of the nozzles 71 and 72 has been completed, the fixing devices 23 and 24 (see FIG. 7) are removed, and the positioning mechanism 2 is removed from the nozzles 71 and 72.

[0060] [Effects of the nozzle position adjustment device and nozzle position adjustment method according to the embodiment] The nozzle position adjustment device 10 includes a position confirmation plate 1 and a positioning mechanism 2 extending toward the position confirmation plate 1. The positioning mechanism 2 can determine the positions of the nozzles 71, 72 using the position indicators 11, and therefore can quantitatively adjust the nozzle positions. This can reduce the variation in adjustment by an operator. The variation between devices can also be reduced. Therefore, the positions of the nozzles 71, 72 can be adjusted with high precision. Therefore, the nozzles 71, 72 can spray the cleaning liquid onto the correct position of the substrate W in the process of cleaning the substrate W. Therefore, it is possible to suppress a decrease in the cleaning effect caused by the misalignment of the nozzles 71, 72.

[0061] The positioning mechanism 2 includes a holder 16 and a rod 17 that is extendably held by the holder 16. The positioning mechanism 2 can determine the positions of the nozzles 71, 72 based on the position of the rod 17 relative to the position indicator 11. This makes it possible to easily adjust the positions of the nozzles 71, 72.

[0062] The positioning mechanism 2 can determine the positions of the nozzles 71, 72 by engaging the tip of the rod 17 with the engagement recess 13. This prevents the tip of the rod 17 from shifting from the position confirmation plate 1, making it easier to identify the position of the rod 17 with respect to the position indicator 11. This allows the positions of the nozzles 71, 72 to be determined with high precision.

[0063] The position indicator 11 has a first reference line 11A and a second reference line 11B in a lattice pattern (rectangular lattice pattern). The engagement recess 13 is formed at the intersection of the first reference line 11A and the second reference line 11B. This makes it easy to identify the position of the rod 17 relative to the position indicator 11. This makes it easy to adjust the positions of the nozzles 71, 72.

[0064] In the nozzle position adjustment method, the positions of the nozzles 71, 72 are determined by the positioning mechanism 2. Therefore, the positions of the nozzles 71, 72 can be adjusted with high precision. Therefore, the nozzles 71, 72 can inject the cleaning liquid to an accurate position on the substrate W in the process of cleaning the substrate W. Therefore, a decrease in the cleaning effect caused by misalignment of the nozzles 71, 72 can be suppressed.

[0065] The holder 16 of the nozzle position adjustment device 10 can determine the positions of the nozzles 71, 72 using the rod 17 and the position indicators 11. Therefore, the positions of the nozzles 71, 72 can be adjusted with high precision. Therefore, the nozzles 71, 72 can spray the cleaning liquid onto accurate positions on the substrate W in the process of cleaning the substrate W. Therefore, a decrease in the cleaning effect caused by misalignment of the nozzles 71, 72 can be suppressed.

[0066] [Nozzle position adjustment device] (Second embodiment) 11 is a front view of a nozzle position adjustment device 110 according to the second embodiment. Components common to the nozzle position adjustment device 10 according to the first embodiment (see FIG. 6) are given the same reference numerals and description thereof will be omitted.

[0067] As shown in FIG. 11, the nozzle position adjustment device 110 includes a position confirmation plate 1 and one or more positioning mechanisms 102. The positioning mechanism 102 can be detachably attached to the nozzles 71 and 72. The positioning mechanism 102 extends from the nozzle to which it is attached toward the position confirmation plate 1.

[0068] The positioning mechanism 102 includes a holder 216 and a laser light source 217 (light source). The holder 216 includes an attachment portion 18 and a light source holding portion 219. The light source holding portion 219 extends from the tip of the attachment portion 18. An insertion hole 225 is formed in the light source holding portion 219. The insertion hole 225 opens in a tip surface 219a of the light source holding portion 219. The laser light source 217 can irradiate the first main surface 1a of the position confirmation plate 1 with laser light L through the opening of the insertion hole 225.

[0069] [Nozzle position adjustment method] (Second embodiment) An example of a method for adjusting the positions of the nozzles 71, 72 using the nozzle position adjustment device 110 will be described. The position confirmation plate 1 is placed on the substrate support part 51. The positioning mechanism 102 is attached to the first nozzle 71. Laser light L is irradiated from the laser light source 217 to the first main surface 1a of the position confirmation plate 1. The orientation of the first nozzle 71 is adjusted so that the laser light L is irradiated to a predetermined position on the position indication 11.

[0070] Similarly, in the case of the second nozzle 72, a positioning mechanism 102 is attached to the second nozzle 72, and laser light L is irradiated onto the position confirmation plate 1. The orientation of the second nozzle 72 is adjusted so that the laser light L is irradiated onto a predetermined position on the position indication 11. In this manner, the positions of the nozzles 71, 72 can be determined using the position indication 11 on the position confirmation plate 1.

[0071] [Effects of the nozzle position adjustment device and nozzle position adjustment method according to the embodiment] The nozzle position adjustment device 110 includes a position confirmation plate 1 and a positioning mechanism 102 extending toward the position confirmation plate 1. The positioning mechanism 102 can determine the positions of the nozzles 71, 72 using the position indicators 11. This allows the positions of the nozzles 71, 72 to be adjusted with high precision. Thus, the nozzles 71, 72 can spray the cleaning liquid onto accurate positions on the substrate W in the process of cleaning the substrate W. This allows a decrease in the cleaning effect caused by misalignment of the nozzles 71, 72 to be suppressed.

[0072] The positioning mechanism 102 includes a laser light source 217. Therefore, it is possible to position the nozzles 71, 72 using the laser light L. This makes it possible to easily adjust the positions of the nozzles 71, 72.

[0073] In the nozzle position adjustment method, the position of the nozzles 71, 72 is determined by the positioning mechanism 102 using the position indicators 11. Therefore, it is possible to accurately adjust the positions of the nozzles 71, 72. Therefore, the nozzles 71, 72 can spray the cleaning liquid onto an accurate position on the substrate W in the process of cleaning the substrate W.

[0074] The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention. 9 is rectangular, the shape of the position confirmation plate is not particularly limited, and may be, for example, circular.

[0075] The position confirmation plate 1 has a plurality of engagement recesses 13 formed therein, but the number of the engagement recesses is not particularly limited. The number of the engagement recesses may be one or more (any number equal to or greater than two). The position confirmation plate 1 has the engagement recesses 13 formed therein, but the position confirmation plate does not have to have any engagement recesses formed therein. The position indication 11 has lattice-like reference lines 11A, 11B, but the form is not particularly limited as long as the position of the tip of the rod 17 can be identified. The position indication may be formed, for example, by a plurality of dots arranged in the X and Y directions.

[0076] 11 uses a laser light source 217, but the light source is not particularly limited. As the light source, for example, a light emitting element such as a light emitting diode (LED) may be used.

[0077] In addition, within the scope of the spirit of the present invention, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate. [Explanation of symbols]

[0078] 1...position confirmation plate, 2,102...positioning mechanism, 10,110...nozzle position adjustment device, 11...position display, 11A...first reference line (reference line), 11B...second reference line (reference line), 13...engagement recess, 16...holder (nozzle position adjustment holder), 17...rod, 33a...tip, 51...substrate support portion, 71...first nozzle (nozzle), 72...second nozzle (nozzle), 50...substrate cleaning device, W...substrate

Claims

1. 1. A nozzle position adjustment device for use in a substrate cleaning apparatus including a substrate support part for supporting a substrate and a nozzle for spraying a cleaning liquid toward the substrate, a position confirmation plate having a position indication formed thereon and installed on the substrate support; a positioning mechanism extending from the nozzle toward the position confirmation plate; Equipped with the positioning mechanism uses the position indication to determine the position of the nozzle relative to the position confirmation plate; Nozzle position adjustment device.

2. the positioning mechanism includes a holder and a rod held by the holder so as to be extendable and contractible in a direction approaching and moving away from the position confirmation plate; determining a position of the nozzle based on a position of the tip of the rod relative to the position indicia; The nozzle position adjustment device according to claim 1.

3. One or more engagement recesses are formed in the position confirmation plate, The tip of the rod is engageable with the engagement recess, The positioning mechanism determines the position of the rod by engaging the tip with the engagement recess. The nozzle position adjustment device according to claim 2.

4. The position indication has a grid-like reference line, The engagement recess is formed at an intersection of the reference lines. The nozzle position adjustment device according to claim 3.

5. Prior to cleaning the substrate by a substrate cleaning apparatus including a substrate support portion for supporting the substrate and a nozzle for spraying a cleaning liquid toward the substrate, a position confirmation plate having a position indication written thereon is provided on the substrate support portion; determining a position of the nozzle relative to the position confirmation plate using the position indicia by a positioning mechanism extending from the nozzle towards the position confirmation plate; How to adjust the nozzle position.

6. A nozzle position adjustment holder for use in a substrate cleaning apparatus including a substrate support part for supporting a substrate and a nozzle for spraying a cleaning liquid toward the substrate, a position confirmation plate having a position indication and installed on the substrate support part; and a positioning mechanism having a rod and extending from the nozzle toward the position confirmation plate, holding the rod so as to be extendable in a direction toward and away from the position confirmation plate; Holder for adjusting nozzle position.

Images