Reaction apparatus

Abstract

To provide a reaction apparatus capable of preventing the reaction apparatus from being unable to normally operate even if a reaction vessel deforms due to thermal expansion or thermal shrinkage.SOLUTION: A reaction apparatus 10A includes: a cylindrical reaction vessel 100 including an intermediate part A3 between a supply part and a delivery part; a temperature control part for controlling a temperature of the intermediate part; the supply part; the delivery part; and a transportation mechanism for transporting a processed product from a supply part side through the intermediate part to a delivery part side. The temperature control part controls a rate of temperature rise or a rate of temperature fall of the intermediate part so that a real displacement velocity of a specific part (E) of the reaction vessel follows a desirable displacement velocity of the specific part of the reaction vessel.SELECTED DRAWING: Figure 19

Description

[Technical field]

[0001] The present invention relates to a reactor. [Background technology]

[0002] There are reactors for producing desired products by providing a specific atmosphere to powdered or granular materials to be treated. For example, a reactor generally called a rotary kiln heats a hollow reaction vessel that rotates around a central axis, and produces the desired product by passing the material through the reaction vessel while rolling it. Another reactor, for example, called a roller hearth kiln, produces the desired product by passing the material or workpiece through a tunnel-shaped reaction vessel. Various other reactors have also been developed.

[0003] For example, Patent Document 1 discloses the following reaction apparatus. The reaction apparatus has a screw feeder body that serves as a pressure reaction vessel, a catalyst supplying section that introduces a catalyst into the screw feeder body, and a lower hydrocarbon supplying section that introduces lower hydrocarbons into the screw feeder body. The reaction apparatus also has a screw that transports the generated nanocarbon, a solid delivery section that delivers the catalyst and nanocarbon transported by the screw, and a gas delivery section that delivers the generated hydrogen to the outside of the feeder body. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2006-290682 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in such a reaction apparatus, when the temperature of the reaction vessel is changed, the reaction vessel, the transport mechanism, etc. are deformed due to thermal expansion or thermal contraction, which hinders normal operation of the reaction apparatus.

[0006] Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0007] A reaction apparatus according to one embodiment includes a cylindrical reaction vessel including an intermediate section between a supply section and a discharge section, a temperature control section for controlling the temperature of the intermediate section, the supply section for supplying a material to be treated to the reaction vessel, the discharge section for discharging a product from the reaction vessel, and a transport mechanism for transporting the material to be treated from the supply section side of the reaction vessel through the intermediate section to the discharge section side of the reaction vessel, wherein the temperature control section controls the heating rate or cooling rate of the intermediate section until the temperature of the intermediate section reaches a target temperature, so that the actual displacement speed of a specific section of the reaction vessel follows the desired displacement speed of the specific section of the reaction vessel. Effect of the Invention

[0008] According to the present disclosure, a reaction apparatus can be provided that can prevent a reaction vessel, a transport mechanism, etc. from becoming unable to operate normally even if the reaction vessel, transport mechanism, etc. are deformed due to thermal expansion or contraction. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a side view of a reaction apparatus according to a first embodiment. [Diagram 2] FIG. 1 is a block diagram of a reaction apparatus according to a first embodiment. [Diagram 3] 1 is a flowchart of a process performed by a reaction device. [Figure 4] FIG. 11 is a side view of a reaction apparatus according to a second embodiment. [Diagram 5](a) A diagram showing a specific example 1 of supporting the other end side A2 of the reaction vessel 100 in a state movable in the direction of the major axis AX100 of the reaction vessel 100; (b) A diagram showing a specific example 2 of supporting the other end side A2 of the reaction vessel 100 in a state movable in the direction of the major axis AX100 of the reaction vessel 100; (c) A diagram showing a specific example 3 of supporting the other end side A2 of the reaction vessel 100 in a state movable in the direction of the major axis AX100 of the reaction vessel 100. [Figure 6] It is a structural example of rotatably supporting the reaction vessel 100. [Figure 7] It is a view seen from the direction of arrow AR2 in Fig. 5(a). [Figure 8] It is a schematic diagram of a specific example 4 of supporting the other end side A2 of the reaction vessel 100 in a state rotatable about the rotation axis AXV (vertical axis) in addition to the direction of the major axis AX100 of the reaction vessel 100. [Figure 9] It is an example of the biaxial reaction vessel 100A. [Figure 10] It is a schematic diagram of a specific example 5 of supporting the other end side A2 of the reaction vessel 100 in a state rotatable about the rotation axis AXV (vertical axis) and movable in the minor axis direction (see arrow AR6 in Fig. 10) in addition to the direction of the major axis AX100 of the reaction vessel 100. [Figure 11] (a) A diagram showing a state where the reaction vessel 100 is twisted; (b) A diagram showing a state where the reaction vessel 100 is tilted; (c) A diagram showing a state where the twist of the reaction vessel 100 is suppressed; (d) A diagram showing a state where the tilt of the reaction vessel 100 is suppressed. [Figure 12] It is a perspective view of the temperature control region 110. [Figure 13] It is a block diagram showing the electrical connection relationship between the heating units H1 to H4 and the temperature control unit 202. [Figure 14] (a) An example of the deformation pattern of the reaction vessel 100; (b) Another example of the deformation pattern of the reaction vessel 100. [Figure 15] It is a diagram for explaining the first problem (the problem when controlling the temperature (heating or cooling) of the reaction vessel 100). [Figure 16] (a) An example of stepwise cooling; (b) An example of stepwise heating. [Figure 17] 1 is a graph showing the relationship between temperature change C1 during heating and actual temperature change C2 of the reaction vessel 100 when the temperature of the reaction vessel 100 is controlled (heated) to a target temperature at a certain heating rate in the reaction apparatus 10 of Reference Example 2. [Figure 18] 1 is a flowchart showing a temperature increase process for increasing the temperature stepwise in the reaction apparatus 10 of Reference Example 2. [Figure 19] FIG. 1 is a schematic diagram of a reaction apparatus 10A according to a first embodiment. [Figure 20] FIG. 1 is a block diagram of a reaction apparatus 10A according to a first embodiment. [Figure 21] 1 is a graph showing the relationship between a desired displacement speed C3 of point E and an actual displacement speed C4 of point E when the reaction vessel 100 is subjected to temperature decreasing control (cooling control). [Figure 22] 1 is a flowchart of an operation example 1 of the reaction device 10A. [Figure 23] 4 is a flowchart of a temperature decreasing rate control process. [Figure 24] 11 is a flowchart of an operation example 2 of the reaction device 10A. [Diagram 25] 1 is a graph showing the relationship between a desired displacement speed V1 of point E and an actual displacement speed V2 of point E when the reaction vessel 100 is subjected to temperature increase control (heating control). [Figure 26] 4 is a flowchart of a temperature rise rate control process. [Figure 27] FIG. 11 is a block diagram of a reaction apparatus 10B according to a second embodiment. [Figure 28] 13 is a flowchart of an emergency processing example 1. [Figure 29] 13 is a flowchart of an emergency processing example 2. [Diagram 30] 13 is a flowchart of an emergency operation example 3. [Diagram 31] FIG. 11 is a block diagram of a reaction apparatus 10C according to a third embodiment. [Diagram 32] 4 is an example of a temperature control table stored in a storage unit 207. [Diagram 33] 1 is a flowchart of an operation example 1 of the reaction device 10C. [Diagram 34] 13 is a flowchart of an operation example 2 of the reaction device 10C. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The present invention will be described below through the embodiments of the invention, but the invention according to the claims is not limited to the following embodiments. In addition, not all of the configurations described in the embodiments are necessarily essential as means for solving the problems. For clarity of explanation, the following description and drawings are omitted and simplified as appropriate. In each drawing, the same elements are given the same reference numerals, and duplicate explanations are omitted as necessary.

[0011] <Reference example 1> The main configuration of the reaction apparatus according to Reference Example 1 will be described with reference to Fig. 1. Fig. 1 is a side view of the reaction apparatus 10 according to Reference Example 1. The reaction apparatus 10 shown in the figure is shown in a partially cut away state for ease of understanding.

[0012] The reaction apparatus 10 is an apparatus for producing a product by applying conditions such as a predetermined physical stimulus to a powder or granular material to be treated. The reaction apparatus 10 includes a cylindrical reaction vessel 100 (reactor), a supply section (supply port 101) for supplying the material to be treated R10 to the reaction vessel 100, an outlet section (outlet 102) for delivering the product from the reaction vessel 100, a transport mechanism 120 (e.g., a screw) for transporting the material to be treated R10 supplied to the reaction vessel 100 from the supply section of the reaction vessel 100 to the outlet section of the reaction vessel 100, a fluid supply section (first fluid inlet 131, first fluid outlet 132, first valve 134, etc.) for supplying a fluid that comes into contact with the transported material to the inside of the reaction vessel 100, and a temperature control section (a temperature sensor 136, a temperature sensor 138, a temperature sensor 139, a temperature sensor 140, a temperature sensor 141, a temperature sensor 142, a temperature sensor 143, a temperature sensor 144, a temperature sensor 145, a temperature sensor 146, a temperature sensor 147, a temperature sensor 148, a temperature sensor 149 ... 100 The device is provided with temperature control sections (temperature control area 110, etc.) that control different areas in different directions.

[0013] The physical stimulus is not particularly limited as long as it is a means used in the process of changing the processed material into the product. The physical stimulus is, for example, a temperature change such as heating or cooling. The physical stimulus is, for example, a stress transfer such as stirring, mixing, kneading, or pulverization. The physical stimulus is, for example, a reaction involving the transfer of electrons or radicals.

[0014] In the reaction device 10, the material to be treated R10 supplied to the reaction vessel 100 is heated while being transported to the outlet side of the reaction vessel 100 by the transport mechanism 120, and a predetermined fluid that comes into contact with the material to be treated R10 being transported is supplied into the reaction vessel 100, so that the material to be treated R10 (material to be treated) is continuously treated at a predetermined temperature. The material to be treated may be a solid, a fluid, or a mixture of both. In order to stir the material to be treated while transporting it, the reaction vessel 100 itself may be rotatable, or a transport mechanism 120 having a rotatable structure may be provided in the reaction vessel 100.

[0015] The type and state of the processed material or product are not particularly limited, and may be an inorganic material such as a metal oxide or metal sulfide containing lithium as one of its components, or an organic material such as a hydrocarbon or food. The processed material may be a solid such as a powder or granular material, or a fluid such as a liquid or gas.

[0016] The processed product may pass through an intermediate in the process of changing into the product. The form or state of the intermediate is not particularly limited. The intermediate may be, for example, a product in each reaction when two or more reactions are carried out stepwise. In that case, the intermediate is, for example, an anhydrous compound produced by heating a hydrated compound. Alternatively, the intermediate may be a monosaccharide produced by hydrolysis of a polysaccharide. The intermediate may be a fired body in which at least a part of the processed product has grown into grains or been sintered. The intermediate may be in a state in which at least a part of the processed product has been liquefied or vaporized. The intermediate may be in a state in which the temperature, hardness, etc. of the processed product have changed, although it does not appear to have changed. The intermediate may be in a form or state other than those described above.

[0017] The type and state of the product are not particularly limited, and the product may be a solid such as a powder or a fluid such as a liquid or gas. The product may be a mixture containing members other than the processed material, such as a catalyst or a transport auxiliary member. The product may be a mixture containing two or more compounds, such as a main product and a by-product.

[0018] The shape and size of the processed material or product are not particularly limited, but when the processed material or product is a powder or granular material, the particle size is preferably 50 mm or less, more preferably 0.005 to 20 mm. Furthermore, when the processed material or product is in the form of a lump, the ratio of the diagonal lengths (aspect ratio) is preferably 1 to 10, more preferably 1.3 to 1.8.

[0019] The reaction apparatus 10 mainly comprises a reaction vessel 100, a temperature control area 110, a transport mechanism 120, a first fluid control area 130, and a second fluid control area 140.

[0020] The reaction vessel 100 is, for example, cylindrical, and has a supply port 101 for receiving the material to be treated and a delivery port 102 for delivering the product. The supply port 101 is an example of a supply unit of the present disclosure. The shape and configuration of the reaction vessel 100 are not particularly limited. For example, the cross-sectional shape of the reaction vessel 100 may be circular or elliptical, or may be polygonal such as a square, or may be other shapes. For example, the reaction vessel 100 may be composed of one member, or may be composed of two or more members connected together. When two or more members are connected together, for example, a fastening means such as a bolt may be used at the point where the members are connected.

[0021] The reaction vessel 100 has an intermediate section A3 between the supply inlet 101 and the delivery outlet 102. The number and arrangement of the supply inlet 101, the delivery outlet 102, and the intermediate section A3 are not particularly limited. For example, two or more supply inlets 101 and delivery outlets 102 may be provided at each end of the intermediate section A3.

[0022] The supply port 101 may be located in the middle of the reaction vessel 100, and may have a middle section A3 and a delivery port 102 at both ends of the supply port 101. In this case, the material to be processed R10 may be supplied to the middle of the reaction vessel 100, and the product R11 may be delivered from one end side and the other end side of the reaction vessel 100, respectively. Furthermore, in this case, for example, a screw may be used as the conveying mechanism 120, and the direction of the helical convex part (spiral direction) on the screw may be reversed with the supply port 101 as the boundary, so that the material to be processed R10 may be branched and conveyed to one end side and the other end side of the reaction vessel 100, respectively, with the supply port 101 as the boundary. Alternatively, when the discharge port 102 is located in the middle of the reaction vessel 100 and the middle section A3 and the supply port 101 are provided at both ends of the discharge port 102, for example, a screw may be used as the conveying mechanism 120, and the direction of the helical convex part (spiral direction) on the screw may be reversed at the discharge port 102, for example, so that the product R11 is conveyed so as to be gathered from one end side and the other end side of the reaction vessel 100 at the discharge port 102. In this way, a means for conveying the material R10 to be processed, the product R11, etc. so as to diverge or gather in the conveying direction is desirable, for example, when a plurality of reaction devices 10 are connected in parallel.

[0023] The reaction vessel 100 is made of a material that can tolerate temperature changes occurring during the production of a product in the furnace, and contact with substances (such as materials to be processed) supplied to the furnace and substances (such as products) produced. The reaction vessel 100 and the transport mechanism 120 can be made of, for example, alloys, ceramics, carbon, and composite materials containing two or more of these. The alloys are metal members containing at least one of alloy elements such as nickel, cobalt, chromium, molybdenum, tungsten, tantalum, titanium, iron, copper, aluminum, silicon, boron, and carbon as components. The ceramics can include ceramic members such as oxides such as alumina and zirconia, carbides such as silicon carbide and titanium carbide, nitrides such as silicon nitride and titanium nitride, and borides such as chromium boride, as well as glass materials having at least a part of an amorphous structure. The carbon is a carbon member such as crystalline graphite and fiber-reinforced graphite.

[0024] The reaction apparatus 10 shown in FIG. 1 lies horizontally, has a supply port 101 at the upper left end of FIG. 1, and has an outlet port 102 at the lower right end. The reaction vessel 100 shown in FIG. 1 receives the material R10 to be treated from the supply port 101. The reaction vessel 10 conveys the material R10 received by the reaction vessel 100 from the supply port 101 (A1) of the reaction vessel 100 through the middle part A3 to the outlet port 102 (A2) of the reaction vessel 100 by a conveying mechanism 120 provided inside the reaction vessel 100. The reaction vessel 10 produces a product R11 from the material R10 to be treated by passing the material R10 through the middle part A3 of the reaction vessel 100. The reaction vessel 100 then outputs the produced product R11 from the outlet port 102.

[0025] The temperature control area 110 includes a temperature control device, i.e., a heating device or a cooling device, and controls the temperature of the reaction vessel at a predetermined position in the intermediate portion A3 between the supply port 101 and the delivery port 102. The temperature control area 110 and the like are an example of a temperature control portion of the present disclosure. The temperature control area 110 shown in FIG. 1 has a heating device surrounding the cylindrical reaction vessel 100 in the intermediate portion A3 of the reaction vessel 100. The heating device includes any heater capable of controlling temperature, such as a sheath heater, a coil heater, or a ceramic heater. The heating device performs heating in a range from room temperature to about 1000 degrees Celsius, for example. The temperature control area 110 may have a configuration in which the cylindrical reaction vessel 100 is divided and surrounded by a plurality of heating devices in the intermediate portion A3 of the reaction vessel 100. This allows different temperatures to be set individually in each of the upper, lower, left, and right portions around the reaction vessel 100, for example. In addition, the temperature of the intermediate portion A3 can be controlled for each different region in the short axis direction of the reaction vessel 100. The temperature control area 110 is arranged such that the axis AX of the transport mechanism 120 described later is fixed to each area of ​​the intermediate portion A3 of the reaction vessel 100. 120 For example, the temperature control region 110 can control the temperature change applied to the object to be treated R10 in the first fluid control region 130 and the second fluid control region 140 described below.

[0026] The temperature control area 110 may also include a control device for controlling a heating device or a cooling device. For example, the temperature control area 110 may have a thermometer for monitoring the temperature at a predetermined position of the reaction vessel 100. In addition, in the case where the heating device has a principle of heating by passing an electric current, the reaction vessel 100 may perform temperature control by monitoring the electric current value.

[0027] The temperature control area 110 may be configured to perform heating or cooling by circulating water or oil, for example. The temperature control area 110 may also be configured to perform cooling by using a Peltier element, for example. With the above-mentioned configuration, the temperature control area 110 is configured to perform heating or cooling by circulating water or oil, for example, by using a Peltier element, for example. 120 Various temperature distributions can be set along the directions.

[0028] As described above, the temperature control area 110 controls the temperature of the reaction vessel 100 (for example, the middle part A3) along the long axis AX 100 It is possible to control each of the different regions in the direction.

[0029] The conveying mechanism 120 conveys the material R10 supplied from the supply port 101 toward the discharge port 102 by extending, for example, from one end side A1 to the other end side A2 of the reaction vessel 100. The shape and conveying method of the conveying mechanism 120 of the present disclosure are not limited as long as it can convey raw materials, products, etc. The conveying mechanism 120 may be a screw provided inside the reaction vessel 100 so as to extend from one end side to the other end side of the reaction vessel 100. The conveying mechanism 120 may be a drum provided inside the reaction vessel 100 so as to extend from one end side to the other end side of the reaction vessel 100. The conveying mechanism 120 may be a belt conveyor provided inside the reaction vessel 100 so as to extend from one end side to the other end side of the reaction vessel 100. The conveying mechanism 120 may be a blower provided inside the reaction vessel 100. The conveying mechanism 120 may be a vibration generating device provided inside the reaction vessel 100. The transport mechanism 120 may be other than the above.

[0030] The size of the transport mechanism 120 is not particularly limited, and may be shorter than the overall length of the reaction vessel 100, for example. The material forming the transport mechanism 120 is not particularly limited, but it is desirable that the transport mechanism 120 is formed from a material that can tolerate temperature changes occurring during the production of a product, and contact with substances (such as processed materials) supplied into the vessel and substances (such as products) produced, similar to the reaction vessel 100. The transport mechanism may be formed from, for example, alloys, ceramics, carbon, and composite materials containing two or more of these materials.

[0031] 1 is an example of a screw mechanism, and a spiral convex portion 121 is formed around a main axis extending in the longitudinal direction of the reaction vessel 100. The convex portion 121 rotates while in contact with the material to be treated R10, whereby the conveying mechanism 120 conveys the material to be treated R10 from the supply port side to the delivery port side.

[0032] The shape of the convex portion 121 shown in FIG. 1 is an example, and the shape of the convex portion 121 is not limited to this. The convex portion 121 may have a different shape for each region of the reaction vessel 100. More specifically, for example, the pitch of the spiral of the convex portion 121 may change. The spiral shape of the convex portion 121 may be two-stranded instead of one-stranded. The convex portion 121 may have a portion that is not a spiral shape. The convex portion 121 may be provided in a direction in which the apex of the convex portion forms an angle of 90 degrees with respect to the long axis direction of the screw. Furthermore, the convex portion 121 may extend in a direction in which the angle forms an angle of 0 degrees with respect to the long axis direction of the screw. This allows the reaction device 10 to set the moving speed and behavior of the object present inside the reaction vessel 100 for each region. More specifically, for example, the reaction device 10 transports, stirs, mixes, retains, kneads, or crushes the object in the reaction vessel 100.

[0033] The transport mechanism 120 is supported by a shaft at both ends (one end side A1, the other end side A2) of the reaction vessel 100. The transport mechanism 120 illustrated in FIG. 1 is a screw, and is connected (coupled) to a drive device 150 at one end side B1. The drive device 150 is an example of a drive device for the transport mechanism 120 in the present disclosure. The drive device 150 includes a motor 151 provided on one end side of the reaction vessel 10, and a reducer 152 provided between the motor 151 and one end side A1 of the reaction vessel 100. The reducer 152 includes an input shaft coupled to the rotating shaft of the motor 151 and an output shaft coupled to one end side B1 of the transport mechanism 120, and reduces the rotation of the rotating shaft of the motor 151 and transmits it to the transport mechanism 120 to rotate the transport mechanism 120. The drive device 150 may be set to be capable of changing the rotation speed of the transport mechanism 120. In this case, the driving device 150 may be a motor with a variable rotation speed, or may be a combination of a motor with a fixed rotation speed and a reducer with a variable reduction ratio.

[0034] The first fluid control region 130 includes a first fluid inlet 131 and a first fluid outlet 132 for passing the first fluid through the reaction vessel 100 in a predetermined region in the intermediate section A3. The first fluid control region 130 is provided between the supply port 101 and the second fluid control region 140 in the reaction vessel 100. The first fluid inlet 131 is connected to a first fluid supply pipe 133, and supplies the first fluid supplied from the first fluid supply pipe 133 to the reaction vessel 100. The first fluid supply pipe 133 includes a first valve 134 for adjusting the flow rate of the first fluid. The first fluid supply pipe 133 may also supply the first fluid to the reaction vessel 100 intermittently while controlling the time by opening and closing the first valve 134. The first fluid outlet 132 connected to the first fluid discharge pipe 135 is a hole for discharging the fluid in the first fluid control region 130 to the outside of the reaction vessel 100. The first fluid discharge pipe 135 may be provided with a valve or discharge mechanism for adjusting the flow rate or flow speed of the fluid discharged from the reaction vessel 100. The discharge mechanism is, for example, a suction mechanism such as a pump or an ejector using the Venturi effect. A plurality of first fluid inlets 131 and first fluid outlets 132 may be provided. In the first fluid control region 130, the locations where the first fluid inlets 131 and first fluid outlets 132 are provided are not particularly limited, and they may be provided at the top, bottom, or side of the reaction vessel 100. In addition, the first fluid inlet 131 may be provided at the bottom of the reaction vessel 100 and the first fluid outlet 132 may be provided at the top of the reaction vessel 100 to generate an airflow in a predetermined direction in the reaction vessel. In this way, the first fluid is easily brought into contact with the treatment object, and the reaction of the treatment object can be suitably carried out. Moreover, by making the inner diameter of the first fluid inlet 131 smaller than the inner diameter of the first fluid supply pipe 133, the first fluid may be vaporized when it is supplied to the reaction vessel 100. In this way, the temperature of the atmosphere around the object to be treated can be adjusted by the heat of vaporization, and the reaction of the object to be treated can be suitably controlled.

[0035] With the above-mentioned configuration, the reaction device 10 makes the treatment product R10 into an intermediate by contacting the treatment product R10 with the first fluid in the first fluid control region 130. The reaction device 10 also discharges the fluid after contacting the treatment product R10 to the outside of the first fluid control region 130. The reaction device 10 can promote the reaction by the first fluid by transporting the treatment product R10 or the intermediate product while the transport mechanism 120 rotates and further contacting the first fluid. The form and composition of the first fluid are not limited as long as it has fluidity. The first fluid may be a gas or a liquid. The first fluid may be a dispersion liquid in which a solid is dispersed in a liquid. The temperature of the reaction vessel 100 and the transport mechanism 120 can be partially controlled by supplying the first fluid to the reaction device 10. Therefore, the reaction device 10 can efficiently control the temperature of the treatment product R10 and efficiently turn the treatment product R10 into an intermediate product. Before the first fluid is supplied to the reaction vessel 100, a mechanism for adjusting the temperature and pressure of the first fluid may be provided.

[0036] The second fluid control region 140 includes a second fluid inlet 141 and a second fluid outlet 142 for passing a second fluid in a region in the intermediate portion A3 different from the first fluid control region 130. That is, the second fluid control region 140 can have a configuration equivalent to that of the first fluid control region 130 in a region different from the first fluid control region 130.

[0037] The second fluid control region 140 is provided between the first fluid control region 130 and the delivery port 102 in the reaction vessel 100. The second fluid inlet 141 is connected to a second fluid supply pipe 143, and supplies the second fluid supplied from the second fluid supply pipe 143 to the reaction vessel 100. The second fluid supply pipe 143 includes a second valve 144 for adjusting the flow rate of the second fluid. The second fluid supply pipe 143 may supply the second fluid while controlling the time timing of supplying the second fluid to the reaction vessel 100 to be an intermittent interval by opening and closing the second valve 144. The second fluid outlet 142 connected to the second fluid discharge pipe 145 is a hole for discharging the fluid in the second fluid control region 140 to the outside of the reaction vessel 100. The second fluid discharge pipe 145 may include a valve or discharge mechanism for adjusting the flow rate or flow speed of the fluid discharged from the reaction vessel 100. The discharge mechanism is, for example, a suction mechanism such as a pump or an ejector. The first fluid inlet 131, the first fluid outlet 132, and the first valve 134 are an example of a fluid supply unit of the present disclosure.

[0038] With the above-mentioned configuration, the reaction device 10 contacts the intermediate after passing through the first fluid control region 130 with the second fluid in the second fluid control region 140 to generate the product R11. The reaction device 10 also discharges the fluid after contacting the intermediate to the outside of the second fluid control region 140. The form and composition of the second fluid are not limited as long as it has fluidity. The second fluid may be a gas or a liquid. The second fluid may be a dispersion liquid in which a solid is dispersed in a liquid. In addition, by supplying the second fluid to the reaction device 10, the temperature of the reaction vessel 100 and the transport mechanism 120 can be partially controlled. Therefore, the reaction device 10 can efficiently control the temperature of the intermediate, and can efficiently convert the intermediate into the product R11.

[0039] Although the configuration of the reaction device 10 has been described above, the reaction device 10 according to Reference Example 1 is not limited to the above configuration. For example, the number of transport mechanisms 120 is one or more, and may be two or more. That is, the reaction device 10 may have a plurality of transport mechanisms 120 arranged in parallel.

[0040] The cross-sectional shape of the reaction vessel 100 in a plane perpendicular to the axis of the transport mechanism 120 may have a combination defined by a Reuleaux constant width figure. In this case, the transport mechanism 120 is preferably a screw, and the cross-sectional shape of the convex portion 121 of the screw has a shape combining multiple arcs corresponding to the Reuleaux constant width figure. For example, when the cross-sectional shape inside the reaction vessel 100 is circular, the cross-sectional shape of the screw may have a Reuleaux constant width figure composed of three arcs.

[0041] The reaction vessel 100 is not limited to one lying parallel to the horizontal direction, but may have a predetermined angle with respect to the horizontal plane, and the reaction vessel 100 may have an inclined surface. The reaction device 10 has the first fluid control region 130 and the second fluid control region 140 in the intermediate section A3, but may also have a configuration for passing another fluid. That is, the reaction device 10 may have three or more fluid control regions. Alternatively, the reaction device 10 may have only the first fluid control region 130 in the intermediate section A3. The reaction device 10 is controlled by a control device described later.

[0042] Next, the function of the reaction device 10 will be described with reference to Fig. 2. Fig. 2 is a block diagram of the reaction device 10 according to Reference Example 1. In addition to the configuration shown in Fig. 1, the reaction device 10 has a control device 200, a temperature control device 210, a first fluid control device 230, a second fluid control device 240, and an information input / output device 250 (information input / output unit 250).

[0043] The control device 200 is a circuit board including a calculation device such as a CPU (Central Processing Unit) and an MCU (Micro Controller Unit). The control device 200 is communicatively connected to each of the temperature control device 210, the first fluid control device 230, the second fluid control device 240, and the information input / output unit 250, and controls the configuration of each of these. The control device 200 realizes its functions by hardware and software implemented on the circuit board.

[0044] The control device 200 has, as its main functional components, an overall control unit 201, a temperature control unit 202, a transport control unit 203, a first fluid control unit 204, a second fluid control unit 205, an IF control unit 206, and a memory unit 207. These functional components of the control device 200 may be integrated or may be discrete. Furthermore, these functional components of the control device 200 may be realized by interlocking a plurality of separate devices.

[0045] The overall control unit 201 is connected to each functional configuration of the control device 200 and controls the overall operation of these functions. For example, the overall control unit 201 can perform an operation such as issuing an operation instruction to the transport control unit 203 depending on the state of the temperature supplied from the temperature control unit 202.

[0046] The temperature control section 202 is connected to the temperature control device 210 and controls the temperature of the reaction vessel 100 in the temperature control area 110. The temperature control section 202 has at least one of a heating device and a cooling device. The temperature control section 202 may also have one or more thermometers for controlling the temperature.

[0047] The transport control unit 203 is connected to the driving device 150 and controls the operation of the driving device 150. The transport control unit 203 may have, for example, a motor driving circuit for driving a motor (motor 151) included in the driving device 150. The transport control unit 203 may also have a rotation sensor for monitoring the number of rotations of the motor (motor 151).

[0048] The first fluid control section 204 controls the flow of the first fluid in the first fluid control region 130. More specifically, the first fluid control section 204 is connected to the first fluid control device 230 and controls the operation of the first fluid control device 230. The first fluid control device 230 includes a first valve 134 for pumping the first fluid. The second fluid control section 205 controls the flow of the second fluid in the second fluid control region 140. More specifically, the second fluid control section 205 is connected to the second fluid control device 240 and controls the operation of the second fluid control device 240. The second fluid control device 240 includes a second valve 144 for pumping the second fluid.

[0049] The IF control unit 206 (IF = Interface) is an interface that is connected to the information input / output unit 250 and exchanges information with the user via the information input / output unit 250. That is, the IF control unit 206 accepts operations from the user via the information input / output unit 250 and appropriately supplies information related to the accepted operations to each component of the control device 200. The IF control unit 206 also controls the state of a display unit that the information input / output unit 250 has.

[0050] The storage unit 207 is a storage device including a non-volatile memory such as a flash memory or an SSD (Solid State Drive). The storage unit 207 stores a program for the reaction device 10 to realize the functions of the present disclosure. The storage unit 207 also includes a volatile memory, and temporarily stores predetermined information when the control device 200 operates. The information input / output unit 250 has, for example, a button, a switch, or a touch panel for accepting an operation from a user. The information input / output unit 250 also includes a display device for presenting information to a user.

[0051] The above describes the functional blocks of the reaction apparatus 10. With the above-mentioned configuration, the reaction apparatus 10 transports the received treatment object R10 using the transport mechanism 120, controls the temperature of the reaction vessel 100, and controls the atmosphere in the first fluid control region 130 and the second fluid control region 140.

[0052] Next, a method for producing the product R11 (product production method) executed by the reaction device 10 will be described with reference to Fig. 3. Fig. 3 is a flowchart of the process executed by the reaction device 10. The flowchart shown in Fig. 3 starts, for example, by starting the supply of the product R10 to be treated to the reaction device 10.

[0053] First, the reaction device 10 receives a predetermined material to be treated R10 from the supply port 101 (step S11).

[0054] Next, the control device 200 of the reaction device 10 controls the temperature by driving the heating device or the cooling device of the temperature control region 110 of the reaction vessel 100 via the temperature control section 202 (step S12).

[0055] Next, the control device 200 of the reaction device 10 drives the driving device 150 via the transport control unit 203. As a result, the driving device 150 drives the transport mechanism 120. Then, the transport mechanism 120 transports the received object to be processed R10 toward the outlet 102 (step S13).

[0056] Next, the control device 200 of the reaction device 10 controls the flow of the first fluid passed through the first fluid control region 130 (first atmosphere control region) via the first fluid control unit 204 (step S14).

[0057] Next, the control device 200 of the reaction device 10 controls the flow of the second fluid passed through the second fluid control region 140 (second atmosphere control region) via the second fluid control section 205 (step S15).

[0058] Next, the reaction device 10 discharges the product R11 that has passed through the second fluid control region 140 from the discharge port 102 (step S16).

[0059] The above describes the reaction method (product production method) executed by the reaction apparatus 10. The above-mentioned method is shown along the flow from when the reaction apparatus 10 produces the product R11 from the treated material R10 to when the produced product R11 is discharged. However, the reaction apparatus 10 may perform the temperature control in step S12, for example, before step S11. Also, for example, the reaction apparatus 10 may start step S14 and step S15 simultaneously.

[0060] Reference Example 1 has been described above. In the above-mentioned reaction device 10, the reaction device 10 has two fluid control regions (the first fluid control region 130 and the second fluid control region 140), but the reaction device 10 may have one or three or more fluid control regions. In addition, the reaction device 10 has an axis AX120 The reactor 10 may have a plurality of temperature control regions 110 along the direction (longitudinal direction). The above-mentioned reactor 10 brings a plurality of fluids into contact with the object to be treated R10 received from the supply port 101 in the intermediate section A3. In addition, the reactor 10 has a plurality of fluids in contact with the object to be treated R10 in the intermediate section A3 along the axis AX of the transport mechanism 120. 120 The temperature of the reaction vessel 100 is controlled along the longitudinal direction (longitudinal direction). Furthermore, the reaction device 10 can transport an object inside the reaction vessel 100 and provide a physical stimulus to it. The reaction device 10 can simultaneously and accurately perform the above-mentioned atmosphere control, temperature control, and physical control. Therefore, according to Reference Example 1, a reaction device or the like that efficiently produces a desired product can be provided.

[0061] <Reference example 2> Next, as Reference Example 2, a configuration example for supporting the reaction vessel 100 and a configuration example for supporting the transport mechanism 120 will be described with reference to Fig. 4. This configuration example can be applied to the above-mentioned Reference Example 2. Fig. 4 is a side view of a reaction apparatus according to Reference Example 2. Fig. 4 corresponds to Fig. 1 to which a first support part 103 and a second support part 104 are added. Other than that, the configuration is the same as Fig. 1. Below, the differences from Reference Example 1 will be mainly described.

[0062] <Example of a configuration for supporting the reaction vessel 100> As shown in Fig. 4, the reaction apparatus 10 includes a first support part 103 and a second support part 104 as a structure for supporting the reaction vessel 100. The reaction vessel 100 in Fig. 4 is a cylindrical reaction vessel (furnace) including an intermediate part A3 between one end side A1 and the other end side A2, and is supported by the first support part 103 and the second support part 104 installed on a floor surface 170. The floor surface 170 may be the floor surface of a building in which the reaction apparatus 10 is installed, or may be a surface of a part of a structure constituting the reaction apparatus 10, such as the upper surface of a stand.

[0063] The first support portion 103 is disposed on a floor surface 170 below one end side A1 of the reaction vessel 100, and supports one end side A1 of the reaction vessel 100 from below. Specifically, the first support portion 103 supports one end side A1 of the reaction vessel 100 from the bottom side. 100 The reaction vessel 100 is supported in a state where it cannot move in the direction. This is realized, for example, by fixing one end side A1 of the reaction vessel 100 supported by the first support part 103 to the first support part 103 by a direct fixing means such as a bolt or welding. Alternatively, without being limited to a direct fixing means, for example, the reaction vessel 100 may be indirectly fixed by contacting one end side A1 of the reaction vessel 100 supported by the first support part 103 with a member such as a plate material or wire material separately fixed to a stand or the like.

[0064] On the other hand, the second support part 104 is disposed on a floor surface 170 below the other end side A2 of the reaction vessel 100, and supports the other end side A2 of the reaction vessel 100 from below. 100 This is realized, for example, by specific examples 1 to 3 described later.

[0065] The other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 The technical significance of supporting the device in a state in which it can move in the direction is as follows.

[0066] That is, when the temperature of the reaction vessel 100 is controlled by the temperature control device 210 or the like as described in the above-mentioned Reference Example 1 (for example, when it is heated from room temperature to about 900 degrees), the reaction vessel 100 moves along its long axis AX 100 thermal expansion along the major axis AX 100 In this case, if the other end A2 of the reaction vessel 100 is parallel to the longitudinal axis AX 100 When the reaction vessel 100 is immobilized in the long axis AX 100Thermal expansion in the direction of the axis ...

[0067] Therefore, the reaction vessel 100 has a long axis AX 100 In order to prevent the driving device 150 from being damaged due to thermal expansion in the direction of the axis of the reaction vessel 100, the second support portion 104 supports the other end A2 of the reaction vessel 100 in the direction of the long axis AX of the reaction vessel 100. 100 The support is supported in a state in which it can move in the direction.

[0068] Next, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 A specific example of supporting the object in a state where the object can move in the direction will be described.

[0069] <Example 1> FIG. 5(a) shows the other end A2 of the reaction vessel 100 along the long axis AX 100 5(a) is a view seen from the direction of arrow AR1 in FIG.

[0070] As shown in FIG. 5(a), in the first specific example, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In this example, in order to allow the reaction vessel 100 to move in the axial direction, a flange portion 109 is provided on the other end side A2 of the reaction vessel 100, a recess 109a is formed in the lower part of the flange portion 109, and a protrusion 104a that is inserted into the recess 109a is provided on the upper part of the second support portion 104, and the other end side A2 of the reaction vessel 100 is supported with the protrusion 104a inserted into the recess 109a. 100The recess 109a extends in the direction of the groove 106. A gap G1 is formed between the lower surface 109b of the flange portion 109 and the upper surface 104b of the second support portion 104. A lubricant or the like may be supplied between the recess 109a and the protrusion 104a. Conversely, the protrusion 104a may be provided on the lower part of the flange portion 109, and the recess 109a into which the protrusion 104a is inserted may be formed on the upper part of the second support portion 104.

[0071] <Example 2> FIG. 5(b) shows the other end A2 of the reaction vessel 100 along the long axis AX 100 5(b) is a view seen from the direction of arrow AR1 in FIG.

[0072] As shown in FIG. 5(b), in the second example, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100In this example, in order to allow the reaction vessel 100 to move in the direction, a flange portion 109 is provided on the other end side A2 of the reaction vessel 100, a friction reduction member 111 is provided on the upper surface 104b of the second support portion 104, and the other end side A2 of the reaction vessel 100 is supported with the lower surface 109b of the flange portion 109 in contact with the friction reduction member 111. The form, shape, and material of the friction reduction member 111 are not particularly limited as long as it is a member that smoothly moves the reaction vessel 100. The friction reduction member 111 may be a member having a rotating part such as a roller or a belt. The friction reduction member 111 may be a member made of a high hardness material having a Vickers hardness (HV) of 450 or more or a Rockwell hardness (HRC) of 45 or more on the surface where the friction reduction member 111 supports the reaction vessel 100, such as a tool steel material that can be subjected to a quenching heat treatment, a nitriding steel material that can be subjected to a nitriding heat treatment, a powder metallurgy material that contains ceramic particles at least in a part, or a steel material with a coating applied to the surface. The friction reducing member 111 may be a member whose surface is coated with, for example, diamond-like carbon (DLC), titanium carbide (TiC), titanium carbonitride (TiBN), titanium boride (TiB2), vanadium carbide (VC), alumina (Al2O3), zirconia (ZrO2), or the like by a film forming means such as CVD, PVD, or thermal spraying. The friction reducing member 111 may be a member whose surface is coated with chrome plating or nickel plating (Ni-P or Ni-Co-W) by electroplating or electroless plating. The friction reducing member 111 may be a member whose surface is coated with a compound having solid lubricity such as molybdenum disulfide by a coating means such as a spray. In other words, the chemical composition of the surface (support surface) on which the friction reducing member 111 supports the reaction vessel 100 preferably contains at least one of the elements (chemical elements) of B, C, N, Al, P, Ti, V, Cr, Co, Ni, Mo, and W.

[0073] <Example 3> FIG. 5(c) shows the other end A2 of the reaction vessel 100, which is aligned along the long axis AX 100 5(c) is a view seen from the direction of arrow AR1 in FIG.

[0074] As shown in FIG. 5(c), in the third embodiment, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In order to make the reaction vessel 100 movable in the axial direction, a flange portion 109 having protruding portions 109c and 109d protruding on both the left and right sides (protruding in a direction intersecting (for example, perpendicular to) the long axis of the reaction vessel 100) is provided on the other end side A2 of the reaction vessel 100, and standing portions 104c and 104d are provided on the upper surface 104b of the second support portion 104, and the other end side A2 of the reaction vessel 100 is supported in a state in which the protruding portions 109c and 109d are placed on the standing portions 104c and 104d. A gap G2 is formed between the lower surface 109b of the flange portion 109 and the upper surface 104b of the second support portion 104, and gaps G3 and G4 are formed between the left and right sides of the flange portion 109 and the standing portions 104c and 104d. Lubricating oil or the like may be supplied between the protruding portions 109c and 109d and the standing portions 104c and 104d.

[0075] As in the above specific examples 1 to 3, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 The reaction vessel 100 is supported in a movable state along its long axis AX. 100 This can prevent the drive device 150 from being damaged or the like due to a force acting on the drive device 150 caused by thermal expansion (or thermal contraction) in the direction.

[0076] <Example of configuration for supporting the transport mechanism 120> As shown in FIG. 4, the reaction apparatus 10 includes bearings 106 and 107 as a structure for supporting the screw serving as the transport mechanism 120.

[0077] The bearing 106 is provided at one end side A1 of the reaction vessel 100, and rotatably supports one end side B1 of the transport mechanism 120. The bearing 106 is, for example, a bearing or a bush. The one end side B1 of the transport mechanism 120 is connected (fixed) to the output shaft of the reducer 152. That is, the one end side B1 of the transport mechanism 120 is rotatable and is connected to the axis AX of the transport mechanism 120. 120 The actuator is supported in such a way that it cannot move in any direction.

[0078] On the other hand, the bearing 107 is provided on the other end side A2 of the reaction vessel 100, and is capable of rotating the other end side B2 of the transport mechanism 120 and is connected to the axis AX 120 The bearing 107 is an example of a third support portion and a sixth support portion of the present disclosure. The bearing 107 is, for example, a bearing or a bush. The other end B2 of the transport mechanism 120 is supported by the axis AX of the transport mechanism 120. 120 In order to allow the transport mechanism 120 to move in the direction of the axis AX of the transport mechanism 120, a predetermined range (see the range indicated by the symbol L1 in FIG. 4) of the other end side B2 of the transport mechanism 120 is not provided with a spiral convex portion 121. In addition, between the end of the other end side B2 of the transport mechanism 120 and the lid portion 108 provided on the other end side A2 of the reaction vessel 100, 120 4) into which the other end B2 of the transport mechanism 120 moving in the forward direction (rightward in FIG. 4) enters (see the range indicated by the symbol L2 in FIG. 4).

[0079] The axis AX of the transfer mechanism 120 supported as described above 120 and the long axis AX of the reaction vessel 100 100 are consistent (almost consistent).

[0080] The other end B2 of the transport mechanism 120 is connected to the axis AX 120 The technical significance of supporting the device in a state in which it can move in the direction is as follows.

[0081] That is, when the temperature of the reaction vessel 100 is controlled by the temperature control device 210 or the like as described in the above-mentioned Reference Example 1 (for example, when the reaction vessel 100 is heated from room temperature to about 900 degrees Celsius), the reaction vessel 100 rotates along its long axis AX 100 thermal expansion along the major axis AX 100 (The transfer mechanism 120 also thermally expands in the direction of its axis AX.) 120 Thermal expansion in the direction (for example, axis AX 120 In this case, if the other end B2 of the transport mechanism 120 is aligned along the axis AX 120 When the transport mechanism 120 is unable to move in the axis AX 120The transport mechanism 120 may be deformed due to thermal expansion in the direction, and the spiral convex portion 121 of the deformed transport mechanism 120 may come into contact with the inner wall of the reaction vessel 100, which may cause the transport mechanism 120 to become unable to rotate normally.

[0082] In addition, one end side B1 of the transport mechanism 120 is connected to the axis AX 120 The other end B2 of the transport mechanism 120 is set to a state in which it can move in the direction of the axis AX 120 If the reaction vessel 100 is unable to move in the direction, the other end side B2 of the conveying mechanism 120 will move due to thermal expansion and contraction of the reaction vessel 100, making it difficult to control the positions of the convex and concave portions of the screw, which may result in the material to be treated not being able to react normally.

[0083] Therefore, the transport mechanism 120 is connected to the axis AX 120 In order to prevent the conveying mechanism 120 from being deformed due to thermal expansion in the direction, the bearing 107 supports the other end B2 of the conveying mechanism 120 so as to be rotatable and to be supported by the axis AX 120 The support is supported in a state in which it can move in the direction.

[0084] As described above, the other end side B2 of the transport mechanism 120 is rotatable, and the axis AX 120 The transport mechanism 120 is supported in a state in which it can move in the axis AX 120 Therefore, deformation of the transport mechanism 120 due to thermal expansion in the direction can be prevented.

[0085] As described above, according to the second embodiment, the reaction vessel 100 is arranged along its major axis AX 100 It is possible to provide a reaction device 10 capable of preventing a malfunction caused by thermal expansion in the vertical direction.

[0086] Next, a modified example will be described.

[0087] In the above-mentioned Reference Example 2, an example in which the reaction vessel 100 is supported so as not to be rotatable has been described, but the present invention is not limited to this. For example, a reaction vessel 100 supported so as to be rotatable may be used.

[0088] FIG. 6 shows an example of a configuration for supporting the reaction vessel 100 so that it can rotate.

[0089] As shown in FIG. 6, the reaction apparatus 10 of this modified example includes bearings 112 and 113 as a structure for supporting the reaction vessel 100 so that the reaction vessel 100 is rotatable.

[0090] The bearing 112 is provided between the one end side A1 of the reaction vessel 100 and the first support portion 103, and is capable of rotating the one end side A1 of the reaction vessel 100 and is aligned with the long axis AX of the reaction vessel 100. 100 The reaction vessel 100 is supported in a state where it cannot move in the longitudinal direction. The bearing 112 is, for example, a bearing or a bush. A flange portion 114 is provided on one end side A1 of the reaction vessel 100. When this flange portion 114 comes into contact with the bearing 112, the one end side A1 of the reaction vessel 100 is supported in a state where it cannot move in the longitudinal direction. 100 6. A plurality of flanges 114 and bearings 112 may be provided. For example, two bearings 112 are used for one flange 114, and the flange 114 is sandwiched between the bearings 112, so that one end side A1 of the reaction vessel 100 is prevented from moving in the long axis AX of the reaction vessel 100. 100 The bearing 112 may be an annular bearing or bushing into which the one end side A1 of the reaction vessel 100 is inserted, or may be an arc-shaped bearing or bushing with a portion of the annular bearing or bushing cut out. Instead of the bearing 112, a member made of a lubricating material may be used to rotate the one end side A1 of the reaction vessel 100 and move in the longitudinal direction of the long axis AX of the reaction vessel 100. 100 The bearing 112 and the flange portion 114 are an example of a fourth support portion of the present disclosure.

[0091] On the other hand, the bearing 113 is provided between the other end side A2 of the reaction vessel 100 and the second support part 104, and is capable of rotating the other end side A2 of the reaction vessel 100 and supporting the long axis AX of the reaction vessel 100. 100The bearing 113 is, for example, a bearing or a bush. The bearing 113 may be an annular bearing or bush into which the other end side A2 of the reaction vessel 100 is inserted, or may be an arc-shaped bearing or bush with a portion of the annular bearing or bush cut out. Instead of the bearing 113, a member made of a lubricating material may be used to rotate the other end side A2 of the reaction vessel 100 and move in the longitudinal direction of the long axis AX of the reaction vessel 100. 100 The reaction vessel 100 may be supported in a state in which it can move in the direction. The bearing 113 is an example of a fifth support portion of the present disclosure. The reaction vessel 100 supported rotatably in this modification is connected (coupled) at one end side A1 to a reaction vessel driving device 116 (not shown in FIG. 6) similar to the driving device 150 (screw driving device).

[0092] When using a configuration in which the reaction vessel 100 is rotatably supported as in this modified example, a rotatably supported transport mechanism 120 (see FIG. 4) may be used, or a non-rotatably supported transport mechanism 120 (not shown) may be used instead of the rotatably supported transport mechanism 120. Also, the transport mechanism 120 may be omitted.

[0093] In the above-mentioned reference example 2, the first support part is the first support part 103 that supports the one end side A1 of the reaction vessel 100 from below. However, the present invention is not limited to this. That is, the first support part supports the one end side A1 of the reaction vessel 100 from below along its long axis AX 100 Any configuration may be used as the first support as long as it supports the reaction vessel 100 in a state where it cannot move in the direction. For example, although not shown, the first support may be a first support that supports one end side A1 of the reaction vessel 100 in a manner of suspending it from above, or a first support that supports one end side A1 of the reaction vessel 100 from the side.

[0094] In the above-mentioned reference example 2, an example was described in which the second support part 104 was a support part that supports the other end side A2 of the reaction vessel 100 from below, but this is not limited thereto. 100Any configuration of the support part may be used as long as it supports the reaction vessel 100 in a state where it can move in the direction. For example, although not shown, the second support part may be a second support part that supports the other end side A2 of the reaction vessel 100 in a manner of suspending it from above, or a second support part that supports the other end side A2 of the reaction vessel 100 from the side.

[0095] In the above-mentioned reference example, as shown in FIG. 5(a) and FIG. 7, the second support portion 104 supports the other end side A2 of the reaction vessel 100 along the long axis AX of the reaction vessel 100. 100 7 is a view seen from the direction of the arrow AR2 in FIG. 5(a). For example, the other end A2 of the reaction vessel 100 is supported in a state where it can move only in the long axis AX of the reaction vessel 100. 100 In addition to the direction, the axis of rotation AX V It may be supported in a rotatable state around a vertical axis.

[0096] Next, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In addition to the direction, the axis of rotation AX V A fourth concrete example will be described, in which the object is supported in a rotatable state around a (vertical axis).

[0097] <Example 4> FIG. 8 shows the other end A2 of the reaction vessel 100 along the long axis AX 100 In addition to the direction, the axis of rotation AX V FIG. 11 is a schematic diagram of a fourth specific example in which the actuator is supported in a rotatable state around a vertical axis.

[0098] As shown in FIG. 8, the protrusion 104a is connected to the rotation axis AX via a bearing or the like. V The rotation axis AX is a vertical axis. V 8. In this way, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In addition to the direction, the axis of rotation AX V It is supported in a rotatable manner around a vertical axis.

[0099] In this way, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In addition to the direction, the axis of rotation AX V The advantages of supporting the device in a rotatable state around a vertical axis are as follows:

[0100] That is, depending on the state of the reaction (state of the physical stimulus), the longitudinal axis AX of the reaction vessel 100 in FIG. 100 In this case, a temperature difference may occur between the left and right sides of the reaction vessel 100. 100 A phenomenon occurs in which the amount of stretching differs between the left and right sides.

[0101] For example, in FIG. 7, the long axis AX 100 When the temperature on the right side is higher and the temperature on the left side is lower, the longitudinal axis AX 100 The right side stretches more and the left side stretches less. The lengths of the arrows AR3 and AR4 in Figure 7 represent this.

[0102] As described above, the long axis AX of the reaction vessel 100 100 If the left and right sides are stretched by different amounts, horizontal stress (see arrow AR5 in FIG. 7) may be generated on the other end side A2 of the reaction vessel 100.

[0103] When this stress occurs, friction occurs between the second support portion 104 (the convex portion 104a) and the flange portion 109 (the concave portion 109a), causing the reaction vessel 100 (the other end side A2) to rotate around the long axis AX 100 There is a risk of directional movement being impeded.

[0104] Therefore, by adopting the configuration shown in FIG. 8, it becomes possible to appropriately respond to various physical stimulus situations.

[0105] In particular, when the state where a temperature difference is intentionally created between the left and right sides of the reaction vessel 100 is applied to a twin-screw type reaction vessel 100A (see FIG. 9), it is effective for controlling the reaction rate of the material to be treated. FIG. 9 shows an example of a twin-screw type reaction vessel 100A.

[0106] Next, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 A fifth concrete example will be described in which the support is movable in the minor axis direction (see arrow AR6 in FIG. 10) in addition to the minor axis direction.

[0107] <Example 5> FIG. 10 shows the other end A2 of the reaction vessel 100 along the long axis AX 100 10 is a schematic diagram of a fifth embodiment in which the support is movable in the short axis direction (see arrow AR6 in FIG. 10) in addition to the short axis direction.

[0108] As shown in FIG. 10, the protrusion 104a is connected to the rotation axis AX via a bearing or the like. V The base 104e is supported on the second support portion 104 (upper surface 104b) so as to be rotatable around the rotation axis AX (vertical axis). The base 104e is further supported on a guide rail 104f (supported on the second support portion 104 (upper surface 104b)) so as to be movable in the minor axis direction (see arrow AR6 in FIG. 10). V 10. In this way, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In addition to the direction, the rotation axis AX V The actuator is supported so as to be rotatable about a vertical axis and movable in a minor axis direction (see arrow AR6 in FIG. 10).

[0109] In this way, the other end A2 of the reaction vessel 100 is aligned along the long axis AX 100 In addition to the direction, the rotation axis AX V The advantages of supporting the actuator in a state in which it can rotate around the vertical axis and move in the minor axis direction (see arrow AR6 in FIG. 10) are as follows.

[0110] When the above stress (see arrow AR5 in FIG. 7) occurs, friction occurs between the second support portion 104 (projection portion 104a) and the flange portion 109 (recess 109a), causing the reaction vessel 100 (other end side A2) to rotate around the long axis AX 100 There is a risk of directional movement being impeded.

[0111] If the deformation becomes even larger (if the stress becomes even larger), the other end side A2 of the reaction vessel 100 may tilt (see FIG. 11(b)), and the reaction vessel 100 may twist (see FIG. 11(a)). FIG. 11(a) is a diagram showing the reaction vessel 100 in a twisted state, and FIG. 11(b) is a diagram showing the reaction vessel 100 in a tilted state. Such twisting and tilting are likely to occur at the other end side A2 or the middle part A3.

[0112] Therefore, by adopting the configuration shown in Fig. 10, it becomes possible to suppress twisting of the reaction vessel 100 (see Fig. 11(c) and Fig. 11(d)). Fig. 11(c) is a diagram showing a state in which twisting of the reaction vessel 100 is suppressed, and Fig. 11(d) is a diagram showing a state in which tilting of the reaction vessel 100 is suppressed.

[0113] In the above-mentioned reference examples 1 and 2, the temperature control section (temperature control area 110, etc.) controls the temperature of the reaction vessel 100 along the long axis AX 100 Although an example in which control is performed for each of the regions having different directions has been described, the present invention is not limited to this. That is, the number of regions for which the temperature control section (temperature control region 110, etc.) controls the temperature is not limited to a plurality of regions, and may be one region.

[0114] In addition, in the above-mentioned Reference Examples 1 and 2, examples using the fluid supply unit (first fluid inlet 131, first fluid outlet 132, first valve 134, etc.) have been described, but the present invention is not limited to this. That is, a part or the whole of the fluid supply unit (first fluid inlet 131, first fluid outlet 132, first valve 134, etc.) may be omitted.

[0115] In the above-mentioned Reference Examples 1 and 2, the driving device 150 is provided at one end side A1 of the reaction vessel 100 and connected to one end side B1 of the transport mechanism 120 (e.g., a screw), but the present invention is not limited to this. Another driving device may be used as a device for driving the transport mechanism 120.

[0116] <Embodiment> <Specific example of temperature control area 110> First, a specific example of the temperature control region 110 common to the reaction apparatuses 10A, 10B, and 10C of the following embodiments 1 to 3 will be described.

[0117] FIG. 12 is a perspective view of the temperature control region 110.

[0118] As shown in FIG. 12, the temperature control region 110 is aligned along the longitudinal axis AX 100 The direction is divided into a total of three zones D1 to D3. Note that the number of zones is not limited to three, and the number of zones may be one, two, or four or more.

[0119] The zone D1 is arranged around the reaction vessel 100 along the long axis AX 100 The circumference (circumferential direction) is divided into four zones D11 to D14, one above, one below, one to one to one left, and one to one. The number of zones is not limited to four, and may be one to three or five or more. The same applies to zones D2 and D3.

[0120] In these four zones D11 to D14, a first heating section H1, a second heating section H2, a third heating section H3, and a fourth heating section H4 are arranged. In this manner, the heating sections H1 to H4 are arranged along the major axis AX of the reaction vessel 100 so as to surround the reaction vessel 100. 100 are placed around it.

[0121] As the heating parts H1 to H4, it is preferable to use heaters including electric heating wires (electric heaters) in consideration of temperature controllability.

[0122] Fig. 13 is a block diagram showing the electrical connection relationship between the heating units H1 to H4 and the temperature control unit 202. As shown in Fig. 13, each heater is electrically connected to the temperature control unit 202. Note that the heating units H1 to H4 are not limited to heaters and may be other heating means.

[0123] Although not shown, temperature measurement units are arranged in the four zones D11 to D14. For example, it is preferable to use a thermocouple as the temperature measurement unit. Each temperature measurement unit is electrically connected to the temperature control unit 202. Note that the temperature measurement unit is not limited to a thermocouple, and may be another temperature measurement unit (temperature sensor).

[0124] The temperature control unit 202 individually controls (e.g., PID control) the current passed through each heater (heat wire) to individually control the temperature of each of the multiple locations (12 locations) of the reaction vessel 100 (middle section A3) corresponding to each zone. At that time, the temperature control unit 202 refers to the temperature measured by each temperature measurement unit. For example, when the temperature control unit 202 controls the temperature of the location of the reaction vessel 100 corresponding to zone D11 by controlling the heater that is the first heating unit H1 of zone D11, the temperature control unit 202 refers to the temperature measured by the temperature measurement unit arranged in that zone D11. The same applies when controlling the other heaters that are the other heating units H2 to H4.

[0125] The position (target) measured by the temperature measuring unit may be a heater arranged in the zone in which the temperature measuring unit is arranged, a location in the reaction vessel 100 corresponding to the zone in which the temperature measuring unit is arranged, the space between the heater arranged in the zone in which the temperature measuring unit is arranged and the reaction vessel 100, or some other position (target).

[0126] As described above, in the reaction devices 10A, 10B, and 10C of the first to third embodiments described below, the temperature control area 110 is divided into a total of 12 zones (3×4), and the temperature of each of the multiple points (12 points) in the reaction vessel 100 (middle section A3) corresponding to each zone can be individually controlled. This allows the reaction of the raw materials to be more suitably carried out in the reaction devices 10A, 10B, and 10C.

[0127] <Deformation of reaction vessel 100> Next, a modification of the reaction vessel 100 will be described.

[0128] FIG. 14(a) shows an example of a deformation pattern of the reaction vessel 100, and FIG. 14(b) shows another example of a deformation pattern of the reaction vessel 100.

[0129] The reaction vessel 100 is supported at both ends, and is not supported at the intermediate portions between the ends (see FIG. 4). Therefore, as shown in FIG. 14(a), the reaction vessel 100 is curved downwardly convexly due to its own weight. When the reaction vessel 100 is heated, the rigidity (hardness) of the reaction vessel 100 decreases, and the amount of deformation of the downward convexity increases.

[0130] On the other hand, when the temperature of the reaction vessel 100 is controlled (temperature increase control or temperature decrease control), the reaction vessel 100 expands and contracts, causing the reaction vessel 100 to curve upwardly convexly (see FIG. 14(b)).

[0131] The reaction vessel 100 is curved in an upward convex shape because the temperature of the upper part of the reaction vessel 100 differs from the temperature of the lower part of the reaction vessel 100. Specifically, the temperature of the upper part A of the reaction vessel 100 becomes higher than the temperature of the lower part of the reaction vessel 100. Therefore, the upper part A of the reaction vessel 100 expands more than the lower part C of the reaction vessel 100. As a result, the reaction vessel 100 is curved in an upward convex shape.

[0132] The reason why the temperature of the upper part A of the reaction vessel 100 is higher than the temperature of the lower part of the reaction vessel 100 is because the first heating part H1 (see Figure 12) arranged in the upper zone D11 of the temperature control area 110 and the third heating part H3 (see Figure 12) arranged in the lower zone D13 of the temperature control area 110 are in different current output states.

[0133] For example, when the temperature of the lower part C of the reaction vessel 100 is 400°C, the temperature of the upper part A of the reaction vessel 100 is (400+Δ)°C. Here, when controlling the temperature of the reaction vessel 100 (temperature increase control or temperature decrease control) (for example, when controlling the temperature increase from 400°C to 405°C), the temperature of the lower part C of the reaction vessel 100 (third heating part H3) is lower than the temperature of the upper part A of the reaction vessel 100 (first heating part H1), so a current larger than that of the first heating part H1 is passed through the third heating part H3. Therefore, the lower part C of the reaction vessel 100 is heated more strongly than the upper part A of the reaction vessel 100.

[0134] At that time, since heat moves from bottom to top, the third heating part H3 to which a current larger than that of the first heating part H1 is applied as described above heats not only the lower part C of the reaction vessel 100 but also the upper part A of the reaction vessel 100. As a result, the temperature difference between the upper part of the reaction vessel 100 and the lower part of the reaction vessel 100 becomes larger.

[0135] <First problem (problem when controlling the temperature of the reaction vessel 100 (temperature increase control or temperature decrease control))> Next, the first problem (problem when controlling the temperature of the reaction vessel 100 (temperature increase control or temperature decrease control)) will be described.

[0136] FIG. 15 is a diagram for explaining the first problem (problem when controlling the temperature of the reaction vessel 100 (temperature increase control or temperature decrease control)).

[0137] When the temperature of the reaction vessel 100 is controlled (temperature increase control or temperature decrease control) as described above, the reaction vessel 100 is curved upwardly convexly due to the temperature difference between the upper part of the reaction vessel 100 and the lower part of the reaction vessel 100 (see FIG. 14(b)). Meanwhile, the conveying mechanism 120 (screw) is curved downwardly convexly due to its own weight (see FIG. 15). Therefore, the buffer space S1 (see FIG. 15) between the conveying mechanism 120 (screw) and the reaction vessel 100 gradually narrows, and finally, the flight top of the conveying mechanism 120 (screw) comes into contact with the inner wall of the reaction vessel 100. As a result, there is a problem (first problem) that the normal operation of the reaction apparatuses 10A to 10C may be hindered (the reaction apparatuses 10A to 10C may break down).

[0138] <Desired temperature conditions> Considering the first problem above, it is desirable for the temperature control unit 202 to individually control each heater (heating wire) so that the temperature difference between the upper part A, the lower part C, the left part D, and the right part B (see FIG. 12) of the reaction vessel 100 is as small as possible.

[0139] Specifically, the temperature difference between the upper part A, the lower part C, the left part D, and the right part B of the reaction vessel 100 is preferably within ±20°C, more preferably within ±10°C.

[0140] Next, a process of cooling the temperature of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) from a current temperature (eg, 1000° C.) to a target temperature (eg, 500° C.) will be described.

[0141] In this process, the temperature control unit 202 individually controls each heater (heating wire) so that the temperature of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) changes from the current temperature (e.g., 1000°C) to the target temperature (e.g., 500°C).

[0142] In this case, in order to suppress the temperature difference between the upper part A, the lower part C, the left part D, and the right part B of the reaction vessel 100, it is desirable that the temperature drop rate (cooling rate) of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is as slow as possible. Specifically, the temperature drop rate of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is desirably 10° C. / min or less, more desirably 5° C. / min or less, and further desirably 2° C. / min or less. The same applies to the temperature rise rate (heating rate) of the reaction vessel 100 (upper part A, lower part C, left part D, right part B). The desirable temperature drop rate and temperature rise rate can be found, for example, by experience, experiment, or predetermined calculation.

[0143] <Second problem (problem when controlling the temperature of the reaction vessel 100 (temperature increase control or temperature decrease control))> When controlling the temperature of the reaction vessel 100 (temperature increase control or temperature decrease control) in the reaction apparatus 10 of Reference Example 2 shown in FIG. 4, a stepwise temperature increase or decrease is usually performed.

[0144] Fig. 16(a) is an example of a stepwise temperature decrease. Fig. 16(b) is an example of a stepwise temperature increase. Fig. 17 is a graph showing the relationship between the temperature increase temperature change C1 and the actual temperature change C2 of the reaction vessel 100 when the temperature of the reaction vessel 100 is controlled (heated) to a target temperature at a certain temperature increase rate in the reaction apparatus 10 of Reference Example 2.

[0145] The reason for carrying out stepwise temperature increase in the reaction apparatus 10 of Reference Example 2 shown in FIG. 4 is as follows.

[0146] That is, as shown in Fig. 17, when the temperature of the reaction vessel 100 is controlled (heated) to rise to a target temperature at a certain rate of temperature rise, a displacement amount ΔX' (amount of displacement in the vertical direction of the reaction vessel 100) that cannot follow the temperature change C1 (time axis) of the temperature rise occurs before the target temperature is finally reached (for example, see time T1 in Fig. 17). Therefore, a stepwise temperature rise control is performed, and a waiting time T is set to wait until the amount of displacement in the vertical direction of the reaction vessel 100 reaches ΔX. W (See Figure 17) This waiting time T W is set in consideration of the waiting time until the temperature difference Δ (the difference between the temperature at the top of the reaction vessel 100 and the temperature at the bottom of the reaction vessel 100) becomes as small as possible.

[0147] 17, the symbol ΔX represents the vertical displacement of the reaction vessel 100 when the temperature of the reaction vessel 100 reaches the target temperature (intermediate temperature in the case of FIG. 17) (when the temperature difference is ΔT). The symbol ΔX' represents the displacement (vertical displacement of the reaction vessel 100) that cannot follow the temperature change C1 (time axis) of the temperature rise at time T1 before the target temperature is reached.

[0148] However, the waiting time T W Since is a time that is mainly set manually based on experience, the "extra waiting time T EX17) occurs. Therefore, when a stepwise temperature increase is performed in the reaction apparatus 10 of Reference Example 2, there is a problem (second problem) that the time (temperature increase time) until the temperature of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) reaches the target temperature becomes long (for example, several days are required). Similarly, when a stepwise temperature decrease is performed in the reaction apparatus 10 of Reference Example 2, there is a problem (second problem) that the time (temperature decrease time) until the temperature of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) reaches the target temperature becomes long (for example, several days are required).

[0149] Next, the second problem will be further described with reference to FIG.

[0150] FIG. 18 is a flowchart showing an example of a temperature increase process for increasing the temperature stepwise in the reaction apparatus 10 of Reference Example 2. In FIG.

[0151] First, a current temperature T1 (e.g., 500° C.), a target temperature T2 (e.g., 1000° C.), a heating rate Vt (e.g., 10° C. / min), and an intermediate temperature Tm (e.g., 750° C.) are set (steps S20 to S22). For example, this is set manually by an operator.

[0152] Next, the temperature is increased at a temperature increase rate Vt (step S23). This is achieved by the temperature control unit 202 controlling each heater so that the temperature of the reaction vessel 100 increases from the current temperature T1 to the intermediate temperature Tm.

[0153] Next, when the temperature of the reaction vessel 100 reaches the intermediate temperature Tm (for example, 750° C.) (step S24: YES), the reaction vessel 100 waits for a preset waiting time Tw (see FIG. 17) (step S25: NO). The intermediate temperature Tm is maintained during the waiting time Tw.

[0154] Next, when a preset waiting time Tw has elapsed (step S25: YES), the temperature is increased at a temperature increase rate Vt (step S26). This is achieved by the temperature control unit 202 controlling each heater so that the temperature of the reaction vessel 100 becomes the target temperature T2.

[0155] Then, when the temperature of the reaction vessel 100 reaches the target temperature T2 (step S27: YES), the temperature increasing process (steps S20 to S27) ends.

[0156] As described above, when the temperature is increased stepwise in the reaction apparatus 10 of the above-mentioned Reference Example 2, the “extra waiting time T EX 17) occurs. Therefore, when a stepwise temperature increase is performed in the reaction apparatus 10 of Reference Example 2, there is a problem (second problem) that the heating time of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) becomes long (for example, several days are required for heating). Similarly, when a stepwise temperature decrease is performed in the reaction apparatus 10 of Reference Example 2, there is a problem (second problem) that the cooling time until the temperature of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) reaches the target temperature becomes long (for example, several days are required for cooling).

[0157] <Embodiment 1> Next, a configuration example 1 for solving the first and second problems will be described as embodiment 1. Hereinafter, the reaction apparatus of embodiment 1 will be referred to as a reaction apparatus 10A.

[0158] Fig. 19 is a schematic configuration diagram of the reaction apparatus 10A of the embodiment 1. Fig. 20 is a block diagram of the reaction apparatus 10A according to the embodiment 1.

[0159] 19 and 20, the reaction apparatus 10A of the embodiment 1 corresponds to the reaction apparatus 10 of Reference Example 2 to which a protrusion 117, a position measuring device 260, a first displacement speed calculation unit 208, and a second displacement speed calculation unit 209 have been added. Hereinafter, the same components as those of the reaction apparatus 10 of Reference Example 2 are denoted by the same reference symbols, and the description thereof will be omitted as appropriate.

[0160] The protruding portion 117 protrudes downward from the lower center in the longitudinal direction of the reaction vessel 100 (temperature controlled region 110). The base end side of the protruding portion 117 is connected to the lower center in the longitudinal direction of the reaction vessel 100 (temperature controlled region 110) by welding or the like. Meanwhile, a metal plate 118 (measurement surface 118a) that is the measurement target of the position measuring device 260 is provided on the tip side (lower end side in FIG. 19) of the protruding portion 117. The measurement surface 118a is a flat surface parallel to the floor surface 170 on which the position measuring device 260 is placed.

[0161] By providing the protruding portion 117 in this manner and measuring the tip side (metal plate 118 (measurement surface 118a)), it is possible to measure the vertical displacement (position) of the reaction vessel 100 in a room temperature environment away from the lower center in the longitudinal direction of the reaction vessel 100 (temperature controlled region 110) (which becomes hot because it is inside the furnace body). As a result, the measurement accuracy of the vertical displacement (position) of the reaction vessel 100 is improved.

[0162] The connection point of protrusion 117 may be a location other than the lower center in the longitudinal direction of reaction vessel 100 (temperature controlled area 110) (for example, the upper center in the longitudinal direction of reaction vessel 100 (temperature controlled area 110)) as long as the vertical displacement (position) of reaction vessel 100 can be measured. Furthermore, the protrusion direction of protrusion 117 may be a direction other than downward (for example, upward, sideways) as long as the vertical displacement (position) of reaction vessel 100 can be measured. Furthermore, the number of protrusions 117 may be one or more.

[0163] The position measuring device 260 measures the vertical displacement (position) of the reaction vessel 100 (metal plate 118 (measurement surface 118a) provided on the tip side of the protrusion 117). Since the vertical displacement of the reaction vessel 100 is extremely small, it is preferable to use a contact type measuring device, for example, a digital dial gauge or a micrometer, as the position measuring device 260. An example in which a digital dial gauge is used as the position measuring device 260 will be described below. Hereinafter, it will also be referred to as a digital dial gauge 260. As shown in FIG. 19, the digital dial gauge 260 is installed with its measuring element 261 in contact with the metal plate 118 (measurement surface 118a) provided on the tip side of the protrusion 117. The digital dial gauge 260 is an example of a contact type position measuring device including a contactor that contacts the tip side of the protrusion of the present disclosure.

[0164] The position measuring device 260 is not limited to a contact type measuring device, and may be a non-contact type measuring device (e.g., a laser displacement meter) that irradiates a laser through quartz glass. Alternatively, for example, the protruding portion 117 may be omitted, and one end face of another rod-shaped member may be brought into contact with the lower center in the longitudinal direction of the reaction vessel 100 (temperature controlled region 110), and the other end face of the other rod-shaped member may be measured with a contact or non-contact type measuring device. Alternatively, the protruding portion 117 may be omitted, and the lower center in the longitudinal direction of the reaction vessel 100 (temperature controlled region 110) may be measured with a contact or non-contact type measuring device.

[0165] The position measuring device 260 measures the actual position of a specific point of the reaction vessel 100 which displaces as described above (see Figs. 14(a) and 14(b)). This specific point is, for example, the contact point (hereinafter referred to as point E, see Fig. 19) between the probe 261 of the digital dial gauge 260 and the metal plate 118 (measurement surface 118a). Note that this specific point may be a point other than point E. Below, an example in which this specific point is point E of the reaction vessel 100 will be described.

[0166] Here, the position of point E measured at room temperature is defined as the zero point (H0), the position of point E measured at a specified temperature after heating or cooling from room temperature is defined as (H1), and the difference between the two (H1-H0) is defined as the vertical displacement of point E.

[0167] On the other hand, a part of the protrusion 117 is inside the reaction vessel 100 (temperature control region 110). Therefore, the protrusion 117 is heated or cooled at a predetermined temperature. Therefore, the vertical displacement (Hr) of the reaction vessel 100 is expressed by the following formula 1 using a correction value (Hm) that takes into account the thermal expansion of the protrusion 117.

[0168] Hr=(H1-H0)-Hm (Formula 1) Here, as shown in Fig. 14(a), Hr = Z1 - Z0. Here, Z0 represents the position of the longitudinal center of the reaction vessel 100 measured at room temperature, and Z1 represents the position of the longitudinal center of the reaction vessel 100 measured at a predetermined temperature after heating or cooling from room temperature. The means for determining the correction value Hm is not particularly limited. The correction value Hm may be determined based on empirical data, or may be determined by a simulation such as a heat transfer analysis.

[0169] The protruding portion 117 may have a structure that allows a fluid to flow therethrough. For example, the protruding portion 117 may be the first fluid supply pipe 133 or the second fluid supply pipe 143. The protruding portion 117 may also have a temperature measuring unit that measures the temperature inside or around the protruding portion 117. This allows the correction value Hm to be determined more accurately.

[0170] The first displacement speed calculation unit 208 calculates the displacement speed (desired displacement speed V1) of the point E of the reaction vessel 100 when the temperature of the reaction vessel 100 (middle part A3) is controlled from the current temperature T1 to the target temperature T2 at a desired temperature drop rate (or temperature rise rate). At that time, the first displacement speed calculation unit 208 calculates in consideration of, for example, the desired temperature drop rate (or temperature rise rate) and the material properties such as the thermal expansion coefficient of each member constituting the reaction vessel 100. This desired displacement speed is a displacement speed that is considered so that the deviation between the temperature of the upper part of the reaction vessel 100 and the temperature of the lower part of the reaction vessel 100 is as small as possible. This desired displacement speed V1 (calculated value) can be represented, for example, by a straight line C3 in FIG. 21. FIG. 21 is a graph showing the relationship between the desired displacement speed C3 of the point E and the actual displacement speed C4 of the point E when the reaction vessel 100 is subjected to temperature drop control (cooling control). The first displacement velocity calculation unit 208 is realized, for example, by the control device 200 executing a predetermined program. Note that the first displacement velocity calculation unit 208 may be realized by hardware, not limited to the predetermined program. Also, the calculation performed by the first displacement velocity calculation unit 208 may be performed manually.

[0171] The second displacement speed calculation unit 209 calculates an actual displacement speed V2 of the point E (specific location) based on the actual position (multiple positions measured at different times and corrected by the above-mentioned correction value (Hm)) of the point E (specific location) measured by the position measurement device 260. This actual displacement speed V2 (actual measurement value) of the point E can be represented, for example, by a curve C4 in FIG. 21. The second displacement speed calculation unit 209 is realized, for example, by the control device 200 executing a predetermined program. Note that the second displacement speed calculation unit 209 is not limited to a predetermined program and may be realized by hardware.

[0172] The temperature control unit 202 executes a temperature drop rate control process (or a temperature rise rate control process) for controlling the temperature drop rate (or temperature rise rate) of the reaction vessel 100 (middle section A3) so that the actual displacement speed V2 of point E follows (matches) the desired displacement speed V1 of point E. This temperature drop rate control process (and temperature rise rate control process) will be described later. The temperature control unit 202 is realized, for example, by the control device 200 executing a predetermined program. Note that the temperature control unit 202 is not limited to the predetermined program and may be realized by hardware.

[0173] <Operation Example 1 of Reaction Apparatus 10A> Next, a first operational example of the reaction device 10A will be described with reference to FIG.

[0174] FIG. 22 is a flowchart of an operation example 1 of the reaction device 10A.

[0175] Hereinafter, as an operation example 1 of the reaction device 10A, an operation example in which the temperature of the reaction vessel 100 is controlled to decrease (cool) from a current temperature of 1000° C. to a target temperature of 500° C. will be described.

[0176] First, a current temperature T1 (1000° C.), a target temperature T2 (500° C.), and a desired temperature drop rate Vt (for example, 1° C. / min) are set (steps S30 to S31). This is done manually by an operator, for example.

[0177] Next, a desired displacement speed V1 is calculated (step S32). This is realized by, for example, the first displacement speed calculation unit 208. Specifically, the first displacement speed calculation unit 208 calculates the displacement speed (desired displacement speed V1) of the point E of the reaction vessel 100 when the temperature of the reaction vessel 100 (middle part A3) is controlled from the current temperature T1 to the target temperature T2 at a desired temperature drop speed Vt. At that time, the first displacement speed calculation unit 208 performs the calculation in consideration of, for example, the desired temperature drop speed Vt, material properties such as the thermal expansion coefficient of each member constituting the reaction vessel 100, and the like. This desired displacement speed V1 (calculated value) can be represented, for example, by a straight line C3 in FIG. 21.

[0178] Next, the position of point E is measured, and an actual displacement velocity V2 (actual measurement value) is calculated (step S33). This is realized by the second displacement velocity calculation unit 209. Specifically, the second displacement velocity calculation unit 209 calculates the actual displacement velocity V2 of point E based on the actual position (multiple positions measured at different times and corrected by the above correction value (Hm)) of point E (specific point) measured by the position measurement device 260. This actual displacement velocity V2 (actual measurement value) of point E can be represented, for example, by the curve C4 in FIG. 21.

[0179] Next, a temperature drop rate control process is executed (step S34). This temperature drop rate control process is a process for controlling the temperature drop rate of the reaction vessel 100 (middle section A3) so that the actual displacement speed V2 of point E calculated in step S33 follows (matches) the desired displacement speed V1 of point E calculated in step S32, and is realized by the temperature control section 202.

[0180] This temperature decreasing rate control process (step S34) will be specifically described with reference to Fig. 23. Fig. 23 is a flowchart of the temperature decreasing rate control process.

[0181] 23, first, it is determined whether or not the actual displacement speed V2 and the desired displacement speed V1 deviate from each other (for example, whether the difference between the actual displacement speed V2 and the desired displacement speed V1 exceeds a threshold value) (step S341). For example, this is determined by the temperature control unit 202 comparing the actual displacement speed V2 of the point E calculated in step S33 with the desired displacement speed V1 of the point E calculated in step S32.

[0182] As a result, if the actual displacement speed V2 and the desired displacement speed V1 deviate from each other (step S341: YES) and the deviation is positive (see arrow AR8 in FIG. 21) (step S342: YES), this means that the actual displacement speed V2 of point E is slower than the desired displacement speed V1 of point E, so the temperature drop rate of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is increased (step S343). For example, the temperature control unit 202 increases the temperature drop rate from 1° C. / min to 2° C. / min. Specifically, the temperature control unit 202 controls each heater so that the actual displacement speed V2 of point E follows (matches) the desired displacement speed V1 of point E. This causes the actual displacement speed V2 of point E to follow the desired displacement speed V1 of point E (see FIG. 21).

[0183] On the other hand, if the actual displacement speed V2 and the desired displacement speed V1 deviate from each other (step S341: YES) and the deviation is negative (see arrow AR9 in FIG. 21) (step S342: NO), this means that the actual displacement speed V2 of point E is faster than the desired displacement speed V1 of point E, so the temperature drop rate of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is reduced (step S344). For example, the temperature control unit 202 reduces the temperature drop rate from 2° C. / min to 1° C. / min. Specifically, the temperature control unit 202 controls each heater so that the actual displacement speed V2 of point E follows (matches) the desired displacement speed V1 of point E. This causes the actual displacement speed V2 of point E to follow the desired displacement speed V1 of point E (see FIG. 21).

[0184] If there is no deviation between the actual displacement speed V2 and the desired displacement speed V1 (step S341: NO), the processes after step S341 are not executed.

[0185] The processes of steps S33 and S34 are repeatedly executed until the temperature of the reaction vessel 100 reaches the target temperature T2 set in step S30 (step S35: NO).

[0186] Then, when the temperature of the reaction vessel 100 reaches the target temperature T2 (step S35: YES), the operation example 1 of the reaction device 10A ends.

[0187] As described above, according to the first operation example of the reaction device 10A, the actual displacement speed V2 of the point E follows the desired displacement speed V1 of the point E until the temperature of the reaction vessel 100 reaches the target temperature T2 (see FIG. 21). This solves the first and second problems.

[0188] <Operation Example 2 of Reaction Apparatus 10A> Next, an operation example 2 of the reaction apparatus 10A will be described with reference to Fig. 24. While the operation example 1 of the reaction apparatus 10A is an example of temperature decrease control (cooling control) of the reaction vessel 100, the operation example 2 of the reaction apparatus 10A is an example of temperature increase control (heating control) of the reaction vessel 100.

[0189] FIG. 24 is a flowchart of an operation example 2 of the reaction device 10A.

[0190] Hereinafter, as an operation example 2 of the reaction device 10A, an operation example in which the temperature of the reaction vessel 100 is controlled to increase from a current temperature of 500° C. to a target temperature of 1000° C. (heating control) will be described.

[0191] First, a current temperature T1 (500° C.), a target temperature T2 (1000° C.), and a desired heating rate Vt (for example, 1° C. / min) are set (steps S40 to S41). This is set manually by an operator, for example.

[0192] Next, a desired displacement speed is calculated (step S42). This is realized by, for example, the first displacement speed calculation unit 208. Specifically, the first displacement speed calculation unit 208 calculates the displacement speed (desired displacement speed V1) of the point E of the reaction vessel 100 when the temperature of the reaction vessel 100 (middle part A3) is controlled from the current temperature T1 to the target temperature T2 at the desired heating speed Vt. At that time, the first displacement speed calculation unit 208 performs the calculation in consideration of, for example, the desired heating speed Vt and the material properties such as the thermal expansion coefficient of each member constituting the reaction vessel 100. This desired displacement speed V1 (calculated value) can be represented by, for example, a straight line C5 in FIG. 25. FIG. 25 is a graph showing the relationship between the desired displacement speed V1 of the point E and the actual displacement speed V2 of the point E when the reaction vessel 100 is subjected to temperature rise control (heating control).

[0193] Next, the position of point E is measured, and an actual displacement velocity V2 (actual measurement value) is calculated (step S43). This is realized by the second displacement velocity calculation unit 209. Specifically, the second displacement velocity calculation unit 209 calculates the actual displacement velocity V2 of point E based on the actual position (multiple positions measured at different times and corrected by the above correction value (Hm)) of point E (specific point) measured by the position measurement device 260. This actual displacement velocity V2 (actual measurement value) of point E can be represented, for example, by the curve C6 in FIG. 25.

[0194] Next, a temperature rise rate control process is executed (step S44). This temperature rise rate control process is a process for controlling the temperature rise rate of the reaction vessel 100 (middle part A3) so that the actual displacement speed V2 of the point E calculated in step S43 follows (matches) the desired displacement speed V1 of the point E calculated in step S42, and is realized by the temperature control part 202.

[0195] This temperature rise rate control process (step S44) will be specifically described with reference to Fig. 26. Fig. 26 is a flowchart of the temperature rise rate control process.

[0196] 26, first, it is determined whether or not the actual displacement speed V2 and the desired displacement speed V1 deviate from each other (for example, whether the difference between the actual displacement speed V2 and the desired displacement speed V1 exceeds a threshold) (step S441). This is determined, for example, by the temperature control unit 202 comparing the actual displacement speed V2 of the point E calculated in step S43 with the desired displacement speed V1 of the point E calculated in step S42.

[0197] As a result, if the actual displacement speed V2 and the desired displacement speed V1 deviate from each other (step S441: YES) and the deviation is positive (see arrow AR10 in FIG. 25) (step S442: YES), this means that the actual displacement speed V2 of point E is slower than the desired displacement speed V1 of point E, so the heating rate of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is increased (step S443). For example, the temperature control unit 202 increases the heating rate from 1° C. / min to 2° C. / min. Specifically, the temperature control unit 202 controls each heater so that the actual displacement speed V2 of point E follows (matches) the desired displacement speed V1 of point E. This causes the actual displacement speed V2 of point E to follow the desired displacement speed V1 of point E (see FIG. 25).

[0198] On the other hand, if the actual displacement speed V2 and the desired displacement speed V1 are different (step S441: YES) and the difference is negative (see arrow AR11 in FIG. 25) (step S442: NO), this means that the actual displacement speed V2 of point E is faster than the desired displacement speed V1 of point E, so the heating rate of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is reduced (step S444). For example, the temperature control unit 202 reduces the heating rate from 2° C. / min to 1° C. / min. Specifically, the temperature control unit 202 controls each heater so that the actual displacement speed V2 of point E follows (matches) the desired displacement speed V1 of point E. This causes the actual displacement speed V2 of point E to follow the desired displacement speed V1 of point E (see FIG. 25).

[0199] If there is no deviation between the actual displacement speed V2 and the desired displacement speed V1 (step S441: NO), the processes after step S441 are not executed.

[0200] The processes of steps S43 and S44 are repeatedly executed until the temperature of the reaction vessel 100 reaches the target temperature T2 set in step S40 (step S45: NO).

[0201] Then, when the temperature of the reaction vessel 100 reaches the target temperature (step S45: YES), the operation example 2 of the reaction device 10A is ended.

[0202] As described above, according to the second operation example of the reaction device 10A, the actual displacement speed V2 of the point E follows the desired displacement speed V1 of the point E until the temperature of the reaction vessel 100 reaches the target temperature T2 (see FIG. 25). This solves the first and second problems.

[0203] <Third problem (problem when controlling the temperature rise (heating control) of the reaction vessel 100)> As shown in FIG. 26, when the reaction vessel 100 is temperature-raised (heat-controlled), even if the temperature-raising rate of the reaction vessel 100 (upper part A, lower part C, left part D, right part B) is increased (step S443), a case may be assumed in which point E does not displace, i.e., the actual displacement speed V2 (actual measured value) of point E does not follow the desired displacement speed V1 (calculated value) of point E.

[0204] In this case, for example, it is considered that the reaction vessel 100 may come into contact with the transport mechanism 120, causing an abnormal operation of the second support part 104, which is the movable support part (third problem). The hatched area in Fig. 25 indicates a danger area where the reaction vessel 100 may come into contact with the transport mechanism 120.

[0205] <Embodiment 2> Next, a configuration example 1 for solving the above third problem will be described as an embodiment 2. Hereinafter, the reaction apparatus of the embodiment 2 will be referred to as a reaction apparatus 10B.

[0206] FIG. 27 is a block diagram of a reaction device 10B according to the second embodiment.

[0207] 27, the reaction apparatus 10B of the embodiment 2 corresponds to the reaction apparatus 10A of the embodiment 1 to which an emergency operation control unit 290 is added. Hereinafter, the same components as those of the reaction apparatus 10A of the embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0208] The emergency operation control unit 290 executes emergency processing (emergency operation) to avoid a situation in which the reaction device 10B cannot operate normally. This emergency processing may be, for example, a processing to control each heater so as to reduce the heating rate of the reaction vessel 100, a processing to stop heating of the reaction vessel 100 (emergency stop), or other processing.

[0209] The process of stopping the heating of the reaction vessel 100 (emergency stop) may be a process similar to the heating stop process executed when an emergency stop button (not shown) provided on the reaction device 10B is pressed (e.g., stopping the supply of electricity to the temperature control unit 202).

[0210] The emergency process may be, for example, a process of notifying that an abnormality has occurred in the reaction device 10B. The process of notifying may be, for example, a process of displaying the occurrence of an abnormality in the reaction device 10B on a display device (for example, a display), or a process of outputting a sound indicating that an abnormality has occurred in the reaction device 10B from a sound output device (for example, a speaker).

[0211] <Emergency response example 1> Next, emergency processing example 1 will be specifically described with reference to FIG.

[0212] Fig. 28 is a flowchart of emergency processing example 1. Emergency processing example 1 is executed in step S443 (see Fig. 26).

[0213] First, the position of point E is measured (step S4431). This is realized by the position measuring device 260.

[0214] Next, it is determined whether the time change dx / dt of the position of point E measured in step S4431 has turned negative (step S4432). If the time change dx / dt of the position of point E has turned negative (step S4432: YES), this is because the position of point E has moved toward the major axis AX due to heating of the reaction vessel 100. 100 Since this indicates that the displacement is correct in the direction, the process proceeds to step S4431 without executing emergency processing (emergency operation), and thereafter, the subsequent processes are repeatedly executed.

[0215] On the other hand, if the time change dx / dt of the position of point E does not turn negative (step S4432: NO), this means that the position of point E is on the major axis AX 100 In order to indicate that the reaction vessel 100 is not displaced correctly in the direction, i.e., that the second support part 104, which is the movable support part, may be malfunctioning (for example, the reaction vessel 100 and the transport mechanism 120 may be in contact), emergency processing (emergency operation) is executed (step S4433). This is realized by the emergency operation control part 290. This emergency processing may be, for example, a process of controlling each heater to reduce the rate at which the reaction vessel 100 is heated, a process of stopping the heating of the reaction vessel 100 (emergency stop), or other processes. This solves the above problem 3.

[0216] <Emergency handling example 2> Next, a second example of emergency processing will be described.

[0217] The difference between emergency processing example 1 and emergency processing example 2 is that in emergency processing example 1, the change over time in the position of point E after increasing the heating rate is used as the criterion for transitioning to emergency processing (emergency operation), whereas in emergency processing example 2, the degree of deviation from "ideal expansion" is used as the criterion for transitioning to emergency processing (emergency operation).

[0218] That is, even if the second support portion 104, which is the movable support portion, is normal, there is a possibility that the position of point E will not change over time immediately after the temperature increase rate is increased.

[0219] Therefore, in emergency processing example 2, a threshold value for the allowable deviation between the desired displacement speed V2 and the actual displacement speed V1 is set in advance, and if the deviation between the desired displacement speed V2 and the actual displacement speed V1 exceeds that threshold value, emergency operation is initiated.

[0220] Next, emergency processing example 2 will be specifically described with reference to FIG.

[0221] Fig. 29 is a flowchart of emergency processing example 2. Emergency processing example 2 is executed in step S443 (see Fig. 26).

[0222] First, the position of point E is measured, and an actual displacement velocity V2 is calculated (step S4434). This is realized by the second displacement velocity calculation unit 209. Specifically, the second displacement velocity calculation unit 209 calculates the actual displacement velocity V2 of point E based on the actual position of point E (specific point) measured by the position measurement device 260 (multiple positions measured at different times and corrected by the above correction value (Hm)).

[0223] Next, if the deviation between the desired displacement velocity V1 and the actual displacement velocity V2 does not exceed the threshold (step S4435: NO), this is because the position of point E has moved toward the major axis AX due to the increase in the temperature rise rate. 100 Since this indicates that the displacement is correct in the direction, the process proceeds to step S4434 without executing emergency processing (emergency operation), and thereafter, the subsequent processes are repeatedly executed.

[0224] On the other hand, if the deviation between the desired displacement speed V1 and the actual displacement speed V2 exceeds the threshold value (step S4435: YES), this is because the position of point E is not aligned with the major axis AX despite the increase in the temperature rise rate. 100In order to indicate that the reaction vessel 100 is not displaced correctly in the direction, i.e., that the second support part 104, which is the movable support part, may be malfunctioning (for example, the reaction vessel 100 and the transport mechanism 120 may be in contact), emergency processing (emergency operation) is executed (step S4436). This is realized by the emergency operation control part 290. This emergency processing may be, for example, a process of controlling each heater to reduce the rate at which the reaction vessel 100 is heated, a process of stopping the heating of the reaction vessel 100 (emergency stop), or other processes. This solves the above problem 3.

[0225] <Emergency handling example 3> Next, a third example of emergency processing will be described.

[0226] The emergency processing example 3 corresponds to the above emergency processing example 2 (see FIG. 29) with step S4437 added.

[0227] The difference between emergency processing example 1 and emergency processing example 3 is that in emergency processing example 1, the change over time in the position of point E after increasing the heating rate is used as the criterion for transitioning to emergency processing, whereas in emergency operation example 3, "behavior different from that in steady state" is used as the criterion for transitioning to emergency processing.

[0228] In actual production operations, the temperature is increased or decreased in the same pattern every time. Therefore, in emergency processing example 3, a threshold value that is acceptable for deviation from "behavior different from normal operation" is set in advance, and if the threshold value is exceeded, the system transitions to emergency operation.

[0229] Next, emergency processing example 3 will be specifically described with reference to FIG.

[0230] Fig. 30 is a flowchart of emergency operation example 3. Emergency operation example 3 is executed in step S443 (see Fig. 26).

[0231] First, the position of point E is measured, and an actual displacement velocity V2 is calculated (step S4434). This is realized by the second displacement velocity calculation unit 209. Specifically, the second displacement velocity calculation unit 209 calculates the actual displacement velocity V2 of point E based on the actual position of point E (specific point) measured by the position measurement device 260 (multiple positions measured at different times and corrected by the above correction value (Hm)).

[0232] Next, if the deviation between the desired displacement speed V1 and the actual displacement speed V2 does not exceed the threshold (step S4435: NO), and if the deviation between the desired displacement speed V1 and the actual displacement speed V2 does not exceed the steady-state threshold (step S4437: NO), this is because the position of point E has moved toward the major axis AX due to the increase in the temperature rise rate. 100 Since this indicates that the displacement is correct in the direction, the process proceeds to step S4434 without executing emergency processing (emergency operation), and thereafter, the subsequent processes are repeatedly executed.

[0233] On the other hand, if the deviation between the desired displacement speed V1 and the actual displacement speed V2 exceeds the threshold (step S4435: YES), or if the deviation between the desired displacement speed V1 and the actual displacement speed V2 exceeds the steady-state threshold (step S4437: YES), this is because the position of point E is not aligned with the major axis AX despite the increase in the temperature rise rate. 100 In order to indicate that the reaction vessel 100 is not displaced correctly in the direction, i.e., that the second support part 104, which is the movable support part, may be malfunctioning (for example, the reaction vessel 100 and the transport mechanism 120 may be in contact), emergency processing (emergency operation) is executed (step S4436). This is realized by the emergency operation control part 290. This emergency processing may be, for example, a process of controlling each heater to reduce the rate at which the reaction vessel 100 is heated, a process of stopping the heating of the reaction vessel 100 (emergency stop), or other processes. This solves the above problem 3.

[0234] <Embodiment 3> Next, a configuration example 2 for solving the above first and second problems will be described as an embodiment 3. Hereinafter, the reaction apparatus of the embodiment 3 will be referred to as a reaction apparatus 10C.

[0235] FIG. 31 is a block diagram of a reaction device 10C according to the third embodiment.

[0236] As shown in Fig. 31, the reaction apparatus 10C of the embodiment 3 corresponds to the reaction apparatus 10A of the embodiment 1 to which a temperature control pattern correction unit 291 is added. Hereinafter, the same components as those of the reaction apparatus 10A of the embodiment 1 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

[0237] In the reaction apparatus 10C of the third embodiment, as shown in Fig. 32, a temperature control table is stored in the storage unit 207. Fig. 32 is an example of the temperature control table stored in the storage unit 207. The storage unit 207 is an example of a temperature control pattern storage unit and a displacement speed storage unit of the present disclosure.

[0238] As shown in FIG. 32, the temperature control table includes, as items, a current temperature DT1, a target temperature DT2, a desired temperature drop rate DT3, a desired change rate DT4, and a temperature control pattern DT5.

[0239] The current temperature DT1 stores the current temperature of the reaction vessel 100. The target temperature DT2 stores the target temperature of the reaction vessel 100. The desired temperature drop rate (or temperature rise rate) DT3 stores a temperature drop rate (or temperature rise rate) set in consideration of the above-mentioned <desired temperature condition>. The desired displacement rate DT4 stores a displacement rate (desired displacement rate V1) calculated by the first displacement rate calculation unit 208. The temperature control pattern DT5 stores the control pattern of each heater actually controlled by the temperature control unit 202 until the temperature of the reaction vessel 100 (middle section A3) reaches the target temperature DT2 from the current temperature DT1, for example, information on the current value per time that is applied to each heater.

[0240] The temperature control pattern correction unit 291 corrects the temperature control pattern DT5 so that the displacement speed (V1 or V2) of the point E (specific location) of the reaction vessel 100 becomes as fast as possible. For example, the control patterns (multiple times) of each heater actually controlled by the temperature control unit 202 until the temperature of the reaction vessel 100 (middle part A3) reaches the target temperature DT2 from the current temperature DT1 are stored in the memory unit 207 or the like. Then, the temperature control pattern correction unit 291 stores (overwrites) in the memory unit 207 (temperature control pattern DT5) the temperature control pattern that has the fastest displacement speed (V1 or V2) among the stored temperature control patterns (multiple times).

[0241] Alternatively, the temperature control pattern correction unit 291 may correct the temperature control pattern DT5 based on the results of machine learning so that the displacement speed (V1 or V2) of the point E (specific point) of the reaction vessel 100 becomes as fast as possible. For example, a learning model is generated by a learning engine (e.g., scikit-learn), and the displacement speed (V E or DT4) as fast as possible, and this predicted temperature control pattern may be stored (overwritten) in the storage unit 207 (temperature control pattern DT5). The temperature control pattern correction unit 291 is realized, for example, by the control device 200 executing a predetermined program. Note that the temperature control pattern correction unit 291 is not limited to being realized by a predetermined program, and may be realized by hardware.

[0242] The correction performed by the temperature control pattern correction unit 291 may be performed manually based on experience. For example, the temperature control pattern may be corrected based on experience so that the displacement speed (V1 or V2) of the point E (specific point) of the reaction vessel 100 becomes as fast as possible, and the corrected temperature control pattern may be stored (overwritten) in the storage unit 207 (temperature control pattern DT5).

[0243] <Operation Example 1 of Reaction Apparatus 10C> Next, a first operational example of the reaction device 10C will be described with reference to FIG.

[0244] FIG. 33 is a flowchart of an operation example 1 of the reaction device 10C.

[0245] Operation Example 1 of the reaction apparatus 10C corresponds to Operation Example 1 of the reaction apparatus 10A (see FIG. 22) with the addition of steps S31A, S32A, S32B, and S36 to S39.

[0246] Hereinafter, as an operation example 1 of the reaction device 10C, an operation example in which the temperature of the reaction vessel 100 is controlled to decrease (cool) from a current temperature of 1000° C. to a target temperature of 500° C. will be described.

[0247] First, a current temperature T1 (1000° C.), a target temperature T2 (500° C.), and a desired temperature drop rate Vt (for example, 1° C. / min) are set (steps S30 to S31). This is done manually by an operator, for example.

[0248] Next, if there is no stored set value (step S31A: NO), that is, if the temperature control pattern corresponding to the current temperature T1 and the target temperature T2 is not stored in the storage unit 207 (temperature control pattern DT5), a desired displacement speed V1 is calculated (step S32). This is realized, for example, by the first displacement speed calculation unit 208. Specifically, the first displacement speed calculation unit 208 calculates the displacement speed (desired displacement speed V1) of the point E of the reaction vessel 100 when the temperature of the reaction vessel 100 (middle part A3) is controlled from the current temperature T1 to the target temperature T2 at a desired temperature drop speed Vt. At that time, the first displacement speed calculation unit 208 performs the calculation in consideration of, for example, the desired temperature drop speed Vt, the material properties such as the thermal expansion coefficient of each member constituting the reaction vessel 100, and the like. This desired displacement speed V1 (calculated value) can be represented, for example, by a straight line C3 in FIG. 21.

[0249] Next, the desired displacement speed V1 calculated in step S32 is stored (step S32A). Specifically, the desired displacement speed V1 calculated in step S32 is stored in the memory unit 207 (desired displacement speed DT4) in association with the current temperature DT1, the target temperature DT2, and the desired temperature drop speed DT3. Note that the current temperature T1 and the target temperature T2 set in step S30, and the desired temperature drop speed Vt set in step S31 are stored as the current temperature DT1, the target temperature DT2, and the desired temperature drop speed DT3.

[0250] Next, the position of point E is measured, and an actual displacement velocity V2 (actual measurement value) is calculated (step S33). This is realized by the second displacement velocity calculation unit 209. Specifically, the second displacement velocity calculation unit 209 calculates the actual displacement velocity V2 of point E based on the actual position (multiple positions measured at different times and corrected by the above correction value (Hm)) of point E (specific point) measured by the position measurement device 260. This actual displacement velocity V2 (actual measurement value) of point E can be represented, for example, by the curve C4 in FIG. 21.

[0251] Next, a temperature drop rate control process is executed (step S34). This temperature drop rate control process is a process for controlling the temperature drop rate of the reaction vessel 100 (middle part A3) so that the actual displacement speed V2 of the point E calculated in step S33 follows (matches) the desired displacement speed V1 of the point E calculated in step S32, and is realized by the temperature control unit 202. This temperature drop rate control process has already been described in the operation example 1 of the reaction device 10A (see FIG. 23), so a description thereof will be omitted.

[0252] The processes of steps S33 and S34 are repeatedly executed until the temperature of the reaction vessel 100 reaches the target temperature T2 set in step S30 (step S35: NO).

[0253] Next, when the temperature of the reaction vessel 100 reaches the target temperature T2 (step S35: YES) and the temperature control pattern has not been stored in the storage unit 207 (temperature control pattern DT5) (step S36: NO), the temperature control pattern is stored in the storage unit 207 (temperature control pattern DT5) (step S37). The temperature control pattern stored here is the control pattern of each heater actually controlled by the temperature control unit 202 in step S34 until the temperature of the reaction vessel 100 (middle section A3) reaches the target temperature T2 from the current temperature T1, for example, information on the current value per time that power is applied to each heater. This temperature control pattern is stored in the storage unit 207 (temperature control pattern DT5) in association with the current temperature DT1, the target temperature DT2, and the desired temperature drop rate DT3.

[0254] Next, it is determined whether or not the temperature control has been performed appropriately (step S38). This is realized, for example, by the control device 200 executing a predetermined program.

[0255] As a result, if it is determined that the temperature control has been performed appropriately (step S38: YES), Operation Example 1 of the reaction device 10C is terminated.

[0256] On the other hand, if the temperature control is not performed appropriately (step S38: NO), the heater control conditions (the temperature control pattern stored in step S37) are corrected and overwritten (step S39), and the operation example 1 of the reaction device 10C is terminated. This correction is realized by the temperature control pattern correction unit 291. Specifically, the temperature control pattern correction unit 291 corrects the temperature control pattern DT5 so that the displacement speed (V1 or V2) of the point E (specific point) of the reaction vessel 100 becomes as fast as possible. For example, the control patterns (multiple times) of each heater actually controlled by the temperature control unit 202 until the temperature of the reaction vessel 100 (middle part A3) reaches the target temperature DT2 from the current temperature DT1 are stored in the storage unit 207 or the like. Then, the temperature control pattern correction unit 291 stores (overwrites) the temperature control pattern with the fastest displacement speed (V1 or V2) among the stored temperature control patterns (multiple times) in the storage unit 207 (temperature control pattern DT5). The processes in steps S38 and S39 may be performed manually based on experience.

[0257] As described above, according to the first operation example of the reaction device 10C, the actual displacement speed V2 of the point E follows the desired displacement speed V1 of the point E until the temperature of the reaction vessel 100 reaches the target temperature T2 (see FIG. 21). This solves the first and second problems.

[0258] Moreover, according to the first operational example of the reaction device 10C, storing the temperature control pattern in step S37 has the following advantages.

[0259] That is, by storing the temperature control pattern in step S37, next time, when the same current temperature T1 as the previous time, the same target temperature T2 as the previous time, and the same desired temperature drop rate Vt as the previous time are set in step S30, it is determined in step S31A that there are stored set values ​​(step S31A: YES), that is, the desired displacement speed and temperature control pattern corresponding to the current temperature T1 and target temperature T2 set in step S30 and the desired temperature drop rate Vt set in step S31 are stored in the memory unit 207 (desired displacement speed DT4, temperature control pattern DT5), and the desired displacement speed and temperature control pattern are read out from the memory unit 207 (desired displacement speed DT4, temperature control pattern DT5) (step S32B) and used in the subsequent processing. Therefore, there is an advantage that the processing of steps S32 and S32A can be omitted.

[0260] In addition, by performing the processes of steps S37 to S39, the following advantage is obtained. That is, even if a desirable displacement speed and a temperature control pattern based on past experience are read out from the storage unit 207, the actual displacement speed in the currently executed pattern is not necessarily exactly the same as the past one. For this reason, when a desirable displacement speed and a temperature control pattern based on past experience are executed, both the past displacement speed and the current displacement speed are stored in the storage unit 207 (step S37). Then, if there is a difference between the two, the operator judges whether the difference is acceptable, and if the difference is not acceptable, the operator appropriately corrects the control conditions (heater control conditions), and further stores (overwrites) the result in the storage unit 207 (step S39). This has the advantage that the storage unit 207 can obtain new data for machine learning and use it for calculations to find rules for the temperature control pattern by comparing it with past data.

[0261] <Operation Example 2 of Reaction Apparatus 10C> Next, an operation example 2 of the reaction device 10C will be described with reference to Fig. 34. While the operation example 1 of the reaction device 10C is an example of temperature decrease control (cooling control) of the reaction vessel 100, the operation example 2 of the reaction device 10C is an example of temperature increase control (heating control) of the reaction vessel 100.

[0262] FIG. 34 is a flowchart of an operation example 2 of the reaction device 10C.

[0263] Hereinafter, as an operation example 2 of the reaction device 10C, an operation example in which the temperature of the reaction vessel 100 is controlled to increase from a current temperature of 500° C. to a target temperature of 1000° C. (heating control) will be described.

[0264] First, a current temperature T1 (500° C.), a target temperature T2 (1000° C.), and a desired temperature drop rate Vt (for example, 1° C. / min) are set (steps S40 to S41). This is done manually by an operator, for example.

[0265] Next, if there is no stored set value (step S41A: NO), that is, if the temperature control pattern corresponding to the current temperature T1 and the target temperature T2 is not stored in the storage unit 207 (temperature control pattern DT5), a desired displacement speed V1 is calculated (step S42). This is realized, for example, by the first displacement speed calculation unit 208. Specifically, the first displacement speed calculation unit 208 calculates the displacement speed (desired displacement speed V1) of the point E of the reaction vessel 100 when the temperature of the reaction vessel 100 (middle part A3) is controlled from the current temperature T1 to the target temperature T2 at the desired temperature drop speed Vt. At that time, the first displacement speed calculation unit 208 performs the calculation in consideration of, for example, the desired temperature drop speed Vt, the material properties such as the thermal expansion coefficient of each member constituting the reaction vessel 100, and the like. This desired displacement speed V1 (calculated value) can be represented, for example, by a straight line C5 in FIG. 25.

[0266] Next, the desired displacement speed V1 calculated in step S42 is stored (step S42A). Specifically, the desired displacement speed V1 calculated in step S42 is stored in the memory unit 207 (desired displacement speed DT4) in association with the current temperature DT1, the target temperature DT2, and the desired temperature drop speed DT3. Note that the current temperature T1 and the target temperature T2 set in step S40, and the desired temperature drop speed Vt set in step S31 are stored as the current temperature DT1, the target temperature DT2, and the desired temperature drop speed DT3.

[0267] Next, the position of point E is measured, and an actual displacement velocity V2 (actual measurement value) is calculated (step S43). This is realized by the second displacement velocity calculation unit 209. Specifically, the second displacement velocity calculation unit 209 calculates the actual displacement velocity V2 of point E based on the actual position (multiple positions measured at different times and corrected by the above correction value (Hm)) of point E (specific point) measured by the position measurement device 260. This actual displacement velocity V2 (actual measurement value) of point E can be represented, for example, by the curve C6 in FIG. 25.

[0268] Next, a temperature rise rate control process is executed (step S44). This temperature rise rate control process is a process for controlling the temperature rise rate of the reaction vessel 100 (middle part A3) so that the actual displacement speed V2 of the point E calculated in step S43 follows (matches) the desired displacement speed V1 of the point E calculated in step S42, and is realized by the temperature control unit 202. This temperature rise rate control process has already been described in the operation example 2 of the reaction device 10A (see FIG. 26), so a description thereof will be omitted.

[0269] The processes of steps S43 and S44 are repeatedly executed until the temperature of the reaction vessel 100 reaches the target temperature T2 set in step S40 (step S45: NO).

[0270] Next, when the temperature of the reaction vessel 100 reaches the target temperature T2 (step S45: YES) and the temperature control pattern has not been stored in the storage unit 207 (temperature control pattern DT5) (step S46: NO), the temperature control pattern is stored in the storage unit 207 (temperature control pattern DT5) (step S47). The temperature control pattern stored here is the control pattern of each heater actually controlled by the temperature control unit 202 until the temperature of the reaction vessel 100 (middle part A3) reaches the target temperature T2 from the current temperature T1 in step S44, for example, information on the current value per time when electricity is applied to each heater. This temperature control pattern is stored in the storage unit 207 (temperature control pattern DT5) in association with the current temperature DT1, the target temperature DT2, and the desired temperature drop rate DT3.

[0271] Next, it is determined whether or not the temperature control has been performed appropriately (step S48), which is realized, for example, by the control device 200 executing a predetermined program.

[0272] As a result, if it is determined that the temperature control has been performed appropriately (step S48: YES), the second operation example of the reaction device 10C is ended.

[0273] On the other hand, if the temperature control is not performed appropriately (step S48: NO), the heater control conditions (the temperature control pattern stored in step S47) are corrected and overwritten (step S49), and the operation example 2 of the reaction device 10C is terminated. This correction is realized by the temperature control pattern correction unit 291. Specifically, the temperature control pattern correction unit 291 corrects the temperature control pattern DT5 so that the displacement speed (V1 or V2) of the point E (specific point) of the reaction vessel 100 becomes as fast as possible. For example, the control patterns (multiple times) of each heater actually controlled by the temperature control unit 202 until the temperature of the reaction vessel 100 (middle part A3) reaches the target temperature DT2 from the current temperature DT1 are stored in the storage unit 207 or the like. Then, the temperature control pattern correction unit 291 stores (overwrites) the temperature control pattern with the fastest displacement speed (V1 or V2) among the stored temperature control patterns (multiple times) in the storage unit 207 (temperature control pattern DT5). The processes in steps S48 and S49 may be performed manually based on experience.

[0274] As described above, according to the second operation example of the reaction device 10C, the actual displacement speed V2 of the point E follows the desired displacement speed V1 of the point E until the temperature of the reaction vessel 100 reaches the target temperature T2 (see FIG. 25). This solves the first and second problems.

[0275] Moreover, according to the second operation example of the reaction device 10C, the following advantage is obtained by storing the temperature control pattern in step S37.

[0276] That is, by storing the temperature control pattern in step S47, next time, when the same current temperature T1 as the previous time, the same target temperature T2 as the previous time, and the same desired heating rate Vt as the previous time are set in step S40, it is determined in step S41A that there are stored set values ​​(step S41A: YES), that is, the desired displacement speed and temperature control pattern corresponding to the current temperature T1 and target temperature T2 set in step S40 and the desired heating rate Vt set in step S31 are stored in the memory unit 207 (desired displacement speed DT4, temperature control pattern DT5), and the desired displacement speed and temperature control pattern are read out from the memory unit 207 (desired displacement speed DT4, temperature control pattern DT5) (step S42B) and used in the subsequent processing. Therefore, there is an advantage that the processing of steps S42 and S42A can be omitted.

[0277] In addition, by performing the processes of steps S47 to S49, the following advantage is obtained. That is, even if a desirable displacement speed and a temperature control pattern based on past experience are read out from the storage unit 207, the actual displacement speed in the currently executed pattern is not necessarily exactly the same as the past one. For this reason, when a desirable displacement speed and a temperature control pattern based on past experience are executed, both the past displacement speed and the current displacement speed are stored in the storage unit 207 (step S47). Then, if there is a difference between the two, the operator judges whether the difference is acceptable, and if the difference is not acceptable, the operator appropriately corrects the control conditions (heater control conditions), and further stores (overwrites) the result in the storage unit 207 (step S49). This has the advantage that the storage unit 207 can obtain new data for machine learning and use it for calculations to find rules for the temperature control pattern by comparing it with past data.

[0278] The above <Emergency Processing Example 1> to <Emergency Processing Example 3> can be applied to the Operation Example 2 of the reaction device 10C as well. As a result, the above Problem 3 is also solved in the Operation Example 2 of the reaction device 10C.

[0279] The invention made by the inventor has been specifically described above based on the embodiments, but it goes without saying that the present invention is not limited to the embodiments already described, and various modifications are possible without departing from the gist of the invention.

[0280] For example, in each of the above embodiments, the reaction apparatus of the present disclosure is applied to the reaction apparatus 10 (10A to 10C) including the reaction vessel 100 in which one end side A1 is supported (fixedly supported) by the first support part 103 in an immovable state and the other end side A2 is supported (movably supported) by the second support part 104 in a movably state, but the present disclosure is not limited thereto. For example, the reaction apparatus of the present disclosure may be applied to the reaction apparatus 10 (10A to 10C) including a reaction vessel (not shown) in which one end side A1 and the other end side A2 are each supported (movably supported) in a movably state. [Explanation of symbols]

[0281] 10, 10A, 10B, 10C...Reactor 100…Reaction vessel 101…Supply inlet 102…Outlet port 103...First support part 104…Second support part 104a…Convex part 104b…Top surface 104c, 104d...Standing part 106, 107...Bearings 108…Lid part 109…Flange section 109a…recess 109b…Bottom surface 109c, 109d...Protruding part 110…Temperature control area 111...Friction reducing material 112, 113...Bearings 114…Flange section 116...Reaction vessel drive device 120…Screw 121…Convex part 130...First fluid control region 131...1st fluid inlet 132…1st fluid outlet 133...First fluid supply pipe 134…First valve 140...Second fluid control region 141…Second fluid inlet 142…Second fluid outlet 143…Second fluid supply pipe 144…Second valve 150…Drive unit 151...Motor 152...Reducer 170…Floor surface 200...Control device 201... Overall control unit 202...Temperature control unit 203...Screw rotation control section 204...First fluid control section 205...Second fluid control section 206...IF control section 207...Storage section 210...Temperature control device 230...First fluid control device 240...Second fluid control device 250...Information input / output section A1…One end side A2…Other end side A3…middle part B1…One end side B2…Other end side E: Specific area G1~G4…Gap R10: Processing material R11...Product

Claims

1. a cylindrical reaction vessel including an intermediate portion between a supply portion and a delivery portion; A temperature control unit for controlling the temperature of the intermediate portion; The supply unit supplies a material to be treated to the reaction vessel, and the delivery unit delivers a product from the reaction vessel; a conveying mechanism that conveys the material to be treated from the supply portion side of the reaction vessel through the intermediate portion to the discharge portion side of the reaction vessel; Equipped with The temperature control unit controls a temperature increase rate or a temperature decrease rate of the intermediate portion so that an actual displacement rate of the specific portion of the reaction vessel follows a desired displacement rate of the specific portion of the reaction vessel.

2. a displacement speed storage unit that stores the desired displacement speed of the specific location; a position measuring device for measuring an actual position of the specific portion of the reaction vessel; The reaction apparatus according to claim 1 , further comprising: a displacement velocity calculation unit that calculates the actual displacement velocity of the specific point based on the actual position of the specific point measured by the position measurement device.

3. The reaction vessel includes a protruding portion protruding from a center in a longitudinal direction thereof, The reaction device according to claim 2 , wherein the specific location is a tip side of the protrusion.

4. The reaction apparatus according to claim 3 , wherein the displacement speed calculation unit calculates the actual displacement speed of the specific location based on the actual position of the specific location measured by the position measurement device and a correction value.

5. 2. The reaction apparatus according to claim 1, wherein the desired displacement speed is determined so as to minimize the difference between the temperature of the upper portion of the reaction vessel and the temperature of the lower portion of the reaction vessel.

6. The reaction device according to claim 3 , wherein the position measuring device is a contact-type position measuring device including a contactor that comes into contact with the tip side of the protrusion.

7. 2. The reaction apparatus according to claim 1, wherein the temperature control unit controls the temperature increase rate or temperature decrease rate of the intermediate portion to be increased when a deviation between the actual displacement rate of the specific location and the desired displacement rate of the specific location is positive, and controls the temperature increase rate or temperature decrease rate of the intermediate portion to be decreased when a deviation between the actual displacement rate of the specific location and the desired displacement rate of the specific location is negative.

8. A temperature control pattern storage unit that stores a temperature control pattern executed by the temperature control unit, The reaction apparatus according to claim 2 , wherein the temperature control unit controls a temperature increase rate or a temperature decrease rate of the intermediate portion based on the temperature control pattern.

9. The reaction apparatus according to claim 8, further comprising a temperature control pattern correction unit that corrects the temperature control pattern so that the difference between the temperature of the upper part of the reaction vessel and the temperature of the lower part of the reaction vessel is as small as possible and the displacement speed of the specific location is as fast as possible.

10. The reaction apparatus according to claim 9 , wherein the temperature control pattern correction unit corrects the temperature control pattern based on a result of machine learning.

11. An emergency operation control unit that executes an emergency process to avoid a situation in which the reaction device cannot operate normally, 2. The reaction apparatus according to claim 1, wherein the temperature control unit controls a temperature rise rate of the intermediate section, and when a predetermined condition is satisfied, the emergency operation control unit executes the emergency process.

12. The reaction apparatus according to claim 11, wherein the predetermined condition is satisfied when the change over time in the position of the specific point of the reaction vessel turns negative.

13. The reaction apparatus according to claim 11 , wherein the predetermined condition is satisfied when a deviation between the desired displacement rate and the actual displacement rate exceeds a threshold value.

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