Component mounting device and component mounting method

Abstract

To provide a component mounting device and a component mounting method, capable of performing a specific operation to a component supplied by any component supply devices even in a dual-head type.SOLUTION: A component mounting device 1 comprises: a specific operation unit U (a transfer material supply unit 5) that is arranged at a position where a first operation head H1 can access, but a second operation head H2 cannot access; a relay stage 10 that is arranged at a position where both of the first operation head H1 and the second operation head H2 can access; and a control part. The control part executes processing including: first processing Q1 making the second operation head H2 perform an operation for mounting a second component D2 on the relay stage 10; and second processing Q2 for holding the second component D2 mounted on the relay stage 10, and making the first operation head H1 perform the operation for being mounted on a substrate 3 via the specific operation unit U.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a component mounting device and a component mounting method for mounting components on a substrate. [Background technology]

[0002] Among component mounting devices that mount components on a board, those equipped with a specific operation unit that performs specific operations on the components are known. The specific operations here include operations of applying paste to the components, activating and cleaning the surfaces of the components, and inspecting the electrical characteristics of the components. Components that have protruding electrodes on their backs, such as BGAs, are mounted on the board after applying paste to the electrodes. The component mounting device of Patent Document 1 is configured to be able to mount two component supply devices that supply components at two locations, the front and the rear, and two component supply devices are installed at one of the front and rear locations, and one component supply device and a paste supply unit are installed at the other location. Then, the work head takes out the components from the other component supply device, and the paste supply unit applies paste to the electrodes on the backs of the components before mounting them on the board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-253713 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, among the narrow, compact component mounting devices, there are dual-head types equipped with two work heads, one at the front and one at the back. In some of these component mounting devices, when a tray feeder is installed at the front, there is no space beside it to install a paste supply unit, and the paste supply unit can only be installed at the rear in parallel with the tape feeder. However, in such compact component mounting devices, the front work head that picks up the tray components supplied by the tray feeder at the front cannot access the paste supply unit installed at the rear, and therefore cannot apply paste to the tray components. Similar problems occur not only in the case of applying paste to components, but also in the case of performing other specific tasks (surface activation, cleaning, electrical property inspection).

[0005] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a component mounting device and a component mounting method that are capable of performing a specific task on components supplied by either component supply device, even if the device is of the dual head type. [Means for solving the problem]

[0006] The component mounting device of the present invention comprises a first working head and a second working head having holding nozzles for holding components, a specific operation unit arranged at a position accessible by the first working head but not by the second working head and performing a specific operation on a component transferred by the first working head, an intermediate stage arranged at a position accessible by both the first working head and the second working head, and a control unit for controlling the operation of the first working head and the second working head, the control unit executing processes including a first process of causing the second working head to perform an operation of mounting a component on the intermediate stage, and a second process of causing the first working head to hold a component mounted on the intermediate stage by the second working head and transport it to the specific operation unit or mount it on a board via the specific operation unit.

[0007] The component mounting method of the present invention is a component mounting method in a component mounting device comprising a first working head and a second working head having holding nozzles for holding components, a specific operation unit arranged in a position accessible to the first working head but not to the second working head, which performs a specific operation on a component transferred by the first working head, and an intermediate stage arranged in a position accessible to both the first working head and the second working head, wherein the second working head mounts a component on the intermediate stage, the first working head holds the component mounted on the intermediate stage, and the component is transported to the specific operation unit or mounted on a board via the specific operation unit. Effect of the Invention

[0008] According to the present invention, even in the case of a dual head type, a specific operation can be performed on components supplied by either component supply device. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a schematic structure of a component mounting device according to an embodiment of the present invention; [Diagram 2] FIG. 1 is an explanatory diagram of a process for applying paste to bumps of a component using a transfer material supply unit provided in a component mounting device according to an embodiment of the present invention; [Diagram 3] FIG. 1 is an explanatory diagram of a process of mounting components having paste attached to their bumps onto a substrate in a component mounting device according to an embodiment of the present invention; [Figure 4] FIG. 1 is an explanatory diagram of an example of a process for mounting components supplied by a first component supply device onto a board in a component mounting device according to an embodiment of the present invention; [Diagram 5] FIG. 1 is an explanatory diagram of an example of a process in which a paste is applied to components supplied by a second component supply device in a component mounting device according to an embodiment of the present invention, and the components are mounted on a board. [Figure 6] FIG. 1 is an explanatory diagram of an example of a process in which a paste is applied to components supplied by a third component supply device in a component mounting device according to an embodiment of the present invention, and the components are mounted on a board. [Figure 7]FIG. 11 is an explanatory diagram of an example of a process for mounting components supplied by a fourth component supply device onto a board in a component mounting device according to an embodiment of the present invention; [Figure 8] 1A and 1B are explanatory diagrams illustrating an example of a process for applying paste to bumps of a component using a paste discharge unit provided in a component mounting device according to an embodiment of the present invention; [Figure 9] FIG. 1 is an explanatory diagram of an example of a process for irradiating plasma onto the back surface of a component using an atmospheric plasma unit provided in a component mounting device according to an embodiment of the present invention. [Figure 10] FIG. 1 is an explanatory diagram of an example of a process for inspecting electrical characteristics of a component using an electrical characteristic inspection unit provided in a component mounting device according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples and can be appropriately changed according to the specifications of the component mounting device, transfer material supply unit, and paste discharge unit. In the following, the same reference numerals are used for corresponding elements in all drawings, and duplicated explanations will be omitted. In FIG. 1 and some parts described later, the X-axis (left and right direction in FIG. 1) in the substrate transport direction and the Y-axis (up and down direction in FIG. 1) perpendicular to the substrate transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 1 and some parts described later, the Z-axis (perpendicular to the paper surface in FIG. 1) is shown as a height direction perpendicular to the horizontal plane. The specific work includes the work of attaching paste to the components, the work of activating and cleaning the surfaces of the components, the work of inspecting the electrical characteristics of the components, and the like.

[0011] First, the detailed configuration of the component mounting device 1 will be described with reference to Fig. 1. In the center of the base 2, the first board transport section L1 is disposed on the rear side in the Y-axis direction, and the second board transport section L2 is disposed on the front side. That is, the second board transport section L2 is disposed at a position away from the first board transport section L1 in the Y-axis direction. Hereinafter, in the Y-axis direction, the side where the first board transport section L1 is disposed will be referred to as the rear (lower side of the paper), and the side where the second board transport section L2 is disposed will be referred to as the front (upper side of the paper).

[0012] The first board transport section L1 is provided with a pair of first board transport conveyors K1 that transport the board 3 along the X-axis direction. The second board transport section L2 is provided with a pair of second board transport conveyors K2 that transport the board 3 along the X-axis direction. Hereinafter, unless there is a need to distinguish between them, the first board transport section L1 and the second board transport section L2 will be simply referred to as "board transport section L". The board transport section L transports the board 3 and positions and holds it at the mounting work position. Note that the component mounting device 1 is not limited to a configuration having two board transport sections L (first board transport section L1, second board transport section L2), and may be a configuration having one board transport section L.

[0013] In FIG. 1, a first unit mounting section S1 is provided behind the first substrate transport section L1. A second unit mounting section S2 is provided in front of the second substrate transport section L2. A dolly 6 having a plurality of tape feeders 4 and a transfer material supply unit 5 attached to the upper portion is attached to the first unit mounting section S1. The tape feeder 4 feeds the carrier tape holding the components by pitch feeding to supply the components to the component supply position. The transfer material supply unit 5 supplies paste to be attached to the components as described later. A tray feeder 7 is attached to the second unit mounting section S2. The tray feeder 7 supplies a plurality of components D accommodated in a tray 8 to the component supply position.

[0014] In Fig. 1, a Y-axis table 9 equipped with a linear drive mechanism is arranged along the Y-axis direction at both ends in the X-axis direction on the upper surface of the base 2. A first X-axis beam B1 equipped with a linear drive mechanism on the rear side is connected to the Y-axis table 9 so as to be movable back and forth along the Y-axis direction. In addition, a second X-axis beam B2 equipped with a linear drive mechanism on the front side is connected to the Y-axis table 9 so as to be movable back and forth along the Y-axis direction. The first X-axis beam B1 and the second X-axis beam B2 are arranged along the X-axis direction.

[0015] In Fig. 1, a first work head H1 that moves left and right along the X-axis direction is connected to the first X-axis beam B1. A second work head H2 that moves left and right along the X-axis direction is connected to the second X-axis beam B2. The first work head H1 and the second work head H2 each have a holding nozzle N that holds a component D at their lower end (see Fig. 2). The first work head H1 and the second work head H2 raise and lower the holding nozzle N in the vertical direction (Z-axis direction) and rotate it around the Z axis, thereby raising and lowering the component D held by the holding nozzle N and rotating it around the Z axis.

[0016] The first work head H1 moves horizontally (X-axis direction, Y-axis direction) by the Y-axis table 9 and the first X-axis beam B1, holds a component D supplied to the component supply position by the tape feeder 4 of the first unit mounting section S1, and mounts it on the board 3 held in the board transport section L. The second work head H2 moves horizontally by the Y-axis table 9 and the second X-axis beam B2, holds a component D supplied to the component supply position by the tray feeder 7 of the second unit mounting section S2, and mounts it on the board 3 held in the board transport section L. In this way, the component mounting device 1 is a dual-head type having two work heads (first work head H1, second work head H2).

[0017] 1, between the first unit mounting section S1 and the first board transport section L1 on the upper surface of the base 2, the first component camera C1 and the relay stage 10 are arranged side by side in the X-axis direction. Between the second unit mounting section S2 and the second board transport section L2 on the upper surface of the base 2, the second component camera C2 and the component recovery stage 11 are arranged side by side in the X-axis direction. On the relay stage 10, the component D held by the second working head H2 is temporarily mounted as described later, and the temporarily mounted component D is held by the first working head H1. That is, the component mounting device 1 of this embodiment can transfer the component D held by the second working head H2 to the first working head H1 via the relay stage 10.

[0018] When the first work head H1 or the second work head H2 holding the part D is positioned above, the first part camera C1 and the second part camera C2 capture an image of the part D held by the holding nozzle N from below. From the captured image, the position of the part D held by the holding nozzle N, the holding posture of the part D, the state of the bumps on the part D, the state of the paste attached to the bumps on the part D, etc. can be recognized. If the holding posture of the part D held by the first work head H1 or the second work head H2 is defective, the part D is discarded or collected on the part collection stage 11.

[0019] In FIG. 1, component mounting device 1 includes a control unit 13 that controls various operations, which will be described later, including the operations of first working head H1 and second working head H2.

[0020] The first working head H1 moves within a movement range A1 from the middle position of the first unit mounting part S1 on the rear side to the front of the second unit mounting part S2 on the front side as shown in Fig. 4. That is, the movement range A1 of the first working head H1 includes the component supply position of the tape feeder 4 of the first unit mounting part S1, the container 14 of the transfer material supply unit 5 (Fig. 2), the first component camera C1, the relay stage 10, the board 3 held at the mounting work position of the board transport part L, the second component camera C2, and the component recovery stage 11.

[0021] The second working head H2 moves within a movement range A2 from the middle position of the second unit mounting part S2 on the front side to the front of the first unit mounting part S1 on the rear side as shown in Fig. 4. That is, the movement range A2 of the second working head H2 includes the component supply position of the tray feeder 7 of the second unit mounting part S2, the second component camera C2, the component recovery stage 11, the board 3 held at the mounting work position of the board transport part L, the first component camera C1, and the relay stage 10.

[0022] 1, the transfer material supply unit 5, whose container 14 is included in the movement range A1 but not included in the movement range A2, is disposed in a position accessible to the first work head H1 but not to the second work head H2, and is a specific work unit U that supplies paste to be applied to the component D held by the first work head H1. Also, the relay stage 10, which is included in both the movement range A1 and the movement range A2, is disposed in a position accessible to both the first work head H1 and the second work head H2.

[0023] Moreover, the tape feeder 4 of the first unit mounting section S1, whose component supply position is included in the movement range A1 but not included in the movement range A2, is disposed in a position accessible to the first work head H1 but not to the second work head H2, and is a first component supply device F1 that supplies a first component D1. Moreover, the tray feeder 7 of the second unit mounting section S2, whose component supply position is included in the movement range A2 but not included in the movement range A1, is disposed in a position accessible to the second work head H2 but not to the first work head H1, and is a second component supply device F2 that supplies a second component D2.

[0024] Next, the main configuration of the transfer material supply unit 5 will be described with reference to Fig. 2. The transfer material supply unit 5 has a function of smoothing the liquid surface of the paste P or the like, which is the transfer material to be attached to the bumps B of the component D by transfer, and supplying it. The transfer material supply unit 5 is configured with a container 14 and a blade 15. The blade 15 is disposed above the concave-shaped container 14. A blade driving unit (not shown) controlled by the control unit 13 causes the blade 15 to reciprocate horizontally along the concave bottom surface of the container 14, thereby forming a coating of the paste P of a predetermined thickness on the bottom surface of the container 14.

[0025] Next, referring to FIG. 2, a paste attachment process (specific operation) will be described in which the first working head H1, holding the second component D2 supplied by the second component supply device F2 with the holding nozzle N, attaches the paste P to the bumps B of the second component D2 using the transfer material supply unit 5 (specific operation unit U). The second component D2 is supplied to the first working head H1 via the intermediate stage 10. In the paste attachment process, first, the control unit 13 moves the blade 15 of the transfer material supply unit 5 in the horizontal direction to form a coating film in the container 14 with the paste P on a smooth liquid surface. Next, the control unit 13 moves the first working head H1 holding the second component D2 to above the container 14 of the transfer material supply unit 5.

[0026] Next, the control unit 13 lowers the holding nozzle N holding the second component D2 to land the bumps B of the second component D2 on the coating of the paste P formed in the container 14 (arrow a). Next, the control unit 13 raises the holding nozzle N holding the second component D2 (arrow b). This causes the paste P to adhere to the bumps B of the second component D2. In this manner, the transfer material supply unit 5 (specific operation unit U) supplies the paste P with the liquid surface of the paste P smoothed, and the first work head H1 raises and lowers the holding nozzle N holding the second component D2 relative to the liquid surface of the paste P to adhere the paste P to the bumps B of the second component D2.

[0027] 3, a component mounting process will be described in which a first work head H1 mounts a second component D2 having a paste P applied to its bumps B on a substrate 3. Electrodes 3a to which the terminals and bumps B of the component D are bonded are formed on the surface of the substrate 3. Also, cream solder 16 (solder paste) has been applied in advance by a screen printing device or the like to the electrodes 3a on which a first component D1, which is a chip component supplied by a first component supply device F1 or the like, is to be mounted.

[0028] In the component mounting process, first, the control unit 13 moves the first work head H1, which holds the second component D2 with the paste P attached to the bumps B by the holding nozzle N, to above the mounting position on the substrate 3. Next, the control unit 13 lowers the holding nozzle N holding the second component D2 to land the bumps B of the second component D2 on the electrodes 3a of the substrate 3 (arrow c). Next, the control unit 13 releases the holding of the second component D2 by the holding nozzle N and raises the holding nozzle N (arrow d). This causes the second component D2 to be mounted on the substrate 3.

[0029] Next, the process that the control unit 13 causes the first working head H1 or the second working head H2 to perform, and the component mounting method in the component mounting device 1 will be described with reference to FIGS.

[0030] First, referring to Fig. 4, a third process Q3 in which the control unit 13 causes the first work head H1 to mount the first component D1 supplied by the first component supply device F1 on the board 3 will be described. In the third process Q3, the control unit 13 first moves the first work head H1 above the component supply position of the first component supply device F1 (tape feeder 4) and raises and lowers the holding nozzle N to pick up the first component D1. Next, the control unit 13 moves the first work head H1 above the first component camera C1 and causes the first component camera C1 to capture an image of the first component D1 held by the holding nozzle N, thereby recognizing the position and posture of the first component D1 held by the holding nozzle N.

[0031] Next, the control unit 13 moves the first work head H1 to above the board 3 held at the mounting work position of the board transport unit L (first board transport unit L1 or second board transport unit L2), corrects the stop position of the first work head H1 based on the recognition result by the first component camera C1, and mounts the first component D1 at the mounting position on the board 3. In this way, in the component mounting method (third process step) in the component mounting device 1, the first work head H1 mounts the first component D1 supplied by the first component supply device F1 onto the board 3.

[0032] Next, referring to Fig. 5, a first process Q1 in which the control unit 13 causes the second work head H2 to mount the second component D2 supplied by the second component supply device F2 on the intermediate stage 10 will be described. In the first process Q1, first, the control unit 13 moves the second work head H2 above the component supply position of the second component supply device F2 (tray feeder 7) and raises and lowers the holding nozzle N to pick up the second component D2. Next, the control unit 13 moves the second work head H2 above the second component camera C2 and causes the second component camera C2 to capture an image of the second component D2 held by the holding nozzle N, thereby recognizing the position, attitude, and state of the bump B of the second component D2 held by the holding nozzle N.

[0033] Next, the control unit 13 moves the second work head H2 to above the relay stage 10, and raises and lowers the holding nozzle N to place the second component D2 on the relay stage 10. Note that in the first process Q1, the imaging of the second component D2 by the second component camera C2 may be omitted, and the second component D2 may be placed on the relay stage 10 immediately after being picked up from the second component supply device F2.

[0034] Thus, in the component mounting method (first process step) in the component mounting device 1, the second work head H2 mounts the second component D2 supplied by the second component supply device F2 on the relay stage 10. The second component camera C2 constitutes a component recognition unit R that images the second component D2 held by the second work head H2 operating in the first process Q1 and recognizes the position where the holding nozzle N of the second component D2 holds it. The second component camera C2 also constitutes a component inspection unit T that images the second component D2 held by the second work head H2 operating in the first process Q1 and inspects the state of the bumps B of the second component D2, etc.

[0035] 5, a second process Q2 will be described in which the control unit 13 causes the first working head H1 to hold the second component D2 placed on the relay stage 10 by the second working head H2 and place it on the substrate 3 via the transfer material supply unit 5 (specific work unit U). In the second process Q2, the control unit 13 first moves the first working head H1 above the relay stage 10 and raises and lowers the holding nozzle N to pick up the second component D2 on the relay stage 10.

[0036] Next, the control unit 13 moves the first work head H1 above the first component camera C1, and causes the first component camera C1 to capture an image of the first component D1 held by the holding nozzle N, thereby recognizing the position, posture, and state of the bump B of the second component D2 held by the holding nozzle N. Next, the control unit 13 moves the first work head H1 above the transfer material supply unit 5 (specific work unit U) and executes the paste attachment process (FIG. 2). That is, the second process Q2 includes a paste attachment process (specific work) in which the holding nozzle N holding the second component D2 on the first work head H1 is raised and lowered relative to the liquid surface of the paste P to attach the paste to the second component D2.

[0037] 5, the control unit 13 then moves the first work head H1 above the first component camera C1, and causes the first component camera C1 to capture an image of the second component D2 held by the holding nozzle N, thereby recognizing the position and posture of the second component D2 held by the holding nozzle N, and the state of the paste P attached to the bumps B. Next, the control unit 13 moves the first work head H1 above the substrate 3 held at the mounting work position of the substrate transport unit L (first substrate transport unit L1 or second substrate transport unit L2), corrects the stop position of the first work head H1 based on the recognition result by the first component camera C1, and mounts the second component D2 at the mounting position on the substrate 3 (FIG. 3).

[0038] In the second process Q2, the imaging of the second component D2 by the first component camera C1 before the paste application process may be omitted, and the paste application process may be performed immediately after the second component D2 is picked up from the relay stage 10. In this case, the stop position of the first work head H1 when mounting the second component D2 at the mounting position on the board 3 is corrected based on the imaging result of the second component D2 by the first component camera C1 after the paste application process.

[0039] In this way, the component mounting method (second processing step) in component mounting device 1 holds second component D2 mounted on relay stage 10 with first work head H1, and mounts it on substrate 3 via transfer material supply unit 5 (specific work unit U). In this way, control unit 13 executes first processing Q1 and second processing Q2 on second component D2 supplied by second component supply device F2.

[0040] 5, the first component camera C1 constitutes a transfer material inspection section V that captures an image of the second component D2 held by the first work head H1 operating by the second process Q2 and inspects the state of the paste P attached to the bumps B of the second component D2. When the second component D2 held by the first work head H1 passes the inspection by the transfer material inspection section V, the control section 13 continues the second process Q2 and mounts the second component D2 on the substrate 3. When the second component D2 held by the first work head H1 fails the inspection by the transfer material inspection section V, the control section 13 interrupts the second process Q2.

[0041] Furthermore, in the first process Q1, when the second part D2 held by the second work head H2 fails the inspection by the part inspection unit T (second part camera C2), the control unit 13 causes the part recovery stage 11 to discard the second part D2, and causes the first process Q1 to be performed on the next second part D2. In other words, the control unit 13 performs the second process Q2 on the second part D2 that has passed the inspection by the part inspection unit T.

[0042] In FIG. 5, the control unit 13 may correct the stopping position of the first work head H1 when mounting the second component D2 on the relay stage 10 based on the recognition result received from the component recognition unit R (second component camera C2) in the second process Q2.

[0043] If the position of the second component D2 held by the holding nozzle N of the second working head H2 in the first process Q1 is misaligned, the position of the second component D2 mounted on the relay stage 10 will also be misaligned from a predetermined position. However, by correcting the stopping position of the first working head H1 when the first working head H1 holds the second component D2 mounted on the relay stage 10 in the second process Q2 based on the position of the second component D2 held by the second working head H2 recognized by the component recognition unit R in the first process Q1, the holding nozzle N of the first working head H1 can appropriately hold the second component D2.

[0044] Next, a fourth process Q4 that the control unit 13 causes the first working head H1 to perform in a first modified example of a component mounting device (hereinafter referred to as "component mounting device 1A") will be described with reference to Fig. 6. The component mounting device 1A differs from the component mounting device 1 shown in Fig. 1 in that a tape feeder 4A that supplies a third component D3 (Fig. 2) having a bump B is mounted on a carriage 6 mounted on the first unit mounting section S1. Hereinafter, in the component mounting device 1A, the same parts as those in the component mounting device 1 are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

[0045] In component mounting device 1A, similarly to component mounting device 1, control unit 13 executes a first process Q1 and a second process Q2 on second component D2 supplied by second component supplying device F2 (tray feeder 7).

[0046] 6, in component mounting device 1A, the component supply position of tape feeder 4A is included in movement range A1 but not in movement range A2. That is, tape feeder 4A in first unit mounting section S1 is disposed in a position accessible to first working head H1 but not accessible to second working head H2, and is a third component supply device F3 that supplies a third component D3.

[0047] In the fourth process Q4, first, the control unit 13 moves the first work head H1 above the component supply position of the third component supply device F3 (tape feeder 4A) and raises and lowers the holding nozzle N to pick up the third component D3. Next, the control unit 13 moves the first work head H1 above the first component camera C1 and causes the first component camera C1 to capture an image of the third component D3 held by the holding nozzle N and inspect the state of the bump B of the third component D3 held by the holding nozzle N. If the inspection of the bump B by the first component camera C1 is unsuccessful, the control unit 13 discards the third component D3 held by the first work head H1 to the component recovery stage 11 and picks up the next third component D3 from the third component supply device F3.

[0048] 6, when the inspection of the bump B by the first component camera C1 is found to be successful, the control unit 13 moves the second work head H2 above the transfer material supply unit 5 (specific work unit U) to perform a paste attachment process (specific work). Next, the control unit 13 moves the first work head H1 above the first component camera C1 and causes the first component camera C1 to capture an image of the third component D3 held by the holding nozzle N, thereby recognizing the position and posture of the third component D3 held by the holding nozzle N and the state of the paste P attached to the bump B.

[0049] Next, the control unit 13 moves the first work head H1 above the substrate 3 held at the mounting position of the substrate transport unit L (first substrate transport unit L1 or second substrate transport unit L2), corrects the stop position of the first work head H1 based on the recognition result by the first component camera C1, and mounts the third component D3 at the mounting position on the substrate 3. Note that the image capture of the third component D3 by the first component camera C1 before the paste application process may be omitted, and the paste application process may be performed immediately. In this case, the state of the bumps B of the third component D3 is inspected based on the image capture result of the third component D3 by the first component camera C1 after the paste application process.

[0050] In this way, the control unit 13 executes a fourth process Q4 in which the first working head H1 holds the third component D3 supplied by the third component supplying device F3 and mounts it on the board 3 via the transfer material supplying unit 5 (specific work unit U). Also, in the component mounting method (fourth process step) in the component mounting device 1, the first working head H1 holds the third component D3 supplied by the third component supplying device F3 and mounts it on the board 3 via the transfer material supplying unit 5 (specific work unit U).

[0051] Next, referring to Fig. 7, a fifth process Q5 that the control unit 13 causes the second work head H2 to perform in a second modified example of a component mounting device (hereinafter referred to as "component mounting device 1B") will be described. Component mounting device 1B differs from component mounting device 1 shown in Fig. 1 in that a small tray feeder 7B (second component supply device F2) and a tape feeder 4B that supplies fourth components D4 (Fig. 3), which are chip components, are mounted in the second unit mounting section S2. Hereinafter, in component mounting device 1B, the same parts as those in component mounting device 1 are denoted by the same reference numerals, and detailed descriptions thereof will be omitted.

[0052] In component mounting device 1B, similarly to component mounting device 1, control unit 13 executes a first process Q1 and a second process Q2 on second component D2 supplied by second component supplying device F2 (tray feeder 7B).

[0053] 7, in component mounting device 1B, the component supply position of tape feeder 4B is included in movement range A2 but not in movement range A1. That is, tape feeder 4B in second unit mounting section S2 is disposed in a position accessible to second working head H2 but not accessible to first working head H1, and is a fourth component supply device F4 that supplies a fourth component D4.

[0054] In the fifth process Q5, first, the control unit 13 moves the second work head H2 above the component supply position of the fourth component supply device F4 (tape feeder 4B) and raises and lowers the holding nozzle N to pick up the fourth component D4. Next, the control unit 13 moves the second work head H2 above the second component camera C2 and causes the second component camera C2 to capture an image of the fourth component D4 held by the holding nozzle N, thereby recognizing the position and posture of the fourth component D4 held by the holding nozzle N.

[0055] In Figure 7, the control unit 13 then moves the second work head H2 above the board 3 held at the mounting work position of the board transport unit L (first board transport unit L1 or second board transport unit L2), corrects the stopping position of the second work head H2 based on the recognition results by the second component camera C2, and mounts the fourth component D4 at the mounting position on the board 3.

[0056] In this manner, the control unit 13 executes a fifth process Q5 in which the second work head H2 performs an operation of mounting the fourth component D4 supplied by the fourth component supply device F4 onto the board 3. In addition, in the component mounting method (fifth process) in the component mounting device 1, the second work head H2 mounts the fourth component D4 supplied by the fourth component supply device F4 onto the board 3.

[0057] Next, referring to Fig. 8(a), a paste discharge unit 17 that sprays paste P onto bumps B of component D will be described. The paste discharge unit 17 is a jet-type dispenser having a discharge port 17a at its upper portion that sprays (discharges) droplets of paste P of a predetermined size. The paste discharge unit 17 can be used as a specific operation unit U that is mounted on the first unit mounting part S1 in place of the transfer material supply unit 5.

[0058] 8(a) and 8(b), a paste application process will be described in which the first work head H1 holding the second component D2 supplied by the second component supply device F2 with the holding nozzle N applies paste P to the bumps B of the second component D2 using the paste discharge unit 17. In the paste application process using the paste discharge unit 17, first, the control unit 13 moves the first work head H1 holding the second component D2 above the paste discharge unit 17, and positions the bumps B to which the paste P is to be applied above the discharge port 17a.

[0059] Next, the control unit 13 causes the paste discharge unit 17 to spray droplets of the paste P from the discharge port 17a (arrow e). This causes the paste P to adhere to one bump B. Thereafter, the control unit 13 moves the first work head H1 horizontally to position the next bump B above the discharge port 17a (arrow f), and sprays droplets of the paste P from the discharge port 17a to adhere the paste P to the next bump B. Thereafter, the control unit 13 repeatedly executes the movement of the first work head H1 (arrow f) and the spraying of droplets of the paste P from the discharge port 17a (arrow e) until the paste P adheres to all bumps B of the second component D2.

[0060] In this way, the paste discharge unit 17 is a specific operation unit U that performs a specific operation of spraying the paste P onto the second component D2 held by the holding nozzle N. When the paste discharge unit 17 attached to the first unit attachment part S1 is the specific operation unit U, the second process Q2 includes a process of moving the holding nozzle N holding the second component D2 on the first work head H1 horizontally relative to the discharge port 17a to apply the paste P to the second component D2.

[0061] As described above, the component mounting device 1 of this embodiment comprises a first work head H1 and a second work head H2 each having a holding nozzle N for holding a component D, a specific work unit U (transfer material supply unit 5 or paste ejection unit 17) arranged in a position accessible to the first work head H1 but not to the second work head H2, which performs a specific work on a second component D2 transported by the first work head H1, an intermediate stage 10 arranged in a position accessible to both the first work head H1 and the second work head H2, and a control unit 13 which controls the operation of the first work head H1 and the second work head H2.

[0062] Then, the control unit 13 executes processes including a first process Q1 in which the second working head H2 performs an operation of mounting the second component D2 on the relay stage 10, and a second process Q2 in which the first working head H1 performs an operation of holding the second component D2 mounted on the relay stage 10 by the second working head H2 and mounting it on the substrate 3 via the specific operation unit U (transfer material supply unit 5 or paste discharge unit 17). This allows the paste P to adhere to the components D supplied by the front and rear component supply devices (second component supply device F2, third component supply device F3) even in the case of a dual head type.

[0063] In the embodiments described so far, a component mounting device (component mounting method) has been described in which a transfer material supply unit 5 or a paste discharge unit 17 is used as the specific operation unit U, but the same applies when an atmospheric pressure plasma unit that performs surface activation of the components or an electrical characteristic inspection unit that performs electrical characteristic inspection of the components is used as the specific operation unit U.

[0064] Next, referring to Figure 9, a specific operation will be described in which an atmospheric pressure plasma unit 18 is used as a specific operation unit U to irradiate plasma onto the back surface of a fifth part D5 (part) held by the first work head H1, to perform surface activation and cleaning of the fifth part D5.

[0065] 7, an example will be described in which an atmospheric pressure plasma unit 18 is arranged as the specific operation unit U in place of the transfer material supply unit 5. That is, the atmospheric pressure plasma unit 18 is arranged in a position that is accessible to the first working head H1 but not accessible to the second working head H2.

[0066] 9, atmospheric plasma unit 18 includes plasma generator 19 that generates plasma, and injection nozzle 20 that injects the generated plasma upward. Also, tray 8 of tray feeder 7B (second component supply device F2) contains fifth components D5 having multiple flat electrodes E on the back surface thereof.

[0067] First, the control unit 13 causes the second working head H2 to perform a first process Q1 in which the fifth component D5 supplied by the tray feeder 7B is held by the holding nozzle N and mounted on the relay stage 10. Next, the control unit 13 causes the holding nozzle N of the first working head H1 to hold the fifth component D5 mounted on the relay stage 10, and moves the fifth component D5 above the atmospheric plasma unit 18 (specific operation unit U) and stops it for a predetermined time. As a result, the planar electrode E of the fifth component D5 is cleaned by the plasma sprayed from the atmospheric plasma unit 18 and the surface is activated (specific operation).

[0068] 9, the control unit 13 then moves the first working head H1 above the substrate 3 to mount the fifth component D5 at the mounting position on the substrate 3. In this manner, the control unit 13 executes a second process Q2 in which the first working head H1 holds the fifth component D5 mounted on the relay stage 10 and mounts it on the substrate 3 via the atmospheric plasma unit 18 (specific operation unit U).

[0069] 10, a specific operation for inspecting the electrical characteristics of the sixth component D6 (component) will be described using an electrical characteristic inspection unit 21 that inspects the electrical characteristics of the sixth component D6 (component) transferred by the first work head H1 as the specific operation unit U. The inspection of the electrical characteristics of the component by the electrical characteristic inspection unit 21 (specific operation) is performed when components are replenished to a component supplying device such as a tape feeder or a tray feeder.

[0070] 7 will be described as an example in which an electrical characteristic inspection unit 21 is arranged as a specific operation unit U in place of the transfer material supply unit 5. That is, the electrical characteristic inspection unit 21 is arranged in a position that is accessible to the first working head H1 but not accessible to the second working head H2.

[0071] 10, the electrical characteristic inspection unit 21 includes a measurement table 23 on whose surface electrode pads 22 electrically connectable with terminals G of a sixth component D6 are arranged, a measurement unit 24 for measuring electrical characteristics such as resistance and capacitance of the sixth component D6 connected to the electrode pads 22, and a waste box 25 for disposing of the components. The sixth component D6 is accommodated in a tray 8 of a tray feeder 7B (second component supply device F2). The sixth component D6 may be supplied by a tape feeder 4B (fourth component supply device F4).

[0072] First, the control unit 13 causes the second working head H2 to perform a first process Q1 in which the sixth component D6 supplied by the tray feeder 7B is held by the holding nozzle N and mounted on the relay stage 10. Next, the control unit 13 executes a second process Q2 in which the sixth component D6 mounted on the relay stage 10 is held by the holding nozzle N of the first working head H1, and the sixth component D6 is transferred onto the electrode pad 22 of the electrical characteristic inspection unit 21 (specific operation unit U).

[0073] In Fig. 10, the sixth component D6 transferred onto the electrode pad 22 is pressed against the electrode pad 22 by a component presser (not shown) made of an insulating material possessed by the electrical characteristic inspection unit 21, and the electrical characteristics are measured by the measurement unit 24. If the holding nozzle N is made of an insulating material, the sixth component D6 may be pressed against the electrode pad 22 while the holding nozzle N holds the sixth component D6, and the electrical characteristics may be measured. From the measurement results of the electrical characteristics, it is inspected whether the sixth component D6 has been properly supplied to the tray feeder 7B. If the inspection result is unsuccessful, i.e., if the component supplied to the tray feeder 7B is incorrect, the control unit 13 suspends the component mounting operation and notifies the operator that the component supplied to the tray feeder 7B is incorrect.

[0074] After the electrical characteristics are measured, the electrical characteristic inspection unit 21 executes a sixth process Q6 in which the sixth component D6 whose electrical characteristics have failed is disposed of in the disposal box 25 by a disposal means (not shown) that moves the components on the measurement stage 23 to the disposal box 25 by air or the like. Alternatively, if the measurement result of the electrical characteristics is passed, the control unit 13 executes a seventh process Q7 in which the sixth component D6 on the measurement stage 23 is mounted at the mounting position on the board 3. Note that even if the measurement result is passed, the sixth process Q6 in which the sixth component D6 whose electrical characteristics have been measured is disposed of in the disposal box 25 may be executed.

[0075] 10, if the measurement result of the electrical characteristics by the electrical characteristic inspection unit 21 is acceptable, that is, if the components supplied to the tray feeder 7B are correct, there is no need to inspect the electrical characteristics of the sixth component D6 supplied from the tray feeder 7B thereafter. Therefore, the control unit 13 executes a fifth process Q5 in which the second work head H2 performs an operation of mounting the sixth component D6 supplied by the tray feeder 7B onto the board 3. [Industrial Applicability]

[0076] The component mounting device and component mounting method of the present invention have the advantage that, even if it is a dual head type, specific tasks can be performed on components supplied by either component supply device, and are useful in fields where components are mounted on boards. [Explanation of symbols]

[0077] 1, 1A, 1B Component mounting equipment 5 Transfer material supply unit 10 Relay Stage 13 Control section 17 Paste Dispensing Unit 18 Atmospheric Pressure Plasma Unit 21 Electrical Characteristics Test Unit D parts D1 First part D2 Second part D3 Third part D4 Fourth part D5 5th part D6 6th part F1 1st parts supply device F2 Second part supply device F3 Third parts supply device F4 4th parts supply device H1 First working head H2 No. 2 working head N Retaining nozzle P Paste Q1 First process Q2 Second Processing Q3 Third Processing Q4 Fourth Processing Q5 Fifth Processing R Component recognition section T Parts Inspection Department U Specific Work Unit

Claims

1. a first work head and a second work head each having a holding nozzle for holding a component; a specific operation unit that is located at a position accessible to the first work head but not accessible to the second work head and that performs a specific operation on a part transferred by the first work head; an intermediate stage disposed at a position accessible to both the first working head and the second working head; A control unit is provided for controlling the operation of the first working head and the second working head, The control unit is a first process for causing the second working head to perform an operation of mounting a component on the intermediate stage; a second process of causing the first work head to hold the component mounted on the relay stage by the second work head and transport it to the specific work unit or mount it on a substrate via the specific work unit.

2. the specific operation unit is a transfer material supplying unit that supplies the paste with a smooth liquid surface, 2. The component mounting device according to claim 1, wherein the second process includes a process of applying the paste to the component by raising and lowering the holding nozzle holding the component on the first working head relative to the liquid surface.

3. 2. The component mounting device according to claim 1, wherein the specific operation unit is a paste ejection unit that sprays paste onto the component held by the holding nozzle.

4. 2. The component mounting device according to claim 1, wherein the specific operation unit is an atmospheric pressure plasma unit that irradiates plasma onto a back surface of the component held by the first working head.

5. 2. The component mounting device according to claim 1, wherein the specific operation unit is an electrical characteristic inspection unit that inspects electrical characteristics of the component transferred by the first work head.

6. a first component supply device disposed at a position accessible to the first work head but inaccessible to the second work head, the first component supply device supplying a first component; a second component supply device that is disposed at a position accessible to the second work head but not accessible to the first work head and supplies a second component; The component mounting device according to claim 1 , wherein the control unit executes the first process and the second process on a second component supplied by the second component supply device.

7. 7. The component mounting device according to claim 6, wherein the control unit is capable of executing a third process of causing the first work head to perform an operation of mounting the first component, supplied by the first component supply device, onto a board.

8. a third component supply device that is disposed at a position accessible to the first work head but inaccessible to the second work head and supplies a third component; 7. The component mounting device according to claim 6, wherein the control unit executes a fourth process of causing the first work head to hold a third component supplied by the third component supply device and mount the third component on a board via the paste supply unit.

9. a fourth component supply device that is disposed at a position accessible to the second work head but not accessible to the first work head and supplies a fourth component; 7. The component mounting device according to claim 6, wherein the control unit executes a fifth process of causing the second work head to perform an operation of mounting a fourth component, supplied by the fourth component supply device, onto a board.

10. a component recognition unit that captures an image of a component held by the second work head during operation by the first process and recognizes a position of the component; 2 . The component mounting device according to claim 1 , wherein the control unit corrects a stop position of the first work head when mounting the component on the intermediate stage based on a recognition result received from the component recognition unit in the second process.

11. a component inspection unit that captures an image of a component held by the second work head during operation by the first process and inspects the component; The component mounting device according to claim 1 , wherein the control unit performs the second process on components that have passed the inspection by the component inspection unit.

12. A component mounting method in a component mounting device including a first working head and a second working head each having a holding nozzle for holding a component, a specific operation unit disposed at a position accessible to the first working head but not to the second working head, the specific operation unit performing a specific operation on a component transferred by the first working head, and an intermediate stage disposed at a position accessible to both the first working head and the second working head, comprising: The second work head mounts a component on the intermediate stage; A component mounting method, comprising: holding a component mounted on the relay stage by the first working head; transferring the component to the specific operation unit; or mounting the component on a board via the specific operation unit.

13. the specific operation unit is a transfer material supplying unit that supplies the paste with a smooth liquid surface, The component mounting method according to claim 12 , wherein the first work head raises and lowers the holding nozzle holding the component relative to the liquid surface to apply the paste to the component.

14. 13. The component mounting method according to claim 12, wherein the specific operation unit is a paste ejection unit that sprays paste onto the component held by the holding nozzle.

15. 13. The component mounting method according to claim 12, wherein the specific operation unit is an atmospheric pressure plasma unit that irradiates plasma onto a back surface of the component held by the first working head.

16. 13. The component mounting method according to claim 12, wherein the specific operation unit is an electrical characteristic inspection unit that inspects electrical characteristics of the component transferred by the first work head.

17. a first component supply device disposed at a position accessible to the first work head but inaccessible to the second work head, the first component supply device supplying a first component; a second component supply device that is disposed at a position accessible to the second work head but not accessible to the first work head and supplies a second component; 13. The component mounting method according to claim 12, wherein the second work head mounts the second component, which is supplied by the second component supply device, onto the intermediate stage.

18. 18. The component mounting method according to claim 17, wherein the first work head mounts the first component, supplied by the first component supply device, onto the board.

19. a third component supply device that is disposed at a position accessible to the first work head but inaccessible to the second work head and supplies a third component; 18. The component mounting method according to claim 17, wherein the first work head holds a third component supplied by the third component supply device and mounts the third component on the board via the paste supply section.

20. a fourth component supply device that is disposed at a position accessible to the second work head but not accessible to the first work head and supplies a fourth component; 18. The component mounting method according to claim 17, wherein the second work head mounts a fourth component, supplied by the fourth component supply device, onto the board.

21. a component recognition unit that captures an image of a component held by the second work head and recognizes a position of the component before the component is mounted on the relay stage; 13. The component mounting method according to claim 12, wherein a stop position of the first work head when mounting the component on the relay stage is corrected based on the recognition result received from the component recognition unit.

22. a component inspection unit that captures an image of the component held by the second working head and inspects the component before the component is mounted on the relay stage, The component mounting method according to claim 12 , wherein the first work head transfers the components that have passed the inspection by the component inspection section to the specific operation unit or mounts the components on the board via the specific operation unit.

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