Magnetic sensor and magnetic sensor device

Abstract

To increase a region where components other than a magnetic sensor or a magnetic sensor device are arranged, in a component placement surface of a substrate where the magnetic sensor or the magnetic sensor device is arranged utilizing a large Barkhausen effect.SOLUTION: A magnetic sensor 1 includes: a magnetic wire material 2 for exerting a large Barkhausen effect; a coil 3; and a bobbin 4. The bobbin 4 includes: an electric wire winding part in which the magnetic wire material 2 is arranged inside and a coil 3 is provided at an outer peripheral part; and a pair of support pillar parts 7 provided at both end side portions of the electric wire winding part. The pair of support pillar parts 7 protrudes downward from both end side parts of the electric wire winding parts, respectively. The protrusion amounts are set in such a manner that, when the magnetic sensor 1 is mounted on the substrate 11, a component arrangement space 8 is formed where a component 12 can be placed between a portion opposing to a component placement surface 11A on the outer peripheral surface of the coil 3 and the component placement surface 11A.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a magnetic sensor and a magnetic sensor device that utilizes the large Barkhausen effect. [Background technology]

[0002] The magnetic sensor utilizing the Large Barkhausen effect includes a magnetic wire, a coil, and a bobbin that exhibit the Large Barkhausen effect. The magnetic wire is provided inside the bobbin, and the coil is formed by winding an electric wire around the bobbin and is provided on the outer periphery of the magnetic wire.

[0003] A magnetic wire that exhibits the Large Barkhausen effect has uniaxial anisotropy, in which the direction in which magnetization is easiest is the axial direction of the magnetic wire. This magnetic wire also has the property that the magnetization direction of the magnetic wire suddenly reverses in response to a change in the direction of an external magnetic field. The sudden reversal of the magnetization direction of the magnetic wire generates a pulse-like current in the coil. This current is extracted as a detection pulse, and the change in the direction of the external magnetic field can be detected based on the detection pulse.

[0004] A magnetic sensor using the Great Barkhausen effect can be used as a detection element for detecting the rotation of a rotating body. An example is described in International Publication No. 2016 / 021074. When detecting the rotation of a rotating body using a magnetic sensor using the Great Barkhausen effect, the magnet and the rotating body are made to rotate together by a method such as fixing a magnet to the rotating body. As a result, a rotating magnetic field is formed around the rotating body when the rotating body rotates. In addition, a plurality of magnetic sensors are provided on a substrate, and the substrate is provided on the outer periphery side of the rotating body so as not to contact either the rotating body or the magnet. The plurality of magnetic sensors are disposed in different positions in the rotation direction of the magnet near the rotation orbit of the magnet. As a result, when the rotating body rotates, the plurality of magnetic sensors are placed in a rotating magnetic field. As a result, the direction of the external magnetic field acting on each magnetic sensor changes according to the rotation of the rotating body, so that a detection pulse is obtained from the coil of each magnetic sensor. Furthermore, by arranging the multiple magnetic sensors at different positions in the rotation direction of the magnet, the timing at which the direction of the external magnetic field changes in each magnetic sensor can be made different in response to the rotation of the rotating body, and therefore the timing at which detection pulses are obtained from the coils of each magnetic sensor can be made different in response to the rotation of the rotating body. This makes it possible to detect the amount of rotation, rotation angle, number of rotations, rotation direction, etc. of the rotating body based on the detection pulses obtained from the coils of each magnetic sensor. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2016 / 021074 Summary of the Invention [Problem to be solved by the invention]

[0006] For example, when detecting the rotation of a rotating body using a magnetic sensor utilizing the large Barkhausen effect, the magnetic sensor utilizing the large Barkhausen effect is mounted on a substrate. In many cases, in addition to the magnetic sensor, a plurality of electric and electronic components are mounted on the substrate. The electric and electronic components mounted on the substrate may be various components such as resistors, capacitors, diodes, transistors, and integrated circuits.

[0007] Since a magnetic sensor utilizing the Large Barkhausen effect has a structure in which a coil is provided on the outer periphery of a magnetic wire that produces the Large Barkhausen effect, it is difficult to reduce its size to the order of millimeters. Therefore, when a magnetic sensor utilizing the Large Barkhausen effect is placed on the component mounting surface of a circuit board, the proportion of the area of ​​the component mounting surface of the circuit board that is occupied by the magnetic sensor increases, and as a result, there is a risk that the area of ​​the component mounting surface of the circuit board for placing electric and electronic components other than the magnetic sensor will be insufficient.

[0008] The present invention has been made in consideration of problems such as those described above, and an object of the present invention is to provide a magnetic sensor that utilizes the large Barkhausen effect and that can increase the area for placing components other than the magnetic sensor on the component mounting surface of a substrate on which the magnetic sensor is placed, or a magnetic sensor device that utilizes the large Barkhausen effect and that can increase the area for placing components other than the magnetic sensor on the component mounting surface of a substrate on which the magnetic sensor is placed. [Means for solving the problem]

[0009] In order to solve the above problems, the magnetic sensor of the present invention is a magnetic sensor utilizing the Large Barkhausen effect, and includes a magnetic wire that exhibits the Large Barkhausen effect, a coil through which a current flows according to a change in the magnetization direction of the magnetic wire, an electric wire winding section in which the magnetic wire is disposed and an electric wire that forms the coil is wound around the outer periphery, and a bobbin having a pair of support parts provided on both end portions of the electric wire winding section, the pair of support parts being arranged in a direction intersecting an axis of the electric wire winding section from both end portions of the electric wire winding section, The magnetic sensor is characterized in that the end surface of each support part on the protruding end side becomes a surface that contacts the component mounting surface when the magnetic sensor is mounted on the board, and the protruding amount in the one direction from both end portions of the electric wire winding part of the pair of support parts is set so that when the magnetic sensor is mounted on the board, a component placement space is formed between the part of the outer circumferential surface of the coil facing the component mounting surface and the component mounting surface, in which components other than the magnetic sensor that are expected to be placed on the component mounting surface can be placed. According to the magnetic sensor of the present invention, on the component mounting surface of the board on which the magnetic sensor is disposed, components other than the magnetic sensor that are expected to be placed on the component mounting surface can be placed in the area where the component placement space is formed. In this way, according to the magnetic sensor of the present invention, it is possible to increase the area for placing components other than the magnetic sensor on the component mounting surface of the board on which the magnetic sensor is disposed.

[0010] In the magnetic sensor of the present invention, the protrusion amount of the pair of support parts is preferably set so that when the magnetic sensor is mounted on the board, the distance between the component mounting surface and a portion of the outer circumferential surface of the coil that faces the component mounting surface is greater than the height of the component. In the magnetic sensor of the present invention, the protrusion amount of the pair of support parts may be set so that when the magnetic sensor is mounted on the board, the distance between the component mounting surface and a portion of the outer circumferential surface of the coil that faces the component mounting surface is greater than or equal to the height of the component plus an insulation distance to be secured between the component and the magnetic sensor.

[0011] In order to solve the above problems, the magnetic sensor device of the present invention is a magnetic sensor device that utilizes the Large Barkhausen effect, and includes a magnetic sensor having a magnetic wire that exhibits the Large Barkhausen effect, a coil through which a current flows according to a change in the magnetization direction of the magnetic wire, and a bobbin in which the magnetic wire is disposed and an electric wire that forms the coil is wound around the outer periphery, and a sensor support member for supporting the magnetic sensor on a component mounting surface of a circuit board, the sensor support member including a main body having a predetermined three-dimensional shape extending in a first direction, a sensor attachment portion provided on the main body for attaching the magnetic sensor to the main body in a direction in which the axis of the bobbin is parallel to a plane including the first direction, and a sensor support portion for supporting the magnetic sensor on the main body in a direction in which the axis of the bobbin is parallel to a plane including the first direction. The magnetic sensor device according to the present invention has a plurality of support parts provided on the main body part, each of the support parts protruding from the main body part in a second direction intersecting with a plane including the first direction, an end face of the protruding end side of each support part becomes a surface that contacts the component mounting surface when the magnetic sensor device is mounted on the board, and the amount of protrusion of each support part from the main body part in the second direction is set so that when the magnetic sensor device is mounted on the board, a component placement space is formed between the component placement surface and a part of the outer peripheral surface of the coil of the magnetic sensor attached to the sensor attachment part that faces the component placement surface. According to the magnetic sensor device of the present invention, a component other than the magnetic sensor device that is expected to be placed on the component placement surface can be placed in an area where a component placement space is formed on the component placement surface of the board on which the magnetic sensor device is placed. In this way, according to the magnetic sensor device of the present invention, it is possible to increase the area for placing components other than the magnetic sensor device on the component placement surface of the board on which the magnetic sensor device is placed.

[0012] In the magnetic sensor device of the present invention, the protrusion amount of each support part is preferably set so that when the magnetic sensor device is mounted on the substrate, the distance between the component mounting surface and a portion of the outer peripheral surface of the coil of the magnetic sensor attached to the sensor mounting part that faces the component mounting surface is greater than the height of the component. In the magnetic sensor device of the present invention, the protrusion amount of each support part may be set so that when the magnetic sensor device is mounted on the substrate, the distance between the component mounting surface and a portion of the outer peripheral surface of the coil of the magnetic sensor attached to the sensor mounting part that faces the component mounting surface is greater than the height of the component plus an insulation distance to be secured between the component and the magnetic sensor.

[0013] In the magnetic sensor device of the present invention, the sensor support member may have a fixing portion for fixing the sensor support member to the substrate using a fixing device. In the magnetic sensor device of the present invention, the main body may be provided with a yoke for controlling the direction of the magnetic flux of the magnetic field acting on the magnetic sensor. In the magnetic sensor device of the present invention, a plurality of the magnetic sensors may be provided, and the sensor support member may have a plurality of sensor mounting portions for mounting the plurality of magnetic sensors to the main body, respectively. Effect of the Invention

[0014] According to the present invention, it is possible to provide a magnetic sensor utilizing the large Barkhausen effect, which allows an area for arranging components other than the magnetic sensor to be increased on the component mounting surface of a substrate on which the magnetic sensor is mounted. Also, according to the present invention, it is possible to provide a magnetic sensor device utilizing the large Barkhausen effect, which allows an area for arranging components other than the magnetic sensor to be increased on the component mounting surface of a substrate on which the magnetic sensor is mounted. [Brief description of the drawings]

[0015] [Figure 1] 1 is a perspective view showing an embodiment of a magnetic sensor of the present invention. [Diagram 2] FIG. 2 is a front view of an embodiment of the magnetic sensor of the present invention. [Diagram 3] FIG. 2 is a perspective view showing a state in which a coil is removed from the magnetic sensor according to the embodiment of the present invention. [Figure 4] FIG. 2 is an explanatory diagram showing an embodiment of a magnetic sensor of the present invention mounted on a substrate. [Diagram 5] FIG. 1 is an explanatory diagram showing a rotation detection device as an example of an application of an embodiment of a magnetic sensor of the present invention. [Figure 6] 6 is an explanatory diagram showing the operation of a magnetic sensor in the rotation detection device in FIG. 5. [Figure 7] 1 is a perspective view showing a magnetic sensor device according to a first embodiment of the present invention. [Figure 8] FIG. 2 is a perspective view showing a magnetic sensor and a yoke in the magnetic sensor device according to the first embodiment of the present invention. [Figure 9] 1 is a perspective view showing a magnetic sensor in a magnetic sensor device according to a first embodiment of the present invention. [Figure 10] FIG. 1 is an explanatory diagram illustrating a magnetic sensor in a magnetic sensor device according to a first embodiment of the present invention. [Figure 11] 3 is an explanatory diagram showing a yoke provided inside a sensor support member in the magnetic sensor device according to the first embodiment of the present invention. FIG. [Figure 12] FIG. 1 is an explanatory diagram illustrating a magnetic sensor device according to a first embodiment of the present invention. [Figure 13] 5A to 5C are explanatory views showing a method of attaching a magnetic sensor to a sensor support member in the magnetic sensor device according to the first embodiment of the present invention. [Figure 14] FIG. 2 is an explanatory diagram showing a magnetic sensor device according to a first embodiment of the present invention mounted on a substrate. [Figure 15] FIG. 1 is an explanatory diagram showing a rotation detection device as an example of use of the magnetic sensor device according to a first embodiment of the present invention. [Figure 16]16 is an explanatory diagram showing a function of a yoke of the magnetic sensor device in the rotation detection device in FIG. 15. [Figure 17] FIG. 11 is a perspective view showing a state in which a magnetic sensor device according to a second embodiment of the present invention is mounted on a substrate, as viewed obliquely from above. [Figure 18] FIG. 11 is a perspective view showing a magnetic sensor device according to a second embodiment of the present invention, as viewed obliquely from below. [Figure 19] FIG. 4 is an explanatory diagram showing a state in which a magnetic sensor device according to a second embodiment of the present invention is viewed from above. [Figure 20] FIG. 4 is an explanatory diagram showing a state in which a magnetic sensor device according to a second embodiment of the present invention is seen from the side. [Figure 21] FIG. 11 is a perspective view showing a magnetic sensor and a yoke in a magnetic sensor device according to a second embodiment of the present invention. [Figure 22] FIG. 4 is a perspective view showing a magnetic sensor in a magnetic sensor device according to a second embodiment of the present invention. [Diagram 23] FIG. 4 is an explanatory diagram showing a magnetic sensor in a magnetic sensor device according to a second embodiment of the present invention. [Figure 24] FIG. 11 is a perspective view showing a terminal of a magnetic sensor in a magnetic sensor device according to a second embodiment of the present invention. [Diagram 25] FIG. 11 is a perspective view showing a state in which a sensor support member in a magnetic sensor device according to a second embodiment of the present invention is viewed obliquely from below. [Figure 26] FIG. 4 is an explanatory diagram showing a magnetic sensor device according to a second embodiment of the present invention mounted on a substrate. [Figure 27] 27 is a cross-sectional view showing the magnetic sensor device taken along the line LL in FIG. 26. [Figure 28] FIG. 11 is an explanatory diagram showing a rotation detection device as an example of use of the magnetic sensor device according to the second embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] (Embodiment of Magnetic Sensor) An embodiment of the magnetic sensor of the present invention will be described with reference to Figures 1 to 6. In this embodiment, the directions of up (Ud), down (Dd), front (Fd), back (Bd), left (Ld), and right (Rd) will be described according to the arrows drawn at the bottom right of Figures 1 to 4. For ease of explanation, when the magnetic sensor is placed on the component mounting surface of a board, the direction away from the component mounting surface is defined as up, and the direction approaching the component mounting surface is defined as down.

[0017] Fig. 1(A) shows magnetic sensor 1, an embodiment of the magnetic sensor of the present invention, as viewed from the upper right front side. Fig. 1(B) shows magnetic sensor 1 as viewed from the upper right rear side. Fig. 1(C) shows magnetic sensor 1 as viewed from the lower right front side. Fig. 2 shows magnetic sensor 1 as viewed from the front. Fig. 3 shows magnetic sensor 1 with coil 3 removed. Fig. 4(A) shows magnetic sensor 1 mounted on substrate 11 as viewed from the front. Fig. 4(B) shows magnetic sensor 1 mounted on substrate 11 as viewed from above.

[0018] The magnetic sensor 1 is a magnetic sensor that utilizes the large Barkhausen effect, and includes a magnetic wire 2, a coil 3, a bobbin 4, and a pair of terminals 9, as shown in FIG.

[0019] The magnetic wire 2 is a magnetic wire that exhibits the large Barkhausen effect, and is called a composite magnetic wire. The magnetic wire 2 is formed, for example, from a semi-hard magnetic material containing iron and cobalt, and is a wire having a diameter of, for example, about 0.1 mm to 1 mm and a length of, for example, about 10 mm to 30 mm. The magnetic wire 2 is formed, for example, by drawing the semi-hard magnetic material and twisting it several times while changing the direction. The magnetic wire 2 has uniaxial anisotropy, in which the direction in which magnetization is easy is the direction of the central axis of the magnetic wire 2. In addition, the magnetic wire 2 has a larger coercive force in the central part than in the outer peripheral part. The magnetic wire 2 has a property that the magnetization direction of the magnetic wire 2 (its outer peripheral part) suddenly reverses in response to a change in the direction of the external magnetic field.

[0020] The coil 3 is formed by winding an insulated electric wire such as an enameled wire. The coil 3 is disposed on the outer periphery of the magnetic wire 2. When the direction of the external magnetic field changes and the magnetization direction of the magnetic wire 2 suddenly reverses in response to the change, a pulse-like current flows through the coil 3. By extracting this current as a detection pulse, the change in the direction of the external magnetic field can be detected based on the detection pulse.

[0021] The bobbin 4 is made of a non-magnetic material such as resin, etc. As shown in FIG.

[0022] The electric wire winding part 5 is formed in a cylindrical shape extending in the left-right direction. The axis D of the electric wire winding part 5 extends in the left-right direction (see FIG. 2). The magnetic wire 2 is disposed inside the electric wire winding part 5. Specifically, a groove 6 extending in the left-right direction is formed in the electric wire winding part 5, and the magnetic wire 2 is disposed in the groove 6. The magnetic wire 2 is disposed such that its axis extends in the left-right direction and is parallel to the axis D. Note that instead of the groove 6, a hole extending in the left-right direction may be formed in the electric wire winding part 5, and the magnetic wire 2 may be disposed in the hole. Also, as shown in FIG. 1(B), an insulated electric wire forming a coil 3 is wound around the outer periphery of the electric wire winding part 5.

[0023] As shown in FIG. 2, the pair of support pillars 7 are provided at both ends of the electric wire winding part 5 in the left-right direction. The pair of support pillars 7 protrude from both ends of the electric wire winding part 5 in the left-right direction in a direction perpendicular to the axis D of the electric wire winding part 5. Specifically, the pair of support pillars 7 protrude downward from the left end part and the right end part of the electric wire winding part 5. As shown in FIG. 1C, the end face on the protruding end side of each support pillar 7, i.e., the lower end face 7A, is a flat surface that expands in the left-right direction and the front-rear direction. As shown in FIG. 4A, when the magnetic sensor 1 is mounted on the board 11, the lower end face 7A of each support pillar 7 contacts the component mounting face 11A of the board 11.

[0024] 4(A), the downward protrusion amount of the pair of support parts 7 from both end side parts of the electric wire winding part 5 is set so that when the magnetic sensor 1 is mounted on the substrate 11, a component placement space 8 in which another component 12 can be placed is formed between the part of the outer circumferential surface of the coil 3 facing the component placement surface 11A and the component placement surface 11A, i.e., between the lowermost part of the outer circumferential surface of the coil 3 and the component placement surface 11A. The other component 12 is an electric / electronic component other than the magnetic sensor 1 that is expected to be placed on the component placement surface 11A of the substrate 11, such as a resistor, a capacitor, a diode, a transistor, or an integrated circuit. For example, the other component 12 is an electric / electronic component required for detection using the magnetic sensor 1. For example, the other component 12 is an integrated circuit chip having a counting circuit that counts the detection pulses output from the coil 3 of the magnetic sensor 1, or a memory chip having a memory element that stores the number of detection pulses counted by the counting circuit, or a custom chip having a detection circuit including the counting circuit and memory element.

[0025] Specifically, the above-mentioned protrusion amount of each support part 7 is set so that when the magnetic sensor 1 is mounted on the substrate 11, the distance G between the lowest part of the outer circumferential surface of the coil 3 and the component mounting surface 11A is greater than the height dimension (vertical dimension) of the other component 12. Currently, a wide variety of surface mount type (chip type) electric / electronic components having a height dimension of 0.8 mm or less are widely used in general. When the other component 12 is a surface mount type electric / electronic component having a height dimension of 0.8 mm or less, the above-mentioned protrusion amount of each support part 7 is set so that the distance G is greater than 0.8 mm. However, there are cases where the other component 12 is an electric / electronic component having a height dimension greater than 0.8 mm. For example, when the other component 12 is an electric / electronic component having a height dimension of 1.7 mm, the above-mentioned protrusion amount of each support part 7 is set so that the distance G is greater than 1.7 mm.

[0026] The protruding amount of each support part 7 may be set so that when the magnetic sensor 1 is mounted on the substrate 11, the distance G between the bottom of the outer circumferential surface of the coil 3 and the component mounting surface 11A is equal to or greater than the sum of the height dimension of the other component 12 and the insulation distance to be secured between the other component 12 and the magnetic sensor 1. For example, when the height dimension of the other component 12 is 0.8 mm and the insulation distance to be secured between the other component 12 and the magnetic sensor 1 is 0.2 mm, the protruding amount of each support part 7 is set so that the distance G is equal to or greater than 1 mm. For example, when the height dimension of the other component 12 is 1.7 mm and the insulation distance to be secured between the other component 12 and the magnetic sensor 1 is 0.2 mm, the protruding amount of each support part 7 is set so that the distance G is equal to or greater than 1.9 mm.

[0027] As shown in FIG. 1B, each terminal 9 is formed in an L-shape from a conductive material, for example, a metal material. Each terminal 9 is a surface-mount terminal. A pair of terminals 9 is attached and fixed to the rear of both end portions of the electric wire winding portion 5 or to the rear of the pair of support portions 7. An end of the insulated electric wire forming the coil 3 from which the insulating coating has been removed is connected to the upper portion of one terminal 9. An end of the insulated electric wire forming the coil 3 from which the insulating coating has been removed is connected to the upper portion of the other terminal 9. A lower rear end portion of each terminal 9 is soldered to a connection pad provided on the component mounting surface 11A of the substrate 11 when the magnetic sensor 1 is mounted on the substrate 11.

[0028] Figures 5 and 6 show an example of the use of the magnetic sensor 1. That is, Figure 5(A) shows a rotation detection device 15 using three magnetic sensors 1. Figure 5(B) shows the state of the rotation detection device 15 cut along the cutting line KK in Figure 5(A) as viewed from the bottom right in Figure 5(A). Figures 6(A) and 6(B) show how the direction of the magnetic field around the magnetic sensor 1 changes in response to the rotation of the rotating shaft 19. Figure 6(C) shows a pulsed current flowing through the coil 3 of the magnetic sensor 1 in response to the change in the direction of the magnetic field.

[0029] 5(A), rotation detection device 15 is a device that detects the rotation of a rotating shaft 19 as a rotating body. For example, rotating shaft 19 is an output shaft of a motor. Rotation detection device 15 includes a magnetic field generating member 16, three magnetic sensors 1, and a substrate 17.

[0030] The magnetic field forming member 16 is formed in a ring shape from a magnetic material such as ferrite. The magnetic field forming member 16 is disposed coaxially with the rotating shaft 19 on the outer periphery of the rotating shaft 19 and is fixed to the rotating shaft 19. The magnetic field forming member 16 is a magnetized with multiple poles, and the outer periphery of the magnetic field forming member 16 has four magnetic poles, an N pole, an S pole, an N pole, and an S pole, formed in that order at intervals of, for example, 90 degrees in the circumferential direction of the magnetic field forming member 16. The magnetic field forming member 16 may also be formed from four magnets that are not magnetized with multiple poles.

[0031] The substrate 17 is provided on the outer periphery of the rotating shaft 19. The substrate 17 is provided in the vicinity of the magnetic field forming member 16. The substrate 17 is arranged so that its component mounting surface 17A faces upward. As shown in FIG. 5B, the substrate 17 is arranged so that a plane including the component mounting surface 17A is perpendicular to the rotation axis of the rotating shaft 19. An insertion hole 18 is formed in the center of the substrate 17, and the rotating shaft 19 is inserted into the insertion hole 18. The diameter of the insertion hole 18 is larger than the outer diameter of the rotating shaft 19, and the rotating shaft 19 does not contact the substrate 17. The substrate 17 is fixed, for example, via a bracket to a housing of a motor in which the rotating shaft 19 is rotatably supported.

[0032] The three magnetic sensors 1 are disposed on the component mounting surface 17A of the substrate 17. The three magnetic sensors 1 are disposed on the outer periphery of the magnetic field forming member 16 at intervals of 120 degrees in the rotation direction of the magnetic field forming member 16. The magnetic sensors 1 are disposed such that the extension direction of the axis of the magnetic wire 2 is parallel to the component mounting surface 17A of the substrate 17. When the component mounting surface 17A of the substrate 17 is viewed from above, the magnetic sensors 1 are disposed such that the center of the extension direction of the magnetic wire 2 is in contact with a circle B drawn on the outer periphery of the magnetic field forming member 16 and centered on the rotation center A of the rotating shaft 19.

[0033] The magnetic field forming member 16 is not in contact with any of the three magnetic sensors 1. Furthermore, while the magnetic field forming member 16 rotates together with the rotating shaft 19, each of the magnetic sensors 1 is stationary. When the magnetic field forming member 16 rotates together with the rotating shaft 19, the magnetic field formed by the magnetic field forming member 16 rotates. This creates a magnetic field (rotating magnetic field) that rotates around the rotation axis of the rotating shaft 19. The three magnetic sensors 1 are placed within this magnetic field. Each magnetic sensor 1 detects changes in the direction of the magnetic field.

[0034] Here, the magnetic field detection operation of the magnetic sensor 1 will be described by focusing on one of the three magnetic sensors 1 in FIG. 5(A) arranged on the upper side in FIG. 5(A). In FIG. 5(A), the S pole of the magnetic field forming member 16 approaches the upper one of the magnetic sensors 1 at the left front, and the N pole of the magnetic field forming member 16 approaches the upper one of the magnetic sensors 1 at the right front. From this state, when the rotating shaft 19 rotates 90 degrees clockwise, as shown in FIG. 6(A), the N pole of the magnetic field forming member 16 approaches the upper one of the magnetic sensors 1 at the left front, and the S pole of the magnetic field forming member 16 approaches the upper one of the magnetic sensors 1 at the right front. At this time, the direction of the magnetic field acting on the magnetic wire 2 of the magnetic sensor 1 becomes rightward. As a result, the magnetization direction of the magnetic wire 2, which was leftward until just before, is suddenly reversed to the right. As a result, as shown in FIG. 6(C), a pulse-like current P1 flows in the coil 3 in, for example, a positive direction.

[0035] After that, when the rotating shaft 19 rotates further 90 degrees clockwise, the S pole of the magnetic field generating member 16 approaches the left front of the magnetic sensor 1, and the N pole of the magnetic field generating member 16 approaches the right front of the magnetic sensor 1, as shown in FIG. 6(B). At this time, the direction of the magnetic field acting on the magnetic wire 2 of the magnetic sensor 1 becomes leftward. As a result, the magnetization direction of the magnetic wire 2, which was rightward just before, suddenly reverses to leftward. As a result, a pulse-like current P2, for example, in the negative direction, flows through the coil 13, as shown in FIG. 6(C).

[0036] Each terminal 9 of each magnetic sensor 1 is electrically connected to a detection circuit provided on the substrate 11. In each magnetic sensor 1, currents P1 and P2 flowing through the coil 3 are output to the detection circuit as detection pulses. The detection circuit detects the amount of rotation and direction of rotation of the rotating shaft 19 based on the detection pulses output from the coils 3 of the three magnetic sensors 1. Note that the method of detecting the amount of rotation and direction of rotation of the rotating shaft 19 in the rotation detection device 15 can be, for example, the method described in International Publication No. WO 2016 / 002437.

[0037] Moreover, the detection circuit is, for example, a custom chip having a counting circuit for counting detection pulses output from the coil 3 of each magnetic sensor 1, and a memory element for storing the number of detection pulses counted by the counting circuit. On the component mounting surface 11A of the substrate 11, three component arrangement spaces 8 are formed by the three magnetic sensors 1 mounted on the substrate 11. The custom chip of the detection circuit is arranged as another component 12 in an area on the component mounting surface 11A where any one of the three component arrangement spaces 8 is formed. For example, the other component 12 in FIG. 5(A) is the custom chip of the detection circuit.

[0038] As described above, in the magnetic sensor 1 which is an embodiment of the magnetic sensor of the present invention, the bobbin 4 has a pair of support parts 7, and the downward protrusion amount of the pair of support parts 7 from both end parts of the electric wire winding part 5 is set so that when the magnetic sensor 1 is mounted on the substrate 11, a component arrangement space 8 in which another component 12 can be arranged is formed between the part of the outer circumferential surface of the coil 3 facing the component mounting surface 11A and the component mounting surface 11A. With this configuration, when the magnetic sensor 1 is mounted on the substrate 11, the component arrangement space 8 is formed between the part of the magnetic sensor 1 around which the coil 3 is wound and the component mounting surface 11A. In the area of ​​the component mounting surface 11A where the component arrangement space 8 is formed, another component 12 can be arranged, as shown in FIG. 4(B). Thus, according to the magnetic sensor 1 of this embodiment, it is possible to increase the area in which electric and electronic components other than the magnetic sensor 1 are arranged on the component mounting surface 11A on which the magnetic sensor 1 is arranged.

[0039] (First embodiment of the magnetic sensor device) A first embodiment of the magnetic sensor device of the present invention will be described with reference to Figures 7 to 16. In this embodiment, the directions of up (Ud), down (Dd), front (Fd), back (Bd), left (Ld), and right (Rd) will be described according to the arrows drawn at the bottom right of Figures 7 to 14. For ease of explanation, when the magnetic sensor device is placed on the component mounting surface of a board, the direction away from the component mounting surface is defined as up, and the direction approaching the component mounting surface is defined as down.

[0040] Fig. 7(A) shows a magnetic sensor device 30 according to a first embodiment of the present invention, as viewed from the upper right front side. Fig. 7(B) shows the magnetic sensor device 30 as viewed from the lower right front side. Fig. 8 shows the magnetic sensor 31 and yoke 36 of the magnetic sensor device 30.

[0041] The magnetic sensor device 30 is a magnetic sensor device that utilizes the large Barkhausen effect. As shown in Figures 7(A), 7(B) and 8, the magnetic sensor device 30 includes a magnetic sensor 31, a yoke 36, and a sensor support member 41. The magnetic sensor 31 is attached to the sensor support member 41, and the yoke 36 is embedded in the sensor support member 41.

[0042] Fig. 9 shows the magnetic sensor 31 as viewed from the upper right front side. Fig. 10(A) shows the magnetic sensor 31 as viewed from the front. Fig. 10(B) shows the magnetic sensor 31 as viewed from the rear. Fig. 10(C) shows the magnetic sensor 31 as viewed from the right. Fig. 11 shows the yoke 36 and the sensor support member 41.

[0043] As shown in FIG. 9, the magnetic sensor 31 includes a magnetic wire 32, a coil 33, a bobbin 34, and a pair of terminals 35. The magnetic wire 32 and the coil 33 are the same as the magnetic wire 2 and the coil 3 of the magnetic sensor 1 in FIG. 1(A). As shown in FIGS. 10(A) to 10(C), the bobbin 34 does not have a support, that is, both end portions in the left-right direction of the bobbin 34 do not protrude downward. The bobbin 34 is the same as the bobbin 4 of the magnetic sensor 1 except that it does not have a support. Also, E in FIG. 10(A) is the axis of the bobbin 34. Also, each terminal 35 is the same as the terminal 9 of the magnetic sensor 1. However, since the bobbin 34 does not have a support, the lower part of each terminal 35 protrudes downward from the lower surface 34A of the bobbin 34. The magnetic sensor 31 is attached and fixed to a sensor attachment part 43 provided on the sensor support member 41 as shown in FIG. 7(B).

[0044] The yoke 36 has a function of controlling the direction of the magnetic flux of the magnetic field acting on the magnetic sensor 31 (the magnetic field around the magnetic sensor 31). As shown in FIG. 8, the yoke 36 includes two yoke pieces 36A. Each yoke piece 36A is formed of a soft magnetic material such as iron. A part of one yoke piece 36A is disposed in front of the left part of the magnetic sensor 31, and another part of the one yoke piece 36A is disposed above the left end part of the magnetic sensor 31. A part of the other yoke piece 36A is disposed in front of the right part of the magnetic sensor 31, and another part of the other yoke piece 36A is disposed above the right end part of the magnetic sensor 31. As shown in FIG. 11, the yoke 36 is embedded in the front part of the main body part 42 of the sensor support member 41. For example, the sensor support member 41 and the yoke 36 are integrally formed by insert molding.

[0045] Fig. 12(A) shows the magnetic sensor device 30 as viewed from the front. Fig. 12(B) shows the magnetic sensor device 30 as viewed from below. Fig. 12(C) shows the magnetic sensor device 30 as viewed from the back. Fig. 12(D) shows the magnetic sensor device 30 as viewed from the right. Fig. 13 shows a method for attaching the magnetic sensor 31 to the sensor support member 41. Fig. 14(A) shows the magnetic sensor device 30 mounted on a substrate 51 as viewed from the front. Fig. 14(B) shows the magnetic sensor device 30 mounted on a substrate 51 as viewed from above.

[0046] In the magnetic sensor device 30, the sensor support member 41 is a member for supporting the magnetic sensor 31 and the yoke 36 on the component mounting surface 51A of the substrate 51. The sensor support member 41 is formed of a non-magnetic material such as resin. As shown in FIGS. 12(A) to 12(D), the sensor support member 41 has a main body portion 42, a sensor mounting portion 43, and a plurality of support portions 44.

[0047] The main body 42 has a predetermined three-dimensional shape extending in a first direction. In this embodiment, as shown in Fig. 12(A), the main body 42 is formed in a flat plate shape extending in the left-right and front-rear directions so as to be thick enough to cover most of the magnetic sensor 31 from above and to embed the yoke 36 therein. In this embodiment, the "first direction" refers to the left-right or front-rear direction.

[0048] The sensor mounting portion 43 is a portion for mounting the magnetic sensor 31 to the main body portion 42. The main body portion 42 has a lower surface 42A that is wide in the left-right direction and the front-rear direction. As shown in FIG. 13, the sensor mounting portion 43 is a recess that is long in the left-right direction and is provided on the lower surface 42A of the main body portion 42. The magnetic sensor 31 is inserted into the sensor mounting portion 43 from below the main body portion 42. As shown in FIG. 12(A), the magnetic sensor 31 is mounted in the sensor mounting portion 43 so that the axis E of the bobbin 34 is parallel to the lower surface 42A of the main body portion 42. In addition, the shape of the sensor mounting portion 43 is set so that the bobbin 34 provided with the coil 33 is inserted snugly and the magnetic sensor 31 is supported in the sensor mounting portion 43, as shown in FIG. 12(B). Furthermore, when the magnetic sensor 31 is attached to the sensor attachment portion 43, the position of the bottom of the outer circumferential surface of the coil 33 of the magnetic sensor 31 and the position of the bottom surface 42A of the main body portion 42 are substantially the same in the vertical direction.

[0049] The multiple support columns 44 are provided on the lower surface 42A of the main body 42. Each support column 44 protrudes from the lower surface 42A of the main body 42 in a second direction intersecting with a plane including the first direction. In this embodiment, each support column 44 protrudes from the lower surface 42A of the main body 42 in a direction perpendicular to the lower surface 42A, i.e., downward. In this embodiment, the "second direction" is the downward direction.

[0050] In this embodiment, the sensor support member 41 has two support columns 44. One support column 44 is disposed at the left end portion of the lower surface 42A of the main body 42, and the other support column 44 is disposed at the right end portion of the lower surface 42A of the main body 42. The end face on the protruding end side of each support column 44, i.e., the lower end face 44A, is a flat surface parallel to the lower surface 42A of the main body 42. As shown in FIG. 14(A), when the magnetic sensor device 30 is mounted on the substrate 51, the lower end face 44A of each support column 44 comes into contact with the component mounting surface 51A of the substrate 51.

[0051] 14(A), the downward protrusion amount from the lower surface 42A of the pair of support parts 44 is set so that when the magnetic sensor device 30 is mounted on the substrate 51, a component placement space 45 in which another component 52 can be placed is formed between the component placement surface 51A and a portion of the outer circumferential surface of the coil 33 of the magnetic sensor 31 attached to the sensor attachment part 43 that faces the component placement surface 51A, i.e., between the lowermost part of the outer circumferential surface of the coil 33 and the component placement surface 51A. The other component 52 is an electric / electronic component other than the magnetic sensor device 30 that is expected to be placed on the component placement surface 51A of the substrate 51, and the details thereof are the same as those of the other component 12 in FIG. 4 described above.

[0052] Specifically, the protruding amount of each support portion 44 is set so that when the magnetic sensor device 30 is mounted on the substrate 51, the distance H between the bottom of the outer circumferential surface of the coil 33 of the magnetic sensor 31 attached to the sensor mounting portion 43 and the component mounting surface 51A is greater than the height dimension (vertical dimension) of the other component 52. Also, the protruding amount of each support portion 44 may be set so that when the magnetic sensor device 30 is mounted on the substrate 51, the distance H between the bottom of the outer circumferential surface of the coil 33 of the magnetic sensor 31 attached to the sensor mounting portion 43 and the component mounting surface 51A is greater than the height dimension of the other component 52 plus an insulation distance to be secured between the other component 52 and the magnetic sensor 31.

[0053] Further, the lower surface of the rear end portion of the lower part of each terminal 35 is located in the same plane as the lower end surface 44A of each support portion 44. The rear end portion of the lower part of each terminal 35 is soldered to a connection pad provided on the component mounting surface 51A of the substrate 51 when the magnetic sensor device 30 is mounted on the substrate 51.

[0054] 15 and 16 show an example of using the magnetic sensor device 30. That is, FIG. 15 shows a rotation detection device 55 using three magnetic sensor devices 30. FIGS. 16(A) and 16(B) show how the direction of the magnetic field around the magnetic sensor device 30 changes according to the rotation of the rotating shaft 19. In addition, when comparing the rotation detection device 55 in FIG. 15 with the rotation detection device 15 in FIG. 5, the rotation detection device 55 in FIG. 15 is the same as the rotation detection device 15 in FIG. 5 except that the three magnetic sensors 1 in the rotation detection device 15 in FIG. 5 are replaced with three magnetic sensor devices 30. Therefore, in the rotation detection device 55 in FIG. 15, the same components as those in the rotation detection device 15 in FIG. 5 are given the same reference numerals, and their description will be simplified or omitted.

[0055] In FIG. 15, the rotation detection device 55 is a device that detects the rotation of the rotating shaft 19, and includes a magnetic field generating member 16, three magnetic sensor devices 30, and a substrate 17.

[0056] The three magnetic sensor devices 30 are arranged on the component mounting surface 17A of the substrate 17. The three magnetic sensor devices 30 are arranged on the outer periphery of the magnetic field forming member 16 at intervals of 120 degrees in the rotation direction of the magnetic field forming member 16. The magnetic sensor devices 30 are arranged such that the extension direction of the axis of the magnetic wire 32 of the magnetic sensor 31 is parallel to the component mounting surface 17A of the substrate 17. When the component mounting surface 17A of the substrate 17 is viewed from above, the magnetic sensor devices 30 are arranged such that the center of the extension direction of the magnetic wire 32 of the magnetic sensor 31 is in contact with a circle B drawn on the outer periphery of the magnetic field forming member 16 and centered on the rotation center A of the rotating shaft 19.

[0057] The magnetic field forming member 16 is not in contact with any of the three magnetic sensor devices 30. Furthermore, the magnetic field forming member 16 rotates together with the rotating shaft 19, while each of the magnetic sensor devices 30 is stationary. When the magnetic field forming member 16 rotates together with the rotating shaft 19, the magnetic field formed by the magnetic field forming member 16 rotates. This forms a magnetic field (rotating magnetic field) that rotates around the rotation axis of the rotating shaft 19. The three magnetic sensors 31 provided in each of the three magnetic sensor devices 30 are placed in this magnetic field. Each magnetic sensor 31 detects changes in the direction of the magnetic field.

[0058] The magnetic field detection operation of each magnetic sensor 31 is basically the same as that of the magnetic sensor 1 described above, so a description thereof will be omitted and only the yoke 36 of each magnetic sensor device 30 will be described here.

[0059] In each magnetic sensor device 30, a yoke 36 is embedded in the front part of the main body 42 of the sensor support member 41. When each magnetic sensor device 30 is placed on the component mounting surface 51A of the substrate 51 as shown in FIG. 15 , the yoke 36 is placed between the magnetic sensor 31 and the magnetic field forming member 16.

[0060] The yoke 36 controls the direction of the magnetic flux of the magnetic field formed by the two magnetic poles of the magnetic field forming member 16 located close to the left front and right front of the magnetic sensor 31 so that the magnetic flux is concentrated on the magnetic wire 32 of the magnetic sensor 31 .

[0061] 16(A), in one of the three magnetic sensor devices 30 arranged on the component mounting surface 51A of the substrate 51, when the N pole of the magnetic field forming member 16 approaches the left front side of the magnetic sensor 31 and the S pole of the magnetic field forming member 16 approaches the right front side of the magnetic sensor 31, the direction of the magnetic flux of the magnetic field formed by these two magnetic poles of the magnetic field forming member 16 is controlled by the yoke 36 arranged between the magnetic sensor 31 and the magnetic field forming member 16 as shown by the arrow S in FIG. 16(A). As a result, the magnetic flux of the magnetic field formed by these two magnetic poles is concentrated on the magnetic wire 32 of the magnetic sensor 31.

[0062] 16(B), in one magnetic sensor device 30, when the S pole of the magnetic field forming member 16 approaches the left front of the magnetic sensor 31 and the N pole of the magnetic field forming member 16 approaches the right front of the magnetic sensor 31, the direction of the magnetic flux of the magnetic field formed by these two magnetic poles of the magnetic field forming member 16 is controlled by the yoke 36 arranged between the magnetic sensor 31 and the magnetic field forming member 16 as shown by the arrow T in FIG. 16(B). As a result, the magnetic flux of the magnetic field formed by these two magnetic poles is concentrated on the magnetic wire 32 of the magnetic sensor 31.

[0063] By concentrating the magnetic flux on the magnetic wire 32 by the yoke 36, the magnetic flux flows along the extension direction of the magnetic wire 32 and reliably passes through the magnetic wire 32. This ensures that the magnetization direction of the magnetic wire 32 of each magnetic sensor 31 can be reversed reliably in response to changes in the magnetic field formed by the rotating magnetic field forming member 16, and the pulse waveform of the pulsed current flowing through the coil 33 in response to the reversal of the magnetization direction of the magnetic wire 32 can be made sharp.

[0064] As described above, in the magnetic sensor device 30 which is the first embodiment of the magnetic sensor device of the present invention, the sensor support member 41 has a plurality of support pillars 44, and the downward protrusion amount of each support pillar 44 from the lower surface 42A of the main body 42 is set so that when the magnetic sensor device 30 is mounted on the substrate 51, a component arrangement space 45 in which another component 52 can be arranged is formed between the component mounting surface 51A and a portion of the outer peripheral surface of the coil 33 of the magnetic sensor 31 attached to the sensor mounting portion 43 that faces the component mounting surface 51A. With this configuration, when the magnetic sensor device 30 is mounted on the substrate 51, the component arrangement space 45 is formed between the portion of the magnetic sensor 31 attached to the sensor mounting portion 43 around which the coil 33 is wound and the component mounting surface 51A.

[0065] Furthermore, in the magnetic sensor device 30 of this embodiment, when the magnetic sensor device 30 is mounted on the substrate 51, the entire main body 42 is lifted by the support parts 44. That is, the entire main body 42 is disposed at a position above the component mounting surface 51A and away from the component mounting surface 51A, and the distance between the lower surface 42A of the main body 42 and the component mounting surface 51A is approximately the same as the distance H between the part of the outer circumferential surface of the coil 33 of the magnetic sensor 31 attached to the sensor mounting part 43 that faces the component mounting surface 51A and the component mounting surface 51A. As a result, a component arrangement space 45 in which another component 52 can be arranged is formed not only between the part around which the coil 33 is wound in the magnetic sensor 31 attached to the sensor mounting part 43 and the component mounting surface 51A, but also between the left-right intermediate part of the lower surface 42A of the main body 42 and the component mounting surface 51A.

[0066] 14(B), on the component mounting surface 51A, other components 52 can be placed in the area where the component placement space 45 is formed. In this manner, according to the magnetic sensor device 30 of the present embodiment, on the component mounting surface 51A of the substrate 51 on which the magnetic sensor device 30 is placed, the area for placing electric / electronic components other than the magnetic sensor device 30 can be increased.

[0067] In addition, in the magnetic sensor device 30 of this embodiment, the yoke 36 is provided inside the main body 42 of the sensor support member 41. When the magnetic sensor device 30 is mounted on the substrate 51, the main body 42 is disposed at a position above the component mounting surface 51A of the substrate 51 by the support 44. Therefore, when the magnetic sensor device 30 is mounted on the substrate 51, the yoke 36 is disposed at a position above the component mounting surface 51A of the substrate 51 and away from the component mounting surface 51A. Furthermore, when the magnetic sensor device 30 is mounted on the substrate 51, a part of the component arrangement space 45 is located below most of the yoke 36. As a result, other components 52 can be arranged below the yoke 36. Thus, according to the magnetic sensor device 30 of this embodiment, it is possible to reduce the area on the component mounting surface 51A of the substrate 51 where electric and electronic components other than the magnetic sensor device 30 cannot be arranged due to the provision of the yoke 36.

[0068] (Second embodiment of the magnetic sensor device) A second embodiment of the magnetic sensor device of the present invention will be described with reference to Figures 17 to 28. In this embodiment, the directions of up (Ud), down (Dd), front (Fd), back (Bd), left (Ld), and right (Rd) will be described according to the arrows drawn at the bottom right in Figures 20 to 24 and 27. For ease of explanation, when the magnetic sensor device is placed on the component mounting surface of a board, the direction away from the component mounting surface is defined as up, and the direction approaching the component mounting surface is defined as down.

[0069] Fig. 17 shows a magnetic sensor device 60 according to a second embodiment of the magnetic sensor device of the present invention, as viewed obliquely from above. Fig. 17 shows the magnetic sensor device 60 mounted on a substrate 91. Fig. 18 shows the magnetic sensor device 60 as viewed obliquely from below. Fig. 19 shows the magnetic sensor device 60 as viewed from above. Fig. 20 shows the magnetic sensor device 60 as viewed from the side. Fig. 21 shows one of the three magnetic sensors 61 included in the magnetic sensor device 60, and one of the three yokes 77 included in the magnetic sensor device 60.

[0070] The magnetic sensor device 60 is a magnetic sensor device that utilizes the large Barkhausen effect. As shown in Figs. 17 to 21, the magnetic sensor device 60 includes three magnetic sensors 61, three yokes 77, and a sensor support member 81. The three magnetic sensors 61 are attached to the sensor support member 81, and the three yokes 77 are embedded in the sensor support member 81. The three magnetic sensors 61 themselves are identical in configuration to one another, and the three yokes 77 themselves are identical in configuration to one another.

[0071] Fig. 22(A) shows one of the three magnetic sensors 61 in the magnetic sensor device 60 as viewed from the upper right front side. Fig. 22(B) shows the magnetic sensor 61 in Fig. 22(A) as viewed from the lower right front side. Fig. 23(A) shows the magnetic sensor 61 in Fig. 22(A) as viewed from the front. Fig. 23(B) shows the magnetic sensor 61 in Fig. 22(A) as viewed from the right.

[0072] As shown in Fig. 22(A), the magnetic sensor 61 includes a magnetic wire 62, a coil 63, a bobbin 64, and a pair of terminals 71. The magnetic wire 62 and the coil 63 are the same as the magnetic wire 2 and the coil 3 of the magnetic sensor 1 in Fig. 1(A).

[0073] 2 and 23(A), the bobbin 64 of the magnetic sensor 61 shown in FIG. 23(A) has an electric wire winding section 65 and a pair of support sections 66, similar to the bobbin 4 of the magnetic sensor 1 shown in FIG. 2. The electric wire winding section 65 of the magnetic sensor 61 is formed in a cylindrical shape extending in the left-right direction, similar to the electric wire winding section 5 of the magnetic sensor 1, and the axis F of the electric wire winding section 65 extends in the left-right direction. A magnetic wire 62 is disposed inside the electric wire winding section 65 of the magnetic sensor 61, similar to the electric wire winding section 5 of the magnetic sensor 1. An insulated electric wire forming a coil 63 is wound around the outer periphery of the electric wire winding section 65 of the magnetic sensor 61.

[0074] The pair of support pillars 66 are provided at both ends of the electric wire winding part 65 in the left-right direction. The pair of support pillars 66 each protrude from both ends of the electric wire winding part 65 in the left-right direction in a direction perpendicular to the axis F of the electric wire winding part 65. Specifically, the pair of support pillars 66 each protrude downward from the left end side part and the right end side part of the electric wire winding part 65. As shown in FIG. 22(B), the end face on the protruding end side of each support pillar 66, i.e., the lower end face 66A, is a flat surface that expands in the left-right direction and the front-rear direction. When the magnetic sensor device 60 is mounted on the board 91, the lower end face 66A of each support pillar 66 contacts the component mounting face 91A of the board 91 (see FIGS. 26 and 27).

[0075] Further, the downward protrusion amount of the pair of support parts 66 from both end side parts of the electric wire winding part 65 is set so that, when the magnetic sensor device 60 is mounted on the substrate 91, a component placement space 89 (see FIG. 26 ) in which another component 92 can be placed is formed between the component placement surface 91A and the part of the outer circumferential surface of the coil 63 of the magnetic sensor 61 that faces the component placement surface 91A, i.e., between the lowermost part of the outer circumferential surface of the coil 63 and the component placement surface 91A. The other component 92 is an electric / electronic component other than the magnetic sensor device 60 that is expected to be placed on the component placement surface 91A of the substrate 91, and the details thereof are the same as those of the other component 12 in FIG. 4 described above.

[0076] Specifically, the protruding amount of each support portion 66 is set so that when the magnetic sensor device 60 is mounted on the substrate 91, the distance J between the bottom of the outer circumferential surface of the coil 63 and the component mounting surface 91A is greater than the height dimension (vertical dimension) of the other component 92 (see FIG. 27). Also, the protruding amount of each support portion 66 may be set so that when the magnetic sensor device 60 is mounted on the substrate 91, the distance J between the bottom of the outer circumferential surface of the coil 63 and the component mounting surface 91A is greater than or equal to the height dimension of the other component 92 plus the insulation distance to be secured between the other component 92 and the magnetic sensor 61.

[0077] 23(A), the bobbin 64 is provided with two joints 67 for joining the magnetic sensor 61 to the sensor support member 81. One joint 67 is provided on the left side of the left support portion 66, and the other joint 67 is provided on the right side of the right support portion 66. Also, as shown in FIG. 22(A), each joint 67 is formed with a joint hole 68 into which a joint protrusion 85 provided on the sensor attachment portion 84 of the sensor support member 81 is inserted.

[0078] Each terminal 71 is a compression terminal. The compression terminal is sometimes called a spring terminal. FIG. 24 shows the terminal 71. As shown in FIG. 24, each terminal 71 is made of a conductive material, for example, a metal material. Each terminal 71 has a base 72, an electric wire connection portion 73, a spring portion 74, and a contact portion 75. The base 72 is formed in a plate shape bent into a U-shape. The electric wire connection portion 73 protrudes forward from the front end portion on the upper side of the base 72. The end portion of the insulated electric wire forming the coil 63 from which the insulating coating has been removed is connected to the electric wire connection portion 73. The spring portion 74 protrudes downward and rearward from the front end portion on the lower side of the base 72, and the contact portion 75 is provided at the protruding end portion of the spring portion 74. In addition, a slit 76 is formed in the spring portion 74 and the contact portion 75. The spring portion 74 is a portion that functions as a leaf spring, and can displace the contact portion 75 in the vertical direction by elastically deforming. The contact portion 75 comes into contact with a connection pad provided on the component mounting surface 91 A of the substrate 91 .

[0079] As shown in Fig. 23(A), a terminal mounting hole 69 is provided on the front surface of each support portion 66 of the bobbin 64. The terminal 71 is attached and fixed to the support portion 66 by inserting the base portion 72 into the terminal mounting hole 69. Also, as shown in Fig. 23(B), a notch 70 is formed on the lower end portion of the front portion of each support portion 66 of the bobbin 64 for passing the spring portion 74 of the terminal 71 therethrough. The spring portion 74 and the contact portion 75 pass through the notch 70 and protrude downward from the lower end surface 66A of the support portion 66. When mounting the magnetic sensor device 60 on the substrate 91, the contact portion 75 of each terminal 71 is placed on a connection pad provided on the component mounting surface 91A of the substrate 91, and when the lower end surface 66A of each support portion 66 is brought into contact with the component mounting surface 91A, the contact portion 75 is pushed upward by the upper surface of the connection pad, and accordingly the spring portion 74 is elastically deformed, and the contact portion 75 is displaced upward. As a result, the elastic force of the spring portion 74 presses the contact portion 75 against the upper surface of the connection pad.

[0080] 21, the yoke 77 includes two yoke pieces 77A. Each yoke piece 77A is formed of a soft magnetic material such as iron. A portion of one of the yoke pieces 77A is disposed in front of the left portion of the magnetic sensor 61, and another portion of the one yoke piece 77A is disposed above the left end portion of the magnetic sensor 61. A portion of the other yoke piece 77A is disposed in front of the right portion of the magnetic sensor 61, and another portion of the other yoke piece 77A is disposed above the right end portion of the magnetic sensor 61.

[0081] The three magnetic sensors 61 are attached to three sensor attachment portions 84 provided on the outer periphery of a main body 82 of a sensor support member 81. The three yokes 77 are embedded in the inner periphery of the main body 82. For example, the sensor support member 81 and the yoke 77 are integrally formed by insert molding. As shown in FIG. 19, the three yokes 77 are arranged in the main body 82 in a one-to-one correspondence with the three magnetic sensors 61. In the main body 82, one magnetic sensor 61 and one yoke 77 corresponding to each other are arranged in a positional relationship shown in FIG. 21.

[0082] The sensor support member 81 is a member for supporting the three magnetic sensors 61 and the three yokes 77 on the component mounting surface 91A of the substrate 91. The sensor support member 81 is formed of a non-magnetic material such as resin. As shown in Figs. 17 to 20, the sensor support member 81 has a main body portion 82, three sensor mounting portions 84, three pairs of support portions 86, and three fixing portions 87.

[0083] The main body 82 has a predetermined three-dimensional shape extending in a first direction. In this embodiment, as shown in FIG. 17, the main body 82 is formed in a flat plate shape extending in the left-right and front-rear directions, having a thickness that can cover most of the three magnetic sensors 61 from above and can embed the three yokes 77 therein. In this embodiment, the "first direction" refers to the left-right or front-rear direction. Also, as shown in FIG. 19, when the magnetic sensor device 60 is viewed from above, the main body 82 has a polygonal shape with three-fold symmetry (120-degree symmetry). Also, a central hole 83 is formed in the center of the main body 82, penetrating the main body 82 in the up-down direction.

[0084] The sensor mounting portion 84 is a portion for mounting the magnetic sensor 61 to the main body portion 82, and is provided on the lower surface 82A of the main body portion 82. FIG. 25 shows the sensor support member 81 as viewed obliquely from below. As shown in FIG. 25, three sensor mounting portions 84 are provided on the lower surface 82A of the main body portion 82 in order to mount the three magnetic sensors 61 of the magnetic sensor device 60. Each sensor mounting portion 84 is a recess or a notch provided on the outer periphery of the lower surface 82A of the main body portion 82. The three sensor mounting portions 84 are disposed on the outer periphery of the lower surface 82A of the main body portion 82 at intervals of 120 degrees so that the distances from the center of the main body portion 82 are equal to each other.

[0085] As shown in Fig. 18, each magnetic sensor 61 is inserted into the sensor attachment portion 84 from below the main body portion 82 and attached. Each magnetic sensor 61 is attached in the sensor attachment portion 84 so that the axis F of the bobbin 64 is parallel to the lower surface 82A of the main body portion 82. When the magnetic sensor device 60 is viewed from above, the three magnetic sensors 61 attached to the three sensor attachment portions 84, respectively, are arranged at intervals of 120 degrees along a circle Q centered on the center C of the main body portion 82, as shown in Fig. 19. When the magnetic sensor device 60 is viewed from above, each magnetic sensor 61 is arranged so that the center of the magnetic wire 62 in the extension direction is in contact with the circle Q.

[0086] 25, a joint protrusion 85 is provided on one end and the other end of each sensor mounting portion 84. When the magnetic sensor 61 is inserted into the sensor mounting portion 84 from below, the two joint protrusions 85 provided on the sensor mounting portion 84 are inserted into the joint holes 68 formed in the two joint portions 67 provided on the bobbin 64 of the magnetic sensor 61. In this state, the joint protrusions 85 and the joint portions 67 are joined by means of thermal caulking or the like, whereby the magnetic sensor 61 is fixed in the sensor mounting portion 84.

[0087] The six support pillars 86 are provided on the lower surface 82A of the main body 82. Each support pillar 86 protrudes downward from the lower surface 82A of the main body 82. As shown in FIG. 25, the six support pillars 86 are arranged on both sides of the three sensor mounting parts 84 so as to sandwich the three sensor mounting parts 84. The end face on the protruding end side of each support pillar 86, i.e., the lower end face 86A, is a flat surface parallel to the lower surface 82A of the main body 82. When the magnetic sensor device 60 is mounted on the substrate 91, the lower end face 86A of each support pillar 86 comes into contact with the component mounting surface 91A of the substrate 91. In addition, the amount of downward protrusion from the lower surface 82A of each support portion 86 is set so that the lower end surface 86A of the support portion 86 and the lower end surface 66A of each support portion 66 of the bobbin 64 of the magnetic sensor 61 attached to each sensor mounting portion 84 are aligned in the vertical direction, as shown in Figure 18.

[0088] Each of the fixing parts 87 has a function of fixing the sensor support member 81 to the substrate 91 using a fixing tool. As shown in FIG. 19, each of the fixing parts 87 is provided on the outer periphery of the main body 82. The three fixing parts 87 are arranged on the outer periphery of the main body 82 at intervals of, for example, 120 degrees. Each of the fixing parts 87 is arranged between two adjacent sensor mounting parts 84 on the outer periphery of the main body 82. Each of the fixing parts 87 protrudes downward from the main body 82, and the lower end surface of each of the fixing parts 87 is aligned in the up-down direction with the lower end surface 86A of the support part 86 and the lower end surface 66A of each support part 66 of the bobbin 64 of the magnetic sensor 61 attached to each sensor mounting part 84. When the magnetic sensor device 60 is mounted on the substrate 91, the lower end surface of each of the fixing parts 87 comes into contact with the component mounting surface 91A of the substrate 91. Further, each fixing portion 87 is formed with a fixing hole 88 for inserting a fastener for fixing the sensor support member 81 to the substrate 91. The fixing hole 88 penetrates the fixing portion 87 in the up-down direction.

[0089] Fig. 26 shows the magnetic sensor device 60 mounted on the substrate 91 as viewed from above. Fig. 27 shows a schematic cross-section of the magnetic sensor device 60 and the substrate 91 cut along the cutting line LL in Fig. 26 as viewed from below in Fig. 26. Since the magnetic sensor device 60 has a three-fold symmetric structure when viewed from above, the cross-section of the magnetic sensor device 60 cut along the cutting line MM in Fig. 26 and the cross-section of the magnetic sensor device 60 cut along the cutting line NN in Fig. 26 are the same as the cross-section of the magnetic sensor device 60 cut along the cutting line LL in Fig. 26, i.e., the cross-section of the magnetic sensor device 60 shown in Fig. 27.

[0090] When mounting the magnetic sensor device 60 on the substrate 91, as shown in Figs. 26 and 27, the sensor support member 81 is placed on the component mounting surface 91A of the substrate 91 while aligning the fixing holes 88 of the fixing portions 87 of the sensor support member 81 with the holes for fixing the magnetic sensor device provided in the substrate 91. Then, a fixing tool 93 such as a bolt is inserted into the fixing holes 88 and the holes for fixing the magnetic sensor device, and another fixing tool 94 such as a nut is coupled (e.g., fastened) to the fixing tool 93. This fixes the sensor support member 81 onto the component mounting surface 91A of the substrate 91.

[0091] In this state where the sensor support member 81 is fixed to the substrate 91, the lower end surface 66A of each support portion 66 of the bobbin 64 of each magnetic sensor 61, the lower end surface 86A of each support portion 86 of the sensor support member 81, and the lower end surface of each fixing portion 87 of the sensor support member 81 are in contact with the component mounting surface 91A of the substrate 91. Also, each terminal 71 of each magnetic sensor 61 is in contact with a connection pad provided on the component mounting surface 91A. Also, as shown in FIG. 27, the portion of the outer peripheral surface of the coil 63 of each magnetic sensor 61 facing the component mounting surface 91A and the component mounting surface 91A are spaced apart from each other, and the distance J between them is larger than the height dimension of the other component 92. That is, a component arrangement space 89 in which the other component 92 can be arranged is formed between the portion of the outer peripheral surface of the coil 63 of each magnetic sensor 61 facing the component mounting surface 91A and the component mounting surface 91A.

[0092] 28, by using the magnetic sensor device 60, a rotation detection device 95 having a configuration similar to that of the rotation detection device 55 shown in FIG. 15 can be formed. Since three magnetic sensors 61 and three yokes 77 are fixed to the sensor support member 81 of the magnetic sensor device 60, the rotation detection device 95 can be easily formed by placing and fixing the sensor support member 81 on the component mounting surface 91A of the substrate 91 while determining the position of the sensor support member 81 relative to the rotating shaft 19 or the magnetic field forming member 16. When the sensor support member 81 is placed on the component mounting surface 91A of the substrate 91 while determining the position of the sensor support member 81 relative to the rotating shaft 19 or the magnetic field forming member 16, the central hole 83 of the sensor support member 81 and the insertion hole 18 formed in the substrate 17 coincide with each other, and the rotating shaft 19 inserted in the insertion hole 18 and the magnetic field forming member 16 fixed to the rotating shaft 19 are disposed in the central hole 83 of the sensor support member 81. As a result, the three yokes 77 and the three magnetic sensors 61 are disposed on the outer periphery side of the magnetic field forming member 16.

[0093] As described above, according to the magnetic sensor device 60 which is the second embodiment of the magnetic sensor device of the present invention, other components 92 can be placed in an area where the component placement space 89 is formed on the component placement surface 91A of the substrate 91. In this way, according to the magnetic sensor device 60, it is possible to increase the area for placing electric / electronic components other than the magnetic sensor device 60 on the component placement surface 91A on which the magnetic sensor device 60 is placed.

[0094] In each of the above embodiments, examples have been given of cases in which electric and electronic components other than a magnetic sensor or a magnetic sensor device are arranged in the component arrangement space, but components other than electric and electronic components can also be arranged in the component arrangement space.

[0095] In addition, in the above embodiment of the magnetic sensor and the first embodiment of the magnetic sensor device, surface mount type terminals are given as examples of the terminals of the magnetic sensor, and in the second embodiment of the magnetic sensor device, compression terminals are given as examples of the terminals of the magnetic sensor, but the terminals of the magnetic sensor in the present invention may be dip type terminals or press-fit type terminals.

[0096] In addition, in the second embodiment of the magnetic sensor device described above, an example was given in which three magnetic sensors 61 and three yokes 77 are arranged in the main body 82 of the sensor support member 81 as shown in Figure 19, but the number or positions of the magnetic sensors and yokes arranged in the main body portion of the sensor support member can be changed depending on the purpose of use of the magnetic sensor device, etc.

[0097] Furthermore, the present invention can be modified as appropriate within the scope that does not contradict the gist or idea of ​​the invention that can be read from the claims and the entire specification, and magnetic sensors and magnetic sensor devices with such modifications are also included in the technical idea of ​​the present invention. [Explanation of symbols]

[0098] 1, 61 Magnetic sensor 2, 62 magnetic wire 3. 63 Coil 4, 64 bobbins 5, 65 Wire winding section 7, 66 Post section 7A, 66A Bottom end face (end face on the protruding end side) 8, 89 Component placement space 11, 51, 91 Board 11A, 51A, 91A Parts placement surface 12, 52, 92 Other parts (parts) 30, 60 Magnetic sensor device 31 Magnetic Sensor 32 Magnetic wire 33 Coil 34 Bobbin 36, 77 York 41, 81 Sensor support member 42, 82 Main body 43, 84 Sensor mounting part 44, 86 Post section 44A, 86A Bottom end face (end face on the protruding end side) 45 Component placement space 87 Fixed part 93, 94 Fixtures

Claims

1. A magnetic sensor utilizing the large Barkhausen effect, A magnetic wire that exhibits the large Barkhausen effect, a coil through which a current flows according to a change in the magnetization direction of the magnetic wire; a wire winding section in which the magnetic wire is disposed and an electric wire forming the coil is wound around an outer periphery of the wire winding section; and a bobbin having a pair of support pillars provided at both end portions of the wire winding section, the pair of support portions protrude from both end portions of the electric wire winding portion in a direction intersecting an axis of the electric wire winding portion, an end face on the protruding end side of each of the support columns becomes a surface that comes into contact with the component mounting surface when the magnetic sensor is mounted on the substrate, A magnetic sensor characterized in that the amount of protrusion in one direction from both end portions of the wire winding portion of the pair of support portions is set so that, when the magnetic sensor is mounted on the board, a component placement space is formed between the component placement surface and the portion of the outer surface of the coil that faces the component placement surface, in which components other than the magnetic sensor that are expected to be placed on the component placement surface can be placed.

2. The magnetic sensor according to claim 1, characterized in that the protrusion amount of the pair of support portions is set so that, when the magnetic sensor is mounted on the board, the distance between the portion of the outer peripheral surface of the coil that faces the component mounting surface and the component mounting surface is greater than the height dimension of the component.

3. The magnetic sensor described in claim 1, characterized in that the protrusion amount of the pair of support portions is set so that when the magnetic sensor is mounted on the board, the distance between the part of the outer surface of the coil that faces the component mounting surface and the component mounting surface is greater than or equal to the height dimension of the component plus the insulation distance to be secured between the component and the magnetic sensor.

4. A magnetic sensor device utilizing the large Barkhausen effect, a magnetic sensor including a magnetic wire that exhibits a large Barkhausen effect, a coil through which a current flows according to a change in the magnetization direction of the magnetic wire, and a bobbin inside which the magnetic wire is disposed and around which an electric wire that forms the coil is wound; a sensor support member for supporting the magnetic sensor on a component mounting surface of a substrate, The sensor support member includes: A main body portion having a predetermined three-dimensional shape elongated in a first direction; a sensor attachment portion provided on the main body portion and configured to attach the magnetic sensor to the main body portion in a direction in which an axis of the bobbin is parallel to a plane including the first direction; A plurality of support columns are provided on the main body, Each of the support pillars protrudes from the main body in a second direction intersecting a plane including the first direction, an end face on the protruding end side of each of the support columns becomes a surface that comes into contact with the component mounting surface when the magnetic sensor device is mounted on the substrate, a magnetic sensor device characterized in that the amount of protrusion of each support portion from the main body portion in the second direction is set so that, when the magnetic sensor device is mounted on the board, a component placement space is formed between the component placement surface and the portion of the outer surface of the coil of the magnetic sensor attached to the sensor mounting portion that faces the component placement surface, in which components other than the magnetic sensor device that are expected to be placed on the component placement surface can be placed.

5. The magnetic sensor device described in claim 4, characterized in that the protrusion amount of each support portion is set so that when the magnetic sensor device is mounted on the board, the distance between the part of the outer surface of the coil of the magnetic sensor attached to the sensor mounting portion that faces the component mounting surface and the component mounting surface is greater than the height dimension of the component.

6. The magnetic sensor device described in claim 4, characterized in that the protrusion amount of each support portion is set so that when the magnetic sensor device is mounted on the board, the distance between the part of the outer surface of the coil of the magnetic sensor attached to the sensor mounting portion that faces the component mounting surface and the component mounting surface is greater than or equal to the height dimension of the component plus the insulation distance to be secured between the component and the magnetic sensor.

7. 5. The magnetic sensor device according to claim 4, wherein the sensor support member has a fixing portion for fixing the sensor support member to the substrate using a fixing tool.

8. 5. The magnetic sensor device according to claim 4, wherein the main body portion is provided with a yoke for controlling a direction of a magnetic flux of a magnetic field acting on the magnetic sensor.

9. A plurality of the magnetic sensors are provided, 5. The magnetic sensor device according to claim 4, wherein the sensor support member has a plurality of sensor attachment portions for attaching the plurality of magnetic sensors to the main body portion, respectively.

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