Connector frame unit and connector frame strip for chicklet

Abstract

To provide a frame unit capable of rapidly placing variable numbers of components, such as chicklets and PCBs, to form devices of variable complexity.SOLUTION: A frame unit 710 includes at least one fixing member 750a that fixes the frame unit 710 to a PCB, and an opening 760 that accepts and holds a chicklet therein. The frame unit 710 accepts a chicklet such that electrical connections are formed between the chicklet and the PCB beneath the frame unit 710. The edge 770 of the opening 760 can flex and / or make conductive contact with the chicklet, and fixing members 755a, 755b, 755c, 755d can make electrical contact to the PCB. The frame unit 710 and a frame strip can facilitate chicklet placement within strict tolerances.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to electrical connectors and assemblies thereof. For example, connection assemblies for chiclets and printed circuit boards (PCBs) are described herein. [Background technology]

[0002] Electrical connectors between different electrical components are used in many devices. Disclosed herein is a frame unit for connecting chiclets to a PCB, and a frame strip comprising a plurality of frame units. The frame strip can be used to connect various numbers of chiclets to one or more PCBs.

[0003] Chiclet can be used to make electrical connections with PCBs, for example, between PCBs, and / or between surface mount devices (SMDs) and PCBs. Connection modules such as chiclets have tolerances for connecting to PCBs. Chiclets with rigid housings, for example, rigid metal housings to reduce electromagnetic interference (EMI), have tighter tolerances than more flexible connectors, such as connectors with softer housings. Making robust physical and / or electrical contact between chiclets and PCBs can be difficult, and assembly processes can be susceptible to stress-induced failure, such as when tolerances are not met. When making electrical and physical contact between chiclets and PCBs, there can be issues with mechanical distortion of joints, connections, and other components, which can shorten the life of the components. Summary of the Invention [Problem to be solved by the invention]

[0004] Disclosed herein is a frame unit that can help meet tolerance requirements for the assembly of devices utilizing chiclets and PCBs. The frame units described herein can be used singly or in combination to hold one or more chiclets to a PCB.

[0005] Furthermore, the ability to rapidly and flexibly form electrical devices of various complexities and / or functionalities is a key manufacturing challenge. A manufacturing process that can be flexibly adapted to produce various types of surface mount devices is desirable. Disclosed herein is a frame strip of multiple connected frame units that can be used to attach one or more chiclets to one or more PCBs. During manufacturing, it is desirable to be able to rapidly arrange various numbers of components, such as chiclets and PCBs, to form devices of various complexities. [Means for solving the problem]

[0006] Described herein is a frame strip comprising a plurality of connected frame units. The frame units of the frame strip may be as described herein.

[0007] A frame unit configured to connect a chiclet and a PCB is disclosed, the frame unit comprising at least one fixing member configured to fix the frame unit to the PCB and an opening configured to receive the chiclet and to form an electrical connection between the chiclet and the PCB under the frame unit. The opening is configured to hold the chiclet therein. This configuration can function as an intermediate between the chiclet and the PCB, and thus can transmit some of the mechanical strain of the attachment between the chiclet and the PCB to the frame unit. Alternatively / additionally, the opening can function to guide the chiclet to a proper position, for example, reducing assembly errors.

[0008] Each of the above frame units and frame strips can be further improved by one or more optional features as shown in the following embodiments, each of which is advantageous in itself and can be independently combined with other optional features.

[0009] The frame unit according to any embodiment described herein can make a conductive contact with the chiclet, for example, at least a part of the edge of the opening can make a conductive contact with the chiclet. Making an electrical contact can result in better electromagnetic shielding. For example, a good electrical contact can shield sensitive high frequency signals passing through the chiclet. Alternatively / in addition, ground loops can be avoided.

[0010] The opening of any of the frame units described herein can be aligned with at least one PCB contact to electrically couple the PCB contact to at least one electrical connector of the chiclet. Alternatively / in addition, the opening is configured such that an electrical connection is formed between the electrical connector and the PCB below the opening of the frame unit, e.g., directly below the opening. The location of the opening can help simplify the assembly process, e.g., the chiclet can reach (sometimes directly) the contact of the PCB when inserted into the opening. The frame unit can help guide the chiclet to the proper position, reducing assembly errors. Alternatively / in addition, the tight contact of the chiclet to the PCB below (sometimes directly below) the opening can help shield from electromagnetic interference (EMI).

[0011] At least a portion of the edge of the opening can bend in some cases to hold the chiclet. The flexible edge can inhibit mechanical strain from being transferred to the chiclet. Alternatively / in addition, the flexible edge can provide a variable contact force for holding the chiclet, e.g., a contact force that tends to hold the chiclet in a desired position, e.g., on a PCB contact. Alternatively / in addition, as previously described, at least a portion of the edge can electromagnetically shield signals passing through the chiclet and / or at least one PCB contact. For example, it may be desirable to provide multiple capabilities, such as providing electrical contact, EMI shielding, and / or mechanical retention of the chiclet / PCB assembly.

[0012] The frame unit may comprise at least one contact spring at an edge of the opening for holding and / or making electrical contact with the chiclet, the contact spring being capable of effectively holding the chiclet, for example for alignment between a PCB contact and a chiclet terminal.

[0013] The frame unit may include at least one shielding element that extends above the bottom of the edge of the opening. Additional EMI shielding, especially near the junction of the frame unit with the chiclet, may be desirable, for example, to avoid signal crosstalk between conductors of the PCB and / or the chiclet. At least one contact spring may extend above the at least one shielding element (790). Very long contact springs may help to adjust the contact force more easily, for example, because the stiffness of the contact springs can be adjusted with length to provide a contact force within acceptable tolerances (e.g., greater than a minimum to provide sufficient clamping force, and less than a maximum to avoid breakage). There may be multiple contact springs and shielding elements, and the contact springs and shielding elements may alternate along the edge.

[0014] Multiple contact springs can help distribute the contact force along the length of the opening and / or the length of the chiclet. High local stresses can be avoided in the frame unit and / or the chiclet. Multiple shielding elements can help provide sufficient shielding spatially as needed, for example to avoid EMI. Having alternating shielding elements and contact springs can make it possible to balance the effect of each, for example to distribute the contact force more evenly while providing good spatial protection from EMI.

[0015] The opening can have a minor axis and a major axis, and the contact spring can be along the major axis. Having the contact spring along the major axis can distribute the contact force evenly along the longer axis, e.g., to distribute stress more evenly. Alternatively / additionally, distributing the contact force can more securely secure the chiclet in the proper position, e.g., for alignment with a PCB. Assembly errors can be reduced.

[0016] The fastening member according to any of the embodiments described herein may include one or more standoffs extending below the frame unit. The standoffs may be solderable and / or weldable to form a connection, such as an electrical connection with a PCB. Having a connection between the standoffs at the bottom of the frame unit and the PCB can help meet tight mechanical tolerances (e.g., positioning the frame opening relative to the PCB) and / or provide a stronger electrical connection between the frame unit and the PCB (e.g., to reduce ground loops and / or EMI). The standoffs can provide a uniform distance between the bottom of the frame unit and the PCB. This can aid in alignment and positioning of the chiclets relative to the PCB. Tight positional tolerances are more easily met and / or there are fewer assembly errors.

[0017] Any of the fixing members described herein may include a guide element extending below the frame unit. The guide unit may fit into a hole in the PCB. The guide element may help accurately position the frame unit relative to the PCB. Optionally, the guide element includes at least one chamfered edge configured to contact a hole in the PCB to secure the frame unit to the PCB. The guide element may help hold the frame unit relative to the PCB.

[0018] The materials of the frame units and frame strips described herein may include solderable and / or weldable materials. The materials may help provide an electromechanical connection with the PCB. The materials may include at least one of beryllium copper, tin-coated metals, such as tin-coated copper, tin-coated stainless steel, or tin-coated copper alloys, such as tin-coated copper 10 alloy. Beryllium copper may have desirable elastic properties, such as for bending to hold chiclets. The tin coating may help provide a weldable / solderable surface. Copper is also desirable for its low resistivity and / or thermal conductivity properties, which may reduce undesired heating.

[0019] The frame strips described herein may include a groove between two adjacent frame units. The groove may separate the two adjacent frame units. For example, for flexible manufacturing of devices with various numbers of chiclet connections, it may be desirable to have a frame strip that can separate individual adjacent frame units or groups of adjacent frame units.

[0020] The frame strips described herein can include a first rail and a second rail at opposing edges of the respective openings of the frame units. A plurality of frame members connect the first rail and the second rail, the frame members being along the major axis of the respective openings. The frame members can include edges of the openings. The rails can be along the minor axis of the openings, and the plurality of frame units can be connected side-by-side along the length of the rails of the frame strip. The openings of adjacent frame units can be separated by the frame members. The rails and frame members can provide rigidity and / or continuity with the frame strip.

[0021] The frame strip herein has a fastening member extending below at least one of the first rail and the second rail or frame member. The contact spring and / or shielding element extends above the frame member. Extending the contact spring and / or shielding element above the frame strip on the opposite side of the frame strip from the fastening member allows for a short distance between the PCB and the frame strip and / or chiclets. This can help meet positional tolerances connecting the chiclets to the PCB and / or help reduce EMI.

[0022] Disclosed herein is a connection assembly comprising a PCB and at least one chiclet electrically connected to at least one PCB contact of the PCB and held by at least one respective frame unit. The frame units described herein can, for example, aid in meeting tolerance requirements for mounting the chiclet to the PCB.

[0023] The following description and examples are given with reference to the drawings. The embodiments are described such that the features of one embodiment can be combined with other embodiments. For example, a given feature described in one embodiment but not specified in another embodiment can be incorporated into an embodiment that does not specify the given feature. Furthermore, the description herein explicitly or implicitly refers to optional features that may be omitted from an embodiment, such as when the technical effect of the optional feature is not important for a particular application. [Brief description of the drawings]

[0024] [Figure 1] FIG. 2 illustrates a frame strip according to an embodiment. [Diagram 2] A diagram showing a frame strip, chiclets, and a PCB according to an embodiment. [Diagram 3] A diagram showing a frame strip, chiclets, and a PCB according to an embodiment. [Figure 4] FIG. 2 illustrates a frame strip and a PCB according to an embodiment. [Diagram 5] FIG. 2 illustrates a frame strip and a PCB according to an embodiment. [Figure 6] FIG. 2 is a schematic diagram of a portion of a PCB according to an embodiment. [Figure 7] FIG. 2 illustrates a frame unit according to an embodiment. [Figure 8] FIG. 2 illustrates a portion of a frame strip on a PCB, according to an embodiment. [Figure 9] FIG. 1 illustrates a portion of a frame strip holding chiclets on a PCB, according to an embodiment. [Figure 10] FIG. 13 is a diagram showing a portion of an edge of a frame unit according to an embodiment. [Figure 11] FIG. 13 is a diagram showing a portion of an edge of a frame unit according to an embodiment. [Figure 12] 1 illustrates a guide element according to an embodiment. [Figure 13]FIG. 2 illustrates a portion of a frame strip according to an embodiment. [Figure 14] FIG. 2 illustrates a chiclet according to an embodiment. [Figure 15] 1 illustrates a connection assembly according to an embodiment. [Figure 16] 1 illustrates a connection assembly according to an embodiment. [Figure 17] FIG. 2 illustrates a frame strip according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] 1 shows a frame strip according to an embodiment. The frame strip 100 can comprise one or more frame units 110a, 110b, 110c, each including a respective opening 160a, 160b, 160c. The frame strip 100 can comprise fastening members 150a, 150b, 150c, capable of attaching the frame strip 100 or at least one of the frame units 110a to a PCB.

[0026] Figure 2 shows a frame strip 200 attached to a PCB 230, according to an embodiment. A chiclet 220 is shown in Figure 2 to illustrate the alignment of the chiclet with respect to the frame strip 200, such as during assembly. Each of the openings 160a, 160b, 160c in the frame strip 200 can hold a chiclet 220 therein and is appropriately sized to allow for insertion and / or retention of the chiclet.

[0027] FIG. 3 illustrates an assembled frame strip, chiclets, and PCB, according to an embodiment. The frame strip 201 attached to the PCB 230 can allow attachment of one or more chiclets 222, such that each chiclet 222 is received in an opening 160a, 160b, 160c of the frame strip 201. An electrical connection is formed between the chiclets 222 and the PCB under each of the frame units 110 of the frame strip 201. The electrical connection can be formed directly between each chiclet 222 and a respective portion of the PCB under each of the frame units 110a, 110b, 110c. The electrical connection formed between each of the chiclets and the PCB can be directly under a respective opening 160a, 160b, 160c of the respective frame unit 110. Each chiclet is capable of forming one or more electrical connections with the PCB. The openings 160a, 160b, 160c are in a plane parallel to the PCB 230.

[0028] FIG. 4 is an exploded view of the frame strip 100 and the PCB 230 according to an embodiment. FIG. 4 shows the PCB contacts 235 and the PCB holes 237a, 237b. The openings 160a of the frame unit 110a are aligned with at least one respective PCB contact 235. The frame strip 100 can allow alignment of the openings 160a, 160b, 160c with each of the respective PCB contacts 235. Electrical coupling of the at least one PCB contact 235 with at least one electrical connector of each chiclet held by the respective openings 160a of the frame unit 110a is possible. The PCB 230 may include holes 237a, 237b that may mate with complementary features of the frame unit and / or frame strip to guide and / or secure the frame unit 110 and / or frame strip to the PCB. For example, the fastening units 150a, 150b, 150c shown in FIG. 1 may be used to guide and / or secure the frame strip 100 to the PCB 230.

[0029] Figure 5 shows the frame strip attached to a PCB. The respective openings 160a, 160b, 160c of each of the one or more frame units 110a, 110b, 110c of the frame strip 200 are shown. Figure 5 shows the PCB contacts 235a, 235b below the opening 160a. When a chiclet (not shown) is held in the respective opening 160, the chiclet can make electrical contact with the PCB 230, for example, via the PCB contacts 235a, 235b.

[0030] FIG. 6 shows a schematic of a portion of a PCB according to an embodiment. FIG. 6 shows a footprint 600 corresponding to a portion of a PCB in an area of ​​approximately two frame units side by side (corresponding to the area of ​​approximately two openings of each of the frame units). For ease of interpretation, the features labeled in FIG. 6 correspond to the area of ​​the first frame unit 110a on the right. Most of the reference numbers used in FIG. 6 refer to features corresponding to one frame unit with one opening. Each frame unit of the frame strip may be aligned with a complementary area of ​​the PCB, e.g., an area directly under each opening of each frame unit, to contact a respective chiclet held in the respective opening.

[0031] FIG. 7 illustrates a frame unit according to an embodiment.

[0032] For example, the PCB shown in Fig. 6 may include holes 637a, 637b that may fit into respective guide elements 750a, 750b of the frame unit 710 and / or frame strip to, for example, guide and / or fix the frame unit and / or frame strip relative to the PCB. For example, each frame unit may include two fixing members (such as guide elements 750a, 750b) at diagonal corners that may be inserted into corresponding holes 637a, 637b in the PCB. Fig. 6 also shows two further holes 637c, 637d for fixing a second frame unit, for example a second frame unit of a frame strip of at least two frame units.

[0033] Instead of or in addition to the one or more holes 637a, 637b, the PCB may also include complementary features for connecting to features on the underside of the frame unit and / or frame strip. One or more pads 650a, 650b, 650c, 650d, 651a, 651b, 651c, 651d may be aligned with complementary features of the frame unit 710.

[0034] For example, the frame unit and / or frame strip may include a weldable and / or solderable material and may be welded and / or soldered to the PCB, for example, via a pad. The frame unit and / or frame strip may be formed from stamped metal in some cases, which may reduce manufacturing costs. A monolithic frame unit and / or frame strip may reduce manufacturing costs, for example, the stamped metal may be coated (e.g., with tin) before or after stamping. Metals, for example, beryllium copper, tin-coated metals, for example, tin-coated copper, tin-coated stainless steel, or tin-coated copper alloys, such as tin-coated copper 10 alloy or tin-coated beryllium copper, may be used for the frame unit and / or frame strip. The metallic frame units and / or frame strips may also help to make conductive contact between the frame and the PCB, and between the frame and the chiclets. Beryllium copper may be useful for its elastic properties, for example, for use as contact springs to hold the chiclets in their respective openings.

[0035] The PCB contacts 635a, 635b, 635c can include those for making electrical contact with the chiclet, for example, the PCB contacts 635a, 635b, 635c on the surface of the PCB contact complementary contacts on the chiclet. For example, one or more of the PCB contacts 635a, 635b, 635c are signal contacts that connect to corresponding connectors on the chiclet to transmit signals, for example. One or more of the PCB contacts 634a, 634b, 634c, 636a, 6346, 636c can contact a conductive housing on the chiclet.

[0036] Each opening 160 of the frame unit 110 may be configured to align with one or more respective PCB contacts 635a, 635b, 635c, 634a, 634b, 634c, 636a, 636b, 636c for a chiclet, for example, such that the PCB contacts 634a, 634b, 634c, 636a, 636b, 636c, 635a, 635b, 635c are under the respective opening 160a of the frame unit 110a. The openings 160 are aligned to form an electrical coupling between at least one PCB contact and at least one electrical connector of the chiclet.

[0037] Alternatively / in addition, the openings can help guide the chiclet to the corresponding electrical contacts of the PCB, particularly during assembly. Alternatively / in addition, the openings that hold the chiclet can provide structural support for assembly of the chiclet and the PCB. The openings 160 can be configured such that an electrical connection is made between the electrical connector of the chiclet and the PCB below the openings 160 of the frame unit 110 (such a connection can be a direct connection). The connection with the PCB can be made directly below the openings. By making the connection directly below the chiclet, the conductive housing of the chiclet can help electromagnetically shield the connection from the surrounding environment. Alternatively / in addition, manufacturing can be simplified, for example, the chiclet can be inserted into the openings and contacted to the PCB with fewer assembly operations.

[0038] The frame unit 710 has an opening 760 for holding the chiclet. The frame unit 710 connects the chiclet and the PCB. At least one fastening member 755a, 755b, 755c, 755d can fasten the frame unit 710 to the PCB. For example, a bottom surface of the frame unit is attached to the PCB using at least one fastening member 755a, 755b, 755c, 755d. The fastening member can protrude downward toward the PCB. The fastening member can be weldable and / or solderable to the PCB via a complementary feature of the PCB, such as a pad. The fastening member can form a connection, such as an electrical connection, between the frame unit 710 and the PCB. Having multiple electrical connections can avoid EMI, ground loops, and / or provide a stronger electrical connection between the frame unit 710 and the PCB, and a stronger electrical connection between the frame strip and the PCB.

[0039] Alternatively / in addition, at least one of the fixing members 755a, 755b, 755c, 755d can act as a standoff extending below the frame. The standoff can provide a uniform distance between the frame unit and the PCB. Providing a uniform distance can help meet tight mechanical and / or electrical tolerances between the chiclet and the PCB.

[0040] The opening 760 of the frame unit 710 may be surrounded by at least one edge 770 of the frame unit 710. The edge 770 may completely circumnavigate the opening 760. The opening 760 configured to receive a chiclet may allow an electrical connection to be made between the chiclet and a PCB underneath the frame unit (e.g., underneath the opening 760). At least a portion of the edge 770 of the opening 760 may make electrical contact with the chiclet when, for example, the chiclet is held in the opening 760. The electrical contact with the chiclet may help shield electromagnetic noise (EM noise), such as EM noise, between the connection between the PCB and the chiclet.

[0041] The edge 770, or at least a portion of the edge 770, can bend to hold the chiclet. Alternatively / additionally, at least a portion of the edge 770 of the opening 760 can provide electromagnetic shielding. For example, the edge 770, or a portion thereof, electromagnetically shields the chiclet and / or signals passing through at least one PCB contact. The bend can help hold the chiclet intact and / or can help make a low resistance electrical connection.

[0042] FIG. 7 shows a contact spring 780 at an edge 770 of an opening 760 of a frame unit 710. The contact spring 780 can hold and / or make electrical contact with a chiclet. Such functionality can help allow the assembly process to meet tight electrical and / or mechanical tolerances for making a connection between the chiclet and a PCB. The contact spring 780 can be more flexible than the chiclet. The flex can help hold the chiclet without damage and / or help make a low resistance electrical connection.

[0043] The contact spring 780 extends above the edge 770 of the opening. In this specification, "up" or upward direction 713 is away from the direction toward the PCB, which is downward direction 712. The bottom of the frame unit 710 can be connected to the PCB. The contact spring 780 can extend above 711 the edge 770 of the opening 760, and the guide elements 750a, 750b can extend in the downward direction 712. The contact spring 780 can have an upper portion 785 and a lower portion 782. The upper portion 785 and the lower portion 782 can form different angles with respect to the plane of the opening and / or the surface of the chiclet. The chiclet can be held at the edge 770 of the opening 760 (which can include above the edge 770 of the opening 760) by contact force from the edge 770 and / or the contact spring (780).

[0044] At least one of the top 785 or bottom 782 of the contact spring 780 can extend at an angle toward the area of ​​space directly above the opening 760. The angle of the top 785 or bottom 782 can be non-perpendicular to the plane of the PCB and / or the plane of the opening. The other of the top 785 and bottom 782 can present a surface that is approximately perpendicular to the opening 760 and can make good contact with the chiclet.

[0045] At least an angled portion of the contact spring 780 can extend into a region of space directly above the opening, such as when no chiclet is present. For example, the lower portion 782 can be angled to extend into a region of space directly above the opening 760 when no chiclet is present, and when a chiclet is held in the opening 760, the lower portion 782 can bend away from the opening 760 and / or the upper portion 785 can make surface contact with the chiclet. The bending can provide sufficient contact force to hold the chiclet in the opening 760, such as along an edge 770. When a chiclet is held, the contact spring 780 can extend directly upward and contact the chiclet directly above and / or flush with the edge 770 of the opening 760.

[0046] FIG. 7 also shows a shielding element 790. The frame unit 710 can include a shielding element 790. The shielding element can extend above the bottom of the edge 770 of the opening 760, for example in a vertically upward direction 711. The shielding element 790 can be shaped to at least partially fill the space between the contact springs 780, for example along the edge 770. The shielding element 790 can reduce electromagnetic interference of the chiclet and / or PCB signals. The shielding element 790, such as the one shown in FIG. 7, can extend above the opening 760. As shown in FIG. 7, the contact springs 780 can extend to a height above the height of the shielding element 790. The shielding element 790 can have a surface that extends parallel to the surface of the chiclet. Alternatively / in addition, the surface of the shielding element 790 closest to the chiclet is perpendicular to the opening 760.

[0047] The upper portion 785 of the contact spring can help guide the chiclet into the opening 760 during assembly of the device. The upper portion 785 of the contact spring can extend further above the plane of the opening 760 than the shield element 790, for example, to help guide the insertion of the chiclet into the opening and / or to help guide the formation of a connection between the chiclet and a PCB.

[0048] The lower portion 782 and / or the upper portion 785 of the contact spring 780 may, in some cases, aid in electromagnetic shielding, for example in conjunction with a shielding element 790 .

[0049] The opening 760 can have a major axis 714 and a minor axis 713. The contact springs 780 and / or shield elements 790 can be along the major axis 714 of the opening 760. The contact springs 780 and / or shield elements 790 can be positioned on either side of the opening 760 along respective opposing edges 770 of the opening 760. The contact springs can be positioned diametrically opposite each other across the opening 760 with the shield elements 790. This interleaving of the contact springs 780 and shield elements 790 can more evenly distribute stress from the spring contact forces and aid in extending the life of the electrical and mechanical connections.

[0050] The guide elements 750a, 750b can be inserted into holes in the PCB to aid in aligning the openings 760 with the PCB contacts, for example. Alternatively / additionally, the guide elements 750a, 750b can include features, such as chamfered surfaces 752a, 752b, that help securely fasten the frame unit 710 to the PCB.

[0051] 8 illustrates a portion of a frame strip in a PCB according to an embodiment. The portion illustrated in FIG. 8 may be exemplary of any of the frame strips described herein. A frame unit (e.g., of a frame strip described herein) may include a fixing member 150, such as a guide element 850a and / or a standoff 850b.

[0052] To aid in understanding, Figure 8 shows a hole 837 in PCB 830. A guide element 850a of frame strip 801 (part of which is shown in Figure 8) is inserted into hole 837.

[0053] FIG. 8 also shows standoffs 850b of the frame strip 801, which may extend below the frame strip 801. The standoffs 850b may be soldered and / or welded to the PCB, for example to pads on the PCB. The standoffs may provide a uniform distance between the frame unit and / or frame strip and the PCB. Alternatively / additionally, the standoffs may provide a planar orientation of the openings 160 of the frame unit and / or frame strip 801, for example an orientation parallel to the plane of the PCB. Having a fixed orientation of the plane of the frame unit and / or frame strip 801 may aid in the attachment of the chiclets, considering that the connection between the PCB and the chiclets may have tight physical and / or electrical tolerances in some cases.

[0054] 8, two openings are partially visible and show PCB contacts 834. The PCB contacts 834 may contact the chiclets, for example, the chiclets' terminals, pins, and / or housings.

[0055] 8 shows a groove 840 that can be used to optionally separate one or more frame units from a frame strip. During assembly of a device, it may be convenient to use a strip of frame units (herein, a frame strip) so that one or more frame units can be connected to a PCB at once, and then a chiclet is inserted into each of the respective openings of the frame units and connected to the PCB. The frame strip may comprise a plurality of connected frame units (which may be separable along respective grooves 840, for example).

[0056] 8 shows a shield element 890 and a spring contact 880 (with optional upper and lower portions 885 and 882) along an edge 870 of an opening 860. There may be a gap 886 between adjacent shield elements and spring contacts. For example, there may be a gap (886) between the nearest adjacent shield element and contact spring, where the gap is along the major axis of the edge of the opening and / or the major axis of the opening.

[0057] There may be at least one gap 886 along the edge 870 of the opening between adjacent lower portions 882 of the spring contacts 880 and each adjacent shield element 890. The gap 886 may allow bending of the spring contacts 880, and therefore, for example, the spring contacts 880 may require less force to insert a chiclet into the opening. The reduced force may minimize the risk of damage, such as during assembly, e.g., cracking the PCB. The gap may be along the major axis of each edge 770, for example, to allow for even distribution of the contact force of the contact spring on each chiclet.

[0058] FIG. 9 shows a portion of a frame strip for a PCB and a chiclet. The portion of the frame strip shown and the exemplary interaction with the chiclet 920 shown in FIG. 9 may be exemplary of any of the frame strips described herein. The chiclet 920 may be held, for example, in the respective openings of the frame units of the frame strip. Each opening may hold one chiclet, for example, via a contact force of the edge of the respective opening of the respective frame unit against the surface of the held chiclet. FIG. 9 shows an edge 970 of the opening that is bendable to hold the chiclet 920. The bending edge 970 or a portion thereof may be reversibly bent, such that, for example, a contact force occurs between the edge 970 or a portion thereof and the chiclet 920 and / or its surface 922.

[0059] 9 illustrates electrical and / or physical contact between the contact spring 980 and the chiclet 920. For example, a side 922 of the chiclet 920 contacts the contact spring 980, such as a top 985 of the contact spring 980. The bottom of the chiclet 920 can make mechanical and / or electrical contact with a PCB, such as directly under an opening in a frame unit.

[0060] A bottom portion 982 of the contact spring 980 may be angled toward the chiclet 920. The optional shield element 990 may also make electrical and / or physical contact with the chiclet, e.g., by contact between respective surfaces including the side 922 of the chiclet 980. Contact with the chiclet 920 (and / or its surface 922) may be made along an edge 970 of the opening, e.g., along its long axis 714. The chiclet may make electrical and / or physical connection with the PCB 930, e.g., directly below the opening, e.g., with no intervening material or mechanism other than solder, solder paste, solder flux, and / or flux between the surface of the PCB below the chiclet and the chiclet.

[0061] An opening edge 970 of the frame unit (which may have two opposing long edges and two opposing short edges) may abut the chiclet 920 on both sides of the chiclet 920 along the opening long edge 970. In addition, the top of the frame unit at the opening narrow edge may abut the bottom of the chiclet 920 at the chiclet's short edge. The opening edge (970) may include a contact spring (980) and / or a shield element (990).

[0062] FIG. 10 illustrates a portion of an edge 1070 of a frame unit. The portion of the frame unit illustrated in FIG. 10 may be illustrative of any of the frame strips described herein. The edge 1070 may have a spring contact 1080 and / or a shield element 1090 along its length, e.g., along its long axis. The spring contact 1080 may include an upper portion 1085 and a lower portion 1082. The shield element 1090 may have a contact surface configured to contact the side 922 of the chiclet. Alternatively / in addition, the upper portion 1085 of the spring contact 1080 may have a surface for directly contacting the chiclet and / or a surface thereof (e.g., a side).

[0063] FIG. 11 shows a portion of an edge 1170 of a frame unit. The portion of the frame unit shown in FIG. 11 may be illustrative of any of the frame strips described herein. The bottom of the portion of the frame unit is shown. A downward direction 1112 towards the PCB is shown, as is an upward direction 1111. The edge 1117 may include a shielding element 1190 and / or a contact spring 1180. The bottom of the frame unit portion shows a type of fixing member 150 for fixing the frame unit and / or the frame strip to the PCB. The fixing member may be for mechanical attachment (mechanical connection) and / or electrical connection.

[0064] The fixing members 150 of the frame units and / or frame strips described herein may include standoffs 1150 such as those shown in FIG. 11. One or more standoffs 1150 may extend below the frame units and / or frame strips. The standoffs may be solderable and / or weldable to form a connection (such as an electrical connection with a PCB). The standoffs may provide a uniform distance between the frame units and the PCB. Alternatively / in addition, the standoffs may provide a uniform distance between the frame strips and the PCB.

[0065] FIG. 12 illustrates a guide element according to an embodiment. The guide element 1250 may be part of any of the frame units and / or frame strips described herein. The guide element 1250 may be insertable into a hole in a PCB and may function to guide the attachment of the frame unit and / or strip to the PCB. The guide element 1250 extends downwardly of the frame unit. The guide element may include at least one chamfered edge, such as edge 1252, that may be in frictional contact with a hole in the PCB and may help secure the frame unit to the PCB. The guide element 150 may include a slot 1255 or the like, so that the radial dimension of the guide element 1250 may be reversibly reduced, for example, during insertion into a hole.

[0066] The tip of the guide element can have a cross-sectional area that increases from the bottom of the guide element 1250 upward to a point of maximum cross-sectional area. Above the point of maximum cross-sectional area, the cross-sectional area of ​​the guide element can decrease. This decrease can take the form of a chamfered edge 1252, such as that shown in FIG.

[0067] The chamfered edge 1252 may be sized to press the holes in the PCB outward, helping to secure the frame unit and / or frame strip to the PCB. Additionally, there may be a shank portion 1251, which may help ensure a uniform distance between the PCB and the frame unit and / or frame strip. At least two of the chamfered edge 1252, the shank portion 1251, and the standoff 1150 described herein may act synergistically to ensure a uniform distance between the PCB and the frame unit. The standoff 1150 may be sized to provide a retention force that holds the PCB against the underside of the frame unit and / or frame strip in synergy with the size of the shank portion 1251 and the size and angle of the chamfered edge 1252.

[0068] FIG. 13 shows a groove between two adjacent frame units. The groove may be part of any of the frame strips described herein. FIG. 13 shows only a portion of a frame unit 1301. The groove 1300 may be positioned between two adjacent frame units 1301, for example at the boundary between adjacent frame units of a frame strip. The groove 1300 may allow for easy separation of a frame unit from an adjacent frame unit or from the remainder of the frame strip. Alternatively, the groove 1300 may allow for separation of multiple frame units from the remainder of the frame strip. To facilitate reconfigurable manufacturing, it may be useful to be able to separate any number of frame units from a frame strip, for example depending on the desired number of chiclets to be attached to a PCB.

[0069] The groove 1300 can have a long axis aligned with the long axis of the opening of the adjacent frame unit. The groove 1300 can include a through hole 1305 (e.g., in the form of a slot that can extend with its long axis aligned with the long axis of the groove 1300). Alternatively / additionally, the groove 1300 can include a partial cut 1307 in the material of the frame strip, for example along the outer edge of the frame unit. The groove 1300 can include a portion through the frame strip 1301, for example, a slot and a portion forming a trench or partial cut 1307 in the frame strip 1301.

[0070] The inner edge of the frame unit opening may be configured to hold a chiclet, and the outer edge may be the location of a groove 1300 that may provide separation from an adjacent frame unit.

[0071] The frame strip may include a groove 1300 between two adjacent frame units configured to separate the two adjacent frame units. The groove may extend in the direction of the long axis of the opening of the frame unit. The groove may include at least one through hole and / or at least one recess, such as the partial cut described above.

[0072] FIG. 14 shows a chiclet. A frame unit as described herein can hold a chiclet, such as the chiclet of FIG. 14. An up direction 1413 and a down direction 1412 are shown. The chiclet can have a metal housing, which can be a rigid housing 1401, for example, more rigid than a plastic housing. The chiclet can have one or more connectors 1440, for example, configured to connect to a PCB at the bottom, for example directly to the PCB. The frame unit as described herein is configured to facilitate the chiclet 1400 connecting to the PCB at the bottom. The side 1420 of the chiclet can be metal. The housing of the chiclet can be metal. The metal can aid in EMI shielding. An additional connector 1445 can connect to other devices, such as another PCB, a surface mounted device, and / or another connector assembly. The additional connector 1445 can protrude from the narrow side. The narrow side connects to a larger side configured to receive a contact force from an edge of an opening in the frame unit and / or a contact spring.

[0073] The side 1420 for receiving the contact is, for example, the largest surface of the generally rectangular prism shape of the chiclet 1400. The frame units described herein may be configured to apply a contact force to the side 1420, particularly both sides, of the held chiclet 1400.

[0074] The chiclet may be configured to contact the PCB by its bottom side (the side of the chiclet facing the PCB). For example, two sides 1420 of the chiclet 1400 (the second side is at the rear of FIG. 15) are held by openings and / or contact springs of a frame unit (such as its edges). Between the sides 1420 of the chiclet 1400, a conductive element may connect a connector 1440 at the bottom of the chiclet to an additional connector 1445 at one of the narrow sides. The sides 1420 may provide EM shielding. A side formed from metal may be contacted by a conductive feature of the frame unit, for example an edge of an opening and / or a contact spring.

[0075] 15 illustrates a connection assembly according to an embodiment. The connection assembly 1500 can include a PCB 1530, at least one chiclet 1400, and at least one frame unit 110 that holds the at least one chiclet. The frame unit 110 can be according to any of the frame units described herein and can also be part of any of the frame strips described herein.

[0076] 16 illustrates a connector assembly. The connector assembly 1600 can include a PCB 1630 and at least one chiclet 1400 electrically connected to at least one PCB contact of the PCB 1630. Each chiclet can be held by a respective frame unit (e.g., any frame unit described herein), such as a frame unit of a frame strip (e.g., any frame strip described herein).

[0077] FIG. 17 illustrates a frame strip according to an embodiment. The features described with respect to the frame strip 1700 of FIG. 17 may be part of any of the frame strips described herein. The frame strip 1700 includes an opening 1760, such as the opening of any of the frame units described herein. The frame strip 1700 may include a first rail 1710 and a second rail 1720 at opposing edges 1711, 1721 of the respective openings 1760 of the frame units. The frame strip 1700 may include a plurality of frame members 1730 connecting the first rail 1710 and the second rail 1720, the frame members being aligned with the major axis of the respective openings 1760. Each of the frame members 1730 can include an edge for holding a chiclet and optionally a groove as described herein. The frame strip 1700 can include a plurality of frame units, where the frame units are as described herein. The frame members 1730 can include an edge of an opening of the frame unit (possibly including a spring contact and / or a shield member) as described herein.

[0078] Herein, the frame unit may be about 15-35 mm in the longitudinal direction and 4-8 mm in the transverse direction. Herein, the opening of the frame unit may have a length along the major axis of 10-30 mm and a length along the minor axis of 2-5 mm. Herein, the frame member of the frame strip may have a width (in the direction of the minor axis of the opening) of 2-6 mm, for example 3-5 mm. Herein, the rail of the frame strip may have a width (in the direction of the major axis of the opening) of 3-10 mm, or 4-8 mm, for example about 5-6 mm.

[0079] Herein, the contact springs may be conductive, for example to form an electrical connection with a chiclet.

[0080] As used herein, "and / or" and " / " mean "and" or "or", for example, "weldable and / or solderable" means only weldable, only solderable, or both weldable and solderable. "Weldable and / or solderable" can also be expressed as "weldable / solderable".

[0081] As used herein, "above" can mean reaching a point higher than a reference point, e.g., reaching a position away from the PCB in a direction perpendicular to the PCB face. As used herein, "directly above" can mean reaching a point along a line higher than a reference point, e.g., "directly above an opening" can mean reaching a position along a line perpendicular to both the opening and the PCB, on the opposite side of the opening from the PCB.

[0082] As used herein, the upward direction of a frame unit and / or frame strip is the direction perpendicular to the plane of the opening of the frame unit and / or frame strip. As used herein, the downward direction of a frame unit and / or frame strip is the direction perpendicular to the plane of the opening of the frame unit and / or frame strip.

[0083] The chiclets described herein may include metal housings, such as rigid metal housings. Rigid metal housings may provide good electromagnetic shielding, especially compared to similarly sized plastic housings. The chiclets herein may be contact modules for connecting electrical components, such as PCBs to other connectors, especially surface mount device (SMD) connectors.

[0084] In this specification, a chiclet may be an electrical connector having a rigid metal housing. The chiclet may be for connecting high frequency signal lines, such as between a PCB and another PCB, or between a PCB and a surface mount device. In this specification, the described guide element may be considered as, for example, a board lock for locking a frame unit to a PCB.

[0085] Rigid housings, particularly chiclet rigid housings, can have smaller tolerances than more flexible housings for alignment with a PCB, such as alignment with a complementary mounting structure of the PCB and / or alignment with a complementary electrical connector of the PCB. The need for larger tolerances can impact the error rate of manufacturing. The frame units and / or frame strips described herein can reduce the manufacturing error rate, for example, by providing a mechanism for meeting required electrical and / or mechanical connection tolerances.

[0086] Below is a list of reference signs used in this specification, which are presented herein as non-limiting illustrative examples: [Explanation of symbols]

[0087] 100 Frame Strips 110a, 110b, 110c frame units 150a, 150b, 150c Fixing members 160a, 160b, 160c opening 170a, 170b, 170c Edges of openings 200 Frame Strips 201 Frame Strip 220 Chicklet 222 Chicklet 230 PCB 235a, 235b PCB Contacts 237a, 237b PCB holes 600 Footprint 634a, 634b, 634c PCB Contacts to Housings 635a, 635b, 635c PCB Contacts 636a, 636b, 636c PCB Contacts to Housings 637a, 637b PCB holes 650 PCB complementary fixing member (pad for standoff) 651a, 651b, 651c Complementary fixing members for PCB 710 Frame Unit 711 Upper 712 Downward 713 Short axis 714 Long axis 750a, 750b Guide elements 752a, 752b chamfered edges 755a, 755b, 755c, 755d Fixing members 760 Opening 770 Edge 780 Contact Spring 790 Shield Element 801 Partial Frame Strip 830 PCB 837 PCB holes 840 Groove 850a Guide Element 850b standoff 860 Opening 870 Edge 880 Spring Contact 882 Lower 885 Top 886 Gap 890 Shield Element 920 Chicklet 922 Surface 930 PCB 970 Edge 980 Contact Spring 982 Lower 985 Top 990 Shielding Elements 1070 Edge 1080 Contact spring 1082 Lower 1085 Top 1090 Shield Element 1111 top 1112 lower 1150 Standoff 1170 Edge 1180 Contact spring 1182 Lower 1185 Top 1190 Shield Element 1250 Guide Elements 1251 Shank 1252 Chamfer 1253 Chamfer 1255 Slots 1300 Groove 1301 Adjacent frame units 1305 Through hole 1307 Partial cut 1400 Chicklet 1401 Housing 1412 lower 1413 top 1420 Side 1440 Connector 1445 Additional Connectors 1500 Connector Assembly 1530 PCB 1600 Connector Assembly 1630 PCB 1650 Plug 1700 Frame Strip 1710 First Rail 1711 First edge 1720 Second Rail 1721 Second Edge 1730 Frame members 1760 Opening

Claims

1. A frame unit (110, 710) configured to connect a chiclet (220) and a printed circuit board (PCB) (230), comprising: The frame unit (110, 710) comprises at least one fixing member (150) configured to fix the frame unit to the PCB (230); - an opening (160, 760) configured to receive a chiclet (220), the opening (160, 760) being configured so that an electrical connection is made between the chiclet (220) and the PCB (230) below the frame unit (110, 710); Equipped with The opening is configured to hold the chiclet therein. Frame unit (110, 710).

2. said frame unit (110) is configured to make conductive contact with said chiclets (220), and optionally at least a portion of an edge (170, 770) of said opening (160) is configured to make conductive contact with said chiclets; A frame unit (110, 710) according to claim 1.

3. the opening (160) is configured to align with at least one PCB contact (235a, 235b) for electrically coupling the at least one PCB contact (235a, 235b) with at least one electrical connector (225) of the chiclet (220); and / or the opening (160) is configured such that an electrical connection is formed between the electrical connector (225) and the PCB (230) below the opening (160) of the frame unit (110). A frame unit (110, 710) according to claim 1 or 2.

4. At least a portion of the edge (170) of the opening (160, 760) is configured to flex to retain the chiclet (220); and / or at least a portion of the edge (170) of the opening (160) is configured to electromagnetically shield signals passing through the chiclet and / or the at least one PCB contact (235); A frame unit (110, 710) according to claim 3.

5. further comprising at least one contact spring (780) at said edge (170, 770) of said opening for holding said chiclet (220) and / or for making electrical contact with said chiclet; A frame unit (110, 710) according to claim 4.

6. at least one shield element (790) extending above a bottom of the edge (170, 770) of the opening (160, 760); the at least one contact spring (780) extends above the at least one shield element (790); Optionally, said at least contact spring (780) is a plurality of contact springs and said at least one shield element is a plurality of shield elements, and optionally said contact springs and said shield elements are arranged in an alternating manner along said edge (170, 770). A frame unit (110, 710) according to claim 5.

7. the opening (160, 760) has a minor axis (713) and a major axis (714), and the contact spring (780) is aligned along the major axis; A frame unit (110, 710) according to claim 5 or 6.

8. the at least one fixing member (150) includes one or more standoffs (850b) extending below the frame unit (110, 710); the one or more standoffs are optionally solderable and / or weldable to form a connection, such as an electrical connection, with the PCB (230); Optionally, said one or more standoffs (850b) are configured to provide a uniform distance between said frame unit (110, 710) and said PCB (230). A frame unit (110, 710) according to any one of claims 1 to 7.

9. The at least one fixed member (150) includes a guide element (750) extending below the frame unit; the guide element is configured to fit into a hole (237, 637f) of the PCB (230); Optionally, said guide element includes at least one chamfered edge (752) configured to contact said hole in said PCB to secure said frame unit to said PCB (230). A frame unit (110, 710) according to any one of claims 1 to 8.

10. the frame unit comprises a solderable and / or weldable material, optionally comprising at least one of beryllium copper, tin-coated metal, e.g., tin-coated copper, tin-coated stainless steel, or a tin-coated copper alloy, such as tin-coated copper 10 alloy or tin-coated beryllium copper; A frame unit (110, 710) according to any one of claims 1 to 9.

11. A plurality of connected frame units (110, 710), Each frame unit is as claimed in any one of claims 1 to 10. Frame strips (100, 200, 201, 1700).

12. Further comprising a groove (1300) between two adjacent frame units (110, 710, 1301); The frame strip (100, 200, 201, 1700) of claim 11, wherein the groove (1300) is configured to separate the two adjacent frame units.

13. - a first rail (1710) and a second rail (1720) on opposing edges (1711, 1721) of the opening (160, 760, 1760) of each of the frame units (110, 710); a plurality of frame members (1730) connecting said first rail and said second rail, said frame members being aligned along the major axis (714) of each of said openings; and Further comprising: A frame strip (100, 200, 201, 1700) according to claim 11 or 12.

14. the at least one fixing member (150) extends below at least one of the first rail (1710), the second rail (1720), or the frame member (1730); the at least one contact spring (780) and / or the at least one shield element (790) extend above the frame member (1730); A frame strip (100, 200, 201, 1700) according to claim 13.

15. - PCB (230), at least one chiclet (220) electrically connected to at least one PCB contact (235, 634, 635, 636) of said PCB and held by at least one respective frame unit (110, 710) according to any one of claims 1 to 11; Equipped with Connection assembly.

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