Liquid discharge head and liquid discharge device

Abstract

To provide a liquid discharge head which can be easily fitted to a liquid discharge device.SOLUTION: This liquid discharge head comprises: a storage part for storing a liquid; an element substrate having an outlet surface in which an outlet for discharging the liquid stored in the storage part is formed; and an electric circuit board that electrically relays a liquid discharge device and the element substrate. In a posture in which the liquid discharge head is fitted to the liquid discharge device, the electric circuit board is positioned above the element substrate in a vertical direction. A connector for electric connection with an electric connection member included in the liquid discharge device is provided in the electric circuit board. In the electric circuit board, the connector is provided only on an upper surface facing a direction opposite to the outlet surface.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection apparatus. [Background technology]

[0002] A liquid ejection head that can be attached to and detached from a liquid ejection device is known. When attaching and detaching the liquid ejection head, a predetermined wiring may be connected to a predetermined electrical connection portion provided on a circuit board arranged inside the liquid ejection head.

[0003] Patent Document 1 discloses a liquid jet head (liquid ejection head) in which a circuit board is laminated on the upper surface of a head case above a nozzle plate. The circuit board is provided with a connector (electrical connection portion) to which a wiring member for transmitting a predetermined electrical signal can be connected.

[0004] According to the configuration of Patent Document 1, the circuit board is arranged in a laid-down state, so that it is possible to connect wiring members to the connector arranged on the circuit board while reducing the height of the liquid ejection head. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-41658 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the circuit board disclosed in Patent Document 1, multiple connectors are arranged not only on the top surface of the circuit board but also on the bottom surface, making it difficult to connect all of the multiple wiring components to all of the connectors provided on the circuit board.

[0007] In view of the above, an object of the present disclosure is to provide a liquid ejection head that can be easily attached to a liquid ejection device. [Means for solving the problem]

[0008] The liquid ejection head of the present disclosure comprises a storage section for storing liquid, an element substrate having an ejection port surface on which an ejection port is formed for ejecting the liquid stored in the storage section, and an electric circuit board that electrically connects the liquid ejection device and the element substrate, and is characterized in that, when the liquid ejection head is attached to the liquid ejection device, the electric circuit board is located vertically above the element substrate, the electric circuit board is provided with a connector for electrically connecting to an electrical connection member provided in the liquid ejection device, and the connector is provided only on the upper surface of the electric circuit board facing away from the ejection port surface. Effect of the Invention

[0009] The liquid ejection head according to the present disclosure can be easily attached to a liquid ejection device. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is an exploded perspective view showing an example of a liquid ejection head according to an embodiment. [Diagram 2] FIG. 4 is a diagram showing an example of a connection portion between an electric circuit board and an element substrate according to an embodiment. [Diagram 3] FIG. 4 is a diagram showing a liquid ejection head in a hypothetical comparative example. [Figure 4] FIG. 1 is a schematic cross-sectional view of a liquid ejection head according to an embodiment. [Diagram 5] FIG. 2 is a schematic top view of an electric circuit board according to an embodiment. [Figure 6] FIG. 1 is a schematic perspective view showing a portion of a liquid ejection head according to an embodiment. [Figure 7] FIG. 1 is a schematic cross-sectional view of a liquid ejection head according to an embodiment. [Figure 8] FIG. 2 is a schematic top view of an electric circuit board according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] [First embodiment] FIG. 1 is an exploded perspective view showing an example of a liquid ejection head 100 that can be applied to this embodiment.

[0012] The coordinate axes in the figure will be described. Here, the liquid ejection head 100 will be described in a posture in which it is attached to a liquid ejection device (not shown). In the figures referred to in this specification, the X direction and the Y direction indicate two directions that are perpendicular to each other on a horizontal plane. The Z direction indicates the vertical direction. The +Y direction indicates the rear of the liquid ejection head 100, the -Y direction indicates the front, the -X direction indicates the left, the +X direction indicates the right, the +Z direction indicates the upper direction, and the -Z direction indicates the lower direction. The +Y direction is also downstream in the conveying direction of the recording medium, and the -Y direction is also upstream in the conveying direction of the recording medium. The X direction is appropriately called the scanning direction. In the following description, unless otherwise specified, the upper direction, the lower direction, and the left and right directions indicate the directions in the use posture in which the liquid ejection head 100 is used in a normal state.

[0013] In this embodiment, the description will be made on the assumption that the "liquid" is ink. However, the liquid that can be used in this embodiment is not limited to ink. In other words, various recording liquids including a treatment liquid used for the purpose of improving the fixation of ink on a recording medium, reducing uneven gloss, or improving abrasion resistance may be used as the liquid.

[0014] In this embodiment, the description will be given assuming that the "recording medium" is paper used in general liquid ejection devices. However, the "recording medium" is not limited as long as it is a medium capable of receiving liquid. Other examples of the "recording medium" include cloth, plastic film, metal plate, glass, ceramics, resin, wood, leather, etc.

[0015] "Recording" (also called "printing") does not only mean forming meaningful information such as letters and figures. "Recording" also means forming meaningless information such as images, designs, or patterns. Furthermore, "recording" does not matter whether it is something that is manifested so that humans can perceive it visually. In other words, "recording" also means forming a structure on a recording medium or processing the medium.

[0016] 1 can be detachably attached to a liquid ejection device (e.g., an inkjet printer) capable of performing recording on a recording medium (e.g., paper) by ejecting liquid in a so-called serial manner. For example, the liquid ejection head 100 is attached to a carriage (not shown) capable of reciprocating in a scanning direction (±X direction). When attached to the carriage, the liquid ejection head 100 can perform recording on a recording medium (not shown) while moving back and forth in the scanning direction (±X direction).

[0017] The liquid ejection device includes a transport unit (not shown) for transporting the recording medium in a transport direction. In this embodiment, the transport direction is set to a direction (-Y direction) perpendicular to the scanning direction. The liquid ejection device drives the transport unit to intermittently move the recording medium in the transport direction while moving the liquid ejection head 100 in the scanning direction to eject liquid, thereby performing recording.

[0018] The liquid ejection device includes a control unit (e.g., a CPU, not shown) for controlling the entire device, a ROM (not shown) in which programs executed by the control unit and various parameters are stored, and a RAM (not shown) that can be used as a temporary storage unit. For example, the CPU can read out a program stored in the ROM, expand the program into the RAM, and execute the program, thereby recording on a recording medium. Note that in this embodiment, the CPU can also circulate ink inside the liquid ejection head 100 by reading out a program stored in the ROM, expand the program into the RAM, and execute the program.

[0019] 1, the liquid ejection head 100 includes four individual units 101 capable of ejecting liquid individually. The liquid ejection head 100 includes a base member 102 capable of supporting all of the individual units 101, an electric circuit board 103 disposed on the base member 102, and a cover 104 capable of covering the electric circuit board 103. In this embodiment, the cover 104 is detachable from the base member 102. However, the cover 104 may be fixed so that it cannot be easily removed from the base member 102.

[0020] Each of the four individual units 101 includes a sub-tank 105 that functions as a storage unit capable of temporarily storing liquid used for recording, a flow path unit 106 in which a flow path is formed, and an element substrate 107 that is a semiconductor device capable of ejecting liquid. The electric circuit board 103 and each of the four element substrates 107 are connected by a flexible substrate 108. That is, in this embodiment, four flexible substrates 108 are used.

[0021] In this embodiment, an example is shown in which liquid is supplied to the subtank 105 from the outside (for example, a main tank not shown), but a cartridge in which a predetermined amount of liquid is stored in advance may be attached inside the liquid ejection head 100. In this way, it is also possible to supply liquid to the flow path portion 106 by attaching and detaching a disposable cartridge. Two flow paths that fluidly connect the subtank 105 and the element substrate 107 are formed inside the flow path portion 106.

[0022] The element substrate 107 has a discharge port surface on which a plurality of energy generating elements (e.g., heaters) that generate energy for discharging liquid and a discharge port array consisting of a plurality of discharge ports for discharging liquid are formed along a predetermined direction. The discharge port array is formed along the conveying direction (Y direction) of the recording medium. Each of the plurality of energy generating elements is provided at a position corresponding to each of the plurality of discharge ports. When the energy generating elements are driven, droplets are discharged from the discharge ports. An electric signal (discharge signal) for driving the energy generating elements is generated by the above-mentioned control unit. The discharge signal is transmitted from the main body of the liquid discharge device to the electric circuit board 103 via the electric connection member 109.

[0023] In this embodiment, a flexible cable is used as the electrical connection member 109. The ejection signal received by the electric circuit board 103 is transmitted to the element board 107 via the flexible board 108. The element board 107 is provided with a terminal capable of receiving the ejection signal. When the element board 107 receives the ejection signal, it drives the energy generating elements. In this manner, the liquid is ejected in this embodiment.

[0024] Each of the four individual units 101 is attached to the liquid ejection head 100 by being fixed to the base member 102. The periphery of the sub-tank 105 is covered by a cover 104. The cover 104 is attached from above toward below in the vertical direction, and is fixed to the base member 102.

[0025] In this embodiment, four individual units 101 are used, but the number of individual units 101 is not limited to four.

[0026] FIG. 2 is a diagram showing an example of a connection state between the electric circuit board 103 and the element substrate 107 of this embodiment.

[0027] 2, the electric circuit board 103 is disposed vertically above the flow path portion 106 with the front and back surfaces horizontal. Therefore, the electric circuit board 103 has an upper surface facing upward in the vertical direction (+Z direction) and a lower surface facing downward (-Z direction). A first opening 201 is formed in the electric circuit board 103.

[0028] Flexible substrate 108 is disposed so as to pass through first opening 201. An end portion (not shown in FIG. 2) of flexible substrate 108 is connected to approximately the center in the Y direction on the upper surface of electric circuit board 103. Flexible substrate 108 passes through first opening 201 from the upper surface of electric circuit board 103 and extends along the side surface of flow path section 106 (the surface facing the -X direction in FIG. 2).

[0029] An element substrate 107 is attached to the bottom surface of the flow path section 106 (the surface facing the -Z direction in FIG. 2). The flexible substrate 108 extends from the side surface of the flow path section 106 along the bottom surface so as to bend at approximately 90 degrees. The shape of the element substrate 107 is a rectangle having long sides and short sides when viewed from the bottom. An electrical contact portion to which an end of the flexible substrate 108 is connected is provided on the bottom surface of the element substrate 107 (the surface facing the -Z direction in FIG. 2). The electrical contact portion is provided at an end in the short side direction of the flexible substrate 108 so as to be along the longitudinal direction of the flexible substrate 108.

[0030] Specifically, the electrical contact portion is configured by arranging a plurality of terminals along the longitudinal direction of flexible substrate 108 at an end portion in the short side direction of flexible substrate 108. A plurality of wirings 203 (e.g., copper foil) is included inside flexible substrate 108. The electrical contact portion is sealed with sealing material 202 after element substrate 107 and flexible substrate 108 are electrically connected. In flexible substrate 108, each wiring 203 is linearly arranged along the extension direction of flexible substrate 108.

[0031] With this arrangement, it is not necessary to secure a relatively large area for arranging the wiring 203 on the bottom surface of the liquid ejection head 100. In other words, it is possible to reduce the size of the bottom surface of the liquid ejection head 100 and the size of the entire liquid ejection head. As described above, on the bottom surface of the liquid ejection head 100, the wiring 203 is arranged linearly along the extension direction of the flexible substrate 108 without changing the extension direction, taking into consideration the miniaturization of the liquid ejection head 100 and the production costs. Hereinafter, the effect of miniaturization in the liquid ejection head 100 of this embodiment will be described using a hypothetical comparative example.

[0032] FIG. 3A is a diagram showing a liquid ejection head 310 in a first comparative example.

[0033] As shown in FIG. 3(a), the liquid ejection head 310 includes an electric circuit board 303, a flexible board 318, an element board 317, a flow path portion 316, and a sealant 312. The flexible board 318 includes wiring 313. The electric circuit board 303 corresponds to the electric circuit board 103 (see FIG. 1 and FIG. 2). The flexible board 318 corresponds to the flexible board 108 (see FIG. 1 and FIG. 2). The wiring 313 corresponds to the wiring 203 (see FIG. 2). The element board 317 corresponds to the element board 107 (see FIG. 1 and FIG. 2). The flow path portion 316 corresponds to the flow path portion 106 (see FIG. 1 and FIG. 2). The sealant 312 corresponds to the sealant 202 (see FIG. 2).

[0034] In this comparative example, an end of flexible substrate 318 is connected to an end of electric circuit substrate 303. Flexible substrate 318 is bent from the back surface (surface facing the -Y direction) of flow path portion 316 along the bottom surface (surface facing the -Z direction).

[0035] Moreover, the element substrate 317 has an electrical connection portion provided in the same manner as in this embodiment. At the bottom surface of the liquid ejection head 310, the wiring 313 extends along the depth direction (Y direction) of the flow path portion 316 and changes direction along the width direction (X direction) of the flow path portion 316. That is, in the flexible substrate 318 of this comparative example, the individual wirings 313 are not arranged along the extending direction of the flexible substrate 318, and an extra region for changing the direction of the wiring 313 is required compared to the flexible substrate 108 of this embodiment. Therefore, the width W31 of the bottom surface of the flow path portion 316 on which the element substrate 317 is provided is larger than the width W2 (see FIG. 2) of the flow path portion 106, which may lead to an increase in size of the liquid ejection head 310.

[0036] Fig. 3(b) is a diagram showing a liquid ejection head 320 in a second comparative example. Below, a description of the configuration common to the liquid ejection head 310 (see Fig. 3(a)) will be omitted as appropriate, and the differences will be mainly described.

[0037] As shown in FIG. 3(b), the liquid ejection head 320 includes an electric circuit board 333, a flexible board 328, an element board 327, a flow path portion 326, and a sealant 322. The flexible board 328 includes a wiring 323. The electric circuit board 333 corresponds to the electric circuit board 103 (see FIG. 1 and FIG. 2). The flexible board 328 corresponds to the flexible board 108 (see FIG. 1 and FIG. 2). The wiring 323 corresponds to the wiring 203 (see FIG. 2). The element board 327 corresponds to the element board 107 (see FIG. 1 and FIG. 2). The flow path portion 326 corresponds to the flow path portion 106 (see FIG. 1 and FIG. 2). The sealant 322 corresponds to the sealant 202 (see FIG. 2).

[0038] In this comparative example, the electrical connection parts of the element substrate 327 are provided along the short side direction (X direction) at both ends in the longitudinal direction of the element substrate 327. As a result, the wiring 323 connected to the electrical connection parts provided on the forward side (-Y direction side) of the center of the element substrate 327 is linearly arranged.

[0039] However, the wiring 323 connected to the electrical connection portion provided on the rear side (+Y direction side) of the center of the element substrate 327 extends toward the depth direction (Y direction) of the flow path portion 326. Then, the wiring 323 changes its direction in the short side direction (X direction) and then changes its direction toward the depth direction (Y direction) again. That is, in the flexible substrate 328 of this comparative example, the individual wirings 323 are not arranged along the extending direction of the flexible substrate 328, and an extra region for changing the direction of the wiring 313 is required compared to the flexible substrate 108 of this embodiment. Therefore, the width W32 of the bottom surface of the flow path portion 326 on which the element substrate 327 is provided becomes larger than the width W2 (see FIG. 2) of the flow path portion 106, which may lead to an increase in size of the liquid ejection head 320.

[0040] Figures 4(a) and 4(b) are schematic cross-sectional views of a liquid ejection head 100 in this embodiment. In Figures 4(a) and 4(b), the liquid ejection head 100 is shown in a state where it is attached to a liquid ejection device. In Figure 4(a), the liquid ejection head 100 is cut along a cutting line passing through the Y-axis and the Z-axis. In Figure 4(b), the liquid ejection head 100 is cut along a cutting line passing through the X-axis and the Z-axis.

[0041] 4(a), a second opening 401 is formed in the top surface of the cover 104. The subtank 105 is provided with a supply port 402 through which liquid is supplied from the main tank (not shown). The supply port 402 is provided inside the second opening 401. The electric circuit board 103 is provided with a third opening 403.

[0042] The base member 102 is provided with a fourth opening 404 and a sixth opening 414 (see FIG. 4(b)) for passing a part of the flow path portion 106. The flow path portion 106 is provided with a supply flow path 406 connected to the sub-tank 105. The supply flow path 406 is formed so as to penetrate the third opening 403 and the fourth opening 404. The upper surface of the electric circuit board 103 is provided with an electrical connection portion 407 (specifically, a plurality of terminals) to which an end of the flexible board 108 is connected. The flexible board 108 and the element board 107 are connected via a wire 408. The wire 408 is sealed with a sealing material 202.

[0043] When the liquid ejection head 100 is attached to a liquid ejection device, the upper surface of the electric circuit board 103 is arranged parallel to the bottom surface of an element substrate 107 in which ejection ports capable of ejecting liquid are formed.

[0044] The flexible substrate 108 is arranged so as to pass from an electrical connection portion 407 provided on the upper surface of the electric circuit board 103 through a first opening 201 provided in the electric circuit board 103 and a fifth opening 405 provided in the base member 102. The flexible substrate 108 is arranged along the side and bottom surfaces of the flow path portion 106 and is connected to a wire 408. A terminal of the flexible substrate 108 and a terminal provided on the element substrate 107 are connected by wire bonding using the wire 408.

[0045] When recording is performed by the liquid ejection head 100, the liquid used for recording is supplied from a main tank (not shown) to the subtank 105 via a supply port 402. The liquid is temporarily stored in the subtank 105. When the subtank 105 is incorporated in the liquid ejection head 100, the subtank 105 is disposed vertically above the electric circuit board 103. The liquid stored in the subtank 105 is supplied to the element substrate 107 via a supply flow path 406.

[0046] When an ejection signal for ejecting liquid is transmitted to the energy generating elements provided on the element substrate 107 via the flexible substrate 108 and the wires 408, the liquid is ejected from the ejection ports.

[0047] 4(b), a first connector 410 capable of connecting an electrical connection member 109 for transmitting an electrical signal (e.g., an ejection signal) transmitted from the liquid ejection device main body to the electric circuit board 103 is provided on the upper surface of the electric circuit board 103. In this embodiment, the first connector 410 is provided only on the upper surface of the electric circuit board 103 facing in the opposite direction (+Z direction) to the direction in which the ejection port surface of the element substrate 107 faces (-Z direction).

[0048] Furthermore, in this embodiment, in order to obtain stable ejection performance even when the viscosity of the liquid increases, the liquid ejection head 100 is configured to circulate the liquid inside. A pump (not shown) for sucking and circulating the liquid is provided inside the subtank 105. An original signal for driving the pump is generated by a pump control unit (for example, the above-mentioned CPU not shown). The original signal is input from the liquid ejection device main body via an electrical connection member 109 to a first connector 410 provided on the upper surface of the electrical circuit board 103.

[0049] In the electric circuit board 103, the original signal is transmitted to a second connector 412 provided on the upper surface of the electric circuit board 103 via a circuit provided on the electric circuit board 103. With a harness 411 connected to the second connector 412, the original signal is transmitted to a pump provided inside the subtank 105 via the harness 411. The harness 411 is detachable from the second connector 412.

[0050] As described above, the liquid ejection head 100 can be attached to and detached from the liquid ejection apparatus. Before the liquid ejection head 100 is attached to the liquid ejection apparatus, the electrical connection member 109 and the harness 411 are not connected to the first connector 410 and the second connector 412, respectively. When the liquid ejection head 100 is attached to the liquid ejection apparatus, the electrical connection member 109 is connected to the first connector 410. Specifically, an end of the electrical connection member 109 is inserted into an insertion portion of the first connector 410. When the liquid ejection head 100 is removed from the liquid ejection apparatus, an end of the electrical connection member 109 is removed from the insertion portion of the first connector 410.

[0051] Furthermore, when the liquid ejection head 100 is attached to the liquid ejection device, the harness 411 is connected to the second connector 412. Specifically, an end of the harness 411 is inserted into an insertion portion of the second connector 412. When the liquid ejection head 100 is removed from the liquid ejection device, the end of the harness 411 is pulled out from the insertion portion of the second connector 412.

[0052] A recovery flow path 413 for recovering liquid from the element substrate to the subtank 105 when circulating the liquid is formed in the flow path section 106. The recovery flow path 413 is formed so as to pass through a sixth opening 414 provided in the base member 102 and a seventh opening 415 provided in the electric circuit board 103. The subtank 105 and the flow path section 106 are connected to each other via the supply flow path 406 and the recovery flow path 413.

[0053] According to this configuration, when a drive signal for driving the pump is input to the first connector 410 via the electrical connection member 109, the drive signal is transmitted to the second connector 412 via a circuit provided on the electrical circuit board 103. The drive signal is then transmitted to the pump via the harness 411. When the pump is driven by the drive signal, liquid is supplied from the pump via the supply flow path 406 to the element substrate 107, and is recovered from the element substrate 107 via the recovery flow path 413 to the pump.

[0054] In this embodiment, the first connector 410 is located in a relatively narrow space inside the liquid ejection head 100. Therefore, the user needs to attach and detach the electrical connection member 109 to and from the first connector 410 inside this narrow space. For this reason, ease of the attachment and detachment work is required.

[0055] Therefore, in this embodiment, a first connector 410 is used that extends linearly from the upper surface of the electric circuit board 103 upward in the vertical direction when the liquid ejection head 100 is attached to the liquid ejection device. The electrical connection member 109 is connected to the linear first connector 410 linearly from the top to the bottom in the vertical direction. With this configuration, the electrical connection member 109 can be connected to the first connector 410 without the need for complicated work.

[0056] Furthermore, in this embodiment, the operation of connecting the harness 411 to the second connector 412 is performed after the sub-tank 105 is assembled. Therefore, after the sub-tank 105 is assembled, the second connector 412 is located in a relatively narrow space inside the liquid ejection head 100. Therefore, the user needs to attach and detach the harness 411 to and from the second connector 412 inside this narrow space. Therefore, ease of the attachment and detachment operation is also required.

[0057] Therefore, in this embodiment, a second connector 412 is used that extends linearly from the upper surface of the electric circuit board 103 upward in the vertical direction when the liquid ejection head 100 is attached to the liquid ejection device. The harness 411 is then connected to the second connector 412 linearly from the top to the bottom in the vertical direction. With this configuration, the harness 411 can be connected to the second connector 412 without the need for complicated work.

[0058] Furthermore, in this embodiment, the first connector 410 and the second connector 412 are disposed at both ends of the electric circuit board 103, respectively, and a space for extending the electric connection member 109 and the harness 411 is secured above in the vertical direction. Therefore, by connecting the electric connection member 109 and the harness 411 along the vertical direction, it is possible to achieve both ease of attachment and detachment and miniaturization of the liquid ejection head.

[0059] As shown in Fig. 4(b), the first connector 410 and the second connector 412 are preferably provided at the end of the upper surface of the electric circuit board 103 in the transport direction (Y direction). That is, on the upper surface of the electric circuit board 103, the first connector 410 and the second connector 412 are preferably provided at the end in a direction (Y direction) that intersects in a plane with the scanning direction (X direction) of the liquid ejection head 100. This is because the risk of interference with the carriage is reduced when an operator (i.e., a user) accesses the first connector 410 and the second connector 412 from the transport direction compared to accessing them from the scanning direction.

[0060] FIG. 5 is a top view of an electric circuit board 103 that can be applied to this embodiment.

[0061] 5, an electrical connection portion and an electrical component mounting portion are provided on the upper surface of the electrical circuit board 103. In this embodiment, an electrical connection portion includes an electrical connection portion 407, a first connector 410, and a second connector 412. As the electrical component mounting portion, a memory device 501 that records information about the liquid ejection head 100, and a pump drive circuit 502 that converts an original signal for driving the pump into a drive signal and generates the drive signal are provided. In this manner, in this embodiment, the electrical connection portion and the electrical component mounting portion are all concentrated on the upper surface of the electrical circuit board 103.

[0062] Further, a third opening 403 for passing a supply flow path 406 (see FIG. 4) and a seventh opening 415 for passing a recovery flow path 413 (see FIG. 4) are formed in the electric circuit board 103. An electric connection part 407 explaining the flexible board 108 and the electric circuit board 103 is preferably sealed with a sealing material (not shown). With such a configuration, electrical safety can be maintained.

[0063] As described above, the liquid ejection head of this embodiment can be easily attached to the liquid ejection device.

[0064] Furthermore, compared to a liquid ejection head in which electrical connection sections and electrical component mounting sections are provided on the upper and lower surfaces of an electrical circuit board, it is possible to reduce the size and prevent costs from increasing.

[0065] In addition, by concentrating the electrical connection parts and the electrical component mounting parts on the upper surface of the electrical circuit board 103, it is possible to suppress an increase in costs in the production process and shorten the time required for the work.

[0066] In addition, if liquid leaks from the flow path, it is necessary to prevent the liquid from reaching the electrical mounting section, but since the electrical component mounting sections are concentrated on the upper surface of the electrical circuit board 103, the range that the user can access can be limited to the upper surface. In other words, if liquid leaks, it is easier to deal with the leakage compared to a liquid ejection head in which the electrical connection sections and the electrical component mounting sections are provided on the upper and lower surfaces of the electrical circuit board.

[0067] [Second embodiment] The present embodiment aims to provide a technology that allows a liquid ejection head to be easily attached to a liquid ejection device even when the liquid ejection head is elongated. In the following, the same reference numerals and names are used for configurations common to or corresponding to the first embodiment, and explanations are omitted, and differences from the first embodiment are mainly described.

[0068] FIG. 6 is a schematic perspective view showing a part of a second liquid ejection head 600 that can be applied to this embodiment.

[0069] 6, two element substrates 107 are arranged in a staggered manner along the direction in which the ejection port array extends (Y direction) on the bottom surface of one flow path section 106. These two element substrates 107 are arranged so as to be point symmetrical with respect to a center point 601 located at the center of the bottom surface of the flow path section 106. In this embodiment, two flexible substrates 108 are used in conjunction with the use of two element substrates 107.

[0070] Each of the two flexible substrates 108 is provided for each of the two element substrates 107. Ends of each of the two flexible substrates 108 are connected to electrical contact portions of the element substrate 107, similar to the first embodiment.

[0071] FIG. 7(a) is a cross-sectional view taken along line VIIA-VIIA of FIG.

[0072] 7(a), one of the two flexible substrates 108 is connected to one of two electrical connection parts 407 (electrical connection part 407 at the left end in the figure) provided on the upper surface of the electric circuit board 103. This flexible substrate 108 passes through the first opening 201 on the left side in the figure and the fifth opening 405, and is drawn out below the electric circuit board 103. Then, this flexible substrate 108 is bent by about 90 degrees so as to follow the left side surface (surface facing the -X direction) and the bottom surface of the flow channel part 106, and is connected to one of the two element substrates 107 arranged on the bottom surface of the flow channel part 106 via a wire 408.

[0073] FIG. 7B is a cross-sectional view taken along line VIIB-VIIB of FIG.

[0074] As described above, the two element substrates 107 are arranged so as to be point-symmetrical with respect to the center point 601 (see FIG. 6). Therefore, the two electrical connection parts 407 are also provided so as to be point-symmetrical with respect to the center point 601 (see FIG. 6). Therefore, the two flexible substrates 108 are each drawn out in the opposite directions from the two electrical connection parts 407.

[0075] 7(b), the other of the two flexible substrates 108 is connected to the other of the two electrical connection parts 407 (electrical connection part 407 at the right end in the figure) provided on the upper surface of the electric circuit board 103. This flexible substrate 108 passes through the first opening 201 on the right side in the figure and the fifth opening 405, and is pulled out below the electric circuit board 103. Then, this flexible substrate 108 is bent by about 90 degrees so as to follow the right side surface (surface facing the +X direction) and the bottom surface of the flow channel section 106, and is connected to the other of the two element substrates 107 arranged on the bottom surface of the flow channel section 106 via a wire 408.

[0076] FIG. 8 is a top view of an electric circuit board 103 that can be applied to this embodiment.

[0077] 8, two third openings 403 and two first openings 201 are provided on the upper surface of the electric circuit board 103 of this embodiment at positions corresponding to the positions of two element substrates 107 (see FIG. 6) arranged in a staggered pattern. Ends of two flexible substrates 108 (see FIG. 6) pass through the two first openings 201, respectively, and are connected to two electrical connection parts 407 provided on the upper surface of the electric circuit board 103, respectively.

[0078] As in the first embodiment, in this embodiment, the electrical connection portions and the electrical component mounting portions are concentrated on the upper surface of the electric circuit board 103. That is, the first connector 410, the second connector 412, the memory device 501, and the pump drive circuit 502 are provided only on the upper surface of the electric circuit board 103. The first connector 410, the second connector 412, the memory device 501, and the pump drive circuit 502 are not provided on the lower surface of the electric circuit board 103. Even with this configuration, it is possible to obtain the same effects as in the first embodiment.

[0079] As described above, in this embodiment, the two element substrates 107 are arranged in a staggered manner, thereby lengthening the individual unit 101. In this manner, by providing a single individual unit 101 with a plurality of common components, it is possible to provide a second liquid ejection head 600 that is relatively inexpensive and has high performance.

[0080] In this embodiment, the electric circuit board 103 is disposed so that the upper surface of the electric circuit board 103 is parallel to the ejection port surface, and the electric contacts and the electric component mounting portion are provided only on the upper surface of the electric circuit board 103. This makes it possible to provide a second liquid ejection head 600 that is small and easily detachable.

[0081] In this embodiment, four flow path sections 106 in which two element substrates 107 are arranged in a staggered manner are used, but the number of flow path sections 106 is not limited to four. Furthermore, the number of element substrates 107 arranged in a staggered manner for one flow path section 106 is not limited to two. In other words, any number of flow path sections 106 and element substrates 107 can be used.

[0082] [Other embodiments] In the first and second embodiments, the individual units 101 are configured to be capable of ejecting ink of a single color. However, as long as the liquids do not mix inside one individual unit 101, multiple types of liquids may be ejected from one individual unit 101.

[0083] Furthermore, four or more individual units 101 may be arranged along the X direction (scanning direction) and the Y direction (transport direction). In other words, four or more individual units 101 do not have to be arranged in a row.

[0084] The present disclosure includes the following configurations.

[0085] [Configuration 1] A liquid ejection head, a reservoir for storing liquid; an element substrate having a discharge port surface on which a discharge port for discharging the liquid stored in the storage portion is formed; an electric circuit board that electrically connects the liquid ejection device and the element substrate; Equipped with When the liquid ejection head is attached to the liquid ejection device, the electric circuit board is positioned vertically above the element substrate, a connector for electrically connecting to an electrical connection member of the liquid ejection device is provided on the electrical circuit board; the connector is provided only on an upper surface of the electric circuit board facing in a direction opposite to the ejection port surface; A liquid ejection head comprising:

[0086] [Configuration 2] When the liquid ejection head is attached to the liquid ejection device, the electric circuit board and the element substrate are horizontally disposed, The connector receives the electrical connection member vertically downwardly. A liquid ejection head according to configuration 1.

[0087] [Configuration 3] a flow path portion that fluidly connects the reservoir portion and the element substrate; a flexible substrate that electrically connects the element substrate and the electric circuit substrate; Further comprising: The liquid ejection head ejects liquid while moving in a scanning direction, the flexible substrate is disposed in a folded state along a side surface of the flow path portion facing the scanning direction and a bottom surface on which the element substrate is provided. 3. The liquid ejection head according to configuration 1 or 2.

[0088] [Configuration 4] the electric circuit board is provided with a first opening for passing the flexible board; The flexible substrate is disposed so as to pass through the first opening. A liquid ejection head according to configuration 3.

[0089] [Configuration 5] The flow path portion is arranged to pass through a second opening provided in the electric circuit board. 5. The liquid ejection head according to configuration 3 or 4.

[0090] [Configuration 6] When the liquid ejection head is attached to the liquid ejection device, the connector receives insertion of the electrical connection member corresponding to the connector vertically downward. 6. The liquid ejection head according to any one of configurations 1 to 5.

[0091] [Configuration 7] a sealing portion that seals an electrical connection portion in the liquid ejection head; The liquid ejection head according to any one of configurations 1 to 6.

[0092] [Configuration 8] On the upper surface, the connector is provided at an end portion in a direction intersecting the scanning direction. The liquid ejection head according to any one of configurations 3 to 7.

[0093] [Configuration 9] A pump capable of sucking liquid is further provided, the flow path section includes a first flow path for supplying liquid from the storage section to the element substrate, and a second flow path for recovering liquid from the element substrate to the storage section; When the pump is driven, liquid circulates between the pump and the element substrate. The liquid ejection head according to any one of configurations 5 to 8.

[0094] [Configuration 10] The storage section includes: A storage chamber capable of temporarily storing liquid; The pump; Including, A liquid ejection head according to configuration 9.

[0095] [Configuration 11] The electric circuit board has a circuit for converting an original signal for driving the pump into a drive signal, and the connector includes a connector for receiving the original signal and a connector for transmitting the drive signal. 11. The liquid ejection head according to configuration 9 or 10.

[0096] [Configuration 12] the connector for transmitting the drive signal is provided so as to be capable of receiving insertion of the harness for transmitting the drive signal vertically downward; A liquid ejection head according to configuration 11.

[0097] [Configuration 13] On the upper surface, a connector for transmitting the drive signal is provided at an end portion in a direction intersecting a plane with respect to the scanning direction. 13. The liquid ejection head according to configuration 11 or 12.

[0098] [Configuration 14] A pump control unit capable of generating a drive signal for driving the pump, The pump control unit is provided only on the upper surface. 14. The liquid ejection head according to any one of configurations 9 to 13.

[0099] [Configuration 15] A plurality of the storage portions; A plurality of the element substrates; A plurality of flow path sections connecting each of the plurality of storage sections to each of the plurality of element substrates; having Each of the plurality of storage sections, each of the plurality of element substrates, and each of the plurality of flow path sections are provided on one of the electric circuit boards. 15. The liquid ejection head according to any one of configurations 3 to 14.

[0100] [Configuration 16] The element substrate is provided corresponding to each of the plurality of storage sections. A liquid ejection head according to configuration 15.

[0101] [Configuration 17] The plurality of element substrates are arranged in a staggered manner along a direction intersecting the scanning direction. 17. A liquid ejection head according to configuration 15 or 16.

[0102] [Configuration 18] A liquid ejection head according to any one of configurations 1 to 17, A conveying unit capable of conveying the recording medium along a conveying direction; Equipped with A liquid ejection device comprising:

[0103] [Configuration 19] a moving means for moving the liquid ejection head along a scanning direction, 19. A liquid ejection device according to configuration 18.

Claims

1. A liquid ejection head, a reservoir for storing liquid; an element substrate having a discharge port surface on which a discharge port for discharging the liquid stored in the storage portion is formed; an electric circuit board that electrically connects the liquid ejection device and the element substrate; Equipped with When the liquid ejection head is attached to the liquid ejection device, the electric circuit board is positioned vertically above the element substrate, a connector for electrically connecting to an electrical connection member of the liquid ejection device is provided on the electrical circuit board; the connector is provided only on an upper surface of the electric circuit board facing in a direction opposite to the ejection port surface; A liquid ejection head comprising:

2. When the liquid ejection head is attached to the liquid ejection device, the electric circuit board and the element substrate are horizontally disposed, The connector receives the electrical connection member vertically downwardly. The liquid ejection head according to claim 1 .

3. a flow path portion that fluidly connects the reservoir portion and the element substrate; a flexible substrate that electrically connects the element substrate and the electric circuit substrate; Further comprising: The liquid ejection head ejects liquid while moving in a scanning direction, the flexible substrate is disposed in a folded state along a side surface of the flow path portion facing the scanning direction and a bottom surface on which the element substrate is provided. The liquid ejection head according to claim 1 .

4. the electric circuit board is provided with a first opening for passing the flexible board; The flexible substrate is disposed so as to pass through the first opening. The liquid ejection head according to claim 3 .

5. The flow path portion is arranged to pass through a second opening provided in the electric circuit board. The liquid ejection head according to claim 3 .

6. When the liquid ejection head is attached to the liquid ejection device, the connector receives insertion of the electrical connection member corresponding to the connector vertically downward. The liquid ejection head according to claim 1 .

7. a sealing portion that seals an electrical connection portion in the liquid ejection head; The liquid ejection head according to claim 1 .

8. On the upper surface, the connector is provided at an end portion in a direction intersecting the scanning direction. The liquid ejection head according to claim 3 .

9. A pump capable of sucking liquid is further provided, the flow path section includes a first flow path for supplying liquid from the storage section to the element substrate, and a second flow path for recovering liquid from the element substrate to the storage section, When the pump is driven, liquid circulates between the pump and the element substrate. The liquid ejection head according to claim 5 .

10. The storage section includes: A storage chamber capable of temporarily storing liquid; The pump; Including, The liquid ejection head according to claim 9.

11. The electric circuit board has a circuit for converting an original signal for driving the pump into a drive signal, and the connector includes a connector for receiving the original signal and a connector for transmitting the drive signal. The liquid ejection head according to claim 9.

12. the connector for transmitting the drive signal is provided so as to be capable of receiving insertion of the harness for transmitting the drive signal vertically downward; The liquid ejection head according to claim 11.

13. On the upper surface, a connector for transmitting the drive signal is provided at an end portion in a direction intersecting a plane with respect to the scanning direction. The liquid ejection head according to claim 11.

14. A pump control unit capable of generating a drive signal for driving the pump, The pump control unit is provided only on the upper surface. The liquid ejection head according to claim 9.

15. A plurality of the storage portions; A plurality of the element substrates; A plurality of flow path sections connecting each of the plurality of storage sections to each of the plurality of element substrates; having Each of the plurality of storage sections, each of the plurality of element substrates, and each of the plurality of flow path sections are provided on one of the electric circuit boards. The liquid ejection head according to claim 3 .

16. The element substrate is provided corresponding to each of the plurality of storage sections. The liquid ejection head according to claim 15.

17. The plurality of element substrates are arranged in a staggered manner along a direction intersecting the scanning direction. The liquid ejection head according to claim 15.

18. The liquid ejection head according to claim 1 ; A conveying unit capable of conveying the recording medium along a conveying direction; Equipped with A liquid ejection device comprising:

19. a moving means for moving the liquid ejection head along a scanning direction, The liquid ejection device according to claim 18.

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