Laminate and method for processing the same

Abstract

To provide a laminate capable of easily discriminating whether or not a desired layer is exposed when a recess is formed, and a method for processing the laminate.SOLUTION: A laminate 10 is provided that is used for manufacturing an IC card in which an IC module is arranged in a recess. The laminate 10 includes: a transparent or translucent first layer 12; a second layer 13 present at a position deeper than the first layer 12 in a depth direction D from a front face 10A toward a rear face 10B, the front face 10A being a face of the laminate 10 on which a recess is formed, and the face 10B being a face opposite to the front face 10A; and a first intermediate layer 18 disposed between the first layer 12 and the second layer 13 and having a color tone different from the first layer 12 and the second layer 13 or developing color by light irradiation.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a laminate and a method for processing the laminate. [Background technology]

[0002] Conventionally, there have been contact IC cards that input and output electrical signals through external contact terminals on the surface of the card, contactless IC cards that input and output electrical signals through electromagnetic induction or the like via an antenna coil, and contact / contactless IC cards that can achieve the functions of both a contact IC card and a contactless IC card using a single IC chip mounted on the card.

[0003] Of these, in contact IC cards and contact / contactless IC cards, an IC module including a substrate and an IC chip arranged on the back side of the substrate is arranged in a recess provided on the surface of the card base (see, for example, Patent Document 1). Patent Document 1 discloses that a printed pattern is formed on at least one surface of the core sheet, but the printed pattern is for identifying the position of the antenna. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 7142484 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the substrate of the IC module is adhered to a step within the recess, and depending on the type of layer that constitutes the step within the recess, the adhesion to the substrate may be poor, and there is a risk that the IC module will peel off from the card base due to bending of the IC card, etc.

[0006] For this reason, studies have been conducted on improving adhesion to the substrate by exposing a desired layer that has good adhesion to the substrate by controlling the cutting depth of the recesses.

[0007] However, when a transparent or semi-transparent layer (upper layer) exists above a desired layer, it is difficult to tell whether the desired layer or the upper layer is exposed, even when checking, because the upper layer is transparent or semi-transparent. Similarly, when a layer (upper layer) of the same color as the desired layer exists above the desired layer, it is difficult to tell whether the desired layer or the upper layer is exposed, even when checking, because the upper layer has the same color as the desired layer.

[0008] The present invention has been made to solve the above problems, and aims to provide a laminate and a method for processing the laminate that can easily determine whether or not a desired layer is exposed when forming a recess. [Means for solving the problem]

[0009] [1] A laminate used in the manufacture of an IC card having an IC module disposed in a recess, the laminate comprising: a transparent or translucent first layer; a second layer that is deeper than the first layer in a depth direction from the front surface to the back surface, when the surface of the laminate on which the recess is formed is defined as the front surface and the surface opposite to the front surface is defined as the back surface; and a first intermediate layer that is disposed between the first layer and the second layer and has a different color from the first layer and the second layer or changes color when exposed to light.

[0010] [2] The laminate according to the above [1], wherein the second layer is a transparent layer or a semi-transparent layer.

[0011] [3] The laminate described in [2] above, further comprising: a third layer located deeper than the second layer in the depth direction; and a second intermediate layer disposed between the second layer and the third layer, in contact with the second layer and the third layer, and having a color different from those of the first layer, the second layer, the third layer, and the first intermediate layer, or emitting a color different from that of the first intermediate layer when exposed to light.

[0012] [4] The laminate according to [1] above, wherein the second layer is an opaque layer.

[0013] [5] The laminate described in [4] above, further comprising: a transparent or translucent third layer located deeper than the second layer in the depth direction; and a second intermediate layer located deeper than the third layer in the depth direction, in contact with the third layer, and having a color different from those of the first layer, the second layer, the third layer, and the first intermediate layer or emitting a color different from that of the first intermediate layer when exposed to light.

[0014] [6] A laminate used in the manufacture of an IC card having an IC module disposed in a recess, the laminate comprising: an opaque first layer; a transparent or translucent second layer that is deeper than the first layer in a depth direction from the front surface to the back surface and in contact with the first layer, when the surface of the laminate on which the recess is formed is defined as the front surface and the surface opposite to the front surface is defined as the back surface; and a first intermediate layer that is deeper than the second layer in the depth direction, in contact with the second layer, and has a color different from that of the first layer and the second layer or changes color when exposed to light.

[0015] [7] The laminate described in [6] above, further comprising: a transparent or translucent third layer that is located deeper than the second intermediate layer in the depth direction and in contact with the first layer; and a second intermediate layer that is located deeper than the third layer in the depth direction, in contact with the third layer, and has a color different from that of the first layer, the second layer, the third layer, and the first intermediate layer, or that emits a color different from that of the first intermediate layer when exposed to light.

[0016] [8] A method for processing the laminate described in [1] above, comprising the steps of: preparing the laminate; and cutting the laminate from the surface side of the laminate in the depth direction to form a recess, wherein cutting of the laminate is continued until the color of the first intermediate layer is no longer noticeable.

[0017] [9] A method for processing the laminate described in [6] above, comprising the steps of: preparing the laminate; and cutting the laminate in the depth direction from the surface side of the laminate to form a recess, wherein cutting of the laminate is continued until the color of the first intermediate layer is confirmed. Effect of the Invention

[0018] According to the present invention, it is possible to provide a laminate and a method for processing the laminate that can easily determine whether or not a desired layer is exposed when forming a recess. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a schematic plan view of a laminate used in manufacturing a contact and contactless IC card according to the first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view showing the configuration of another laminate used in manufacturing the contact and contactless IC card according to the first embodiment. [Figure 4] FIG. 4 is a schematic cross-sectional view showing the configuration of another laminate used in manufacturing the contact and contactless IC card according to the first embodiment. [Diagram 5] 5A to 5C are schematic diagrams showing the process of processing the laminate according to the first embodiment and the process of manufacturing an IC card compatible with both contact and contactless IC cards. [Figure 6] 6A and 6B are schematic diagrams showing the process of processing the laminate according to the first embodiment and the process of manufacturing an IC card for both contact and contactless use. [Figure 7]FIG. 7 is a schematic diagram showing a processing step of another laminate according to the first embodiment. [Figure 8] FIG. 8 is a schematic diagram showing a processing step of another laminate according to the first embodiment. [Figure 9] FIG. 9 is a schematic cross-sectional view showing the configuration of a laminate used in manufacturing an IC card for contact and contactless use according to the second embodiment. [Figure 10] FIG. 10 is a schematic cross-sectional view showing the configuration of another laminate used in manufacturing the contact and contactless IC card according to the second embodiment. [Figure 11] FIG. 11 is a schematic diagram showing a processing step of another laminate according to the second embodiment. [Figure 12] FIG. 12 is a schematic diagram showing a processing step of another laminate according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] [First embodiment] Hereinafter, a laminate according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a schematic plan view of a laminate used in manufacturing a contact and contactless IC card according to this embodiment, and Fig. 2 is a cross-sectional view taken along line AA in Fig. 1. Figs. 3 and 4 are schematic cross-sectional views showing the configuration of another laminate used in manufacturing a contact and contactless IC card according to this embodiment. Figs. 5A to 5C, 6A, and 6B are schematic views showing the processing steps of the laminate according to this embodiment and the manufacturing steps of a contact and contactless IC card, and Figs. 7 and 8 are schematic views showing the processing steps of another laminate according to this embodiment.

[0021] <<<Laminate>>> The laminate 10 shown in Figures 1 and 2 is used for manufacturing an IC card having an IC module disposed in a recess. The laminate 10 is used for manufacturing both contact and contactless IC cards, but may also be used for manufacturing contact IC cards. As shown in Figure 2, the laminate 10 has a front surface 10A and a back surface 10B, which is the surface opposite to the front surface 10A. The front surface 10A is the surface on the side that forms a recess for disposing the IC module.

[0022] As shown in FIG. 2, the laminate 10 has a structure in which the over-sheet layer 11, the first layer 12, the second layer 13, the third layer 14, the inner layer 15, the core layer 16, and the over-sheet layer 17 are laminated in this order in the depth direction D from the front surface 10A to the back surface 10B of the laminate 10. That is, the second layer 13 is located deeper than the first layer 12 in the depth direction D of the laminate 10, and the third layer 14 is located deeper than the second layer 13 in the depth direction D of the laminate 10. However, the layer structure of the laminate 10 is not limited to this, and may be a two-layer structure of the first layer and the second layer, or a three-layer structure of the first layer, the second layer, and the third layer. Alternatively, the layer structure of the laminate 10 may be a multi-layer structure of seven or more layers. In addition, printing or a magnetic stripe may be embedded on the surface of the over-sheet layer 11 opposite to the first layer 12 side of the laminate 10 or the surface of the over-sheet layer 17 opposite to the core layer 16.

[0023] A first intermediate layer 18 (hereinafter, sometimes simply referred to as "intermediate layer 18") is disposed between the first layer 12 and the second layer 13. In addition, an antenna coil 19 wound in a loop shape and made of a coated conductive wire or the like is disposed on the surface of the third layer 14.

[0024] <<Oversheet layer>> The over-sheet layers 11 and 17 may be transparent layers, semi-transparent layers, or opaque layers such as white, but the over-sheet layers 11 and 17 shown in Fig. 2 are transparent layers. The thickness of the over-sheet layers 11 and 17 may be about 0.03 mm or more and 0.18 mm or less. From the viewpoint of preventing curling when the laminate 10 is integrated by heat pressing or the like, it is preferable that the over-sheet layers 11 and 17 have the same thickness, but they do not necessarily have to be the same thickness.

[0025] The material of the over-sheet layers 11 and 17 may be any material that has adhesive properties when heated. Even if the over-sheet layers themselves do not have adhesive properties when heated, the two can be integrated by additionally forming a layer of a known adhesive that generates adhesive strength when heated or the like between the over-sheet layer 11 and the first layer 12, or between the over-sheet layer 17 and the core layer 16.

[0026] <<First layer>> The first layer 12 is a transparent layer or a semi-transparent layer. In this specification, "transparent" and "semi-transparent" mean that the total light transmittance is not 0%, and the total light transmittance is preferably 30% or more, and more preferably 50% or more. "Transparent" may be either colorless transparent or colored transparent, and "semi-transparent" may be either colorless semi-transparent or colored semi-transparent. Since the first layer 12 is a transparent layer or a semi-transparent layer, the color of the intermediate layer 18 can be confirmed when cutting the first layer 12 to form a recess for arranging an IC module. The total light transmittance can be measured in accordance with JIS K7361-1:1997, for example, using a haze meter HM150 manufactured by Murakami Color Research Laboratory.

[0027] The first layer 12 functions as, for example, a core layer. The first layer 12 is not particularly limited as long as it is a transparent layer or a semi-transparent layer, and examples of the first layer 12 include a plastic sheet. Examples of the plastic sheet include a single film of polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, copolymer polyester, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylic ester, polypropylene, polyethylene, polyurethane, and the like, or a composite film thereof. In addition, the plastic sheet may be a plastic sheet made by recycling waste materials or marine plastics generated during the manufacturing process from the viewpoint of environmental measures. Note that, when a crystallized plastic sheet such as C-PET (crystalline PET) is used as the first layer 12, the adhesion to the substrate of the IC module is poor.

[0028] The thickness of the first layer 12 can be appropriately selected taking into consideration the overall thickness of the laminate 10, and may be, for example, about 0.03 mm or more and 0.20 mm or less.

[0029] <<Second layer>> The second layer 13 may be a transparent layer, a semi-transparent layer, or an opaque layer that is white or the like. The second layer 13 has better adhesion to the substrate of the IC module than the first layer 12. For example, when a marine plastic sheet is used as the first layer 12 and, for example, a copolymer polyester sheet is used as the second layer 13, the second layer 13 has better adhesion to the substrate of the IC module than the first layer 12.

[0030] The second layer 13 functions, for example, as an inner layer. The second layer 13 is not particularly limited, but may be, for example, the plastic sheet described in the section on the first layer 12. The thickness of the second layer 13 can be appropriately selected in consideration of the overall thickness of the laminate 10, and may be, for example, about 0.03 mm or more and 0.20 mm or less.

[0031] <<Third layer>> The third layer 14 may be a transparent layer, a semi-transparent layer, or an opaque layer such as a white layer. The third layer 14 functions, for example, as an antenna coil holding layer. The third layer 14 is not particularly limited, but may be, for example, the plastic sheet described in the section on the first layer 12. The thickness of the third layer 14 can be appropriately selected taking into account the overall thickness of the laminate 10, and may be, for example, about 0.03 mm or more and 0.40 mm or less.

[0032] <<Inner layer>> The inner layer 15 may be a transparent layer, a translucent layer, or an opaque layer such as a white layer, but the inner layer 15 shown in FIG. 1 is a transparent layer.

[0033] The inner layer 15 is not particularly limited, but may be, for example, the plastic sheet described in the section on the first layer 12. The thickness of the inner layer 15 is preferably in the same range as the thickness of the second layer 13.

[0034] <<Core Layer>> The core layer 16 may be a transparent layer, a translucent layer, or an opaque layer such as white, but the core layer 16 shown in Fig. 2 is a translucent layer. The core layer 16 is not particularly limited, and examples thereof include the plastic sheet described in the section on the first layer 12. The thickness of the core layer 16 is preferably in the same range as the thickness of the first layer 12.

[0035] <<Antenna coil>> The antenna coil 19 is in a loop shape. The antenna coil 19 may be for performing close-proximity communication using, for example, a 13.56 MHz HF frequency band, or may be for performing communication using, for example, a 920 MHz UHF frequency band, and is disposed so that the IC chip 34 can communicate with an external reader / writer (information reading / writing device) when performing non-contact communication. When an IC card is held over the reader / writer, a magnetic field formed by the reader / writer generates a current through the antenna coil 19, which supplies power to the IC chip. This enables the IC chip to be driven, and when performing non-contact communication, the IC chip transmits and receives information to and from the reader / writer, or rewrites information.

[0036] The antenna coil 19 is typically formed of a coated conductor in which the periphery of a copper wire is coated with an insulating material. In addition to this, it is also possible to select copper alloy wires such as Cu-Ni, Cu-Cr, Cu-Zn, Cu-Sn, and Cu-Be, or various metal wires and metal alloy wires such as iron, stainless steel, and aluminum. By using a coated conductor as the antenna coil 27, the forming processing cost can be reduced compared to, for example, a copper foil etching method.

[0037] <<Middle layer>> The intermediate layer 18 is disposed between the first layer 12 and the second layer 13. The intermediate layer 18 shown in FIG. 2 is present at the interface between the first layer 12 and the second layer 13, and is therefore in contact with the first layer 12 and the second layer 13. The intermediate layer 18 is a colored layer having a different color from the first layer 12 and the second layer 13. The color of the intermediate layer 18 is not particularly limited as long as it is different from the first layer 12 and the second layer 13, and may be, for example, red, blue, green, black, or the like. In this specification, the term "color" means a color that can be expressed by a family color name or a common color name as defined in "Color Names of Object Colors" of JIS Z8102:2001, and "different colors" means that the family color names or common color names are different from each other. The intermediate layer 18 can be composed of a pigment or dye and a binder resin. In this case, for example, the intermediate layer 18 can be formed by a printing method such as silk printing or a transfer method using a resin composition containing a pigment or dye.

[0038] The thickness of the intermediate layer 18 is preferably, for example, 2 μm or more and 20 μm or less. If the thickness of the intermediate layer 18 is 3 μm or more, the color of the intermediate layer 18 can be clearly confirmed through the first layer 12, which is a transparent or semi-transparent layer, and if the thickness is 20 μm or less, the thickness of the intermediate layer 18 is thin, so that unevenness and deformation of the pattern can be suppressed during hot press molding. The lower limit of the thickness of the intermediate layer 18 is preferably 5 μm or more, or 8 μm or more, and the upper limit of the thickness of the intermediate layer 18 is preferably 15 μm or less, or 10 μm or less.

[0039] The following combinations can be given for the first layer 12, the second layer 13, and the intermediate layer 18. Note that " / " is used to indicate the boundary between layers when listing the layers. The layers are listed from the front surface to the back surface of the laminate. 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (transparent layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (transparent layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (opaque layer) 1st layer (translucent layer) / 1st intermediate layer / 2nd layer (opaque layer)

[0040] Among these combinations, when the first layer 12 is a transparent layer, the color of the intermediate layer 18 can be easily seen through the first layer 12, so it is preferable that the first layer 12 be a transparent layer. Furthermore, when a colored layer is present closer to the back surface 10B than the second layer 13, if the second layer 13 is a transparent layer, the color of the colored layer will also be visible through the intermediate layer 18, and there is a risk of the visibility of the intermediate layer 18 decreasing. For this reason, in order to suppress the decrease in visibility of the intermediate layer 18, when a colored layer other than the intermediate layer 21 described later is present closer to the back surface 10B than the second layer 13, it is preferable that the second layer 13 be a semi-transparent layer or an opaque layer.

[0041] The laminate 10 can be obtained, for example, as follows. First, the intermediate layer 18 is formed in the cutting region or the entire surface of one side of the first layer 12, for example, by a printing method. In addition, the antenna coil 19 is formed on the third layer 14. Then, the over-sheet layer 11, the first layer 12, the second layer 13, the third layer 14, the inner layer 15, the core layer 16, and the over-sheet layer 17 are stacked in this order from the upper side in the thickness direction. Here, the first layer 12 is arranged so that the intermediate layer 18 is located between the first layer 12 and the second layer 13, and the third layer 14 is arranged so that the antenna coil 19 is on the surface 10A side. After that, the laminate is sandwiched between stainless steel plates from above and below in the thickness direction in units of a laminate of large sheets arranged vertically and horizontally in a multi-faceted manner, and heat pressure is applied to the laminate through the stainless steel plates. By undergoing such a heat pressing process, the laminate 10 can be obtained. Furthermore, if any of the layers constituting the laminate 10 has heat resistance such that it does not heat-seal at a predetermined temperature, an adhesive sheet that heat-seals at a predetermined temperature can be sandwiched between each layer, or an adhesive can be applied, and then these can be subjected to a heat pressing process to obtain an integrated laminate 10.

[0042] According to the laminate 10, the first layer 12 is a transparent or semi-transparent layer, and the intermediate layer 18 is disposed between the first layer 12 and the second layer 13, so that the color of the intermediate layer 18 can be confirmed through the first layer 12 when the laminate 10 is cut to form a recess in the laminate 10. Therefore, when the color of the intermediate layer 18 can be confirmed, it can be confirmed that the first layer 12 has not been completely cut and therefore the first layer 12 is exposed, and when the color of the intermediate layer 18 cannot be confirmed, it can be confirmed that the second layer 13 has been exposed by cutting. This makes it easy to determine whether the second layer 13, which is the desired layer, is exposed when forming a recess.

[0043] <<Other laminates>> In the laminate 10, the intermediate layer 18 is disposed only between the first layer 12 and the second layer 13. However, when the second layer 13 is a transparent layer or a semi-transparent layer, a second intermediate layer 21 (hereinafter, simply referred to as "intermediate layer 21") may be disposed between the second layer 13 and the third layer 14, as in the laminate 20 shown in FIG. 3. In this case, the third layer 14 may be a transparent layer, a semi-transparent layer, or an opaque layer. The laminate 20 has a front surface 20A, which is a surface on the side forming a recess for disposing an IC module, and a back surface 20B, which is a surface opposite to the front surface 20A. In FIG. 2 and the figures following FIG. 2, the members denoted by the same reference numerals as those in FIG. 1 are the same as the members constituting the laminate 10, and therefore the description thereof will be omitted.

[0044] Examples of combinations of the first layer 12, the second layer 13, the third layer 14, and the intermediate layers 18 and 21 include the following combinations. 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (transparent layer) / 2nd intermediate layer / 3rd layer (transparent layer) 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (transparent layer) / 2nd intermediate layer / 3rd layer (transparent layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) / 2nd intermediate layer / 3rd layer (transparent layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) / 2nd intermediate layer / 3rd layer (semi-transparent layer) 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) / 2nd intermediate layer / 3rd layer (transparent layer) 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (transparent layer) / 2nd intermediate layer / 3rd layer (semi-transparent layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) / 2nd intermediate layer / 3rd layer (semi-transparent layer) 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) / 2nd intermediate layer / 3rd layer (semi-transparent layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (transparent layer) / 2nd intermediate layer / 3rd layer (opaque layer) 1st layer (translucent layer) / 1st intermediate layer / 2nd layer (transparent layer) / 2nd intermediate layer / 3rd layer (opaque layer) 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (translucent layer) / 2nd intermediate layer / 3rd layer (opaque layer) 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (semi-transparent layer) / 2nd intermediate layer / 3rd layer (opaque layer)

[0045] Among these combinations, when the first layer 12 is a transparent layer, the intermediate layer 18 can be easily confirmed through the first layer 12, so it is preferable that the first layer 12 is a transparent layer. When the second layer 13 is a transparent layer, the intermediate layer 21 can be easily confirmed through the second layer 13, while when a colored layer is present on the back surface 20B side of the intermediate layer 18, the color of the intermediate layer 21 and the color of the colored layer are visible through the second layer 13, and there is a risk of the visibility of the intermediate layer 21 decreasing. For this reason, in order to suppress the decrease in the visibility of the intermediate layer 21, it is preferable that the second layer 13 is a semi-transparent layer. Also, when a colored layer is present on the back surface 20B side of the third layer 14, if the third layer 14 is a transparent layer or a semi-transparent layer, the color of the colored layer is visible through the intermediate layer 21, and there is a risk of the visibility of the intermediate layer 21 decreasing. For this reason, in order to suppress the decrease in the visibility of the intermediate layer 21, it is preferable that the third layer 14 is an opaque layer.

[0046] <<Middle layer>> The intermediate layer 21 is disposed between the second layer 13 and the third layer 14, but is present at the interface between the second layer 13 and the third layer 14, and is therefore in contact with the second layer 13 and the third layer 14. The intermediate layer 21 is a colored layer having a different color from the first layer 12, the second layer 13, the third layer 14, and the intermediate layer 18. The color of the intermediate layer 21 is not particularly limited as long as it is different from the first layer 12, the second layer 13, the third layer 14, and the intermediate layer 18, and may be, for example, red, blue, green, black, or the like. For example, when the color of the intermediate layer 18 is red, the color of the intermediate layer 21 may be, for example, green, or the like. The intermediate layer 21 can also be composed of a pigment or dye and a binder resin. In this case, for example, the intermediate layer 21 can be formed by a printing method such as silk printing using a resin composition containing a pigment or dye. The thickness of the intermediate layer 21 is the same as that of the intermediate layer 18, and therefore a description thereof will be omitted here.

[0047] According to the laminate 20, the first layer 12 and the second layer 13 are transparent or semi-transparent layers, an intermediate layer 18 in contact with the first layer 12 and the second layer 13 is disposed between the first layer 12 and the second layer 13, and an intermediate layer 21 in contact with the second layer 13 and the third layer 14 is disposed between the second layer 13 and the third layer 14. Thus, when cutting the laminate 20 to form a recess in the laminate 20, the color of the intermediate layer 18 can be confirmed through the first layer 12, which is a transparent or semi-transparent layer, and the color of the intermediate layer 21 can be confirmed through the second layer 13, which is a transparent or semi-transparent layer. Therefore, when the color of intermediate layer 18 is not confirmed, it can be confirmed that first layer 12 has not been completely cut and therefore first layer 12 is exposed, when the color of intermediate layer 21 is confirmed, it can be confirmed that second layer 13 has been exposed by cutting, or when the colors of neither intermediate layer 18 nor 21 are confirmed, it can be confirmed that third layer 14 or a layer thereafter is exposed. This makes it easy to determine whether or not the desired layer, second layer 13, is exposed when forming a recess.

[0048] <<Other laminates>> In the laminate 20, when the second layer 13 is a transparent layer or a semi-transparent layer, the intermediate layer 21 is disposed between the second layer 13 and the third layer 14. However, as in the laminate 30 shown in FIG. 4, when the second layer 31 is an opaque layer and the third layer 14 is a transparent layer or a semi-transparent layer, the intermediate layer 32 may be disposed in contact with the third layer 14 at a position deeper than the third layer 14 in the depth direction D of the laminate 30. Specifically, the intermediate layer 32 is disposed between the third layer 14 and the inner layer 15. The intermediate layer 32 is similar to the intermediate layer 21 except that the position of the intermediate layer 32 is different from that of the intermediate layer 21. The laminate 30 has a front surface 30A, which is a surface on the side forming a recess for arranging an IC module, and a back surface 30B, which is a surface opposite to the front surface 30A.

[0049] The combinations of the first layer 12, the second layer 31, the third layer 14, and the intermediate layers 18, 32 include the following combinations. 1st layer (transparent layer) / 1st intermediate layer / 2nd layer (opaque layer) / 3rd layer (transparent layer) / 2nd intermediate layer 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (opaque layer) / 3rd layer (transparent layer) / 2nd intermediate layer 1st layer (semi-transparent layer) / 1st intermediate layer / 2nd layer (opaque layer) / 3rd layer (semi-transparent layer) / 2nd intermediate layer

[0050] Of these combinations, when the first layer 12 is a transparent layer, the intermediate layer 18 can be easily confirmed through the first layer 12, so it is preferable that the first layer 12 be a transparent layer. Similarly, when the third layer 14 is a transparent layer, the intermediate layer 32 can be easily confirmed through the third layer 14, so it is preferable that the third layer 14 be a transparent layer.

[0051] In the case of the laminate 30, the first layer 12 and the third layer 14 are transparent or semi-transparent layers, the second layer 31 is an opaque layer, an intermediate layer 18 in contact with the first layer 12 and the second layer 31 is disposed between the first layer 12 and the second layer 31, and an intermediate layer 32 in contact with the third layer 14 is disposed at a deeper position than the third layer 14 in the depth direction D of the laminate 30. Thus, when cutting the laminate 30 to form a recess in the laminate 30, the color of the intermediate layer 18 can be confirmed through the first layer 12, which is a transparent or semi-transparent layer, and the color of the intermediate layer 32 can be confirmed through the third layer 14, which is a transparent or semi-transparent layer. Therefore, when the color of intermediate layer 18 is confirmed, it can be confirmed that first layer 12 has not been completely cut and therefore is exposed, when the color of neither intermediate layer 18 nor intermediate layer 31 is confirmed, it can be confirmed that second layer 31 has been exposed by cutting, and when the color of intermediate layer 32 is confirmed, it can be confirmed that third layer 14 has been exposed by cutting. This makes it easy to determine whether or not the desired layer, second layer 31, is exposed when forming a recess.

[0052] <<Other laminates>> In the laminates 10, 20, and 30, the intermediate layers 18, 21, and 32 are colored layers, but at least one of the intermediate layers 18, 21, and 32 may be a layer that develops color by light irradiation. By disposing a layer that develops color by light irradiation as the intermediate layers 18, 21, and 32, the same effect as a colored layer can be obtained, and since a colored layer is not used, the transparency of the laminates 10, 20, and 30 can be ensured, so that the appearance is not affected. Examples of layers that develop color by light irradiation include layers containing photosensitive ink that develops color by infrared or ultraviolet irradiation. The wavelength range of the infrared rays to be irradiated can be, for example, 0.78 μm or more and 1 mm or less, and the wavelength range of the ultraviolet rays to be irradiated can be, for example, 0.01 μm or more and 0.38 μm or less. However, there is no problem with photosensitive ink as long as it can emit color in a wavelength range longer than infrared rays or shorter than ultraviolet rays, so it may be excited by, for example, terahertz waves or millimeter waves, or by X-rays or gamma rays.

[0053] Materials that are excited by infrared irradiation and emit visible light to develop color are also called up-conversion type luminescent materials, and examples of such materials include those that contain at least one rare earth element selected from the group consisting of erbium (Er), holmium (Ho), praseodymium (Pr), thulium (Tm), neodymium (Nd), gadolinium (Gd), europium (Eu), samarium (Sm), terbium (Tb), dysprosium (Dy) and cerium (Ce), and the base material of the phosphor particles is a halide, etc. In addition, although there are some overlapping with the above, examples of such materials include the materials shown in JP-A-7-297475.

[0054] Examples of color-developing materials that are excited by ultraviolet irradiation and emit visible light include dyes such as fluorescein-based fluorescent dyes, coumarin-based fluorescent dyes, and rhodamine-based fluorescent dyes, and inorganic pigments such as europium-manganese-activated barium magnesium aluminate, manganese-activated zinc silicate, europium-activated yttrium oxide, europium-activated yttrium sulfide, zinc oxide, manganese-activated zinc germanate, and europium-activated yttrium phosphovanadate.

[0055] In the laminate 20, when both the intermediate layer 18 and the intermediate layer 21 are layers that develop color upon light irradiation, the intermediate layer 21 develops a color different from that of the intermediate layer 18 upon light irradiation. In the laminate 30, when both the intermediate layer 18 and the intermediate layer 32 are layers that develop color upon light irradiation, the intermediate layer 32 develops a color different from that of the intermediate layer 18 upon light irradiation.

[0056] <<<Laminate processing method and IC card manufacturing method>>> When processing the laminate 10, first, the laminate 10 is prepared. Then, a first recess 10C is formed in the laminate 10 as shown in Fig. 5A. Specifically, the laminate 10 is cut from the surface 10A of the laminate 10 in the depth direction D of the laminate 10.

[0057] The cutting of the laminate 10 is performed until the color of the intermediate layer 18 is no longer visible. Here, the determination that the color of the intermediate layer is not visible may be determined by a human being by observing the cutting state with the human eye, or by a computer based on the image obtained by processing an image of the cutting state captured by a camera, and either of these may be used. The cutting may be performed so as to stop at the interface between the intermediate layer 18 and the second layer 13, or may be performed until it penetrates into a part of the second layer 13 as shown in FIG. 5A. This forms the first recess 10C. In addition, in the case where the intermediate layer 18 is a layer that develops color by light irradiation, cutting is performed until the color development of the intermediate layer 18 is no longer visible even by light irradiation. When the color or color development of the intermediate layer 18 is not confirmed, it can be determined that the second layer 13 is exposed, so it is easy to determine whether the desired layer, the second layer 13, is exposed.

[0058] For example, in the case of a contact and contactless IC card, a part of the first recess 10C is then cut further until the antenna coil 19 is exposed as shown in Fig. 5B to form the second recess 10D. This cutting is performed so that the width of the second recess 10D is smaller than the width of the first recess 10C. This creates a step on the bottom surface of the first recess 10C.

[0059] 5C, a portion of the second recess 10D is further cut to a depth capable of accommodating an IC module, which will be described later, to form a third recess 10E. This cutting is performed so that the width of the third recess 10E is smaller than the width of the second recess 10D. This results in a laminate 10 having a recess 10F formed therein, which is made up of the first recess 10C, the second recess 10D, and the third recess 10E.

[0060] After forming the recess 10F in the laminate 10, for example, as shown in Fig. 6A, a conductive paste 40 is applied to the exposed surface of the antenna coil 19. Also, an adhesive (not shown) is applied to a step 10G (exposed surface of the second layer 13) formed by the first recess 10C and the second recess 10D.

[0061] Thereafter, as shown in FIG. 6B, the IC module 50 is placed in the recess 10F so that the back surface 51B of the substrate 51 of the IC module 50 contacts the second layer 13 of the step portion 10G. This electrically connects the IC module 50 and the antenna coil 19 via the conductive paste 40. Since the second layer 13 is exposed in the recess 10F, the substrate 51 of the IC module 50 can be bonded to the second layer 13 when the IC module is placed in the recess 10F. This makes it possible to obtain an IC card with excellent adhesion. Note that, in the above, the IC module 50 and the antenna coil 19 are electrically connected using the conductive paste 40, but the IC module 50 and the antenna coil 19 may be electrically connected by an anisotropic conductive film method (ACF method), a coil-on-module method, or a solder welding method.

[0062] <<ICモジュール> > The IC module 50 includes a flat substrate 51, an external contact terminal 52 arranged on a front surface 51A of the substrate 51, an antenna coil connection terminal 53 arranged on a rear surface 51B of the substrate 51, an IC chip 54 arranged on the rear surface 51B of the substrate 51, a molded portion 55 that covers the IC chip 54, and wires 56 such as gold wires that electrically connect the antenna coil connection terminal 53 and the IC chip 54. Note that the wires that electrically connect the external contact terminal 52 and the IC chip 54 are not shown in the figure.

[0063] <Board, external contact terminals, and antenna coil connection terminals> The substrate 51 may be a flexible resin film such as glass epoxy resin or polyimide resin. The external contact terminal 52 and the antenna coil connection terminal 53 are made of patterned copper foil. Specifically, the external contact terminal 42 and the antenna coil connection terminal 53 are formed by providing copper foil on the front surface 51A and the back surface 51B of the substrate 51 and etching the copper foil into a predetermined pattern. Furthermore, the substrate 51 is provided in advance with a plurality of through holes (not shown) for wire bonding to the external contact terminal 52.

[0064] <ICチップ> The IC chip 54 is fixed via an adhesive (not shown) to the rear surface 51B side of the substrate 51. Specifically, it is disposed in the center of the surface of the substrate 51 on which the antenna coil connection terminal 53 is formed. The IC chip 54 includes a CPU for controlling the operations of both contact communication and non-contact communication, a storage device such as a RAM, EEPROM, and flash memory, and various circuits such as an interface circuit for decoding input signals and generating output signals for the contact communication and non-contact communication, and a power generation circuit.

[0065] <Molding section> The molded portion 55 is for protecting the IC chip 54 and the wires 56 from external loads and environmental loads. The molded portion 55 is made of an ultraviolet curable resin, a thermosetting resin, or the like.

[0066] <<Other laminate processing methods and IC card manufacturing methods>> When processing the laminate 20 to form the first recess 20B, as shown in FIG. 7, the laminate 20 is cut from the surface 20A of the laminate 20 in the depth direction D of the laminate 20 in the same manner as the laminate 10, but the cutting of the laminate 20 is performed until the color of the intermediate layer 21 is confirmed. In addition, if the intermediate layer 21 is a layer that develops color by light irradiation, the cutting is performed until the color of the intermediate layer 21 is confirmed by light irradiation. When the color or color of the intermediate layer 21 is confirmed, it can be determined that the second layer 13 is exposed, so it is easy to determine whether the second layer 13, which is the desired layer, is exposed. In addition, the process of forming the second recess and the third recess in the laminate 20 is the same as that of the laminate 10, so the description will be omitted. In addition, the process of manufacturing an IC card using the laminate 20 in which the recess is formed is also the same as that of the laminate 10, so the description will be omitted.

[0067] When processing the laminate 30 to form the first recess 30B, as shown in FIG. 8, the laminate 30 is cut from the surface 30A of the laminate 30 in the depth direction D of the laminate 30 in the same manner as the laminate 10, but the cutting of the laminate 30 is performed until the color of any of the intermediate layers 18 and 32 is not confirmed. If any of the intermediate layers 18 and 32 are layers that develop color by light irradiation, the cutting is performed until the color of the intermediate layers 18 and 32 is not confirmed by light irradiation. If the color or color of any of the intermediate layers 18 and 32 is not confirmed, it can be determined that the second layer 31 is exposed, so it is easy to determine whether the desired layer, the second layer 31, is exposed. The process of forming the second recess and the third recess in the laminate 30 is the same as that of the laminate 10, so the description will be omitted. The process of manufacturing an IC card using the laminate 30 with the recess formed therein is also the same as that of the laminate 10, so the description will be omitted.

[0068] [Second embodiment] Hereinafter, a laminate according to a second embodiment of the present invention will be described with reference to the drawings. Fig. 9 is a schematic cross-sectional view showing the configuration of a laminate used in manufacturing a contact and contactless IC card according to this embodiment, and Fig. 10 is a schematic cross-sectional view showing the configuration of another laminate used in manufacturing a contact and contactless IC card according to this embodiment. Figs. 11 and 12 are schematic views showing the processing steps of another laminate according to this embodiment.

[0069] <<<Laminate>>> In the laminate 10 according to the first embodiment, the first layer 12 is a transparent layer or a semi-transparent layer, but the first layer 61 may be an opaque layer as in the laminate 60 shown in FIG. 9. In this case, the second layer 13 is a transparent layer or a semi-transparent layer, and a first intermediate layer 62 (hereinafter, sometimes simply referred to as "intermediate layer 62") in contact with the second layer 13 is disposed at a position deeper than the second layer 13 in the depth direction D of the laminate 60. Specifically, the intermediate layer 62 is disposed between the second layer 13 and the third layer 14. The first layer 61 is the same as the first layer 12 except that it is an opaque layer, and the intermediate layer 62 is the same as the intermediate layer 18 except that the position of the intermediate layer 62 is different. The laminate 60 has a front surface 60A, which is a surface on the side forming a recess for arranging an IC module, and a back surface 60B, which is a surface opposite to the front surface 60A.

[0070] The combinations of the first layer 61, the second layer 13, and the intermediate layer 62 include the following combinations. 1st layer (opaque layer) / 2nd layer (transparent layer) / 1st intermediate layer 1st layer (opaque layer) / 2nd layer (translucent layer) / 1st intermediate layer

[0071] Of these combinations, when the second layer 13 is a transparent layer, the intermediate layer 62 can be easily confirmed through the second layer 13, so it is preferable that the second layer 13 be a transparent layer.

[0072] According to the laminate 60, the first layer 61 is an opaque layer, the second layer 13 is a transparent layer or a semi-transparent layer, and the intermediate layer 62 is disposed in contact with the second layer 13 at a position deeper than the second layer 13 in the depth direction D of the laminate 60, so that the color of the intermediate layer 62 can be confirmed through the second layer 13, which is a transparent layer or a semi-transparent layer, when the laminate 60 is cut to form a recess in the laminate 60. Therefore, when the color of the intermediate layer 62 is not confirmed, it can be confirmed that the first layer 61 is exposed by cutting, and when the color of the intermediate layer 62 is confirmed, it can be confirmed that the second layer 13 is exposed by cutting. This makes it easy to determine whether the second layer 13, which is the desired layer, is exposed when forming a recess.

[0073] <<Other laminates>> In the laminate 60, the intermediate layer 62 is disposed only between the second layer 13 and the third layer 14, but in addition to the intermediate layer 62, a second intermediate layer 71 (hereinafter, sometimes simply referred to as "intermediate layer 71") in contact with the third layer 14 may be disposed at a position deeper than the third layer 14 in the depth direction D of the laminate 70, as in the laminate 70 shown in Fig. 10. Specifically, the intermediate layer 71 is disposed between the third layer 14 and the inner layer 15. The laminate 70 has a front surface 70A which is a surface on the side forming a recess for disposing an IC module, and a back surface 70B which is a surface opposite to the front surface 70A.

[0074] The combinations of the first layer 61, the second layer 13, the third layer 14, and the intermediate layers 62, 71 include the following combinations. 1st layer (opaque layer) / 2nd layer (transparent layer) / 1st intermediate layer / 3rd layer (transparent layer) / 2nd intermediate layer 1st layer (opaque layer) / 2nd layer (translucent layer) / 1st intermediate layer / 3rd layer (transparent layer) / 2nd intermediate layer 1st layer (opaque layer) / 2nd layer (transparent layer) / 1st intermediate layer / 3rd layer (translucent layer) / 2nd intermediate layer 1st layer (opaque layer) / 2nd layer (semi-transparent layer) / 1st intermediate layer / 3rd layer (semi-transparent layer) / 2nd intermediate layer

[0075] Of these combinations, when the second layer 13 is a transparent layer, the intermediate layer 62 can be easily confirmed through the second layer 13, so it is preferable that the second layer 13 be a transparent layer. Similarly, when the third layer 14 is a transparent layer, the intermediate layer 712 can be easily confirmed through the third layer 14, so it is preferable that the third layer 14 be a transparent layer.

[0076] In the case of the laminate 70, the first layer 61 is an opaque layer, the second layer 13 and the third layer 14 are transparent or semi-transparent layers, the intermediate layer 62 is disposed between the second layer 13 and the third layer 14, and the intermediate layer 71 is disposed in contact with the third layer 14 at a position deeper than the third layer 14. When the laminate 70 is cut to form a recess in the laminate 70, the color of the intermediate layer 62 can be confirmed through the second layer 13, which is a transparent or semi-transparent layer, and the color of the intermediate layer 71 can be confirmed through the third layer 14, which is a transparent or semi-transparent layer. Therefore, when the colors of the intermediate layers 62 and 71 are not confirmed, it can be confirmed that the first layer 12 is not completely cut and therefore the first layer 12 is exposed, and when the color of the intermediate layer 62 is confirmed, it can be confirmed that the second layer 13 is exposed by cutting, or when the color of the intermediate layer 71 is confirmed, it can be confirmed that the third layer 14 or a layer thereafter is exposed. This makes it easy to determine whether or not the second layer 13, which is the desired layer, is exposed when forming the recess.

[0077] <<Other laminates>> In the laminates 60 and 70, the intermediate layers 62 and 71 are colored layers, but at least one of the intermediate layers 62 and 71 may be a layer that changes color when irradiated with light. By disposing a layer that changes color when irradiated with light as the intermediate layers 62 and 71, the same effect as a colored layer can be obtained, and since a colored layer is not used, there is no effect on the appearance. An example of a layer that changes color when irradiated with light is a layer containing a photosensitive ink that changes color when irradiated with ultraviolet light.

[0078] <<Laminate processing method and IC card manufacturing method>> When processing the laminates 60, 70 to form the first recesses 60B, 70B, as shown in Figs. 11 and 12, the laminates 60, 70 are cut from the surfaces 60A, 70A of the laminates 60, 70 in the depth direction D of the laminates 60, 70 in the same manner as the laminate 10, but the cutting of the laminates 60, 70 is performed until the color of the intermediate layer 62 is confirmed. In addition, if the intermediate layer 62 is a layer that develops color by light irradiation, the cutting is performed until the color of the intermediate layer 62 is confirmed by light irradiation. When the color or color of the intermediate layer 62 is confirmed, it can be determined that the second layer 13 is exposed, so it is easy to determine whether the second layer 13, which is the desired layer, is exposed. In addition, the process of forming the second recess and the third recess in the laminates 60, 70 is the same as that of the laminate 10, so the description will be omitted. In addition, the process of manufacturing an IC card using the laminates 60, 70 in which the recesses are formed is also the same as that of the laminate 10, so the description will be omitted. [Explanation of symbols]

[0079] 10, 20, 30, 60, 70...Laminate 10A, 20A, 30A, 60A, 70A…Surface 10B, 20B, 30B, 60B, 70B...Back side 10C, 20C, 30C, 60C, 70C...First recess 12, 61…1st layer 13, 31…Second layer 14...Third layer 18, 62...First middle class 21, 32, 71...Second middle class 19…Antenna coil

Claims

1. 1. A laminate used in the manufacture of an IC card having an IC module disposed in a recess, comprising: a transparent or translucent first layer; a second layer that is located deeper than the first layer in a depth direction from the front surface to the back surface, when a surface of the laminate on which a recess is formed is defined as a front surface and a surface opposite to the front surface is defined as a back surface; a first intermediate layer disposed between the first layer and the second layer, the first intermediate layer having a color different from those of the first layer and the second layer or developing a color upon exposure to light; A laminate comprising:

2. The laminate of claim 1 , wherein the second layer is a transparent or semi-transparent layer.

3. a third layer that is located deeper than the second layer in the depth direction; a second intermediate layer disposed between the second layer and the third layer, in contact with the second layer and the third layer, and having a color different from those of the first layer, the second layer, the third layer, and the first intermediate layer, or emitting a color different from that of the first intermediate layer upon irradiation with light; The laminate of claim 2 further comprising:

4. The laminate of claim 1 , wherein the second layer is an opaque layer.

5. a transparent or semi-transparent third layer that is located deeper than the second layer in the depth direction; a second intermediate layer that is located deeper than the third layer in the depth direction, is in contact with the third layer, and has a color different from those of the first layer, the second layer, the third layer, and the first intermediate layer or emits a color different from that of the first intermediate layer when irradiated with light; The laminate of claim 4 further comprising:

6. 1. A laminate used in the manufacture of an IC card having an IC module disposed in a recess, comprising: An opaque first layer; a transparent or semi-transparent second layer that is located deeper than the first layer in a depth direction from the front surface to the back surface, when a surface of the laminate on which a recess is formed is defined as a front surface and a surface opposite to the front surface is defined as a back surface, and that is in contact with the first layer; a first intermediate layer that is located deeper than the second layer in a depth direction of the laminate, is in contact with the second layer, and has a color different from the first layer and the second layer or develops a color when irradiated with light; A laminate comprising:

7. a transparent or semi-transparent third layer that is located deeper than the second intermediate layer in the depth direction and in contact with the first layer; a second intermediate layer that is located deeper than the third layer in the depth direction, is in contact with the third layer, and has a color different from those of the first layer, the second layer, the third layer, and the first intermediate layer, or emits a color different from that of the first intermediate layer when irradiated with light; The laminate of claim 6 further comprising:

8. A method for processing the laminate according to claim 1, comprising the steps of: providing the laminate; and cutting the laminate in the depth direction from the surface side of the laminate to form a recess. The cutting of the laminate is carried out until the color of the first intermediate layer is no longer noticeable.

9. A method for processing the laminate according to claim 6, comprising the steps of: providing the laminate; and cutting the laminate in the depth direction from the surface side of the laminate to form a recess. The cutting of the laminate is continued until the color of the first intermediate layer is confirmed.

Images