Laser irradiation device, manufacturing system of electronic device, laser irradiation method, and manufacturing method of electronic device

Abstract

To execute soldering processing in a solid substrate with stably at high speed.SOLUTION: A laser irradiation device comprises: a stage for supporting a solid substrate; a laser head that irradiates a cream solder holding a component mounted on the solid substrate with a laser beam; and a management device that controls the stage so as to level a front surface of the solid substrate at a mounting position of the component, and controls the laser head so that the cream solder is irradiated with the laser beam at the mounting position. On the basis of component data containing at least one of the ratios of a region where the cream solder is applied, to a size, a height, and a weight of the component, and a contact surface with the front surface of the solid substrate, a rotational speed of the stage when the front surface of the solid substrate at the mounting position of the component is leveled is set.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a laser irradiation apparatus, an electronic device manufacturing system, a laser irradiation method, and an electronic device manufacturing method. [Background technology]

[0002] 2. Description of the Related Art In the technical field relating to mounting apparatuses, a three-dimensional mounting apparatus that mounts components on a three-dimensional substrate, as disclosed in Patent Document 1, is known. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 207313 Summary of the Invention [Problem to be solved by the invention]

[0004] In the mounting device, electronic components are mounted on the area where the cream solder has been applied. The electronic components are then transported to a laser irradiation device, where the cream solder is melted by irradiation with a laser beam, and the melted cream solder is cooled to solder the electronic components to the substrate. When soldering electronic components mounted on a three-dimensional substrate, it is necessary to control the stage supporting the three-dimensional substrate and rotate the three-dimensional substrate on the stage so that the mounting positions of the electronic components on the surface of the three-dimensional substrate are horizontal. At this time, the electronic components are held on the three-dimensional substrate only by the adhesive force of the solder, so there is a possibility that unsoldered electronic components may shift or come off due to the high-speed rotation of the three-dimensional substrate.

[0005] The technology disclosed in this specification aims to perform soldering processing on a three-dimensional substrate stably and quickly. [Means for solving the problem]

[0006] This specification discloses a laser irradiation device, which includes a stage for supporting a three-dimensional substrate, a laser head for irradiating a cream solder holding a component mounted on the three-dimensional substrate with a laser beam, and a management device for controlling the stage so as to level the surface of the three-dimensional substrate at the mounting position of the component, and controlling the laser head so as to irradiate the cream solder at the mounting position with a laser beam, and sets a rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component, based on component data including at least one of the size, height, and weight of the component, and the ratio of the area where the cream solder is applied to the contact surface with the surface of the three-dimensional substrate. Effect of the Invention

[0007] According to the technology disclosed in this specification, soldering processing on a three-dimensional substrate can be performed stably and quickly. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a substrate and a component according to an embodiment. [Diagram 2] FIG. 2 is a perspective view showing a pallet for supporting a substrate according to the embodiment. [Diagram 3] FIG. 3 is an exploded perspective view showing a substrate and a pallet according to the embodiment. [Figure 4] FIG. 4 is a diagram illustrating a production system for electronic devices according to an embodiment. [Diagram 5] FIG. 5 is a plan view illustrating a mounting apparatus according to an embodiment. [Figure 6] FIG. 6 is a perspective view showing a pallet and a stage according to the embodiment. [Figure 7] FIG. 7 is a diagram illustrating a mounting head according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining board data and NC data according to the embodiment. [Figure 9] FIG. 9 is a diagram for explaining a method of controlling the stage. [Figure 10] FIG. 10 is a diagram illustrating a schematic configuration of a management device according to an embodiment. [Figure 11] FIG. 11 is a flowchart showing the mounting process according to the embodiment. [Figure 12] FIG. 12 is a flowchart illustrating a laser soldering process according to an embodiment. [Figure 13] FIG. 13 is a flowchart illustrating a laser soldering process according to an embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiment will be described with reference to the drawings. In the embodiment, an XYZ orthogonal coordinate system is defined, and the positional relationship of each part will be described with reference to this XYZ orthogonal coordinate system. The direction parallel to the X axis of a predetermined surface is defined as the X axis direction. The direction parallel to the Y axis of a predetermined surface perpendicular to the X axis is defined as the Y axis direction. The direction parallel to the Z axis perpendicular to the predetermined surface is defined as the Z axis direction. The rotation direction or tilt direction centered on the X axis direction is defined as the θX direction. The rotation direction or tilt direction centered on the Y axis direction is defined as the θY direction. The rotation direction or tilt direction centered on the Z axis direction is defined as the θZ direction. In the embodiment, the predetermined surface and the horizontal plane are parallel. The Z axis is parallel to the vertical axis, and the Z axis direction is the up-down direction. The +Z side is the upper side, and the -Z side is the lower side. The predetermined surface may be inclined with respect to the horizontal plane. In the embodiment, the predetermined surface including the X axis and the Y axis is appropriately referred to as the XY plane.

[0010] [substrate] FIG. 1 is a perspective view showing a substrate 1 and a component 2 according to an embodiment. In the embodiment, the substrate 1 is a three-dimensional substrate. A three-dimensional substrate refers to a substrate having a non-planar surface. The surface of the substrate 1 includes a curved surface. At least a portion of the surface of the substrate 1 is curved. The surface of the substrate 1 may include corners. A protrusion may be provided on the surface of the substrate 1.

[0011] An electric circuit is provided on the surface of the substrate 1. In an embodiment, the substrate 1 is formed by an in-mold molding technique. The substrate 1 includes a base material 1A having a curved surface, and a film 1B bonded to the surface of the base material 1A. The film 1B is flexible. The film 1B is a flexible film. The film 1B includes an electric circuit. The electric circuit includes electrodes such as lands and pads. The position (planar coordinates) of each electrode in the film 1B is assumed to be known. The surface of the substrate 1 includes the surface of the film 1B.

[0012] The components 2 include electronic components. Although only one component 2 is shown in FIG. 1, in this embodiment, it is assumed that a plurality of components 2 are mounted on one board 1. The plurality of components 2 includes a plurality of types of components 2 that differ in size, height, weight, material, and the like. The components 2 may be lead-type electronic components having leads protruding from a body. The components 2 may be chip-type electronic components having no leads. By mounting the components 2 on the surface of the board 1, an electronic device is manufactured.

[0013] [palette] Fig. 2 is a perspective view showing a pallet 3 supporting a substrate 1 according to an embodiment. Fig. 3 is an exploded perspective view showing a substrate 1 and a pallet 3 according to an embodiment. The pallet 3 supports the substrate 1. In the embodiment, the substrate 1 is handled while being supported by the pallet 3. The pallet 3 has a support member 4 that supports the substrate 1, and a clamp mechanism 5 that fixes the substrate 1.

[0014] The support member 4 includes a base portion 4A that supports the substrate 1 from the -Z side, guard portions 4B provided on each of the +Y side and -Y side of the base portion 4A, and a plurality of pin portions 4C that support the substrate 1 from each of the +Y side and -Y side.

[0015] The base portion 4A is in the form of a plate having a plurality of openings. Two holes 4D are provided in the base portion 4A. The holes 4D penetrate the upper and lower surfaces of the base portion 4A.

[0016] The guard portion 4B is long in the X-axis direction. A pair of guard portions 4B are provided. The pair of guard portions 4B are spaced apart from each other in the Y-axis direction. One guard portion 4B protrudes to the +Z side from the end portion on the +Y side of the upper surface of the base portion 4A. The other guard portion 4B protrudes to the +Z side from the end portion on the -Y side of the upper surface of the base portion 4A.

[0017] Each of the multiple pin portions 4C protrudes from the top surface of the base portion 4A to the +Z side. Some of the pin portions 4C are arranged on the +Y side of the center of the base portion 4A. Some of the pin portions 4C are arranged on the -Y side of the center of the base portion 4A. The multiple pin portions 4C arranged on the +Y side of the center of the base portion 4A support the end of the substrate 1 on the +Y side. The multiple pin portions 4C arranged on the -Y side of the center of the base portion 4A support the end of the substrate 1 on the -Y side.

[0018] The clamp mechanism 5 is provided on the support member 4. The clamp mechanism 5 fixes the substrate 1 to the support member 4. The clamp mechanism 5 includes a pair of support parts 5A that support an end part of the substrate 1 on the -X side, and a movable part 5B that supports an end part of the substrate 1 on the +X side. The movable part 5B is movable in the X-axis direction on the upper surface of the base part 4A. With the substrate 1 disposed between the support parts 5A and the movable part 5B, the movable part 5B moves in the -X direction, whereby the substrate 1 is sandwiched between the support parts 5A and the movable part 5B. The substrate 1 is fixed to the pallet 3 by being sandwiched between the support parts 5A and the movable part 5B.

[0019] In the embodiment, the pallet 3 may have an information medium 80. The information medium 80 holds substrate data related to the substrate 1. In the present embodiment, the information medium 80 is a two-dimensional code. The information medium 80 may also be a one-dimensional barcode. The information medium 80 may also be an RF tag. In the present embodiment, the information medium 80 is attached to a portion of the upper surface of the base portion 4A. The information medium 80 is positioned so as not to overlap the substrate 1.

[0020] [Production System] Fig. 4 is a diagram illustrating a schematic diagram of an electronic device production system 10 according to an embodiment. As illustrated in Fig. 4, the production system 10 includes a mounting apparatus 12, a preheating apparatus 13, a laser irradiation apparatus 14, and a management apparatus 16. The mounting apparatus 12, the preheating apparatus 13, and the laser irradiation apparatus 14 constitute a production line for electronic devices.

[0021] The mounting device 12 mounts the components 2 on the board 1. At least one mounting device 12 is provided in the production line. Note that a plurality of mounting devices 12 may be provided.

[0022] 5 is a plan view showing a schematic diagram of the mounting apparatus 12 according to the embodiment. The mounting apparatus 12 includes a base member 18, a transport device 19, a stage 20, a stage moving device 21, a component supply device 22, a mounting head 24 including a nozzle 23, a board camera 25, a height sensor 26, a head moving device 27, a nozzle moving device 28, and a chamber 29.

[0023] The base member 18 supports the transport device 19 , the stage 20 , the stage moving device 21 , the component supply device 22 , the mounting head 24 , and the head moving device 27 .

[0024] The transport device 19 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 19 transports the pallet 3 supplied to the mounting device 12 to a processing position of the mounting device 12. The processing position is defined by a transport path of the transport device 19.

[0025] The conveying device 19 includes a conveying belt 19A that conveys the pallet 3 in the X-axis direction, and a guide member 19B that guides the pallet 3.

[0026] Guide member 19B is long in the X-axis direction. A pair of guide members 19B are provided. The pair of guide members 19B are spaced apart from each other in the Y-axis direction. One guide member 19B is disposed on the +Y side of pallet 3. The other guide member 19B is disposed on the -Y side of pallet 3.

[0027] The conveyor belt 19A is circular. A pair of conveyor belts 19A are provided. The conveyor belts 19A are supported by a guide member 19B via a driving pulley and a driven pulley. The conveyor belts 19A are hung on the driving pulley and the driven pulley. One of the conveyor belts 19A is supported by one of the guide members 19B. The other conveyor belt 19A is supported by the other guide member 19B.

[0028] Of the pair of conveyor belts 19A, the conveyor belt 19A arranged on the +Y side supports the +Y side end of the underside of pallet 3. The conveyor belt 19A arranged on the -Y side supports the -Y side end of the underside of pallet 3. The pallet 3 is conveyed in the X-axis direction by the drive pulley rotating due to a drive motor (not shown).

[0029] An actuator (not shown) allows one guide member 19B to move in the Y-axis direction relative to the other guide member 19B. When one guide member 19B and the other guide member 19B move away from each other in the Y-axis direction, support of the pallet 3 by the conveyor belt 19A is released.

[0030] FIG. 6 is a perspective view showing a pallet 3 and a stage 20 according to the embodiment. The stage 20 supports the substrate 1 via the pallet 3. The stage 20 supports the pallet 3 transported to the processing position from the -Z side. Two positioning members 20A are provided on the upper surface of the stage 20. The positioning members 20A are inserted into holes 4D of the pallet 3. The positioning members 20A are inserted into the holes 4D from the -Z side of the pallet 3, thereby positioning the stage 20 and the pallet 3. A hook is provided on the upper end of the positioning member 20A. The hook is hung on the pallet 3. The hook includes a ball that moves by air pressure. After the positioning member 20A is inserted into the hole 4D from the -Z side of the pallet 3, the ball is hung on the pallet 3, thereby fixing the stage 20 and the pallet 3.

[0031] The stage moving device 21 moves the stage 20. In the embodiment, the stage moving device 21 moves the stage 20 in each of the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The stage moving device 21 includes a Y-axis motor that generates power to move the stage 20 in the Y-axis direction, a Z-axis motor that generates power to move the stage 20 in the Z-axis direction, a θX motor that generates power to rotate the stage 20 in the θX direction, and a θY motor that generates power to rotate the stage 20 in the θY direction.

[0032] After the pallet 3 is transported to the processing position by the transport device 19, the stage 20 is moved in the +Z direction by the stage moving device 21, so that the stage 20 supports the pallet 3 from below, and the pallet 3 is handed over from the transport device 19 to the stage 20. Next, the guide member 19B on the +Y side moves in the Y-axis direction away from the other guide member 19B, so that the support of the pallet 3 by the conveyor belt 19A is released. Furthermore, the stage 20 moves in the +Z direction to support the pallet 3, and the support of the pallet 3 by the conveyor belt 19A is released. With the pallet 3 supported by the stage 20, the stage moving device 21 moves the stage 20 in the +Y direction so that it is in the center between the two guide members 19B, making it possible to move the stage 20 in each of the Z-axis direction, the θX direction, and the θY direction.

[0033] When transferring the pallet 3 from the stage 20 to the transport device 19, the stage 20 moves in the -Y direction until one side of the pallet 3 comes onto the transport belt 19A, and the guide member 19B on the +Y side moves to the -Y side until the other side of the pallet 3 comes onto the transport belt 19A. After the hook provided at the upper end of the positioning member 20A is released from its fastening, the stage 20 moves in the -Z direction by the stage movement device 21. As a result, support of the pallet 3 by the stage 20 is released, and the pallet 3 is supported by the transport belt 19A.

[0034] The component supplying device 22 supplies the components 2. The component supplying device 22 includes a plurality of tape feeders. The tape feeders hold a plurality of components 2. The component supplying device 22 supplies at least one component 2 of the plurality of components 2 to a supply position. The component supplying device 22 is disposed on the -Y side of the conveying device 19. Note that the component supplying device 22 may be disposed on both the +Y side and the -Y side of the conveying device 19.

[0035] The mounting head 24 mounts the components 2 on the board 1. The mounting head 24 supports a plurality of nozzles 23. The mounting head 24 holds the components 2 supplied from the component supply device 22 with the nozzles 23 and mounts them on the board 1. The mounting head 24 is movable between a supply position where the components 2 are supplied from the component supply device 22 and a processing position where the board 1 is placed. The mounting head 24 holds the components 2 supplied to the supply position with the nozzles 23, moves to the processing position, and then mounts the components 2 on the surface of the board 1 placed at the processing position.

[0036] The head moving device 27 moves the mounting head 24. In the embodiment, the head moving device 27 moves the mounting head 24 in each of the X-axis and Y-axis directions. The head moving device 27 has an X-axis moving device 27X that moves the mounting head 24 in the X-axis direction, and a Y-axis moving device 27Y that moves the mounting head 24 in the Y-axis direction. Each of the X-axis moving device 27X and the Y-axis moving device 27Y includes an actuator. The X-axis moving device 27X is connected to the mounting head 24. The mounting head 24 moves in the X-axis direction by the operation of the X-axis moving device 27X. The Y-axis moving device 27Y is connected to the mounting head 24 via the X-axis moving device 27X. The mounting head 24 moves in the Y-axis direction by the operation of the Y-axis moving device 27Y.

[0037] FIG. 7 is a diagram showing a schematic diagram of a mounting head 24 according to an embodiment. As shown in FIG. 7, the mounting head 24 has a plurality of nozzles 23. The nozzles 23 detachably hold the component 2. The nozzles 23 are suction nozzles that suction and hold the component 2. An opening is provided at the lower end of the nozzle 23. The opening of the nozzle 23 is connected to a vacuum system. With the lower end of the nozzle 23 and the component 2 in contact with each other, a suction operation is performed from the opening provided at the lower end of the nozzle 23, so that the component 2 is suctioned and held at the lower end of the nozzle 23. The suction operation from the opening is released, so that the component 2 is released from the nozzle 23. The nozzle 23 may be a gripper nozzle that pinches and holds the component 2.

[0038] The mounting head 24 has a nozzle moving device 28 that moves the nozzle 23. The nozzle moving device 28 moves the nozzle 23 in each of the Z-axis direction and the θZ direction. The nozzle moving device 28 is supported by the mounting head 24. The nozzle 23 is connected to a lower end of the shaft 23A. A plurality of shafts 23A are provided. The plurality of nozzles 23 are connected to each of the plurality of shafts 23A. A plurality of nozzle moving devices 28 are provided. The plurality of nozzle moving devices 28 are connected to each of the plurality of shafts 23A. The nozzle 23 is supported by the mounting head 24 via the shaft 23A and the nozzle moving device 28. The nozzle moving device 28 moves the shaft 23A in the Z-axis direction and the θZ direction to move the nozzle 23.

[0039] Nozzle 23 can be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction by head moving device 27 and nozzle moving device 28. By moving nozzle 23, component 2 held by nozzle 23 can also be moved in each of the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

[0040] The board camera 25 images the board 1. In the embodiment, the board camera 25 images the surface of the board 1 from the +Z side of the board 1. The board camera 25 is provided on the mounting head 24. The board camera 25 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. The board camera 25 can, for example, image an alignment mark provided on the surface of the board 1.

[0041] The height sensor 26 detects a height indicating the position of the surface of the substrate 1 in the Z-axis direction. The height sensor 26 is provided on the mounting head 24. The height sensor 26 moves in the X-axis direction and the Y-axis direction together with the mounting head 24. In the embodiment, the height sensor 26 is a laser positioning sensor. The height sensor 26 can detect the distance from the mounting head 24 to the substrate 1 by irradiating the surface of the substrate 1 with laser light from the +Z side of the substrate 1 and receiving the laser light reflected by the surface of the substrate 1. By detecting the distance from the mounting head 24 to the substrate 1, the height of the surface of the substrate 1 is detected.

[0042] The chamber 29 has an internal space in which the base member 18, the transport device 19, the stage 20, the stage moving device 21, the component supply device 22, the mounting head 24, the head moving device 27, and the nozzle moving device 28 are housed.

[0043] In the embodiment, the mounting device 12 has a dispenser 34 that applies cream solder to the board 1. The dispenser 34 moves in each of the X-axis direction, the Y-axis direction, and the Z-axis direction on the +Z side of the transport device 19. The dispenser 34 and the mounting head 24 are capable of moving separately. After the cream solder is applied to the surface of the board 1 by the dispenser 34, the components 2 are mounted on the board 1 by the mounting head 24. The board 1 on which the components 2 have been mounted by the mounting device 12 is transported to the preheating device 13 while being fixed to the pallet 3.

[0044] The preheating device 13 reduces the liquid component of the cream solder applied to the substrate 1. The cream solder includes flux and metallic solder balls dispersed in the flux. The preheating device 13 reduces the liquid component of the cream solder by activating the flux and vaporizing at least a portion of the liquid component. The preheating device 13 includes a base member 35, a transport device 36 that transports the pallet 3, a heater 37 that heats the substrate 1, and a chamber 38.

[0045] The base member 35 supports a conveying device 36. The conveying device 36 conveys the pallet 3 supporting the substrate 1 in the X-axis direction. The conveying device 36 has a conveyor belt 36A that conveys the pallet 3, and a guide member 36B that guides the pallet 3.

[0046] The heater 37 heats the substrate 1 so that at least a part of the liquid component of the flux of the cream solder is vaporized.

[0047] The chamber 38 has an internal space in which the base member 35, the transport device 36, and the heater 37 are respectively housed.

[0048] Preheating device 13 heats substrate 1 supported on pallet 3 so as to reduce the liquid component of the cream solder. Preheating device 13 heats substrate 1 to a temperature lower than the melting point of the cream solder. Preheating device 13 heats substrate 1, for example, at a temperature of 80°C or higher and 100°C or lower for 10 minutes. Substrate 1 preheated by preheating device 13 is transported to laser irradiation device 14 while being fixed to pallet 3.

[0049] The laser irradiation device 14 irradiates the cream solder with a laser beam so as to melt the cream solder. The laser irradiation device 14 includes a base member 39, a transport device 40 that transports the pallet 3, a stage 41 that supports the pallet 3, a stage moving device 42 that moves the stage 41, a laser head 43 that emits a laser beam, and a chamber 44.

[0050] The base member 39 supports each of the transport device 40, the stage 41, the stage moving device 42, and the laser head 43. The transport device 40 transports the pallet 3 supporting the substrate 1 in the X-axis direction. The transport device 40 has a transport belt 40A that transports the pallet 3, and a guide member 40B that guides the pallet 3. The structure and function of the transport device 40 are substantially equal to the structure and function of the transport device 19.

[0051] The stage 41 supports the pallet 3 from the -Z side. The stage movement device 42 moves the stage 41 in the Y-axis direction, the Z-axis direction, the θX direction, and the θY direction. The structure and function of the stage 41 are substantially the same as the structure and function of the stage 20.

[0052] The laser head 43 irradiates the cream solder with a laser beam to melt the cream solder. The laser head 43 moves on the +Z side of the conveying device 40 in each of the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0053] The chamber 44 has an internal space in which the base member 39, the transport device 40, the stage 41, the stage moving device 42, and the laser head 43 are housed.

[0054] In the laser irradiation device 14, the cream solder is irradiated with the laser light emitted from the laser head 43. The cream solder is heated by the laser light and melts. The melted cream solder is cooled, and the component 2 is soldered to the board 1. In the embodiment, the cream solder is irradiated with the laser light after the liquid component of the cream solder is reduced in the preheating device 13. Since the cream solder is irradiated with the laser light in a state in which the liquid component of the cream solder has been reduced, solder balls due to bumping of the cream solder are suppressed.

[0055] When the pallet 3 has an information medium 80, the mounting device 12 may be provided with a reader 101, the preheating device 13 may be provided with a reader 102, and the laser irradiation device 14 may be provided with a reader 103. The reader 101 reads the board data stored in the information medium 80. When the information medium 80 is a two-dimensional code, the reader 101 is a two-dimensional code reader. When the information medium 80 is an RF tag, the reader 101 is an RFID reader. Like the reader 101, the readers 102 and 103 each read the board data stored in the information medium 80.

[0056] [Board data and NC data] 8 and 9 are diagrams for explaining board data and NC data according to the embodiment. The board data may be stored in, for example, an information medium 80, or in a storage device provided in each of the mounting device 12, the preheating device 13, and the laser irradiation device 14, or in an external storage device via a network, such as a storage 49 of the management device 16 described below or a storage device on a server that manages the production system 10. In this embodiment, the board data is described as being stored in the information medium 80.

[0057] The board data includes the mounting position Pp (xp, yp, zp) of the component 2 on the surface of the board 1. The board data also includes, for example, the normal vector (u, v, w) of the surface of the board 1 at the mounting position Pp, surface data of the surface of the board 1, and texture data of the circuit pattern on the surface data. The board data is expressed in a board coordinate system (Xp, Yp, Zp) with the board coordinate reference point Pr fixed to the board 1 or pallet 3 as the origin. In addition to the above, the board data includes the part number to be mounted, the land position to which the cream solder is applied, the preheating temperature, the preheating time, the laser power, the laser irradiation time, etc., and is used by each device on the production line.

[0058] The stage 20 is used in the mounting device 12. The mounting device 12 is a three-dimensional mounting device. The stage 20 is rotatable while supporting the substrate 1. The stage 20 can rotate in the θX direction around the rotation axis Xt. The stage 20 can rotate in the θY direction around the rotation axis Yt. The stage 20 supports the substrate 1 via a pallet 3. When the stage 20 rotates in the θX direction and the θY direction around the rotation axis Xt and the rotation axis Yt to tilt the substrate 1, the mounting position Pp rotates around the rotation axis Xt and the rotation axis Yt. The rotation axis Xt and the rotation axis Yt are perpendicular to each other.

[0059] The machine coordinate system (Xm, Ym, Zm) is defined in the mounting device 12. The machine coordinate system (Xm, Ym, Zm) is a coordinate system fixed to the mounting device 12, and serves as a reference when the mounting head 24 moves. The origin of the machine coordinate system may be anywhere in the mounting device 12. When the stage 20 rotates in the θX direction and the θY direction around the rotation axis Xt and the rotation axis Yt and the board 1 is tilted, the mounting position Pp rotates around the rotation axis Xt and the rotation axis Yt. The mounting position Pm (xm, ym, zm) in the machine coordinate system of the rotated mounting position Pp is calculated, and the board camera 25, the height sensor 26, and the nozzle 23 of the mounting head 24 move using this mounting position Pm (xm, ym, zm). The mounting position Pm (xm, ym, zm) in the machine coordinate system and the rotation angle of the stage 20 are stored as NC data, and are used as command positions for the drive motor when the mounting device 12 is operated. Similarly, NC data is created and used by each device on the production line other than the mounting device 12. Since the NC data is calculated based on mechanical parameters such as the positions of the rotation axis Xt and rotation axis Yt of the stage 20, the NC data for each device will be different.

[0060] 9 is a diagram for explaining a method of controlling the stage 20. When the stage 20 rotates about the rotation axis Rm, the substrate 1 and the substrate coordinate system also rotate. When the stage 20 moves up and down in the Z-axis direction, the substrate 1 and the substrate coordinate system also move up and down. Therefore, the mounting position Pp (xp, yp, zp) is converted to a mounting position Pm (xm, ym, zm) in the machine coordinate system based on the data of the rotation angle and vertical movement amount of the stage 20, the position of the rotation axis of the stage 20, and the positions of the rotation axis of the stage 20 and the origin of the substrate coordinate system. In addition, the position of the machine coordinate system can also be converted to a position of the substrate coordinate system based on the control amount of the stage 20.

[0061] As described above, the surface of the substrate 1 at the mounting position Pm can be made horizontal by rotating and moving the stage 20 in the mounting device 12. The stage 20 of the mounting device 12 is substantially equal in structure and function to the stage 41 of the laser irradiation device 14. Therefore, also in the laser irradiation device 14, the surface of the substrate 1 at the laser irradiation position can be made horizontal by rotating and moving the stage 41 in the same manner as described above.

[0062] [Management device] 10 is a diagram illustrating a schematic configuration of a management device 16 according to an embodiment. The management device 16 controls a production line. The management device 16 may be present in each of the mounting device 12, the preheating device 13, and the laser irradiation device 14, or may be present separately via a network. The management device 16 includes a computer system.

[0063] The management device 16 has at least one processor 47, a main memory 48, a storage 49, and an interface 50. The processor 47 is a central processing unit (CPU). The main memory 48 includes a non-volatile memory such as a read only memory (ROM) and a volatile memory such as a random access memory (RAM). Examples of the storage 49 include a hard disk drive (HDD), a solid state drive (SSD), a magnetic disk, a magneto-optical disk, a CD-ROM, and a DVD-ROM. The interface 50 includes an input / output circuit. The functions of the processor 47 are stored in the storage 49 as a program. The processor 47 reads the program from the storage 49, expands it in the main memory 48, and executes processing according to the program. The program may be distributed to the management device 16 via a network.

[0064] [Implementation process] 11 is a flowchart showing a mounting process according to an embodiment. The board 1 is fixed to the pallet 3. In this embodiment, board data of the board 1 fixed to the pallet 3 is stored in an information medium 80. If the information medium 80 is a two-dimensional code, the two-dimensional code indicating the board data is attached to the pallet 3, and only an identification number is stored in the information medium 80 held on the pallet 3, and the board data stored in the storage 49 of the management device 16 or on a server that manages the production system 10 may be referenced.

[0065] In this embodiment, the pallet 3 on which the information medium 80 is attached is transported to the mounting device 12 while supporting the board 1. The reading device 102 reads the information medium 80 attached to the pallet 3, and the management device 16 acquires board data for the board 1 (step SA1). The board data for the board 1 transported to the mounting device 12 includes coordinate data for the mounting position on the surface of the board 1, data for the components 2 to be mounted, soldering land positions, etc. The data for the components 2 includes the component number, type, size, height, weight, etc. of the components 2. Conditions such as the ratio of the area to the ground surface to which cream solder is applied vary depending on the type of component 2.

[0066] Management device 16 sets the rotation speed of stage 20 based on data of component 2 such as the size, height, weight, and ratio of the area to the ground surface to which cream solder is applied of component 2. The rotation speed of stage 20 may be set, for example, based on the sum of the size, height, weight, and ratio of the area to the ground surface to which cream solder is applied of component 2, each of which has a predetermined weighting coefficient set. The rotation speed of stage 20 may be set, for example, to three levels, high speed, medium speed, and low speed, or may be set to two levels or four or more levels, or may be set continuously.

[0067] The management device 16 sets the rotation speed of the stage 20 for each component 2 (step SA2). In this embodiment, it is set to one of high, medium, and low speeds shown in Table 1 below. The management device 16 also sets the order in which the components 2 are mounted based on the set rotation speed of the stage 20 (step SA3). At this time, the rotation speed of the stage 20 is set in the order from high to low. In this embodiment, the rotation speed is set in three stages, high, medium, and low, so that the order of the multiple components 2 set to the same rotation speed stage is arbitrary, and for example, it is set from the center toward the outer periphery of the surface of the board 1 so that the rotation of the stage 20 and the movement of the mounting head 24 are minimized.

[0068] [Table 1]

[0069] Next, the dispenser 34 of the mounting device 12 creates NC data using the board data read by the reader 102 from the information medium 80 and the mechanism parameters, and applies cream solder to the board 1 based on the created NC data. The dispenser 34 applies cream solder to pad positions for the component to be mounted at the mounting position Pp (step SA4). The application of cream solder is repeated for all components 2 to be mounted on the board 1.

[0070] After the solder paste is applied to the board 1, the management device 16 sets the number of executions i to i=1 and starts the loop process (step SA5). In the loop process, while i≦n is satisfied, the processes from step SA6 to step SA7 are repeatedly executed n times. Here, n is the number of components 2 to be mounted on the board 1, and i is the order in which the components 2 are mounted, which was set in step SA3.

[0071] The management device 16 controls the stage 20 so that the surface of the board 1 at the mounting position Pp of the i-th component 2 is horizontal. At this time, the management device 16 controls the stage 20 so that it rotates and moves at the rotation speed set in step SA2 relative to the i-th component 2 (step SA6). The stage 20 is controlled based on the board data read by the reading device 104 from the information medium 80 and NC data created from the mechanism parameters. The management device 16 controls the mounting head 24 so that the component 2 is mounted on the board 1 supported by the stage 20. The mounting head 24 is controlled based on the NC data. The mounting head 24 mounts the component 2 at the mounting position Pp (step SA7).

[0072] The management device 16 resets the execution count i in the loop process as i=i+1, and returns to step SA6. After executing the processes from step SA6 to step SA7 n times and mounting all of the components 2 at their respective predetermined positions on the board 1, the loop process ends (step SA8). Note that the application of cream solder and mounting of the components may be performed after the cream solder has been applied to all positions, and then mounting of the n components 2 may be performed all at once, or the application of cream solder and mounting of the components 2 may be repeated for each component 2.

[0073] [Preheating treatment] After the components 2 are mounted on the board 1, the pallet 3, supporting the board 1, is transported to the preheating device 13. The reading device 103 reads the information medium 80 attached to the pallet 3. The preheating device 13 preheats the cream solder applied to the board 1 based on the preheating temperature and preheating time of the board data read by the reading device 103 from the information medium 80.

[0074] [Laser soldering process] FIG. 12 is a flowchart showing the laser soldering process according to the embodiment. After the cream solder is preheated, the pallet 3 is transported to the laser irradiation device 14 while supporting the board 1. The reading device 104 reads the information medium 80 attached to the pallet 3, and the management device 16 acquires the board data of the board 1 (step SB1). The board data of the board 1 transported to the laser irradiation device 14 includes coordinate data of the mounting position on the surface of the board 1, data of the components 2 to be mounted, soldering land positions, etc. The data of the components 2 includes the component number, type, size, height, weight, etc. of the components 2. Depending on the type of the components 2, conditions such as the ratio of the area where the cream solder is applied to the ground surface differ. The board data also includes laser irradiation conditions such as laser power and laser irradiation time.

[0075] Management device 16 sets the rotation speed of stage 41 based on data of component 2 such as the size, height, weight, and ratio of the area to the ground surface to which cream solder is applied of component 2. The rotation speed of stage 41 may be set, for example, based on the sum of the size, height, weight, and ratio of the area to the ground surface to which cream solder is applied of component 2, each of which is set with a predetermined weighting coefficient. The rotation speed of stage 41 may be set, for example, to three levels, low speed, medium speed, and high speed, or may be set to two levels or four or more levels, or may be set steplessly.

[0076] The management device 16 sets the rotation speed of the stage 41 for each component 2 (step SB2). In this embodiment, it is set to one of low speed, medium speed, and high speed shown in Table 2 below. The management device 16 also sets the order in which the cream solder corresponding to the components 2 is irradiated with the laser based on the set rotation speed of the stage 41 (step SB3). At this time, the rotation speed of the stage 41 is set in the order from low speed to high speed. In this embodiment, the rotation speed is set in three stages, low speed, medium speed, and high speed, so that the order of the multiple components 2 set to the same rotation speed stage is arbitrary, and for example, it is set from the center to the outer periphery of the surface of the substrate 1 so that the rotation of the stage 41 and the movement of the laser head 43 are minimized.

[0077] [Table 2]

[0078] Next, management device 16 sets the number of executions j to j=1 and starts loop processing (step SB4). In the loop processing, while j≦n is satisfied, the processing from step SB5 to step SB6 is repeated n times. Here, n is the number of components 2 mounted on board 1, and j is the order of laser irradiation set in step SB3.

[0079] The management device 16 controls the stage 41 so that the surface of the board 1 is horizontal at the position where the j-th component 2 is mounted. At this time, the management device 16 controls the stage 41 so that it rotates and moves at the rotation speed set in step SB2 with respect to the j-th component 2 (step SA5). The stage 41 is controlled based on the board data read by the reading device 104 from the information medium 80 and the NC data created from the mechanism parameters. The management device 16 controls the laser head 43 so that the laser light is irradiated onto the cream solder applied to the area of ​​the board 1 where the j-th component 2 is mounted. The laser head 43 is controlled based on the NC data. The cream solder is melted by being irradiated with the laser light from the laser head 43, and is cooled, so that the component 2 is soldered to the board 1 (step SB6).

[0080] The NC data for component mounting is created so that the surface of the board 1 at the mounting position Pp of the component 2 is horizontal, but the surface of the board 1 when irradiated with laser light may be tilted within a range that does not cause the component to shift position due to gravity. By intentionally tilting the surface of the board 1 when irradiated with laser light, it is possible to regulate the direction of the laser reflected light on the solder surface and prevent the board 1 from burning. The possible angle of tilt is determined by the weight of the component 2 and the adhesive strength of the cream solder, and is stored in advance in the board data.

[0081] Management device 16 resets the execution number j in the loop process as j=j+1 and returns to step SB5. When the processes from step SB5 to step SB6 have been executed n times and all components 2 on board 1 have been soldered, the loop process ends (step SB7).

[0082] [Another example of the laser soldering process] FIG. 13 is a flowchart showing the laser soldering process according to the embodiment. In the process shown in FIG. 13, the description of the process common to the process shown in FIG. 12 will be omitted as appropriate. In the example shown in FIG. 13, the mounting device 12 uses each data used in the process of the flowchart shown in FIG. 11. Specifically, when the mounting process is performed in the mounting device 12, the rotation speed of the stage 20 corresponding to each component 2 and the order in which the components 2 are mounted are stored in the information medium 80. After the cream solder is preheated, the pallet 3 is transported to the laser irradiation device 14 while supporting the board 1. The reading device 104 reads the information medium 80 attached to the pallet 3, and the management device 16 acquires the board data for the board 1 as well as the rotation speed of the stage 20 set in the mounting device 12 and the order in which the components 2 are mounted (step SC1).

[0083] Next, management device 16 sets the number of executions i to i=n and starts loop processing (step SC2). In the loop processing, while i≧1 is satisfied, the processing from step SC3 to step SC4 is repeatedly executed n times. Here, n is the number of components 2 mounted on board 1, and i is the order of mounting components 2 set in step SA3 shown in FIG. 11. That is, as shown in Table 3 below, in the processing shown in FIG. 13, stage 41 is rotated at the same speed as the rotation speed of stage 20 when mounting components 2, and the cream solder is irradiated with a laser in the reverse order to the order in which components 2 were mounted.

[0084] [Table 3]

[0085] The management device 16 controls the stage 41 so that the surface of the board 1 for the i-th component 2 in the reverse order is horizontal. At this time, the management device 16 controls the stage 41 to rotate and move at the rotation speed set in step SA3 shown in FIG. 11 for the i-th component 2 in the reverse order (step SC3). The stage 41 is controlled based on the board data read by the reading device 104 from the information medium 80 and the NC data created from the mechanism parameters. The management device 16 controls the laser head 43 so that the laser light is irradiated onto the cream solder applied to the area on the board 1 where the i-th component 2 in the reverse order is mounted. The laser head 43 is controlled based on the NC data. The cream solder is melted by the irradiation of the laser light from the laser head 43, and is cooled, so that the component 2 is soldered to the board 1 (step SC4).

[0086] The management device 16 resets the execution number i in the loop process to i=i-1 and returns to step SC3. When the processes from step SC3 to step SC4 have been executed n times and all the components 2 on the board 1 have been soldered, the loop process ends (step SC5).

[0087] [effect] As described above, according to this embodiment, the rotation speed of the stage 41 when rotating the stage 41 to make the mounting position of the component 2 horizontal can be set based on component data including at least one of the size, height, and weight of the component 2 mounted on the surface of the board 1 supported by the stage 41, and the ratio of the area where the cream solder is applied to the contact surface with the surface of the board 1. As a result, in a state where soldering has not yet been completed on the board 1 on which multiple components 2 are mounted and some components 2 are still held only by the adhesive force of the solder, when the stage 41 rotates, it is possible to prevent the components 2 from shifting or coming off, and the soldering process can be performed stably and quickly.

[0088] [Other embodiments] Although the embodiments of the present application have been described above, the present invention is not limited by the contents of these embodiments. The above-described embodiments and modified examples can be appropriately combined within a range that does not cause contradictions in the processing contents. In addition, the above-described components include those that a person skilled in the art can easily imagine, those that are substantially the same, and those that are within the so-called equivalent range. Furthermore, the above-described components can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the components can be made within a range that does not deviate from the gist of the above-described embodiments.

[0089] For example, in the embodiment, the rotation speed of the stage 41 corresponding to each of all the components 2 to be soldered to the board 1 is set, and the laser irradiation order corresponding to all the components 2 is set in advance, but the rotation speed of the stage 41 when the next component 2 is soldered may be set based on the component data of the component 2 that has not yet been soldered among the mounted components 2. In other words, the rotation speed of the stage 41 is set according to the component 2 that should have the slowest rotation speed of the stage 41 among the multiple components 2 that have not yet been soldered.

[0090] Also, the pallet 3 may not have the information medium 80, and may refer to the board data stored in the storage 49 of the management device 16 or in a storage device on a server that manages the production system 10. In this case, the mounting device 12, the preheating device 13, and the laser irradiation device 14 do not need the reading devices 101, 102, and 103, and reading operations for acquiring the board data from the information medium 80 are also not required. In other words, when board data is stored in the respective storage devices of the mounting device 12, the preheating device 13, and the laser irradiation device 14, the storage 49, or an external storage device, in the mounting process, preheating process, and laser soldering process shown in the embodiment, the board data is acquired by referring to the board data from the storage device rather than by reading from the information medium 80.

[0091] Furthermore, among the processes described in the above embodiments, all or part of the processes described as being performed automatically can be performed manually, or all or part of the processes described as being performed manually can be performed automatically by a known method. In addition, the information including the processing procedures, specific names, various data and parameters shown in the above documents and drawings can be changed arbitrarily unless otherwise specified. For example, the various information shown in each drawing is not limited to the illustrated information.

[0092] Moreover, each component of each device shown in the figure is a functional concept, and does not necessarily have to be physically configured as shown in the figure. In other words, the specific form of distribution and integration of each device is not limited to that shown in the figure, and all or part of them can be functionally or physically distributed and integrated in any unit according to various loads, usage conditions, etc. Furthermore, the above-mentioned management device 16 may be configured by multiple computers divided into several functions, and some of the functions of the computers may be possessed by a cloud server that executes various functions in the form of cloud computing. [Explanation of symbols]

[0093] 1...substrate, 1A...base material, 1B...film, 2...component, 3...pallet, 4...support member, 4A...base portion, 4B...guard portion, 4C...pin portion, 4D...hole, 5...clamp mechanism, 5A...support portion, 5B...movable portion, 10...production system, 12...mounting device, 13...preheating device, 14...laser irradiation device, 16...management device, 18...base member, 19...transport device, 19A...transport belt, 19B...guide member, 20...stage, 20A...positioning member, 21...stage movement device, 22...component supply device, 23...nozzle, 23A...shaft, 24...mounting head, 25...substrate camera, 26...height sensor, 27...head movement device, 27X...X-axis movement device, 27Y...Y-axis movement device position, 28...nozzle moving device, 29...chamber, 34...dispenser, 35...base member, 36...transport device, 36A...transport belt, 36B...guide member, 37...heater, 38...chamber, 39...base member, 40...transport device, 40A...transport belt, 40B...guide member, 41...stage, 42...stage moving device, 43...laser head, 44...chamber, 47...processor, 48...main memory, 49...storage, 50...interface, 80...information medium, 101...reading device, 102...reading device, 103...reading device, 104...reading device, Pp...mounting position (board coordinates), Pm...mounting position (machine coordinates), Pr...board coordinate reference point, Rm...rotation axis.

Claims

1. A stage for supporting the three-dimensional substrate; a laser head that irradiates a laser beam onto cream solder that holds the components mounted on the three-dimensional substrate; a management device that controls the stage so as to make the surface of the three-dimensional substrate at the mounting position of the component horizontal, and controls the laser head so as to irradiate the cream solder at the mounting position with a laser beam, setting a rotation speed of the stage when leveling the surface of the three-dimensional substrate at the mounting position of the component, based on component data including at least one of a size, height, and weight of the component, and a ratio of an area where the cream solder is applied to a contact surface with the surface of the three-dimensional substrate; Laser irradiation device.

2. setting a rotation speed of the stage when leveling a surface of the three-dimensional substrate at a mounting position of a component held in the cream solder to be irradiated with a laser beam next, based on component data of the component that is not soldered among the components mounted on the three-dimensional substrate; 2. The laser irradiation device according to claim 1.

3. setting a rotation speed of the stage based on the component data for each of the plurality of components mounted on the three-dimensional substrate, and setting an order in which a laser beam is irradiated onto the cream solder holding the components based on the set rotation speed of the stage.

2. The laser irradiation device according to claim 1.

4. and setting the stage so that the components are mounted in ascending order of rotation speed.

4. The laser irradiation device according to claim 3.

5. a pallet that supports the three-dimensional substrate and has an information medium that holds substrate data including component mounting positions on a surface of the three-dimensional substrate, a horizontal direction at the mounting positions, and the component data; a mounting device that applies cream solder to the three-dimensional substrate that is transported while being fixed to the pallet and mounts the components at the mounting positions; and a laser irradiation device according to any one of claims 1 to 4, which irradiates a cream solder holding the component mounted by the mounting device with a laser beam to solder the component. Electronic device manufacturing system.

6. acquiring board data including component data including a mounting position where a component is mounted on a surface of a three-dimensional substrate supported by a stage, a horizontal direction at the mounting position, and at least one of a size, height, and weight of the component, and a ratio of an area where cream solder is applied to a contact surface with the surface of the three-dimensional substrate; setting a rotation speed of the stage when horizontally leveling a surface of the three-dimensional substrate at a mounting position of the component based on the component data; controlling the stage so as to level a surface of the three-dimensional substrate at the mounting position based on the substrate data and the rotation speed; and irradiating a cream solder holding the component mounted at the mounting position with a laser beam while the surface of the three-dimensional substrate at the mounting position is in a horizontal state, thereby soldering the component. Laser light irradiation method.

7. acquiring a rotation speed of a stage supporting the three-dimensional substrate when the component is mounted on the three-dimensional substrate; and controlling the stage so as to level a surface of the three-dimensional substrate at the mounting position where the laser light is irradiated, based on the substrate data and the acquired rotation speed.

7. The laser light irradiation method according to claim 6.

8. Applying cream solder to the three-dimensional substrate; Mounting the component on the three-dimensional substrate; and soldering the component by the laser light irradiation method according to claim 6 or 7. A method for manufacturing an electronic device.

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