Chip collection device, chip collection box, component mounting system, and chip collection method

Abstract

To provide a chip collection device, a chip collection box, a component mounting system, and a chip collection method that can appropriately collect chips from a tape member.SOLUTION: A chip collection device that collects chips Ts of tape material discharged from a chute 14 of a component mounting device having a tape feeder includes a collection path 21 that receives the chips Ts discharged from the chute 14 from a chip receiving opening 21a, a posture change portion U1 that changes the posture of the chips Ts received in the collection path 21, and a transport portion 25 that transports the posture-changed chips Ts within the collection path 21.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a chip collection device that collects chips of a tape member discharged from a tape feeder, a chip collection box, a component mounting system, and a chip collection method. [Background technology]

[0002] In a component mounting device, a tape feeder conveys a tape member (carrier tape) on which many components are arranged and stored, and mounts the supplied components on a board. After components are supplied, the tape member is discharged from the tape feeder, cut to a predetermined length by a cutter, and collected as tape member scraps. Patent Document 1 discloses a production line equipped with a scrap collection device that cuts tape members discharged from a plurality of tape feeders arranged on a feeder cart with a cutter, and collects the cut pieces in a storage unit provided at the end of the production line. The scrap collection device of Patent Document 1 pressure-feeds the scraps that fall under their own weight from a chute of the feeder cart through a scrap inlet opening provided in a collection path to the storage unit using air. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 131165 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the conventional techniques including Patent Document 1, the following problem occurs due to the configuration in which the chips discharged from the chute fall to the collection path under their own weight. That is, when the end of the tape material is discharged from the tape feeder, the discharged tape material falls to the collection path without being cut by the cutter, which may result in chips that are longer than usual. When chips that are longer than usual fall in this way, there is a problem that the chips may get caught between the chute and the collection path and cannot be collected.

[0005] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, an object of the present invention is to provide a scrap collection device, a scrap collection box, a component mounting system, and a scrap collection method that are capable of appropriately collecting scraps of tape members. [Means for solving the problem]

[0006] The chip collection device of the present invention is a chip collection device that collects chips of a tape material discharged from a chute of a component mounting device having a tape feeder that supplies components using a tape material, and is equipped with a collection path that receives the chips discharged from the chute through an opening, a posture change unit that changes the posture of the chips received in the collection path, and a transport unit that transports the chips whose posture has been changed within the collection path.

[0007] The chip storage box of the present invention is a chip storage box that stores chips of a tape material discharged from a chute of a component mounting device having a tape feeder that supplies components using a tape material, and is equipped with a receiving section that receives the chips discharged from the chute through an opening, and a posture changing section that changes the posture of the chips received in the receiving section.

[0008] The component mounting system of the present invention is a component mounting system comprising: a component mounting device having a tape feeder that supplies components using a tape member; and a chip collection device that collects chips of the tape member discharged from a chute of the component mounting device, wherein the chip collection device comprises a collection path that receives the chips discharged from the chute through an opening, a posture change unit that changes the posture of the chips received in the collection path, and a transport unit that transports the chips whose posture has been changed within the collection path.

[0009] The chip collection method of the present invention is a chip collection method for collecting chips of a tape material discharged from a chute of a component mounting device having a tape feeder that supplies components using a tape material, and includes a discharge process for discharging the chips from the chute to an opening of a collection path, a posture changing process for changing the posture of the chips received in the collection path, and a transporting process for transporting the chips whose posture has been changed within the collection path. Effect of the Invention

[0010] According to the present invention, cutting chips of the tape member can be appropriately collected. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing a configuration of a component mounting system including a chip collecting device and a plurality of component mounting devices according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a side view showing the configuration of a main part of a component mounting device installed above a chip collecting device according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a perspective view showing a configuration of a chip collecting device according to an embodiment of the present invention; [Figure 4] 1A is a plan view of a first embodiment of a position changing unit provided in a chip collecting device according to an embodiment of the present invention; FIG. 1B is a side cross-sectional view of the first embodiment; [Diagram 5] 1A is a plan view illustrating a first embodiment of a position changing unit provided in a chip collecting device according to an embodiment of the present invention; FIG. 1B is a cross-sectional view illustrating the position changing unit; [Figure 6] FIG. 4 is a plan view of a second embodiment of the position changing unit provided in the chip collecting device according to the embodiment of the present invention; [Figure 7] FIG. 11 is a timing chart for explaining a chip transport method according to a second embodiment of the attitude changing unit provided in the chip collection device according to the embodiment of the present invention. [Figure 8] FIG. 2 is a side view showing the configuration of the main part of a component mounting device installed above a chip collection box according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting system, the component mounting device, the chip collecting device, and the chip collecting box. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations are omitted. In FIG. 1 and in a part described later, the X-axis in the board transport direction (the left-right direction as seen from the worker OP in FIG. 1) and the Y-axis perpendicular to the board transport direction (the front-back direction as seen from the worker OP in FIG. 1) are shown as two axes perpendicular to each other in a horizontal plane. In addition, in FIG. 1 and in a part described later, the Z-axis (the up-down direction) is shown as a height direction perpendicular to the horizontal plane.

[0013] First, the configuration of the component mounting system 1 will be described with reference to Fig. 1. The component mounting system 1 is configured to include a plurality of component mounting devices M1-M3 and a chip collection device 20 (see Fig. 2). The component mounting system 1 has the function of delivering a board KB between adjacent component mounting devices M1-M3 and mounting components on the board KB to produce a mounted board. The component mounting system 1 also has the function of collecting chips from the empty tape member after components have been supplied. The component mounting devices M1-M3 are installed above the collection path 21 (see Fig. 2) and transport path 22 of the chip collection device 20.

[0014] Each of the component mounting devices M1-M3 has a feeder carriage 3 on which a plurality of tape feeders 2 are mounted to supply components using a tape member, and has a function of mounting the components on the board KB. The scrap collection device 20 has a function of collecting scraps of the tape member discharged from the chutes of the component mounting devices M1-M3. The number of component mounting devices M1-M3 provided in the component mounting system 1 is not limited to three, and may be one, two, or four or more. Furthermore, the component mounting system 1 may be configured to include a printing device (not shown) that prints solder paste on the board upstream of the component mounting devices M1-M3, and a reflow device (not shown) that melts the solder paste for soldering downstream.

[0015] Next, the configuration of component mounting devices M1 to M3 will be described with reference to Fig. 2. The three component mounting devices M1 to M3 have the same configuration, and here, component mounting device M1 will be described as an example. Component mounting device M1 includes a component mounting main body 4 and two feeder carts 3. The feeder carts 3 are detachably connected to component supply units 5 on the front and rear sides of the component mounting main body 4, respectively.

[0016] A plurality of tape feeders 2 are mounted on the upper surface of the feeder cart 3 in a line along the X-axis. A reel 7 around which a tape material T is wound and which stores components 6 to be supplied to the component mounting main body 4 is rotatably held by the feeder cart 3. The tape feeder 2 transports the tape material T stored on the reel 7 in the tape feed direction to supply the components 6 to the component mounting main body 4.

[0017] 2, when the feeder cart 3 is mounted on the component supply unit 5, the multiple tape feeders 2 are connected to a mounting control device 8 provided in the component mounting main body unit 4 via the feeder cart 3. The mounting control device 8 transmits a supply command for components 6 to the tape feeders 2, and upon receiving the command, the tape feeders 2 feed the tape material T to supply the components 6 to the component removal position.

[0018] The mounting control device 8 calculates the length of the empty tape material T discharged from the tape feeder 2 from the length of the tape material T discharged from the tape feeder 2 in response to one supply command and the number of components 6 supplied by the tape feeder 2. The mounting control device 8 also receives the detection result of the sensor 2a that detects the end of the tape material T built into the tape feeder 2, and executes a predetermined process described later.

[0019] 2, two board transport mechanisms 10 are arranged side by side in front and behind on the upper surface of the base 9 of the component mounting main body 4, between the front and rear component supply units 5. Each board transport mechanism 10 transports, positions, and holds a board KB along the X-axis. Two mounting heads 12 are installed above the board transport mechanisms 10 and are moved horizontally (in the X-axis and Y-axis directions) by a head moving mechanism 11.

[0020] The mounting control device 8 controls the head moving mechanism 11 and the mounting head 12 to perform a component mounting operation in which the mounting head 12 picks up the components 6 supplied to the component pick-up position by the tape feeder 2 and transfers and mounts them at the mounting point of the board KB held by the board transport mechanism 10. A body cover 13 that can be opened and closed freely is provided above the feeder cart 3 to prevent an operator from touching the moving mechanism such as the mounting head 12 during the component mounting operation.

[0021] 2, a chute 14 is provided on the side of the feeder cart 3 that is coupled to the base 9, for guiding downward the empty tape material T discharged from the tape feeder 2. A cutter 15 is provided on the chute 14 for cutting the empty tape material T.

[0022] The cutter 15 is controlled by the mounting control device 8, and cuts the empty tape members T all at once when the empty tape members T discharged from any of the multiple tape feeders 2 reach a predetermined length (for example, 10 cm). The cut tape members T are discharged from below the chute 14 as scraps Ts (see FIG. 4) of the tape member T. The predetermined length to which the tape member T is cut by the cutter 15 is set to a length that allows the scrap collection device 20 to easily collect the scraps Ts.

[0023] Next, the configuration of the chip collection device 20 will be described with reference to Figs. 2 to 4. In Fig. 3, the chip collection device 20 includes six collection paths 21, two conveying paths 22, a positive pressure supply unit 23, and a storage unit 24. The conveying paths 22 are tubular members extending in the line-up direction (X-axis direction) of the component mounting devices M1 to M3, and are installed on the floor FL. Two conveying paths 22 are installed side by side, one in front of the other. The conveying path 22 installed on the front side corresponds to the three feeder carts 3 located on the front side. The conveying path 22 installed on the rear side corresponds to the three feeder carts 3 located on the rear side.

[0024] Each of the front and rear transport paths 22 extends linearly in the area below the multiple component mounting devices M1-M3 that are lined up in series in the X-axis direction, and each transport path 22 has an opening at one end located upstream of the flow of boards KB, and at the other end of the flow of boards KB. Hereinafter, the opening at one end of each transport path 22 will be referred to as the "air inlet 22A," and the opening at the other end of each transport path 22 will be referred to as the "air outlet 22B."

[0025] 2 to 4, three recovery paths 21 corresponding to the three feeder carriages 3 connected to the front side are connected to the front side of the transport path 22 installed on the front side. Also, three recovery paths 21 corresponding to the three feeder carriages 3 connected to the rear side are connected to the rear side of the transport path 22 installed on the rear side. In the recovery paths 21, a transport opening 22K is opened at the tip end on the opposite side to the one end connected to the transport path 22.

[0026] A chip receiving opening 21a is formed on the upper surface of the recovery path 21. The chip receiving opening 21a is located directly below the chute 14 of each of the component mounting devices M1 to M3. The recovery path 21 receives chips Ts of the tape material T discharged from the chute 14 through the chip receiving opening 21a (opening). In the recovery path 21, below the chip receiving opening 21a, a position changing unit U is disposed which changes the position of the chips Ts discharged from the chute 14 and received in the recovery path 21.

[0027] Some of the chips Ts are curved along an arc due to a warp that occurs when the tape member T is wound around the reel 7 and passes through the tape feeder 2. When the end of the tape member T is discharged from the tape feeder 2, the chips Ts are not cut by the cutter 15 and become longer than the length (predetermined length) that is easily collected by the chip collection device 20. The position changer U has a function of changing the position of the chips Ts so that the chips Ts that are curved along an arc or chips Ts that are longer than the predetermined length are smoothly received in the collection path 21 without getting caught in the chip receiving opening 21a or the like.

[0028] 4, inside the recovery path 21, in front of the wall facing the conveying opening 22K, a conveying unit 25 having a conveying air outlet 25a that discharges air in a direction toward the conveying opening 22K is disposed. The conveying unit 25 conveys the chips Ts, whose position has been changed by the air discharged from the conveying air outlet 25a, toward the conveying opening 22K within the recovery path 21 (conveying step). The chips Ts conveyed within the recovery path 21 are then conveyed into the conveying path 22 through the conveying opening 22K.

[0029] 3, the positive pressure supply unit 23 is connected to a positive pressure source 27 via an external pipe 26. The positive pressure supply unit 23 has a built-in control valve 23V. The air inlets 22A of the front and rear transport paths 22 and the upstream ends of the respective pipelines 28 are connected to the control valve 23V via internal pipes (not shown) provided inside the positive pressure supply unit 23. The external pipes 26 are connected to the internal pipes via the control valve 23V.

[0030] The operation of the control valve 23V is controlled by the management device 29. The positive pressure supply unit 23 supplies positive pressure to the air inlets 22A of the front and rear conveying paths 22 by controlling the positive pressure supplied from the positive pressure source 27 through the external piping 26 with the control valve 23V. When positive pressure is supplied to the air inlet 22A of the conveying path 22, an air flow is formed in the conveying path 22 from the air inlet 22A to the air outlet 22B.

[0031] 3, the positive pressure supply unit 23 also supplies positive pressure to each of the pipes 28 by controlling the positive pressure supplied from the positive pressure source 27 with the control valve 23V. When positive pressure is supplied into the pipes 28, air is blown out from the conveying unit 25 in the recovery path 21 connected to the pipes 28. By discharging air from the conveying unit 25, the chips Ts in the recovery path 21 are conveyed to the conveying path 22 through the conveying opening 22K (conveying process). Furthermore, by supplying positive pressure to the air inlet 22A of the conveying path 22, the chips Ts in the conveying path 22 are discharged outside the conveying path 22 from the air outlet 22B.

[0032] The storage section 24 has a belt conveyor 30 that receives the chips Ts discharged from the air outlet 22B and transports them to a chip passage 31. A box-shaped storage box 32 that opens upward is provided below the chip passage 31. The chips Ts transported to the chip passage 31 by the belt conveyor 30 are collected in the storage box 32. In this manner, the chip collection device 20 collects in the storage box 32 the chips Ts of the tape member T discharged from the chutes 14 of the component mounting devices M1 to M3 having the tape feeders 2 that supply components 6 using the tape member T.

[0033] Next, the configuration and function of a first embodiment of the position change unit U (hereinafter simply referred to as "position change unit U1") provided in the chip collection device 20 will be described with reference to Figures 4 and 5. Figure 4(a) is a plan view of the state in which the chutes 14 of the component mounting devices M1 to M3 are disposed above the chip receiving opening 21a of the collection path 21. Figure 4(b) is a cross section taken along line AA of Figure 4(a). Figure 4(c) is a front view of the collection path 21 as viewed from the conveying opening 22K side (downstream in the conveying direction of the chips Ts).

[0034] 4, a partition plate 21c hanging down from the ceiling 21b of the recovery path 21 is disposed closer to the transport section 25 than the chip receiving opening 21a. At the corner where the partition plate 21c intersects with the opposing inner walls 21e, 21f of the recovery path 21, a plate-shaped first inclined portion P1 and a second inclined portion P2 are installed in an inclined position. Air discharged from the transport air outlet 25a of the transport section 25 is sprayed in the transport direction of the chips Ts from a gap G surrounded by the partition plate 21c, the first inclined portion P1, the second inclined portion P2, and the bottom surface 21d of the recovery path 21.

[0035] In this way, the first inclined portion P1 and the second inclined portion P2 are provided spaced apart from each other at the end of the recovery path 21 on the upstream side in the transport direction (Y-axis direction) of the chips Ts. Hereinafter, when there is no need to distinguish between the first inclined portion P1 and the second inclined portion P2, they will be simply referred to as "inclined portion P."

[0036] Fig. 5(b) is a BB cross section perpendicular to the bottom side Pa where the first inclined portion P1 shown in Fig. 5(a) contacts the bottom surface 21d of the recovery path 21. The upward surface (inclined surface Ps) of the inclined inclined portion P faces the downstream side (the conveying opening 22K side) in the conveying direction (Y-axis direction) of the chips Ts in the recovery path 21. In this way, the inclined surface Ps is provided at a position where it comes into contact with the chips Ts that have passed through the chip receiving opening 21a (opening).

[0037] 5(a), the first inclined portion P1 and the second inclined portion P2 are installed in a direction in which the bottom side Pa of the inclined surface Ps is inclined by angles θy1 and θy2 with respect to the transport direction (Y-axis direction) of the chips Ts in a plan view. The distance between the bottom sides Pa of the inclined surface Ps of the first inclined portion P1 and the second inclined portion P2 becomes wider toward the downstream side in the transport direction of the chips Ts. In other words, in a plan view, the bottom side Pa of the inclined surface Ps (the first inclined portion P1 and the second inclined portion P2) is inclined from the transport direction of the chips Ts and is installed along a direction in which the distance between the first inclined portion P1 and the second inclined portion P2 becomes wider toward the downstream side.

[0038] 5(b), the first inclined portion P1 and the second inclined portion P2 are installed at an angle θz from the bottom surface 21d of the recovery path 21. That is, the inclined surface Ps of the inclined portion P extends obliquely upward from the bottom side Pa of the inclined surface Ps and in a direction approaching the upstream side in the transport direction (Y-axis direction) of the chips Ts. The angle θz between the bottom surface 21d of the recovery path 21 and the inclined surface Ps is set to be equal to or greater than 45 degrees and less than 90 degrees.

[0039] 4(b), chips Ts of the tape material T discharged from the chute 14 and dropped from the chip receiving opening 21a into the recovery path 21 (discharge process) change their posture as they fall along the inclined surface Ps of the inclined portion P (posture changing process). As a result, even chips Ts that are warped or longer than a predetermined length are received in the recovery path 21 without getting caught in the chip receiving opening 21a. In this way, the inclined portion P having the inclined surface Ps (first inclined portion P1 and second inclined portion P2) constitutes a posture changing portion U1 that changes the posture of the chips Ts received in the recovery path 21.

[0040] As described above, the chip collection method for collecting chips Ts of the tape material T discharged from the chute 14 of the component mounting devices M1 to M3 by the chip collection device 20 equipped with the position changing unit U1 discharges the chips Ts from the chute 14 to the chip receiving opening 21a (opening) of the collection path 21 (discharging step), changes the position of the chips Ts received in the collection path 21 along the inclined surface Ps of the inclined portion P (position changing step), and transports the chips Ts with the changed position within the collection path 21 (transporting step). This makes it possible to properly collect chips Ts of the tape material T that are warped or the like.

[0041] 6 and 7, a configuration and function of a second embodiment of the position change unit U (hereinafter simply referred to as "position change unit U2") included in the chip collection device 20 will be described. Fig. 6(b) is a cross section taken along the line CC shown in Fig. 6(a).

[0042] 6, the attitude changing unit U2 is configured to have a first air discharge unit Q1 and a second air discharge unit Q2, which are respectively arranged at the corners where the opposing inner walls 21e, 21f and the partition plate 21c of the recovery path 21 intersect. That is, the first air discharge unit Q1 and the second air discharge unit Q2 are provided at both ends in a direction (X-axis direction) perpendicular to the transport direction of the chips Ts in a horizontal plane at the end of the recovery path 21 on the upstream side in the transport direction of the chips Ts (Y-axis direction). Hereinafter, when there is no need to distinguish between the first air discharge unit Q1 and the second air discharge unit Q2, they will be simply referred to as "air discharge unit Q."

[0043] The air discharge section Q has a discharge port Qa formed therein for discharging air toward the opposing inner walls 21e, 21f. In a plan view, the discharge direction of the air discharged from the discharge port Qa is set to a direction intersecting the chip transport direction (Y-axis direction) of the chips Ts and inclined toward the downstream side of the chip transport direction. The angle θx1 between the air discharge direction of the first air discharge section Q1 and the X-axis direction (horizontal direction) is set to be different from the angle θx2 between the air discharge direction of the second air discharge section Q2 and the X-axis direction (horizontal direction). This makes it possible to efficiently change the attitude of the chips Ts discharged from the chute 14 and received in the recovery passage 21 through the chip receiving opening 21a.

[0044] 6(c), when the recovery path 21 is viewed from the conveying opening 22K side (side view), the air discharged from the discharge port Qa is discharged in a horizontal direction or a diagonally upward direction. That is, the angle θz1 between the air discharge direction of the first air discharge part Q1 and the horizontal plane and the angle θz2 between the air discharge direction of the second air discharge part Q2 and the horizontal plane are set to 0 degrees or greater than 0 degrees. This makes it possible to efficiently change the attitude of the chips Ts discharged from the chute 14 and received in the recovery path 21 through the chip receiving opening 21a.

[0045] In this way, the air discharge part Q having the first air discharge part Q1 and the second air discharge part Q2 discharges air toward the chips Ts received in the recovery path 21, constituting a posture changing part U2 that changes the posture of the chips Ts received in the recovery path 21. Note that the posture changing part U that changes the posture of the chips Ts received in the recovery path 21 may be configured such that the first inclined part P1 and the first air discharge part Q1 are disposed on one side of the upstream end of the recovery path 21, and the second inclined part P2 and the second air discharge part Q2 are disposed on the other side.

[0046] 6(a), positive pressure (air) supplied from positive pressure source 27 through pipe 28 is supplied to conveying section 25, first air outlet Q1, and second air outlet Q2 via air valves S1, S2, and S3. The air valves S1, S2, and S3 are controlled by a mounting control device 8. The mounting control device 8 opens and closes air valves S1, S2, and S3 at predetermined timings to discharge air from conveying section 25, first air outlet Q1, and second air outlet Q2.

[0047] 7, a method of transporting the chips Ts in which the mounting control device 8 controls the air valves S1, S2, and S3 to transport the chips Ts in the recovery path 21 will be described. At time T0, the cutter 15 is stopped, none of the sensors 2a of the multiple tape feeders 2 mounted on the feeder cart 3 has detected the end of the tape material T, and the air valves S1, S2, and S3 are closed. That is, at time T0, air is not being discharged from the transport unit 25, the first air discharge unit Q1, or the second air discharge unit Q2.

[0048] The mounting control device 8 monitors the length of the empty tape material T discharged from each of the multiple tape feeders 2 mounted on the feeder cart 3. When the length of the empty tape material T discharged from any of the multiple tape feeders 2 mounted on the feeder cart 3 reaches a predetermined length since the previous cutting by the cutter 15, the mounting control device 8 controls the cutter 15 to cut the empty tape material T discharged from the multiple tape feeders 2 all at once.

[0049] 7, in this example, the length of the empty tape material T discharged from any one of the multiple tape feeders 2 mounted on the feeder cart 3 at time T1 has reached a predetermined length. Therefore, the mounting control device 8 operates the cutter 15 between time T1 and time T2. As a result, the empty tape material T discharged from the multiple tape feeders 2 mounted on the feeder cart 3 is cut, and chips Ts of the predetermined length or shorter than the predetermined length fall from the chute 14 through the chip receiving opening 21a into the recovery path 21 (discharging process).

[0050] The mounting control device 8 waits for a predetermined waiting time Td after stopping the operation of the cutter 15 at time T2, and opens the air valve S2 (first air valve) to discharge air from the first air discharge part Q1 (position change process) from time T3 to time T4 when the cut chips Ts have fallen into the recovery path 21. Next, the mounting control device 8 opens the air valve S3 (second air valve) to discharge air from the second air discharge part Q2 (position change process) from time T4 to time T5.

[0051] That is, the timing of air discharge from the first air discharge part Q1 is different from the timing of air discharge from the second air discharge part Q2. This efficiently changes the position of the chips Ts received in the recovery path 21, and the chips Ts caught in the chip receiving opening 21a, etc., fall to the bottom surface 21d of the recovery path 21. Also, by making the discharge timing different, the amount of positive pressure (air) supplied by the positive pressure source 27 through the pipe 28 can be saved.

[0052] 7, the mounting control device 8 then opens the air valve S1 (transport air valve) to discharge air from the transport section 25 during the period from time T5 to time T6. As a result, the chips Ts whose position has been changed are transported downstream in the recovery path 21 and transported from the transport opening 22K into the transport path 22 (transport step). The chips Ts transported into the transport path 22 are transported to the storage section 24 by air supplied from the positive pressure source 27 and are collected in the storage box 32 (collection step).

[0053] 7, between time T7 and time T8, one of the sensors 2a of the multiple tape feeders 2 mounted on the feeder cart 3 detects the end of the tape material T. The mounting control device 8 waits for an elapsed time Tt from when the end of the tape material T passes the sensor 2a until it is discharged from the tape feeder 2 (discharge process), and then opens air valve S2, air valve S3, and air valve S1 in that order.

[0054] Specifically, between time T9 and time T10, which is an elapsed time Tt from time T7, the air valve S2 (first air valve) is opened to discharge air from the first air discharge unit Q1, and between time T10 and time T11, the air valve S3 (second air valve) is opened to discharge air from the second air discharge unit Q2 (position change process). That is, the first air discharge unit Q1 and the second air discharge unit Q2 discharge air after a predetermined time has elapsed (after the elapsed time Tt) after the end of the tape material T is detected in the tape feeder 2. This allows even chips Ts at the end longer than a predetermined length to be received in the recovery path 21 by appropriately changing their position.

[0055] In FIG. 7, next, between time T11 and time T12, the mounting control device 8 opens the air valve S1 (transport air valve) to eject air from the transport section 25, and transports the chips Ts at the end portion downstream within the recovery path 21 (transport process).

[0056] As described above, the chip collection method for collecting chips Ts of the tape material T discharged from the chute 14 of the component mounting devices M1 to M3 by the chip collection device 20 equipped with the position changing unit U2 discharges the chips Ts from the chute 14 to the chip receiving opening 21a (opening) of the collection path 21 (discharge step), changes the position of the chips Ts received in the collection path 21 by discharging air from the air discharge unit Q (first air discharge unit Q1, second air discharge unit Q2) (position changing step), and transports the chips Ts whose position has been changed within the collection path 21 (transport step). This makes it possible to properly collect chips Ts with terminal ends longer than a predetermined length and chips Ts that are warped.

[0057] As described above, the chip collection device 20 of this embodiment includes the collection path 21 that receives the chips Ts discharged from the chute 14 through the chip receiving opening 21a (opening), the attitude changing unit U that changes the attitude of the chips Ts received in the collection path 21, and the transport unit 25 that transports the chips Ts whose attitude has been changed within the collection path 21. This makes it possible to properly collect the chips Ts of the tape material T that is warped or the like.

[0058] The above describes a configuration in which the chip collection device 20, which is equipped with a collection path 21 that transports the chips Ts discharged from the chute 14 to the conveying path 22, collects the chips Ts. However, the chips Ts discharged from the chute 14 may also be collected by storing them in chip storage boxes installed below the chutes 14.

[0059] An example of the chip collection box 33 will now be described with reference to Fig. 8. The chip collection box 33, which collects chips Ts of the tape material T discharged from the chute 14 of the component mounting devices M1 to M3, includes a receiving section 34 that receives the chips discharged from the chute 14 through the chip receiving opening 21a (opening), and a position changing section U that changes the position of the chips Ts received in the receiving section. This allows chips Ts of the tape material T that are warped or the like to be appropriately collected in the chip collection box 33. An operator makes a round to collect the chips Ts stored in the chip collection boxes 33 installed on the component mounting devices M1 to M3. [Industrial Applicability]

[0060] INDUSTRIAL APPLICABILITY The scrap collection device, scrap collection box, component mounting system, and scrap collection method of the present invention have the effect of being able to properly collect scraps of tape materials, and are useful in the field of mounting components on circuit boards. [Explanation of symbols]

[0061] 1 Component placement system 2 Tape Feeder 14 Shooter 20 Chip collection device 21 Recovery Route 21a Chip receiving opening (opening) 25 Conveyor 33 Chip collection box M1~M3 Component placement device P slope part P1 1st slope P2 2nd slope Ps slope Pa Base Q Air outlet Q1 First air outlet Q2 Second air outlet T tape material Ts chips U, U1, U2 attitude change section

Claims

1. A chip collection device for collecting chips of a tape member discharged from a chute of a component mounting device having a tape feeder that supplies components using the tape member, comprising: a recovery passage that receives the chips discharged from the chute through an opening; a position changing unit that changes the position of the chips received in the recovery path; A chip collection device comprising: a transport section that transports the chips, the position of which has been changed, through the collection path.

2. the attitude changing portion is an inclined portion having an inclined surface, The inclined surface is provided at a position where the chips that have passed through the opening come into contact with the inclined surface, In a plan view, a bottom side of the inclined surface is along a direction inclined from a conveying direction of the chips, The chip collecting device according to claim 1 , wherein the inclined surface extends obliquely upward from the bottom side and in a direction approaching an upstream side in a chip transport direction.

3. The chip collection device according to claim 2 , wherein an angle between a bottom surface of the collection path and the inclined surface is equal to or greater than 45 degrees and less than 90 degrees.

4. The inclined portion includes a first inclined portion and a second inclined portion, The chip collecting device according to claim 2 or 3, wherein the first inclined portion and the second inclined portion are provided spaced apart from each other at an end of the collection path on an upstream side in a chip transport direction.

5. the position changing unit is an air discharge unit that discharges air toward the chips received in the collection path, The chip collection device according to claim 1 , wherein, in a plan view, a direction in which the air is discharged intersects with a direction in which the chips are transported.

6. The chip collecting device according to claim 5 , wherein the air is discharged in a horizontal direction or an obliquely upward direction in a side view.

7. The air discharge portion includes a first air discharge portion and a second air discharge portion, The chip collection device according to claim 6 , wherein the first air discharge portion and the second air discharge portion are respectively provided at both ends of the collection path in a direction perpendicular to the chip transport direction in a horizontal plane.

8. The chip collection device according to claim 7 , wherein an angle formed between the air ejection direction of the first air ejection portion and the horizontal direction is different from an angle formed between the air ejection direction of the second air ejection portion and the horizontal direction.

9. The chip collecting device according to claim 7 , wherein a timing at which the first air discharge portion discharges the air is different from a timing at which the second air discharge portion discharges the air.

10. The chip collection device according to claim 7 , wherein the first air discharge section and the second air discharge section discharge the air a predetermined time after a terminal end of the tape material is detected in the tape feeder.

11. A chip collection box for collecting chips of a tape member discharged from a chute of a component mounting device having a tape feeder that supplies components using the tape member, a receiving portion that receives the chips discharged from the chute through an opening; A chip storage box comprising: a position change section that changes the position of the chips received in the receiving section.

12. A component mounting system comprising: a component mounting device having a tape feeder that supplies components using a tape member; and a chip collection device that collects chips of the tape member discharged from a chute of the component mounting device, The chip collection device includes: a recovery passage that receives the chips discharged from the chute through an opening; a position changing unit that changes the position of the chips received in the recovery path; a conveying section that conveys the chips, the orientation of which has been changed, through the collection path.

13. 1. A scrap collection method for collecting scraps of a tape member discharged from a chute of a component mounting apparatus having a tape feeder that supplies components using a tape member, comprising: a discharge step of discharging the chips from the chute to an opening of a recovery passage; a posture changing step of changing a posture of the chips received in the recovery path; and a transporting step of transporting the chips whose attitude has been changed within the collection path.

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