Mounting head, mounting apparatus, and method for manufacturing electronic device

Abstract

To provide a mounting head capable of applying a low load to an electronic component with good control when mounting the electronic component on a substrate.SOLUTION: A mounting head according to the present invention includes a drive unit 10 that moves vertically and applies a load to an electronic component, a float unit 20 supported on the drive unit so as to be freely movable vertically, and a linear motor 30 that applies a vertically upward pressing force to the float unit, with a stator 30A of the linear motor fixed to the drive unit and a mover 30B of the linear motor fixed to the float unit, and the electronic component is mounted on a substrate by moving the drive unit vertically downward, and the magnitude of the load applied to the electronic component is controlled by the pressing force.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a mounting head that mounts electronic components such as semiconductor chips onto a substrate, a mounting apparatus that uses the same, and a method for manufacturing an electronic device in which electronic components are mounted onto a substrate using a mounting head. [Background technology]

[0002] 2. Description of the Related Art When mounting electronic components on a substrate, a mounting head that uses a voice coil motor (linear motor) is known as a mounting head that can apply a low load to the electronic components (see, for example, Patent Document 1).

[0003] The voice coil motor described in Patent Document 1 is composed of a stator fixed to a motor holder and a mover connected to a mounting tool that holds electronic components. By driving the voice coil motor, the mounting tool connected to the mover is lowered toward the board, thereby pressing the electronic component held by the mounting tool against the board. By controlling the drive current of the voice coil motor at this time, a relatively small load can be applied to the electronic component. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-408211 A Summary of the Invention [Problem to be solved by the invention]

[0005] When mounting small, thin electronic components on a substrate, if an excessive load is applied to the electronic components, the electronic components may crack. Therefore, it is necessary to control the load applied to the electronic components to a low load.

[0006] Although the use of a voice coil motor makes it possible to apply a low load to electronic components, it is not possible to control a load below the resolution that the voice coil motor can output. Therefore, it is difficult to apply a low load that will not break electronic components that are becoming smaller and thinner, and there is a demand for a mounting head that can apply an even lower load.

[0007] The present invention has been made in consideration of the above-mentioned points, and its main object is to provide a mounting head that can apply a low load to an electronic component in a well-controlled manner when mounting the electronic component on a board. [Means for solving the problem]

[0008] The mounting head of the present invention is a mounting head for mounting an electronic component on a substrate, and comprises a drive unit that moves vertically and applies a load to the electronic component, a float unit supported on the drive unit so as to be freely movable vertically, a linear motor that applies a vertically upward pressing force to the float unit, and a mounting tool fixed to the float unit and holding the electronic component, wherein the stator of the linear motor is fixed to the drive unit and the mover of the linear motor is fixed to the float unit, and the electronic component is mounted on the substrate by moving the drive unit vertically downward, and the magnitude of the load applied to the electronic component is controlled by the pressing force. Effect of the Invention

[0009] According to the present invention, it is possible to provide a mounting head that can apply a low load to an electronic component with good control when mounting the electronic component on a substrate. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing a configuration of a mounting device equipped with a mounting head in one embodiment of the present invention. [Diagram 2] 2 is a diagram showing a schematic configuration of a mounting head according to the present embodiment. FIG. [Diagram 3]1A to 1D are diagrams illustrating the process of mounting electronic components on a substrate using the mounting head in this embodiment. [Figure 4] 13 is a diagram showing a configuration of a mounting head in a first modified example of the present invention. FIG. [Diagram 5] 10A to 10C are diagrams illustrating a process of mounting electronic components on a board using a mounting head in Modification 1. [Figure 6] 13 is a diagram showing the configuration of a mounting head in a second modified example of the present invention. FIG. [Figure 7] 13(A) to 13(D) are diagrams illustrating the process of mounting electronic components on a board using a mounting head in Modification 2. [Figure 8] 13 is a diagram showing another configuration of the mounting device including the mounting head in the present embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the following embodiment. In addition, appropriate modifications are possible without departing from the scope of the effects of the present invention.

[0012] FIG. 1 is a diagram showing the configuration of a mounting device equipped with a mounting head in one embodiment of the present invention.

[0013] 1, the mounting apparatus 100 includes a mounting head 110 that picks up electronic components and mounts them on a substrate. The mounting head 110 includes a mounting tool 40 that picks up and holds electronic components, and is controlled to move in a horizontal direction by a drive shaft 120. The mounting head 110 moves to above a component supply stage 140 and picks up an electronic component 150, and then moves to above a mounting stage 130, where the mounting head 110 is lowered to mount the electronic component 150 held by the mounting tool 40 on a substrate 160.

[0014] FIG. 2 is a diagram showing a schematic configuration of the mounting head 110 in this embodiment.

[0015] As shown in FIG. 2, the mounting head 110 includes a drive unit 10 that moves vertically and applies a load to the electronic component, a float unit 20 supported by the drive unit 10 so as to be freely movable vertically, a linear motor 30 that applies a vertically upward pressing force to the float unit 20, and a mounting tool 40 that is fixed to the float unit 20 and holds the electronic component.

[0016] A servo motor 60 that controls the movement of the drive unit 10 in the vertical direction is fixed to a frame 63 of the mounting device 100 via a base member 61. A ball screw 62 is connected to the output shaft of the servo motor 60, and the ball screw 62 is fixed to a head base 10A of the drive unit 10. The drive unit 10 is connected to a guide rail 64 that guides the movement of the drive unit 10 in the vertical direction. This allows the drive unit 10 to move in the vertical direction by being driven by the servo motor 60.

[0017] The float portion 20 is supported by the drive portion 10 via a leaf spring 50 so as to be movable in the vertical direction. The horizontal movement of the float portion 20 is restricted by the leaf spring 50. The leaf spring 50 is preferably a member that exhibits low sliding resistance with respect to vertical movement.

[0018] The linear motor 30 is composed of a stator 30A in which a permanent magnet is arranged, and a mover 30B made of a coil arranged inside the stator 30A. The stator 30A is fixed to the driving unit 10, and the mover 30B is fixed to the float unit 20. When the coil is energized, the stator 30A can apply a vertically upward pressing force to the mover 30B. As a result, when the coil is energized, a vertically upward pressing force can also be applied to the float unit 20 to which the mover 30B is fixed. For example, a voice coil motor or the like can be used as the linear motor 30.

[0019] The mounting tool 40 is connected to the float portion 20 so as to be located at the lower tip of the mounting head 110, and can suck and hold electronic components by a vacuum suction method or the like.

[0020] In this embodiment, the electronic component is mounted on the board by moving the drive unit 10 vertically downward and applying the load due to the weight of the float unit 20 to the electronic component. At the same time, the linear motor 30 is driven to apply a vertically upward pressing force to the float unit 20. As a result, a load obtained by subtracting the vertically upward pressing force applied to the float unit 20 from the load due to the weight of the float unit 20 is actually applied to the electronic component. In other words, the magnitude of the load applied to the electronic component is controlled by the vertically upward pressing force applied to the float unit 20 by driving the linear motor 30.

[0021] According to this embodiment, by setting the vertically upward pressing force applied to the float portion 20 to a value close to the load due to the weight of the float portion 20, even a very small load of 0.1 N or less can be applied with good control to the electronic component when mounting the electronic component on the board. This makes it possible to prevent the electronic component from cracking even when a very small and thin electronic component is mounted on the board.

[0022] In this embodiment, since the mover 30B of the linear motor 30 is fixed to the float portion 20, the "load due to the weight of the float portion 20" refers to the load including the load of the mover 30B.

[0023] Next, with reference to FIGS. 3(A) to 3(D), a process for mounting electronic components on a substrate using the mounting head 110 of this embodiment will be described.

[0024] 3(A) shows the mounting head 110 in a standby state, in which the mounting head 110 moves horizontally and the electronic component 150 held by the mounting tool 40 is positioned above the substrate 160 placed on the mounting stage 130. At this time, the drive unit 10 is in an elevated state, the linear motor 30 is not driven for reasons that will be described later, and the float unit 20 is in a lower limit state due to a load F caused by its own weight.

[0025] Next, as shown in FIG. 3(B), drive the linear motor 30 to apply an upward vertical pushing force T to the float portion 20. At this time, the float portion 20 rises slightly from the lower limit state.

[0026] Next, as shown in FIG. 3(C), drive the servo motor 60 to lower the drive portion 10, bring the electronic component 150 into contact with the substrate 160, and push in the mounting tool 40. At this time, the float portion 20 rises by the amount of pushing, and a load obtained by subtracting the pushing force T (T < F) applied to the float portion 20 from the load F due to the self-weight of the float portion 20 is applied to the electronic component 150.

[0027] Next, as shown in FIG. 3(D), release the holding of the electronic component 150 by the mounting tool 40, mount the electronic component 150 on the substrate 160, and then drive the servo motor 60 to raise the drive portion 10. During the raising of the drive portion 10, the driving of the linear motor may be released.

[0028] According to the present embodiment, by applying the upward vertical pushing force T to the float portion 20 by the linear motor 30 at least before moving the drive portion 10 downward in the vertical direction and applying the load F due to the self-weight of the float portion 20 to the electronic component 150, when the electronic component 150 is brought into contact with the substrate 160, it is possible to prevent the load F due to the self-weight of the float portion 20 from being suddenly applied to the electronic component 150.

[0029] In the present embodiment, the "standby state of the mounting head" includes at least a state in which the mounting head 110 moves to above the component supply stage 140 in order to pick up the electronic component 150, and a state in which the mounting head 110 moves to above the mounting stage 130 in order to mount the picked-up electronic component 150 on the substrate.

[0030] However, if the linear motor 30 is constantly driven, the coil of the mover 30B generates heat, which changes the magnetic flux density of the permanent magnet arranged in the stator 30A. This makes the output of the linear motor 30 unstable, reducing the accuracy of the pressing force T applied to the float portion 20, and as a result, the accuracy of the load applied to the electronic component 150 during mounting also reduces. Therefore, when the mounting head 110 is in a standby state, it is preferable to cancel the driving of the linear motor 30 and not apply the pressing force T in the vertical upward direction to the float portion 20.

[0031] (Variation 1 of the present invention) In the above embodiment, the float portion 20 is supported by the drive unit 10 via the leaf spring 50 so as to be freely movable in the vertical direction, so there is a risk of the float portion 20 vibrating when the mounting head 110 moves horizontally or vertically at high speed. If vibration occurs in the float portion 20, problems may occur such as the vertical height position of the mounting tool 40 becoming unstable or the electronic component 150 held by the mounting tool 40 falling.

[0032] FIG. 4 is a diagram showing the configuration of a mounting head 110 that can suppress such vibration of the float portion 20. As shown in FIG.

[0033] 4, in the present modified example 1, the drive unit 10 is provided with a biasing means 70 that biases the float unit 20 vertically downward. Specifically, the compression spring 70 is disposed between the head base 10A of the drive unit 10 and the float unit 20.

[0034] In this way, by constantly biasing the float portion 20 with a vertically downward force by the compression spring 70, vibration of the float portion 20 can be suppressed.

[0035] Since the configuration other than the above is the same as the configuration of the mounting head 110 shown in FIG. 2, the same reference numerals are used and the description thereof is omitted.

[0036] FIG. 5 is a diagram corresponding to the mounting process shown in FIG. 3(C), showing a state in which the servo motor 60 is driven to lower the driving unit 10, bring the electronic component 150 into contact with the substrate 160, and push in the mounting tool 40. At this time, a load obtained by subtracting the pressing force T (T < F + R) applied to the floating unit 20 from the combined load (F + R) of the load F due to the self-weight of the floating unit 20 and the biasing force R due to the compression spring 70 is applied to the electronic component 150.

[0037] In addition, since the mounting processes other than the above are the same as the mounting processes shown in FIGS. 3(A) to 3(D), the description thereof is omitted.

[0038] (Modification Example 2 of the Present Invention) FIG. 6 is a diagram showing another configuration of the mounting head 110 that can suppress the vibration of the floating unit 20.

[0039] As shown in FIG. 6, the driving unit 10 has a first extending portion (head base) 10A extending in the horizontal direction, and the floating unit 20 is located vertically above the first extending portion 10A and has a second extending portion 20A having a portion overlapping the first extending portion 10A in the vertical direction. Further, a mechanical stopper 80 having a spherical surface is provided on the second extending portion 20A.

[0040] In this modification example 2, in the standby state of the mounting head, due to the self-weight of the floating unit 20, the mechanical stopper 80 provided on the second extending portion 20A comes into contact with the first extending portion 10A, thereby restricting the movement of the floating unit 20 in the vertical direction. As a result, the vibration of the floating unit 20 can be suppressed.

[0041] Note that since the mechanical stopper 80 repeatedly contacts the first extending portion (head base) 10A, it is preferable that both are made of a material with high rigidity such as steel so that the position of the floating unit 20 does not fluctuate due to deformation of the member.

[0042] In addition, if the parallelism of the mutually facing surfaces of the first extending portion 10A and the second extending portion 20A is high and both are made of a material with high rigidity, the mechanical stopper 80 may not be provided on the second extending portion 20A, and the first extending portion 10A and the second extending portion 20A may be brought into direct contact with each other.

[0043] In addition, since the configuration other than the above is the same as the configuration of the mounting head 110 shown in FIG. 2, the same reference numerals are given and the description thereof is omitted.

[0044] FIGS. 7(A) to 7(D) are diagrams for explaining the process of mounting an electronic component on a substrate using the mounting head 110 in the second modification.

[0045] FIG. 7(A) shows the standby state of the mounting head 110, and the electronic component 150 held by the mounting tool 40 is located on the substrate 160 placed on the mounting stage 130. At this time, the linear motor 30 is not driven, and the float portion 20 is in contact with the first extending portion 10A of the driving portion 10 by the load F of its own weight, and the movement in the vertical direction is restricted.

[0046] Next, as shown in FIG. 7(B), the linear motor 30 is driven to apply an upward vertical pushing force T to the float portion 20. At this time, by setting the load F due to the own weight of the float portion 20 to be larger than the pushing force T applied to the float portion 20, the movement of the float portion 20 in the vertical direction is restricted.

[0047] Next, as shown in FIG. 7(C), the servo motor 60 is driven to lower the driving portion 10, bring the electronic component 150 into contact with the substrate 160, and push in the mounting tool 40. At this time, the float portion 20 rises by the amount of pushing in, the mechanical stopper 80 moves away from the driving portion 10, and a load obtained by subtracting the pushing force T (T < F) applied to the float portion 20 from the load F due to the own weight of the float portion 20 is applied to the electronic component 150.

[0048] 7(D), the mounting tool 40 releases the electronic component 150, and the electronic component 150 is mounted on the board 160. The servo motor 60 is then driven to raise the drive unit 10. At this time, the load F due to the weight of the float unit 20 is set to be greater than the pressing force T applied to the float unit 20, thereby restricting the movement of the float unit 20 in the vertical direction. Note that the drive of the linear motor may be released while the drive unit 10 is being raised.

[0049] FIG. 8 is a diagram showing another configuration of the mounting apparatus 100 equipped with the mounting head 110 shown in the above embodiment.

[0050] 8, the mounting apparatus 100 is made up of a mounting head 110, a mounting stage 130, a component supply stage 140, and a stage drive shaft 170. The mounting stage 130 and the component supply stage 140 are each installed on the stage drive shaft 170, and can move horizontally to a position directly below the mounting head 110.

[0051] The electronic component 150 is picked up by transporting the component supply stage 140, on which the electronic component 150 is mounted, to directly below the mounting head 110 by the stage drive shaft 170. The electronic component 150 is mounted on the board by transporting the mounting stage 130, on which the board 160 is mounted, to directly below the mounting head 110 by the stage drive shaft 170.

[0052] In the mounting apparatus 100 configured as above, there is no need to move the mounting head 110 in the horizontal direction at high speed, so vibration of the float portion 20 caused by the movement of the mounting head 110 can be suppressed.

[0053] Using the mounting head 110 in this embodiment, an electronic device can be manufactured in which an electronic component 150 is mounted on a substrate 160. In this case, the method for manufacturing the electronic device includes a step of moving the drive unit 10 vertically downward, and a step of applying a pressing force vertically upward to the float unit 20 by driving the linear motor 30, and controlling the load applied to the electronic component 150 by the weight of the float unit 20 with the pressing force, thereby mounting the electronic component 150 on the substrate 160.

[0054] Although the present invention has been described above with reference to the preferred embodiments, such description is not limiting and, of course, various modifications are possible. [Explanation of symbols]

[0055] 10 Drive unit 10A Head base (first extension) 20 Float section 20A 2nd extension 30 Linear motor 30A stator 30B Mover 40 Implementation Tools 50 Leaf spring 60 Servo motor 61 Base material 63 Frames 64 Guide Rail 70 Compression spring (biasing means) 80 Mecha Stopper 100 Mounting device 110 Mounting head 120 Drive shaft 130 Implementation Stage 140 Parts supply stage 150 Electronic Components 160 Substrate 170 Stage drive axis

Claims

1. A mounting head for mounting electronic components on a substrate, a drive unit that moves in a vertical direction and applies a load to the electronic component; a float portion supported by the drive portion so as to be movable in a vertical direction; A linear motor that applies a vertically upward pressing force to the float portion; a mounting tool fixed to the float portion and holding the electronic component; Equipped with a stator of the linear motor is fixed to the drive section, and a mover of the linear motor is fixed to the float section, The electronic component is mounted on the substrate by moving the drive unit vertically downward. A mounting head, wherein the magnitude of the load applied to the electronic component is controlled by the pressing force.

2. 2. The mounting head of claim 1, wherein the linear motor applies a vertically upward pressing force to the float portion at least before the drive portion is moved vertically downward to apply a load due to the weight of the float portion to the electronic component.

3. 3. The mounting head according to claim 1, wherein the float portion is supported by the drive portion via a leaf spring so as to be movable vertically.

4. 4. The mounting head according to claim 1, wherein when the mounting head is in a standby state, no vertically upward pressing force is applied to the float portion by the linear motor.

5. 5. The mounting head according to claim 1, wherein the drive portion further comprises a biasing means for biasing the float portion vertically downward.

6. The drive unit has a first extension unit extending in a horizontal direction, the float portion is located vertically above the first extension portion and has a second extension portion having a portion that overlaps with the first extension portion in the vertical direction, 5. The mounting head according to claim 1, wherein when the mounting head is in a standby state, the second extension portion comes into contact with the first extension portion, thereby restricting vertical movement of the float portion.

7. The second extension portion is provided with a mechanical stopper having a spherical surface, The mounting head according to claim 6 , wherein, when the mounting head is in a standby state, the mechanical stopper provided on the second extension portion comes into contact with the first extension portion, thereby restricting vertical movement of the float portion.

8. A mounting head according to any one of claims 1 to 7; a horizontal movement mechanism for horizontally moving the mounting head.

9. A manufacturing method of an electronic device in which electronic components are mounted on a substrate using a mounting head, comprising the steps of: The mounting head includes: a drive unit that moves in a vertical direction and applies a load to the electronic component; a float portion supported by the drive portion so as to be movable in a vertical direction; A linear motor that applies a vertically upward pressing force to the float portion; a mounting tool fixed to the float portion and holding the electronic component; Equipped with a stator of the linear motor is fixed to the drive section, and a mover of the linear motor is fixed to the float section, moving the drive unit vertically downward; a step of applying a pressing force vertically upward to the float portion by driving the linear motor, and controlling a load applied to the electronic component by the pressing force, thereby mounting the electronic component on the board; A method for manufacturing an electronic device comprising the steps of:

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