Processing device

Abstract

To provide a processing device in which a region that is larger than the size of a processed material is not processed without setting a margin width in the case where a processing is made along a division schedule line of the processed material.SOLUTION: A processing device is a processing device that performs a processing along a division schedule line to a processed material in which a device is formed to a plurality of regions segmented by a first division schedule line and a second division schedule line. The processing device comprises a controller that includes a first storage part that stores a first image of a key pattern that becomes a mark when performing a processing of a processed material by obtaining an image obtained by imaging a specific region of the processed material with an imaging unit and a position of the key pattern, and a second storage part that stores a position relation from the position of the key pattern to a processing start position of an X-shaft direction where a processing is started in a processing unit. After the processed material held to a holding table is imaged by the imaging unit, and the key pattern is detected, the processing is executed by the processing unit from the processing start position on the basis of the position relation stored by the second storage part.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a processing device. [Background technology]

[0002] There is known a cutting device (processing device) that processes a workpiece having a device formed in an area partitioned by a planned division line by holding the workpiece on a holding table and cutting and feeding the workpiece along the planned division line with a cutting unit (processing unit) having a rotatable cutting blade. For example, Patent Document 1 discloses a cutting device that sets a margin width on both ends of the planned cutting line to set a cutting start position and a cutting end position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-185644 A Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional processing devices, the distance between both ends of the line to be cut is set based on the distance based on the center of the holding table. Therefore, if the distance between both ends to be cut is set to a distance that does not allow for a margin relative to the size of the workpiece, and the workpiece is held offset from the center of the holding table, an area that is not cut will occur. Therefore, in conventional processing devices, a margin width is set in addition to the size of the workpiece on the cutting start position side and the cutting end position side at both ends of the line to be cut, and an area larger than the size of the workpiece is set as the cutting area. However, in conventional processing devices, when a margin width is set to cut an area larger than the size of the workpiece, the excess processing distance increases, resulting in a problem of reduced productivity.

[0005] The present invention has been made in consideration of the above, and its object is to provide a processing device that, when processing along the planned dividing line of the workpiece, does not process an area larger than the size of the workpiece without setting a margin width. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the processing apparatus of the present invention is a processing apparatus that processes a workpiece along a planned dividing line, the workpiece having devices formed in a plurality of regions partitioned on a surface by a first planned dividing line extending in a first direction and a second planned dividing line extending in a second direction perpendicular to the first planned dividing line, the processing apparatus comprising: a holding table that holds the workpiece on a holding surface; a processing unit that processes the workpiece held on the holding table at least along the first planned dividing line; a moving unit that relatively moves the holding table and the processing unit in an X-axis direction parallel to the holding surface in order to process the workpiece along the first planned dividing line; and a controller for controlling each of the components, the controller having a first memory section for storing a first image of a key pattern serving as a guide when processing the workpiece and a position of the key pattern by acquiring an image of a specific area of ​​the surface of the workpiece captured by the imaging unit, and a second memory section for storing a positional relationship from the position of the key pattern to a processing start position in the X-axis direction where processing is started by the processing unit, and is characterized in that after the workpiece held on the holding table is imaged by the imaging unit and the key pattern is detected, processing is performed by the processing unit from the processing start position based on the positional relationship stored in the second memory section.

[0007] In the above-mentioned processing device, the controller may have a third memory unit which stores the position at which processing ends in the X-axis direction based on the position of the key pattern, or the distance from the processing start position in the X-axis direction to the position at which processing ends.

[0008] In the above-mentioned processing device, the processing unit may be a cutting unit including a rotatable cutting blade.

[0009] The above-mentioned processing apparatus includes a Z-axis direction moving unit which moves the holding table and the processing unit relatively in the Z-axis direction perpendicular to the holding surface, and when processing is performed from the processing start position using the cutting blade of the cutting unit, the rotated cutting blade is moved by the Z-axis direction moving unit from above the processing start position to a predetermined height to cut into the workpiece, and at the predetermined height, the cutting blade is moved relatively in the X-axis direction by the moving unit to perform processing. Effect of the Invention

[0010] The processing apparatus of the present invention has the advantage of being able to provide a processing apparatus that, when processing along the planned dividing line of the workpiece, does not process an area larger than the size of the workpiece without setting a margin width. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view that illustrates a configuration example of a processing device according to an embodiment. [Diagram 2] FIG. 2 is a plan view showing a configuration example of a workpiece to be processed by the processing device according to the embodiment. [Diagram 3] FIG. 3 is a block diagram illustrating an example of a functional configuration of the processing device according to the embodiment. [Figure 4] FIG. 4 is a diagram for explaining an example of registration of a key pattern of a workpiece in the processing apparatus shown in FIG. [Diagram 5] FIG. 5 is a diagram for explaining an example of registration of the processing end position for the key pattern shown in FIG. [Figure 6] FIG. 6 is a flowchart showing an example of a processing procedure of a teaching method executed by the processing device. [Figure 7] FIG. 7 is a flowchart illustrating an example of a processing procedure of the processing control executed by the processing device. [Figure 8] FIG. 8 is a diagram for explaining an example of the processing control shown in FIG. [Figure 9] FIG. 9 is a diagram for explaining problems that arise when a conventional processing device processes a plurality of workpieces by setting a margin width. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0013] In the embodiment described below, an XYZ Cartesian coordinate system is set, and the positional relationship of each part is described with reference to this XYZ Cartesian coordinate system. One direction in a horizontal plane is the X-axis direction, a direction perpendicular to the X-axis direction in the horizontal plane is the Y-axis direction, and a direction perpendicular to both the X-axis direction and the Y-axis direction is the Z-axis direction. The XY plane including the X-axis and Y-axis is parallel to the horizontal plane. The Z-axis direction perpendicular to the XY plane is the vertical direction.

[0014] [Embodiment] The processing device according to the embodiment will be described with reference to the drawings. Fig. 1 is a perspective view showing a typical configuration example of the processing device according to the embodiment. Fig. 2 is a plan view showing a typical configuration example of a workpiece processed by the processing device according to the embodiment. Fig. 3 is a block diagram showing a typical example of a functional configuration of the processing device according to the embodiment.

[0015] As shown in Fig. 1, the processing apparatus 10 according to the embodiment is a cutting apparatus that cuts a workpiece 100 along a first planned division line 102 and a second planned division line 103 (see Fig. 2). The processing apparatus 10 basically includes a holding table 11 that holds the workpiece 100, an imaging unit 12, a processing unit 13, a moving unit 14, a Z-axis direction moving unit 15, and a controller 40. The controller 40 is electrically connected to the holding table 11, the imaging unit 12, the processing unit 13, the moving unit 14, and the Z-axis direction moving unit 15.

[0016] As shown in FIG. 2, the workpiece 100 is attached to the surface of an adhesive tape 107 attached to an annular frame 108. The workpiece 100 is partitioned into a plurality of regions by a plurality of first division lines 102 and a plurality of second division lines 103 formed in a lattice pattern on the surface 101, and devices 104 having semiconductor chip configurations such as ICs and LSIs are formed in the partitioned regions. The plurality of first division lines 102 are lines extending along a first direction 111 and are arranged at a predetermined interval in a second direction 112. The plurality of second division lines 103 are lines extending along the second direction 112 and are arranged at a predetermined interval in the first direction 111. The workpiece 100 thus configured has its back surface attached to the adhesive tape 107 attached to the annular frame 108 with the surface 101 facing up.

[0017] In this embodiment, the workpiece 100 is formed in a rectangular plate shape, and a plurality of first planned division lines 102 and a plurality of second planned division lines 103 are formed in each of two regions of the surface 101. Note that the workpiece 100 is not limited to a rectangular plate shape, and may be formed in a shape such as a circle, an ellipse, or a square.

[0018] Returning to FIG. 1, the holding table 11 has a holding surface 11-1 for suction-holding the workpiece 100, and is connected to a motor 19 so as to be rotatable. The holding table 11 includes, for example, a chuck table. The holding table 11 has a holding portion formed of, for example, a porous ceramic having a large number of porous holes, and is configured to suction-hold the workpiece 200 placed on the holding surface 11-1 by negative pressure introduced from a vacuum suction source (not shown). The holding table 11 is also configured to be movable in the X-axis direction, which is horizontal to the holding surface 11-1, by an X-axis moving means 22 having a well-known configuration including a ball screw 20, a nut, a pulse motor 21, etc. As a result, the processing device 10 can move the workpiece 100 held on the holding table 11 in the X-axis direction relative to the imaging unit 12 and the processing unit 13.

[0019] The imaging unit 12 is a microscope camera unit equipped with an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The imaging unit 12 images the surface 101 of the workpiece 100 held on the holding surface 11-1 of the holding table 11. The imaging unit 12 can image the surface 101 of the workpiece 100 by switching between low magnification (Lo) macro imaging and high magnification (Hi) micro imaging. An area portion (street) to be cut is detected based on image information (key pattern) acquired by the imaging unit 12, and is used for positioning the processing operation by the processing unit 13. The imaging unit 12 may include, for example, a light source that irradiates illumination light onto the surface 101 of the workpiece 100 held on the holding surface 11-1 of the holding table 11. This light source can be composed of an epi-illumination light source that illuminates the workpiece 100 from directly above and an oblique light source that illuminates the workpiece 100 from an oblique direction.

[0020] The processing unit 13 cuts the workpiece 100 held on the holding surface 11-1 of the holding table 11 along a planned division line with a rotating ring-shaped extremely thin cutting blade 24 to form a cutting groove (kerf). The imaging unit 12 is integrated by being attached to and supported by a part of a housing 25 for the processing unit 13, and is provided so as to be movable in the Z-axis direction by a Z-axis movement unit 15.

[0021] The machining unit 13 has a spindle (not shown) housed in a housing 25 and rotatably supported by an air bearing. The spindle is rotated by a motor (not shown) housed in the housing 25. The cutting blade 24 is detachably attached to the tip of the spindle and rotates when the spindle is rotated.

[0022] The moving unit 14 relatively moves the holding table 11 and the processing unit 13 in the X-axis direction parallel to the holding surface 11-1 in order to process along the first planned division line 102. The moving unit 14 has an X-axis moving means 22 and a Y-axis moving means 27. The X-axis moving means 22 moves in the X-axis direction which is horizontal to the holding surface 11-1 of the holding table 11. The Y-axis moving means 27 moves the imaging unit 12 and the processing unit 13 in the Y-axis direction relative to the holding surface 11-1 of the holding table 11. The Y-axis moving means 27 is composed of a ball screw 28, a nut, a pulse motor 29, etc., and constitutes the moving unit 14 together with the X-axis moving means 22.

[0023] The Z-axis direction moving unit 15 relatively moves the holding table 11 and the processing unit 13 in the Z-axis direction perpendicular to the holding surface 11-1. The Z-axis direction moving unit 15 is composed of, for example, a ball screw, a nut, a pulse motor 26, etc.

[0024] The processing device 10 configured as described above cuts the cutting blade 24 rotated at high speed into the workpiece 100 to a predetermined cutting depth, while the holding table 11 is moved relatively in the X-axis direction with respect to the processing unit 13 by the X-axis moving means 22. This makes it possible to cut the division lines on the workpiece 100 and form cut grooves (kerfs). Next, the processing device 10 rotates the workpiece 100 by 90° by rotating the holding table 11, and then repeats the same cutting process with the processing unit 13 for all the new division lines arranged in the X-axis direction. This makes it possible to divide the workpiece 100 into individual devices 104.

[0025] 1 and 3, the processing device 10 further includes a display unit 17. Under the control of the controller 40, the display unit 17 displays an image of the surface 101 of the workpiece 100 captured by the imaging unit 12 and various information required for processing, and receives input operations and the like required for processing from an operator. The display unit 17 is disposed at a location on the housing of the processing device 10 that is easy to see and easy to operate. The display unit 17 includes a display device and an input device. The display unit 17 may be configured as a touch panel including a display device such as a liquid crystal display or an organic EL display, and a touch screen for specifying an input position or coordinates on the display surface of the display device.

[0026] The LED light 18 uses a plurality of display colors to notify the operating status of the processing device 10. The LED light 18 is configured to be able to light up or blink under the control of the controller 40.

[0027] The controller 40 includes an arithmetic processing device such as a CPU (Central Processing Unit), a storage device such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The controller 40 is a computer capable of executing a control program for controlling each of the above-mentioned components according to a series of processing steps performed by the processing device 10 using such devices. The controller 40 realizes the functions, actions, etc. of each part by executing the control program. The controller 40 controls the overall operation of the processing device 10 according to the processing conditions set by the operator via the display unit 17.

[0028] The controller 40 includes a first storage unit 41, a second storage unit 42, and a third storage unit 43.

[0029] Fig. 4 is a diagram for explaining a registration example of a key pattern of the workpiece 100 in the processing apparatus 10 shown in Fig. 1. Fig. 5 is a diagram for explaining a registration example of a processing end position for the key pattern shown in Fig. 4.

[0030] As shown in Fig. 4, the controller 40 acquires an image 120 obtained by capturing an image of a specific region of the surface 101 of the workpiece 100 by the imaging unit 12, and stores in the first storage unit 41 a first image 310 of a key pattern 140 that serves as a landmark when processing the workpiece 100 and key information capable of identifying a position 141 of the key pattern 140. The specific region includes, for example, a region on the surface 101 of the workpiece 100 that is optimal for detecting the key pattern 140. The key information includes, for example, information capable of identifying the first image 310 of the key pattern 140, the position 141 of the key pattern 140 in the image 120, the orientation of the first image 310, the scale of the first image 310, and the like.

[0031] For example, the controller 40 detects the key pattern 140 by pattern matching between an image 120 captured of the workpiece 100 and a predetermined key pattern. When identifying an arbitrary region in the device 104 portion of the image 120 as the key pattern 140, the controller 40 calculates the similarity with other regions, calculates the suitability of the arbitrary region as the key pattern 140 as the similarity is lower, and after calculating the suitability for each of a plurality of arbitrary regions, identifies the arbitrary region with the highest suitability as the key pattern 140. The controller 40 can search for a similar key pattern based on a first image 310 of a previously registered key pattern 140.

[0032] The controller 40 stores, in the second storage unit 42, positional relationship information capable of identifying a positional relationship from a position 141 of the key pattern 140 to a processing start position 150 in the X-axis direction where processing is started by the processing unit 13. The positional relationship information includes, for example, information capable of identifying the position 141 of the key pattern 140, the processing start position 150, a first distance 151 from the position 141 to the processing start position 150, and the like.

[0033] For example, the controller 40 calculates a first distance 151 from the key pattern 140 to the second planned division line 103 at the processing start position 150 in the captured image 120. The controller 40 stores (registers) positional relationship information capable of identifying the first image 310 showing the detected key pattern 140, the first distance 151 from the key pattern 140 to the second planned division line 103, etc. in the second storage unit 42. The controller 40 can associate identification information capable of identifying the workpiece 100 with the positional relationship information and store it in the second storage unit 42.

[0034] 5, the controller 40 stores, in the third storage unit 43, end information capable of identifying a processing end position 160 where processing in the X-axis direction is ended based on the position 141 of the key pattern 140, or a second distance 161 from the processing start position 150 in the X-axis direction to the processing end position 160 where processing is ended. The end information includes, for example, information capable of identifying the processing end position 160, the second distance 161 from the processing start position 150 to the processing end position 160 where processing is ended, etc.

[0035] For example, the controller 40 calculates a second distance 161 from the processing start position 150 to the processing end position 160 of the key pattern 140 in the captured image 120. The controller 40 stores end information having the processing end position 160 in the X-axis direction and the second distance 161 from the processing start position 150 to the processing end position 160 in the third storage unit 43 in association with the positional relationship information in the second storage unit 42.

[0036] 1, the controller 40 controls the imaging unit 12 to capture an image of the workpiece 100 held on the holding table 11, detects a key pattern 140, and then controls the processing unit 13 to perform processing from a processing start position 150 based on the positional relationship stored in the second storage unit 42. In this embodiment, when processing is performed from the processing start position 150 by the cutting blade 24 of the processing unit 13, the controller 40 controls the Z-axis direction moving unit 15 to move the rotated cutting blade 24 from above the processing start position 150 to a predetermined height to cut into the workpiece 100, and controls the cutting blade 24 to be moved relatively in the X-axis direction by the moving unit 14 at the predetermined height to perform processing.

[0037] The configuration example of the processing device 10 according to the present embodiment has been described above. Note that the above configuration described with reference to Figs. 1 to 5 is merely an example, and the configuration of the processing device 10 according to the present embodiment is not limited to the above example. The functional configuration of the processing device 10 according to the present embodiment can be flexibly modified according to the specifications and operation.

[0038] (Method of teaching processing equipment) Fig. 6 is a flowchart showing an example of a processing procedure of a teaching method executed by the processing apparatus 10. The processing procedure shown in Fig. 6 is realized by the controller 40 of the processing apparatus 10 executing a control program, for example, during alignment.

[0039] 6, the controller 40 of the processing device 10 aligns the first direction 111 of the first planned division line 102 with the X-axis direction (step 1101). For example, the controller 40 rotates the holding table 11 that holds the workpiece 100, and executes θ alignment to align the first direction 111 with the X-axis direction. When the process of step 1101 ends, the controller 40 advances the process to step 1102.

[0040] The controller 40 stores the first image 310 and the position 141 of the key pattern 140 in the first storage unit 41 (step 1102). For example, the controller 40 detects the key pattern 140 from the captured image 120 by pattern matching, and stores key information capable of identifying the first image 310 of the key pattern 140 and the position 141 of the key pattern 140 in the first storage unit 41, thereby registering the key pattern 140. When the process of step 1102 ends, the controller 40 advances the process to step 1103.

[0041] The controller 40 detects the distance in the Y-axis direction from the key pattern 140 to the first planned division line 102 (step 1103). For example, the controller 40 detects the distance from the key pattern 140 to the first planned division line 102 extending along the X-axis direction in the first image 310 of the key pattern 140. When the process of step 1103 ends, the controller 40 advances the process to step 1104.

[0042] The controller 40 stores positional relationship information regarding the processing start position 150 in the second storage unit 42 based on the first image 310 of the key pattern 140 (step 1104). For example, the controller 40 calculates a first distance 151 from the key pattern 140 to the second planned division line 103 of the processing start position 150 in the captured image 120, generates positional relationship information having the first image 310 showing the detected key pattern 140 and the first distance 151 from the key pattern 140 to the second planned division line 103, and stores the information in the second storage unit 42. When the process of step 1104 ends, the controller 40 advances the process to step 1105.

[0043] The controller 40 stores end information related to the processing end position in the X-axis direction in the third storage unit 43 based on the first image 310 of the key pattern 140 (step 1105). For example, the controller 40 calculates a second distance 161 from the processing start position 150 to the processing end position 160 of the key pattern 140. The controller 40 generates end information having the processing end position 160 in the X-axis direction and the second distance 161 from the processing start position 150 to the processing end position 160 in the captured image 120, and stores the information in the third storage unit 43. When the process of step 1105 ends, the controller 40 ends the process procedure shown in FIG. 6.

[0044] As described above, the processing device 10 includes a controller 40 having a first storage unit 41 that stores the first image 310 of the key pattern 140 and the position 141 of the key pattern 140, and a second storage unit 42 that stores the positional relationship from the position of the key pattern 140 to the processing start position 150 in the X-axis direction where processing is started, and after the imaging unit 12 captures the workpiece 100 held on the holding table 11 and detects the key pattern 140, the processing unit 13 can perform processing from the processing start position 150 based on the positional relationship stored in the second storage unit 42. As a result, even if the workpiece 100 is held shifted from the center of the holding table 11, the processing device 10 determines the processing start position 150 in the X-axis direction based on the position 141 of the key pattern 140 after detecting the key pattern 140, and therefore can prevent processing an area larger than the size of the workpiece 100 without setting a margin.

[0045] (Example of processing equipment) Fig. 7 is a flowchart showing an example of a processing procedure of processing control executed by the processing device 10. Fig. 8 is a diagram for explaining the example of processing control shown in Fig. 7. The processing procedure shown in Fig. 7 is realized by the controller 40 of the processing device 10 executing a control program, for example, during alignment. In Fig. 8, only the adhesive tape 107 is shown between the workpiece 100 and the holding table 11, and the annular frame 108 is omitted.

[0046] 7, the processing device 10 positions the cutting blade 24 above the processing start position 150 (step 1201). For example, as shown in scene 2001 in Fig. 8, while the workpiece 100 is held by suction to the holding part 11-2 of the holding table 11, the processing device 10 moves the holding table 11 by the moving unit 14 and rotates the holding table 11 so that the rotated cutting blade 24 is positioned above the processing start position 150.

[0047] 7, when step 1201 is completed, the processing device 10 moves the cutting blade 24 by the Z-axis direction moving unit 15 so as to position the cutting blade 24 at a predetermined height of the processing start position 150 (step 1202). For example, as shown in scene 2002 of FIG. 8, the processing device 10 drives the Z-axis direction moving unit 15 to lower the cutting blade 24 to the predetermined height so that the rotated cutting blade 24 is positioned at the predetermined height.

[0048] Returning to Fig. 7, when step 1202 is completed, the processing device 10 moves the cutting blade 24 at the predetermined height to the processing end position 160 by the moving unit 14 (step 1203). For example, as shown in scene 2003 of Fig. 8, the processing device 10 moves the cutting blade 24 from the processing start position 150 to the processing end position 160 by moving the moving unit 14 toward the processing end position 160 while maintaining the rotated cutting blade 24 at the predetermined height.

[0049] 7, when step 1203 is completed, the processing device 10 uses the Z-axis direction moving unit 15 to position the cutting blade 24 above the processing end position 160 (step 1204). For example, as shown in scene 2004 of FIG. 8, the processing device 10 drives the Z-axis direction moving unit 15 so that the rotated cutting blade 24 moves upward from a predetermined height, thereby raising the cutting blade 24 above the processing end position 160.

[0050] As described above, the processing device 10 does not cause the cutting blade 24 to cut into the rectangular workpiece 100 from the outside of the outer periphery of the workpiece 100, but rather causes the cutting blade 24 to cut into the workpiece 100 from above (the top surface side) on the inside of the outer periphery of the workpiece 100, thereby preventing the cutting blade from escaping or meandering when cutting begins and suppressing damage to the workpiece 100 and the cutting blade 24.

[0051] [Variations] The processing device 10 of the above embodiment has been described as specifying the key pattern 140 by pattern matching, but the present invention is not limited to this. For example, the processing device 10 may be configured to allow an operator to select a key pattern for the planned division line detection condition.

[0052] The processing device 10 of the above embodiment can process a plurality of workpieces 100 collectively in a state where the plurality of workpieces 100 are attached to one frame 108. FIG. 9 is a diagram for explaining a problem when a conventional processing device sets a margin width and processes a plurality of workpieces 100. As shown in FIG. 9, when the conventional processing device processes a plurality of workpieces 100 in a state where the workpieces 100 are attached to one frame 108 via an adhesive tape 107, the cutting start position and the cutting end position are set by setting a margin width 510 for each of the plurality of workpieces 100. As shown in scene 5001, when the plurality of workpieces 100 are neatly aligned, the conventional processing device can set an appropriate margin width 510 for each of the plurality of workpieces 100. However, as shown in scene 5002, when it is assumed that a plurality of workpieces 100 are placed with a shift relative to one frame 108, the conventional processing device must set a margin width 520 that is larger than the margin width 510 and takes into account the shift, for the device position where the workpieces 100 will be placed. In this case, the conventional processing device has a problem that the number of workpieces 100 that can be attached to one frame 108 decreases. In contrast, the processing device 10 of the above embodiment can prevent processing of an area larger than the size of the workpiece 100 without setting a margin width, so that more workpieces 100 can be attached to one frame 108. As a result, the processing device 10 can improve productivity and contribute to reducing tape costs.

[0053] In the above embodiment, the processing device 10 is implemented as a cutting device that cuts the workpiece 100, but is not limited thereto. For example, the processing device 10 may be implemented as a grinding device, a polishing device, a plasma etching device, a laser beam irradiation device, a bit cutting device, or the like.

[0054] It should be noted that the present invention is not limited to the above-described embodiment and modifications, and can be practiced in various forms without departing from the spirit of the present invention. [Explanation of symbols]

[0055] 10 Processing equipment 11 Retaining table 11-1 Holding surface 11-2 Holding part 12 Imaging unit 13 Processing unit 14 Mobile Units 15 Z-axis direction movement unit 17 Display unit 18 LED lights 22 X-axis movement means 27 Y-axis movement means 40 Controller 41 1st memory section 42 2nd memory section 43 Third memory section 100 Workpiece 101 Surface 102 First division line 103 Second division line 104 Devices 107 Adhesive Tape 108 frames 111 First Direction 112 Second Direction 140 Key Pattern 141 position 150 Processing start position 151 1st distance 160 Processing end position 161 2nd distance 310 1st image

Claims

1. A processing apparatus for processing a workpiece having devices formed in a plurality of regions partitioned on a surface by a first division line extending in a first direction and a second division line extending in a second direction perpendicular to the first division line, along the division lines, the processing apparatus comprising: a holding table that holds the workpiece on a holding surface; a processing unit that processes the workpiece held on the holding table at least along the first planned dividing line; a moving unit that relatively moves the holding table and the processing unit in an X-axis direction parallel to the holding surface in order to process along the first planned division line; an imaging unit for imaging the workpiece held on the holding table; A controller for controlling each of the components; The controller a first storage unit that acquires an image of a specific area of ​​the surface of the workpiece captured by the imaging unit and stores a first image of a key pattern that serves as a guide when processing the workpiece and a position of the key pattern; a second storage unit that stores a positional relationship from a position of the key pattern to a machining start position in the X-axis direction where machining is started by the machining unit; A processing apparatus characterized in that the workpiece held on the holding table is imaged by the imaging unit, the key pattern is detected, and then processing is performed by the processing unit from the processing start position based on the positional relationship stored in the second memory unit.

2. 2. The processing device according to claim 1, wherein the controller has a third memory unit which stores a position at which processing in the X-axis direction is to be ended based on the position of the key pattern or a distance from the processing start position to the processing end position in the X-axis direction.

3. 3. The processing device according to claim 1, wherein the processing unit is a cutting unit having a rotatable cutting blade.

4. a Z-axis direction moving unit that relatively moves the holding table and the processing unit in a Z-axis direction perpendicular to the holding surface, The processing device according to claim 3, characterized in that, when processing is performed from the processing start position by the cutting blade of the cutting unit, the rotated cutting blade is moved by the Z-axis direction moving unit from above the processing start position to a predetermined height to cut into the workpiece, and at the predetermined height, the cutting blade is moved relatively in the X-axis direction by the moving unit to perform processing.

Images