Component mounting machine, method, and computer program

Abstract

To provide technique capable of appropriately arranging a backup pin.SOLUTION: The present specification discloses a component mounting machine for mounting a component on a substrate. The component mounting machine comprises: a backup pin that can support a substrate from a lower side while being positioned to the lower side of the substrate; a rotational mechanism that rotates the backup pin; and a control device that can control the rotational mechanism before the substrate is supported from the lower side by the backup pin. In the part mounting machine, the control device rotates the backup pin by the rotational mechanism before the substrate is supported from the lower side by the backup pin. Thus, the backup pin can be appropriately arranged.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a backup pin that supports a board in a component mounter that mounts components on the board. [Background technology]

[0002] Patent Document 1 discloses a substrate support device having a backup pin with a smaller cross-sectional area than the pin body and a protruding shape that protrudes at a predetermined height at a position eccentric to the central axis of the pin body. The backup pin is configured to be rotatable around the central axis, and an operator rotates the backup pin to adjust the position of the protruding shape. This makes it possible to adjust the position at which the protruding shape of the backup pin supports the underside of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-171149 A Summary of the Invention [Problem to be solved by the invention]

[0004] The backup pin is designed to extend vertically toward the substrate. However, in reality, the backup pin may be arranged at an incline with respect to the vertical direction due to the inclination of the backup pin itself or the inclination of the installation surface on which the backup pin is installed. If the backup pin is arranged at an incline with respect to the vertical direction, the upper end of the backup pin may come into contact with the substrate at an unintended position. This specification provides a technology that allows the backup pin to be appropriately arranged. [Means for solving the problem]

[0005] This specification discloses a component mounter for mounting components on a substrate, the component mounter including: a backup pin positioned below the substrate and capable of supporting the substrate from below; a rotation mechanism for rotating the backup pin; and a control device capable of controlling the rotation mechanism before the substrate is supported from below by the backup pin.

[0006] In the above-mentioned component mounter, before the backup pins support the board from below, the control device rotates the backup pins using the rotation mechanism, which makes it possible to appropriately position the backup pins.

[0007] The above-mentioned method for controlling a component mounting machine and the computer program for the control device of the component mounting machine are also novel and useful. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a side view of the component mounter according to the embodiment. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. [Figure 4] An enlarged view of the area enclosed by dashed line IV in Figure 1. [Diagram 5] 6 is a flowchart of a backup pin determination process executed by a control device of a component mounter. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] (Example) As shown in FIG. 1 and FIG. 2, the component mounter 10 of this embodiment includes a feeder holder 11, a plurality of feeders 12, a touch panel 13, a mounting unit 14, a pair of board conveyors 20, a lifting device 22, a backup plate 24, a plurality of backup pins 30, a pin storage plate 19, a camera 5, and a control device 40. The component mounter 10 is a device that mounts electronic components 4 on a circuit board 2, and is also called an electronic component mounting device or a chip mounter. Hereinafter, the circuit board 2 will be simply referred to as a "board 2", and the electronic components 4 will be simply referred to as a "component 4". The board 2 is a so-called wafer, and is typically made of silicon. The board 2 has a thickness of, for example, about 1 mm. For ease of understanding, the board 2 is shown in this specification by a dashed line.

[0010] The feeder holding unit 11 has a plurality of slots, and the feeder 12 can be detachably arranged in each of the plurality of slots. The feeder holding unit 11 may be fixed to the component mounter 10, or may be detachably attached to the component mounter 10. The feeder 12 is a component supplying device for supplying the components 4 to the component mounter 10. In this embodiment, the feeder 12 is a tape-type feeder that stores a plurality of components on a rolled tape. However, the specific configuration of the feeder 12 is not particularly limited. The feeder 12 may be, for example, a tray-type feeder that stores a plurality of components 4 on a tray, or a bulk-type feeder that randomly stores a plurality of components 4 in a container. The touch panel 13 is a display device that provides various information of the component mounter 10 to the worker, and is also an input device that receives instructions and information from the worker.

[0011] The mounting unit 14 includes a mounting head 15 and a head moving device 16. The mounting unit 14 mounts the components 4 housed in the feeders 12 arranged in the feeder holding unit 11 to the mounting positions of the board 2. The mounting head 15 includes one or more nozzles 6. The nozzles 6 are held by the mounting head 15 so as to be detachable and rotatable. The nozzles 6 have a cylindrical shape, and a vacuum pump (not shown) maintains the inside of the nozzles 6 at a negative pressure. As a result, the nozzles 6 pick up the components 4 supplied by the feeders 12 by suctioning them to the lower ends of the nozzles 6. As shown in the enlarged view at the bottom of FIG. 1, in this embodiment, a pin attaching / detaching member 7 can be attached to the mounting head 15 instead of the nozzles 6. The pin attaching / detaching member 7 is an auxiliary tool for attaching the backup pins 30 to the backup plate 24 and for removing the installed backup pins 30 from the backup plate 24. The pin attaching / detaching member 7 has a hollow shape with an open bottom, and includes a slit 8. The structure of the pin attaching / detaching member 7 will be described later with reference to Fig. 4. The head moving device 16 is a robot that moves the mounting head 15 and the camera 5 along the upper surface 3u of the substrate 2 (that is, in the horizontal direction).

[0012] As shown in FIG. 2, the pair of board conveyors 20 extend in the ±X direction (i.e., the vertical direction on the paper surface of FIG. 2). The pair of board conveyors 20 carry in the board 2 on which the components 4 are mounted by the upstream component mounter from the upstream component mounter (not shown) and transport it to the downstream component mounter (not shown). The carried-in board 2 is supported from below between the pair of board conveyors 20. The lifting device 22 is located between the pair of board conveyors 20. The lifting device 22 supports the backup plate 24 from below. As shown by the arrow in FIG. 1, the lifting device 22 lifts the backup plate 24 toward the board 2. The lifting device 22 also lowers the backup plate 24 so as to move away from the board 2. The backup plate 24 has a flat plate shape. The backup plate 24 faces the lower surface 3d of the board 2 from below. A plurality of backup pins 30 are arranged on the upper surface of the backup plate 24.

[0013] The backup pin 30 has a rod shape extending from the backup plate 24 toward the board 2. As shown in FIG. 2, the component mounter 10 of this embodiment includes nine backup pins 30. However, in a modified example, for example, only one backup pin 30 that supports the center of the board 2 may be included, or other numbers of backup pins 30 may be included. When the board 2 is positioned at the mounting position by the pair of board conveyors 20, the lifting device 22 raises the backup plate 24. As a result, the upper end of the backup pin 30 comes into contact with the lower surface 3d of the board 2. The backup pin 30 supports the board 2 from below while the components 4 are mounted on the board 2. As described above, the board 2 has a relatively small thickness. Therefore, the board 2 is more likely to deform than other circuit boards that are thicker and more rigid. By supporting the board 2 with the backup pins 30, it is possible to suppress deformation of the board 2 while the components 4 are mounted on the board 2. As a result, the components can be appropriately mounted at the mounting position on the upper surface 3u of the board 2.

[0014] The camera 5 captures an image of the backup pin 30 from above before the board 2 is transported by the board conveyor 20. For example, a CCD camera is used as the camera 5. The illumination light source is constituted by an LED, and illuminates the top surface of the backup pin 30.

[0015] The pin storage plate 19 is located below the backup plate 24. The pin storage plate 19 stores new backup pins 30 for replacement. The pin storage plate 19 also stores backup pins 30 to be discarded after replacement. The pin storage plate 19 is a plate that holds multiple backup pins 30 from below. Like the backup plate 24, the pin storage plate 19 is configured to be liftable. As shown in Figs. 1 and 2, multiple through holes 25 are formed in the part of the backup plate 24 facing the pin storage plate 19. Each through hole 25 is positioned so as to be coaxial with the backup pin 30 stored in the pin storage plate 19, and the backup pin 30 on the pin storage plate 19 can pass through the through hole 25 located above. When a new backup pin 30 stored in the pin storage plate 19 is placed on the backup plate 24, the pin storage plate 19 first lifts the new backup pin 30. As a result, the new backup pin 30 passes through the through hole 25 and protrudes above the backup plate 24. Thereafter, the new backup pin 30 is held by the pin attaching / detaching member 7 and placed at a predetermined position on the backup plate 24. When a backup pin 30 determined to be unusable is to be discarded, the pin storage plate 19 is raised, and then the unusable backup pin 30 is placed on the pin storage plate 19 via the through-hole 25. Thereafter, when the pin storage plate 19 lowers the backup pin 30, the discarded backup pin 30 passes through the through-hole 25 and moves below the backup plate 24.

[0016] The control configuration of the component mounter 10 will be described with reference to FIG. 3. The control device 40 is communicatively connected to the camera 5, the touch panel 13, the mounting head 15, the head moving device 16, the pin storage plate 19, the pair of board conveyors 20, and the lifting device 22. The control device 40 is a computer that controls each part. The control device 40 includes a CPU 42 and a memory 44. The memory 44 is configured by a volatile memory, a non-volatile memory, and the like. The memory 44 stores a program 46, a target position table, and a threshold value Th. The CPU 42 executes various processes according to the program 46 stored in the memory 44. The CPU 42 executes the backup pin determination process of FIG. 5, for example, according to the program 46. The target position table is a table that stores the coordinates of the target position of each backup pin 30. The threshold value Th is used in the backup pin determination process described later. The target position table and the threshold value Th are stored in the memory 44 at the time of shipment of the component mounter 10, but can be changed later by an operator.

[0017] The detailed structure of the backup pin 30 will be described with reference to FIG. 4. FIG. 4 shows an enlarged view of the area surrounded by the dashed line IV in FIG. 1. The upper part of FIG. 4 shows a plan view of the backup pin 30. That is, the plan view of FIG. 4 shows an image of the backup pin 30 captured by the camera 5. The backup pin 30 includes a pin body 31 and three ribs 33, 34, and 35. The pin body 31 of the backup pin 30 has a cylindrical shape extending upward. That is, the pin body 31 has a circular planar shape. This allows the backup pin 30 to be easily attached and detached by the pin attachment / detachment member 7. An inclined surface is formed at the corner of the upper end of the pin body 31. The upper surface 32 of the pin body 31 is a plane that abuts against the lower surface 3d of the substrate 2. A magnet (not shown) is disposed at the lower end of the pin body 31, and the backup pin 30 is fixed to the backup plate 24 by magnetic force.

[0018] As shown in the plan view of FIG. 4, the ribs 33 to 35 protrude from the side surface of the pin body 31 in the radial direction of the pin body 31. That is, the ribs 33 to 35 extend radially from the center of the pin body 31 on the outer side of the pin body 31. In terms of the height direction, the ribs 33 to 35 are located above the center of the side surface of the pin body 31. The ribs 33 to 35 have a rectangular flat plate shape. The ribs 33 to 35 are arranged at intervals of 120 degrees along the circumferential direction of the pin body 31. That is, the ribs 33 to 35 are evenly arranged on the outer circumferential surface of the pin body 31. The ribs 33 to 35 have the same shape.

[0019] The inclination angle of the backup pin 30 will now be described. The backup pin 30 is designed to extend along the vertical direction V1. This allows the position of the backup pin 30 to overlap with the target position when viewed from above. This makes it easy to check whether the backup pin 30 is placed at the target position.

[0020] As described above, the backup pin 30 extends from the backup plate 24 toward the substrate 2. The backup plate 24 is designed to be arranged parallel to the horizontal direction. However, in reality, for example, due to unavoidable manufacturing errors, the backup plate 24 may be arranged tilted with respect to the horizontal direction. For example, as shown in FIG. 4, when the backup plate 24 is tilted by an angle A1 so as to be displaced downward in the -Y direction (i.e., toward the left of the paper surface of FIG. 4), the plate orthogonal direction V2 perpendicular to the upper surface of the backup plate 24 is tilted in the -Y direction by the angle A1 with respect to the vertical direction V1. Also, the backup pin 30 is designed to be arranged perpendicular to the upper surface of the backup plate 24, that is, parallel to the plate orthogonal direction V2. However, in reality, for example, due to unavoidable manufacturing errors, the pin body 31 of the backup pin 30 may be bent. As a result, the backup pin 30 is not arranged parallel to the plate orthogonal direction V2. Thus, the inclination angle of the backup pin 30 is mainly determined by the inclination angle (eg, angle A1) of the plate orthogonal direction V2 relative to the vertical direction V1 and the inclination angle (eg, angle A2) of the central axis of the backup pin 30 relative to the plate orthogonal direction V2.

[0021] 4 shows two backup pins 30 arranged on the same backup plate 24. The left backup pin 30 is bent in the -Y direction starting from a contact point P25 between the side surface of the pin body 31 on the -Y direction side and the backup plate 24. That is, the left backup pin 30 is bent in the same direction as the inclination direction of the plate orthogonal direction V2 with respect to the vertical direction V1. As a result, as shown in the relationship diagram of each direction shown to the left of the left backup pin 30, the axial direction L1 along the central axis of the left backup pin 30 is inclined by an angle A2 away from the vertical direction V1 with respect to the plate orthogonal direction V2.

[0022] In contrast, the right backup pin 30 is bent in the +Y direction starting from a contact point P27 between the side surface of the pin body 31 located on the +Y direction side and the backup plate 24. That is, the right backup pin 30 is bent in a direction opposite to the inclination direction of the plate orthogonal direction V2 with respect to the vertical direction V1. As a result, as shown in the relationship diagram of each direction shown to the left of the right backup pin 30, the axial direction L2 along the central axis of the right backup pin 30 is inclined by an angle A3 with respect to the plate orthogonal direction V2 so as to approach the vertical direction V1.

[0023] 4, for ease of understanding, the target point P10 for locating the backup pin 30 is indicated by a circle, points related to the outer shape of the pin body 31 are indicated by triangles, and points related to the ribs 33 to 35 are indicated by squares. In addition, in the diagram showing the relationship between each direction, the vertical direction V1 is indicated by a solid line, the plate perpendicular direction V2 is indicated by a dashed line, and the axial directions L1, L2 of the backup pin 30 are indicated by dashed two-dot lines.

[0024] The target point P10 is a point indicated by coordinates in a target position table stored in the memory 44 of the control device 40. That is, when the backup plate 24 is arranged along the horizontal direction and the backup pin 30 is arranged perpendicular to the backup plate 24, the center point P20 of the backup pin 30 coincides with the target point P10 when viewed from above. That is, the coordinates of the center point P20 and the coordinates of the target point P10 in the XY plane coincide with each other. Note that, as shown in FIG. 4, when the backup plate 24 is inclined by an angle A1 with respect to the horizontal direction, the coordinates of the target point P10 do not coincide with the coordinates of the center point of the installation position 26 of the backup plate 24. However, in FIG. 4, the inclination of the backup plate 24 is exaggerated, and the actual inclination of the backup plate 24 is very small. Therefore, the coordinates of the target point P10 can be made to coincide with the coordinates of the center point of the installation position 26 of the backup plate 24.

[0025] The center point P20 is a point calculated from the outer shape of the pin body 31 of the backup pin 30. Specifically, the center point P20 is the center of an outer circle specified from three outer shape points P21 to P23 located on the outer shape of the pin body 31. In this way, by calculating the center point P20 of the pin body 31 from the three outer shape points P21 to P23 of the pin body 31 having a circular planar shape, the position of the backup pin 30 can be obtained relatively easily.

[0026] As shown in the plan view of FIG. 4, in the left backup pin 30, the center point P20 is separated from the target point P10 by a distance D1. That is, in the left backup pin 30, the lower surface 3d of the board 2 cannot be supported at the target point P10, and the lower surface 3d of the board 2 is supported at a position displaced in the -Y direction from the target point P10. For example, if the electrode part 3e protrudes from the lower surface 3d of the board 2, the upper end of the backup pin 30 and the electrode part 3e interfere with each other when the left backup pin 30 supports the lower surface 3d of the board 2. In this case, the electrode part 3e is interposed between the upper end of the backup pin 30 and the lower surface 3d of the board 2, and the board 2 is deformed when the component 4 is mounted on the upper surface 3u of the board 2. As a result, the component 4 cannot be mounted appropriately at the mounting position of the board 2.

[0027] In contrast, the axial direction L2 of the right backup pin 30 is inclined at an angle A3 with respect to the plate orthogonal direction V2 so as to approach the vertical direction V1, despite being disposed on the backup plate 24 which is inclined at an angle A1 with respect to the horizontal direction. As a result, as shown in the plan view of Fig. 4, the center point P20 of the backup pin 30 overlaps with the target point P10. As a result, when the backup pin 30 supports the lower surface 3d of the substrate 2, the upper end of the backup pin 30 does not contact the electrode part 3e.

[0028] In this way, even if the backup plate 24 is inclined relative to the horizontal direction and the backup pin 30 is bent, if the backup pin 30 is bent in a direction opposite to the inclination of the backup plate 24, the bottom surface 3d of the substrate 2 can be appropriately supported by the backup pin 30. The inventors have discovered that by rotating the backup pin 30 and changing the bending direction of the backup pin 30 to a direction opposite to the inclination of the backup plate 24, the bent backup pin 30 can be used to appropriately support the bottom surface 3d of the substrate 2.

[0029] The lower part of FIG. 4 shows a side view of the pin attaching / detaching member 7 and the backup pin 30 inserted into the pin attaching / detaching member 7. Three slits 8 are formed on the side of the pin attaching / detaching member 7, which are evenly arranged in the circumferential direction of the pin attaching / detaching member 7. Each slit 8 has an opening that extends to the lower end of the pin attaching / detaching member 7 and is open to the outside, and a fixed part that is offset from the opening in the +Y direction. The slits 8 are openings for inserting the ribs 33 to 35. The pin attaching / detaching member 7 holds the backup pin 30 stored in the raised pin storage plate 19 and moves above a predetermined installation position 26 of the backup plate 24. At this time, for example, the lower surface 35d of the rib 35 is held by the upper surface 8u of the fixed part of the slit 8. The pin attaching / detaching member 7, while holding the backup pin 30, descends toward the backup plate 24 and places it at the installation position 26 of the backup plate 24. Thereafter, the pin attaching / detaching member 7 passes the ribs 33 to 35 through the open part of the slit 8 and ascends.

[0030] The pin attaching / detaching member 7 rotates in the direction indicated by the arrow R1 in FIG. 4 while holding the backup pin 30 (i.e., while the backup pin 30 is separated from the installation position 26 of the backup plate 24). As a result, the backup pin 30 rotates in the direction indicated by the arrow R1 about the central axis of the backup pin 30. In the rotated state, the pin attaching / detaching member 7 places the backup pin 30 at the installation position 26 of the backup plate 24. In this way, in this embodiment, since the pin attaching / detaching member 7 rotates the backup pin 30 it holds, the backup pin 30 can be rotated with a simpler configuration than, for example, a configuration in which a separate rotation mechanism is provided in the backup plate 24 to rotate the backup pin 30 about a rotation axis perpendicular to the central axis of the backup pin 30.

[0031] Here, even if the axial direction L1 of the backup pin 30 is inclined with respect to the vertical direction V1, there may be cases where the center point P20 of the backup pin 30 coincides with the target point P10 when viewed from above. However, when the lower surface 3d of the substrate 2 is supported by the inclined backup pin 30, the corners of the upper surface 32 of the backup pin 30 come into contact with the lower surface 3d of the substrate 2. In this case, the upper surface 32 of the backup pin 30 cannot properly support the lower surface 3d of the substrate 2.

[0032] As described above, the ribs 33-35 have the same shape. Therefore, when viewed from the axial direction L1 of the backup pin 30, the tip points P33-P35 of the ribs 33-35 are located on a circle centered on the central point P20 of the backup pin 30. The plan view of FIG. 4 shows a specific point P30 that is the center of a specific circle C1 that passes through the tip points P33-P35 when viewed from above. As described above, in the left backup pin 30, the axial direction L1 of the backup pin 30 is inclined with respect to the vertical direction V1. Therefore, as shown in FIG. 4, in the left backup pin 30, the specific point P30 is separated from the central point P20 by a distance D2. In this way, the inventors have discovered that the tip points P33-P35 of the three ribs 33-35 in an image of the backup pin 30 from above can be used to determine the degree of inclination of the backup pin 30.

[0033] The backup pin determination process executed by the CPU 42 of the control device 40 will be described below with reference to Fig. 5. The CPU 42 starts the process of Fig. 5 when the pin attaching / detaching member 7 has placed all of the backup pins 30 on the backup plate 24. The CPU 42 executes the process of Fig. 5 for each of the multiple backup pins 30.

[0034] The CPU 42 transmits an image capturing instruction to the camera 5 (S10). In response to this, the camera 5 captures a backup pin image of one backup pin 30 from above.

[0035] The CPU 42 receives the backup pin image captured by the camera 5 (S12). In this manner, the CPU 42 causes the camera 5 to capture an image of the backup pin 30 before the backup pin 30 supports the board 2 from below, and obtains the backup pin image before the board 2 is supported from below.

[0036] The CPU 42 extracts three contour points (eg, contour points P21 to P23) of the pin body 31 from the backup pin image received in S12 (S14).

[0037] The CPU 42 specifies an outline circle based on the three outline points extracted in S14 (S16).

[0038] Furthermore, the CPU 42 calculates the center coordinates, which are the coordinates of the center point (for example, center point P20) of the outline circle identified in S16 (S18).

[0039] The CPU 42 compares the center coordinates calculated in S18 with the target coordinates stored in the target value table in the memory 44 (S20). If the center coordinates match the target coordinates (YES in S20), the CPU 42 proceeds to S44, and if the center coordinates do not match the target coordinates (NO in S20), the CPU 42 proceeds to S22. Note that the determination of whether the center coordinates match the target coordinates may be made, for example, based on whether the integer values ​​of both coordinates match, or based on whether the center coordinates are included within a predetermined range based on the target coordinates. Alternatively, the distance between both coordinates (for example, distance D1) may be calculated from the coordinates of both, and it may be determined that they match if the distance between them is equal to or less than a predetermined value.

[0040] When the process proceeds to S22, the CPU 42 rotates the backup pin 30 by 120 degrees using the pin attaching / detaching member 7 (S22). As a result, if the center coordinates do not match the target coordinates (NO in S20), the bending direction of the backup pin 30 is changed. As a result, the positional deviation of the backup pin 30 is adjusted.

[0041] The CPU 42 increments the number of rotations N (S24). The number of rotations N is the number of times the processes of S10 to S20 have been performed.

[0042] The CPU 42 judges whether the number of rotations N is equal to or greater than a threshold value Th in the memory 44 (S30). The threshold value Th is a value for judging whether or not to continue the process of rotating the backup pin 30, and is, for example, two times. In a modified example, the threshold value Th may be one time, or three times or more. If the number of rotations N is equal to or greater than the threshold value Th (YES in S30), the CPU 42 proceeds to S32. If the number of rotations N is smaller than the threshold value Th (NO in S30), the CPU 42 returns to S10 and transmits an image capture instruction to the camera 5 again. In this way, the CPU 42 repeats the processes of S10 to S20 until the number of rotations N reaches the threshold value Th. This makes it possible to increase the number of backup pins 30 that properly support the lower surface 3d of the substrate 2, thereby reducing the waste rate of the backup pins 30.

[0043] The CPU 42 resets the number of rotations N (S32).

[0044] When the process proceeds to S34, the CPU 42 uses the pin attaching / detaching member 7 attached to the mounting head 15 instead of the nozzle 6 to remove the backup pin 30 from the backup plate 24. Furthermore, the CPU 42 moves the mounting head 15 above the pin storage plate 19 and lowers the mounting head 15. As a result, the backup pin 30 held by the pin attaching / detaching member 7 passes through the through hole 25 and is placed on the pin storage plate 19. In this way, even if the backup pin 30 is rotated until the rotation count N reaches the threshold value Th, if the center coordinate does not match the target coordinate (NO in S20), the CPU 42 determines that the backup pin 30 is unusable and places it on the pin storage plate 19. This makes it possible to prevent the processes of S10 to S24 from being repeated beyond the threshold value Th. This makes it possible to prevent the time required for adjusting the angle of the backup pin 30 from becoming longer than a predetermined time. Although not shown in the figure, when the CPU 42 places a backup pin 30 determined to be unusable on the pin storage plate 19, the CPU 42 displays a message on, for example, the touch panel 13, indicating that a backup pin 30 determined to be unusable has been placed on the pin storage plate 19.

[0045] After discarding the backup pin 30, the CPU 42 uses the pin attaching / detaching member 7 attached to the mounting head 15 to place a new backup pin 30 stored in the pin storage plate 19 on the backup plate 24 (S36). After that, the CPU 42 returns to S10 again and executes the processes of S10 to S20 on the new backup pin 30.

[0046] Furthermore, if the center coordinates match the target coordinates (YES in S20), the CPU 42 extracts three tip points (for example, tip points P33, P34, and P35) from the backup pin image received in S12 (S44).

[0047] The CPU 42 uses the three tip points extracted in S44 to specify a specific circle (eg, specific circle C1) (S46).

[0048] Furthermore, the CPU 42 calculates specific coordinates that are the coordinates of the center point (eg, specific point P30) of the specific circle identified in S46 (S48).

[0049] The CPU 42 compares the specific coordinates calculated in S48 with the center coordinates calculated in S18 (S50). If the specific coordinates match the center landmark (YES in S50), the CPU 42 proceeds to S52, and if the specific coordinates do not match the center landmark (NO in S50), the CPU 42 proceeds to S34. Note that, as in S20 described above, the determination of whether the specific coordinates match the center landmark may be made based on, for example, whether the integer values ​​of the coordinates match, or whether the specific coordinates are included within a predetermined range based on the center coordinates.

[0050] If the answer is YES in S50, the CPU 42 determines (S52) whether or not the processes of S10 to S50 have been completed for the other backup pins 30. If the other backup pins 30 have already been adjusted (YES in S52), the CPU 42 proceeds to S54, and if the other backup pins 30 have not been adjusted (NO in S52), the CPU 42 skips S54 and ends the process of FIG.

[0051] If the answer is YES in S52, the CPU 42 transmits a carry-in instruction to the pair of board conveyors 20, and then transmits a lift instruction to the lifting device 22 (S54). As a result, after the pair of board conveyors 20 carry the board 2 into the component mounter 10, the lifting device 22 lifts the backup plate 24 and causes the backup pins 30 to support the lower surface 3d of the board 2 from below. As a result, the lower surface 3d of the board 2 can be appropriately supported by the backup pins 30, the position of which has been adjusted.

[0052] As described above, the process of S34 discards the backup pin 30. When the specific coordinates do not match the central coordinates (NO in S50), the CPU 42 determines that the backup pin 30 is unusable and discards it, thereby preventing the backup pin 30, which is arranged with an inclined central axis, from supporting the lower surface 3d of the substrate 2.

[0053] (Effects of this embodiment) In the component mounter 10 of this embodiment, before the backup pin 30 supports the lower surface 3d of the board 2 from below, the control device 40 can rotate the backup pin 30 using the pin attaching / detaching member 7. This makes it possible to appropriately adjust the angle of the backup pin 30. This allows the backup pin 30 to be appropriately positioned.

[0054] The correspondence relationships in this embodiment are as follows: The pin attachment / detachment member 7 is an example of a "rotation mechanism". The camera 5 is an example of an "imaging device". The threshold value Th is an example of a "predetermined number". The process of S10 is an example of an "imaging process". The process of S20 is an example of a "determination process". The process of S22 is an example of a "rotation process". The process of S54 is an example of a "support process".

[0055] Points to note about this embodiment are described below. The "rotation mechanism" is not limited to the pin attaching / detaching member 7. For example, the periphery of the installation position 26 of the backup plate 24 may be configured to be rotatable around the central axis of the installation position 26.

[0056] The component mounter 10 may include an imaging device capable of capturing an image of the backup pin 30 from the side, instead of the camera 5. In this modification, the CPU 42 may determine, for example, in S20, whether or not the upper end position of the backup pin 30 coincides with the target coordinates.

[0057] The position of the backup pin is not limited to the center of the backup pin. For example, the position of the backup pin may be an end point on the side where the electrode part 3e is located. In this case, the CPU 42 may determine whether or not the end point of the backup pin is located in an area that interferes with the electrode part 3e, instead of comparing the center coordinates with the target coordinates in S20 of Fig. 5. In this modification, the area that does not interfere with the electrode part 3e is an example of a "target range."

[0058] The pin body 31 of the backup pin 30 does not have to have a cylindrical shape. For example, the pin body 31 may have a polygonal planar shape. In that case, the CPU 42 may calculate the center point from the intersection of the diagonals.

[0059] The backup pin 30 does not have to include the ribs 33 to 35. In that case, the CPU 42 does not have to execute the processes of S44 to S50 in FIG.

[0060] Although specific examples of the technology disclosed in this specification have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and variations of the specific examples exemplified above. Furthermore, the technical elements described in this specification or drawings exhibit technical utility alone or in various combinations, and are not limited to the combinations described in the claims at the time of filing. Furthermore, the technology exemplified in this specification or drawings achieves multiple objectives simultaneously, and achieving one of the objectives itself has technical utility.

[0061] This specification also discloses a technical idea of ​​changing "the component mounter according to claim 3" to "the component mounter according to claim 3 or 4" in claim 5. Similarly, the technical idea of ​​changing "the component mounter according to claim 3" to "the component mounter according to any one of claims 3 to 5" in claim 6, the technical idea of ​​changing "the component mounter according to claim 3" to "the component mounter according to any one of claims 3 to 6" in claim 7, the technical idea of ​​changing "the component mounter according to claim 3" to "the component mounter according to any one of claims 3 to 7" in claim 8, and the technical idea of ​​changing "the component mounter according to claim 3" to "the component mounter according to any one of claims 3 to 8" in claim 9 are also disclosed. Furthermore, this specification also discloses a technical idea of ​​changing "the component mounter according to claim 1" to "the component mounter according to any one of claims 1 to 9" in claim 10. [Explanation of symbols]

[0062] 2: Substrate 3d,35d:Bottom surface 3e: Electrode parts 3u,8u,32:Top surface 4: Parts 5: Camera 6: Nozzle 7: Pin attachment / detachment member 8: Slit 10: Component mounting machine 11: Feeder holder 12: Feeder 13: Touch panel 14: Mounting section 15: Mounting head 16: Head moving device 19: Pin storage plate 20: Circuit board conveyor 22: Lifting device 24: Backup plate 25:Through hole 26: Installation position 30: Backup pin 31: Pin body 33, 34, 35: Ribs 40: Control device 42: CPU 44: Memory 46: Program C1: Specific circle P10:Target point P20: Center point P21,P22,P23:Outline points P30:Specific point P33,P34,P35: tip point Th: Threshold V1: Vertical direction V2: Orthogonal to plate

Claims

1. A component mounter that mounts components on a board, a backup pin located below the substrate and capable of supporting the substrate from below; a rotation mechanism that rotates the backup pin; a control device capable of controlling the rotation mechanism before the substrate is supported from below by the backup pins; Equipped with Component mounting machine.

2. the component mounter further includes an imaging device capable of imaging the backup pin from above, the control device is capable of executing an imaging process for causing the imaging device to image the backup pins before supporting the substrate from below with the backup pins.

2. The component mounter according to claim 1.

3. The control device further comprises: a determination process for determining whether or not a position of the backup pin calculated from an image of the backup pin captured in the imaging process is included in a preset target range; a supporting process for supporting the substrate from below with the backup pins when the position of the backup pins is within the target range in the determination process; a rotation process of rotating the backup pin by a predetermined angle using the rotation mechanism when the position of the backup pin is not included in the target range in the determination process; It is possible to 3. The component mounter according to claim 2.

4. the control device further repeatedly executes the rotation process and the image capturing process until it is determined in the determination process that the position of the backup pin is included in the target range.

4. The component mounter according to claim 3.

5. The component mounter according to claim 3 , wherein the rotation mechanism rotates the backup pin about an axis of the backup pin.

6. 4. The component mounter according to claim 3, wherein the control device determines that the backup pin is unusable when the position of the backup pin is not included in the target range even after the rotation process and the image capturing process are repeated a predetermined number of times.

7. The position of the backup pin is indicated by the coordinates of the center point of the backup pin in the image.

4. The component mounter according to claim 3.

8. The backup pin has a circular planar shape, The control device identifies coordinates of at least three points located on the outline of the backup pin in the image; The position of the backup pin is the coordinates of a center point of a circle passing through the coordinates of the at least three identified points.

4. The component mounter according to claim 3.

9. the backup pin includes three ribs extending radially from a center point of the backup pin on an outer side of the backup pin when viewed in an axial direction along a central axis of the backup pin, each tip of the three ribs is located on a circle having a center at the center point of the backup pin when viewed in the axial direction; The control device includes: Furthermore, the coordinates of the points of the tips of the three ribs in the image are identified; when the position of the backup pin is included in the target range and the coordinates of the center of a specific circle passing through the tip points of each of the three ribs are within a predetermined distance range from the center point, the backup pin is made to support the substrate from below; If the coordinates of the center of the specific circle are not included within the range of the predetermined distance, the backup pin is determined to be unusable.

4. The component mounter according to claim 3.

10. The mounter according to claim 1 , further comprising a plurality of the backup pins.

11. A method for controlling a mounter that mounts components on a board, comprising: The component mounter includes: a backup pin positioned below the substrate and capable of supporting the substrate from below; a rotation mechanism that rotates the backup pin; Equipped with The method comprises: rotating the backup pins by the rotation mechanism before supporting the substrate from below with the backup pins. method.

12. A computer program for a component mounter that mounts components on a board, comprising: The component mounter includes: a backup pin positioned below the substrate and capable of supporting the substrate from below; a rotation mechanism that rotates the backup pin; Equipped with the computer program causes a control device of the component mounter to execute a process of rotating the backup pins by the rotation mechanism before the backup pins support the board from below. Computer program.

Images