Color filter substrate, display device and manufacturing method of color filter substrate

Abstract

To miniaturize a light shielding part.SOLUTION: A color filter substrate 20 comprises a first color filter 29G, a second color filter 29B, and a light shielding part 40 disposed at the boundary between the first color filter 29G and the second color filter 29B. The light shielding part 40 includes a first transmission film 41, a first reflection film 42 disposed on the upper layer side of the first transmission film 41, a second transmission film 43 disposed on the upper layer side of the first reflection film 42, and a second reflection film 44 disposed on the upper layer side of the second transmission film 43 and having a film thickness larger than that of the first reflection film 42. The first transmission film 41 has a first bottom face 41A located on the side opposite to the first reflection film 42 side, and a first side face 41B forming a first angle θ1, the acute angle with respect to the first bottom face 41A. The second reflection film 44 has a second bottom face 44A in contact with the upper surface 43C of the second transmission film 43 and parallel to the first bottom face 41A, and a second side face 44B forming a second angle θ2, the acute angle with respect to the second bottom face 44A.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present specification relates to a color filter substrate, a display device, and a method for manufacturing a color filter substrate. [Background technology]

[0002] Conventionally, one example of a color filter substrate provided in an image display panel such as a liquid crystal panel is known from the following Patent Document 1. In Patent Document 1, an oxime ester compound having a specific structure is used as a photopolymerization initiator and resin-coated carbon black is used as a light-shielding agent in a photosensitive composition containing a light-shielding agent that constitutes a black matrix provided in the color filter substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-120768 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned Patent Document 1, a resin material is used as the material of the black matrix. Therefore, when the pixel density of the image display panel is increased to, for example, 1000 ppi or more (particularly, 1200 ppi or more), there is a problem that the exposure precision when exposing the black matrix using an exposure device is not sufficient, making it difficult to miniaturize the black matrix.

[0005] The technology described in this specification was completed based on the above circumstances, and aims to miniaturize the light-shielding portion. [Means for solving the problem]

[0006] (1) A color filter substrate according to the technology described in this specification includes a first color filter, a second color filter having a color different from that of the first color filter, and a light-shielding portion disposed at a boundary between the first color filter and the second color filter below the first color filter and the second color filter, the light-shielding portion having a first transmissive film, a first reflective film disposed above the first transmissive film, a second transmissive film disposed above the first reflective film, and a second reflective film disposed above the second transmissive film and having a thickness greater than that of the first reflective film, the first transmissive film having a first bottom surface located on the opposite side to the first reflective film side and a first side surface forming a first acute angle with respect to the first bottom surface, and the second reflective film having a second bottom surface in contact with an upper surface of the second transmissive film and parallel to the first bottom surface, and a second side surface forming a second acute angle with respect to the second bottom surface.

[0007] (2) In addition to the above (1), the color filter substrate may be configured such that the first reflective film has a third bottom surface in contact with an upper surface of the first transparent film and parallel to the first bottom surface, and a third side surface forming a third angle with respect to the third bottom surface, the second transparent film has a fourth bottom surface in contact with an upper surface of the first reflective film and parallel to the first bottom surface, and a fourth side surface forming a fourth angle with respect to the fourth bottom surface, and the first reflective film is configured such that the third side surface is in contact with the upper surface of the first transparent film without being in contact with the first side surface.

[0008] (3) In addition to the above (2), the color filter substrate may be configured such that the third angle and the fourth angle are greater than the first angle.

[0009] (4) In addition to either (2) or (3) above, the color filter substrate may also have a fifth side surface in contact with the second bottom surface, the second reflective film forming a fifth angle that is an obtuse angle with respect to the second bottom surface.

[0010] (5) In addition to any one of (1) to (4) above, the color filter substrate may be configured such that the light-shielding portion is configured such that an angle formed by a line segment connecting an outer end of the first transparent film and an outer end of the second reflective film with respect to the first bottom surface is in the range of 70° or more and 90° or less.

[0011] (6) A display device according to the technology described in this specification includes a color filter substrate according to any one of (1) to (5) above, and an array substrate arranged opposite the color filter substrate.

[0012] (7) A method for manufacturing a color filter substrate according to the technology described in this specification includes forming a first transmission film on a substrate, forming a first reflective film on an upper side of the first transmission film, forming a second transmission film on an upper side of the first reflective film, forming a second reflective film on an upper side of the second transmission film, the second reflective film having a thickness larger than that of the first reflective film, forming a photosensitive resist film on an upper side of the second reflective film, exposing and developing the resist film, performing a first etching process in which at least the second reflective film is etched using the resist film as a mask, and then forming a second reflective film on the upper side of the second reflective film. a second etching is performed in which the second reflective film, the second transparent film, the first reflective film, and the first transparent film are etched at an etching rate slower than that of the first etching, thereby forming a light-shielding portion consisting of the first transparent film, the first reflective film, the second transparent film, and the second reflective film, forming a first color filter having an end portion disposed on the upper layer side of the light-shielding portion, and forming a second color filter having a different color from that of the first color filter, and having an end portion disposed on the upper layer side of the light-shielding portion adjacent to the first color filter.

[0013] (8) In addition to the above (7), the method for producing a color filter substrate may further include using at least SF6 gas in the first etching, and using at least CF4 gas and O2 gas in the second etching.

[0014] (9) In addition to the above (7) or (8), the method for manufacturing the color filter substrate may further include an etching apparatus for the first etching and the second etching, the etching apparatus having a vacuum chamber in which the substrate is accommodated, and a substrate support portion disposed in the vacuum chamber, the substrate support portion having a plurality of protrusions arranged at intervals on a main surface of the substrate and supporting the substrate. Effect of the Invention

[0015] According to the technique described in this specification, it is possible to miniaturize the light-shielding portion. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a schematic perspective view showing a state in which a user wears a head-mounted display according to a first embodiment on his or her head. [Diagram 2] FIG. 1 is a schematic side view showing an optical relationship between a liquid crystal display device and a lens unit provided in a head-mounted device constituting a head-mounted display according to a first embodiment, and a user's eyeball. [Diagram 3] 1 is a schematic plan view of a liquid crystal panel and a flexible substrate included in a liquid crystal display device according to a first embodiment; [Figure 4] 1 is a schematic cross-sectional view of a liquid crystal panel according to a first embodiment of the present invention; [Diagram 5] FIG. 1 is a circuit diagram showing a pixel arrangement in a display area of ​​an array substrate provided in a liquid crystal panel according to a first embodiment; [Figure 6] FIG. 1 is a cross-sectional view showing a pixel arrangement in a display area of ​​a liquid crystal panel according to a first embodiment. [Figure 7] 1 is a cross-sectional view of a color filter substrate provided in a liquid crystal panel according to a first embodiment of the present invention; [Figure 8] FIG. 2 is an enlarged cross-sectional view of a second light-shielding portion provided on the color filter substrate according to the first embodiment; [Figure 9] FIG. 1 is a diagram showing a schematic configuration of an etching apparatus used in a first step of a color filter substrate manufacturing process according to embodiment 1. [Figure 10]FIG. 2 is a cross-sectional view showing a state in which a glass substrate is supported by a protrusion of a substrate support portion provided in the etching apparatus according to the first embodiment. [Figure 11] FIG. 1 is a cross-sectional view showing a state in which a resist film is exposed and developed in a first step of the color filter substrate manufacturing process according to embodiment 1. [Figure 12] FIG. 1 is a cross-sectional view showing a state where a first etching step is performed in a first step of a color filter substrate manufacturing process according to Embodiment 1. [Figure 13] FIG. 1 is a cross-sectional view showing a state where a second etching is performed in a first step of the color filter substrate manufacturing process according to the first embodiment. [Figure 14] Table showing the experimental results of Comparative Example 1 of Comparative Experiment 1 according to the first embodiment [Figure 15] Table showing the experimental results of Comparative Example 2 of Comparative Experiment 1 according to the first embodiment [Figure 16] Table showing the experimental results of Comparative Example 3 of Comparative Experiment 1 according to the first embodiment [Figure 17] Table showing the experimental results of Comparative Example 4 of Comparative Experiment 1 according to the first embodiment [Figure 18] Table showing the experimental results of Example 1 of Comparative Experiment 1 according to the first embodiment [Figure 19] Table showing the experimental results of Example 2 of Comparative Experiment 1 according to the first embodiment [Figure 20] Table showing the experimental results of Example 3 of Comparative Experiment 1 according to the first embodiment [Figure 21] Table showing the experimental results of Example 4 of Comparative Experiment 1 according to the first embodiment [Figure 22] Table showing the experimental results of Example 5 of Comparative Experiment 1 according to the first embodiment [Figure 23] Table showing the experimental results of Example 6 of Comparative Experiment 1 according to the first embodiment [Figure 24] Table showing the experimental results of Example 7 of Comparative Experiment 1 according to the first embodiment DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] <Embodiment 1> A first embodiment will be described with reference to Fig. 1 to Fig. 24. In this embodiment, a goggle-type head-mounted display (HMD) 10HMD and a liquid crystal display device 10 used therein are illustrated. Note that an X-axis, a Y-axis, and a Z-axis are shown in a part of each drawing, and each axis direction is drawn to be the direction shown in each drawing.

[0018] The appearance of a goggle-type head mounted display 10HMD will be described with reference to Fig. 1. The head mounted display 10HMD includes a head mounted device 10HMDa that is mounted on a user's head 10HD, as shown in Fig. 1. The head mounted device 10HMDa surrounds both of the user's eyes.

[0019] The configuration of the head-mounted device 10HMDa will be described with reference to FIG. 2. As shown in FIG. 2, the head-mounted device 10HMDa incorporates at least a liquid crystal display device 10 for displaying an image and a lens unit 10RE for focusing the image displayed on the liquid crystal display device 10 on the user's eyeball 10EY. The liquid crystal display device 10 includes at least a liquid crystal panel (display device) 11 and a backlight device (illumination device) 12 for irradiating the liquid crystal panel 11 with light. The main surface of the liquid crystal panel 11 facing the lens unit 10RE is a display surface 11DS for displaying an image. The lens unit 10RE is disposed between the liquid crystal display device 10 and the user's eyeball 10EY. The lens unit 10RE imparts a refracting effect to light. By adjusting the focal length of the lens unit 10RE, the user can recognize that an image focused on the retina 10EYb via the crystalline lens 10EYa of the eyeball 10EY is displayed on a virtual display 10VD that appears to be located at a distance L2 from the eyeball 10EY. This distance L2 is much larger than the actual distance L1 from the eyeball 10EY to the liquid crystal display device 10. This allows the user to view an enlarged image, which is a virtual image, displayed on the virtual display 10VD, which has a screen size (e.g., about several tens of inches to several hundreds of inches) that is much larger than the screen size (e.g., about several tenths of an inch to a few inches) of the liquid crystal display device 10.

[0020] It is possible to mount one liquid crystal display device 10 on the head mounted device 10HMDa and display an image for the right eye and an image for the left eye on the liquid crystal display device 10. Alternatively, it is possible to mount two liquid crystal display devices 10 on the head mounted device 10HMDa and display an image for the right eye on one liquid crystal display device 10 and an image for the left eye on the other liquid crystal display device 10. The head mounted device 10HMDa may also be provided with earphones or the like that are placed against the user's ears to output sound.

[0021] The configuration of the liquid crystal panel 11 provided in the liquid crystal display device 10 will be described with reference to FIG. 3 and the like. The configuration of the backlight device 12 is as known, and includes, for example, a light source such as an LED and an optical member that converts light from the light source into planar light by applying an optical effect. As shown in FIG. 3, the liquid crystal panel 11 has a rectangular shape as a whole when viewed in a plane. The central part of the screen of the liquid crystal panel 11 is a display area AA where an image is displayed. The outer peripheral part of the screen of the liquid crystal panel 11, which is a frame-like part surrounding the display area AA, is a non-display area NAA where no image is displayed. The area surrounded by the dashed line in FIG. 3 is the display area AA. The liquid crystal panel 11 according to this embodiment is used in the head-mounted display 10HMD described above, and therefore has extremely high resolution, with a pixel density of, for example, 1000 ppi or more, particularly 1200 ppi or more.

[0022] As shown in FIG. 3, the liquid crystal panel 11 is formed by bonding a pair of substrates 20 and 21. The substrate 20 and 21 is a color filter substrate (opposing substrate, CF substrate) 20 arranged on the front side, and an array substrate (active matrix substrate) 21 arranged on the back side. The color filter substrate 20 and the array substrate 21 are formed by laminating various films on the inner side of the substrates 20GS and 21GS made of glass, which are almost transparent and have excellent light transmission. The substrates 20GS and 21GS contain, for example, non-alkali glass as a main material. The array substrate 21 is larger than the color filter substrate 20, and a part of it protrudes laterally from the color filter substrate 20. The flexible substrate 13 is mounted on the protruding portion 21A of the array substrate 21. The flexible substrate 13 is configured by forming a large number of wiring patterns on a base material having insulating properties and flexibility. One end of the flexible substrate 13 is connected to the array substrate 21, and the other end is connected to an external control substrate (signal supply source). Various signals supplied from the control substrate are transmitted to the liquid crystal panel 11 via the flexible substrate 13.

[0023] As shown in FIG. 3, the non-display area NAA of the liquid crystal panel 11 is provided with a circuit section (peripheral circuit section) 14. The circuit section 14 includes a first circuit section 14A and a second circuit section 14B. A pair of the first circuit sections 14A are arranged to sandwich the display area AA from both sides in the X-axis direction. The first circuit section 14A is provided in a strip-shaped range extending along the Y-axis direction. The first circuit section 14A is for supplying scanning signals to gate wiring 25 described later, and is monolithically provided on the array substrate 21. The first circuit section 14A is a GDM (Gate Driver Monolithic) circuit. The first circuit section 14A includes a shift register circuit that outputs scanning signals at a predetermined timing, a buffer circuit that amplifies the scanning signals, and the like. The second circuit section 14B is arranged at a position sandwiched between the display area AA and the flexible substrate 13 in the Y-axis direction. The second circuit section 14B is provided in a strip-shaped range extending along the X-axis direction. The second circuit section 14B is for supplying image signals (data signals) to the source wirings 26 described later, and is monolithically provided on the array substrate 21. The second circuit section 14B includes an SSD (Source Shared Driving) circuit, etc. The second circuit section 14B has a switch function for distributing image signals supplied by the flexible substrate 13 to each source wiring 26, etc.

[0024] Next, the cross-sectional configuration of the liquid crystal panel 11 will be outlined with reference to FIG. 4. As shown in FIG. 4, the pair of substrates 20, 21 are arranged facing each other with a gap in the Z-axis direction, which is the normal direction of the main surfaces of the substrates 20, 21. Between the pair of substrates 20, 21, at least a liquid crystal layer 22 and a seal portion 23 for sealing (sealing) the liquid crystal layer 22 are interposed. The liquid crystal layer 22 contains liquid crystal molecules, which are a substance whose optical properties change with the application of an electric field. The seal portion 23 has a rectangular frame shape (endless ring shape) as a whole in a plan view, and surrounds the liquid crystal layer 22 all around in the non-display area NAA. The seal portion 23 maintains a gap (cell gap) equivalent to the thickness of the liquid crystal layer 22. A polarizing plate 24 is attached to each of the outer surfaces of the pair of substrates 20, 21.

[0025] An outline of the pixel arrangement in the display area AA of the array substrate 21 will be described with reference to FIG. 5. As shown in FIG. 5, a plurality of gate wirings (scanning wirings) 25 and source wirings (image wirings) 26 are arranged in a lattice pattern on the inner surface of the display area AA of the array substrate 21. The gate wirings 25 extend along the X-axis direction so as to cross the display area AA. A plurality of the gate wirings 25 are arranged in a line at intervals in the Y-axis direction. The plurality of gate wirings 25 are supplied with a scanning signal output from the first circuit section 14A described above. The source wirings 26 extend along the Y-axis direction so as to cross the display area AA, and intersect with the gate wirings 25. A plurality of the source wirings 26 are arranged at intervals in the X-axis direction. An image signal output from the second circuit section 14B described above is distributed to the source wirings 26. A TFT (switching element) 27 and a pixel electrode 28 are provided near the intersection of the gate wirings 25 and the source wirings 26. The TFTs 27 and the pixel electrodes 28 are regularly arranged in a row along the X-axis direction and the Y-axis direction. The TFTs 27 are connected to the gate wiring 25, the source wiring 26, and the pixel electrodes 28. The TFTs 27 have a gate electrode 27A to which the gate wiring 25 is connected, a source electrode 27B to which the source wiring 26 is connected, a drain electrode 27C to which the pixel electrodes 28 are connected, and a semiconductor portion 27D to which the source electrode 27B and the drain electrode 27C are connected. The semiconductor portion 27D is made of a semiconductor material and is arranged to overlap the gate electrode 27A. When the TFTs 27 are driven based on a scanning signal supplied from the gate wiring 25 to the gate electrode 27A, the TFTs 27 charge the pixel electrodes 28 to a potential based on an image signal supplied from the source wiring 26 to the source electrode 27B. The pixel electrodes 28 are elongated with the Y-axis direction as the longitudinal direction.

[0026] The configuration of the color filter substrate 20 and the array substrate 21 on each inner surface in the display area AA will be described with reference to FIG. 6. As shown in FIG. 6, the array substrate 21 has a common electrode 30, a pixel circuit section 31, an alignment film, and the like on the inner surface side in the display area AA. The alignment film is not shown. The pixel circuit section 31 is composed of the gate wiring 25, the source wiring 26, the TFT 27, and the like, and has a function of supplying a predetermined potential to a plurality of pixel electrodes 28 at a predetermined timing. The common electrode 30 is located on the upper layer side of the pixel electrodes 28 and is arranged over almost the entire display area AA. As a result, the common electrode 30 overlaps all the pixel electrodes 28 arranged in the display area AA. In this way, in the array substrate 21 according to this embodiment, the "upper layer electrode" that is the electrode located on the upper layer side of the pixel electrodes 28 and the common electrode 30 is the common electrode 30, and the "lower layer electrode" that is the electrode located on the lower layer side is the pixel electrode 28. An insulating film 32 is provided between the pixel electrodes 28 and the common electrode 30. A plurality of slits 30A are formed in the common electrode 30 at portions overlapping the pixel electrodes 28. A common potential signal, which is a common potential (reference potential), is supplied to the common electrode 30 by the pixel circuit section 31. When the pixel electrodes 28 are charged to a potential based on an image signal transmitted to the source wiring 26 in response to the driving of the TFT 27, a potential difference occurs between the pixel electrodes 28 and the common electrode 30. Then, a fringe electric field (oblique electric field) including a component normal to the main surface of the array substrate 21 in addition to a component along the main surface of the array substrate 21 is generated between the opening edge of the slit 30A in the common electrode 30 and the pixel electrodes 28. Therefore, the orientation state of the liquid crystal molecules contained in the liquid crystal layer 22 can be controlled by utilizing this fringe electric field, and a predetermined display is performed based on the orientation state of the liquid crystal molecules. That is, the liquid crystal panel 11 according to this embodiment operates in a FFS (Fringe Field Switching) mode.

[0027] On the other hand, as shown in Fig. 6, a color filter 29, a light-shielding portion 40, and an alignment film are provided on the inner surface side of the display area AA of the color filter substrate 20. The alignment film is not shown. The alignment films provided on the color filter substrate 20 and the array substrate 21 are made of an organic material such as polyimide. Each alignment film is provided on the innermost side (closest to the liquid crystal layer 22) of the color filter substrate 20 and the array substrate 21, respectively. Each alignment film has a function of aligning liquid crystal molecules by performing a photo-alignment treatment on the upper surface facing the liquid crystal layer 22.

[0028] As shown in FIG. 6, the color filter 29 is arranged so as to overlap with the pixel electrode 28 of the array substrate 21, and constitutes a pixel, which is a display unit, together with the overlapping pixel electrode 28. The color filter 29 includes a plurality of types (three types) of different colors. The plurality of types of color filters 29 that exhibit different colors are arranged side by side in the extension direction (X-axis direction) of the gate wiring 25. In other words, the arrangement direction of the plurality of types of color filters 29 that exhibit different colors coincides with the X-axis direction. The plurality of types of color filters 29 that exhibit different colors extend along the extension direction (Y-axis direction) of the source wiring 26. In this way, the plurality of types of color filters 29 that exhibit different colors are arranged in a vertical stripe pattern as a whole. The plurality of color filters 29 that exhibit different colors are arranged so that their boundaries (color boundaries) overlap with the source wiring 26. The color filters 29 include three types of filters: a green color filter (first color filter) 29G that exhibits green, a blue color filter (second color filter) 29B that exhibits blue, and a red color filter (third color filter) 29R that exhibits red. The green color filter 29G constitutes a green pixel (first pixel) that exhibits green together with the overlapping pixel electrode 28. The blue color filter 29B constitutes a blue pixel (second pixel) that exhibits blue together with the overlapping pixel electrode 28. The red color filter 29R constitutes a red pixel (third pixel) that exhibits red together with the overlapping pixel electrode 28. Note that in FIG. 6 and other figures, the colors exhibited by the color filters 29 are indicated by the letters R (Red), G (Green), and B (Blue).

[0029] As shown in FIG. 6, the light shielding portion 40 is provided on the inner surface of the glass substrate (substrate) 20GS and is located below the color filter 29. The light shielding portion 40 extends along the Y-axis direction and is arranged to overlap the source wiring 26 provided on the array substrate 21. A plurality of light shielding portions 40 are arranged in a line at intervals in the X-axis direction, and are arranged in a vertical stripe pattern in a plan view. The plurality of light shielding portions 40 are respectively arranged at color boundaries of the plurality of color filters 29 that exhibit different colors. In detail, the plurality of light shielding portions 40 include a light shielding portion 40 arranged at the boundary between the green color filter 29G and the blue color filter 29B, a light shielding portion 40 arranged at the boundary between the blue color filter 29B and the red color filter 29R, and a light shielding portion 40 arranged at the boundary between the red color filter 29R and the green color filter 29G. The arrangement intervals of the plurality of light shielding portions 40 are approximately equal to the arrangement intervals of the source wiring 26. The light blocking portion 40 can block light from passing between pixels that exhibit different colors. This makes it difficult for color mixture to occur, thereby ensuring the display independence of the display of each pixel that exhibits each color.

[0030] The detailed configuration of the light shielding section 40 will be described. As shown in FIG. 7, the light shielding section 40 has a laminated structure (multilayer film structure) including, from the bottom, a first transmission film 41, a first reflective film (reflective / transmissive film) 42, a second transmission film 43, and a second reflective film 44. The first transmission film 41 is provided on the inner surface of the glass substrate 20GS. The first reflective film 42 is disposed on the upper layer side of the first transmission film 41. The second transmission film 43 is disposed on the upper layer side of the first reflective film 42. The second reflective film 44 is disposed on the upper layer side of the second transmission film 43.

[0031] The first transparent film 41 is preferably made of a material that is almost transparent and has a high refractive index, for example, a light-transmitting resin material (e.g., SiN x(silicon nitride, etc.) and has a refractive index of about 1.9. The first transmission film 41 has a function of reducing reflection of external light by utilizing thin film interference, which will be described later. In order to exert the above-mentioned function of reducing reflection of external light, the film thickness of the first transmission film 41 is preferably in the range of, for example, 20 nm to 100 nm, and specifically, for example, about 70 nm.

[0032] The first reflection film 42 is preferably made of a material having high light reflectivity and light blocking properties, and is made of a metal material (for example, W (tungsten) or the like). The first reflection film 42 has a function of reducing reflection of external light, which will be described later, and a function of re-reflecting light reflected by the second reflection film 44, which will be described later. The film thickness of the first reflection film 42 is preferably set to a range of, for example, 3 nm to 20 nm in order to achieve each of the above-mentioned functions, and is specifically set to, for example, about 10 nm. The film thickness of the first reflection film 42 is smaller than that of the second reflection film 44. Compared to the second reflection film 44, the first reflection film 42 has a high light transmittance and a low light reflectance. Compared to each of the transmission films 41 and 43, the first reflection film 42 has a low light transmittance and a high light reflectance, and thus has a high light blocking property. Specifically, the film thickness of the first reflection film 42 is adjusted so that the light transmittance and the light reflectance are approximately 50% each.

[0033] The second transparent film 43 is preferably made of a material that is almost transparent and has a high refractive index, for example, a light-transmitting resin material (e.g., SiN x The second transmission film 43 is made of a material such as a fluorine-containing film (fluorescent film) having a refractive index of about 1.9. The second transmission film 43 has a function of reducing reflection of external light by utilizing thin film interference, which will be described later. In order to achieve the function of reducing reflection of external light described above, the film thickness of the second transmission film 43 is preferably in the range of, for example, 20 nm to 100 nm, and specifically, is about 60 nm, for example. The film thickness of the second transmission film 43 is smaller than the film thickness of the first transmission film 41.

[0034] The second reflective film 44 is preferably made of a material having high light reflectivity and light blocking properties, and is made of a metal material (for example, W, etc.). The second reflective film 44 mainly functions to block light irradiated from the backlight device 12. That is, the second reflective film 44 can block light that is about to pass between the color filters 29R, 29G, and 29B that are adjacent in the X-axis direction and exhibit different colors. In order to achieve the above-mentioned light blocking function, the film thickness of the second reflective film 44 is preferably, for example, 30 nm or more, and specifically, is, for example, about 100 nm. The film thickness of the second reflective film 44 is larger than the film thickness of the first reflective film 42. Such a second reflective film 44 has a lower light transmittance and a higher light blocking property and light reflectance than the first reflective film 42. Specifically, the film thickness of the second reflective film 44 is adjusted so that the light reflectance is approximately 100% and the light transmittance is approximately 0%.

[0035] Thus, the second reflective film 44 has the lowest light transmittance and the highest light reflectance among the films constituting the light-shielding portion 40. For this reason, the amount of reflected light generated when external light incident on the liquid crystal panel 11 from the outside on the front side is reflected by the second reflective film 44 is greater than the amount of reflected light by the first reflective film 42. If the light reflected by the second reflective film 44 were to be emitted as is, this could significantly degrade the display quality.

[0036] In contrast, among the films constituting the light-shielding portion 40, the first transmission film 41, the first reflection film 42, and the second transmission film 43 mainly function to suppress reflection of external light incident from the outside on the front side of the liquid crystal panel 11. In detail, the above-mentioned external light is incident on the first transmission film 41 after passing through the glass substrate 20GS of the color filter substrate 20. A part of the light incident on the first transmission film 41 is reflected at the interface between the glass substrate 20GS and the first transmission film 41 (the bottom surface of the first transmission film 41), and the remainder passes through the first transmission film 41 and reaches the first reflection film 42. A part (about 50%) of the light that reaches the first reflection film 42 is reflected at the interface between the first transmission film 41 and the first reflection film 42 (the bottom surface of the first reflection film 42), and the remainder (about 50%) passes through the first reflection film 42. A part of the light transmitted through the first reflection film 42 is reflected at the interface between the first reflection film 42 and the second transmission film 43 (the bottom surface of the second transmission film 43), and the rest is transmitted through the second transmission film 43 to reach the second reflection film 44. Almost all of the light that reaches the second reflection film 44 is reflected at the interface between the second transmission film 43 and the second reflection film 44 (the bottom surface of the second reflection film 44). When the light reflected at the interface between the second transmission film 43 and the second reflection film 44 is transmitted through the second transmission film 43 and reaches the first reflection film 42, a part (about 50%) of the light is transmitted through the first reflection film 42, while the rest (about 50%) is reflected again by the first reflection film 42 and heads toward the second reflection film 44. This prevents the light reflected at the interface between the second transmission film 43 and the second reflection film 44 from being emitted from the first transmission film 41 toward the lower layer side.

[0037] Here, the light reflected at the interface between the first transmission film 41 and the first reflection film 42 and the light reflected at the interface between the second transmission film 43 and the second reflection film 44 and transmitted through the first reflection film 42 are canceled to a certain extent based on interference conditions according to the refractive indexes and film thicknesses of the first transmission film 41 and the second transmission film 43. That is, the refractive indexes and film thicknesses of the first transmission film 41 and the second transmission film 43 are adjusted so that the reflected light at the interface between the first transmission film 41 and the first reflection film 42 and the reflected light at the interface between the second transmission film 43 and the second reflection film 44 are in opposite phase to each other. Specifically, in this embodiment, the film thickness of the first transmission film 41 is about 70 nm, the refractive index of the first transmission film 41 is about 1.9, the film thickness of the second transmission film 43 is about 60 nm, and the refractive index of the second transmission film 43 is about 1.9. As a result, the light reflected at the interface between the first transmission film 41 and the first reflection film 42 and the light reflected at the interface between the second transmission film 43 and the second reflection film 44 and transmitted through the first reflection film 42 are in opposite phases, and these lights cancel each other out efficiently, thereby reducing the reflection of external light by the light-shielding section 40. Moreover, a part of the light reflected at the interface between the second transmission film 43 and the second reflection film 44 is repeatedly reflected between the second reflection film 44 and the first reflection film 42 and does not exit to the outside of the front side. In this way, the low reflectivity of the light-shielding section 40 is achieved, and thus the deterioration of display quality due to the installation of the light-shielding section 40 can be sufficiently suppressed.

[0038] As described above, the light shielding portion 40 according to this embodiment has a laminated structure of the first transmitting film 41, the first reflective film 42, the second transmitting film 43, and the second reflective film 44. Therefore, compared to the conventional case in which the light shielding portion 40 is made of a resin material, it is possible to sufficiently increase the exposure accuracy of the exposure device used to pattern the light shielding portion 40 in the manufacturing process. This is suitable for miniaturizing the light shielding portion 40.

[0039] The detailed configuration of each film 41 to 44 constituting the light shielding portion 40 will be mainly described with reference to FIG. 8. As shown in FIG. 8, the first transmission film 41 has a first bottom surface 41A in contact with the glass substrate 20GS and a first side surface 41B inclined with respect to the first bottom surface 41A. The first bottom surface 41A is a surface of the first transmission film 41 opposite to the upper surface 41C and is located opposite to the first reflection film 42 side. The first bottom surface 41A is a flat surface along the X-axis direction (width direction of the light shielding portion 40) and the Y-axis direction (length direction of the light shielding portion 40). The first side surface 41B is provided in pairs at both ends of the first transmission film 41 in the X-axis direction. The first side surface 41B is an inclined surface with a gradient that forms a first angle θ1 with respect to the first bottom surface 41A. The first angle θ1 is an acute angle and is smaller than 90°. That is, the first side surface 41B is a forward tapered inclined surface with respect to the first bottom surface 41A. Specifically, the first angle θ1 is, for example, in the range of 29° to 75°, and is approximately 52° in Fig. 8. The rising base end of the first side surface 41B (the contact point between the first side surface 41B and the inner surface of the glass substrate 20GS) is the outer end 41D of the first transmitting film 41 in the X-axis direction.

[0040] As shown in FIG. 8, the second reflection film 44 has a second bottom surface 44A in contact with the upper surface 43C of the second transmission film 43, and a second side surface 44B inclined with respect to the second bottom surface 44A. The second bottom surface 44A is a surface on the opposite side of the second reflection film 44 from the upper surface 44C, and is parallel to the first bottom surface 41A. The second side surface 44B is provided in a pair at both ends of the second reflection film 44 in the X-axis direction. The second side surface 44B is an inclined surface with a gradient that forms a second angle θ2 with respect to the second bottom surface 44A. The second angle θ2 is an acute angle and is smaller than 90°. That is, the second side surface 44B is an inclined surface that is forward tapered with respect to the second bottom surface 44A. Specifically, the second angle θ2 is, for example, in the range of 50° to 65°, and FIG. 8 illustrates a case where the second angle θ2 is about 57°.

[0041] In this embodiment, the first side surface 41B of the first transmission film 41 forms a first angle θ1 that is an acute angle with respect to the first bottom surface 41A, and the second side surface 44B of the second reflection film 44 forms a second angle θ2 that is an acute angle with respect to the second bottom surface 44A. Therefore, compared to a case in which the first side surface forms an obtuse angle with respect to the first bottom surface 41A and the second side surface forms an obtuse angle with respect to the second bottom surface 44A, when forming the color filters 29R, 29G, 29B in the manufacturing process, the wettability of the material of the color filters 29R, 29G, 29B near the light shielding portion 40 is improved. Since the material of the color filters 29R, 29G, 29B is unlikely to be repelled near the light shielding portion 40, unintended openings (non-formed portions) are unlikely to be formed in the color filters 29R, 29G, 29B.

[0042] As shown in FIG. 8, the first reflection film 42 has a third bottom surface 42A in contact with the top surface 41C of the first transmission film 41, and a third side surface 42B that forms a third angle θ3 with respect to the third bottom surface 42A. The third bottom surface 42A is a surface on the opposite side of the first reflection film 42 from the top surface 42C, is located on the opposite side to the second transmission film 43 side, and is parallel to the first bottom surface 41A. The third side surface 42B is provided in pairs at both ends of the first reflection film 42 in the X-axis direction. The third angle θ3 that the third side surface 42B forms with the third bottom surface 42A may be smaller than 90°, may be larger than 90°, or may even be 90°. That is, the third side surface 42B may be a forward tapered inclined surface with respect to the third bottom surface 42A, may be a reverse tapered inclined surface, or may even be a vertical surface. Specifically, the third angle θ3 is set in the range of, for example, 73° to 105°, and FIG. 8 illustrates a case where the third angle θ3 is set to about 80°. Furthermore, the third angle θ3 is greater than the first angle θ1 and the second angle θ2. In this embodiment, the first reflective film 42 is configured such that the third side surface 42B is in contact with the upper surface 41C of the first permeable film 41 without being in contact with the first side surface 41B. In other words, the first reflective film 42 is disposed such that the third side surface 42B is recessed inward from the first side surface 41B of the first permeable film 41.

[0043] As shown in FIG. 8, the second transmission film 43 has a fourth bottom surface 43A in contact with the upper surface 42C of the first reflection film 42, and a fourth side surface 43B that forms a fourth angle θ4 with respect to the fourth bottom surface 43A. The fourth bottom surface 43A is a surface on the opposite side to the upper surface 43C of the second transmission film 43, is located on the opposite side to the second reflection film 44 side, and is parallel to the first bottom surface 41A. The fourth side surface 43B is provided in pairs at both ends in the X-axis direction of the second transmission film 43. The fourth angle θ4 that the fourth side surface 43B forms with respect to the fourth bottom surface 43A may be smaller than 90°, may be larger than 90°, or may even be 90°. In other words, the fourth side surface 43B may be a forward tapered inclined surface with respect to the fourth bottom surface 43A, may be a reverse tapered inclined surface, or may even be a vertical surface. Specifically, the fourth angle θ4 is set in the range of, for example, 73° to 105°, and FIG. 8 illustrates a case where the fourth angle θ4 is set to about 80°. The fourth angle θ4 is greater than the first angle θ1 and the second angle θ2. In this embodiment, the second transmitting film 43 has a fourth side surface 43B that is substantially flush with the third side surface 42B of the first reflecting film 42 and is parallel to the third side surface 42B. That is, the second transmitting film 43 has a fourth side surface 43B that is recessed inward relative to the first side surface 41B of the first transmitting film 41.

[0044] 8, the second reflective film 44 has a fifth side surface 44D in addition to the second side surface 44B. The fifth side surface 44D forms a fifth angle θ5, which is an obtuse angle, with the second bottom surface 44A, and is in contact with the second side surface 44B and the second bottom surface 44A. That is, the fifth side surface 44D is an inverted tapered inclined surface with respect to the second bottom surface 44A. Specifically, the fifth angle θ5 is set to, for example, a range of 97° to 137°, and FIG. 8 illustrates a case where the fifth angle θ5 is set to about 110°. The contact point between the fifth side surface 44D and the second side surface 44B is the outer end 44E of the second reflective film 44 in the X-axis direction. That is, the second reflective film 44 is configured such that a portion including the outer end 44E protrudes outward in the X-axis direction relative to the second transmitting film 43. Also, the contact point between the fifth side surface 44D and the second side surface 44B is disposed closer to the second bottom surface 44A than to the top surface 44C in the Z-axis direction. That is, the fifth side surface 44D has a smaller area than the second side surface 44B.

[0045] As shown in Fig. 8, the light-shielding portion 40 is configured such that a line segment LS connecting an outer end 41D of the first transmission film 41 and an outer end 44E of the second reflection film 44 forms an acute angle with the first bottom surface 41A. More specifically, the light-shielding portion 40 is configured such that a sixth angle θ6, which is an angle that the line segment LS forms with the first bottom surface 41A, is in the range of 70° or more and 90° or less. In Fig. 8, the line segment LS is illustrated by a two-dot chain line. The sixth angle θ6 is greater than the first angle θ1 and the second angle θ2.

[0046] The liquid crystal display device 10 according to this embodiment has the above-mentioned structure, and its manufacturing method will be described below. The liquid crystal display device 10 is manufactured by assembling the liquid crystal panel 11 and the backlight device 12, which are manufactured separately. The manufacturing method of the liquid crystal panel 11 includes a color filter substrate manufacturing process (CF substrate manufacturing process) for manufacturing the color filter substrate 20, an array substrate manufacturing process for manufacturing the array substrate 21, and a bonding process for bonding the manufactured color filter substrate 20 and the array substrate 21 together. The color filter substrate manufacturing process will be described below.

[0047] The color filter substrate manufacturing process includes at least a first step (second light-shielding portion forming step) of forming a light-shielding portion 40 on the inner surface of the glass substrate 20GS, and a second step (color filter forming step) of forming a color filter 29 on the upper layer side of the light-shielding portion 40. The first step will be described in detail below.

[0048] In the first step, the first transmission film 41, the first reflective film 42, the second transmission film 43, the second reflective film 44, and the resist film R are formed (film formation step), and the resist film R is exposed and developed (exposure and development step). In the film formation step, the first transmission film 41 is formed on the glass substrate (substrate) 20GS, the first reflective film 42 is formed on the upper side of the first transmission film 41, the second transmission film 43 is formed on the upper side of the first reflective film 42, the second reflective film 44 having a thickness larger than that of the first reflective film 42 is formed on the upper side of the second transmission film 43, and the resist film R having photosensitivity is formed on the upper side of the second reflective film 44. The resist film R may be a positive type or a negative type. In the exposure and development step, the resist film R is irradiated with light emitted from a light source of an exposure device through a photomask to which a predetermined exposure pattern is applied. The resist film R is selectively exposed to a portion according to the exposure pattern of the photomask. When the exposed resist film R is developed, the exposed or unexposed portions of the resist film R are selectively removed (see FIG. 11).

[0049] In the first step, after the exposure and development steps are completed, etching is performed using the resist film R as a mask (etching step). In the etching step, an etching apparatus 50 shown in FIG. 9 is used. The etching apparatus 50 will be described. The etching apparatus 50 of this embodiment is a dry etching apparatus that employs an inductively coupled plasma (ICP) method. As shown in FIG. 9, the etching apparatus 50 has at least a vacuum chamber (etching processing chamber) 51, a substrate support part 52, a dielectric 53, and a coil (antenna) 54. The vacuum chamber 51 can accommodate the glass substrate 20GS therein, and is maintained in a vacuum state when etching is performed. The dielectric 53 is made of, for example, quartz glass, and is disposed at an upper part in the vacuum chamber 51. The coil 54 is disposed above the dielectric 53 outside the vacuum chamber 51. A first high frequency power supply (plasma generation power supply) RF1 is connected to the coil 54, and a high frequency current (RF (radio-frequency) current) is supplied by the first high frequency power supply RF1. When a high-frequency current is supplied from the first high-frequency power supply RF1 to the coil 54, an induced electric field is generated in the plasma, and the resulting acceleration of electrons generates high-density plasma. The substrate support 52 is disposed in the lower part of the vacuum chamber 51, and supports the glass substrate 20GS. The substrate support 52 constitutes a lower electrode, and is connected to a second high-frequency power supply (bias power supply) RF2. A high-frequency current is supplied to the substrate support 52, which is the lower electrode, by the second high-frequency power supply RF2.

[0050] As shown in FIG. 10, the substrate support portion 52 has a plurality of protrusions (embossments) 52A on the main surface facing the glass substrate 20GS. The plurality of protrusions 52A are arranged in a line at intervals in the X-axis direction and the Y-axis direction in the main surface of the glass substrate 20GS, and support the glass substrate 20GS from below. The arrangement interval of the plurality of protrusions 52A is about several mm. The protrusions 52A are roughly hemispherical and are in point contact with the main surface of the glass substrate 20GS. Since the substrate support portion 52 has a plurality of protrusions 52A in this way, the contact area of ​​the substrate support portion 52 with the glass substrate 20GS is smaller than when the substrate support portion is in surface contact with the main surface of the glass substrate 20GS. As a result, even if the material of the first reflection film 42 or the second reflection film 44 scatters and adheres to the surface of the substrate support portion 52 as etching is performed, etching defects are less likely to occur due to the adhered material.

[0051] On the other hand, as shown in Fig. 10, the glass substrate 20GS has a portion that contacts the protrusion 52A and a portion that does not contact the protrusion 52A, and this raises concerns about differences in heat dissipation between these portions. If differences in heat dissipation between portions of the glass substrate 20GS occur, differences will also occur in the amount of retraction of the resist film R as etching progresses, and there is a concern that differences will also occur in the finished width dimension (dimension in the X-axis direction) of the light-shielding portion 40. If differences in the width dimension of the light-shielding portion 40 occur between portions of the glass substrate 20GS in this way, there is a risk that display unevenness reflecting the arrangement interval of the protrusions 52A will be visible.

[0052] In order to solve such a problem, in this embodiment, the etching process includes a first etching process and a second etching process in which the etching rate is slower than that in the first etching process. In detail, in the first etching process, at least the second reflective film 44 is etched using the resist film R as a mask, and the etching rate is made faster than that in the second etching process. Specifically, in the first etching process, at least SF6 gas is used as an etching gas (reactive gas) to be introduced into the vacuum chamber 51, so that the etching rate is made faster than that in the second etching process. On the other hand, in the second etching process, the second reflective film 44, the second permeable film 43, the first reflective film 42, and the first permeable film 41 are etched using the resist film R as a mask, and the etching rate is made slower than that in the first etching process. Specifically, in the second etching process, at least CF4 gas and O2 gas are used as an etching gas to be introduced into the vacuum chamber 51, so that the etching rate is made slower than that in the first etching process.

[0053] The first etching step is performed by etching at least the second reflective film 44 through the resist film R patterned through the exposure and development steps, as shown in Fig. 11. When the first etching step is performed, at least the portion of the second reflective film 44 that is not covered by the resist film R is removed, as shown in Fig. 12. Since the etching rate in the first etching step is faster than the etching rate in the second etching step, the second reflective film 44 at the stage when the first etching step is performed is processed so that its side surface forms a large angle close to 90° with respect to the bottom surface.

[0054] Subsequently, when a second etching step is performed through the resist film R, as shown in Fig. 13, the portions of the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 that are not covered by the resist film R are removed, thereby forming the light-shielding portion 40. In Fig. 13, each of the films 41-44 and R in a state before the second etching step is performed is illustrated by a two-dot chain line. Since the etching rate in the second etching step is slower than the etching rate in the first etching step, the resist film R gradually retreats as the etching proceeds, and the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are gradually etched. As a result, the second reflective film 44, the second permeable film 43, the first reflective film 42 and the first permeable film 41 are processed so that the angles that the side surfaces 41B-44B make with the bottom surfaces 41A-44A are smaller than the angles of the side surfaces processed if only the first etching step is performed without the second etching step in the etching step. After the second etching step is completed, ashing is performed to remove the resist film R (ashing step).

[0055] After the first step is completed, the second step is performed. In the second step, the materials of the color filters 29R, 29G, and 29B of each color are sequentially applied to the inner surface of the glass substrate 20GS using an inkjet device or the like. For example, when the material of the green color filter 29G is applied, its end is disposed on the upper layer side of the light shielding portion 40. Then, when the material of the blue color filter 29B is applied, its end is disposed adjacent to the green color filter 29G on the upper layer side of the light shielding portion 40. Then, when the material of the red color filter 29R is applied, its end is disposed adjacent to the green color filter 29G and the blue color filter 29B on the upper layer side of the light shielding portion 40. The order in which the materials of the color filters 29R, 29G, and 29B of each color are applied can be appropriately changed to other than the above.

[0056] As described above, in the first step according to this embodiment, by performing the first etching step and then the second etching step, at least the first angle θ1 that the first side surface 41B of the first permeable film 41 makes with respect to the first bottom surface 41A and the second angle θ2 that the second side surface 44B of the second reflective film 44 makes with respect to the second bottom surface 44A can both be acute angles. Also, the first reflective film 42 and the second permeable film 43 have their respective side surfaces 42B, 43B recessed inward from the first side surface 41B of the first permeable film 41, and the third side surface 42B comes into contact with the upper surface 41C of the first permeable film 41 without coming into contact with the first side surface 41B. In addition, the third angle θ3 that the third side surface 42B of the first reflective film 42 makes with respect to the third bottom surface 42A, and the fourth angle θ4 that the fourth side surface 43B of the second transparent film 43 makes with respect to the fourth bottom surface 43A are both greater than the first angle θ1.

[0057] According to this embodiment, the recession of the first transmission film 41 and the second transmission film 43 is suppressed, and a large undercut is less likely to occur in the light shielding portion 40, compared to the case where the etching process is composed of only the first etching process. Furthermore, according to this embodiment, the first angle θ1 that the first side surface 41B of the first transmission film 41 makes with respect to the first bottom surface 41A and the second angle θ2 that the second side surface 44B of the second reflection film 44 makes with respect to the second bottom surface 44A can both be made larger, compared to the case where the etching process is composed of only the second etching process. Therefore, the heat transfer from the second reflection film 44 side to the first transmission film 41 side is reduced, and the difference in heat dissipation that may occur between the portion of the glass substrate 20GS that contacts the protrusion 52A and the portion that does not contact the protrusion 52A can be mitigated. As a result, the finished width dimension of the light shielding portion 40 is made uniform, and the amount of transmitted light that passes through each of the color filters 29R, 29G, and 29B is made uniform. Furthermore, compared to a case in which the first angle that the first side surface of the first transmitting film 41 makes with respect to the first bottom surface 41A and the second angle that the second side surface of the second reflective film 44 makes with respect to the second bottom surface 44A are both obtuse angles, the wettability of the material of each of the color filters 29G, 29B near the light shielding portion 40 is improved when forming each of the color filters 29G, 29B in the second step. Therefore, the material of each of the color filters 29G, 29B is less likely to be repelled near the light shielding portion 40, and unintended openings are less likely to occur in each of the color filters 29G, 29B.

[0058] In addition, since the third side surface 42B of the first reflective film 42 is recessed inward from the first side surface 41B, the heat transfer from the first reflective film 42 to the first transmitting film 41 is lower than in a configuration in which the third side surface is in contact with the first side surface 41B. Therefore, even if the substrate support portion 52 of the etching device 50 used in the etching process has a configuration in which a plurality of intermittently arranged protrusions 52A are provided, a difference in heat dissipation is unlikely to occur between a portion of the glass substrate 20GS that is in contact with the protrusions 52A and a portion that is not in contact with the protrusions 52A. This makes the finish of the light-shielding portion 40 uniform, and therefore the amount of transmitted light passing through each of the color filters 29R, 29G, and 29B is equalized. Moreover, since the light shielding portion 40 is configured so that the third angle θ3 and the fourth angle θ4 are larger than the first angle θ1, the heat transfer from the first reflective film 42 to the first transmissive film 41 is lower than when the third angle and the fourth angle are equal to or smaller than the first angle θ1. This makes the finish of the light shielding portion 40 more uniform. Furthermore, the second reflective film 44 has a fifth side surface 44D that forms an obtuse fifth angle θ5 with respect to the second bottom surface 44A and is in contact with the second bottom surface 44A, and is configured so that a part of the second reflective film 44 protrudes outward from the second transmissive film 43. Therefore, compared to when the second reflective film does not have the fifth side surface 44D, the heat transfer from the second reflective film 44 to the second transmissive film 43 is lower. This makes the finish of the light shielding portion 40 more uniform.

[0059] In addition, the light shielding portion 40 is configured such that the sixth angle θ6 formed by the line segment LS connecting the outer end 41D of the first transmission film 41 and the outer end 44E of the second reflection film 44 with respect to the first bottom surface 41A is in the range of 70° or more and 90° or less. Since the sixth angle θ6 is set to be 90° or less in this manner, compared to the case where the sixth angle exceeds 90°, when forming the color filters 29R, 29G, 29B in the second step, the wettability of the material of the color filters 29R, 29G, 29B near the light shielding portion 40 is improved. As a result, the material of the color filters 29R, 29G, 29B is less likely to be repelled near the light shielding portion 40, and unintended openings are less likely to occur in the color filters 29R, 29G, 29B. On the other hand, since the sixth angle θ6 is set to 70° or more, the heat transfer from the second reflective film 44 side to the first transmitting film 41 side is lower than when the sixth angle is less than 70°. Therefore, even if the substrate support portion 52 of the etching device 50 used in the etching process has a configuration in which a plurality of intermittently arranged protrusions 52A are provided, a difference in heat dissipation is unlikely to occur between a portion of the glass substrate 20GS that contacts the protrusions 52A and a portion that does not contact the protrusions 52A. This makes the finished width dimension of the light shielding portion 40 uniform, and therefore the amount of transmitted light passing through each of the color filters 29R, 29G, and 29B is equalized.

[0060] Next, to verify the superiority of the color filter substrate 20 according to this embodiment, the following Comparative Experiment 1 was performed. In Comparative Experiment 1, the conditions of the first step included in the color filter substrate manufacturing process were changed as described below, and a light-shielding portion 40 was provided on each of the color filter substrates 20 of Comparative Examples 1 to 4 and Examples 1 to 7.

[0061] In Comparative Example 1, the first step is composed of only the first etching step, and SF6 gas and O2 gas are used. In Comparative Examples 2 and 3, the first step is composed of only the second etching step, and CF4 gas and O2 gas are used. Comparative Examples 2 and 3 are the same conditions, but etching is performed in different vacuum chambers 51 among the multiple vacuum chambers 51 provided in the etching device 50. Comparative Example 4 and Examples 1 to 7 are common in that the first step is composed of the first etching step and the second etching step, and the first etching step is performed before the second etching step. Comparative Example 4 and Examples 1 to 7 are also common in that the first etching step uses SF6 gas and O2 gas, and the second etching step uses CF4 gas, O2 gas, and Cl2 gas.

[0062] On the other hand, Comparative Example 4 and Examples 1 to 7 are different in any one of the time for performing the first etching step, the time for performing the second etching step, and the flow rate of Cl2 gas in the second etching step, and Example 1 is the reference for these parameters. In detail, Example 2 is 10 seconds longer than Example 1 in the time for performing the first etching step. Example 3 is 10 seconds shorter than Example 1 in the time for performing the first etching step. Example 4 is 1.33 times the flow rate of Cl2 gas in the second etching step. Example 5 is 0.66 times the flow rate of Cl2 gas in the second etching step. Example 6 is 15 seconds longer than Example 1 in the time for performing the second etching step. Example 7 is 15 seconds shorter than Example 1 in the time for performing the second etching step. Comparative Example 4 is 30 seconds longer than Example 1 in the time for performing the second etching step.

[0063] In Comparative Experiment 1, an image (SEM image) of the light-shielding portion 40 was obtained for each of the manufactured color filter substrates 20 of Comparative Examples 1 to 4 and Examples 1 to 7 using a scanning electron microscope (SEM). Based on the obtained image of the light-shielding portion 40, a sixth angle θ6 was measured, which is an angle formed by a line segment LS connecting an outer end 41D of the first transmission film 41 and an outer end 44E of the second reflection film 44 with respect to the first bottom surface 41A. Furthermore, each of the color filter substrates 20 of Comparative Examples 1 to 4 and Examples 1 to 7 was bonded to an array substrate 21 to manufacture a liquid crystal panel 11, and a lighting test was performed on the manufactured liquid crystal panel 11 to determine whether display unevenness (display defect) was visible. The experimental results of Comparative Experiment 1 are as shown in Figs. 14 to 24. Figs. 14 to 24 show images, the sixth angle θ6, and the determination results. The sixth angle θ6 is expressed in degrees. The evaluation results are indicated as follows: "◯" indicates that the display unevenness is hardly visible; "X" indicates that the display unevenness is visible over the entire area; and "△" indicates that the display unevenness is partially visible. FIG. 14 shows the experimental results of Comparative Example 1. FIG. 15 shows the experimental results of Comparative Example 2. FIG. 16 shows the experimental results of Comparative Example 3. FIG. 17 shows the experimental results of Comparative Example 4. FIG. 18 shows the experimental results of Example 1. FIG. 19 shows the experimental results of Example 2. FIG. 20 shows the experimental results of Example 3. FIG. 21 shows the experimental results of Example 4. FIG. 22 shows the experimental results of Example 5. FIG. 23 shows the experimental results of Example 6. FIG. 24 shows the experimental results of Example 7.

[0064] The experimental results of Comparative Experiment 1 will be described. As shown in Figs. 14 to 17, in Comparative Examples 1 to 4, the judgment result was either "x" or "Δ", and the sixth angle θ6 was smaller than 70° or larger than 90°. In detail, in Comparative Example 1, the judgment result was "x", and the sixth angle θ6 was 99°. In Comparative Example 2, the judgment result was "Δ", and the sixth angle θ6 was 50°. In Comparative Example 3, the judgment result was "x", and the sixth angle θ6 was 47°. In Comparative Example 4, the judgment result was "Δ", and the sixth angle θ6 was 64°. Among them, in Comparative Example 1, a large undercut occurs in the light shielding portion 40, and the sixth angle θ6 exceeds 90°. Therefore, when forming each of the color filters 29R, 29G, 29B, the wettability of the material of each of the color filters 29R, 29G, 29B deteriorates near the light shielding portion 40, causing the material to be "repelled", resulting in unintended openings (non-formed portions) in each of the color filters 29R, 29G, 29B. It is presumed that this is why the judgment result was "x". In Comparative Examples 2 to 4, the sixth angle θ6 is smaller than 70°, so that the heat transfer from the second reflection film 44 side to the first transmission film 41 side is high. For this reason, in Comparative Examples 2 to 4, a large difference occurs in heat dissipation between the portion where the glass substrate 20GS contacts and the portion where the glass substrate 20GS does not contact the multiple protrusions 52A provided on the substrate support portion 52 of the etching device 50 used in the first step, and the difference causes a large difference in the finished width dimension of the light shielding portion 40. As a result, a large difference occurs in the amount of light transmitted through each of the color filters 29R, 29G, and 29B, and it is presumed that the judgment result was "x" or "△". In particular, in Comparative Example 3, since the sixth angle θ6 is 47°, which is less than 50°, a large difference occurs in the finished width dimension of the light-shielding portion 40, and it is presumed that the judgment result was "x". On the other hand, in Comparative Examples 2 and 4, since the sixth angle θ6 is 50° or more, the difference in the finished width dimension of the light-shielding portion 40 is smaller than that in Comparative Example 3, and as a result, it is presumed that the judgment results were both "△".

[0065] In contrast, as shown in Figs. 18 to 24, in Examples 1 to 7, the judgment result was "○" and the sixth angle θ6 was in the range of 70° or more and 90° or less. In detail, in Example 1, the judgment result was "○" and the sixth angle θ6 was 74°. In Example 2, the judgment result was "○" and the sixth angle θ6 was 78°. In Example 3, the judgment result was "○" and the sixth angle θ6 was 70°. In Example 4, the judgment result was "○" and the sixth angle θ6 was 70°. In Example 5, the judgment result was "○" and the sixth angle θ6 was 74°. In Example 6, the judgment result was "○" and the sixth angle θ6 was 71°. In Example 7, the judgment result was "○" and the sixth angle θ6 was 81°. In all of Examples 1 to 7, the sixth angle θ6 is set to 90° or less, and therefore, compared to Comparative Example 1 in which the sixth angle θ6 exceeds 90°, when forming each of the color filters 29R, 29G, 29B, the wettability of the material of each of the color filters 29R, 29G, 29B is good near the light-shielding portion 40, and the material is less likely to be "repelled." As a result, unintended openings are less likely to occur in each of the color filters 29R, 29G, 29B. In all of Examples 1 to 7, the sixth angle θ6 is set to 70° or more, and therefore, compared to Comparative Examples 2 to 4 in which the sixth angle θ6 is less than 70°, the heat transfer from the second reflective film 44 side to the first transmissive film 41 side is lower. For this reason, in Examples 1 to 7, there is little difference in heat dissipation between the portion of the glass substrate 20GS that contacts the plurality of protrusions 52A provided on the substrate support portion 52 of the etching device 50 used in the first step and the portion that does not contact the glass substrate 20GS, so there is little difference in the finished width dimension of the light shielding portion 40. As a result, it is presumed that there is little difference in the amount of light transmitted through each of the color filters 29R, 29G, and 29B, and the judgment result was "○". As described above, in Examples 1 to 7, unintended openings are unlikely to occur in each of the color filters 29R, 29G, and 29B, and there is little difference in the finished width dimension of the light shielding portion 40, so that display unevenness is unlikely to be visually recognized.Although undercuts are generated in all the light-shielding portions 40 in Examples 1, 2, 5, and 7, the size of the undercuts is smaller than that generated in the light-shielding portions 40 in Comparative Example 1, and therefore the "bounce" of the material of each of the color filters 29R, 29G, and 29B is sufficiently suppressed, and the effect of reducing the heat transfer from the second reflective film 44 side to the first transmissive film 41 side is sufficiently obtained, which is preferable. On the other hand, in Examples 3, 4, and 6, the second reflective film 44 is configured to have no fifth side surface 44D (configuration in which no undercuts are generated), and even with this configuration, the occurrence of display unevenness is sufficiently suppressed.

[0066] As described above, the color filter substrate 20 of the present embodiment includes the green color filter (first color filter) 29G, the blue color filter (second color filter) 29B that exhibits a color different from that of the green color filter 29G, and the light-shielding portion 40 that is disposed at the boundary between the green color filter 29G and the blue color filter 29B below the green color filter 29G and the blue color filter 29B. The light-shielding portion 40 includes the first transmission film 41, the first reflective film 42 that is disposed above the first transmission film 41, and the first reflective film 43 that is disposed above the first transmission film 41. 2, and a second reflective film 44 arranged on the upper side of the second reflective film 43 and having a thickness greater than that of the first reflective film 42. The first reflective film 41 has a first bottom surface 41A located on the side opposite to the first reflective film 42 side, and a first side surface 41B forming a first angle θ1 that is an acute angle with the first bottom surface 41A. The second reflective film 44 has a second bottom surface 44A that is in contact with an upper surface 43C of the second reflective film 43 and is parallel to the first bottom surface 41A, and a second side surface 44B that forms a second angle θ2 that is an acute angle with the second bottom surface 44A.

[0067] Light passing between the green color filter 29G and the blue color filter 29B is blocked by the light blocking portion 40 located at the boundary between the green color filter 29G and the blue color filter 29B. This makes it difficult for color mixture to occur.

[0068] External light incident on the light shielding portion 40 from the lower layer side passes through the first transmission film 41 and then reaches the first reflection film 42. Since the first reflection film 42 has a smaller film thickness than the second reflection film 44, it does not reflect all the light, but reflects a predetermined amount of light while transmitting a predetermined amount of light. The light that has passed through the first reflection film 42 passes through the second transmission film 43 and reaches the second reflection film 44. Since the second reflection film 44 has a larger film thickness than the first reflection film 42, it can reflect almost all the light. The light reflected by the first reflection film 42 and the light reflected by the second reflection film 44 are canceled out to a certain extent based on interference conditions according to the refractive indexes and film thicknesses of the first transmission film 41 and the second transmission film 43. This suppresses the reflection of external light by the light shielding portion 40. Furthermore, a predetermined amount of the light reflected by the second reflective film 44 is reflected again by the first reflective film 42 back toward the second reflective film 44, thereby preventing the light from being emitted from the first transparent film 41 toward the lower layer side.

[0069] In this way, the light shielding portion 40 has a laminated structure of the first transmitting film 41, the first reflective film 42, the second transmitting film 43, and the second reflective film 44. Therefore, compared to the conventional case where the light shielding portion 40 is made of a resin material, it is possible to sufficiently increase the exposure accuracy of an exposure device used when patterning the light shielding portion 40 in the manufacturing process. This is suitable for miniaturizing the light shielding portion 40. In addition, since the first side surface 41B of the first transmitting film 41 forms a first angle θ1 that is an acute angle with the first bottom surface 41A and the second side surface 44B of the second reflecting film 44 forms a second angle θ2 that is an acute angle with the second bottom surface 44A, the wettability of the material of each of the color filters 29G, 29B near the light shielding portion 40 is improved when forming each of the color filters 29G, 29B in the manufacturing process, compared to a case in which the first side surface forms an obtuse angle with the first bottom surface 41A and the second side surface forms an obtuse angle with the second bottom surface 44A. Therefore, the material of each of the color filters 29G, 29B is less likely to be repelled near the light shielding portion 40, and unintended openings are less likely to occur in each of the color filters 29G, 29B.

[0070] The first reflection film 42 has a third bottom surface 42A in contact with the upper surface 41C of the first transmission film 41 and parallel to the first bottom surface 41A, and a third side surface 42B that forms a third angle θ3 with the third bottom surface 42A, and the second transmission film 43 has a fourth bottom surface 43A in contact with the upper surface 42C of the first reflection film 42 and parallel to the first bottom surface 41A, and a fourth side surface 43B that forms a fourth angle θ4 with the fourth bottom surface 43A, and the first reflection film 42 is configured such that the third side surface 42B does not contact the first side surface 41B but contacts the upper surface 41C of the first transmission film 41. In this way, since the third side surface 42B is disposed inwardly with respect to the first side surface 41B, the heat transfer from the first reflection film 42 to the first transmission film 41 is lower than in a configuration in which the third side surface is in contact with the first side surface 41B. Therefore, in the manufacturing process, when an etching device 50 is used to pattern the light shielding portion 40 and the color filter substrate 20 is supported by a substrate support portion 52 including intermittent protrusions 52A, a difference in heat dissipation is unlikely to occur between a portion of the color filter substrate 20 that contacts the protrusions 52A and a portion that does not contact the protrusions 52A. This makes the finish of the light shielding portion 40 uniform, and therefore the amount of light transmitted through each of the color filters 29G, 29B is equalized.

[0071] Moreover, the light-shielding portion 40 is configured so that the third angle θ3 and the fourth angle θ4 are larger than the first angle θ1. In this way, the heat transfer from the first reflective film 42 to the first transmissive film 41 becomes lower than when the third angle and the fourth angle are set to be equal to or smaller than the first angle θ1. This makes the finish of the light-shielding portion 40 more uniform.

[0072] The second reflective film 44 also has a fifth side surface 44D that forms an obtuse fifth angle θ5 with respect to the second bottom surface 44A and is in contact with the second bottom surface 44A. The second reflective film 44 having the fifth side surface 44D is configured to partially protrude outward from the second transmitting film 43. Therefore, compared to a case in which the second reflective film does not have the fifth side surface 44D, the heat transfer from the second reflective film 44 to the second transmitting film 43 is lower. This allows the finish of the light-shielding portion 40 to be more uniform.

[0073] In addition, the light shielding portion 40 is configured such that the sixth angle θ6, which is the angle that the line segment LS that connects the outer end 41D of the first transmission film 41 and the outer end 44E of the second reflection film 44 makes with respect to the first bottom surface 41A, is in the range of 70° or more and 90° or less. Since the sixth angle θ6, which is the angle that the line segment LS makes with respect to the first bottom surface 41A, is set to 90° or less, the wettability of the material of each of the color filters 29G, 29B near the light shielding portion 40 is improved when forming each of the color filters 29G, 29B in the manufacturing process, compared to the case where the sixth angle exceeds 90°. As a result, the material of each of the color filters 29G, 29B is less likely to be repelled near the light shielding portion 40, and unintended openings are less likely to occur in each of the color filters 29G, 29B. On the other hand, since the sixth angle θ6, which is the angle between the line segment LS and the first bottom surface 41A, is set to 70° or more, the heat transfer from the second reflective film 44 side to the first transmissive film 41 side is lower than when the sixth angle is less than 70°. Therefore, in the manufacturing process, when an etching device 50 is used to pattern the light-shielding portion 40 and the color filter substrate 20 is supported by a substrate support portion 52 including intermittent protrusions 52A, a difference in heat dissipation is unlikely to occur between a portion of the color filter substrate 20 that contacts the protrusions 52A and a portion that does not contact the protrusions 52A. This homogenizes the finish of the light-shielding portion 40, and thus the amount of light transmitted through each color filter 29G, 29B is equalized.

[0074] Moreover, the liquid crystal display device (display device) 10 according to this embodiment includes the above-described color filter substrate 20 and an array substrate 21 disposed to face the color filter substrate 20. According to such a liquid crystal display device 10, the light-shielding portions 40 of the color filter substrate 20 are miniaturized, which is suitable for achieving high definition of a displayed image.

[0075] Moreover, the manufacturing method of the color filter substrate 20 according to this embodiment includes forming a first transmission film 41 on a glass substrate (substrate) 20GS, forming a first reflective film 42 on the upper side of the first transmission film 41, forming a second transmission film 43 on the upper side of the first reflective film 42, forming a second reflective film 44 having a thickness larger than that of the first reflective film 42 on the upper side of the second transmission film 43, forming a photosensitive resist film R on the upper side of the second reflective film 44, exposing and developing the resist film R, and performing a first etching process in which at least the second reflective film 44 is etched using the resist film R as a mask, and as a mask to perform a second etching in which the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are etched at an etching rate slower than that of the first etching, thereby forming a light-shielding portion 40 consisting of the first transparent film 41, the first reflective film 42, the second transparent film 43, and the second reflective film 44, forming a green color filter 29G whose end is disposed on the upper layer side of the light-shielding portion 40, and forming a blue color filter 29B which has a different color from the green color filter 29G and whose end is disposed on the upper layer side of the light-shielding portion 40 and adjacent to the green color filter 29G.

[0076] After the first transmission film 41, the first reflection film 42, the second transmission film 43, the second reflection film 44, and the resist film R are formed in sequence, the resist film R is exposed and developed. When the first etching is performed through the patterned resist film R, at least a portion of the second reflection film 44 that is not covered by the resist film R is removed. Then, when the second etching is performed through the resist film R, a portion of the second reflection film 44, the second transmission film 43, the first reflection film 42, and the first transmission film 41 that is not covered by the resist film R is removed, thereby forming the light-shielding portion 40. After that, when the green color filter 29G and the blue color filter 29B are formed, the light-shielding portion 40 is disposed at the boundary between the green color filter 29G and the blue color filter 29B.

[0077] The first etching and the second etching will be described in detail. When the first etching, which has a faster etching rate than the second etching, is performed first, the second reflective film 44 is processed so that its side surface forms a large angle close to 90° with respect to the bottom surface. Then, when the second etching, which has a slower etching rate than the first etching, is performed, the resist film R gradually retreats while etching of the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 progresses, so that the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are processed so that the angles that the side surfaces 41B-44B make with respect to the bottom surfaces 41A-44A of the second reflective film 44, the second transparent film 43, the first reflective film 42, and the first transparent film 41 are smaller than the angles of the side surfaces processed when only the first etching is performed without performing the second etching. As a result, it is possible to make both the first angle θ1, which is the angle between the first side surface 41B, which is the side surface of the first transmitting film 41, and the first bottom surface 41A, which is the bottom surface, and the second angle θ2, which is the angle between the second side surface 44B, which is the side surface of the second reflecting film 44, and the second bottom surface 44A, which is the bottom surface, acute angles. Furthermore, since recession of the first transmitting film 41 and the second transmitting film 43 is suppressed compared to the case where only the first etching is performed, large undercuts are less likely to occur in the light-shielding portion 40.

[0078] The light shielding portion 40 thus formed has a laminated structure of a first transmitting film 41, a first reflective film 42, a second transmitting film 43, and a second reflective film 44. Therefore, compared to the conventional case where the light shielding portion 40 is made of a resin material, it is possible to sufficiently increase the exposure accuracy of an exposure device used for patterning the light shielding portion 40 in the manufacturing process. This is suitable for miniaturizing the light shielding portion 40. In addition, since the first angle θ1, which is the angle that the first side surface 41B, which is the side surface of the first transmission film 41, makes with respect to the first bottom surface 41A, which is the bottom surface, and the second angle θ2, which is the angle that the second side surface 44B, which is the side surface of the second reflection film 44, makes with respect to the second bottom surface 44A, which is the bottom surface, are both acute angles, the wettability of the material of each of the color filters 29G, 29B near the light shielding portion 40 is improved when forming each of the color filters 29G, 29B in the manufacturing process, compared to a case in which the first angle that the first side surface of the first transmission film 41 makes with respect to the first bottom surface 41A and the second angle that the second side surface of the second reflection film 44 makes with respect to the second bottom surface 44A are both obtuse angles. Therefore, the material of each of the color filters 29G, 29B is less likely to be repelled near the light shielding portion 40, and unintended openings are less likely to occur in each of the color filters 29G, 29B.

[0079] In addition, at least SF6 gas is used in the first etching, and at least CF4 gas and O2 gas are used in the second etching. In this way, by using at least SF6 gas in the first etching and at least CF4 gas and O2 gas in the second etching, the etching rate in the first etching can be increased and the etching rate in the second etching can be decreased.

[0080] In the first and second etching, an etching apparatus 50 is used, which has a vacuum chamber 51 in which the glass substrate 20GS is accommodated, and a substrate support part 52 arranged in the vacuum chamber 51, the substrate support part 52 having a plurality of protrusions 52A arranged at intervals on the main surface of the glass substrate 20GS to support the glass substrate 20GS. When the first and second etching are performed, the glass substrate 20GS accommodated in the vacuum chamber 51 of the etching apparatus 50 is supported by the plurality of protrusions 52A provided on the substrate support part 52. Compared to the case where the substrate support part is in surface contact with the main surface of the glass substrate 20GS, the contact area of ​​the substrate support part 52 with the glass substrate 20GS is smaller. As a result, even if the material of the first reflection film 42 or the second reflection film 44 scatters and adheres to the surface of the substrate support part 52 as the first and second etching are performed, etching defects due to the adhered material are unlikely to occur. On the other hand, since the glass substrate 20GS has a portion that contacts the protrusion 52A and a portion that does not contact the protrusion 52A, there is a concern that a difference in heat dissipation between them will occur. In this regard, since the first etching, which has an etching rate faster than the second etching, is performed and then the second etching, which has an etching rate slower than the first etching, it is possible to increase both the angle that the side surface of the first transmission film 41 makes with respect to the bottom surface and the angle that the side surface of the second reflection film 44 makes with respect to the bottom surface, compared to the case where only the second etching is performed. Therefore, since the heat transfer from the second reflection film 44 side to the first transmission film 41 side is reduced, it is possible to alleviate the difference in heat dissipation that may occur between the portion of the glass substrate 20GS that contacts the protrusion 52A and the portion that does not contact the protrusion 52A. As a result, the finish of the light shielding portion 40 is homogenized, and the amount of transmitted light that passes through each color filter 29G, 29B is equalized.

[0081] <Other embodiments> The technology disclosed in this specification is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included in the technical scope.

[0082] (1) The specific values ​​of the angles θ1 to θ6 in the light blocking portion 40 can be changed appropriately to values ​​other than those mentioned above. Even in this case, the sixth angle θ6 is preferably in the range of 70° or more and 90° or less, but is not necessarily limited to this.

[0083] 7 and 8, the light-shielding portion 40 may be configured such that the second reflective film 44 does not have the fifth side surface 44D (a configuration in which no undercut occurs) as in Examples 3, 4, and 6 of Comparative Experiment 1. In other words, the first reflective film 42 may be configured such that the third side surface 42B is in contact with the first side surface 41B.

[0084] 7 and 8, the third angle θ3 and the fourth angle θ4 of the first reflective film 42 and the second transmissive film 43 of the light-shielding portion 40 may be 90° or more. In that case, the third side surface 42B and the fourth side surface 43B of the first reflective film 42 and the second transmissive film 43 may be parallel to the fifth side surface 44D or may intersect with the fifth side surface 44D.

[0085] (4) The material of each of the reflective films 42 and 44 constituting the light shielding portion 40 can be changed to, for example, Mo (molybdenum), MoW (molybdenum tungsten) which is an alloy of Mo and W, Al (aluminum), Cu (copper), or the like.

[0086] (5) The light-transmitting resin material of each of the transmitting films 41 and 43 constituting the light-shielding portion 40 can be changed to, for example, SiO2 (silicon oxide) or the like.

[0087] (6) The material of each of the transmissive films 41 and 43 constituting the light blocking portion 40 may be a material other than an insulating material, and may be, for example, a transparent electrode material such as ITO (Indium Tin Oxide).

[0088] (7) The specific film thicknesses of the films 41 to 44 constituting the light-shielding portion 40 can be changed as appropriate.

[0089] (8) The specific value of the refractive index of the material of each of the transmissive films 41 and 43 constituting the light blocking portion 40 can be changed as appropriate.

[0090] (9) The first transparent film 41 constituting the light-shielding portion 40 may have a smaller film thickness than the second transparent film 43. In addition, the first transparent film 41 and the second transparent film 43 may have different refractive indices and yet have the same film thickness.

[0091] (10) Another film may be interposed between the glass substrate 20GS constituting the color filter substrate 20 and the first transmissive film 41 constituting the light-shielding portion 40. In other words, the first bottom surface 41A of the first transmissive film 41 does not have to be in direct contact with the inner surface of the glass substrate 20GS.

[0092] (11) The specific types of etching gas used in the first etching and the second etching can be appropriately changed to those other than those mentioned above.

[0093] (12) In the etching device 50, the substrate support 52 may not have the protrusion 52A, and the main surface facing the glass substrate 20GS may be flat. Even in this case, when dirt or the like occurs on the main surface of the substrate support 52, the glass substrate 20GS may have a portion in contact with the dirt or the like and a portion not in contact with the dirt or the like, and a difference in heat dissipation may occur between these portions, which may cause a difference in the width dimension of the light shielding portion 40 and cause display unevenness reflecting the dirt or the like to be visible. However, the occurrence of such a defect can be suppressed. In addition, a lattice-shaped slit (groove) for filling a cooling gas (e.g., He (helium) gas, etc.) may be formed on the main surface of the substrate support 52 facing the glass substrate 20GS. In this case, the glass substrate 20GS will have a portion that contacts the main surface of the substrate support portion 52 and a portion that does not contact the main surface of the substrate support portion 52 (a portion that overlaps with the lattice-shaped slits), and since there will be a difference in the heat dissipation properties between these portions, there is a risk that a difference will occur in the width dimension of the light-shielding portion 40 and display unevenness reflecting the slits will be visible; however, the occurrence of such a defect can be suppressed.

[0094] (13) The etching device 50 may be a dry etching device that employs a method other than the inductively coupled plasma method.

[0095] (14) The light shielding portions 40 may be arranged in a lattice pattern in a plan view so as to overlap both the gate lines 25 and the source lines 26 .

[0096] (15) The color filter substrate 20 may be provided with an overcoat film for planarization.

[0097] (16) The number of colors in the color filter 29 may be four or more. The additional color filter 29 may be a yellow color filter that exhibits yellow, a transparent color filter that transmits light in the entire wavelength range, or the like.

[0098] (17) A source driver may be attached to the array substrate 21 instead of the first circuit section 14A.

[0099] (18) A source driver may be attached to the flexible substrate 13 instead of the first circuit section 14A.

[0100] (19) A gate driver may be attached to the array substrate 21 instead of the second circuit section 14B.

[0101] (20) Of the pixel electrode 28 and the common electrode 30, the "upper layer electrode" that is the electrode located on the upper layer side may be the pixel electrode 28, and the "lower layer electrode" that is the electrode located on the lower layer side may be the common electrode 30. In this case, a slit is provided in the pixel electrode 28 that is the "upper layer electrode."

[0102] (21) The display mode of the liquid crystal panel 11 may be VA mode, IPS mode, or the like other than FFS mode.

[0103] (22) The liquid crystal panel 11 may be a reflective or semi-transmissive type other than a transmissive type. When the liquid crystal panel 11 is a reflective type, the backlight device 12 can be omitted.

[0104] (23) In addition to the head mounted display 10 HMD, the present invention can be applied to devices such as head-up displays and projectors that use lenses to enlarge an image displayed on the liquid crystal panel 11. The present invention can also be applied to display devices that do not have a magnification function (such as television receivers, tablet terminals, and smartphones). [Explanation of symbols]

[0105] 10... liquid crystal display device (display device), 20... color filter substrate, 20GS... glass substrate (substrate), 21... array substrate, 29B... blue color filter (second color filter), 29G... green color filter (first color filter), 40... light shielding portion, 41... first transmission film, 41A... first bottom surface, 41B... first side surface, 41C... upper surface, 41D... outer edge, 42... first reflective film, 42A... third bottom surface, 42B... third side surface, 42 C...top surface, 43...second transmission film, 43A...fourth bottom surface, 43B...fourth side surface, 43C...top surface, 44...second reflection film, 44A...second bottom surface, 44B...second side surface, 44D...fifth side surface, 44E...outer end, 50...etching device, 51...vacuum chamber, 52...substrate support portion, 52A...projection, LS...line segment, R...resist film, θ1...first angle, θ2...second angle, θ3...third angle, θ4...fourth angle, θ5...fifth angle, θ6...sixth angle (angle)

Claims

1. A first color filter; A second color filter having a different color from the first color filter; a light-shielding portion disposed at a boundary between the first color filter and the second color filter below the first color filter and the second color filter, the light blocking portion includes a first transmission film, a first reflection film disposed on an upper layer side of the first transmission film, a second transmission film disposed on an upper layer side of the first reflection film, and a second reflection film disposed on the upper layer side of the second transmission film and having a thickness larger than that of the first reflection film; the first transmitting film has a first bottom surface located on a side opposite to the first reflecting film side, and a first side surface that forms a first angle that is an acute angle with the first bottom surface, The second reflective film has a second bottom surface that is in contact with an upper surface of the second transmissive film and is parallel to the first bottom surface, and a second side surface that forms a second angle that is an acute angle with respect to the second bottom surface.

2. the first reflective film has a third bottom surface in contact with an upper surface of the first transmitting film and parallel to the first bottom surface, and a third side surface that forms a third angle with the third bottom surface; the second transmitting film has a fourth bottom surface in contact with an upper surface of the first reflecting film and parallel to the first bottom surface, and a fourth side surface that forms a fourth angle with the fourth bottom surface; The color filter substrate according to claim 1 , wherein the first reflective film is configured so that the third side surface is not in contact with the first side surface but is in contact with an upper surface of the first transmissive film.

3. The color filter substrate according to claim 2 , wherein the light blocking portion is configured such that the third angle and the fourth angle are greater than the first angle.

4. 4. The color filter substrate according to claim 2, wherein the second reflective film has a fifth side surface that makes a fifth angle with the second bottom surface, the fifth side surface being in contact with the second bottom surface.

5. 4. The color filter substrate according to claim 1, wherein the light-shielding portion is configured such that an angle formed by a line segment connecting an outer end of the first transparent film and an outer end of the second reflective film with respect to the first bottom surface is in the range of 70° or more and 90° or less.

6. A color filter substrate according to any one of claims 1 to 3, an array substrate disposed opposite the color filter substrate.

7. A first transparent film is formed on a substrate; forming a first reflective film on the upper layer side of the first transparent film; forming a second transmitting film on the upper layer side of the first reflective film; forming a second reflective film having a thickness larger than that of the first reflective film on an upper layer side of the second transparent film; forming a photosensitive resist film on an upper layer side of the second reflective film; The resist film is exposed and developed, performing a first etching process for etching at least the second reflective film using the resist film as a mask; performing a second etching process in which the second reflective film, the second transparent film, the first reflective film, and the first transparent film are etched at an etching rate slower than that of the first etching process using the resist film as a mask, thereby forming a light-shielding portion including the first transparent film, the first reflective film, the second transparent film, and the second reflective film; forming a first color filter having an end portion disposed on an upper layer side of the light shielding portion; A method for manufacturing a color filter substrate, comprising forming a second color filter having a different color from the first color filter and an end portion adjacent to the first color filter on the upper layer side of the light shielding portion.

8. In the first etching, at least SF ６ In the second etching, at least CF ４ Gas and O ２ 8. The method for producing a color filter substrate according to claim 7, wherein a gas is used.

9. 9. The method for manufacturing a color filter substrate according to claim 7, wherein the first etching and the second etching use an etching apparatus having a vacuum chamber in which the substrate is accommodated, and a substrate support portion disposed in the vacuum chamber, the substrate support portion having a plurality of protrusions arranged at intervals on a main surface of the substrate and supporting the substrate.

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