Power converter

Abstract

To provide a power converter capable of suppressing positional displacement of a semiconductor element.SOLUTION: A power converter 1 comprises: a base plate 7 including a tabular plate main body 70 and a partition wall 71 protruding from a first face 70a of the plate main body 70 in a plate thickness direction of the plate main body 70 and partitioning the inside; a semiconductor element 2 including an element main body 22 and a plurality of terminals 21 protruding from the element main body 22 in the plate thickness direction; a circuit board 3 which is disposed so as to face the plate main body 70 in the plate thickness direction while interposing the partition wall 71 therebetween and includes a through hole 3c through which the terminals 21 are inserted; and a support 4 disposed between the element main body 22 and the circuit board 3 and supporting the semiconductor element 2. The partition wall 71 includes: outer side faces 71c and 71d extending from the first face 70a, and a distal end face 71e which is positioned in an end at an opposite side of the plate main body 70 in the plate thickness direction. The element main body 22 is fixed to the outer side faces 71c and 71d, and the support 4 is fixed to the distal end face 71e.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a power converter. [Background technology]

[0002] For example, Patent Document 1 describes a mounting structure for a semiconductor element in an on-board charger. The mounting structure for a semiconductor element described in Patent Document 1 includes a housing, a support, a leaf spring, a semiconductor element, and a circuit board. In the mounting structure for a semiconductor element, the semiconductor element is fixed to one side of the support, the support is pressed against a side wall of a water channel provided in the housing via the leaf spring, and the circuit board is joined to the terminals of the semiconductor element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] China Patent Application Publication No. 110621133 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned mounting structure for a semiconductor element, the support has a positioning pin for determining the position of the semiconductor element. The positioning pin is fixed to the bottom surface of the housing, and the position of the semiconductor element within the housing is determined. However, in this structure, the distance from the fixing portion of the positioning pin to the terminal of the semiconductor element is long, so that the position of the terminal assumed by the positioning of the semiconductor element may deviate from the actual position. In this case, it may be difficult to mount a circuit board on the terminal of the semiconductor element. Therefore, a mounting structure capable of suppressing the positional deviation of the semiconductor element is required in order to easily mount a circuit board on the terminal.

[0005] An object of the present invention is to provide a power converter capable of suppressing misalignment of semiconductor elements. [Means for solving the problem]

[0006] A power converter according to one embodiment of the present invention comprises a base plate having a flat plate body and a partition wall that protrudes from one main surface of the plate body in the plate thickness direction of the plate body and partitions the inside, a semiconductor element having an element body and a plurality of terminals protruding from the element body, a circuit board that is arranged opposite the plate body in the plate thickness direction across the partition wall and has a through hole through which the terminal is inserted, and a support that is arranged between the element body and the circuit board and supports the semiconductor element, the partition wall having a side surface that extends from the main surface and a tip surface that is located at the end opposite the plate body in the plate thickness direction, the element body being fixed to the side surface and the support being fixed to the tip surface.

[0007] In such a power converter, the support body supporting the semiconductor element is positioned and fixed to the tip end surface of the partition wall. This allows the semiconductor element to be positioned in a state where the fixing position of the support body is close to the position of the terminal to which the circuit board is joined. As a result, it is possible to prevent the semiconductor element from being misaligned.

[0008] The element body may be bonded to the side surface with an adhesive. This eliminates the need to use a special fixing member to fix the element body of the semiconductor element to the side surface of the partition wall. As a result, the power converter can be made smaller.

[0009] The power converter may further include a protective electronic component electrically connected to the semiconductor element for protecting the semiconductor element from an overcurrent or overvoltage, and the protective electronic component may be bonded to a support or a terminal. This reduces the distance between the semiconductor element and the protective electronic component, suppresses parasitic inductance, and enhances the protection effect of the semiconductor element. In addition, since the protective electronic component can be arranged regardless of the shape of the circuit board, the circuit board can be easily miniaturized.

[0010] The support may be made of an insulating substrate, and the protective electronic component may be bonded to the support, whereby after producing an assembly made of the semiconductor element, the support, and the protective electronic component, the element body of the semiconductor element can be fixed to the side surface of the partition wall, and the terminals of the semiconductor element can be inserted into the through holes of the circuit board to bond them to the circuit board, thereby facilitating the assembly of the power converter.

[0011] The partition wall may be cylindrical, and a pair of supports may be provided on the tip surface of the partition wall, which simplifies the structure of the support and minimizes the size of the support, thereby improving yield.

[0012] The support may have a pair of support body parts that support the semiconductor element, and a pair of connecting parts that connect both ends of the support body parts, and may be integrally formed in a ring shape by the support body parts and the connecting parts. This makes it difficult for the positional relationship between the semiconductor elements arranged on both sides of the support body in the direction perpendicular to the plate thickness direction to shift. As a result, it is possible to suppress the positional shift of the semiconductor element.

[0013] The connection portion may support the semiconductor element, which allows flexible placement of the semiconductor element, thereby expanding the range of configurations of the power converter. Effect of the Invention

[0014] According to the present invention, it is possible to provide a power converter capable of suppressing misalignment of semiconductor elements. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic plan view showing an example of the configuration of a power converter according to one embodiment of the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 3 is a schematic cross-sectional view taken along line III-III in FIG. [Figure 4]4(a) and 4(b) are enlarged cross-sectional views showing the bonding surface between the semiconductor element and the partition wall. [Diagram 5] 5(a) and 5(b) are side and top views of an example of an assembly produced when assembling a power converter. [Figure 6] FIG. 6 is a schematic cross-sectional view showing an example of a power converter according to a comparative example. [Figure 7] FIG. 7 is a schematic plan view showing a part of a modified example of the configuration of the power converter shown in FIG. [Figure 8] FIG. 8 is a schematic plan view showing a part of another modified example of the configuration of the power converter shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. In the drawings, the same or equivalent elements are designated by the same reference numerals, and duplicated explanations will be omitted.

[0017] Fig. 1 is a schematic plan view showing an example of the configuration of a power converter according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a schematic cross-sectional view taken along line III-III in Fig. 1. The power converter 1 of this embodiment is an inverter, converter, or the like that converts input power. Note that Fig. 1 omits the circuit board 3 shown in Figs. 2 and 3.

[0018] The power converter 1 includes a plurality of semiconductor elements 2, a base plate 7, a circuit board 3, a pair of supports 4, and a plurality of protective electronic components 6.

[0019] The semiconductor element 2 is a so-called power semiconductor element, such as a MOSFET or an IGBT. The semiconductor element 2 includes an element body 22 and a plurality of terminals 21 protruding from the element body 22. The element body 22 has a rectangular parallelepiped shape, and is sealed with resin to protect the chip and wires from stress, moisture, and the like. The element body 22 has a terminal protruding surface 22a from which the plurality of terminals 21 protrude, and a side surface 22b that dissipates heat generated from the chip.

[0020] The base plate 7 is made of metal. In this embodiment, the base plate 7 is made of aluminum. The base plate 7 has a plate body 70, a partition wall 71, and a side wall 72. The base plate 7 is configured such that the plate body 70, the partition wall 71, and the side wall 72 are all integrally formed by casting or the like.

[0021] The plate body 70 is flat. The plate body 70 has two main surfaces, a first surface 70a and a second surface 70b. The first surface 70a and the second surface 70b are surfaces that are perpendicular to the thickness direction of the plate body 70. The second surface 70b is the surface opposite to the first surface 70a. The side wall 72 is provided on the outer edge portion 70c of the plate body 70. The first surface 70a is a portion located inside the side wall 72, and constitutes the inner bottom surface of the base plate 7.

[0022] The partition wall 71 is in the shape of a rectangular cylinder. The partition wall 71 protrudes from the first surface 70a of the plate body 70 in the thickness direction of the plate body 70. That is, the partition wall 71 protrudes from one main surface of the plate body 70 in the thickness direction of the plate body 70. The first surface 70a of the plate body 70, inner sides 71f to 71i (described later) of the partition wall 71, and a side surface 74a of the partition wall 74 (described later) define an accommodating recess 73 for accommodating a magnetic component T such as a transformer or a coil that is likely to generate heat. That is, the partition wall 71 defines the accommodating recess 73, protruding from the first surface 70a and defining the inside of the base plate 7. A plurality of (here, two) accommodating recesses 73 are provided side by side. A partition wall 74 is disposed between each of the accommodating recesses 73 on the inner side of the partition wall 71.

[0023] The partition wall 71 has a rectangular annular tip surface 71e located at the end (tip) opposite to the plate body 70 in the first direction (Z direction) which is the plate thickness direction of the plate body 70. The partition wall 71 has outer sides 71c and 71d perpendicular to a second direction (X direction) perpendicular to the plate thickness direction, and outer sides 71a and 71b perpendicular to a third direction (Y direction) perpendicular to the first and second directions. The outer side 71c is an outer side opposite to the outer side 71d across the accommodating recess 73 in the second direction. The outer side 71a is an outer side opposite to the outer side 71b across the accommodating recess 73 in the third direction. The outer sides 71a to 71d are surfaces extending from the first surface 70a of the plate body 70.

[0024] The partition wall 71 has inner sides 71h, 71i perpendicular to a second direction (X direction) perpendicular to the plate thickness direction, and inner sides 71f, 71g perpendicular to a third direction (Y direction) perpendicular to the first and second directions. The outer side 71c is an outer side opposite to the outer side 71d across the accommodating recess 73 in the second direction. The inner side 71h is a side opposite to the outer side 71c. The inner side 71i is a side opposite to the outer side 71d. The inner side 71f is a side opposite to the outer side 71a. The inner side 71g is a side opposite to the outer side 71b. The inner sides 71f to 71i are surfaces extending from the first surface 70a of the plate main body 70.

[0025] The tip surface 71e is a surface perpendicular to the outer surfaces 71c and 71d, the outer surfaces 71a and 71b, the inner surfaces 71h and 71i, and the inner surfaces 71f and 71g. The accommodating recesses 73 are arranged side by side in the third direction.

[0026] A plurality of semiconductor elements 2 are fixed to the outer surfaces 71c, 71d of the partition wall 71. In the semiconductor element 2, the element body 22 is fixed to the outer surfaces 71c, 71d of the partition wall 71 so that the plurality of terminals 21 face the opposite side to the plate body 70 in the plate thickness direction. In other words, the plurality of terminals 21 protrude from the element body 22 to the opposite side to the plate body 70 in the plate thickness direction.

[0027] 1 to 3, in this embodiment, for the sake of simplicity, it is assumed that three semiconductor elements 2 are arranged on each of outer surfaces 71c and 71d of the partition wall 71, and each semiconductor element 2 has three terminals 21. Also, for the sake of simplicity, hatching is partially omitted in the cross-sectional views of FIG. 2 and subsequent figures.

[0028] The circuit board 3 has a flat plate shape. The circuit board 3 has a first surface 3a and a second surface 3b that are perpendicular to the plate thickness direction. The first surface 3a is the surface opposite to the second surface 3b. The circuit board 3 has a through hole 3c that penetrates from the first surface 3a to the second surface 3b. The circuit board 3 is made of an insulating material. The circuit board 3 is joined to the terminal 21 with the terminal 21 inserted into the through hole 3c at a position where the second surface 3b faces the tip surface 71e of the partition wall 71 in the plate thickness direction. A soldering land (not shown) is provided around the through hole 3c in the circuit board 3.

[0029] The support 4 is disposed between the element body 22 of the semiconductor element 2 and the circuit board 3 in the plate thickness direction. The support 4 is disposed on each of the tip surfaces 71e of the partition walls 71 so as to form a pair in the second direction (X direction). The support 4 has a rectangular plate shape and extends in the third direction (Y direction). The support 4 has a first surface 4a and a second surface 4b perpendicular to the plate thickness direction. The second surface 4b of the support 4 is joined to the terminal protruding surface 22a of the element body 22, and supports the semiconductor element 2. The terminals 21 of the semiconductor element 2 penetrate the support 4. The support 4 is formed of an insulating substrate. Although not particularly shown in the figure, the insulating substrate has an insulating base material and a conductor pattern. The terminals 21 of the semiconductor element 2 are joined to the conductor pattern.

[0030] The support 4 is provided at both ends in the third direction (Y direction) with protrusions 40 that protrude inward in the second direction (X direction). The protrusions 40 are provided with circular positioning holes 41 that penetrate from the first surface 4a to the second surface 4b. The protrusions 40 are positioned and fixed to the tip surface 71e of the partition wall 71.

[0031] A flow passage forming recess 51 is formed on the second surface 70b of the plate body 70. The opening of the flow passage forming recess 51 is closed by a flow passage forming plate 90. The flow passage forming plate 90 is made of metal. A water passage 50 for cooling the semiconductor element 2 is provided in the flow passage forming recess 51 of the plate body 70, the inside of the partition wall 71, and the inside of the partition wall 74. The water passage 50 is a flow passage through which cooling water for cooling the semiconductor element 2 flows. The flow passage of the water passage 50 is provided so as to extend from the flow passage forming recess 51 of the plate body 70 to the inside of the partition wall 71 and the inside of the partition wall 74. The plate body 70 is provided with an introduction part (not shown) for introducing cooling water from the outside into the water passage 50. The water passage 50 is provided so as to surround the accommodation recess 73. A magnetic part T such as a transformer or a coil that easily generates heat is arranged in the accommodation recess 73.

[0032] Positioning pins 52 (see FIG. 1) that fit into positioning holes 41 of the support body 4 protrude from the four corners of the tip end surface 71e of the partition wall 71. By fitting the positioning pins 52 into the positioning holes 41, the support body 4 is positioned and fixed to the tip end surface 71e.

[0033] The protective electronic component 6 is a chip component for protecting the semiconductor element 2 from an overcurrent or an overvoltage. Examples of the protective electronic component 6 include a Zener diode, a capacitor, and a resistor. The protective electronic component 6 is disposed between the support 4 and the circuit board 3, outside the terminal 21 of the semiconductor element 2 in the second direction (X direction). The protective electronic component 6 has a joint surface 6a electrically connected to the terminal 21 of the semiconductor element 2. The joint surface 6a of the protective electronic component 6 is bonded to the first surface 4a of the support 4. That is, the joint surface 6a is bonded to the conductor pattern of the support 4. As a result, the protective electronic component 6 is electrically connected to the terminal 21 of the semiconductor element 2. The protective electronic component 6 is disposed at a position where a part of the protective electronic component 6 overlaps a part of the semiconductor element 2 in the plate thickness direction (Z direction). One protective electronic component 6 is disposed for one semiconductor element 2.

[0034] 4(a) and 4(b) are enlarged cross-sectional views showing the bonding surface between the semiconductor element 2 and the partition wall 71. As shown in Fig. 4(a), the side surface 22b of the element body 22 of the semiconductor element 2 and the outer surfaces 71c, 71d (only the outer surface 71c is shown) of the partition wall 71 are bonded by an adhesive sheet 23, which is an adhesive. The adhesive sheet 23 is made of an insulating heat dissipating material obtained from a resin composition in which a resin and a filler are mixed.

[0035] 4(b), the side surface 22b of the element body 22 and the outer surfaces 71c, 71d of the partition wall 71 (only the outer surface 71c is shown) may be joined by adhesives 24, 26 and an insulating plate 25. The insulating plate 25 is disposed between the adhesives 24, 26. Also, the side surface 22b of the element body 22 and the outer surfaces 71c, 71d of the partition wall 71 may be joined by another configuration.

[0036] Fig. 5(a) is a side view showing an assembly 80 produced when assembling the semiconductor element 2, the support 4, and the protective electronic component 6. Fig. 5(b) is a plan view showing the assembly 80. Figs. 5(a) and 5(b) describe the assembly 80 disposed on one side in the second direction (X direction) in the power converter 1, but the assembly 80 disposed on the other side in the second direction has a similar configuration.

[0037] 5(a) and 5(b), an assembly 80 is assembled as an element sub-assembly. The assembly 80 is composed of a semiconductor element 2, a support 4, and a protective electronic component 6. As described above, the assembly 80 is constructed by joining the terminal protruding surface 22a of the element body 22 of the semiconductor element 2 to the second surface 4b of the support 4, and by joining the first surface 4a of the support 4 to the joining surface 6a of the protective electronic component 6.

[0038] 2, after assembling such an assembly 80, the element body 22 of the semiconductor element 2 of the assembly 80 is joined to each of the outer surfaces 71c, 71d of the partition wall 71. Thereafter, the terminals 21 of the semiconductor element 2 are inserted into the through holes 3c of the circuit board 3 and joined, thereby attaching the assembly 80 to the partition wall 71.

[0039] As described above, the power converter 1 of this embodiment includes a base plate 7 having a flat plate body 70, a partition wall 71 that protrudes in the plate thickness direction of the plate body 70 from a first surface 70a, which is one of the main surfaces of the plate body 70, and partitions the inside, an element body 22, a semiconductor element 2 having a plurality of terminals 21 protruding from the element body 22, a circuit board 3 that is arranged opposite the plate body 70 in the plate thickness direction across the partition wall 71 and has a through hole 3c through which the terminal 21 is inserted, and a support 4 that is arranged between the element body 22 and the circuit board 3 and supports the semiconductor element 2, and the partition wall 71 has outer sides 71c, 71d that extend from the first surface 70a, and a tip surface 71e that is located at the end opposite the plate body 70 in the plate thickness direction, and the element body 22 is fixed to the outer sides 71c, 71d, and the support 4 is fixed to the tip surface 71e.

[0040] In such a power converter 1, the support 4 supporting the semiconductor element 2 is positioned and fixed to the tip surface 71e of the partition wall 71. This allows the semiconductor element 2 to be positioned in a state in which the fixing position of the support 4 is close to the position of the terminal 21 to which the circuit board 3 is joined. As a result, it is possible to suppress misalignment of the semiconductor element 2.

[0041] In this embodiment, the element body 22 is bonded to the outer surfaces 71c, 71d with an adhesive. This eliminates the need to use special fixing members to fix the element body 22 of the semiconductor element 2 to the outer surfaces 71c, 71d of the partition wall 71. As a result, the power converter 1 can be made smaller.

[0042] In addition, in this embodiment, a protective electronic component 6 is provided that is electrically connected to the semiconductor element 2 and protects the semiconductor element 2 from an overcurrent or an overvoltage, and the protective electronic component 6 is joined to the support 4. For example, as shown in FIG. 6, when the protective electronic component 6 is disposed on the first surface 3a of the circuit board 3, the size of the circuit board 3 may become large. Compared to such a configuration, in this embodiment, the distance between the semiconductor element 2 and the protective electronic component 6 is shortened, thereby suppressing parasitic inductance and enhancing the protective effect of the semiconductor element 2. In addition, since the protective electronic component 6 can be disposed regardless of the shape of the circuit board 3, the circuit board 3 can be easily miniaturized.

[0043] In this embodiment, the support 4 is made of an insulating substrate, and the protective electronic components 6 are joined to the support 4. As a result, after producing an assembly 80 consisting of the semiconductor element 2, the support 4, and the protective electronic components 6, the element body 22 of the semiconductor element 2 is fixed to the outer surfaces 71c, 71d of the partition wall 71, and the terminals 21 of the semiconductor element 2 are joined to the circuit board 3, whereby the power converter 1 can be easily assembled.

[0044] In this embodiment, the partition wall 71 has a cylindrical shape, and the support 4 is provided in a pair on the tip surface 71e. This makes it possible to minimize the size of the support 4 and improve the yield.

[0045] The present invention is not limited to the above embodiment, and various modifications are possible. For example, as shown in FIG. 7, the support 4 may be integrally formed and have a rectangular ring shape. Specifically, the support 4 has a pair of support body parts 42 arranged on both sides in a second direction (X direction) perpendicular to the plate thickness direction (Z direction), and a pair of connection parts 43 connecting both ends of each support body part 42. The support body part 42 extends in a third direction (Y direction). The connection part 43 extends in the second direction. The above-mentioned positioning holes 41 are provided at both ends of the connection part 43. This makes it difficult for a positional relationship between the semiconductor elements 2 arranged on both sides of the support 4 in the second direction to be shifted. As a result, the positional shift of the semiconductor elements 2 can be suppressed.

[0046] 8, the semiconductor element 2 may be disposed on both sides in the second direction and both sides in the third direction. That is, the semiconductor element 2 may be disposed not only on the support body portion 42 but also on the connection portion 43. This allows the semiconductor element 2 to be disposed in a flexible manner. As a result, the range of configurations of the power converter 1 can be expanded.

[0047] In addition, in the above embodiment, a positioning pin 52 is provided on the partition wall 71, and a positioning hole 41 that engages with the positioning pin 52 is provided on the support body 4, but this is not particularly limited to this form, and a positioning pin may be provided on the support body 4, and a positioning hole that engages with the positioning pin may be provided on the partition wall 71.

[0048] In addition, in the above embodiment, the water channel 50 is arranged to surround the accommodating recess 73, but this is not particularly limited to this form, and for example, the water channel 50 may be arranged only in the flow path forming recess 51 of the plate body 70.

[0049] In addition, in the above embodiment, the bonding surface 6a of the protective electronic component 6 is provided to be bonded to the conductor pattern of the support 4, but this is not particularly limited to this form, and the bonding surface 6a of the protective electronic component 6 may be bonded to the terminal 21 of the semiconductor element 2.

[0050] In the above embodiment, the support 4 is made of an insulating substrate, but is not limited to this form. For example, the support 4 may be made of a resin plate. In this case, the bonding surface 6a of the protective electronic component 6 is bonded to the terminal 21 of the semiconductor element 2. As a result, the protective electronic component 6 is electrically connected to the terminal 21 of the semiconductor element 2.

[0051] Furthermore, the circuit board 3 may be fixed by a fixing member provided on the plate body 70, for example, a boss extending from the first surface 70a of the plate body 70 in the plate thickness direction, and a screw.

[0052] In the above embodiment, the support 4 is positioned and fixed to the tip surface 71e of the partition wall 71, but there is no particular limitation on the method of fixing the support 4. For example, the support 4 may be fixed to the tip surface 71e of the partition wall 71 by frictional force caused by fitting the positioning hole 41 of the support 4 with the positioning pin 52 of the partition wall 71, or the element body 22 of the semiconductor element 2 joined to the support 4 may be fixed to the outer surfaces 71c, 71d of the partition wall 71, thereby fixing the support 4 to the tip surface 71e of the partition wall 71. In addition, the support 4 may be fixed to the tip surface 71e of the partition wall 71 by a separate fastening means such as an adhesive or a screw.

[0053] In addition, in the above embodiment, adhesive is used to fix the element body 22 of the semiconductor element 2 to the outer surfaces 71c, 71d of the partition wall 71, but the element body 22 of the semiconductor element 2 may also be fixed by pressing it against the outer surfaces 71c, 71d of the partition wall 71 with, for example, a leaf spring.

[0054] In addition, in the above embodiment, the base plate 7 has the side walls 72, but the present invention is not limited to this form, and for example, columnar members extending in the plate thickness direction may be provided at the four corners of the plate body 70 instead of the side walls 72. In this case, a shielding member or the like for blocking electromagnetic noise may be attached to the column members.

[0055] In addition, in the above embodiment, the base plate 7 has the partition wall 71 in a rectangular cylindrical shape, but is not limited to this shape. For example, instead of the partition wall 71, one or more walls may be provided.

[0056] In addition, in the above embodiment, the semiconductor element 2 is provided on the outer surfaces 71c, 71d of the partition wall 71, but this is not particularly limited to this form, and for example, the semiconductor element 2 may be provided on the inner surfaces 71h, 71i of the partition wall 71.

[0057] The constituent elements of the present invention will be described below. [Form 1] A base plate including a flat plate body and a partition wall protruding from one main surface of the plate body in a plate thickness direction of the plate body and partitioning an inner side of the plate body; A semiconductor element having an element body and a plurality of terminals protruding from the element body; a circuit board disposed opposite the plate body in the plate thickness direction across the partition wall, the circuit board having a through hole through which the terminal is inserted; a support member disposed between the element body and the circuit board and supporting the semiconductor element; The partition wall has a side surface extending from the main surface and a tip surface located at an end opposite to the plate body in the plate thickness direction, The element body is fixed to the side surface, The support is a power converter fixed to the tip surface. [Form 2] 2. The power converter according to claim 1, wherein the element body is bonded to the side surface with an adhesive. [Form 3] a protective electronic component electrically connected to the semiconductor element for protecting the semiconductor element from an overcurrent or an overvoltage; 3. The power converter according to claim 1, wherein the protective electronic component is joined to the support or the terminal. [Form 4] The support is made of an insulating substrate, The power converter according to embodiment 3, wherein the protective electronic component is joined to the support. [Form 5] The partition wall has a cylindrical shape, The power converter according to any one of the first to fourth aspects, wherein the support body is provided in a pair on the tip surface. [Form 6] The support body has a pair of support body portions that support the semiconductor element and a pair of connecting portions that connect both ends of the support body portions, and is integrally formed into a cylindrical shape by the support body portions and the connecting portions. A power converter described in any one of forms 1 to 4. [Form 7] The power converter according to embodiment 6, wherein the connection portion supports the semiconductor element. [Explanation of symbols]

[0058] 1...power converter, 2...semiconductor element, 3...circuit board, 3c...through hole, 4...support, 6...protective electronic component, 7...base plate, 21...terminal, 22...element body, 23...adhesive sheet (adhesive), 24, 26...adhesive, 70...plate body, 70a...first surface (main surface), 71...partition wall, 71c, 71d...outer surface (side surface), 71e...tip surface.

Claims

1. A base plate including a flat plate body and a partition wall protruding from one main surface of the plate body in a plate thickness direction of the plate body and partitioning an inner side of the plate body; A semiconductor element having an element body and a plurality of terminals protruding from the element body; a circuit board disposed opposite the plate body in the plate thickness direction across the partition wall, the circuit board having a through hole through which the terminal is inserted; a support member disposed between the element body and the circuit board and supporting the semiconductor element; The partition wall has a side surface extending from the main surface and a tip surface located at an end opposite to the plate body in the plate thickness direction, The element body is fixed to the side surface, The support is a power converter fixed to the tip surface.

2. The power converter according to claim 1 , wherein the element body is bonded to the side surface with an adhesive.

3. a protection electronic component electrically connected to the semiconductor element for protecting the semiconductor element from an overcurrent or an overvoltage; The power converter according to claim 1 , wherein the protective electronic component is bonded to the support or the terminal.

4. The support is made of an insulating substrate, The power converter according to claim 3 , wherein the protective electronic component is bonded to the support.

5. The partition wall has a cylindrical shape, The power converter according to claim 1 , wherein the support members are provided in pairs on the tip surface.

6. The power converter according to claim 1 , wherein the support body has a pair of support body portions that support the semiconductor element, and a pair of connecting portions that connect both ends of the support body portions, and is integrally formed in a ring shape by the support body portions and the connecting portions.

7. The power converter according to claim 6 , wherein the connection portion supports the semiconductor element.

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